JP7567720B2 - Insulating aluminum alloy conductor and its manufacturing method - Google Patents

Description

The present invention relates to an insulating aluminum alloy conductor and a method for manufacturing the same.

Insulating aluminum alloy conductors, which are aluminum alloy conductors covered with an insulating layer, are widely used as conductive materials and heat sink materials for various electrical devices that require insulation. Examples of aluminum alloys that are used include Al-Cu alloys, Al-Mn alloys, Al-Si alloys, and Al-Mg-Si alloys. Resins such as polyimide and polyamide-imide resins are used as materials for the insulating layer of insulating aluminum alloy conductors.

Electrodeposition is a known method for coating the surface of an aluminum alloy conductor with an insulating layer. The electrodeposition method includes an electrodeposition process and a baking process. In the electrodeposition process, the conductor body and a counter electrode are immersed in an electrodeposition solution in which charged resin particles are dispersed, and a voltage is applied between the conductor body and the counter electrode to electrodeposit the resin particles onto the surface of the conductor body, forming an electrodeposition layer. In the baking process, the electrodeposition layer is heated and baked onto the conductor body to form an insulating layer.

Electrodeposition methods include anionic electrodeposition, which uses resin particles made of a resin with anionic groups, and cationic electrodeposition, which uses resin particles made of a resin with cationic groups. In anionic electrodeposition, a voltage is applied to the conductor body as the anode and the counter electrode as the cathode. In cationic electrodeposition, a voltage is applied to the conductor body as the cathode and the counter electrode as the anode. For example, Patent Document 1 discloses an electrodeposition liquid (electrodeposition coating composition) that uses a block copolymer polyimide that has siloxane bonds in the molecular skeleton and anionic groups in the molecule as the material for the insulating layer.

JP 2015-156378 A

An insulating layer formed by anionic electrodeposition of polyamide-imide resin having carboxyl groups has high heat resistance and flexibility, and is therefore used for highly heat-resistant enameled wires. However, anionic electrodeposition has a problem in that protons are generated on the surface of the conductor body, which is the anode, during electrodeposition, and the pH of the electrodeposition solution around the conductor body may decrease. If the pH of the electrodeposition solution decreases and the electrodeposition solution becomes acidic, aluminum from the conductor body may dissolve into the electrodeposition solution and hydrogen gas may be generated. If hydrogen gas is generated during electrodeposition, hydrogen gas may be mixed into the electrodeposition layer, and bubbles may be mixed into the film, which may cause poor appearance. If this polyamide-imide resin is coated on an aluminum substrate using anionic electrodeposition, the electrodeposition layer immediately after electrodeposition may have abnormal appearance, which is thought to be caused by the bubbles, and unevenness or bubbles may occur in the insulating layer after baking.

The present invention was made in consideration of these circumstances, and aims to provide an insulating aluminum alloy conductor that can be manufactured by anionic electrodeposition and is coated with an insulating layer having a smooth surface with minimal irregularities, and a method for manufacturing the same.

In order to solve the above problems, the insulating aluminum alloy conductor of the present invention is an insulating aluminum alloy conductor including a conductor body made of an aluminum alloy and an insulating layer covering the conductor body, the conductor body having a Si content in the range of 0.3% by mass to 13.5% by mass, a Mg content of 1.8% by mass or less, and the insulating layer containing a polyamide-imide resin having a carboxyl group.

According to the insulating aluminum alloy conductor having such a configuration, the insulating layer contains a polyamide-imide resin having a carboxyl group, and therefore can be manufactured by anionic electrodeposition. The Si content of the conductor body is set to be within the range of 0.3 mass% to 13.5 mass%, so that in the electrodeposition process when manufacturing the insulating aluminum alloy conductor by anionic electrodeposition, the pH of the electrodeposition solution around the conductor body is lowered, and even when the electrodeposition solution becomes acidic, aluminum is less likely to be eluted from the conductor body. This reduces the amount of hydrogen gas generated by the elution of aluminum, thereby reducing the appearance defects of the electrodeposition layer. Furthermore, the Mg content of the conductor body is set to be 1.8 mass% or less, and the content of Mg, which has a higher ionization tendency than aluminum, is low, so that aluminum is less likely to be eluted from the conductor body even when the electrodeposition solution becomes acidic. Therefore, the insulating aluminum alloy conductor having the above configuration has a smooth surface of the insulating layer with few irregularities.

In the insulating aluminum alloy conductor of the present invention, the conductor body may have a Si content in the range of 0.5 mass % or more and 11.0 mass % or less.
In this case, since the Si content of the conductor body is within the range of 0.5 mass% or more and 11.0 mass% or less, aluminum is less likely to dissolve from the conductor body even when the electrodeposition solution becomes acidic during the electrodeposition process when producing an insulating aluminum alloy conductor by anionic electrodeposition.

In the insulative aluminum alloy conductor of the present invention, the conductor body may have a Mg content in the range of 0.8 mass % to 1.3 mass %.
In this case, since the Mg content of the conductor body is 0.8 mass% or more, the conductor body has high hardness and improves workability. Also, since the Mg content of the conductor body is 1.3 mass% or less, aluminum is further prevented from eluting from the conductor body even when the electrodeposition solution becomes acidic.

The method for producing an insulating aluminum alloy conductor of the present invention includes an electrodeposition step in which resin particles are electrodeposited on the surface of a conductor body made of an aluminum alloy by anionic electrodeposition to obtain a conductor body with an electrodeposition layer, and a baking step in which the conductor body with the electrodeposition layer is heated to bake the electrodeposition layer onto the conductor body to form an insulating layer and obtain an insulating aluminum alloy conductor, characterized in that the Si content of the conductor body is in the range of 0.3 mass% to 13.5 mass%, the Mg content is 1.8 mass% or less, and in the electrodeposition step, the conductor body is immersed in an electrodeposition liquid containing resin particles containing a polyamideimide resin having a carboxyl group.

According to the manufacturing method of the insulating aluminum alloy conductor having such a configuration, since the electrodeposition liquid contains resin particles containing polyamide-imide resin having carboxyl groups, the electrodeposition layer can be formed by anionic electrodeposition. The Si content of the conductor body is set to be within the range of 0.3 mass% to 13.5 mass%, so that in the electrodeposition process, even when the pH of the electrodeposition liquid around the conductor body decreases and the electrodeposition liquid becomes acidic, aluminum is less likely to be eluted from the conductor body. This reduces the amount of hydrogen gas generated by the elution of aluminum, thereby reducing the appearance defects of the electrodeposition layer. Furthermore, since the Mg content of the conductor body is set to be 1.8 mass% or less, and the content of metals having a higher ionization tendency than aluminum is low, aluminum is less likely to be eluted from the conductor body even when the electrodeposition liquid becomes acidic. Therefore, the manufacturing method having the above configuration makes it possible to manufacture an insulating aluminum alloy conductor with a smooth surface of the insulating layer and less unevenness.

The present invention makes it possible to provide an insulated aluminum alloy conductor that can be manufactured by anionic electrodeposition and is coated with an insulating layer having a smooth surface with minimal irregularities, as well as a method for manufacturing the same.

FIG. 1 is a cross-sectional view of an insulative aluminum alloy conductor according to one embodiment of the present invention. FIG. 1 is a flow diagram showing a method for producing an insulated aluminum alloy conductor according to an embodiment of the present invention. FIG. 1 is a diagram showing the configuration of an electrodeposition apparatus that can be used in a method for producing an insulated aluminum alloy conductor according to one embodiment of the present invention.

Below, an insulated aluminum alloy conductor and a method for manufacturing the same, which is one embodiment of the present invention, will be described with reference to the attached drawings.

FIG. 1 is a cross-sectional view of an insulative aluminum alloy conductor according to one embodiment of the present invention.
As shown in FIG. 1 , an insulative aluminum alloy conductor 10 according to this embodiment includes a conductor body 11 and an insulating layer 12 that covers the conductor body 11 .

The conductor body 11 is made of an aluminum alloy.
The aluminum alloy contains Si. Si has the effect of chemically stabilizing the aluminum alloy and making it less soluble in acid. In addition, Si has the effect of improving the strength of the aluminum alloy. On the other hand, if the content of Si is too high, the strength of the aluminum alloy may become too high, and the workability may decrease. For this reason, in this embodiment, the content of Si in the conductor body 11 is set to be in the range of 0.3 mass% or more and 13.5 mass% or less. The content of Si in the conductor body 11 is preferably in the range of 0.5 mass% or more and 11.0 mass% or less, and particularly preferably in the range of 0.8 mass% or more and 11.0 mass% or less.

The aluminum alloy may contain Mg. Mg has the effect of reducing the weight of the aluminum alloy and improving its hardness. On the other hand, Mg has a higher ionization tendency than aluminum. Therefore, if the Mg content is too high, the aluminum alloy becomes more likely to dissolve in acid. For this reason, in this embodiment, the Mg content of the conductor body 11 is set to 1.8 mass% or less. From the viewpoint of the solubility of the aluminum alloy in acid, the Mg content is preferably 1.3 mass% or less. Also, from the viewpoint of improving the hardness of the aluminum alloy, the Mg content of the conductor body 11 is preferably 0.8 mass% or more.

The aluminum alloy preferably contains 0.1 mass% or less of each of Li, K, Ca, and Na. These metals have a higher ionization tendency than aluminum. Therefore, if the content of these metals is too high, the aluminum alloy may become more easily dissolved in acid.

Aluminum alloys include Al-Cu alloys, Al-Mn alloys, and Al-Si alloys. Al-Mg-Si alloys can be used. As an Al-Cu alloy, a 2000 series alloy such as A2024 can be used. As an Al-Mn alloy, a 3000 series alloy such as A3003 can be used. As an Al-Si alloy, a 4000 series alloy such as A4032 can be used. As an Al-Mg-Si alloy, a 6000 series alloy such as A6061 can be used. Of these alloys, the 6000 series alloy is preferred.

The insulating layer 12 contains a polyamideimide resin having a carboxyl group. The polyamideimide resin having a carboxyl group may be electrodeposited on the surface of the conductor body 11 by anionic electrodeposition. The polyamideimide resin having a carboxyl group electrodeposited by anionic electrodeposition has high adhesion to the conductor body 11. This increases the heat resistance of the insulating layer 12. In addition, the insulating layer 12 has high flexibility, so that peeling is unlikely to occur even when the conductor body 11 is deformed.

The shape of the insulating aluminum alloy conductor 10 is not particularly limited, and may be, for example, linear, cylindrical, square prism, coiled, etc. The thickness of the insulating layer 12 is not particularly limited, and may be, for example, in the range of 5 μm to 100 μm.

Next, a method for producing the insulating aluminum alloy conductor of this embodiment will be described.
FIG. 2 is a flow diagram showing a method for producing an insulated aluminum alloy conductor according to one embodiment of the present invention.
As shown in FIG. 2, the method for producing an insulating aluminum alloy conductor according to this embodiment includes a degreasing step S01, an electrodeposition step S02, and a baking step S03.

The degreasing step S01 is a step of removing grease adhering to the surface of the conductor body 11. As a method of removing grease, for example, a method of immersing the conductor body 11 in a degreaser can be adopted. As the degreaser, an organic solvent or a surfactant can be used. For example, in this embodiment, the grease adhering to the surface of the substrate is dissolved and removed by immersing the substrate for 1 minute in an aqueous degreaser solution containing 10 mass% of a degreaser (Neo Sundep S, manufactured by Nippon Marcel Co., Ltd.) with a liquid temperature of about 20°C.

The conductor body 11 preferably has a surface roughness Ra of 2.0 μm or less. By using a conductor body 11 with a smooth surface having a surface roughness Ra of 2.0 μm or less, air bubbles generated in the next electrodeposition step S02 are less likely to adhere to the surface of the conductor body 11.

The electrodeposition step S02 is a step of electrodepositing resin particles onto the surface of the conductor body 11 made of an aluminum alloy by anionic electrodeposition to obtain the conductor body 11 with an electrodeposition layer.
FIG. 3 is a diagram showing the configuration of an electrodeposition apparatus that can be used in the method for producing an insulated aluminum alloy conductor according to one embodiment of the present invention.
The electrodeposition apparatus 20 shown in Fig. 3 has an electrodeposition tank 21 and a power source 22. An electrodeposition liquid 30 is stored in the electrodeposition tank 21. A conductor body 11 and a counter electrode 23 are immersed in the electrodeposition liquid 30. The power source 22 is connected to the conductor body 11 and the counter electrode 23.

The electrodeposition liquid 30 contains resin particles 31 and a solvent 32 .
The resin particles 31 contain a polyamideimide resin having a carboxyl group. The resin particles 31 are negatively charged. The particle diameter of the resin particles 31 is not particularly limited, but may be, for example, in the range of 50 nm to 500 nm in terms of median diameter. The content of the resin particles 31 in the electrodeposition liquid is not particularly limited, but may be, for example, in the range of 1 mass % to 10 mass %, and preferably in the range of 1.5 mass % to 5 mass %.

The solvent 32 may include an organic solvent, water, and a hydrophobic base.
As the organic solvent, for example, polar solvents such as N-methyl-2-pyrrolidone (NMP), N,N-dimethylformamide (DMF), N,N-dimethylacetamide (DMAc), 1,3 dimethylimidazolidinone, dimethyl sulfoxide (DMSO), and γ-butyrolactone (γ-BL) can be used. These solvents may be used alone or in combination of two or more. In addition, it is preferable that the hydrophobic base has affinity for the organic solvent. Examples of the hydrophobic base include tri-n-propylamine, tri-n-butylamine, dibenzylamine, decylamine, octylamine, hexylamine, diamylamine, dihexylamine, dioctylamine triamylamine, trihexylamine, trioctylamine, tribenzylamine, and aniline. These hydrophobic bases may be used alone or in combination of two or more. The content of the organic solvent relative to the total amount of the organic solvent and water is, for example, in the range of 10% by mass to 87% by mass, and the content of the hydrophobic base is, for example, in the range of 0.02% by mass to 0.1% by mass with respect to the electrodeposition solution 30.

The electrodeposition liquid 30 can be obtained, for example, by adding water, which is a poor solvent for the polyamideimide solution, to a polyamideimide resin solution prepared by mixing a polyamideimide resin having a carboxyl group, an organic solvent capable of dissolving the polyamideimide resin, and a hydrophobic base.

The electrodeposition liquid 30 may further contain fluororesin particles. Examples of fluororesin particles include polytetrafluoroethylene (PTFE), perfluoroalkoxy fluororesin (PFA) particles, and tetrafluoroethylene-hexafluoropropylene copolymer (FEP) particles. There are no particular limitations on the content of fluororesin particles in the electrodeposition liquid, but it is, for example, in the range of 0.5% by mass to 10% by mass with respect to the electrodeposition liquid 30, and in the range of 100% by mass to 1000% by mass with respect to the resin particles 31 (polyamideimide resin particles).

In the electrodeposition step S02, the conductor body 11 immersed in the electrodeposition liquid 30 is used as the anode, and the counter electrode 23 is used as the cathode, and a DC voltage is applied using the power source 22. The applied DC voltage is preferably in the range of 1 V to 600 V. By applying the DC voltage, the resin particles 31 in the electrodeposition liquid 30 are electrodeposited onto the surface of the conductor body 11 to form an electrodeposition layer.

The baking step S03 is a step in which the conductor body 11 with the electrodeposition layer is heated to bake the electrodeposition layer onto the conductor body 11 to form an insulating layer and obtain an insulating aluminum alloy conductor. The baking temperature may be within a temperature range in which the polyamideimide resin in the electrodeposition layer hardens and an insulating layer is formed on the substrate, and may be in the range of 200°C to 450°C. The baking time may be, for example, in the range of 1 minute to 60 minutes.

Before the electrodeposition layer is baked onto the conductor body, the electrodeposition liquid 30 adhering to the conductor body 11 with the electrodeposition layer may be removed. Methods for removing the electrodeposition liquid 30 include blowing compressed air onto the conductor body 11 with the electrodeposition layer to blow off the electrodeposition liquid 30, and heating the conductor body 11 with the electrodeposition layer at a temperature lower than the temperature at which the electrodeposition layer is formed to volatilize the electrodeposition liquid 30.

Through the above steps, an insulating layer 12 containing polyamide-imide resin can be formed on the surface of the conductor body 11. Note that if no oil or grease is attached to the surface of the conductor body 11, the degreasing step S01 may be omitted.

According to the insulating aluminum alloy conductor 10 configured as above, the insulating layer 12 contains a polyamide-imide resin having a carboxyl group, so that it can be manufactured by anionic electrodeposition. The Si content of the conductor body 11 is set to be within the range of 0.3 mass% to 13.5 mass%, so that in the electrodeposition step S02 when manufacturing the insulating aluminum alloy conductor 10 by anionic electrodeposition, the pH of the electrodeposition liquid 30 around the conductor body 11 is lowered, so that even when the electrodeposition liquid 30 becomes acidic, aluminum is less likely to be eluted from the conductor body 11. This reduces the amount of hydrogen gas generated by the elution of aluminum, thereby reducing the appearance defects of the electrodeposition layer. Furthermore, since the Mg content of the conductor body 11 is set to be 1.8 mass% or less, aluminum is less likely to be eluted from the conductor body 11 even when the electrodeposition liquid 30 becomes acidic. Therefore, the insulating aluminum alloy conductor 10 configured as above has a smooth surface of the insulating layer 12 with few irregularities.

In addition, in the insulating aluminum alloy conductor of the present invention, when the Si content of the conductor body 11 is within the range of 0.5 mass% or more and 11.0 mass% or less, aluminum is less likely to dissolve from the conductor body 11 even when the electrodeposition solution becomes acidic during the electrodeposition process when manufacturing the insulating aluminum alloy conductor 10 by anionic electrodeposition.

In addition, in the insulating aluminum alloy conductor 10 of the present invention, when the Mg content of the conductor body 11 is 1.3 mass% or less, aluminum is even less likely to dissolve from the conductor body 11 even when the electrodeposition solution becomes acidic. In addition, in the insulating aluminum alloy conductor 10 of this embodiment, when the Mg content of the conductor body 11 is 0.8 mass% or more, the hardness of the conductor body 11 is increased.

In addition, according to the manufacturing method of the insulating aluminum alloy conductor of this embodiment, since the electrodeposition liquid 30 contains resin particles 31 containing polyamideimide resin having a carboxyl group, the electrodeposition layer can be formed by anionic electrodeposition. Since the Si content of the conductor body 11 is set to a range of 0.3 mass% to 13.5 mass%, in the electrodeposition step S02, the pH of the electrodeposition liquid 30 around the conductor body 11 decreases, and even when the electrodeposition liquid 30 becomes acidic, aluminum is less likely to dissolve from the conductor body 11. This reduces the amount of hydrogen gas generated by the dissolution of aluminum, thereby reducing the appearance defects of the electrodeposition layer. Furthermore, since the Mg content of the conductor body 11 is set to 1.8 mass% or less, aluminum is less likely to dissolve from the conductor body 11 even when the electrodeposition liquid 30 becomes acidic. Therefore, the manufacturing method of this embodiment makes it possible to manufacture an insulating aluminum alloy conductor 10 in which the surface of the insulating layer 12 is smooth and has few irregularities.

The above describes an embodiment of the present invention, but the present invention is not limited to this and can be modified as appropriate without departing from the technical concept of the invention.

[Example 1]
(Preparation of electrodeposition solution)
Carboxyl group-containing polyamideimide (PAI) was dissolved in NMP (N-methyl-2-pyrrolidone) to obtain a PAI varnish with a PAI concentration of 20% by mass. NMP, tri-n-propylamine, and water were added to the obtained PAI varnish to precipitate PAI particles, and an electrodeposition solution with the following composition was prepared: PAI particles:NMP:water:tri-n-propylamine=2.0% by mass:79% by mass:18.95% by mass:0.05% by mass.

(Degreasing process)
As an aluminum alloy conductor, a conductor body (A2024, width: 1 cm, length: 10 cm, thickness: 0.3 cm) made of an aluminum alloy containing 0.5% by mass of Si, 1.8% by mass of Mg, and the remainder Al was prepared. The conductor body was machined to a surface roughness Ra of 2 μm. The machined conductor body was immersed in a degreaser aqueous solution containing 10% by mass of a degreaser (Neo Sandep S, manufactured by Nippon Marcel Co., Ltd.) for 1 minute. After immersion, the conductor body was removed from the degreaser, washed with water, and then the moisture on the surface was wiped off. In this way, the conductor body was degreased.

(Electrodeposition process)
The electrodeposition solution prepared in (1) above was placed in an electrodeposition tank equipped with a stirrer and a thermostat. A cylindrical counter electrode (diameter: 5 cm, length: 15 cm, thickness: 0.3 mm) made of pure copper was immersed in the electrodeposition solution. Next, the conductor body degreased in (2) above was immersed in the center of the cylindrical counter electrode. Furthermore, a stirrer and a throw-in thermostat were placed in the electrodeposition solution.

The temperature of the electrodeposition solution was adjusted to 10°C. Next, while stirring the electrodeposition solution, a voltage of 100 V was applied for 20 seconds with the conductor body as the anode and the cylindrical counter electrode as the cathode, to adhere PAI resin particles to the surface of the conductor body, thereby obtaining a conductor body with an electrodeposition layer.

(Baking process)
The conductor body with the electrodeposition layer was removed from the electrodeposition bath, and the electrodeposition layer was washed with water. Next, the washed conductor body with the electrodeposition layer was heated at 100° C. for 10 minutes to dry the electrodeposition layer, and then heated at 220° C. for 30 minutes to bake the electrodeposition layer onto the conductor body.

In this way, an insulating aluminum alloy conductor was produced. The thickness of the insulating layer of the resulting insulating aluminum alloy conductor was 34 μm.

[Inventive Examples 2 to 6, Comparative Examples 1 to 3]
An insulating aluminum alloy conductor was produced in the same manner as in Example 1 of the present invention, except that the conductor body used had a chemical composition shown in Table 1 below. The thickness of the insulating layer of the resulting insulating aluminum alloy conductor was 34 μm, the same as that obtained in Example 1 of the present invention.

[evaluation]
The following evaluations were carried out on the insulating aluminum alloy conductors obtained in Inventive Examples 2 to 6 and Comparative Examples 1 to 3. The results are shown in Table 1 below.

(Foaming of insulation layer)
The appearance of the insulating layer on both sides of the obtained insulating aluminum alloy conductor was observed using an optical microscope, and the number of bubbles in the insulating layer was counted. When the number of bubbles per 1 ^cm2 of the insulating layer was 9 or less, it was marked as "◎", when it was 10 to 29, it was marked as "◯", when it was 30 to 59, it was marked as "△", and when it was 60 or more, it was marked as "X".

(hardness)
The Brinell hardness of the obtained insulating aluminum alloy conductor was evaluated. The evaluation was performed by measuring the Brinell hardness of the portion of the insulating aluminum alloy conductor where the insulating layer was not formed. The Brinell hardness was measured according to JIS Z 2243-1:2018 (Brinell hardness test - Part 1: Test method). When the Brinell hardness was 70 or more, it was marked as "◯", when it was 20 or more and less than 70, it was marked as "△", and when it was less than 20, it was marked as "X".

The insulating aluminum alloy conductors obtained in Examples 1 to 6 of the present invention, in which the Si content and Mg content of the conductor body are within the ranges of the present invention, all showed reduced foaming in the insulating layer. In addition, the insulating aluminum alloy conductors obtained in Examples 1, 3, and 4 of the present invention, in which the Mg content of the conductor body is 0.8 mass% or more, showed high hardness. In contrast, the insulating aluminum alloy conductor obtained in Comparative Example 1, in which the Si content of the conductor body is lower than the range of the present invention, showed a lot of foaming in the insulating layer and low hardness. In addition, the insulating aluminum alloy conductor obtained in Comparative Example 2, in which the Si content of the conductor body is lower than the range of the present invention and the Mg content is higher than the range of the present invention, showed high hardness but a lot of foaming in the insulating layer. In addition, the insulating aluminum alloy conductor obtained in Comparative Example 3, in which the Si content of the conductor body is within the range of the present invention and the Mg content is higher than the range of the present invention, showed high hardness but a lot of foaming in the insulating layer, similar to Comparative Example 2.

REFERENCE SIGNS LIST 10 insulating aluminum alloy conductor 11 conductor body 12 insulating layer 20 electrodeposition device 21 electrodeposition tank 22 power source 23 counter electrode 30 electrodeposition liquid 31 resin particles 32 solvent

Claims (4)

An insulated aluminum alloy conductor comprising a conductor body made of an aluminum alloy and an insulating layer covering the conductor body,
The conductor body has a Si content in the range of 0.3 mass % or more and 13.5 mass % or less, and a Mg content in the range of 1.8 mass % or less,
1. An insulating aluminum alloy conductor, wherein the insulating layer contains a polyamide-imide resin having a carboxyl group. The insulating aluminum alloy conductor according to claim 1, wherein the Si content of the conductor body is in the range of 0.5% by mass to 11.0% by mass. An insulated aluminum alloy conductor according to claim 1 or 2, in which the Mg content of the conductor body is in the range of 0.8% by mass to 1.3% by mass. an electrodeposition step of electrodepositing resin particles on a surface of a conductor body made of an aluminum alloy by anionic electrodeposition to obtain a conductor body with an electrodeposition layer;
a baking step of heating the conductor body with the electrodeposition layer to bake the electrodeposition layer onto the conductor body to form an insulating layer and obtain an insulated aluminum alloy conductor,
The conductor body has a Si content in the range of 0.3 mass % or more and 13.5 mass % or less, and a Mg content in the range of 1.8 mass % or less,
A method for producing an insulating aluminum alloy conductor, characterized in that in the electrodeposition step, the conductor body is immersed in an electrodeposition liquid containing resin particles containing a polyamideimide resin having a carboxyl group.

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