JP7574685B2 - Feeding device - Google Patents

Description

The present invention relates to a supply device.

The following Patent Document 1 discloses a supply device that has multiple partitions on a flat substrate (i.e., a smooth surface) with a vibration generating unit, forming multiple alignment paths for aligning parts. This supply device has a gate in the middle of the alignment path to prevent parts aligned in the alignment path from being fed in an overlapping state.

JP 2012-082046 A

For example, when aligning spiral parts along multiple alignment paths, if a gate is provided in the middle of the multiple alignment paths, there is a concern that the spiral parts may get caught in the gate and block it.

The objective of this disclosure is to obtain a supply device that suppresses clogging of spiral parts at the gate portion compared to a case in which gas is not injected between the protrusions.

The supply device according to the first aspect has a moving section that moves spiral parts on a plate surface in one direction from one end of the plate surface to the other end, a number of protrusions that extend in the one direction and protrude from the plate surface and align the parts so that the longitudinal direction of the parts is along the one direction, a gate section that is provided across the protrusions and restricts the movement of the parts that are entangled between the protrusions in the one direction, and an injection section that is provided on the gate section and intermittently injects gas diagonally downward on the one end side between the protrusions.

The supply device according to the second aspect is the supply device according to the first aspect, in which a wall is formed on the plate surface rising from one end of the plate surface, and the ejection section ejects the gas at a flow rate such that the part blown away by the ejected gas hits the wall.

The supply device according to the third aspect is the supply device according to the second aspect, in which another plate is attached to the upper end of the wall so as to face the plate surface.

The supply device according to the fourth aspect is the supply device according to any one of the first to third aspects, in which the width of the protrusion in the direction intersecting the one direction is longer than the length of the part in the longitudinal direction.

The supply device according to the fifth aspect is the supply device according to any one of the first to fourth aspects, in which the moving unit is configured to move the part in one direction from one end of the plate surface to the other end by vibrating the plate surface.

The supply device according to the sixth aspect is the supply device according to any one of the first to fifth aspects, in which a first surface is provided on one end side of the plate surface, spanning the multiple protrusions and being equal to or lower than the height of the plate surface.

The supply device according to the seventh aspect is the supply device according to the sixth aspect, and has an inclined surface that is provided at an end in a direction intersecting the one direction with respect to the position where the multiple protrusions are arranged, adjacent to the first surface in the one direction, and that slopes upward from one end side of the plate surface toward the other end side of the plate surface, and a second surface that is provided on the other end side of the plate surface and adjacent to the inclined surface in the one direction.

The supply device according to the eighth aspect is the supply device according to the seventh aspect, in which the height of the first surface is equal to or greater than the height of the lowest portion of one end of the inclined surface.

The supply device according to the ninth aspect is the supply device according to the seventh or eighth aspect, in which the height of the second surface is equal to or greater than the height of the upper surface of the convex portion.

The supply device according to the tenth aspect is the supply device according to any one of the first to ninth aspects, in which the injection port of the injection unit is provided on one end side of the plate surface of the gate unit.

The supply device according to the eleventh aspect is a supply device according to any one of the first to tenth aspects, and is provided with a plurality of transport paths provided outside the other end of the plate surface, along which the parts that have moved in the one direction between the plurality of protrusions are transported, a single connecting path provided downstream in the transport direction of the parts on the plurality of transport paths, to which the plurality of transport paths are connected, and a sending unit provided between the other end of the plate surface and the plurality of transport paths, which sends out the parts to the transport path in order between the protrusions.

The supply device according to the 12th aspect is the supply device according to the 11th aspect, in which the multiple conveying paths and the connecting path are configured to convey the parts at a downward incline from the gate side.

The supply device according to the thirteenth aspect is the supply device according to the eleventh or twelfth aspect, in which the delivery section performs one cycle of sending the parts to the transport path in order between the multiple protrusions, and then the ejection section ejects the gas and resumes the delivery of the parts from the delivery section.

The supply device according to the 14th aspect is the supply device according to any one of the first to 13th aspects, in which the part is a compression coil spring.

The supply device according to the first aspect reduces clogging of the spiral parts at the gate compared to when gas is not injected between the protrusions.

The supply device according to the second aspect can untangle tangled parts when they hit a wall, compared to when one end of the plate surface is flat.

The supply device according to the third aspect prevents parts from bouncing off the wall and falling off the plate surface, compared to when the top of the wall is open.

The supply device according to the fourth aspect reduces entanglement of the parts compared to when the width of the protrusion is equal to or less than the longitudinal length of the parts.

The feeding device according to the fifth aspect reduces entanglement of parts compared to when parts are moved from one end to the other end by tilting the plate surface.

According to the supply device of the sixth aspect, the gas from the ejection section makes it easier for the components to be ejected from the plate surface between the protrusions toward the first surface, compared to when the height of the plate surface between the protrusions is lower than the height of the surface at one end of the plate surface.

According to the supply device of the seventh aspect, the parts can more easily move up from the first surface to the inclined surface and more easily move from the inclined surface to the second surface, compared to when the end portion in a direction intersecting the position where the multiple protrusions are arranged is at the same height as the protrusions.

According to the supply device of the eighth aspect, the parts can be easily moved from the first surface to the inclined surface, compared to when the height of the first surface is lower than the height of the lowest point on one end side of the inclined surface.

According to the supply device of the ninth aspect, the part that has been moved to the second surface is more likely to move to the upper surface of the convex portion compared to when the height of the second surface is lower than the height of the upper surface of the convex portion.

The supply device according to the tenth aspect reduces clogging of parts at the gate section compared to when the injection port of the injection section is provided on the other end side of the plate surface of the gate section.

The supply device according to the eleventh aspect makes it easier to align and supply multiple parts along the connecting path compared to a case in which parts are randomly sent along the conveying path between multiple protrusions.

The supply device according to the twelfth aspect makes it easier for parts to move along the multiple transport paths and connecting paths compared to when parts are transported by vibration of the multiple transport paths and connecting paths.

The supply device according to the thirteenth aspect makes it easier for parts to be aligned in the connecting path compared to when the ejection unit ejects gas regardless of the operation of the delivery unit.

According to the supply device of the 14th aspect, even when the part is a compression coil spring, clogging of the compression coil spring at the gate is suppressed compared to a case where gas is not injected between the protrusions.

FIG. 2 is a perspective view showing the supply device according to the first embodiment. FIG. 2 is a front view showing the supply device according to the first embodiment. FIG. 2 is a plan view showing the supply device according to the first embodiment. FIG. 2 is a perspective view showing a moving device used in the supply device according to the first embodiment. FIG. 4 is a plan view showing a moving device used in the supply device according to the first embodiment. 4 is a cross-sectional view showing the vicinity of a gate portion of a moving device used in the supply device according to the first embodiment. FIG. 4 is a perspective view showing the vicinity of a gate portion of a moving device used in the supply device according to the first embodiment. FIG. 4 is a cross-sectional view showing a moving portion of a moving device used in the supply device according to the first embodiment. FIG. FIG. 2 is a side view showing a conveying device used in the supply device according to the first embodiment. 1A is a cross-sectional view showing a state in which the output section of the conveying device used in the supply device of the first embodiment has moved downward, and FIG. 1B is a cross-sectional view showing a state in which the output section of the conveying device has moved upward.

The following describes the embodiment of the technology disclosed herein. In the following description, the direction indicated by the arrow X (arrow X direction) as appropriate in the drawings is the device width direction (horizontal direction), the direction indicated by the arrow Y (arrow Y direction) is the device height direction (vertical direction), and the direction indicated by the arrow Z (arrow Z direction) is the device depth direction (horizontal direction). Note that the "device width direction" is mainly used to mean "both the arrow X direction and the direction opposite to the arrow X direction (opposite to the arrow X direction)". Furthermore, the "device height direction" is mainly used to mean "both the arrow Y direction and the direction opposite to the arrow Y direction (opposite to the arrow Y direction)". Furthermore, the "device depth direction" is mainly used to mean "both the arrow Z direction and the direction opposite to the arrow Z direction (opposite to the arrow Z direction)". These device width direction, device height direction, and device depth direction are directions that intersect with each other (specifically, directions that are perpendicular to each other).

First Embodiment
<Overall configuration of the supply device>
Fig. 1 shows a perspective view of a supplying device 10 according to a first embodiment. Fig. 2 shows a front view of the supplying device 10, and Fig. 3 shows a plan view of the supplying device 10.

As shown in Figs. 1 to 3, the supply device 10 includes a moving device 12 that moves multiple springs S on a plate surface 22 in one direction, and a transport device 14 that aligns the springs S moved by the moving device 12 in a row by transporting them in order. The springs S aligned in a row by the transport device 14 are supplied to other manufacturing equipment (not shown). Here, the springs S are an example of a spiral part. The springs S are, for example, compression coil springs. In this embodiment, the moving device 12 transports the multiple springs S to the side of the transport device 14 that is arranged in the opposite direction to the direction of the arrow X. In Figs. 1 and 3, the number of multiple springs S is shown as fewer than the actual number in order to make the configuration of the supply device 10 easier to understand.

<Configuration of Mobile Device>
The moving device 12 is supported by a support part 102 installed on a base 100 (see Figs. 1 and 2). The moving device 12 includes a plate-shaped body 18 having a plate surface 22 on the upper part, and a moving part 20 that moves the spring S on the plate surface 22 in one direction (the device width direction) from one end 22A of the plate surface 22 to the other end 22B of the plate surface 22 (the opposite direction to the direction of the arrow X) (see Figs. 1 and 3). Here, the one end 22A is an example of one end of the plate surface 22, and the other end 22B is an example of the other end of the plate surface 22. The plate surface 22 is arranged horizontally.

The moving device 12 also includes a plurality of protrusions 24 that extend in the device width direction (one direction) and protrude from the plate surface 22 in the direction of the arrow Y, and a gate section 26 that is provided across the plurality of protrusions 24 (see Figures 1 and 3). The moving device 12 also includes an injection section 28 that is provided in the gate section 26 and that injects gas between the plurality of protrusions 24. Here, the gate section 26 is an example of a gate section. Air is used as an example of the gas, but nitrogen or the like may also be used.

The moving device 12 also includes a wall 30 rising from one end 22A of the plate surface 22, and an upper plate 34 provided at the upper end of the wall 30 (see Figures 1 and 3). The moving device 12 also includes a first surface 40 disposed on the one end 22A side of the plate surface 22, and an inclined surface 42 and a second surface 44 disposed at the end of the plate surface 22 in the device depth direction (direction intersecting with the one direction).

(Moving part)
As shown in Fig. 4, the moving unit 20 includes a plate-like body 18 that is substantially rectangular in plan view. Here, plan view refers to a case where the object is viewed from above in the vertical direction (the direction opposite to the direction of the arrow Y). The plate-like body 18 is supported by the support portion 102 in a state where it is arranged along the horizontal direction (see Figs. 1 and 2). The moving unit 20 includes an actuator 36 (see Fig. 2) that vibrates the plate-like body 18. The moving unit 20 is configured to vibrate the plate-like body 18 by the actuator 36, thereby moving the spring S on the plate surface 22 provided on the upper part of the plate-like body 18 in one direction from one end 22A to the other end 22B of the plate surface 22.

(Multiple protrusions)
As shown in FIG. 4, the multiple protrusions 24 are provided on the upper part of the plate-like body 18. The multiple protrusions 24 are block-shaped members extending in the device width direction (one direction) in a plan view, and are arranged at intervals in the device depth direction. As an example, five multiple protrusions 24 are provided at equal intervals in the device depth direction. As a result, the plate surface 22 between adjacent protrusions 24 is arranged along the device width direction (one direction), and four are provided in the device depth direction. The multiple protrusions 24 may be fixed to the plate-like body 18 using an adhesive, or may be formed integrally with the plate-like body 18.

The width of the protrusion 24 in the device depth direction (the direction intersecting the one direction) is longer than the length of the spring S in the longitudinal direction. In this embodiment, the width of the protrusion 24 in the device depth direction is longer than the length of the spring S in the longitudinal direction. In other words, the width of the protrusion 24 is set to a length that allows the spring S arranged in the device depth direction to fit on the protrusion 24.

For example, the width of the plate surface 22 between adjacent convex portions 24 (width in the device depth direction) is slightly larger than the diameter of the spring S. Also, the height of the upper surfaces of the multiple convex portions 24 from the plate surface 22 is slightly larger than the diameter of the spring S. As a result, in the moving unit 20, the springs S are aligned on the plate surface 22 between adjacent convex portions 24 so that their longitudinal direction is along the device width direction (one direction). That is, in the moving unit 20, the plate surface 22 between adjacent convex portions 24 functions as an alignment path that aligns the springs S along their longitudinal direction. These alignment paths are arranged in parallel.

(Page 1)
As shown in FIG. 4, the first surface 40 is provided on the upper part of the plate-like body 18. The first surface 40 is disposed on the one end 22A side of the plate surface 22, straddling the multiple protrusions 24. In other words, the first surface 40 is disposed on the one end 22A side of the plate surface 22 with respect to the end faces of the multiple protrusions 24 in the arrow X direction. The first surface 40 constitutes a part of the plate surface 22 and extends in the device depth direction. The first surface 40 is planar, and the height of the first surface 40 is equal to or less than the height of the plate surface 22 between the multiple protrusions 24. In this embodiment, the first surface 40 is disposed horizontally, and is set to be equal to the height of the plate surface 22 between the multiple protrusions 24.

(wall)
As shown in FIG. 4, the wall 30 rises from an edge of one end 22A of the plate surface 22. As an example, the wall 30 is a vertical wall arranged along the device height direction (up and down direction). In this embodiment, the first surface 40 constitutes a part of the plate surface 22, and the wall 30 rises from an edge of the first surface 40 in the direction of the arrow X. In addition, the moving device 12 is provided with a pair of vertical walls 32 on both sides of the plate surface 22 in the device depth direction. The pair of vertical walls 32 are connected to the wall 30 at one end in the device width direction. In other words, the wall 30 and the pair of vertical walls 32 are configured to surround the edge of the plate surface 22 other than the other end 22B side. In addition, the wall 30 and the pair of vertical walls 32 are separated from the multiple protrusions 24 in the device width direction and the device depth direction. The height of the wall 30 and the pair of vertical walls 32 from the plate surface 22 is higher than the length of the spring S in the longitudinal direction.

(Upper plate)
As shown in FIG. 4, the upper plate 34 is attached to the upper end of the wall 30 and faces the first surface 40 on the one end 22A side of the plate surface 22. Here, the upper plate 34 is an example of another plate. In this embodiment, the upper plate 34 is attached to the upper surface of the wall 30 and the upper surfaces of parts of the pair of vertical walls 32. A space is provided between the first surface 40 and the upper plate 34, and the height from the first surface 40 to the lower surface of the upper plate 34 is higher than the length of the spring S in the longitudinal direction. This makes it easier for the spring S to get between the first surface 40 and the upper plate 34 when the spring S is blown toward the one end 22A side of the plate surface 22 by the gas injected from the injection unit 28.

As an example, the upper plate 34 is a transparent plate. For example, the upper plate 34 is formed from acrylic resin. By making the upper plate 34 a transparent plate, the spring S on the first surface 40 that has entered under the upper plate 34 can be easily seen (visually confirmed).

(Inclined surface)
The inclined surface 42 is provided on the upper part of the plate-like body 18. As shown in Fig. 4 and Fig. 5, the inclined surface 42 is provided at an end in the device depth direction (direction intersecting one direction) with respect to the position where the multiple protrusions 24 are arranged, and is arranged at a position adjacent to the first surface 40 in the device width direction (one direction). In this embodiment, the inclined surfaces 42 are arranged as a pair on both sides in the device depth direction with respect to the position where the multiple protrusions 24 are arranged. The pair of inclined surfaces 42 are symmetrical in the device depth direction. The inclined surfaces 42 may be formed integrally with the plate-like body 18.

As shown in FIG. 8, the inclined surface 42 is inclined from one end 22A side of the plate surface 22 toward the other end 22B side of the plate surface 22 so as to have an upward gradient. In this embodiment, a flat surface portion 42A having a height lower than the height of the first surface 40 is provided between the inclined surface 42 and the first surface 40. Note that a configuration in which the flat surface portion 42A is not provided between the inclined surface 42 and the first surface 40 is also possible.

The height of the first surface 40 is equal to or greater than the height of the lowest portion of the inclined surface 42 on the one end 22A side. In this embodiment, the height of the first surface 40 is greater than the height of the lowest portion of the inclined surface 42 on the one end 22A side.

(Page 2)
The second surface 44 is provided on the upper part of the plate-like body 18 (see FIG. 4). As shown in FIG. 4 and FIG. 5, the second surface 44 is provided at the end in the device depth direction (direction intersecting one direction) with respect to the position where the multiple protrusions 24 are arranged, and is arranged on the other end 22B side of the plate surface 22 with respect to the inclined surface 42. The second surface 44 is arranged at a position adjacent to the inclined surface 42 in the device width direction (one direction). In this embodiment, the second surface 44 is arranged in a pair on both sides of the position where the multiple protrusions 24 are arranged in the device depth direction. The pair of second surfaces 44 are symmetrical in the device depth direction.

As shown in FIG. 8, the second surface 44 is planar, and the height of the second surface 44 is equal to or greater than the height of the upper surface of the protrusion 24. In this embodiment, the height of the second surface 44 is greater than the height of the upper surface of the protrusion 24. As an example, the second surface 44 is disposed horizontally.

(Gate section)
As shown in Fig. 4, Fig. 5 and Fig. 7, the gate section 26 is arranged along the device depth direction, and is arranged on the upper side of the plurality of protrusions 24 so as to cross the plurality of protrusions 24. As shown in Fig. 6, the gate section 26 is a rectangular block member arranged in a diagonal direction with respect to the plate surface 22. In other words, the gate section 26 is arranged (fixed) on the moving device 12 in a state in which the angle between the plate surface 22 and the lower surface of the block member is an acute angle. In addition, the corner (ridge line portion) located at the lowest end of the gate section 26 in this state is cut out, and a lower surface 26A is formed at a position facing the plate surface 22 by cutting out the corner of the block member. A plurality of spaces are formed between the lower surface 26A of the gate section 26 and the plate surface 22 between the plurality of protrusions 24. The lower surface 26A of the gate section 26 is arranged so as to be parallel to the plate surface 22. Specifically, the lower surface 26A of the gate portion 26 is disposed so that a portion of the lower surface 26A is in contact with the upper surfaces of the multiple protrusions 24.

The distance between the lower surface 26A of the gate portion 26 and the plate surface 22 is slightly larger than the diameter of the spring S, and each space formed between the lower surface 26A of the gate portion 26 and the plate surface 22 is configured to allow one spring S to pass through. The gate portion 26 restricts the movement of the multiple springs S entangled between the protrusions 24 in one direction (the device width direction), more precisely, in the direction of the arrow A along the device width direction. More specifically, as the multiple springs S entangle, the springs S protruding from between the protrusions 24 hit the wall portion 26B on the one end 22A side of the gate portion 26. This prevents the springs S protruding from between the protrusions 24 from passing through the gate portion 26, and the springs S in a normal position inserted on the plate surface 22 between the protrusions 24, i.e., one spring S moving on the plate surface 22 between the protrusions 24, pass through the gate portion 26. Here, a spring S in a normal position is a spring S whose longitudinal direction is aligned along the device width direction (one direction), inserted on the plate surface 22 between the protrusions 24, and not entangled with other springs S.

As shown in Figures 4 and 5, a pair of guide portions 50 that guide (induce) the spring S on the second surface 44 toward the gate portion 26 are provided on one end 22A side of the gate portion 26 on both sides in the device depth direction of the gate portion 26. The pair of guide portions 50 are provided on both sides of the width direction of the gate portion 26 that intersect in one direction. The pair of guide portions 50 are arranged across the second surface 44 and the protrusion 24 adjacent to the second surface 44.

The pair of guiding sections 50 have vertical wall sections 50A arranged diagonally from the vertical wall 32 toward the gate section 26. In a plan view, the distance between the pair of vertical wall sections 50A is arranged so that it gradually narrows from one end 22A side of the plate surface 22 toward the other end 22B side. The pair of vertical wall sections 50A are arranged symmetrically in the device depth direction. As a result, when the spring S on the second surface 44 hits the vertical wall section 50A of the guiding section 50, the spring S on the second surface 44 is guided (invited) toward the gate section 26 side. The spring S guided toward the gate section 26 side is easily inserted onto the plate surface 22 between the protrusions 24.

(Injection part)
5 and 6 , the ejection unit 28 is provided in the gate portion 26, and is disposed at a position corresponding to the plate surface 22 between adjacent convex portions 24. In this embodiment, since there are four plate surfaces 22 between adjacent convex portions 24, four ejection units 28 are provided. The ejection units 28 are configured to eject gas intermittently toward the plate surface 22 located diagonally downward on the side of one end portion 22A between the convex portions 24.

The injection section 28 is provided with a flow path 54 that is disposed obliquely to the gate section 26 and through which gas flows, an injection port 52 provided at the tip of the flow path 54, and a supply pipe 56 that supplies gas to the flow path 54. Although not shown, a blower (gas compressor) that supplies gas to the supply pipe 56 is provided upstream of the supply direction of the supply pipe 56. As an example, one blower is provided, and gas is supplied from the one blower to four supply pipes 56.

The flow path 54 is formed inside the gate portion 26 and is arranged so as to have a downward gradient from the other end 22B side of the plate surface 22 to the one end 22A side. The flow path 54 is configured so that the inner diameter of the injection port 52 is smaller than the inner diameter on the opposite side of the injection port 52. The injection port 52 is provided on the one end 22A side of the plate surface 22 in the gate portion 26. In this embodiment, the gate portion 26 is provided with a wall portion 26B that has an upward gradient from the one end 22A side of the lower surface 26A, and the injection port 52 is formed on the wall portion 26B. As a result, gas is injected from the injection port 52 diagonally downward on the one end 22A side between the convex portions 24. In other words, the injection port 52 injects gas in the opposite direction (arrow X direction) to the one-way movement direction of the spring S, and also injects gas toward the plate surface 22 between the convex portions 24.

In the injection section 28, gas is injected from the injection port 52 diagonally downward toward one end 22A between the protrusions 24, so that the multiple springs S entangled between the protrusions 24 are blown toward one end 22A (i.e., upstream in the direction of movement of the springs S).

The injection unit 28 is configured to inject gas at a flow rate that causes the spring S to hit the wall 30 when it is blown away by the gas injected from the injection port 52. In this embodiment, the flow rate of the gas injected from the four injection ports 52 is adjusted by the airflow rate of a blower (not shown), so that the spring S hits the wall 30. The flow rate of the gas injected from the injection port 52 is adjusted so that it is not a weak flow rate that causes the spring S to not reach the wall 30, but is not a strong flow rate that causes the spring S to jump over the wall 30. The flow rate of the gas injected from the injection port 52 is appropriately adjusted according to the distance from the gate unit 26 to the wall 30 and the weight of the spring S. In addition, the gas injected from the injection port 52 may blow away both one spring S and two or more entangled springs S.

<Configuration of the conveying device>
As shown in Figures 1 and 2, the conveying device 14 includes an inclined plate 60 arranged on the outer side of the other end 22B of the plate surface 22 so as to have a downward slope toward the opposite side of the plate surface 22. The inclined plate 60 is attached in an inclined state by a mounting fixture 104 installed on a base 100. As shown in Figures 1, 3, and 9, the conveying device 14 includes a plurality of conveying paths 62 provided on the outer side of the other end 22B of the plate surface 22, and one connecting path 64 arranged downstream in the conveying direction of the springs S in the plurality of conveying paths 62. Furthermore, the conveying device 14 includes a sending section 66 for the springs S provided between the other end 22B of the plate surface 22 and the plurality of conveying paths 62.

(Transport path)
1 and 9, the multiple transport paths 62 are grooves formed on the upper surface of the inclined plate 60, and the springs S can be inserted into the multiple transport paths 62. The multiple transport paths 62 are disposed at positions corresponding to the plate surface 22 between the multiple convex portions 24, and extend linearly along the device width direction in a plan view of the supply device 10. The multiple transport paths 62 are configured such that the springs S that have moved in the device width direction (one direction) on the plate surface 22 between the multiple convex portions 24 are transported to the transport paths 62 via the sending units 66. In this embodiment, since four plate surfaces 22 between the multiple convex portions 24 are provided, four transport paths 62 are also provided.

The width of the transport path 62 (width in the device depth direction) is slightly larger than the diameter of the spring S. In other words, the width of the transport path 62 is the same as the width of the plate surface 22 between adjacent convex portions 24 (width in the device depth direction). As a result, the spring S is inserted into the transport path 62 so that the longitudinal direction of the spring S is aligned with the longitudinal direction of the transport path 62. The multiple transport paths 62 are formed on the inclined plate 60, and are arranged so as to have a downward slope from the gate portion 26 side to the opposite side of the gate portion 26. The inclined plate 60 is fixed to the mounting fixture 104 in a non-vibrating state. Therefore, the multiple transport paths 62 transport the spring S by gravity due to the downward slope from the gate portion 26 side.

As an example, the longitudinal lengths of the multiple transport paths 62 are different. In this embodiment, the multiple transport paths 62 are formed so that the longitudinal lengths become shorter as they move in the direction of the arrow Z (the front side in the device depth direction).

(Connecting road)
The connecting path 64 is disposed downstream in the transport direction of the springs S transported through the multiple transport paths 62, and connects the multiple transport paths 62 together. The connecting path 64 has a linear shape that connects the downstream ends in the transport direction of the multiple transport paths 62 that are different in length, and is disposed in a direction that intersects with the device width direction in a plan view of the supply device 10.

The connecting path 64 is a groove formed on the upper surface of the inclined plate 60, into which the spring S can be inserted. The width of the connecting path 64 (width in the device depth direction) is slightly larger than the diameter of the spring S. In other words, the width of the connecting path 64 is the same as the width of the plate surface 22 between adjacent protrusions 24 (width in the device depth direction). As a result, the spring S is inserted into the connecting path 64 so that the longitudinal direction of the spring S is aligned with the longitudinal direction of the connecting path 64. The connecting path 64 is arranged so that it slopes downward from the side of the multiple transport paths 62. The connecting path 64 is designed to transport the spring S by gravity due to its downward slope.

At the downstream end of the connecting path 64 in the conveying direction, an extension path 68 is provided that extends downward in the conveying direction downstream. The extension path 68 extends linearly along the device width direction in a plan view of the supply device 10, and the downward inclination allows the springs S to be conveyed by gravity.

(Sending section)
The sending section 66 has a function of sequentially sending out the springs S conveyed on the plate surface 22 between the convex portions 24 to the conveying path 62. As shown in Figs. 7 and 10, the sending section 66 has a plurality of introduction paths 72 into which the springs S on the plate surface 22 between the convex portions 24 are respectively introduced. Furthermore, the sending section 66 has support parts 74 respectively arranged downstream in the conveying direction of the plurality of introduction paths 72, and cylinders 76 for moving the support parts 74 in the up and down direction (directions perpendicular to the conveying direction of the springs S on the conveying path 62). In this embodiment, since four plate surfaces 22 between the convex portions 24 are provided, four introduction paths 72, support parts 74, and cylinders 76 are also provided. Each of the introduction paths 72, support parts 74, and cylinders 76 has the same configuration.

The delivery section 66 is provided with an inclined plate 70 arranged on the outer side of the plate surface 22 so as to have a downward slope. The introduction path 72 is a concave groove formed on the upper surface 70A of the inclined plate 70. The width of the introduction path 72 (width in the device depth direction) is slightly larger than the diameter of the spring S. In other words, the width of the introduction path 72 is the same as the width of the plate surface 22 between adjacent convex parts 24 (width in the device depth direction). In addition, the longitudinal length of the introduction path 72 is longer than the longitudinal length of the spring S. As a result, the spring S is introduced into the introduction path 72 from the plate surface 22 between the convex parts 24. The introduction path 72 extends linearly along the device width direction in a plan view of the supply device 10, and the spring S is transported by gravity due to the downward slope (see FIG. 7).

The four introduction paths 72 are arranged at positions corresponding to the four transport paths 62 across the support portion 74. The longitudinal extension of the bottom surface of the introduction path 72 is arranged at a position lower than the bottom surface of the transport path 62, and as an example, is parallel to the bottom surface of the transport path 62 (see FIG. 10).

The support portion 74 is made of a rectangular block-shaped member, and is arranged so that the upper surface 74A is inclined downward along the inclined plate 70. The upper surface 74A of the support portion 74 is formed with a groove 74B into which the spring S is inserted along the longitudinal direction. The width (width in the device depth direction) of the groove 74B is slightly larger than the diameter of the spring S. In other words, the width of the groove 74B is the same as the width (width in the device depth direction) of the plate surface 22 between adjacent protrusions 24. The longitudinal length of the groove 74B is shorter than the longitudinal length of the spring S (see FIG. 10). However, in order to stabilize the posture of the spring S in the groove 74B when the support portion 74 rises, the longitudinal length of the groove 74B is set to be 60% or more of the longitudinal length of the spring S.

The cylinder 76 is attached to the mounting portion 80 that extends from (attached to) the inclined plate 60. The cylinder 76 moves the support portion 74 in the vertical direction (a direction perpendicular to the conveying direction of the spring S in the conveying path 62) to move the recessed groove 74B between a position (retracted position) located on the extension of the introduction path 72 and a position (protruding position) located on the extension of the conveying path 62.

As shown in FIG. 10A, when the support portion 74 is positioned in the lower retracted position by the cylinder 76, the recessed groove 74B is disposed on an extension line of the introduction passage 72. As a result, the spring S of the introduction passage 72 is introduced into the recessed groove 74B by gravity.

As shown in FIG. 10B, when the support portion 74 is positioned in the upper protruding position by the cylinder 76, the groove 74B is positioned on an extension of the conveying path 62. As a result, the spring S in the groove 74B is sent out onto the conveying path 62 by gravity.

As an example, the sending unit 66 normally has the support parts 74 in a retracted position on the lower side, and the cylinder 76 operates to move the support parts 74 corresponding to the four transport paths 62 to the upper protruding position in a specified order. This causes the springs S to be sent out to the transport paths 62 in order from the four support parts 74. That is, the sending unit 66 prevents two or more support parts 74 from moving up in the vertical direction at the same time in positions corresponding to the four transport paths 62, and prevents the springs S from being sent out to the four transport paths 62 at the same time. Therefore, for example, even if springs S are inserted into all of the grooves 74B of the four support parts 74, the cylinder 76 moves the support parts 74 to the upper protruding position in a specified order, and the springs S are sent out to the four transport paths 62 in order.

In this embodiment, the sending unit 66 sends out the springs S onto the four transport paths 62 in the order of the longitudinal lengths of the four transport paths 62 from the longest to the shortest. In other words, the four support units 74 send out the springs S onto the transport paths 62 in the order of the directions of the arrow Z in FIG. 7 (the front side in the device depth direction). This prevents the springs S from colliding when they join the connecting path 64 from the four transport paths 62, compared to when the springs S are sent out onto the transport paths 62 in the order of the longitudinal lengths of the four transport paths 62 from the shortest to the longest.

In addition, the operating time of the four support parts 74 (the time it takes to move from the retracted position to the protruding position and then return from the protruding position to the retracted position) is all the same, and is set to a time longer than the maximum time it takes for the spring S to pass through the conveying path 62 and the connecting path 64. Specifically, if the results (actual values) of the time it takes for the spring S to pass through the conveying path 62 and the connecting path 64 in the order of the arrow Z direction in FIG. 7 (the front side in the device depth direction) are, for example, 1.0 seconds, 1.2 seconds, 1.1 seconds, and 1.3 seconds, the operating time of the support parts 74 is set to, for example, 1.5 seconds. In other words, the sending part 66 sends out the spring S to the conveying path 62 every predetermined time (for example, 1.5 seconds) in the order of the longitudinal lengths of the four conveying paths 62 from the long side to the short side. As a result, compared to the case where the operating time is not predetermined, the collision of the spring S is suppressed when the spring S joins the connecting path 64 from the four conveying paths 62.

As an example, in the supply device 10, the delivery unit 66 performs a cycle of operations in which the springs S are delivered to the transport path 62 in order between the multiple protrusions 24, and then the ejection unit 28 ejects gas, causing the delivery unit 66 to resume delivery of the springs S. That is, after the delivery unit 66 performs a cycle of operations in which the support units 74 corresponding to the four transport paths 62 are moved upward in the vertical direction in a set order, the ejection unit 28 ejects gas simultaneously onto the plate surface 22 between the four protrusions 24. The gas is ejected for a preset time. This causes the gas to be ejected intermittently from the ejection unit 28.

<Action and Effects>
Next, the operation and effects of this embodiment will be described.

In the supply device 10, the moving part 20 vibrates, causing the springs S on the plate surface 22 to move in one direction from one end 22A to the other end 22B of the plate surface 22. In the supply device 10, a plurality of protrusions 24 are provided that extend in one direction and protrude from the plate surface 22, and the springs S on the protrusions 24 tend to fall onto the plate surface 22 between the protrusions 24. As a result, the springs S are aligned on the plate surface 22 between the protrusions 24 so that their longitudinal directions are aligned in one direction.

In the supply device 10, a gate portion 26 is provided across multiple protrusions 24, and when multiple springs S become entangled between the protrusions 24, the entangled springs S hit the wall portion 26B of the gate portion 26. This restricts the movement of the multiple springs S entangled between the protrusions 24 in one direction by the gate portion 26. Therefore, a single spring S in a normal position moving in one direction on the plate surface 22 between the protrusions 24 passes through the gate portion 26.

The gate section 26 is provided with an injection section 28 that intermittently injects gas diagonally downward toward one end 22A between the protrusions 24. By injecting gas from the injection section 28 diagonally downward toward one end 22A between the protrusions 24, the multiple springs S entangled between the protrusions 24 are blown away (blow away) by the gas toward the one end 22A side. The multiple blown away springs S fall toward the one end 22A side of the plate surface 22. This prevents the springs S entangled between the protrusions 24 from accumulating near the gate section 26.

As a result, in the supply device 10, clogging of the spring S at the gate portion 26 is suppressed compared to when gas is not injected between the protrusions 24.

In addition, in the supply device 10, a wall 30 is formed on the plate surface 22, rising from one end 22A of the plate surface 22, and the ejection unit 28 ejects gas at a flow rate that causes the springs S, blown by the ejected gas, to strike the wall 30. As a result, the multiple springs S tangled between the protrusions 24 are thrown toward the one end 22A by the gas, and are bounced off the wall 30 when they strike the wall 30. The impact of the multiple springs S hitting the wall 30, or the impact of the bounced springs S dropping to the first surface 40, makes it easier for the multiple springs S to become untangled.

As a result, the supply device 10 can untangle the tangled spring S when it hits a wall, compared to when one end side of the plate surface 22 is flat.

In addition, in the supply device 10, an upper plate 34 that faces the plate surface 22 is attached to the upper end of the wall 30. This allows the springs S to hit the upper plate 34 even if they bounce upward when the multiple springs S are blown toward the one end 22A by the gas and hit the wall 30.

As a result, in the supply device 10, the spring S that bounces off the wall 30 is prevented from falling from the plate surface 22 (i.e., falling to the outside of the moving part 20) compared to when the upper end of the wall 30 is open.

In addition, in the supply device 10, the width of the protrusion 24 in the direction intersecting the one direction is longer than the length of the spring S in the longitudinal direction. This makes it difficult for multiple springs S to come into contact with each other on the protrusion 24, and therefore makes it difficult for multiple springs S to become entangled again.

In contrast, if the width of the protrusion in the direction intersecting the one direction is less than or equal to the length of the spring S in the longitudinal direction, multiple springs S are likely to come into contact on the protrusion 24, and the multiple springs S are likely to become entangled.

As a result, in the supply device 10, entanglement of the spring S is suppressed compared to when the width of the protrusion 24 is equal to or less than the longitudinal length of the part (spring S).

In the supply device 10, the moving unit 20 is configured to move the springs S in one direction from one end 22A of the plate surface 22 to the other end 22B of the plate surface 22 by vibrating the plate surface 22. By vibrating the plate surface 22, the multiple springs S are constantly vibrating, making it difficult for the multiple springs S to come into contact at the same position.

As a result, the supply device 10 reduces tangling of the spring S compared to when the part is moved from one end to the other by tilting the plate surface.

In the supply device 10, a first surface 40 is provided on one end side of the plate surface 22, spanning multiple protrusions 24 and having a height equal to or less than that of the plate surface 22. In other words, the height of the first surface 40 is equal to or less than the height of the plate surface 22 between adjacent protrusions 24, so that the spring S is easily moved from the plate surface 22 to the first surface 40 by the gas ejection from the ejection unit 28, and the spring S is difficult to move from the first surface 40 to the plate surface 22.

For this reason, in the supply device 10, the gas ejection from the ejection unit 28 makes it easier for the springs S to be ejected from the plate surface 22 between the protrusions 24 toward the first surface 40, compared to when the height of the plate surface 22 between the protrusions 24 is lower than the height of the surface (first surface 40) on one end side of the plate surface 22. In other words, the gas ejection from the ejection unit 28 suppresses clogging of the springs S at the boundary between the plate surface 22 between the protrusions 24 and the first surface 40. In yet other words, the gas ejection from the ejection unit 28 creates a smooth flow of the springs S in the direction of the arrow X from the plate surface 22 between the protrusions 24 toward the first surface 40.

In the supply device 10, an inclined surface 42 is provided at a position adjacent to the first surface 40 in one direction at an end in a direction intersecting the position where the multiple protrusions 24 are arranged, and a second surface 44 is provided at a position adjacent to the inclined surface 42 in one direction. The inclined surface 42 is inclined so as to have an upward gradient from the one end 22A side of the plate surface 22 toward the other end 22B side of the plate surface. In addition, the second surface 44 is provided on the other end 22B side of the plate surface 22 with respect to the inclined surface 42.

On the first surface 40, for example, a number of springs S are scattered, which have been blown to one end 22A of the plate surface 22 by the gas sprayed from the spray unit 28, or a number of springs S newly supplied to the moving unit 20 by a supply device (not shown) are present. In the supply device 10, with the above configuration, the springs S on the first surface 40 move from the first surface 40 to the inclined surface 42 due to the vibration of the moving unit 20, and climb the upward gradient of the inclined surface 42. Then, the springs S that have climbed the inclined surface 42 move to the second surface 44 due to the vibration of the moving unit 20. Furthermore, the springs S on the second surface 44 move from the second surface 44 to the convex portion 24 due to the vibration of the moving unit 20, and as the springs S move on the convex portion 24, some of the springs S are inserted on the plate surface 22 between the convex portions 24.

As a result, in the supply device 10, the spring S is more likely to rise from the first surface 40 to the inclined surface 42, and the spring S is more likely to move from the inclined surface 42 to the second surface 44, compared to when the end of the spring S in a direction intersecting the position where the multiple protrusions 24 are arranged is at the same height as the protrusions 24.

In addition, in the supply device 10, the height of the first surface 40 is set to be equal to or greater than the height of the lowest portion of the one end 22A side of the inclined surface 42. As a result, some of the multiple springs S on the first surface 40 move to the lowest portion of the one end 22A side of the inclined surface 42, which is equal to or less than the height of the first surface 40, due to the vibration of the moving part 20.

For this reason, in the supply device 10, the spring S is more likely to move from the first surface 40 to the inclined surface 42 than when the height of the first surface 40 is lower than the height of the lowest portion of one end side of the inclined surface 42. In other words, in the supply device 10, the occurrence of the spring S getting stuck (clogging) at the boundary between the first surface 40 and the inclined surface 42 can be suppressed compared to when the height of the first surface 40 is lower than the height of the lowest portion of one end side of the inclined surface 42.

In addition, in the supply device 10, the height of the second surface 44 is set to be equal to or greater than the height of the upper surface of the protrusion 24. As a result, some of the multiple springs S on the second surface 44 move to the upper surface of the protrusion 24, which is at a height equal to or less than the second surface 44, due to the vibration of the moving part 20.

For this reason, in the supply device 10, the spring S that has moved to the second surface 44 is more likely to move to the upper surface of the convex portion 24 than when the height of the second surface 44 is lower than the height of the upper surface of the convex portion 24. In other words, in the supply device 10, the occurrence of the spring S getting caught (clogging) at the boundary between the second surface 44 and the convex portion 24 can be suppressed compared to when the height of the second surface 44 is lower than the height of the upper surface of the convex portion 24.

In addition, in the supply device 10, the injection port 52 of the injection unit 28 is provided on the one end 22A side of the plate surface 22 at the gate section 26. Then, gas is injected from the injection port 52 of the injection unit 28 diagonally downward toward the one end 22A side between the protrusions 24, so that the multiple springs S entangled between the protrusions 24 near the upstream side of the gate section 26 in the conveying direction are blown by the gas to the one end 22A side of the plate surface 22. For example, if the injection port 52 of the injection unit 28 is provided on the other end side of the plate surface 22 at the gate section (gate section 26), the gas is less likely to hit the multiple springs S entangled between the protrusions 24.

As a result, in the supply device 10, clogging of the spring S at the gate portion 26 is suppressed compared to when the injection port 52 of the injection portion 28 is provided at the other end side of the plate surface 22 at the gate portion (gate portion 26).

As described above, in the supply device 10, the moving part 20 vibrates, so that the springs S on the plate surface 22 move in one direction from one end 22A to the other end 22B of the plate surface 22. Then, one spring S in a normal position moving in one direction on the plate surface 22 between the convex parts 24 passes through the gate part 26. On the other hand, the movement of the multiple springs S entangled between the convex parts 24 in one direction from one end 22A to the other end 22B of the plate surface 22 is restricted by the gate part 26, and the multiple springs S are discharged from the plate surface 22 between the convex parts 24 toward the first surface 40 by the gas injection from the injection part 28. Most of the springs S discharged to the first surface 40 extending in the device depth direction move in one direction from one end 22A to the other end 22B of the plate surface 22 on the inclined surfaces 42 and second surfaces 44 on both sides in the device depth direction due to the vibration of the moving part 20, and move to the upper surface of the convex part 24. The springs S that have moved to the top surface of the protrusions 24 either fall onto the plate surface 22 between the protrusions 24 due to the vibration of the moving part 20, or are restricted from moving in one direction from one end 22A to the other end 22B of the plate surface 22 by the gate part 26. In this way, the supply device 10 uses vibration to allow springs S that are in a normal position to pass through the gate part 26, and for springs S that are not in a normal position, vibration and gas injection are used to untangle the tangles and create a flow of springs S that fall onto the plate surface 22 between the protrusions 24.

The supply device 10 is also provided with a plurality of transport paths 62 provided outside the other end 22B of the plate surface 22, a single connecting path 64 provided downstream in the transport direction of the springs S on the multiple transport paths 62, and a sending section 66 provided between the other end 22B of the plate surface 22 and the multiple transport paths 62. In the sending section 66, the springs S that have moved in one direction between the multiple protrusions 24 are sent out in sequence to the multiple transport paths 62. The sent out springs S are transported through each of the multiple transport paths 62. The springs S transported through the multiple transport paths 62 are transported through the single connecting path 64.

The springs S are sent out to the multiple transport paths 62 in order between the protrusions 24 by the delivery section 66, so that when the springs S being transported on the multiple transport paths 62 join the connecting path 64, the springs S are prevented from colliding with other springs S being transported on the connecting path 64. This prevents the multiple springs S from clogging the connecting path 64, and allows the multiple springs S to be transported in a row on the connecting path 64.

As a result, the supply device 10 can more easily align and supply multiple springs S in the connecting path 64 compared to a case in which parts (springs S) are randomly sent to the conveying path 62 between multiple protrusions 24.

In addition, in the supply device 10, the multiple transport paths 62 and the connecting paths 64 are configured to transport the springs S with a downward incline from the gate section 26 side. In other words, the multiple transport paths 62 and the connecting paths 64 are configured not to vibrate, and the springs S are transported by gravity with a downward incline.

For this reason, in the supply device 10, the springs S are more likely to move between the multiple conveying paths 62 and the connecting paths 64 than when the parts (springs S) are conveyed by vibration of the multiple conveying paths 62 and the connecting paths 64.

In addition, in the supply device 10, the ejection unit 28 ejects gas and resumes the ejection of the spring S from the ejection unit 66 after the ejection unit 66 has performed a cycle of ejecting the spring S from the plurality of protrusions 24 to the conveying path 62 in order. In other words, in the supply device 10, the ejection unit 28 stops ejecting gas, and the ejection unit 28 ejects gas for a predetermined period of time, after which the ejection unit 66 stops ejecting gas and resumes the ejection of the spring S from the ejection unit 66. In other words, the supply device 10 alternates between the operation of the ejection unit 28 (ejection of gas) and the operation of the ejection unit 66 (ejection of spring S). As a result, the springs S are sent out to the conveying path 62 in order between the multiple convex parts 24, and then gas is sprayed from the spray unit 28, causing the multiple springs S entangled on the upstream side of the gate unit 26 in the conveying direction to fly toward one end 22A of the plate surface 22. Then, the sending unit 66 resumes sending out the springs S, causing the sending unit 66 to send out the springs S to the conveying path 62 in order between the multiple convex parts 24. As a result, the springs S sent out to the multiple conveying paths 62 in order are transported along the conveying path 62 and supplied to the connecting path 64.

For this reason, in the supply device 10, the spring S is more likely to be aligned in the connecting passage 64 than in a case where the ejection unit 28 ejects gas regardless of the operation of the delivery unit 66. In other words, in the supply device 10, the spring S is more likely to be aligned in the connecting passage 64. In addition, the supply device 10 can simplify control because it is sufficient to alternately operate the ejection unit 28 and the delivery unit 66.

In addition, in the supply device 10, the springs S supplied are compression coil springs. If a compression coil spring comes into contact with another compression coil spring while moving, the compression coil springs tend to become entangled.

For this reason, in the supply device 10, even when the supplied spring S is a compression coil spring, clogging of the compression coil spring at the gate portion 26 is suppressed compared to a case in which gas is not injected between the protrusions 24.

〔supplementary explanation〕
In the supply device 10 of the first embodiment, the helical part to be supplied is the spring S, but the present invention is not limited to this configuration. For example, the helical part may be a coil auger, an agitator, a screw, or the like.

In the first embodiment of the supply device 10, the injection port 52 of the injection unit 28 is provided on the one end 22A side of the plate surface 22 in the gate unit 26, but the injection port 52 may be provided at another position in the gate unit 26 as long as it faces the one end 22A side of the plate surface 22. In addition, the injection port 52 may be formed of another independent part different from the gate unit 26, and the other part may be provided at a position near the gate unit 26 so as to face the one end 22A side of the plate surface 22.

In the supply device 10 of the first embodiment, the number of protrusions 24 can be changed, and the number of alignment paths formed on the plate surface 22 between the protrusions 24 can also be changed. The number of alignment paths formed on the plate surface 22 between the protrusions 24 may be one, or may be changed to two or more. In addition, the width of the protrusions 24 in the device depth direction may be shorter than the length of the spring S in the longitudinal direction.

In the first embodiment of the supply device 10, the size and height of the first surface 40, the inclined surface 42, and the second surface 44 can be changed without departing from the scope of the present invention.

In the supply device 10 of the first embodiment, the shapes of the multiple conveying paths 62 and the connecting paths 64 and the inclination angles with respect to the horizontal plane can be changed. The number of conveying paths 62 can also be changed according to the number of alignment paths formed on the plate surface 22 between the protrusions 24.

Although the present invention has been described in detail with respect to a specific embodiment, it will be apparent to those skilled in the art that the present invention is not limited to such an embodiment, and that various other embodiments are possible within the scope of the present invention.

10 Supply device 20 Moving part 22 Plate surface 22A One end (an example of one end part)
22B other end (an example of the other end)
24 Convex portion 26 Gate portion (an example of a gate portion)
28 Injection portion 30 Wall 32 Vertical wall 34 Upper plate (an example of another plate)
40 First surface 42 Inclined surface 42A Flat surface 44 Second surface 52 Injection port 62 Conveying path 64 Connecting path 66 Delivery section

Claims (14)

a moving unit that moves the spiral part on the plate surface in one direction from one end of the plate surface to the other end of the plate surface;
a plurality of protrusions extending in the one direction and protruding from the plate surface, the protrusions aligning the components such that the longitudinal directions of the components are aligned in the one direction;
a gate portion provided across the plurality of protruding portions and configured to restrict movement of the plurality of components entangled between the protruding portions in the one direction;
an ejection portion provided at the gate portion and configured to eject gas intermittently obliquely downward on the one end side between the protrusions;
A supply device having A wall is formed on the plate surface, the wall rising from one end of the plate surface,
2. The supply device according to claim 1, wherein the jetting portion jets the gas at a flow rate such that the part, which is blown off by the jetted gas, strikes the wall. The supply device according to claim 2, wherein another plate is attached to the upper end of the wall so as to face the plate surface. The supply device according to any one of claims 1 to 3, wherein the width of the protrusion in a direction intersecting the one direction is longer than the length of the part in the longitudinal direction. The supply device according to any one of claims 1 to 4, wherein the moving unit is configured to move the part in one direction from one end of the plate surface to the other end by vibrating the plate surface. The supply device according to any one of claims 1 to 5, wherein a first surface is provided on one end side of the plate surface, spanning the multiple protrusions and having a height equal to or less than the plate surface. At an end portion in a direction intersecting the one direction with respect to a position where the plurality of protrusions are arranged,
an inclined surface provided adjacent to the first surface in the one direction and inclined upward from one end side of the plate surface toward the other end side of the plate surface;
a second surface provided on the other end side of the plate surface and adjacent to the inclined surface in the one direction;
7. The delivery device of claim 6, further comprising: The supply device according to claim 7, wherein the height of the first surface is equal to or greater than the height of the lowest portion of one end of the inclined surface. The supply device according to claim 7 or claim 8, wherein the height of the second surface is equal to or greater than the height of the upper surface of the convex portion. The supply device according to any one of claims 1 to 9, wherein the injection port of the injection unit is provided on one end side of the plate surface of the gate unit. a plurality of conveying paths provided on the outside of the other end of the plate surface, along which the components that have moved in the one direction between the plurality of protrusions are conveyed;
a connecting path that is provided downstream of the plurality of conveying paths in a conveying direction of the parts and connects the plurality of conveying paths;
a delivery section provided between the other end of the plate surface and the plurality of transport paths, the delivery section delivering the components to the transport paths in order between the protrusions;
11. The device according to claim 1, further comprising: The supply device according to claim 11, wherein the plurality of conveying paths and the connecting path are configured to convey the parts at an incline that slopes downward from the gate side. The supply device according to claim 11 or 12, wherein the ejection unit ejects the gas and resumes ejection of the parts from the ejection unit after the ejection unit has completed one cycle of ejecting the parts to the conveying path between the multiple protrusions in order. The supply device according to any one of claims 1 to 13, wherein the part is a compression coil spring.