JP7574882B2 - X-ray generator - Google Patents

Description

The present invention relates to an X-ray generating device.

As a device for non-destructively acquiring information about the inside of an object, for example, an X-ray device having an X-ray source that irradiates an object with X-rays and a detector that detects the transmitted X-rays that have passed through the object, as disclosed in the following patent document, is known.

US Patent Application Publication No. 2009/0268869

According to a first aspect of the present invention, an X-ray generating device includes an electron emitting section that emits electrons, an X-ray emitting section that emits X-rays when irradiated with electrons from the electron emitting section, a housing having an emission section through which X-rays are emitted from the X-ray emitting section, and a member that is disposed on an emission path through which the X-rays from the X-ray emitting section reach the emission section, and the member at least partially contains an element having an atomic number smaller than that of the X-ray emitting section.
According to a second aspect of the present invention, an X-ray device includes the X-ray generating device described in the first aspect, a stage that holds a measured object to be irradiated with X-rays emitted from the emission section, and a detector that detects the X-rays irradiated to and transmitted through the measured object.
According to a third aspect of the present invention, a method for manufacturing a structure includes a design process for producing design information regarding a shape of the structure, a molding process for fabricating the structure based on the design information, a process for measuring the shape of the fabricated structure using the X-ray device described in the second aspect, and an inspection process for comparing the shape information obtained in the measurement process with the design information.
According to a fourth aspect of the present invention, a structure manufacturing system includes a design device that creates design information regarding a shape of a structure, a molding device that creates a structure based on the design information, an X-ray device described in the second aspect that measures the shape of the created structure, and an inspection device that compares shape information regarding the shape of the structure obtained by the X-ray device with the design information.

1 is a schematic configuration diagram showing an example of an inspection device according to an embodiment of the present invention. 1 is a schematic configuration diagram showing an example of an inspection device according to an embodiment of the present invention. 2 is a schematic diagram of a shield according to the embodiment; FIG. FIG. 13 is a diagram showing an example of an image when X-rays pass through a shield. 1 is a schematic cross-sectional view of an X-ray generating device according to an embodiment of the present invention. FIG. 2 is a schematic enlarged cross-sectional view of a storage section according to the embodiment. FIG. 2 is a schematic diagram illustrating generation of X-rays. FIG. 2 is a schematic diagram illustrating generation of X-rays. FIG. 13 is a diagram for explaining the results of simulation calculations of the intensity of X-rays reaching a detector. 11 is a graph illustrating the results of a simulation calculation of the intensity of X-rays reaching a detector. FIG. 11 is a schematic cross-sectional view showing another example of an X-ray generating device. FIG. 1 is a schematic diagram showing a configuration of a system having an inspection device. FIG. 1 is a block diagram of a manufacturing system. 1 is a flowchart showing a process flow of the manufacturing system.

Embodiments of the present disclosure will be described in detail below with reference to the drawings. The components in the following embodiments include those that a person skilled in the art would easily imagine, those that are substantially the same, and those that are within the so-called equivalent range. Furthermore, the components disclosed in the following embodiments can be combined as appropriate.

In the following explanation, an XYZ Cartesian coordinate system is set, and the positional relationship of each part is explained with reference to this XYZ Cartesian coordinate system. A specific direction in a horizontal plane is the Z-axis direction, a direction perpendicular to the Z-axis direction in the horizontal plane is the X-axis direction, and a direction perpendicular to both the Z-axis direction and the X-axis direction (i.e., the vertical direction) is the Y-axis direction. In addition, the directions of rotation (tilt) around the X-axis, Y-axis, and Z-axis are the θX, θY, and θZ directions, respectively.

Figures 1 and 2 are schematic diagrams showing an example of an inspection device according to this embodiment. The inspection device 100, which is an X-ray device according to this embodiment, irradiates X-rays onto a measurement object S and detects the transmitted X-rays that have passed through the measurement object S. The X-rays are electromagnetic waves with a wavelength of, for example, about 1 pm to 30 nm. The X-rays include at least one of ultra-soft X-rays of about 50 eV, soft X-rays of about 0.1 to 2 keV, X-rays of about 2 to 20 keV, and hard X-rays of about 20 to 1000 eKV. Inspection devices using X-rays are disclosed, for example, in JP 60-210087 A, JP 7-308313 A, JP 2013-113798 A, JP 2013-174495 A, JP 2017-22054 A, and JP 2018-536978 A.

In this embodiment, the inspection device 100 includes an X-ray CT inspection device that irradiates the measured object S with X-rays, detects the transmitted X-rays that have passed through the measured object S, and non-destructively acquires information about the inside of the measured object S (e.g., the internal structure). In this embodiment, the measured object S includes, for example, mechanical parts, electronic parts, and other industrial parts. The X-ray CT inspection device includes an industrial X-ray CT inspection device that irradiates the industrial parts with X-rays and inspects the industrial parts.

1, the inspection apparatus 100 includes a measuring device 1 that irradiates a measuring object S with X-rays and detects the transmitted X-rays, and a control device 7 that controls the overall operation of the inspection apparatus 100 including the measuring device 1. The measuring device 1 includes an X-ray generating device 2 that emits X-rays XL, a shielding device 3 that blocks at least a portion of the X-rays, a stage device 4 that can move while holding the measuring object S, and a detector 5 that detects the transmitted X-rays that are emitted from the X-ray source 2 and have transmitted through the measuring object S held by the stage device 4.

In this embodiment, the X-ray generator 2, shielding device 3, and detector 5 are installed so that the optical axis of the X-rays XL emitted from the X-ray generator 2 through the shielding device 3 toward the detector 5 is oriented along the Z axis. The detection surface of the detector 5 is installed parallel to a plane (XZ plane) perpendicular to the optical axis of the X-rays XL. In this embodiment, the X-ray generator 2 and shielding device 3 are placed on a base B.

In addition, in this embodiment, the inspection device 100 includes a chamber member 6 that forms an internal space SP through which the X-rays XL emitted from the X-ray generator 2 travel. In this embodiment, the X-ray generator 2, the shielding device 3, the stage device 4, the detector 5, and the base B are disposed in the internal space SP.

In this embodiment, the chamber member 6 is placed on the support surface FR. The support surface FR includes the floor surface of a factory or the like. The chamber member 6 is supported by a plurality of support members 6S. The chamber member 6 is placed on the support surface FR via the support members 6S. In this embodiment, the support members 6S separate the lower surface of the chamber member 6 from the support surface FR. That is, a space is formed between the lower surface of the chamber member 6 and the support surface FR. Note that at least a portion of the lower surface of the chamber member 6 may be in contact with the support surface FR.

In this embodiment, the chamber member 6 contains lead. The chamber member 6 prevents the X-rays XL in the internal space SP from leaking into the external space RP of the chamber member 6.

In this embodiment, the inspection device 100 has a member 6D attached to the chamber member 6 and having a lower thermal conductivity than the chamber member 6. In this embodiment, the member 6D is disposed on the outer surface of the chamber member 6. The member 6D prevents the temperature of the internal space SP from being affected by the temperature (temperature change) of the external space RP. In other words, the member 6D functions as a heat insulating member that prevents the heat of the external space RP from being transferred to the internal space SP. The member 6D includes, for example, plastic. In this embodiment, the member 6D includes, for example, polystyrene foam.

The X-ray generator 2 irradiates the measured object S with X-rays XL. The X-ray generator 2 has an emission unit 50B that emits X-rays XL. The X-ray generator 2 forms a point X-ray source. In this embodiment, the X-ray generator 2 includes a point X-ray source (a point where X-rays are generated). The X-ray generator 2 irradiates the measured object S with cone-shaped X-rays (so-called cone beam). The X-ray generator 2 may be capable of adjusting the intensity of the emitted X-rays XL. When adjusting the intensity of the X-rays XL emitted from the X-ray generator 2, it may be based on the X-ray absorption characteristics of the measured object S. In addition, the shape of the spread of the X-rays emitted from the X-ray generator 2 is not limited to a cone shape, and may be, for example, a fan-shaped X-ray (so-called fan beam). In addition, it may be, for example, a linear X-ray (so-called pencil beam).

The emission part 50B of the X-ray generator 2 faces the +Z direction. In this embodiment, at least a portion of the X-rays XL emitted from the emission part 8 travels in the +Z direction in the internal space SP. The configuration of the X-ray generator 2 will be described later.

The shielding device 3 is disposed on the +Z direction side of the X-ray generating device 2. The shielding device 3 includes a shielding body 3A and a moving part 3M. FIG. 3 is a schematic diagram of the shielding body according to this embodiment. The shielding body 3A is irradiated with X-rays XL emitted from the X-ray generating device 2. The shielding body 3A transmits a part of the X-rays XL emitted from the X-ray generating device 2 and blocks (absorbs) the other part. As shown in FIG. 3, the shielding body 3A includes a transmitting member 3B and a shielding part 3C. The transmitting member 3B is a member through which the X-rays XL can transmit, such as acrylic, and is a plate-shaped member in this embodiment. The shielding part 3C is a member that can block X-rays, such as tungsten carbide. A plurality of shielding parts 3C are provided in the transmitting member 3B. The shielding parts 3C are arranged on the transmitting member 3B at predetermined intervals, here at equal intervals, in the X-axis direction and the Y-axis direction. In this embodiment, the shielding portion 3C is an axial member and is disposed in the transparent member 3B so as to face outward in the radial direction as it approaches the +Z direction. Here, the outward radial direction refers to a direction away from the optical axis _AXL of the X-ray XL when the optical axis AXL is the center. Note that the shielding portion 3C is not limited to an axial member, and may be, for example, spherical. In this case, for example, the transparent member 3B is provided with a plurality of openings formed so as to face outward in the radial direction as it approaches the +Z direction, and a spherical shielding portion 3C is disposed in each opening.

The shield 3A can be considered a member in which the shielding portions 3C are arranged in a grid pattern. The shield 3A blocks (absorbs) the X-rays XL in the areas where the shielding portions 3C are provided, and transmits the X-rays XL in areas where the shielding portions 3C are not provided.

The moving unit 3M is a mechanism that moves the shielding body 3A. The moving unit 3M moves the shielding body 3A to switch between an overlapping state in which the shielding body 3A overlaps with the emission part 50B of the X-ray generating device 2 in direction Z, and a non-overlapping state in which the shielding body 3A does not overlap with the emission part 50B of the X-ray generating device 2 in direction Z. In this embodiment, as shown in FIG. 2, the moving unit 3M moves the shielding body 3A along direction X to switch between the overlapping state and the non-overlapping state. For example, the moving unit 3M moves the shielding body 3A by driving a drive unit that moves the shielding body 3A by the control device 7.

The shielding device 3 is used to calculate the intensity of scattered light of the X-ray XL. FIG. 4 is a diagram showing an example of an image when the X-ray passes through the shield. The image P1 shown in FIG. 4A shows an example of an image of the transmitted X-ray transmitted through the measurement object S in the superimposed state. That is, the image P1 is an image of the transmitted X-ray transmitted through the measurement object S when the shield 3A is placed in the superimposed state by the moving part 3M and the measurement object S is irradiated with the X-ray XL by the X-ray generating device 2. In the superimposed state, the shield 3A is located at a position overlapping with the emission part 50B of the X-ray generating device 2, so that the X-ray XL that has passed through the shield 3A is irradiated to the measurement object S. Since the shield 3A does not transmit X-rays in the area where the shielding part 3C is provided, the image P1 in the superimposed state includes the image P _C of the shielding part 3C in addition to the image P _S of the measurement object S. On the other hand, image P2 shown in Fig. 4B shows an example of an image of transmitted X-rays transmitted through the measurement object S in a non-overlapping state. That is, image P2 is an image of transmitted X-rays transmitted through the measurement object S when the shield 3A is put into a non-overlapping state by the moving part 3M and the measurement object S is irradiated with X-rays XL by the X-ray generator 2. In the non-overlapping state, since the shield 3A is in a position not overlapping with the emission part 50B of the X-ray generator 2, the X-rays XL from the X-ray generator 2 are irradiated to the measurement object S without passing through the shield 3A. Therefore, image P2 in the non-overlapping state does not include an image P _C of the shielding part 3C but includes an image P _S of the measurement object S.

Here, since the shielding portion 3C does not transmit the X-rays XL, the luminance of the image _PC of the shielding portion 3C in the image P1 should be zero. However, since scattered light is actually included, the luminance of the image _PC of the shielding portion 3C is not zero. Therefore, the intensity (luminance) of the scattered light can be calculated from the luminance of the image _PC of the shielding portion 3C in the image P1. By subtracting the intensity (luminance) of the scattered light calculated based on the image P1 from the image P2, an image of the measurement object S from which scattered light has been removed can be generated.

As shown in FIG. 1, the stage device 4 includes a stage 9 that can move while holding the object to be measured S, and a drive system 10 that moves the stage 9.

In this embodiment, the stage 9 has a table 12 having a holding portion 11 that holds the reference object 48 and the measurement object S, a first movable member 13 that movably supports the table 12, a second movable member 14 that movably supports the first movable member 13, and a third movable member 15 that movably supports the second movable member 14.

The table 12 can rotate with the object S held in the holding section 11. The table 12 can move (rotate) in the θY direction. The first movable member 13 can move in the X-axis direction. When the first movable member 13 moves in the X-axis direction, the table 12 moves in the X-axis direction together with the first movable member 13. The second movable member 14 can move in the Y-axis direction. When the second movable member 14 moves in the Y-axis direction, the first movable member 13 and the table 12 move in the Y-axis direction together with the second movable member 14. The third movable member 15 can move in the Z-axis direction. When the third movable member 15 moves in the Z-axis direction, the second movable member 14, the first movable member 13, and the table 12 move in the Z-axis direction together with the third movable member 15.

In this embodiment, the drive system 10 includes a rotation drive device 16 that rotates the table 12 around the Y axis on the first movable member 13, a first drive device 17 that moves the first movable member 13 in the X axis direction on the second movable member 14, a second drive device 18 that moves the second movable member 14 in the Y axis direction, and a third drive device 19 that moves the third movable member 15 in the Z axis direction.

The second drive device 18 includes a screw shaft 20B that is disposed in a nut of the second movable member 14, and an actuator 20 that rotates the screw shaft 20B. The screw shaft 20B is supported by bearings 21A and 21B so that it can rotate around the Y axis. In this embodiment, the screw shaft 20B is supported by the bearings 21A and 21B so that the axis of the screw shaft 20B is substantially parallel to the Y axis. In this embodiment, a ball is disposed between the nut of the second movable member 14 and the screw shaft 20B. That is, the second drive device 18 includes a so-called ball screw drive mechanism.

The third drive device 19 includes a screw shaft 23B that is disposed in a nut of the third movable member 15, and an actuator 23 that rotates the screw shaft 23B. The screw shaft 23B is rotatably supported by bearings 24A and 24B. In this embodiment, the screw shaft 23B is supported by the bearings 24A and 24B so that the axis of the screw shaft 23B is substantially parallel to the Z-axis. In this embodiment, a ball is disposed between the nut of the third movable member 15 and the screw shaft 23B. That is, the third drive device 19 includes a so-called ball screw drive mechanism.

The third movable member 15 has a guide mechanism 25 that guides the second movable member 14 in the Y-axis direction. The guide mechanism 25 includes rail-shaped guide members 25A, 25B that extend in the Y-axis direction. At least a portion of the second drive device 18, including the actuator 20 and bearings 21A, 21B that support the screw shaft 20B, is supported by the third movable member 15. When the actuator 20 rotates the screw shaft 20B, the second movable member 14 moves in the Y-axis direction while being guided by the guide mechanism 25.

In this embodiment, the inspection device 100 has a base member 26. The base member 26 is supported by the chamber member 6. In this embodiment, the base member 26 is supported by the inner wall (inner surface) of the chamber member 6 via a support mechanism. The position of the base member 26 is fixed at a predetermined position.

The base member 26 has a guide mechanism 27 that guides the third movable member 15 in the Z-axis direction. The guide mechanism 27 includes rail-shaped guide members 27A, 27B that extend in the Z-axis direction. At least a portion of the third drive device 19, including the actuator 23 and bearings 24A, 24B that support the screw shaft 23B, is supported by the base member 26. When the actuator 23 rotates the screw shaft 23B, the third movable member 15 moves in the Z-axis direction while being guided by the guide mechanism 27.

Although not shown in the figures, in this embodiment, the second movable member 14 has a guide mechanism that guides the first movable member 13 in the X-axis direction. The first drive device 17 includes a ball screw mechanism that can move the first movable member 13 in the X-axis direction. The rotation drive device 16 includes a motor that can move (rotate) the table 12 in the θY direction.

In this embodiment, a reference object 48 is placed on the table 12, and the measurement object S is placed on the reference object 48. The reference object 48 and the measurement object S held on the table 12 can be moved in four directions, the X-axis, the Y-axis, the Z-axis, and the θY direction, by the drive system 10.

The drive system 10 may move the measurement object S held on the table 12 in six directions, namely, the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions. In the present embodiment, the drive system 10 includes a ball screw drive mechanism, but may also include, for example, a voice coil motor. For example, the drive system 10 may include a linear motor or a planar motor.

In this embodiment, the stage 9 is movable in the internal space SP. The stage 9 is disposed on the +Z side of the emission unit 8. The stage 9 is movable in the space of the internal space SP on the +Z side of the emission unit 8. At least a portion of the stage 9 can face the emission unit 8. The stage 9 can position the held measured object S in a position facing the emission unit 8. The stage 9 can position the measured object S on the path through which the X-rays XL emitted from the emission unit 8 pass. The stage 9 can be positioned within the irradiation range of the X-rays XL emitted from the emission unit 8.

In this embodiment, the inspection device 100 is equipped with a measurement system 28 that measures the position of the stage 9. In this embodiment, the measurement system 28 includes an encoder system.

The measurement system 28 has a rotary encoder 29 that measures the amount of rotation of the table 12 (position in the θY direction), a linear encoder 30 that measures the position of the first movable member 13 in the X-axis direction, a linear encoder 31 that measures the position of the second movable member 14 in the Y-axis direction, and a linear encoder 32 that measures the position of the third movable member 15 in the Z-axis direction.

In this embodiment, the rotary encoder 29 measures the amount of rotation of the table 12 relative to the first movable member 13. The linear encoder 30 measures the position of the first movable member 13 relative to the second movable member 14 (position in the X-axis direction). The linear encoder 31 measures the position of the second movable member 14 relative to the third movable member 15 (position in the Y-axis direction). The linear encoder 32 measures the position of the third movable member 15 relative to the base member 26 (position in the Z-axis direction).

The rotary encoder 29 includes, for example, a scale member 29A arranged on the first movable member 13, and an encoder head 29B arranged on the table 12 and detecting the scale of the scale member 29A. The scale member 29A is fixed to the first movable member 13. The encoder head 29B is fixed to the table 12. The encoder head 29B can measure the amount of rotation of the table 12 relative to the scale member 29A (first movable member 13).

The linear encoder 30 includes, for example, a scale member 30A arranged on the second movable member 14, and an encoder head 30B arranged on the first movable member 13 and detecting the scale of the scale member 30A. The scale member 30A is fixed to the second movable member 14. The encoder head 30B is fixed to the first movable member 13. The encoder head 30B can measure the position of the first movable member 13 relative to the scale member 30A (second movable member 14).

The linear encoder 31 includes a scale member 31A arranged on the third movable member 15, and an encoder head 31B arranged on the second movable member 14 to detect the scale of the scale member 31A. The scale member 31A is fixed to the third movable member 15. The encoder head 31B is fixed to the second movable member 14. The encoder head 31B can measure the position of the second movable member 14 relative to the scale member 31A (third movable member 15).

The linear encoder 32 includes a scale member 32A arranged on the base member 26, and an encoder head 32B arranged on the third movable member 15 and detecting the scale of the scale member 32A. The scale member 32A is fixed to the base member 26. The encoder head 32B is fixed to the third movable member 15. The encoder head 32B can measure the position of the third movable member 15 relative to the scale member 32A (base member 26).

The detector 5 is disposed on the +Z side of the X-ray generator 2 and the stage 9 in the internal space SP. The position of the detector 5 is fixed at a predetermined position. The detector 5 may be movable. The stage 9 is movable in the space between the X-ray generator 2 and the detector 5 in the internal space SP.

The detector 5 has a scintillator section 34 having an incidence surface 33 on which X-rays XL from the X-ray generator 2, including transmitted X-rays that have passed through the measured object S, are incident, and a light receiving section 35 that receives light generated in the scintillator section 34. The incidence surface 33 of the detector 5 can face the measured object S held on the stage 9.

The scintillator section 34 contains a scintillation material that generates light of a different wavelength from the X-rays when struck by the X-rays. The light receiving section 35 contains a photomultiplier tube. The photomultiplier tube contains a phototube that converts light energy into electrical energy by the photoelectric effect. The light receiving section 35 amplifies the light generated in the scintillator section 34, converts it into an electrical signal, and outputs it.

The detector 5 has a plurality of scintillator sections 34. A plurality of scintillator sections 34 are arranged in the XY plane. The scintillator sections 34 are arranged in an array. The detector 5 has a plurality of light receiving sections 35 so as to be connected to each of the plurality of scintillator sections 34. Note that the detector 5 may directly convert the incident X-rays into an electrical signal without converting them into light.

The moving mechanism 46 supports the detector 5 so that it can move. The moving mechanism 46 is equipped with a drive device that moves the detector 5 at least in the Z-axis direction (the direction toward and away from the X-ray generator 2 and the stage 9). The moving mechanism 46 may be a mechanism that moves the detector 5 in the X-axis direction, Y-axis direction, Z-axis direction, and θY direction, similar to the stage 9.

Next, the structure of the X-ray generating device will be described. FIG. 5 is a schematic cross-sectional view of the X-ray generating device according to this embodiment. As shown in FIG. 5, the X-ray generating device 2 according to this embodiment includes a housing 50, an electron emitter 52, a storage section 54, an X-ray emitter 56, a pressure reducing section 58, power sources 60 and 62, a wiring storage section 64, and wiring L1 and L2. The housing 50 is a housing that stores the storage section 54 and the X-ray emitter 56 inside. The housing 50 has an emission section 50B on the surface 50A on the +Z direction side. The emission section 50B is not an opening on the surface 50A, but a closed portion on the surface 50A, but has a smaller thickness than the surrounding area. However, the shape of the emission section 50B is arbitrary and is not limited to being smaller in thickness than the surrounding area. Since the housing 50 is made of a light element material such as aluminum, the emission section 50B is also made of a light element material such as aluminum. A light element member is a member that contains an element with an atomic number smaller than that of the X-ray emitter 56 (e.g., tungsten) described below, and is more preferably aluminum.

The housing 50 is connected to a pressure reduction unit 58. The pressure reduction unit 58 is a device that exhausts gas from the space SP inside the housing 50 to create a vacuum in the space SP. The pressure reduction unit 58 is, for example, an exhaust pump. The housing 50 maintains a vacuum in the space SP by having the pressure reduction unit 58 exhaust the gas inside. However, the space SP is not limited to being a vacuum, and it is sufficient that the partial pressure of gas such as oxygen is lower than that of the atmosphere. In other words, the housing 50 maintains the internal space SP at a reduced pressure or vacuum.

The electron emitter 52 is a mechanism for emitting an electron beam E (electrons). The electron emitter 52 includes an electron source housing 52A, an electron source 52B, and an intermediate electrode 52C. The electron source housing 52A is a housing that houses the electron source 52B inside. The electron source housing 52A is connected to the housing 50, and the internal space SP1 is connected to the space SP of the housing 50. Therefore, the internal space SP1 of the electron source housing 52A is also reduced in pressure or held at a vacuum by the pressure reducing unit 58. In this embodiment, the electron emitter 52 (electron source housing 52A) is connected to the surface 50C on the +Y direction side of the housing 50. That is, the electron emitter 52 is connected to a surface 50C different from the surface 50A on which the emission unit 50B of the housing 50 is provided. However, the electron emitter 52 is not limited to the surface 50C, and may be provided at any position.

The electron source 52B is a mechanism for emitting the electron beam E, and in this embodiment is a filament. The electron source 52B is made of a material containing tungsten, for example, and is configured to have a sharply pointed tip toward the X-ray emitter 56. The intermediate electrode 52C is disposed on the side where the X-ray emitter 56 is provided, in this case the -Y direction side, of the electron source 52B. The intermediate electrode 52C is provided with an opening 52D that penetrates from the surface on the electron source 52B side to the surface on the X-ray emitter 56 side.

The storage section 54 is a member that stores the X-ray emitter 56 inside. The storage section 54 is formed with a space 54C, an entrance path 70, and an exit path 72. In addition, an insertion member 76 and a member 80 that contains at least a part of a light element are attached to the storage section 54. The member 80 is a light element member 80 that contains a light element.

6 is a schematic enlarged cross-sectional view of the storage unit according to this embodiment. The storage unit 54 is made of a material capable of absorbing X-rays XL. In this embodiment, the storage unit 54 is made of a material containing tungsten, and more specifically, is made of tungsten. The storage unit 54 has a space 54C formed therein, and stores the X-ray emitter 56 in the space 54C. The incident path 70 is an opening formed in the storage unit 54, and is provided from one end 70A to the other end 70B. The end 70A of the incident path 70 is formed on the surface 54A of the storage unit 54, and the end 70B of the incident path 70 is connected to the space 54C. That is, the incident path 70 is provided from the surface 54A to the space 54C. The surface 54A is the surface of the storage unit 54 on the electron emitter 52 side, and in this embodiment, it is the surface on the +Y direction side. Therefore, the incident path 70 can be said to be a path formed between the electron emitter 52 and the X-ray emitter 56, and more specifically, it can be said to be a path disposed inside the housing 50 (inside the storage section 54) through which the electron beam E from the electron emitter 52 reaches the X-ray emitter 56.

In this embodiment, the incident path 70 is an opening formed in a cylindrical shape, and the inside diameter is constant from end 70A to end 70B. Furthermore, if the central axis of the incident path 70 is axis AX1, axis AX1 intersects with the Z-axis direction. In this embodiment, axis AX1 is inclined toward the +Z direction (the direction from the X-ray emitter 56 toward the emitter 50B) as it approaches the -Y direction. However, the incident path 70 is not limited to being cylindrical, and the direction of axis AX1 is not limited to that described above.

The emission path 72 is an opening formed in the storage section 54, and is provided from one end 72A to the other end 72B. The end 72A of the emission path 72 is formed on the surface 54B of the storage section 54, and the end 72B of the emission path 72 is connected to the space 54C. In other words, the emission path 72 is provided from the surface 54B to the space 54C. Since the emission path 72 is connected to the end 70A of the incident path 70 at the end 72B, the emission path 72 and the incident path 70 are connected. The surface 54B is the surface of the storage section 54 on the emission section 50B side, and in this embodiment, it is the surface on the +Z direction side. Therefore, the emission path 72 can be said to be a path formed between the X-ray emitter 56 and the emission part 50B, and more specifically, it can be said to be a path disposed inside the housing 50 (inside the storage part 54) through which the X-rays XL from the X-ray emitter 56 reach the emission part 50B.

In this embodiment, the exit path 72 is an opening formed in a truncated cone shape, and the inner diameter increases toward the end 72B, i.e., toward the exit section 50B. In addition, the inner diameter of the exit path 72 on the end 72A side is preferably smaller than the inner diameter of the entrance path 70. Furthermore, it is preferable that the area of the region of the exit path 72 that does not overlap with the X-ray emission section 56 when viewed from the +Z direction side is small, and the area of that region is preferably smaller than the inner diameter of the entrance path 70. In addition, if the central axis of the exit path 72 is the axis AX2, the axis AX2 intersects with the axis AX1 of the entrance path 70. In other words, the exit path 72 and the entrance path 70 intersect. In this embodiment, the axis AX2 of the exit path 72 is along the Z-axis direction. However, the exit path 72 is not limited to a truncated cone shape, and the direction of the axis AX2 is not limited to that described above.

The X-ray emitter 56 is provided in the space 54C of the storage section 54. The X-ray emitter 56 is a so-called target, and is a member that generates X-rays when struck by electrons. In this embodiment, the X-ray emitter 56 is made of a material containing tungsten, and more specifically, is made of tungsten. The X-ray emitter 56 emits X-rays XL when irradiated with the electron beam E from the electron emitter 52. In this embodiment, the X-ray emitter 56 has a curved surface, and when irradiated with the electron beam E from the entrance path 70, it emits X-rays XL toward the exit path 72, i.e., in the +Z direction. However, the shape of the X-ray emitter 56 is not limited to a curved surface and can be any shape.

The insertion member 76 is a member inserted into the incident path 70. The insertion member 76 is made of a material capable of absorbing X-rays XL. In this embodiment, the insertion member 76 is made of a material containing tungsten, and more specifically, is made of an alloy of tungsten and copper. The insertion member 76 is a tubular member extending from one end 76A to the other end 76B, and is open from the end 76A to the end 76B. The end 76A is provided with a flange. The insertion member 76 is inserted into the incident path 70 from the end 76B side, so that the end 76B is located on the end 70B side of the incident path 70, and the end 76A is located on the end 70A side of the incident path 70. However, the end 76B of the insertion member 76 is located closer to the end 70A side than the end 70B of the incident path 70, and does not reach the space 54C (X-ray emission section 56). A light element member 82, which will be described later, is provided between the end 76B of the insertion member 76 and the space 54C (X-ray emission portion 56).

The light element member 80 is a member that is disposed in the path along which the X-rays XL from the X-ray emitter 56 reach the emission section 50B. The light element member 80 is a member that contains an element with a smaller atomic number than the X-ray emitter 56 (tungsten in this case). In this embodiment, the light element member 80 is, for example, aluminum.

The light element member 80 is not limited to aluminum, but may be copper.
Also, for example, the light element member 80 may be a light metal-based material such as aluminum (Al) or titanium (Ti), a ceramic-based material such as silicon carbide (SiC), or a carbon-based material such as pyrolytic graphite. Pyrolytic graphite is a carbon material produced by depositing a hydrocarbon gas on a substrate of graphite or carbon fiber. It is also called pyrolytic graphite or pyrocarbide.
For example, the light element member 80 may be an aluminum alloy or a titanium alloy. At least a portion of the member in the path is not limited to being made of the above-mentioned materials (aluminum, aluminum alloy, titanium, titanium alloy, silicon carbide, pyrolytic graphite, etc.), and may be coated with the above-mentioned materials or a material that at least partially contains the above-mentioned materials.
Furthermore, the light element member 80 may contain an X-ray emitting material as long as it can suppress measurement failures due to suppression of generation of secondary X-rays, which will be described later. For example, when the X-ray emitting material is tungsten, the light element member 80 may contain tungsten. For example, when an alloy containing tungsten and aluminum, which is a light element relative to tungsten, is used, the tungsten content may be 10% by weight. The weight ratio is not limited to this, and may be 5% or 20%. Tungsten or other substances may be contained depending on the degree to which measurement failures should be suppressed.

The light element member 80 includes a first light element member 82, a second light element member 84, and a third light element member 86. The first light element member 82 is provided between the incident path 70 and the exit path 72. Since the end 70B of the incident path 70 and the end 72B of the exit path 72 are connected, it can be said that the first light element member 82 is provided at the connection point between the end 70B of the incident path 70 and the end 72B of the exit path 72. In addition, since the incident path 70 and the exit path 72 are connected and intersect with each other, it can be said that the first light element member 82 is disposed at the portion 78 where the incident path 70 and the exit path 72 intersect.

More specifically, the first light element member 82 has a tube portion 82A and a wall portion 82B. The tube portion 82A is a tubular member that is provided in the incident path 70 and opens from one end 82Aa to the other end 82Ab. The tube portion 82A is provided at the end 70B of the incident path 70 and covers the inner surface of the end 70B of the incident path 70. The tube portion 82A is provided between the insertion member 76 and the space 54C (X-ray emitter 56) and covers the inner surface of the incident path 70 between the insertion member 76 and the space 54C (X-ray emitter 56). In this embodiment, the end 82Aa of the tube portion 82A contacts the end 76B of the insertion member 76. The end 82Ab of the tube portion 82A is located near the surface of the X-ray emitter 56 on the X-ray emitter 56 side (-Z direction side), but it is preferable that it does not contact the surface of the X-ray emitter 56 and is separated from the surface of the X-ray emitter 56.

The wall portion 82B is a plate-like (wall-like) member and extends from the end 82Ab of the tube portion 82A. The wall portion 82B is not provided around the entire circumference of the end 82Ab of the tube portion 82A, but is provided on the emission path 72 side (+Z direction side) of the end 82Ab of the tube portion 82A. The end 82Ba of the wall portion 82B is connected to the emission path 72 side (+Z direction side) of the end 82Ab of the tube portion 82A, and extends from the end 82Ba to the end 82Bb toward the space 54C (X-ray emitter 56), here the -Y direction side. Furthermore, the emission path 72 side (+Z direction side) part of the end 82Ab of the tube portion 82A is located at the part 78 where the entrance path 70 and the emission path 72 intersect. Therefore, it can be said that the wall portion 82B extends from the portion 78 where the incident path 70 and the exit path 72 intersect toward the space 54C (X-ray emitter 56). Therefore, it can be said that the wall portion 82B is provided between the incident path 70 and the exit path 72, and is provided at the portion 78 where the incident path 70 and the exit path 72 intersect, and extends from the portion 78 toward the space 54C (X-ray emitter 56). Since the wall portion 82B is provided at such a position, it overlaps the exit path 72 when viewed from the Z-axis direction, and blocks at least a part of the exit path 72. It can be said that the wall portion 82B is disposed in the path along which the X-rays from the X-ray emitter 56 reach the exit portion 50B.

The extending direction of the tube portion 82A from the end 82Aa to the end 82Ab is along the extending direction of the incident path 70, i.e., along the axis AX1. On the other hand, the extending direction of the wall portion 82B from the end 82Ba to the end 82Bb is preferably inclined with respect to the axis AX1. The wall portion 82B is preferably inclined toward the -Z direction side (the direction from the emission portion 50B to the X-ray emission portion 56) with respect to the axis AX1 as it moves from the end 82Ba to the end 82Bb. However, the extending direction of the wall portion 82B from the end 82Ba to the end 82Bb may also be along the extending direction of the incident path 70, i.e., along the axis AX1. In addition, when the inner peripheral surface of the insertion member 76 is virtually extended along the axis AX1 in the direction along the axis AX1, the space occupied by the inner peripheral surface of the insertion member 76 is referred to as the space AR (see FIG. 6). In this case, it is preferable that the wall portion 82B is located outside the space AR, without entering inside the space AR. In other words, the space AR is the space through which the electron beam E from the electron emitter 52 passes on the incident path 70, and it is preferable that the wall portion 82B is outside the space AR through which the electron beam E from the electron emitter 52 passes on this incident path 70.

In addition, the end 82Bb of the wall portion 82B is located near the surface of the X-ray emitter 56, but it is preferable that it does not contact the surface of the X-ray emitter 56 and is separated from the surface of the X-ray emitter 56.

Thus, the first light element member 82 includes a tube portion 82A and a wall portion 82B, but it is sufficient to include at least one of the tube portion 82A and the wall portion 82B.

The second light element member 84 is provided in the emission path 72. More specifically, the second light element member 84 is a tubular member, and is provided on the inner peripheral surface of the emission path 72, covering the inner peripheral surface of the emission path 72. It is preferable that the second light element member 84 covers the inner peripheral surface of the emission path 72 from the end 72A to the end 72B of the emission path 72. It can also be said that the second light element member 84 is provided from the end 72A of the emission path 72 to the portion 78 where the entrance path 70 and the emission path 72 intersect, and preferably covers the inner peripheral surface of the emission path 72 from the end 72A to the portion 78. The diameter of the second light element member 84 increases toward the end 72A in accordance with the shape of the emission path 72.

The third light element member 86 is provided in the emission path 72. More specifically, the third light element member 86 is a plate-shaped (wall-shaped) member, and is provided at the end 72A of the emission path 72. The third light element member 86 is provided so as to overlap the end 72A of the emission path 72 when viewed from the Z-axis direction, and overlaps the entire area of the end 72A of the emission path 72 when viewed from the Z-axis direction. In other words, the third light element member 86 blocks the emission path 72 when viewed from the Z-axis direction. However, the third light element member 86 is not limited to overlapping the entire area of the emission path 72, and it is sufficient that it overlaps at least a portion of the emission path 72 when viewed from the Z-axis direction.

As shown in FIG. 5, the power supply 60 is connected to the electron source 52B via wiring L1. The housing 50, the electron source housing 52A, and the intermediate electrode 52C are grounded and held at ground potential. The power supply 60 applies a negative voltage (e.g., −225 kV) to the electron source 52B with respect to the intermediate electrode 52C, which is at ground potential. The power supply 62 is connected to the X-ray emitter 56 via wiring L2. The wiring L2 is covered by a wiring storage section 64 inside the housing 50. The power supply 62 applies a positive voltage (e.g., +225 kV) to the X-ray emitter 56 with respect to the intermediate electrode 52C, which is at ground potential. Therefore, the electron source 52B applies a large negative voltage (e.g., −450 kV) with respect to the X-ray emitter 56. The storage section 54 is grounded and held at ground potential. In addition, since the light element member 80 is in contact with the storage section 54, it is grounded through the storage section 54 and is held at ground potential.

By applying a negative voltage to the electron source 52B and passing a separate heating current through the electron source 52B, the electron source 52B is heated and an electron beam E (thermal electrons) is emitted from the tip of the electron source 52B. That is, when a high voltage is applied to the electron source 52B by the power supply 60, the electron source 52B functions as a cathode that emits an electron beam E. As described above, in this embodiment, the cathode uses thermal electrons generated by filament heating, but it may also be a cathode that emits an electron beam E by forming a strong electric field around the cathode without heating the cathode, or a cathode that utilizes the Schottky effect.

7 and 8 are schematic diagrams for explaining the generation of X-rays. The electron beam E emitted from the electron source 52B is accelerated by the potential difference (e.g., 450 kV) between the electron source 52B and the X-ray emitter 56 and moves toward the X-ray emitter 56. That is, the electron beam E emitted from the electron source 52B is focused by an electron optical member (not shown) provided in the electron emitter 52, and passes through the opening 52D of the intermediate electrode 52C and the space SP of the housing 50, as shown in FIG. 5, and enters the entrance path 70 of the storage unit 54. As shown in FIG. 7, the electron beam E enters the entrance path 70 from the end 70A of the entrance path 70, passes through the entrance path 70, and is irradiated onto the surface of the X-ray emitter 56. The X-ray emitter 56 generates X-rays XL in the +Z direction by being irradiated with the electron beam E. The X-rays XL generated by the X-ray emitter 56 enter the emission path 72 from the end 72B of the emission path 72, travel through the emission path 72, exit from the end 72A of the emission path 72 to the outside of the storage unit 54, i.e., the space SP of the housing 50, and are emitted from the emission unit 50B through the space SP to the outside of the housing 50 as shown in FIG. 5. The X-rays XL emitted from the X-ray emitter 56 are in the form of a cone-shaped, so-called cone beam. The traveling direction of the electron beam E irradiated to the X-ray emitter 56 is along the axis AX1, and the traveling direction of the X-rays XL emitted from the X-ray emitter 56 is along the axis AX2. Therefore, in this embodiment, the traveling direction of the electron beam E incident on the X-ray emitter 56 is different from the traveling direction of the X-rays XL emitted from the X-ray emitter 56.

Here, the X-ray emitter 56 may reflect a part of the irradiated electron beam E. The reflected electron beam E collides with the inner circumferential surface of the storage section 54, etc., and X-rays are generated from the storage section 54. The electron beam E may also be reflected by the storage section 54, and the reflected electron beam E may collides with other parts of the storage section 54 or the X-ray emitter 56, generating X-rays from there as well. Hereinafter, the X-rays XL emitted from the X-ray emitter 56, passing through the emission section 50B and the measured object S to reach the detector 5 are referred to as primary X-rays, and X-rays other than the primary X-rays are referred to as secondary X-rays. In other words, secondary X-rays can also be referred to as scattered light, and include X-rays generated by the electron beam E reflected by the X-ray emitter 56 or the storage section 54. Such secondary X-rays may reach the detector 5 through the emission section 50B. Furthermore, since the X-ray generating section has a large spread, the secondary X-rays may reach the detector 5 without passing through the measured object S, for example. In addition to the primary X-rays that have passed through the measured object S, the detector 5 also detects the secondary X-rays that have not passed through the measured object S and have reached the detector 5, which may cause errors in the detection of the measured object S. Therefore, in order to prevent a decrease in the inspection accuracy of the measured object S, it is effective to prevent the secondary X-rays from reaching the detector 5.

Furthermore, when the reflected electron beam E heads toward the emission unit 50B, the electron beam E hits, for example, the inner peripheral surface of the emission path 72, and secondary X-rays are generated from the inner peripheral surface of the emission path 72 toward the emission unit 50B, i.e., the detector 5. Therefore, in order to prevent the secondary X-rays from reaching the detector 5, it is important to prevent the electron beam E headed toward the emission unit 50B from hitting the inner peripheral surface of the emission path 72. The X-ray generating device 2 according to this embodiment absorbs the electron beam E headed toward the emission unit 50B with the light element member 80, thereby suppressing the generation of secondary X-rays that reach the detector 5. That is, since the light element member 80 has a smaller atomic number than the X-ray emitter 56, even if the electron beam E is irradiated, it can absorb the electron beam E without generating X-rays. Furthermore, the light element member 80 is disposed in the path along which the X-rays from the X-ray emitter 56 reach the emission unit 50B. Therefore, the light element member 80 can receive and absorb the electron beam E headed toward the emission unit 50B. Therefore, the X-ray generating device 2 according to this embodiment can absorb the electron beam E that causes the secondary X-rays to reach the detector 5, thereby preventing the secondary X-rays from reaching the detector 5.

Furthermore, the light element member 80 includes a first light element member 82 arranged between the incident path 70 and the exit path 72. The first light element member 82 is arranged between the incident path 70 and the exit path 72, thereby blocking at least a portion of the exit path 72. Therefore, the X-ray generating device 2 is capable of absorbing the electron beam E toward the exit path 72, i.e., the electron beam E toward the exit portion 50B, with the first light element member 82, and is capable of suppressing secondary X-rays from reaching the detector 5. Furthermore, the wall portion 82B of the first light element member 82 is inclined toward the -Z direction side (the direction from the exit portion 50B toward the X-ray emitter 56) with respect to the axis AX1 as it approaches the end portion 82Bb. Therefore, for example, even if the light element member 80 reflects a portion of the irradiated electron beam E1 (see FIG. 7), it is possible to direct the reflected electron beam E2 (see FIG. 7) toward the incident path 70, and it is possible to prevent the reflected electron beam E2 from being irradiated to the X-ray emitter 56 and generating secondary X-rays from the X-ray emitter 56.

Furthermore, the first light element member 82 of the light element member 80 has a tube portion 82A arranged in the incident path 70. By providing the tube portion 82A in the incident path 70, the electron beam E1 irradiated toward the inner circumferential surface of the incident path 70 can be absorbed by the tube portion 82A, and secondary X-rays can be prevented from being generated from the inner circumferential surface of the incident path 70.

Furthermore, the light element member 80 includes a second light element member 84 provided on the inner circumferential surface of the emission path 72. Therefore, according to the X-ray generating device 2 of this embodiment, as shown in FIG. 8, it is possible to absorb the electron beam E1 irradiated toward the inner circumferential surface of the emission path 72, suppress the emission of secondary X-rays from the inner circumferential surface of the emission path 72, and suppress the secondary X-rays from reaching the detector 5. Furthermore, the light element member 80 includes a third light element member 86 provided at the end 72A of the emission path 72. Therefore, according to the X-ray generating device 2 of this embodiment, as shown in FIG. 8, it is possible to absorb the electron beam E1 emitted from the emission path 72.

The light element member 80 may include at least one of the first light element member 82, the second light element member 84, and the third light element member 86; in other words, it may be disposed in the path along which the X-rays from the X-ray emitter 56 reach the emission unit 50B. By disposing the light element member 80 in the path along which the X-rays from the X-ray emitter 56 reach the emission unit 50B, the electron beam E that causes the secondary X-rays to reach the detector 5 can be absorbed, thereby preventing the secondary X-rays from reaching the detector 5.

The calculation results of the intensity of the X-rays reaching the detector 5 by simulation are described below. FIG. 9 is a diagram for explaining the calculation results of the intensity of the X-rays reaching the detector by simulation. As a simulation, a Monte Carlo simulator was used to calculate a two-dimensional distribution of the intensity of the X-rays in the XY plane at the Z coordinate where the axis AX1 and the X-ray emitter 56 intersect. The image P in FIG. 9 shows an example of the simulation result of the intensity distribution of the X-rays in the XY plane at the Z coordinate where the axis AX1 and the X-ray emitter 56 intersect, calculated from the information on the X-rays reaching the detector 5. The center C of the image P indicates the center point of the X-rays, for example, the position where the axis AX2 overlaps. As described above, the secondary X-rays have a larger spread of the X-ray generating portion than the primary X-rays. Therefore, as shown in the image P, when the secondary X-rays reach the detector 5, the detector 5 detects the image Pb of the secondary X-rays that is located outside the image Pa in the radial direction in addition to the image Pa of the primary X-rays that converges near the center C. If the light element member 80 is not provided, the secondary X-rays cannot be prevented from reaching the detector 5, and the ratio of the intensity of the secondary X-rays (brightness of image Pb) to the intensity of the primary X-rays (brightness of image Pa) becomes high.

Figure 10 is a graph illustrating the results of a simulation calculation of the intensity of X-rays reaching the detector. The horizontal axis of Figure 10 indicates the distance from the center C in the XY plane in the Z coordinate where the axis AX1 and the X-ray emitter 56 intersect, and the vertical axis indicates the intensity ratio of X-rays. That is, Figure 10 shows the integrated value of the ratio of X-ray intensity for each distance from the center C to the total value of the intensity of X-rays in the entire XY plane. Since the primary X-rays converge closer to the center C than the secondary X-rays, the more the secondary X-rays are suppressed from reaching the detector 5, i.e., the smaller the ratio of the intensity of the secondary X-rays, the higher the integrated value of the ratio of X-ray intensity becomes on the side closer to the center C. Conversely, if the secondary X-rays are not suppressed from reaching the detector 5, the integrated value of the ratio of X-ray intensity becomes lower on the side closer to the center C. Line D in FIG. 10 shows the X-ray intensity ratio when the light element member 80 is provided as in this embodiment, and line DX in FIG. 10 shows the X-ray intensity ratio when the light element member 80 is not provided as a comparative example. As shown by line D, when the light element member 80 is provided, the integrated value of the X-ray intensity ratio is higher on the side closer to the center C than line DX when the light element member 80 is not provided. In other words, the simulation shows that providing the light element member 80 suppresses the secondary X-rays from reaching the detector 5.

As described above, the X-ray generating device 2 according to this embodiment has an electron emitting portion 52 that emits electrons (electron beam E), an X-ray emitting portion 56 that is irradiated with electrons from the electron emitting portion 52 and emits X-rays, a housing 50 having an emission portion 50B from which X-rays are emitted from the X-ray emitting portion 56, and a light element member 80. The light element member 80 is disposed in the emission path 72 through which X-rays from the X-ray emitting portion 56 reach the emission portion 50B, and at least partly contains an element having a smaller atomic number than the X-ray emitting portion 50B. The X-ray generating device 2 according to this embodiment absorbs the electron beam E that causes secondary X-rays to reach the detector 5 and suppresses the secondary X-rays from reaching the detector 5 by disposing the light element member 80 in the path through which X-rays from the X-ray emitting portion 56 reach the emission portion 50B. Therefore, according to the X-ray generating device 2 according to this embodiment, it is possible to suppress a decrease in the inspection accuracy of the measured object S.

The X-ray generating device 2 also includes a storage section 54 that stores the X-ray emitter 56, an emission path 72 is formed within the storage section 54, and a light element member 80 is disposed in the emission path 72. By providing the emission path 72 within the storage section 54, the X-ray generating device 2 according to this embodiment can appropriately dispose the light element member 80 in the emission path 72.

In addition, the light element member 80 (second light element member 82) is disposed on the inner circumferential surface of the emission path 72. By providing the light element member 80 on the emission path 72, the electron beam E irradiated toward the inner circumferential surface of the emission path 72 can be absorbed, thereby suppressing the generation of secondary X-rays.

The inner diameter of the emission path 72 also increases as it approaches the emission section 50B. By increasing the inner diameter of the emission path 72 toward the emission section 50B in this manner, the X-rays XL, which are a cone beam, can be appropriately guided to the emission section 50B.

In addition, the X-ray generating device 2 has an incident path 70 formed in the storage section 54 through which electrons (electron beam E) from the X-ray emitter 56 reach the X-ray emitter 56. The light element member 80 is provided between the incident path 70 and the exit path 72. By providing the light element member 80 between the incident path 70 and the exit path 72, the X-ray generating device 2 according to this embodiment is able to absorb the electron beam E heading toward the exit section 50B, and is able to prevent secondary X-rays from reaching the detector 5.

In addition, in the X-ray generating device 2, a light element member 80 is disposed at a portion 78 where the entrance path 70 and the exit path 72 intersect. By disposing the light element member 80 at the intersecting portion 78, it becomes possible to absorb the electron beam E heading toward the exit section 50B, and it becomes possible to prevent the secondary X-rays from reaching the detector 5.

The X-ray generating device 2 also includes an incident path 70 arranged in the housing 50, through which electrons from the electron emitter 52 reach the X-ray emitter 56, and an exit path 72 arranged in the housing 50, through which X-rays from the X-ray emitter 56 reach the exit unit 50B. A light element member 80 (first light element member 82) is provided between the incident path 70 and the exit path 72. By providing the light element member 80 between the incident path 70 and the exit path 72, the X-ray generating device 2 according to this embodiment is able to absorb the electron beam E heading toward the exit unit 50B, and is able to prevent secondary X-rays from reaching the detector 5.

In addition, the incident path 70 and the exit path 72 intersect, and the light element member 80 (first light element member 82) is arranged along the extension direction (axis AX1) of the incident path 70. By arranging the light element member 80 along the axis AX1, even if the electron beam E is reflected from the light element member 80, the reflected electron beam E is prevented from being irradiated onto the electron emission section 52, thereby suppressing the generation of secondary X-rays.

The light element member 80 (the tube portion 82A of the first light element member 82) is provided in the incident path 70. By providing the light element member 80 in the incident path 70, the electron beam E irradiated toward the inner peripheral surface of the incident path 70 can be absorbed, thereby suppressing the generation of secondary X-rays.

The light element member 80 is a conductive member and is electrically grounded. By being grounded, the light element member 80 is prevented from becoming charged even when irradiated with the electron beam E. It is also preferable that the light element member 80 is made of a material that emits a small amount of gas in a vacuum state.

The housing 50 also maintains a reduced pressure or vacuum inside. By maintaining a reduced pressure or vacuum inside the housing 50, X-rays XL can be generated appropriately.

The inspection device 100 according to this embodiment also includes an X-ray generator 2, a stage 9 that holds a measurement object S that is irradiated with X-rays XL emitted from the emission unit 50B, and a detector 5 that detects the X-rays XL that are irradiated and transmitted through the measurement object S. The inspection device 100 uses the X-ray generator 2 to prevent secondary X-rays from reaching the detector 5, thereby preventing a decrease in the inspection accuracy of the measurement object S to be measured.

The shape of the X-ray emitter 56 is not limited to that described above. FIG. 11 is a schematic cross-sectional view showing another example of an X-ray generating device. The X-ray emitter 56 shown in FIG. 5 is cylindrical and does not rotate, but as shown in X-ray emitter 56a in FIG. 11, it may be non-cylindrical and rotate. For example, the X-ray emitter 56a in FIG. 11 is truncated cone shaped and rotates around the central axis of the truncated cone. The X-ray emitter 56a is irradiated with an electron beam E on the side of the truncated cone, generating X-rays XL from the side.

In the above embodiment, the inspection device 100 performs processing using one device, but multiple devices may be combined. FIG. 12 is a schematic diagram showing the configuration of a system having an inspection device. Next, a manufacturing system 300 having an inspection device will be described using FIG. 12. The manufacturing system 300 has an inspection device 100, multiple (two in FIG. 12) inspection devices 100a, and a program creation device 302. The inspection devices 100, 100a, and the program creation device 302 are connected by wired or wireless communication lines. The inspection device 100a has the same configuration as the inspection device 100. The program creation device 302 creates various settings and programs to be created by the control device of the above-mentioned inspection device 100. The program creation device 302 outputs the created programs and data to the inspection devices 100, 100a. The inspection device 100a acquires area and range information and inspection programs from the inspection device 100 and the program creation device 302, and performs processing using the acquired data and programs. The manufacturing system 300 can effectively utilize the created data and programs by performing inspections with the inspection device 100a using the data and programs created by the inspection device 100 and the program creation device 302.

Next, a manufacturing system equipped with the above-mentioned inspection device will be described with reference to FIG. 13. FIG. 13 is a block diagram of the manufacturing system. The manufacturing system 200 of this embodiment includes the inspection device 100 described in the above embodiment, a design device 202, a molding device 203, a control device 204, and a repair device 205. The control device 204 includes an internal structure memory unit 210 and a judgment unit 211.

The design device 202 creates design information regarding the shape and composition of the measurement object S, and transmits the created design information to the molding device 203. The design device 202 also stores the created design information in the internal structure memory unit 210 of the control device 204.

The molding device 203 creates a measurement object S based on the design information input from the design device 202. The inspection device 100 inspects the internal structure of the created measurement object S and transmits the inspection results (e.g., image data) to the control device 204.

The internal structure memory unit 210 of the control device 204 stores the design information. The judgment unit 211 of the control device 204 reads out the design information from the internal structure memory unit 210. The judgment unit 211 compares the measurement result of the shape of the measured object S received from the inspection device 100 with the design information read out from the internal structure memory unit 210. The judgment unit 211 judges whether the measured object S has been formed according to the design information based on the comparison result. In other words, the judgment unit 211 judges whether the created measured object S is a good product. If the measured object S is not formed according to the design information, the judgment unit 211 judges whether the measured object S can be repaired. If the measured object S can be repaired, the judgment unit 211 calculates the defective part and the repair content based on the comparison result, and transmits information indicating the defective part and information indicating the repair content to the repair device 205.

The repair device 205 repairs the defective parts of the structure based on the information indicating the defective parts and the information indicating the repair contents received from the control device 204.

Figure 14 is a flowchart showing the flow of processing by the manufacturing system. In the manufacturing system 200, the design device 202 first creates design information for the measured object S (step S101). Next, the molding device 203 creates the measured object S based on the design information (step S102). Next, the inspection device 100 inspects (measures) the shape of the created measured object S (step S103). Next, the judgment unit 211 of the control device 204 compares the inspection results obtained by the inspection device 100 with the above design information to inspect whether the measured object S was created according to the design information (step S104).

Next, the judgment unit 211 of the control device 204 judges whether the created measured object S is a non-defective product (step S105). If the judgment unit 211 judges that the created measured object S is a non-defective product (Yes in step S105), the manufacturing system 200 ends the process. If the judgment unit 211 judges that the created measured object S is not a non-defective product (No in step S105), the judgment unit 211 judges whether the created measured object S can be repaired (step S106).

When the judgment unit 211 judges that the created measured object S can be repaired (Yes in step S106), the repair device 205 repairs the measured object S (step S107) and the manufacturing system 200 returns to the processing of step S103. When the judgment unit 211 judges that the created measured object S cannot be repaired (No in step S106), the manufacturing system 200 ends the processing and collects the defective product. With this, the manufacturing system 200 ends the processing of the flowchart shown in FIG. 14.

The manufacturing system 200 of this embodiment can determine whether the created measured object S is a non-defective product because the inspection device 100 in the above embodiment can inspect the internal structure of the measured object S with high accuracy. Furthermore, the manufacturing system 200 can repair the measured object S if it is not a non-defective product.

The repair process performed by the repair device 205 in this embodiment may be replaced with a process in which the molding device 203 re-executes the molding process. In that case, if the judgment unit 211 of the control device 204 determines that the product can be repaired, the molding device 203 re-executes the molding process.

Although the preferred embodiment of the present invention has been described above with reference to the attached drawings, it goes without saying that the present invention is not limited to the examples. The shapes and combinations of the components shown in the above examples are merely examples, and various modifications can be made based on design requirements, etc., without departing from the spirit of the present invention. The components of the above embodiments can be combined as appropriate. In addition, some components may not be used. In addition, to the extent permitted by law, the disclosures of all published patent applications relating to the inspection devices, etc. cited in the above embodiments are incorporated by reference and made part of the description in this text. All other embodiments and operational techniques, etc. made by those skilled in the art based on the above embodiments are included in the scope of this embodiment.

REFERENCE SIGNS LIST 1 Measuring device 2 X-ray generating device 5 Detector 50 Housing 50B Emission section 52 Electron emission section 54 Storage section 56 X-ray emission section 54C Space 70 Incident path 72 Emission path 80 Light element member (member)
82 First light element member 82A Tube portion 82B Wall portion 84 Second light element member 86 Third light element member 100 Inspection device E Electron beam S Measurement object XL X-ray

Claims (14)

an electron emitting portion that emits electrons;
an X-ray emitting portion that emits X-rays when irradiated with electrons from the electron emitting portion;
a housing section for housing the X-ray emitter;
a housing having an emission unit through which X-rays are emitted from the X-ray emission unit;
an incident path through which electrons from the electron emitter reach the X-ray emitter is formed in the storage section, and a member is provided on an inner circumferential surface of the incident path ;
The storage section and the member are different members,
An X-ray generating device, wherein the member at least partially contains an element having an atomic number smaller than that of the X-ray emitting portion. The X-ray generating device according to claim 1 , wherein the member is also disposed between the X-ray emitting portion and the X-ray exiting portion. 3. The X-ray generating device according to claim 2, wherein an exit path through which X-rays from the X-ray emission part reach the exit part is formed within the storage part, and the member is disposed between the entrance path and the exit path . The X-ray generating device according to claim 3 , wherein the member blocks at least a portion of the emission path. The X-ray generating device according to claim 3 , wherein the member is also disposed at a portion where the entrance path and the exit path intersect. The X-ray generating device according to any one of claims 3 to 5, wherein the member is disposed on an inner circumferential surface of the emission path. 7. The X-ray generating device according to claim 1, wherein the container is a member that emits X-rays when irradiated with the electrons. 8. The X-ray generating device according to claim 1, wherein the member is a conductive member. 9. The X-ray generating device according to claim 1, wherein the inside of the housing is maintained at a reduced pressure or a vacuum. An X-ray generating device according to any one of claims 1 to 9,
a stage for holding a measurement object to be irradiated with X-rays emitted from the emission unit;
and a detector for detecting X-rays irradiated onto and transmitted through the object. A design process for creating design information regarding the shape of a structure;
a forming process for forming the structure based on the design information;
a measuring step of measuring a shape of the fabricated structure by using the X-ray apparatus according to claim 10;
and an inspection step of comparing the shape information obtained in the measurement step with the design information. The method for manufacturing a structure according to claim 11, further comprising a repair step, which is executed based on a comparison result of the inspection step, and which reworks the structure. The method for manufacturing a structure according to claim 12 , wherein the repair step is a step of repeating the molding step. A design device that creates design information regarding the shape of a structure;
a forming device that produces the structure based on the design information;
The X-ray apparatus according to claim 10, which measures the shape of the fabricated structure;
and an inspection device that compares shape information regarding the shape of the structure obtained by the X-ray device with the design information.

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