JP7578418B2 - Processing Equipment - Google Patents

Description

The present invention relates to a processing device.

In a processing device that uses a grinding wheel to grind a workpiece held on the holding surface of a chuck table, the upper surface of the chuck table is used as the holding surface. As disclosed in Patent Document 1, after the ground workpiece is separated from the holding surface, the holding surface is cleaned by contacting it with a brush, or as disclosed in Patent Document 2, the holding surface is cleaned by spraying two fluids toward it. Furthermore, as disclosed in Patent Documents 3 and 4, two fluids are sprayed from the holding surface of the chuck table to spray grinding chips that have entered the porous member from the holding surface during grinding from the holding surface.

Grinding chips adhering to the holding surface may enter the holding surface and the porous member from the outer periphery of the workpiece and the outer periphery of the holding surface due to the suction force acting on the holding surface to hold the workpiece. It is difficult to remove grinding chips that have entered the porous member, and there is a risk that the suction force of the holding surface will be reduced due to grinding chips that have entered the porous member.

JP 2003-059881 A JP 2011-020078 A JP 2015-054359 A JP 2015-060922 A

When the suction force of the holding surface decreases, a gap is formed between the holding surface and the bottom surface of the workpiece. If the workpiece is ground with a grinding wheel while being held by the holding surface with reduced suction force, the outer periphery of the workpiece will end up being thinner than a preset thickness.
Therefore, the processing device has a problem of preventing a decrease in the suction force of the holding surface.

The present invention relates to a processing apparatus including a chuck table having a holding surface for holding a workpiece, a grinding means for grinding the workpiece while generating grinding chips by bringing a grinding wheel into contact with the workpiece held on the holding surface, or a polishing means for polishing the workpiece while generating polishing chips by supplying a slurry to the workpiece, and a holding surface cleaning mechanism for cleaning the holding surface, the holding surface cleaning mechanism including a chemical liquid supply nozzle for supplying a chemical liquid capable of dissolving the grinding chips or the polishing chips from one jetting port to the holding surface , and a suction port arranged to surround the jetting port of the chemical liquid supply nozzle from the outer periphery, the chemical liquid suction nozzle having a suction port positioned on the holding surface and which sucks in the chemical liquid supplied from the chemical liquid supply nozzle through the suction port ; lifting and moving means for moving the chemical liquid supply nozzle and the chemical liquid suction nozzle towards and away from the holding surface; and control means, wherein the control means uses the lifting and moving means to lower the chemical liquid supply nozzle and the chemical liquid suction nozzle so as to bring them closer to the holding surface with a gap between them, supply the chemical liquid from the chemical liquid supply nozzle to the holding surface, and suck up the chemical liquid supplied to the holding surface with the chemical liquid suction nozzle, thereby removing grinding or polishing debris adhering to the holding surface.
The present invention also provides a processing apparatus including a chuck table having a holding surface for holding a workpiece, a rotation mechanism for rotating the chuck table about an axis at the center of the holding surface of the chuck table, grinding means for grinding the workpiece held on the holding surface while generating grinding chips by bringing a grinding wheel into contact with the workpiece held on the holding surface, or polishing means for polishing the workpiece while generating polishing chips by supplying a slurry to the workpiece, and a holding surface cleaning mechanism for cleaning the holding surface,
It is desirable that the holding surface cleaning mechanism be a processing device that includes a chemical liquid supply nozzle having a length greater than or equal to the radius and less than or equal to the diameter of the holding surface, and that supplies to the holding surface a chemical liquid capable of dissolving grinding chips or polishing chips from a plurality of spray nozzles arranged in the longitudinal direction, a chemical liquid suction nozzle arranged parallel to the chemical liquid supply nozzle and rearward of the chemical liquid supply nozzle in the rotation direction of the chuck table, and a control means, wherein the control means rotates the chuck table at a predetermined rotational speed using the rotation mechanism, supplies the chemical liquid from the chemical liquid supply nozzle to the holding surface, and sucks up the chemical liquid supplied to the holding surface and guided by the rotation of the chuck table with the chemical liquid suction nozzle, thereby causing the chemical liquid to flow through the chemical liquid supply nozzle, the holding surface, and the chemical liquid suction nozzle in that order, thereby removing the grinding chips or polishing chips adhering to the holding surface.

The present invention supplies a chemical liquid to the holding surface from a chemical liquid supply nozzle, and then suctions the chemical liquid supplied to the holding surface from a chemical liquid suction nozzle, thereby allowing the chemical liquid to flow through the chemical liquid supply nozzle, the holding surface, and the chemical liquid suction nozzle in that order, thereby removing grinding chips adhering to the holding surface.
Furthermore, by removing the grinding chips adhering to the holding surface, the grinding chips are prevented from entering the inside of the porous member, and a decrease in the suction force at the holding surface is prevented when the workpiece is held by suction on the holding surface.

FIG. 2 is a perspective view showing the entire processing device. FIG. 4 is a perspective view illustrating a part of a first holding surface cleaning mechanism. 11 is a cross-sectional view showing a state in which the holding surface is cleaned using a first holding surface cleaning mechanism. FIG. FIG. 4 is a perspective view illustrating a second holding surface cleaning mechanism. FIG. 4 is a perspective view illustrating a part of a second holding surface cleaning mechanism. 11 is a cross-sectional view showing a state in which the holding surface is cleaned using a second holding surface cleaning mechanism. FIG. FIG. 13 is a perspective view illustrating a third holding surface cleaning mechanism. 11 is a cross-sectional view showing a state in which the holding surface is cleaned using a third holding surface cleaning mechanism. FIG.

1 Configuration of the Processing Apparatus The processing apparatus 1 shown in Fig. 1 is a processing apparatus that processes a workpiece 14 using a grinding means 3. The configuration of the processing apparatus 1 will be described below.

As shown in FIG. 1, the processing device 1 includes a base 10 extending in the Y-axis direction and a column 11 erected on the +Y-direction side of the base 10.

A grinding feed means 4 supporting the grinding means 3 is disposed on the side surface of the column 11 on the -Y direction side. The grinding means 3 includes a spindle 30 having a rotation axis 35 in the Z-axis direction, a housing 31 rotatably supporting the spindle 30, a spindle motor 32 that rotates and drives the spindle 30 about the rotation axis 35, a mount 33 connected to the lower end of the spindle 30, and a grinding wheel 34 detachably attached to the lower surface of the mount 33. The grinding wheel 34 includes a wheel base 341 and a plurality of grinding wheels 340 having a substantially rectangular parallelepiped shape arranged in a ring shape on the lower surface of the wheel base 341, and a lower surface 342 of the grinding wheel 340 serves as a grinding surface for grinding the workpiece 14.
By using the spindle motor 32 to rotate the spindle 30 around the rotation axis 35, the mount 33 connected to the spindle 30 and the grinding wheel 34 attached to the mount 33 rotate around the rotation axis 35 in the Z-axis direction that passes through the center of the wheel base 341.

The grinding feed means 4 includes a ball screw 40 having a rotating shaft 45 in the Z-axis direction, a pair of guide rails 41 arranged parallel to the ball screw 40, a Z-axis motor 42 connected to the upper end of the ball screw 40 and rotating the ball screw 40 around the rotating shaft 45, an encoder 420 that measures and controls the amount of rotation of the Z-axis motor 42, a lifting plate 43 whose internal nut is screwed onto the ball screw 40 and whose side is in sliding contact with the guide rail 41, and a holder 44 connected to the lifting plate 43 and holds the spindle 30.
When the ball screw 40 is driven by the Z-axis motor 42 and rotates about the rotation shaft 45, the lift plate 43 moves up and down in the Z-axis direction while being guided by the guide rail 41. Accordingly, the grinding means 3 held by the holder 44 moves in a direction perpendicular to the holding surface 200 (Z-axis direction).

The processing device 1 is equipped with a height recognition means 46 that recognizes the height of the grinding means 3. The height recognition means 46 includes a scale 460 arranged, for example, on the side surface of the guide rail 41 on the -Y direction side, and a height recognition unit 461 arranged, for example, on the side surface of the lift plate 43 on the +X direction side, adjacent to the scale 460. The height recognition unit 461 is, for example, a block having an optical recognition mechanism that reads reflected light from the scale marks formed on the scale 460. The height of the grinding means 3 can be recognized by reading the scale marks on the scale 460 using the height recognition unit 461.

A chuck table 2 is disposed on the base 10. The chuck table 2 includes a disk-shaped suction portion 20 and an annular frame 21 that supports the suction portion 20. The suction portion 20 is a porous member having a large number of fine holes, and the upper surface of the suction portion 20 serves as a holding surface 200 on which the workpiece 14 is held by suction. The upper surface 210 of the frame 21 is formed flush with the holding surface 200.

A cover 28 is disposed around the chuck table 2, and the cover 28 is connected to a bellows 29 so as to be expandable and contractible.
When the chuck table 2 moves in the Y-axis direction, the cover 28 moves integrally with the chuck table 2 in the Y-axis direction, causing the bellows 29 to expand and contract.

A first holding surface cleaning mechanism 5 is disposed on the base 10 on the −Y direction side.
The first holding surface cleaning mechanism 5 includes a rectangular parallelepiped case 59 and an elevation movement means 52 that supports the case 59 so that it can be raised and lowered.
The lifting and moving means 52 includes a cylinder 520 embedded inside the base 10, and a piston portion 521 housed in the cylinder 520 so as to be movable up and down. The piston portion 521 passes through a through hole 101 formed in the upper surface 100 of the base 10, and protrudes in the +Z direction from the inside of the base 10 to the outside. One end of an arm portion 522 is connected to the upper end of the piston portion 521, and a shaft portion 523 hangs down from the other end of the arm portion 522. A case 59 is connected to the lower end of the shaft portion 523.

An air supply source (not shown), for example, is connected to the cylinder 520. Air is supplied from the air supply source into the inside of the cylinder 520 to urge the piston portion 521 upward from below, whereby the piston portion 521, the arm portion 522, the shaft portion 523, and the case 59 are raised together.
In the lifting/moving means 52, by controlling the amount of air supplied to the cylinder 520, the piston portion 521 can be lifted and moved up and down, thereby lifting and moving the case 59 to an appropriate height position.

2, a chemical supply nozzle 50 is disposed inside the case 59 of the first holding surface cleaning mechanism 5, which supplies a chemical solution capable of dissolving grinding chips to the holding surface 200. Here, the chemical solution is, for example, an aqueous potassium hydroxide solution, and the mass percentage concentration of potassium hydroxide in the aqueous potassium hydroxide solution is set to 5% to 10%. That is, in the aqueous potassium hydroxide solution, the ratio of the mass of potassium hydroxide to the total mass of water and potassium hydroxide constituting the aqueous potassium hydroxide solution is set to 5% to 10%.
The chemical solution supply nozzle 50 is formed in a substantially rectangular parallelepiped shape, and has a length that is equal to or greater than the radius of the holding surface 200 and equal to or less than the diameter of the holding surface 200, for example.

As shown in FIG. 3, the first holding surface cleaning mechanism 5 has a chemical liquid supply path 501 that penetrates the shaft portion 523 in the Z-axis direction and further extends in the Z-axis direction inside the chemical liquid supply nozzle 50 and branches into multiple paths inside the chemical liquid supply nozzle 50. Each of the multiple branches of the chemical liquid supply path 501 is connected to an injection port 503 that is formed and opens on the underside 502 of the chemical liquid supply nozzle 50.

The chemical supply path 501 is also connected to a chemical supply source 500. When the chemical supply nozzle 50 is positioned above the holding surface 200, the chemical supply source 500 supplies the chemical solution, which can be sprayed from the nozzle 503 of the chemical supply nozzle 50.

The first holding surface cleaning mechanism 5 includes a chemical solution suction nozzle 51 that suctions the chemical solution supplied to the holding surface 200 by the chemical solution supply nozzle 50. The chemical solution suction nozzle 51 has a long portion 518 formed by extending parallel to the chemical solution supply nozzle 50 as shown in FIG. 2, and short diameter portions 519 provided at both ends of the long portion 518 so as to be perpendicular to the long diameter portion 518.
3, while the chemical liquid is being sprayed from the spray port 503 of the chemical liquid supply nozzle 50 onto the holding surface 200, the chemical liquid is sucked into the chemical liquid suction nozzle 51 by operating the chemical liquid suction nozzle 51. In this way, the chemical liquid flows through the chemical liquid supply nozzle 50, the holding surface 200, and the chemical liquid suction nozzle 51 in this order.

The first holding surface cleaning mechanism 5 includes a control means 9. Using the control means 9, the lifting and lowering means 52 is controlled to lower the chemical solution supply nozzle 50 and the chemical solution suction nozzle 51, thereby allowing them to approach the holding surface 200 with a gap therebetween.
With the chemical liquid supply nozzle 50 and the chemical liquid suction nozzle 51 close to each other above the holding surface 200 with a gap between them, the control means 9 is further used to control the chemical liquid supply nozzle 50, supplying the chemical liquid from the chemical liquid supply nozzle 50 to the holding surface 200, and using the chemical liquid suction nozzle 51 to suction the chemical liquid supplied to the holding surface 200, thereby causing the chemical liquid to flow from the chemical liquid supply nozzle 50 through the holding surface 200 to the chemical liquid suction nozzle 51, thereby removing grinding chips adhering to the holding surface 200.

A rotation mechanism 26 for rotating the chuck table 2 is disposed below the chuck table 2. The rotation mechanism 26 is provided with a motor 260.
The rotation mechanism 26 is, for example, a pulley mechanism, and includes a drive shaft 262 that can be rotated about an axis in the Z-axis direction by a motor 260, a drive pulley 263 connected to the upper end of the drive shaft 262, a transmission belt 264 that is wound around the drive pulley 263 and transmits the driving force of the drive pulley 263 to a driven pulley 265, a driven pulley 265 that is wound around the transmission belt 264 together with the drive pulley 263, a driven shaft 266 connected to the driven pulley 265, and a rotary joint 267 connected to the lower end of the driven shaft 266. The driven shaft 266 is connected to the chuck table 2.

When the drive shaft 262 is rotated by the motor 260, the drive pulley 263 rotates and the rotational force of the drive pulley 263 is transmitted to the driven pulley 265 by the transmission belt 264, causing the driven pulley 265 to rotate. As a result, the driven shaft 266 connected to the driven pulley 265 rotates around the center of the holding surface 200 as its axis, and the chuck table 2 connected to the driven shaft 266 rotates around the center of the holding surface 200 as its axis.

Below the chuck table 2, a suction source 240, a water supply source 241, and an air supply source 242 are arranged, which are connected to the suction unit 20 via a flow path 243.
The flow path 243 is formed, for example, to penetrate the frame 21, the driven shaft 266, and the rotary joint 267, and protrudes from the side of the rotary joint 267 to the outside of the rotary joint 267, branching into a suction path 2430, a water path 2431, and an air flow path 2432.

A suction valve 2400 is disposed between the suction source 240 and the suction unit 20. When the suction source 240 is operated with the suction valve 2400 open, the suction force generated by the suction source 240 is transmitted to the holding surface 200 of the suction unit 20 through the flow path 243.
For example, when the workpiece 14 is placed on the holding surface 200, the suction valve 2400 can be opened and the suction source 240 can be operated, thereby suctioning and holding the workpiece 14 on the holding surface 200.

In addition, a water valve 2410 is disposed between the water supply source 241 and the suction unit 20. When water is supplied using the water supply source 241 with the water valve 2410 open, the supplied water is transmitted to the suction unit 20 through the flow path 243 and is sprayed in the +Z direction from a large number of pores formed in the holding surface 200.
For example, when no workpiece 14 or the like is placed on the holding surface 200, the holding surface 200 can be cleaned by opening the water valve 2410 and activating the water supply source 241 to spray water from the numerous pores in the holding surface 200.

In addition, an air valve 2420 is disposed between the air supply source 242 and the suction unit 20. When air is supplied from the air supply source 242 with the air valve 2420 open, the supplied air is transmitted to the suction unit 20 through the flow path 243 and is sprayed from the numerous pores in the holding surface 200.
For example, when no workpiece 14 or the like is placed on the holding surface 200, the air valve 2420 is opened and the air supply source 242 is operated to inject air from the numerous pores in the holding surface 200, thereby removing grinding debris and the like adhering to the inside of the suction part 20 and the holding surface 200. At this time, the water valve 2410 may be opened to inject water together with the air.

2 Operation of the processing device (grinding of the workpiece)
The operation of the processing device 1 when grinding the workpiece 14 using the processing device 1 will be described. First, the workpiece 14 shown in Fig. 1 is placed on the holding surface 200 of the chuck table 2. Then, the suction source 240 shown in Fig. 3 is operated to transmit the generated suction force to the holding surface 200. As a result, the workpiece 14 is suction-held on the holding surface 200.

With the workpiece 14 being suction-held on the holding surface 200 , the chuck table 2 is moved in the +Y direction using a Y-axis moving means (not shown) or the like, and positioned below the grinding means 3 .
Next, the chuck table 2 is rotated at a predetermined rotational speed around the rotating shaft 25 using the rotation mechanism 26 to rotate the workpiece 14 held on the holding surface 200, and the grinding wheel 340 is rotated around the rotating shaft 35 using the spindle motor 32 shown in Figure 1.

While the workpiece 14 rotates around the rotation axis 25 and the grinding wheel 340 rotates around the rotation axis 35, the grinding means 3 is lowered in the -Z direction using the grinding feed means 4.

By lowering the grinding wheel 340 in the −Z direction, the lower surface 342 of the grinding wheel 340 comes into contact with the upper surface 140 of the workpiece 14 .
With the lower surface 342 in contact with the upper surface 140 of the workpiece 14, the grinding wheel 340 is further lowered in the -Z direction, thereby grinding the workpiece 14.

(Cleaning of holding surface)
As described above, when the grinding wheel 340 is brought into contact with the workpiece 14 held on the holding surface 200 to grind the workpiece 14 , grinding chips are generated and adhere to the holding surface 200 .
Therefore, the first holding surface cleaning mechanism 5 is used to remove the grinding debris adhering to the holding surface 200. Hereinafter, the operation of the processing apparatus 1 when the first holding surface cleaning mechanism 5 is used to remove the machining debris adhering to the holding surface 200 will be described.

First, the chuck table 2 shown in FIG. 1 is moved in the -Y direction using a Y-axis moving means (not shown) to position the chuck table 2 below the case 59 of the first holding surface cleaning mechanism 5 as shown in FIG. 3. At this time, the end of the case 59 of the first holding surface cleaning mechanism 5 on the +Y direction side is made to approximately coincide with the end of the upper surface 210 of the frame 21 of the chuck table 2 on the +Y direction side.

Then, the control means 9 (not shown) is used to control the rotation mechanism 26 to rotate the chuck table 2 at a predetermined rotation speed.
Furthermore, the lifting and lowering means 52 is controlled to lower the chemical solution supply nozzle 50 and the chemical solution suction nozzle 51 in the -Z direction, so that the chemical solution supply nozzle 50 and the chemical solution suction nozzle 51 approach the holding surface 200. At this time, a gap is created between the holding surface 200 and the chemical solution supply nozzle 50 and between the holding surface 200 and the chemical solution suction nozzle 51.

Next, the control means 9 is used to control the chemical supply nozzle 50 to supply the chemical liquid from the chemical supply source 500 to the chemical supply nozzle 50. This causes the chemical liquid to be sprayed from the nozzle 503 of the chemical supply nozzle 50 onto the holding surface 200.

Then, the suction source 510 is operated using the control means 9 to suck the chemical solution supplied to the holding surface 200 through the chemical solution suction nozzle 51 .
As the chuck table 2 rotates, the holding surface 200 approaches the chemical solution supply nozzle 50 in the −X direction shown in FIG.
This allows the chemical liquid to flow through the chemical liquid supply nozzle 50, the holding surface 200, and the chemical liquid suction nozzle 51 in that order, dissolving and removing the grinding debris adhering to the holding surface 200.
By removing the grinding chips adhering to the holding surface 200, the grinding chips are prevented from penetrating into the porous member, and a decrease in the suction force acting on the holding surface 200 when the workpiece 14 is held by suction onto the holding surface 200 can be prevented.

The processing apparatus 1 may be provided with a second holding surface cleaning mechanism 6 shown in FIG. 4 in place of the first holding surface cleaning mechanism 5 .
The second holding surface cleaning mechanism 6 includes a cleaning pad 69 connected to the lifting and moving means 52. As shown in Fig. 5, the cleaning pad 69 includes a disk portion 690 and a rim portion 692 formed in an annular shape on the outer periphery of a lower surface 691 of the disk portion 690.

Figure 6 shows the cleaning pad 69 being brought close to the holding surface 200. As shown in Figure 6, the outer diameter of the cleaning pad 69 is approximately the same as the outer diameter of the frame 21 of the chuck table 2. An injection port 603 for injecting the chemical solution is formed in the center of the lower surface 691 of the disc portion 690 of the cleaning pad 69, and a suction port 613 for sucking in the chemical solution is formed and extends in a ring shape on the edge portion 692 of the cleaning pad 69.

A chemical solution supply path 601 is formed in the connecting member 68 and the cleaning pad 69, penetrating both in the Z-axis direction. The upper end of the chemical solution supply path 601 is connected to the chemical solution supply source 500, and the lower end of the chemical solution supply path 601 is connected to the space below the cleaning pad 69 through an injection port 603 of the cleaning pad 69.
The chemical solution supply nozzle 60 is composed of a cleaning pad 69 and a chemical solution supply path 601 .

When the chemical liquid is supplied from the chemical liquid supply source 500, the chemical liquid passes through the chemical liquid supply path 601 and is sprayed from the nozzle 603 into the space below the cleaning pad 69. When the chemical liquid is sprayed from the nozzle 603 while the cleaning pad 69 is close to the holding surface 200, the sprayed chemical liquid is stored in the chemical liquid storage space 602 formed by the holding surface 200, the underside 691 of the disc portion 690 of the cleaning pad 69, and the inner surface 693 of the edge portion 692.

A suction path 611 is provided inside the cleaning pad 69. The suction path 611 is formed in an annular shape near the outer periphery inside the cleaning pad 69, and has an upper end connected to the suction source 510. A suction port 613 is connected to the lower end of the suction path 611.
The chemical solution suction nozzle 61 is composed of a cleaning pad 69 and a suction path 611 .

When the suction source 510 is operated, the generated suction force is transmitted to the suction port 613 through the suction path 611. For example, in a state in which the cleaning pad 69 is close to the holding surface 200 and the chemical solution is sprayed onto the holding surface 200 from the spray port 603, the chemical solution sprayed onto the holding surface 200 is sucked in from the suction port 613 by operating the suction source 510.
When the chemical liquid is stored in the chemical liquid storage space 602, the chemical liquid may be sucked through the suction port 613. Also, an annular seal member 694 may be provided on the outer surface of the disk portion 690. The inner surface of the seal member 694 is formed to have a size that forms a small gap between the inner surface of the seal member 694 and the outer surface of the chuck table 2.

The second holding surface cleaning mechanism 6 is connected to the control means 9. The other parts of the second holding surface cleaning mechanism 6 are configured in the same way as the first holding surface cleaning mechanism 5, so their description will be omitted.

When cleaning the holding surface 200 using the second holding surface cleaning mechanism 6, first, the control means 9 shown in FIG. 4 is used to control the lifting and moving means 52 to lower the chemical solution supply nozzle 50 and the chemical solution suction nozzle 51 to approach the holding surface 200. At this time, a gap is created between the holding surface 200 and the chemical solution supply nozzle 50 and the chemical solution suction nozzle 51.

Next, the control means 9 is used to supply the chemical liquid from the chemical liquid supply source 500 to the chemical liquid supply nozzle 60. This causes the chemical liquid to be supplied from the injection port 603 through the chemical liquid supply nozzle 60 to the holding surface 200.

Then, the suction source 510 is operated using the control means 9 to suck the chemical solution supplied to the holding surface 200 through the chemical solution suction nozzle 61 .
As a result, the chemical liquid flows through the chemical liquid supply nozzle 60, the holding surface 200, and the chemical liquid suction nozzle 61 in this order, and grinding debris adhering to the holding surface 200 is removed.

The processing device 1 may be equipped with a third holding surface cleaning mechanism 7 having a small diameter pad 79 as shown in FIG. 7.

8 shows the small diameter pad 79 approaching the holding surface 200. The small diameter pad 79 has a disk shape with a smaller diameter than the cleaning pad 69 of the second holding surface cleaning mechanism 6 described above.
8, a chemical solution supply path 701 connected to a chemical solution supply source 500 is formed inside small diameter pad 79. Chemical solution supply path 701 penetrates small diameter pad 79 in the Z-axis direction, and the lower end of chemical solution supply path 701 is connected to an injection port 703 formed in the center of a lower surface 791 of small diameter pad 79.
The small diameter pad 79 and the chemical supply path 701 constitute the chemical supply nozzle 70 .

A suction path 711 connected to the suction source 510 is formed inside the small diameter pad 79. The suction path 711 extends in an annular shape near the outer periphery of the small diameter pad 79, and its lower end is connected to a suction port 713 formed in an annular shape on the lower surface 791 of the small diameter pad 79.
The small diameter pad 79 and the suction path 711 constitute the chemical solution suction nozzle 71 .

Furthermore, the third holding surface cleaning mechanism 7 is equipped with a horizontal movement means 53 that moves the chemical solution supply nozzle 70 and the chemical solution suction nozzle 71 in the horizontal direction.

In the third holding surface cleaning mechanism 7, chemical liquid is supplied to the holding surface 200 from the chemical liquid supply nozzle 70 and the chemical liquid is suctioned from the chemical liquid suction nozzle 71 while the horizontal movement means 53 is controlled to move the chemical liquid supply nozzle 70 and the chemical liquid suction nozzle 71 horizontally, thereby cleaning each part of the holding surface 200.
The third holding surface cleaning mechanism 7 can, for example, pinpoint clean the outer circumferential edge of the holding surface 200 where grinding debris is particularly likely to accumulate.
That is, the chemical supply nozzle 70 may be positioned on the outer periphery of the holding surface, and the chuck table 2 may be rotated by the rotation mechanism 26 to clean the outer periphery of the holding surface 200 in an annular manner.
In addition, the holding surface 200 can be imaged with a camera (not shown), and if there is a part of a color on the holding surface 200 that indicates that grinding debris is attached, the chemical supply nozzle 7 can be positioned at the part determined to have grinding debris attached thereto and used for pinpoint cleaning.

The processing apparatus 1 includes a polishing means for supplying a slurry to the upper surface 140 of the workpiece 14 held on the holding surface 200 to polish the upper surface 140 of the workpiece 14, and when polishing the workpiece 14 using the polishing means, the polishing debris, the slurry, and the grinding debris adhering to the holding surface 200 may be removed by the chemical solution using a first holding surface cleaning mechanism 5, a second holding surface cleaning mechanism 6, or a third holding surface cleaning mechanism 7.
Even if the processing apparatus 1 includes a polishing means as described above, the holding surface 200 can be cleaned by supplying a chemical solution to the holding surface 200 using the first holding surface cleaning mechanism 5, the second holding surface cleaning mechanism 6, or the third holding surface cleaning mechanism 7, and then sucking up the supplied chemical solution.

1: Grinding device 10: Base 11: Column 14: Workpiece 140: Top surface of workpiece 2: Chuck table 20: Suction part 200: Holding surface 21: Frame 210: Top surface 240: Suction source 241: Water supply source 242: Air supply source 243: Flow path 25: Rotating shaft 26: Rotating means 260: Motor 262: Drive shaft 263: Drive pulley 264: Transmission belt 265: Driven pulley 266: Driven shaft 267: Rotary joint 2400: Suction valve 2410: Air valve 2420: Water valve 2430: Suction path 2431: Water path 2432: Air path 28: Cover 29: Bellows 3: Grinding means 30: Spindle 31: Housing 32: Spindle motor 33: Mount 34: Grinding wheel 340: Grinding stone 341: Wheel base 342: Underside 35: Rotating shaft 4: Grinding feed means 40: Ball screw 41: Guide rail 42: Z-axis motor 420: Encoder 43: Lifting plate 44: Holder 45: Rotating shaft 46: Height recognition means 460: Scale 461: Height recognition section 5: First holding surface cleaning mechanism 50: Chemical solution supply nozzle 500: Chemical solution supply source 501: Chemical solution supply path 502: Underside 503: Spray nozzle 51: Chemical solution suction nozzle 518: Long diameter portion 519: Short diameter portion 510: Suction source 511: Suction path 52: Lifting and moving means 520: Cylinder 521: Piston portion 522: Arm portion 523: Shaft portion 59: Case 53: Horizontal movement means 9: Control means 6: Second holding surface cleaning mechanism 60: Chemical liquid supply nozzle 601: Chemical liquid supply path 602: Chemical liquid storage space 603: Jet orifice 61: Chemical liquid suction nozzle 611: Suction path 613: Suction port 69: Cleaning pad 690: Disc portion 691: Underside 692: Edge portion 963: Inner surface 694: Seal member 7: Third holding surface cleaning mechanism 70: Chemical liquid supply nozzle 701: Chemical liquid supply path 702: Chemical liquid storage space 703: Jet orifice 71: Chemical liquid suction nozzle 711: Suction path 713: Suction port 79: Small diameter pad 791: Underside

Claims (2)

a chuck table having a holding surface for holding a workpiece;
a grinding means for grinding the workpiece held on the holding surface while generating grinding chips by bringing a grinding wheel into contact with the workpiece, or a polishing means for polishing the workpiece while generating grinding chips by supplying a slurry to the workpiece;
A processing apparatus including a holding surface cleaning mechanism for cleaning the holding surface,
The support surface cleaning mechanism includes:
a chemical supply nozzle that supplies a chemical capable of dissolving grinding or polishing debris from one nozzle to the holding surface;
a chemical solution suction nozzle including a suction port arranged to surround an injection port of the chemical solution supply nozzle from an outer periphery side, and suctioning the chemical solution supplied from the chemical solution supply nozzle to the holding surface through the suction port ;
a lifting means for moving the chemical supply nozzle and the chemical suction nozzle toward and away from the holding surface, and a control means;
The control means
the liquid supply nozzle and the liquid suction nozzle are lowered by the lifting and moving means to approach the holding surface with a gap between them;
supplying the chemical solution from the chemical solution supply nozzle to the holding surface;
Aspirating the chemical solution supplied to the holding surface with the chemical solution suction nozzle;
This processing device removes grinding or polishing debris adhering to the holding surface. a chuck table having a holding surface for holding a workpiece; and a rotation mechanism for rotating the chuck table about an axis of the center of the holding surface of the chuck table;
a grinding means for grinding the workpiece held on the holding surface while generating grinding chips by bringing a grinding wheel into contact with the workpiece, or a polishing means for polishing the workpiece while generating grinding chips by supplying a slurry to the workpiece;
A processing apparatus including a holding surface cleaning mechanism for cleaning the holding surface,
The support surface cleaning mechanism includes:
a chemical supply nozzle having a length equal to or greater than the radius and equal to or less than the diameter of the holding surface, and supplying a chemical capable of dissolving grinding or polishing debris to the holding surface from a plurality of nozzles aligned in the longitudinal direction;
a chemical liquid suction nozzle disposed in parallel with the chemical liquid supply nozzle and behind the chemical liquid supply nozzle in the rotation direction of the chuck table;
A control means,
The control means
rotating the chuck table at a predetermined rotation speed by the rotation mechanism;
supplying the chemical solution from the chemical solution supply nozzle to the holding surface;
and sucking the chemical liquid supplied to the holding surface and guided by the rotation of the chuck table with the chemical liquid suction nozzle.
The chemical liquid is caused to flow through the chemical liquid supply nozzle, the holding surface, and the chemical liquid suction nozzle in this order;
A processing device that removes grinding or polishing debris adhering to the holding surface.

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