JP7583522B2 - package - Google Patents

Description

The present invention relates to a package for use in optical components, such as a package and transparent sealing member suitable for use in LEDs (light emitting diodes) and LDs (semiconductor lasers).

In general, optical components that have optical elements (such as LEDs and LDs) that emit ultraviolet light require a transparent sealing member to protect the optical elements from the outside air and moisture. Metallization or a resin adhesive is used to bond the mounting substrate on which the optical elements are mounted to the transparent sealing member.

Patent document 1 discloses a housing that is composed of a metal heat sink plate on which a semiconductor element is mounted, a metal frame body joined to the upper surface of the heat sink plate with a solder material such as silver solder, and a ceramic lid body joined to the upper surface of the frame body with the solder material.

Patent document 2 discloses a package for an ultraviolet light emitting element in which a condenser lens made of glass such as quartz is bonded to a lens holding member with an adhesive.

JP 2001-237335 A JP 2007-311707 A

However, when the lid body is resin-bonded to the mounting substrate, the resin may overflow into the space in which the optical element is placed. In this case, the light emitted from the optical element may be blocked by the overflowing resin, which may reduce the overall light transmittance.

In addition, pressure and heat may be applied when resin bonding the lid to the mounting substrate. In this case, some of the protruding resin may volatilize due to heating, etc., and the volatile components may adhere to the optical element, causing deterioration of the optical element and optical components.

On the other hand, when the lid is metal-bonded to the mounting substrate, a solder such as AuSn (gold-tin) is layered on a metal layer formed in advance by metallization, and the soldering is performed by applying pressure and heat. During this process, the solder may leak out. If the solder gets into the space in which the optical elements are placed, it may block light and cause the wiring to short out.

The present invention was made in consideration of these problems, and aims to provide a package and transparent sealing member that can prevent a bonding material such as resin or solder from spilling into the arrangement space of an optical element in a package formed by bonding a transparent sealing member and a mounting substrate, and can also prevent a part of the bonding material or volatile components from adhering to the optical element, etc.

The first aspect of the present invention is a package in which a transparent sealing member and a mounting substrate are bonded together, and which has a space for accommodating at least one optical element, and in which the portion where the transparent sealing member and the mounting substrate are bonded has a step or taper that prevents a bonding material from entering the space.

The second aspect of the present invention is a transparent sealing member having a bonding surface that is bonded to a mounting substrate, and has a step or taper that prevents the bonding material from penetrating into the inside of the transparent sealing member.

According to the package of the first aspect described above, when the transparent sealing member is bonded to the mounting substrate, the step or taper prevents the bonding material from entering the storage space, so that the light emitted from the optical element is hardly blocked by the bonding material, and the overall decrease in light transmittance can be suppressed. Even if pressure or heat is applied when bonding the transparent sealing member to the mounting substrate, the step or taper prevents the bonding material from entering the storage space, so that, for example, when the bonding material is resin, the volatile components of the resin can be prevented from adhering to the optical element. For example, when the bonding material is solder, the light can be blocked and the phenomenon of wiring shorting can be suppressed. This leads to suppression of deterioration in the quality of the optical element and optical components.

According to the transparent sealing member of the second aspect described above, when the transparent sealing member is bonded to the mounting substrate, the step or taper prevents the bonding material from entering the storage space, so that the light emitted from the optical element is hardly blocked by the bonding material, and the decrease in the overall light transmittance can be suppressed.

FIG. 1A is a vertical cross-sectional view showing a package (first package) according to a first embodiment, and FIG. 1B is an exploded vertical cross-sectional view showing the first package. FIG. 2A is an enlarged cross-sectional view showing a first example of a step formed in a transparent sealing member of a first package, and FIG. 2B is an enlarged cross-sectional view showing a second example of the step. FIG. 3A is an enlarged cross-sectional view showing a third example of a step formed in a transparent sealing member of a first package, and FIG. 3B is an enlarged cross-sectional view showing a fourth example of the step. FIG. 4A is a bottom view showing an example in which a stepped convex portion is formed in a circular ring shape on the bottom surface of a transparent base, FIG. 4B is a bottom view showing an example in which a plurality of stepped convex portions are arranged in a circular ring shape, FIG. 4C is a bottom view showing an example in which a stepped convex portion is formed in a rectangular ring shape, and FIG. 4D is a bottom view showing an example in which a plurality of stepped convex portions are arranged in a rectangular ring shape. Figure 5A is an enlarged cross-sectional view showing an example in which the position of the end face of the convex portion on the storage space side is aligned with the position of the inner surface of the transparent body, and Figure 5B is an enlarged cross-sectional view showing an example in which the position of the end face is shifted toward the outer periphery of the base of the transparent body. 6A is an enlarged cross-sectional view showing an example in which the end surface of the protrusion on the storage space side shown in FIG. 2A is an inclined surface, and FIG. 6B is an enlarged cross-sectional view showing an example in which the end surface of the protrusion on the storage space side shown in FIG. 3A is an inclined surface. FIG. 7A is a vertical cross-sectional view showing a package according to a comparative example, and FIG. 7B is an exploded vertical cross-sectional view showing the package according to the comparative example. FIG. 8A is a vertical cross-sectional view showing a package (second package) according to the second embodiment, and FIG. 8B is an exploded vertical cross-sectional view showing the second package. FIG. 9A is a vertical cross-sectional view showing a package (third package) according to a third embodiment, and FIG. 9B is an exploded vertical cross-sectional view showing the third package. FIG. 10A is a vertical cross-sectional view showing a package (fourth package) according to a fourth embodiment, and FIG. 10B is an exploded vertical cross-sectional view showing the fourth package. FIG. 11A is an enlarged cross-sectional view showing a first example of a step formed in a mounting substrate of the fourth package, and FIG. 11B is an enlarged cross-sectional view showing a second example of the step. FIG. 12A is an enlarged cross-sectional view showing a third example of a step formed in a mounting substrate of a fourth package, and FIG. 12B is an enlarged cross-sectional view showing a fourth example of the step. FIG. 13A is a top view showing an example of a protrusion having steps formed in a circular ring shape on the top surface of a mounting substrate, FIG. 13B is a top view showing an example of a plurality of protrusions having steps arranged in a circular ring shape, FIG. 13C is a top view showing an example of a protrusion having steps formed in a rectangular ring shape, and FIG. 13D is a top view showing an example of a protrusion having steps arranged in a rectangular ring shape. Figure 14A is an enlarged cross-sectional view showing an example in which the position of the end face of the convex portion on the storage space side is aligned with the position of the inner surface of the transparent body, and Figure 14B is an enlarged cross-sectional view showing an example in which the position of the above-mentioned end face is shifted toward the outer periphery of the transparent sealing member. 15A is an enlarged cross-sectional view showing an example in which the end surface of the convex portion shown in FIG. 11A facing the storage space is inclined, and FIG. 15B is an enlarged cross-sectional view showing an example in which the end surface of the convex portion shown in FIG. 12A facing the storage space is inclined. FIG. 16A is a vertical cross-sectional view showing a package (fifth package) according to a fifth embodiment, and FIG. 16B is an exploded vertical cross-sectional view showing the fifth package. FIG. 17A is a vertical cross-sectional view showing a package (sixth package) according to a sixth embodiment, and FIG. 17B is an exploded vertical cross-sectional view showing the sixth package. FIG. 18A is a vertical cross-sectional view showing a package (seventh package) according to the seventh embodiment, and FIG. 18B is an exploded vertical cross-sectional view showing the seventh package.

Below, examples of embodiments of the package and transparent sealing member according to the present invention will be described with reference to Figures 1A to 18B.

First, an optical component (hereinafter referred to as first optical component 100A) having a package (hereinafter referred to as first package 10A) according to the first embodiment has the first package 10A and at least one optical element 12 housed in the first package 10A, as shown in Figures 1A and 1B. The optical element 12 emits, for example, ultraviolet light 13.

The first package 10A has a flat first mounting substrate 14A on which the optical element 12 is mounted, and a first transparent sealing member 18A that is bonded onto the first mounting substrate 14A via, for example, an organic resin. As the resin, for example, an epoxy adhesive, a silicone adhesive, a urethane adhesive, or the like can be preferably used. Note that wiring and the like are formed on the surface of the first mounting substrate 14A.

In addition to the resin bonding described above, the first mounting substrate 14A and the first transparent sealing member 18A can be bonded by metal bonding. Metal bonding is a method of bonding by applying pressure and heat to a metal layer formed in advance by metallization on the bonding surface of the first mounting substrate 14A with the first transparent sealing member 18A and on the bonding surface of the first transparent sealing member 18A with the first mounting substrate 14A, and then laminating solder such as AuSn (gold-tin).

Therefore, when referring to the above-mentioned "organic resin for resin bonding" and "solder for metal bonding" without making a distinction, they will simply be referred to as "bonding material 16."

Although not shown, the optical element 12 is configured by stacking a GaN-based crystal layer having a quantum well structure on, for example, a sapphire substrate (thermal expansion coefficient: 7.7×10 ⁻⁶ /° C.). The optical element 12 can be mounted, for example, in a so-called face-up mounting manner in which the crystal layer-forming surface faces the first transparent sealing member 18A and functions as the light emission surface 12a.

That is, the terminals (not shown) extending from the optical element 12 are electrically connected to the circuit wiring (not shown) formed on the first mounting substrate 14A, for example, by bonding wires (not shown). Of course, it is also possible to preferably adopt so-called flip-chip mounting, in which the light emitting surface 12a is mounted facing the first mounting substrate 14A and the back surface of the sapphire substrate functions as the light emitting surface.

The first transparent sealing member 18A comprises a transparent body 20 fixed on, for example, a flat first mounting substrate 14A, and the transparent body 20 has a recess at the bottom opening, i.e., a storage space 22. The transparent body 20 has an annular base 24 fixed on the first mounting substrate 14A, and a lens body 26 formed integrally on the base 24. The storage space 22 is dome-shaped.

The planar shape of the bottom surface of the lens body 26 is, for example, circular, and the outer shape (planar shape) of the base 24 is, for example, square. Of course, the planar shape of the bottom surface of the lens body 26 may be elliptical, track-shaped, etc., and the outer shape of the base 24 may be polygonal, such as circular, rectangular, triangular, or hexagonal.

The first transparent sealing member 18A having such a shape can be preferably manufactured by powder sintering. For example, a molding slurry containing silica powder and an organic compound is poured into a mold, solidified by a chemical reaction between the organic compounds, for example, between a dispersion medium and a hardener, or between hardeners, and then released from the mold and fired to produce the first transparent sealing member 18A.

The dimensions of the first transparent sealing member 18A are: height of the first transparent sealing member 18A is 0.5-10 mm, outer diameter of the base 24 is 3.0-100 mm, and height of the base 24 is 0.2-1 mm. The lens body 26 has a maximum length of the bottom of 2.0-10 mm, a maximum height of 0.5-10 mm, and an aspect ratio of 0.3-1.0, for example.

The dimensions of the optical element 12 are a thickness of 0.005 to 0.5 mm, and although not shown, a vertical dimension viewed from above of 0.5 to 2.0 mm and a horizontal dimension of 0.5 to 2.0 mm.

With this configuration, when the height from the lower surface 14a of the first mounting substrate 14A to the light emitting surface 12a of the optical element 12 is ha and the height from the lower surface 14a of the first mounting substrate 14A to the upper surface of the bonding material 16 (the lower surface of the first pedestal 24A) is hb, the relationship of ha > hb is satisfied.

Therefore, even if the distribution angle of the ultraviolet light 13 emitted from the optical element 12 is 180° or more, the ultraviolet light 13 emitted laterally from the light emission surface 12a of the optical element 12 hits the base 24 of the first transparent sealing member 18A directly and hardly hits the joint between the first mounting substrate 14A and the first transparent sealing member 18A, i.e., the bonding material 16.

Furthermore, as shown in Figures 1A to 2B, the first package 10A has a step 30 that prevents the bonding material 16 from entering the accommodation space 22 at least in the portion where the first transparent sealing member 18A and the first mounting substrate 14A are bonded. In particular, in the first package 10A, a protrusion 32 is integrally formed on the bottom surface of the first transparent sealing member 18A, thereby forming the step 30. Of course, the step 30 may also be formed by providing a separate protrusion 32 on the bottom surface of the first transparent sealing member 18A. The same applies below.

Here, examples of the step 30 will be described with reference to Figures 2A to 6B. As shown in Figures 2A and 2B, the step 30 may be a step with an inclination angle of 90° (where the cross-sectional shape of the convex portion 32 is rectangular), or as shown in Figures 3A and 3B, a step with an inclination angle θ of less than 90° (where the cross-sectional shape of the convex portion 32 is wedge-shaped). If the inclination angle θ is less than 20°, the effect of suppressing the overflow of the bonding material 16 is insufficient. Of course, a step with an inclination angle θ greater than 90° can also be used, but the tip of the step 30 is likely to become brittle.

In the above description, the inclination angle θ is defined as a "step" having an inclination angle of 20° or more and 90° or less, but it is also possible to define a "step" when the inclination angle θ is 90°, and a "taper" when the inclination angle θ is 20° or more and less than 90°. Therefore, the step 30 is defined as a "step 30 or taper 30" that prevents the resin or metal layer from entering the storage space 22.

The term "cross section" refers to a plane that is perpendicular to the bottom surface of the package and passes through the center of the package when the lens body 26 is viewed from above. The height of the step 30 or taper 30 is measured by cutting the package to obtain a cross section, and measuring the length of the cross section using a length measuring microscope or a scanning electron microscope.

As shown in Fig. 4A and Fig. 4C (bottom view), the convex portion 32 on which the step 30 or taper 30 is formed may be formed in a ring shape, or as shown in Fig. 4B and Fig. 4D (bottom view), a plurality of convex portions 32 on which the step 30 or taper 30 is formed may be arranged in a ring shape. As an example, Fig. 4A and Fig. 4B show convex portions 32 formed or arranged in a circular ring shape, and Fig. 4C and Fig. 4D show convex portions 32 formed or arranged in a rectangular ring shape. As shown in Fig. 1A, these convex portions 32 are formed in a position close to the optical element 12 in the portion bonded to the first mounting substrate 14A by resin or metal, and the step 30 or taper 30 is formed in the convex portion 32 at a position facing the bonding material 16.

As shown in Figures 2A and 3A, the corners of the protrusions 32 may be acute-angled, but as shown in Figures 2B and 3B, it is preferable that the corners of the protrusions 32 are rounded. This can prevent the corners of the protrusions 32 from being chipped when they come into contact with the first mounting board 14A, for example.

As shown in Figures 2A to 3B, the step 30 or taper 30 (height hc of the protrusion 32) is preferably 10 to 500 μm, and the width W of the protrusion 32 is at least 50 μm. It is preferable that the width W of the protrusion 32 is set to a value that does not excessively narrow the size of the first package 10A, i.e., the area of the portion where the bonding material 16 is applied (bonding material application portion 34).

As shown in FIG. 5A, the position of the end face 32a of the protrusion 32 on the side of the storage space 22 may be aligned with the position of the inner peripheral surface 20a of the transparent body 20. As shown in FIG. 5B, the position of the end face 32a may be shifted toward the outer periphery of the base 24, provided that the area of the portion where the bonding material 16 is applied (bonding material application portion 34) is not excessively narrowed. Also, as shown in FIGS. 6A and 6B, the end face 32a of the protrusion 32 on the side of the storage space 22 may be an inclined surface. These modified examples are also applicable to the configuration of the second package 10B and subsequent packages described below.

Here, the effects of the first package 10A will be explained with reference to a comparative example and to Figures 7A and 7B.

First, as shown in Figures 7A and 7B, the package 200 according to the comparative example does not have a step 30 or a taper 30 at the portion where the transparent sealing member 18 and the mounting substrate 14 are joined. Therefore, when the transparent sealing member 18 is joined to the mounting substrate 14, the bonding material 16 may protrude into the accommodation space 22 of the optical element 12. In this case, the ultraviolet light 13 from the optical element 12 may be blocked by the protruding bonding material 16, which may reduce the overall light transmittance.

In addition, in the package 200 according to the comparative example, if pressure and heat are applied when bonding the transparent sealing member 18 to the mounting substrate 14, some of the protruding bonding material 16 described above may volatilize due to heating, etc., and the volatile components may adhere to the optical element 12, causing deterioration of the optical element 12 and the optical components.

In the package 200 according to the comparative example, when the transparent sealing member 18 is metal-bonded to the mounting substrate 14, solder such as AuSn (gold-tin) is laminated on a metal layer formed in advance by metallization, and the soldering is performed by applying pressure and heat. During this process, the solder may leak out. If the solder enters the storage space 22 for the optical element 12, it may block light and cause the wiring to short out.

In contrast, the first package 10A shown in Figures 1A and 1B, etc., has a step 30 or taper 30 that prevents the bonding material 16 from entering the accommodation space 22 at least in the portion where the first transparent sealing member 18A and the first mounting substrate 14A are bonded, as described above.

Therefore, when the first transparent sealing member 18A is bonded to the first mounting substrate 14A, the step 30 or taper 30 prevents the bonding material 16 from entering the storage space 22, so that the ultraviolet light 13 from the optical element 12 is hardly blocked by the bonding material 16, and the decrease in the overall light transmittance can be suppressed.

In addition, even if pressure and heat are applied when bonding the first transparent sealing member 18A to the first mounting substrate 14A, the step 30 or taper 30 prevents the bonding material 16 from entering the accommodation space 22, thereby preventing the volatile components of the bonding material 16 (if the bonding material is an adhesive) from adhering to the optical element 12. This helps prevent deterioration in the quality of the optical element 12 and the first optical component 100A.

In addition, when the first transparent sealing member 18A is metal-bonded to the first mounting substrate 14A, a solder such as AuSn (gold-tin) is laminated on a metal layer formed in advance by metallization, and the solder is then pressurized and heated to bond. At this time, the solder may leak out. However, in the first optical component 100A, the step 30 or taper 30 prevents the bonding material 16 (solder in this case) from entering the housing space 22, so that short circuits between wirings and contacts caused by the bonding material 16 can be avoided.

Next, an optical component (hereinafter referred to as second optical component 100B) having a package (hereinafter referred to as second package 10B) according to the second embodiment has the second package 10B and at least one optical element 12 housed in the second package 10B, as shown in Figures 8A and 8B.

The second package 10B has a second mounting substrate 14B and a second transparent sealing member 18B. The second mounting substrate 14B has an upper opening storage space 22 in which the optical element 12 is mounted. The second transparent sealing member 18B is bonded to the second mounting substrate 14B via a bonding material 16 so as to close the storage space 22.

The second transparent sealing member 18B has a transparent body 20 fixed onto the second mounting substrate 14B. The transparent body 20 does not have a storage space 22 formed therein, unlike the transparent body 20 of the first transparent sealing member 18A. In other words, the transparent body 20 of the second transparent sealing member 18B has a base 24 fixed onto the second mounting substrate 14B, and a solid lens body 26 formed integrally on the base 24.

As shown in Figures 8A and 8B, the second package 10B, like the first package 10A, has a step 30 or taper 30 that prevents the bonding material 16 from entering the accommodation space 22 at least in the portion where the second transparent sealing member 18B and the second mounting substrate 14B are bonded. In the second package 10B, the step 30 or taper 30 is also formed by forming a protrusion 32 integrally or separately on the bottom surface of the second transparent sealing member 18B.

The manufacturing method, dimensions, steps, and shape of the protrusions 32 of the second transparent sealing member 18B are the same as those of the first transparent sealing member 18A described above, and therefore will not be described here. The same applies below.

Next, an optical component (hereinafter referred to as third optical component 100C) having a package according to the third embodiment (hereinafter referred to as third package 10C) has a third package 10C and at least one optical element 12 housed in the third package 10C, as shown in Figures 9A and 9B.

The third package 10C has a third mounting substrate 14C and a third transparent sealing member 18C. The third mounting substrate 14C has an upper opening storage space 22, similar to the second mounting substrate 14B described above. The third transparent sealing member 18C has a transparent body 20 fixed onto the third mounting substrate 14C. The transparent body 20 has a base 24 fixed onto the third mounting substrate 14C, and a solid lens body 26 formed integrally on the base 24.

The third transparent sealing member 18C is then bonded, for example via a bonding material 16, to the third mounting substrate 14C in the same manner as the second package 10B, so as to close the accommodation space 22.

In particular, the third package 10C has a step 30 or taper 30 that prevents the bonding material 16 from entering the accommodation space 22 at least at the portion where the third transparent sealing member 18C and the third mounting substrate 14C are bonded. That is, the step 30 or taper 30 is formed by integrally forming a plate-shaped (planar shape is a circle, a square, a polygon, etc.) protrusion 32 having an area larger than the opening area of the accommodation space 22 on the bottom surface of the third transparent sealing member 18C.

The cross-sectional shape of the step 30 or taper 30 may be a step with an inclination angle of 90° or a step with an inclination angle of less than 90°, similar to the shapes shown in Figures 2A to 3B described above. In this case, the corners of the convex portion 32 may be acute-angled, but are preferably rounded.

Next, an optical component (hereinafter referred to as fourth optical component 100D) having a package according to the fourth embodiment (hereinafter referred to as fourth package 10D) has a fourth package 10D and at least one optical element 12 housed in the fourth package 10D, as shown in Figures 10A and 10B.

The fourth package 10D has a fourth mounting substrate 14D and a fourth transparent sealing member 18D. The fourth mounting substrate 14D has a configuration similar to that of the first mounting substrate 14A (see FIG. 1B) described above, and the fourth transparent sealing member 18D has a configuration similar to that of the first transparent sealing member 18A (see FIG. 1B) described above, i.e., has a storage space 22 in which the optical element 12 is stored.

The fourth package 10D has a step 30 or taper 30 that prevents the bonding material 16 from entering the accommodation space 22 at least in the portion where the fourth transparent sealing member 18D and the fourth mounting substrate 14D are joined. In particular, in the fourth package 10D, as shown in FIG. 10B, a protrusion 32 is integrally or separately formed on the upper surface of the fourth mounting substrate 14D, thereby forming the step 30 or taper 30.

Here, examples of steps 30 or tapers 30 will be described with reference to Figures 11A to 15B.

As shown in Figures 11A and 11B, examples of the step 30 or taper 30 include a step with an inclination angle of 90° (where the cross-sectional shape of the convex portion 32 is rectangular), and as shown in Figures 12A and 12B, a step 30 or taper 30 with an inclination angle θ of less than 90° (where the cross-sectional shape of the convex portion 32 is wedge-shaped).

As shown in Fig. 13A and Fig. 13C (top view), the convex portion 32 on which the step 30 or taper 30 is formed may be formed in a ring shape, or as shown in Fig. 13B and Fig. 13D (top view), a plurality of convex portions 32 on which the step 30 or taper 30 is formed may be arranged in a ring shape. As an example, Fig. 13A and Fig. 13B show convex portions 32 formed or arranged in a circular ring shape, and Fig. 13C and Fig. 13D show convex portions 32 formed or arranged in a rectangular ring shape. As shown in Fig. 11A, these convex portions 32 are formed in a position close to the optical element 12 in the portion bonded to the fourth mounting substrate 14D, and the step 30 or taper 30 is formed in a position of the convex portion 32 facing the bonding material 16.

As shown in Figures 11A and 12A, the corners of the convex portion 32 may be acute-angled, but as shown in Figures 11B and 12B, it is preferable that they are rounded. This can prevent the corners of the convex portion 32 from being chipped when it comes into contact with the transparent body 20, etc.

Moreover, preferably, the step 30 or taper 30 (height hc of the protrusion 32) is 10 to 500 μm, and the width W of the protrusion 32 is at least 50 μm. This ensures a sufficient adhesive layer capacity to bond and fix the mounting substrate and the transparent body. Note that it is preferable that the width W of the protrusion 32 is set to a width that does not excessively narrow the size of the package, i.e., the area of the portion where the bonding material 16 is applied (bonding material application portion 34).

11A, 11B, 12A, 12B, and 14A, the position of the inner end face 32a of the convex portion 32 may be aligned with the position of the inner circumferential surface 20a of the transparent body 20 (the position of the outer periphery of the storage space 22). As shown in FIG. 14B, the end face 32a may be shifted toward the outer periphery of the fourth transparent sealing member 18D, provided that the area of the portion where the bonding material 16 is applied (bonding material application portion 34) is not excessively narrowed. Also, as shown in FIGS. 15A and 15B, the end face 32a on the side of the storage space 22 may be an inclined surface. These modified examples are also applicable to the configurations of various packages described later.

Next, an optical component (hereinafter referred to as a fifth optical component 100E) having a package according to the fifth embodiment (hereinafter referred to as a fifth package 10E) has a fifth package 10E and at least one optical element 12 housed in the fifth package 10E, as shown in Figures 16A and 16B.

The fifth package 10E has a similar configuration to the second package 10B described above (see Figures 8A and 8B), but differs in that a step 30 or taper 30 due to a protrusion 32 is formed on the upper surface of the fifth mounting substrate 14E.

The shape of the step 30 or taper 30 and the protrusion 32 can be any of the various shapes shown in Figures 11A to 15B described above.

Next, an optical component (hereinafter referred to as sixth optical component 100F) having a package according to the sixth embodiment (hereinafter referred to as sixth package 10F) has a sixth package 10F and at least one optical element 12 housed in the sixth package 10F, as shown in Figures 17A and 17B.

The sixth package 10F, like the first package 10A described above, has a flat sixth mounting substrate 14F on which the optical element 12 is mounted, and a sixth transparent sealing member 18F bonded to the sixth mounting substrate 14F via a bonding material 16.

The sixth transparent sealing member 18F includes a transparent body 20 fixed onto, for example, a flat sixth mounting substrate 14F. The transparent body 20 has a box-like shape with a flat upper surface and a rectangular storage space 22.

In this sixth package 10F as well, the step 30 or taper 30 and the protrusion 32 may have any of the various shapes shown in Figures 2A to 5B and Figures 11A to 15B described above.

Next, an optical component (hereinafter referred to as the seventh optical component 100G) having a package according to the seventh embodiment (hereinafter referred to as the seventh package 10G) has the seventh package 10G and at least one optical element 12 housed in the seventh package 10G, as shown in Figures 18A and 18B.

The seventh package 10G has a configuration similar to that of the third package 10C (see Figures 9A and 9B) described above, but the shape of the transparent body 20 is different, and the upper surface is a flat plate. In other words, the solid lens body 26 is omitted.

In this seventh package 10G, the step 30 or taper 30 and the protrusion 32 can have any of the shapes shown in Figures 2A to 5B and Figures 11A to 15B.

[Summary of the embodiment]
[1] The package according to this embodiment is a package (10: 10A-10E) in which a transparent sealing member (18: 18A-18G) and a mounting substrate (14: 14A-14G) are bonded together, and which has a space (22) for accommodating at least one optical element (12). The portion where the transparent sealing member (18) and the mounting substrate (14) are bonded has a step (30) or taper (30) that prevents a bonding material (16) from entering the space (22).

According to the above configuration, when the transparent sealing member 18 is bonded to the mounting substrate 14, the step 30 or taper 30 prevents the bonding material 16 (resin, metal, etc.) from entering the accommodation space 22, so that the light emitted from the optical element 12 (e.g., ultraviolet light 13) is hardly blocked by the bonding material 16, and the decrease in the overall light transmittance can be suppressed.

In addition, even if pressure and heat are applied when bonding the transparent sealing member 18 to the mounting substrate 14, the step 30 or taper 30 prevents the bonding material 16 from entering the housing space 22, preventing the volatile components of the bonding material 16 from adhering to the optical element 12. This helps prevent deterioration in the quality of the optical element 12 and the optical components (100: 100A-100G).

[2] In this embodiment, it is preferable that the inclination angle of the step (30) or taper (30) is 20° or more and 90° or less.

[3] In this embodiment, at least one of the transparent sealing member (18) and the mounting substrate (14) has a convex portion (32) at the portion to be joined, and the step (30) or taper (30) is formed at a position of the convex portion (32) that faces the bonding material (16). As a result, when the transparent sealing member 18 is joined to the mounting substrate 14, the step 30 or taper 30 of the convex portion 32 can efficiently prevent the bonding material 16 from entering the storage space 22.

[4] In this embodiment, the step (30) or taper (30) is formed in an annular shape. As a result, the step 30 or taper 30 formed in an annular shape can prevent the joining material 16 from entering the storage space 22.

[5] In this embodiment, multiple steps (30) or tapers (30) are arranged in a ring shape. In this case, the multiple steps 30 or tapers 30 arranged in a ring shape can also prevent the joining material 16 from entering the storage space 22.

[6] In this embodiment, the step (30) or taper (30) is formed in a portion that is bonded to the mounting substrate (14) and is located close to the optical element (12). By forming the step 30 or taper 30 in a position close to the optical element 12, it is possible to prevent the bonding material 16 from entering the storage space 22.

[7] In this embodiment, the step (30) is a part of the rectangular cross section. Of the part of the rectangular cross section, the surface facing the bonding material 16 constitutes the step 30, making it possible to prevent the bonding material 16 from entering the storage space 22.

[8] In this embodiment, the taper (30) is part of a wedge-shaped cross section, and the higher part of the taper (30) is located close to the optical element (12). Of the convex portion 32 of the wedge-shaped cross section, the surface facing the bonding material 16 forms an inclined surface, and the closer it is to the optical element 12, the narrower the space into which the bonding material 16 enters. As a result, it is possible to suppress the entry of the bonding material 16 into the storage space 22.

[9] In this embodiment, the height (hc) of the step (30) or taper (30) (for example, the height in a direction perpendicular to the surface of the mounting substrate (14)) is preferably 10 to 500 μm. If it is less than 10 μm, the amount of bonding material (adhesive layer) is reduced, making it difficult to ensure adhesion to the mounting substrate 14 or the transparent sealing member 18. If it exceeds 500 μm, the strength of the step 30 or taper 30 decreases and there is a risk of breakage. Also, if it is less than 10 μm, the effect of suppressing the overflow of the bonding material 16 is insufficient. If it exceeds 500 μm, the height relationship with the optical element 12 (ha>hb) will no longer be established, and as a result, there is a risk that the ultraviolet light 13 will hit the bonding material 16.

[10] In this embodiment, the width of the step (30) or taper (30) is preferably set to a width that does not excessively narrow the size of the package, i.e., the area of the portion where the bonding material 16 is applied (bonding material application portion 34). In other words, it is preferable that the width is at least 50 μm. If it is less than 50 μm, the effect of suppressing the overflow of the bonding material 16 is not sufficient.

[11] In this embodiment, it is preferable that the corners of the step (30) or taper (30) are curved, i.e., the corners are rounded. This can prevent the corners of the protrusion 32 from chipping when it comes into contact with the mounting board 14, etc.

[12] The transparent sealing member (18) according to this embodiment is a transparent sealing member (18) having a bonding surface (bonding material application portion 34) that is bonded to the mounting substrate (14), and has a step (30) or taper (30) that prevents the bonding material (16) from entering the inside of the transparent sealing member (18).

According to the above configuration, when the transparent sealing member 18 is bonded to the mounting substrate 14, the step 30 or taper 30 prevents the bonding material 16 from entering the storage space 22, so that the light emitted from the optical element 12 is hardly blocked by the bonding material 16, and the decrease in the overall light transmittance can be suppressed.

The package and transparent sealing member according to the present invention are not limited to the above-mentioned embodiment, and may of course be configured in various ways without departing from the gist of the present invention.

Reference Signs List 10A to 10G...first package to seventh package 12...optical element 12a...light emission surface 13...ultraviolet light 14A to 14G...first mounting substrate to seventh mounting substrate 14a...bottom surface 16...bonding material 18A to 18G...first transparent sealing member to seventh transparent sealing member 20...transparent body 20a...inner peripheral surface 22...accommodation space 24...pedestal 26...lens body 30...step or taper 32...convex portion 32a...end surface 100A to 100G...first optical component to seventh optical component 200...package (comparative example)

Claims (9)

A package in which a transparent sealing member and a mounting substrate are joined and which has a space for accommodating at least one optical element,
a recess provided in the transparent sealing member and forming the space together with the mounting substrate;
a protrusion provided on one of the transparent sealing member and the mounting substrate, the protrusion being located at a portion where the transparent sealing member and the mounting substrate are joined;
having
The protrusion has a step or a taper that suppresses the intrusion of a bonding material into the space,
a protruding end of the convex portion contacts the other of the transparent sealing member and the mounting substrate,
The step or the taper is formed at a position inside the position of the bonding material. 2. The package of claim 1,
A package, wherein the inclination angle of the step or the taper is 20° or more and 90° or less. 3. The package according to claim 1 or 2,
The step or taper is formed in an annular shape. The package according to any one of claims 1 to 3,
A package in which a plurality of the steps or tapers are arranged in an annular shape. The package according to any one of claims 1 to 4,
The protrusion has the step,
A package, wherein the step is a part of a rectangular cross section. The package according to any one of claims 1 to 4,
The protrusion has the taper,
The package, wherein the taper is part of a wedge-shaped cross section, and the higher portion of the taper is located adjacent to the optical element. The package according to any one of claims 1 to 6,
The height of the step or taper is 10 to 500 μm. The package according to any one of claims 1 to 7,
The width of the step or taper is at least 50 μm;
the width of the step is a dimension from an end surface of the protrusion on the side of the space to an end surface of the protrusion on the opposite side to the space,
A package, wherein the width of the taper is a dimension from an end face of the protrusion on the side facing the space to an end point of the taper on the opposite side to the space. The package according to any one of claims 1 to 8,
The package, wherein the step or the taper has a curved corner.

Images