JP7576404B2 - Substrate cleaning apparatus and substrate cleaning method - Google Patents

Description

The present invention relates to a substrate cleaning device and a substrate cleaning method.

Substrate processing equipment is used to perform various processes on various substrates, such as semiconductor substrates (wafers), substrates for liquid crystal displays, substrates for plasma displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, and substrates for photomasks. Substrate cleaning equipment is used to clean substrates.

The substrate cleaning devices described in Patent Documents 1 to 4 include two suction pads that hold the peripheral edge of the back surface of the wafer, a spin chuck that holds the central part of the back surface of the wafer, and a brush that cleans the back surface of the wafer. The two suction pads hold the wafer and move laterally. In this state, the central part of the back surface of the wafer is cleaned with the brushes. The spin chuck then receives the wafer from the suction pads, and rotates while holding the central part of the back surface of the wafer. In this state, the peripheral edge of the back surface of the wafer is cleaned with the brushes.

Patent No. 4983565 Patent No. 5136103 Patent No. 5348277 Patent No. 5641110

There is a need for a substrate cleaning apparatus and method that can more reliably clean the underside of a substrate.

The object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method that can more reliably clean the underside of a substrate.

(1) The substrate cleaning device according to the first invention includes a rotary holder that rotates while holding a central portion of the underside of the substrate, first and second linear holders that respectively hold first and second regions facing each other on the peripheral portion of the underside of the substrate and move back and forth in a direction parallel to the first direction, and an underside cleaner that cleans the central portion of the underside of the substrate when the substrate is held by the first and second linear holders and cleans the peripheral portion of the underside of the substrate when the substrate is held and rotated by the rotary holder. The underside cleaner includes a cleaner holder that can rotate in one direction and in the opposite direction around a vertical axis, a cleaner that is provided on the cleaner holder and can rotate around the vertical axis and contact the underside of the substrate, and first and second discharge nozzles that are provided on the cleaner holder and can each discharge a cleaning liquid upward, the first discharge nozzle being disposed adjacent to the cleaner in one direction of rotation, and the second discharge nozzle being disposed adjacent to the cleaner in the opposite direction of rotation.

In the substrate cleaning device, first and second opposing regions of the peripheral edge of the underside of the substrate are held by the first and second linear motion holding parts. In this state, the central part of the underside of the substrate is cleaned by the underside cleaner. At this time, the cleaning tool rotates while in contact with the underside of the substrate, and the cleaning tool holding part can rotate in one direction and the opposite direction. This allows the central part of the underside of the substrate to be cleaned reliably. In addition, cleaning liquid can be discharged onto the underside of the substrate from at least one of the first and second discharge nozzles arranged adjacent to the cleaning tool in the direction of rotation of the cleaning tool holding part. This allows the underside of the substrate to be cleaned more reliably.

(2) The substrate cleaning apparatus may further include a liquid supply unit that supplies cleaning liquid to the first and second discharge nozzles to cause the cleaning liquid to be discharged from the first and second discharge nozzles, respectively, and a control unit that controls the operation of the liquid supply unit so that the cleaning liquid is discharged from at least the first discharge nozzle of the first and second discharge nozzles when the cleaning tool holding unit rotates in one direction, and so that the cleaning liquid is discharged from at least the second discharge nozzle of the first and second discharge nozzles when the cleaning tool holding unit rotates in the opposite direction.

In this case, when the cleaning tool holder rotates in one direction and then in the opposite direction with the cleaning tool in contact with the underside of the substrate, the cleaning liquid is supplied first to the portion of the underside of the substrate that the cleaning tool will come into contact with. This allows contaminants adhering to the underside of the substrate to be smoothly peeled off by the cleaning tool. Therefore, the underside of the substrate can be cleaned smoothly and reliably.

(3) The control unit may control the operation of the liquid supply unit so that cleaning liquid is ejected from the first and second ejection nozzles when the cleaning tool holding unit rotates in one direction, and so that cleaning liquid is ejected from the first and second ejection nozzles when the cleaning tool holding unit rotates in the opposite direction.

In this case, when the cleaning tool holder rotates in one direction and then the opposite direction with the cleaning tool in contact with the underside of the substrate, the cleaning liquid is supplied first to the portion of the underside of the substrate that the cleaning tool will come into contact with. This allows contaminants adhering to the underside of the substrate to be smoothly peeled off from the substrate. Also, the cleaning liquid is supplied to the portion of the underside of the substrate that has been cleaned by the cleaning tool. This allows contaminants that have been peeled off from the substrate to be smoothly washed off from the substrate. This further improves the cleanliness of the underside of the substrate after cleaning.

(4) The substrate cleaning apparatus may further include a dryer that dries the underside of the substrate held by the first and second linear holding units, and the control unit may further control the operation of the first linear holding unit, the second linear holding unit, the underside cleaner, and the dryer such that the underside of the substrate held by the underside cleaner is cleaned while the substrate is held by the first and second linear holding units and moved in one direction parallel to the first direction, and the underside of the substrate held by the dryer is dried while the substrate is held by the first and second linear holding units and moved in a direction opposite to the one direction parallel to the first direction.

In this case, the first and second linear holding parts hold first and second regions facing each other on the peripheral edge of the underside of the substrate. In this state, the central part of the underside of the substrate moving in one direction parallel to the first direction is cleaned by the underside cleaner. Also, the underside of the substrate moving in the opposite direction to the one direction parallel to the first direction is dried by the dryer. Therefore, since the central part of the underside of the substrate is dried after being cleaned, the peripheral edge of the underside of the substrate can be cleaned while the substrate after the central part of the underside is securely held by the rotating holding part.

(5) The substrate cleaning apparatus may further include a gas ejector that ejects gas upward to surround the rotating holder, and an ejector drive unit that raises and lowers the gas ejector relative to the rotating holder.

In this case, when the substrate is not held by the rotating holder, the gas ejector can eject gas upward so as to surround the rotating holder. This prevents droplets of cleaning liquid from adhering to the rotating holder. Also, when the substrate is held and moved by the first and second linear holders, the gas ejector can eject gas upward in a state close to the underside of the substrate. This allows the underside of the substrate to be dried after cleaning. Therefore, the central portion of the underside of the substrate can be securely held by the rotating holder.

(6) The substrate cleaning apparatus may further include a casing having a side wall portion, an upper plate portion, and a bottom plate portion that form an internal space, and the rotating holder, the first linear holder, the second linear holder, and the bottom cleaner are provided in the internal space of the casing, and the upper plate portion may have an upper opening that includes an area above the substrate held by the rotating holder and an area above the substrate moved by the first and second linear holders.

In this case, when the substrate is held by the first and second linear holders inside the casing, the center of the substrate's underside is cleaned by the underside cleaner. Also, when the substrate is held and rotated by the rotary holder inside the casing, the peripheral edge of the substrate's underside is cleaned by the underside cleaner. At this time, the casing acts as a splash prevention member to prevent the cleaning liquid from splashing. Because the casing does not move, a mechanism for moving the splash prevention member is not required.

Furthermore, an upper opening is formed in the upper plate portion so as to include the area above the substrate held by the rotating holder and the area above the substrate moved by the first and second linear holders, thereby preventing droplets of cleaning liquid adhering to the upper plate portion from falling onto the substrate.

(7) The underside cleaner further includes a fixed part that is fixed to the bottom plate part in the internal space of the casing, a rotating part that is rotatable around an axis vertical to the fixed part in the internal space of the casing, and a cleaner drive part configured to rotate the rotating part relative to the fixed part and move the rotating part up and down relative to the fixed part, and the cleaner holder may be integrally provided on the rotating part.

In this case, there is no need to provide a structure for moving the cleaning tool held in the cleaning tool holder outside the casing, which acts as a splash prevention member. All of the structure for moving the cleaning tool that cleans the underside of the substrate is provided inside the casing, which prevents the structure and assembly work of the substrate cleaning device from becoming too complicated.

(8) A substrate cleaning method according to a second aspect of the present invention includes the steps of holding first and second opposing regions of the peripheral edge of the underside of the substrate with first and second linear holding parts, respectively, and reciprocating the substrate in a direction parallel to the first direction; cleaning the central portion of the underside of the substrate with a bottom cleaner while the substrate is being held by the first and second linear holding parts; holding the central portion of the underside of the substrate with a rotary holding part and rotating the substrate; and cleaning the peripheral edge of the underside of the substrate with the bottom cleaner while the substrate is being rotated by the rotary holding part. The step of cleaning the central portion of the underside of the substrate includes contacting the underside of the substrate with a cleaning tool provided on a cleaning tool holder of the underside cleaner, rotating the cleaning tool holder in one direction and in the opposite direction around a vertical axis while the cleaning tool is in contact with the underside of the substrate, discharging the cleaning liquid onto the underside of the substrate from a first discharge nozzle provided on the cleaning tool holder so as to be adjacent to the cleaning tool in one direction of the rotation, and discharging the cleaning liquid onto the underside of the substrate from a second discharge nozzle provided on the cleaning tool holder so as to be adjacent to the cleaning tool in the opposite direction of the rotation.

In the substrate cleaning method, first and second opposing regions of the peripheral underside of the substrate are held by first and second linear holding parts. In this state, the substrate held by the first and second linear holding parts is reciprocated in a direction parallel to the first direction, and the central portion of the substrate's lower surface is cleaned by the lower surface cleaner. In addition, the central portion of the substrate's lower surface is held and rotated by the rotating holding part. In this state, the peripheral underside of the substrate rotated by the rotating holding part is cleaned by the lower surface cleaner.

According to the above substrate cleaning method, when the cleaning tool holder rotates in one direction and in the opposite direction to clean the central portion of the underside of the substrate, cleaning liquid can be discharged from at least one of the first and second discharge nozzles onto the underside of the substrate. This makes it possible to more reliably clean the underside of the substrate.

(9) The step of cleaning the central portion of the underside of the substrate may include discharging cleaning liquid from at least a first discharge nozzle of the first and second discharge nozzles when the cleaning tool holding part rotates in one direction, and discharging cleaning liquid from at least a second discharge nozzle of the first and second discharge nozzles when the cleaning tool holding part rotates in the opposite direction.

In this case, when the cleaning tool holder rotates in one direction and then in the opposite direction with the cleaning tool in contact with the underside of the substrate, the cleaning liquid is supplied first to the portion of the underside of the substrate that the cleaning tool will come into contact with. This allows contaminants adhering to the underside of the substrate to be smoothly peeled off by the cleaning tool. Therefore, the underside of the substrate can be cleaned smoothly and reliably.

(10) Discharging the cleaning liquid from at least the first discharge nozzle may include discharging the cleaning liquid from the first and second discharge nozzles when the cleaning tool holding part rotates in one direction, and discharging the cleaning liquid from at least the second discharge nozzle may include discharging the cleaning liquid from the first and second discharge nozzles when the cleaning tool holding part rotates in the opposite direction.

In this case, when the cleaning tool holder rotates in one direction and then the opposite direction with the cleaning tool in contact with the underside of the substrate, the cleaning liquid is supplied first to the portion of the underside of the substrate that the cleaning tool will come into contact with. This allows contaminants adhering to the underside of the substrate to be smoothly peeled off from the substrate. Also, the cleaning liquid is supplied to the portion of the underside of the substrate that has been cleaned by the cleaning tool. This allows contaminants that have been peeled off from the substrate to be smoothly washed off from the substrate. This further improves the cleanliness of the underside of the substrate after cleaning.

(11) The step of cleaning the central portion of the underside of the substrate includes cleaning the underside of the substrate with a underside cleaner when the substrate is moved in a direction parallel to the first direction by the first and second linear holding parts, and the substrate cleaning method may further include a step of drying the underside of the substrate with a dryer when the substrate is moved in a direction opposite to the direction parallel to the first direction by the first and second linear holding parts.

In this case, the central portion of the underside of the substrate moving in one direction parallel to the first direction is cleaned by the underside cleaner. Also, the underside of the substrate moving in the opposite direction to the one direction parallel to the first direction is dried by the dryer. Therefore, since the central portion of the underside of the substrate is dried after being cleaned, the peripheral portion of the underside of the substrate can be cleaned while the substrate after the central portion of the underside is securely held by the rotating holder.

(12) The substrate cleaning method may further include a step of using a gas ejector to eject gas upward to surround the rotating holder when the substrate is moved in a direction parallel to the first direction by the first and second linear holders, and a step of raising the gas ejector before or when the substrate is moved in the reverse direction by the first and second linear holders.

In this case, when the substrate is not held by the rotating holder, the gas ejector can eject gas upward so as to surround the rotating holder. This prevents droplets of cleaning liquid from adhering to the rotating holder. Also, when the substrate is held and moved by the first and second linear holders, the gas ejector can eject gas upward in a state close to the underside of the substrate. This allows the underside of the substrate to be dried after cleaning. Therefore, the central portion of the underside of the substrate can be securely held by the rotating holder.

(13) The method for cleaning a substrate may further include a step of carrying a substrate into an internal space of a casing having an upper plate portion, a side wall portion, and a bottom plate portion, the upper plate portion having an upper opening including an area above the substrate held by the rotary holder and an area above the substrate moved by the first and second linear holders, the step of reciprocating the substrate includes reciprocating the substrate by the first and second linear holders in the internal space of the casing, the step of cleaning the central portion of the underside of the substrate includes cleaning the central portion of the underside of the substrate by a bottom cleaner in the internal space of the casing, the step of holding and rotating the substrate includes holding and rotating the central portion of the underside of the substrate by the rotary holder in the internal space of the casing, and the step of cleaning the peripheral portion of the underside of the substrate may include cleaning the peripheral portion of the underside of the substrate by a bottom cleaner in the internal space of the casing.

In this case, when the substrate is held by the first and second linear holders inside the casing, the center of the substrate's underside is cleaned by the underside cleaner. Also, when the substrate is held and rotated by the rotary holder inside the casing, the peripheral edge of the substrate's underside is cleaned by the underside cleaner. At this time, the casing acts as a splash prevention member to prevent the cleaning liquid from splashing. Because the casing does not move, a mechanism for moving the splash prevention member is not required.

Furthermore, an upper opening is formed in the upper plate portion so as to include the area above the substrate held by the rotating holder and the area above the substrate moved by the first and second linear holders, thereby preventing droplets of cleaning liquid adhering to the upper plate portion from falling onto the substrate.

(14) Bringing the cleaning tool provided in the cleaning tool holder into contact with the underside of the substrate includes raising the cleaning tool in the cleaning tool holder by moving a rotating part upward relative to a fixed part provided in the bottom plate part in the internal space of the casing, and rotating the cleaning tool holder in one direction and in the opposite direction around a vertical axis may include rotating a rotating part with which the cleaning tool holder is integrally provided, around a vertical axis relative to the fixed part, thereby rotating the cleaning tool holder in one direction and in the opposite direction.

In this case, there is no need to provide a structure for moving the cleaning tool held in the cleaning tool holder outside the casing that acts as a splash prevention member. All of the structure for moving the cleaning tool that cleans the underside of the substrate is provided inside the casing, which prevents the structure and assembly work of the device for cleaning the underside of the substrate from becoming too complicated.

The present invention provides a substrate cleaning apparatus and a substrate cleaning method that can more reliably clean the underside of a substrate.

1 is a perspective view of a substrate cleaning apparatus according to a first embodiment; FIG. 2 is a plan view of the substrate cleaning apparatus of FIG. 3 is a cross-sectional view of the substrate cleaning apparatus shown in FIG. 2 taken along line AA. 3 is a cross-sectional view of the substrate cleaning apparatus shown in FIG. 2 along line BB. FIG. 2 is a cross-sectional view of a gas ejector. FIG. 6 is a plan view of the gas ejector of FIG. 5 . FIG. 2 is a schematic diagram showing the formation of a cylindrical gas curtain by a gas ejector. 4 is an enlarged plan view of a portion including one suction pad of the suction arm. FIG. FIG. 9 is an enlarged perspective view of a portion including the suction pad of FIG. 8 . FIG. FIG. FIG. 2 is a schematic cross-sectional view of a linear chuck. FIG. 2 is a schematic cross-sectional view of a linear chuck. FIG. 2 is a schematic diagram showing the configuration of a main part of the underside cleaner. 2 is a block diagram showing a configuration of a control system of the substrate cleaning apparatus according to the present embodiment. FIG. 5 is a flowchart showing an example of the operation of the substrate cleaning apparatus according to the present embodiment. 5 is a flowchart showing an example of the operation of the substrate cleaning apparatus according to the present embodiment. 5 is a flowchart showing an example of the operation of the substrate cleaning apparatus according to the present embodiment. 5 is a flowchart showing an example of the operation of the substrate cleaning apparatus according to the present embodiment. 5A and 5B are schematic diagrams for explaining the operation of the substrate cleaning apparatus. 5A and 5B are schematic diagrams for explaining the operation of the substrate cleaning apparatus. 5A and 5B are schematic diagrams for explaining the operation of the substrate cleaning apparatus. 5A and 5B are schematic diagrams for explaining the operation of the substrate cleaning apparatus. 5A and 5B are schematic diagrams for explaining the operation of the substrate cleaning apparatus. 5A and 5B are schematic diagrams for explaining the operation of the substrate cleaning apparatus. 5A and 5B are schematic diagrams for explaining the operation of the substrate cleaning apparatus. 5A and 5B are schematic diagrams for explaining the operation of the substrate cleaning apparatus. 5A and 5B are schematic diagrams for explaining the operation of the substrate cleaning apparatus. 5A and 5B are schematic diagrams for explaining the operation of the substrate cleaning apparatus. 5A and 5B are schematic diagrams for explaining the operation of the substrate cleaning apparatus. 5A and 5B are schematic diagrams for explaining the operation of the substrate cleaning apparatus. 4 is a cross-sectional view showing the positional relationship between a line sensor and a substrate. FIG. 4 is a plan view showing the positional relationship between a line sensor and a substrate. FIG. 13 is a diagram showing a change in the amount of light received by the light receiving section when the spin chuck rotates 360 degrees. FIG. 11 is a plan view showing a method of correcting the eccentricity direction of a substrate. FIG. 11 is a plan view showing a method of correcting the eccentricity direction of a substrate. FIG. 11A and 11B are plan views showing a method of correcting the eccentricity of a substrate. 11A and 11B are plan views showing a method for correcting the eccentricity of a substrate. FIG. 11 is a plan view showing an example in which an opening cover is attached to a casing. 11 is a cross-sectional view showing an example in which an opening cover is attached to a casing. FIG. FIG. 4 is a schematic diagram for explaining a function of a drying gas nozzle. FIG. 2 is a plan view showing an exhaust system and a waste liquid system of the substrate cleaning apparatus. 2 is a cross-sectional view showing an exhaust system and a waste liquid system of the substrate cleaning apparatus. FIG. 2 is a bottom view showing an exhaust system and a waste liquid system of the substrate cleaning apparatus. FIG. 13 is a perspective view of a substrate cleaning apparatus according to a second embodiment. FIG. 46 is a plan view of the substrate cleaning apparatus of FIG. 45. 10A to 10C are cross-sectional views illustrating the operation of a substrate cleaning apparatus according to a second embodiment. 10 is a flowchart illustrating an example of a part of the operation of the substrate cleaning apparatus according to the second embodiment.

The substrate cleaning apparatus and substrate cleaning method according to the embodiment of the present invention will be described below with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate (wafer), a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. In this embodiment, the upper surface of the substrate is the circuit formation surface (front surface), and the lower surface of the substrate is the surface opposite the circuit formation surface (rear surface). In this embodiment, the substrate has a circular shape excluding the notch.

[1] First embodiment (1) Overall configuration of a substrate cleaning apparatus Fig. 1 is a perspective view of a substrate cleaning apparatus according to a first embodiment. Fig. 2 is a plan view of the substrate cleaning apparatus of Fig. 1. Fig. 3 is a cross-sectional view of the substrate cleaning apparatus of Fig. 2 taken along line A-A. Fig. 4 is a cross-sectional view of the substrate cleaning apparatus of Fig. 2 taken along line B-B.

In Figure 1 and certain figures following Figure 2, arrows are provided indicating the mutually orthogonal X, Y, and Z directions to clarify the positional relationships. The X and Y directions are mutually orthogonal in the horizontal plane, and the Z direction corresponds to the vertical direction.

As shown in FIG. 1, the substrate cleaning apparatus 1 includes a rectangular parallelepiped casing 100, a drive unit 200, a spin chuck 300, a gas ejector 400, a number of lift pins 500, a pair of linear chucks 600a, 600b, and a bottom cleaner 700. The substrate cleaning apparatus 1 in FIG. 1 is provided in a unit housing UC indicated by a dashed line.

The casing 100 is composed of a pair of side walls 101, 102 facing each other, another pair of side walls 103, 104 facing each other, a bottom plate 105, and an upper plate 106. The side walls 101, 102 are formed perpendicular to the X direction, and the side walls 103, 104 are formed perpendicular to the Y direction. The bottom plate 105 and the upper plate 106 are formed perpendicular to the Z direction. As a result, an internal space is formed by the side walls 101-104, the bottom plate 105, and the upper plate 106.

An oval-shaped upper opening 110 is formed in the upper plate portion 106. In this embodiment, the casing 100 is made of a transparent resin. For example, polyvinyl chloride is used as the transparent resin.

The drive unit 200 is disposed on the bottom plate portion 105 inside the casing 100. The drive unit 200 is provided with a spin chuck 300. As shown in FIG. 2, the spin chuck 300 has a circular suction surface 310 capable of suction-holding the underside of the substrate W, and is configured to be rotatable around a vertical axis (axis in the Z direction). The suction surface 310 suctions the underside of the substrate W by the suction force of gas.

The gas ejector 400 has a cylindrical shape so as to surround the spin chuck 300. Three or more lift pins 500 are provided in the annular region between the spin chuck 300 and the gas ejector 400 so as to extend in the vertical direction (Z direction). In this embodiment, three lift pins 500 are provided at equal angular intervals. The lift pins 500 are configured to be movable up and down.

The spin chuck 300 and the gas ejector 400 are positioned closer to the side wall 103 than to the side wall 104. A linear chuck 600a is positioned between the drive unit 200 and the side wall 101 in the casing 100. A linear chuck 600b is positioned between the drive unit 200 and the side wall 102 in the casing 100. The linear chucks 600a and 600b face each other with the spin chuck 300 in between.

2, each of the linear chucks 600a, 600b includes a suction arm 610 and a pair of suction pads 620. Each suction arm 610 has a pair of pad mounting portions 611, 612 spaced apart at a fixed interval in the Y direction, and a connecting portion 613 extending in the Y direction between the pad mounting portions 611, 612. The pair of suction pads 620 are attached to the upper surfaces of the pad mounting portions 611, 612. A suction hole 621 is formed in the center of each suction pad 620. This allows the two pairs of suction pads 620 to suction and hold opposing areas of the peripheral portion of the lower surface of the substrate W by the suction force of gas.

The underside cleaner 700 is provided between the drive unit 200 and the side wall portion 104 within the casing 100. The underside cleaner 700 includes a fixed portion 710, a rotating portion 720, a brush arm 730, a cleaning brush 740, and a pair of rinse nozzles 750. The fixed portion 710 is fixed to the bottom plate portion 105. The rotating portion 720 is provided so as to be rotatable around a rotation axis RC that is vertical to the fixed portion 710 and to be movable up and down in the vertical direction. The brush arm 730 is formed so as to protrude horizontally from the rotating portion 720. The brush arm 730 is rotatable in a horizontal plane together with the rotating portion 720 and is movable up and down.

A brush 740 is provided on the upper surface of the tip of the brush arm 730 so as to be rotatable (rotatable) around a vertical axis of rotation. A pair of rinse nozzles 750 are provided at the tip of the brush arm 730 and on both sides of the brush 740. In this embodiment, the pair of rinse nozzles 750 extend in the vertical direction.

As shown in Figures 1 to 3, the position where the tip of the brush arm 730 faces the side wall portion 101 of the casing 100 is called the standby position. As shown in Figures 2 and 3, a brush cleaning nozzle 760 is attached to the upper plate portion 106 of the casing 100. The brush cleaning nozzle 760 is positioned above the brush 740 when the brush arm 730 is in the standby position. This allows the brush 740 to be cleaned by ejecting a rinsing liquid as a cleaning liquid from the brush cleaning nozzle 760. The rinsing liquid is, for example, pure water. The rinsing liquid may also be another cleaning liquid.

As shown in FIG. 2, inside the casing 100, a pad cover 800 is attached to the side of the drive unit 200 facing the side wall portion 101 and the side of the drive unit 200 facing the side wall portion 102. Each of the pad covers 800 has a rectangular cutout 810 formed therein.

A top surface cleaning dryer 900 is provided outside the casing 100. The top surface cleaning dryer 900 includes an arm drive unit 910, a nozzle arm 920, a rinse nozzle 930, and a drying gas nozzle 950. The arm drive unit 910 is provided on the outer surface of the side wall portion 101 of the casing 100. The arm drive unit 910 rotates the nozzle arm 920 in a horizontal plane. The rinse nozzle 930 is attached to the tip of the nozzle arm 920 so as to eject a rinse liquid as a cleaning liquid in a direction inclined relative to the horizontal plane. The rinse liquid is, for example, pure water. The rinse liquid may be another cleaning liquid.

A drying gas nozzle 950 is attached to the nozzle arm 920. The drying gas nozzle 950 ejects a drying gas (e.g., an inert gas such as _N2 gas) in a direction inclined with respect to the horizontal plane. Other gases such as air may be used as the drying gas.

The light emitting unit LE of the line sensor 23 is disposed in a position close to the side wall portion 103 inside the casing 100. The light receiving unit LR of the line sensor 23 is attached to a position above the side wall portion 104 of the casing 100. As shown in FIG. 1, a shutter SH is provided so as to protrude upward from the upper end of the side wall portion 102 of the casing 100. The shutter SH is configured to be movable up and down. This opens and closes the opening OP of the unit housing UC.

(2) Configuration of gas jet 400 Fig. 5 is a cross-sectional view of gas jet 400, and Fig. 6 is a plan view of gas jet 400 of Fig. 5. Fig. 5 shows a cross section of gas jet 400 of Fig. 6 taken along line CC. As shown in Fig. 5, gas jet 400 includes a movable support part 410, an annular jet part 420, and a vertically movable cylinder 460. The annular jet part 420 is attached on the movable support part 410. The movable support part 410 and the annular jet part 420 have a cylindrical opening 450. An annular slit 430 is formed in the annular jet part 420.

The annular slit 430 opens upward. The opening width of the annular slit 430 is, for example, 0.1 mm. The annular jetting portion 420 is formed with a gas inlet 440 that communicates with the annular slit 430. As shown by arrow z1, the movable support portion 410 and the annular jetting portion 420 are moved up and down by the vertical movement cylinder 460. The spin chuck 300 of Figures 1 to 3 is placed inside the cylindrical opening 450. When the movable support portion 410 moves upward, the position of the upper end of the annular jetting portion 420 becomes higher than the position of the suction surface 310 of the spin chuck 300.

Figure 7 is a schematic diagram showing the formation of a cylindrical gas curtain by the gas ejector 400. When gas is introduced from the gas inlet 440 in Figure 5 into the annular slit 430, a cylindrical gas curtain GC1 is formed that extends upward from the annular slit 430.

(3) Configuration of Linear Chucks 600a, 600b FIG. 8 is an enlarged plan view of a portion of the suction arm 610 including one suction pad 620. FIG. 9 is an enlarged perspective view of a portion including the suction pad 620 of FIG. 8. FIGS. 8 and 9 show a part of the suction arm 610 of the linear chuck 600b. As shown in FIG. 8, the suction pad 620 is attached to the upper surface of the pad attachment portion 611 of the suction arm 610. Of the four sides of a rectangle surrounding the suction pad 620, slits 630 are formed along three sides except for one side opposite to the spin chuck 300 (one side facing the side wall portion 102). When gas is introduced into the flow path in the suction arm 610, a gas curtain GC2 is formed upward from the slit 630 as shown in FIG. 9.

Figure 10 is a perspective view of the suction pad. Figure 11 is a cross-sectional view of the suction pad. The suction pad 620 is composed of a circular central member 622, a plate-like peripheral member 623 having a circular opening, and an annular connecting member 624. A circular suction hole 621 is formed in the central member 622. In addition, an annular protrusion 625 is provided on the outer edge of the central member 622. A plurality of screw holes 626 are formed in the peripheral member 623.

The central member 622 and the peripheral member 623 are formed of a resin material such as polybenzimidazole. The central member 622 and the peripheral member 623 may be formed of other resin materials such as polyetheretherketone (PEEK). The connecting member 624 is formed of a rubber material such as perfluoroelastomer. The connecting member 624 may be formed of other rubber materials or resin materials.

The outer periphery of the connecting member 624 is fitted into the inner periphery of the opening of the peripheral member 623. The inner periphery of the connecting member 624 is also fitted into the outer periphery of the central member 622. As a result, the central member 622 is connected to the peripheral member 623 by the connecting member 624 within the opening of the peripheral member 623. The peripheral member 623 is attached to the pad attachment portion 611 (or 612) of the suction arm 610.

The central member 622 and the peripheral members 623 are harder than the connecting members 624. The connecting members 624 have higher elasticity than the central member 622 and the peripheral members 623. This allows the central member 622 to move slightly up and down relative to the peripheral members 623. Therefore, even if the heights of the upper surfaces of the four suction pads 620 attached to a pair of suction arms 610 are slightly different, the central members 622 of each suction pad 620 move slightly up and down, so that the lower surface of the substrate W is stably supported by the four suction pads 620.

Figure 12 is a schematic cross-sectional view of linear chucks 600a and 600b. Figure 13 is a schematic cross-sectional view of linear chuck 600a. Figure 12 shows a vertical cross section in the X direction, and Figure 13 shows a vertical cross section in the Y direction. A pair of stripe-shaped openings 120 extending in the Y direction are formed in the bottom plate portion 105 of the casing 100. A linear chuck driver 13 is provided on the underside of the bottom plate portion 105.

The pair of suction arms 610 are attached to a pair of arm attachment parts 614, respectively. The pair of arm support parts 615 are inserted into a pair of stripe-shaped openings 120 so as to extend in the vertical direction. The pair of suction arms 610 and the pair of arm attachment parts 614 are attached to the pair of arm support parts 615 so as to be able to move up and down. The lower ends of the pair of arm support parts 615 are connected to each other by an arm connection part 616.

A pair of linear guides 640 extending in the Y direction are fixed inside the linear chuck drive unit 13. A guide unit 617 extending in the Y direction is provided on the pair of arm support units 615 so as to face the pair of linear guides 640. The pair of arm support units 615 can move parallel to the Y direction along the linear guides 640. Therefore, the pair of suction arms 610 can move integrally parallel to the Y direction and integrally in the vertical direction.

A pair of lower covers 650 are attached to the upper surface of the bottom plate portion 105 along both sides of each stripe-shaped opening 120. Each lower cover 650 has a horizontal portion 651 fixed to the bottom plate portion 105 and a vertical edge 652 bent upward from the horizontal portion 651. An upper cover 660 is disposed above the pair of lower covers 650. The upper cover 660 has a flat plate portion 661 having a width greater than the distance between the vertical edges 652 of the pair of lower covers 650, and vertical edges 662 bent downward from both sides of the flat plate portion 661. The upper cover 660 is fixed to the arm support portion 615 so that the lower end of the vertical edge 662 of the upper cover 660 is lower than the upper end of the vertical edge 652 of the lower cover 650. As a result, the upper cover 660 moves in the +Y direction and the -Y direction together with the arm support portion 615.

The upper cover 660 prevents liquids such as rinse liquid that fall from an upper position inside the casing 100 from entering the striped opening 120. The lower cover 650 also prevents liquids such as rinse liquid that have accumulated at the bottom inside the casing 100 from entering the striped opening 120.

(4) Bottom cleaning device 700
Fig. 14 is a schematic diagram showing the configuration of the main parts of the underside cleaner 700. As shown in Fig. 14, a brush arm 730 is provided with a brush pressure cylinder 731, a brush rotation motor 732, and a swinging member 733. A brush shaft 741 is rotatably attached to the brush arm 730 near the tip thereof. A brush 740 is fixed to the brush shaft 741. A pulley 735 is attached to the brush shaft 741. Brush rotation The rotational force of the motor 732 is transmitted to the pulley 735 and the brush shaft 741 by the belt 734. This causes the brush 740 to rotate.

The oscillating member 733 is attached below the brush arm 730 so as to be able to oscillate around axis A0. The brush pressure cylinder 731 is attached to axis A1 at one end of the oscillating member 733. A movable member 736 is attached below the tip of the brush arm 730 so as to be able to move up and down. The lower end of the brush shaft 741 is rotatably attached to the movable member 736. The movable member 736 is attached to axis A2 at the other end of the oscillating member 733.

When the brush pressure cylinder 731 moves the axis A1 of the oscillating member 733 downward as shown by arrow z3, the axis A2 of the oscillating member 733 moves upward as shown by arrow z4. This causes the movable member 736 to rise, and the brush shaft 741 and brush 740 to rise. Conversely, when the brush pressure cylinder 731 moves the axis A1 of the oscillating member 733 upward, the axis A2 of the oscillating member 733 moves downward. This causes the movable member 736 to descend, and the brush shaft 741 and brush 740 to descend. In this way, the operation of the brush pressure cylinder 731 causes the brush 740 to move up and down relative to the brush arm 730. This makes it possible to adjust the pressure with which the brush 740 presses against the underside of the substrate W.

(5) Control System Fig. 15 is a block diagram showing the configuration of a control system of the substrate cleaning apparatus 1 according to this embodiment. The control unit 10 in Fig. 15 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and a storage device. The RAM is used as a working area for the CPU. The ROM stores a system program. The storage device stores a control program. The CPU executes the substrate cleaning program stored in the storage device on the RAM to control the operation of each part of the substrate cleaning apparatus 1.

The control unit 10 controls the shutter opening/closing unit 11, the lift pin driving unit 12, the linear chuck driving unit 13, the linear chuck suction unit 14, and the linear chuck gas supply unit 15. The shutter opening/closing unit 11 opens and closes the shutter SH in FIG. 1 when the substrate W is loaded into the substrate cleaning apparatus 1 and when the substrate W is unloaded from the substrate cleaning apparatus 1.

The lift pin driver 12 moves the lift pins 500 up and down. The linear chuck driver 13 moves the suction arms 610 of the linear chucks 600a and 600b in the +Y and -Y directions, and also moves the suction arms 610 up and down. The linear chuck suction unit 14 holds the lower surface of the substrate W by the suction pads 620 by sucking the lower surface of the substrate W through the suction holes 621 of the suction pads 620 of the suction arms 610. The linear chuck gas supply unit 15 supplies gas to the suction arms 610, thereby ejecting the gas from the slits 630 in FIG. 8 and FIG. 9.

The control unit 10 controls the spin chuck driving unit 16, the spin chuck suction unit 17, the gas jet driving unit 18, the jet gas supply unit 19, the brush arm driving unit 20, the lower surface rinsing liquid supply unit 21, and the upper surface rinsing liquid supply unit 22. The spin chuck driving unit 16 includes a spin motor that rotates the spin chuck 300. The spin chuck suction unit 17 holds the lower surface of the substrate W by the spin chuck 300 by sucking the lower surface of the substrate W through suction holes in the adsorption surface 310 of the spin chuck 300.

The gas ejector driver 18 moves the gas ejector 400 up and down. The ejected gas supply unit 19 supplies gas to the gas ejector 400, causing the gas to be ejected from the annular slit 430 in Figures 5 to 7.

The brush arm driving unit 20 rotates the rotating unit 720 of the lower surface cleaner 700 to rotate the brush arm 730 in a horizontal plane, and moves the rotating unit 720 up and down relative to the fixed unit 710 to move the brush arm 730 up and down. The brush arm driving unit 20 also rotates the brush 740 and moves the brush 740 up and down relative to the brush arm 730. The brush pressure cylinder 731 and the brush rotation motor 732 in FIG. 14 are included in the brush arm driving unit 20. The lower surface rinse liquid supply unit 21 supplies rinse liquid as a cleaning liquid to the brush arm 730 to cause the rinse liquid to be discharged from the rinse nozzle 750. The upper surface rinse liquid supply unit 22 supplies rinse liquid as a cleaning liquid to the upper surface cleaner/dryer 900 to cause the rinse liquid to be discharged from the rinse nozzle 930.

The control unit 10 includes an eccentricity detection unit 23a. The control unit 10 controls the emission of light from the light-emitting unit LE of the line sensor 23, and acquires a light-receiving signal output from the light-receiving unit LR of the line sensor 23. The eccentricity detection unit 23a detects the eccentricity of the substrate W held by the spin chuck 300 based on the light-receiving signal, and provides the detection result to the control unit 10. In this example, the eccentricity detection unit 23a is configured as part of the control unit 10, but the eccentricity detection unit 23a may be configured independently of the control unit 10.

The control unit 10 controls the drying gas supply unit 24. The drying gas supply unit 24 supplies drying gas to the drying gas nozzle 950. The lift pin drive unit 12, spin chuck drive unit 16, and gas ejector drive unit 18 are provided in the drive unit 200 shown in Figures 1 to 4.

(6) Operation of Substrate Cleaning Apparatus 1 Figures 16 to 19 are flow charts showing an example of the operation of substrate cleaning apparatus 1 according to this embodiment. Figures 20 to 31 are schematic diagrams for explaining the operation of substrate cleaning apparatus 1. Figures 20, 22, 24 and 30 are vertical cross-sectional views of substrate cleaning apparatus 1 in the Y direction. Figures 21, 23, 25 and 31 are plan views of substrate cleaning apparatus 1. Figures 26 to 29 are cross-sectional views of substrate cleaning apparatus 1 in the X direction. The operations of Figures 16 to 19 are performed by control unit 10 in Figure 15 controlling the components (11 to 24).

In the initial state, the brush arm 730 is in the standby position shown in FIG. 1 and FIG. 2. First, the shutter SH in FIG. 1 opens (step S1). Next, the lift pin 500 rises (step S2). In this case, the upper end of the lift pin 500 is positioned above the upper plate portion 106 of the casing 100. Then, the hand (substrate holder) of the substrate transport robot (not shown) carries the substrate W through the opening OP of the unit housing UC to a position above the casing 100 (step S3). In this state, the hand of the substrate transport robot descends. As a result, as shown in FIG. 3 and FIG. 4, the substrate W is supported on the upper end of the lift pin 500 at a position above the upper plate portion 106. After the hand of the substrate transport robot leaves the unit housing UC, the shutter SH in FIG. 1 closes (step S4).

Next, the lift pins 500 are lowered (step S5). As a result, as shown by the arrow a1 in FIG. 20, the substrate W is lowered through the upper opening 110 of the upper plate portion 106 and placed on the suction pads 620 of the pair of suction arms 610. In this state, the linear chuck suction portion 14 in FIG. 15 sucks the substrate W. As a result, the suction pads 620 of the pair of suction arms 610 hold the peripheral portion of the lower surface of the substrate W (step S6).

Furthermore, as shown by arrow a2 in FIG. 21, the brush arm 730 rotates 90 degrees from the standby position, and as shown by arrow a3 in FIG. 20, the brush arm 730 rises, moving the brush arm 730 to the cleaning position (step S7). As a result, the upper surface of the brush 740 comes into contact with the lower surface of the substrate W. Here, the cleaning position is the position where the brush 740 of the brush arm 730 comes into contact with the substrate W.

At this time, the linear chuck gas supply unit 15 in FIG. 15 supplies gas to the slit 630 of the suction arm 610. As a result, the suction arm 610 forms a gas curtain GC2 around the suction pad 620 (step S8). Also, the ejection gas supply unit 19 in FIG. 15 supplies gas at a first flow rate to the annular slit 430 of the gas ejector 400. As a result, the gas ejector 400 forms a cylindrical gas curtain GC1 (step S9).

Next, as shown by arrow a4 in FIG. 22 and FIG. 23, the pair of suction arms 610 move in the +Y direction, while the brush arm 730 repeatedly swings in one direction and the opposite direction in the horizontal plane as shown by arrow a5 in FIG. 23 (step S10). At this time, the rinse liquid is discharged from the pair of rinse nozzles 750. As a result, the brush arm 730 cleans the central part of the lower surface of the substrate W with the brush 740. The pair of upper covers 660 move in the +Y direction together with the suction arm 610. At this time, the cylindrical gas curtain GC1 formed by the gas ejector 400 prevents the rinse liquid from adhering to the suction surface 310 of the spin chuck 300. When the suction arm 610 reaches the limit position in the +Y direction, the suction arm 610 stops. Also, the discharge of the rinse liquid from the pair of rinse nozzles 750 stops.

Then, as shown by arrow a6 in FIG. 24, the gas ejector 400 rises until it approaches the underside of the substrate W (step S11). The ejected gas supply unit 19 in FIG. 15 increases the flow rate of the gas supplied to the annular slit 430 of the gas ejector 400 to a second flow rate that is greater than the first flow rate. This increases the linear velocity of the gas ejected onto the underside of the substrate W.

In this state, the suction arm 610 moves in the -Y direction as shown by the arrow a7 in Figure 25 (step S12). The upper cover 660 moves in the -Y direction together with the suction arm 610. At this time, mainly the center of the lower surface of the substrate W is dried by the cylindrical gas curtain GC1 formed by the gas ejector 400.

When the substrate W returns to its initial position, the gas ejector 400 descends away from the underside of the substrate W, as shown by arrow a8 in FIG. 26 (step S13). The gas ejector 400 finishes forming the gas curtain GC1 (step S14). The pair of suction arms 610 also finish forming the gas curtain GC2 (step S15). The linear chuck suction section 14 also stops suction, releasing the suction arms 610 from holding the underside of the substrate W.

In this state, the lift pins 500 rise as shown by the arrow a9 in FIG. 27 (step S16). As a result, the substrate W is supported by the upper ends of the lift pins 500. Next, the suction arms 610 descend as shown by the arrow a10 in FIG. 28 (step S17). The lift pins 500 also descend (step S18). As a result, the substrate W descends as shown by the arrow a11 in FIG. 29 and is placed on the suction surface 310 of the spin chuck 300. The spin chuck suction part 17 sucks the lower surface of the substrate W. As a result, the spin chuck 300 holds the center of the lower surface of the substrate W (step S19). The pair of suction arms 610 also move to a retracted position (step S20). The retracted position is a position of the pair of suction arms 610 where each suction pad 620 is covered by the pad cover 800. When the suction arm 610 is in the retracted position, the pad cover 800 is present between the suction pad 620 and the spin chuck 300. In this example, the suction arm 610 can be moved to the retracted position by moving in the -Y direction after descending. Note that in step S20, the suction arm 610 does not have to move only downward and not to the retracted position.

Next, the light emitting unit LE of the line sensor 23 emits a strip of light. The light receiving unit LR of the line sensor 23 receives the light from the light emitting unit LE and outputs a light receiving signal indicating the amount of light received. In this state, the spin chuck 300 rotates 360 degrees (step S21). The eccentricity detection unit 23a acquires the light receiving signal output from the light receiving unit LR of the line sensor 23 during the period when the spin chuck 300 rotates 360 degrees. This allows the distribution of the amount of light received by the line sensor 23 to be obtained. The eccentricity detection unit 23a detects the eccentricity direction and amount of eccentricity of the substrate W based on the distribution of the amount of light received by the line sensor 23 during the period when the spin chuck 300 rotates 360 degrees (step S22). The eccentricity direction of the substrate W refers to the direction connecting the physical center of the substrate W and the center of rotation of the spin chuck 300. In this embodiment, the eccentricity direction of the substrate W is represented by the angle (hereinafter referred to as the eccentricity angle) that the line segment connecting the physical center of the substrate W and the rotation center of the spin chuck 300 forms with respect to the Y direction. A method for detecting the eccentricity direction and amount of eccentricity of the substrate W will be described later.

The spin chuck 300 rotates to correct the eccentric direction of the substrate W (step S23). Specifically, the spin chuck 300 rotates by an eccentric angle so that the eccentric direction of the substrate W coincides with the +Y direction. Then, the spin chuck suction unit 17 stops suction. This releases the substrate W from the spin chuck 300. The lift pins 500 rise (step S24). This causes the substrate W supported by the upper ends of the lift pins 500 to rise to a position above the spin chuck 300. Then, the pair of suction arms 610 move out of the retracted position (step S25). Furthermore, the pair of suction arms 610 rise (step S26). Furthermore, the lift pins 500 descend (step S27). This causes the substrate W to be placed on the suction pads 620 of the suction arms 610. In this state, the linear chuck suction unit 14 suctions the substrate W. As a result, the suction pads 620 of the pair of suction arms 610 hold the peripheral portion of the lower surface of the substrate W (step S28). The suction arms 610 move in the +Y direction or the -Y direction to correct the eccentricity of the substrate W (step S29). Thereafter, the substrate W is released from the suction pads 620 of the suction arms 610.

Then, the lift pins 500 are raised (step S30). Also, the pair of suction arms 610 are lowered (step S31). As a result, the upper ends of the lift pins 500 support the substrate W. In this state, the lift pins 500 are lowered (step S32). As a result, the substrate W is placed on the suction surface 310 of the spin chuck 300. The spin chuck suction portion 17 sucks the lower surface of the substrate W. As a result, the spin chuck 300 holds the central portion of the lower surface of the substrate W (step S33). An example of the operation of steps S20 to S33 is called an eccentricity correction operation. The eccentricity correction operation causes the physical center of the substrate W to coincide with the center of rotation of the spin chuck 300.

The pair of suction arms 610 then move to the retracted position (step S34). As a result, as shown in Figures 30 and 31, each suction pad 620 of the suction arm 610 is covered with a pad cover 800. In this case, the pad cover 800 is present between the spin chuck 300 and each suction pad 620.

As shown by arrow a12 in Figures 30 and 31, the spin chuck 300 rotates, and as shown by arrow a13 in Figure 30, the brush arm 730 rises, causing the brush 740 to contact the peripheral portion of the lower surface of the substrate W. In this state, the brush 740 cleans the peripheral portion of the lower surface of the substrate W while the spin chuck 300 rotates (step S35).

Then, the nozzle arm 920 rotates, and the rinse nozzle 930 moves to a position above the peripheral portion of the upper surface of the substrate W held by the spin chuck 300. In this state, the rinse nozzle 930 ejects rinse liquid onto the outer peripheral edge (bevel portion) of the substrate W (step S36). This cleans the outer peripheral edge of the substrate W. In this case, the nozzle arm 920 rotates while the substrate W is rotated by the spin chuck 300, so that the entire upper surface of the substrate W may be cleaned.

The spin chuck 300 then rotates to dry the substrate W (step S37). Drying the substrate W by rotating the spin chuck 300 is called spin drying. At this time, the drying gas nozzle 950 ejects drying gas from the inside and above the substrate W toward the outside and below the substrate W onto the outer periphery of the upper surface of the substrate W (step S38). After the substrate W has been dried, the spin chuck 300 releases the substrate W from its hold.

Then, the lift pins 500 rise (step S39). As a result, the substrate W is supported by the upper ends of the lift pins 500 and rises to a position above the casing 100 through the upper opening 110 of the casing 100. The shutter SH then opens (step S40). The substrate transport robot transports the substrate W to the outside of the unit housing UC (step S41). The shutter SH then closes (step S42).

(7) Eccentricity Correction Operation Next, a description will be given of the eccentricity correction operation of the substrate W relative to the spin chuck 300, which is performed in steps S20 to S33. Fig. 32 is a cross-sectional view showing the positional relationship between the line sensor 23 and the substrate W. Fig. 33 is a plan view showing the positional relationship between the line sensor 23 and the substrate W.

As shown in FIG. 32, the substrate W is held on the spin chuck 300. The light-emitting unit LE of the line sensor 23 is disposed in a position lower than the substrate W inside the casing 100. The light-receiving unit LR of the line sensor 23 is disposed outside the casing 100 at a position higher than the substrate W.

As shown in FIG. 33, the light emitter LE emits a strip of light SL through the outer periphery of the substrate W toward the light receiver LR. At this time, part of the light SL is blocked by the outer periphery of the substrate W. In the example of FIG. 33, the center of the substrate W (hereinafter referred to as the substrate center) Sc is offset from the rotation center Rc of the spin chuck 300. In this case, the amount of offset between the substrate center Sc and the rotation center Rc is defined as the eccentricity amount d. Furthermore, the direction from the rotation center Rc toward the substrate center Sc is defined as the eccentricity direction f. The angle that the eccentricity direction makes with the Y direction is defined as the eccentricity angle θ.

When the spin chuck 300 rotates, the eccentricity direction f of the substrate W changes, and the amount of light blocked by the outer periphery of the substrate W changes. Figure 34 shows the change in the amount of light received by the light receiving part LR when the spin chuck 300 rotates 360 degrees. The horizontal axis of Figure 34 is the rotation angle of the spin chuck 300, and the vertical axis is the amount of light received by the light receiving part LR. The amount of light received is proportional to the length of the part of the light receiving part LR that receives light.

As shown in Figure 34, the amount of light received describes a sine curve. The maximum amount of light received is Ma, and the minimum amount of light received is Mi. The average value of the maximum amount Ma and the minimum amount Mi is M0. The amount of eccentricity d is calculated using the following formula. K is a proportionality coefficient that indicates the relationship between the amount of light received by the light receiving element LR and the length over which the light is received at the light receiving element LR.

d=K {(Ma-Mi)/2}
The rotation angle at which the amount of received light is the average value M0 of the maximum value Ma and the minimum value Mi is the eccentric angle θ.

Figures 35 and 36 are plan views showing a method for correcting the eccentricity direction of the substrate W. Figures 37 and 38 are plan views showing a method for correcting the amount of eccentricity of the substrate W. As shown by arrows a14 and a15 in Figure 35, the spin chuck 300 is rotated in the opposite direction together with the substrate W by the eccentricity angle θ. As a result, the eccentricity direction f of the substrate W coincides with the Y direction, as shown in Figure 36.

Then, the spin chuck 300 releases its hold on the substrate W. As described above, the lift pins 500 receive the substrate W, and place the substrate W on a pair of suction arms 610 as shown in FIG. 37. The suction pads 620 of the suction arms 610 hold the substrate W, and move by an eccentricity amount d in the direction opposite to the eccentricity direction f, as shown by arrow a16 in FIG. 37. This causes the substrate center Sc and the rotation center Rc of the spin chuck 300 to coincide, as shown in FIG. 38. As a result, in step S36, the outer peripheral edge of the substrate W can be accurately cleaned with the rinse liquid.

(8) Opening Cover Fig. 39 is a plan view showing an example in which an opening cover is attached to the casing 100. Fig. 40 is a cross-sectional view showing an example in which an opening cover is attached to the casing 100.

As shown in Figures 39 and 40, an opening cover 140 may be attached to a portion of the upper opening 110 of the casing 100. The opening cover 140 covers a portion of the area of the upper opening 110 so as not to interfere with the substrate W when the substrate W is loaded and unloaded through the upper opening 110. This opening cover 140 has a shape that slopes toward the edge of the upper opening 110.

When the outer peripheral edge of the substrate W is cleaned with the rinse liquid in step S36 and when spin drying is performed in step S37, the rinse liquid splashes outward from the substrate W. In this case, some of the rinse liquid may splash diagonally upward from the substrate W. The rinse liquid splashed diagonally upward from the substrate W is received by the opening cover 140. This makes it difficult for some of the rinse liquid to splash outside the casing 100. Furthermore, the droplets that adhere to the opening cover 140 are guided along the inclined lower surface of the opening cover 140 to the edge of the upper opening 110. Therefore, the droplets that adhere to the opening cover 140 are prevented from re-adhering onto the substrate W.

(9) Drying Gas Nozzle FIG. 41 is a schematic diagram for explaining the function of the drying gas nozzle. As shown in FIG. 41, during spin drying, the drying gas nozzle 950 discharges the drying gas GC3 from the inside and above the substrate W to the outside and below the substrate at the outer periphery of the upper surface of the substrate W. This ensures that the liquid droplets Dr adhering to the upper surface of the substrate W can be removed even when the rotation speed of the substrate W is relatively low. Therefore, since it is not necessary to rotate the substrate W at high speed, the substrate W can be held reliably even if the size of the spin chuck 300 is reduced. Therefore, the diameter of the suction surface 310 of the spin chuck 300 can be reduced. This allows the area of the lower surface peripheral portion of the lower surface of the substrate W held and rotated by the spin chuck 300 that can be cleaned by the lower surface cleaner 700 to be increased.

The time required for the substrate W held and rotated by the spin chuck 300 to be cleaned by the brush 740 is shorter than the time required for the substrate W held by the linear chucks 600a, 600b to be cleaned by the reciprocating rotation of the brush arm 730. Therefore, by making the spin chuck 300 smaller, it is possible to shorten the overall time required to clean the underside of the substrate W. As a result, the throughput of the substrate cleaning apparatus 1 can be improved.

In addition, the droplets adhering to the substrate W are blown off below the substrate W, preventing the droplets from scattering outside the casing 100 through the upper opening 110.

(10) Exhaust System and Waste Liquid System Fig. 42 is a plan view showing the exhaust system and waste liquid system of the substrate cleaning apparatus 1. Fig. 43 is a cross-sectional view showing the exhaust system and waste liquid system of the substrate cleaning apparatus 1. Fig. 44 is a bottom view showing the exhaust system and waste liquid system of the substrate cleaning apparatus 1.

As shown in FIG. 42, exhaust ducts 171, 172, and 173 are provided within the casing 100. The exhaust ducts 171, 172, and 173 have exhaust ports 171a, 172a, and 173a, respectively. The exhaust ducts 171 and 172 are arranged along the side wall portion 104. The exhaust duct 173 is arranged along the side wall portion 103. An exhaust volume adjustment mechanism, such as an exhaust damper and exhaust slits for adjusting the exhaust volume, is provided within the exhaust duct 173.

As shown in Figures 43 and 44, exhaust ducts 174, 175, and 176 are provided on the underside of the casing 100. The exhaust ducts 174 and 175 are arranged to extend parallel to the side walls 101 and 102. The exhaust duct 176 is provided along the side wall 103. One end of the exhaust ducts 174 and 175 is connected to the exhaust ducts 171 and 172, respectively. The other ends of the exhaust ducts 174 and 175 are connected to the exhaust duct 176. The exhaust duct 176 is connected to an exhaust duct outside the substrate cleaning apparatus 1.

The gas inside the casing 100 is discharged to the outside of the casing 100 through the exhaust ducts 171, 172, 174, 175, and 176 from the exhaust ports 171a and 172a, and is also discharged to the outside through the exhaust ducts 173 and 176 from the exhaust port 173a.

As shown in Figures 42 and 43, a drain opening 180 is formed in the bottom plate portion 105 of the casing 100. As shown in Figures 43 and 44, a drain box 181 is provided on the underside of the casing 100. The drain box 181 is connected to the drain opening 180. A drain pipe is connected to the drain box 181. Liquid such as the rinse liquid in the casing 100 is guided from the drain opening 180 to the drain box 181, and is further discharged to the outside through the drain pipe.

(11) Effects of the embodiment (a) In substrate cleaning apparatus 1 according to the present embodiment, when the substrate W is held by the linear chucks 600a, 600b in the casing 100, the central portion of the underside of the substrate W is cleaned by the bottom-surface cleaner 700. Also, when the substrate W is held and rotated by the spin chuck 300 in the casing 100, the peripheral portion of the underside of the substrate W is cleaned by the bottom-surface cleaner 700. At this time, the casing 100 acts as a splash prevention member for preventing the splashing of liquid. Because the casing 100 does not move, a mechanism for moving the splash prevention member is not required.

Furthermore, an upper opening 110 is formed in the upper plate portion 106 extending in the movement direction of the substrate W so as to include, in a plan view, the area above the substrate W held by the spin chuck 300 and the area above the substrate W moved by the linear chucks 600a, 600b, thereby preventing droplets adhering to the upper plate portion 106 from falling onto the substrate W.

(b) Each of the pair of linear chucks 600a, 600b has a number of suction pads 620 aligned in the Y direction. In this case, each of two opposing areas of the underside of the substrate W is held by the multiple suction pads 620. This allows the linear chucks 600a, 600b to stably move the substrate W back and forth in the +Y direction and the -Y direction. Therefore, the underside of the substrate W can be uniformly cleaned by the underside cleaner 700.

(c) The linear chucks 600a, 600b are connected to each other by the arm connector 616 and driven by a common linear chuck driver 13. This causes the linear chucks 600a, 600b to move integrally in the +Y and -Y directions. This ensures the parallelism of the upper surfaces of the suction arms 610 of the linear chucks 600a, 600b. As a result, the substrate W is stably held by the pair of linear chucks 600a, 600b.

(d) A pair of linear guides 640 are provided below the bottom plate portion 105 of the casing 100 and below the linear chucks 600a, 600b, respectively, and a linear chuck drive unit 13 is provided below the bottom plate portion 105 of the casing 100. This allows the linear chucks 600a, 600b to be moved stably and horizontally in the +Y and -Y directions without complicating the structure inside the casing 100. Therefore, the underside of the substrate W can be uniformly cleaned by the underside cleaner 700. In addition, since the linear chuck drive unit 13 is disposed below the casing 100, the substrate cleaning apparatus 1 is configured compactly.

(e) A lower cover 650 and an upper cover 660 are provided along the stripe-shaped opening 120 of the bottom plate portion 105 of the casing 100. The upper cover 660 moves integrally with the linear chucks 600a and 600b. This prevents liquids such as rinsing liquid from flowing into the linear chuck drive unit 13 through the stripe-shaped opening 120.

(f) The slits 630 of each suction arm 610 of the linear chucks 600a, 600b form a gas curtain GC2 surrounding at least a portion of each suction pad 620. This prevents liquid droplets from adhering to each suction pad 620. Therefore, the substrate W is prevented from slipping on each suction pad 620. Furthermore, even if a relatively large load is applied to the lower surface of the substrate W by the brush 740 of the lower surface cleaner 700, the substrate W is prevented from coming off each suction pad 620. Therefore, the lower surface of the substrate W can be reliably held by the linear chucks 600a, 600b.

(g) When cleaning the substrate W held by the spin chuck 300, the suction arms 610 of the linear chucks 600a, 600b move to the retracted position, and each suction pad 620 is covered by the pad cover 800. This prevents liquid such as rinsing liquid from adhering to each suction pad 620. At this time, a gas curtain GC2 may be formed on each suction arm 610. This prevents liquid droplets adhering to the pad cover 800 from adhering to each suction pad 620.

(h) When the substrate W is not held by the spin chuck 300, the gas ejector 400 forms a gas curtain GC1 surrounding the spin chuck 300. This prevents liquid droplets from adhering to the suction surface 310 of the spin chuck 300. Also, when the substrate W is held and moved by the linear chucks 600a, 600b, a gas curtain GC1 surrounding the spin chuck 300 is formed with the gas ejector 400 in close proximity to the lower surface of the substrate W. This allows the lower surface of the substrate W to be dried before the substrate W is held by the spin chuck 300. Therefore, the substrate W is reliably held by the spin chuck 300.

(i) When the substrate W is held and moved by the linear chucks 600a, 600b, the brush 740 of the bottom surface cleaner 700 rotates in contact with the bottom surface of the substrate W, and the brush arm 730 can pivot in one direction and the other direction. This allows the central portion of the bottom surface of the substrate W to be reliably cleaned. In addition, a rinse liquid can be ejected onto the bottom surface of the substrate W from at least one of a pair of rinse nozzles 750 adjacent to the brush 740 in the pivoting direction of the brush arm 730. This allows the bottom surface of the substrate W to be more reliably cleaned.

(j) When the linear chucks 600a, 600b holding the substrate W move in the +Y direction, the central portion of the underside of the substrate W is cleaned by the bottom cleaner 700. Thereafter, when the linear chucks 600a, 600b holding the substrate W move in the -Y direction, the central portion of the underside of the substrate W is dried by the gas curtain GC1 formed by the gas ejector 400. This allows the spin chuck 300 to reliably hold the central portion of the underside of the substrate W.

(k) The substrate W is transferred between the multiple lift pins 500 and the linear chucks 600a and 600b, and the substrate W is transferred between the multiple lift pins 500 and the spin chuck 300. As a result, even if the size of the suction surface 310 of the spin chuck 300 is small, the substrate W can be transferred reliably. Therefore, by reducing the size of the spin chuck 300, the area of the central part of the lower surface to be cleaned of the lower surface of the substrate W held by the linear chucks 600a and 600b can be reduced. As a result, the cleaning time of the substrate W held by the linear chucks 600a and 600b can be shortened. The cleaning time when the substrate W is held by the spin chuck 300 is shorter than the cleaning time when the substrate W is held by the linear chucks 600a and 600b, so the overall cleaning time of the lower surface of the substrate W can be shortened.

(l) When the size of the spin chuck 300 is small, it is desirable to reduce the rotation speed of the substrate W in order to reliably hold the substrate W. In this embodiment, after cleaning the substrate W, gas is discharged from the inside and above the substrate W to the outside and below the substrate W at the outer circumferential edge of the substrate W while the substrate W is being held and rotated by the spin chuck 300. As a result, even if the spin chuck 300 rotates the substrate W at a relatively low speed, liquid droplets adhering to the substrate W can be removed from the substrate W in a short time. This makes it possible to miniaturize the spin chuck 300.

[2] Second embodiment (1) Configuration of substrate cleaning apparatus 1 Fig. 45 is a perspective view of a substrate cleaning apparatus according to a second embodiment. Fig. 46 is a plan view of the substrate cleaning apparatus of Fig. 45. Fig. 47 is a cross-sectional view showing the cleaning operation of the substrate cleaning apparatus according to the second embodiment.

The configuration of the substrate cleaning apparatus 1 according to the second embodiment differs from the configuration of the substrate cleaning apparatus 1 according to the first embodiment in the following respects. As shown in Figures 45 and 46, the substrate cleaning apparatus 1 according to the second embodiment further includes an upper surface cleaner 960 and a bevel cleaner 970.

The upper surface cleaner 960 includes an arm driver 961, a nozzle arm 962, a spray nozzle 963, and a rinse nozzle 964. The arm driver 961 is provided so as to be movable back and forth in parallel to the Y direction along the outer surface of the side wall portion 101 of the casing 100, as shown by the arrow a17. The arm driver 961 moves the nozzle arm 962 up and down in the Z direction. The spray nozzle 963 is attached to the nozzle arm 962 so as to eject multiple droplets downward. The spray nozzle 963 is, for example, a two-fluid nozzle that generates multiple droplets by colliding a liquid with a gas. The two-fluid nozzle is supplied with, for example, pure water as the liquid, and an inert gas such as nitrogen gas as the gas. The rinse nozzle 964 is attached to the lower surface of the nozzle arm 962 so as to eject a rinse liquid such as pure water downward as the cleaning liquid.

The reciprocating movement of the arm drive unit 961 and the up and down movement of the nozzle arm 962 are controlled by the control unit 10 in FIG. 15. The liquid supply unit that supplies liquid to the spray nozzle 963, the gas supply unit that supplies gas to the spray nozzle 963, and the rinse liquid supply unit that supplies rinse liquid to the rinse nozzle 964 are controlled by the control unit 10 in FIG. 15.

The bevel cleaner 970 includes an arm driver 971, a brush arm 972, and a bevel brush 973. The arm driver 971 is provided on the outer surface of the side wall 101 of the casing 100. This arm driver 971 moves the brush arm 972 up and down in the Z direction, and also rotates it in a horizontal plane as shown by arrow a18 in FIG. 46. As shown in FIG. 47, the bevel brush 973 has an upper cleaning part 973a in the shape of an inverted truncated cone and a lower cleaning part 973b in the shape of a truncated cone. This bevel brush 973 is provided below the brush arm 972 so that it can rotate (spin) around a vertical axis by a motor in the brush arm 972.

The up and down movement and rotation of the brush arm 972 by the arm drive unit 971, and the rotation of the bevel brush 973 are controlled by the control unit 10 in FIG. 15. The configurations of other parts of the substrate cleaning apparatus 1 according to the second embodiment are similar to the configurations of the corresponding parts of the substrate cleaning apparatus 1 according to the first embodiment.

(2) Operation of Substrate Cleaning Apparatus 1 The operation of substrate cleaning apparatus 1 according to the second embodiment is similar to that of substrate cleaning apparatus 1 according to the first embodiment, except for the following points.

When the central portion of the lower surface of the substrate W is being cleaned while the substrate W is held by the suction arm 610 (steps S6 to S16), the nozzle arm 920 in FIG. 1 rotates and an inert gas is supplied to the upper surface of the substrate W by the drying gas nozzle 950.

Figure 48 is a flow chart showing an example of the operation of a portion of the substrate cleaning apparatus according to the second embodiment. In the substrate cleaning apparatus 1 according to this embodiment, while the spin chuck 300 rotates and the brush 740 cleans the peripheral portion of the lower surface of the substrate W (step S35), the upper surface cleaner 960 cleans the upper surface of the substrate W (step S35a), and the bevel cleaner 970 cleans the outer peripheral edge of the substrate W (step S35b).

In detail, as shown in FIG. 47, the nozzle arm 962 moves to above the substrate W and then descends. In this state, as shown by arrow a17, the nozzle arm 962 moves in the radial direction of the substrate W, while the rinse nozzle 964 ejects rinse liquid onto the upper surface of the substrate W, and the spray nozzle 963 ejects multiple droplets onto the upper surface of the substrate W. This cleans the upper surface of the substrate W.

In addition, the brush arm 972 rotates and descends, so that the bevel brush 973 comes into contact with the outer peripheral edge of the substrate W. The outer peripheral edge of the substrate W includes an upper inclined portion that slopes diagonally downward and outward from the horizontal upper surface, a lower inclined portion that slopes diagonally upward and outward from the horizontal lower surface, and an end surface portion that is the boundary between the upper inclined portion and the lower inclined portion. The upper inclined portion of the outer peripheral edge of the substrate W is cleaned by the upper cleaning portion 973a of the bevel brush 973, and the lower cleaning portion of the outer peripheral edge of the substrate W is cleaned by the lower cleaning portion 973b of the bevel brush 973. In addition, the end surface portion of the outer peripheral edge of the substrate W is cleaned by the boundary portion between the upper cleaning portion 973a and the lower cleaning portion 973b. This cleans the outer peripheral edge of the substrate W.

The cleaning of the lower surface peripheral portion of the substrate W (step S35), the cleaning of the upper surface of the substrate W (step S35a), and the cleaning of the outer circumferential edge portion of the substrate W (step S35b) may or may not be performed simultaneously. For example, the cleaning of the upper surface of the substrate W and the cleaning of the outer circumferential edge portion of the substrate W may be performed before or after the cleaning of the lower surface peripheral portion of the substrate W. Also, the cleaning of the upper surface of the substrate W and the cleaning of the outer circumferential edge portion of the substrate W may or may not be performed simultaneously. For example, the cleaning of the outer circumferential edge portion of the substrate W may be performed before or after the cleaning of the upper surface of the substrate W.

45 to 47 , a brush similar to the brush 740 in the bottom surface cleaner 700 may be used. In this case, the brush is rotatably provided below the nozzle arm 962. When the circuit-forming surface of the substrate W is covered with a protective film or when no circuit is formed on the top surface of the substrate W, the top surface of the substrate W may be cleaned by a brush.

In this embodiment, when the central portion of the lower surface of the substrate W is being cleaned while the substrate W is held by a pair of suction arms 610, an inert gas is supplied to the upper surface of the substrate W, but it is not necessary that an inert gas is supplied to the upper surface of the substrate W. Alternatively, when the central portion of the lower surface of the substrate W is being cleaned, the nozzle arm 920 may be rotated to supply rinsing liquid to the upper surface of the substrate W by the rinse nozzle 930. Also, the nozzle arm 962 in Figures 45 to 47 may be moved to a position above the substrate W to supply rinsing liquid to the upper surface of the substrate W by the rinse nozzle 964.

Instead of the brush 740 in the lower surface cleaner 700, a spray nozzle similar to the spray nozzle 963 in the upper surface cleaner 960 may be used. In this case, the spray nozzle is provided on the brush arm 730 so as to eject droplets upward.

To clean and dry the central portion of the underside of the substrate W, one or more cleaning or drying media selected from a rinse liquid ejected by a rinse nozzle 750, an inert gas ejected by a gas ejector 400, droplets ejected by a spray nozzle, and a brush 740 may be used.

In this embodiment, while the peripheral portion of the lower surface of the substrate W is being cleaned while the substrate W is held by the spin chuck 300, the upper surface of the substrate W is cleaned with the rinsing liquid and droplets, but the method of cleaning the upper surface is not limited to this. To clean and dry the upper surface of the substrate W, one or more cleaning or drying media selected from droplets discharged by the spray nozzle 963, rinsing liquid discharged by the rinse nozzle 964, inert gas discharged by the drying gas nozzle 950, and a brush may be used.

To clean and dry the peripheral portion of the underside of the substrate W, one or more cleaning or drying media selected from a rinse liquid ejected by a rinse nozzle 750, an inert gas ejected by a gas ejector 400, droplets ejected by a spray nozzle, and a brush 740 may be used.

In this embodiment, the spray nozzle 963 and the rinse nozzle 964 are provided on the same nozzle arm 962, but the spray nozzle 963 and the rinse nozzle 964 may each be provided on a separate nozzle arm and moved by a separate arm drive unit.

[3] Other embodiments (1) The shape of the casing 100 is not limited to a rectangular parallelepiped shape, and may be another three-dimensional shape having an internal space. For example, the side walls 101 to 104, the bottom plate 105, and the top plate 106 of the casing 100 may be connected by curved surfaces. Also, the side walls 101 to 104, the bottom plate 105, and the top plate 106 may have a curved shape. In this case, the casing 100 may have an oval shape, an elliptical shape, a polygonal shape, or the like in a plan view.

(2) The shape of the upper opening 110 of the upper plate portion 106 is not limited to an elliptical shape, but may be other shapes such as an elliptical shape extending parallel to the Y direction, a rectangular shape, or a polygonal shape.

(3) In the above embodiment, after the substrate W is transferred from the linear chucks 600a, 600b to the multiple lift pins 500, an eccentricity correction operation is performed to correct the eccentricity of the physical center of the substrate W relative to the center of rotation of the spin chuck 300. However, the eccentricity correction operation does not have to be performed. In this case, the processes of steps S20 to S33 are not performed.

Alternatively, the eccentricity correction operation may be performed after the substrate W is transferred sequentially from the hand (substrate holding part) of a substrate transport robot (not shown) to the lift pins 500 and the spin chuck 300. Then, the central part of the underside of the substrate W held by the linear chucks 600a and 600b may be cleaned, and the peripheral part of the underside of the substrate W held by the spin chuck 300 may be cleaned.

(4) In the above embodiment, the gas ejector 400 ejects gas vertically upward from the annular slit 430, but the gas ejector 400 may also eject gas diagonally upward. For example, the flow path of the annular slit 430 of the gas ejector 400 may be formed to form an obtuse angle with respect to the +Y direction. In this case, when the substrate W is dried (when moving on the return path), the liquid droplets are blown away in the direction opposite to the traveling direction of the substrate W (the -Y direction in the above embodiment). This makes it possible to efficiently remove the liquid droplets from the center of the underside of the substrate W.

(5) The tips (upper ends) of the multiple lift pins 500 may be made of a soft material. For example, the tips of the multiple lift pins 500 may be made of a rubber-based material. The rubber-based material may have a structure in which multiple fine protrusions are regularly formed on the surface. With such a structure, the underside of the substrate W adheres to the tips of the lift pins 500 due to van der Waals forces. This prevents the substrate W from moving on the lift pins 500.

(6) In the above embodiment, three lift pins 500 are provided, but the number of lift pins 500 is not limited to this, and four or more lift pins 500 may be provided. For example, six lift pins 500 may be provided. In this case, one set of three lift pins 500 may be used to transfer the substrate W before the substrate W is cleaned, and another set of three lift pins 500 may be used to transfer the substrate W after the substrate W is cleaned. Also, one set of three lift pins 500 may be used to transfer the substrate W when the substrate W is loaded, and another set of three lift pins 500 may be used to transfer the substrate W when the substrate W is unloaded.

(7) The lower surface rinse liquid supply unit 21 may be controlled so that rinse liquid is discharged from the rinse nozzle 750 that precedes the brush 740 in the rotation direction of the brush arm 730 of the lower surface cleaner 700. For example, when the brush arm 730 rotates in a direction approaching the side wall portion 101, rinse liquid may be discharged from the rinse nozzle 750 that is closer to the side wall portion 101 out of the pair of rinse nozzles 750, and when the brush arm 730 rotates in a direction approaching the side wall portion 102, rinse liquid may be discharged from the rinse nozzle 750 that is closer to the side wall portion 102 out of the pair of rinse nozzles 750. This allows the lower surface of the substrate W to be efficiently cleaned while reducing the consumption of rinse liquid.

(8) The rotation direction (rotation direction) of the brush 740 may be changed depending on the rotation direction of the brush arm 730 of the underside cleaner 700. For example, when the brush arm 730 rotates clockwise in a plan view, the brush 740 may rotate clockwise, and when the brush arm 730 rotates counterclockwise in a plan view, the brush 740 may rotate counterclockwise.

(9) In the above embodiment, the cleaning brush 740 is provided on the brush arm 730 of the bottom surface cleaner 700, but a polishing brush may be provided on the brush arm 730 instead of the cleaning brush 740, or both the cleaning brush 740 and the polishing brush may be provided on the brush arm 730. In this case, for example, the bottom surface of the substrate W can be polished with the polishing brush on the outward movement of the substrate W, and the bottom surface of the substrate W can be cleaned with the cleaning brush 740 on the return movement of the substrate W. Also, the cleaning brush 740 of the brush arm 730 may be replaceable with a polishing brush.

(10) In the above embodiment, the substrate cleaning apparatus 1 includes a control unit 10 that controls each component, but the embodiment is not limited to this. If each component of the substrate cleaning apparatus 1 is configured to be controllable by an information processing device external to the substrate cleaning apparatus 1, the substrate cleaning apparatus 1 does not need to include the control unit 10.

[4] Correspondence between each component of the claims and each element of the embodiment Below, examples of correspondence between each component of the claims and each element of the embodiment will be described, but the present invention is not limited to the following examples.

In the above embodiment, the spin chuck 300 is an example of a rotating holding part, the linear chucks 600a and 600b are examples of the first and second linear holding parts, the brush arm 730 is an example of a cleaning tool holding part, the brush 740 is an example of a cleaning tool, and the rinse nozzle 750 is an example of a first or second discharge nozzle. In addition, the underside rinse liquid supply unit 21 is an example of a liquid supply unit, the gas ejector 400 is an example of a dryer and gas ejector, the gas ejector drive unit 18 is an example of an ejector drive unit, and the brush arm drive unit 20 is an example of a cleaning tool drive unit.

Various other elements having the configuration or function described in the claims may also be used as components of the claims.

[5] Reference Form (1) A substrate cleaning apparatus according to a first reference form includes a casing having side wall portions, an upper plate portion, and a bottom plate portion which define an internal space; a rotary holding portion provided in the internal space of the casing and which rotates while holding a central portion of the underside of a substrate; first and second linear holding portions provided in the internal space of the casing and which hold first and second opposing regions of the peripheral edge of the underside of the substrate, respectively, and move back and forth in a direction parallel to the first direction; and a bottom cleaner provided in the internal space of the casing and which cleans the central portion of the underside of the substrate when the substrate is held by the first and second linear holding portions, and cleans the peripheral edge of the underside of the substrate when the substrate is held and rotated by the rotary holding portion, and the upper plate portion has an upper opening which includes an area above the substrate held by the rotary holding portion and an area above the substrate moved by the first and second linear holding portions.

In this substrate cleaning device, when the substrate is held by the first and second linear holders inside the casing, the center of the underside of the substrate is cleaned by the underside cleaner. Also, when the substrate is held and rotated by the rotary holder inside the casing, the peripheral portion of the underside of the substrate is cleaned by the underside cleaner. At this time, the casing acts as a splash prevention member to prevent the liquid from splashing. Because the casing does not move, a mechanism for moving the splash prevention member is not required.

Furthermore, an upper opening is formed in the upper plate portion so as to include the area above the substrate held by the rotating holding portion and the area above the substrate moved by the first and second linear holding portions, thereby preventing droplets adhering to the upper plate portion from falling onto the substrate.

(2) A substrate cleaning apparatus according to a second reference embodiment includes a rotary holding unit that rotates while holding a central portion of the underside of a substrate, first and second linear holding units that hold first and second opposing regions of the peripheral portion of the underside of the substrate, respectively, and move back and forth in a direction parallel to the first direction, and an underside cleaner that cleans the central portion of the underside of the substrate when the substrate is held by the first and second linear holding units, and cleans the peripheral portion of the underside of the substrate when the substrate is held and rotated by the rotary holding unit, the first linear holding unit including a plurality of first suction pads that hold the first region of the substrate by suction, and the second linear holding unit including a plurality of second suction pads that hold the second region of the substrate by suction.

In the substrate cleaning device, a plurality of first suction pads of the first linear holding unit suck a first region of the peripheral edge of the underside of the substrate, while a plurality of second suction pads of the second linear holding unit suck a second region of the peripheral edge of the underside of the substrate. As a result, the first and second opposing regions of the peripheral edge of the underside of the substrate are held by the first and second linear holding units. In this state, the central portion of the underside of the substrate is cleaned by the underside cleaner. Additionally, the peripheral edge of the underside of the substrate is cleaned by the underside cleaner while the substrate is being held and rotated by the rotating holding unit.

With the above configuration, the peripheral portion of the underside of the substrate is held at at least four points, so the substrate can be stably moved back and forth by the first and second linear holding parts. Therefore, the underside of the substrate can be uniformly cleaned by the underside cleaner.

(3) A substrate cleaning apparatus according to a third embodiment includes a casing having a side wall portion, an upper plate portion, and a bottom plate portion that define an internal space; a rotary holding portion that is provided in the internal space of the casing and rotates while holding a central portion of the underside of the substrate; first and second linear holding portions that are provided in the internal space of the casing and hold first and second regions that face each other on the peripheral edge of the underside of the substrate, respectively, and move back and forth in a direction parallel to the first direction; and a rotary holding portion that is provided in the internal space of the casing and moves the substrate back and forth when the substrate is held by the first and second linear holding portions. The casing includes a bottom cleaner that cleans the central portion of the bottom surface of the casing and cleans the peripheral portion of the bottom surface of the substrate when the substrate is held and rotated by the rotating holder, a first guide member that is provided below the bottom plate of the casing and below the first linear holder and extends in a first direction, a second guide member that is provided below the bottom plate of the casing and below the second linear holder and extends in the first direction, and a linear drive unit that is provided below the bottom plate of the casing and moves the first and second linear holders along the first and second guide members, respectively.

In this substrate cleaning device, when the substrate is held by the first and second linear holders inside the casing, the center of the underside of the substrate is cleaned by the underside cleaner. Also, when the substrate is held and rotated by the rotary holder inside the casing, the peripheral portion of the underside of the substrate is cleaned by the underside cleaner. At this time, the casing acts as a splash prevention member to prevent the liquid from splashing. Because the casing does not move, a mechanism for moving the splash prevention member is not required.

Furthermore, the first and second guide members are provided below the bottom plate of the casing and below the first and second linear holding parts, respectively, and the linear drive part is provided below the bottom plate of the casing. This allows the first and second linear holding parts to be stably moved in a direction parallel to the first direction without complicating the structure inside the casing. Therefore, the underside of the substrate can be uniformly cleaned by the underside cleaner.

(4) A substrate cleaning device according to a fourth reference embodiment includes a rotary holding unit that rotates while holding a central portion of the underside of a substrate, first and second linear holding units that hold first and second opposing regions of the peripheral portion of the underside of the substrate, respectively, and a bottom cleaner that cleans the central portion of the underside of the substrate when the substrate is held by the first and second linear holding units, and cleans the peripheral portion of the underside of the substrate when the substrate is held and rotated by the rotary holding unit, the first linear holding unit includes a first suction pad that holds the first region of the substrate by suction, and a first gas ejection unit that ejects gas upward to surround at least a portion of the first suction pad, and the second linear holding unit includes a second suction pad that holds the second region of the substrate by suction, and a second gas ejection unit that ejects gas upward to surround at least a portion of the second suction pad.

In the substrate cleaning device, a first suction pad of a first linear holding part sucks a first region of the peripheral edge of the underside of the substrate, and a second suction pad of a second linear holding part sucks a second region of the peripheral edge of the underside of the substrate. As a result, the first and second opposing regions of the peripheral edge of the underside of the substrate are held by the first and second linear holding parts. In this state, the central part of the underside of the substrate is cleaned by the underside cleaner. Also, when the substrate is held and rotated by the rotating holding part, the peripheral edge of the underside of the substrate is cleaned by the underside cleaner.

Furthermore, the first gas ejection unit ejects gas upward so as to surround at least a portion of the first suction pad. The second gas ejection unit ejects gas upward so as to surround at least a portion of the second suction pad. This prevents liquid droplets from adhering to the first and second suction pads. Therefore, when the substrate is held by the first and second linear holding units, the substrate is prevented from slipping on the first and second suction pads. Furthermore, even if a large load is applied to the underside of the substrate by the underside cleaner, the substrate is prevented from coming off the first and second suction pads. Therefore, the underside of the substrate can be reliably held by the first and second linear holding units.

(5) A substrate cleaning apparatus according to a fifth embodiment includes a rotary holder that rotates while holding a central portion of the underside of a substrate, first and second linear holders that hold first and second opposing regions of the peripheral portion of the underside of the substrate, respectively, and move back and forth in a direction parallel to the first direction, a bottom cleaner that cleans the central portion of the underside of the substrate when the substrate is held by the first and second linear holders, and cleans the peripheral portion of the underside of the substrate when the substrate is held and rotated by the rotary holder, a gas jet that jets gas upward to surround the rotary holder, and a jet drive that raises and lowers the gas jet relative to the rotary holder.

In the substrate cleaning device, first and second opposing regions of the peripheral edge of the underside of the substrate are held by the first and second linear holding parts. In this state, the central part of the underside of the substrate is cleaned by the underside cleaner. In addition, when the substrate is held and rotated by the rotating holding part, the peripheral edge of the underside of the substrate is cleaned by the underside cleaner.

Furthermore, when the substrate is not held by the rotating holder, the gas ejector can eject gas upward so as to surround the rotating holder. This prevents liquid droplets from adhering to the rotating holder. Also, when the substrate is held and moved by the first and second linear holders, the gas ejector can eject gas upward in a state close to the underside of the substrate. This allows the underside of the substrate to be dried.

(6) A substrate cleaning device according to a sixth embodiment includes a rotary holder that rotates while holding a central portion of the underside of a substrate, first and second linear holders that respectively hold first and second regions facing each other on the peripheral portion of the underside of the substrate and move back and forth in a direction parallel to the first direction, and an underside cleaner that cleans the central portion of the underside of the substrate when the substrate is held by the first and second linear holders and cleans the peripheral portion of the underside of the substrate when the substrate is held and rotated by the rotary holder. The underside cleaner includes a cleaner holder that can rotate in one direction and in the opposite direction around a vertical axis, a cleaner provided on the cleaner holder that can rotate around the vertical axis and contact the underside of the substrate, and first and second discharge nozzles provided on the cleaner holder that can each discharge a cleaning liquid upward, the first discharge nozzle being disposed adjacent to the cleaner in one direction of rotation, and the second discharge nozzle being disposed adjacent to the cleaner in the opposite direction of rotation.

In the substrate cleaning device, first and second opposing regions of the peripheral edge of the underside of the substrate are held by the first and second linear motion holding parts. In this state, the central part of the underside of the substrate is cleaned by the underside cleaner. At this time, the cleaning tool rotates while in contact with the underside of the substrate, and the cleaning tool holding part can rotate in one direction and the opposite direction. This allows the central part of the underside of the substrate to be cleaned reliably. In addition, cleaning liquid can be discharged onto the underside of the substrate from at least one of the first and second discharge nozzles arranged adjacent to the cleaning tool in the direction of rotation of the cleaning tool holding part. This allows the underside of the substrate to be cleaned more reliably.

(7) A substrate cleaning device according to a seventh embodiment includes a rotating holder that rotates while holding a central portion of the underside of a substrate, first and second linear holders that hold first and second regions of the peripheral portion of the underside of the substrate facing each other, respectively, and move back and forth in a direction parallel to the first direction, a bottom cleaner that cleans the central portion of the underside of the substrate when the substrate is held by the first and second linear holders, and cleans the peripheral portion of the underside of the substrate when the substrate is held and rotated by the rotating holder, and a control unit that controls the operation of the rotating holder, the first linear holder, the second linear holder, and the bottom cleaner, and the bottom cleaner includes a cleaning tool holder that can rotate in one direction and in the opposite direction around a vertical axis, and a cleaning tool provided on the cleaning tool holder, and the control unit controls the rotational operation of the cleaning tool holder and the movement of the first and second linear holders so that a predetermined cleaning region of the underside of the substrate held by the first and second linear holders is cleaned by the cleaning tool.

In the substrate cleaning device, first and second opposing regions of the peripheral edge of the underside of the substrate are held by the first and second linear motion holding parts. In this state, the central part of the underside of the substrate is cleaned by the underside cleaner. At this time, the cleaning tool rotates while in contact with the underside of the substrate, and the cleaning tool holding part can rotate in one direction and the opposite direction. This allows the central part of the underside of the substrate to be cleaned reliably. In addition, cleaning liquid can be discharged onto the underside of the substrate from at least one of the first and second discharge nozzles arranged adjacent to the cleaning tool in the direction of rotation of the cleaning tool holding part. This allows the underside of the substrate to be cleaned more reliably.

(8) A substrate cleaning apparatus according to an eighth embodiment of the present invention includes a rotary holding unit that holds and rotates a central portion of the underside of a substrate, first and second linear holding units that hold first and second regions facing each other on the peripheral portion of the underside of the substrate, respectively, and move back and forth in a direction parallel to the first direction, a bottom cleaner that cleans the central portion of the underside of the substrate when the substrate is held by the first and second linear holding units, and cleans the peripheral portion of the underside of the substrate when the substrate is held and rotated by the rotary holding unit, and a bottom cleaner that cleans the first and second linear holding units. The apparatus includes a dryer that dries the underside of the substrate held by the second linear holding unit, and a control unit that controls the operation of the first linear holding unit, the second linear holding unit, the underside cleaner, and the dryer so that the underside of the substrate held by the underside cleaner is cleaned while the substrate is held by the first and second linear holding units and moved in a first direction, and the underside of the substrate held by the dryer is dried while the substrate is held by the first and second linear holding units and moved in a direction opposite to the first direction.

In the substrate cleaning device, the first and second linear holding parts hold opposing first and second regions of the peripheral portion of the underside of the substrate. In this state, the central portion of the underside of the substrate is cleaned by the underside cleaner when the first and second linear holding parts move in a first direction. Thereafter, the underside of the substrate is dried by the dryer when the first and second linear holding parts move in a direction opposite to the first direction. In addition, the peripheral portion of the underside of the substrate is cleaned by the underside cleaner while the substrate is being held and rotated by the rotating holding part. With this configuration, the central portion of the underside of the substrate is dried after being cleaned, so that the central portion of the underside of the substrate can be reliably held by the rotating holding part.

(9) A substrate cleaning apparatus according to a ninth embodiment of the present invention includes a rotary holding unit that rotates while holding a central portion of the underside of a substrate, first and second linear holding units that hold first and second regions facing each other on the peripheral portion of the underside of the substrate, respectively, and move back and forth in a direction parallel to the first direction, a bottom cleaner that cleans the central portion of the underside of the substrate when the substrate is held by the first and second linear holding units, and cleans the peripheral portion of the underside of the substrate when the substrate is held and rotated by the rotary holding unit, and three or more support pins that are vertically movable around the periphery of the rotary holding unit and can support the underside of the substrate, and the support pins transfer the substrate to and from the first and second linear holding units. The substrate is configured to be able to be transferred to and from the rotating holder, and the multiple support pins transfer the substrate to the first and second linear holders, the first and second linear holders hold the substrate received from the multiple support pins and move in a first direction while the bottom surface cleaner cleans the bottom surface of the substrate held by the first and second linear holders, the multiple support pins then receive the substrate from the first and second linear holders and transfer the received substrate to the rotating holder, the rotating holder holds the substrate received from the multiple support pins and rotates while the bottom surface cleaner cleans the bottom surface of the substrate held by the rotating holder, and the multiple support pins receive the substrate from the rotating holder.

In the substrate cleaning device, the central portion of the underside of the substrate is cleaned by the underside cleaner when the substrate is held by the first and second linear holders. Also, the peripheral portion of the underside of the substrate is cleaned by the underside cleaner when the substrate is held and rotated by the rotary holder. According to the above configuration, the substrate is transferred between the multiple support pins and the first and second linear holders, and between the multiple support pins and the rotary holder. As a result, the substrate can be transferred reliably even if the size of the holding surface of the rotary holder is small. Therefore, by reducing the size of the rotary holder, the area of the central portion of the underside of the substrate held by the first and second linear holders that should be cleaned can be reduced. As a result, the cleaning time of the substrate held by the first and second linear holders can be shortened. The cleaning time when the substrate is held by the rotary holder is shorter than the cleaning time when the substrate is held by the first and second linear holders, so the cleaning time of the underside of the substrate can be shortened overall.

(10) A substrate cleaning apparatus according to a tenth embodiment includes a rotary holder that rotates while holding a central portion of the underside of a substrate, first and second linear holders that respectively hold first and second opposing regions of the peripheral edge of the underside of the substrate and move back and forth in a direction parallel to the first direction, a bottom cleaner that cleans the central portion of the underside of the substrate when the substrate is held by the first and second linear holders and cleans the peripheral edge of the underside of the substrate when the substrate is held and rotated by the rotary holder, and a gas discharge nozzle that discharges gas outwardly toward the outer peripheral edge of the substrate when the substrate is held and rotated by the rotary holder after cleaning the peripheral edge of the underside of the substrate.

In the substrate cleaning device, the central portion of the underside of the substrate is cleaned by the underside cleaner when the substrate is held by the first and second linear holders. Also, the peripheral portion of the underside of the substrate is cleaned by the underside cleaner when the substrate is held and rotated by the rotating holder. When the size of the rotating holder is small, it is desirable to reduce the rotation speed of the substrate in order to hold the substrate securely. According to the above configuration, after the substrate is cleaned, gas is discharged outwardly to the outer peripheral edge of the substrate when the substrate is held and rotated by the rotating holder. As a result, even if the rotating holder rotates the substrate at a relatively low speed, liquid droplets adhering to the substrate can be removed from the substrate. This makes it possible to reduce the size of the rotating holder.

1...Substrate cleaning apparatus, 10...Control unit, 11...Shutter opening/closing unit, 12...Lift pin driving unit, 13...Linear chuck driving unit, 14...Linear chuck suction unit, 15...Linear chuck gas supply unit, 16...Spin chuck driving unit, 17...Spin chuck suction unit, 18...Gas ejector driving unit, 19...Ejected gas supply unit, 20...Brush arm driving unit, 21...Lower surface rinsing liquid supply unit, 22...Upper surface rinsing liquid supply unit, 23...Line sensor, 23a...Eccentricity detection unit, 24...Drying gas supply unit, 100...Casing, 101-104...Side wall unit, 105...Bottom plate unit, 106...Upper plate unit, 110...Upper opening, 120...Striped opening, 140...Opening casing Bar, 171, 172, 173, 174, 175, 176...exhaust duct, 171a, 172a, 173a...exhaust port, 180...drain opening, 181...drain box, 200...driving unit, 300...spin chuck, 310...suction surface, 400...gas ejector, 410...movable support part, 420...annular ejection part, 430...annular slit, 440...gas inlet, 450...cylindrical opening, 460...vertical movement cylinder, 500...lift pin, 600a, 600b...linear motion chuck, 610...suction arm, 611, 612...pad mounting part, 613...connection part, 614...arm mounting part, 615...arm support part, 616... Arm connecting portion, 617...guide portion, 620...suction pad, 621...suction hole, 622...central member, 623...peripheral member, 624...connecting member, 625...projection portion, 626...screw hole, 630...slit, 640...linear guide, 650...lower cover, 651...horizontal portion, 652, 662...vertical edge, 660...upper cover, 661...flat plate portion, 700...lower surface cleaner, 710...fixed portion, 720...rotating portion, 730, 972...brush arm, 731...brush pressure cylinder, 732...brush rotation motor, 733...oscillating member, 734...belt, 735...pulley, 736...movable member, 740...brush, 741...brush shaft, 750, 930, 9 64...Rinse nozzle, 760...Brush cleaning nozzle, 800...Pad cover, 810...Rectangular cutout, 900...Upper surface cleaning dryer, 910...Arm drive unit, 920, 962...Nozzle arm, 950...Drying gas nozzle, 960...Upper surface cleaner, 961, 971...Arm drive unit, 963...Spray nozzle, 970...Bevel cleaner, 973...Bevel brush, 973a...Upper cleaner, 973b...Lower cleaner, GC1, GC2...Gas curtain, GC3...Drying gas, LE...Light emitter, LR...Light receiver, M0...Average value, OP...Opening, RC...Rotation axis, Rc...Center of rotation, SH...Shutter, SL...Light, UC...Unit housing, W...Substrate

Claims (14)

a rotating holder that holds and rotates a central portion of a lower surface of the substrate;
first and second linear motion holding parts which hold first and second regions facing each other on a peripheral portion of a lower surface of the substrate, respectively, and move back and forth in a direction parallel to the first direction;
a bottom surface cleaner that cleans a central portion of a bottom surface of the substrate when the substrate is held by the first and second linear holding parts, and cleans a peripheral portion of a bottom surface of the substrate when the substrate is held and rotated by the rotary holding part,
The underside cleaner is
a cleaning tool holder that can rotate in one direction and in the other direction around a vertical axis;
a cleaning tool provided on the cleaning tool holder so as to be rotatable around a vertical axis and contactable with a lower surface of the substrate;
a first nozzle and a second nozzle provided in the cleaning tool holder and capable of respectively discharging a cleaning liquid upward;
The first discharge nozzle is disposed adjacent to the cleaning tool in the one direction of rotation,
The second discharge nozzle is disposed adjacent to the cleaning tool in the reverse direction of the rotation. a liquid supplying section that supplies a cleaning liquid to the first and second discharge nozzles to cause the cleaning liquid to be discharged from the first and second discharge nozzles, respectively;
2. The substrate cleaning apparatus of claim 1, further comprising: a control unit that controls an operation of the liquid supply unit so that the cleaning liquid is discharged from at least the first discharge nozzle of the first and second discharge nozzles when the cleaning tool holding unit rotates in the one direction, and so that the cleaning liquid is discharged from at least the second discharge nozzle of the first and second discharge nozzles when the cleaning tool holding unit rotates in the reverse direction. The substrate cleaning apparatus according to claim 2, wherein the control unit controls the operation of the liquid supply unit so that cleaning liquid is discharged from the first and second discharge nozzles when the cleaning tool holding unit rotates in the one direction, and cleaning liquid is discharged from the first and second discharge nozzles when the cleaning tool holding unit rotates in the opposite direction. a rotating holder that holds and rotates a central portion of a lower surface of the substrate;
first and second linear motion holding parts which hold first and second regions facing each other on a peripheral portion of a lower surface of the substrate, respectively, and move back and forth in a direction parallel to the first direction;
a bottom surface cleaner that cleans a central portion of a bottom surface of the substrate when the substrate is held by the first and second linear holding parts, and cleans a peripheral portion of a bottom surface of the substrate when the substrate is held and rotated by the rotary holding part;
a dryer that dries the lower surface of the substrate held by the first and second linear holding parts;
A control unit,
the control unit controls operations of the first linear motion holding unit, the second linear motion holding unit, the bottom surface cleaner, and the dryer such that a substrate is held by the first and second linear motion holding units and moved in one direction parallel to the first direction while an underside of the held substrate is cleaned by the bottom surface cleaner, and a substrate is held by the first and second linear motion holding units and moved in a direction opposite to the one direction parallel to the first direction while an underside of the held substrate is dried by the dryer. a gas ejector that ejects gas upward so as to surround the rotation holder;
4. The substrate cleaning apparatus according to claim 1, further comprising a gas ejector drive unit that raises and lowers the gas ejector relative to the spin holder. The device further includes a casing having a side wall portion, a top plate portion, and a bottom plate portion that define an internal space,
the rotation holding part, the first linear holding part, the second linear holding part, and the underside cleaning device are provided in the internal space of the casing,
6. The substrate cleaning apparatus of claim 1, wherein the upper plate portion has an upper opening that includes an area above the substrate held by the rotary holding portion and an area above the substrate moved by the first and second linear holding portions. a rotating holder that holds and rotates a central portion of a lower surface of the substrate;
first and second linear motion holding parts which hold first and second regions facing each other on a peripheral portion of a lower surface of the substrate, respectively, and move back and forth in a direction parallel to the first direction;
a bottom surface cleaner that cleans a central portion of a bottom surface of the substrate when the substrate is held by the first and second linear holding parts, and cleans a peripheral portion of a bottom surface of the substrate when the substrate is held and rotated by the rotary holding part;
a casing having a side wall portion, a top plate portion, and a bottom plate portion that define an internal space;
The underside cleaner is
a cleaning tool holder that can rotate in one direction and in the other direction around a vertical axis;
a cleaning tool provided on the cleaning tool holder so as to be rotatable around a vertical axis and contactable with a lower surface of the substrate;
a first nozzle and a second nozzle provided in the cleaning tool holder and capable of respectively discharging a cleaning liquid upward;
The first discharge nozzle is disposed adjacent to the cleaning tool in the one direction of rotation,
The second discharge nozzle is disposed adjacent to the cleaning tool in the reverse direction of the rotation,
the rotation holding part, the first linear holding part, the second linear holding part, and the underside cleaning device are provided in the internal space of the casing,
the upper plate portion has an upper opening including an area above the substrate held by the rotary holder and an area above the substrate moved by the first and second linear holders;
The underside cleaner is
a fixing portion fixed to the bottom plate portion in the internal space of the casing;
a rotating part provided in an internal space of the casing so as to be rotatable around an axis perpendicular to the fixed part;
a cleaner drive unit configured to rotate the rotating unit relative to the fixed unit and to move the rotating unit up and down relative to the fixed unit,
The cleaning tool holder is integrally provided on the rotating part. holding first and second regions of a peripheral portion of a lower surface of the substrate facing each other by first and second linear holding parts, respectively, and reciprocating the substrate in a direction parallel to a first direction;
cleaning a central portion of a lower surface of the substrate by a lower surface cleaner while the substrate is held by the first and second linear motion holding parts;
a step of rotating the substrate by holding a central portion of a lower surface of the substrate with a rotary holder;
cleaning a peripheral portion of a lower surface of the substrate by a lower surface cleaner while the substrate is being rotated by the spin holder;
The step of cleaning the central portion of the lower surface of the substrate includes:
bringing a cleaning tool provided in a cleaning tool holder of the lower surface cleaner into contact with a lower surface of a substrate;
rotating the cleaning tool holder in one direction and in the other direction about a vertical axis with the cleaning tool in contact with the lower surface of the substrate;
discharging a cleaning liquid onto a lower surface of the substrate from a first discharge nozzle provided on the cleaning tool holder so as to be adjacent to the cleaning tool in the one direction of rotation;
and discharging a cleaning liquid onto an underside of the substrate from a second discharge nozzle provided on the cleaning tool holder so as to be adjacent to the cleaning tool in the reverse direction of the rotation. The step of cleaning the central portion of the lower surface of the substrate includes:
discharging cleaning liquid from at least the first discharge nozzle of the first and second discharge nozzles when the cleaning tool holding part rotates in the one direction;
The method for cleaning a substrate according to claim 8 , further comprising: discharging a cleaning liquid from at least the second discharge nozzle of the first and second discharge nozzles when the cleaning tool holding part rotates in the reverse direction. Discharging the cleaning liquid from at least the first discharge nozzle includes discharging the cleaning liquid from the first and second discharge nozzles when the cleaning tool holding part rotates in the one direction,
10. The substrate cleaning method according to claim 9, wherein discharging the cleaning liquid from at least the second discharge nozzle includes discharging the cleaning liquid from the first and second discharge nozzles when the cleaning tool holding part rotates in the opposite direction. holding first and second regions of a peripheral portion of a lower surface of the substrate facing each other by first and second linear holding parts, respectively, and reciprocating the substrate in a direction parallel to a first direction;
cleaning a central portion of a lower surface of the substrate by a lower surface cleaner while the substrate is held by the first and second linear motion holding parts;
a step of rotating the substrate by holding a central portion of a lower surface of the substrate with a rotary holder;
cleaning a peripheral portion of a lower surface of the substrate by a lower surface cleaner while the substrate is being rotated by the spin holder;
The step of cleaning the central portion of the lower surface of the substrate includes:
cleaning the lower surface of the substrate by the lower surface cleaner while the substrate is being moved in one direction parallel to the first direction by the first and second linear motion holding parts;
The substrate cleaning method further includes a step of drying the underside of the substrate by a dryer while the substrate is moved by the first and second linear motion holders in a direction opposite to the one direction parallel to the first direction. a step of ejecting gas upward by a gas ejector so as to surround the rotation holding unit while the substrate is being moved in a direction parallel to the first direction by the first and second linear motion holding units;
The substrate cleaning method according to any one of claims 8 to 11, further comprising a step of raising the gas ejector before or while the substrate is being moved in the reverse direction by the first and second linear motion holding parts. The method further includes a step of carrying the substrate into an internal space of a casing having a top plate portion, a side wall portion, and a bottom plate portion;
the upper plate portion has an upper opening including an area above the substrate held by the rotary holder and an area above the substrate moved by the first and second linear holders;
the step of reciprocating the substrate includes reciprocating the substrate by the first and second linear motion holding parts in the internal space of the casing;
the step of cleaning the central portion of the lower surface of the substrate includes cleaning the central portion of the lower surface of the substrate by the lower surface cleaner in the internal space of the casing;
the step of holding and rotating the substrate includes holding and rotating a central portion of a lower surface of the substrate by the rotary holder in the internal space of the casing;
The substrate cleaning method according to any one of claims 8 to 12, wherein the step of cleaning the peripheral portion of the lower surface of the substrate includes cleaning the peripheral portion of the lower surface of the substrate by the lower surface cleaner in the internal space of the casing. holding first and second regions of a peripheral portion of a lower surface of the substrate facing each other by first and second linear holding parts, respectively, and reciprocating the substrate in a direction parallel to a first direction;
cleaning a central portion of a lower surface of the substrate by a lower surface cleaner while the substrate is held by the first and second linear motion holding parts;
a step of rotating the substrate by holding a central portion of a lower surface of the substrate with a rotary holder;
and cleaning a peripheral portion of a lower surface of the substrate by a lower surface cleaner while the substrate is being rotated by the spin holder,
The step of cleaning the central portion of the lower surface of the substrate includes:
bringing a cleaning tool provided in a cleaning tool holder of the lower surface cleaner into contact with a lower surface of a substrate;
rotating the cleaning tool holder in one direction and in the other direction about a vertical axis with the cleaning tool in contact with the lower surface of the substrate;
discharging a cleaning liquid onto a lower surface of the substrate from a first discharge nozzle provided on the cleaning tool holder so as to be adjacent to the cleaning tool in the one direction of rotation;
and discharging a cleaning liquid onto a lower surface of the substrate from a second discharge nozzle provided on the cleaning tool holder so as to be adjacent to the cleaning tool in the reverse direction of the rotation.
The method further includes a step of carrying the substrate into an internal space of a casing having a top plate portion, a side wall portion, and a bottom plate portion;
the upper plate portion has an upper opening including an area above the substrate held by the rotary holder and an area above the substrate moved by the first and second linear holders;
the step of reciprocating the substrate includes reciprocating the substrate by the first and second linear motion holding parts in the internal space of the casing;
the step of cleaning the central portion of the lower surface of the substrate includes cleaning the central portion of the lower surface of the substrate by the lower surface cleaner in the internal space of the casing;
the step of holding and rotating the substrate includes holding and rotating a central portion of a lower surface of the substrate by the rotary holder in the internal space of the casing;
The step of cleaning the peripheral portion of the lower surface of the substrate includes cleaning the peripheral portion of the lower surface of the substrate by the lower surface cleaner in the internal space of the casing;
bringing the cleaning tool provided on the cleaning tool holder into contact with the underside of the substrate includes lifting the cleaning tool on the cleaning tool holder by moving a rotating part upward relative to a fixed part provided on the bottom plate part in the internal space of the casing,
The substrate cleaning method includes rotating the cleaning tool holder in one direction and in the opposite direction around a vertical axis by rotating the rotating part, to which the cleaning tool holder is integrally formed, around the vertical axis relative to the fixed part, thereby rotating the cleaning tool holder in one direction and in the opposite direction.

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