JP7598085B2 - Capacitor, manufacturing method thereof, and capacitor mounting method - Google Patents
Capacitor, manufacturing method thereof, and capacitor mounting method Download PDFInfo
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- JP7598085B2 JP7598085B2 JP2020019994A JP2020019994A JP7598085B2 JP 7598085 B2 JP7598085 B2 JP 7598085B2 JP 2020019994 A JP2020019994 A JP 2020019994A JP 2020019994 A JP2020019994 A JP 2020019994A JP 7598085 B2 JP7598085 B2 JP 7598085B2
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- 239000003990 capacitor Substances 0.000 title claims description 211
- 238000000034 method Methods 0.000 title claims description 23
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 21
- 239000003566 sealing material Substances 0.000 claims description 21
- 238000002788 crimping Methods 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 5
- 239000003792 electrolyte Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
本発明は、回路基板等の配線板に実装されるコンデンサに関し、たとえば、コンデンサの金属製外装ケースを封止する封口部材側に台座が配置されたチップ形電解コンデンおよびその製造方法、コンデンサの実装方法に関する。 The present invention relates to a capacitor mounted on a wiring board such as a circuit board, for example, a chip-type electrolytic capacitor in which a base is arranged on the sealing material side that seals the metal exterior case of the capacitor, and a method for manufacturing the same and a method for mounting the capacitor.
例えば電力変換装置における制御回路を構成する蓄電デバイスを構成するコンデンサの一つとしてチップ型電解コンデンサがある。チップ型電解コンデンサは陽極リード線と陰極リード線とがそれぞれ接続された陽極箔と陰極箔とをその間にセパレータを介在させて巻回することにより構成されたコンデンサ素子を駆動用電解液と共に有底円筒状の金属からなる外装ケース内に収納し、この外装ケースの開放端部を封口部材により封止して外装ケースを加締めることによって構成されたものに、貫通孔を有する絶縁性の台座を装着し、この貫通孔にコンデンサ本体から導出された一対のリード端子を貫通し、かつ台座の下面に沿って折曲げることで、面実装に対応可能としたものがある。また、絶縁板の貫通孔から導出された一対のリード端子を折り曲げずに、回路基板に設けられたスルーホールに貫通し半田リフロー処理によって半田付けする方法もある。 For example, a chip-type electrolytic capacitor is one of the capacitors that make up the power storage device that makes up the control circuit in a power conversion device. A chip-type electrolytic capacitor is constructed by winding an anode foil and a cathode foil, each connected to an anode lead wire and a cathode lead wire, with a separator between them, and storing the capacitor element together with a driving electrolyte in a cylindrical metal exterior case with a bottom, sealing the open end of the exterior case with a sealing member, and crimping the exterior case. An insulating base with through holes is attached to the capacitor, and a pair of lead terminals extending from the capacitor body are passed through the through holes and bent along the underside of the base, making it compatible with surface mounting. There is also a method in which the pair of lead terminals extending from the through holes in the insulating plate are not bent but are passed through through holes provided in a circuit board and soldered by solder reflow processing.
このような絶縁性の台座を備えたチップ型電解コンデンサに関する文献としては、次のような文献が知られている。 The following literature is known regarding chip-type electrolytic capacitors with such insulating bases:
チップ型電解コンデンサは前述したように内部に駆動用電解液を保持しており、半田リフロー処理による高温状態に曝されると駆動用電解液の溶媒が気化して電解コンデンサの内部圧力を上昇させてしまう。そして、内圧上昇に伴い、封口部材が絶縁板側に膨張することで、絶縁板とコンデンサとが離間してしまい半田付けが上手く成されずに回路基板へ接続されると、接続強度の低下を起こし、実使用時に基板から電解コンデンサが脱落するなどの課題がある。
そこで、本発明の目的は上記課題に鑑み、半田リフロー処理における回路基板への実装不良の発生を大幅に低減することのできるコンデンサを提供することを目的とする。
As mentioned above, the chip-type electrolytic capacitor holds the driving electrolyte inside, and when exposed to high temperatures caused by solder reflow processing, the solvent in the driving electrolyte vaporizes, causing the internal pressure of the electrolytic capacitor to increase. As the internal pressure increases, the sealing material expands toward the insulating plate, causing the insulating plate and the capacitor to separate, and if the capacitor is connected to a circuit board without being properly soldered, the connection strength decreases, leading to problems such as the electrolytic capacitor falling off the board during actual use.
SUMMARY OF THE PRESENT DISCLOSURE In view of the above problems, an object of the present invention is to provide a capacitor that can significantly reduce the occurrence of mounting defects on a circuit board during solder reflow processing.
本発明のコンデンサは、コンデンサ素子を収納した有底筒状の外装ケースの開放端を封口部材で封止されており、前記コンデンサ素子より導出されたリード端子が前記封口部材を貫通して成るコンデンサ本体を、前記リード端子が貫通する貫通孔を備えた底面部と前記コンデンサ本体の外周を取り巻くように形成された側壁とを有する台座に収納し、前記側壁の内側面からコンデンサ本体に向かって突出した凸部を備えたコンデンサであって、前記外装ケースの側面を加締めて形成した加締部に前記凸部が配置され、前記加締部と前記凸部との間に隙間部を設けたことを特徴とする。 The capacitor of the present invention is characterized in that the open end of a bottomed cylindrical exterior case housing a capacitor element is sealed with a sealing member, the capacitor body formed by lead terminals extending from the capacitor element penetrating the sealing member is housed in a base having a bottom surface portion with through holes through which the lead terminals pass and a side wall formed to surround the outer periphery of the capacitor body, and the capacitor has a protrusion protruding from the inner surface of the side wall toward the capacitor body, the protrusion being disposed in a crimped portion formed by crimping the side of the exterior case, and a gap is provided between the crimped portion and the protrusion.
本発明のコンデンサは、コンデンサ素子を収納した有底筒状の外装ケースの開放端を封口部材で封止されており、前記コンデンサ素子より導出されたリード端子が前記封口部材を貫通して成るコンデンサ本体を、前記リード端子が貫通する貫通孔を備えた底面部と前記コンデンサ本体の外周を取り巻くように形成された側壁とを有する台座に収納し、前記側壁の内側面からコンデンサ本体に向かって突出した凸部を備えたコンデンサの製造方法であって、前記外装ケースの側面を加締めて形成した加締部に前記加締部と前記凸部との間に隙間部を設けて前記凸部を配置する工程を特徴とする。 The capacitor of the present invention is a method for manufacturing a capacitor in which the open end of a bottomed cylindrical outer case housing a capacitor element is sealed with a sealing member, the capacitor body formed by lead terminals extending from the capacitor element penetrating the sealing member is housed in a base having a bottom surface portion with through holes through which the lead terminals penetrate and a side wall formed to surround the outer periphery of the capacitor body, and the capacitor has a protrusion protruding from the inner surface of the side wall toward the capacitor body, and is characterized by a step of arranging the protrusion in a crimped portion formed by crimping the side of the outer case, with a gap between the crimped portion and the protrusion.
本発明のコンデンサは、コンデンサのリード端子を、回路基板に備えた半田ペーストが充填されたスルーホールに挿入する工程と、前記リード端子と回路基板とを半田リフロー接続する工程と、を含むことを特徴とする。 The capacitor of the present invention is characterized by including a process of inserting the lead terminals of the capacitor into through holes filled with solder paste provided in a circuit board, and a process of connecting the lead terminals to the circuit board by solder reflow.
本発明によれば、次のいずれかの効果が得られる。 The present invention provides one of the following effects:
(１)コンデンサが半田リフロー処理による高温状態に曝されて封口部材が膨張してもコンデンサ本体が台座から離脱することを回避できる。 (1) Even if the capacitor is exposed to high temperatures during solder reflow processing and the sealing material expands, the capacitor body can be prevented from coming off the base.
(２) 半田リフロー処理におけるコンデンサの実装不良の発生を抑制できる。 (2) It is possible to prevent capacitor mounting defects during solder reflow processing.
本実施例のコンデンサは、図１に示すような外観形状を有しており、内部にコンデンサ素子を収納するアルミ製外装ケ－スの開口側を封口する封口部材２６を貫通して導出されたリード端子２２を有するコンデンサ本体４と、リード端子２２が導出されたコンデンサ本体４の封口部材２６側に配置される台座６とから主に構成されている。 The capacitor of this embodiment has an external shape as shown in FIG. 1, and is mainly composed of a capacitor body 4 having lead terminals 22 extending through a sealing member 26 that seals the open side of an aluminum exterior case that houses a capacitor element, and a base 6 that is disposed on the sealing member 26 side of the capacitor body 4 from which the lead terminals 22 extend.
本実施例に用いたコンデンサ本体４は、図１(a)、図１(b)に示すように、有底円筒状のアルミ製外装ケ－ス内部にコンデンサ素子を収納し、その開放端部に封口部材２６を挿着した後、外装ケースにおける外周側面と開口端とを加締めることで加締部１２が形成され、これによってコンデンサ本体４が密封される。この封口部材２６を貫通するようにコンデンサ素子より導出されたリード端子２２が設けられており、封口部材２６の外側に導出されたリード端子２２の端部が、台座６に形成された貫通孔（図示略）に貫通する。封口部材２６は、柔軟性や弾力性を発揮する硬度で形成され、たとえばエチレンプロピレンゴムやブチルゴム、シリコンゴムなどが用いられる。 As shown in Figures 1(a) and 1(b), the capacitor body 4 used in this embodiment is constructed by housing a capacitor element inside a cylindrical aluminum exterior case with a bottom, inserting a sealing member 26 into the open end of the case, and then crimping the outer circumferential side surface of the exterior case to the open end to form a crimped portion 12, thereby sealing the capacitor body 4. Lead terminals 22 are provided extending from the capacitor element so as to penetrate the sealing member 26, and the ends of the lead terminals 22 extending to the outside of the sealing member 26 penetrate through through holes (not shown) formed in the base 6. The sealing member 26 is formed with a hardness that provides flexibility and elasticity, and for example, ethylene propylene rubber, butyl rubber, silicone rubber, etc. are used.
コンデンサ素子には、アルミニウム等の弁金属からなる陽極箔と陰極箔との間にセパレータを介在させて、巻回して形成され、電解液が含浸されたものや、電解質としてポチエチレンジオキシチオフェン等の導電性高分子を用いたものや、導電性高分子を含浸したコンデンサ素子に電解液を含浸させるハイブリッドタイプとしてもよい。 The capacitor element may be formed by winding an anode foil and a cathode foil made of a valve metal such as aluminum with a separator between them, and may be impregnated with an electrolyte, may use a conductive polymer such as polyethylenedioxythiophene as the electrolyte, or may be a hybrid type in which a capacitor element impregnated with a conductive polymer is impregnated with an electrolyte.
コンデンサ本体４の封口部材２６側に配置される台座６は、図１(a)、図１(b)に示すように、所定厚みの電気絶縁性を有する樹脂製とされ、コンデンサ本体４の封口部材２６側が当接する底面部２０とコンデンサ本体４の外周側面を取り巻くようにして上方に延びる側壁８が形成されている。この台座６は上面視略方形で、かつその隣り合う１組の角に切欠き１０が形成されている。このように、台座６の上面視形状を略方形に形成することは、得られるコンデンサの基板への実装面積を小さくできることから好ましいが、本発明はこれに限定されるものではなく、上面視多角形状のものや上面視円形状としても良く、これら台座６の形状は適宜選択すれば良い。また、台座６の側壁８に切欠き１０を形成すると、コンデンサを基板へ実装する際に、リード端子２２の極性が目視にて容易に判別できることから好ましいが、これら切欠き１０等を設けずとも良い。 The base 6 arranged on the sealing member 26 side of the capacitor body 4 is made of a resin having a predetermined thickness of electrical insulation, as shown in Fig. 1(a) and Fig. 1(b), and has a bottom surface 20 against which the sealing member 26 side of the capacitor body 4 abuts, and a side wall 8 extending upward so as to surround the outer peripheral side surface of the capacitor body 4. This base 6 is approximately square when viewed from above, and notches 10 are formed at a pair of adjacent corners. In this way, forming the shape of the base 6 in an approximately square shape when viewed from above is preferable because it is possible to reduce the mounting area of the resulting capacitor on the board, but the present invention is not limited to this, and the base 6 may be polygonal or circular when viewed from above, and the shape of these bases 6 may be selected appropriately. In addition, forming the notches 10 in the side walls 8 of the base 6 is preferable because it is easy to visually distinguish the polarity of the lead terminals 22 when mounting the capacitor on the board, but these notches 10, etc. may not be provided.
また本実施例では、台座６の側壁８を分断する分断部１４が形成されており、側壁８の内面とコンデンサ本体４の外周側面との間隙に、分断部１４から外気が効率良く流入するようになるため、側壁８による放熱効果の低下を極力抑えることができることから好ましいが、本発明はこれに限定されるものではなく、特に形成されていなくても良い。 In addition, in this embodiment, a dividing portion 14 is formed that divides the side wall 8 of the base 6, and since outside air efficiently flows into the gap between the inner surface of the side wall 8 and the outer peripheral side surface of the capacitor body 4 from the dividing portion 14, this is preferable because it minimizes the reduction in the heat dissipation effect caused by the side wall 8, but the present invention is not limited to this, and it does not necessarily have to be formed.
図２、図３に示すように、コンデンサのケース側面を取り巻くように形成された台座６の側壁８の内側面にはコンデンサ本体４側に突出し、外装ケースの加締部１２内に配置される凸部１６が設けられている。 As shown in Figures 2 and 3, the inner surface of the side wall 8 of the base 6, which is formed to surround the side of the capacitor case, is provided with a protrusion 16 that protrudes toward the capacitor body 4 and is positioned within the crimped portion 12 of the exterior case.
図1(b)に示すように、凸部１６が設けられた台座６にコンデンサ本体４を収納すると、凸部１６は外装ケースの側面を加締めて形成した加締部１２内に配置され、加締部１２と凸部１６との間には隙間部３４が設けられている。この隙間部３４は、コンデンサ本体４の軸方向における凸部１６の上下と加締部１２との間の少なくとも一方に設けられ、図５(b)に示すように、この実施例のコンデンサ２では加締部１２と凸部１６との間に凸部１
６の上側に隙間部３４aと凸部１６の下側に隙間部３４bが設けられており、コンデンサ本体４が、隙間部３４を介してコンデンサ本体４の軸方向に可動可能に台座６に収納される。
As shown in Fig. 1(b), when the capacitor body 4 is stored on the seat 6 provided with the protrusion 16, the protrusion 16 is disposed within the crimped portion 12 formed by crimping the side surface of the exterior case, and a gap 34 is provided between the crimped portion 12 and the protrusion 16. This gap 34 is provided at least on one side between the crimped portion 12 and above or below the protrusion 16 in the axial direction of the capacitor body 4, and as shown in Fig. 5(b), in the capacitor 2 of this embodiment, the protrusion 16 is disposed between the crimped portion 12 and the protrusion 16.
A gap 34 a is provided above the protruding portion 16 and a gap 34 b is provided below the protruding portion 16 , and the capacitor body 4 is housed in the base 6 so as to be movable in the axial direction of the capacitor body 4 via the gap 34 a.
また、凸部１６の端部２１とコンデンサ本体４の直径方向における加締部１２との間にも隙間部３４cが備えると好ましい。凸部１６の端部２１と加締部１２との間に隙間部３
４cを備え凸部１６の端部２１と加締部１２とを非接触とすることでコンデンサ本体４の
軸方向への可動を円滑にすることができる。
It is also preferable that a gap 34c is provided between the end 21 of the protrusion 16 and the crimped portion 12 in the diameter direction of the capacitor body 4.
By providing 4c and keeping end 21 of protrusion 16 out of contact with crimped portion 12, capacitor body 4 can be moved smoothly in the axial direction.
本実施例のコンデンサ２は、台座６の凸部１６を基点にコンデンサ本体４の加締部１２が上下方向に可動可能となるので、つまり隙間部３４を介してコンデンサ本体４と台座６とが上下に可動できる状態で一体化されている。そのため詳細は後述するが、半田リフロー処理による封口部材２６の変形に伴いコンデンサ本体４が台座６から押し上げられたとしても、その可動を隙間部３４で許容することができる。つまり、凸部１６と加締め部とが外れてしまうことを抑制できるので、リード端子２２と回路基板２８との接続の信頼性を向上することができる。 In the capacitor 2 of this embodiment, the crimped portion 12 of the capacitor body 4 can move in the vertical direction with the protrusion 16 of the base 6 as the base point, that is, the capacitor body 4 and the base 6 are integrated in a state in which they can move up and down through the gap 34. Therefore, as will be described in detail later, even if the capacitor body 4 is pushed up from the base 6 due to deformation of the sealing material 26 caused by the solder reflow process, the gap 34 can allow this movement. In other words, the protrusion 16 and the crimped portion can be prevented from coming off, which can improve the reliability of the connection between the lead terminal 22 and the circuit board 28.
また、図５a、図５bに示すように、コンデンサ本体４の封口部材２６側を台座６の底面部２０に接触させてこの台座６に収納したときに、コンデンサ２の軸方向における凸部１６の上に隙間部３４aを備えるように設計すると好ましい。この隙間部３４ａを備えるこ
とで、凸部１６は、加締部１２に非接触となり、コンデンサ本体４を密封するこの加締部１２への過度のストレスが加わらなく、好ましい。加えて、この隙間部３４ａが個々のコンデンサの加締部１２寸法の微差を許容し、コンデンサ本体４を台座６の底面部２０まで確実に収納することが可能となる。
5a and 5b, when the capacitor body 4 is stored in the base 6 with the sealing material 26 side in contact with the bottom surface 20 of the base 6, it is preferable to design the capacitor 2 so that a gap 34a is provided above the protrusion 16 in the axial direction of the capacitor 2. By providing this gap 34a, the protrusion 16 is not in contact with the crimped portion 12, which is preferable because excessive stress is not applied to the crimped portion 12 that seals the capacitor body 4. In addition, this gap 34a allows for slight differences in the dimensions of the crimped portion 12 of each capacitor, making it possible to reliably store the capacitor body 4 up to the bottom surface 20 of the base 6.
また、凸部１６は台座６の開口側から底に向かってテーパ状のテーパ部１５に形成されている。これによりコンデンサ本体４の台座６への収納を補助することができる。さらに、凸部１６には収納したコンデンサ本体４の抜けを抑制する係り止め部１９が形成されている。これにより、半田フローによる封口部材２６の変形に伴いコンデンサ本体４が台座６から離間しても係り止め部に加締部１２が接触し抜け出す方向への可動を抑制することができる。 The protrusion 16 is also formed as a tapered portion 15 that tapers from the opening side of the base 6 toward the bottom. This can assist in storing the capacitor body 4 in the base 6. Furthermore, the protrusion 16 is formed with a locking portion 19 that prevents the stored capacitor body 4 from falling out. As a result, even if the capacitor body 4 separates from the base 6 due to deformation of the sealing material 26 caused by solder flow, the tightening portion 12 comes into contact with the locking portion, preventing movement in the direction of the capacitor body 4 coming out.
凸部１６は側壁８における内側面の少なくとも一箇所に形成されていれば良い。本実施例では、図３に示すように凸部１６は、コンデンサ本体４の中心軸に対して上面から観察すると直行する位置に二つ形成されている。この様に凸部１６を複数配置する場合、コンデンサ本体４の中心軸を介して対抗する位置に形成しないことが好ましい。コンデンサ本体４の中心軸を介して凸部１６を対向させて配置した台座６の場合、コンデンサ収納部の直径に対して凸部１６二つ分狭くなるため、そこにコンデンサ本体４を台座６へ収納しようとすると台座６に負荷がかかり割れや破損が生じる可能性がある。 The protrusion 16 may be formed at least in one location on the inner surface of the side wall 8. In this embodiment, as shown in FIG. 3, two protrusions 16 are formed at positions perpendicular to the central axis of the capacitor body 4 when observed from above. When arranging multiple protrusions 16 in this manner, it is preferable not to form them in positions opposing each other across the central axis of the capacitor body 4. In the case of a base 6 in which the protrusions 16 are arranged facing each other across the central axis of the capacitor body 4, the diameter of the capacitor storage section is narrower by the width of two protrusions 16, so when an attempt is made to store the capacitor body 4 in the base 6, a load is applied to the base 6, which may cause cracks or damage.
また、図３に示すように、側壁８に設けた凸部１６のコンデンサの軸方向の下に位置する台座６の底面部２０に開口部１８を備えてもよい。コンデンサ本体４を台座６に挿入し凸部１６にコンデンサ本体４が接触するとテーパ部１５に沿って凸部１６は径方向に弾性変形し台座６に応力がかかる。そこで、側壁８に設けた凸部１６のコンデンサの軸方向の下に位置する台座６の底面部２０に開口部１８を形成することで、応力が開口部１８の周縁部分に逃げるため応力を緩和することができ台座６の割れや破損を抑制することができる。 Also, as shown in FIG. 3, an opening 18 may be provided in the bottom surface 20 of the base 6 located below the protrusion 16 on the side wall 8 in the axial direction of the capacitor. When the capacitor body 4 is inserted into the base 6 and the protrusion 16 comes into contact with the capacitor body 4, the protrusion 16 elastically deforms in the radial direction along the tapered portion 15, and stress is applied to the base 6. Therefore, by forming an opening 18 in the bottom surface 20 of the base 6 located below the protrusion 16 on the side wall 8 in the axial direction of the capacitor, the stress can be relieved by escaping to the peripheral portion of the opening 18, and cracking or damage to the base 6 can be suppressed.
また、図２に示すように、側壁８の内側面には上下方向にわたって内側に突出するリブ１７が等間隔に４箇所設けられている。また、相対向するように位置する一対のリブ１７における先端同士の離間幅は、コンデンサ本体４の直径よりも若干短寸となるように形成されている。 As shown in FIG. 2, the inner surface of the side wall 8 is provided with four equally spaced ribs 17 that protrude inward in the vertical direction. The distance between the tips of a pair of ribs 17 that are positioned opposite each other is formed to be slightly shorter than the diameter of the capacitor body 4.
またリブ１７は凸部１６のコンデンサ本体４の軸方向の上方に形成してもよい。これにより、コンデンサ本体４を台座６に収納する際に、リブ１７がコンデンサ本体４をガイドする役割となり、安定して台座６に収納されると共に、前記コンデンサ本体４がリブ１７のコンデンサ本体４の軸方向の下方に形成された凸部１６に、リブ１７から連続して案内されてコンデンサ本体４に備えた加締部１２に隙間部３４を備えて前記凸部１６が配置される。 The rib 17 may also be formed above the protrusion 16 in the axial direction of the capacitor body 4. In this way, when the capacitor body 4 is stored in the base 6, the rib 17 serves to guide the capacitor body 4, allowing it to be stored stably in the base 6, and the capacitor body 4 is guided continuously from the rib 17 to the protrusion 16 formed below the rib 17 in the axial direction of the capacitor body 4, and the protrusion 16 is positioned with a gap 34 in the crimped portion 12 provided on the capacitor body 4.
このように本実施例では、リブ１７が側壁８における内側面の上下方向にわたって形成されており、コンデンサ本体４の外周側面が側壁８の上下にわたって支持され、コンデンサ本体４２の揺動をより効果的に抑止することができることから好ましいが、本発明はこれに限定されるものではなく、側壁８における内側面の少なくとも一部に形成されていれば良い。 In this embodiment, the ribs 17 are formed on the inner surface of the side wall 8 in the vertical direction, and the outer peripheral side surface of the capacitor body 4 is supported on the upper and lower sides of the side wall 8, which is preferable because it more effectively prevents the capacitor body 42 from swinging. However, the present invention is not limited to this, and it is sufficient that the ribs 17 are formed on at least a portion of the inner surface of the side wall 8.
また、リブ１７の上面視形状は半円状に形成することが好ましいが、本発明はこれに限定されるものではなく、少なくとも先端がコンデンサ本体４の外周側面に当接できるように形成されていればその形状は任意である。 In addition, it is preferable that the shape of the rib 17 when viewed from above is semicircular, but the present invention is not limited to this, and the shape can be arbitrary as long as at least the tip is formed so as to be able to abut against the outer peripheral side surface of the capacitor body 4.
また、リブ１７は側壁８の内側面に等間隔に４箇所設けられ、それぞれ対向する位置となるように形成されており、コンデンサ本体４が均一に挟持され、より一層安定的に支持されることから好ましいが、本発明はこれに限定されるものではなく、コンデンサ本体４が側壁８に設けられたリブ１７に挟持されるようになっていれば良く、その数、形成位置は適宜選択可能である。 Furthermore, the ribs 17 are provided at four equally spaced locations on the inner surface of the side wall 8, and are formed so that they are positioned opposite each other, which is preferable because it allows the capacitor body 4 to be evenly clamped and more stably supported, but the present invention is not limited to this, and it is sufficient that the capacitor body 4 is clamped between the ribs 17 provided on the side wall 8, and the number and positions of the ribs can be selected as appropriate.
このように構成されたコンデンサ２にあっては、側壁８の内側面に設けられたリブ１７の内方にコンデンサ本体４を装着することで、リブ１７の先端がコンデンサ本体４の外周側面に押圧され、側壁８側に弾性変形し、その弾性反発力によりコンデンサ本体４の外周側面がリブ１７の先端に強く挟持されるため、加振時においてもコンデンサ本体４の揺動を抑止でき、コンデンサ本体４の揺動によるリード端子２２の破断を防止できる。 また
、リブ１７が側壁８と一体に構成されているため、強度に優れるとともに、側壁８の製造コストも低減できる。
In the capacitor 2 configured in this manner, by mounting the capacitor body 4 inside the rib 17 provided on the inner surface of the side wall 8, the tip of the rib 17 is pressed against the outer circumferential side surface of the capacitor body 4 and elastically deforms towards the side wall 8, and the outer circumferential side surface of the capacitor body 4 is tightly held by the tip of the rib 17 due to the elastic repulsive force, so that it is possible to suppress the oscillation of the capacitor body 4 even when vibration is applied and to prevent breakage of the lead terminals 22 due to the oscillation of the capacitor body 4. Furthermore, because the rib 17 is configured integrally with the side wall 8, it is excellent in strength and the manufacturing cost of the side wall 8 can be reduced.
さらに、コンデンサ本体４はリブ１７に支持されており、コンデンサ本体４の外周側面と側壁８との間に間隙が形成されるようになるため、側壁８を設けることによるコンデンサ本体４の放熱性の低下を極力抑えることができる。 Furthermore, the capacitor body 4 is supported by the ribs 17, and a gap is formed between the outer peripheral side surface of the capacitor body 4 and the side wall 8, so that the reduction in heat dissipation performance of the capacitor body 4 due to the provision of the side wall 8 can be minimized.
また、図４に示したように、コンデンサ本体４から導出された一対のリード端子２２を折り曲げずにスルーホール３０へ挿入し半田リフロー処理によって接続してもよい。これにより、リード端子２２を折れ曲げた場合に生じるリード端子２２への応力の集中を回避することができ、さらにスルーホール３０内でリード端子２２が固定されるため、リード端子２２をスルーホール３０に挿入しない一般的な面実装品と比較してコンデンサと回路基板２８とを強固に接続することができる。 Also, as shown in FIG. 4, a pair of lead terminals 22 extending from the capacitor body 4 may be inserted into the through holes 30 without bending and connected by solder reflow processing. This avoids the concentration of stress on the lead terminals 22 that occurs when the lead terminals 22 are bent, and furthermore, since the lead terminals 22 are fixed within the through holes 30, the capacitor and the circuit board 28 can be more firmly connected than in a typical surface-mounted product in which the lead terminals 22 are not inserted into the through holes 30.
また本実施例では、台座６の下面に台座６と回路基板２８との接続をより強固にする補助端子２４を備えることが好ましいが、本発明はこれに限定されるものではなく、特に形成されていなくても良い。 In addition, in this embodiment, it is preferable to provide an auxiliary terminal 24 on the underside of the base 6 to strengthen the connection between the base 6 and the circuit board 28, but the present invention is not limited to this, and it is not necessary for this to be formed.
また図８に示すように補助端子を用いた他の実施形態によれば、コンデンサ本体から導出された一対のリード端子を結ぶ仮想線Ｌ１と、台座６の下面に配置された一対の補助端子を結ぶ仮想線Ｌ２と、の接点の角度が略直行する関係となるように補助端子を配置してもよい。この仮想線Ｌ１の方向は、一対のリード端子によって２点で基板に固定されるため高い耐振動性を確保することが可能となる。同様に、仮想線Ｌ２の方向は、一対の補助端子によって２点で基板に固定されるため高い耐振動性を確保することが可能となる。それぞれの仮想線を異なる方向(例えば直行方向)になるよう補助端子を配置することで複数の方向からの振動に高い耐振動性を確保することが可能となる。 In another embodiment using auxiliary terminals as shown in FIG. 8, the auxiliary terminals may be arranged so that the angle of contact between an imaginary line L1 connecting a pair of lead terminals derived from the capacitor body and an imaginary line L2 connecting a pair of auxiliary terminals arranged on the underside of the base 6 is approximately perpendicular. The direction of this imaginary line L1 is fixed to the board at two points by the pair of lead terminals, making it possible to ensure high vibration resistance. Similarly, the direction of the imaginary line L2 is fixed to the board at two points by the pair of auxiliary terminals, making it possible to ensure high vibration resistance. By arranging the auxiliary terminals so that each imaginary line is in a different direction (e.g., perpendicular direction), it is possible to ensure high vibration resistance against vibrations from multiple directions.
以上のように構成されたコンデンサ２は、回路基板２８の所定位置へ半田付けにより接続される。回路基板２８に備えたスルーホール３０に半田ペーストを充填し、そのスルーホール３０にコンデンサのリード端子２２を挿入する。このとき、コンデンサ本体４の封口部材２６側と台座６の底面部２０とが接触するよう十分に押し込むと、コンデンサ本体４と台座６の底面部２０とが接触することで高さ決めがされ、コンデンサ本体４の軸方向における凸部１６の上方に隙間部３４a、下方に隙間部３４bが生じる。このとき、図５(a)、図５(b)に示したように凸部１６は、台座６と加締部１２との間に生じる加締部内領域の上方に配置され、加締部１２内領域の下方には封口部材２６の変形に伴うコンデンサ本体４の可動を許容する空間部として隙間部３４bが設けられる。 The capacitor 2 configured as above is connected to a predetermined position on the circuit board 28 by soldering. The through holes 30 in the circuit board 28 are filled with solder paste, and the lead terminals 22 of the capacitor are inserted into the through holes 30. At this time, when the capacitor body 4 is pressed sufficiently so that the sealing material 26 side and the bottom surface 20 of the base 6 come into contact with each other, the height is determined by the contact between the capacitor body 4 and the bottom surface 20 of the base 6, and a gap 34a is formed above the protrusion 16 in the axial direction of the capacitor body 4, and a gap 34b is formed below the protrusion 16. At this time, as shown in Figures 5(a) and 5(b), the protrusion 16 is positioned above the crimped portion inner area generated between the base 6 and the crimped portion 12, and a gap 34b is provided below the crimped portion 12 inner area as a space that allows the capacitor body 4 to move due to the deformation of the sealing material 26.
図５(a)、図５(b)に示した状態で半田リフロー処理をすると、コンデンサ２によって若干の個体差はあるが図６(a)、図６(b)に示したように、コンデンサ２の内圧上昇に伴い封口部材２６が膨張しコンデンサ本体４が台座６の底面部２０から離間する方向（図６矢印方向）押し上げられる。しかし、コンデンサ本体４の軸方向における凸部１６の下方に配置された隙間部３４ｂにより加締部１２の上方へ可動されるとともにコンデンサ本体４の加締部１２内に凸部１６が制御されるため、台座６からコンデンサが外れてしまうことを抑制できる。このようにコンデンサ本体４が押し上げられると、図６(a)、図６(b)に示したように凸部１６は加締部内領域内の下方に位置される。また、コンデンサが押し上げられた高さ分、凸部１６の上方に隙間部３４aが生じる。尚、コンデンサ２の個体差により
封口部材２６の膨張によるコンデンサ本体４の押し上げられる高さは若干異なるが、図６(b)に示したように、コンデンサ本体４を台座６の底面部２０に接触させて台座６に収納
したときに半田リフロー処理に伴う封口部材２６の変形によってコンデンサ本体４が台座６の底面部２０から離間するする長さをaとし、図５(b)に示すコンデンサ本体４を台座６の底面部２０に接触させて台座６に収納したときに、コンデンサの軸方向における凸部１６の下に設けた隙間部３４bの長さbとしたときの大小関係がa≦bとなるように凸部１６や加締め部の位置を設計すればよい。これにより、コンデンサ本体４の半田リフロー処理に伴う可動を加締部１２で確実に許容することができる。
When the solder reflow process is performed in the state shown in FIG. 5(a) and FIG. 5(b), although there are some individual differences depending on the capacitor 2, as shown in FIG. 6(a) and FIG. 6(b), the sealing material 26 expands with an increase in the internal pressure of the capacitor 2, and the capacitor body 4 is pushed up in a direction away from the bottom surface portion 20 of the base 6 (in the direction of the arrow in FIG. 6). However, the gap 34b arranged below the protrusion 16 in the axial direction of the capacitor body 4 moves the capacitor body 4 upward in the crimped portion 12 and controls the protrusion 16 within the crimped portion 12 of the capacitor body 4, so that the capacitor can be prevented from coming off the base 6. When the capacitor body 4 is pushed up in this way, the protrusion 16 is positioned below the region within the crimped portion as shown in FIG. 6(a) and FIG. 6(b). In addition, a gap 34a is generated above the protrusion 16 by the height to which the capacitor is pushed up. Although the height to which the capacitor body 4 is pushed up due to the expansion of the sealing material 26 varies slightly depending on the individual capacitor 2, as shown in Fig. 6(b), the length by which the capacitor body 4 separates from the bottom surface 20 of the base 6 due to the deformation of the sealing material 26 caused by the solder reflow treatment when the capacitor body 4 is in contact with the bottom surface 20 of the base 6 and stored in the base 6 is a, and the length b of the gap 34b provided under the convex portion 16 in the axial direction of the capacitor when the capacitor body 4 shown in Fig. 5(b) is in contact with the bottom surface 20 of the base 6 and stored in the base 6 is b, the positions of the convex portion 16 and the crimping portion can be designed so that the relationship between a and b is satisfied. This allows the crimping portion 12 to reliably allow the movement of the capacitor body 4 caused by the solder reflow treatment.
また、図５(b)に示したコンデンサ本体４を台座６の底面部２０に接触させて台座６に収納したときに、コンデンサ２の軸方向における凸部１６の下に設けた隙間部３４bの長
さbは、0.2mm～3.0mm程度が好ましく、0.5mm～2.0mm程度であればさらに好ましく、コン
デンサ本体４のサイズや加締部１２の深さに合わせて適宜設計すればよい。
Furthermore, when the capacitor body 4 shown in FIG. 5(b) is placed in contact with the bottom surface 20 of the base 6 and stored in the base 6, the length b of the gap 34b provided under the convex portion 16 in the axial direction of the capacitor 2 is preferably approximately 0.2 mm to 3.0 mm, and more preferably approximately 0.5 mm to 2.0 mm, and may be designed as appropriate in accordance with the size of the capacitor body 4 and the depth of the crimped portion 12.
半田リフロー処理の冷却工程でコンデンサ２が冷却されると、コンデンサ２によって若干の個体差はあるが図７に示したように膨張した封口部材２６は収縮し、コンデンサ本体４は封口部材２６が収縮した分の高さだけ自重で降下する。そして半田は凝固し、機械的および電気的に相互接続される。このとき、コンデンサ本体４と側壁８に備えたリブ１７との密着の度合いよってはコンデンサ本体４が台座６の底面部２０まで降下せずに僅かにクリアランスを備えた状態でリード端子２２と回路基板２８とが接続される場合もあるが、回路基板２８への実装に影響はない。 When the capacitor 2 is cooled in the cooling step of the solder reflow process, the expanded sealing material 26 contracts as shown in FIG. 7, although there are slight individual differences depending on the capacitor 2, and the capacitor body 4 drops by its own weight the height of the sealing material 26 that has contracted. The solder then solidifies and is mechanically and electrically interconnected. At this time, depending on the degree of adhesion between the capacitor body 4 and the rib 17 on the side wall 8, the capacitor body 4 may not drop to the bottom surface 20 of the base 6, and the lead terminals 22 and the circuit board 28 may be connected with a slight clearance, but this does not affect the mounting on the circuit board 28.
以上、本発明の実施例を図面により説明してきたが、具体的な構成はこれら実施例に限られるものではなく、本発明の要旨を逸脱しない範囲における変更や追加があっても本発明に含まれる。 Although the embodiments of the present invention have been described above with reference to the drawings, the specific configuration is not limited to these embodiments, and the present invention also includes modifications and additions that do not deviate from the gist of the present invention.
例えば、本実施例ではコンデンサ２を回路基板２８へ実装する方法として、回路基板２８に備えたスルーホール３０にコンデンサ本体４のリード端子２２を挿入した後、コンデンサ本体４の封口部材２６側と台座６の底面部２０とが接触するよう十分に押し込んだうえで半田リフロー処理する実装方法を説明したが、本発明はこれに限らず他の実装方法として回路基板２８に備えたスルーホール３０にコンデンサ本体４のリード端子２２を挿入した後、コンデンサ本体４の封口部材２６側と台座６の底面部２０とを予め離間させて半田リフロー処理をしてもよい。具体的には台座６に備えた凸部１６がコンデンサ本体４に備えた加締部１２に配置される範囲内でコンデンサ本体を上方へ引き上げ、凸部１６を加締部１２内領域の下方に配置してもよい。 For example, in this embodiment, the method of mounting the capacitor 2 on the circuit board 28 is described as a mounting method in which the lead terminals 22 of the capacitor body 4 are inserted into the through holes 30 of the circuit board 28, and then the sealing material 26 of the capacitor body 4 is sufficiently pressed so that it comes into contact with the bottom surface 20 of the base 6, and then solder reflow processing is performed. However, the present invention is not limited to this, and other mounting methods may be used in which the lead terminals 22 of the capacitor body 4 are inserted into the through holes 30 of the circuit board 28, and then the sealing material 26 of the capacitor body 4 and the bottom surface 20 of the base 6 are separated in advance and solder reflow processing is performed. Specifically, the capacitor body may be pulled upward within a range where the protrusion 16 of the base 6 is located in the crimping portion 12 of the capacitor body 4, and the protrusion 16 may be located below the area inside the crimping portion 12.
このように、コンデンサ本体４の封口部材２６側と台座６とを予め離間させて、封口部材２６と台座６との間に空隙を設ける若しくは空隙を拡張することで、半田リフロー処理に伴う封口部材２６の変形をこの空隙で吸収することができるため、封口部材２６と台座６の底面部２０とが接触した状態での半田リフロー処理と比較して、コンデンサ本体の上方への可動距離を皆無若しくは低減することができる。半田リフロー処理に伴うコンデンサ本体４の上方への可動距離は、短いほどリード端子２２への負荷を低減できる。つまり、コンデンサ本体４の加締部１２と台座６の凸部１６との間に備えた隙間部３４によって、コンデンサ本体４の上下方向への可動が可能となるため、コンデンサ２のサイズや封口部材２６の材質、実装設備等に応じて、半田リフロー処理の際にコンデンサ本体４と台座６との離間する距離を適宜選択することができる。 In this way, by separating the sealing member 26 side of the capacitor body 4 from the base 6 in advance and providing or expanding a gap between the sealing member 26 and the base 6, the deformation of the sealing member 26 accompanying the solder reflow process can be absorbed by this gap, so that the upward movement distance of the capacitor body can be eliminated or reduced compared to the solder reflow process in a state where the sealing member 26 and the bottom surface portion 20 of the base 6 are in contact. The shorter the upward movement distance of the capacitor body 4 accompanying the solder reflow process, the less the load on the lead terminals 22 can be. In other words, the gap portion 34 provided between the crimping portion 12 of the capacitor body 4 and the protruding portion 16 of the base 6 allows the capacitor body 4 to move in the vertical direction, so the distance between the capacitor body 4 and the base 6 during the solder reflow process can be appropriately selected depending on the size of the capacitor 2, the material of the sealing member 26, the mounting equipment, etc.
この発明によれば、半田リフローにおける回路基板２８への実装不良の発生を大幅に低減することができる。 This invention can significantly reduce the occurrence of mounting defects on the circuit board 28 during solder reflow.
２ コンデンサ
４ コンデンサ本体
６ 台座
８ 側壁
１０ 切欠き
１２ 加締部
１４ 分断部
１５ テーパ部
１６ 凸部
１７ リブ
１８ 開口部
１９ 係り止め部
２０ 底面部
２２ リード端子
２４ 補助端子
２６ 封口部材
２８ 回路基板
３０ スルーホール
３２ 半田ペースト
３４ 隙間部
Reference Signs List 2 Capacitor 4 Capacitor body 6 Base 8 Side wall 10 Notch 12 Crimping portion 14 Separation portion
REFERENCE SIGNS 15 Tapered portion 16 Convex portion 17 Rib 18 Opening 19 Engagement portion 20 Bottom surface portion 22 Lead terminal 24 Auxiliary terminal 26 Sealing material 28 Circuit board 30 Through hole 32 Solder paste 34 Gap portion
Claims (11)
前記外装ケースの側面を加締めて形成した加締部に前記凸部が配置され、前記加締部と前記凸部との間に隙間部を設け、
前記隙間部は、コンデンサ本体の軸方向における凸部の上下と加締部との間の少なくとも一方に設けられ、前記コンデンサ本体が、該隙間部を介してコンデンサの軸方向に可動可能に台座に収納されたことを特徴とするコンデンサ。 A capacitor comprising: a bottomed cylindrical exterior case housing a capacitor element, the open end of which is sealed with a sealing material; a capacitor body formed by lead terminals extending from the capacitor element and penetrating the sealing material, which is housed in a base having a bottom surface portion with through holes through which the lead terminals pass and a side wall formed to surround an outer periphery of the capacitor body; and a protrusion protruding from an inner surface of the side wall toward the capacitor body,
the protrusion is disposed on a crimped portion formed by crimping a side surface of the exterior case, and a gap is provided between the crimped portion and the protrusion;
The gap portion is provided at least on one side between the upper and lower parts of the convex portion and the tightening portion in the axial direction of the capacitor body, and the capacitor body is stored in a base so as to be movable in the axial direction of the capacitor through the gap portion .
前記外装ケースの側面を加締めて形成した加締部に前記加締部と前記凸部との間に隙間部を設けて前記凸部を配置する工程を含み、
前記隙間部は、コンデンサ本体の軸方向における凸部の上下と加締部との間の少なくとも一方に設けられ、前記コンデンサ本体が、該隙間部を介してコンデンサの軸方向に可動可能に台座に収納されたことを特徴とするコンデンサの製造方法。 A method for manufacturing a capacitor, comprising the steps of: sealing an open end of a bottomed cylindrical exterior case housing a capacitor element with a sealing material; housing a capacitor body formed by lead terminals extending from the capacitor element and penetrating the sealing material in a base having a bottom surface portion with through holes through which the lead terminals pass and a side wall formed to surround an outer periphery of the capacitor body; and providing a convex portion protruding from an inner surface of the side wall toward the capacitor body, the method comprising the steps of:
a step of disposing the convex portion by providing a gap between a crimped portion formed by crimping a side surface of the exterior case and the convex portion,
A method for manufacturing a capacitor, characterized in that the gap portion is provided at least on one side between the upper and lower parts of the convex portion and the crimped portion in the axial direction of the capacitor body, and the capacitor body is stored in a base so as to be movable in the axial direction of the capacitor through the gap portion .
回路基板に備えた半田ペーストが充填されたスルーホールに挿入する工程と、前記リード端子と回路基板とを半田リフロー接続する工程と、
を含むことを特徴とするコンデンサの実装方法。 The lead terminal of the capacitor according to claim 1 is
a step of inserting the lead terminal into a through hole filled with solder paste provided in a circuit board, and a step of solder reflow connecting the lead terminal and the circuit board;
A method for mounting a capacitor, comprising:
挿入したリード端子を屈曲させて仮止めする工程を含むことを特徴とする請求項１０に記載のコンデンサの実装方法。 After the step of inserting the lead terminals of the capacitor into the through holes,
11. The method for mounting a capacitor according to claim 10, further comprising the step of bending and temporarily fixing the inserted lead terminals.
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| US17/616,551 US11908635B2 (en) | 2019-06-06 | 2020-05-01 | Capacitor and method for producing same, and capacitor-mounting method |
| EP20818685.8A EP3982383A4 (en) | 2019-06-06 | 2020-05-01 | Capacitor and method for producing same, and capacitor-mounting method |
| CN202080041332.8A CN114342024B (en) | 2019-06-06 | 2020-05-01 | Capacitor and method for manufacturing the same, and method for mounting the capacitor |
| PCT/JP2020/018473 WO2020246195A1 (en) | 2019-06-06 | 2020-05-01 | Capacitor and method for producing same, and capacitor-mounting method |
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| JP2001102237A (en) | 1999-09-29 | 2001-04-13 | Nippon Chemicon Corp | Chip capacitor |
| JP2001217148A (en) | 2000-02-03 | 2001-08-10 | Matsushita Electric Ind Co Ltd | Chip type aluminum electrolytic capacitor |
| JP2007317688A (en) | 2006-05-23 | 2007-12-06 | Sony Corp | Electronic component and electronic component mounting method |
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