Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JP7569712B2 - Gas detection equipment - Google Patents
[go: Go Back, main page]

JP7569712B2 - Gas detection equipment - Google Patents

Gas detection equipment Download PDF

Info

Publication number
JP7569712B2
JP7569712B2 JP2021036353A JP2021036353A JP7569712B2 JP 7569712 B2 JP7569712 B2 JP 7569712B2 JP 2021036353 A JP2021036353 A JP 2021036353A JP 2021036353 A JP2021036353 A JP 2021036353A JP 7569712 B2 JP7569712 B2 JP 7569712B2
Authority
JP
Japan
Prior art keywords
substrate
light
main surface
gas detection
detection device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021036353A
Other languages
Japanese (ja)
Other versions
JP2021162577A (en
Inventor
優二 池田
圭一郎 桑田
貴明 古屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Microdevices Corp
Original Assignee
Asahi Kasei EMD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei EMD Corp filed Critical Asahi Kasei EMD Corp
Priority to US17/208,004 priority Critical patent/US11662305B2/en
Publication of JP2021162577A publication Critical patent/JP2021162577A/en
Application granted granted Critical
Publication of JP7569712B2 publication Critical patent/JP7569712B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Investigating Or Analysing Materials By Optical Means (AREA)

Description

本開示はガス検出装置に関する。 This disclosure relates to a gas detection device.

ガスを検出するガス検出装置が様々な分野で利用されている。例えば特許文献1は、赤外線を放射する光源と、特定波長の赤外線を検出する検出器とを同一のケース内に備え、当該ケース内に被検出ガスが導入されるように構成された装置を開示する。 Gas detection devices that detect gases are used in a variety of fields. For example, Patent Document 1 discloses a device that includes a light source that emits infrared rays and a detector that detects infrared rays of a specific wavelength in the same case, and is configured so that the gas to be detected is introduced into the case.

特開2015-184211号公報JP 2015-184211 A

ここで、特許文献1に記載されるガス検出装置において、光路管は基板固定部の溝及び固定具によって基板及びケースに対して強固に接合される。そのため、例えば熱膨張による基板及びケースの歪みが光路管に伝わって、光路の歪みが生じ、若しくは光学面の相対位置が変化し、ガス検出感度が変動するおそれがある。 In the gas detection device described in Patent Document 1, the optical path tube is firmly joined to the substrate and case by the groove and fastener of the substrate fixing part. Therefore, for example, distortion of the substrate and case due to thermal expansion may be transmitted to the optical path tube, causing distortion of the optical path or changing the relative position of the optical surfaces, which may cause fluctuations in gas detection sensitivity.

かかる点に鑑みてなされた本開示の目的は、光路の歪みの発生を抑制することが可能なガス検出装置を提供することにある。 In view of the above, the objective of this disclosure is to provide a gas detection device that can suppress the occurrence of distortion in the optical path.

本開示の一実施形態に係るガス検出装置は、
基板と、
前記基板の主面に設けられ、光を発する発光素子と、
前記基板の主面に設けられ、前記光を受け取る受光素子と、
前記発光素子が発した前記光を前記受光素子に導く導光部材と、
第1の接合部材と、
第2の接合部材とを備え、
前記第1の接合部材は、前記基板と前記導光部材とを接合し、かつ、前記導光部材に対する外力を加えた際に前記基板の主面と平行及び/又は垂直な方向に動きを抑制し、
前記第2の接合部材は前記基板と前記導光部材とを接合し、前記導光部材に対する外力を加えた際又は熱膨張による歪みが生じた際に、前記基板の主面と平行な方向に前記導光部材の動きを抑制し、及び/又は、前記基板の主面に垂直な平面内に動きを抑制し、
第1の接合部材及び第2の接合部材の少なくとも一方は、前記基板の主面と平行な方向又は前記基板の主面に垂直な平面内に動きうる。
A gas detection device according to an embodiment of the present disclosure includes:
A substrate;
A light emitting element that is provided on a main surface of the substrate and emits light;
a light receiving element provided on a main surface of the substrate and receiving the light;
a light guiding member that guides the light emitted by the light emitting element to the light receiving element;
A first bonding member;
A second joining member,
the first bonding member bonds the substrate and the light guiding member and suppresses movement of the light guiding member in a direction parallel to and/or perpendicular to a main surface of the substrate when an external force is applied to the light guiding member;
the second bonding member bonds the substrate and the light guiding member, and when an external force is applied to the light guiding member or when distortion occurs due to thermal expansion, suppresses movement of the light guiding member in a direction parallel to a main surface of the substrate and/or suppresses movement within a plane perpendicular to the main surface of the substrate;
At least one of the first bonding member and the second bonding member may move in a direction parallel to a major surface of the substrate or in a plane perpendicular to the major surface of the substrate.

本開示の一実施形態に係るガス検出装置は、
光を発する発光素子と前記光を受け取る受光素子とを主面に設けた基板と、
前記発光素子が発した前記光を前記受光素子に導く導光部材と、
前記基板と前記導光部材とを接合する第1の接合部材と、
前記基板と前記導光部材とを接合し、前記第1の接合部材より低い接合度を有する第2の接合部材と、を備える。
A gas detection device according to an embodiment of the present disclosure includes:
A substrate having a light emitting element that emits light and a light receiving element that receives the light provided on a main surface thereof;
a light guiding member that guides the light emitted by the light emitting element to the light receiving element;
a first bonding member that bonds the substrate and the light guide member;
a second bonding member that bonds the substrate and the light guide member and has a bonding strength lower than that of the first bonding member.

本開示の一実施形態に係るガス検出装置は、
基板と、
前記基板の主面に設けられ、光を発する発光素子と、
前記基板の主面に設けられ、前記光を受け取る受光素子と、
前記発光素子が発した前記光を前記受光素子に導く導光部材と、
第1の接合部材と、
第2の接合部材と、を備え、
前記第1の接合部材は、前記基板と前記導光部材とを、基板の平面と平行な第1方向に第1拘束度で、前記基板の平面と平行かつ前記1方向と垂直な第2方向に第2拘束度で、及び前記基板の平面に垂直な第3方向に第3拘束度で、それぞれの並進方向に拘束し、
前記第2の接合部材は、前記基板と前記導光部材とを、前記第1方向に第4拘束度で、前記第2方向に第5拘束度で、及び前記第3方向に第6拘束度で、それぞれの並進方向に拘束し、
前記第1拘束度から前記第6拘束度のうち少なくとも1つはゼロであり、前記第1拘束度と前記第4拘束度の何れか一方はゼロではなく、前記第2拘束度と前記第5拘束度の何れか一方はゼロではなく、前記第3拘束度と前記第6拘束度の何れか一方はゼロではない。
A gas detection device according to an embodiment of the present disclosure includes:
A substrate;
A light emitting element that is provided on a main surface of the substrate and emits light;
a light receiving element provided on a main surface of the substrate and receiving the light;
a light guiding member that guides the light emitted by the light emitting element to the light receiving element;
A first bonding member;
A second joining member,
the first bonding member constrains the substrate and the light guide member in each translation direction with a first degree of constraint in a first direction parallel to a plane of the substrate, a second degree of constraint in a second direction parallel to the plane of the substrate and perpendicular to the first direction, and a third degree of constraint in a third direction perpendicular to the plane of the substrate;
the second bonding member constrains the substrate and the light guiding member in each translation direction at a fourth constraint degree in the first direction, a fifth constraint degree in the second direction, and a sixth constraint degree in the third direction;
At least one of the first constraint degree to the sixth constraint degree is zero, one of the first constraint degree and the fourth constraint degree is not zero, one of the second constraint degree and the fifth constraint degree is not zero, and one of the third constraint degree and the sixth constraint degree is not zero.

本開示の一実施形態によれば、光路の歪みの発生を抑制することが可能なガス検出装置が提供され得る。 According to one embodiment of the present disclosure, a gas detection device can be provided that can suppress the occurrence of distortion in the optical path.

図1は、本開示の一実施形態に係るガス検出装置の一部を透過させた斜視図である。FIG. 1 is a partially see-through perspective view of a gas detection device according to an embodiment of the present disclosure. 図2は、ガス検出装置の断面の一例を示す図である。FIG. 2 is a diagram showing an example of a cross section of the gas detection device. 図3は、第1及び第2の接合部材の配置及び形状の一例を示す図である。FIG. 3 is a diagram showing an example of the arrangement and shape of the first and second joint members. 図4は、第1の接合部材の配置の別の例を示す図である。FIG. 4 is a diagram showing another example of the arrangement of the first joint members. 図5は、第2の接合部材の断面拡大図である。FIG. 5 is an enlarged cross-sectional view of the second joining member. 図6は、ガス検出装置の断面の別の例を示す図である。FIG. 6 is a diagram showing another example of a cross section of a gas detection device. 図7は、第1の接合部材の配置及び形状の別の例を示す図である。FIG. 7 is a diagram showing another example of the arrangement and shape of the first joint members. 図8は、第1の接合部材の形状の別の例を示す図である。FIG. 8 is a diagram showing another example of the shape of the first joint member. 図9は、第1の接合部材の形状の別の例を示す図である。FIG. 9 is a diagram showing another example of the shape of the first joint member. 図10は、導光部材の別の構成例を示す図である。FIG. 10 is a diagram showing another configuration example of the light guide member. 図11は、長穴を説明するための図である。FIG. 11 is a diagram for explaining the slot. 図12は、物面(発光面)での強度分布と像面(受光面)における照度分布とを説明するための図である。FIG. 12 is a diagram for explaining the intensity distribution on the object plane (light-emitting surface) and the illuminance distribution on the image plane (light-receiving surface). 図13は、拘束点と歪みとの関係を説明するための図である。FIG. 13 is a diagram for explaining the relationship between the constraint points and the distortion. 図14は、第1の接合部材の形状の別の例を示す図である。FIG. 14 is a diagram showing another example of the shape of the first joint member. 図15は、第1及び第2の接合部材の配置を説明する図である。FIG. 15 is a diagram illustrating the arrangement of the first and second joint members.

(第1実施形態)
図1は、本開示の一実施形態に係るガス検出装置1の一部を透過させた斜視図である。ガス検出装置1は、一例として30mm×20mm×10mmの小型の装置であって、ガスセンサーとも称される。本実施形態において、ガス検出装置1は、導入した気体を透過した赤外線に基づいて被検出ガスの濃度を測定する、NDIR(Non Dispersive InfraRed)方式の装置である。被検出ガスは、例えば二酸化炭素、水蒸気、メタン、プロパン、ホルムアルデヒド、一酸化炭素、一酸化窒素、アンモニア、二酸化硫黄又はアルコール等である。
First Embodiment
1 is a partially transparent perspective view of a gas detection device 1 according to an embodiment of the present disclosure. The gas detection device 1 is, for example, a small device measuring 30 mm×20 mm×10 mm, and is also called a gas sensor. In this embodiment, the gas detection device 1 is an NDIR (Non Dispersive InfraRed) type device that measures the concentration of a detection target gas based on infrared rays transmitted through an introduced gas. The detection target gas is, for example, carbon dioxide, water vapor, methane, propane, formaldehyde, carbon monoxide, nitric oxide, ammonia, sulfur dioxide, alcohol, or the like.

ガス検出装置1は、基板2と、発光素子3と、受光素子4と、導光部材5と、第1の接合部材6と、第2の接合部材7と、を備える。図1では、導光部材5の一部を透過させてガス検出装置1の構成例を示しており、基板2の主面20に設けられた発光素子3及び受光素子4が見えている。本実施形態において、主面20は、基板2の面積が最も大きい面のうちで導光部材5と対向する面である。 The gas detection device 1 comprises a substrate 2, a light-emitting element 3, a light-receiving element 4, a light-guiding member 5, a first bonding member 6, and a second bonding member 7. In FIG. 1, an example of the configuration of the gas detection device 1 is shown with a portion of the light-guiding member 5 being transparent, and the light-emitting element 3 and the light-receiving element 4 provided on the main surface 20 of the substrate 2 are visible. In this embodiment, the main surface 20 is the surface of the substrate 2 that has the largest area and faces the light-guiding member 5.

以下、図1に示すように、xy平面が基板2の主面20と平行であるように、直交座標が設定される。z軸方向は、基板2の主面20に垂直な方向である。x軸方向及びy軸方向は、基板2の主面20の辺と平行である。ここで、y軸方向は、後述する第1の反射部51と第2の反射部52とが向かい合う方向に対応する。 As shown in FIG. 1, below, the orthogonal coordinates are set so that the xy plane is parallel to the main surface 20 of the substrate 2. The z-axis direction is perpendicular to the main surface 20 of the substrate 2. The x-axis direction and the y-axis direction are parallel to the sides of the main surface 20 of the substrate 2. Here, the y-axis direction corresponds to the direction in which the first reflecting section 51 and the second reflecting section 52, which will be described later, face each other.

基板2は、ガス検出装置1の部品を実装し、実装された電子部品の電気的な接続を行う板状の部材である。基板2は、発光素子3と、受光素子4と、を主面20に設ける。基板2はさらに別の電子部品を実装してよい。例えば、基板2は主面20又は主面20と反対の面である底面に、発光素子3及び受光素子4の少なくとも一方を制御するコントローラを設けてよい。また、基板2は主面20又は底面に、ガス濃度算出における演算を実行する演算部を備えてよい。演算部は、読み込むプログラムに応じた機能を実行する汎用のプロセッサ、及び、特定の処理に特化した専用のプロセッサの少なくとも1つを含んでよい。専用のプロセッサは、特定用途向けIC(ASIC;Application Specific Integrated Circuit)を含んでよい。プロセッサは、プログラマブルロジックデバイス(PLD;Programmable Logic Device)を含んでよい。演算部は、上記のコントローラと一体化されていてよい。 The substrate 2 is a plate-shaped member on which the components of the gas detection device 1 are mounted and which electrically connects the mounted electronic components. The substrate 2 has the light-emitting element 3 and the light-receiving element 4 on the main surface 20. The substrate 2 may further have other electronic components mounted thereon. For example, the substrate 2 may have a controller for controlling at least one of the light-emitting element 3 and the light-receiving element 4 on the main surface 20 or the bottom surface opposite the main surface 20. The substrate 2 may also have a calculation unit on the main surface 20 or the bottom surface that performs calculations in calculating the gas concentration. The calculation unit may include at least one of a general-purpose processor that performs functions according to a program to be loaded and a dedicated processor specialized for a specific process. The dedicated processor may include an application specific integrated circuit (ASIC). The processor may include a programmable logic device (PLD). The calculation unit may be integrated with the controller.

発光素子3は、被検出ガスの検出に用いられる光を発する部品である。発光素子3は、被検出ガスによって吸収される波長を含む光を出力するものであれば特に制限されない。本実施形態において、発光素子3が発する光は赤外線であるが、これに限定されない。本実施形態において、発光素子3はLED(light emitting diode、発光ダイオード)であるが、別の例として半導体レーザ、有機発光素子又はMEMS(Micro Electro Mechanical Systems)ヒータ等であり得る。発光素子3は、基板2の主面20の第1の領域21に設けられる。第1の領域21は、z軸方向において、後述する第1のミラー511と対向する位置に定められる。 The light-emitting element 3 is a component that emits light used to detect the gas to be detected. There are no particular limitations on the light-emitting element 3 as long as it outputs light that includes a wavelength that is absorbed by the gas to be detected. In this embodiment, the light emitted by the light-emitting element 3 is infrared light, but is not limited to this. In this embodiment, the light-emitting element 3 is an LED (light emitting diode), but other examples include a semiconductor laser, an organic light-emitting element, or a MEMS (Micro Electro Mechanical Systems) heater. The light-emitting element 3 is provided in a first region 21 of the main surface 20 of the substrate 2. The first region 21 is positioned in the z-axis direction opposite a first mirror 511, which will be described later.

受光素子4は、導入した気体を透過した光を受け取る部品である。受光素子4は、被検出ガスによって吸収される波長を含む光の帯域に感度を有するものであれば特に制限されない。本実施形態において、受光素子4が受け取る光は赤外線であるが、これに限定されない。本実施形態において、受光素子4はフォトダイオード(Photodiode)であるが、別の例としてフォトトランジスタ又はサーモパイル、焦電センサ、ボロメータ等であり得る。受光素子4は、受け取った光を電気信号に変換して、変換した電気信号を出力する。電気信号は、例えば演算部に出力される。電気信号を受け取った演算部は、光の透過率等に基づいて被検出ガスの濃度を演算する。受光素子4は、基板2の主面20の第2の領域22に設けられる。第2の領域22は、z軸方向において、後述する第5のミラー513と対向する位置に定められる。受光素子4は波長選択機能を有する光学フィルタを備えていてよい。 The light receiving element 4 is a component that receives light that has passed through the introduced gas. The light receiving element 4 is not particularly limited as long as it has sensitivity to a band of light that includes the wavelength absorbed by the gas to be detected. In this embodiment, the light received by the light receiving element 4 is infrared light, but is not limited to this. In this embodiment, the light receiving element 4 is a photodiode, but other examples may include a phototransistor, a thermopile, a pyroelectric sensor, a bolometer, etc. The light receiving element 4 converts the received light into an electric signal and outputs the converted electric signal. The electric signal is output to, for example, a calculation unit. The calculation unit that receives the electric signal calculates the concentration of the gas to be detected based on the light transmittance, etc. The light receiving element 4 is provided in the second region 22 of the main surface 20 of the substrate 2. The second region 22 is determined to be opposite the fifth mirror 513 described later in the z-axis direction. The light receiving element 4 may be equipped with an optical filter having a wavelength selection function.

導光部材5は、発光素子3が発した光を受光素子4に導く部材である。導光部材5は、ガス検出装置1の光学系である。導光部材5は光学部材を備え、発光素子3から受光素子4への光路を構成する。換言すると、導光部材5は、発光素子3と受光素子4とを光学的に接続させる。ここで、光学部材は例えばミラー及びレンズ等である。 The light-guiding member 5 is a member that guides the light emitted by the light-emitting element 3 to the light-receiving element 4. The light-guiding member 5 is the optical system of the gas detection device 1. The light-guiding member 5 includes optical members and forms an optical path from the light-emitting element 3 to the light-receiving element 4. In other words, the light-guiding member 5 optically connects the light-emitting element 3 and the light-receiving element 4. Here, the optical members are, for example, mirrors and lenses.

本実施形態において、導光部材5は、第1の反射部51と、第2の反射部52と、を備える。第1の反射部51は、光学部材として、第1のミラー511と、第3のミラー512と、第5のミラー513と、を備える。第1の反射部51は、発光素子3から発せられた光を最初に反射する鏡を持ち、及び受光素子4が受け取る光を最後に反射する鏡を持つ。第2の反射部52は、光学部材として、第2のミラー521と、第4のミラー522と、を備える。導光部材5は、発光素子3が発した光を、第1のミラー511、第2のミラー521、第3のミラー512、第4のミラー522及び第5のミラー513の順に反射して、受光素子4に導く。光路は、導光部材5と基板2との間に設けられた、気体が導入されるセル54を通過するように構成される。別の例として、導光部材5が備えるミラーの数は5つ以外の1つ以上であってよい。また、導光部材5は光路の一部においてレンズを備える構成であってよい。 In this embodiment, the light-guiding member 5 includes a first reflecting portion 51 and a second reflecting portion 52. The first reflecting portion 51 includes a first mirror 511, a third mirror 512, and a fifth mirror 513 as optical members. The first reflecting portion 51 has a mirror that first reflects the light emitted from the light-emitting element 3, and a mirror that finally reflects the light received by the light-receiving element 4. The second reflecting portion 52 includes a second mirror 521 and a fourth mirror 522 as optical members. The light-guiding member 5 reflects the light emitted by the light-emitting element 3 in the order of the first mirror 511, the second mirror 521, the third mirror 512, the fourth mirror 522, and the fifth mirror 513, and guides the light to the light-receiving element 4. The light path is configured to pass through a cell 54, which is provided between the light-guiding member 5 and the substrate 2 and into which gas is introduced. As another example, the number of mirrors provided in the light-guiding member 5 may be one or more other than five. Also, the light-guiding member 5 may be configured to include a lens in part of the optical path.

導光部材5において、第1の反射部51は、第2の反射部52に対する相対位置が固定される。例えば、第1の反射部51及び第2の反射部52は樹脂製であって一体形成されてよい。第1の反射部51及び第2の反射部52のミラーは、一体形成の後に金属メッキで加工されてよい。別の例として、第1の反射部51及び第2の反射部52は個別に形成されて、接着剤、ネジ、ツメ、はめ合い、グロメット、溶着等によって強力に固定されてよい。 In the light-guiding member 5, the first reflecting portion 51 is fixed in position relative to the second reflecting portion 52. For example, the first reflecting portion 51 and the second reflecting portion 52 may be made of resin and integrally formed. The mirrors of the first reflecting portion 51 and the second reflecting portion 52 may be processed by metal plating after integral formation. As another example, the first reflecting portion 51 and the second reflecting portion 52 may be formed separately and strongly fixed by adhesives, screws, claws, fittings, grommets, welding, etc.

第1のミラー511は、焦点にある発光素子3から射出された光を反射する集光鏡である。第1のミラー511は例えば凹面鏡である。第1のミラー511の形状として、楕円面が使用されてよい。本実施形態において、第1のミラー511は、焦点にある発光素子3からz軸方向に発せられた光をxy平面方向に反射する。ここで、xy平面方向は、x軸方向及びy軸方向の少なくとも1つの方向の成分を有する方向である。ただし、xy平面方向は、z軸方向成分を有していてよい。 The first mirror 511 is a collecting mirror that reflects the light emitted from the light-emitting element 3 at the focal point. The first mirror 511 is, for example, a concave mirror. The shape of the first mirror 511 may be an ellipsoid. In this embodiment, the first mirror 511 reflects the light emitted in the z-axis direction from the light-emitting element 3 at the focal point in the xy plane direction. Here, the xy plane direction is a direction that has components in at least one of the x-axis and y-axis directions. However, the xy plane direction may have a z-axis component.

第2のミラー521、第3のミラー512及び第4のミラー522は、入射した光を反射する。第2のミラー521、第3のミラー512及び第4のミラー522の少なくとも1つは、集光機能を有する集光鏡であってよい。第2のミラー521、第3のミラー512及び第4のミラー522の少なくとも1つは、例えば凹面鏡であってよい。図1に示すように、第2のミラー521は、入射した第1のミラー511からの光を、第3のミラー512へ反射する。第3のミラー512は、入射した第2のミラー521からの光を、第4のミラー522へ反射する。第4のミラー522は、入射した第3のミラー512からの光を、第5のミラー513へ反射する。 The second mirror 521, the third mirror 512, and the fourth mirror 522 reflect the incident light. At least one of the second mirror 521, the third mirror 512, and the fourth mirror 522 may be a focusing mirror having a focusing function. At least one of the second mirror 521, the third mirror 512, and the fourth mirror 522 may be, for example, a concave mirror. As shown in FIG. 1, the second mirror 521 reflects the incident light from the first mirror 511 to the third mirror 512. The third mirror 512 reflects the incident light from the second mirror 521 to the fourth mirror 522. The fourth mirror 522 reflects the incident light from the third mirror 512 to the fifth mirror 513.

第5のミラー513は、入射した光を受光素子4に集光させる集光鏡である。第5のミラー513は例えば凹面鏡である。第5のミラー513の形状として、楕円面が使用されてよい。本実施形態において、第5のミラー513は、入射した第4のミラー522からのxy平面方向の光をz軸方向の成分を有するように反射する。具体的には、第5のミラー513は、焦点位置にある受光素子4において集光するように入射した光を反射する。 The fifth mirror 513 is a focusing mirror that focuses the incident light on the light receiving element 4. The fifth mirror 513 is, for example, a concave mirror. The shape of the fifth mirror 513 may be an ellipsoid. In this embodiment, the fifth mirror 513 reflects the incident light in the xy plane direction from the fourth mirror 522 so that it has a z-axis component. Specifically, the fifth mirror 513 reflects the incident light so that it is focused on the light receiving element 4 at the focal position.

第1のミラー511、第2のミラー521、第3のミラー512、第4のミラー522及び第5のミラー513を構成する材料は、例えば、金属、ガラス、セラミックス、ステンレス等であってよいが、この限りではない。検出感度向上の観点から、これらのミラーを構成する材料は、光の吸収係数が小さく反射率が高い材料で構成されることが好ましい。具体的には、アルミニウム、金、銀を含む合金、誘電体、若しくはこれらの積層体のコーティングが施された樹脂筐体が好ましい。信頼性及び経時変化の観点から金又は金を含む合金層でコーティングされた樹脂筐体が好ましい。さらに、反射率を高め、かつ経年劣化を避けるために金属層の表面に誘電体積層膜を形成することが好ましい。第1のミラー511及び第5のミラー513が樹脂筐体への蒸着又はめっきによって形成される場合、金属材料で形成される場合と比較して、高生産性と軽量化の向上を図ることができる。さらに、基板2との熱膨張係数差が縮まり、熱変形が抑制され、感度の変動が抑制される。また、導光部材5は切削加工で成形されてよく、生産性の観点からより好ましくは射出成型で成形されることが望ましい。 The materials constituting the first mirror 511, the second mirror 521, the third mirror 512, the fourth mirror 522 and the fifth mirror 513 may be, for example, metal, glass, ceramics, stainless steel, etc., but are not limited thereto. From the viewpoint of improving the detection sensitivity, it is preferable that the materials constituting these mirrors are composed of materials with a small light absorption coefficient and high reflectance. Specifically, a resin housing coated with an alloy containing aluminum, gold, or silver, a dielectric, or a laminate of these is preferable. From the viewpoint of reliability and change over time, a resin housing coated with gold or an alloy layer containing gold is preferable. Furthermore, it is preferable to form a dielectric laminate film on the surface of the metal layer to increase the reflectance and avoid deterioration over time. When the first mirror 511 and the fifth mirror 513 are formed by deposition or plating on the resin housing, it is possible to improve high productivity and weight reduction compared to when they are formed from a metal material. Furthermore, the difference in thermal expansion coefficient with the substrate 2 is reduced, thermal deformation is suppressed, and fluctuations in sensitivity are suppressed. The light guide member 5 may be formed by cutting, and from the standpoint of productivity, it is more preferable that it be formed by injection molding.

第1の接合部材6は、基板2と導光部材5とを接合する部材である。本実施形態において、第1の接合部材6は、1本の柱体であって、基板2に接合する第1の底面部61(図2参照)と、導光部材5に接合する第2の底面部62と、を有する。第1の底面部61と基板2とは、例えば接着剤、グロメット又はネジ、溶着、ツメ、はめ合い等によって接合される。第2の底面部62と導光部材5との接合も同様である。また、生産性の観点から、構成部材の数が削減されるため第1の接合部材6と導光部材5は一体成型されていることが望ましい。 The first joining member 6 is a member that joins the substrate 2 and the light-guiding member 5. In this embodiment, the first joining member 6 is a single column, and has a first bottom surface portion 61 (see FIG. 2) that is joined to the substrate 2, and a second bottom surface portion 62 that is joined to the light-guiding member 5. The first bottom surface portion 61 and the substrate 2 are joined by, for example, adhesive, grommets or screws, welding, tabs, fitting, etc. The same applies to the joining of the second bottom surface portion 62 and the light-guiding member 5. In addition, from the viewpoint of productivity, it is desirable that the first joining member 6 and the light-guiding member 5 are integrally molded in order to reduce the number of components.

第2の接合部材7は、第1の接合部材6と異なる位置において、基板2と導光部材5とを接合する部材である。第2の接合部材7の挿入部7a(図2参照)は導光部材5と接続される。第2の接合部材7の挿入部7aは、導光部材5と例えば接着剤、グロメット又はネジ、溶着ツメ、はめ合い等によって強固に接続されてよい。別の例として、第2の接合部材7の挿入部7aは、導光部材5と同じ材料であって、導光部材5と一体形成されてよい。導光部材5と一体形成される場合、構成部材の数が削減されるため、生産性が向上する。図1に示すように、第1の反射部51が第1の接合部材6によって基板2と接合されて、第2の反射部52が第2の接合部材7によって基板2と接合される。 The second joining member 7 is a member that joins the substrate 2 and the light guide member 5 at a position different from that of the first joining member 6. The insertion portion 7a (see FIG. 2) of the second joining member 7 is connected to the light guide member 5. The insertion portion 7a of the second joining member 7 may be firmly connected to the light guide member 5 by, for example, adhesive, grommets or screws, welding tabs, fitting, or the like. As another example, the insertion portion 7a of the second joining member 7 may be made of the same material as the light guide member 5 and may be integrally formed with the light guide member 5. When integrally formed with the light guide member 5, the number of components is reduced, thereby improving productivity. As shown in FIG. 1, the first reflecting portion 51 is joined to the substrate 2 by the first joining member 6, and the second reflecting portion 52 is joined to the substrate 2 by the second joining member 7.

図2は、ガス検出装置1の断面の一例を示す図である。図2では、基板2と、第3のミラー512を含む導光部材5と、第1の接合部材6と、第2の接合部材7と、をyz平面に平行な面で切断した断面が示されている。セル54は、基板2と導光部材5とで挟まれた、ガス検出装置1の内部に形成される。導光部材5は、セル54に気体を導入する通気口53を備える。通気口53は、セル54からの気体の排出でも使用され得る。本実施形態において、第1の接合部材6は、中空の円柱体である。第1の底面部61は、基板2の底面から中空部分にネジが挿入されることによって、基板2と接合される。第2の底面部62は、中空部分にグロメットが挿入されて広がることによって、導光部材5と接合される。別の例として、第1の接合部材6は、中実の円柱体であってよい。第1の底面部61と基板2、及び、第2の底面部62と導光部材5は、接着剤、溶着、ツメ、はめ合い等によって接合されてよい。 2 is a diagram showing an example of a cross section of the gas detection device 1. In FIG. 2, a cross section of the substrate 2, the light guide member 5 including the third mirror 512, the first joint member 6, and the second joint member 7 is shown cut along a plane parallel to the yz plane. The cell 54 is formed inside the gas detection device 1, sandwiched between the substrate 2 and the light guide member 5. The light guide member 5 has a vent 53 for introducing gas into the cell 54. The vent 53 may also be used to exhaust gas from the cell 54. In this embodiment, the first joint member 6 is a hollow cylinder. The first bottom surface portion 61 is joined to the substrate 2 by inserting a screw into the hollow portion from the bottom surface of the substrate 2. The second bottom surface portion 62 is joined to the light guide member 5 by inserting a grommet into the hollow portion and expanding it. As another example, the first joint member 6 may be a solid cylinder. The first bottom surface portion 61 and the substrate 2, and the second bottom surface portion 62 and the light-guiding member 5 may be joined by adhesive, welding, nails, fitting, etc.

第2の接合部材7は、挿入部7aと、留め具7bと、を備える。挿入部7aは、上記のように、一部が導光部材5と強固に接続される。挿入部7aは、少なくとも一部が基板2のホール25に挿入される。別の例として、留め具7bの少なくとも一部がホール25に挿入される場合もある。ホール25は基板2に設けられた穴である。本実施形態において、ホール25は基板2をz軸方向すなわち厚み方向に貫通する。本実施形態において、挿入部7aは円柱体である。挿入部7aは、導光部材5と接続される面と反対側の面に、留め具7bが挿入される穴を有する。留め具7bは、基板2の底面のホール25から挿入されて、挿入部7aを留める。本実施形態において、留め具7bはネジであるが、他の具体例としてピン又はグロメット等であり得る。留め具7b及び挿入部7aの穴は、互いに対応するネジ山を有する。換言すると、留め具7bは挿入部7aをねじ留めする。ここで、別の例として、第2の接合部材7は、留め具7bのない構成であってよい。つまり、第2の接合部材7は、留め具7b用の穴がない挿入部7aのみで構成されてよい。この場合に、ホール25は主面20に設けられ、基板2をz軸方向に貫通しない穴であってよい。図2の第1のミラー511、基板2の主面20及び発光素子3は、図1の同じ番号が付された要素と同じであるため、説明を省略する。理由は後述するがホール25が一方向に伸長した長穴であってよい。また好ましくはホール25が、第1の接合部材と第2の接合部材の基板2の主面への垂直投影像のそれぞれの中心をつないだ方向に対して伸長している穴であってよい。ここで伸長した方向とは、長穴において長径を有する方向のことである。ホール25が長穴であり第2の接合部材7が留め具7bで留められている構成である場合には、第2の接合部材は、導光部材5に対する外力を加えた際又は熱膨張による歪みが生じた際に、基板2の主面20と平行であって、長穴の伸長する方向である、ある1方向以外の導光部材の動きを抑制する。外力の一例としては、ガス検出装置1の基板2を土台に固定し、導光部材5の代表点を押すことで、z軸方向にねじりを加えることである。詳細には代表点として、例えば第1の接合部材以外の導光部材5の一点、若しくは第1の接合部材から最も遠い導光部材5の表面の点を選択し、ここに外力を加える。他にも代表点としては導光部材5の各面の幾何中心を選んでよい。また外力の方向は基板2の主面20と平行な方向かつ代表点と第1の接合部をつなぐ方向に垂直な方向である。また、第2の接合部材7が留め具7bのない構成である場合、第2の接合部材7は基板2の主面20と垂直方向に自由に動ける。そのため、導光部材5に対する外力を加えた際又は熱膨張による歪みが生じた際に、第2の接合部材7は基板2の主面20に垂直な平面内に動きを抑制される。ここで長穴とは、図11に示すように、穴の外周に平行な2つの線分を含む形状の穴のことである。具体例として長穴とは、それぞれの中心が線分上に並ぶよう、同じ径の円を連続的に並べ、重ね合わせた図形の穴、又は長方形状の穴であってよい。ただし、第1の接合部材及び第2の接合部材が、それぞれ基板の主面と平行な方向及び垂直な方向に動きを抑制するものは本開示の実施形態から除かれる場合がある。 The second joint member 7 includes an insertion portion 7a and a fastener 7b. As described above, a portion of the insertion portion 7a is firmly connected to the light-guiding member 5. At least a portion of the insertion portion 7a is inserted into the hole 25 of the substrate 2. As another example, at least a portion of the fastener 7b may be inserted into the hole 25. The hole 25 is a hole provided in the substrate 2. In this embodiment, the hole 25 penetrates the substrate 2 in the z-axis direction, i.e., the thickness direction. In this embodiment, the insertion portion 7a is a cylindrical body. The insertion portion 7a has a hole into which the fastener 7b is inserted on the surface opposite to the surface connected to the light-guiding member 5. The fastener 7b is inserted from the hole 25 on the bottom surface of the substrate 2 to fasten the insertion portion 7a. In this embodiment, the fastener 7b is a screw, but other specific examples may include a pin or a grommet. The fastener 7b and the hole of the insertion portion 7a have corresponding threads. In other words, the fastener 7b screws the insertion portion 7a. Here, as another example, the second joining member 7 may be configured without the fastener 7b. That is, the second joining member 7 may be configured only with the insertion portion 7a without a hole for the fastener 7b. In this case, the hole 25 may be a hole provided on the main surface 20 and not penetrating the substrate 2 in the z-axis direction. The first mirror 511, the main surface 20 of the substrate 2, and the light-emitting element 3 in FIG. 2 are the same as the elements with the same numbers in FIG. 1, so their explanations are omitted. The reason will be described later, but the hole 25 may be an elongated hole extending in one direction. Also, preferably, the hole 25 may be a hole extending in a direction connecting the centers of the vertical projection images of the first joining member and the second joining member onto the main surface of the substrate 2. Here, the extended direction refers to the direction in which the elongated hole has a major diameter. In the case where the hole 25 is an elongated hole and the second joint member 7 is fastened by a fastener 7b, the second joint member suppresses the movement of the light guide member in a direction other than one direction, which is parallel to the main surface 20 of the substrate 2 and is the direction in which the elongated hole extends, when an external force is applied to the light guide member 5 or when distortion occurs due to thermal expansion. One example of the external force is to fix the substrate 2 of the gas detection device 1 to a base and press a representative point of the light guide member 5 to apply a twist in the z-axis direction. In detail, for example, a point on the light guide member 5 other than the first joint member or a point on the surface of the light guide member 5 farthest from the first joint member is selected as the representative point, and an external force is applied to this point. Alternatively, the geometric center of each surface of the light guide member 5 may be selected as the representative point. The direction of the external force is parallel to the main surface 20 of the substrate 2 and perpendicular to the direction connecting the representative point and the first joint. In addition, when the second bonding member 7 is configured without the fastener 7b, the second bonding member 7 can freely move in a direction perpendicular to the main surface 20 of the substrate 2. Therefore, when an external force is applied to the light guide member 5 or when distortion occurs due to thermal expansion, the second bonding member 7 is restricted from moving in a plane perpendicular to the main surface 20 of the substrate 2. Here, the long hole refers to a hole having a shape including two line segments parallel to the periphery of the hole, as shown in FIG. 11. As a specific example, the long hole may be a hole having a shape in which circles of the same diameter are continuously arranged and superimposed so that their centers are aligned on the line segments, or a rectangular hole. However, the first bonding member and the second bonding member that restrict the movement in the direction parallel to and perpendicular to the main surface of the substrate, respectively, may be excluded from the embodiments of the present disclosure.

図3は、第1の接合部材6の配置及び形状の一例を示す図である。図3では、z軸の負方向に向かって見た基板2の主面20が示されている。垂直投影像6iは、第1の接合部材6が基板2の主面20に対して垂直に投影された像である。本実施形態において、基板2の主面20への垂直投影像6iは中空円形である。別の例として、第1の接合部材6が中実の円柱体の場合に、垂直投影像6iは中実円形である。ここで、図3において、第1の領域21の中心21cと、第2の領域22の中心22cと、を結ぶ線分の中点24が示されている。また、図3において、第1の領域21の中心21cと第2の領域22の中心22cとを結ぶ線分の垂直二等分線23が示されている。また、挿入部7a及び留め具7bを備える第2の接合部材7が、ホール25に対して隙間を有しながら、挿入されている様子が示されている。本実施形態において、第1の接合部材6は、基板2の主面20への垂直投影像6iが、垂直二等分線23上にあるように配置される。また、詳細について後述するが、第2の接合部材7は導光部材5を自由に動ける方向をもって、つまり自由度を有して接合するために、実質的に、基板2と導光部材5とが第1の接合部材6によって接合されている。ここで垂直投影像6iとは、基板2の主面20の直上にある第1の接合部材6の断面形状であってよい。 Figure 3 is a diagram showing an example of the arrangement and shape of the first joining member 6. In Figure 3, the main surface 20 of the substrate 2 viewed toward the negative direction of the z axis is shown. The vertical projection image 6i is an image of the first joining member 6 projected perpendicularly onto the main surface 20 of the substrate 2. In this embodiment, the vertical projection image 6i onto the main surface 20 of the substrate 2 is a hollow circle. As another example, when the first joining member 6 is a solid cylinder, the vertical projection image 6i is a solid circle. Here, in Figure 3, the midpoint 24 of the line segment connecting the center 21c of the first region 21 and the center 22c of the second region 22 is shown. Also, in Figure 3, the perpendicular bisector 23 of the line segment connecting the center 21c of the first region 21 and the center 22c of the second region 22 is shown. Also, the second joining member 7 having the insertion portion 7a and the fastener 7b is shown being inserted into the hole 25 with a gap therebetween. In this embodiment, the first bonding member 6 is disposed so that a vertical projection image 6i onto the main surface 20 of the substrate 2 is on the perpendicular bisector 23. In addition, as will be described in detail later, the second bonding member 7 bonds the light guide member 5 in a direction that allows it to move freely, that is, with a degree of freedom, so that the substrate 2 and the light guide member 5 are essentially bonded by the first bonding member 6. Here, the vertical projection image 6i may be the cross-sectional shape of the first bonding member 6 directly on the main surface 20 of the substrate 2.

第1の接合部材6及び第2の接合部材7は、弾性率が大きく、変形しにくい材料を用いることができる。例えば第1の接合部材6及び第2の接合部材7の材料は、LCP(液晶ポリマー)、PP(ポリプロピレン)、PEEK(ポリエーテルエーテルケトン)、PA(ポリアミド)、PPE(ポリフェニレンエーテル)、PC(ポリカーボネート)、又はPPS(ポリフェニレンスルファイド)、PMMA(ポリメタクリル酸メチル樹脂)等、及び、これらの2つ以上を混合した硬質樹脂か、又は耐熱性の観点から金属であってよい。また第1の接合部材6及び第2の接合部材7と導光部材5は同じ材料であってよい。第1の接合部材6及び第2の接合部材7と導光部材5の材料が同じであれば熱膨張差が生じないため、熱歪みを抑えることができる。基板2と導光部材5とは、実質的に第1の接合部材6で接合される。そのため、基板2が例えば熱膨張によって変形しても、拘束点が一つで過拘束になっていないため、導光部材5は基板2の変形の影響を受けない。例えば、基板2がy軸方向に広がるように変形した場合に、導光部材5が基板2と実質的に一点だけで接続されているので、光学部材は歪みを生じることなく一点を中心に相似縮小(膨張)する。その場合、光学性能には影響がない。 The first bonding member 6 and the second bonding member 7 can be made of a material that has a large elastic modulus and is difficult to deform. For example, the material of the first bonding member 6 and the second bonding member 7 may be LCP (liquid crystal polymer), PP (polypropylene), PEEK (polyether ether ketone), PA (polyamide), PPE (polyphenylene ether), PC (polycarbonate), PPS (polyphenylene sulfide), PMMA (polymethyl methacrylate resin), etc., or a hard resin made by mixing two or more of these, or a metal from the viewpoint of heat resistance. In addition, the first bonding member 6, the second bonding member 7, and the light guide member 5 may be made of the same material. If the first bonding member 6, the second bonding member 7, and the light guide member 5 are made of the same material, no difference in thermal expansion occurs, and thermal distortion can be suppressed. The substrate 2 and the light guide member 5 are substantially bonded by the first bonding member 6. Therefore, even if the substrate 2 deforms due to, for example, thermal expansion, the light-guiding member 5 is not affected by the deformation of the substrate 2 because there is only one constraint point and it is not over-constrained. For example, if the substrate 2 deforms so as to expand in the y-axis direction, the optical member shrinks (expands) similarly around the one point without distortion, because the light-guiding member 5 is essentially connected to the substrate 2 at only one point. In that case, there is no effect on the optical performance.

また、仮に第2の接合部材7が存在せず、基板2と導光部材5とに異なる力が作用する場合、第1の接合部材6は軸方向に変形しにくいが、一方でねじれ変形及び曲げ変形を生じうる。そのため、導光部材5は、たとえば第2の接合部材7が導光部材5をx方向には拘束しない場合、基板2に対して第1の接合部材6を回転軸とする回転移動することがあり得る。すなわち、第1の接合部材6は導光部材5に対して基板2の主面20と平行な方向に外力を加えた際に回転軸となる。換言すると、導光部材5が基板2に対して動く場合に回転軸となりえる。ここで動くとは、基板2を固定し、かつ導光部材5の側面に基板2の主面に平行な剪断応力を印加した際に、導光部材5と基板2が相対的に回転することであってよい。しかし、図12に示す通り物面(発光面)での強度分布と像面(受光面)における照度分布は、回転軸に対して点対称に分布している。したがって、導光部材5が基板2(つまり発光面)に対して変形し移動しても、発光面がつくる受光面における照度分布の移動ベクトルは、受光部の移動ベクトルと一致する。このため受光面が受け取る照度分布に変化は生じず、ガス検出感度の変動がさらに抑制される。ここで物面(発光面)とは発光素子3の発光部において気体と触れ合う面でかつ光学的な透過性を持つ材料でできている面である。また像面(受光面)とは受光素子4の受感部において気体と触れ合う面でかつ光学的な透過性を持つ材料でできている面である。 In addition, if the second joint member 7 does not exist and different forces act on the substrate 2 and the light-guiding member 5, the first joint member 6 is unlikely to deform in the axial direction, but may be twisted or bent. Therefore, for example, if the second joint member 7 does not restrain the light-guiding member 5 in the x-direction, the light-guiding member 5 may rotate with the first joint member 6 as the rotation axis relative to the substrate 2. That is, the first joint member 6 becomes the rotation axis when an external force is applied to the light-guiding member 5 in a direction parallel to the main surface 20 of the substrate 2. In other words, it can become the rotation axis when the light-guiding member 5 moves relative to the substrate 2. Here, movement may mean that the light-guiding member 5 and the substrate 2 rotate relatively when the substrate 2 is fixed and a shear stress parallel to the main surface of the substrate 2 is applied to the side of the light-guiding member 5. However, as shown in FIG. 12, the intensity distribution on the object plane (light-emitting surface) and the illuminance distribution on the image plane (light-receiving surface) are distributed point-symmetrically with respect to the rotation axis. Therefore, even if the light-guiding member 5 deforms and moves relative to the substrate 2 (i.e., the light-emitting surface), the movement vector of the illuminance distribution on the light-receiving surface created by the light-emitting surface coincides with the movement vector of the light-receiving section. This causes no change in the illuminance distribution received by the light-receiving surface, further suppressing fluctuations in gas detection sensitivity. Here, the object surface (light-emitting surface) is the surface in the light-emitting section of the light-emitting element 3 that comes into contact with the gas and is made of an optically transparent material. The image surface (light-receiving surface) is the surface in the sensing section of the light-receiving element 4 that comes into contact with the gas and is made of an optically transparent material.

ここで、図4は第1の接合部材6の配置の別の例を示す図である。図4の各要素は、図3における同じ符号の要素と同じであるため、説明を省略する。図4に示すように、第1の接合部材6は基板2の主面20上の異なる位置に設けられてよい。つまり、第1の接合部材6は、基板2の主面20へ垂直投影像6iが、垂直二等分線23上にないように配置されてよい。また、第1の接合部材6は、y軸方向について、第1のミラー511及び第5のミラー513より、第2のミラー521及び第4のミラー522に近い位置に配置されてよい。ただし、上記のように、光路を保つために、発光素子3及び受光素子4が第1の反射部51との間で直接的に光を受発光することが必要である。そのため、第1の接合部材6は、導光部材5が基板2に対して動く場合に、第1の反射部51の移動量が第2の反射部52の移動量よりも小さくなる位置に設けられることが好ましい。つまり、回転軸となる第1の接合部材6は、第2の反射部52よりも第1の反射部51に近い位置に設けられることが好ましい。具体的には、第1の接合部材6の垂直投影像6iが中点24に近いことが好ましい。 Here, FIG. 4 is a diagram showing another example of the arrangement of the first bonding member 6. Each element in FIG. 4 is the same as the element with the same reference numeral in FIG. 3, so the description is omitted. As shown in FIG. 4, the first bonding member 6 may be provided at a different position on the main surface 20 of the substrate 2. That is, the first bonding member 6 may be arranged so that the vertical projection image 6i onto the main surface 20 of the substrate 2 is not on the perpendicular bisector 23. In addition, the first bonding member 6 may be arranged at a position closer to the second mirror 521 and the fourth mirror 522 than the first mirror 511 and the fifth mirror 513 in the y-axis direction. However, as described above, in order to maintain the optical path, it is necessary for the light-emitting element 3 and the light-receiving element 4 to directly receive and emit light between the first reflecting portion 51. Therefore, it is preferable that the first bonding member 6 is provided at a position where the movement amount of the first reflecting portion 51 is smaller than the movement amount of the second reflecting portion 52 when the light-guiding member 5 moves relative to the substrate 2. In other words, the first joint member 6 that serves as the axis of rotation is preferably provided at a position closer to the first reflecting portion 51 than to the second reflecting portion 52. Specifically, it is preferable that the vertical projection image 6i of the first joint member 6 is closer to the midpoint 24.

ここで、図4の場合においても第2の接合部材7は、導光部材5に外力を加えた際又は熱膨張による歪みが生じた際に、基板2の主面20と平行な方向以外の導光部材5の動きを抑制する。換言すると第2の接合部材7は基板2の主面20に垂直な方向の動きを抑制する。 Here, even in the case of FIG. 4, the second bonding member 7 suppresses movement of the light-guiding member 5 in directions other than those parallel to the main surface 20 of the substrate 2 when an external force is applied to the light-guiding member 5 or when distortion occurs due to thermal expansion. In other words, the second bonding member 7 suppresses movement in a direction perpendicular to the main surface 20 of the substrate 2.

一例としては、第1の接合部材から最も遠い導光部材5の表面の点を始点として、導光部に対して基板2の主面20と平行方向かつ始点と第1の接合部をつなぐ直線の垂直方向に外力を加えた際に、第1の接合部材が回転軸となる場合では、第2の接合部材は基板2の主面20に垂直な方向の動きと、第1の接合部材と第2の接合部材の基板2の主面20への垂直投影像のそれぞれの中心をつないだ方向の動きを抑制する。 As an example, when an external force is applied to the light guide section in a direction parallel to the main surface 20 of the substrate 2 and perpendicular to the line connecting the starting point and the first joint, starting from a point on the surface of the light guide member 5 farthest from the first joint member, and the first joint member serves as the axis of rotation, the second joint member suppresses movement in a direction perpendicular to the main surface 20 of the substrate 2 and movement in a direction connecting the centers of the vertical projection images of the first and second joint members onto the main surface 20 of the substrate 2.

別の例としては、熱膨張による歪みが生じた際、第2の接合部材は基板2の主面20に垂直な方向の動きと、第1の接合部材と第2の接合部材の基板2の主面20への垂直投影像のそれぞれの中心をつないだ方向以外の動きを抑制する。 As another example, when distortion occurs due to thermal expansion, the second bonding member suppresses movement in a direction perpendicular to the main surface 20 of the substrate 2 and movement in a direction other than the direction connecting the centers of the perpendicular projection images of the first bonding member and the second bonding member onto the main surface 20 of the substrate 2.

図5は、第2の接合部材7の断面拡大図である。本実施形態において、挿入部7a及び留め具7bを備える第2の接合部材7は、ホール25に対してxy平面に平行な方向に隙間を有する。図5に示すように、挿入部7aのうちホール25に挿入された部分の側面7asは、少なくとも一部が基板2のホール25の側面2sと接しない。図5の例において、仮に第2の接合部材7がy軸正方向に最大に移動して挿入部7aの側面7asとホール25の側面2sとが接触しても、y軸負方向側では隙間が生じる。これに対し、第1の底面部61、すなわち第1の接合部材6のうち基板2と接合される部分は、基板2との間に空間を有しない。xy平面方向について隙間を有する第2の接合部材7は、第1の接合部材6より低い接合度を有する。ここで、接合度は、接合させる対象の動きにくさを意味する。本実施形態において、接合度が高いとは、導光部材5が基板2に対して強く接合されている、又は、隙間なく密接に接合されているため基板2に対して移動しにくい状態を示す。接合度が低いとは、導光部材5が基板2に対して弱く接合されている、又は、隙間があるように接合されている、若しくは側面7asと側面2sが一部接してはいるが摩擦が少なく基板2に対して移動しやすい状態を示す。 Figure 5 is an enlarged cross-sectional view of the second joining member 7. In this embodiment, the second joining member 7, which includes the insertion portion 7a and the fastener 7b, has a gap in the direction parallel to the xy plane with respect to the hole 25. As shown in Figure 5, at least a part of the side surface 7as of the portion of the insertion portion 7a inserted into the hole 25 does not contact the side surface 2s of the hole 25 of the substrate 2. In the example of Figure 5, even if the second joining member 7 moves to the maximum in the positive y-axis direction and the side surface 7as of the insertion portion 7a contacts the side surface 2s of the hole 25, a gap is generated on the negative y-axis side. In contrast, the first bottom surface portion 61, i.e., the portion of the first joining member 6 that is joined to the substrate 2, does not have a space between it and the substrate 2. The second joining member 7, which has a gap in the xy plane direction, has a lower degree of joining than the first joining member 6. Here, the degree of joining means the difficulty of moving the object to be joined. In this embodiment, a high degree of bonding indicates that the light guide member 5 is strongly bonded to the substrate 2, or is bonded closely with no gaps, making it difficult to move relative to the substrate 2. A low degree of bonding indicates that the light guide member 5 is weakly bonded to the substrate 2, or is bonded with a gap, or the side 7as and side 2s are partially in contact but have little friction and are therefore easy to move relative to the substrate 2.

上記のように、導光部材5は、基板2に対して第1の接合部材6を回転軸として回転移動することがあり得る。第2の接合部材7は、z軸を回転軸とした自由な回転移動を抑制するが、ホール25との間に隙間を有することによって、微小な回転移動を許容する。ここで、許容される微小な回転移動は、隙間の大きさで定めることが可能である。上記のように、第1の反射部51が発光素子3から発せられた光及び受光素子4が受け取る光を直接的に反射することが可能である限り、光路は回転移動の前と同じく保たれる。よって、第2の接合部材7とホール25との間の隙間は、導光部材5が基板2に対して最大に移動しても導光部材5に対する光路が保たれるように設定される。また第2の接合部材7と第1の接合部材6は、それぞれの接合部材の取り付け公差が同じ場合、両接合部材間の距離が離れているほうが、光学部材の角度ずれが少なく、量産収率の観点から良い。特に第1の接合部材と第2の接合部材の基板2の主面20への垂直投影像のそれぞれの中心間の距離が、基板2における最大距離の半分よりも長いほうが好ましい。ここで異種樹脂材料間の熱膨張係数差が100ppm程度であり、電子機器一般の使用環境の最大温度差が150℃程度であるため、熱膨張による歪みの量はそれぞれの積から導光部材5の最大長の1.5%と見積もられる。したがって、隙間は導光部材5の最大長の1.5%以上と設計すればよい。 As described above, the light guide member 5 may rotate relative to the substrate 2 with the first joint member 6 as the axis of rotation. The second joint member 7 suppresses free rotation with the z-axis as the axis of rotation, but allows slight rotation by having a gap between the second joint member 7 and the hole 25. Here, the permitted slight rotation can be determined by the size of the gap. As described above, as long as the first reflecting portion 51 can directly reflect the light emitted from the light emitting element 3 and the light received by the light receiving element 4, the optical path is maintained the same as before the rotation. Therefore, the gap between the second joint member 7 and the hole 25 is set so that the optical path for the light guide member 5 is maintained even if the light guide member 5 moves to the maximum relative to the substrate 2. In addition, when the mounting tolerances of the second joint member 7 and the first joint member 6 are the same, the greater the distance between the two joint members, the less the angular deviation of the optical member, which is good from the viewpoint of mass production yield. In particular, it is preferable that the distance between the centers of the vertical projection images of the first and second bonding members onto the main surface 20 of the substrate 2 is longer than half the maximum distance on the substrate 2. Here, since the difference in thermal expansion coefficient between different resin materials is about 100 ppm, and the maximum temperature difference in the general use environment of electronic devices is about 150°C, the amount of distortion due to thermal expansion is estimated to be 1.5% of the maximum length of the light-guiding member 5 from the product of these. Therefore, the gap should be designed to be 1.5% or more of the maximum length of the light-guiding member 5.

また、図5に示すように、基板2のホール25は、留め具7bであるネジの頭部が接触する段差が設けられている。留め具7bが導光部材5と接続された挿入部7aとねじ留めされることによって、z軸方向において、基板2と導光部材5とは強く接合される。そのため、導光部材5の基板2に対するz軸方向への移動はさらに制限され、z方向の並進自由度が失われる。また二つの拘束点をつなぐ軸に対する回転自由度に関して、第1の接合部材6と基板は面接触しているため、回転が抑制され回転の自由度が失われている。換言すると、導光部材5は、第1の接合部材6と第2の接合部材7と基板2との接点を結んだ軸を中心とする回転自由度を持たない。 As shown in FIG. 5, the hole 25 of the substrate 2 has a step that contacts the head of the screw, which is the fastener 7b. The fastener 7b is screwed into the insertion portion 7a connected to the light-guiding member 5, so that the substrate 2 and the light-guiding member 5 are strongly joined in the z-axis direction. Therefore, the movement of the light-guiding member 5 in the z-axis direction relative to the substrate 2 is further restricted, and the translational degree of freedom in the z direction is lost. In addition, with regard to the degree of freedom of rotation about the axis connecting the two constraint points, the first joint member 6 and the substrate are in surface contact, so that the rotation is suppressed and the degree of freedom of rotation is lost. In other words, the light-guiding member 5 does not have the degree of freedom of rotation about the axis connecting the contact points between the first joint member 6, the second joint member 7, and the substrate 2.

また、第1の接合部材6は基板2に対して導光部材5のx軸、y軸、z軸の各々に対しての並進方向の自由度を拘束する。一方で第2の接合部材7は、上述の通り、基板2の主面20と垂直な方向の導光部材5の動きを抑制する。第2の接合部材7は、好ましくはホール25との間に隙間を有することによって、隙間が存在する方向に対しては自由度を拘束しない。図13に示すように、一般に過拘束とは対象物に対して、二つ以上の拘束点で、さらに同じ自由度に対して拘束がなされている場合に発生する。熱膨張などで対象物が変形した場合に、拘束点をつなぐ線分に沿って歪みが生じうる。過拘束である場合、その歪みは拘束点によって自由に伸長できないため、拘束点をつなぐ方向と別の方向にその歪みが逸れることで、全体の相似縮小(膨張)以外の変形をもたらす。 The first joining member 6 also restricts the degree of freedom of the light guide member 5 in the translation direction with respect to each of the x-axis, y-axis, and z-axis with respect to the substrate 2. On the other hand, the second joining member 7, as described above, suppresses the movement of the light guide member 5 in the direction perpendicular to the main surface 20 of the substrate 2. The second joining member 7 preferably has a gap between it and the hole 25, so that the degree of freedom in the direction in which the gap exists is not restricted. As shown in FIG. 13, over-constraint generally occurs when an object is constrained at two or more constraint points and with respect to the same degree of freedom. When an object is deformed due to thermal expansion or the like, distortion can occur along the line segment connecting the constraint points. In the case of over-constraint, the distortion cannot be freely extended by the constraint points, so the distortion deviates in a direction different from the direction connecting the constraint points, resulting in deformation other than the overall homothetic contraction (expansion).

よって、図11に示すように、ホール25は長穴であることによって、過拘束状態でなくなる。そのため、その長穴の伸長する方向には、第2の接合部材7は自由に動くことができ、熱膨張による歪みが低減される。特に第1の接合部材と第2の接合部材の基板2の主面20への垂直投影像のそれぞれの中心をつないだ方向に対して伸長していると、ガス検出装置1は、膨張による光学性能の劣化を抑制することが可能である。なぜならば拘束点間で歪みが生じうるが、その拘束点間をつなぐ方向に拘束がないときは、自由に動くことでその歪みをすべて解消でき、温度変化による相似縮小(膨張)以外の変形をもたらさないからである。 Therefore, as shown in FIG. 11, the hole 25 is an elongated hole, and is therefore not overly constrained. Therefore, the second bonding member 7 can move freely in the direction of the elongated hole, and distortion due to thermal expansion is reduced. In particular, when the hole 25 is elongated in the direction connecting the centers of the vertical projection images of the first bonding member and the second bonding member onto the main surface 20 of the substrate 2, the gas detection device 1 can suppress deterioration of optical performance due to expansion. This is because, although distortion may occur between the constrained points, when there is no constraint in the direction connecting the constrained points, the distortion can be completely eliminated by moving freely, and no deformation other than homothetic contraction (expansion) due to temperature change is caused.

以上のように、本実施形態に係るガス検出装置1は、上記の構成によって、例えば基板2に熱膨張による歪みが生じても、導光部材5がその変形の影響を受けない。また、上記のように、導光部材5が基板2に対して最大に移動しても、第2の接合部材7によって光路は適切に保たれる。したがって、ガス検出装置1は、相似縮小(膨張)以外の変形による光学性能の劣化を抑制することが可能である。 As described above, in the gas detection device 1 according to this embodiment, due to the above configuration, even if distortion occurs in the substrate 2 due to thermal expansion, the light-guiding member 5 is not affected by the deformation. Furthermore, even if the light-guiding member 5 moves to its maximum relative to the substrate 2 as described above, the second bonding member 7 properly maintains the optical path. Therefore, the gas detection device 1 is capable of suppressing deterioration of optical performance due to deformation other than homothetic contraction (expansion).

また、ガス検出装置1は、基板2の主面20へ垂直投影像6iが、第1の領域21の中心と第2の領域22の中心とを結ぶ線分の垂直二等分線上にあるように配置されることによって、像面(受光面)上の照度分布が変化を受けず、ガス検出感度の変動が抑制される。図12に示す通り物面(発光面)での強度分布と像面(受光面)における照度分布は、回転軸に対して点対称に分布しており、熱膨張によって基板2が変形した場合、上記の垂直二等分線に対し左右対称に変形が起こる。発光面がつくる受光面における照度分布の移動は、受光面の移動と、方向及び量が一致するからである。 In addition, the gas detection device 1 is arranged so that the vertical projection image 6i onto the main surface 20 of the substrate 2 is on the perpendicular bisector of the line segment connecting the center of the first region 21 and the center of the second region 22, so that the illuminance distribution on the image plane (light-receiving surface) does not change and fluctuations in gas detection sensitivity are suppressed. As shown in FIG. 12, the intensity distribution on the object plane (light-emitting surface) and the illuminance distribution on the image plane (light-receiving surface) are distributed point-symmetrically with respect to the rotation axis, and when the substrate 2 is deformed due to thermal expansion, deformation occurs symmetrically with respect to the perpendicular bisector. This is because the movement of the illuminance distribution on the light-receiving surface created by the light-emitting surface matches the movement of the light-receiving surface in both direction and amount.

また、図15に示すとおり、第1の接合部材6及び第2の接合部材7の基板の主面への垂直投影像が領域Rtに配置されていれば、熱膨張によって基板2が変形した場合、同じ理由から像面(受光面)上の照度分布が変化を受けづらく、ガス検出感度の変動が抑制される。ここで、直線Lpは、第1の領域21の中心と第2の領域22の中心とを結ぶ線分の垂直二等分線23である。直線Leは、直線Lpと平行な第1の領域21を通る直線である。直線Ldは、直線Lpと平行な第2の領域22を通る直線である。領域Rtは、直線Leと直線Ldに挟まれた基板の主面内の最大の領域である。 Also, as shown in FIG. 15, if the vertical projection images of the first and second bonding members 6 and 7 onto the main surface of the substrate are located in region Rt, when the substrate 2 is deformed due to thermal expansion, the illuminance distribution on the image surface (light receiving surface) is less likely to change for the same reason, and fluctuations in gas detection sensitivity are suppressed. Here, line Lp is the perpendicular bisector 23 of the line segment connecting the center of the first region 21 and the center of the second region 22. Line Le is a line passing through the first region 21 parallel to line Lp. Line Ld is a line passing through the second region 22 parallel to line Lp. Region Rt is the largest region within the main surface of the substrate sandwiched between lines Le and Ld.

(第2実施形態)
図6は、本開示の別の実施形態に係るガス検出装置1の断面の一例を示す図である。本実施形態に係るガス検出装置1は、上記の第1実施形態に係るガス検出装置1と比べて、第1の接合部材6の構成が異なる。その他の構成要素は、第1実施形態に係るガス検出装置1と同じである。例えば、本実施形態に係るガス検出装置1の斜視図は、第1実施形態と同じく図1で示される。また、第1実施形態に係るガス検出装置1と同じ構成要素については、図1~図4と同じ符号を付しており、詳細な説明を省略する。
Second Embodiment
6 is a diagram showing an example of a cross section of a gas detection device 1 according to another embodiment of the present disclosure. The gas detection device 1 according to this embodiment differs from the gas detection device 1 according to the above-described first embodiment in the configuration of the first bonding member 6. The other components are the same as those of the gas detection device 1 according to the first embodiment. For example, a perspective view of the gas detection device 1 according to this embodiment is shown in FIG. 1, as in the first embodiment. Moreover, the same components as those of the gas detection device 1 according to the first embodiment are denoted by the same reference numerals as in FIGS. 1 to 4, and detailed description thereof will be omitted.

図6に示すように、本実施形態において第1の接合部材6は柱体でない。第1の接合部材6は、第1の底面部61を含む第1の部分6aと、第2の底面部62を含む第2の部分6bと、第1の部分6a、第2の部分6b及び第3のミラー512を結合する結合部63と、を備える。第3のミラー512が第1の接合部材6と結合されることによって、第1の反射部51の第2の反射部52に対する相対位置はさらに強固に固定される。 As shown in FIG. 6, in this embodiment, the first joining member 6 is not a column. The first joining member 6 includes a first portion 6a including a first bottom surface portion 61, a second portion 6b including a second bottom surface portion 62, and a joining portion 63 that joins the first portion 6a, the second portion 6b, and the third mirror 512. By joining the third mirror 512 to the first joining member 6, the relative position of the first reflecting portion 51 to the second reflecting portion 52 is more firmly fixed.

図7は、本実施形態における、第1の接合部材6の配置及び形状の一例を示す図である。図7では、z軸の負方向に向かって見た基板2の主面20が示されている。本実施形態において、基板2の主面20への垂直投影像6iは弓形である。第1の接合部材6は、基板2の主面20へ垂直投影像6iが、第1の領域21の中心21cと第2の領域22の中心22cとを結ぶ線分の中点24を含むように配置される。上記のように、第1の接合部材6の垂直投影像6iが中点24に近くすることで、第1の反射部51の移動量を第2の反射部52の移動量よりも小さくできるので、光路パラメーターのからのずれを小さく保つことに寄与する。 Figure 7 is a diagram showing an example of the arrangement and shape of the first bonding member 6 in this embodiment. In Figure 7, the main surface 20 of the substrate 2 viewed in the negative direction of the z axis is shown. In this embodiment, the vertical projection image 6i onto the main surface 20 of the substrate 2 is arch-shaped. The first bonding member 6 is arranged so that the vertical projection image 6i onto the main surface 20 of the substrate 2 includes the midpoint 24 of the line segment connecting the center 21c of the first region 21 and the center 22c of the second region 22. As described above, by bringing the vertical projection image 6i of the first bonding member 6 closer to the midpoint 24, the amount of movement of the first reflecting portion 51 can be made smaller than the amount of movement of the second reflecting portion 52, which contributes to keeping the deviation from the optical path parameters small.

以上のように、本実施形態に係るガス検出装置1は、上記の構成によって、第1実施形態と同じ効果を奏する。また、本実施形態に係るガス検出装置1は、第3のミラー512も結合する結合部63を有する第1の接合部材6を備えることによって、第1の反射部51の第2の反射部52に対する相対位置をさらに強固に固定することができる。 As described above, the gas detection device 1 according to this embodiment has the same effect as the first embodiment due to the above-mentioned configuration. Furthermore, the gas detection device 1 according to this embodiment includes a first joining member 6 having a joining portion 63 to which the third mirror 512 is also joined, so that the relative position of the first reflecting portion 51 to the second reflecting portion 52 can be fixed even more firmly.

(変形例)
以上、実施形態を諸図面及び実施例に基づき説明したが、当業者であれば本開示に基づき種々の変形及び修正を行うことが容易であることに注意されたい。したがって、これらの変形及び修正は本開示の範囲に含まれることに留意すべきである。例えば、各部材、各手段などに含まれる機能などは論理的に矛盾しないように再配置可能であり、複数の手段などを1つに組み合わせたり、或いは分割したりすることが可能である。
(Modification)
Although the embodiment has been described above based on the drawings and examples, it should be noted that a person skilled in the art can easily make various modifications and corrections based on the present disclosure. Therefore, it should be noted that these modifications and corrections are included in the scope of the present disclosure. For example, the functions included in each member, each means, etc. can be rearranged so as not to be logically inconsistent, and multiple means, etc. can be combined into one or divided.

例えば、第1の接合部材6は、垂直投影像6iが多角形の形状であってよい。一つの変形例として、図8に示すように、垂直投影像6iが四角形であって、第1の接合部材6は四角柱であってよい。 For example, the vertical projection image 6i of the first joining member 6 may be a polygonal shape. As a variation, as shown in FIG. 8, the vertical projection image 6i may be a square, and the first joining member 6 may be a square prism.

例えば、上記の実施形態において、第1の接合部材6は1つの部品で構成されると説明した。第1の接合部材6は複数の部品で構成されてよい。ここで、複数の部品は、互いに離れているが、導光部材5に対して基板2の主面20と平行な方向に外力を加えた際に全体として回転軸となるように、ある程度近接して配置されている。一つの変形例として、図9に示すように、垂直投影像6iが複数の中実円形であってよい。このとき、第1の接合部材6は、基板2と導光部材5とをより強固に接合することが可能である。 For example, in the above embodiment, the first joining member 6 is described as being composed of one part. The first joining member 6 may be composed of multiple parts. Here, the multiple parts are spaced apart from each other, but are arranged to a certain degree in close proximity so that they collectively form a rotation axis when an external force is applied to the light-guiding member 5 in a direction parallel to the main surface 20 of the substrate 2. As one modified example, as shown in FIG. 9, the vertical projection image 6i may be multiple solid circles. In this case, the first joining member 6 can more firmly join the substrate 2 and the light-guiding member 5.

例えば、上記の実施形態において、一体形成又は接着剤等によって、第1の反射部51は、第2の反射部52に対する相対位置が固定されると説明した。一つの変形例として、図10に示すように、第2の反射部52は、第1の反射部51と共に、第1の接合部材6の第2の底面部62と接着剤、ネジ、ツメ、はめ合い、グロメット、溶着等によって強力に接合されてよい。このとき、第2の反射部52は、第2のミラー521及び第4のミラー522と一体形成され、第1の反射部51まで延びる延長部523を備えてよい。 For example, in the above embodiment, it has been described that the relative position of the first reflecting portion 51 with respect to the second reflecting portion 52 is fixed by integral formation or adhesive or the like. As one modified example, as shown in FIG. 10, the second reflecting portion 52 may be strongly joined together with the first reflecting portion 51 to the second bottom surface portion 62 of the first joining member 6 by adhesive, screws, tabs, fitting, grommets, welding or the like. In this case, the second reflecting portion 52 may be formed integrally with the second mirror 521 and the fourth mirror 522, and may include an extension portion 523 that extends to the first reflecting portion 51.

例えば、上記の実施形態において、第1の接合部材6は、z軸方向に長辺を有する形状であるが、z軸以外の方向に長辺を有する形状であってよい。例えば図14に示すように、第1の接合部材6は、x軸方向に長辺を有する柱体であってよい。第1の接合部材6は、基板2の主面20のx軸と平行な一辺と、その一辺と対向する第1の反射部51の底面部分のそれぞれと、接着剤等で接続されてよい。このとき、導光部材5は、基板2に対して第1の接合部材6を回転軸としてz軸正方向に移動し得る。しかし、留め具7bによって、z軸方向において基板2と導光部材5とが強く接合されれば、導光部材5の移動を抑制することができる。 For example, in the above embodiment, the first joint member 6 has a shape with a long side in the z-axis direction, but may have a shape with a long side in a direction other than the z-axis. For example, as shown in FIG. 14, the first joint member 6 may be a column with a long side in the x-axis direction. The first joint member 6 may be connected to one side of the main surface 20 of the substrate 2 parallel to the x-axis and to the bottom surface portion of the first reflecting portion 51 facing the one side, with an adhesive or the like. At this time, the light-guiding member 5 may move in the positive direction of the z-axis with respect to the substrate 2, with the first joint member 6 as the rotation axis. However, if the substrate 2 and the light-guiding member 5 are strongly joined in the z-axis direction by the fastener 7b, the movement of the light-guiding member 5 can be suppressed.

例えば、上記の実施形態において、第1の反射部51が高い接合度を有する第1の接合部材6によって基板2と接合されて、第2の反射部52が低い接合度を有する第2の接合部材7によって基板2と接合される。ここで、第1の接合部材6及び第2の接合部材7と、第1の反射部51及び第2の反射部52との組み合わせは、上記の実施形態の例に限定されない。例えば、第1の反射部51が第2の接合部材7によって基板2と接合されて、第2の反射部52が第1の接合部材6によって基板2と接合されてよい。また、例えば、第1の接合部材6及び第2の接合部材7は、第1の反射部51又は第2の反射部52うち所望の反射部と基板2とを接合してよい。 For example, in the above embodiment, the first reflecting portion 51 is joined to the substrate 2 by the first joining member 6 having a high degree of bonding, and the second reflecting portion 52 is joined to the substrate 2 by the second joining member 7 having a low degree of bonding. Here, the combination of the first joining member 6 and the second joining member 7 with the first reflecting portion 51 and the second reflecting portion 52 is not limited to the example of the above embodiment. For example, the first reflecting portion 51 may be joined to the substrate 2 by the second joining member 7, and the second reflecting portion 52 may be joined to the substrate 2 by the first joining member 6. Also, for example, the first joining member 6 and the second joining member 7 may join a desired reflecting portion of the first reflecting portion 51 or the second reflecting portion 52 to the substrate 2.

上述した実施形態を別の捉え方をすると、本実施形態のガス検出装置は、基板と、基板の主面20に設けられ、光を発する発光素子3と、基板の主面20に設けられ、光を受け取る受光素子4と、発光素子3が発した光を受光素子4に導く導光部材と、第1の接合部材と、第2の接合部材と、を備え、第1の接合部材は、基板と導光部材とを、基板の平面と平行な第1方向に第1拘束度、基板の平面と平行かつ1方向と垂直な第2方向に第2拘束度、及び基板の平面に垂直な第3方向に第3拘束度でそれぞれ並進方向に拘束し、第2の接合部材は、基板と導光部材とを、第1方向に第4拘束度、第2方向に第5拘束度、第3方向に第6拘束度でそれぞれ並進方向に拘束し、拘束度のうち少なくとも1つはゼロであり、第1拘束度と第4拘束度の何れか一方はゼロではなく、第2拘束度と第5拘束度の何れか一方はゼロではなく、第3拘束度と第6拘束度の何れか一方はゼロではないガス検出装置である。 Looking at the above-described embodiment from another perspective, the gas detection device of this embodiment includes a substrate, a light-emitting element 3 that is provided on the main surface 20 of the substrate and emits light, a light-receiving element 4 that is provided on the main surface 20 of the substrate and receives the light, a light-guiding member that guides the light emitted by the light-emitting element 3 to the light-receiving element 4, a first joining member, and a second joining member, and the first joining member connects the substrate and the light-guiding member to a first constrained degree in a first direction parallel to the plane of the substrate, a second constrained degree in a second direction parallel to the plane of the substrate and perpendicular to the first direction, and the first bonding member constrains the substrate and the light guide member in the translational direction by a fourth degree of constraint in the first direction, a fifth degree of constraint in the second direction, and a sixth degree of constraint in the third direction, and at least one of the degrees of constraint is zero, one of the first degree of constraint and the fourth degree of constraint is not zero, one of the second degree of constraint and the fifth degree of constraint is not zero, and one of the third degree of constraint and the sixth degree of constraint is not zero.

ここで、拘束度とは、対象物がある方向に対して並進に自由に動けるか否かを表す指標であり、拘束度がゼロとはその方向に対象物が自由に動けることを指す。具体的に拘束度を測定する方法として、対象物の一点を規定量X変位させ、そのときに対象物全体の平均変位量Yを測定する方法が挙げられる。このとき、拘束度は(X-Y)/Xの絶対値である。ただし、拘束度が0.01以下の場合はゼロとする。 The degree of constraint here is an index that indicates whether an object can move freely in translation in a certain direction, and a degree of constraint of zero means that the object can move freely in that direction. A specific method for measuring the degree of constraint is to displace a point on the object a specified amount X, and then measure the average displacement amount Y of the entire object. In this case, the degree of constraint is the absolute value of (X-Y)/X. However, if the degree of constraint is 0.01 or less, it is considered to be zero.

第1から第6拘束度のうち少なくとも1つがゼロであることにより、第1の接合部材と第2の接合部材の少なくともいずれか一方が、第1から第3方向の何れか一方に自由に動くことが可能になる。 At least one of the first to sixth degrees of constraint is zero, allowing at least one of the first and second joining members to move freely in one of the first to third directions.

また、第1拘束度と第4拘束度の何れか一方がゼロでなく、第2拘束度と第5拘束度の何れか一方がゼロでなく、かつ、第3拘束度と第6拘束度の何れか一方がゼロでないことにより、導光部材全体が基板から離脱することを防止する。 In addition, by having either the first or fourth degree of constraint not be zero, either the second or fifth degree of constraint not be zero, and either the third or sixth degree of constraint not be zero, the entire light-guiding member is prevented from coming off the substrate.

すなわち、導光部材と基板とが、全体としては固定され、かつ、導光部材に対する外力を加えた際又は熱膨張による歪みが生じた際に第1から第3方向の何れか一方に自由に動くことが可能であるため、装置の信頼性は保ちつつ、光路の歪みの発生を抑制することが可能となる。 In other words, the light-guiding member and the substrate are fixed as a whole, and can move freely in either the first to third directions when an external force is applied to the light-guiding member or when distortion occurs due to thermal expansion, making it possible to suppress distortion of the optical path while maintaining the reliability of the device.

各拘束度をゼロにする方法は特に制限されないが、上述した実施形態に示したとおり、接合部材の挿入部をホールに挿入する形態において留め具を外す方法(これにより第3、第6拘束度がゼロになりうる)、挿入部がホールの側面と接しない形態とする方法(これにより第1、第2、第4、第5拘束度がゼロになりうる)が挙げられる。 There are no particular limitations on the method for making each degree of constraint zero, but as shown in the above-mentioned embodiment, examples include a method of removing the fastener when inserting the insertion portion of the joining member into the hole (which can make the third and sixth degrees of constraint zero), and a method of making the insertion portion not in contact with the side of the hole (which can make the first, second, fourth, and fifth degrees of constraint zero).

基板の平面方向に対する外力及び応力に対する光路の歪みの発生を抑制するためには、第4拘束度及び/又は第5拘束度をゼロにすれば良い(この場合、第2の接合部材側が基板に平行な面方向に少なくとも一方に自由に動く)。あるいは、第1拘束度及び/又は第2拘束度をゼロにすれば良い(この場合、第1の接合部材側が基板に平行な面方向に少なくとも一方に自由に動く)。 To suppress distortion of the optical path due to external forces and stresses in the planar direction of the substrate, the fourth and/or fifth constraint degrees can be set to zero (in this case, the second bonding member side is free to move in at least one direction in the planar direction parallel to the substrate). Alternatively, the first and/or second constraint degrees can be set to zero (in this case, the first bonding member side is free to move in at least one direction in the planar direction parallel to the substrate).

基板の垂直方向に対する外力及び応力に対する光路の歪みの発生を抑制するためには、第6拘束度をゼロにすれば良い(この場合、第2の接合部材側が基板に垂直な方向に自由に動く)。あるいは、第3拘束度をゼロにすれば良い(この場合、第1の接合部材側が基板に垂直な方向に自由に動く)。 To suppress distortion of the optical path due to external forces and stresses in the direction perpendicular to the substrate, the sixth degree of constraint can be set to zero (in this case, the second bonding member side is free to move in the direction perpendicular to the substrate). Alternatively, the third degree of constraint can be set to zero (in this case, the first bonding member side is free to move in the direction perpendicular to the substrate).

信頼性及び組み立て容易性の観点から、第1~第3拘束度がゼロではないことが好ましい場合がある。 From the standpoint of reliability and ease of assembly, it may be preferable for the first to third constraint degrees to be non-zero.

1 ガス検出装置
2 基板
2s ホールの側面
3 発光素子
4 受光素子
5 導光部材
6 第1の接合部材
6a 第1の部分
6b 第2の部分
6i 垂直投影像
7 第2の接合部材
7a 挿入部
7as 挿入部の側面
7b 留め具
20 主面
21 第1の領域
21c 第1の領域の中心
22 第2の領域
22c 第2の領域の中心
23 垂直二等分線
24 中点
25 ホール
51 第1の反射部
52 第2の反射部
53 通気口
54 セル
61 第1の底面部
62 第2の底面部
63 結合部
511 第1のミラー
512 第3のミラー
513 第5のミラー
521 第2のミラー
522 第4のミラー
523 延長部
LIST OF SYMBOLS 1 Gas detection device 2 Substrate 2s Side of hole 3 Light emitting element 4 Light receiving element 5 Light guide member 6 First joint member 6a First portion 6b Second portion 6i Vertical projection image 7 Second joint member 7a Insertion portion 7as Side of insertion portion 7b Fastener 20 Main surface 21 First region 21c Center of first region 22 Second region 22c Center of second region 23 Perpendicular bisector 24 Midpoint 25 Hole 51 First reflecting portion 52 Second reflecting portion 53 Vent 54 Cell 61 First bottom portion 62 Second bottom portion 63 Joint portion 511 First mirror 512 Third mirror 513 Fifth mirror 521 Second mirror 522 Fourth mirror 523 Extension portion

Claims (19)

基板と、
前記基板の主面に設けられ、光を発する発光素子と、
前記基板の主面に設けられ、前記光を受け取る受光素子と、
前記発光素子が発した前記光を前記受光素子に導く導光部材と、
第1の接合部材と、
第2の接合部材とを備え、
前記第1の接合部材は、前記基板と前記導光部材とを接合し、かつ、前記導光部材に対する外力を加えた際に前記基板の主面と平行及び/又は垂直な方向に動きを抑制し、
前記第2の接合部材は前記基板と前記導光部材とを接合し、前記導光部材に対する外力を加えた際又は熱膨張による歪みが生じた際に、前記基板の主面と平行な方向に前記導光部材の動きを抑制し、及び/又は、前記基板の主面に垂直な平面内に動きを抑制し、
第1の接合部材及び第2の接合部材の少なくとも一方は、前記基板の主面と平行な方向又は前記基板の主面に垂直な平面内に動きうるガス検出装置であって、
第1の接合部材及び第2の接合部材が、それぞれ基板の主面と平行及び垂直な方向の動きを抑制するものは除き、
前記受光素子の中心と前記発光素子の中心とを結ぶ線分の垂直二等分線を直線Lpとし、前記受光素子を通る直線で前記直線Lpと平行なものを直線Ldとし、前記発光素子を通る直線で前記直線Lpと平行なものを直線Leとし、前記直線Ldと前記直線Leに挟まれた前記基板の主面内の最大の領域を領域Rtとし、前記第1の接合部材の前記基板の主面への垂直投影像が前記領域Rtに存在する、ガス検出装置。
A substrate;
A light emitting element that is provided on a main surface of the substrate and emits light;
a light receiving element provided on a main surface of the substrate and receiving the light;
a light guiding member that guides the light emitted by the light emitting element to the light receiving element;
A first bonding member;
A second joining member,
the first bonding member bonds the substrate and the light guiding member and suppresses movement of the light guiding member in a direction parallel to and/or perpendicular to a main surface of the substrate when an external force is applied to the light guiding member;
the second bonding member bonds the substrate and the light guiding member, and when an external force is applied to the light guiding member or when distortion occurs due to thermal expansion, suppresses movement of the light guiding member in a direction parallel to a main surface of the substrate and/or suppresses movement within a plane perpendicular to the main surface of the substrate;
At least one of a first bonding member and a second bonding member is movable in a direction parallel to a main surface of the substrate or in a plane perpendicular to the main surface of the substrate ,
Except for the case where the first bonding member and the second bonding member suppress the movement of the substrate in the directions parallel and perpendicular to the main surface of the substrate, respectively,
a perpendicular bisector of a line segment connecting the center of the light receiving element and the center of the light emitting element is defined as a straight line Lp, a straight line passing through the light receiving element and parallel to the straight line Lp is defined as a straight line Ld, a straight line passing through the light emitting element and parallel to the straight line Lp is defined as a straight line Le, the largest area within the main surface of the substrate sandwiched between the straight line Ld and the straight line Le is defined as a region Rt, and a vertical projection image of the first bonding member onto the main surface of the substrate exists in the region Rt.
前記第1の接合部材は、前記基板を固定し、前記第1の接合部材から最も遠い前記導光部材の表面の点を始点として、前記導光部に対して前記基板の主面と平行方向かつ前記始点と第1の接合部をつなぐ直線の垂直方向に外力を加えた際に回転軸となる、請求項1に記載のガス検出装置。 The gas detection device according to claim 1, wherein the first joint member fixes the substrate and becomes a rotation axis when an external force is applied to the light guide section in a direction parallel to the main surface of the substrate and perpendicular to a line connecting the starting point and the first joint member, with the first joint member being the starting point and the point on the surface of the light guide member farthest from the first joint member as the starting point. 前記基板はホールを備え、
前記第2の接合部材は、前記導光部材と接続されて、少なくとも一部が前記ホールに挿入される挿入部を備える、請求項1又は2に記載のガス検出装置。
the substrate has a hole;
The gas detection device according to claim 1 , wherein the second joint member is connected to the light guide member and includes an insertion portion, at least a portion of which is inserted into the hole.
前記ホールは前記基板を貫通し、
前記第2の接合部材は、前記基板の主面と反対の面である底面の前記ホールから挿入されて、前記挿入部を留める留め具を備える、請求項3に記載のガス検出装置。
the hole penetrates the substrate;
4. The gas detection device according to claim 3, wherein the second bonding member includes a fastener that is inserted from the hole in a bottom surface that is the surface opposite to the main surface of the substrate and fastens the inserted portion.
前記留め具は前記挿入部をねじ留めする、請求項4に記載のガス検出装置。 The gas detection device according to claim 4, wherein the fastener screws the insert. 前記挿入部のうち前記ホールに挿入された部分の側面は、少なくとも一部が前記ホールの側面と接しない、請求項3から5のいずれか一項に記載のガス検出装置。 The gas detection device according to any one of claims 3 to 5, wherein at least a portion of the side of the portion of the insertion part inserted into the hole does not contact the side of the hole. 第1の接合部材のうち前記基板と接合される部分は、前記基板との間に空間を有しない、請求項6に記載のガス検出装置。 The gas detection device according to claim 6, wherein the portion of the first joining member that is joined to the substrate does not have a space between the portion and the substrate. 前記ホールは、長穴である、請求項3から請求項7のいずれか一項に記載のガス検出装置。 The gas detection device according to any one of claims 3 to 7, wherein the hole is an elongated hole. 前記長穴は、前記第1の接合部材と前記第2の接合部材の前記基板の主面への垂直投影像のそれぞれの中心をつないだ方向に対して伸長している穴である、請求項8に記載のガス検出装置。 The gas detection device according to claim 8, wherein the elongated hole is a hole extending in a direction connecting the centers of the vertical projection images of the first and second bonding members onto the main surface of the substrate. 前記第2の接合部材が、熱膨張による歪みが生じた際、前記第1の接合部材と前記第2の接合部材の前記基板の主面への垂直投影像のそれぞれの中心をつないだ方向以外の動きを抑制する請求項1から9のいずれか一項に記載のガス検出装置。 The gas detection device according to any one of claims 1 to 9, wherein the second bonding member suppresses movement in any direction other than a direction connecting the centers of the vertical projection images of the first bonding member and the second bonding member onto the main surface of the substrate when distortion occurs due to thermal expansion. 前記導光部材は、第1の反射部と第2の反射部とを備える、請求項1から10のいずれか一項に記載のガス検出装置。 The gas detection device according to any one of claims 1 to 10, wherein the light guide member comprises a first reflecting portion and a second reflecting portion. 前記第1の反射部は、第2の反射部に対する相対位置が固定される、請求項11に記載のガス検出装置。 The gas detection device according to claim 11, wherein the first reflecting portion is fixed in position relative to the second reflecting portion. 前記第1の反射部は、前記第1の接合部材によって前記基板と接合され、
前記第2の反射部は、前記第2の接合部材によって前記基板と接合される、請求項11又は12に記載のガス検出装置。
the first reflecting portion is bonded to the substrate by the first bonding member,
The gas detection device according to claim 11 , wherein the second reflecting portion is joined to the substrate by the second joining member.
前記第1の接合部材は複数の部品で構成される、請求項1から13のいずれか一項に記載のガス検出装置。 The gas detection device according to any one of claims 1 to 13, wherein the first joining member is composed of multiple parts. 前記第1の接合部材は1つの部品で構成される、請求項1から13のいずれか一項に記載のガス検出装置。 The gas detection device according to any one of claims 1 to 13, wherein the first joining member is composed of a single part. 前記第1の接合部材は、前記基板の主面への垂直投影像が、中実円形、中空円形、弓形又は多角形である、請求項15に記載のガス検出装置。 The gas detection device according to claim 15, wherein the first bonding member has a vertical projection image on the main surface of the substrate that is a solid circle, a hollow circle, an arch, or a polygon. 前記第1の接合部材は、前記第1の接合部材の前記基板の主面への垂直投影像が、前記直線Lp上にあるように配置される、請求項に記載のガス検出装置。 2 . The gas detection device according to claim 1 , wherein the first bonding member is disposed such that a vertical projection image of the first bonding member onto the main surface of the substrate is on the straight line Lp. 前記第1の接合部材と前記第2の接合部材の前記基板の主面への垂直投影像のそれぞれの中心間の距離が、前記基板における最大距離の半分よりも長い、請求項1から請求項17のいずれか一項に記載のガス検出装置。 18. The gas detection device according to claim 1 , wherein a distance between the centers of vertical projection images of the first bonding member and the second bonding member onto the main surface of the substrate is longer than half a maximum distance on the substrate. 前記第2の接合部材の接合度は、前記第1の接合部材の接合度よりも小さい請求項1から18のいずれか一項に記載のガス検出装置。 19. The gas detection device according to claim 1, wherein a bonding degree of the second bonding member is smaller than a bonding degree of the first bonding member.
JP2021036353A 2020-03-31 2021-03-08 Gas detection equipment Active JP7569712B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/208,004 US11662305B2 (en) 2020-03-31 2021-03-22 Gas detection apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020064487 2020-03-31
JP2020064487 2020-03-31

Publications (2)

Publication Number Publication Date
JP2021162577A JP2021162577A (en) 2021-10-11
JP7569712B2 true JP7569712B2 (en) 2024-10-18

Family

ID=78003173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021036353A Active JP7569712B2 (en) 2020-03-31 2021-03-08 Gas detection equipment

Country Status (1)

Country Link
JP (1) JP7569712B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023152792A (en) * 2022-03-30 2023-10-17 旭化成エレクトロニクス株式会社 Gas concentration measurement system, gas concentration calculation unit, and gas concentration measurement method
US12523603B2 (en) 2023-03-14 2026-01-13 Asahi Kasei Microdevices Corporation Optical concentration measuring apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013517467A (en) 2010-01-18 2013-05-16 ガス・センシング・ソリューションズ・リミテッド Gas sensor with radiation guide
JP2017020901A (en) 2015-07-10 2017-01-26 旭化成エレクトロニクス株式会社 Gas sensor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013517467A (en) 2010-01-18 2013-05-16 ガス・センシング・ソリューションズ・リミテッド Gas sensor with radiation guide
JP2017020901A (en) 2015-07-10 2017-01-26 旭化成エレクトロニクス株式会社 Gas sensor

Also Published As

Publication number Publication date
JP2021162577A (en) 2021-10-11

Similar Documents

Publication Publication Date Title
JP7569712B2 (en) Gas detection equipment
JP6530652B2 (en) Light emitting and receiving device
JP7602933B2 (en) Gas detection equipment
JP7602934B2 (en) Gas detection equipment
JPH10239235A (en) Infrared gas analyzer
US11662305B2 (en) Gas detection apparatus
US11644417B2 (en) Gas detection apparatus
CN114965339A (en) Integrated infrared gas sensor with special-shaped gas chamber and using method thereof
JP2025061268A (en) Gas detection equipment
US20080292238A1 (en) Temperature-Resistant Ir Measurement Probe
JP7490398B2 (en) Gas Sensors
CN106959271A (en) Long light path air chamber with stabilization package structure
US11474031B2 (en) Gas detection apparatus
US12510465B2 (en) Gas detection device
US12411079B2 (en) Gas detection apparatus
JP2006275632A (en) Spectroscopic gas sensor
US20250146935A1 (en) Optical density measuring apparatus
JP2024016805A (en) gas detection device
US12523603B2 (en) Optical concentration measuring apparatus
JP2025075687A (en) Gas detection equipment
CN115144356B (en) Gas detection device
JP2025076995A (en) Optical concentration measuring device
US20250216327A1 (en) Compact injection molded optical module for gas sensing
US20070272834A1 (en) Optical module
JP6599675B2 (en) Optical sensor

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231122

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20240627

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240702

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240830

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240910

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241007

R150 Certificate of patent or registration of utility model

Ref document number: 7569712

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150