JP7567372B2 - 三次元造形装置 - Google Patents
三次元造形装置 Download PDFInfo
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- JP7567372B2 JP7567372B2 JP2020182320A JP2020182320A JP7567372B2 JP 7567372 B2 JP7567372 B2 JP 7567372B2 JP 2020182320 A JP2020182320 A JP 2020182320A JP 2020182320 A JP2020182320 A JP 2020182320A JP 7567372 B2 JP7567372 B2 JP 7567372B2
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- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/665—Local sintering, e.g. laser sintering
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- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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Description
ステージと、
無機粉末およびバインダーを含む材料を供給する材料供給手段と、
移動手段と、
レーザーと、
制御部と、
を含み、
前記制御部は、
前記材料供給手段を制御して前記ステージ上に前記材料を供給する処理と、
前記レーザーを制御して、前記ステージ上の前記材料に、エネルギー密度が140J/mm3以上のレーザー光を照射する処理を行う。
1.1. 全体の構成
まず、本実施形態に係る三次元造形装置について、図面を参照しながら説明する。図1は、本実施形態に係る三次元造形装置100を模式的に示す断面図である。なお、図1では、互いに直交する3軸として、X軸、Y軸、およびZ軸を示している。X軸方向およびY軸方向は、例えば、水平方向である。Z軸方向は、例えば、鉛直方向である。
10を移動させる。これにより、ステージ20と、材料供給手段120およびレーザー130と、の相対的な位置を変化させることができる。図示の例では、移動手段30は、支持部材110に接続されており、支持部材110を移動させることにより、造形ユニット10を移動させる。
材料供給手段120によってステージ20上に供給される材料は、無機粉末およびバインダーを含む。無機粉末の材質は、例えば、金属、セラミックである。材料供給手段120によって供給される材料は、金属粉末とセラミック粉末との両方を含んでいてもよい。
制御部40は、移動手段30、材料供給手段120、およびレーザー130を制御する。図2は、制御部40の処理を説明するためのフローチャートである。図3および図4は、三次元造形装置100で製造される三次元造形物の製造工程を模式的に示す断面図である。
0mm/sec以下、エネルギー密度Egを140J/mm3以上となるように制御する。
三次元造形装置100では、制御部40は、材料供給手段120を制御して、ステージ20上に材料50を供給する処理と、レーザー130を制御して、ステージ20上の材料50に、エネルギー密度が140J/mm3以上のレーザー光を照射する処理を行う。そのため、三次元造形装置100では、後述する実験例のように、造形層52の残膜率を大きくすることができ、無機粉末の飛散を抑制することができる。これにより、三次元造形物の厚さの安定化を図ることができる。
無機粉末としてSUS630の粉末と、バインダーとしてPVAと、を含む材料を用意した。材料におけるPVAの含有量を、8質量%とした。この材料をノズルからステージ上に供給し、レーザー光を照射した。レーザー光として、角トップハット形状のものと、ガウシアン形状のものと、の2種類を用いた。レーザー光のビーム幅、出力、およびスキャン速度を調整することにより、照射エネルギー密度を振った。
ステージと、
無機粉末およびバインダーを含む材料を供給する材料供給手段と、
レーザーと、
制御部と、
を含み、
前記制御部は、
前記材料供給手段を制御して、前記ステージ上に前記材料を供給する処理と、
前記レーザーを制御して、前記ステージ上の前記材料に、エネルギー密度が140J/mm3以上のレーザー光を照射する処理を行う。
前記材料供給手段は、前記材料を吐出するノズルを有し、
前記レーザー光が照射される前の前記材料における前記バインダーの含有量は、6質量%以上9質量%以下であってもよい。
前記レーザー光は、角トップハット形状を有してもよい。
前記制御部は、前記材料を供給する処理において、前記ステージの第1領域に前記材料を供給し、前記ステージの前記第1領域と異なる第2領域に前記材料を供給しなくてもよい。
Claims (3)
- ステージと、
無機粉末およびバインダーを含む材料を供給する材料供給手段と、
レーザーと、
制御部と、
を含み、
前記制御部は、
前記材料供給手段を制御して、前記ステージ上に前記材料を供給する処理と、
前記レーザーを制御して、前記ステージ上の前記材料に、エネルギー密度が140J/mm3以上500J/mm 3 以下のレーザー光を照射する処理を行い、
前記材料供給手段は、前記材料を吐出するノズルを有し、
前記レーザー光が照射される前の前記材料における前記バインダーの含有量は、6質量%以上9質量%以下である、三次元造形装置。 - 請求項1において、
前記レーザー光は、角トップハット形状の形状を有する、三次元造形装置。 - 請求項1または2において、
前記制御部は、前記材料を供給する処理において、前記ステージの第1領域に前記材料を供給し、前記ステージの前記第1領域と異なる第2領域に前記材料を供給しない、三次元造形装置。
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| CN202111263879.5A CN114433875A (zh) | 2020-10-30 | 2021-10-27 | 三维造型装置 |
| US17/452,619 US20220134432A1 (en) | 2020-10-30 | 2021-10-28 | Three-dimensional shaping apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2017002387A (ja) | 2015-06-16 | 2017-01-05 | セイコーエプソン株式会社 | 3次元形成装置および3次元形成方法 |
| JP2017043805A (ja) | 2015-08-26 | 2017-03-02 | セイコーエプソン株式会社 | 3次元形成装置、3次元形成方法および3次元形成物 |
| WO2018230421A1 (ja) | 2017-06-15 | 2018-12-20 | 住友電工焼結合金株式会社 | 造形物の製造方法、及び造形物 |
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| EP1418013B1 (en) * | 2002-11-08 | 2005-01-19 | Howmedica Osteonics Corp. | Laser-produced porous surface |
| DE102013019716A1 (de) * | 2013-11-27 | 2015-05-28 | Voxeljet Ag | 3D-Druckverfahren mit Schlicker |
| JP6359316B2 (ja) * | 2014-03-31 | 2018-07-18 | 三菱重工業株式会社 | 三次元積層装置及び三次元積層方法 |
| JP6547262B2 (ja) * | 2014-09-25 | 2019-07-24 | セイコーエプソン株式会社 | 3次元形成装置および3次元形成方法 |
| JP2016172893A (ja) * | 2015-03-17 | 2016-09-29 | セイコーエプソン株式会社 | 3次元形成装置および3次元形成方法 |
| US20200086388A1 (en) * | 2015-07-15 | 2020-03-19 | Nuburu, Inc. | Additive Manufacturing System with Addressable Array of Lasers and Real Time Feedback Control of each Source |
| DE102015226722A1 (de) * | 2015-12-23 | 2017-06-29 | Eos Gmbh Electro Optical Systems | Vorrichtung und Verfahren zum Kalibrieren einer Vorrichtung zum generativen Herstellen eines dreidimensionalen Objekts |
| CN110073040B (zh) * | 2016-12-13 | 2022-05-10 | 巴斯夫欧洲公司 | 用作熔融沉积成型中的支撑材料的纤丝 |
| CN107262713B (zh) * | 2017-05-08 | 2020-02-21 | 广东工业大学 | 一种光内同轴送粉激光冲击锻打复合加工成形装置及方法 |
| GB201809901D0 (en) * | 2018-06-15 | 2018-08-01 | Ascend Diagnostics Ltd | Improvements in and relating to mass spectrometers |
| US20200384535A1 (en) * | 2019-06-10 | 2020-12-10 | Canon Kabushiki Kaisha | Three-dimensional shaping method |
| JP7221157B2 (ja) * | 2019-07-02 | 2023-02-13 | 株式会社荏原製作所 | Am装置 |
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- 2020-10-30 JP JP2020182320A patent/JP7567372B2/ja active Active
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- 2021-10-27 CN CN202111263879.5A patent/CN114433875A/zh active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017002387A (ja) | 2015-06-16 | 2017-01-05 | セイコーエプソン株式会社 | 3次元形成装置および3次元形成方法 |
| JP2017043805A (ja) | 2015-08-26 | 2017-03-02 | セイコーエプソン株式会社 | 3次元形成装置、3次元形成方法および3次元形成物 |
| WO2018230421A1 (ja) | 2017-06-15 | 2018-12-20 | 住友電工焼結合金株式会社 | 造形物の製造方法、及び造形物 |
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