JP7581766B2 - Optical Modules - Google Patents

Description

The present disclosure relates to an optical module .

A laser module is known that includes a first thermoelectric cooling module and a second thermoelectric cooling module and has a temperature regulator that performs heat exchange using the Peltier effect (see, for example, Patent Document 1). Also known is an optical module that has a plate-shaped lower substrate and multiple plate-shaped upper substrates and has a temperature regulator that uses a Peltier element to regulate the temperature of the laser element (see, for example, Patent Document 2). Also known is a thermomodule in which the size of each electrode formed on a pair of insulating substrates is set to a size that allows only one end face of a thermoelectric element to be joined (see, for example, Patent Document 3).

JP 2004-134776 A JP 2019-140306 A JP 2007-266084 A

The electronic cooling module includes a heat sink, a heat absorption plate, and a number of semiconductor pillars arranged between the heat sink and heat absorption plates. The semiconductor pillars are made up of Peltier elements, with p-type semiconductor pillars and n-type semiconductor pillars arranged alternately next to each other. The ends of adjacent semiconductor pillars are alternately electrically connected in series to form an electrical circuit. In the electronic cooling module, a member that detects temperature is placed on the heat absorption plate. When a current is passed through the electrical circuit, for example, the heat absorption plate side is cooled and the heat sink side generates heat. In this way, the Peltier effect is utilized to cool, for example, a member placed on the heat absorption plate, to adjust the temperature.

When using an electronic cooling module to adjust the temperature of a component, there may be cases where the heat-generating area is unevenly positioned. In such cases, if the electronic cooling module uniformly cools the component placed on the heat absorption plate, a temperature distribution will occur. When this type of temperature distribution is undesirable, it can be difficult to address the situation.

In Patent Document 1, a first thermoelectric cooling module and a second thermoelectric cooling module are used. However, since the electronic cooling modules are separate components, it is necessary to assemble two components during manufacturing, which reduces workability. In the temperature regulator disclosed in Patent Document 2, the upper substrate that serves as the heat absorption plate is divided. However, although the lower substrate that serves as the heat dissipation plate is common, multiple upper substrates that serve as heat absorption plates are provided, so there is a risk that warping will occur due to temperature changes in the heat dissipation plate, and the relative positions of the components arranged on the two upper substrates will shift. Therefore, it is difficult to respond to cases where strict component arrangement is required. In addition, according to Patent Document 3, there are shape restrictions, which may impair convenience in mounting electronic components. In the electronic cooling module using the Peltier effect as described above, it is desired to be able to appropriately adjust the temperature of the components that generate temperature distribution, and to improve workability during manufacturing.

Therefore, one of the objectives of this disclosure is to provide an electronic cooling module that can appropriately adjust the temperature of components that cause temperature distribution and can improve workability during manufacturing.

The electronic cooling module according to the present disclosure includes a heat sink, a plate-like plate including a first region and a second region spaced apart from the first region in the thickness direction, and a heat absorption plate spaced apart from the heat sink in the thickness direction, a plurality of first semiconductor pillars disposed between the heat sink and the heat absorption plate in a region overlapping with the first region in the thickness direction of the heat absorption plate and connected to the heat sink and the heat absorption plate, a plurality of second semiconductor pillars disposed between the heat sink and the heat absorption plate in a region overlapping with the second region in the thickness direction of the heat absorption plate and connected to the heat sink and the heat absorption plate, a first electric circuit electrically connecting the plurality of first semiconductor pillars, and a second electric circuit electrically connecting the plurality of second semiconductor pillars.

The electronic cooling module described above allows the temperature of components that have temperature distribution to be appropriately adjusted, and also improves workability during manufacturing.

FIG. 1 is a schematic side view of a thermoelectric cooling module according to a first embodiment. FIG. 2 is a schematic plan view of the thermoelectric cooling module according to the first embodiment shown in FIG. FIG. 3 is a schematic perspective view showing a part of the thermoelectric cooling module according to the first embodiment. FIG. 4 is an external perspective view showing the structure of an optical module including a thermoelectric cooling module according to the first embodiment. FIG. 5 is an external perspective view showing a state in which the cap of the optical module shown in FIG. 4 is removed. FIG. 6 is a schematic cross-sectional view of an optical module including a thermoelectric cooling module according to the first embodiment. FIG. 7 is a schematic cross-sectional view of an optical module including a thermoelectric cooling module according to the first embodiment. FIG. 8 is a schematic side view of the thermoelectric cooling module according to the third embodiment. FIG. 9 is a schematic side view of the electronic cooling module according to the fourth embodiment. FIG. 10 is a schematic side view of the thermoelectric cooling module according to the fifth embodiment.

[Description of the embodiments of the present disclosure]
First, the embodiments of the present disclosure will be described. The electronic cooling module according to the present disclosure includes a heat sink, a plate-like heat sink including a first region and a second region spaced apart from the first region in the thickness direction, and spaced apart from the heat sink in the thickness direction, a plurality of first semiconductor pillars arranged between the heat sink and the heat absorption plate in a region overlapping with the first region in the thickness direction of the heat absorption plate and connected to the heat sink and the heat absorption plate, a plurality of second semiconductor pillars arranged between the heat sink and the heat absorption plate in a region overlapping with the second region in the thickness direction of the heat absorption plate and connected to the heat sink and the heat absorption plate, a first electric circuit electrically connecting the plurality of first semiconductor pillars, and a second electric circuit electrically connecting the plurality of second semiconductor pillars.

In the electronic cooling module of the present disclosure, the heat absorption plate includes a first region and a second region disposed away from the first region. In the first region, the temperature of the first region can be adjusted by controlling the amount of current flowing through a first electric circuit formed by electrically connecting a plurality of first semiconductor pillars. In the second region, the temperature of the second region can be adjusted by controlling the amount of current flowing through a second electric circuit formed by electrically connecting a plurality of second semiconductor pillars. That is, the temperature can be adjusted separately in the first region and the second region of the heat absorption plate. In addition, since the heat absorption plate is composed of a single plate-shaped member, even if the heat dissipation plate warps due to thermal expansion or thermal contraction based on temperature change, the relative positional deviation of the members on the heat absorption plate due to the warping of the heat dissipation plate can be suppressed. In addition, there is no need to prepare and install a plurality of electronic cooling modules, and workability can be improved. Therefore, according to such an electronic cooling module, the temperature of the member in which a temperature distribution occurs can be appropriately adjusted, and workability during manufacturing can be improved.

The electronic cooling module may further include a first temperature detection unit that detects the temperature of the first region, and a second temperature detection unit that detects the temperature of the second region. In this way, the temperature of each region can be adjusted based on the temperature of the first region detected by the first temperature detection unit and the temperature of the second region detected by the second temperature detection unit. This makes it possible to more appropriately adjust the temperature of each of the first and second regions.

The electronic cooling module may have a groove that is disposed between the first and second regions when viewed in the thickness direction of the heat absorption plate and reduces the thickness of the heat absorption plate. In this way, heat transfer through the heat absorption plate between the first and second regions can be suppressed. This makes it possible to more appropriately adjust the temperature of each of the first and second regions.

In the electronic cooling module, the distance between the first region and the second region when viewed in the thickness direction of the heat absorption plate may be wider than the distance between the multiple first semiconductor pillars and the distance between the multiple second semiconductor pillars. In this way, the first region and the second region can be physically arranged with a wide distance between them. Therefore, the temperature of each of the first region and the second region can be more appropriately adjusted.

The electronic cooling module may further include a third semiconductor pillar that is disposed between the first region and the second region when viewed in the thickness direction of the heat absorption plate, is not electrically connected to either the first electric circuit or the second electric circuit, and connects the heat sink and the heat absorption plate. In this way, the first region and the second region can be separated by the region in which the third semiconductor pillar is disposed, and heat transfer between the first region and the second region can be suppressed. Therefore, the temperature of each of the first region and the second region can be more appropriately adjusted.

The optical module according to the present disclosure includes a support plate, the electronic cooling module arranged on the support plate, and a light forming section arranged on the electronic cooling module, the light forming section being configured to form light. The light forming section is arranged in the first region when viewed in the thickness direction of the heat absorption plate, and includes a semiconductor light emitting element that emits light.

The light forming section, which has a semiconductor light emitting element that emits light, can adjust the temperature of the light forming section to within a certain range even when the temperature of the surrounding environment changes, and can stabilize the output of the emitted light, by using an electronic cooling module included in the optical module. In the light forming section, the semiconductor light emitting element generates heat when emitting light, so the area in which the semiconductor light emitting element is located is significantly affected by the heat and the temperature becomes relatively high. Therefore, it is necessary to actively absorb heat by cooling. On the other hand, in areas in which the semiconductor light emitting element is not located, the effect of the heat is small and the temperature remains relatively low. Therefore, it is not necessary to actively absorb heat by cooling. In other words, such an optical module is a component in which a temperature distribution occurs when the optical module is operating, i.e., when light is emitted.

Here, according to the optical module of the present disclosure, by arranging the region in which the semiconductor light-emitting element is arranged within the first region, control by the first electric circuit in the first region can be performed. Therefore, the temperature can be adjusted separately in the first region and in the second region in which the semiconductor light-emitting element is not arranged. Therefore, according to such an optical module, the influence of temperature on the members other than the semiconductor light-emitting element that constitute the optical module can be reduced, and the temperature can be appropriately adjusted.

The optical module may further include a mirror driving mechanism that is disposed in the second region as viewed in the thickness direction of the heat absorption plate and scans the light emitted from the semiconductor light-emitting element. The mirror driving mechanism periodically oscillates the mirror that reflects the light emitted from the semiconductor light-emitting element, thereby scanning the light emitted from the semiconductor light-emitting element. By including the mirror driving mechanism in the optical module, the light emitted from the semiconductor light-emitting element can be scanned and emitted outside the optical module. In this way, the optical module can use the light emitted from the semiconductor light-emitting element to perform drawing. Here, the oscillating motion of the mirror is highly temperature-dependent, and unless the temperature of the mirror driving mechanism is within a certain temperature range, the mirror's deflection angle changes significantly. In this case, the light emitted from the semiconductor light-emitting element cannot be properly scanned. In addition, if the relative position of the mirror driving mechanism with respect to the semiconductor light-emitting element shifts in an environment where the temperature changes, the amount of deviation of the optical axis adjusted when the optical module is not operating increases. In other words, even in an environment where the temperature changes, strict positioning of the mirror driving mechanism with respect to the semiconductor light-emitting element is required.

However, by arranging the mirror drive mechanism in the second region, the temperature of the mirror drive mechanism can be adjusted in the second region by the second electric circuit. Therefore, the temperature of the mirror drive mechanism can be adjusted separately from the semiconductor light-emitting element arranged in the first region and generating heat during operation. Therefore, the temperature can be appropriately adjusted for each of the semiconductor light-emitting element and the mirror drive mechanism. As a result, the change in the deflection angle of the mirror can be reduced. In addition, since the heat absorption plate is made of a single plate-shaped member, even if the heat dissipation plate warps due to thermal expansion or thermal contraction caused by temperature change, the relative positional deviation of the members on the heat absorption plate due to the warping of the heat dissipation plate can be suppressed. Therefore, even in an environment where the temperature changes, the deviation of the optical axis of the light emitted from the semiconductor light-emitting element, which is adjusted with respect to the oscillating mirror, can be suppressed. As a result, drawing can be performed appropriately using the optical module.

[Details of the embodiment of the present disclosure]
Next, an embodiment of an optical module according to the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference characters and their description will not be repeated.

(Embodiment 1)
An electronic cooling module according to a first embodiment of the present disclosure will be described. FIG. 1 is a schematic side view of the electronic cooling module according to the first embodiment. FIG. 2 is a schematic plan view of the electronic cooling module according to the first embodiment shown in FIG. 1. FIG. 3 is a schematic perspective view showing a part of the electronic cooling module according to the first embodiment. In FIG. 2, thermistors 101A and 101B described later are omitted, and a heat dissipation plate 31A and a heat absorption plate 32A described later are shown by dashed lines. In FIG. 3, the heat absorption plate 32A is shown by dashed lines.

Referring to Figures 1, 2 and 3, electronic cooling module 30A in embodiment 1 includes heat dissipation plate 31A and heat absorption plate 32A. Electronic cooling module 30A is sometimes called a TEC (Thermo-Electric Cooler). Heat dissipation plate 31A and heat absorption plate 32A are each a flat plate. Heat dissipation plate 31A and heat absorption plate 32A each have a rectangular shape, specifically a rectangular shape, when viewed in the thickness direction, and are the same shape. They also have the same thickness. In Figures 1, 2, and 3, the direction indicated by the arrow X or the opposite direction indicates the longitudinal direction of the heat dissipation plate 31A and the heat absorption plate 32A, the direction indicated by the arrow Y or the opposite direction indicates the transverse direction of the heat dissipation plate 31A and the heat absorption plate 32A, and the direction indicated by the arrow Z or the opposite direction indicates the thickness direction of the heat dissipation plate 31A and the heat absorption plate 32A.

The heat absorption plate 32A is disposed at a distance from the heat dissipation plate 31A in the thickness direction. The material of the heat dissipation plate 31A and the heat absorption plate 32A is, for example, alumina. The heat dissipation plate 31A includes one main surface 11A that faces the heat absorption plate 32A in the thickness direction, and the other main surface 11B that is located on the opposite side of the one main surface 11A in the thickness direction. The heat absorption plate 32A includes one main surface 12A and the other main surface 12B that is located on the opposite side of the one main surface 12A in the thickness direction and faces the heat dissipation plate 31A.

The heat absorbing plate 32A includes a first region 34A indicated by the region surrounded by a two-dot dashed line, and a second region 34B indicated by the region surrounded by a one-dot dashed line. The first region 34A and the second region 34B are arranged apart when viewed in the thickness direction of the heat absorbing plate 32A. In this embodiment, the first region 34A and the second region 34B are arranged apart in the X direction. The first region 34A and the second region 34B are each rectangular in shape with a length in the Y direction longer than the length in the X direction when viewed in the thickness direction of the heat absorbing plate 32A.

The electronic cooling module 30A includes a plurality of first semiconductor pillars 33A and a plurality of second semiconductor pillars 33B. The plurality of first semiconductor pillars 33A and the plurality of second semiconductor pillars 33B are each composed of a Peltier element, and include a p-type and an n-type. The first semiconductor pillars 33A and the second semiconductor pillars 33B are manufactured using, for example, a BiTe-based material. The first semiconductor pillars 33A and the second semiconductor pillars 33B are each arranged at intervals between the heat sink 31A and the heat absorption plate 32A. The plurality of first semiconductor pillars 33A are arranged in a region overlapping the first region 34A when viewed in the thickness direction of the heat absorption plate 32A (in the X-Y plane). The plurality of second semiconductor pillars 33B are arranged in a region overlapping the second region 34B when viewed in the thickness direction of the heat absorption plate 32A (in the X-Y plane). A plurality of p-type first semiconductor pillars 33A and a plurality of n-type first semiconductor pillars 33A are alternately arranged at intervals. Similarly, a plurality of p-type second semiconductor pillars 33B and a plurality of n-type second semiconductor pillars 33B are alternately arranged at intervals.

The first semiconductor pillar 33A is rectangular when viewed in the thickness direction of the heat absorption plate 32A and is connected to the heat sink 31A with a thin plate-like electrode 35A sandwiched between them. The first semiconductor pillar 33A is rectangular when viewed in the thickness direction of the heat absorption plate 32A and is connected to the heat absorption plate 32A with a thin plate-like electrode 36A sandwiched between them. In FIG. 2, the electrode 35A is shown by a solid line, and the electrode 36A is shown by a dashed line. The end of the p-type first semiconductor pillar 33A is connected to the end of the adjacent n-type first semiconductor pillar 33A on one side by the thin plate-like electrode 35A. In addition, the end of the p-type first semiconductor pillar 33A different from the end is connected to the adjacent n-type first semiconductor pillar 33A on the other side by the thin plate-like electrode 36A. In this way, all the first semiconductor pillars 33A are connected in series. A power supply 39A and a control unit 38A that electrically controls the circuit are electrically connected to the first semiconductor pillars 33A connected in series, forming a first electric circuit 37A included in the electronic cooling module 30A. In other words, the first electric circuit 37A is formed by electrically connecting multiple first semiconductor pillars 33A.

The second semiconductor pillar 33B is rectangular when viewed in the thickness direction of the heat absorption plate 32A and is connected to the heat sink 31A with a thin plate-like electrode 35B sandwiched between them. The second semiconductor pillar 33B is rectangular when viewed in the thickness direction of the heat absorption plate 32A and is connected to the heat absorption plate 32A with a thin plate-like electrode 36B sandwiched between them. In FIG. 2, the electrode 35B is shown by a solid line, and the electrode 36B is shown by a dashed line. The end of the p-type second semiconductor pillar 33B is connected to the end of the adjacent n-type second semiconductor pillar 33B on one side by the thin plate-like electrode 35B. In addition, the end of the p-type second semiconductor pillar 33B different from the end is connected to the adjacent n-type second semiconductor pillar 33B on the other side different from the one side by the thin plate-like electrode 36B. In this way, all the second semiconductor pillars 33B are connected in series. A power supply 39B and a control unit 38B that electrically controls the circuit are electrically connected to the second semiconductor pillars 33B connected in series, forming a second electric circuit 37B included in the electronic cooling module 30A. In other words, the second electric circuit 37B is formed by electrically connecting multiple second semiconductor pillars 33B.

The electronic cooling module 30A includes a thermistor 101A as a first temperature detector that detects the temperature of the first region 34A, and a thermistor 101B as a second temperature detector that detects the temperature of the second region 34B. The thermistor 101A is attached to one of the main surfaces 12A in the first region 34A of the heat absorption plate 32A. The thermistor 101A can detect the temperature of the heat absorption plate 32A in the first region 34A. The thermistor 101B is attached to one of the main surfaces 12A in the second region 34B of the heat absorption plate 32A. The thermistor 101B can detect the temperature of the heat absorption plate 32A in the second region 34B.

In such an electronic cooling module 30A, a member in which a temperature distribution occurs is considered to be arranged on the heat absorbing plate 32A so that a temperature distribution occurs between the first region 34A and the second region 34B. The heat absorbing plate 32A includes a first region 34A and a second region 34B arranged away from the first region 34A. In the first region 34A, the temperature of the first region 34A can be adjusted by controlling the amount of current flowing through the first electric circuit 37A formed by electrically connecting a plurality of first semiconductor pillars 33A. In the second region 34B, the temperature of the second region 34B can be adjusted by controlling the amount of current flowing through the second electric circuit 37B formed by electrically connecting a plurality of second semiconductor pillars 33B. That is, the temperature can be adjusted separately in the first region 34A and the second region 34B of the heat absorbing plate 32A. Specifically, for example, when the members are arranged with a temperature distribution such that the first region 34A of the heat absorbing plate 32A is higher in temperature than the second region 34B of the heat absorbing plate 32A, the current flowing through the first electric circuit 37A is increased and the current flowing through the second electric circuit 37B is decreased, so that the first region 34A can be more actively cooled than the second region 34B. In FIG. 3, the magnitude of the current flowing is shown by the size of the arrow. In addition, since the heat absorbing plate 32A is made of a single plate-shaped member, even if the heat dissipation plate 31A warps due to thermal expansion or thermal contraction caused by temperature change, the relative positional deviation of the members on the heat absorbing plate 32A due to the warping of the heat dissipation plate 31A can be suppressed. In addition, there is no need to prepare and install multiple electronic cooling modules, and workability can be improved. Therefore, with such an electronic cooling module 30A, the temperature of the members in which the temperature distribution occurs can be appropriately adjusted, and workability during manufacturing can be improved.

In this embodiment, thermistor 101A is included as a first temperature detector that detects the temperature of first region 34A, and thermistor 101B is included as a second temperature detector that detects the temperature of second region 34B. Therefore, the temperature of each region can be adjusted based on the temperature of first region 34A detected by thermistor 101A and the temperature of second region 34B detected by thermistor 101B. Therefore, the temperature of each of first region 34A and second region 34B can be adjusted more appropriately.

(Embodiment 2)
Next, as a second embodiment, an optical module including the electronic cooling module 30A in the first embodiment will be described. FIG. 4 is an external perspective view showing the structure of the optical module including the electronic cooling module in the first embodiment. FIG. 5 is an external perspective view showing the state in which the cap of the optical module shown in FIG. 4 is removed. FIGS. 6 and 7 are schematic cross-sectional views of the optical module including the electronic cooling module in the first embodiment. FIG. 6 is a view of the optical module shown in FIG. 4 cut in the XY plane including the cap and not including the light forming part, and viewed in the thickness direction of the support plate. FIG. 7 is a view of the optical module shown in FIG. 4 cut in the XZ plane including the cap and not including the light forming part, and viewed in a direction perpendicular to the thickness direction of the support plate, specifically in the Y direction.

Referring also to FIG. 4 to FIG. 7, the optical module 1 includes the electronic cooling module 30A of the above-mentioned embodiment 1, a light forming section 20 configured to form light and arranged on the electronic cooling module 30A, and a protective member 2 that surrounds the light forming section 20 and seals the light forming section 20. The protective member 2 includes a flat support plate 10 as a base body and a cap 40 that is a lid section welded to the support plate 10. The electronic cooling module 30A is arranged on one main surface 10A of the support plate 10 so that the other main surface 11B of the heat sink 31A contacts one main surface 10A of the support plate 10. The light forming section 20 is mounted on the support plate 10. Specifically, the light forming section 20 is arranged on the electronic cooling module 30A arranged on one main surface 10A of the support plate 10. The cap 40 is arranged in contact with one main surface 10A of the support plate 10 so as to cover the light forming section 20. The light forming part 20 is hermetically sealed by the protective member 2. By surrounding the light forming part 20 with the support plate 10 and the cap 40, each component included in the light forming part 20 is effectively protected from the external environment. A plurality of lead pins 51 are installed on the support plate 10 so as to penetrate from the other main surface 10B side to one main surface 10A side of the support plate 10 and protrude on both the one main surface 10A side and the other main surface 10B side.

The light forming unit 20 includes a red laser diode 81 as a semiconductor light emitting element emitting red light in the direction indicated by arrow _L1 , a green laser diode 82 as a semiconductor light emitting element emitting green light in the direction indicated by arrow _L2 , a blue laser diode 83 as a semiconductor light emitting element emitting blue light in the direction indicated by arrow _L3 , a first lens 91, a second lens 92, a third lens 93, a first filter 97, a second filter 98, a third filter 99, a plate-shaped laser diode base 60, and a rectangular parallelepiped block portion 61. The light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83 is multiplexed and emitted to the outside of the optical module 1 from the window 42.

The laser diode base 60 has one main surface 60A and the other main surface 60B that have a rectangular shape (square shape) when viewed in the thickness direction. The laser diode base 60 is placed on one main surface 12A of the heat absorption plate 32A so that the other main surface 60B of the laser diode base 60 contacts one main surface 12A of the heat absorption plate 32A. The laser diode base 60 is placed in the first region 34A. The block portion 61 is mounted on a portion of one main surface 60A of the laser diode base 60.

On one main surface 61A of the block portion 61, a flat first submount 71, a second submount 72, and a third submount 73 are arranged side by side. A red laser diode 81 is arranged on the first submount 71. A green laser diode 82 is arranged on the second submount 72. A blue laser diode 83 is arranged on the third submount 73. A thermistor 101A for detecting the temperature of the block portion 61 is arranged on one main surface 61A of the block portion 61. Here, the light forming portion 20 is arranged in the first region 34A when viewed in the thickness direction of the heat absorption plate 32A, and includes a red laser diode 81, a green laser diode 82, and a blue laser diode 83 as semiconductor light emitting elements that emit light.

A first lens 91, a second lens 92, and a third lens 93 that convert the spot size of light are arranged on one main surface 60A of the laser diode base 60. The first lens 91, the second lens 92, and the third lens 93 convert the spot size of light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83, respectively. The first lens 91, the second lens 92, and the third lens 93 convert the light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83 into collimated light.

A first filter 97, a second filter 98, and a third filter 99 are disposed on one main surface 60A of the laser diode base 60. The first filter 97 reflects red light. The second filter 98 transmits red light and reflects green light. The third filter 99 transmits red light and green light and reflects blue light. In this manner, the first filter 97, the second filter 98, and the third filter 99 selectively transmit and reflect light of a specific wavelength. As a result, the first filter 97, the second filter 98, and the third filter 99 combine the light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83. The combined light travels along the direction indicated by the arrow _L4 .

The optical module 1 also includes an aperture member 55 as a beam shaping section of the light formed by the light forming section 20. The aperture member 55 has a flat plate shape. The aperture member 55 has a through hole 55A penetrating the aperture member 55 in the thickness direction. In this embodiment, the shape in a cross section perpendicular to the extending direction of the through hole 55A is circular. The aperture member 55 shapes the shape of the light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83 in a cross section perpendicular to the traveling direction of the light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83. The aperture member 55 is disposed on one main surface 12A of the heat absorption plate 32A. Specifically, the aperture member 55 is disposed in the second region 34B when viewed in the thickness direction of the heat absorption plate 32A. The aperture member 55 is disposed on the opposite side of the second filter 98 when viewed from the third filter 99. The aperture member 55 is positioned so that the through hole 55A is located in a region corresponding to the optical path of the light combined in the first filter 97, the second filter 98, and the third filter 99. The aperture member 55, the stage 65A described below, and the mirror drive mechanism 110 are also hermetically sealed by the protective member 2 together with the light forming unit 20 and the like.

The optical module 1 also includes a mirror drive mechanism 110 that scans the light emitted from the light forming unit 20, specifically, the light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83 and combined, and a stage 65A. The mirror drive mechanism 110 includes a mirror 111 that can oscillate. The mirror drive mechanism 110 reflects and scans the light emitted from the light forming unit 20 by the mirror 111 that oscillates at high speed. A part of the scanned light is indicated by an arrow _L5 in FIG. 7. The stage 65A has a shape of a right triangular prism. The stage 65A supports the mirror drive mechanism 110. The stage 65A that supports the mirror drive mechanism 110 is disposed on the heat absorption plate 32A. The stage 65A is also disposed on one main surface 12A of the heat absorption plate 32A, similar to the aperture member 55. Specifically, the stage 65A is disposed within the second region 34B as viewed in the thickness direction of the heat absorption plate 32A. That is, the optical module 1 is disposed within the second region 34B as viewed in the thickness direction of the heat absorption plate 32A, and includes a mirror drive mechanism 110 that scans the light emitted from the red laser diode 81, the green laser diode 82, and the blue laser diode 83. The stage 65A and the mirror drive mechanism 110 are disposed on the opposite side of the aperture member 55 to a third filter 99, which will be described later.

According to the optical module 1 of the present disclosure, the region in which the semiconductor light-emitting elements red laser diode 81, green laser diode 82, and blue laser diode 83 are arranged is arranged in the first region 34A, so that control can be performed by the first electric circuit 37A in the first region 34A. Therefore, the temperature can be adjusted separately in the first region 34A and in the second region 34B in which the red laser diode 81, green laser diode 82, and blue laser diode 83 are not arranged. Therefore, according to such an optical module 1, the influence of temperature on the members other than the red laser diode 81, green laser diode 82, and blue laser diode 83 constituting the optical module 1 can be reduced, and the temperature can be appropriately adjusted.

Here, the oscillation motion of the mirror 111 is highly temperature-dependent, and unless the temperature of the mirror drive mechanism 110 is within a certain temperature range, the deflection angle of the mirror 111 will change significantly. In that case, the light emitted from the light forming unit 20 cannot be scanned appropriately. In addition, if the relative position of the mirror drive mechanism 110 with respect to the red laser diode 81, the green laser diode 82, and the blue laser diode 83 shifts in an environment where the temperature changes, the deviation of the optical axis adjusted when the optical module 1 is not operating will increase. That is, even in an environment where the temperature changes, strict arrangement of the mirror drive mechanism 110 with respect to the red laser diode 81, the green laser diode 82, and the blue laser diode 83 is required. In the optical module 1, by arranging the mirror drive mechanism 110 in the second region 34B, the temperature of the mirror drive mechanism 110 can be adjusted in the second region 34B by the second electric circuit 37B. Therefore, the temperature of the mirror drive mechanism 110 can be adjusted separately from the red laser diode 81, green laser diode 82, and blue laser diode 83, which are arranged in the first region 34A and generate heat during operation. Therefore, the temperature of each of the red laser diode 81, green laser diode 82, and blue laser diode 83 and the mirror drive mechanism 110 can be appropriately adjusted. As a result, the change in the deflection angle of the mirror 111 can be reduced. In addition, since the heat absorption plate 32A is made of a single plate-shaped member, even if the heat dissipation plate 31A warps due to thermal expansion or thermal contraction caused by temperature change, the relative positional deviation of the members on the heat absorption plate 32A due to the warping of the heat dissipation plate 31A can be suppressed. Therefore, even in an environment where the temperature changes, the deviation of the optical axis of the light emitted from the red laser diode 81, green laser diode 82, and blue laser diode 83 adjusted to the oscillating mirror 111 can be suppressed. As a result, drawing by the optical module 1 can be performed appropriately.

(Embodiment 3)
Next, a third embodiment, which is yet another embodiment, will be described. Fig. 8 is a schematic side view of a thermoelectric cooling module in the third embodiment. The thermoelectric cooling module in the third embodiment has a different shape of a heat absorbing plate from that in the first embodiment.

Referring to FIG. 8, the electronic cooling module 30B of the third embodiment includes a heat dissipation plate 31B and a heat absorption plate 32B. The electronic cooling module 30B has a groove portion 13 that is disposed between the first region 34A and the second region 34B when viewed in the thickness direction of the heat absorption plate 32B and reduces the thickness of the heat absorption plate 32B. The groove portion 13 is formed on one of the main surfaces 12A. The groove portion 13 is formed so as to extend in the Y direction. In this way, heat transfer through the heat absorption plate 32B between the first region 34A and the second region 34B can be suppressed. Therefore, the temperature of each of the first region 34A and the second region 34B can be more appropriately adjusted.

In the above embodiment, the grooves 13 may be formed on the other main surface 12B. The grooves 13 may not be continuous in the Y direction, but may be formed in a portion of the Y direction. A configuration in which multiple grooves 13 are formed intermittently may also be adopted. The grooves 13 may have a cross section formed by a curved surface such as an arc surface.

(Embodiment 4)
Next, a fourth embodiment, which is yet another embodiment, will be described. Fig. 9 is a schematic side view of a thermoelectric cooling module in the fourth embodiment. The thermoelectric cooling module in the fourth embodiment differs from the first embodiment in the arrangement of the semiconductor pillars.

9, the electronic cooling module 30C of the fourth embodiment includes a heat sink 31C and a heat absorbing plate 32C. When viewed in the thickness direction of the heat absorbing plate 32C, the interval between the first region 34A and the second region 34B is wider than the interval between the first semiconductor pillars 33A and the interval between the second semiconductor pillars 33B. In this case, the area of the heat sink 31C and the heat absorbing plate 32C is increased, specifically, the length in the X direction is made longer than in the first embodiment, to increase the interval between the first region 34A and the second region 34B. In this way, the first region 34A and the second region 34B can be physically arranged with a wider interval. Therefore, the temperature of each of the first region 34A and the second region 34B can be more appropriately adjusted. In the above embodiment, a notch penetrating the thickness direction of the heat absorbing plate 32A may be provided in the region between the first region 34A and the second region 34B.

(Embodiment 5)
Next, a fifth embodiment, which is yet another embodiment, will be described. Fig. 10 is a schematic side view of a thermoelectric cooling module in the fifth embodiment. The thermoelectric cooling module in the fifth embodiment differs from the fourth embodiment in the arrangement of the semiconductor pillars.

Referring to FIG. 10, the electronic cooling module 30D of the fifth embodiment includes a heat sink 31D and a heat absorption plate 32D. The electronic cooling module 30D includes a third semiconductor pillar 33D that is disposed between the first region 34A and the second region 34B when viewed in the thickness direction of the heat absorption plate 32D, is not electrically connected to either the first electric circuit 37A or the second electric circuit 37B, and connects the heat sink 31D and the heat absorption plate 32D. In this way, the first region 34A and the second region 34B can be separated by the region in which the third semiconductor pillar 33D is disposed, and heat transfer between the first region 34A and the second region 34B can be suppressed. Therefore, the temperature of each of the first region 34A and the second region 34B can be more appropriately adjusted.

Other Embodiments
In the above embodiment, the optical module 1 is configured to include a red laser diode, a green laser diode, and a blue laser diode, but is not limited to this and may be configured to include at least one of the colors, i.e., at least one of the red laser diode, the green laser diode, and the blue laser diode.

In addition, in the above embodiment, the case where the component is cooled on the heat absorption plate side on which the component is placed is described, but a configuration in which heating is performed on the heat absorption plate side and cooling is performed on the heat dissipation plate side depending on the temperature of the surrounding environment or the temperature of the component to be adjusted may also be used.

In the above embodiment, the heat absorption plate includes a first region and a second region that is disposed apart from the first region in the thickness direction, but this is not limited to this. The heat absorption plate may include a third region different from the first region and the second region. That is, the heat absorption plate may include a first region, a second region that is disposed apart from the first region in the thickness direction, and a third region that is disposed apart from each of the first region and the second region in the thickness direction. The electronic cooling module may include a plurality of fourth semiconductor pillars that are disposed between the heat sink and the heat absorption plate and overlap with the third region in the thickness direction of the heat absorption plate, and are connected to the heat sink and the heat absorption plate, and a third electric circuit that is configured by electrically connecting the plurality of fourth semiconductor pillars. In this way, in addition to the temperature control in the first and second regions of the heat absorption plate, the third region of the heat absorption plate can also perform temperature control separate from the first and second regions. Therefore, more precise temperature control can be performed on the heat absorption plate. Of course, it is also possible to provide a fourth area, fifth area, etc., each of which has its own temperature control.

It should be understood that the embodiments disclosed herein are illustrative in all respects and are not limiting in any respect. The scope of the present invention is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims.

The electronic cooling module and optical module disclosed herein can be particularly advantageously applied in cases where it is required to appropriately adjust the temperature of components that have a temperature distribution, and to improve workability during manufacturing.

1 Optical module 2 Protective member 4 Base member 10 Support plate 10A, 10B, 11A, 11B, 12A, 12B, 60A, 60B, 61A Main surface 13 Groove portion 20 Light forming portion 30A, 30B, 30C, 30D Electronic cooling module 31A, 31B, 31C, 31D Heat sink 32A, 32B, 32C, 32D Heat absorption plate 33A First semiconductor pillar 33B Second semiconductor pillar 33D Third semiconductor pillar 34A First region 34B Second region 35A, 35B, 36A, 36B Electrode 37A First electric circuit 37B Second electric circuit 38A, 38B Control unit 39A, 39B Power supply 40 Cap 42 Window 51 Lead pin 55 Aperture member 55A Through hole 60 Laser diode base 61 Block portion 65A Stage 71 First submount 72 Second submount 73 Third submount 81 Red laser diode 82 Green laser diode 83 Blue laser diode 91 First lens 92 Second lens 93 Third lens 97 First filter 98 Second filter 99 Third filter 101A, 101B Thermistor 110 Mirror drive mechanism 111 Mirrors _L1 , _L2 , _L3 , _L4 , _L5 (arrows)

Claims (5)

A support plate;
a thermoelectric cooling module disposed on the support plate;
a light forming unit configured to form a light and disposed on the electronic cooling module;
The electronic cooling module includes:
A heat sink and
a heat absorbing plate having a plate shape, the heat absorbing plate including a first region and a second region disposed apart from the first region in a thickness direction, and disposed apart from the heat radiating plate in the thickness direction;
a plurality of first semiconductor pillars connected to the heat sink and the heat absorption plate, the first semiconductor pillars being disposed between the heat sink and the heat absorption plate in a region overlapping the first region when viewed in a thickness direction of the heat absorption plate;
a plurality of second semiconductor pillars that are disposed between the heat sink and the heat absorption plate in a region that overlaps with the second region when viewed in a thickness direction of the heat absorption plate, and are connected to the heat sink and the heat absorption plate;
a first electric circuit formed by electrically connecting the plurality of first semiconductor pillars;
a second electric circuit configured by electrically connecting the second semiconductor pillars;
the light generating unit is disposed on the heat absorbing plate within the first region as viewed in a thickness direction of the heat absorbing plate, and includes a semiconductor light emitting element that emits light;
a mirror driving mechanism that is disposed on the heat absorption plate within the second region as viewed in a thickness direction of the heat absorption plate and that scans the light emitted from the semiconductor light emitting element ;
a stage for supporting the mirror drive mechanism ;
The stage is directly attached onto the heat absorbing plate,
The mirror drive mechanism is mounted directly on the stage . a first temperature detection unit that detects the temperature of the first region;
The optical module according to claim 1 , further comprising: a second temperature detector configured to detect a temperature of the second region. The optical module according to claim 1 or 2, which has a groove portion disposed between the first region and the second region when viewed in the thickness direction of the heat absorption plate, and which reduces the thickness of the heat absorption plate. The optical module according to any one of claims 1 to 3, wherein the distance between the first region and the second region is greater than the distance between the first semiconductor pillars and the distance between the second semiconductor pillars. The optical module according to any one of claims 1 to 4, further comprising a third semiconductor pillar that is disposed between the first region and the second region when viewed in the thickness direction of the heat absorption plate, is not electrically connected to either the first electric circuit or the second electric circuit, and connects the heat sink and the heat absorption plate.

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