JP7595264B2 - Component crimping device and component crimping method - Google Patents

Description

This disclosure relates to a component crimping device that crimps components onto a substrate.

Conventionally, a component bonding device that bonds electronic components (hereinafter simply referred to as "components") to a substrate such as a liquid crystal panel has been provided as an electronic component mounting device (see Patent Document 1). This component bonding device is equipped with a punching device that punches out components from a film carrier, and while feeding the film carrier at a constant pitch, it bonds the punched components to the liquid crystal panel. This produces a mounted substrate, which is a substrate to which components are bonded.

Japanese Unexamined Patent Publication No. 7-106796

However, the component bonding device in Patent Document 1 has the problem that mounting accuracy may decrease.

Therefore, this disclosure provides a component crimping device that can improve mounting accuracy.

A component crimping device according to one aspect of the present disclosure includes a substrate moving mechanism that holds a substrate on which a first alignment mark is formed and moves the substrate, a crimping tool that holds a component on which a second alignment mark is formed and crimps the substrate to the substrate, an imaging unit that captures an image of a subject included in an imaging range, an imaging movement mechanism that moves the imaging range of the imaging unit, and a control unit, and the control unit causes the imaging movement mechanism to move the imaging range so that an edge of the component held by the crimping tool falls within the imaging range, causes the imaging unit to capture an image of the edge of the component included in the imaging range as the subject, and if the second alignment mark is not included in the imaging range, causes the imaging unit to capture an image of the edge of the component so that the second alignment mark falls within the imaging range after the edge of the component is captured. The imaging movement mechanism is caused to move the imaging range as described above, the second alignment mark included in the imaging range is imaged by the imaging unit as the subject, relationship information indicating the positional relationship between the edge of the component and the second alignment mark is generated and output based on the respective imaging results of the edge of the component and the second alignment mark, the substrate movement mechanism is caused to move the substrate so that the first alignment mark falls within the imaging range, the first alignment mark included in the imaging range is imaged by the imaging unit as the subject, and the bonding of the component to the substrate by the substrate movement mechanism and the bonding tool is controlled based on the respective imaging results of the first alignment mark and the second alignment mark.

These comprehensive or specific aspects may be realized by a system, a method, an integrated circuit, a computer program, or a recording medium such as a computer-readable CD-ROM, or may be realized by any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. The recording medium may also be a non-transitory recording medium.

The component crimping device disclosed herein can improve mounting accuracy.

Further advantages and benefits of certain aspects of the present disclosure will become apparent from the specification and drawings. Such advantages and/or benefits may be provided by some of the embodiments and features described in the specification and drawings, respectively, but not necessarily all of them need be provided to obtain one or more identical features.

FIG. 1 is a diagram showing a schematic configuration of a component mounting line according to an embodiment. FIG. 2 is a plan view of a component mounting line according to the embodiment. FIG. 3 is a diagram showing a computer provided in a component mounting line according to the embodiment and each of the components controlled by the computer. FIG. 4 is a block diagram showing a configuration of a component crimping device according to an embodiment of the present invention. FIG. 5 is a diagram showing an example of a tape member on which a plurality of components are provided and a part of a substrate according to the embodiment. FIG. 6 is a diagram illustrating a configuration example of a punching unit of a component supply unit according to an embodiment. FIG. 7 is a diagram showing the flow of components supplied from a component supply unit to a crimping tool via a component movement unit in the embodiment. FIG. 8 is a diagram showing an example of a procedure for crimping components using a crimping tool and a stage of a substrate moving mechanism according to an embodiment. FIG. 9 is a diagram illustrating an example of relationship information according to the embodiment. FIG. 10 is a diagram showing an example of a first camera, a second camera, and an imaging movement mechanism included in the imaging unit according to the embodiment. FIG. 11 is a diagram showing a state in which the first camera and a component are viewed from the X-axis direction when an image of the component is captured in the embodiment. FIG. 12A is a diagram illustrating an example of imaging by the first camera according to the embodiment. FIG. 12B is a diagram illustrating an example of imaging by the second camera in the embodiment. FIG. 13A is a diagram showing an example of imaging an edge of a component as a subject in the embodiment. FIG. 13B is a diagram showing an example of imaging of a second alignment mark as a subject in the embodiment. FIG. 14A is a diagram showing another example of imaging an edge of a component as a subject in the embodiment. FIG. 14B is a diagram showing another example of imaging the second alignment mark as a subject in the embodiment. FIG. 15 is a flow chart showing the overall process steps of the component crimping device according to the embodiment. FIG. 16 is a flowchart showing details of the positional relationship specifying process in step S13 of FIG. FIG. 17 is a diagram for explaining timing at which the imaging unit and the imaging range move in the embodiment. FIG. 18 is a diagram showing a configuration example of a part of an image pickup moving mechanism in a modified example of the embodiment.

(Findings that formed the basis of this disclosure)
The present inventors have found that the component crimping device of Patent Document 1 described in the "Background Art" section has the following problems.

As the frame of liquid crystal panels becomes narrower these days, there is a demand for higher punching accuracy for components. The punching accuracy is the accuracy of the state of the components, including the position of the components punched from the film carrier. However, as in Patent Document 1, it is difficult to maintain the required accuracy with only the mechanical accuracy of the punching device. In addition, if a sensor for checking the punching state is provided in the punching device to maintain the punching accuracy, the punching device may become larger. Therefore, if the camera used for aligning the components and the board is used as the sensor for checking the punching state, the size of the punching device can be suppressed. However, in that case, it may be necessary to move the camera to align the components and the board. As a result, the movement of the camera may result in insufficient accuracy in aligning the components and the board, and the mounting accuracy may decrease.

In order to solve such problems, a component crimping device according to one aspect of the present disclosure includes a substrate moving mechanism that holds a substrate on which a first alignment mark is formed and moves the substrate, a crimping tool that holds a component on which a second alignment mark is formed and crimps the component onto the substrate, an imaging unit that images a subject included in an imaging range, an imaging movement mechanism that moves the imaging range of the imaging unit, and a control unit, and the control unit causes the imaging movement mechanism to move the imaging range so that an edge of the component held by the crimping tool falls within the imaging range, causes the imaging unit to image the edge of the component included in the imaging range as the subject, and if the second alignment mark is not included in the imaging range, after imaging the edge of the component, causes the second alignment mark to be moved to the position indicated by the imaging unit. The imaging moving mechanism moves the imaging range so that the imaging range fits within the imaging range, the imaging unit captures the second alignment mark included in the imaging range as the subject, and based on the imaging results of the edge of the component and the second alignment mark, relationship information indicating the positional relationship between the edge of the component and the second alignment mark is generated and output, the substrate moving mechanism moves the substrate so that the first alignment mark fits within the imaging range, the imaging unit captures the first alignment mark included in the imaging range as the subject, and based on the imaging results of the first alignment mark and the second alignment mark, the substrate moving mechanism and the pressure bonding of the component to the substrate by the pressure bonding tool are controlled. For example, the component pressure bonding device may further include a punching unit that sequentially punches out each of the multiple components from a tape member on which multiple components are provided, and the pressure bonding tool may hold the components punched out by the punching unit and pressure bond them to the substrate.

This eliminates the need to provide a sensor for checking the punching state of the component in the punching section, and the size of the punching section can be suppressed. In other words, in the component crimping device according to one aspect of the present disclosure, the imaging section can also be used as a sensor for checking the punching state of the component, and the size of the punching section can be suppressed. Specifically, the imaging section is used to control the crimping of the component to the substrate by the substrate moving mechanism and the crimping tool. For example, the imaging section is used to capture images of the first alignment mark and the second alignment mark for controlling the alignment of the component and the substrate. In the component crimping device according to one aspect of the present disclosure, the imaging section can also be used as a sensor for checking the punching state of the component by causing the imaging section to capture images of the edge of the component and generating and outputting related information. Therefore, it is not necessary to provide a sensor for checking the punching state of the component in the punching section, and the size of the punching section can be suppressed.

Here, in order to check the punched state of the component, it is necessary to image the edge of the component and the second alignment mark separately, but if they cannot be imaged simultaneously, it is necessary to move the imaging range and image them separately. In such a case, for example, if the second alignment mark is imaged first, and then the imaging range is moved and the edge of the component is imaged, the imaging range must be moved again to return to the original position for the next alignment between the component and the board. For this alignment, it is necessary to image the first alignment mark, and it is desirable that the imaging range be in the same position for the imaging of the first alignment mark and the imaging of the second alignment mark to ensure the accuracy of the alignment. However, even if the imaging range is returned to the original position, if the reproducibility of the position is insufficient, the accuracy of the alignment between the component and the board will decrease.

In the component crimping device according to one aspect of the present disclosure, when the edge of the component and the second alignment mark cannot be imaged simultaneously, the edge of the component is imaged first, and then the second alignment mark is imaged. As a result, the first alignment mark of the substrate can be captured in the imaging range by moving the substrate without moving the imaging range when the second alignment mark is imaged. Therefore, since the imaging range is the same for the imaging of the first alignment mark and the imaging of the second alignment mark, the accuracy of alignment between the component and the substrate can be sufficiently ensured. In other words, the mounting accuracy can be improved. As a result, the punching state of the component can be confirmed while suppressing the increase in size of the punching section, and the mounting accuracy can be improved.

The control unit may further control the punching of parts from the tape member by the punching unit based on the output of the relationship information.

This allows the positional relationship between the edge of the part and the second alignment mark to be automatically kept constant, making it easy to improve the punching accuracy of the part.

The control unit may further generate the relationship information indicating the distance between the edge of the component and the second alignment mark as the positional relationship, and if the distance is not within a predetermined tolerance range, may report that a malfunction has occurred in the punching unit.

This encourages workers to inspect and repair the punching area, improving punching accuracy.

In addition, the imaging movement mechanism does not need to move the imaging range of the imaging unit between the time when the imaging unit captures an image of the second alignment mark and the time when the imaging unit captures an image of the first alignment mark.

As a result, the position of the imaging range is the same when imaging the first alignment mark and when imaging the second alignment mark, so the accuracy of aligning the component and the board can be sufficiently ensured. In other words, mounting accuracy can be improved.

The following describes the embodiment in detail with reference to the drawings.

Note that the embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, the arrangement and connection of the components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not described in the independent claims that show the highest concept are described as optional components. Furthermore, each figure is a schematic diagram and is not necessarily illustrated precisely. Furthermore, the same components in each figure are given the same reference numerals. Furthermore, expressions such as "approximately the same" are used in the following embodiments. For example, "approximately the same" does not only mean completely the same, but also means substantially the same, that is, including an error of, for example, a few percent. Furthermore, "approximately the same" means the same within the scope in which the effects of the present disclosure can be achieved. The same applies to other expressions using "approximately".

(Embodiment)
[Outline of component mounting line configuration]
FIG. 1 is a diagram showing a schematic configuration of a component mounting line according to the present embodiment.

The component mounting line 1 in this embodiment is a system that produces mounted boards by mounting components 5 on a board 3, which is a display panel such as a liquid crystal panel or an organic EL (Electro-Luminescence) panel. The components 5 are, for example, electronic components such as a drive circuit. Specifically, as shown in FIG. 1, the component mounting line 1 has a board carry-in section 10, a bonding section 20, a temporary pressure bonding section 30, a full pressure bonding section 40, and a board carry-out section 50. The board carry-in section 10, the bonding section 20, the temporary pressure bonding section 30, the full pressure bonding section 40, and the board carry-out section 50 are connected in this order.

The board loading section 10 receives a rectangular board 3 that is loaded by a worker or from another device upstream. The board 3 is then loaded to the downstream attachment section 20.

The adhesion section 20 receives the substrate 3 carried out from the substrate carrying section 10 and adheres an adhesive material to each of the multiple electrode sections 4 on the periphery of the substrate 3. The substrate 3 with the adhesive material attached thereto is then carried out to the temporary pressure bonding section 30. Each of the multiple electrode sections 4 is, for example, composed of multiple electrodes.

The temporary bonding unit 30 receives the substrate 3 removed from the attachment unit 20, and mounts and presses the component 5 on the portion of the substrate 3 to which the adhesive material is attached. The substrate 3 to which the component 5 is pressed is then removed to the full bonding unit 40. The pressing performed by the temporary bonding unit 30 is also called temporary pressing.

The final bonding section 40 receives the board 3 that has been removed from the temporary bonding section 30, and performs final bonding (also called thermocompression bonding) on the components 5 that have been temporarily bonded to the board 3. The board 3 that has been subjected to the final bonding is then removed to the board removal section 50.

The substrate discharge section 50 receives the substrate 3 discharged from the main pressure bonding section 40. The substrate 3 received by the substrate discharge section 50 is discharged downstream.

In this way, the component mounting line 1 performs the component mounting work of mounting components 5 to each of the multiple electrode portions 4 provided on the periphery of the board 3 that has been brought in, and then transports the mounted board, which is the board 3 on which the components 5 have been mounted, out of the board removal section 50.

[Detailed configuration of component mounting line]
2 is a plan view of the component mounting line 1 in this embodiment. Specifically, FIG. 2 shows the configuration of the component mounting line 1 seen from above. In this embodiment, the conveying direction of the board is referred to as the X-axis direction, the vertical direction is referred to as the Z-axis direction, and the direction perpendicular to the X-axis direction and the Z-axis direction, i.e., the depth direction, is referred to as the Y-axis direction. The negative side and the positive side in the X-axis direction correspond to the upstream side and the downstream side, respectively, of the conveying direction of the board, the negative side and the positive side in the Z-axis direction correspond to the lower side and the upper side, respectively, of the vertical direction, and the negative side and the positive side in the Y-axis direction correspond to the near side and the far side, or the front side and the rear side, respectively, of the depth direction.

The substrate loading section 10 includes a base 1a on which the substrate 3 to be loaded is placed. The base 1a of the substrate loading section 10 includes a stage 11 on which the substrate 3 is placed. The stage 11 moves up and down in the Z-axis direction relative to the base 1a. The stage 11 also has a number of suction holes 11a on its top surface. The stage 11 holds the substrate 3, which has been loaded by a worker or from another device upstream and placed on the stage 11, by vacuum suction through the suction holes 11a using a suction device such as a pump (not shown).

The adhesion unit 20 has a function of performing an adhesion operation (in other words, an adhesion process) of adhering an adhesive member, ACF (Anisotropic Conductive Film), to the electrode portion 4 of the substrate 3. The ACF is also called an anisotropic conductive adhesive, and is a member for electrically connecting the electrode portion 4 of the substrate 3 and the component 5. The adhesion unit 20 includes a substrate movement mechanism 21 and an adhesion mechanism 22.

The substrate moving mechanism 21 is a mechanism for moving the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table movable in the X-axis direction, a Y-axis table movable in the Y-axis direction, a Z-axis table movable in the Z-axis direction, and a stage 23. The substrate moving mechanism 21 includes an X-axis table, a Y-axis table, a Z-axis table, and a stage 23 stacked on top of each other on the base 1b in this order from the bottom up.

The Y-axis table extends in the Y-axis direction and moves freely in the X-axis direction on the X-axis table. The Z-axis table moves freely in the Y-axis direction on the Y-axis table, raising and lowering the stage 23 provided on the top in the Z-axis direction and rotating it around the Z axis.

In addition, the stage 23 has a number of suction holes 23a on its upper surface, and the stage 23 holds the substrate 3 placed on its upper surface by vacuum suction. In this way, the substrate moving mechanism 21 suctions and holds the substrate 3, moves it in a horizontal plane (specifically, in the X-axis and Y-axis directions), raises and lowers it in the vertical direction (specifically, in the Z-axis direction), and rotates it around the Z axis.

The bonding mechanism 22 is provided with, for example, two bonding heads aligned in the X-axis direction above the base 1b. Each bonding head has a supply unit that supplies ACF and a bonding tool for bonding the ACF to the substrate 3. Each of the two bonding heads bonds the ACF to positions corresponding to the multiple electrode portions 4 on the substrate 3. In addition, a bonding support stand is provided at a position corresponding to each of the two bonding heads below.

The temporary bonding unit 30 performs a temporary bonding process in which a component 5 is mounted on the area of the substrate 3 where the ACF is attached (i.e., the area to be bonded) and temporarily bonded. The temporary bonding unit 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supply unit 33, and a component moving unit 35.

The substrate moving mechanism 31 has a structure similar to that of the substrate moving mechanism 21 of the attachment unit 20. Specifically, the substrate moving mechanism 31 has a stage 37 that holds the substrate 3. The upper surface of the stage 37 is provided with a plurality of suction holes 37a. The substrate moving mechanism 31 holds the substrate 3 placed on the stage 37 by vacuum suction through the plurality of suction holes 37a. The substrate moving mechanism 31 also has a function of moving the stage 37 that suctions and holds the substrate 3 in a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. By moving and rotating the stage 37, the substrate moving mechanism 31 positions the area of the substrate 3, where the ACF is affixed, above the lower support unit 36, which is the backup stage of the component mounting mechanism 32. The substrate 3 also has a first alignment mark, which will be described later. That is, the substrate moving mechanism 31 in this embodiment holds the substrate 3 on which the first alignment mark is formed and moves the substrate 3.

The component supply unit 33 is provided protruding from the rear of the base 1b on the far side of the component mounting mechanism 32 (i.e., the positive side in the Y-axis direction). For example, the component supply unit 33 includes a supply reel 33a around which a tape material such as a TCP (Tape carrier package) is wound, a punching unit 33b, a movable stage 33c, and a rail 33d. Such a component supply unit 33 sequentially supplies components 5 from the tape material by the movement of these components.

The component moving unit 35 holds the component 5 supplied from the component supply unit 33 and moves it to the crimping tool 34 included in the component mounting mechanism 32.

The component mounting mechanism 32 is provided on the base 1b and includes a crimping tool 34 and a lower support portion 36.

The lower support 36 supports from below the area to be crimped, which is a predetermined area on the substrate 3 held by the stage 37. The area to be crimped is the area on the edge of the substrate 3 where the ACF is attached. In other words, the lower support 36 supports the edge of the substrate 3 to which the component 5 is crimped, from the lower side of the substrate 3.

The bonding tool 34 holds the component 5 and presses the component 5 onto the substrate 3 held by the stage 37. The component 5 has a second alignment mark, which will be described later. That is, the bonding tool 34 in this embodiment holds the component 5 on which the second alignment mark is formed and presses it onto the substrate 3. Specifically, the bonding tool 34 moves up and down in the Z-axis direction and adsorbs (i.e., picks up) the component 5 moved by the component moving unit 35 from above. Then, the bonding tool 34 places the adsorbed component 5 on the ACF and presses it together with the substrate 3 against the lower support unit 36, thereby pre-pressing the component 5 onto the substrate 3. For example, the bonding tool 34 presses the component 5 onto the substrate 3 in a state where it is heated to about 80°C. The pre-pressing unit 30 may be provided with a mechanism for rotating the direction of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

The final bonding unit 40 performs a final bonding process (i.e., a thermocompression process) in which the component 5, which has been temporarily bonded to the substrate 3 by the temporary bonding unit 30, is permanently bonded (i.e., thermocompressed) to the substrate 3. In this way, the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. Such a final bonding unit 40 includes a substrate moving mechanism 41 and a bonding mechanism 42.

The substrate moving mechanism 41 has a structure similar to that of the substrate moving mechanism 21 of the bonding unit 20. Specifically, the substrate moving mechanism 41 has a stage 49. The upper surface of the stage 49 is provided with a number of suction holes 49a. The substrate moving mechanism 41 holds the substrate 3 placed on the stage 49 by vacuum suction through the number of suction holes 49a. The substrate moving mechanism 41 also has the function of moving the stage 49, which holds the substrate 3 by suction, in a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. By moving and rotating the stage 49, the substrate moving mechanism 41 positions the area where the component 5 of the substrate 3, which is held by suction and is temporarily pressure-bonded, above the lower support portion 46 of the pressure bonding mechanism 42.

The crimping mechanism 42 is provided on the base 1b and includes a crimping tool 43 and a lower support portion 46.

The bonding tool 43 is heated and presses the component 5 of the substrate 3 supported by the support 46 toward the support 46. For example, the bonding tool 43 presses the component 5 while heated to approximately 200°C. This causes the component 5 to be fully bonded, and the electrode portion 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

The substrate unloading section 50 has the function of holding the substrate 3 transported from the main pressure bonding section 40 on the stage 51 by vacuum suction. The substrate 3 held in the substrate unloading section 50 is either unloaded to another device downstream or removed from the stage 51 by an operator.

The stage 51 moves up and down in the Z-axis direction relative to the base 1c. In addition, a number of suction holes 51a are provided on the top surface of the stage 51, and the stage 51 holds the substrate 3 transferred from the main pressure bonding unit 40 by vacuum suction on its top surface.

The transport unit 60 is a device that transports the substrate 3. Specifically, the transport unit 60 has a function of transferring (transporting) the substrate 3 that has been brought into the substrate carry-in unit 10 to the bonding unit 20, the temporary bonding unit 30, the full bonding unit 40, and the substrate carry-out unit 50 in that order. The transport unit 60 is disposed in the front area (i.e., on the negative side in the Y-axis direction) of the bonding unit 20, the temporary bonding unit 30, and the full bonding unit 40.

The transport section 60 includes a substrate transport mechanism 62A, a substrate transport mechanism 62B, a substrate transport mechanism 62C, and a substrate transport mechanism 62D, which are arranged in order from the upstream side on a moving base 61 that extends in the X-axis direction across bases 1a, 1b, and 1c.

Each of the substrate transport mechanisms 62A-62D includes a base 63 and one or more arm units 64. In this embodiment, an example is shown in which each of the substrate transport mechanisms 62A-62D includes two arm units 64.

The base 63 is mounted on a moving base 61 and is movable in the X-axis direction. Two arm units 64 are mounted side by side in the X-axis direction on the base 63. The arm units 64 vacuum-suck the substrate 3 from above.

Each of the substrate transport mechanisms 62A to 62D moves to a substrate transfer position where the substrate 3 held by the stage 11, 23, 37, 49, 51 is vacuum-sucked from above, and receives or transfers the substrate 3 from the rising and lowering stage 11, 23, 37, 49, 51. For example, the substrate transport mechanism 62A receives the substrate 3 placed on the stage 11 of the substrate carry-in section 10 and transfers it to the stage 23 of the bonding section 20. Also, for example, the substrate transport mechanism 62B receives the substrate 3 from the stage 23 of the bonding section 20 and transfers it to the stage 37 of the temporary pressure bonding section 30. Also, for example, the substrate transport mechanism 62C receives the substrate 3 from the stage 37 of the temporary pressure bonding section 30 and transfers it to the stage 49 of the main pressure bonding section 40. Also, for example, the substrate transport mechanism 62D receives the substrate 3 from the stage 49 of the main pressure bonding section 40 and transfers it to the stage 51 of the substrate carry-out section 50.

Figure 3 shows the computer installed in component mounting line 1 and each component controlled by the computer.

The component mounting line 1 includes a computer 2 as shown in FIG. 3. The computer 2 is communicatively connected to, for example, the bonding unit 20, the temporary bonding unit 30, the main bonding unit 40, and the transport unit 60 via, for example, a control line, and controls each of these units. The computer 2 includes a control unit 2a, a memory unit 2b, and a display unit 2c.

The display unit 2c displays images and characters, and is composed of, for example, a liquid crystal display, a plasma display, an organic EL (Electro-Luminescence) display, etc. Note that the display unit 2c is not limited to these displays.

The memory unit 2b stores various data necessary for component mounting operations, such as the size of the board 3, the type of components 5 to be mounted on the board 3, the mounting position, the mounting direction, and the timing of moving the board 3, as well as control programs executed by the control unit 2a. The memory unit 2b is realized, for example, by a ROM (Read Only Memory) or a RAM (Random Access Memory).

The control unit 2a controls the substrate moving mechanism 21 of the bonding unit 20, the substrate moving mechanism 31 of the temporary bonding unit 30, the substrate moving mechanism 41 of the main bonding unit 40, and the transport unit 60 to perform a substrate transfer operation in which the substrate 3 is transferred between each unit to the next process. The transfer of the substrate 3 from the upstream side to the downstream side during the substrate transfer operation is performed synchronously between each unit.

For example, the control unit 2a controls the adhesion unit 20 to change the orientation and position of the substrate 3 held by the substrate movement mechanism 21, change the spacing between the multiple adhesion heads using the head movement motor, and cause the adhesion unit 20 to perform the adhesion task of adhering the ACF to the substrate 3 using the adhesion mechanism 22.

For example, the control unit 2a also controls the temporary bonding unit 30. That is, the control unit 2a changes the orientation and position of the substrate 3 held by the substrate movement mechanism 31, and causes the component mounting mechanism 32 to perform temporary bonding of the components 5 to the substrate 3. At this time, the control unit 2a may correct or change the position of the substrate 3 according to the results of imaging by the imaging unit 39 provided in the temporary bonding unit 30. The imaging range of the imaging unit 39 is moved by the imaging movement mechanism 38. The control unit 2a also controls the component supply unit 33 and the component movement unit 35 to move the components 5 supplied from the component supply unit 33 to the component mounting mechanism 32 side.

For example, the control unit 2a also controls the final bonding unit 40 to change the orientation and position of the substrate 3 held by the substrate movement mechanism 41, and causes the component 5 temporarily bonded to the substrate 3 to be final bonded by the bonding mechanism 42.

The control unit 2a also controls the display unit 2c to display images, text, etc. on the display unit 2c.

Such a control unit 2a is realized, for example, by a control program stored in the memory unit 2b for controlling each part and each mechanism of the component mounting line 1, and a processor such as a CPU (Central Processing Unit) that executes the control program.

[Configuration of component crimping device]
FIG. 4 is a block diagram showing the configuration of component crimping device 100 according to the present embodiment.

The component crimping device 100 consists of a temporary crimping unit 30 in the component mounting line 1 and a control unit 2a of a computer 2.

Specifically, the component crimping device 100 includes a control unit 2a, a component supply unit 33, a component movement unit 35, a crimping tool 34, a lower support unit 36, a board movement mechanism 31, an image capture movement mechanism 38, a first camera 39L, and a second camera 39R.

The imaging unit 39 described above is composed of the first camera 39L and the second camera 39R. Each of the first camera 39L and the second camera 39R captures an image of a subject included in the imaging range. The imaging movement mechanism 38 moves the imaging ranges of the first camera 39L and the second camera 39R. The imaging movement mechanism 38 adjusts the distance between the imaging ranges of the first camera 39L and the second camera 39R by moving the imaging ranges of the first camera 39L and the second camera 39R. Furthermore, the imaging movement mechanism 38 moves the imaging ranges of the first camera 39L and the second camera 39R along the Y-axis direction. The distance between the imaging ranges is also called the optical system pitch or camera pitch. For example, the imaging movement mechanism 38 in this embodiment moves the imaging ranges of the first camera 39L and the second camera 39R.

The control unit 2a controls the board moving mechanism 31, the component supply unit 33, the crimping tool 34, the component moving unit 35, the imaging moving mechanism 38, the first camera 39L, and the second camera 39R.

[Parts supply]
FIG. 5 is a diagram showing an example of a tape member on which a plurality of components 5 are provided and a portion of a substrate 3. As shown in FIG.

As shown in FIG. 5A, the tape member 70 includes a plurality of components 5. These components 5 are arranged along the longitudinal direction of the tape member 70, and are provided at positions spaced apart from each other by a predetermined distance. Such a tape member 70 is a member in which a plurality of components 5 are mounted on a flexible resin film, and is also called a film carrier. For example, the tape member 70 is a TCP. Individual TCPs or COFs (chip on film) are punched out as components 5 from this tape member 70. A plurality of sprocket holes 71 are formed on both ends of the width of the tape member 70, and are arranged in a row along the longitudinal direction of the tape member 70.

The component 5 has an electrode portion 6 formed of multiple electrodes and a pair of second alignment marks Mc. The material constituting the component 5 is not particularly limited, but is, for example, a resin such as polyimide.

Each electrode included in the electrode section 6 is a conductive member such as a metal provided on the surface of the component 5. The multiple electrodes are arranged, for example, in a line along the width direction of the tape member 70.

Each of the pair of second alignment marks Mc is a mark for obtaining the positional relationship between the substrate 3 and the component 5. For example, each of the pair of second alignment marks Mc is a cross-shaped mark and is arranged so as to sandwich the electrode portion 6 along the width direction of the tape member 70.

As shown in FIG. 5B, the substrate 3 is provided with an electrode section 4 consisting of multiple electrodes and a pair of first alignment marks Mb. Each electrode included in the electrode section 4 is a conductive member such as a metal provided on the surface of the substrate 3. The multiple electrodes are arranged side by side, for example, along the X-axis direction.

Each of the pair of first alignment marks Mb is a mark for obtaining the positional relationship between the board 3 and the component 5. For example, each of the pair of first alignment marks Mb is a cross-shaped mark and is arranged to sandwich the electrode part 4 along the X-axis direction. In addition, the above-mentioned ACF 91 is attached to this electrode part 4.

Figure 6 is a diagram showing an example of the configuration of the punching section 33b of the component supply section 33. The punching section 33b sequentially punches out a plurality of components 5 from the tape member 70 while feeding the tape member 70 at a constant pitch. For example, the punching section 33b includes a sprocket 331 that engages with a sprocket hole 71 provided in the tape member 70, a motor 332 that rotates and drives the sprocket 331, and a punch 333 and a die 334 that punch out the components 5 from the tape member 70. The motor 332 is controlled by the control section 2a, and feeds the tape member 70 at a constant pitch by rotating and driving the sprocket 331. The motor 332 can finely adjust the feed amount of the tape member 70. The components 5 punched out of the tape member 70 by the punching section 33b are placed on the movable stage 33c.

Figure 7 shows the flow of components 5 supplied from the component supply unit 33 to the crimping tool 34 via the component movement unit 35.

The component supply unit 33 includes a punching unit 33b, a supply reel 33a, a cover tape recovery unit 336, a winding unit 335, a movable stage 33c, and a rail 33d.

A tape member 70 is wound around the supply reel 33a. The leading end of the tape member 70 is pulled out from the supply reel 33a by the punching section 33b without slack. The cover tape recovery section 336 recovers the cover tape 72 peeled off from the tape member 70. The winding section 335 winds and recovers the remaining part of the tape member 70. The remaining part of the tape member 70 is the part remaining after the cover tape 72 has been peeled off from the tape member 70 and the part 5 has been punched out. The movable stage 33c receives and holds the part 5 punched out by the punching section 33b from the punching section 33b, and moves along the rail 33d.

The component moving section 35 includes a transfer head 35a and a transfer stage 35b. The transfer head 35a receives the component 5 held by the movable stage 33c that has moved along the rail 33d from the movable stage 33c. The transfer head 35a then moves to the crimping tool 34 side while suction-holding the component 5. The transfer stage 35b receives the component 5 that has been suction-held by the transfer head 35a from the transfer head 35a that has moved to the crimping tool 34 side. The transfer stage 35b that has received the component 5 moves to below the crimping tool 34.

The bonding tool 34 adsorbs and holds the component 5 placed on the transfer stage 35b. Here, the imaging unit 39 consisting of the above-mentioned first camera 39L and second camera 39R images the component 5 held by the bonding tool 34 via the under-receiving portion 36. Furthermore, the imaging unit 39 images the edge of the board 3 held on the stage 37 of the board moving mechanism 31 via the under-receiving portion 36. The stage 37 aligns the component 5 with the board 3 based on the results of imaging the component 5 and the edge of the board 3. Then, the bonding tool 34 crimps the component 5 onto the aligned board 3.

In this manner, the component supply unit 33 of the component crimping device 100 in this embodiment includes a punching unit 33b that sequentially punches out each of the multiple components 5 from the tape member 70 on which the multiple components 5 are provided. The crimping tool 34 then holds the components 5 punched out by the punching unit 33b and crimps them onto the substrate 3.

[Crimping of parts]
FIG. 8 is a diagram showing an example of a procedure for crimping the component 5 by the crimping tool 34 and the stage 37 of the substrate moving mechanism 31.

First, as shown in FIG. 8(a), the transfer stage 35b transports the component 5 to the crimping tool 34 and the lower support 36. Next, as shown in FIG. 8(b), the transfer stage 35b stops below the crimping tool 34, that is, between the crimping tool 34 and the lower support 36. Next, as shown in FIG. 8(c), the crimping tool 34 descends to hold the component 5. This transfers the component 5 from the transfer stage 35b to the crimping tool 34. Then, as shown in FIG. 8(d), the crimping tool 34 rises while holding the component 5.

Next, as shown in (e) of FIG. 8, the transfer stage 35b that has handed over the component 5 retreats from below the crimping tool 34. Then, as shown in (f) of FIG. 8, the imaging unit 39 images the component 5. In this imaging, the edge of the component 5 and the second alignment mark Mc are imaged. The imaging result is used to confirm the punching accuracy of the component 5 by the punching unit 33b. The imaging result of the second alignment mark Mc is also used to align the component 5 and the board 3. The crimping tool 34 may lower the component 5 to the focal position of the imaging unit 39 or nearby. The imaging unit 39 may also change the focal position. Next, as shown in (g) of FIG. 8, if the crimping tool 34 has been lowered, the crimping tool 34 rises and the stage 37 holding the board 3 moves. As shown in FIG. 8(h), when the movement of the stage 37 causes the edge of the substrate 3 to reach below the pressure bonding tool 34, the stage 37 descends. As a result, the edge of the substrate 3 is supported from below by the support 36. At this time, the imaging unit 39 captures an image of the first alignment mark Mb formed on the substrate 3. Then, based on the imaging results of the first alignment mark Mb and the second alignment mark Mc, the stage 37 adjusts the position of the substrate 3. In other words, the component 5 and the substrate 3 are aligned.

8(i), the bonding tool 34 starts to descend in order to attach the component 5 to the edge of the substrate 3. Then, as shown in FIG. 8(j), the bonding tool 34 presses the component 5 against the edge of the substrate 3. As a result, the component 5 is temporarily bonded to the substrate 3, and the electrode portion 6 of the component 5 is electrically connected to the electrode portion 4 of the substrate 3 by the ACF 91 attached to the substrate 3. After that, as shown in FIG. 8(k), the bonding tool 34 rises, and the substrate 3 to which the component 5 has been temporarily bonded is carried out by the movement of the stage 37.

[Related information]
The control unit 2a in this embodiment generates and outputs relevant information indicating the punching accuracy of the component 5 based on the image of the component 5 captured by the imaging unit 39 in the situation shown in FIG. 8(f).

Figure 9 shows an example of relationship information.

The relationship information indicates, for each of a pair of second alignment marks Mc, the positional relationship between that second alignment mark Mc and the edge of the component 5 around that second alignment mark Mc as the punching accuracy of the component 5. Specifically, the relationship information indicates the distance between the edge of the component 5 and the second alignment mark Mc as the positional relationship. More specifically, the relationship information indicates the distance XL and distance YL for the second alignment mark Mc on the positive side of the X-axis direction, and the distance XR and distance YR for the second alignment mark Mc on the negative side of the X-axis direction.

Distance XL is the distance between the second alignment mark Mc on the positive side of the X-axis direction and the cut line of the component 5 along the Y-axis direction that is closest to the second alignment mark Mc. Distance YL is the distance between the second alignment mark Mc on the positive side of the X-axis direction and the cut line of the component 5 along the X-axis direction that is closest to the second alignment mark Mc.

The cut line is one side of the part 5 that is generated by punching the part 5 with the punching section 33b. The edge of the part 5 around the second alignment mark Mc on the positive side of the X-axis direction consists of a cut line on the negative side of the Y-axis direction that runs along the X-axis direction, and a cut line on the positive side of the X-axis direction that runs along the Y-axis direction.

Similarly, the distance XR is the distance between the second alignment mark Mc on the negative side of the X-axis direction and the cut line of the component 5 along the Y-axis direction that is closest to the second alignment mark Mc. The distance YR is the distance between the second alignment mark Mc on the negative side of the X-axis direction and the cut line of the component 5 along the X-axis direction that is closest to the second alignment mark Mc. Note that the edge of the component 5 around the second alignment mark Mc on the negative side of the X-axis direction consists of a cut line on the negative side of the Y-axis direction that is along the X-axis direction, and a cut line on the negative side of the X-axis direction that is along the Y-axis direction.

This relationship information is fed back to, for example, the punching unit 33b. In other words, in this embodiment, the control unit 2a controls the punching of the component 5 from the tape member 70 by the punching unit 33b by outputting the relationship information.

For example, when the distances YL and YR deviate from the reference distance, the punching unit 33b shifts the punching position of the component 5 in the longitudinal direction of the tape member 70 so that these distances approach the reference distance. Alternatively, the punching unit 33b adjusts the punching interval of the component 5. Furthermore, when one of the distances XL and XR is shorter than the reference distance and the other is longer, the punching unit 33b shifts the punching position of the component 5 in the width direction of the tape member 70 so that these distances approach the reference distance.

[Details of imaging by imaging unit]
FIG. 10 is a diagram showing an example of each of the first camera 39L and the second camera 39R included in the imaging unit 39 and the imaging movement mechanism 38 in this embodiment.

The first camera 39L and the second camera 39R are disposed below the lower support 36 and capture images in the Z-axis direction. The first camera 39L and the second camera 39R are also arranged in the X-axis direction.

The imaging movement mechanism 38 moves the imaging range of the first camera 39L and the second camera 39R, for example, by moving each of them. The imaging movement mechanism 38 changes the distance between the cameras, i.e., the camera pitch, by moving each of the first camera 39L and the second camera 39R along the X-axis direction. Furthermore, the imaging movement mechanism 38 moves the first camera 39L and the second camera 39R along the Y-axis direction.

When the component 5 is imaged, the crimping tool 34 suctions and holds the component 5 with the electrode portion 6, which is made up of multiple electrodes formed on the component 5, and a pair of second alignment marks Mc, which are arranged to sandwich the electrode portion 6, facing downward. The pair of second alignment marks Mc are also arranged to face the lower support portion 36.

The first camera 39L and the second camera 39R capture images of the pair of second alignment marks Mc of the component 5 and the two edges of the component 5 from below through the two through-holes h1 of the under-support 36. Each of the two through-holes h1 is a hole having an opening on the upper surface of the under-support 36 arranged, for example, along the X-axis direction, and penetrates the under-support 36 along the Z-axis direction. The first camera 39L captures images of the second alignment mark Mc on the positive side of the X-axis direction of the component 5 and the edges of the component 5 around the second alignment mark Mc through the through-hole h1 on the positive side of the X-axis direction. The second camera 39R captures images of the second alignment mark Mc on the negative side of the X-axis direction of the component 5 and the edges of the component 5 around the second alignment mark Mc through the through-hole h1 on the negative side of the X-axis direction. In this embodiment, the through portion h1 is a hole, but it may also be a groove recessed toward the positive side in the Y-axis direction, or may be made of a material such as glass that has translucency.

When the substrate 3 is imaged, the edge of the substrate 3 held by the stage 37 is positioned above the lower support 36. In addition, an electrode portion 4 consisting of multiple electrodes and a pair of first alignment marks Mb arranged to sandwich the electrode portion 4 are formed on the upper surface of the edge. Furthermore, ACF 91 is attached to the upper surface of the edge so as to cover the electrode portion 4.

The first camera 39L and the second camera 39R capture images of the pair of first alignment marks Mb on the substrate 3 from below through the two through holes h1 of the lower support 36. The portion of the substrate 3 on which the pair of first alignment marks Mb are formed is translucent. Therefore, the first alignment mark Mb formed on the upper surface of the substrate 3 is captured through the translucent portion. The first camera 39L captures the first alignment mark Mb on the positive side of the X-axis direction on the substrate 3 through the through hole h1 on the positive side of the X-axis direction. The second camera 39R captures the first alignment mark Mb on the negative side of the X-axis direction on the substrate 3 through the through hole h1 on the negative side of the X-axis direction.

Figure 11 shows the first camera 39L and part 5 as viewed from the X-axis direction when part 5 is imaged.

As shown in FIG. 11, the first camera 39L captures an image of the component 5 above the lower support 36 from below the lower support 36 through the through hole h1 of the lower support 36. The second camera 39R similarly captures an image of the component 5 through the through hole h1 of the lower support 36.

Figures 12A and 12B show examples of images captured by the first camera 39L and the second camera 39R, respectively.

In the example shown in (a) and (b) of FIG. 12A, the imaging range DL of the first camera 39L includes the second alignment mark Mc on the positive side of the X-axis direction of the component 5 and the edge of the component 5 around the second alignment mark Mc. In this case, the first camera 39L simultaneously captures the second alignment mark Mc and the edge of the component 5. This capture generates imaging data that is an image showing the second alignment mark Mc and the edge of the component 5. The control unit 2a then recognizes the position of the edge of the component 5 from the imaging data, as shown in (a) of FIG. 12A, and further recognizes the position of the second alignment mark Mc, as shown in (b) of FIG. 12A.

Similarly, in the example shown in (a) and (b) of FIG. 12B, the imaging range DR of the second camera 39R includes the second alignment mark Mc on the negative side of the X-axis direction of the component 5 and the edge of the component 5 around the second alignment mark Mc. In this case, the second camera 39R simultaneously captures the second alignment mark Mc and the edge of the component 5. This capture generates imaging data that is an image showing the second alignment mark Mc and the edge of the component 5. The control unit 2a then recognizes the position of the edge of the component 5 from the imaging data, as shown in (a) of FIG. 12B, and further recognizes the position of the second alignment mark Mc, as shown in (b) of FIG. 12B.

Here, each of the imaging ranges DL and DR may not include both the second alignment mark Mc and the edge of the component 5. For example, if the distance between the edge of the component 5 and the second alignment mark Mc is long, each of the imaging ranges DL and DR may not include both the second alignment mark Mc and the edge of the component 5. In such a case, the imaging movement mechanism 38 in this embodiment moves the imaging range DL of the first camera 39L and the imaging range DR of the second camera 39R. Then, the control unit 2a first causes the first camera 39L and the second camera 39R to capture images of the two edges of the component 5, and then causes the first camera 39L and the second camera 39R to capture images of the pair of second alignment marks Mc.

Figure 13A shows an example of imaging the edge of a component 5 as a subject. Figure 13B shows an example of imaging the second alignment mark Mc as a subject.

As described above, there are cases where the imaging range DL of the first camera 39L cannot include both the second alignment mark Mc and the edge of the component 5. In such a case, the control unit 2a first controls the imaging movement mechanism 38 to move the imaging range DL so that the edge of the component 5 falls within the imaging range DL, as shown in (a) of FIG. 13A. Then, as shown in (b) of FIG. 13A, the control unit 2a causes the first camera 39L to first capture an image of the edge of the component 5 before capturing an image of the second alignment mark Mc. As a result, the first camera 39L generates imaging data that is an image in which the edge of the component 5 is shown.

After the edge of the component 5 has been imaged, the control unit 2a controls the imaging movement mechanism 38 to move the imaging range DL to the negative side in the X-axis direction, as shown in (a) of FIG. 13B. As a result, the second alignment mark Mc of the component 5 is included in the imaging range DL. Then, the control unit 2a causes the first camera 39L to capture an image of the second alignment mark Mc, as shown in (b) of FIG. 13B. As a result, the first camera 39L generates imaging data that is an image showing the second alignment mark Mc.

The control unit 2a recognizes the position of the edge of the component 5 in the imaging range DL from the imaging data of the edge of the component 5 shown in (b) of FIG. 13A. Furthermore, the control unit 2a recognizes the position of the second alignment mark Mc in the imaging range DL from the imaging data of the second alignment mark Mc shown in (b) of FIG. 13B. Then, the control unit 2a identifies the positional relationship between the edge of the component 5 and the second alignment mark Mc based on the position of the edge of the component 5, the position of the second alignment mark Mc, and the movement direction and movement distance of the imaging range DL. The control unit 2a generates relationship information (XL, YL) that indicates this positional relationship.

The control unit 2a also performs the same processing for the imaging range DR of the second camera 39R as the processing for imaging shown in Figures 13A and 13B. This generates relationship information (XR, YR).

Figure 14A shows another example of imaging the edge of the component 5 as a subject. Figure 14B shows another example of imaging the second alignment mark Mc as a subject.

As in the example shown in FIG. 13A, when the imaging range DL cannot include both the second alignment mark Mc and the edge of the component 5, the control unit 2a first fits the edge of the component 5 within the imaging range DL, as shown in FIG. 14A (a). Next, as shown in FIG. 14A (b), the control unit 2a causes the first camera 39L to capture an image of the edge of the component 5. As a result, the first camera 39L generates imaging data that is an image showing the edge of the component 5.

After the edge of the component 5 has been imaged, the control unit 2a controls the imaging movement mechanism 38 to move the imaging range DL to the positive side in the Y-axis direction, as shown in (a) of FIG. 14B. As a result, the second alignment mark Mc of the component 5 is included in the imaging range DL. Then, the control unit 2a causes the first camera 39L to capture an image of the second alignment mark Mc, as shown in (b) of FIG. 14B. As a result, the first camera 39L generates imaging data that is an image showing the second alignment mark Mc.

[Processing flow of component crimping device]
FIG. 15 is a flow chart showing the overall process steps of component crimping apparatus 100 in this embodiment.

The punching unit 33b included in the component supply unit 33 of the component crimping device 100 executes a punching process to punch the component 5 from the tape member 70 (step S11). The punched component 5 is moved to the crimping tool 34 side by the component moving unit 35.

Next, the crimping tool 34 adsorbs and holds the component 5 supplied from the component supply unit 33 (step S12). The control unit 2a then causes the imaging unit 39 to capture an image of the component 5 held by the crimping tool 34, and executes a positional relationship determination process to determine the positional relationship between the edge of the component 5 and the second alignment mark Mc (step S13). In this step S13, imaging data is generated in which each of the pair of second alignment marks Mc formed on the component 5 is shown by imaging the component 5 by the imaging unit 39.

Then, the control unit 2a judges whether or not the positional relationship is within the allowable range (step S14). If the control unit 2a judges that the positional relationship is within the allowable range (Yes in step S14), it feeds back the positional relationship to the punching process (step S15). In other words, the control unit 2a outputs relationship information indicating the positional relationship to the punching unit 33b of the part supply unit 33, thereby causing the punching unit 33b to adjust the position at which the part 5 is punched by the punching unit 33b.

Then, the control unit 2a controls the substrate moving mechanism 31 to move the substrate 3 toward the undersupport unit 36 without changing the positions of the imaging range DL and imaging range DR of the imaging unit 39 that were set at the end of the processing in step S13. By moving the substrate 3, the control unit 2a causes the pair of first alignment marks Mb of the substrate 3 to fall within the imaging range DL and imaging range DR, respectively (step S16). In other words, the control unit 2a causes the substrate moving mechanism 31 to move the substrate 3 so that the pair of first alignment marks Mb fall within the imaging range DL and imaging range DR, respectively.

Next, the control unit 2a causes the imaging unit 39 to capture an image of a pair of first alignment marks Mb included in the imaging range DL and the imaging range DR as subjects (step S17). That is, the first camera 39L captures an image of the first alignment mark Mb included in the imaging range DL, and the second camera 39R captures an image of the first alignment mark Mb included in the imaging range DR. This generates imaging data that shows each of the pair of first alignment marks Mb.

Next, the control unit 2a causes the substrate moving mechanism 31 to adjust the position of the substrate 3 based on the pair of second alignment marks Mc of the component 5 and the pair of first alignment marks Mb of the substrate 3 (step S18). That is, the control unit 2a recognizes the position of the first alignment mark Mb from the imaging data of the first alignment mark Mb, and recognizes the position of the second alignment mark Mc from the imaging data of the second alignment mark Mc. Then, the stage 37 of the substrate moving mechanism 31 holding the substrate 3 adjusts the position of the substrate 3 under the control of the control unit 2a so that the pair of second alignment marks Mc and the pair of first alignment marks Mb overlap. This allows the component 5 and the substrate 3 to be aligned. Then, the control unit 2a lowers the pressure bonding tool 34 to pressure bond the component 5 to the edge of the substrate 3 supported by the lower support 36 (step S19). In other words, the control unit 2a controls the bonding of the component 5 to the substrate 3 by the substrate moving mechanism 31 and the bonding tool 34 based on the respective imaging results of the pair of first alignment marks Mb and the pair of second alignment marks Mc.

Furthermore, if it is determined in step S14 that the positional relationship is not within the allowable range (No in step S14), the control unit 2a prohibits the component 5 held by the crimping tool 34 from being crimped onto the substrate 3 (step S20). At this time, the control unit 2a may stop the punching of the component 5 by the punching unit 33b. Then, the control unit 2a notifies the user that a malfunction has occurred in the punching unit 33b of the component supply unit 33 (step S21). For example, the control unit 2a notifies the user of the malfunction by displaying a message or warning notifying the user of the malfunction on the display unit 2c.

Specifically, the control unit 2a notifies the occurrence of a malfunction in the punching section 33b when the distance indicated by the relationship information is not within a predetermined tolerance range. More specifically, the control unit 2a notifies the occurrence of a malfunction when the distance YL and the distance YR indicated by the relationship information are shorter or longer than the tolerance range. The control unit 2a may also notify the occurrence of a malfunction when the difference between the distance YL and the distance YR is not within the tolerance range. The control unit 2a may also notify the occurrence of a malfunction when one of the distances XL and XR indicated by the relationship information is shorter and the other is longer than the tolerance range.

Figure 16 is a flowchart showing the details of the positional relationship determination process in step S13 of Figure 15.

The control unit 2a causes each of the first camera 39L and the second camera 39R to capture an image of the component 5 (step S131). As a result, imaging data of the component 5 is generated by each of the first camera 39L and the second camera 39R. Then, based on the imaging data, the control unit 2a determines whether or not both the edge of the component 5 and the second alignment mark Mc are included in each of the imaging range DL of the first camera 39L and the imaging range DR of the second camera 39R (step S132).

Here, when the control unit 2a determines that both the edge of the component 5 and the second alignment mark Mc are included in each of the imaging ranges DL and DR (Yes in step S132), it generates the above-mentioned relationship information (step S133). That is, the control unit 2a identifies the positional relationship (XL, YL) between the edge of the component 5 and the second alignment mark Mc shown in the imaging data of the first camera 39L. Similarly, the control unit 2a identifies the positional relationship (XR, YR) between the edge of the component 5 and the second alignment mark Mc shown in the imaging data of the second camera 39R. Then, the control unit 2a generates relationship information (XL, YL), (XR, YR) indicating the identified positional relationship.

On the other hand, when the control unit 2a determines that neither the edge of the component 5 nor the second alignment mark Mc is included in the imaging range DL and the imaging range DR (No in step S132), the control unit 2a causes the imaging movement mechanism 38 to move the imaging range DL and the imaging range DR (step S134). That is, the control unit 2a causes the imaging movement mechanism 38 to move the imaging range DL and the imaging range DR so that the edge of the component 5 held by the crimping tool 34 fits into each of the imaging range DL and the imaging range DR. Then, the control unit 2a causes the first camera 39L and the second camera 39R to capture images of the edge of the component 5 included in each of the imaging range DL and the imaging range DR as the subject (step S135). As a result, imaging data showing the edge of the component 5 is generated by each of the first camera 39L and the second camera 39R.

In step S134, the first camera 39L and the second camera 39R may continuously move the imaging ranges DL and DR while capturing images of the first camera 39L and the second camera 39R, respectively, until the edge of the component 5 falls within the imaging range DL and the imaging range DR. In this case, steps S134 and S135 are executed simultaneously. In addition, the processing of step S134 is executed immediately when a negative determination is made in step S132, but it does not have to be executed immediately. For example, when a negative determination is made in step S132, the control unit 2a controls the imaging movement mechanism 38 to move the imaging range DL and the imaging range DR, and repeatedly executes the processing of steps S131 and S132. Then, even if step S132 is repeatedly executed a predetermined number of times, the processing of step S134 may be executed when a positive determination is not made in step S132. That is, the process of step S134 may be executed when both the edge of the component 5 and the second alignment mark Mc cannot be captured in each of the imaging ranges DL and DR. Also, if it is known in advance that the edge of the component 5 and the second alignment mark Mc cannot be captured simultaneously based on the specifications of the component 5, the first camera 39L, and the second camera 39R, the process of step S134 may be executed without executing the processes of steps S131 and S132.

Next, the control unit 2a causes the imaging movement mechanism 38 to move the imaging range DL and the imaging range DR (step S137). That is, the control unit 2a moves the imaging range DL and the imaging range DR so that the second alignment mark Mc of the part 5 falls within the imaging range DL and the imaging range DR, respectively. In other words, when the pair of second alignment marks Mc are not included in the imaging range DL and the imaging range DR, the control unit 2a causes the imaging movement mechanism 38 to move the imaging range DL and the imaging range DR so that the pair of second alignment marks Mc falls within the imaging range DL and the imaging range DR, respectively, after imaging the edge of the part 5. Then, the control unit 2a causes the first camera 39L and the second camera 39R to capture the second alignment mark Mc included in the imaging range DL and the imaging range DR, respectively, as a subject (step S138). As a result, imaging data showing the second alignment mark Mc is generated by each of the first camera 39L and the second camera 39R.

In step S137, the first camera 39L and the second camera 39R may continue to move their imaging ranges while capturing images until the second alignment mark Mc falls within the imaging range DL and the imaging range DR, respectively. In this case, steps S137 and S138 are executed simultaneously.

After the imaging in step S138, the control unit 2a generates the above-mentioned relationship information (step S133). At this time, the control unit 2a uses the imaging data generated in step S135 showing the edge of the component 5 and the imaging data generated in step S138 showing the second alignment mark Mc. For example, the control unit 2a recognizes the position of the edge of the component 5 shown in the imaging data generated in step S135 by the first camera 39L, that is, the position of the edge in the imaging range DL. Furthermore, the control unit 2a recognizes the position of the second alignment mark Mc shown in the imaging data generated in step S137 by the first camera 39L, that is, the position of the second alignment mark Mc in the imaging range DL. Then, the control unit 2a determines the positional relationship between the edge of the component 5 and the second alignment mark Mc based on the position of the recognized edge of the component 5, the position of the second alignment mark Mc, and the movement distance and movement direction of the imaging range DL moved in step S137.

In this way, in step S133, the control unit 2a generates and outputs relationship information indicating the positional relationship between the edge of the component 5 and the second alignment mark Mc based on the respective imaging results of the edge of the component 5 and the second alignment mark Mc. The relationship information generated in step S133 is used, for example, for feedback control of the punching position of the component 5 by the punching unit 33b, or for reporting a malfunction of the punching unit 33b.

As described above, in this embodiment, it is not necessary to provide a sensor for checking the punching state of the component 5 in the punching section 33b, and the size of the punching section 33b can be suppressed. In other words, in the component crimping device 100 in this embodiment, the imaging section 39 can also be used as a sensor for checking the punching state of the component 5, so that the size of the punching section 33b can be suppressed. Specifically, the imaging section 39 is used to control the crimping of the component 5 to the board 3 by the board moving mechanism 31 and the crimping tool 34. For example, the imaging section 39 is used to image the first alignment mark Mb and the second alignment mark Mc for controlling the alignment of the component 5 and the board 3. In the component crimping device 100 in this embodiment, the imaging section 39 is also caused to image the edge of the component 5, and related information is generated and output, so that the imaging section 39 can also be used as a sensor for checking the punching state of the component 5. Therefore, there is no need to provide a sensor in the punching section 33b to check the punching state of the part 5, which helps prevent the punching section 33b from becoming too large.

Here, in order to check the punched state of the component 5, it is necessary to image the edge of the component 5 and the second alignment mark Mc, respectively. If they cannot be imaged simultaneously, it is necessary to move the imaging range DL and the imaging range DR to image them separately. In such a case, for example, a procedure is assumed in which the second alignment mark Mc is imaged first, and then the imaging range DL and the imaging range DR are moved to image the edge of the component 5. However, in this procedure, the imaging range DL and the imaging range DR must be further moved and returned to their original positions in order to align the component 5 with the board 3, which is performed next. For this alignment, it is necessary to image the first alignment mark Mb. In addition, in the imaging of the first alignment mark Mb and the imaging of the second alignment mark Mc, it is desirable that the imaging range DL and the imaging range DR are in the same position, respectively, in order to ensure the accuracy of the alignment. However, even if the imaging range DL and the imaging range DR are returned to their original positions, if the reproducibility of their positions is insufficient, the accuracy of the alignment between the component 5 and the board 3 will decrease.

However, in the component crimping device 100 of this embodiment, if it is not possible to simultaneously image the edge of the component 5 and the second alignment mark Mc, the edge of the component 5 is imaged first, and then the second alignment mark Mc is imaged.

Figure 17 is a diagram for explaining the timing of movement of the imaging unit 39 and the imaging range in the component crimping device 100 of this embodiment.

As shown in FIG. 17, in the component crimping device 100 in this embodiment, the edge of the component 5 is imaged first, and then the second alignment mark Mc is imaged. Between these images, the first camera 39L and the second camera 39R, i.e., the image capturing range DL and the image capturing range DR, move. However, between the image capturing of the second alignment mark Mc and the image capturing of the first alignment mark Mb, the position adjustment of the stage 37, which is the alignment between the component 5 and the board 3, can be performed without moving the first camera 39L and the second camera 39R. This is because the edge of the component 5 is imaged before the second alignment mark Mc. In other words, in this embodiment, the first alignment mark Mb can be imaged without moving the image capturing range DL and the image capturing range DR when the image capturing of the second alignment mark Mc is performed. Specifically, the first alignment mark Mb of the board 3 can be accommodated in the imaging range DL and the imaging range DR without moving the imaging range DL and the imaging range DR, and the first alignment mark Mb can be imaged. Therefore, the positions of the imaging range DL and the imaging range DR are the same in the imaging of the first alignment mark Mb and the imaging of the second alignment mark Mc. Therefore, the accuracy of aligning the component 5 and the board 3 can be sufficiently ensured. In other words, the mounting accuracy can be improved. As a result, the punching state of the component 5 can be confirmed while suppressing the increase in size of the punching portion 33b, and the mounting accuracy can be improved.

In addition, in this embodiment, the control unit 2a controls the punching of the component 5 from the tape member 70 by the punching unit 33b by outputting the related information. This makes it possible to automatically maintain a constant positional relationship between the edge of the component 5 and the second alignment mark Mc, and easily improves the punching accuracy of the component 5.

In addition, in this embodiment, the control unit 2a generates relationship information that indicates the distance between the edge of the component 5 and the second alignment mark Mc as a positional relationship, and if the distance is longer than a threshold value, notifies the operator that a malfunction has occurred in the punching unit 33b. This encourages the operator to inspect and repair the punching unit 33b, and improves the punching accuracy.

(Modification)
In the above embodiment, the imaging moving mechanism 38 moves the imaging range DL and the imaging range DR by moving the first camera 39L and the second camera 39R. However, the imaging moving mechanism 38 may move the imaging range DL and the imaging range DR without moving the first camera 39L and the second camera 39R.

Figure 18 shows an example of the configuration of part of the imaging movement mechanism 38 in this modified example.

As shown in (a) and (b) of FIG. 18, the imaging movement mechanism 38 in this modified example includes an optical member 38a composed of a lens or a mirror. The imaging movement mechanism 38 moves the optical member 38a upward, for example, as shown in (a) of FIG. 18, without moving the first camera 39L and the second camera 39R. This causes the imaging ranges DL and DR to move in the X-axis direction so that the camera pitch becomes wider. Alternatively, the imaging movement mechanism 38 moves the optical member 38a downward, for example, as shown in (b) of FIG. 18, without moving the first camera 39L and the second camera 39R. This causes the imaging ranges DL and DR to move in the X-axis direction so that the camera pitch becomes narrower.

In this manner, in this modified example, the imaging range DL and the imaging range DR can be moved simultaneously and easily along the X-axis direction by moving the optical member 38a.

(Other Modifications)
Although the component crimping device according to one or more aspects has been described based on the above embodiment and its modified examples, the present disclosure is not limited to the above embodiment and its modified examples. As long as it does not deviate from the spirit of the present disclosure, various modifications conceivable by a person skilled in the art to the above embodiment and its modified examples, and forms constructed by combining the components of the above embodiment and its modified examples may also be included within the scope of the present disclosure.

For example, in the above embodiment and its modified examples, the shape of each of the first alignment mark Mb and the second alignment mark Mc is cross-shaped, but is not limited to this shape and may be other shapes.

In addition, in the above embodiment and its modified examples, the substrate 3 is a display panel, and the component 5 is temporarily and permanently pressure-bonded to the display panel, but the substrate 3 may be a substrate other than a display panel.

In addition, in the above embodiment and its modified example, the first alignment mark Mb is imaged after the second alignment mark Mc. However, the first alignment mark Mb and the second alignment mark Mc may be imaged simultaneously.

In the above embodiment and its modified example, the control unit 2a notifies the occurrence of a malfunction in the punching portion 33b by displaying a message or warning notifying the occurrence of the malfunction on the display unit 2c. At this time, the control unit 2a may display the distances XL, XR, YL, and YR shown in the relationship information on the display unit 2c, and may display numerical values for adjusting the punching portion 33b according to these distances on the display unit 2c.

In the above embodiment and its modified examples, all or some of the components of the computer 2 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a HDD (Hard Disk Drive) or a semiconductor memory. For example, the program execution unit causes the temporary pressure bonding unit 30 to execute each step included in the flow charts shown in Figures 15 and 16.

The components of the computer 2 may be composed of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit. The one or more electronic circuits may include, for example, a semiconductor device, an IC (Integrated Circuit), or an LSI (Large Scale Integration). The IC or LSI may be integrated into one chip or into multiple chips. Here, the IC or LSI is referred to as an IC or LSI, but the name may change depending on the degree of integration, and may be called a system LSI, a VLSI (Very Large Scale Integration), or an ULSI (Ultra Large Scale Integration). A field programmable gate array (FPGA) that is programmed after the LSI is manufactured can also be used for the same purpose.

This disclosure can be used, for example, in component crimping devices installed in component mounting lines that mount components on display panels.

1 Component mounting line 2 Computer 2a Control unit 2b Memory unit 2c Display unit 3 Substrate 4 Electrode unit 5 Component 6 Electrode unit 10 Substrate loading unit 20 Adhesive unit 30 Pre-pressing unit 31 Substrate moving mechanism 32 Component mounting mechanism 33 Component supply unit 33a Supply reel 33b Punching unit 33c Movable stage 33d Rail 34 Pressing tool 35 Component moving unit 35a Transfer head 35b Transfer stage 36 Under-receiving unit 37 Stage 37a Suction hole 38 Imaging moving mechanism 38a Optical member 39 Imaging unit 39L First camera 39R Second camera 40 Main pressing unit 50 Substrate unloading unit 60 Transport unit 70 Tape member 91 ACF
100 Component pressure bonding device DL Imaging range DR Imaging range Mb First alignment mark Mc Second alignment mark

Claims (5)

a substrate moving mechanism that holds a substrate on which a first alignment mark is formed and moves the substrate;
a compression tool that holds a component on which a second alignment mark is formed and compresses the component onto the substrate;
an imaging unit that captures an image of a subject included in an imaging range;
an imaging movement mechanism that moves an imaging range of the imaging unit;
A control unit.
The control unit is
causing the imaging moving mechanism to move the imaging range so that an edge of the component held by the crimping tool falls within the imaging range;
an image of an edge of the component included in the imaging range is captured by the imaging unit as the subject;
When the second alignment mark is not included in the imaging range,
after capturing an image of the edge of the component, causing the imaging movement mechanism to move the imaging range so that the second alignment mark falls within the imaging range;
The second alignment mark included in the imaging range is imaged by the imaging unit as the subject;
generating and outputting relationship information indicating a positional relationship between the edge of the component and the second alignment mark based on the respective imaging results of the edge of the component and the second alignment mark;
causing the substrate moving mechanism to move the substrate so that the first alignment mark falls within the imaging range;
The first alignment mark included in the imaging range is imaged by the imaging unit as the subject;
controlling the substrate moving mechanism and the bonding tool to bond the component to the substrate based on the imaging results of the first alignment mark and the second alignment mark;
the imaging moving mechanism does not move an imaging range of the imaging unit during a period from when the imaging unit captures an image of the second alignment mark to when the imaging unit captures an image of the first alignment mark;
Component crimping device. The component crimping device further comprises:
a punching unit that sequentially punches out each of the plurality of components from a tape member on which the plurality of components are provided,
The crimping tool holds the component punched by the punching section and crimps it onto the substrate.
The component crimping device according to claim 1 . The control unit further includes:
and controlling the punching of the components from the tape member by the punching unit based on the output of the relationship information.
The component crimping device according to claim 2 . The control unit further includes:
generating the relationship information indicating a distance between an edge of the component and the second alignment mark as the positional relationship;
If the distance is not within a predetermined tolerance, a malfunction is reported in the punching section.
4. The component crimping device according to claim 2 or 3. A component crimping method in which a component crimping device crimps a component onto a substrate, comprising:
The component crimping device includes:
a substrate moving mechanism that holds a substrate on which a first alignment mark is formed and moves the substrate;
a compression tool that holds a component on which a second alignment mark is formed and compresses the component onto the substrate;
an imaging unit that captures an image of a subject included in an imaging range;
an imaging movement mechanism that moves an imaging range of the imaging unit;
A control unit.
In the component crimping method,
the imaging movement mechanism moves the imaging range so that an edge of the component falls within the imaging range;
the imaging unit captures an image of an edge of the component included in the imaging range as the subject;
When the second alignment mark is not included in the imaging range,
after capturing an image of the edge of the component, the imaging moving mechanism moves the imaging range so that the second alignment mark falls within the imaging range;
The imaging unit images the second alignment mark included in the imaging range as the subject,
the control unit generates and outputs relationship information indicating a positional relationship between the edge of the component and the second alignment mark based on the imaging results of the edge of the component and the second alignment mark;
the substrate moving mechanism moves the substrate so that the first alignment mark falls within the imaging range;
The imaging unit captures an image of the first alignment mark included in the imaging range as the subject,
The control unit controls the substrate moving mechanism and the bonding tool to bond the component to the substrate based on the imaging results of the first alignment mark and the second alignment mark,
the imaging moving mechanism does not move an imaging range of the imaging unit during a period from when the imaging unit captures an image of the second alignment mark to when the imaging unit captures an image of the first alignment mark;
Part crimping method.

Images