JP7593787B2 - Cleaning head and mask cleaning method - Google Patents

Description

The present invention relates to a cleaning head and a mask cleaning method.

To connect a general electrode component (horizontal electrode component) to a wiring board, a connection material such as solder paste is printed on the wiring board using a printing mask. After printing on the wiring board is completed, the printing mask is cleaned of any bleeding or remaining material of the connection material on the side facing the wiring board (substrate side). Cleaning is performed automatically by pressing a towel against the flat surface of the mask on the substrate side with a cleaning head, applying a solvent, and vacuuming (see, for example, Patent Document 1).

JP 2013-166315 A

In a diode connector in which a diode chip is placed between a lead frame (metal terminal) and a bridge, the connection material is printed on the upper electrodes of vertical electrode components such as a diode chip mounted on the connection material applied to the lead frame. In order to print and supply the connection material without interfering with the vertical electrode components, a printing mask with a recess (half-etched structure) on the underside is used.

However, when cleaning a printing mask having a half-etch structure, even if a towel is pressed against the mask's flat surface facing the substrate, the towel cannot reach the bottom of the half-etch structure (half-etch bottom), and the bottom of the half-etch cannot be cleaned. If printing is continued in this state, there is a risk that the connecting material remaining at the bottom of the half-etch will adhere to the vertical electrode components (vertical electrode components will stick).

The present invention was made in consideration of the above-mentioned circumstances, and its purpose is to remove deposits from the half-etched bottom of the mask and prevent the problem of vertical electrode parts sticking to the mask.

In order to achieve the above-mentioned object, the cleaning head and the mask cleaning method according to the present invention are characterized by the following (1) to ( 2 ).
(1) A cleaning head for removing the connecting material that has been supplied to and adhered to the first recess by pressing a sheet-like cleaning member against a mask for supplying connecting material to vertical electrode components on a conductive plate, the mask having a hole on one side and a first recess on the other side, the hole penetrating a bottom of the first recess, the cleaning head comprising:
A head body,
a soft material provided in a second recess formed in a tip portion of the head body on the mask side and protruding from the head body;
the head body has a first suction hole, one end of which opens into a bottom surface of the second recess formed in the tip portion,
When the head body presses the cleaning member against the other surface, the soft material is pressed against the first recess and deformed to conform to the shape of the first recess;
The soft material of the cleaning head has a second suction hole penetrating the soft material and communicating with the first suction hole .
( 2 ) A mask cleaning method for supplying a connecting material to vertical electrode components on a conductive plate, the mask having holes on one side and recesses on the other side, the holes penetrating the bottoms of the recesses, the mask comprising a cleaning head pressing a sheet-like cleaning member against the other side of the mask, and removing the connecting material supplied from the holes to the recesses and adhering thereto,
The cleaning head comprises:
A head body,
a soft material provided at a tip portion of the head body on the mask side so as to protrude from the head body,
When the head body presses the cleaning member against the other surface, the soft material is pressed against the recess and deformed to conform to the shape of the recess;
After removing the connecting material, the recess is irradiated with black light and the mask is photographed from the other surface side;
A mask cleaning method in which the presence or absence of adhesion is inspected based on a captured image.

According to the cleaning head of the configuration (1) above and the mask cleaning method of the configuration ( 2 ) above, the head body presses the cleaning member against the other surface, so that the soft material is pressed against the recess and deformed along the shape of the recess, and the cleaning member can be pressed against the bottom of the recess to remove any deposits on the bottom. This prevents the vertical electrode part from sticking to the mask. In this disclosure, the vertical electrode part means a part having electrodes (upper electrode, lower electrode) on the upper and lower parts of the electronic element.

Furthermore, with the cleaning head having the configuration of ( 1 ) above, any deposits on the bottom can be reliably removed by vacuum suction through the first and second suction holes provided in the head body and the soft material.

Furthermore, according to the mask cleaning method having the configuration of ( 2 ) above, after cleaning, the presence or absence of adhesion to the bottom is inspected, thereby ensuring the cleaning effect and reliably preventing the vertical electrode parts from sticking to the mask 12.

According to the present invention, it is possible to remove any deposits on the half-etched bottom of the mask, thereby preventing the problem of the vertical electrode components sticking to the printing mask.

The present invention has been briefly described above. The details of the present invention will become clearer by reading the following description of the embodiment of the invention (hereinafter referred to as "embodiment") with reference to the attached drawings.

FIG. 1 relates to a first embodiment of the present invention and is a diagram showing an example in which a connecting material is supplied to a vertical electrode component on a lead frame using a mask. FIG. 2 is a side view showing a schematic configuration of the cleaning head of the first embodiment. FIG. 3 is an enlarged view of the vicinity of the tip of the cleaning head in FIG. FIG. 4 shows the half-etch structure being cleaned. FIG. 5 is a diagram showing a configuration of a mask according to a second embodiment of the present invention. FIG. 6 is a diagram showing a first modified example of the mask according to the second embodiment. FIG. 7 is a diagram showing a second modified example of the mask according to the second embodiment. FIG. 8 is a diagram showing a mask cleaning method according to the second embodiment. FIG. 9 is a diagram showing the arrangement of a mask and an inspection camera according to the third embodiment of the present invention. FIG. 10 is a diagram showing the operation of the inspection camera according to the third embodiment. FIG. 11 is a diagram showing the operation of the inspection camera according to the third embodiment. FIG. 12 is a diagram showing a state in which a deposit is present on the bottom of a half-etched structure of a mask according to the third embodiment.

Specific embodiments of the present invention will be described below with reference to the drawings. Below, we will explain measures to prevent defects that occur when assembling vertical electrode components in which electrodes are arranged above and below an electronic element, such as when manufacturing a diode connector that houses a diode chip and a metal terminal (lead frame). In other words, we will explain a cleaning head, a mask with a half-etch structure, and a mask cleaning method for preventing sticking defects of vertical electronic components caused by adhesion of a connecting material to a printing mask.

First Embodiment
Printing of connecting material 16 using mask 12 having half-etched structure 17
1 relates to a first embodiment of the present invention and is a diagram showing an example in which a connecting material 16 is supplied to a vertical electrode component 15 on a lead frame 14 using a mask 12, and shows an end face cut in the thickness direction of the mask 12. A connecting material 13 such as solder paste or flux is placed on the upper surface of the lead frame 14 (conductive plate), and the vertical electrode component 15 is mounted on the connecting material 13.

The mask 12 has a hole 18 on the upper surface 12a (one surface) side, and a half-etched structure 17 (recess) on the lower surface 12b (other surface). The half-etched structure 17 has an opening 20 that opens on the lower surface 12b of the mask 12, and a bottom 19 that is approximately the same size as the opening 20, and has a recess (a rectangular parallelepiped recess) whose cross section in the thickness direction of the mask 12 is rectangular. In other words, the half-etched structure 17 has a right-angled etching wall around the bottom 19. The hole 18 that opens on the upper surface 12a side penetrates the bottom 19 of the half-etched structure 17. As an example, the hole 18 is provided at a position corresponding to the center of the bottom 19A.

The mask 12 is placed on the lead frame 14 with the lower surface 12b of the mask 12 in contact with the lead frame 14 so that the upper electrodes of the vertical electrode components 15 mounted on the lead frame 14 are located directly below the holes 18 of the mask 12. Then, by sliding the squeegee 11 on the upper surface 12a of the mask 12, a connection material 16 such as solder paste or flux is printed and supplied to the upper electrodes of the vertical electrode components 15 through the holes 18 of the mask 12. Since the mask 12 has a half-etched structure 17, interference between the mask 12 and the vertical electrode components 15 on the lead frame 14 is prevented. The mask 12 is provided with the same number of half-etched structures 17 as the number of one or more vertical electrode components 15.

<Cleaning of the half-etched structure 17>
1, when the connecting material 16 is printed on the vertical electrode components 15 on the lead frame 14 using the mask 12 having the half-etched structure 17, the connecting material adheres to the bottom 19 of the half-etched structure 17. Cleaning of the lower surface 12b of the mask 12 will be described with reference to FIGS.

Figure 2 is a side view showing a schematic configuration of the cleaning head CH of the first embodiment, and Figure 3 is an enlarged view of the vicinity of the tip 1a of the cleaning head CH in Figure 2. The cleaning head CH includes a head body 1, a cleaning towel 2, a soft material 3, rollers 4a, 4b, and a support 5, which are housed in a rectangular parallelepiped housing, for example. The cleaning towel 2 is a sheet-like cleaning member that is hung between the rollers 4a, 4b that are driven to rotate by a motor. Note that cleaning paper may be used instead of the cleaning towel 2. Also, the cleaning towel 2 and the rollers 4a, 4b do not have to be built into the cleaning head CH. The support 5 supports the head body 1 from below. The cleaning head CH is moved in the vertical and horizontal directions below the mask 12 by a control device (not shown). Note that the cleaning head CH can also be moved in the front-back direction perpendicular to the paper surface of Figure 2.

The head body 1 has an approximately rectangular parallelepiped shape with two upper sides chamfered, and has a soft material 3 in the recess of the tip 1a on the upper side (mask 12 side). The head body 1 pushes the cleaning towel 2 coated with the solvent between the rollers 4a and 4b upward and presses it against the lower surface 12b of the mask 12. The used part of the cleaning towel 2 is wound up by the rotation of the rollers 4a and 4b, and the unused part of the cleaning towel 2 abuts against the lower surface 12b or bottom 19 of the mask 12. The head body 1 has a suction hole 6a (first suction hole) whose one end opens at the tip 1a and a solvent supply hole 6b. The suction hole 6a penetrates the head body 1 in the vertical direction, and the other end is connected to the suction mechanism in the support 5. The solvent supply hole 6b penetrates the head body 1 in the vertical direction, and the other end is connected to the solvent supply mechanism in the support 5.

The soft material 3 is provided at the tip 1a so as to protrude upward from the head body 1. The soft material 3 is made of a resin material, such as a foamed elastomer, which is softer than the head body 1. When the head body 1 presses the cleaning towel 2 against the lower surface 12b of the mask 12, the soft material 3 is pressed against the half-etched structure 17 and deformed along the shape of the half-etched structure 17, as shown in FIG. 3. A solvent such as ethanol supplied from the solvent supply mechanism through the solvent supply hole 6b permeates the tip 1a of the head body 1 and the part of the cleaning towel 2 covering the soft material 3, and is applied to the lower surface 12b of the mask 12 and the bottom 19 of the half-etched structure 17. The cleaning head CH presses the cleaning towel 2 against the mask 12 (bottom 19) and wipes off the deposits by applying the solvent.

The soft material 3 has a suction hole 7 (second suction hole) that penetrates the soft material 3 and communicates with the suction hole 6a. As shown in FIG. 3, the suction hole 7 is located above the suction hole 6a and is smaller in size than the suction hole 6a. The left-right width of the soft material 3 is larger than the left-right width of the half-etched structure 17 (bottom 19 and opening 20). When the soft material 3 is pressed against the bottom 19 of the half-etched structure 17, the connecting material attached to the bottom 19 is vacuum-suctioned and removed through the suction holes 6a and 7 provided in the head body 1 and the soft material 3.

<Method of cleaning half-etched structure 17>
The head body 1 of the cleaning head CH is pushed up, and the cleaning towel 2 is pressed against the lower surface 12b of the mask 12 to remove the connecting material adhering to the lower surface 12b. As shown in FIG. 3, the soft material 3 penetrates into the half-etched structure 17 and removes the connecting material adhering to the bottom 19.

As described above, with the cleaning head CH of this embodiment, the soft material 3 penetrates the half-etched structure 17 and slides against the bottom 19, thereby removing the connecting material (adherent matter) adhering to the bottom 19. In addition, the cleaning head CH can reliably remove the connecting material adhering to the bottom 19 by vacuum suction through the suction holes 6a and 7 provided in the head body 1 and the soft material 3.

<Problems of the First Embodiment>
FIG. 4 is a diagram showing the state of cleaning the half-etched structure 17, where FIG. 4(a) shows an end face cut in the thickness direction of the mask 12, and FIG. 4(b) shows the half-etched structure 17 viewed from the lower surface 12b side of the mask 12. After the printing of the connection material 16 shown in FIG. 1 is repeated, the bottom 19 is cleaned with the cleaning towel 2. Since the half-etched structure 17 is recessed in a rectangular parallelepiped shape and the bottom 19 is surrounded by an etching wall perpendicular to the lower surface 12b, the cleaning towel 2 may not reach the corners of the bottom 19 during cleaning, and the connection material deposit 16a may remain. When the deposit 16a enters the region R in contact with the vertical electrode part 15, a defect occurs in which the vertical electrode part 15 sticks to the bottom 19 of the half-etched structure 17 in the mask 12. Therefore, in the second embodiment, a technology for preventing the occurrence of this defect will be described.

Second Embodiment
5A and 5B are diagrams showing the configuration of a mask 12A according to a second embodiment of the present invention, in which Fig. 5A shows an end face cut in the thickness direction of the mask 12A, and Fig. 5B shows a half-etched structure 17A as viewed from the lower surface 12b side of the mask 12A. The mask 12 of the first embodiment has a half-etched structure 17, whereas the mask 12A of this embodiment has an open half-etched structure 17A. In this embodiment, the same members and parts as those described in the first embodiment are designated by the same reference numerals, and duplicated explanations will be omitted.

The half-etched structure 17A of the mask 12A shown in FIG. 5 has the same depth as the half-etched structure 17 shown in FIG. 4, and has a bottom 19A of the same shape and area as the bottom 19 of the half-etched structure 17. The half-etched structure 17A has an open-type half-etched structure 17A that is etched so as to spread radially from the bottom 19A toward the lower surface 12b (lead frame 14 side, see FIG. 1). The half-etched structure 17A has a rectangular bottom 19A, a rectangular opening 20A that opens on the lower surface 12b, and tapered portions 21 and 22 that are inclined so as to spread from the bottom 19A toward the opening 20A. That is, the half-etched structure 17A has a trapezoidal shape when cut in the thickness direction of the mask 12A, as shown in FIG. 5.

The tapered portion 21 extends from two sides 19Aa, 19Ab of the bottom 19A that intersect in the direction in which the cleaning towel 2 slides (left-right direction in Figs. 5(a) and (b)) to two opposing sides 20Aa, 20Ab of the opening 20A. The tapered portion 22 extends from the other two sides 19Ac, 19Ad of the bottom 19A to the other two sides 20Ac, 20Ad of the opening 20A. The bottom surface 12b and the tapered portions 21, 22 form an angle that allows the cleaning towel 2 to contact the entire surface of the bottom 19A, and this angle is determined appropriately in relation to the surrounding openings. As an example, the angle T1 between the bottom surface 12b and the tapered portion 21 is 120 to 135 degrees.

Figures 6 and 7 show masks 12A-1 and 12A-2, respectively, having half-etched structures 17A-1 and 17A-2 that are different in shape from half-etched structure 17A. Figures 6(a) and 7(a) show the end faces cut in the thickness direction of masks 12A-1 and 12A-2, respectively, and Figures 6(b) and 7(b) show half-etched structures 17A-1 and 17A-2 as viewed from the lower surface 12b side of masks 12A-1 and 12A-2, respectively.

While the half-etched structure 17A shown in Fig. 5 has tapered portions 21 and 22 that are inclined so as to widen from the four sides of the bottom 19 toward the four sides of the opening 20 in the lower surface 12b, the half-etched structure 17A-1 shown in Fig. 6 does not have tapered portion 22. That is, the half-etched structure 17A-1 has a pair of tapered portions 21 that are inclined from two opposing sides 19A-1a, 19A-1b of the bottom 19A-1 toward the two sides 20A-1a, 20A-1b of the opening 20A-1. On the other hand, in the half-etched structure 17A-1, the other two sides 19A-1c, 19A-1d of the bottom 19A-1 are vertical portions that do not incline toward the two sides 20A-1c, 20A-1d of the opening 20A-1. Half-etched structure 17A-1 has the same depth as half-etched structure 17A, and bottom 19A-1, like bottom 19A, has the same shape and area as bottom 19 of half-etched structure 17 shown in FIG. 4. The bottom surface 12b and tapered portion 21 form an angle that allows the cleaning towel 2 to contact the entire surface of bottom 19A-1, including the corners, and this angle is appropriately determined in relation to the surrounding openings. An angle T2 between bottom surface 12b and tapered portion 21 is, for example, 120 to 135 degrees.

The half-etched structure 17A-2 shown in FIG. 7 has a circular bottom 19A-2, a circular opening 20A-2 that opens into the lower surface 12b, and a tapered portion 23 that slopes so as to widen from the bottom 19A-2 toward the opening 20A-2. The half-etched structure 17A-2 has the same depth as the half-etched structure 17A, and the bottom 19A-2 has approximately the same area as the bottom 19A. The lower surface 12b and the tapered portion 23 form an angle that allows the cleaning towel 2 to contact the entire surface of the bottom 19A-2, including the corners, and this angle is appropriately determined in relation to the surrounding openings. The angle T3 between the lower surface 12b and the tapered portion 23 is, for example, 120 to 135 degrees.

<Method of cleaning half-etched structure 17A>
8 is a diagram showing a mask cleaning method according to the second embodiment, and shows an enlarged schematic view of the half-etched structure 17A shown in FIG. 5. As shown in FIG. 8(a), a connection material deposit 16a is attached to the bottom 19A of the half-etched structure 17A. The cleaning towel 2 is pressed against the tapered portion 21 and the bottom 19A from the right side of the half-etched structure 17A by the pressing part W. The cleaning towel 2 contacts the tapered portion 21 and the bottom 19A without floating from the surface of the half-etched structure 17A, and scrapes off the deposit 16a while sliding to the left. In the case of an automatic printing machine, the pressing part W corresponds to the soft material 3 shown in FIG. 2 and FIG. 3, and in the case of a manual printing machine, it corresponds to the operator's finger.

As shown in FIG. 8(b), when the pressing part W and the cleaning towel 2 move leftward on the bottom 19A, the deposit 16a scraped off by the cleaning towel 2 is moved leftward. Furthermore, when the pressing part W and the cleaning towel 2 move leftward on the bottom 19A, the deposit 16a is scraped off and removed from the half-etched structure 17A by the cleaning towel 2, as shown in FIG. 8(c). At this time, the new surface (unused surface) of the cleaning towel 2 is in contact with the bottom 19A, and finish cleaning is performed at the same time.

As described above, the half-etched structure 17A of the mask 12A in this embodiment is an open type having tapered portions 21 and 22, so that the cleaning towel 2 can be brought into contact with the entire surface of the bottom 19A to scrape off the deposits 16a that are attached to the corners of the bottom 19A. In this way, the deposits 16a can be completely removed from the entire surface of the bottom 19A of the half-etched structure 17A, so that the problem of the vertical electrode part 15 sticking to the mask 12A can be suppressed. In addition, since the half-etched structures 17A-1 and 17A-2 shown in Figures 6 and 7 are also open types having tapered portions 21 and 23, the cleaning towel 2 can be brought into contact with the entire surface of the bottom 19A-1 and 19A-2 to completely remove the deposits 16a from the corners.

Third Embodiment
In the third embodiment, a method of image inspection for the presence or absence of adhesions, which is performed after cleaning of the masks 12, 12A, 12A-1, and 12A-2 described in the first and second embodiments, will be described. Note that, although the image inspection method for the mask 12 will be described below, the other masks 12A, 12A-1, and 12A-2 can also be image inspected in the same manner.

Figure 9 shows the arrangement of the mask 12 and the inspection camera 31 according to the third embodiment, and Figures 10 and 11 show the operation of the inspection camera 31. Also, Figure 12 shows the state in which an attachment F is present on the bottom 19 of the half-etched structure 17 of the mask 12.

As mentioned above, if the printing and supplying of the connection material is repeated using the mask 12 having the half-etched structure 17, the connection material will bleed onto the bottom 19 of the half-etched structure 17, causing the vertical electrode components to adhere to the mask 12. Therefore, the mask 12 is cleaned every time printing is performed a set number of times to prevent this problem.

In FIG. 12, the deposit F when the connecting material is only flux is shown by a two-dot chain line. If the connecting material that is adhered in a smudge around the hole 18 is solder paste, the solder particles can be confirmed visually or in an image, but if the connecting material that is adhered in a smudge is minute flux, the deposit F cannot be recognized because it is transparent. For this reason, after the mask 12 is cleaned, a problem may occur in which the vertical electrode parts stick to the mask 12 before the next cleaning is performed.

Therefore, in this embodiment, the minute flux deposit F shown in Figure 12 is irradiated with black light and camera recognition is performed, causing the resin in the flux to turn white and become recognizable.

Figure 9 shows the state after the lead frame 14 is removed from the printer after the connecting material 16 is printed on the vertical electrode components 15 on the lead frame 14 as shown in Figure 1. The mask 12 has a half-etched structure 17 and an alignment mark 30 for aligning the position of the hole 18 with the position of the lead frame 14 to be next loaded on the image. An inspection camera 31 is provided below the mask 12 and is movable at least in the left-right direction. The inspection camera 31 has a switching illumination function between black light and LED light.

During normal printing, the inspection camera 31 waits in the position shown in FIG. 9. When a new lead frame 14 is brought in, the inspection camera 31 moves to a predetermined position for recognizing the alignment mark 30, as shown in FIG. 10, and takes and recognizes an image using LED illumination to align the new lead frame 14 with the hole 18 in the mask 12.

When the connecting material 16 is printed on the vertical electrode components 15 on the lead frame 14 and the lead frame 14 is removed, as shown in FIG. 11, the inspection camera 31 moves to a position directly below the half-etched structure 17, i.e., directly below the center position of the hole 18. The inspection camera 31 irradiates the half-etched structure 17 with black light from the lower surface 12b side of the mask 12, and photographs the mask 12 from the lower surface 12b side.

The inspection camera 31 detects the presence or absence of adhesion F based on this captured image. The resin in the flux is whitened by black light illumination, making it visible. The inspection camera 31 or a control device calculates the area of the adhesion F, thereby calculating the adhesive strength of the vertical electrode part 15 to the mask 12 and calculating a threshold value for the presence or absence of adhesion. If an area of adhesion F equal to or greater than this threshold (allowable area) is detected, the bottom 19 of the half-etched structure 17 is cleaned, thereby preventing the vertical electrode part 15 from sticking to the mask 12. Note that if the connection material 16 contains solder particles, the presence or absence of adhesion and the area of the adhesion can be recognized by switching from black light illumination to LED illumination and performing camera recognition.

As described above, according to the image inspection method of this embodiment, each time printing of the connection material 16 on the new lead frame 14 is completed, the presence or absence of adhesion F is inspected based on the image taken by irradiating the bottom 19 of the half-etched structure 17 with black light, and the resin content in the flux becomes white and can be recognized. Therefore, by cleaning the bottom 19 if adhesion F is present, problems with the vertical electrode component 15 sticking to the mask 12 can be prevented in advance.

In addition, by calculating the area of the adhesion F, a threshold value for whether or not the vertical electrode part 15 is attached to the mask 12 is calculated, so that the frequency of cleaning can be adjusted by, for example, cleaning the bottom 19 when an area of adhesion F equal to or greater than the threshold is detected.

Furthermore, the image inspection method of this embodiment can be performed after the mask cleaning described in the first and second embodiments. After mask cleaning, the presence or absence of adhesions on the bottoms 19, 19A, 19A-1, and 19A-2 of the half-etched structures 17, 17A, 17A-1, and 17A-2 can be inspected to ensure the cleaning effect and to reliably prevent the vertical electrode components 15 from sticking to the mask 12.

Here, the features of the cleaning head and the mask cleaning method according to the above-described embodiments of the present invention will be briefly summarized and listed below in [1] to [4].
[1] A cleaning head (CH) for removing the connecting material (16) that has been supplied to and adhered to the recessed portion through a sheet-like cleaning member (cleaning towel 2) by pressing the mask (12) for supplying a connecting material (16) to a vertical electrode component (15) on a conductive plate (lead frame 14), the mask having holes (18) on one surface (upper surface 12a) and recesses (half-etched structure 17) on the other surface (lower surface 12b), the holes penetrating a bottom (19) of the recessed portion, the mask comprising:
A head body (1),
a soft material (3) provided at a tip portion (1a) of the head body on the mask side so as to protrude from the head body,
The cleaning head (CH) wherein the head body presses the cleaning member against the other surface, whereby the soft material is pressed against the recess and deformed to conform to the shape of the recess.
[2] The head body has a first suction hole (suction hole 6a) whose one end opens to the tip portion,
The cleaning head according to [1], wherein the soft material has a second suction hole (suction hole 7) penetrating the soft material and communicating with the first suction hole.
[3] A mask cleaning method, comprising: pressing the cleaning member against the other surface by a cleaning head according to [1] or [2] above, to remove the connecting material adhering to the recess.
[4] After removing the connecting material, the recess is irradiated with black light and the mask is photographed from the other surface side;
The mask cleaning method according to the above [3], further comprising inspecting the presence or absence of adhesion based on the captured image.

1 Head body 1a Tip portion 2 Cleaning towel 3 Soft material 4a, 4b Roller 5 Support 6a, 7 Suction hole 6b Solvent supply hole 11 Squeegee 12, 12A, 12A-1, 12A-2 Mask 12a Upper surface 12b Lower surface 13, 16 Connection material 14 Lead frame 15 Vertical electrode part 16a Adhesive 17, 17A, 17A-1, 17A-2 Half-etch structure 18 Hole 19, 19A, 19A-1, 19A-2 Bottom 20, 20A, 20A-1, 20A-2 Opening 21, 22, 23 Tapered portion 30 Alignment mark 31 Inspection camera CH Cleaning head F Adhesive R Area W Pressing portion

Claims (2)

a cleaning head for removing the connecting material that has been supplied to and adhered to the first recess by pressing a sheet-like cleaning member against a mask for supplying a connecting material to vertical electrode components on a conductive plate, the mask having a hole on one side and a first recess on the other side, the hole penetrating a bottom of the first recess, the cleaning head comprising:
A head body,
a soft material provided in a second recess formed in a tip portion of the head body on the mask side and protruding from the head body;
the head body has a first suction hole, one end of which opens into a bottom surface of the second recess formed in the tip portion,
When the head body presses the cleaning member against the other surface, the soft material is pressed against the first recess and deformed to conform to the shape of the first recess;
The soft material of the cleaning head has a second suction hole penetrating the soft material and communicating with the first suction hole . A mask cleaning method for supplying connecting material to vertical electrode components on a conductive plate, the mask having holes on one side and recesses on the other side, the holes penetrating bottoms of the recesses, the mask comprising: a cleaning head pressing a sheet-like cleaning member against the other side of the mask, the other side being a mask for supplying connecting material to vertical electrode components on a conductive plate; the mask having holes on one side and recesses on the other side, the holes penetrating bottoms of the recesses; and removing the connecting material supplied through the holes to the recesses and adhering thereto, the mask comprising:
The cleaning head comprises:
A head body,
a soft material provided at a tip portion of the head body on the mask side so as to protrude from the head body,
When the head body presses the cleaning member against the other surface, the soft material is pressed against the recess and deformed to conform to the shape of the recess;
After removing the connecting material, the recess is irradiated with black light and the mask is photographed from the other surface side;
A mask cleaning method in which the presence or absence of adhesion is inspected based on a captured image.

Images