JP7579161B2 - Soldering Equipment - Google Patents

Description

The present invention relates to a soldering device that is attached to an automatic machine such as a soldering robot.

A soldering head for a soldering device that is attached to an automatic machine such as a soldering robot and used has a soldering iron and a solder wire supply mechanism having a solder nozzle that supplies linear solder (solder wire) to the tip of the soldering iron, and the linear solder supplied from the solder nozzle is melted by the tip of the soldering iron to solder an object to be soldered (workpiece) such as an electronic component (Patent Document 1).

Patent No. 6062875

In the conventional soldering head, when moving the soldering iron mechanism and the solder wire supply mechanism up and down, two drive means, a soldering iron drive means and a nozzle drive means, are used to adjust the height of the lowest point of the solder wire supply nozzle relative to the height of the lowest point of the soldering iron tip.

However, in conventional methods, two drive sources (two air cylinders, etc.) were required to use two drive means. It was difficult to control two drive means with one drive source, and in conventional methods, the nozzle tip driven by the nozzle drive means could only be moved upward relative to the iron tip driven by the iron drive means at the lowest point.

The present invention was created in light of these points, and its purpose is to provide a soldering device that can easily, quickly, and accurately control the height of the lowest point of the solder supply nozzle relative to the height of the lowest point of the solder iron tip when moving the solder iron mechanism and the solder supply mechanism up and down without using two driving means, etc.

In order to achieve the above object, a soldering apparatus according to the present invention comprises:
A soldering device having a frame, a soldering iron mechanism, and a solder wire supply mechanism,
a vertical movement unit that moves the soldering iron mechanism vertically relative to the frame;
an elastic member having one end in contact with the soldering iron mechanism and the other end in contact with the solder wire supply mechanism, and biasing the solder wire supply mechanism so that when the soldering iron mechanism moves up and down, the solder wire supply mechanism also moves up and down in the same direction;
A fulcrum block rod fixed to the frame and extending horizontally;
a link arm supported rotatably about the fulcrum block rod;
a sliding block rod that is fixed to the soldering iron mechanism, extends horizontally, and is inserted into a long hole provided in the link arm;
a sliding rod that is fixed to the solder wire supply mechanism, extends vertically, and is slidable on an upper portion of the link arm in an axial direction of the fulcrum block rod and in a direction perpendicular to the axial direction of the sliding block rod;
The sliding block rod moves up and down together with the soldering iron mechanism in the same direction and over the same distance;
The sliding rod moves up and down in the same direction and over the same distance together with the solder wire supply mechanism,
The link arm rotates in response to the up and down movement of the sliding block rod,
The present invention is characterized in that the difference in the descending distance of the solder wire supply mechanism relative to the descending distance of the solder iron mechanism is determined by the relationship between the horizontal distance between the fulcrum block rod and the sliding rod and the horizontal distance between the fulcrum block rod and the sliding block rod.

The present invention makes it possible to provide a soldering device that can easily, quickly, and accurately control the distance the solder wire supply mechanism is lowered relative to the distance the solder iron mechanism is lowered, without using two drive means.

1 is a perspective view showing a schematic configuration of a soldering device according to an embodiment of the present invention; 2A to 2C are six-view diagrams (front view, rear view, left side view, right side view, plan (top) view, and bottom view) of the solder wire supply mechanism of the soldering device shown in FIG. 2 is a six-view diagram of a soldering iron mechanism of the soldering apparatus shown in FIG. 1 . 2 is a six-view diagram of a link arm of the soldering apparatus shown in FIG. 1. 2 is a six-view diagram of a sliding block of the soldering apparatus shown in FIG. 1. 2 is a six-view diagram of a sliding rod of the soldering apparatus shown in FIG. 1. 3 is a six-view diagram of a block into which an adjuster bolt of the solder wire supply mechanism shown in FIG. 2 is inserted and an upper block. FIG. This figure shows the state before the soldering iron mechanism and the solder wire supply mechanism start to descend and the state after they reach their lowest point when the distance from the fulcrum block rod to the sliding rod is equal to the distance from the fulcrum block rod to the sliding block rod. 13A and 13B are diagrams showing the state before the soldering iron mechanism and the solder wire supply mechanism start to descend and the state after they reach their lowest point when the distance from the fulcrum block rod to the sliding rod is shorter than the distance from the fulcrum block rod to the sliding block rod. 13A and 13B are diagrams showing the state before the soldering iron mechanism and the solder wire supply mechanism start to descend and the state after they reach their lowest point when the distance from the fulcrum block rod to the sliding rod is longer than the distance from the fulcrum block rod to the sliding block rod. 11 is a diagram showing a state in which the soldering iron mechanism and the wire solder supply mechanism shown in FIG. 8 to FIG. 10 have reached their lowest points.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the soldering apparatus according to the present invention will be described in detail with reference to the accompanying drawings. However, the following preferred embodiments do not limit the technical scope of the present invention.
FIG. 1 is a perspective view showing a schematic configuration of a soldering apparatus according to an embodiment of the present invention.
As shown in FIG. 1, the soldering apparatus of this embodiment has a fulcrum block 1, a link arm 2, a sliding block 3, a sliding rod 4, a spring 6, a linear guide 7, a solder wire supply mechanism 8, a soldering iron mechanism 9, and an air cylinder 12.
In the soldering device according to this embodiment, a spring 6 (coil spring) is used as the elastic member, but the elastic member is not limited to a coil spring and may be a leaf spring, elastic rubber, elastic resin, etc. The elastic member may be any member that biases the solder wire supply mechanism so that the solder wire supply mechanism moves up and down in the same direction as the soldering iron mechanism moves up and down.
The linear guide 7 has a guide rail 71 and a slide block 72 .
The air cylinder 12 has a cylinder body 121 and a cylinder rod 122. In Fig. 1, the cylinder body 121 is shown cut vertically so that the internal structure of the air cylinder can be seen.

FIG. 2 is a six-view diagram (front view, rear view, left side view, right side view, plan (top) view, and bottom view) of the solder wire supply mechanism.
2, the solder supply mechanism 8 has an upper block 81, a rod 82, a solder supply unit 83, a block 86 into which an adjuster bolt is inserted, a lower block 87, and a supply nozzle 88. The upper block 81 has a through hole 84 that passes through the upper block 81 in the vertical direction. The solder supply unit 83 and the lower block 87 also have a through hole 85 that passes through the solder supply unit 83 and the lower block 87 in the vertical direction.

FIG. 3 is a six-view diagram of the soldering iron mechanism.
3, the soldering iron mechanism 9 has a rod 91, a soldering iron 92, a lower block 93, and a slide bracket 94. The lower block 93 has a through hole 95 that passes through the lower block 93 in the vertical direction.
The rod 82 of the solder wire supply mechanism 8 is inserted into the through hole 95 of the soldering iron mechanism 9 .
The rod 91 of the soldering iron mechanism 9 is inserted into the through hole 84 of the solder wire supply mechanism 8 .
The soldering iron 92 is inserted into the through hole 85 of the solder wire supply mechanism 8 .

FIG. 4 is a six-view diagram of the link arm.
As shown in FIG. 4, the link arm 2 has a through hole 21 and a through hole 22 penetrating the link arm 2 from the rear surface to the front surface, and has a recess 23 on the upper surface.
The openings of the through holes 22 provided on the rear and front sides of the link arm 2 are long in the horizontal direction. The fulcrum block rod 11 is inserted into the through hole 21, and the sliding block rod 31 is inserted into the through hole 22.
The recess 23 provided on the upper surface of the link arm 2 is long in the horizontal direction. The sliding rod 4 can move horizontally over the recess 23 in the long axis direction of the recess 23 while keeping the tip (lower end) of the sliding rod 4 in contact with the recess 23.
The width W1 of the recess 23 is larger than the width W2 of the through hole 22 .

FIG. 5 is a six-view diagram of the sliding block.
As shown in FIG. 5 , the sliding block 3 has a sliding block rod 31 , a through hole 32 and a sliding block U-groove 33 .
The sliding block 3 is held by the solder trowel rod 91 and the side of the link arm 2 and rests on the lower block 93 by gravity.
The through hole 32 passes vertically through the sliding block 3. A rod 91 of a soldering iron is inserted into the through hole 32.
The sliding block U-groove 33 also passes through the sliding block 3 in the vertical direction. A rod 82 of the solder wire supply mechanism 8 is inserted into the sliding block U-groove 33.

FIG. 6 is a six-view diagram of the sliding rod.
As shown in FIG. 6, the sliding rod 4 has a through hole 41 in the head portion.
The through hole 41 passes horizontally through the head of the sliding rod 4. The inner peripheral surface of the through hole 41 is threaded.

FIG. 7 is a six-view diagram of the block into which the adjuster bolt is inserted and the upper block of the solder wire supply mechanism.
As shown in FIG. 7, a block 86 into which the adjuster bolt 5 is inserted horizontally is fixed to the front surface of the upper block 81.
The block 86 has a through hole 52 on its left side through which the adjuster bolt 5 can pass in the horizontal direction, and a recess 53 on the inner surface of its right side that can support the tip of the adjuster bolt 5 .
The block 86 has a through hole 54 on the bottom surface into which the upper portion 42 of the sliding rod 4 can be inserted from below. The through hole 54 has a rectangular shape with rounded ends.

The through hole 41 in the head of the sliding rod 4 inserted into the block 86 from the through hole 54 is screwed with the adjuster bolt 5 inserted from the through hole 52, and the tip of the adjuster bolt 5 is rotatably supported by the recess 53. As a result, the sliding rod 4 can be moved horizontally by rotating the adjuster bolt 5.

The fulcrum block 1 is fixed to a frame (not shown).
The solder wire supply mechanism 8 is a driven mechanism, and when the soldering iron mechanism 9 moves downward, it is pushed downward by the spring 6 and moves downward simultaneously with the soldering iron mechanism 9.
The sliding rod 4 is fixed to the solder feed mechanism 8 and moves up and down the same distance in the same direction together with the solder feed mechanism 8. The link arm 2 is supported rotatably with the fulcrum block rod 11 of the fulcrum block 1 as a fulcrum.

<When the distance from the fulcrum block rod to the sliding rod is equal to the distance from the fulcrum block rod to the sliding block rod>
FIG. 8 shows a case where the distance from the fulcrum block rod to the sliding rod is equal to the distance from the fulcrum block rod to the sliding block rod.
1A shows a state before the soldering iron mechanism and the solder wire supply mechanism start to descend;
4B shows the state in which the tip of the soldering iron is in contact with a work (an object to be soldered).
A1: The upper stopper block 101 is in the release position, the lower stopper block 102 is in the lock position, and the sliding rod 4 is in the center position (directly above the sliding block rod 31).

A2: When the cylinder rod 122 of the air cylinder 12 descends, the slide bracket 94 of the soldering iron mechanism 9 is also pushed downward, and the soldering iron mechanism 9 descends.
A3: The descending iron mechanism 9 is stopped at an intermediate position by the lower stopper block 102. The amount of descent is about 10 mm.

A4: When the soldering iron mechanism 9 descends and the rod 91 descends, the upper block 81 is pushed downward by the spring 6, and the solder wire supply mechanism 8 also descends. At the time of A1 above (when the sliding rod 4 is directly above the sliding block rod 31), the sliding rod 4, adjuster bolt 5, and upper block 81 descend at approximately the same time and by approximately the same distance as the sliding block rod 31, sliding block 3, and lower block 93. As a result, at the time of A1 above, the solder wire supply mechanism 8 and the soldering iron mechanism 9 descend at approximately the same time and by approximately the same distance. The amount of descent is approximately 10 mm.

<When the distance from the fulcrum block rod to the sliding rod is shorter than the distance from the fulcrum block rod to the sliding block rod>
FIG. 9 shows a case where the distance from the fulcrum block rod to the sliding rod is shorter than the distance from the fulcrum block rod to the sliding block rod.
1A shows a state before the soldering iron mechanism and the solder wire supply mechanism start to descend;
4B shows the state in which the tip of the soldering iron is in contact with a work (an object to be soldered).
B1: The upper stopper block 101 is in the release position, the lower stopper block 102 is in the lock position, and the sliding rod 4 is on the fulcrum block side (to the left of directly above the sliding block rod 31).

B2: When the cylinder rod 122 of the air cylinder 12 descends, the slide bracket 94 of the soldering iron mechanism 9 is also pushed downward, and the soldering iron mechanism 9 descends.
B3: The descending iron mechanism 9 is stopped at an intermediate position by the lower stopper block 102. The amount of descent is about 10 mm.

B4: When the soldering iron mechanism 9 descends and the rod 91 descends, the upper block 81 is pushed downward by the spring 6, and the solder wire supply mechanism 8 also descends.
At the time A1 (when the sliding rod 4 is directly above the sliding block rod 31), the solder wire supply mechanism 8 and the soldering iron mechanism 9 move downward at approximately the same time and by approximately the same distance.
However, as shown in FIGS. 9 and 11A, since the sliding rod 4 is located close to the fulcrum block rod 11, the distance that the sliding rod 4 descends is shorter by several mm than the distance that the sliding block rod 31 descends.
As a result, in the above-mentioned B1, the distance that the solder wire supply mechanism 8 moves down is shorter than the distance that the soldering iron mechanism 9 moves down by about several mm.
In other words, compared to the state shown in Figure 8, in the state shown in Figure 9, the solder thread supply position moves upward during soldering, making it possible to perform soldering suitable for narrow pad soldering (hereinafter also referred to as clamping soldering).

For example, when the height of the sliding block rod 31 is the same as the height of the fulcrum block rod 11 (i.e., when the link arm 2 is in a horizontal state), the horizontal distance Hc (FIG. 11(b)) between the fulcrum block rod 11 and the sliding block rod 31 is 26 mm,
It is assumed that the horizontal distance H _L (FIG. 11(a)) between the fulcrum block rod 11 and the sliding rod 4 is 19.5 mm.
In this case, if the descending distance Vc (FIG. 11(b)) of the sliding block rod 31 is 10 mm,
The lowering distance V _L of the sliding rod 4 (FIG. 11(a)) is 7.18 mm.
As a result, the distance that the solder wire supply mechanism 8 descends is approximately 2.82 mm shorter than the distance that the soldering iron mechanism 9 descends. In other words, D _L -Dc is approximately 2.82 mm (FIGS. 11A and 11B).
The descending distance of the sliding rod 4 is approximately equal to the descending distance _VL of the intersection point P _L described later (FIG. 11(a)).

<When the distance from the fulcrum block rod to the sliding rod is longer than the distance from the fulcrum block rod to the sliding block rod>
FIG. 10 shows a case where the distance from the fulcrum block rod to the sliding rod is longer than the distance from the fulcrum block rod to the sliding block rod.
1A shows a state before the soldering iron mechanism and the solder wire supply mechanism start to descend;
4B shows the state in which the tip of the soldering iron is in contact with a work (an object to be soldered).
C1: The upper stopper block 101 is in the release position, the lower stopper block 102 is in the lock position, and the sliding rod 4 is on the fulcrum block side (to the right of directly above the sliding block rod 31).

C2: When the cylinder rod 122 of the air cylinder 12 descends, the slide bracket 94 of the soldering iron mechanism 9 is also pushed downward, and the soldering iron mechanism 9 descends.
C3: The descending iron mechanism 9 is stopped at an intermediate position by the lower stopper block 102. The amount of descent is about 10 mm.

C4: When the soldering iron mechanism 9 descends and the rod 91 descends, the upper block 81 is pushed downward by the spring 6, and the solder wire supply mechanism 8 also descends.
At the time A1 (when the sliding rod 4 is directly above the sliding block rod 31), the solder wire supply mechanism 8 and the soldering iron mechanism 9 move downward at approximately the same time and by approximately the same distance.
However, as shown in FIGS. 10 and 11C, since the sliding rod 4 is located far from the fulcrum block rod 11, the distance that the sliding rod 4 descends is several mm longer than the distance that the sliding block rod 31 descends.
As a result, in the above-mentioned C1, the distance that the solder wire supply mechanism 8 moves down is longer than the distance that the soldering iron mechanism 9 moves down by about several mm.
In other words, compared to the state shown in FIG. 8, in the state shown in FIG. 10, the position at which the solder wire is supplied moves downward during soldering, making it possible to perform soldering suitable for soldering wide pads.

For example, when the height of the sliding block rod 31 is the same as the height of the fulcrum block rod 11 (i.e., when the link arm 2 is in a horizontal state), the horizontal distance Hc (FIG. 11(b)) between the fulcrum block rod 11 and the sliding block rod 31 is 26 mm,
It is assumed that the horizontal distance H _R (FIG. 11(c)) between the fulcrum block rod 11 and the sliding rod 4 is 32.5 mm.
In this case, if the descending distance Vc (FIG. 11(b)) of the sliding block rod 31 is 10 mm,
The lowering distance V _R of the sliding rod 4 (FIG. 11(c)) is 12.18 mm.
As a result, the distance that the solder wire supply mechanism 8 descends is approximately 2.18 mm longer than the distance that the soldering iron mechanism 9 descends. In other words, Dc-D _R is approximately 2.18 mm (FIGS. 11B and 11C).
The descending distance of the sliding rod 4 is approximately equal to the descending distance V _R of the intersection point P _R described later (FIG. 11C).

FIG. 11B shows a state in which the sliding rod 4 is in the central position (directly above the sliding block rod 31) and the soldering iron mechanism 9 is lowered.
In FIG.
Hc indicates the horizontal distance between the fulcrum block rod 11 and the sliding rod 4,
Vc indicates the vertical distance between the fulcrum block rod 11 and the sliding block rod 31,
Dc indicates the distance between the lower end surface of the lower block 87 of the solder wire supply mechanism 8 and the work placement surface.

FIG. 11A shows a state in which the sliding rod 4 is in a position closer to the fulcrum block rod 11 than the central position (directly above the sliding block rod 31) and the soldering iron mechanism 9 is lowered.
In FIG.
H _L indicates the horizontal distance between the fulcrum block rod 11 and the sliding rod 4,
P _L indicates the intersection point of the "straight line connecting the fulcrum block rod 11 and the sliding block rod 31" and the "extended line of the axis of the sliding rod 4",
V _L indicates the vertical distance between the fulcrum block rod 11 and the intersection point PL,
D _L indicates the distance between the lower end surface of the lower block 87 of the solder wire supply mechanism 8 and the work placement surface.

FIG. 11C shows a state in which the sliding rod 4 is at a position farther from the fulcrum block rod 11 than the central position (directly above the sliding block rod 31) and the soldering iron mechanism 9 is lowered.
In FIG.
H _R indicates the horizontal distance between the fulcrum block rod 11 and the sliding rod 4,
P _R indicates the intersection of the "extension of the straight line connecting the fulcrum block rod 11 and the sliding block rod 31" and the "extension of the axis of the sliding rod 4",
V _R indicates the vertical distance between the fulcrum block rod 11 and the intersection point PR,
D _R indicates the distance between the lower end surface of the lower block 87 of the solder wire supply mechanism 8 and the work placement surface.

H _L , V _L , Hc, Vc, H _R , V _R , D _L , Dc and D _R satisfy the following relational expressions (1) to (3).
V _L /H _L =Vc/Hc=V _R /H _R ...(1)
Vc-V _L =D _L -Dc...(2)
V _R -Vc=Dc-D _R ...(3)

As described above, by changing the horizontal position of the sliding rod, the distance the solder wire supply mechanism is lowered relative to the distance the solder iron mechanism is lowered can be easily, quickly, and with high precision, making it possible to perform soldering suitable for narrow pad soldering and soldering suitable for wide pad soldering.

REFERENCE SIGNS LIST 1 fulcrum block 2 link arm 3 sliding block 33 sliding block U-groove 4 sliding rod 5 adjuster bolt 6 upper block pressing spring 7 linear guide
71 Guide rail
72 Slide block 8 Solder wire supply mechanism 81 Upper block 82 Rod 83 Solder wire supply 86 Block into which adjuster bolt is inserted 87 Lower block 88 Supply nozzle 9 Soldering iron mechanism 91 Rod (soldering iron rod)
92 Soldering iron 93 Lower block 94 Slide bracket 101 Upper stopper block 102 Lower stopper block 12 Air cylinder 121 Cylinder body 122 Cylinder rod

Claims (2)

A soldering device having a frame, a soldering iron mechanism, and a solder wire supply mechanism,
a vertical movement unit that moves the soldering iron mechanism vertically relative to the frame;
an elastic member having one end in contact with the soldering iron mechanism and the other end in contact with the solder wire supply mechanism, and biasing the solder wire supply mechanism so that when the soldering iron mechanism moves up and down, the solder wire supply mechanism also moves up and down in the same direction;
A fulcrum block rod fixed to the frame and extending horizontally;
a link arm supported rotatably about the fulcrum block rod;
a sliding block rod that is fixed to the soldering iron mechanism, extends horizontally, and is inserted into a long hole provided in the link arm;
a sliding rod that is fixed to the solder wire supply mechanism, extends vertically, and is slidable on an upper portion of the link arm in an axial direction of the fulcrum block rod and in a direction perpendicular to the axial direction of the sliding block rod;
The sliding block rod moves up and down together with the soldering iron mechanism in the same direction and over the same distance;
The sliding rod moves up and down in the same direction and over the same distance together with the solder wire supply mechanism,
The link arm rotates in response to the up and down movement of the sliding block rod,
A soldering apparatus characterized in that the difference in the descending distance of the solder wire supply mechanism relative to the descending distance of the soldering iron mechanism is determined by the relationship between the horizontal distance between the fulcrum block rod and the sliding rod and the horizontal distance between the fulcrum block rod and the sliding block rod. when the horizontal distance between the fulcrum block rod and the sliding rod is equal to the horizontal distance between the fulcrum block rod and the sliding block rod, a descending distance of the solder wire supply mechanism is substantially equal to a descending distance of the soldering iron mechanism,
when the horizontal distance between the fulcrum block rod and the sliding rod is shorter than the horizontal distance between the fulcrum block rod and the sliding block rod, the descending distance of the solder wire supply mechanism is shorter than the descending distance of the soldering iron mechanism,
2. The soldering apparatus according to claim 1, wherein when the horizontal distance between the fulcrum block rod and the sliding rod is longer than the horizontal distance between the fulcrum block rod and the sliding block rod, a descending distance of the solder wire supply mechanism is longer than a descending distance of the soldering iron mechanism.

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