JP7585518B2 - Board working device, component mounting device, printing device, and board working method - Google Patents

Description

This invention relates to a board work device, a component mounting device, a printing device and a board work method.

Component mounting devices are known in the art. For example, a component mounting device is disclosed in JP 2013-161840 A.

The above-mentioned JP 2013-161840 A discloses a component mounting device that includes a board transport section that transports a board on which components are to be mounted to a work position, a backup member placement section in which multiple backup members are placed to support the board transported to the work position, and a movement section that moves the backup members to placement positions in the backup member placement section that support the board. The component mounting device of JP 2013-161840 A is configured such that when multiple backup members are placed in placement positions in the backup member placement section that support the board according to the type of board, backup members not used to support the board are placed in temporary placement positions outside the board in the backup member placement section.

JP 2013-161840 A

In the component mounting device of JP 2013-161840 A, when multiple backup members are arranged in positions in the backup member arrangement section to support the board according to the type of board, backup members not used to support the board are arranged in temporary placement positions outside the board in the backup member arrangement section, so the backup members must be moved to their temporary placement positions. This increases the time required to move the backup members. Therefore, it is desirable to suppress the increase in the time required to move the backup members when multiple backup members are arranged according to the type of board.

This invention has been made to solve the problems described above, and one object of the invention is to provide a board work device, component mounting device, printing device and board work method that can prevent an increase in the time required to move backup members when multiple backup members are arranged according to the type of board.

In order to achieve the above object, a board work apparatus according to one aspect of the present invention includes a board transport unit which transports a board on which components are mounted to a work position, a backup member placement unit in which multiple backup members are placed to support the board transported to the work position, a moving unit which moves the backup members relative to the backup member placement unit, and a control unit which controls the movement of the backup members by the moving unit, wherein the control unit is configured to, when work is performed on a second board of a different type to the first board after work has been performed on a first board at the work position, perform control to pre-position some of the multiple backup members for supporting the second board within the range of the first board when work is performed on the first board, and the control unit performs control to pre-position the backup members for supporting the second board within the range of the first board when a waiting time occurs while the first board is not positioned at the work position during production of the first board .

In the board working device according to one aspect of the present invention, as described above, the control unit is configured to control the positioning of some of the multiple backup members for supporting the second board within the range of the first board when working on the first board after working on the first board at the working position. By positioning some of the multiple backup members for supporting the second board within the range of the first board in advance when working on the first board, when switching from production of the first board to production of the second board, some of the backup members for supporting the second board are already positioned in the backup member positioning portion, so that the number of backup members to be moved to support the second board can be reduced accordingly. As a result, an increase in the time required for moving the backup members can be suppressed .

In the board working device according to the above aspect, the control unit is preferably configured to perform control to place some of the multiple back-up members in advance at positions where they do not interfere with the board currently being worked on and the back-up members supporting the board currently being worked on. With this configuration, it is possible to prevent a decrease in workability for the board currently being worked on due to the back-up members placed in advance interfering with the board currently being worked on and the back-up members supporting the board.

In this case, the control unit is preferably configured to perform control to place some of the multiple back-up members in advance at positions that do not interfere with components mounted on the back surface of the board currently being worked on. With this configuration, the back-up members placed in advance do not come into contact with the components mounted on the back surface of the board currently being worked on, thereby making it possible to prevent damage to the components on the back surface of the board.

In the above-mentioned configuration for controlling the placement of the backup members in advance at positions that do not interfere with the currently working board and the backup members supporting the currently working board, the control unit is preferably configured to obtain positions that do not interfere with the currently working board and the backup members supporting the currently working board based on information related to the first board and information related to the second board. With this configuration, it is possible to easily determine some of the backup members to be placed in advance among the multiple backup members for supporting the second board .

In the board working apparatus according to the above aspect, preferably, after working on the first board and before working on the second board, the control unit controls the movement of the backup members so as to shorten the movement time of the backup members based on a plurality of candidate movement operations when moving the backup members other than the backup members placed earlier to positions for supporting the second board. With this configuration, the movement time of the backup members that need to be moved when switching from production of the first board to production of the second board can be shortened, and therefore an increase in the time required for moving the backup members can be effectively suppressed.

In the board working apparatus according to the above aspect, preferably, after working on the first board and before working on the second board, the control unit controls the movement of the backup members so as to shorten the distance of movement of the backup members based on a plurality of candidate movement operations when moving the backup members other than the backup member placed earlier to a position for supporting the second board. With this configuration, the movement distance of the backup members that need to be moved when switching from production of the first board to production of the second board can be shortened, and therefore an increase in the time required for moving the backup members can be effectively suppressed.

In the board working device according to the first aspect, the control unit preferably produces the multiple types of boards by setting the production order of the types of boards to be produced in such an order that the total movement time of the backup members other than the backup member placed first becomes small. With this configuration, the multiple types of boards can be produced in such an order that the movement time of the backup members that need to be moved becomes small, thereby shortening the total production time of the multiple types of boards.

In the board working device according to the first aspect, the control unit preferably produces the multiple types of boards by setting the production order of the types of boards to be produced in such an order that the total movement distance of the backup members other than the backup member placed first becomes small. By configuring in this way, the multiple types of boards can be produced in such an order that the movement distance of the backup members that need to be moved becomes small, and therefore the total production time for the multiple types of boards can be shortened accordingly.

In the board working device according to the first aspect, when a waiting time occurs while the first board is being produced and the first board is not positioned at the working position, the control unit performs control to preliminarily position a backup member for supporting the second board within the range of the first board. This makes it possible to preliminarily position the backup member by utilizing the waiting time, so that even during the production of the first board, the backup member for supporting the second board can be preliminarily positioned.

According to the present invention, when multiple backup members are arranged according to the type of substrate as described above, it is possible to prevent an increase in the time required to move the backup members.

1 is a plan view showing a configuration of a component mounting apparatus according to an embodiment of the present invention. 1 is a front view showing a configuration of a component mounting apparatus according to an embodiment of the present invention. 1 is a diagram showing a board for explaining the prior arrangement of backup pins in a component mounting device according to an embodiment of the present invention; FIG. 1 is a diagram showing a substrate for explaining the placement of backup pins in the component mounting device according to an embodiment of the present invention; FIG. 1 is a diagram showing a first example of an arrangement of backup pins on a substrate of a component mounting device according to an embodiment of the present invention. FIG. 13 is a diagram showing a second example of an arrangement of backup pins on a substrate of the component mounting device according to the embodiment of the present invention. FIG. 13A and 13B are diagrams showing a substrate for explaining an example of movement of a backup pin of the component mounting device according to the embodiment of the present invention. 13A and 13B are diagrams showing substrates for explaining a comparative example of movement of backup pins of the component mounting device according to the embodiment of the present invention. 10A and 10B are diagrams for explaining the determination of a production sequence of boards by the component mounting device according to the embodiment of the present invention. 11 is a flowchart for explaining a process of extracting a previously placed pin in the component mounting device according to the embodiment of the present invention. 4 is a flowchart for explaining a preliminary placement operation process of the component mounting apparatus according to the embodiment of the present invention. 11 is a flowchart for explaining a reserved pin extraction process of the component mounting device according to the embodiment of the present invention. 4 is a flowchart for explaining a setup operation process of the component mounting device according to the embodiment of the present invention. 4 is a flowchart for explaining a pin returning operation process of the component mounting device according to the embodiment of the present invention. 4 is a flowchart for explaining a pin rearrangement operation process of the component mounting apparatus according to the embodiment of the present invention.

Below, an embodiment of the present invention is described with reference to the drawings.

With reference to Figures 1 to 15, the configuration of a component mounting apparatus 100 according to one embodiment of the present invention will be described.

As shown in FIG. 1, the component mounting device 100 is a component mounting device that transports a board S in the X direction using a pair of conveyors 2 and mounts a component 31 on the board S at a work position M.

The component mounting device 100 comprises a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a moving mechanism 5, a moving mechanism 6, a component recognition imaging unit 7, and a control unit 8. The component mounting device 100 also comprises a backup pin placement unit 9, as shown in FIG. 2. The conveyor 2 is an example of a "board transport unit" as claimed. The backup pin placement unit 9 is an example of a "backup member placement unit" as claimed. The component mounting device 100 is an example of a "board work device" as claimed.

As shown in Figures 1 and 2, the pair of conveyors 2 are installed on a base 1 and are configured to transport a board S in the X direction. The pair of conveyors 2 are also configured to transport the board S on which components are mounted to a work position M. The pair of conveyors 2 are also provided with a holding mechanism that holds the board S stopped at the work position M during transportation. The pair of conveyors 2 are also configured so that the distance in the Y direction can be adjusted to match the dimensions of the board S.

As shown in FIG. 1, the component supply unit 3 is disposed on the outer side (Y1 side and Y2 side) of the pair of conveyors 2. The component supply unit 3 also has a tape feeder 30 disposed therein that supplies components 31 to the mounting head 42. The component supply unit 3 is also configured to allow multiple tape feeders 30 to be disposed therein.

The tape feeder 30 supplies the components 31 while feeding out a component supply tape holding the components 31. Specifically, the tape feeder 30 holds a reel around which a component supply tape is wound, holding a plurality of components 31 at a predetermined interval. The tape feeder 30 is configured to feed the component supply tape on the reel toward the component supply position. The tape feeder 30 is configured to supply the components 31 from its tip in the Y direction. Here, the components 31 include electronic components such as ICs, transistors, capacitors, resistors, and connectors.

As shown in Figures 1 and 2, the head unit 4 is positioned above the pair of conveyors 2 and the component supply unit 3, and includes multiple (five) mounting heads 42 with nozzles 41 attached to their lower ends, and a board recognition imaging unit 43.

The mounting head 42 is configured to perform work on the board S. The mounting head 42 is configured to mount the components 31 on the board S. Specifically, the mounting head 42 is configured to adsorb the components 31 supplied from the tape feeder 30 arranged in the component supply unit 3 and mount the adsorbed components 31 on the board S arranged at the work position M. The mounting head 42 is also configured to be able to move up and down (movable in the Z direction). The mounting head 42 is also configured to adsorb and hold the components 31 supplied from the tape feeder 30 by the negative pressure generated at the tip of the nozzle 41 by a negative pressure generator (not shown), and mount (mount) the components 31 at the mounting position on the board S. The mounting head 42 is an example of a "moving unit" in the claims.

The mounting head 42 is also configured to move the backup pin 91 relative to the backup pin arrangement section 9. Specifically, the mounting head 42 holds the backup pin 91 with a nozzle capable of holding the backup pin 91 attached to its tip, and moves the backup pin 91. The mounting head 42 is capable of moving the backup pin 91 within the backup pin arrangement section 9, and is also capable of moving the backup pin 91 between the backup pin arrangement section 9 and a backup pin station on which multiple backup pins 91 are placed. The backup pin 91 is an example of a "backup member" as defined in the claims.

The board recognition imaging unit 43 images the board S from above. The board recognition imaging unit 43 is configured to image the fiducial mark F of the board S in order to recognize the position and posture of the board S. Then, by imaging and recognizing the position of the fiducial mark F, it is possible to accurately obtain the mounting position of the component 31 on the board S.

1, the moving mechanism 5 includes a motor 51. The moving mechanism 5 is configured to move the head unit 4 in the X direction along the moving mechanism 5 by driving the motor 51. The moving mechanism 5 is supported at both ends by the moving mechanism 6.

The moving mechanism 6 is fixed on the base 1. The moving mechanism 6 on the X1 side includes a motor 61. The moving mechanism 6 is configured to move the moving mechanism 5 in the Y direction perpendicular to the X direction along the moving mechanism 6 by driving the motor 61. The head unit 4 is movable in the X direction along the moving mechanism 5, and the moving mechanism 5 is movable in the Y direction along the moving mechanism 6, so that the head unit 4 can move in the horizontal direction (XY direction). In other words, the moving mechanisms 5 and 6 are configured to move the mounting head 42 in the horizontal direction.

The component recognition imaging unit 7 images the component 31 from below. The component recognition imaging unit 7 is fixed on the upper surface of the base 1. The component recognition imaging unit 7 is arranged on the outer side (Y1 side and Y2 side) of the pair of conveyors 2. The component recognition imaging unit 7 is configured to image the component 31 adsorbed by the nozzle 41 of the mounting head 42 from the lower side (Z2 side) in order to recognize the adsorption state (adsorption posture) of the component 31 prior to mounting the component 31. This makes it possible for the control unit 8 to acquire the adsorption state of the component 31 adsorbed by the nozzle 41 of the mounting head 42.

The control unit 8 is configured to control the overall operation of the component mounting device 100, such as the transport operation of the board S by the pair of conveyors 2, the mounting operation by the head unit 4, the imaging operation by the component recognition imaging unit 7 and the board recognition imaging unit 43, and the arrangement operation of the backup pins 91 by the mounting head 42. The control unit 8 includes a processor such as a CPU (central processing unit) and a memory. The control unit 8 is also configured to perform various controls by executing a predetermined program.

2, the backup pin arrangement section 9 is configured to have a plurality of backup pins 91 arranged therein. The backup pins 91 are configured to support from below the substrate S transported to the work position M. Furthermore, the plurality of backup pins 91 are arranged within the range of the substrate S so as to correspond to the substrate S being worked on.

The backup pin arrangement section 9 is configured to be movable in the vertical direction (Z direction). By moving upward, the backup pin arrangement section 9 abuts the backup pins 91 against the underside of the board S (the backside opposite to the mounting surface) to support the board S. By moving downward, the backup pin arrangement section 9 separates the backup pins 91 from the board S to prevent the backup pins 91 from interfering with the movement of the board S.

The backup pin arrangement portion 9 is provided with multiple pin holes for arranging the backup pins 91. The multiple pin holes are arranged at a constant pitch in the X and Y directions. The backup pins 91 are inserted into the pin holes and fixed in place.

Here, in this embodiment, the control unit 8 controls the movement of the backup pins 91 by the mounting head 42. Specifically, when performing work on a second substrate Sb of a different type from the first substrate Sa after performing work on the first substrate Sa at the work position M, the control unit 8 is configured to perform control to preliminarily position some of the multiple backup pins 91 for supporting the second substrate Sb within the range of the first substrate Sa when performing work on the first substrate Sa. Note that the range of the first substrate Sa includes the range of the circumscribed rectangle of the first substrate Sa. In other words, when a notch or a through hole is formed in the first substrate Sa, if the notch or the through hole is within the circumscribed rectangle of the first substrate Sa, the notch or the through hole is also within the range of the first substrate Sa.

For example, as shown in FIG. 3, when performing work on the first substrate Sa, the control unit 8 performs control to position a plurality of backup pins 921 supporting the second substrate Sb in advance, separately from a plurality of backup pins 911 supporting the first substrate Sa.

The control unit 8 performs control to position a portion of the multiple backup pins 91 (backup pin 921) in advance at a position that does not interfere with the board S (first board Sa) currently being worked on and the backup pin 91 (backup pin 911) supporting the board S (first board Sa) currently being worked on.

In the example shown in FIG. 3, of the backup pins 921, 922, 923, and 924 for supporting the second substrate Sb, the backup pin 921 is a backup pin 91 that does not interfere with the first substrate Sa and the backup pin 911 that supports the first substrate Sa. The backup pin 922 is a backup pin 91 that is located outside the width direction (Y direction) of the first substrate Sa. The backup pin 922 is not placed first because a position outside the first substrate Sa in the Y direction would interfere with the conveyor 2. The backup pin 923 is a backup pin 91 that is located in a position that interferes with the backup pin 911 that supports the first substrate Sa. For this reason, the backup pin 923 is not placed first.

The backup pin 924 is a backup pin 91 that is positioned to interfere with the first board Sa. Specifically, the backup pin 924 is a backup pin 91 that is positioned to interfere with the component 31a mounted on the back surface of the first board Sa. For this reason, the backup pin 924 is not placed in advance. In other words, the control unit 8 performs control to place some of the multiple backup pins 91 (backup pin 921) in advance in a position that does not interfere with the component 31 (31a) mounted on the back surface of the board S (first board Sa) currently being worked on.

In addition, in this embodiment, when work is performed on a second substrate Sb of a different type from the first substrate Sa after work is performed on the first substrate Sa at the work position M, the control unit 8 is configured to control the retaining of some of the multiple backup pins 91 used to support the first substrate Sa within the range of the second substrate Sb when work is performed on the second substrate Sb.

For example, as shown in FIG. 4, when working on the second substrate Sb, the control unit 8 controls the retention of the multiple backup pins 931 used to support the first substrate Sa separately from the multiple backup pins 911 supporting the second substrate Sb.

The control unit 8 controls the positioning of some of the multiple backup pins 91 (backup pin 931) in a position that does not interfere with the substrate S (second substrate Sb) currently being worked on and the backup pin 91 (backup pin 911) supporting the substrate S (second substrate Sb) currently being worked on.

In the example shown in FIG. 4, of the backup pins 931, 932, 933, and 934 for supporting the first substrate Sa, the backup pin 931 is a backup pin 91 that does not interfere with the second substrate Sb and the backup pin 911 supporting the second substrate Sb. The backup pin 932 is a backup pin 91 that is located outside the width direction (Y direction) of the second substrate Sb. The backup pin 932 is not retained because its position outside the second substrate Sb in the Y direction interferes with the conveyor 2. The backup pin 933 is a backup pin 91 that is located in a position that interferes with the backup pin 911 supporting the second substrate Sb. For this reason, the backup pin 933 is not retained.

The backup pin 934 is a backup pin 91 that is in a position where it interferes with the second board Sb. Specifically, the backup pin 934 is a backup pin 91 that is in a position where it interferes with the component 31a mounted on the back surface of the second board Sb. For this reason, the backup pin 934 is not retained. In other words, the control unit 8 performs control to retain some of the multiple backup pins 91 (backup pin 931) in a position where it does not interfere with the component 31 (31a) mounted on the back surface of the board S (second board Sb) currently being worked on.

The control unit 8 is also configured to acquire a position that does not interfere with the currently working board S and the backup pin 91 supporting the currently working board S, based on information related to the first board Sa and information related to the second board Sb. The control unit 8 also places the backup pin 91 in advance at a position that does not interfere with the currently working board S and the backup pin 91 supporting the currently working board S. The control unit 8 also keeps the backup pin 91 in a position that does not interfere with the currently working board S and the backup pin 91 supporting the currently working board S.

Furthermore, after performing work on the first substrate Sa and before performing work on the second substrate Sb, when the control unit 8 moves the backup pins 91 other than the backup pins 91 placed in advance and the backup pins 91 to be retained to positions to support the second substrate Sb, the control unit 8 controls the movement of the backup pins 91 so as to shorten the movement time of the backup pins 91 based on multiple candidate movement work. Specifically, the control unit 8 obtains multiple movement patterns of the multiple backup pins 91 that need to be moved by simulation, and selects from among them the movement pattern that shortens the movement time of the backup pins 91.

Furthermore, after performing work on the first substrate Sa and before performing work on the second substrate Sb, when the control unit 8 moves the backup pins 91 other than the backup pins 91 placed in advance and the backup pins 91 to be retained to a position to support the second substrate Sb, the control unit 8 controls the movement of the backup pins 91 so as to shorten the movement distance of the backup pins 91 based on multiple candidate movement work. Specifically, the control unit 8 obtains multiple movement patterns of the multiple backup pins 91 that need to be moved by simulation, and selects from among them a movement pattern that shortens the movement distance of the backup pins 91. Note that if the movement distance of the backup pins 91 is shortened, the movement time will be shortened, so the control unit 8 may select a movement pattern based on the movement time or distance.

For example, when performing work on a substrate Sc as shown in FIG. 5 and then performing work on a substrate Sd as shown in FIG. 6, it is necessary to move multiple backup pins 91 from the arrangement of backup pins 91 supporting substrate Sc to the arrangement of backup pins 91 supporting substrate Sd.

In the embodiment shown in Figure 7, the multiple backup pins 931 used to support the substrate Sc are left in place even when work is performed on the substrate Sd. Also, of the multiple backup pins 91 used to support the substrate Sc, those that are in the same position as the backup pins 91 supporting the substrate Sd are used without being moved. As a result, in the example shown in Figure 7, 10 backup pins 91 are rearranged and one backup pin 91 is returned to the backup pin station. In other words, a total of 11 backup pins 91 are moved.

On the other hand, in the comparative example shown in Figure 8, all backup pins 91 not used to support the substrate Sd are returned to the backup pin station, so 10 backup pins 91 are rearranged and 7 backup pins 91 are returned to the backup pin station. In other words, a total of 17 backup pins 91 are moved. As a result, the embodiment shown in Figure 7 makes it possible to shorten the distance and time of movement of the backup pins 91 compared to the comparative example shown in Figure 8.

In addition, the control unit 8 produces multiple types of boards S by setting the production order of the types of boards S to be produced in an order that minimizes the total movement time of the backup pins 91 placed first and the backup pins 91 other than the backup pins 91 to be kept in place. Alternatively, the control unit 8 produces multiple types of boards S by setting the production order of the types of boards S to be produced in an order that minimizes the total movement distance of the backup pins 91 placed first and the backup pins 91 other than the backup pins 91 to be kept in place.

In addition, as shown in Figure 9, the control unit 8 may determine the production sequence by selecting from a plurality of production sequence patterns a production sequence that results in the least total number of movements of the backup pins 91 when changing over from the production variety list of the boards S to be produced.

In addition, when the first substrate Sa is being produced and a waiting time occurs while the first substrate Sa is not positioned at the working position M, the control unit 8 performs control to position a backup pin 91 in advance within the range of the first substrate Sa to support the second substrate Sb.

Next, the preceding pin extraction process performed by the control unit 8 of the component mounting device 100 will be described with reference to Fig. 10. In this preceding pin extraction process, among the backup pins 91 for supporting the second substrate Sb, backup pins 91 to be placed in advance during the work on the first substrate Sa are extracted.

In step S1 of Figure 10, information on the currently placed backup pins 91 is obtained. That is, position information on the backup pins 91 used for the first board Sa currently being worked on is obtained. In step S2, information on the backup pins 91 to be placed for the next board type (second board Sb) to be produced is obtained. That is, position information on the backup pins 91 to be used for the second board Sb to be produced after the production of the first board Sa is obtained.

In step S3, shape information of the board S (first board Sa) currently being produced is acquired. That is, shape information of the outer periphery of the first board Sa currently being worked on is acquired. In step S4, placement information of components 31 on the back surface of the board S (first board Sa) currently being produced is acquired. That is, position information of components 31 on the back surface of the first board Sa currently being worked on is acquired.

From step S5 to step S10, a loop process is performed while incrementing i by 1. In step S6, position information of the i-th backup pin 91 to be placed in the next production board type (second board Sb) is obtained.

In step S7, it is determined whether the Y-direction position of the i-th backup pin 91 is outside the range of the currently produced board S (first board Sa). If it is outside the range, proceed to step S11, and if it is within the range, proceed to step S8. In step S8, it is determined whether any of the currently placed backup pins 91 interfere with the i-th backup pin 91. If there is an interfering backup pin 91, proceed to step S11, and if there is no interfering backup pin 91, proceed to step S9.

In step S9, it is determined whether or not there is an interfering component 31 among the components 31 on the back side of the currently produced board S (first board Sa) with respect to the i-th backup pin 91. If there is an interfering component 31 on the back side, the process proceeds to step S11, and if there is no interfering component 31 on the back side, the process proceeds to step S10. In step S10, the i-th backup pin 91 is registered as the backup pin 91 to be placed first (pre-placed pin). Then, after the loop process from step S5 to step S11 is performed for all backup pins 91 to be placed in the board type (second board Sb) of the next production, the process of extracting pre-placed pins is terminated.

11, the advance placement operation process by the control unit 8 of the component mounting device 100 will be described. In this advance placement operation process, when performing work on the first substrate Sa, some of the multiple backup pins 91 for supporting the second substrate Sb are placed in advance within the range of the first substrate Sa.

In step S12 of FIG. 11, it is determined whether there is a preceding pin. That is, in the preceding pin extraction process of FIG. 10, it is determined whether one or more backup pins 91 are registered as preceding pins. If there is a preceding pin, proceed to step S13, and if there is no preceding pin, proceed to step S20. In step S13, it is determined whether there is a board S (first board Sa) at the work position M. That is, it is determined whether there is no board S at the work position M and the backup pin 91 can be moved relative to the backup pin placement section 9. If there is a board S at the work position M, proceed to step S20, and if there is no board S at the work position M, proceed to step S14.

In step S14, it is determined whether or not a substrate S (first substrate Sa) is being transported to working position M. If a substrate S is being transported to working position M, proceed to step S20; if a substrate S is not being transported to working position M, proceed to step S15. In step S15, it is determined whether or not a substrate S (first substrate Sa) is present in a position upstream of working position M. If a substrate S is present in a position upstream of working position M, proceed to step S20; if a substrate S is not present in a position upstream of working position M, proceed to step S16.

In step S16, it is determined whether or not a substrate S (first substrate Sa) is being transported to a position upstream of the working position M. If a substrate S is being transported to a position upstream of the working position M, the process proceeds to step S20; if a substrate S is not being transported to a position upstream of the working position M, the process proceeds to step S17. In step S17, the transport of the substrate S to the working position M is prohibited.

In step S18, the pre-placement pin is placed. In step S19, the prohibition on transporting the board S to the work position M is lifted. In step S20, production of the board S (first board Sa) continues. Then, the process returns to step S12.

Next, the reserved pin extraction process by the control unit 8 of the component mounting device 100 will be described with reference to Fig. 12. In this reserved pin extraction process, among the backup pins 91 used to support the first substrate Sa, the backup pins 91 that are to be retained during the work on the second substrate Sb are extracted.

In step S21 of FIG. 12, information on the currently placed backup pins 91 is obtained. That is, position information on the backup pins 91 used for the first board Sa currently being worked on is obtained. In step S22, information on the backup pins 91 to be placed for the next board type (second board Sb) to be produced is obtained. That is, position information on the backup pins 91 to be used for the second board Sb to be produced after the production of the first board Sa is obtained.

In step S23, shape information of the next production board S (second board Sb) is acquired. That is, shape information of the outer periphery of the second board Sb on which work will be performed next is acquired. In step S24, placement information of the components 31 on the back surface of the next production board S (second board Sb) is acquired. That is, position information of the components 31 on the back surface of the second board Sb on which work will be performed next is acquired.

From step S25 to step S32, a loop process is performed while incrementing i by 1. In step S26, position information of the i-th backup pin 91 to be placed for the board type (first board Sa) of the current production is obtained.

In step S27, it is determined whether or not there is a backup pin 91 for supporting the next production board S (second board Sb) that is located in the same position as the i-th backup pin 91. If there is a backup pin 91 in the same position, proceed to step S32, and if there is no backup pin 91 in the same position, proceed to step S28. In step S28, it is determined whether or not the Y-direction position of the i-th backup pin 91 is outside the range of the next production board (second board Sb). If it is outside the range, proceed to step S32, and if it is within the range, proceed to step S29.

In step S29, it is determined whether or not there is an interfering backup pin 91 among the backup pins 91 to be placed next with respect to the i-th backup pin 91. If there is an interfering backup pin 91, proceed to step S32, and if there is no interfering backup pin 91, proceed to step S30. In step S30, it is determined whether or not there is an interfering component 31 among the components 31 on the back surface of the next production board S (second board Sb) with respect to the i-th backup pin 91. If there is an interfering back surface component 31, proceed to step S32, and if there is no interfering back surface component 31, proceed to step S31.

In step S31, the i-th backup pin 91 is registered as a backup pin 91 (reserved pin) to be kept. Then, the loop process from step S25 to step S32 is performed for all backup pins 91 to be placed in the next production board type (second board Sb), and the reserved pin extraction process is terminated.

13, the setup operation process by the control unit 8 of the component mounting device 100 will be described. In this setup operation process, after performing work on the first substrate Sa, and before performing work on the second substrate Sb, the backup pins 91 are moved from the position of the backup pins 91 for supporting the first substrate Sa to the position of the backup pins 91 for supporting the second substrate Sb.

In step S41 of FIG. 13, it is determined whether pin rearrangement is necessary. In other words, it is determined whether the backup pins 91 need to be moved. For example, if there are no backup pins 91 to be moved due to the prior placement and retention of the backup pins 91, there is no need to move the backup pins 91. If pin rearrangement is necessary, the process proceeds to step S42, and if pin rearrangement is not necessary, the setup operation process is terminated. In step S42, it is determined whether there is a return pin. A return pin is a backup pin 91 that is returned from the backup pin placement unit 9 to the backup pin station. If there is a return pin, the process proceeds to step S43, and if there is no return pin, the process proceeds to step S45.

In step S43, the reserved pin extraction process of FIG. 12 is performed. In step S44, the pin return operation of FIG. 14, which will be described later, is performed. In step S45, the pin rearrangement operation of FIG. 16, which will be described later, is performed. Thereafter, the setup operation process is terminated.

The pin return operation process of step S44 in Fig. 13 will be described with reference to Fig. 14. In this pin return operation process, the backup pin 91 is returned from the backup pin placement unit 9 to the backup pin station.

In step S51 of FIG. 14, the number of backup pins 91 to be returned is calculated. The number of pins to be returned is calculated by (number of pins to be returned) = (number of backup pins 91 used for the currently produced board (first board Sa)) - (number of reserved pins) - (number of backup pins 91 to be used for the next produced board (second board Sb)). In step S52, it is determined whether the number of pins to be returned is greater than 0. If the number of pins to be returned is greater than 0, the process proceeds to step S53; if the number of pins to be returned is 0 or less, the pin return operation process is terminated.

In step S53, the backup pins 91 to be returned from the backup pins 91 used for the currently produced board (first board Sa), excluding the reserved pins, are returned to the backup pin station in the number equal to the number of backup pins to be returned. The pin return operation process is then terminated.

With reference to Figure 15, the pin rearrangement operation process of step S45 in Figure 13 will be described. In this pin rearrangement operation process, the backup pins 91 arranged in the backup pin arrangement section 9 are rearranged.

In step S54 of FIG. 15, backup pins 91 whose arrangement positions match those of the next production board (second board Sb) and the current production board (first board Sa) are excluded from being moved. In step S55, currently placed backup pins 91 other than reserved pins are moved to unplaced positions among the arrangement positions of the backup pins 91 of the next production board (second board Sb).

In step S56, it is determined whether there are any unplaced pins. If there are any unplaced pins, the process proceeds to step S57. If there are no unplaced pins, the pin rearrangement operation process ends. In step S57, the backup pin 91 is moved as a reserved pin to an unplaced position among the positions of the backup pin 91 on the next production board (second board Sb). Thereafter, the pin rearrangement operation process ends.

(Effects of this embodiment)
In this embodiment, the following effects can be obtained.

In this embodiment, as described above, when the control unit 8 performs work on the second substrate Sb of a different type from the first substrate Sa after performing work on the first substrate Sa at the work position M, the control unit 8 is configured to perform control to preliminarily place some of the multiple backup pins 91 for supporting the second substrate Sb within the range of the first substrate Sa when performing work on the first substrate Sa, and control to retain some of the multiple backup pins 91 used for supporting the first substrate Sa within the range of the second substrate Sb when performing work on the second substrate Sb. As a result, by preliminarily placing some of the multiple backup pins 91 for supporting the second substrate Sb within the range of the first substrate Sa when performing work on the first substrate Sa, when switching from production of the first substrate Sa to production of the second substrate Sb, some of the backup pins 91 for supporting the second substrate Sb are already placed in the backup pin placement unit 9, so that the number of backup pins 91 to be moved to support the second substrate Sb can be reduced accordingly. As a result, it is possible to suppress an increase in the time required for the movement of the backup pins 91. Furthermore, by retaining some of the multiple backup pins 91 used to support the first substrate Sa within the range of the second substrate Sb when working on the second substrate Sb, when switching from production of the first substrate Sa to production of the second substrate Sb, it is not necessary to move some of the backup pins 91 for supporting the first substrate Sa to remove them from the backup pin arrangement section 9, which also prevents an increase in the time required for moving the backup pins 91.

In addition, in this embodiment, as described above, the control unit 8 is configured to perform control to place some of the multiple backup pins 91 in advance and control to retain some of the multiple backup pins 91 in positions that do not interfere with the currently working board S and the backup pins 91 supporting the currently working board S. This makes it possible to suppress a decrease in workability for the currently working board S due to the previously placed backup pins 91 or the retained backup pins 91 interfering with the currently working board S and the backup pins 91 supporting the board S.

In addition, in this embodiment, as described above, the control unit 8 is configured to perform control to place some of the multiple backup pins 91 in advance and control to retain some of the multiple backup pins 91 in positions that do not interfere with the components 31 (31a) mounted on the back surface of the board S currently being worked on. This prevents the backup pins 91 placed in advance or the backup pins 91 that are retained from contacting the components 31 mounted on the back surface of the board S currently being worked on, thereby preventing damage to the components 31 on the back surface of the board S.

In addition, in this embodiment, as described above, the control unit 8 is configured to acquire positions that do not interfere with the currently working substrate S and the backup pins 91 supporting the currently working substrate S, based on information related to the first substrate Sa and information related to the second substrate Sb. This makes it possible to easily determine a portion of the multiple backup pins 91 for supporting the second substrate Sb that will be placed first. Also, it makes it possible to easily determine a portion of the multiple backup pins 91 for supporting the first substrate Sa that will be left in place.

In addition, in this embodiment, as described above, when the control unit 8 moves the backup pins 91 other than the backup pins 91 placed in advance and the backup pins 91 to be retained to positions to support the second substrate Sb after performing work on the first substrate Sa and before performing work on the second substrate Sb, the control unit 8 controls the movement of the backup pins 91 so as to shorten the movement time of the backup pins 91 based on multiple candidate movement work. This makes it possible to shorten the movement time of the backup pins 91 that need to be moved when switching from production of the first substrate Sa to production of the second substrate Sb, and effectively suppresses an increase in the time required for the movement of the backup pins 91.

In addition, in this embodiment, as described above, when the control unit 8 moves the backup pins 91 other than the backup pins 91 placed in advance and the backup pins 91 to be retained to positions to support the second substrate Sb after performing work on the first substrate Sa and before performing work on the second substrate Sb, the control unit 8 controls the movement of the backup pins 91 so as to shorten the movement distance of the backup pins 91 based on multiple candidate movement work. This makes it possible to shorten the movement distance of the backup pins 91 that need to be moved when switching from production of the first substrate Sa to production of the second substrate Sb, and therefore effectively suppresses an increase in the time required for the movement of the backup pins 91.

In addition, in this embodiment, as described above, the control unit 8 produces multiple types of substrates S by setting the production order of the types of substrates S to be produced in an order that minimizes the total movement time of the backup pins 91 other than the backup pins 91 that have been placed first and the backup pins 91 that are to be retained. This allows multiple types of substrates S to be produced in an order that minimizes the time it takes to move the backup pins 91 that need to be moved, thereby shortening the total production time for multiple types of substrates S.

In addition, in this embodiment, as described above, the control unit 8 produces multiple types of substrates S by setting the production order of the types of substrates S to be produced in an order that minimizes the total movement distance of the backup pins 91 other than the backup pins 91 that have been placed first and the backup pins 91 that are to be retained. This allows multiple types of substrates S to be produced in an order that minimizes the movement distance of the backup pins 91 that need to be moved, and therefore the total production time for multiple types of substrates S can be shortened accordingly.

In addition, in this embodiment, as described above, when the first substrate Sa is being produced and a waiting time occurs while the first substrate Sa is not positioned at the work position M, the control unit 8 performs control to place the backup pins 91 for supporting the second substrate Sb in advance within the range of the first substrate Sa. This allows the backup pins 91 to be placed in advance by utilizing the waiting time, so that the backup pins 91 for supporting the second substrate Sb can be placed in advance even during the production of the first substrate Sa.

(Modification)
It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope of the claims.

For example, in the above embodiment, an example of a component mounting device is shown as the board work device, but the present invention is not limited to this. In the present invention, the board work device may be a printing device that includes a board transport unit that transports a board on which components are mounted to a work position, a printing work unit that prints solder on the board at the work position, a backup member placement unit in which multiple backup members that support the board transported to the work position are placed, a movement unit that moves the backup members relative to the backup member placement unit, and a control unit that controls the movement of the backup members by the movement unit.

In the above embodiment, the control unit performs both the control of prepositioning some of the multiple backup members for supporting the second board within the range of the first board when working on the first board in the case where the control unit performs work on a second board of a different type from the first board at the work position and the control of retaining some of the multiple backup members used to support the first board within the range of the second board when working on the second board, but the present invention is not limited to this. In the present invention, the control unit may be configured to perform at least one of the control of prepositioning some of the multiple backup members for supporting the second board within the range of the first board when working on the first board, and the control of retaining some of the multiple backup members used to support the first board within the range of the second board when working on the second board.

In the above embodiment, an example of a configuration in which the backup pin arrangement portion (backup member arrangement portion) includes a plurality of pin holes and the backup pins (backup members) are inserted into the pin holes and fixed, is shown, but the present invention is not limited to this. In the present invention, the backup members may be attracted to and fixed to the backup member arrangement portion by the action of magnetic force, air pressure, or the like.

In addition, in the above embodiment, an example of a configuration in which the backup member is formed in a pin shape is shown, but the present invention is not limited to this. In the present invention, the backup member does not have to be formed in a pin shape as long as it is capable of supporting the substrate.

In the above embodiment, for convenience of explanation, the control process is described using a flow-driven flow in which the control process is performed in sequence according to the processing flow, but the present invention is not limited to this. In the present invention, the control process may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the control process may be completely event-driven, or may be a combination of event-driven and flow-driven.

2 Conveyor (substrate transport section)
8 Control unit 9 Backup pin arrangement unit (backup member arrangement unit)
31 Component 42 Mounting head (moving part)
91 Backup pin (backup member)
100 Component mounting device (substrate working device)
M Working position S Board Sa First board Sb Second board

Claims (8)

a board transport unit that transports a board on which components are to be mounted to a work position;
a backup member arrangement section in which a plurality of backup members for supporting the substrate transported to the work position are arranged;
a moving unit that moves the backup member relative to the backup member placement unit;
a control unit that controls the movement of the backup member by the movement unit,
the control unit is configured to, when performing work on a first substrate at the work position and then performing work on a second substrate of a different type from the first substrate, perform control to preliminarily position some of the plurality of backup members for supporting the second substrate within a range of the first substrate when performing work on the first substrate ;
The control unit controls the backup member for supporting the second substrate to be positioned in advance within the range of the first substrate when a waiting time occurs while the first substrate is being produced and the first substrate is not positioned at the work position . 2. The substrate working apparatus according to claim 1, wherein the control unit is configured to perform control to position some of the plurality of back-up members in advance at positions where they do not interfere with the substrate currently being worked on and the back-up members supporting the substrate currently being worked on. 3. The board working device according to claim 2, wherein the control unit is configured to perform control to position some of the plurality of back-up members in advance at positions where they do not interfere with components mounted on a back surface of the board currently being worked on. The substrate working device according to claim 2 or 3, wherein the control unit is configured to obtain a position that does not interfere with the substrate currently being worked on and the backup member that supports the substrate currently being worked on, based on information related to the first substrate and information related to the second substrate. 5. The substrate working device according to claim 1, wherein, when moving the backup members other than the backup member placed earlier to a position for supporting the second substrate after performing work on the first substrate and before performing work on the second substrate, the control unit controls the movement of the backup members so as to shorten a movement time of the backup members based on a plurality of candidate movement operations. 5. The board working device according to claim 1, wherein, when moving the backup members other than the backup member placed earlier to a position for supporting the second board after performing work on the first board and before performing work on the second board, the control unit controls the movement of the backup members so as to shorten a distance of movement of the backup members based on a plurality of candidate movement operations. 7. The board working device according to claim 1, wherein the control unit produces a plurality of types of boards by setting a production order of the types of boards to be produced in such an order that a total movement time of the back-up members other than the back-up member placed first becomes small. 7. The board working device according to claim 1, wherein the control unit produces a plurality of types of boards by setting a production order of the types of boards to be produced in such an order that a total of travel distances of the back-up members other than the back-up member placed earlier becomes small.

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