JP7581863B2 - Contactless Data Transmitter/Receiver - Google Patents

Description

The present invention relates to a non-contact data transmitter/receiver.

Non-contact data transmitters and receivers such as RFID tags are used for purposes such as distribution management (see, for example, Patent Document 1). A non-contact data transmitter and receiver comprises, for example, a substrate, a circuit provided on the substrate, and a radiating element. Due to the required electrical characteristics, the circuit structure of the non-contact data transmitter and receiver may be restricted.

Patent No. 4813344

Depending on the application, there are cases where a non-contact data transmitter/receiver is required to be compact.
However, it may be difficult to miniaturize the non-contact data transmitter/receiver due to restrictions on the circuit structure.

One aspect of the present invention aims to provide a contactless data transmitter/receiver that can be miniaturized.

One aspect of the present invention provides a non-contact data transmitter/receiver comprising a substrate, a matching circuit provided on the substrate, an antenna having a pair of radiating elements electrically connected to the matching circuit, and an IC chip provided on a first main surface of the substrate and electrically connected to the matching circuit, the matching circuit comprising a first wiring formed on the first main surface, and a second wiring formed on a second main surface of the substrate different from the first main surface and electrically connected to the first wiring at at least a pair of connection points, the second wiring being formed in a non-linear shape from one of the pair of connection points to the other.

The second wiring is preferably in a meander shape.

According to one aspect of the present invention, it is possible to provide a non-contact data transmitter/receiver that can be made compact.

FIG. 2 is a plan view of the non-contact data transmitter/receiver according to the first embodiment. FIG. 2 is a plan view of a first main surface of the substrate. FIG. 4 is a plan view of a second main surface of the substrate. FIG. 11 is a plan view of a second main surface of a substrate of a non-contact data transmitter/receiver according to a second embodiment. FIG. 11 is a plan view of a second main surface of a substrate of a non-contact data transmitter/receiver according to a third embodiment. FIG. 13 is a plan view of a second main surface of a substrate of a non-contact data transmitter/receiver according to a fourth embodiment.

[Non-contact data transmitter/receiver] (first embodiment)
Fig. 1 is a plan view of a non-contact data transmitter/receiver 10 according to the first embodiment. Fig. 2 is a plan view of a first main surface 11a of a substrate 11. Fig. 3 is a plan view of a second main surface 11b of the substrate 11.

As shown in FIG. 1, the non-contact data transmitter/receiver 10 includes a substrate 11, an antenna 12, and an IC chip 13.

As shown in FIG. 2, the substrate 11 is formed in a rectangular plate shape. The substrate 11 is, for example, rectangular. One surface of the substrate 11 is called the first main surface 11a. The other surface of the substrate 11 is called the second main surface 11b. The second main surface 11b is the surface opposite to the first main surface 11a.

In the following description, an XY Cartesian coordinate system may be used. As shown in FIG. 2, the X direction is the longitudinal direction of the first main surface 11a. The Y direction is the lateral direction of the first main surface 11a. The Y direction is perpendicular to the X direction in a plane along the first main surface 11a. The Z direction is perpendicular to the X and Y directions. Viewing from the Z direction is referred to as planar view.

The right side in FIG. 2 is one direction in the X direction (+X direction). The left side in FIG. 2 is the direction opposite to the +X direction (-X direction). The top in FIG. 2 is one direction in the Y direction (+Y direction). The bottom in FIG. 2 is the direction opposite to the +Y direction (-Y direction). The front side of the paper in FIG. 2 is one direction in the Z direction (+Z direction). The back side of the paper in FIG. 2 is the direction opposite to the +Z direction (-Z direction).

The substrate 11 may be a substrate made of a polyester resin such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), or polyethylene naphthalate (PEN); a substrate made of a polyolefin resin such as polyethylene (PE) or polypropylene (PP); a substrate made of a polyethylene fluoride-based resin such as polyvinyl fluoride, polyvinylidene fluoride, or polytetrafluoroethylene; a substrate made of a polyamide resin such as nylon 6 or nylon 6,6; a substrate made of a vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, or vinylon; a substrate made of an acrylic resin such as polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, or polybutyl acrylate; a substrate made of polystyrene; a substrate made of polycarbonate (PC); a substrate made of polyarylate; a substrate made of polyimide; a substrate made of paper such as fine paper, tissue paper, glassine paper, or parchment paper, etc.

The IC chip 13 is provided on the first main surface 11a of the substrate 11. The IC chip 13 is located approximately in the center of the first main surface 11a in the X direction. There are no particular limitations on the IC chip 13, and it is sufficient that information can be written and read in a non-contact manner via the antenna 12.

As shown in FIG. 1, the antenna 12 includes a matching circuit 16 and radiating elements 17 and 18 .
2, the matching circuit 16 has a loop-shaped closed circuit 20. The closed circuit 20 includes a first wiring 21 and a second wiring 22 (see FIG. 3). The matching circuit 16 is capable of adjusting the impedance by changing the pattern shape.

The first wiring 21 is provided on the first main surface 11a of the substrate 11. The first wiring 21 includes a first path 23 and a second path 24.
One end 23a of the first path 23 is electrically connected to the IC chip 13. The other end 23b of the first path 23 is electrically connected to a first connection point 25. One end 24a of the second path 24 is electrically connected to the IC chip 13. The other end 24b of the second path 24 is electrically connected to a second connection point 26. The first connection point 25 and the second connection point 26 are an example of a "pair of connection points."

The first connection point 25 is located away from the IC chip 13 on the -X direction side. The second connection point 26 is located away from the IC chip 13 on the +X direction side. The first connection point 25 includes a through-wire formed from the first main surface 11a to the second main surface 11b. The first connection point 25 electrically connects the other end 23b of the first path 23 to one end 22a of the second wiring 22 (see FIG. 3). The second connection point 26 includes a through-wire formed from the first main surface 11a to the second main surface 11b. The second connection point 26 electrically connects the other end 24b of the second path 24 to the other end 22b of the second wiring 22 (see FIG. 3).

As shown in FIG. 3, one end 22a of the second wiring 22 is electrically connected to the first connection point 25. The other end 22b of the second wiring 22 is electrically connected to the second connection point 26. The second wiring 22 is formed from one of the connection points 25, 26 (first connection point 25) to the other (second connection point 26).

The second wiring 22 includes a plurality of linear main line portions 31 extending along the Y direction, and a plurality of linear connecting line portions 32 extending along the X direction. The plurality of main line portions 31 are formed side by side at intervals in the X direction.
In this embodiment, the second wiring 22 includes eight main line portions 31 and seven connecting line portions 32. The eight main line portions 31 are referred to as first to eighth main line portions 31A to 31H, respectively, in order in the +X direction. The seven connecting line portions 32 are referred to as first to seventh connecting line portions 32A to 32G, respectively, in order in the +X direction.

One end of the nth main line portion 31 and one end of the n+1th main line portion 31 are connected by the nth connecting line portion 32. The other end of the n+1th main line portion 31 and the other end of the n+2th main line portion 31 are connected by the n+1th connecting line portion 32. n is an integer of 1 or more. The second wiring 22 is in a form in which adjacent main line portions 31 are alternately connected at one end and the other end. The second wiring 22 has a meander shape.

The first main line portion 31A extends in the +Y direction from the first connection point 25. The eighth main line portion 31H extends in the +Y direction from the second connection point 26. The +Y end of the first main line portion 31A and the +Y end of the second main line portion 31B are connected by the first connecting line portion 32A. The -Y end of the second main line portion 31B and the -Y end of the third main line portion 31C are connected by the second connecting line portion 32B. The +Y end of the third main line portion 31C and the +Y end of the fourth main line portion 31D are connected by the third connecting line portion 32C. The -Y end of the fourth main line portion 31D and the -Y end of the fifth main line portion 31E are connected by the fourth connecting line portion 32D. The +Y end of the fifth main line portion 31E and the +Y end of the sixth main line portion 31F are connected by the fifth connecting line portion 32E. The -Y end of the sixth main line portion 31F and the -Y end of the seventh main line portion 31G are connected by the sixth connecting line portion 32F. The +Y end of the seventh main line portion 31G and the +Y end of the eighth main line portion 31H are connected by the seventh connecting line portion 32G.

For comparison, assume a straight line wiring connecting the first connection point 25 and the second connection point 26. The second wiring 22 shown in FIG. 3 has a meander shape, and therefore has a shape different from a straight line (i.e., a non-straight line). The total length of the second wiring 22 is longer than that of the straight line wiring.

As shown in FIG. 1, the planar shape of the radiating elements 17, 18 is, for example, a meander shape. The first radiating element 17, which is one of the radiating elements 17, 18, extends in the -X direction while meandering from the first connection point 25. The second radiating element 18, which is the other of the radiating elements 17, 18, extends in the +X direction while meandering from the second connection point 26. The radiating elements 17, 18 are, for example, linear bodies. The radiating elements 17, 18 are formed of, for example, a metal such as steel, stainless steel, copper, or a copper alloy. The radiating elements 17, 18 can be formed of, for example, a brass-plated steel wire.

The first radiating element 17 may be electrically connected to and secured to the first connection point 25 by (i) soldering, (ii) grommets or crimping, (iii) ultrasonic bonding, etc. The second radiating element 18 may be electrically connected to and secured to the second connection point 26 by (i) soldering, (ii) grommets or crimping, (iii) ultrasonic bonding, etc.
There is no particular limitation on the shape of the radiating elements 17 and 18. The radiating elements 17 and 18 may be, for example, plate-shaped bodies.

The matching circuit 16 can be formed on the first main surface 11a and the second main surface 11b of the substrate 11 by a printing method such as screen printing or inkjet printing using a polymer-type conductive ink. The matching circuit 16 may be formed from a conductive foil. The antenna 12 may be formed by metal plating.

The polymer-type conductive ink contains conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, and carbon powder (carbon black, carbon nanotubes, etc.), and a resin composition.

As the resin composition, for example, a thermosetting resin can be used. A polymer-type conductive ink using a thermosetting resin can form a coating film that cures at 200° C. or less, for example, at about 100 to 150° C. The resistance value of the coating film is, for example, on the order of 10 ⁻⁵ Ω·cm. In addition to a thermosetting type, a photocurable, permeation drying, solvent volatilization, or other resin composition can be used for the polymer-type conductive ink. A polymer-type conductive ink containing a photocurable resin composition can improve production efficiency because it has a short curing time.

Examples of the conductive foil that constitutes the matching circuit 16 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil. Examples of the metal plating that constitutes the matching circuit 16 include copper plating, silver plating, gold plating, and platinum plating.

[Effects of the non-contact data transmitter/receiver of the first embodiment]
According to the non-contact data transmitter/receiver 10, the matching circuit 16 includes a first wiring 21 formed on the first main surface 11a and a second wiring 22 formed on the second main surface 11b. Since the matching circuit 16 is formed across multiple main surfaces of the non-contact data transmitter/receiver 10, a large area of the substrate 11 for forming the matching circuit 16 can be secured. Therefore, impedance adjustment is easy even if the size of the substrate 11 is small. Therefore, the non-contact data transmitter/receiver 10 can be made smaller.

The non-contact data transmitter/receiver 10 can effectively utilize the area of the second main surface 11b on which the second wiring 22 is formed, since the second wiring 22 has a meandering shape. Therefore, sufficient impedance adjustment is possible even if the area of the second main surface 11b is small.

In the non-contact data transmitter/receiver 10, the matching circuit 16 is formed across multiple main surfaces 11a and 11b, so the distance between the first wiring 21 and the second wiring 22 can be adjusted by selecting the thickness of the substrate 11. This makes it possible to adjust the mutual inductance between the first wiring 21 and the second wiring 22. This makes it easier to form the inductor component, which is a challenge when using a small substrate.

The non-contact data transmitter/receiver 10 is equipped with radiating elements 17 and 18, making it easy to adjust the communication distance.

[Non-contact data transmitter/receiver] (Second embodiment)
4 is a plan view of the second main surface 11b of the substrate 11 of the non-contact data transmitter/receiver 110 according to the second embodiment. The same components as those in the above-mentioned embodiments are denoted by the same reference numerals and will not be described.

As shown in FIG. 4, the non-contact data transmitter/receiver 110 includes a matching circuit 116. The matching circuit 116 has a second wiring 122 instead of the second wiring 22 (see FIG. 3). Other than the second wiring 122, the non-contact data transmitter/receiver 110 can have the same configuration as the non-contact data transmitter/receiver 10 shown in FIGS. 1 to 3.

The second wiring 122 has a plurality of linear main line portions 131 along the X direction, a plurality of linear connecting line portions 132 along the Y direction, and two connecting line portions 133, 134. The plurality of main line portions 131 are formed in a line spaced apart in the Y direction.

In this embodiment, the second wiring 122 has three main line portions 131, two connecting line portions 132, and two connecting line portions 133, 134. The three main line portions 131 are referred to as first to third main line portions 131A to 131C, respectively. The two connecting line portions 132 are referred to as first connecting line portion 132A and second connecting line portion 132B, respectively. The two connecting line portions 133, 134 are referred to as first connecting line portion 133 and second connecting line portion 134, respectively.

One end of the mth main line portion 131 and one end of the m+1th main line portion 131 are connected by the mth connecting line portion 132. The other end of the m+1th main line portion 131 and the other end of the m+2th main line portion 131 are connected by the m+1th connecting line portion 132. m is an integer of 1 or more. The second wiring 122 is in a form in which adjacent main line portions 131 are alternately connected at one end and the other end. The second wiring 122 has a meander shape.

The first connection line portion 133 includes a first extending portion 133A, a second extending portion 133B, and a third extending portion 133C. The first extending portion 133A extends in the +Y direction from the first connection point 25. The second extending portion 133B extends in the +X direction from the tip of the first extending portion 133A. The third extending portion 133C extends in the -Y direction from the tip of the second extending portion 133B.
The second connection line portion 134 extends from the second connection point 26 in the +Y direction.

The first main line portion 131A extends in the +X direction from the tip of the third extending portion 133C. The +X direction end of the first main line portion 131A and the +X direction end of the second main line portion 131B are connected by a first connecting line portion 132A. The -X direction end of the second main line portion 131B and the -X direction end of the third main line portion 131C are connected by a second connecting line portion 132B. The +X direction end of the third main line portion 131C is connected to the second connecting line portion 134.
The second wiring 122 has a shape different from a straight line (i.e., a non-linear shape).

[Effects of the non-contact data transmitter/receiver of the second embodiment]
According to the non-contact data transmitter/receiver 110, the matching circuit 116 includes the first wiring 21 (see FIG. 2) formed on the first main surface 11a and the second wiring 122 formed on the second main surface 11b. This allows a large area of the substrate 11 for forming the matching circuit 116 to be secured. This makes it easy to adjust the impedance even when the substrate 11 is small in size. This allows the non-contact data transmitter/receiver 110 to be made smaller.

[Non-contact data transmitter/receiver] (third embodiment)
5 is a plan view of the second main surface 11b of the substrate 11 of a non-contact data transmitter/receiver 210 according to the third embodiment. The same components as those in the above-mentioned embodiments are denoted by the same reference numerals and will not be described.

As shown in FIG. 5, the non-contact data transmitter/receiver 210 includes a matching circuit 216. The matching circuit 216 has a second wiring 222 instead of the second wiring 22 (see FIG. 3). Other than the second wiring 222, the non-contact data transmitter/receiver 210 can have the same configuration as the non-contact data transmitter/receiver 10 shown in FIGS. 1 to 3.

The second wiring 222 includes a first introduction portion 231 , a loop-shaped portion 232 , and a second introduction portion 233 .
The first introduction portion 231 includes a first connection portion 231A and a first extension portion 231B. The first connection portion 231A extends in the +Y direction from the first connection point 25. The first extension portion 231B extends in the +X direction from the tip of the first connection portion 231A.
The second introduction portion 233 includes a second connection portion 233A and a second extension portion 233B. The second connection portion 233A extends in the +Y direction from the second connection point 26. The second extension portion 233B extends in the -X direction from the tip of the second connection portion 233A.

The loop portion 232 includes a first base portion 232A, a loop main portion 232B, and a second base portion 232C. The first base portion 232A extends in the -Y direction from the tip of the first extending portion 231B. The second base portion 232C extends in the -Y direction from the tip of the second extending portion 233B.
The loop main portion 232B is formed in a rectangular loop shape from the tip of the first base portion 232A to the tip of the second base portion 232C. The dimension of the loop main portion 232B in the X direction is larger than the dimension of the X direction from the first base portion 232A to the second base portion 232C.
The second wiring 222 has a shape different from a straight line (i.e., a non-straight line).

[Effects of the non-contact data transmitter/receiver of the third embodiment]
According to the non-contact data transmitter/receiver 210, the matching circuit 216 includes the first wiring 21 (see FIG. 2) formed on the first main surface 11a and the second wiring 222 formed on the second main surface 11b. This allows a large area of the substrate 11 for forming the matching circuit 216 to be secured. This makes it easy to adjust the impedance even when the substrate 11 is small in size. This allows the non-contact data transmitter/receiver 210 to be miniaturized.

[Non-contact data transmitter/receiver] (fourth embodiment)
6 is a plan view of the second main surface 11b of the substrate 11 of a non-contact data transmitter/receiver 310 according to the fourth embodiment. The same components as those in the above-mentioned embodiments are denoted by the same reference numerals and will not be described.

As shown in FIG. 6, the non-contact data transmitter/receiver 310 includes a matching circuit 316. The matching circuit 316 has a second wiring 322 instead of the second wiring 22 (see FIG. 3). Other than the second wiring 322, the non-contact data transmitter/receiver 310 can have the same configuration as the non-contact data transmitter/receiver 10 shown in FIGS. 1 to 3.

The second wiring 322 includes a first introduction portion 331 , a meandering portion 332 , and a second introduction portion 333 .
The first introduction portion 331 includes a first connection portion 331A and a first extension portion 331B. The first connection portion 331A extends in the +Y direction from the first connection point 25. The first extension portion 331B extends in the +X direction from the tip of the first connection portion 331A.
The second introduction portion 333 includes a second connection portion 333A and a second extension portion 333B. The second connection portion 333A extends in the +Y direction from the second connection point 26. The second extension portion 333B extends in the -X direction from the tip of the second connection portion 333A.

The meandering portion 332 has a V-shaped structure having a first inclined portion 332A and a second inclined portion 332B, which are repeatedly formed in the X direction. The first inclined portion 332A descends in the +X direction in Fig. 6. The second inclined portion 332B ascends in the +X direction in Fig. 6. The meandering portion 332 is formed from the tip of the first extending portion 331B to the tip of the second extending portion 333B.
The second wiring 322 has a shape different from a straight line (i.e., a non-linear shape).

[Effects of the non-contact data transmitter/receiver of the fourth embodiment]
According to the non-contact data transmitter/receiver 310, the matching circuit 316 includes the first wiring 21 (see FIG. 2) formed on the first main surface 11a and the second wiring 322 formed on the second main surface 11b. This allows a large area of the substrate 11 for forming the matching circuit 316. This makes it easy to adjust the impedance even when the substrate 11 is small in size. This allows the non-contact data transmitter/receiver 310 to be made smaller.

Although the embodiments of the present invention have been described above, each configuration and their combinations in the embodiments are merely examples, and addition, omission, substitution, and other modifications of the configurations are possible without departing from the spirit of the present invention. Furthermore, the present invention is not limited to the embodiments.
In the non-contact data transmitter/receiver 10 of the first embodiment shown in FIG. 1, the matching circuit 16 is formed on both sides of one substrate 11, but the configuration of the non-contact data transmitter/receiver is not limited to this. The substrate may have a multi-layer structure having multiple layers. In this case, the first main surface on which the first wiring is formed and the second main surface on which the second wiring is formed do not need to be one and the other surfaces of the same layer. For example, one surface of a first layer among the multiple layers constituting the substrate may be the first main surface, and one surface of a second layer different from the first layer may be the second main surface.

The matching circuit may be formed across multiple (any number greater than or equal to two) principal surfaces. For example, the matching circuit may be formed across three or more principal surfaces.

3, in the non-contact data transmitter/receiver 10 of the first embodiment, the second wiring 22 is entirely formed on the second main surface 11b, but a part of the second wiring (a partial wiring) may be formed on the first main surface 11a. This partial wiring is connected to the second wiring through a through wiring.
In the non-contact data transmitter/receiver 10, the second wiring 22 is connected to the first wiring 21 at a pair of connection points 25, 26, but the number of points at which the second wiring is connected to the first wiring is not limited to 2 and may be any number equal to or greater than 2. It is sufficient that the second wiring is connected to the first wiring at at least a pair of connection points.
Although the connecting line portion 32 shown in FIG. 3 is a straight line connecting the ends of adjacent main line portions 31, the connecting line portion may be curved (for example, semicircular).

10, 110, 210, 310... non-contact data transmitter/receiver, 11... substrate, 11a... first main surface, 11b... second main surface, 12... antenna, 13... IC chip, 16, 116, 216, 316... matching circuit, 21... first wiring, 22, 122, 222, 322... second wiring.

Claims (2)

A substrate;
an antenna having a matching circuit provided on the substrate and a pair of radiating elements electrically connected to the matching circuit;
an IC chip provided on a first main surface of the base material and electrically connected to the matching circuit;
The matching circuit includes:
A first wiring formed on the first main surface;
a second wiring formed on a second main surface different from the first main surface of the base material and electrically connected to the first wiring at at least a pair of connection points;
the second wiring is formed in a non-linear shape from one of the pair of connection points to the other ,
the second wiring has a meander shape including a plurality of main line portions extending in a second direction perpendicular to a first direction connecting the pair of connection points, and a plurality of connecting line portions extending in the first direction so as to alternately connect one ends of the adjacent main line portions and the other ends of the adjacent main line portions;
The pair of connection points is a first connection point and a second connection point,
the first wiring has a first path connecting the IC chip and the first connection portion and a second path connecting the IC chip and the second connection portion,
The first path and the second path each have a pair of extending portions extending to one side along the second direction, and a connecting portion extending in the first direction so as to connect tips of the pair of extending portions to each other.
Contactless data transmitter/receiver. The base material has a rectangular shape having a long side along the first direction and a short side along the second direction.
2. The non-contact data transmitter/receiver according to claim 1.

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