JP7566122B2 - Electronics - Google Patents

Description

The present disclosure relates to electronic devices.

Conventionally, electronic devices are known in which a circuit board is fixed to a conductive housing via an insulating plate (see, for example, JP 2017-079253 A).

JP 2017-079253 A

In the conventional electronic device disclosed in the above-mentioned JP 2017-079253 A, the insulation between the circuit board and the conductive housing is ensured by the insulating plate. However, if dirt or the like is attached to the surface of the insulating plate, the theoretical starting voltage of the creeping discharge is significantly reduced. Therefore, if a voltage higher than the starting voltage of the creeping discharge is applied, there is a concern that a creeping discharge may occur due to defects in the insulating plate (such as the dirt described above), which may ultimately lead to dielectric breakdown. In addition, it is difficult to completely adhere the insulating plate to the circuit board. That is, due to the unevenness of the insulating plate surface, voids or gaps may be present between the insulating plate and the circuit board. When a high voltage is applied to the circuit board, defects (voids and gaps) with low dielectric breakdown strength become the starting point of discharge, and dielectric breakdown is caused over a long period of time. Therefore, there is room for improvement in the insulation resistance of conventional electronic devices.

This disclosure has been made to solve the problems described above, and the purpose of this disclosure is to provide an electronic device with improved insulation resistance.

The electronic device according to the present disclosure includes a conductive housing, a circuit board, and a connection member. The circuit board is disposed at a distance from the conductive housing. The connection member connects the conductive housing and the circuit board. The connection member includes a first insulating plate portion, a first connection portion, and a second connection portion. The first insulating plate portion is disposed between the conductive housing and the circuit board. The first insulating plate portion extends along the circuit board. The first insulating plate portion is disposed at a distance from both the conductive housing and the circuit board. The first connection portion is connected to a surface of the first insulating plate portion on the circuit board side in order to position the first insulating plate portion at a distance from the circuit board. The second connection portion is connected to a surface of the first insulating plate portion on the conductive housing side in order to position the first insulating plate portion at a distance from the conductive housing. The first connection portion and the second connection portion are disposed at different positions in a plan view from the circuit board side.

As a result of the above, an electronic device with improved insulation resistance can be obtained.

1 is a schematic cross-sectional view of an electronic device according to a first embodiment. FIG. 2 is a schematic perspective view of the electronic device shown in FIG. 1 . 2 is a schematic plan view of a circuit board constituting the electronic device shown in FIG. 1 . 2 is a schematic plan view of a first insulating plate portion constituting the electronic device shown in FIG. 1 . 2 is a schematic plan view of a second insulating plate portion constituting the electronic device shown in FIG. 1 . 2 is a schematic plan view of a conductive housing that constitutes the electronic device shown in FIG. 1 . 2 is a schematic cross-sectional view for explaining an insulation distance in the electronic device shown in FIG. 1 . FIG. 1 is a schematic cross-sectional view of an electronic device as a reference example. FIG. 11 is a schematic cross-sectional view of an electronic device according to a second embodiment. FIG. 10 is a schematic perspective view of the electronic device shown in FIG. 9 . 10 is a schematic plan view of an insulating structure constituting the electronic device shown in FIG. 9 . FIG. 12 is a schematic side view of the insulating structure shown in FIG. 11 . FIG. 11 is a schematic cross-sectional view of an electronic device according to a third embodiment. FIG. 14 is a schematic perspective view of the electronic device shown in FIG. 13 . 14 is a schematic plan view of a first insulating structure constituting the electronic device shown in FIG. 13. FIG. 16 is a schematic side view of the first insulating structure shown in FIG. 15 . 14 is a schematic side view of a second insulating structure constituting the electronic device shown in FIG. 13. FIG. 13 is a schematic cross-sectional view of an electronic device according to a fourth embodiment. FIG. 19 is a schematic perspective view of the electronic device shown in FIG. 18 . 19 is a schematic plan view of a first insulating plate portion constituting the electronic device shown in FIG. 18. 19 is a schematic plan view of a second insulating plate portion constituting the electronic device shown in FIG. 18. FIG. 13 is a schematic cross-sectional view of an electronic device according to a fifth embodiment. FIG. 23 is a schematic perspective view of the electronic device shown in FIG. 22 . 23 is a schematic plan view of a first insulating plate portion constituting the electronic device shown in FIG. 22. 23 is a schematic plan view of a conductive housing that constitutes the electronic device shown in FIG. 22. FIG. 13 is a schematic perspective view of an electronic device according to a sixth embodiment. 27A to 27C are schematic diagrams for explaining a manufacturing method of the electronic device shown in FIG. 26. 27A to 27C are schematic diagrams for explaining a manufacturing method of the electronic device shown in FIG. 26. FIG. 13 is a schematic perspective view of an electronic device according to a seventh embodiment. FIG. 30 is a schematic diagram for explaining the configuration of the electronic device shown in FIG. 29 .

The following describes an embodiment of the present disclosure. Note that the same reference numbers are used for the same configurations, and the description will not be repeated.

Embodiment 1.
<Configuration of Electronic Device>
Fig. 1 is a schematic cross-sectional view of an electronic device according to a first embodiment. Fig. 2 is a schematic perspective view of the electronic device shown in Fig. 1. Fig. 3 is a schematic plan view of a circuit board constituting the electronic device shown in Fig. 1. Fig. 4 is a schematic plan view of a first insulating plate portion constituting the electronic device shown in Fig. 1. Fig. 5 is a schematic plan view of a second insulating plate portion constituting the electronic device shown in Fig. 1. Fig. 6 is a schematic plan view of a conductive housing constituting the electronic device shown in Fig. 1.

The electronic device shown in Figures 1 to 6 mainly comprises a conductive housing 5, a circuit board 1, and a connecting member 50. The circuit board 1 is arranged at a distance from the conductive housing 5. Electrical and electronic components 6 are mounted on the circuit board 1. The connecting member 50 connects the conductive housing 5 and the circuit board 1.

1 and 2, the connection member 50 mainly includes an insulating plate 11 as a first insulating plate portion 51, spacers 21, 22, 23, and 24 as a first connection portion 53, spacers 31, 32, 33, and 34 as a second connection portion 54, an insulating plate 12 as a second insulating plate portion 52, and spacers 41, 42, 43, and 44 as a third connection portion 55. The insulating plate 11 as the first insulating plate portion 51 is disposed between the conductive housing 5 and the circuit board 1. The insulating plate 11 as the first insulating plate portion 51 extends along the circuit board 1. The insulating plate 11 as the first insulating plate portion 51 is disposed at a distance from both the conductive housing 5 and the circuit board 1.

The spacers 21, 22, 23, and 24 connect the surface of the insulating plate 11 facing the circuit board 1 to the circuit board 1 in order to position the insulating plate 11 at a distance from the circuit board 1. The spacers 21, 22, 23, and 24 are each connected to the corners of the circuit board 1. From a different perspective, the spacers 21, 22, 23, and 24 are connected to the outer periphery of the rectangular circuit board 1.

The spacers 31, 32, 33, and 34 connect the surface of the insulating plate 11 facing the conductive housing 5 to the insulating plate 12 in order to position the insulating plate 11 at a distance from the conductive housing 5. In a plan view seen from the circuit board 1 side, the spacers 31, 32, 33, and 34 are arranged in positions overlapping the circuit board 1. Specifically, the spacers 31, 32, 33, and 34 are arranged so as to overlap an intermediate portion including the central portion 101 of the circuit board 1 in a plan view.

The insulating plate 12 is disposed at a distance from the conductive housing 5 and the insulating plate 11. The spacers 41, 42, 43, and 44 are, for example, male-female spacers, and connect the surface of the insulating plate 12 on the conductive housing 5 side to the conductive housing 5 in order to position the insulating plate 12 at a distance from the conductive housing 5. The spacers 41, 42, 43, and 44 and the spacers 31, 32, 33, and 34 are disposed at different positions in a plan view seen from the circuit board 1 side. The spacers 21, 22, 23, and 24 and the spacers 31, 32, 33, and 34 are disposed at different positions in a plan view seen from the circuit board 1 side. As shown in Figures 1 and 2, the spacers 21, 22, 23, and 24 and the spacers 41, 42, 43, and 44 overlap with each other in a plan view seen from the circuit board 1 side. The spacers 21, 22, 23, and 24 and the spacers 41, 42, 43, and 44 may be arranged so as not to overlap each other in a plan view.

The spacers 21, 22, 23, 24, the spacers 31, 32, 33, 34, and the spacers 41, 42, 43, 44 are made of resin materials such as polyoxymethylene and nylon. The shape of these spacers may be, for example, a hexagonal column or a cylindrical column.

The conductive housing 5 may be made of a metal member such as, for example, steels such as iron and iron-based alloys, or non-ferrous metals such as aluminum and copper, and alloys containing these. As shown in FIG. 6, in order to fix the spacers 41, 42, 43, and 44 (see FIG. 2) at appropriate positions on the conductive housing 5, pilot holes 241, 242, 243, and 244 of a suitable size for inserting a fixing member such as a rivet are formed in advance. Fixing members 761, 762, 763, and 764 (see FIG. 2) for fixing the spacers 41, 42, 43, and 44 are inserted into the pilot holes 241, 242, 243, and 244. Then, the fixing members 761, 762, 763, and 764 (see FIG. 2), which are rivets, are crimped with a tool such as a riveter. The fixing members 761, 762, 763, and 764 may be made of a metal member such as aluminum or stainless steel.

The insulating plate 12 may be made of a resin material such as epoxy resin, insulating paper, and a resin film. As shown in Fig. 5, screw through holes 231, 232, 233, and 234 (insertion holes) through which screws 751, 752, 753, and 754 as fixing devices can be inserted are formed at the four corners of the insulating plate 12. Screw through holes 321, 322, 323, and 324 through which screws 741, 742, 743, and 744 (fixing devices) can be inserted are formed on the inside of the insulating plate 12 away from the above-mentioned screw through holes 231, 232, 233, and 234. In addition, each screw through hole 321 , 322, 323, and 324 is arranged on the inner periphery side of the insulating plate 12 when viewed from each screw through hole 231, 232, 233, and 234. The straight-line distance from screw through hole 321 to screw through hole 231, the straight-line distance from screw through hole 322 to screw through hole 232, the straight-line distance from screw through hole 323 to screw through hole 233, and the straight-line distance from screw through hole 324 to screw through hole 234 are substantially the same.

The insulating plate 11 may be made of a resin material such as epoxy resin, insulating paper, and a resin film, as in the insulating plate 12 described above. As shown in FIG. 4, screw holes 221, 222, 223, and 224 (insertion holes) through which screws 721, 722, 723, and 724 (see FIG. 2) as fixing devices can be inserted are formed at the four corners of the insulating plate 11. Screw holes 311, 312, 313, and 314 through which screws 731, 732, 733, and 734 (see FIG. 2) as fixing devices can be inserted are formed on the inside of the insulating plate 11 away from the screw holes 221, 222, 223, and 224 described above. In addition, each screw hole 311, 312, 313, and 314 is arranged on the inner periphery side of the insulating plate 11 as viewed from each screw hole 221, 222, 223, and 224, respectively. The straight-line distance from screw through hole 311 to screw through hole 221, the straight-line distance from screw through hole 312 to screw through hole 222, the straight-line distance from screw through hole 313 to screw through hole 223, and the straight-line distance from screw through hole 314 to screw through hole 224 are substantially the same.

The circuit board 1 is made of printed circuit board materials such as paper phenol and glass epoxy. As shown in FIG. 3, electrical and electronic components 6 are mounted on the circuit board 1. On the outer periphery of the circuit board 1, screw through holes 211, 212, 213, and 214 (insertion holes) are formed through which screws 711, 712, 713, and 714 (see FIG. 2) can be inserted as fixing devices. The planar shape of the circuit board 1 is rectangular. The screw through holes 211, 212, 213, and 214 are arranged at the four corners of the circuit board 1. The thickness of the circuit board 1 can be, for example, 0.4 mm or more and 3.2 mm or less. The size of the circuit board 1 can be, for example, 10 mm or more and 550 mm or less in the vertical dimension and 10 mm or more and 550 mm or less in the horizontal dimension.

The male sides of the spacers 41, 42, 43, and 44, which are male and female spacers, are fixed by fixing members 761, 762, 763, and 764 to the portions of the conductive housing 5 where pilot holes 241, 242, 243, and 244 are formed. The female sides of the spacers 41, 42, 43, and 44 are fixed by screws 751, 752, 753, and 754 to the four corners of the insulating plate 12 where screw-through holes 231, 232, 233, and 234 are formed.

One end of the spacers 31, 32, 33, 34 is fixed by screws 741, 742, 743, 744 to the areas of the insulating plate 12 where the screw holes 321, 322, 323, 324 are formed. The other ends of the spacers 31, 32, 33, 34 are fixed by screws 731, 732, 733, 734 to the areas of the insulating plate 11 where the screw holes 311, 312, 313, 314 are formed.

One end of the spacers 21, 22, 23, 24 is fixed by screws 721, 722, 723, 724 to the four corners of the insulating plate 11 where the screw holes 221, 222, 223, 224 are formed. The other ends of the spacers 21, 22, 23, 24 are fixed by screws 711, 712, 713, 714 to the four corners of the circuit board 1 where the screw holes 211, 212, 213, 214 are formed.

All the screws described above can be of any configuration, but may be, for example, pan head screws. The material constituting the screws described above may be metal, such as iron, stainless steel, brass, etc., or may be resin.

<Electronic Device Manufacturing Method>
A method for manufacturing an electronic device according to the first embodiment will be described. First, the male sides of spacers 41, 42, 43, and 44, which are male and female spacers, are fastened and fixed to fixing members 761, 762, 763, and 764 arranged in pilot holes 241, 242, 243, and 244 of conductive housing 5. Next, one end of spacers 31, 32, 33, and 34 is fastened to insulating plate 12 by screws 741, 742, 743, and 744 passed through screw through holes 321, 322, 323, and 324 formed in insulating plate 12. As a result, spacers 31, 32, 33, and 34 are fixed to insulating plate 12.

Next, screws 751, 752, 753, and 754 are passed through the screw holes 231, 232, 233, and 234 formed in the insulating plate 12 and fastened to the female sides of the spacers 41, 42, 43, and 44, which are male and female spacers. As a result, the insulating plate 12 is fixed to the conductive housing 5 via the spacers 41, 42, 43, and 44.

Next, one end of the spacers 21, 22, 23, 24 is fixed to the insulating plate 11 by screws 721, 722, 723, 724 passed through the screw holes 221, 222, 223, 224 formed in the insulating plate 11. Screws 731, 732, 733, 734 passed through the screw holes 311, 312, 313, 314 formed in the insulating plate 11 are fastened to the other ends of the spacers 31, 32, 33, 34 fixed to the insulating plate 12. As a result, the insulating plate 11 is fixed to the insulating plate 12 via the spacers 31, 32, 33, 34.

Finally, the other ends of the spacers 21, 22, 23, and 24 are fixed to the circuit board 1 by screws 711, 712, 713, and 714 passed through the screw-through holes 211, 212, 213, and 214 formed in the circuit board 1. An electric/electronic component 6 is mounted on the circuit board 1 in advance. In this manner, the electronic device according to the first embodiment can be obtained.

<Action>
The electronic device according to the present disclosure includes a conductive housing 5, a circuit board 1, and a connection member 50. The circuit board 1 is disposed at a distance from the conductive housing 5. The connection member 50 connects the conductive housing 5 and the circuit board 1. The connection member 50 includes an insulating plate 11 as a first insulating plate portion 51, spacers 21, 22, 23, and 24 as a first connecting portion 53, and spacers 31, 32, 33, and 34 as a second connecting portion 54. The insulating plate 11 as the first insulating plate portion 51 is disposed between the conductive housing 5 and the circuit board 1. The insulating plate 11 as the first insulating plate portion 51 extends along the circuit board 1. The insulating plate 11 as the first insulating plate portion 51 is disposed at a distance from both the conductive housing 5 and the circuit board 1. The spacers 21, 22, 23, and 24 serving as the first connecting portion 53 are connected to the surface of the insulating plate 11 on the circuit board 1 side in order to position the insulating plate 11 as the first insulating plate portion 51 at a distance from the circuit board 1. The spacers 31, 32, 33, and 34 serving as the second connecting portion 54 are connected to the surface of the insulating plate 11 as the first insulating plate portion 51 on the conductive housing 5 side in order to position the insulating plate 11 as the first insulating plate portion 51 at a distance from the conductive housing 5. The spacers 21, 22, 23, and 24 and the spacers 31, 32, 33, and 34 are disposed at different positions in a plan view seen from the circuit board 1 side.

In this way, the connection member 50 has the insulating plate 11, the spacers 21, 22, 23, 24, and the spacers 31, 32, 33, 34, and the spacers 21, 22, 23, 24 and the spacers 31, 32, 33, 34 are arranged at different positions in a plan view from the circuit board 1 side, so that the creepage distance between the conductive housing 5 and the circuit board 1 can be increased without increasing the shortest distance between the conductive housing 5 and the circuit board 1. Therefore, a sufficient withstand voltage value can be obtained without making the size of the electronic device larger than necessary. As a result, an electronic device with improved insulation resistance can be obtained.

In the electronic device, the connection member 50 includes the insulating plate 12 as the second insulating plate portion 52 and the spacers 41, 42, 43, and 44 as the third connection portion 55. The insulating plate 12 as the second insulating plate portion 52 is disposed between the conductive housing 5 and the insulating plate 11. The insulating plate 12 is disposed at a distance from the conductive housing 5 and the insulating plate 11. The spacers 41, 42, 43, and 44 as the third connection portion 55 connect the surface of the insulating plate 12 on the conductive housing 5 side to the conductive housing 5 in order to position the insulating plate 12 at a distance from the conductive housing 5. The spacers 21, 22, 23, and 24 connect the surface of the insulating plate 11 on the circuit board 1 side to the circuit board 1. The spacers 41, 42, 43, and 44 connect the surface of the insulating plate 11 on the conductive housing 5 side to the insulating plate 12. The spacers 41, 42, 43, and 44 and the spacers 31, 32, 33, and 34 are disposed at different positions in a plan view seen from the circuit board 1 side.

In this case, the connecting member 50 further has an insulating plate 12 and spacers 41, 42, 43, and 44, thereby further increasing the creepage distance between the conductive housing 5 and the circuit board 1.

In the above electronic device, in a plan view seen from the circuit board 1 side, spacers 31, 32, 33, 34 as the second connection portion 54 are located on the central portion 101 side of the circuit board 1 when viewed from spacers 21, 22, 23, 24 as the first connection portion 53 and spacers 41, 42, 43, 44 as the third connection portion 55.

In this case, the area occupied by the electronic device can be made smaller than when the spacers 31, 32, 33, and 34 are arranged on the opposite side of the circuit board 1 from the center portion 101 side, as viewed from the spacers 21, 22, 23, and 24 and the spacers 41, 42, 43, and 44. In other words, the area occupied by the electronic device can be prevented from increasing.

In the above electronic device, spacers 21, 22, 23, and 24 as first connection portion 53 overlap with spacers 41, 42, 43, and 44 as third connection portion 55 in a plan view seen from the circuit board 1 side. In this case, the area occupied by the electronic device can be made smaller than when spacers 21, 22, 23, and 24 and spacers 41, 42, 43, and 44 are arranged at different positions in a plan view.

In the above electronic device, in a plan view seen from the circuit board 1 side, the spacers 31, 32, 33, and 34 serving as the second connection portion 54 are arranged in a position overlapping the circuit board 1. In this case, the area below the circuit board 1 can be used as an arrangement space for the spacers 31, 32, 33, and 34, thereby making it possible to miniaturize the electronic device.

1 to 6, by sandwiching multiple insulating plates 11, 12 between the circuit board 1 and the conductive housing 5, the extra spatial distance required to ensure the creepage distance can be reduced. This allows the electronic device to be made smaller. Furthermore, by shifting the positions of the second spacers 31, 32, 33, and 34 from the positions of the first spacers 21, 22, 23, and 24 and the third spacers 41, 42, 43, and 44 in a plan view, the vibration resistance of the electronic device is improved.

In addition, in the electronic device described above, the circuit board 1 and the insulating plates 11 and 12 are mechanically fixed at a distance via a spacer. This creates an air layer between the insulating plates 11 and 12 and the circuit board 1, reducing the possibility of void discharge or creeping discharge occurring in the connection member 50.

Here, the effects of the electronic device according to the present embodiment will be described in more detail. Figure 7 is a schematic cross-sectional view for explaining the insulation distance in the electronic device shown in Figure 1. Figure 8 is a schematic cross-sectional view of an electronic device as a reference example.

In the electronic device shown in FIG. 8 as a reference example, a circuit board 1001 on which an electric/electronic component 1006 is mounted is fixed to a conductive housing 1005 via a spacer 1020, which is a rod-shaped insulating spacer. The insulation distance between the circuit board 1001 and the conductive housing 1005 is maintained by the length L of the spacer 1020.

Here, the insulation distance includes the spatial distance and the creepage distance along the surface of the insulator. For example, in JEM1103, which is the standard for insulation distances in control devices, when the voltage applied to the circuit board is 3.6 kV to 7.2 kV, it is necessary to ensure a spatial distance of 60 mm and a creepage distance of 90 mm or more. Therefore, in the electronic device as a reference example shown in FIG. 8, when a voltage of 3.6 kV to 7.2 kV is applied to the circuit board 1001, the length L of the spacer 1020 needs to be at least 90 mm or more to satisfy the insulation distance between the circuit board 1001 and the conductive housing 1005. A spatial distance of 60 mm or more is sufficient to ensure the insulation distance, but since a rod-shaped spacer 1020 is used, it is necessary to ensure a creepage distance of 90 mm or more for the insulation distance, which results in the electronic device becoming larger.

In addition, in order to ensure an insulation distance between the circuit board 1001 and the conductive housing 1005, a configuration can be adopted in which the circuit board 1001 and the conductive housing 1005 are fixed via an insulator. By using an insulator, the creepage distance between the circuit board 1001 and the conductive housing 1005 can be ensured by the uneven structure of the insulator surface. Therefore, the creepage distance can be ensured with an insulator that is shorter than a typical spacer. However, when an insulator is provided, the larger the creepage distance to be ensured, the larger the size of the insulator must be.

If the size of the insulator is large, the mounting area of the circuit board 1001 will be reduced. In order to secure the mounting area of the circuit board 1001, the size of the circuit board 1001 will be further increased. This vicious cycle has also led to the problem of the size of electrical equipment becoming larger.

Furthermore, in electronic devices that secure an insulation distance through a rod-shaped spacer 1020 as shown in FIG. 8, the resonant frequency of the circuit board 1001 may be low. Therefore, the resonant frequency of the circuit board 1001 is likely to fall within the vibration frequency band of the structure of the electronic device. When the circuit board 1001 resonates with the structure of the electronic device, the amplitude of a heavy object such as an electronic component mounted on the circuit board 1001 may be amplified. As a result, the circuit board 1001 vibrates violently, and there is a risk that the circuit board 1001 may be destroyed by the vibration. Here, the vibration of the circuit board 1001 can occur in three directions. Specifically, the destruction by vibration of the circuit board 1001 on which the above-mentioned heavy object is mounted is, for example, destruction of the connection point between the terminal of a heavy electronic component such as a transformer, a capacitor, or a reactor and the circuit board 1001, or breakage of the terminal.

In order to solve the above-mentioned problems, in the structure of Patent Document 1, a solid insulating material such as an insulating plate is inserted between the circuit board 1001 and the conductive housing 1005 to insulate the circuit board 1001 from the conductive housing 1005. However, it is difficult for the solid insulating material to be completely in contact with the circuit board 1001. Due to defects (voids or gaps) in the solid insulating material, a small gap may be formed between the solid insulating material and the circuit board 1001. When a high voltage is applied to the circuit board 1001, partial discharge may occur if there are minute defects such as voids in the solid insulating material. As a result, the solid insulating material may deteriorate and ultimately the solid insulating material may break down. In addition, if the solid insulating material itself contains impurities, the theoretical starting voltage of creeping discharge may be significantly reduced. In this case, if a voltage higher than the starting voltage of the creeping discharge is applied to the circuit board 1001, creeping discharge may occur due to defects in the solid insulating material, and ultimately insulation breakdown may occur in the electronic device.

Therefore, in the electronic device of embodiment 1, the spatial distance and creepage distance between the circuit board 1 and the conductive housing 5 are ensured by combining the insulating plates 11, 12 with the spacers 21, 22, 23, 24, 31, 32, 33, 34, 41, 42, 43, 44. In addition, since an air layer is interposed between the insulating plates 11, 12 and the circuit board 1, the risk of void discharge and creepage discharge as in the electronic device of Patent Document 1 is reduced. In addition, the extra spatial distance required to ensure the creepage distance can be reduced, allowing the electronic device to be made smaller.

Specifically, as shown in FIG. 7, the distance between the electric/electronic component 6 (or the metal wiring pattern to which the electric/electronic component 6 is connected) and the screw 713 on the circuit board 1 is the shortest distance, and this distance is the length f. The distance between the circuit board 1 and the insulating plate 11, i.e., the length of the spacer 23, is the length a. The distance between the screw 723 and the spacer 33 is the length b. The distance between the insulating plate 11 and the insulating plate 12, i.e., the length of the spacer 33, is the length c. The distance between the spacer 33 and the screw 753 (see FIG. 2) is the length d. The distance between the insulating plate 12 and the conductive housing 5, i.e., the length of the spacer 43, is the length e. The shortest creepage distance from the metal wiring pattern of the circuit board 1 to the conductive housing 5 via the spacer 23, the insulating plate 11, the spacer 33, the insulating plate 12, and the spacer 43 is the length (f+a+b+c+d+e). The configuration of the electronic device of the present disclosure can be determined so that the shortest creepage distance is equal to or greater than the creepage distance required by the standard. 7 is proportional to the shortest creepage distance. In other words, by increasing the shortest creepage distance, the withstand voltage value of the electronic device can be increased.

Furthermore, in the electronic device according to the first embodiment, the long spacer 1020 for ensuring the creepage distance as shown in FIG. 8 is divided. In the electronic device according to the first embodiment, the insulating plates 11 and 12 are arranged between the circuit board 1 and the conductive housing 5 via the spacers so as to be spaced apart from each other. In addition, the spacers 31, 32, 33, and 34 for fixing the insulating plates 11 and 12 are arranged on the inner side of the circuit board 1 (the area side including the central portion 101) in a plan view from the spacers 21, 22, 23, and 24 and the spacers 41, 42, 43, and 44. As a result, the natural frequency of the circuit board 1 is increased, and the vibration resistance of the circuit board 1 is improved. Furthermore, compared to the electronic device disclosed in Patent Document 1, the electronic device according to the first embodiment has a structure in which outside air flows in the wiring pattern area of the circuit board 1 and the component area in which the electric and electronic components 6 are mounted, so that the heat dissipation of the electric and electronic components 6 is excellent.

Embodiment 2.
<Configuration of Electronic Device>
Fig. 9 is a schematic cross-sectional view of an electronic device according to embodiment 2. Fig. 10 is a schematic perspective view of the electronic device shown in Fig. 9. Fig. 11 is a schematic plan view of an insulating structure constituting the electronic device shown in Fig. 9. Fig. 12 is a schematic side view of the insulating structure shown in Fig. 11.

The electronic devices shown in Figs. 9 to 12 basically have the same configuration as the electronic devices shown in Figs. 1 and 2 and can achieve the same effects, but the specific configuration of the connection member 50 is different from that of the electronic devices shown in Figs. 1 and 2. That is, in the electronic devices shown in Figs. 9 to 12, an insulating structure 16 is used as the connection member 50, in which the first flat plate portion 161, the second flat plate portion 162, the upper convex portions 16a, 16b, 16c, 16d, the central portion 16i, and the lower convex portions 16e, 16f, 16g, 16h are integrated. Any material having insulating properties can be used as the material constituting the insulating structure 16, and for example, a resin material can be used. As the resin material, for example, ABS (acrylonitrile butadiene styrene) resin, photocurable acrylic resin, etc. can be used. The insulating structure 16 can be produced, for example, using a mold.

In the insulating structure 16, the first flat plate portion 161 and the second flat plate portion 162 are arranged to face each other. The first flat plate portion 161 and the second flat plate portion 162 are arranged to extend parallel to each other. The first flat plate portion 161 and the second flat plate portion 162 are arranged to extend in a direction along the surface of the circuit board 1. A central portion 16i is arranged to connect the central portion of the first flat plate portion 161 and the central portion of the second flat plate portion 162.

11 and 12, the first flat plate portion 161 has a rectangular planar shape. Upper convex portions 16a, 16b, 16c, and 16d are formed at the four corners of the first flat plate portion 161. The upper convex portions 16a, 16b, 16c, and 16d are each formed to extend from the surface of the first flat plate portion 161 toward the circuit board 1. The second flat plate portion 162 has a rectangular planar shape. Lower convex portions 16e, 16f, 16g, and 16h are formed at the four corners of the second flat plate portion 162. The lower convex portions 16e, 16f, 16g, and 16h are each formed to extend from the surface of the second flat plate portion 162 toward the conductive housing 5. The upper convex portions 16a, 16b, 16c, and 16d and the lower convex portions 16e, 16f, 16g, and 16h can have any shape, but are, for example, rectangular prisms. The upper convex portions 16a, 16b, 16c, and 16d and the lower convex portions 16e, 16f, 16g, and 16h may have a polygonal columnar shape or a cylindrical shape.

From a different perspective, the first flat plate portion 161 includes an area connected to the central portion 16i and extending portions 161a and 161b extending outward from the area. The upper convex portions 16a and 16c are formed at the end of the extending portion 161a opposite the central portion 16i side. The upper convex portions 16b and 16d are formed at the end of the extending portion 161b opposite the central portion 16i side. The second flat plate portion 162 includes an area connected to the central portion 16i and extending portions 162a and 162b extending outward from the area. The lower convex portions 16e and 16g are formed at the end of the extending portion 162a opposite the central portion 16i side. The lower convex portions 16f and 16h are formed at the end of the extending portion 162b opposite the central portion 16i side.

In the connection member 50, the width of the central portion 16i in a direction intersecting the direction from the extending portion 161a toward the extending portion 161b is substantially equal to the width of the first flat portion 161 and the second flat portion 162. Note that the width of the central portion 16i may be narrower or wider than the width of the first flat portion 161 and the second flat portion 162.

As shown in Fig. 11, the upper convex portions 16a, 16b, 16c, and 16d are formed with screw-through holes 16aa, 16bb, 16cc, and 16dd (insertion holes) through which screws 711, 712, 713, and 714 (see Fig. 10) serving as fasteners can be inserted, respectively. The lower convex portions 16e, 16f, 16g, and 16h are formed with screw-through holes (insertion holes) through which fixing members 761, 762, 763, and 764 (see Fig. 2) serving as screws can be inserted, respectively.

As shown in FIG. 9, the shortest distance is the distance between the electric/electronic component 6 (or the metal wiring pattern to which the electric/electronic component 6 is connected) and the screw 713 on the circuit board 1, and this distance is length f. The distance between the circuit board 1 and the first flat plate portion 161, i.e., the length of the upper convex portion 16c, is length a. The distance between the upper convex portion 16c and the central portion 16i is length b. The distance between the first flat plate portion 161 and the second flat plate portion 162, i.e., the length of the side of the central portion 16i, is length c. The distance between the central portion 16i and the lower convex portion 16g is length d. The distance between the second flat plate portion 162 and the conductive housing 5, i.e., the length of the lower convex portion 16g, is length e. The shortest creepage distance from the metal wiring pattern of the circuit board 1 to the conductive housing 5 via the upper convex portion 16c, the first flat plate portion 161, the central portion 16i, the second flat plate portion 162, and the lower convex portion 16g is a length (f+a+b+c+d+e). The configuration of the electronic device of the present disclosure can be determined so that the shortest creepage distance is equal to or greater than the creepage distance required by the standard. Furthermore, the insulation performance (voltage resistance value) of the electronic device shown in FIG. 9 is proportional to the shortest creepage distance described above. In other words, by increasing the shortest creepage distance, the voltage resistance value of the electronic device can be increased.

<Action>
The electronic device according to the present disclosure includes a conductive housing 5, a circuit board 1, and an insulating structure 16 as a connecting member 50. The circuit board 1 is disposed at a distance from the conductive housing 5. The insulating structure 16 connects the conductive housing 5 and the circuit board 1. The insulating structure 16 includes a first flat plate portion 161 as a first insulating plate portion 51, upper convex portions 16a, 16b, 16c, and 16d as a first connecting portion 53, and a central portion 16i as a second connecting portion 54. The first flat plate portion 161 is disposed between the conductive housing 5 and the circuit board 1. The first flat plate portion 161 extends along the circuit board 1. The first flat plate portion 161 is disposed at a distance from both the conductive housing 5 and the circuit board 1. The upper convex portions 16a, 16b, 16c, and 16d serving as the first connecting portion 53 are connected to the surface of the first flat plate portion 161 facing the circuit board 1 in order to position the first flat plate portion 161 at a distance from the circuit board 1. The central portion 16i serving as the second connecting portion 54 is connected to the surface of the first flat plate portion 161 facing the conductive housing 5 in order to position the first flat plate portion 161 at a distance from the conductive housing 5. The upper convex portions 16a, 16b, 16c, and 16d and the central portion 16i are disposed at different positions in a plan view seen from the circuit board 1 side.

In the electronic device, the connection member 50 includes the second flat plate portion 162 as the second insulating plate portion 52 and the lower convex portions 16e, 16f, 16g, and 16h as the third connection portion 55. The second flat plate portion 162 is disposed between the conductive housing 5 and the first flat plate portion 161. The second flat plate portion 162 is disposed at a distance from the conductive housing 5 and the first flat plate portion 161. The lower convex portions 16e, 16f, 16g, and 16h connect the surface of the second flat plate portion 162 on the conductive housing 5 side to the conductive housing 5 in order to position the second flat plate portion 162 at a distance from the conductive housing 5. The upper convex portions 16a, 16b, 16c, and 16d as the first connection portion 53 connect the surface of the first flat plate portion 161 on the circuit board 1 side to the circuit board 1. Central portion 16i connects the surface of first flat plate portion 161 facing the conductive housing 5 to second flat plate portion 162. Lower convex portions 16e, 16f, 16g, and 16h and central portion 16i are disposed at different positions in a plan view seen from the circuit board 1 side.

In the above electronic device, in a plan view seen from the circuit board 1 side, the central portion 16i as the second connection portion 54 is located on the central portion 101 side of the circuit board 1 when viewed from the upper convex portions 16a, 16b, 16c, 16d as the first connection portion 53 and the lower convex portions 16e, 16f, 16g, 16h as the third connection portion 55.

In the above electronic device, when viewed in a plan view from the circuit board 1 side, the upper convex portions 16a, 16b, 16c, and 16d as the first connection portion 53 overlap with the lower convex portions 16e, 16f, 16g, and 16h as the third connection portion 55.

In the above electronic device, when viewed in a plan view from the circuit board 1 side, the central portion 16i as the second connection portion 54 is positioned so as to overlap with the circuit board 1.

In the above electronic device, the connection member 50 is an insulating structure 16 integrally formed with a first flat plate portion 161, a second flat plate portion 162, upper convex portions 16a, 16b, 16c, 16d, a central portion 16i, and lower convex portions 16e, 16f, 16g, 16h.

In the electronic device having the above-mentioned configuration, the same effect as the electronic device according to the first embodiment can be obtained. In addition, by disposing the insulating structure 16, which is a single member, between the circuit board 1 and the conductive housing 5, a structure having the same function as the connecting member 50 consisting of multiple members in the first embodiment can be realized, so that the manufacturing process of the electronic device can be simplified. In other words, the manufacturing cost can be reduced by reducing the number of manufacturing processes of the electronic device. In addition, since the connecting member 50 is a single member, the rigidity of the connecting member 50 can be increased. Therefore, the natural frequency of the circuit board 1 in the electronic device can be increased, and as a result, the vibration resistance of the circuit board 1 can be improved.

Embodiment 3.
<Configuration of Electronic Device>
Fig. 13 is a schematic cross-sectional view of an electronic device according to embodiment 3. Fig. 14 is a schematic perspective view of the electronic device shown in Fig. 13. Fig. 15 is a schematic plan view of a first insulation structure constituting the electronic device shown in Fig. 13. Fig. 16 is a schematic side view of the first insulation structure shown in Fig. 15. Fig. 17 is a schematic side view of a second insulation structure constituting the electronic device shown in Fig. 13.

The electronic devices shown in Figures 13 to 17 basically have the same configuration as the electronic devices shown in Figures 9 to 12 and can achieve the same effects, but the specific configuration of the connection member 50 is different from that of the electronic devices shown in Figures 9 to 12. That is, in the electronic devices shown in Figures 13 to 17, the connection member 50 mainly has the first insulating structure 17, the second insulating structure 18, and the spacers 31, 32, 33, and 34. The first insulating structure 17 is an insulating structure in which the first flat plate portion 161 and the upper convex portions 16a, 16b, 16c, and 16d in the second embodiment are integrally formed. The second insulating structure 18 is an insulating structure in which the second flat plate portion 162 and the lower convex portions 16e, 16f, 16g, and 16h in the second embodiment are integrally formed. In the electronic devices shown in Figures 13 to 17, the spacers 31, 32, 33, and 34 correspond to the central portion 16i (see Figure 10) in the second embodiment. The configurations of the spacers 31, 32, 33, and 34 are similar to the configurations of the spacers 31, 32, 33, and 34 of the electronic device according to embodiment 1. The configurations of the connection portions between the spacers 31, 32, 33, and 34 and the first insulating structure 17 and the second insulating structure 18 are similar to the configurations of the connection portions between the spacers 31, 32, 33, and 34 and the insulating plates 11 and 12 in embodiment 1.

The first insulating structure 17 includes a first insulating plate portion 51 and protrusions 17a, 17b, 17c, and 17d. The planar shape of the first insulating plate portion 51 in the first insulating structure 17 is rectangular. Protrusions 17a, 17b, 17c, and 17d are formed at the four corners of the first insulating plate portion 51. Protrusions 17a, 17b, 17c, and 17d extend so as to protrude from the surface of the first insulating plate portion 51 toward the circuit board 1. The shape of protrusions 17a, 17b, 17c, and 17d can be any shape, but is, for example, a square prism. The shape of protrusions 17a, 17b, 17c, and 17d may be a polygonal prism or a cylinder.

The material constituting the first insulating structure 17 and the second insulating structure 18 may be any material having insulating properties, for example, a resin material. Examples of the resin material that may be used include ABS resin and photocurable acrylic resin. The first insulating structure 17 and the second insulating structure 18 may be produced, for example, by using a mold.

14 to 17, screw through holes 17aa, 17bb, 17cc, 17dd are formed in the protrusions 17a, 17b, 17c, 17d of the first insulating structure 17, through which screws 711, 712, 713, 714 serving as fasteners can be inserted. In addition, in the first insulating structure 17, screw through holes 311, 312, 313, 314 are formed in the central region inside the protrusions 17a, 17b, 17c, 17d, through which screws 731, 732, 733, 734 (see FIG. 14) serving as fasteners can be inserted.

Each of the screw holes 311, 312, 313, and 314 is formed inside each of the convex portions 17a, 17b, 17c, and 17d. The linear distance from the screw hole 311 to the convex portion 17a is the same as the linear distance from the screw hole 312 to the convex portion 17b, the linear distance from the screw hole 313 to the convex portion 17c, and the linear distance from the screw hole 314 to the convex portion 17d.

As shown in Figures 14, 16 and 17, the second insulating structure 18 has the same configuration as the first insulating structure 17, and is the first insulating structure 17 inverted by 180 degrees. As shown in Figures 15 to 17, in the second insulating structure 18, protrusions 18a, 18b, 18c, and 18d are formed at the four corners of the second insulating plate portion 52. Screw through holes (insertion holes) are formed in the protrusions 18a, 18b, 18c, and 18d, through which fixing members 761, 762, 763, and 764 (see Figures 2 and 13), which are screws, can be inserted.

In addition, in the second insulating structure 18, in the central region inside the protrusions 18a, 18b, 18c, and 18d, four screw holes are formed through which screws 741, 742, 743, and 744 (see FIG. 14) serving as fasteners can be inserted. The positional relationship between the screw holes and the protrusions 18a, 18b, 18c, and 18d is the same as the relationship between the screw holes 311, 312, 313, and 314 in the first insulating structure 17 and the protrusions 17a, 17b, 17c, and 17d.

As shown in FIG. 13, the distance between the electric/electronic component 6 (or the metal wiring pattern to which the electric/electronic component 6 is connected) and the screw 713 on the circuit board 1 is the shortest distance, and this distance is the length f. The distance between the circuit board 1 and the first insulating plate portion 51, i.e., the length of the convex portion 17c, is the length a. The distance between the convex portion 17c and the spacer 33 is the length b. The distance between the first insulating plate portion 51 and the second insulating plate portion 52, i.e., the length of the spacer 33, is the length c. The distance between the spacer 33 and the convex portion 18c is the length d. The distance between the second insulating plate portion 52 and the conductive housing 5, i.e., the length of the convex portion 18c, is the length e. The shortest creepage distance from the metal wiring pattern of the circuit board 1 to the conductive housing 5 via the convex portion 17c, the first insulating plate portion 51, the spacer 33, the second insulating plate portion 52, and the convex portion 18c is the length (f+a+b+c+d+e). The configuration of the electronic device of the present disclosure can be determined so that the shortest creepage distance is equal to or greater than the creepage distance required by the standard. Furthermore, the insulation performance (voltage resistance) of the electronic device shown in FIG. 13 is proportional to the shortest creepage distance. In other words, by increasing the shortest creepage distance, the voltage resistance of the electronic device can be increased.

<Action>
The electronic device according to the present disclosure includes a conductive housing 5, a circuit board 1, and a connection member 50. The circuit board 1 is disposed at a distance from the conductive housing 5. The connection member 50 connects the conductive housing 5 and the circuit board 1. The connection member 50 includes a first insulating plate portion 51, protrusions 17a, 17b, 17c, and 17d as a first connection portion 53, and spacers 31, 32, 33, and 34 as a second connection portion 54. The first insulating plate portion 51 is disposed between the conductive housing 5 and the circuit board 1. The first insulating plate portion 51 extends along the circuit board 1. The first insulating plate portion 51 is disposed at a distance from both the conductive housing 5 and the circuit board 1. The protrusions 17a, 17b, 17c, and 17d as the first connection portion 53 are connected to the surface of the insulating plate 11 on the circuit board 1 side in order to position the first insulating plate portion 51 at a distance from the circuit board 1. The spacers 31, 32, 33, and 34 serving as the second connecting portion 54 are connected to the surface of the first insulating plate portion 51 on the conductive housing 5 side in order to position the first insulating plate portion 51 at a distance from the conductive housing 5. The protruding portions 17a, 17b, 17c, and 17d and the spacers 31, 32, 33, and 34 are disposed at different positions in a plan view seen from the circuit board 1 side.

In the above electronic device, the connection member 50 includes the second insulating plate portion 52 and the protrusions 18a, 18b, 18c, and 18d as the third connection portion 55. The second insulating plate portion 52 is disposed between the conductive housing 5 and the first insulating plate portion 51. The second insulating plate portion 52 is disposed at a distance from the conductive housing 5 and the first insulating plate portion 51. The protrusions 18a, 18b, 18c, and 18d as the third connection portion 55 connect the surface of the second insulating plate portion 52 on the conductive housing 5 side to the conductive housing 5 in order to position the second insulating plate portion 52 at a distance from the conductive housing 5. The protrusions 17a, 17b, 17c, and 17d as the first connection portion 53 connect the surface of the first insulating plate portion 51 on the circuit board 1 side to the circuit board 1. Spacers 31, 32, 33, and 34 serving as second connecting portion 54 connect the surface of first insulating plate portion 51 on the conductive housing 5 side to second insulating plate portion 52. Protrusions 18a, 18b, 18c, and 18d serving as third connecting portion 55 and spacers 31, 32, 33, and 34 serving as second connecting portion 54 are disposed at different positions in a plan view seen from the circuit board 1 side.

In the above electronic device, in a plan view seen from the circuit board 1 side, the spacers 31, 32, 33, 34 as the second connection portion 54 are located on the central portion 101 side of the circuit board 1 when viewed from the convex portions 17a, 17b, 17c, 17d as the first connection portion 53 and the convex portions 18a, 18b, 18c, 18d as the third connection portion 55.

In the above electronic device, when viewed in a plan view from the circuit board 1 side, the convex portions 17a, 17b, 17c, and 17d as the first connection portion 53 overlap with the convex portions 18a, 18b, 18c, and 18d as the third connection portion 55.

In the above electronic device, in a plan view seen from the circuit board 1 side, the spacers 31, 32, 33, and 34 serving as the second connection portion 54 are positioned so as to overlap the circuit board 1.

In the above electronic device, the first insulating plate portion 51 and the convex portions 17a, 17b, 17c, and 17d serving as the first connection portion 53 are integrally configured as a first insulating structure 17. The second insulating plate portion 52 and the convex portions 18a, 18b, 18c, and 18d serving as the third connection portion 55 are integrally configured as a second insulating structure 18. The shape of the first insulating structure 17 and the shape of the second insulating structure 18 may be the same.

In the electronic device having the above-mentioned configuration, the same effect as the electronic device according to the first embodiment can be obtained. In addition, by arranging the first insulating structure 17 and the second insulating structure, and the spacers 31, 32, 33, and 34 having the same configuration between the circuit board 1 and the conductive housing 5, a structure having the same function as the connection member 50 consisting of a plurality of members in the first embodiment can be realized, so that the manufacturing process of the electronic device can be simplified. In other words, the manufacturing cost of the electronic device can be reduced by reducing the number of manufacturing steps compared to the manufacturing process of the electronic device according to the first embodiment. In addition, since the number of components of the connection member 50 is less than that of the connection member 50 in the electronic device of the first embodiment, the rigidity of the connection member 50 can be increased compared to the electronic device of the first embodiment. Therefore, the natural frequency of the circuit board 1 in the electronic device can be increased, and as a result, the vibration resistance of the circuit board 1 can be improved. Furthermore, since the above-mentioned first insulating structure 17 and the second insulating structure 18 have the same configuration, they can be manufactured using the same mold. Therefore, the manufacturing cost of the electronic device can be reduced compared to the case where a plurality of members having different shapes are used as the connection member 50. Furthermore, since the configurations of the first insulating structure 17 and the second insulating structure 18 are simpler in shape than the configuration of the insulating structure 16 in the second embodiment, the cost of making the molds used in the fabrication can be reduced.

Embodiment 4.
<Configuration of Electronic Device>
Fig. 18 is a schematic cross-sectional view of an electronic device according to embodiment 4. Fig. 19 is a schematic perspective view of the electronic device shown in Fig. 18. Fig. 20 is a schematic plan view of a first insulating plate portion constituting the electronic device shown in Fig. 18. Fig. 21 is a schematic plan view of a second insulating plate portion constituting the electronic device shown in Fig. 18.

The electronic device shown in Figures 18 to 21 basically has the same configuration as the electronic device shown in Figures 1 and 2 and can achieve the same effect, but the specific configuration of the connection member 50 is different from that of the electronic device shown in Figures 1 and 2. That is, in the electronic device shown in Figures 18 to 21, the size of the insulating plates 11 and 12 in a plan view is larger than the size of the circuit board 1. Furthermore, as shown in Figures 18 and 19, supports 91, 92, 93, 94, 81, 82, 83, 84, 71, 72, 73, and 74 are used instead of the spacer shown in Figure 2. Furthermore, as shown in Figure 19, the positions of the supports 91, 92, 93, and 94 in a plan view are different from the positions of the supports 71, 72, 73, and 74.

The material and shape of the supports 91, 92, 93, 94, 81, 82, 83, 84, 71, 72, 73, and 74 may be similar to the material and shape of the spacer of the electronic device in embodiment 1. The length of the supports 91, 92, 93, 94, 81, 82, 83, 84, 71, 72, 73, and 74 may be shorter than the length of the spacer in embodiment 1.

As shown in Fig. 21, screw through holes 231, 231, 233, 234 (insertion holes) through which screws 751, 752, 753, 754 (see Figs. 2 and 19) as fasteners can be inserted are formed at the four corners of the insulating plate 12. Screw through holes 321, 232, 233, 324 through which screws 741, 742, 743, 744 (see Fig. 2) as fasteners can be inserted are formed on the inside of the insulating plate 12 away from the above-mentioned screw through holes 231, 232, 233, 234. In addition, each screw through hole 321, 322, 323, 324 is disposed on the inner periphery side of the insulating plate 12 as viewed from each screw through hole 231, 232, 233, 234. The linear distance from the screw through hole 321 to the screw through hole 231 is substantially the same as the linear distance from the screw through hole 322 to the screw through hole 232, the linear distance from the screw through hole 323 to the screw through hole 233, and the linear distance from the screw through hole 324 to the screw through hole 234. The linear distances in the insulating plate 12 shown in Fig. 21 are longer than the corresponding linear distances in the insulating plate 12 shown in Fig. 5.

As shown in Fig. 20, screw through holes 221, 222, 223, 224 (insertion holes) through which screws 721, 722, 723, 724 (see Fig. 19) as fasteners can be inserted are formed in an area toward the center away from the four corners of the insulating plate 11. Screw through holes 311, 312, 313, 314 through which screws 731, 732, 733, 734 (see Fig. 2) as fasteners can be inserted are formed further inward of the insulating plate 11 away from the above-mentioned screw through holes 221, 222, 223, 224. Each screw through hole 311, 312, 313, 314 is disposed on the inner periphery side of the insulating plate 11 as viewed from each screw through hole 221, 222, 223, 224. The straight-line distance from screw through hole 311 to screw through hole 221, the straight-line distance from screw through hole 312 to screw through hole 222, the straight-line distance from screw through hole 313 to screw through hole 223, and the straight-line distance from screw through hole 314 to screw through hole 224 are substantially the same.

18, the distance between the electric/electronic component 6 (or the metal wiring pattern to which the electric/electronic component 6 is connected) and the screw 713 on the circuit board 1 is the shortest distance, and this distance is the length f. The distance between the circuit board 1 and the insulating plate 11, i.e., the length of the support 93, is the length a. The distance between the screw 723 and the support 83 is the length b. The distance between the insulating plate 11 and the insulating plate 12, i.e., the length of the support 83, is the length c. The distance between the support 83 and the screw 753 is the length d. The distance between the insulating plate 12 and the conductive housing 5, i.e., the length of the support 73, is the length e. The shortest creepage distance from the metal wiring pattern of the circuit board 1 to the conductive housing 5 via the support 93, the insulating plate 11, the support 83, the insulating plate 12, and the support 73 is the length (f+a+b+c+d+e). The configuration of the electronic device of the present disclosure can be determined so that the shortest creepage distance is equal to or greater than the creepage distance required by the standard. 18 is proportional to the shortest creepage distance. In other words, by increasing the shortest creepage distance, the withstand voltage value of the electronic device can be increased.

<Action>
In the electronic device, the connection member 50 includes an insulating plate 11 as a first insulating plate portion 51, an insulating plate 12 as a second insulating plate portion 52, supports 91, 92, 93, and 94 as a first connecting portion 53, supports 81, 82, 83, and 84 as a second connecting portion 54, and supports 71, 72, 73, and 74 as a third connecting portion 55. The insulating plate 12 as the second insulating plate portion 52 is disposed between the conductive housing 5 and the insulating plate 11 as the first insulating plate portion 51. The insulating plate 12 as the second insulating plate portion 52 is disposed at a distance from the conductive housing 5 and the insulating plate 11 as the first insulating plate portion 51. The supports 71, 72, 73, and 74 as the third connection portion 55 connect the surface of the insulating plate 12 as the second insulating plate portion 52 on the conductive housing 5 side to the conductive housing 5 in order to position the insulating plate 12 as the second insulating plate portion 52 at a distance from the conductive housing 5. The supports 91, 92, 93, and 94 as the first connection portion 53 connect the surface of the insulating plate 11 as the first insulating plate portion 51 on the circuit board 1 side to the circuit board 1. The supports 81, 82, 83, and 84 as the second connection portion 54 connect the surface of the insulating plate 11 as the first insulating plate portion 51 on the conductive housing 5 side to the insulating plate 12 as the second insulating plate portion 52. The supports 71, 72, 73, and 74 as the third connection portion 55 and the supports 81, 82, 83, and 84 as the second connection portion 54 are disposed at different positions in a plan view seen from the circuit board 1 side.

In the above electronic device, in a plan view seen from the circuit board 1 side, supports 81, 82, 83, 84 as the second connection portion 54 are located on the central portion 101 side of the circuit board 1 when viewed from supports 91, 92, 93, 94 as the first connection portion 53 and supports 71, 72, 73, 74 as the third connection portion 55.

In the above electronic device, in a plan view seen from the circuit board 1 side, the area of the insulating plate 11 as the first insulating plate portion 51 and the insulating plate 12 as the second insulating plate portion 52 are larger than the area of the circuit board 1. In a plan view seen from the circuit board 1 side, the supports 71, 72, 73, and 74 as the third connection portion 55 are positioned so as not to overlap the circuit board 1.

In the above electronic device, in a plan view seen from the circuit board 1 side, supports 81, 82, 83, and 84 serving as second connection portion 54 are positioned so as to overlap with circuit board 1.

In the electronic device having the above-mentioned configuration, the same effect as that of the electronic device according to the first embodiment can be obtained. Furthermore, in the electronic device described above, by making the area of the insulating plate 11 and the insulating plate 12 larger than the area of the circuit board 1, the length d, which is the distance from the support 83 to the support 73, can be made longer than the length d (see FIG. 7), which is the distance from the spacer 33 to the spacer 43 in the first embodiment, as shown in FIG. 18. Also, the length b, which is the distance from the support 93 to the support 83, can be made longer than the length b (see FIG. 7), which is the distance from the spacer 23 to the spacer 33 in the first embodiment. Therefore, the spacers 21, 22, 23, 24, 31, 32, 33, 34, 41, 42, 43, 44 used in the first embodiment can be replaced with supports 91, 92, 93, 94, 81, 82, 83, 84, 71, 72, 73, 74 (see FIG. 18 and FIG. 19) having a length shorter than the space.

The support may be, for example, a nut or a washer. As a result, the spatial distance and creepage distance between the circuit board 1 and the conductive housing 5 can be secured. In addition, air layers are interposed between the insulating plate 11 and the circuit board 1, between the insulating plate 11 and the insulating plate 12, and between the insulating plate 12 and the conductive housing 5. This reduces the risk of void discharge or creepage discharge, which is a problem in the configuration of Patent Document 1. Furthermore, the extra spatial distance required to secure the creepage distance can be reduced. As a result, the electronic device can be made smaller.

Furthermore, in a plan view, the positions of supports 71, 72, 73, and 74 for ensuring the creepage distance are different from the positions of supports 81, 82, 83, and 84, and the positions of supports 91, 92, 93, and 94. This makes it possible to increase the natural frequency of the circuit board 1 in the electronic device. As a result, the vibration resistance of the circuit board 1 can be improved.

Embodiment 5.
<Configuration of Electronic Device>
Fig. 22 is a schematic cross-sectional view of an electronic device according to embodiment 5. Fig. 23 is a schematic perspective view of the electronic device shown in Fig. 22. Fig. 24 is a schematic plan view of a first insulating plate portion constituting the electronic device shown in Fig. 22. Fig. 25 is a schematic plan view of a conductive housing constituting the electronic device shown in Fig. 22.

The electronic devices shown in Figures 22 to 25 basically have the same configuration as the electronic devices shown in Figures 18 to 21 and can achieve the same effects, but the specific configuration of the connection member 50 is different from that of the electronic devices shown in Figures 18 to 21. That is, in the electronic devices shown in Figures 22 to 25, the connection member 50 includes the insulating plate 11 and supports 91, 92, 93, 94, 81, 82, 83, 84, 85, and 86, and does not have the insulating plate 12 shown in Figure 18. In the electronic devices shown in Figures 22 to 25, the insulating plate 11 is connected to the conductive housing 5 via supports 81, 82, 83, 84, 85, and 86.

22 and 23, in a plan view seen from the circuit board 1 side, supports 81 and 82 are arranged closer to the center 101 of the circuit board 1 than supports 91, 92, 93, and 94. Supports 81 and 82 are fixed to the conductive housing 5 by fixing members 765 and 766, respectively. Supports 81 and 82 are fixed to the insulating plate 11 by screws 755 and 756, respectively. In the plan view, supports 83, 84, 85, and 86 are arranged on the opposite side of the center 101 of the circuit board 1 than supports 91, 92, 93, and 94.

22 to 24, screw through holes 231, 232, 233, and 234 (see FIG. 24), which are through holes through which screws 751, 752, 753, and 754 serving as fasteners can be inserted, are formed at the four corners of insulating plate 11. In insulating plate 11, screw through holes 235 and 236 (see FIG. 24), which are through holes, are formed away from screw through holes 231, 232, 233, and 234, in an area toward the inside of insulating plate 11 (for example, an area overlapping circuit board 1 in a plan view). Screw through-holes 251 , 252 , 253 , 254 into which screws 721 , 722 , 723 , 724 (see FIG. 2 ) connected to supports 91 , 92 , 93 , 94 can be inserted are formed in insulating plate 11 between screw through-holes 231 , 232 , 233 , 234 and screw through-holes 235 , 236 .

25, holes 241, 242, 243, 244, 322, 324 of suitable sizes for inserting fixing members such as rivets are formed in advance to fix supports 81, 82, 83, 84, 85, 86 (see FIG. 23) at appropriate positions on conductive housing 5. Fixing members 761, 762, 763, 764, 765, 766 (see FIG. 23) for fixing supports 81, 82, 83, 84, 85, 86 are inserted into holes 241, 242, 243, 244, 322, 324, and supports 81, 82, 83, 84, 85, 86 and fixing members 761, 762, 763, 764, 765, 766 are fixed.

22, the shortest distance between screw 753 and screw 723 (the shortest distance between screw 753 and support 93) is defined as length b. Also, the shortest distance between screw 723 and screw 756 (the shortest distance between support 93 and support 82) is defined as length e. In this case, length e is longer than length b.

22, the distance between the electric/electronic component 6 (or the metal wiring pattern to which the electric/electronic component 6 is connected) and the screw 713 on the circuit board 1 is the shortest distance, and this distance is the length d. The distance between the circuit board 1 and the insulating plate 11, i.e., the length of the support 93, is the length a. The length of the support 85 is the length c. The shortest creepage distance from the metal wiring pattern of the circuit board 1 to the conductive housing 5 via the support 93, the insulating plate 11, and the support 85 is the length (d+a+b+c). The configuration of the electronic device of the present disclosure can be determined so that the shortest creepage distance is equal to or greater than the creepage distance required by the standard. Furthermore, the insulation performance (voltage resistance value) of the electronic device shown in FIG. 22 is proportional to the shortest creepage distance described above. In other words, by increasing the shortest creepage distance, the voltage resistance value of the electronic device can be increased.

<Action>
The electronic device according to the present disclosure includes a conductive housing 5, a circuit board 1, and a connection member 50. The circuit board 1 is disposed at a distance from the conductive housing 5. The connection member 50 connects the conductive housing 5 and the circuit board 1. The connection member 50 includes an insulating plate 11 as a first insulating plate portion 51, supports 91, 92, 93, and 94 as a first connecting portion 53, and supports 81 and 82 as a second connecting portion 54. The insulating plate 11 as the first insulating plate portion 51 is disposed between the conductive housing 5 and the circuit board 1. The insulating plate 11 as the first insulating plate portion 51 extends along the circuit board 1. The insulating plate 11 as the first insulating plate portion 51 is disposed at a distance from both the conductive housing 5 and the circuit board 1. The supports 91, 92, 93, and 94 serving as the first connecting portion 53 are connected to the surface of the insulating plate 11 on the circuit board 1 side in order to position the insulating plate 11 as the first insulating plate portion 51 at a distance from the circuit board 1. The supports 81 and 82 serving as the second connecting portion 54 are connected to the surface of the insulating plate 11 as the first insulating plate portion 51 on the conductive housing 5 side in order to position the insulating plate 11 as the first insulating plate portion 51 at a distance from the conductive housing 5. The supports 91, 92, 93, and 94 serving as the first connecting portion 53 and the supports 81 and 82 serving as the second connecting portion 54 are disposed at different positions in a plan view seen from the circuit board 1 side.

In the electronic device, the connection member 50 may include supports 83, 84, 85, and 86 as the third connection portion 55. The supports 83, 84, 85, and 86 as the third connection portion 55 connect the surface of the insulating plate 11 as the first insulating plate portion 51 on the conductive housing 5 side to the conductive housing 5. The supports 91, 92, 93, and 94 as the first connection portion 53 connect the surface of the insulating plate 11 as the first insulating plate portion 51 on the circuit board 1 side to the circuit board 1. The supports 81 and 82 as the second connection portion 54 connect the surface of the insulating plate 11 as the first insulating plate portion 51 on the conductive housing 5 side to the conductive housing 5. In a plan view seen from the circuit board 1 side, the area of the insulating plate 11 as the first insulating plate portion 51 is larger than the area of the circuit board 1. In a plan view seen from the circuit board 1 side, the supports 83 , 84 , 85 , and 86 serving as the third connection portion 55 are disposed at positions that do not overlap the circuit board 1 .

In the above electronic device, in a plan view seen from the circuit board 1 side, supports 81 and 82 as the second connection portion 54 are located on the central portion 101 side of the circuit board 1 when viewed from supports 91, 92, 93, and 94 as the first connection portion 53 and supports 83, 84, 85, and 86 as the third connection portion 55.

In the above electronic device, in a plan view seen from the circuit board 1 side, the supports 81, 82 serving as the second connection portion 54 are positioned so as to overlap with the circuit board 1.

In the electronic device having the above-mentioned configuration, the same effect as that of the electronic device according to the fourth embodiment can be obtained. Furthermore, in the electronic device described above, by making the area of the insulating plate 11 larger than the area of the circuit board 1, the length b, which is the distance from the support 93 to the support 85, as shown in FIG. 22, can be made sufficiently longer than the length b, which is the distance from the spacer 23 to the spacer 33 in the first embodiment (see FIG. 7). Therefore, the spacers 21, 22, 23, 24, 31, 32, 33, 34, 41, 42, 43, 44 used in the first embodiment can be replaced with the supports 91, 92, 93, 94, 81, 82, 83, 84, 85, 86 (see FIGS. 22 and 23) having a length shorter than the spacers . Furthermore, like the electronic device according to the fourth embodiment, the spatial distance and creepage distance between the circuit board 1 and the conductive housing 5 can be secured, and the electronic device can be made smaller.

Furthermore, in a plan view, the positions of supports 81, 82, 83, 84, 85, and 86 for ensuring the creepage distance are different from the positions of supports 91, 92, 93, and 94. This makes it possible to increase the natural frequency of the circuit board 1 in the electronic device. As a result, the vibration resistance of the circuit board 1 can be improved.

Embodiment 6.
<Configuration of Electronic Device>
FIG. 26 is a schematic perspective view of an electronic device according to a sixth embodiment. The electronic device shown in FIG. 26 basically has the same configuration as the electronic device shown in FIG. 1 and FIG. 2 and can obtain the same effect, but the configuration of the circuit board 1 is different from that of the electronic device shown in FIG. 1 and FIG. 2. That is, in the electronic device shown in FIG. 26, in a plan view seen from the circuit board 1 side, a through hole 801 is formed in an area of the circuit board 1 that overlaps with the spacers 31, 32, 33, and 34 as the second connecting portion 54. Through the through hole 801, the screws 731, 732, 733, and 734 for connecting the insulating plate 11 to the spacers 31, 32, 33, and 34 can be easily operated as described later. The size of the through hole 801 can be set arbitrarily as long as a tool (such as a screwdriver) for operating the screws 731, 732, 733, and 734 can be inserted into the through hole 801.

<Electronic Device Manufacturing Method>
27 and 28 are schematic diagrams for explaining the manufacturing method of the electronic device shown in FIG. 26. In the manufacturing method of the electronic device shown in FIG. 26, a process of preparing a plurality of assemblies in which components constituting the electronic device are connected in advance is carried out. Specifically, as shown in FIG. 27, a first assembly in which a circuit board 1 and an insulating plate 11 are connected via spacers 21, 22, 23, and 24 is prepared. Also, as shown in FIG. 28, a second assembly in which a conductive housing 5 and an insulating plate 12 are connected via spacers 41, 42, 43, and 44 is prepared. In the second assembly, spacers 31, 32, 33, and 34 are fixed to the insulating plate 12. The method of connecting the spacers 21, 22, 23, and 24 to the circuit board 1 and the insulating plate is the same as the corresponding connection method in the electronic device shown in FIG. 1 and FIG. 2. Also, the method of connecting the spacers 41, 42, 43, and 44 to the conductive housing 5 and the insulating plate 12 is the same as the corresponding connection method in the electronic device shown in FIG. 1 and FIG. 2. The method of connecting one end of the spacers 31, 32, 33, and 34 to the insulating plate 12 is similar to the corresponding connection method in the electronic device shown in FIGS.

Next, a process of connecting the first assembly and the second assembly is carried out. Specifically, the insulating plate 11 of the first assembly and the spacers 31, 32, 33, 34 of the second assembly are connected with the screws 731, 732, 733, 734. At this time, a tool such as a screwdriver is inserted into the through hole 801 of the circuit board 1, and the screws 731, 732, 733, 734 can be easily operated with the tool. In this manner, the first assembly and the second assembly are joined. As a result, the electronic device shown in FIG. 26 is obtained.

Here, in the manufacturing method of electronic devices shown in Figures 1 and 2, the steps of fixing insulating plate 12 onto conductive housing 5 via spacers 41, 42, 43, and 44, fixing insulating plate 11 onto insulating plate 12 via spacers 31, 32, 33, and 34, and fixing circuit board 1 onto insulating plate 11 via spacers 21, 22, 23, and 24 are carried out. On the other hand, in the manufacturing process of electronic devices, it is required to shorten the working time from the viewpoint of reducing manufacturing costs. And, in the manufacturing method of electronic devices shown in Figures 1 and 2 described above, there is a limit to how much the working time can be shortened because each step must be carried out sequentially.

On the other hand, in the manufacturing method of the electronic device shown in Figure 26 described above, a first assembly and a second assembly to which multiple members are connected can be prepared in parallel in advance. Furthermore, the electronic device can be manufactured by connecting the first assembly and the second assembly via spacers 31, 32, 33, and 34. In this way, since multiple assemblies that make up the electronic device can be prepared in advance, the work time required to manufacture the electronic device can be shortened.

<Action>
In the electronic device, in a plan view seen from the circuit board 1 side, a through hole 801 is formed in an area overlapping the spacers 31, 32, 33, 34 as the second connection portion 54 on the circuit board 1. In this case, in a state in which the circuit board 1 and the insulating plate 11 are connected via the spacers 21, 22, 23, 24 to form a first assembly, the screws 731, 732, 733, 734 connecting the insulating plate 11 to the insulating plate 12, which is another member, can be operated by a tool such as a screwdriver. This allows the work time required for the manufacturing process of the electronic device to be shortened. For example, a first assembly in which the circuit board 1 and the insulating plate 11 are connected in advance as described above, and a second assembly in which the conductive housing 5 and the insulating plate 12 to which the spacers 31, 32, 33, 34 are fixed are prepared. The insulating plate 11 of the first assembly and the spacers 31, 32, 33, 34 of the second assembly are connected by the screws 731, 732, 733, 734. By preparing the first assembly and the second assembly in advance, each of which is formed by combining a plurality of components, in this way, it is possible to manufacture an electronic device in a shorter working time than in a manufacturing process in which each component is connected in sequence.

The above-described configuration in which the through hole 801 is formed in the circuit board 1 may be applied to embodiments 3 to 5. In this case, too, the same effect as that of the circuit board 1 described above can be obtained.

Embodiment 7.
<Configuration of Electronic Device>
Fig. 29 is a schematic perspective view of an electronic device according to embodiment 7. Fig. 30 is a schematic view for explaining the configuration of the electronic device shown in Fig. 29. Fig. 30 is a schematic plan view of insulating plate 11 in the electronic device shown in Fig. 29.

The electronic device shown in Figures 29 and 30 basically has the same configuration as the electronic device shown in Figures 1 and 2, but the configuration of insulating plates 11 and 12 is different from that of the electronic device shown in Figures 1 and 2. That is, in the electronic device shown in Figures 29 and 30, slits 802 and 803 are formed in insulating plates 11 and 12, respectively.

As shown in FIG. 30, in the insulating plate 11, slits 802 are formed so as to surround the screw through holes 311, 312, 313, and 314 in the center. Two slits 802 are formed so as to face each other across the screw through holes 311, 312, 313, and 314 of the insulating plate 11. The planar shape of the slits 802 is U-shaped. The first slit 802 is formed between the screw through holes 311 and 313 in the center and the screw through holes 221 and 223 formed in the outer periphery of the insulating plate 11. The second slit 802 is formed between the screw through holes 312 and 314 in the center and the screw through holes 222 and 224 formed in the outer periphery of the insulating plate 11. The spacers 21, 22, 23, and 24 as the first connection part 53 are connected to the screw through holes 221, 222, 223, and 224, respectively. Spacers 31, 32, 33, and 34 serving as the second connecting portion 54 are connected to the screw through holes 311, 312, 313, and 314, respectively.

The position and configuration of the slit 803 in the insulating plate 12 of the electronic device shown in FIG. 29 are basically the same as the position and configuration of the slit 802 in the insulating plate 11 shown in FIG. 30. That is, in the insulating plate 12, the slit 803 is formed so as to surround the screw through holes 321, 322, 323, 324 (see FIG. 5) in the center. Two slits 803 are formed so as to face each other across the screw through holes 321, 322, 323, 324 of the insulating plate 12. The planar shape of the slit 803 is U-shaped. The first slit 803 is formed between the screw through holes 321, 323 in the center and the screw through holes 231, 233 (see FIG. 5) formed on the outer periphery of the insulating plate 12. The second slit 803 is formed between the screw through holes 322, 324 (see FIG. 5) in the center and the screw through holes 232, 234 formed on the outer periphery of the insulating plate 12. The spacers 41, 42, 43, and 44 serving as the third connecting portion 55 are connected to the screw through holes 231, 232, 233, and 234, respectively. The spacers 31, 32, 33, and 34 serving as the second connecting portion 54 are connected to the screw through holes 321, 322, 323, and 324, respectively.

Although the slits 802 and 803 have a U-shaped planar shape, any other shape may be adopted. For example, any shape such as an arc shape or a straight line shape may be adopted as the planar shape of the slits 802 and 803. In addition, as the slits 802 and 803, a plurality of slits arranged in a direction from the center to the outer periphery of the insulating plates 11 and 12 may be used. In the electronic device shown in FIG. 29, the slits 802 and 803 are formed in each of the insulating plates 11 and 12, but the slit 802 may be formed only in the insulating plate 11, or the slit 803 may be formed only in the insulating plate 12. In addition, in the electronic device shown in FIG. 29, a through hole 801 (see FIG. 26) may be formed in the circuit board 1 as in the electronic device shown in FIG. 26.

<Action>
In the electronic device, a slit 802 is formed in an area between a position where the first connection portion is connected and a position where the second connection portion is connected in insulating plate 11 as first insulating plate portion 51. Also, a slit 803 is formed in an area between a position where spacers 31, 32, 33, and 34 as second connection portion 54 are connected and a position where spacers 41, 42, 43, and 44 as third connection portion 55 are connected in insulating plate 12 as second insulating plate portion 52.

In this case, by forming the slit 802, the path that defines the creepage distance from the position where the spacers 21, 22, 23, and 24 are connected on the insulating plate 11 to the position where the spacers 31, 32, 33, and 34 are connected bypasses the slit 802. Therefore, the creepage distance on the insulating plate 11 can be made longer than when the slit 802 is not present.

In addition, by forming the slits 803 in the insulating plate 12, the path that defines the creepage distance from the position where the spacers 31, 32, 33, and 34 are connected to the position where the spacers 41, 42, 43, and 44 are connected in the insulating plate 12 bypasses the slits 803. Therefore, the creepage distance in the insulating plate 12 can be made longer than when the slits 803 are not present.

This makes it possible to improve the insulation resistance of electronic devices without increasing their size.

In the insulating plate 11, the distance between the two slits 802 may be made smaller. That is, in the insulating plate 11 shown in FIG. 30, it is preferable that the end of the slit 802 is disposed closer to the center of the insulating plate 11 than the screw holes 311, 312, 313, and 314. For example, by making the length of the slit 802 in the direction from the screw hole 311 to the screw hole 211 (the left-right direction in FIG. 30) sufficiently long, the end of the slit 802 is disposed closer to the center of the insulating plate 11 than the screw holes 311, 312, 313, and 314.

In other words, by increasing the distance between the end of the slit 802 formed in the region between the spacers 21, 23 and the spacers 31, 33 and the spacers 21, 23 and the spacers 31, 33, it is possible to increase the creepage distance from the position where the spacers 21, 23 are connected to the position where the spacers 31, 33 are connected. Also, by increasing the distance between the end of the slit 802 formed in the region between the spacers 22, 24 and the spacers 32, 34 and the spacers 22, 24 and the spacers 32, 34, it is possible to increase the creepage distance from the position where the spacers 22, 24 are connected to the position where the spacers 32, 34 are connected.

29 and 30, the screw hole 311 and the screw hole 221 arranged on either side of the slit 802 may be arranged at a position away from the end of the slit 802, and the distance between the screw hole 311 and the screw hole 221 may be smaller. For example, the screw hole 311 closer to the center may be arranged closer to the screw hole 221 located at the end of the insulating plate 11. In this case, the creeping distance from the screw hole 221 (the position where the spacer 21 is connected) to the screw hole 311 (the position where the spacer 31 is connected) can be further increased. In this case, the positions of the spacers 31, 32, 33, and 34 that fix the insulating plate 11 to the insulating plate 12 can be moved closer to the outer periphery of the insulating plate 11, thereby improving the rigidity of the electronic device. The configuration of the slit 802 described above can also be applied to the slit 803 of the insulating plate 12.

In order to ensure the strength of the insulating plate 11, it is preferable that the distance between the two slits 802 is at least 1/6 of the length of the side of the insulating plate 11 (the side along which the two slits 802 are aligned, extending in the left-right direction in FIG. 30). The width of the slits 802 and 803 depends on the voltage applied to the circuit board 1 and the size and thickness of the insulating plates 11 and 12 used, but can be, for example, 0.5 mm to 5 mm.

The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. Unless inconsistent, at least two of the embodiments disclosed herein may be combined. The basic scope of the present disclosure is indicated by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims.

1,1001 Circuit board, 5,1005 Conductive housing, 6,1006 Electrical and electronic components, 11,12 Insulating plate, 16 Insulating structure, 16a,16b,16c,16d Upper convex portion, 16e,16f,16g,16h Lower convex portion, 16i,101 Center portion, 17 First insulating structure, 17a,17b,17c,17d Convex portion, 18 Second insulating structure, 18a,18b,18c,18d convex portion, 16aa, 16bb, 17aa, 211, 212, 213, 214, 221, 222, 223, 224, 231, 232, 233, 234, 235, 236, 251, 311, 312, 313, 314, 321, 322, 323, 324 screw through holes, 21, 22, 23, 24, 31, 32, 33, 34, 41, 42, 43, 44, 1020 spacer, 50 connection member, 51 first insulating plate portion, 52 second insulating plate portion, 53 first connection portion, 54 second connection portion, 55 third connection portion, 71, 72, 73, 74, 81, 82, 83, 84, 85, 86, 91, 92, 93, 94 Support, 161 First flat plate part, 161a, 161b, 162a, 162b Extension part, 162 Second flat plate part, 241, 242, 243, 244 Hole, 711, 712, 713, 714, 721, 723, 731, 741, 742, 743, 744, 751, 752, 753, 754 , 755, 756 screw, 761, 762, 763, 764, 765, 766 fixing member, 801 through hole, 802, 803 slit.

Claims (13)

A conductive housing;
a circuit board disposed at a distance from the conductive housing;
a connection member that connects the conductive housing and the circuit board;
The connecting member is
a first insulating plate portion disposed between the conductive housing and the circuit board and extending along the circuit board;
The first insulating plate portion is disposed at a distance from both the conductive housing and the circuit board, and the connecting member further comprises:
a first connection portion connected to a surface of the first insulating plate portion facing the circuit board so as to position the first insulating plate portion at a distance from the circuit board;
a second connection portion connected to a surface of the first insulating plate portion facing the conductive housing to position the first insulating plate portion at a distance from the conductive housing;
The electronic device, wherein the first connection portion and the second connection portion are arranged at different positions in a plan view seen from the circuit board side. The connecting member is
a second insulating plate portion disposed between the conductive housing and the first insulating plate portion and spaced apart from the conductive housing and the first insulating plate portion;
a third connection portion that connects a surface of the second insulating plate portion on the conductive housing side to the conductive housing in order to position the second insulating plate portion at a distance from the conductive housing,
the first connection portion connects the surface of the first insulating plate portion facing the circuit board to the circuit board,
the second connection portion connects the surface of the first insulating plate portion on the conductive housing side to the second insulating plate portion,
The electronic device according to claim 1 , wherein the third connection portion and the second connection portion are disposed at different positions in a plan view seen from the circuit board side. The electronic device according to claim 2, wherein a slit is formed in the second insulating plate portion in a region between a position where the second connection portion is connected and a position where the third connection portion is connected. 4 . The electronic device according to claim 2 , wherein in a plan view from the circuit board side, the second connection portion is located toward a center portion of the circuit board when viewed from the first connection portion and the third connection portion. The electronic device according to any one of claims 2 to 4, wherein the first connection portion and the third connection portion overlap in a plan view from the circuit board side. In a plan view seen from the circuit board side,
an area of the first insulating plate portion and an area of the second insulating plate portion are larger than an area of the circuit board;
5. The electronic device according to claim 2, wherein the third connection portion is disposed at a position not overlapping with the circuit board. In a plan view seen from the circuit board side,
The electronic device according to claim 1 , wherein the second connection portion is disposed at a position overlapping the circuit board. In a plan view seen from the circuit board side,
The electronic device according to claim 7 , wherein a through hole is formed in a region of the circuit board that overlaps with the second connection portion. The electronic device according to any one of claims 2 to 5, wherein the connection member is an insulating structure in which the first insulating plate portion, the second insulating plate portion, the first connection portion, the second connection portion, and the third connection portion are integrally formed. the first insulating plate portion and the first connecting portion are integrally formed as a first insulating structure,
the second insulating plate portion and the third connecting portion are integrally formed as a second insulating structure,
6. The electronic device according to claim 2, wherein the first insulating structure and the second insulating structure have the same shape. the connecting member includes a third connecting portion that connects the surface of the first insulating plate portion facing the conductive housing to the conductive housing,
the first connection portion connects the surface of the first insulating plate portion facing the circuit board to the circuit board,
the second connection portion connects the surface of the first insulating plate portion on the conductive housing side to the conductive housing,
In a plan view seen from the circuit board side,
an area of the first insulating plate portion is larger than an area of the circuit board;
The electronic device according to claim 1 , wherein the third connection portion is disposed at a position not overlapping the circuit board. The electronic device according to claim 11, wherein, in a plan view from the circuit board side, the second connection portion is located toward the center of the circuit board when viewed from the first connection portion and the third connection portion. The electronic device according to any one of claims 1 to 12, wherein a slit is formed in the first insulating plate portion in a region between a position where the first connection portion is connected and a position where the second connection portion is connected.

Images