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JP7569280B2 - Ultrasonic flaw detection method and ultrasonic flaw detection device - Google Patents
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JP7569280B2 - Ultrasonic flaw detection method and ultrasonic flaw detection device - Google Patents

Ultrasonic flaw detection method and ultrasonic flaw detection device Download PDF

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JP7569280B2
JP7569280B2 JP2021103930A JP2021103930A JP7569280B2 JP 7569280 B2 JP7569280 B2 JP 7569280B2 JP 2021103930 A JP2021103930 A JP 2021103930A JP 2021103930 A JP2021103930 A JP 2021103930A JP 7569280 B2 JP7569280 B2 JP 7569280B2
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祥 山口
聡 北澤
泰広 仁平
和也 江原
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Hitachi GE Vernova Nuclear Energy Ltd
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    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
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Description

本発明は、超音波探傷手法および超音波探傷装置に関する。 The present invention relates to an ultrasonic flaw detection method and an ultrasonic flaw detection device.

異なる発振周波数の超音波振動子を交互に配列することによって、同じ超音波視野範囲の深部に至るまでの超音波画像と、浅部の高分解能の超音波画像とを同時に取得する技術として、特許文献1には、挿入部の先端に設けた超音波スキャナは、軸線方向に多数の超音波振動子を直線的に並べて設けたものであり、奇数番目の超音波振動子は低周波の発振周波数を持った低周波振動子であり、また偶数番目の超音波振動子は高周波発振する高周波振動子であり、超音波観測装置には、低周波超音波信号処理部と高周波超音波信号処理部とが設けられて、低周波超音波信号処理部を作動させると、低周波振動子が作動して、低周波超音波リニア画像が得られ、また高周波超音波信号処理部を作動させると、高周波振動子が作動して、高周波超音波リニア画像が得られる、ことが記載されている。 Patent Document 1 describes a technology for simultaneously obtaining ultrasound images of deep areas and high-resolution ultrasound images of shallow areas in the same ultrasound field of view by alternately arranging ultrasound transducers with different oscillation frequencies. It states that an ultrasound scanner at the tip of an insertion part has many ultrasound transducers arranged linearly in the axial direction, with odd-numbered ultrasound transducers being low-frequency transducers with a low oscillation frequency and even-numbered ultrasound transducers being high-frequency transducers that oscillate at high frequencies, and that an ultrasound observation device is provided with a low-frequency ultrasound signal processing section and a high-frequency ultrasound signal processing section, and that when the low-frequency ultrasound signal processing section is operated, the low-frequency transducer is operated to obtain a low-frequency ultrasound linear image, and when the high-frequency ultrasound signal processing section is operated, the high-frequency transducer is operated to obtain a high-frequency ultrasound linear image.

不均一表面を有する部品を超音波で検査するための技術の一例として、特許文献2には、a.液体中に部品を浸漬し、各々が超音波ビーム広がりを有する多数の小型の超音波要素の配列体よりなる超音波プローブと不均一表面を有する部品との間に数超音波波長分の厚さの流体カップリングを与え、b.個々の超音波要素を一つずつ作動させながら超音波ビームで部品を走査し、c.各作動ごとに配列体中の個々の超音波要素から出て部品の表面により反射された超音波波形と部品の内部反射物とにより反射された超音波波形とを記憶し、超音波波形データの配列を掃引して表面形状を測定し、表面形状に基づいて、超音波プローブの位置の関数として信号処理パラメーターを算出し、d.信号処理パラメーターを用いてデータ配列を処理することにより、処理部品の表面の不規則性に対する補正を行い、部品内部の反射物の検査結果を算出する、ことが記載されている。 As an example of a technique for ultrasonically inspecting parts having an uneven surface, Patent Document 2 describes: a. immersing the part in a liquid and providing a fluid coupling of a thickness of several ultrasonic wavelengths between the part having an uneven surface and an ultrasonic probe consisting of an array of many small ultrasonic elements, each having an ultrasonic beam spread; b. scanning the part with an ultrasonic beam while activating each ultrasonic element one by one; c. storing ultrasonic waveforms emitted from each ultrasonic element in the array and reflected by the surface of the part and ultrasonic waveforms reflected by internal reflectors of the part for each activation, sweeping the array of ultrasonic waveform data to measure the surface shape, and calculating signal processing parameters as a function of the position of the ultrasonic probe based on the surface shape; and d. processing the data array using the signal processing parameters to correct for irregularities in the surface of the processed part and calculate the inspection results for the reflectors inside the part.

特開平7-163559号公報Japanese Unexamined Patent Publication No. 7-163559 特開2015-145872号公報JP 2015-145872 A

発電プラント設備には、安全性の担保として余寿命評価が用いられており、その際、検査体内部、主に配管内部の欠陥位置と欠陥寸法の情報が必要である。検査体内部の欠陥情報の取得のために非破壊検査が実施されるが、その手法のうちの一つとして超音波探傷が挙げられる。この超音波探傷では、探触子が受信した超音波波形から、欠陥寸法と探触子からの欠陥位置を測定できる。 Remaining life assessments are used to ensure safety in power plant equipment, and for this, information on the location and size of defects inside the inspected object, mainly inside the pipes, is required. Non-destructive testing is carried out to obtain information on defects inside the inspected object, and ultrasonic testing is one of the methods used. With ultrasonic testing, the size of the defect and the location of the defect from the probe can be measured from the ultrasonic waveform received by the probe.

近年、超音波探触子の超音波送受信素子の位置情報と、検査体内部の超音波の音速と、超音波の受信波形の情報から、検査体内部への超音波の経路を計算し、検査体内部を映像化する開口合成手法が注目されている。しかし、検査対象となる配管によっては溶接部余盛による凹凸が残存しており、センサを密着させることができず従来手法では超音波探傷が実施できないため、検査体とセンサを間接的に密着させる手法が必要である。 In recent years, aperture synthesis techniques have been attracting attention. These techniques calculate the path of ultrasound into an object to be inspected from the positional information of the ultrasonic transmitting and receiving elements of an ultrasonic probe, the sound speed of the ultrasound inside the object to be inspected, and information on the received waveform of the ultrasound, and visualize the inside of the object to be inspected. However, depending on the pipe to be inspected, unevenness remains due to excess welds, and it is not possible to make the sensor come into close contact with the pipe, making ultrasonic inspection impossible using conventional methods. Therefore, a method is needed to indirectly bring the sensor into close contact with the object to be inspected.

検査体とセンサを間接的に密着させる手法として、柔らかい素材であるゲルを介在物質として用いて探傷を行う探傷手法が医療で用いられており、例えば上述の特許文献1に記載の技術がある。上述の特許文献1においては、高周波および低周波の超音波を照射する超音波素子を交互に組み合わせたアレイセンサを特徴としているが、医療での使用を前提としている。 As a method for indirectly bringing the test object and the sensor into close contact, a flaw detection method using a soft gel as an intervening substance is used in the medical field, for example the technology described in the above-mentioned Patent Document 1. The above-mentioned Patent Document 1 features an array sensor that alternates between ultrasonic elements that irradiate high-frequency and low-frequency ultrasonic waves, but is intended for medical use.

ここで、医療における超音波探傷の特徴は、検査体が人体である点と、人体での超音波の音速が水と同等であるという点である。検査体が人体である場合、皮膚が柔らかいことからアレイセンサを押し当てた際に、皮膚が自然とアレイセンサの形状になり、検査体とアレイセンサを密着させながらの探傷が可能である。また、仮に骨に近い部分等の皮膚がアレイセンサの形状とならず、アレイセンサを密着させることができない場合でも、超音波の音速が水に近いゲル等の柔らかい中間接触媒質を用いることで、中間接触媒質と検査体との接着面での超音波の屈折を考慮することなく探傷が可能である。 The characteristics of ultrasonic flaw detection in medical applications are that the subject to be inspected is a human body, and that the speed of sound of ultrasonic waves in the human body is equivalent to that of water. When the subject to be inspected is a human body, the skin is soft, so when the array sensor is pressed against the skin, the skin naturally takes on the shape of the array sensor, making it possible to perform flaw detection while the subject to be inspected and the array sensor are in close contact with each other. Even if the skin in areas close to bones does not take on the shape of the array sensor and the array sensor cannot be in close contact with the skin, flaw detection is possible by using a soft intermediate medium such as a gel, which has an ultrasonic sound speed close to that of water, without having to consider the refraction of ultrasonic waves at the adhesive surface between the intermediate medium and the subject to be inspected.

しかし、工業用での検査体では、金属等の超音波の音速が水よりも遥かに速い材質を検査する必要がある。当然、金属であることから検査体がアレイセンサの形状に合わせて変形することはなく、アレイセンサを検査体に密着させるために超音波が伝播する中間層(以下、中間接触媒質)が必要となる。 However, in industrial inspection, it is necessary to inspect materials such as metals, where the speed of ultrasonic waves is much faster than that of water. Naturally, since the inspection object is made of metal, it will not deform to fit the shape of the array sensor, and an intermediate layer through which the ultrasonic waves propagate (hereinafter referred to as intermediate catalytic layer) is required to bring the array sensor into close contact with the inspection object.

しかし、中間接触媒質として用いられる材料での超音波の音速は、金属での超音波の音速とは異なるため、中間接触媒質と検査体との接着面での超音波の屈折が生じる。超音波の屈折を考慮しない映像化手法では、欠陥位置や欠陥寸法に誤差が生じるため、医療における超音波探傷技術を工業にそのまま転用することは非現実的である。 However, because the speed of ultrasound in the material used as the intermediate catalytic medium is different from that in metal, refraction of ultrasound occurs at the bonding surface between the intermediate catalytic medium and the specimen. Imaging methods that do not take into account the refraction of ultrasound will result in errors in the defect location and dimensions, making it unrealistic to directly apply medical ultrasonic flaw detection technology to industry.

以上の事情により、工業における曲面を有する検査体に対し、超音波検査を実施するには、センサと検査体表面を間接的に密着させるウェッジを用いて、表面形状の座標を抽出し、検査体内部への超音波の伝播経路を計算する手法が有効と考えられる。 For these reasons, when performing ultrasonic inspections on curved industrial objects, it is considered effective to use a wedge that indirectly brings the sensor into close contact with the surface of the object, extract the coordinates of the surface shape, and calculate the propagation path of the ultrasonic waves into the interior of the object.

上述の特許文献2では、超音波アレイセンサと検査体表面の間に中間層を設け、超音波の受信波形から検査体の表面座標を抽出し、検査体内部への超音波の伝播経路を求めることで凹凸を考慮した超音波探傷を可能とすることを特徴としている。 The aforementioned Patent Document 2 is characterized by providing an intermediate layer between the ultrasonic array sensor and the surface of the object to be inspected, extracting the surface coordinates of the object to be inspected from the received ultrasonic waveform, and determining the propagation path of the ultrasonic waves into the inside of the object to be inspected, thereby enabling ultrasonic flaw detection that takes unevenness into account.

しかし、中間層を用いた検査体表面の形状抽出に適した超音波の周波数と検査体内部の探傷に適した周波数とは異なる帯域である。 However, the ultrasonic frequency band suitable for extracting the shape of the surface of the test object using an intermediate layer is different from the frequency band suitable for detecting flaws inside the test object.

従って、検査体表面の形状抽出に適する高周波を上記技術に適用しても、表面形状抽出精度は向上する。しかしながら、検査体内部での超音波の散乱,減衰が生じるため、検査体内部からの反射信号の強度低下による欠陥信号の見落としの原因となる、という課題が生じる。 Therefore, even if high frequencies suitable for extracting the shape of the surface of the object to be inspected are applied to the above technology, the accuracy of surface shape extraction is improved. However, there is a problem in that ultrasonic waves are scattered and attenuated inside the object to be inspected, which can cause defect signals to be overlooked due to a decrease in the strength of the reflected signal from inside the object to be inspected.

また、検査体内部の探傷に適する低周波を用いる場合は、検査体表面の形状抽出精度が低いため、検査体内部への超音波の伝播経路が正しく求めることができず、検査体内部への探傷精度は低下する、という課題がある。 In addition, when using low frequencies suitable for detecting flaws inside the test object, the accuracy of extracting the shape of the test object's surface is low, so the propagation path of the ultrasonic waves into the test object cannot be correctly determined, resulting in a problem of reduced accuracy in detecting flaws inside the test object.

また、上記手法においては中間層として水などの流体カップリングを用いることを前提としているが、常にセンサと検査体との間を流体で満たす必要がある。しかし、大量の水の供給手法および排水手法が必要となるため、検査環境によっては使用できない手法である。 The above method is based on the premise of using a fluid coupling such as water as an intermediate layer, which requires that the space between the sensor and the test object be constantly filled with fluid. However, as it requires a method for supplying and draining large amounts of water, this method cannot be used in some test environments.

本発明の目的は、従来は実現が困難であった表面形状の抽出と検査体内部の探傷とを従来に比べて容易に両立させることが可能な超音波探傷手法および超音波探傷装置を提供することである。 The objective of the present invention is to provide an ultrasonic inspection method and ultrasonic inspection device that can more easily achieve both extraction of surface shape and inspection of the interior of an object to be inspected, something that was previously difficult to achieve.

本発明は、上記課題を解決する手段を複数含んでいるが、その一例を挙げるならば、振動周波数の異なる2種類以上の超音波素子を有する超音波探触子、および検査体と前記超音波探触子とを間接的に接触させるウェッジを前記検査体に配置する工程と、前記超音波探触子の前記超音波素子からの超音波の送受信を制御する工程と、配置された前記超音波探触子のうち、2種類以上の前記超音波素子のうち前記振動周波数が高い側の前記超音波素子での超音波の受信波形に基づいて前記ウェッジと前記検査体との境界を求める工程と、配置された前記超音波探触子のうち、前記振動周波数が低い側の前記超音波素子での超音波の受信波形に基づいて前記検査体の内部を映像化する工程と、を有することを特徴とする。 The present invention includes a number of means for solving the above problems, and an example thereof includes the steps of: arranging, on an object to be inspected, an ultrasonic probe having two or more types of ultrasonic elements with different vibration frequencies and a wedge that brings the object to indirect contact with the ultrasonic probe; controlling the transmission and reception of ultrasonic waves from the ultrasonic elements of the ultrasonic probe; determining the boundary between the wedge and the object to be inspected based on the received waveform of ultrasonic waves at the ultrasonic element having the higher vibration frequency among the two or more types of ultrasonic elements of the arranged ultrasonic probe; and imaging the inside of the object to be inspected based on the received waveform of ultrasonic waves at the ultrasonic element having the lower vibration frequency among the arranged ultrasonic probes.

本発明によれば、表面形状の抽出と検査体内部の探傷を従来に比べて容易に両立させることができる。上記した以外の課題、構成および効果は、以下の実施形態の説明により明らかにされる。 According to the present invention, it is easier than ever to simultaneously extract the surface shape and detect flaws inside the test object. Problems, configurations, and effects other than those described above will become clear from the description of the embodiments below.

本発明の実施形態に係る超音波探傷装置における超音波探傷時の概要の全体像を示す図である。1 is a diagram showing an overview of an ultrasonic flaw detection apparatus according to an embodiment of the present invention; FIG. 実施形態に係る超音波探傷装置における高周波素子での波形収録の概要図である。FIG. 2 is a schematic diagram of waveform recording by a high-frequency element in the ultrasonic flaw detection device according to the embodiment. 実施形態に係る超音波探傷装置における高周波素子での受信波形から検査体表面の座標を抽出した際の概要図である。1 is a schematic diagram showing the coordinates of a surface of an object to be inspected being extracted from a waveform received by a high-frequency element in an ultrasonic flaw detection device according to an embodiment of the present invention. 実施形態に係る超音波探傷装置における低周波素子での超音波照射の際の検査体内部への超音波の屈折および低周波素子での受信の概要図である。1 is a schematic diagram showing refraction of ultrasonic waves into an object to be inspected when ultrasonic waves are irradiated by a low-frequency element in an ultrasonic flaw inspection device according to an embodiment, and reception of the ultrasonic waves by the low-frequency element. 実施形態に係る超音波探傷手法の検査フローの図である。FIG. 2 is a diagram showing an inspection flow of an ultrasonic flaw detection method according to an embodiment.

本発明の超音波探傷手法および超音波探傷装置の実施形態について図1乃至図5を用いて説明する。なお、本明細書で用いる図面において、同一のまたは対応する構成要素には同一、または類似の符号を付け、これらの構成要素については繰り返しの説明を省略する場合がある。 The ultrasonic inspection method and ultrasonic inspection device according to the embodiment of the present invention will be described with reference to Figs. 1 to 5. Note that in the drawings used in this specification, identical or corresponding components are designated by the same or similar reference numerals, and repeated explanations of these components may be omitted.

最初に、超音波探傷装置の全体構成や各々の構成の詳細について説明する。図1は、本実施形態の超音波探傷装置の全体構成図である。 First, the overall configuration of the ultrasonic flaw detection device and the details of each component will be described. Figure 1 is a diagram showing the overall configuration of the ultrasonic flaw detection device of this embodiment.

図1において、本実施形態の超音波探傷装置100は、曲面を有する検査体106の検査に好適なものであって、超音波アレイ探触子101、ウェッジ102、送受信制御装置104、および演算装置105を備えている。 In FIG. 1, the ultrasonic flaw detection device 100 of this embodiment is suitable for inspecting an object 106 having a curved surface, and includes an ultrasonic array probe 101, a wedge 102, a transmission/reception control device 104, and a calculation device 105.

超音波アレイ探触子101は、複数の超音波素子を有しており、超音波素子から超音波の照射および受信が可能である。 The ultrasonic array probe 101 has multiple ultrasonic elements and is capable of emitting and receiving ultrasonic waves from the ultrasonic elements.

本実施形態の超音波アレイ探触子101は、共振特性から強く送受信できる周波数特性があり、上記の振動周波数の特性が異なる、少なくとも2種類以上の低周波素子107、高周波素子108から構成される。 The ultrasonic array probe 101 of this embodiment has frequency characteristics that enable strong transmission and reception due to resonance characteristics, and is composed of at least two or more types of low-frequency elements 107 and high-frequency elements 108 that have different vibration frequency characteristics.

この例において、超音波アレイ探触子101は検査体106内部の探傷に適した低周波の超音波が発振可能な低周波素子107と、表面形状抽出に適した高周波の超音波を発振可能な高周波素子108と、の2種類の周波数を送受信可能な複数の超音波素子を、同じ数だけ備えている。低周波素子107は好適には2~5[MHz]、高周波素子108は好適には10[MHz]以上とするが、この範囲に限定されるものではない。また、数についても同じである必要は無く、いずれか一方が多くてもよい。 In this example, the ultrasonic array probe 101 has an equal number of ultrasonic elements capable of transmitting and receiving two types of frequencies: low-frequency elements 107 capable of emitting low-frequency ultrasonic waves suitable for detecting flaws inside the object 106, and high-frequency elements 108 capable of emitting high-frequency ultrasonic waves suitable for extracting surface shapes. The low-frequency elements 107 are preferably 2 to 5 MHz, and the high-frequency elements 108 are preferably 10 MHz or higher, but are not limited to these ranges. Furthermore, the numbers do not need to be the same, and one may be more than the other.

また、異なる周波数が2種類の場合について説明したが、3種類以上とすることができる。3種類以上とした場合、最も周波数の低い素子を含む、周波数の低い側の1種類以上の素子を検査体内部の探傷に適した低周波の超音波が発振可能な低周波素子として、最も周波数の高い素子を含む、周波数の高い側の1種類以上の素子を表面形状抽出に適した高周波の超音波を発振可能な高周波素子に分類することとする。 Although the case where there are two different frequencies has been described, there can be three or more. When there are three or more, one or more elements on the low frequency side, including the element with the lowest frequency, are classified as low frequency elements capable of emitting low frequency ultrasound suitable for detecting flaws inside the inspected object, and one or more elements on the high frequency side, including the element with the highest frequency, are classified as high frequency elements capable of emitting high frequency ultrasound suitable for extracting surface shape.

超音波アレイ探触子101中心を原点Oとした際の超音波アレイ探触子101内における各低周波素子107、高周波素子108の位置は既知であり、これら低周波素子107、および高周波素子108のいずれも、互いの素子を間に挟んで等間隔で配置されている。また、こ低周波素子107および高周波素子108は、各々の素子で超音波を受信した際に分解能の低下する領域が生じにくくするために、図1に示すように交互に配置されている。こで、図1中、センサに対する水平方向をX座標、センサに対する深さ方向をZ座標と定義する。 When the center of the ultrasonic array probe 101 is taken as the origin O, the positions of the low-frequency elements 107 and high-frequency elements 108 in the ultrasonic array probe 101 are known, and the low-frequency elements 107 and high-frequency elements 108 are arranged at equal intervals with each other sandwiched between them. In addition, the low-frequency elements 107 and high-frequency elements 108 are arranged alternately as shown in FIG. 1 to prevent the occurrence of areas where the resolution is reduced when each element receives ultrasonic waves. Here, in FIG. 1, the horizontal direction relative to the sensor is defined as the X coordinate, and the depth direction relative to the sensor is defined as the Z coordinate.

ウェッジ102は、検査体106の上部に設置することが可能な形状であり、超音波アレイ探触子101の移動方向に沿って延びる移動面を有している。また、ウェッジ102は、超音波アレイ探触子101が密着しながら移動可能に構成されており、検査体106と超音波アレイ探触子101とを間接的に接触させている。好適には、ウェッジ102は、超音波アレイ探触子101の移動方向に直線状に延びる直線部材である。なお、ウェッジ102は直線部材に限定されず、移動方向に円弧状に延びる円弧部材であってもよい。 The wedge 102 has a shape that allows it to be placed on top of the inspection object 106, and has a moving surface that extends along the movement direction of the ultrasonic array probe 101. The wedge 102 is configured so that the ultrasonic array probe 101 can move while being in close contact with it, and indirectly contacts the inspection object 106 and the ultrasonic array probe 101. Preferably, the wedge 102 is a straight member that extends linearly in the movement direction of the ultrasonic array probe 101. Note that the wedge 102 is not limited to a straight member, and may be an arcuate member that extends in an arc in the movement direction.

このウェッジ102はアクリル等の固体材質が好ましいが、試験の状況に合わせ流体でもゲル状のものを使用しても構わず、特に限定されない。 This wedge 102 is preferably made of a solid material such as acrylic, but is not particularly limited and may be made of a fluid or gel depending on the test conditions.

ウェッジ102には検査体106の表面に存在する凹凸に対応すべく、検査体106と接触する側の表面に溝103が付与されており、溝103と検査体106との間の空間は液体状の接触媒質103Aで満たされている。 The wedge 102 has a groove 103 on the surface that comes into contact with the test object 106 to accommodate the irregularities present on the surface of the test object 106, and the space between the groove 103 and the test object 106 is filled with a liquid contact medium 103A.

溝103の形状および位置は既知であり、溝103を通過する超音波の屈折は演算装置105を用いることで計算可能となっている。 The shape and position of the groove 103 are known, and the refraction of ultrasound passing through the groove 103 can be calculated using the calculation device 105.

溝103に配置される接触媒質103Aは、例えば大陽日酸ガス&ウェルディング株式会社製のソニコートなどの超音波測定用接触媒質が好適に用いられるが、超音波さえ透過する液体状、あるいはゲル状の物質を用いることができる。 The contact medium 103A placed in the groove 103 is preferably a contact medium for ultrasonic measurement, such as Sonicoat manufactured by Taiyo Nippon Sanso Gas & Welding Co., Ltd., but any liquid or gel-like substance that transmits even ultrasonic waves can also be used.

送受信制御装置104は、超音波アレイ探触子101の低周波素子107、高周波素子108からの超音波の送受信を制御する装置である。 The transmission/reception control device 104 is a device that controls the transmission and reception of ultrasound from the low-frequency elements 107 and high-frequency elements 108 of the ultrasonic array probe 101.

この演算装置105は、例えばコンピュータ(PC)であり、CPUなどに相当する処理部105a、HDDやSSDなどで構成される記録部105b、ディスプレイで構成される表示部105cなどを有する。 This calculation device 105 is, for example, a computer (PC), and has a processing unit 105a equivalent to a CPU, a recording unit 105b consisting of a HDD or SSD, and a display unit 105c consisting of a display.

演算装置105は、超音波アレイ探触子101を用いた探傷により、検査体106の表面からの反射エコーや検査体106の内部での反射エコーを各素子で受信した波形を記録し、ウェッジ102内部の音速と検査体106内部の音速とを用いて、検査体106の表面による超音波伝播経路の屈折を考慮し、ウェッジ102内部と検査体106内部を映像化する機能を有する。 The computing device 105 has a function of recording the waveforms received by each element of the echoes reflected from the surface of the test object 106 and the echoes reflected inside the test object 106 by performing flaw detection using the ultrasonic array probe 101, and visualizing the inside of the wedge 102 and the inside of the test object 106 by taking into account the refraction of the ultrasonic propagation path due to the surface of the test object 106 using the sound speed inside the wedge 102 and the sound speed inside the test object 106.

特には、演算装置105は、処理部105aにおいて、送受信制御装置104を介して入力された、振動周波数が高い側の高周波素子108での超音波の受信波形に基づいてウェッジ102と検査体106との境界を映像化する。好適には、少なくとも2種類の周波数成分の内、高い周波数の送受信が可能な高周波素子108での送受信波形と、ウェッジ102内部の音速を用いて、検査体106表面の座標を抽出することで検査体106の表面形状を特定する。 In particular, the processor 105a of the computing device 105 visualizes the boundary between the wedge 102 and the object to be inspected 106 based on the received waveform of the ultrasonic waves at the high-frequency element 108 with the higher vibration frequency input via the transmission/reception control device 104. Preferably, the surface shape of the object to be inspected 106 is identified by extracting the coordinates of the surface of the object to be inspected 106 using the transmitted/received waveform at the high-frequency element 108 capable of transmitting and receiving the higher frequency of at least two types of frequency components, and the sound speed inside the wedge 102.

図2は超音波アレイセンサの内、高周波の送受信が可能な素子での波形収録を模擬した図である。 Figure 2 shows a simulation of waveform recording using an element of an ultrasonic array sensor that can transmit and receive high-frequency waves.

図2において、高周波素子108から発振された超音波は、検査体106の表面で反射されて、超音波アレイ探触子101内に配置された全ての高周波素子108にて各々収録される。全ての高周波素子108から超音波を順に発振し、全ての高周波素子108で順に受信して波形を記録する、という上記の収録工程を繰り返すことにより、マトリクス状の波形情報が記録される。 In FIG. 2, ultrasonic waves emitted from the high-frequency elements 108 are reflected by the surface of the test object 106 and are recorded by all of the high-frequency elements 108 arranged in the ultrasonic array probe 101. By repeating the above recording process in which ultrasonic waves are emitted from all of the high-frequency elements 108 in sequence, and are received by all of the high-frequency elements 108 in sequence and the waveforms are recorded, a matrix of waveform information is recorded.

収録した波形情報をウェッジ102内部の音速と、接触媒質103Aの音速と、を用いて好ましくは開口合成による映像化を行うことにより、強い反射源である検査体106の表面のエコーが得られる。 The recorded waveform information is visualized, preferably by aperture synthesis, using the sound speed inside the wedge 102 and the sound speed of the contact medium 103A to obtain an echo from the surface of the test object 106, which is a strong reflection source.

図3は図2にて収録した高周波素子での受信波形をウェッジ内部の音速で映像化した後、表面形状を抽出した際の座標情報の図である。 Figure 3 shows the coordinate information when the received waveform recorded by the high-frequency element in Figure 2 was visualized at the speed of sound inside the wedge and the surface shape was extracted.

図2における高周波素子による検査体106表面からの反射波の収録波形と、ウェッジ102の内部の音速を用い、演算装置105を用いて好ましくは開口合成処理により、検査体106表面からの反射エコーの画像が得られる。 Using the recorded waveform of the reflected wave from the surface of the test object 106 by the high-frequency element in FIG. 2 and the sound speed inside the wedge 102, an image of the reflected echo from the surface of the test object 106 is obtained using the calculation device 105, preferably by aperture synthesis processing.

検査体106表面の反射エコーから、センサの中心を原点Oとした座標情報を記録する。本工程により、超音波アレイ探触子101中心を原点Oとする検査体106の表面の座標情報109が抽出できる。従来手法で用いていた低周波に比べ、波長の短い高周波での表面形状の座標情報の抽出であるため、高分解能での表面座標抽出が可能となる。 Coordinate information is recorded from the reflected echo from the surface of the test object 106, with the center of the sensor set as the origin O. This process makes it possible to extract coordinate information 109 of the surface of the test object 106, with the center of the ultrasonic array probe 101 set as the origin O. Compared to the low frequencies used in conventional methods, this extracts coordinate information of the surface shape at high frequencies with short wavelengths, making it possible to extract surface coordinates with high resolution.

また、演算装置105は、処理部105aにおいて、振動周波数が低い側の低周波素子107での超音波の受信波形に基づいて検査体106の内部を映像化する。好適には、先に特定した検査体106の表面形状と、検査体106内部の音速を用いることで、ウェッジから検査体106の内部への超音波の入射の際の屈折角を計算し、その後、低周波素子107から計算点までの超音波の伝播経路を求め、求めた超音波の伝播経路を用いて検査体106内部を映像化する。 The processing unit 105a of the computing device 105 also images the inside of the inspection object 106 based on the received waveform of the ultrasonic wave at the low-frequency element 107, which has a lower vibration frequency. Preferably, the previously identified surface shape of the inspection object 106 and the sound speed inside the inspection object 106 are used to calculate the refraction angle when the ultrasonic wave enters the inside of the inspection object 106 from the wedge, and then the propagation path of the ultrasonic wave from the low-frequency element 107 to the calculation point is obtained, and the inside of the inspection object 106 is imaged using the obtained propagation path of the ultrasonic wave.

図4は低周波素子での超音波照射の際の検査体106の内部への超音波の屈折および低周波素子での受信の図である。 Figure 4 shows the refraction of ultrasound into the test object 106 when ultrasound is irradiated by a low-frequency element, and its reception by the low-frequency element.

超音波が媒質が異なる材料の境界面を通過する際の屈折角を求めるには、境界面の形状と各材料での超音波の音速が必要である。 To calculate the refraction angle when an ultrasonic wave passes through the boundary between different media, the shape of the boundary and the speed of sound of the ultrasonic wave in each material are required.

図4に示すように、検査体106の表面の座標情報109は、図2および図33での工程により既知である。また、ウェッジ102内部での超音波の音速と、接触媒質103Aの音速と、検査体106内部での超音波の音速と、を用いることで、検査体106表面での超音波の屈折は計算可能である。 As shown in FIG. 4, coordinate information 109 of the surface of the test object 106 is known from the steps in FIG. 2 and FIG. 33. In addition, by using the sound speed of the ultrasonic waves inside the wedge 102, the sound speed of the contact medium 103A, and the sound speed of the ultrasonic waves inside the test object 106, the refraction of the ultrasonic waves on the surface of the test object 106 can be calculated.

従って、低周波素子110から低周波素子111までの検査体106内部を経由した、屈折を伴う超音波の伝播経路112は計算可能であり、上記の超音波の伝播経路112を用いた、演算装置105を用いて、好ましくは開口合成処理により、従来手法よりも高精度な検査体106内部の探傷画像が得られる。 Therefore, it is possible to calculate the propagation path 112 of the ultrasonic wave, which involves refraction, passing through the inside of the test object 106 from the low-frequency element 110 to the low-frequency element 111, and by using the above-mentioned propagation path 112 of the ultrasonic wave and the calculation device 105, preferably by aperture synthesis processing, a flaw detection image of the inside of the test object 106 with higher accuracy than conventional methods can be obtained.

演算装置105では、「映像化」した後は、表示部105cに表示してリアルタイムで画像を表示することができ、換えてあるいは加えて記録部105bに記録しておいて後で確認することができる。 After "visualization" has been performed in the computing device 105, the image can be displayed in real time on the display unit 105c, or alternatively or additionally, the image can be recorded in the recording unit 105b for later review.

演算装置105における検査体106の内部を映像化する処理には、開口合成法を用いることができるが、フェーズドアレイ法等の他の超音波映像化技術を用いることができる。 The computation device 105 can use aperture synthesis to image the inside of the test object 106, but other ultrasound imaging techniques such as phased array techniques can also be used.

図1に戻り、検査体106は、例えば配管等の超音波探傷の実施対象となる物質であり、平面であっても、局部的な曲面を有していてもよく、また材質についても特に限定されないが、好適には金属である。 Returning to FIG. 1, the inspection object 106 is the material to be inspected for ultrasonic flaws, such as a pipe, and may be flat or have a locally curved surface. There are no particular restrictions on the material, but it is preferably a metal.

次に、本実施形態に係る超音波探傷手法について図5を参照して説明する。図5は本発明の実施形態における探傷手法の全体フロー図である。 Next, the ultrasonic flaw detection method according to this embodiment will be described with reference to FIG. 5. FIG. 5 is an overall flow diagram of the flaw detection method according to this embodiment of the present invention.

図5に示すように、本実施形態に係る超音波探傷手法による検査体106の内部の映像化は各ステップ(工程)からなる。 As shown in FIG. 5, imaging of the inside of the inspection object 106 using the ultrasonic flaw detection method according to this embodiment consists of various steps (processes).

まず、上記の超音波探触子の発振可能な2種類の周波数のうち、高い周波数の超音波の送受信を行う(ステップS1)。このステップS1が、超音波アレイ探触子101、およびウェッジ102を検査体106に配置する工程、および超音波アレイ探触子101からの超音波の送受信を制御する工程、に相当する。 First, of the two frequencies that the ultrasonic probe can oscillate, ultrasonic waves of the higher frequency are transmitted and received (step S1). This step S1 corresponds to the process of placing the ultrasonic array probe 101 and the wedge 102 on the test object 106, and the process of controlling the transmission and reception of ultrasonic waves from the ultrasonic array probe 101.

ステップS1では、まず、高周波素子108の内の1つの素子で超音波を発振し(ステップS1-1)、全ての高周波素子108で超音波を受信する(ステップs1-2)。その後、全ての高周波素子108で超音波の発振が行われたか否かを判定し(ステップS1-3)、行われたと判定されたときは処理をステップS2に進めるのに対し、行われていないと判定されたときは処理をステップS1-1に戻して、全ての高周波素子108での超音波の発振を行う。 In step S1, first, one of the high-frequency elements 108 emits ultrasonic waves (step S1-1), and all of the high-frequency elements 108 receive the ultrasonic waves (step S1-2). After that, it is determined whether ultrasonic waves have been emitted by all of the high-frequency elements 108 (step S1-3). If it is determined that ultrasonic waves have been emitted, the process proceeds to step S2, whereas if it is determined that ultrasonic waves have not been emitted, the process returns to step S1-1, and ultrasonic waves are emitted by all of the high-frequency elements 108.

次いで、上記ステップS1で受信した高周波の超音波波形を用い、超音波アレイ探触子101中心を原点とする検査体106の表面の座標を抽出する(ステップS2)。このステップS2が、振動周波数が高い側の高周波素子108での超音波の受信波形に基づいてウェッジ102と検査体106との境界を求める工程に相当する。 Next, using the high-frequency ultrasonic waveform received in step S1, the coordinates of the surface of the test object 106 are extracted with the center of the ultrasonic array probe 101 as the origin (step S2). This step S2 corresponds to the process of determining the boundary between the wedge 102 and the test object 106 based on the received ultrasonic waveform at the high-frequency element 108 with the higher vibration frequency.

ステップS2では、まず、先のステップS1-2で高周波素子108で受信し、収録した高周波の超音波波形とウェッジ102内部の音速とを用い、好ましくは開口合成によってウェッジ内部を映像化する(ステップS2-1)。 In step S2, the inside of the wedge is first imaged, preferably by aperture synthesis, using the high-frequency ultrasonic waveform received and recorded by the high-frequency element 108 in the previous step S1-2 and the sound speed inside the wedge 102 (step S2-1).

その後、ウェッジ102内部の映像から検査体106の表面の形状、および超音波アレイ探触子101中心を原点とした際の検査体106の表面座標を抽出する(ステップS2-2)。 Then, the shape of the surface of the object 106 to be inspected is extracted from the image of the inside of the wedge 102, and the surface coordinates of the object 106 to be inspected are extracted when the center of the ultrasonic array probe 101 is set as the origin (step S2-2).

低周波の周波数成分のみを発振可能なアレイセンサを用いた場合、上記の検査体106の表面の形状を低周波の超音波波形を用いて抽出する必要があった。低周波の超音波波形は波長が長く、分解能が低いため検査体106の表面の微細な凹凸を検出不可能であった。故に、検査体106の内部への超音波の屈折を正しく計算できず、欠陥位置や欠陥寸法に誤差が生じる原因となっていた。 When using an array sensor capable of oscillating only low-frequency components, it was necessary to extract the shape of the surface of the above-mentioned inspection object 106 using a low-frequency ultrasonic waveform. Since a low-frequency ultrasonic waveform has a long wavelength and low resolution, it was impossible to detect minute irregularities on the surface of the inspection object 106. As a result, the refraction of ultrasonic waves into the interior of the inspection object 106 could not be calculated correctly, which caused errors in the defect position and defect dimensions.

しかしながら、上記の検査体106の表面の形状抽出に高周波の超音波を用いる本工程を有することにより、より高精度な上記の検査体の表面形状の抽出が可能となったため、上記の検査体106の内部への超音波の伝播経路計算の精度が向上し、欠陥位置と欠陥寸法の誤差を低減させることができる。 However, by using high-frequency ultrasonic waves to extract the surface shape of the above-mentioned inspection object 106, it is possible to extract the surface shape of the above-mentioned inspection object with higher accuracy, which improves the accuracy of calculating the propagation path of ultrasonic waves into the interior of the above-mentioned inspection object 106 and reduces errors in the defect position and defect dimensions.

次いで、超音波素子の発振可能な2種類の周波数のうち、低い周波数の超音波の送受信を行う(ステップS3)。このステップS3も、超音波アレイ探触子101からの超音波の送受信を制御する工程に相当する。 Next, of the two frequencies that the ultrasonic element can oscillate, ultrasonic waves of the lower frequency are transmitted and received (step S3). This step S3 also corresponds to a process of controlling the transmission and reception of ultrasonic waves from the ultrasonic array probe 101.

ステップS3では、まず、低周波素子107の内の1つの素子で超音波を発振し(ステップS3-1)、全ての低周波素子107で超音波を受信する(ステップS3-2)。その後、全ての低周波素子107で超音波の発振が行われたか否かを判定し(ステップS3-3)、行われたと判定されたときは処理をステップS4に進めるのに対し、行われていないと判定されたときは処理をステップS3-1に戻して、全ての低周波素子107での超音波の発振を行う。 In step S3, first, one of the low-frequency elements 107 emits ultrasonic waves (step S3-1), and all of the low-frequency elements 107 receive the ultrasonic waves (step S3-2). After that, it is determined whether ultrasonic waves have been emitted by all of the low-frequency elements 107 (step S3-3). If it is determined that ultrasonic waves have been emitted, the process proceeds to step S4, whereas if it is determined that ultrasonic waves have not been emitted, the process returns to step S3-1, and ultrasonic waves are emitted by all of the low-frequency elements 107.

次いで、上記の低周波の超音波を用い、検査体106の内部を映像化する(ステップS4)。このステップS4が、低周波素子107での超音波の受信波形に基づいて検査体106の内部を映像化する工程に相当する。 Next, the inside of the test object 106 is imaged using the low-frequency ultrasonic waves (step S4). This step S4 corresponds to the process of imaging the inside of the test object 106 based on the waveform of the ultrasonic waves received by the low-frequency element 107.

ステップS4では、まず、ステップS2にて抽出した検査体106の表面形状と、ウェッジ102内部の超音波の音速と、検査体106の内部での低周波超音波の音速と、を用いて、超音波の上記の検査体106の表面での屈折を計算し、上記の超音波探触子の低周波素子から検査体106の内部までの超音波の伝播経路を求める(ステップS4-1)。 In step S4, first, the refraction of the ultrasound on the surface of the inspection object 106 is calculated using the surface shape of the inspection object 106 extracted in step S2, the sound speed of the ultrasound inside the wedge 102, and the sound speed of the low-frequency ultrasound inside the inspection object 106, and the propagation path of the ultrasound from the low-frequency element of the ultrasound probe to the inside of the inspection object 106 is determined (step S4-1).

その後は、上記の超音波の伝播経路と低周波素子107での超音波波形を用いて、好ましくは開口合成法により検査体106の内部を映像化する(ステップS4-2)。 Then, the inside of the test object 106 is imaged, preferably by aperture synthesis, using the above-mentioned ultrasonic propagation path and the ultrasonic waveform at the low-frequency element 107 (step S4-2).

高周波の周波数成分のみを発振可能なアレイセンサを用いた場合、上記の検査体106の内部の探傷を高周波の超音波波形を用いて行う必要があった。高周波の超音波波形は波長が短く、検査体106の内部での散乱、減衰の影響を受けやすく、検査体106の内部からの反射波形の強度が弱いため、欠陥信号の見落としの原因となっていた。 When using an array sensor capable of oscillating only high-frequency components, it was necessary to use a high-frequency ultrasonic waveform to detect flaws inside the above-mentioned inspection object 106. High-frequency ultrasonic waveforms have a short wavelength and are easily affected by scattering and attenuation inside the inspection object 106, and the strength of the reflected waveform from inside the inspection object 106 is weak, which causes defect signals to be overlooked.

しかしながら、上記の検査体106の内部への探傷に低周波の超音波波形を用いる本工程を有することにより、検査体106の内部からの反射波形の強度を強くすることで、欠陥信号の視認性向上が可能となった。 However, by using a low-frequency ultrasonic waveform to detect flaws inside the inspection object 106, the strength of the reflected waveform from inside the inspection object 106 is increased, making it possible to improve the visibility of defect signals.

次に、本実施形態の効果についてまとめる。 Next, we will summarize the effects of this embodiment.

上述した本実施形態の超音波探傷手法では、振動周波数の異なる2種類以上の低周波素子107、高周波素子108を有する超音波アレイ探触子101、および検査体106と超音波アレイ探触子101とを間接的に接触させるウェッジ102を検査体106に配置する工程と、超音波アレイ探触子101の低周波素子107、高周波素子108からの超音波の送受信を制御する工程と、配置された超音波アレイ探触子101のうち、2種類以上の低周波素子107、高周波素子108のうち振動周波数が高い側の高周波素子108での超音波の受信波形に基づいてウェッジ102と検査体106との境界を求める工程と、配置された超音波アレイ探触子101のうち、振動周波数が低い側の低周波素子107での超音波の受信波形に基づいて検査体106の内部を映像化する工程と、を有する。 The ultrasonic flaw detection method of the present embodiment described above includes the steps of arranging an ultrasonic array probe 101 having two or more types of low-frequency elements 107 and high-frequency elements 108 with different vibration frequencies and a wedge 102 that indirectly brings the ultrasonic array probe 101 into contact with the ultrasonic array probe 106 on the object to be inspected 106; controlling the transmission and reception of ultrasonic waves from the low-frequency elements 107 and high-frequency elements 108 of the ultrasonic array probe 101; determining the boundary between the wedge 102 and the object to be inspected 106 based on the received waveform of ultrasonic waves at the high-frequency element 108 with the higher vibration frequency among the two or more types of low-frequency elements 107 and high-frequency elements 108 of the arranged ultrasonic array probe 101; and imaging the inside of the object to be inspected 106 based on the received waveform of ultrasonic waves at the low-frequency element 107 with the lower vibration frequency among the arranged ultrasonic array probe 101.

このように、高周波での検査体106の情報の取得により、従来手法よりも高精度での抽出が可能となる。また表面形状の抽出精度の向上により、ウェッジ102から検査体106の内部へ入射する超音波の屈折経路の計算精度が向上するため、検査体106の内部の欠陥位置と欠陥寸法の検出精度も向上する。特に、検査体106曲面部の抽出精度を向上させることができる。 In this way, by acquiring information on the inspection object 106 at high frequencies, it is possible to extract with higher accuracy than with conventional methods. Furthermore, by improving the accuracy of extracting the surface shape, the accuracy of calculating the refraction path of the ultrasonic waves entering the interior of the inspection object 106 from the wedge 102 is improved, and therefore the accuracy of detecting the defect position and defect dimensions inside the inspection object 106 is also improved. In particular, the accuracy of extracting the curved surface portion of the inspection object 106 can be improved.

これにより、従来手法ではなし得なかった高精度の検査体106の表面抽出と検査体106の内部からの反射信号の強度向上による欠陥信号の視認性向上とを両立可能な検査手法および検査装置が提供され、超音波探傷によるプラント設備等の余寿命評価の信頼性が増すため、設備の稼働率向上が可能となる。 This provides an inspection method and inspection device that can achieve both highly accurate surface extraction of the inspection object 106, which was not possible with conventional methods, and improved visibility of defect signals by increasing the strength of the reflected signal from inside the inspection object 106. This increases the reliability of remaining life assessment of plant equipment, etc. using ultrasonic flaw detection, making it possible to improve the operating rate of the equipment.

また、ウェッジ102と検査体106との境界を求める工程では、振動周波数が高い側の高周波素子108での超音波の送受信波形と、ウェッジ102の内部の音速を用いて、検査体106の表面の座標を抽出するため、映像化、およびその後の検査体106内部の映像化をより高精度に行うことができる。 In addition, in the process of determining the boundary between the wedge 102 and the test object 106, the coordinates of the surface of the test object 106 are extracted using the transmitted and received waveform of the ultrasonic waves from the high-frequency element 108 on the side with the higher vibration frequency and the sound speed inside the wedge 102, so imaging and subsequent imaging of the inside of the test object 106 can be performed with higher accuracy.

更に、検査体106の内部を映像化する工程では、ウェッジ102と検査体106との境界を求める工程で求めた境界、ウェッジ102の内部の音速、および検査体106の内部の音速の情報を用いて、ウェッジ102から検査体106の内部への超音波の入射の際の屈折角を計算し、低周波素子107、高周波素子108から計算点までの超音波の伝播経路を求め、伝播経路を用いて映像化することで、より鮮明な内部映像を得ることができる。 Furthermore, in the process of imaging the inside of the test object 106, the refraction angle when the ultrasonic wave enters the inside of the test object 106 from the wedge 102 is calculated using information on the boundary between the wedge 102 and the test object 106 obtained in the process of determining the boundary between the wedge 102 and the test object 106, the sound speed inside the wedge 102, and the sound speed inside the test object 106. The propagation path of the ultrasonic wave from the low-frequency element 107 and the high-frequency element 108 to the calculation point is determined, and the propagation path is used for imaging, thereby obtaining a clearer image of the inside.

また、検査体106の内部を映像化する工程では、開口合成法により検査体106の内部を映像化することにより、鮮明な像を得ることができる。 In addition, in the process of imaging the inside of the test object 106, a clear image can be obtained by imaging the inside of the test object 106 using aperture synthesis.

更に、超音波アレイ探触子101は、2種類以上の低周波素子107、高周波素子108のうち振動周波数が高い側の高周波素子108が等間隔で配置されていることや超音波アレイ探触子101は、2種類以上の低周波素子107、高周波素子108のうち振動周波数が低い側の低周波素子107を等間隔で配置されていることにより、分解能にムラが生じることを抑制し、より鮮明な像が得ることができるようになる。 Furthermore, the ultrasonic array probe 101 has two or more types of low-frequency elements 107 and high-frequency elements 108, of which the high-frequency elements 108 have a higher vibration frequency, arranged at equal intervals, and the ultrasonic array probe 101 has two or more types of low-frequency elements 107 and high-frequency elements 108, of which the low-frequency elements 107 have a lower vibration frequency, arranged at equal intervals, thereby preventing unevenness in resolution and enabling clearer images to be obtained.

<その他>
なお、本発明は上記の実施形態に限られず、種々の変形、応用が可能なものである。上述した実施形態は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されない。
<Other>
The present invention is not limited to the above-described embodiment, and various modifications and applications are possible. The above-described embodiment has been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to having all of the configurations described.

100…超音波探傷装置
101…超音波アレイ探触子(超音波探触子)
102…ウェッジ
103…溝
103A…接触媒質
104…送受信制御装置(送受信装置)
105…演算装置
105a…処理部
105b…記録部
105c…表示部
106…検査体
107…低周波超音波を発振可能な低周波素子(超音波素子)
108…高周波超音波を発振可能な高周波素子(超音波素子)
109…表面の座標情報
110…低周波超音波を発振する低周波素子
111…低周波超音波を受信する低周波素子
112…内部を経由する超音波伝播経路
100... ultrasonic flaw detector 101... ultrasonic array probe (ultrasonic probe)
102: wedge 103: groove 103A: contact medium 104: transmission/reception control device (transmission/reception device)
105: Calculation device 105a: Processing unit 105b: Recording unit 105c: Display unit 106: Test object 107: Low-frequency element (ultrasonic element) capable of emitting low-frequency ultrasonic waves
108...High-frequency element (ultrasonic element) capable of emitting high-frequency ultrasonic waves
109: Surface coordinate information 110: Low-frequency element that oscillates low-frequency ultrasonic waves 111: Low-frequency element that receives low-frequency ultrasonic waves 112: Ultrasonic wave propagation path passing through the inside

Claims (8)

振動周波数の異なる2種類以上の超音波素子を有する超音波探触子、および検査体と前記超音波探触子とを間接的に接触させるウェッジを前記検査体に配置する工程と、
前記超音波探触子の前記超音波素子からの超音波の送受信を制御する工程と、
配置された前記超音波探触子のうち、2種類以上の前記超音波素子のうち前記振動周波数が高い側の前記超音波素子での超音波の受信波形に基づいて前記ウェッジと前記検査体との境界を求める工程と、
配置された前記超音波探触子のうち、前記振動周波数が低い側の前記超音波素子での超音波の受信波形に基づいて前記検査体の内部を映像化する工程と、を有する
ことを特徴とする超音波探傷手法。
a step of disposing an ultrasonic probe having two or more types of ultrasonic elements with different vibration frequencies and a wedge for indirectly contacting the ultrasonic probe with the object to be inspected on the object to be inspected;
controlling transmission and reception of ultrasonic waves from the ultrasonic elements of the ultrasonic probe;
determining a boundary between the wedge and the object to be inspected based on a received waveform of an ultrasonic wave at an ultrasonic element having a higher vibration frequency among two or more types of ultrasonic elements of the arranged ultrasonic probe;
and imaging the inside of the object to be inspected based on a waveform of ultrasonic waves received by the ultrasonic element having a lower vibration frequency among the arranged ultrasonic probes.
請求項1に記載の超音波探傷手法において、
前記ウェッジと前記検査体との境界を求める工程では、前記振動周波数が高い側の前記超音波素子での超音波の送受信波形と、前記ウェッジの内部の音速を用いて、前記検査体の表面の座標を抽出する
ことを特徴とする超音波探傷手法。
The ultrasonic inspection method according to claim 1,
an ultrasonic flaw detection method, characterized in that in the process of determining the boundary between the wedge and the object to be inspected, the coordinates of the surface of the object to be inspected are extracted using the transmitted and received waveform of the ultrasonic wave at the ultrasonic element on the side with the higher vibration frequency and the sound speed inside the wedge.
請求項1に記載の超音波探傷手法において、
前記検査体の内部を映像化する工程では、前記ウェッジと前記検査体との境界を求める工程で求めた前記境界、前記ウェッジの内部の音速、および前記検査体の内部の音速の情報を用いて、前記ウェッジから前記検査体の内部への超音波の入射の際の屈折角を計算し、前記超音波素子から計算点までの超音波の伝播経路を求め、前記伝播経路を用いて映像化する
ことを特徴とする超音波探傷手法。
The ultrasonic inspection method according to claim 1,
The ultrasonic flaw detection method is characterized in that, in the process of visualizing the inside of the inspection object, the boundary determined in the process of determining the boundary between the wedge and the inspection object, the sound speed inside the wedge, and the sound speed inside the inspection object are used to calculate the refraction angle when ultrasonic waves enter the inspection object from the wedge into the inside of the inspection object, the propagation path of ultrasonic waves from the ultrasonic element to a calculation point are determined, and the inside of the inspection object is visualized using the propagation path.
請求項1に記載の超音波探傷手法において、
前記検査体の内部を映像化する工程では、開口合成法により前記検査体の内部を映像化する
ことを特徴とする超音波探傷手法。
The ultrasonic inspection method according to claim 1,
The ultrasonic flaw detection method according to claim 1, wherein in the step of imaging the inside of the object to be inspected, the inside of the object to be inspected is imaged by an aperture synthesis method.
振動周波数の異なる2種類以上の超音波素子を有する超音波探触子と、
検査体の上部に設置され、前記検査体と前記超音波探触子とを間接的に接触させるウェッジと、
前記超音波探触子の前記超音波素子からの超音波の送受信を制御する送受信装置と、
2種類以上の前記超音波素子のうち前記振動周波数が高い側の前記超音波素子での超音波の受信波形に基づいて前記ウェッジと前記検査体との境界を映像化し、前記振動周波数が低い側の前記超音波素子での超音波の受信波形に基づいて前記検査体の内部を映像化する演算装置と、を備える
ことを特徴とする超音波探傷装置。
An ultrasonic probe having two or more types of ultrasonic elements with different vibration frequencies;
a wedge that is installed on an upper portion of the test object and brings the test object into indirect contact with the ultrasonic probe;
a transmitting/receiving device that controls transmission and reception of ultrasonic waves from the ultrasonic elements of the ultrasonic probe;
an ultrasonic flaw detection device comprising: a calculation device that visualizes the boundary between the wedge and the object to be inspected based on the received waveform of ultrasonic waves at the ultrasonic element having the higher vibration frequency among the two or more types of ultrasonic elements, and visualizes the inside of the object to be inspected based on the received waveform of ultrasonic waves at the ultrasonic element having the lower vibration frequency.
請求項5に記載の超音波探傷装置において、
前記超音波探触子は、2種類以上の前記超音波素子のうち前記振動周波数が高い側の前記超音波素子が等間隔で配置されている
ことを特徴とする超音波探傷装置。
The ultrasonic flaw detector according to claim 5,
The ultrasonic probe is characterized in that the ultrasonic elements having higher vibration frequencies among the two or more types of ultrasonic elements are arranged at equal intervals.
請求項5に記載の超音波探傷装置において、
前記超音波探触子は、2種類以上の前記超音波素子のうち前記振動周波数が低い側の前記超音波素子を等間隔で配置されている
ことを特徴とする超音波探傷装置。
The ultrasonic flaw detector according to claim 5,
The ultrasonic probe is characterized in that the ultrasonic elements having lower vibration frequencies among the two or more types of ultrasonic elements are arranged at equal intervals.
請求項5に記載の超音波探傷装置において、
前記演算装置は、開口合成法を用いて前記検査体の内部を映像化する
ことを特徴とする超音波探傷装置。
The ultrasonic flaw detector according to claim 5,
The ultrasonic flaw detection device, wherein the arithmetic unit images the inside of the object to be inspected by using an aperture synthesis method.
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Citations (3)

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