JP7595285B2 - Component mounting system, component mounting device, and component mounting method - Google Patents

Description

The present invention relates to a component mounting system, a component mounting device, and a component mounting method that picks up components with a nozzle and mounts them on a board.

Conventionally, there is known a component mounting system that includes an adhesive applicator, a component mounting device, and an appearance inspection device, in which the adhesive applicator applies adhesive to a board, the component mounting device mounts components with LEDs formed on their surfaces onto the board, and the appearance inspection device inspects the condition of the components mounted on the board (for example, Patent Document 1). The component mounting system disclosed in Patent Document 1 automatically corrects various setting conditions, such as the amount and application position of adhesive by the adhesive applicator, and the component pressing force (mounting load) and component suction position of the component mounting device, based on feedback data from the appearance inspection device.

Japanese Patent Application Publication No. 6-45753

In recent years, there has been a demand for detailed control of the thickness of the adhesive between the board and the components after mounting. In particular, in products in which LED components are attached to a board with adhesive, and in which heat generated by the LED components when they emit light is dissipated from the board, it is necessary to strictly control the thickness of the adhesive. However, the prior art, including Patent Document 1, does not disclose anything about controlling the thickness of the adhesive after mounting, and there is room for further improvement in order to mount components on a board while controlling the thickness of the adhesive after mounting.

The present invention aims to provide a component mounting system, component mounting device, and component mounting method that can properly manage the thickness of the adhesive between the board and the component.

The component mounting system of the present invention is a component mounting system that picks up a component with a nozzle and mounts it on a board, and includes an adhesive application means that applies adhesive under predetermined application conditions to a mounting position on the top surface of the board, a mounting head that has a nozzle that holds a component and moves above the board and lowers the nozzle holding the component to mount the component under predetermined mounting conditions at the mounting position, an adhesive thickness detection means that detects the adhesive thickness of the adhesive between the top surface of the board and the bottom surface of the component mounted on the board, and a condition change unit that changes at least one of the application conditions and the mounting conditions based on the adhesive thickness.

Another component mounting system of the present invention is a component mounting system that picks up a component with a nozzle and mounts it on a board, and includes: a board height measuring means that measures the board height at a mounting position on the top surface of the board; an adhesive application means that applies adhesive to the mounting position under predetermined application conditions; a mounting head that has a nozzle that holds a component and moves above the board, lowers the nozzle holding the component, and mounts the component at the mounting position under predetermined mounting conditions; and a nozzle height measuring means that measures the height of the suction surface of the nozzle, and the mounting head stops the descent of the nozzle when the height of the suction surface of the nozzle that presses the component against the board reaches a height that is the measured board height plus the component thickness of the component and a preset adhesive thickness of the adhesive.

The component mounting device of the present invention is a component mounting device that picks up a component with a nozzle and mounts it on a board, and is equipped with a mounting head that has a nozzle that holds the component, moves above a board on whose top surface adhesive has been applied at a mounting position, and lowers the nozzle holding the component to mount the component at the mounting position under predetermined mounting conditions, an adhesive thickness detection means that detects the thickness of the adhesive between the top surface of the board and the bottom surface of the component mounted on the board, and a condition change unit that changes the mounting conditions based on the adhesive thickness.

Another component mounting device of the present invention is a component mounting device that picks up a component with a nozzle and mounts it on a board, and is equipped with a board height measurement means that measures the board height at the mounting position on the top surface of the board, a mounting head that has a nozzle that holds a component and moves above the board on which adhesive has been applied at the mounting position, lowers the nozzle holding the component, and mounts the component at the mounting position under predetermined mounting conditions, and a nozzle height measurement means that measures the height of the suction surface of the nozzle, and the mounting head stops the descent of the nozzle when the height of the suction surface of the nozzle that is pressing the component against the board reaches a height that is the measured board height plus the component thickness of the component and the preset adhesive thickness of the adhesive.

The component mounting method of the present invention is a component mounting method for adsorbing a component with a nozzle and mounting it on a board, and includes a component holding step for holding the component with a nozzle, a nozzle moving step for moving the nozzle holding the component above a board on which adhesive has been applied at a mounting position on the top surface, a component mounting step for lowering the nozzle holding the component and mounting the component at the mounting position under predetermined mounting conditions, an adhesive thickness detection step for detecting the adhesive thickness of the adhesive between the top surface of the board and the bottom surface of the component mounted on the board, and a condition change step for changing the mounting conditions based on the adhesive thickness.

Another component mounting method of the present invention is a component mounting method in which a component is suctioned by a nozzle and mounted on a board, and includes a board height measurement step of measuring the board height at the mounting position on the top surface of the board, a component holding step of holding the component by a nozzle, a nozzle moving step of moving the nozzle holding the component to above the board on which adhesive has been applied at the mounting position, a component pressing step of lowering the nozzle holding the component to press the component against the mounting position, and a nozzle height measurement step of measuring the height of the suction surface of the nozzle during the component pressing step, and when the height of the suction surface of the nozzle reaches the measured board height plus the component thickness of the component and the preset adhesive thickness of the adhesive, the component pressing step is terminated.

The present invention allows for proper control of the thickness of the adhesive between the substrate and the component.

FIG. 1 is a configuration explanatory diagram of a component mounting system according to an embodiment of the present invention; FIG. 2A is a front view of an example of a component mounted on a board by a component mounting device according to an embodiment of the present invention; FIG. 1 is a configuration explanatory diagram of a component mounting device according to an embodiment of the present invention; FIG. 1 is a functional explanatory diagram of a component mounting device according to an embodiment of the present invention; FIG. 1 is a block diagram showing a configuration of a control system of a component mounting apparatus according to an embodiment of the present invention. 1A is a front view illustrating a substrate height measurement process in a component mounting apparatus according to an embodiment of the present invention; FIG. 1A is a front view illustrating an adhesive application process in a component mounting apparatus according to an embodiment of the present invention; FIG. FIG. 1 is an explanatory diagram for explaining a component thickness measurement process in a component mounting device according to an embodiment of the present invention. 1A is a front view illustrating a component pressing process in a component mounting device according to an embodiment of the present invention; FIG. 1A is a front view illustrating a component height measurement process in a component mounting device according to an embodiment of the present invention; FIG. 1 is a flow diagram of a first embodiment of a component mounting method according to the present invention; 2 is a flow diagram of a second embodiment of a component mounting method according to an embodiment of the present invention; FIG. 3 is a flow diagram of a third embodiment of a component mounting method according to an embodiment of the present invention. FIG. 3 is a flow diagram of a third embodiment of a component mounting method according to an embodiment of the present invention. FIG. 4 is a flow chart of a fourth embodiment of a component mounting method according to an embodiment of the present invention. FIG. 4 is a flow chart of a fourth embodiment of a component mounting method according to an embodiment of the present invention.

An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the component mounting system, adhesive application device, component mounting device, etc. In the following, the same reference numerals are used for corresponding elements in all drawings, and duplicated explanations will be omitted. In FIG. 2 and in some parts described below, the X-axis in the board transport direction (left-right direction in FIG. 3) and the Y-axis orthogonal to the board transport direction are shown as two axes that are orthogonal to each other in the horizontal plane (up-down direction in FIG. 3). In FIG. 2 and in some parts described below, the Z-axis (up-down direction in FIG. 4) is shown as the height direction that is orthogonal to the horizontal plane.

First, the configuration of component mounting system 1 will be described with reference to FIG. 1. It is configured by connecting production devices such as adhesive application device M1 and component mounting device M2 in series from upstream (left side of the page) to downstream (right side of the page) in the board transport direction. Each production device is connected to management computer 3 via communication network 2. Component mounting system 1 has the function of processing board B carried into adhesive application device M1 in sequence while transporting the board B, mounting components D on board B, and producing a mounted board. Note that component mounting system 1 is a group of production devices connected via communication network 2, and the production devices do not need to be physically connected to each other.

In FIG. 1, adhesive application device M1 applies adhesive under preset application conditions to mounting position P or near mounting position P set on the top surface of board B brought in from upstream by the adhesive application work unit. In other words, adhesive application device M1 is an adhesive application means that applies adhesive under predetermined application conditions to mounting position P on the top surface of board B. Component mounting device M2 performs component mounting work to mount component D at mounting position P on board B to which adhesive has been applied by the component mounting work unit.

Now, referring to FIG. 2, an example of component D mounted on board B will be described. Component D has an LED section Db and multiple electrodes Dc formed on the upper surface of main body Da. An LED chip is attached to LED section Db. The multiple electrodes Dc are connected to the LED chip of LED section Db. The LED section Db emits light when a predetermined voltage and current are supplied from the multiple electrodes Dc. The upper surface of LED section Db is located at the highest position in component D, and the upper surface of LED section Db is defined as the upper surface De of component D. The lower surface of main body Da is located at the lowest position in component D, and the lower surface of main body Da is defined as the lower surface Dd of component D. The difference between the upper surface De and the lower surface Dd of component D is defined as the component thickness Td of component D.

Next, the configuration of the component mounting device M2 will be described with reference to Figures 3 and 4. Figure 4 shows a schematic diagram of a part of the component mounting device M2 including the mounting head in Figure 3. The component mounting device M2 has a function of performing a component mounting operation to mount the component D supplied from the component supply unit onto the board B. The component mounting device M2 also has a function of applying adhesive to the board B. In other words, the component mounting device M2 can apply adhesive to the board B and mount the component D without being connected to the adhesive application device M1.

In FIG. 3, a board transport mechanism 5 is arranged along the X-axis in the center of the base 4. The board transport mechanism 5 transports the board B transported from upstream to the mounting work position, positions it, and holds it. The board transport mechanism 5 also transports the board B downstream after component mounting work has been completed. A component supply unit 6 is arranged on one side of the board transport mechanism 5 (the front side in the Y-axis direction). The component supply unit 6 has multiple tape feeders 7 and tray feeders 8 attached in parallel along the X-axis.

The tape feeder 7 feeds the component tape, which has pockets for storing the components D, in a pitch direction (tape feed direction) from the outside of the component supply unit 6 toward the board transport mechanism 5, to the component supply position from which the components D are picked up by the mounting head described below. The tray feeder 8 moves the pallet 9, which holds the trays 10 that store a number of components D in an array, to the component supply position, and supplies the components D on the trays 10.

In FIG. 3, a Y-axis table 11 equipped with a linear drive mechanism is arranged along the Y-axis at both ends in the X-axis direction on the top surface of the base 4. A front beam 12A and a rear beam 12B, which also have linear drive mechanisms, are connected to the Y-axis table 11 so as to be movable along the Y-axis. The front beam 12A and the rear beam 12B are arranged along the X-axis. A front plate 12Aa is attached to the front beam 12A so as to be movable along the X-axis. A mounting head 13 is attached to the front plate 12Aa.

In Figures 3 and 4, the mounting head 13 has multiple (four in this example) suction units 14. A nozzle 13a is attached to the lower end of the shaft of each suction unit 14. The nozzle 13a suctions and holds the component D on the suction surface 13b. Each suction unit 14 has the function of raising and lowering the shaft in the vertical direction (Z-axis direction) (arrow a) and rotating the nozzle 13a by θ around the Z-axis.

Each suction unit 14 is also equipped with an encoder 14a that detects the height of the shaft. The nozzle height Hn of the nozzle 13a is detected from the output of the encoder 14a. In this way, the suction unit 14 rotates the nozzle 13a to a predetermined rotation angle θ, lowers the nozzle 13a in the Z-axis direction according to preset mounting conditions, and mounts the component D held by the nozzle 13a at the mounting position P on the board B.

In FIG. 3, a rear plate 12Ba is attached to the rear beam 12B so as to be movable along the X-axis. A coating head 16 is attached to the rear plate 12Ba. The coating head 16 is equipped with a dispenser 17 that applies adhesive C to the upper surface of the substrate B according to preset coating conditions (see FIG. 7).

In FIG. 3, the Y-axis table 11 and the front beam 12A constitute a mounting head moving mechanism 15A that moves the mounting head 13 in the X-axis and Y-axis directions. The mounting head moving mechanism 15A and the mounting head 13 perform a mounting turn in which the nozzle 13a picks up and picks up the component D from the tape feeder 7 or tray feeder 8 arranged in the component supply unit 6, and mounts it at the mounting position P of the board B positioned by the board transport mechanism 5.

The Y-axis table 11 and rear beam 12B constitute a coating head moving mechanism 15B that moves the coating head 16 in the X-axis and Y-axis directions. The coating head moving mechanism 15B and the coating head 16 perform an adhesive coating operation to apply adhesive C to the mounting position P or near the mounting position P of the substrate B positioned by the substrate transport mechanism 5.

In Figures 3 and 4, a head camera 19 is attached to the front plate 12Aa to which the mounting head 13 is attached. The head camera 19 moves integrally with the mounting head 13. As the mounting head 13 moves, the head camera 19 moves above the board B positioned by the board transport mechanism 5, and captures an image of a board mark (not shown) provided on the board B. The position of the board B is recognized from the image capture result.

A component recognition camera 20 is disposed between the component supply unit 6 and the board transport mechanism 5. When the mounting head 13, which has picked up a component D from the component supply unit 6, moves above the component recognition camera 20, the component recognition camera 20 captures an image of the component D held by the mounting head 13 (see FIG. 8). From the captured image, the holding posture of the component D is recognized. When the mounting head 13 mounts a component on the board B, the mounting position is corrected taking into account the recognition result of the component D by the component recognition camera 20 and the recognition result of the board position by the head camera 19.

In Figures 3 and 4, a height sensor 18 (distance sensor) such as a laser displacement sensor that moves integrally with the mounting head 13 by the mounting head moving mechanism 15A is installed on one side of the mounting head 13. The height sensor 18 includes a laser light source that projects laser light downward, and a light receiving element that receives the reflected light of the laser light projected by the laser light source. The height sensor 18 is controlled by the height sensor measurement processing unit 41 (see Figure 5), and projects and receives laser light to derive the distance to the measurement target using the principle of triangulation. The height sensor 18 measures the distance to the top surface Ba of the substrate B while the substrate B is held by the substrate transport mechanism 5, and measures the substrate height Hb.

In FIG. 3, a touch panel I operated by an operator is installed at the position where the operator works on the component mounting device M2. The touch panel I displays various information such as error information on its display unit, and the operator inputs data and operates the component mounting device M2 using operation buttons displayed on the display unit.

Next, the detailed configuration of the board transport mechanism 5 will be described with reference to Figures 3 and 4. In the board transport mechanism 5, a pair of transport conveyors 24 are installed inside a pair of plate-like members 23 extending in the X-axis direction. The transport conveyor 24 supports both ends of the board B from below and transports it in the X-axis direction by a transport belt driven by a motor (not shown). A pressure plate 21 that protrudes above the transport conveyor 24 is installed on the upper ends of the pair of plate-like members 23. The distance between the lower surface of the pressure plate 21 and the upper surface of the transport conveyor 24 is wider than the thickness of the board B transported by the transport conveyor 24.

Below the board B being transported to the mounting work position, a lower support member 22 that is raised and lowered by a cylinder 25 (arrow b) is installed. The board transport mechanism 5 positions the board B at the mounting work position, raises the lower support member 22 to lift the board B from the transport conveyor 24, and holds the board B at the mounting work position by pressing down both edges of the board B from above with the lower surface of the pressure plate 21 (state shown in Figure 4). When transporting the board B, the board transport mechanism 5 lowers the lower support member 22 to a position where it does not interfere with the underside of the board B, releasing the board B.

Next, the configuration of the component recognition camera 20 will be described with reference to FIG. 8. A transparent plate 27 is installed on the upper part of the housing 26 of the component recognition camera 20 by cutting out a part of the housing 26. A central camera unit 29, a left camera unit 28L, and a right camera unit 28R are installed inside the housing 26. The central camera unit 29, the left camera unit 28L, and the right camera unit 28R are positioned so that they can capture an image of the underside Dd of the component D held by the nozzle 13a located at the imaging height He.

The central camera unit 29 is installed with its optical axis 29a facing upward, and images the target component D from below. The left camera unit 28L is disposed on the left side of the central camera unit 29 in the X-axis direction (upstream in the board transport direction). The left camera unit 28L is disposed with its optical axis 28La facing upward and to the right, and images the target component D from the lower left. The right camera unit 28R is disposed on the right side of the central camera unit 29 in the X-axis direction (downstream in the board transport direction). The right camera unit 28R is disposed with its optical axis 28Ra facing upward and to the left, and images the target component D from the lower right.

The optical axis 28La of the left camera unit 28L and the optical axis 28Ra of the right camera unit 28R are set to intersect in a range including the imaging height He at which the bottom surface Dd of the part D held in the nozzle 13a is located. The imaging height He at which the bottom surface Dd of the part D is located is detected from the parallax between the image of the part D captured by the left camera unit 28L and the image of the part D captured by the right camera unit 28R. In other words, the left camera unit 28L and the right camera unit 28R form a stereo camera that detects the imaging height He of the part D held in the nozzle 13a.

Next, the configuration of the control system of the component mounting device M2 will be described with reference to Figure 5. The control device 30 of the component mounting device M2 is connected to the board transport mechanism 5, tape feeder 7, tray feeder 8, mounting head 13, mounting head moving mechanism 15A, application head 16, application head moving mechanism 15B, height sensor 18, head camera 19, component recognition camera 20, and touch panel I. The control device 30 is equipped with a memory unit 31, a nozzle height measurement processing unit 40, a height sensor measurement processing unit 41, an adhesive application processing unit 42, a component thickness measurement processing unit 43, a mounting control unit 44, an adhesive thickness calculation unit 45, and a condition change unit 46.

The memory unit 31 is a storage device, and stores production data 32, component data 33, adhesive data 34, application condition data 35, mounting condition data 36, board height data 37, component thickness data 38, component height data 39, etc. The production data 32 stores, for each mounting position P where the component D is mounted on the board B, the mounting order of the component D, the component mounting coordinates (X coordinate, Y coordinate, component direction), the component name (type) of the component D, the type and size (length) of the nozzle 13a that picks up the component D, etc. The component data 33 stores, for each component name of the component D, the size and shape of the component D, the normal pickup target position of the nozzle 13a on the component D, and the offset value between the pickup target position and the component mounting coordinates, etc.

In FIG. 5, the adhesive data 34 stores the target value and allowable range of the adhesive thickness Tc (see FIG. 10(a)) of the adhesive C between the upper surface Ba of the board B and the lower surface Dd of the component D mounted on the board B. The application condition data 35 stores control parameters related to the amount of adhesive C applied by the application head 16 to the board B, such as the discharge speed at which the dispenser 17 discharges the adhesive C, the movement speed of the application head 16 applying the adhesive C, and the application area of the adhesive C. The mounting condition data 36 stores control parameters for mounting the component D on the board B, such as the pressure time for which the nozzle 13a presses the component D against the board B and the mounting load.

The nozzle height measurement processing unit 40 measures the height (nozzle height Hn) of the suction surface 13b of the nozzle 13a based on the output signal of the encoder 14a of the suction unit 14 provided in the mounting head 13 and the size (length) of the nozzle 13a attached to the suction unit 14 (Figures 4 and 9 (a)). In other words, the mounting head 13 and the nozzle height measurement processing unit 40 constitute a nozzle height measurement means 47 that measures the height (nozzle height Hn) of the suction surface 13b of the nozzle 13a.

In FIG. 5, the height sensor measurement processing unit 41 controls the mounting head moving mechanism 15A to move the height sensor 18 above a predetermined measurement position, and based on the output signal of the height sensor 18, measures the height of the top surface Ba of the board B located below the height sensor 18 (board height Hb) (FIG. 6(a)) and the height of the top surface De of the component D mounted on the board B (component height Hd) (FIG. 10(a)). In this way, the mounting head moving mechanism 15A, the height sensor 18, and the height sensor measurement processing unit 41 constitute a height sensor measurement means 48 that measures the height of a predetermined measurement position.

That is, the height sensor measurement means 48 is a board height measurement means that measures the board height Hb at the mounting position P on the top surface Ba of the board B (FIG. 6(a)), and is also a component height measurement means that measures the component height Hd on the top surface De of the component D mounted on the board B (FIG. 10(a)). In other words, the board height measurement means and the component height measurement means measure the board height Hb and the component height Hd using the same height measurement unit (height sensor 18). The measured board height Hb is stored in the memory unit 31 as board height data 37. In addition, the measured component height Hd is stored in the memory unit 31 as component height data 39.

In FIG. 5, the adhesive application processing unit 42 controls the application head moving mechanism 15B and the application head 16 based on the application conditions included in the application condition data 35 to apply the adhesive C discharged by the dispenser 17 to the upper surface Ba of the substrate B. In other words, the application head moving mechanism 15B, the application head 16, and the adhesive application processing unit 42 constitute an adhesive application means 49 that applies the adhesive C under predetermined application conditions to the mounting position P on the upper surface Ba of the substrate B or in the vicinity of the mounting position P.

In FIG. 5, the component thickness measurement processing unit 43 detects the height (imaged height He) of the bottom surface Dd of the component D held by the nozzle 13a based on the images captured by the left camera unit 28L and right camera unit 28R (stereo camera) of the component recognition camera 20 (FIG. 8). Furthermore, the component thickness measurement processing unit 43 calculates the component thickness Td of the component D from the difference between the nozzle height Hn detected by the nozzle height measurement means 47 and the imaged height He. In other words, the component recognition camera 20 and the component thickness measurement processing unit 43 constitute a component thickness measurement means 50 that measures the component thickness Td of the component D held by the nozzle 13a.

The measured component thickness Td is stored in the memory unit 31 as component thickness data 38. The memory unit 31 may store the component thickness Td measured before the component D is stored on the component tape or tray 10 as the component thickness data 38. The memory unit 31 may store the catalog value of the component thickness Td of the component D as the component thickness data 38. The component thickness measurement means 50 may be equipped with a camera that captures an image of the component D from the side, and may be configured to calculate the component thickness Td from the image captured by the camera.

In FIG. 5, the mounting control unit 44 controls the suction unit 14 of the mounting head 13 and the mounting head moving mechanism 15A based on the mounting conditions included in the production data 32 and the mounting condition data 36, causes the nozzle 13a to pick up the component D from the component supply unit 6, moves the nozzle 13a to above the board B on which the adhesive C has been applied, and lowers the nozzle 13a holding the component D to mount the component D at the mounting position P (FIG. 9). When mounting the component D on the board B, the mounting control unit 44 causes the nozzle 13a to press the component D against the board B for a pressing time with the mounting load F specified in the mounting conditions. In the process of pressing the component D against the board B, the adhesive C applied to the board B is crushed and spreads sideways, resulting in a predetermined adhesive thickness Tc.

The adhesive thickness calculation unit 45 calculates the adhesive thickness Tc of the adhesive C between the board B and the component D based on the board height Hb of the mounting position P where the component D is mounted, which is included in the board height data 37, the component thickness Td, which is included in the component thickness data 38, and the component height Hd of the component D mounted on the board B, which is included in the component height data 39. That is, the board height measurement means (height sensor measurement means 48), the component thickness measurement means 50, and the component height measurement means (height sensor measurement means 48) constitute the adhesive thickness detection means 51.

The component height Hd may be determined by lowering the nozzle 13a to contact the top surface De of the component D mounted on the board B, and using the nozzle height Hn measured by the nozzle height measuring means 47 at this time as the component height Hd. In this case, the nozzle height measuring means 47, which measures the component height Hd based on the height (nozzle height Hn) of the suction surface 13b of the nozzle 13a contacting the top surface De of the component D, serves as the component height measuring means.

In FIG. 5, the adhesive thickness detection means 51 calculates the adhesive thickness Tc based on the measured component height Hd, the measured board height Hb, the measured component thickness Td, or the catalog value of the component thickness Td. The adhesive thickness detection means 51 may be configured to include a camera that captures an image of the component D mounted on the board B from an oblique side, and detect the component thickness Td from the length of the gap between the upper surface Ba of the board B and the lower surface Dd of the component D in the image captured by the camera. The component mounting system 1 may also be configured to include a component height measurement means in a mounting inspection device (not shown) downstream of the component mounting device M2, and the adhesive thickness detection means 51 may calculate the adhesive thickness Tc based on the component height Hd calculated by the mounting inspection device.

The adhesive thickness detection means 51 may detect the adhesive thickness Tc every time a component D is attached to the board B, or may detect the adhesive thickness Tc every predetermined time (e.g., every 5 minutes, every time 10 components D are attached). Furthermore, the adhesive thickness detection means 51 may increase the detection interval when the fluctuation in the detected adhesive thickness Tc becomes small.

In FIG. 5, when the detected adhesive thickness Tc exceeds the allowable range (predetermined range) included in the adhesive data 34, the condition change unit 46 changes at least one of the application conditions in the application condition data 35 and the mounting conditions in the mounting condition data 36. For example, the condition change unit 46 changes a control parameter related to the amount of adhesive C applied to the board B among the application conditions, thereby updating the application condition data 35. The condition change unit 46 also changes at least one of the control parameters related to the mounting load and the pressing time for which the nozzle 13a presses the component D against the board B when mounting the component D on the board B, among the mounting conditions, thereby updating the mounting condition data 36.

Next, a first embodiment of a component mounting method in which a component D is sucked by a nozzle 13a and mounted on a board B will be described with reference to the flow chart in FIG. 11. The first embodiment is performed by a component mounting system 1 including an adhesive application device M1 (adhesive application means) and a component mounting device M2 shown in FIG. 1. First, the adhesive application device M1 applies adhesive C to the mounting position P or the vicinity of the mounting position P on the upper surface Ba of the board B that has been brought in from upstream under predetermined application conditions (ST1: first adhesive application process) (FIG. 7). Next, the board transport mechanism 5 of the component mounting device M2 brings the board B to which adhesive C has been applied to the mounting work position (ST2: board carrying process), raises the lower support member 22 to hold the board B by sandwiching it with the pressing plate 21 (ST3: board holding process).

Then, the board height measuring means (height sensor measuring means 48) uses the height sensor 18 to measure the board height Hb at the mounting position P on the top surface Ba of the board B (ST4: board height measuring process) (Figure 6). Next, the nozzle 13a holds the component D supplied to the component supply unit 6 (ST5: component holding process). Next, the component thickness measuring means 50 uses the stereo camera (component recognition camera 20) to measure the component thickness Td of the component D held by the nozzle 13a (ST6: component thickness measuring process) (Figure 8). Next, the nozzle 13a holding the component D moves above the board B where the adhesive C has been applied to the mounting position P on the top surface Ba (ST7: nozzle moving process).

In FIG. 11, the mounting control unit 44 then lowers the nozzle 13a holding the component D to mount the component D at the mounting position P under predetermined mounting conditions (ST8: component mounting process) (FIG. 9). Next, the component height measurement means (height sensor measurement means 48) measures the component height Hd of the component D mounted on the board B (FIG. 10), and the adhesive thickness detection means 51 detects (calculates) the adhesive thickness Tc of the adhesive C between the upper surface Ba of the board B and the lower surface Dd of the component D mounted on the board B based on the board height Hb, the component thickness Td, and the component height Hd (ST9: adhesive thickness detection process).

The condition change unit 46 then determines whether the adhesive thickness Tc is within the allowable range (predetermined range) (ST10: allowable range determination process). If the adhesive thickness Tc exceeds the allowable range (No in ST10), the condition change unit 46 changes at least one of the application conditions and the attachment conditions based on the adhesive thickness Tc (ST11: condition change process). If the adhesive thickness Tc is within the allowable range (Yes in ST10), the condition change unit 46 does not change either the application conditions or the attachment conditions.

Then, the board height measurement process (ST4) through the condition change process (ST11) are repeatedly executed until all components D have been mounted on board B (No in ST12). When all components D have been mounted on board B (Yes in ST12), the board transport mechanism 5 releases board B (ST13: board release process) and transports board B with components D mounted downstream (ST14: board transport process). This allows the adhesive thickness Tc of the adhesive C between board B and components D to be properly managed.

In the above description, the board height measurement process (ST4) is performed each time a component D is mounted, but the board heights Hb of all mounting positions P on the board B are measured in the board height measurement process (ST4), and then the component holding process (ST5) through the condition change process (ST11) may be repeated.

As described above, the component mounting system 1 of this embodiment includes an adhesive application means (adhesive application device M1) that applies adhesive C to the mounting position P on the upper surface Ba of the board B under predetermined application conditions, a mounting head 13 that has a nozzle 13a that holds a component D and moves above the board B and lowers the nozzle 13a holding the component D to mount the component D at the mounting position P under predetermined mounting conditions, an adhesive thickness detection means 51 that detects the adhesive thickness Tc of the adhesive C between the upper surface Ba of the board B and the lower surface Dd of the component D mounted on the board B, and a condition change unit 46 that changes at least one of the application conditions and the mounting conditions based on the adhesive thickness Tc. This allows the adhesive thickness Tc of the adhesive C between the board B and the component D to be appropriately managed.

Next, following the flow of FIG. 12 and with reference to the drawing, a second embodiment of the component mounting method in which component D is attracted by nozzle 13a and mounted on board B will be described. The second embodiment differs from the first embodiment in that, instead of adhesive application device M1, adhesive application means 49 of component mounting device M2 applies adhesive C to board B. In other words, the second embodiment is performed by component mounting device M2 alone. Below, the same steps as in the first embodiment are given the same reference numerals, and detailed explanations will be omitted.

First, the board loading step (ST2), the board holding step (ST3), and the board height measurement step (ST4) are performed. Next, the adhesive application means 49 applies the adhesive C discharged from the dispenser 17 to the mounting position P or the vicinity of the mounting position P on the upper surface Ba of the board B under a predetermined application condition (ST21: second adhesive application step) (FIG. 7). Next, the component holding step (ST5) to the condition change step (ST11) are performed. Next, the board height measurement step (ST4) to the condition change step (ST11) are repeatedly performed until all the components D are mounted on the board B (No in ST12). When all the components D are mounted on the board B (Yes in ST12), the board release step (ST13) and the board removal step (ST14) are performed. This allows the adhesive thickness Tc of the adhesive C between the board B and the components D to be appropriately managed.

In the above description, the board height measurement process (ST4) and the second adhesive application process (ST21) are performed each time a component D is mounted. However, the board height Hb of all mounting positions P on the board B may be measured in the board height measurement process (ST4), adhesive C may be applied to all mounting positions P or in the vicinity of mounting positions P in the second adhesive application process (ST21), and then the component holding process (ST5) through the condition change process (ST11) may be repeated.

As described above, the component mounting device M2 of this embodiment is equipped with a mounting head 13 that has a nozzle for holding a component, moves above the board B on which adhesive C has been applied to the mounting position P on the top surface Ba, and lowers the nozzle 13a holding the component D to mount the component D at the mounting position P under predetermined mounting conditions, an adhesive thickness detection means 51 that detects the adhesive thickness Tc of the adhesive C between the top surface Ba of the board B and the bottom surface Dd of the component D mounted on the board B, and a condition change unit 46 that changes the mounting conditions based on the adhesive thickness Tc. This allows the adhesive thickness Tc of the adhesive C between the board B and the component D to be appropriately managed.

Next, a third embodiment of the component mounting method in which component D is picked up by nozzle 13a and mounted on board B will be described with reference to the drawings, following the flow in Figures 13 and 14. The third embodiment differs from the second embodiment in that if the nozzle 13a does not press component D against board B for an insufficient amount of time, component D is additionally pressed against board B. Below, the same steps as in the first and second embodiments are given the same reference numerals, and detailed descriptions will be omitted.

In FIG. 13, first, the board loading process (ST2) and then the nozzle movement process (ST7) are performed. At this point, the nozzle 13a holding the component D has moved above the mounting position P of the board B on which the adhesive C has been applied.

In FIG. 14, the mounting control unit 44 then lowers the nozzle 13a holding the component D, and presses the component D against the board B for a predetermined pressing time (ST22: component pressing process) (FIG. 9). Next, an adhesive thickness detection process (ST9) is executed, and the mounting control unit 44 judges whether the adhesive thickness Tc has reached the target value of the adhesive thickness Tc included in the adhesive data 34 (ST23: adhesive thickness judgment process). If the adhesive thickness Tc has not reached the target value (No in ST23), the mounting control unit 44 lowers the nozzle 13a, and presses the component D mounted on the board B against the board B for a predetermined additional pressing time (ST24: additional component pressing process) (FIG. 9).

Then, the adhesive thickness detection process (ST9) is executed, and the mounting control unit 44 judges whether the adhesive thickness Tc has reached the target value of the adhesive thickness Tc (ST25: adhesive thickness addition judgment process). If the adhesive thickness Tc has not reached the target value (No in ST25), the component addition pressing process (ST24) is executed again. If the adhesive thickness Tc reaches the target value (Yes in ST25), the condition change process (ST11) is executed. If the adhesive thickness Tc has reached the target value during the pressing time of the component pressing process (ST22) (Yes in ST23), the condition change process (ST11) is not executed.

In FIG. 14, the board height measurement process (ST4) through the condition change process (ST11) are then repeatedly executed until all components D have been mounted on board B (No in ST12). When all components D have been mounted on board B (Yes in ST12), the board release process (ST13) and board removal process (ST14) are executed. This allows the adhesive thickness Tc of the adhesive C between board B and components D to be appropriately managed.

As described above, in the third embodiment of the component mounting method of this embodiment, after the nozzle 13a presses the component D against the board B for a predetermined pressing time (after ST22), if the adhesive thickness Tc detected by the adhesive thickness detection means 51 does not reach the target value (predetermined thickness) (No in ST23), the nozzle 13a further presses the component D against the board B for a predetermined additional pressing time (ST24). Then, when the adhesive thickness Tc reaches the target value (Yes in ST25), the condition change unit 46 changes at least one of the application conditions and the mounting conditions (ST11). Specifically, the condition change unit 46 changes the target value of the pressing time of the mounting conditions to the time to which the additional pressing time is added. This allows the adhesive thickness Tc of the adhesive C between the board B and the component D to be appropriately managed.

Next, a fourth embodiment of the component mounting method in which component D is picked up by nozzle 13a and mounted on board B will be described with reference to the drawings, following the flow in Figures 15 and 16. The fourth embodiment differs from the second embodiment in that the adhesive thickness Tc is calculated while nozzle 13a is pressing component D against board B. Below, the same steps as in the first and second embodiments are given the same reference numerals, and detailed descriptions will be omitted.

In FIG. 15, first, the board loading process (ST2) and then the nozzle movement process (ST7) are executed. At this point, the nozzle 13a holding the component D has moved above the mounting position P of the board B on which the adhesive C has been applied.

In FIG. 16, the mounting control unit 44 then starts the descent of the nozzle 13a holding the component D toward the mounting position P (ST31: nozzle descent start process). Next, the nozzle height measurement means 47 measures the height (nozzle height Hn) of the suction surface 13b of the nozzle 13a (ST32: nozzle height measurement process) (FIG. 9). Next, the adhesive thickness calculation unit 45 calculates the adhesive thickness Tc based on the nozzle height Hn, board height Hb, and component thickness Td (ST33: adhesive thickness calculation process).

Then, the mounting control unit 44 judges whether the calculated adhesive thickness Tc reaches the target value of the adhesive thickness Tc included in the adhesive data 34 (ST34: adhesive thickness judgment process). If the target value of the adhesive thickness Tc has not been reached (No in ST34), the mounting control unit 44 judges whether a preset pressing time has elapsed (ST35: pressing time elapse judgment process). If the pressing time has not elapsed (No in ST35), the nozzle 13a continues to press down the component D, and the nozzle height measurement process (ST32) is executed.

In FIG. 16, when the pressing time has elapsed (Yes in ST35), the mounting control unit 44 causes the touch panel I to notify an error (ST36: error notification process). That is, the touch panel I and the mounting control unit 44 constitute a notification means that notifies an error when the nozzle 13a presses the component D against the board B for a preset pressing time but does not reach the set adhesive thickness Tc (Yes in ST35).

When the adhesive thickness Tc reaches the target value (Yes in ST34), the mounting control unit 44 raises the nozzle 13a (ST37: nozzle raising process). In this way, the period from the nozzle lowering start process (ST31) to the start of the nozzle raising process (ST37) is the component pressing process (ST38) in which the nozzle 13a holding the component D is lowered and the component D is pressed against the mounting position P. The nozzle height measurement process (ST32) is then executed during the component pressing process (ST38).

In Figures 15 and 16, the board height measurement process (ST4) through the nozzle lift process (ST37) are then repeatedly executed until all components D have been mounted on board B (No in ST12). Once all components D have been mounted on board B (Yes in ST12), the board release process (ST13) and board removal process (ST14) are executed. This allows the adhesive thickness Tc of the adhesive C between board B and components D to be appropriately managed.

As described above, the fourth embodiment of the component mounting method of this embodiment, in which component D is sucked by nozzle 13a and mounted on board B, includes a board height measurement process (ST4) for measuring the board height Hb at mounting position P on the upper surface Ba of board B, a component holding process (ST5) for holding component D with nozzle 13a, a nozzle movement process (ST7) for moving nozzle 13a holding component D to above mounting position P or board B on which adhesive C has been applied near mounting position P, a component pressing process (ST38) for lowering nozzle 13a holding component D and pressing component D against mounting position P, and a nozzle height measurement process (ST32) for measuring the height (nozzle height Hn) of suction surface 13b of nozzle 13a during the component pressing process (ST38).

Then, in the component pressing process (ST38), when the height of the suction surface 13b of the nozzle 13a (nozzle height Hn) reaches the measured board height Hb plus the component thickness Td of component D and the preset adhesive thickness Tc of adhesive C (Yes in ST34), the component pressing process (ST38) is terminated.

The component mounting device M2 (component mounting system 1) of this embodiment also includes a board height measuring means (height sensor measuring means 48) that measures the board height Hb at the mounting position P on the upper surface Ba of the board B, a mounting head 13 that has a nozzle 13a that holds a component D and moves above the board B where adhesive C has been applied at or near the mounting position P, and lowers the nozzle 13a holding the component D to mount the component D at the mounting position P under predetermined mounting conditions, and a nozzle height measuring means 47 that detects the height (nozzle height Hn) of the suction surface 13b of the nozzle 13a.

Then, when the height (nozzle height Hn) of the suction surface 13b of the nozzle 13a pressing the component D against the board B reaches the height obtained by adding the measured board height Hb, the component thickness Td of the component D, and the preset adhesive thickness Tc of the adhesive C, the mounting head 13 stops the descent of the nozzle 13a. This allows the adhesive thickness Tc of the adhesive C between the board B and the component D to be appropriately managed.

The component mounting system, component mounting device, and component mounting method of the present invention have the effect of being able to properly manage the thickness of the adhesive between the board and the component, and are useful in the field of mounting components to boards.

REFERENCE SIGNS LIST 1 Component mounting system 13 Mounting head 13a Nozzle 13b Suction surface 18 Height sensor (height measurement unit)
47 Nozzle height measuring means (part height measuring means)
48 Height sensor measuring means (substrate height measuring means, component height measuring means)
49 Adhesive application means 50 Component thickness measurement means 51 Adhesive thickness detection means B Board Ba Top surface C Adhesive D Component Dd Bottom surface De Top surface Hb Board height Hd Component height Hn Nozzle height (height of suction surface)
M1 Adhesive application device (adhesive application means)
M2 Component mounting device P Mounting position Tc Adhesive thickness Td Component thickness

Claims (12)

A component mounting system that picks up components with a nozzle and mounts them on a substrate,
an adhesive application means for applying an adhesive under predetermined application conditions to a mounting position on an upper surface of the substrate;
a mounting head having a nozzle for holding a component, moving above the board, and lowering the nozzle holding the component to place the component at the placement position under predetermined placement conditions;
an adhesive thickness detection means for detecting a thickness of the adhesive between the upper surface of the substrate and the lower surface of the component mounted on the substrate;
and a condition changing unit that changes at least one of the application conditions and the mounting conditions based on the adhesive thickness. The component mounting system according to claim 1, wherein the condition change unit changes at least one of the mounting conditions, the pressing time during which the nozzle presses the component against the board when mounting the component on the board, and the mounting load. The component mounting system according to claim 1, wherein the condition change unit changes the amount of the adhesive applied to the substrate among the application conditions. The component mounting system of claim 1, wherein the condition change unit changes at least one of the application conditions and the mounting conditions when the detected adhesive thickness exceeds a predetermined range. The component mounting system according to claim 1, wherein the adhesive thickness detection means detects the adhesive thickness at predetermined time intervals. a substrate height measuring means for measuring a substrate height at a mounting position on an upper surface of the substrate;
a component height measuring means for measuring a component height of an upper surface of the component mounted on the board,
2. The component mounting system according to claim 1, wherein the adhesive thickness detection means calculates the adhesive thickness based on the measured component height, the measured board height, and a component thickness of the component. The component thickness measuring device further includes a component thickness measuring means for measuring the component thickness of the component,
7. The component mounting system according to claim 6, wherein the adhesive thickness detection means calculates the adhesive thickness based on the component thickness measured by the component thickness detection means. The component mounting system according to claim 6 or 7, wherein the board height measuring means and the component height measuring means measure the board height and the component height using the same height measuring unit. The component mounting system according to claim 6 or 7, wherein the component height measuring means measures the component height based on the height of the suction surface of the nozzle that contacts the upper surface of the component. The component mounting system of claim 1, wherein, after the nozzle presses the component against the substrate for a predetermined pressing time, if the adhesive thickness detected by the adhesive thickness detection means does not reach the predetermined thickness, the nozzle further presses the component against the substrate for a predetermined additional pressing time. A component mounting device that picks up components with a nozzle and mounts them on a board,
a mounting head having a nozzle for holding a component, moving above a board having an adhesive applied to an upper surface of the board at a mounting position, and lowering the nozzle holding the component to mount the component at the mounting position under predetermined mounting conditions;
an adhesive thickness detection means for detecting a thickness of the adhesive between the upper surface of the substrate and the lower surface of the component mounted on the substrate;
and a condition changing unit that changes the mounting condition based on the adhesive thickness. A component mounting method for mounting a component on a substrate by suction with a nozzle, comprising the steps of:
a component holding step of holding a component with a nozzle;
a nozzle moving step of moving the nozzle holding the component above a board on whose upper surface an adhesive has been applied at a mounting position;
a component mounting step of lowering the nozzle holding the component and mounting the component at the mounting position under predetermined mounting conditions;
an adhesive thickness detection step of detecting an adhesive thickness of the adhesive between an upper surface of the substrate and a lower surface of the component mounted on the substrate;
and a condition changing step of changing the mounting conditions based on the adhesive thickness.

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