JP7601707B2 - Heat Transfer Structure - Google Patents

Description

The present invention relates to a heat transfer structure.

As one type of heat transfer structure, Patent Document 1 discloses a heat dissipation structure 1 that includes a heat dissipation plate 30 that is a plate covering the surfaces of one or more heat sources 11, 12, 13 and has a first inner surface 35 that corresponds to the unevenness of the surfaces of the heat sources 11, 12, 13, and a heat conduction sheet 20 that is attached to the first inner surface 35 of the heat dissipation plate 30 and has the function of conducting heat from the heat sources 11, 12, 13 to the heat dissipation plate 30.

JP 2019-140262 A

The heat dissipation structure disclosed in the above-mentioned Patent Document 1 can accommodate the unevenness of the surface of the heat source and has high heat dissipation (heat transfer) properties. However, when the heat transfer target (heat source) is shielded by a shielding member with a relatively low thermal conductivity, it is not easy to transfer heat between the heat transfer target and the shielding member, and there is a demand for heat transfer between the heat transfer target and the shielding member with a relatively low thermal conductivity.

The present invention has been made to solve the above-mentioned problems, and aims to provide a heat transfer structure that allows heat to be transferred between a heat transfer target and a shielding member with a relatively low thermal conductivity.

In order to solve the above problems, the heat transfer structure according to the present invention is characterized by comprising a sheet member formed in a sheet shape and having an adhesive part that can be adhered to an adherend part of a target member, and a heat transfer member formed of a material having a higher thermal conductivity than the target member, integrally provided on the installation part of the sheet member, and capable of being accommodated in a target through hole formed to penetrate the target member in the thickness direction so as to be in contact with a heat transfer target in a state capable of thermally conducting therethrough.

According to the heat transfer structure of the present invention, it is possible to mount the heat transfer structure on the attachment member by accommodating a heat transfer member in an attachment through hole provided in the attachment member so that the heat transfer member is in contact with the heat transfer target in a thermally conductive state. As a result, it is possible to transfer heat from the heat transfer target to the opposite side of the heat transfer target via the heat transfer member, i.e., across the attachment member. In other words, when the heat transfer target is shielded by a shielding member with a relatively low thermal conductivity, by using the shielding member with a relatively low thermal conductivity as the attachment member and providing a heat transfer member on the shielding member, it is possible to transfer heat from the heat transfer target to the heat transfer target via the heat transfer member, i.e., across the attachment member.

In the heat transfer structure according to the present invention, it is preferable that the adhesive portion is provided so as to surround the installation portion. This makes it possible to seal (close) the attachment through hole with the sheet member.

The heat transfer structure according to the present invention preferably further comprises an encapsulating member that forms a space between the sheet member and the heat transfer member and encapsulates the heat transfer member in the space. This makes it possible to manufacture the heat transfer structure relatively easily.

In the heat transfer structure according to the present invention, the heat transfer member includes a first heat transfer member provided on one side of the sheet member and a second heat transfer member provided on the other side of the sheet member, and it is preferable that the first heat transfer member and the second heat transfer member are in close contact with the sheet member. This makes it possible to manufacture the heat transfer structure relatively easily.

In the heat transfer structure according to the present invention, it is preferable that the sheet member has one or more sheet member through holes penetrating in the thickness direction, and the heat transfer member has a first heat transfer member provided on one side of the sheet member, a second heat transfer member provided on the other side of the sheet member, and a connecting portion provided in the sheet member through hole and connecting the first heat transfer member and the second heat transfer member. This makes it possible to relatively easily manufacture a heat transfer structure with relatively high thermal conductivity.

The objective of this invention is to provide a heat transfer structure that allows heat transfer between a heat transfer target and a shielding member with a relatively low thermal conductivity.

1 is a cross-sectional view showing a housing 10 to which a heat transfer structure 540 according to a first embodiment of the present invention is applied. 1B is a cross-sectional view showing the heat transfer integral structure 30 shown in FIG. 1A. FIG. 1B is an external perspective view showing a first casing 11 shown in FIG. 1A. FIG. 1B is a cross-sectional view showing the first casing 11 shown in FIG. 1A. FIG. 1B is a cross-sectional view showing the heat transfer structure 540 shown in FIG. 11 is a cross-sectional view showing a heat transfer integral structure 530 to which the heat transfer structure 40 according to the second embodiment is applied. FIG. 2B is a cross-sectional view showing the heat transfer structure 40 shown in FIG. 2A. FIG. 11 is a cross-sectional view showing a heat transfer structure 140 according to a third embodiment. FIG. 11 is a cross-sectional view showing a heat transfer structure 240 according to a fourth embodiment. FIG. 11 is a cross-sectional view showing a modified example of the heat transfer structure 240 according to the fourth embodiment.

First Embodiment
Hereinafter, a housing 10 to which a heat transfer structure 540 according to a first embodiment of the present invention is applied will be described with reference to the drawings. However, the present invention is not limited to this embodiment, and can be embodied in various forms with various modifications and improvements based on the knowledge of those skilled in the art.

As shown in FIG. 1A, the housing 10 includes a first casing 11 and a second casing (lid member) 12. A substrate 20 is housed in the housing 10. The substrate 20 has electronic components 21 mounted thereon, and the electronic components 21 include ICs (integrated circuits) such as resistors, capacitors, transistors, and microprocessors. Among the electronic components 21, electronic components such as microprocessors that become relatively hot are the electronic components 21a that are the heat transfer targets. The electronic components 21a may be ICs other than microprocessors, or may be power devices (switching elements) such as transistors, FETs (field-effect transistors), and IGBTs (insulated gate bipolar transistors). In this embodiment, the substrate 20 on which the microprocessor is mounted is housed in the housing 10, but this is not limited thereto, and other members that are the heat transfer targets 21a may be housed therein.

The heat transfer target 21a is an object that transfers heat by radiating or absorbing heat through the heat transfer member 31. That is, heat transfer includes both heat radiation and heat absorption. When the heat transfer target 21a is lowered (cooled), the heat of the heat transfer target 21a is transferred through the heat transfer member 31, and the heat transfer target 21a radiates heat and is cooled. When the heat transfer target 21a is cooled, low-temperature heat (low heat) from a heat source that is lower in temperature than the heat transfer target 21a is transferred through the heat transfer member 31, and the heat transfer target 21a absorbs heat and is cooled. When the heat transfer target 21a is raised (heated), high-temperature heat (high heat) from a heat source that is higher in temperature than the heat transfer target 21a is transferred through the heat transfer member 31, and the heat transfer target 21a absorbs heat and is raised in temperature. Note that heat originally moves from a high-temperature object to a low-temperature object, and this transfer phenomenon is called heat transfer, but in this specification, the transfer of heat from a low-temperature object to a high-temperature object is also called heat transfer.

As shown in Figures 1B to 1D, the first casing 11 is made of synthetic resin material in a box shape with an opening 11a. The first casing 11 has a bottom 11b and a wall 11c. The bottom 11b and the wall 11c are integrally formed. The synthetic resin material is a material made of a synthesized polymer compound, and examples of the synthetic resin include thermosetting resins such as phenolic resin, melamine resin, and epoxy resin, and thermoplastic resins such as polyethylene, polyvinyl chloride, polystyrene, ABS resin (acrylonitrile butadiene styrene resin), polyamide, polyacetal, and polycarbonate. The first casing 11 may also be made of materials other than synthetic resin material, such as organic solid materials such as wood, paraffin, and naphthalene, ceramic materials, and glass ceramic materials.

The bottom 11b is formed in a polygonal shape (in this embodiment, a square shape), and the lower end of the wall 11c is connected to the upper peripheral edge of the bottom 11b. The bottom 11b is not limited to a polygonal shape, and may be formed in a circular or elliptical shape, in which case the wall 11c is formed in a shape that corresponds to the shape of the bottom 11b.

The bottom 11b is formed into a plate shape using the above-mentioned synthetic resin material. The bottom 11b is provided with a through hole 11b1 that penetrates in the thickness direction. In this way, the bottom 11b is a plate-shaped portion that is formed into a plate shape and has a through hole 11b1 that penetrates in the thickness direction. The shape of the through hole 11b1 is preferably set according to the shape of the heat transfer target 21a or the heat conductive member (described later). For example, if the heat transfer target 21a is rectangular, the shape of the through hole 11b1 is formed into a square shape as shown in FIG. 1C.

As shown in FIG. 1B, the heat transfer structure 540 is provided on the bottom 11b and thus the first casing 11. In other words, the bottom 11b and thus the first casing 11 are the attachment member, which is the member to which the heat transfer structure 540 is attached. The through hole 11b1 is the attachment through hole, which is a through hole formed in the attachment member.

As shown in FIG. 1B, the heat transfer structure 540 includes a heat transfer member 31 and a resin film 32, which is a sheet member. The heat transfer member 31 is provided in the through hole 11b1. The heat transfer member 31 is formed of a member having a higher thermal conductivity than the bottom 11b, and can be accommodated in the through hole 11b1 so as to be in contact with the heat transfer target 21a in a state in which heat can be transferred. The heat transfer member 31 is integrally provided in the placement portion 32c of the resin film 32. The heat transfer member 31 may be bonded to the resin film 32 with an adhesive or the like, or may be fused by thermal welding or the like. The heat transfer member 31 may also be directly attached (adhered) to the placement portion 32c of the resin film 32 without using an adhesive.

The heat transfer member 31 is formed of a material having a higher thermal conductivity than the bottom (plate-shaped portion) 11b, and is provided in the through hole 11b1 so as to be in contact with the heat transfer target 21a in a thermally conductive state, and can be said to be a heat transfer portion that transfers heat between the heat transfer target 21a and the heat transfer member 31. The bottom 11b and the heat transfer member 31 are integrally formed to form a heat transfer integral structure 30. In addition, the heat transfer integral structure 30 can be formed by the first casing 11 and the heat transfer member 31. The heat-conducting state (heat-conducting state) includes not only a state in which heat is indirectly transferred between the heat transfer target 21a and the heat transfer member 31 via a heat-conducting member such as the substrate 20 as in this embodiment, but also a state in which heat is directly transferred between the heat transfer target 21a and the heat transfer member 31 without passing through a heat-conducting member (heat-conducting member). In other words, as in this embodiment, the contact point with which the heat transfer member 31 comes into direct contact may be a heat conductive member, or the contact point may be the heat transfer target 21a.

The heat transfer member 31 is formed of a material (heat transfer material) in which a filler (thermally conductive filler) having thermal conductivity is added to a base material such as a silicone-based, urethane resin-based, or rubber-based material. Examples of silicone-based materials include one-component curing silicone and two-component curing silicone. For example, one-component curing silicone contains a crosslinkable silyl group-containing low molecular weight compound as a crosslinking agent in a main component containing an organopolysiloxane having a silanol group at the end. Examples of one-component curing silicone include heat dehydration condensation type, moisture curing type, deoxime type, deacetic acid type, and peroxide curing reaction type silicone. In addition, two-component curing silicone is cured by mixing a main agent containing an organopolysiloxane having a silanol group at the end with a curing agent. Examples of two-component curing silicone include addition polymerization type and dealcohol condensation type silicone.

The thermally conductive filler is made of a material with high thermal conductivity and formed into particles, powder, or granules. Examples of the material include metals and ceramics such as oxides (alumina, barium titanate), hydroxides (hydroxyapatite), and nitrides (silicon nitride). If electrical insulation is required for the heat transfer member 31, it is preferable to select a material with high insulation (low electrical conductivity).

The thermal conductivity of the heat transfer member 31 is preferably set to a value greater than the thermal conductivity of the bottom 11b, which is the plate-shaped portion. For example, if the thermal conductivity of the bottom 11b is less than 1 W/m·K, the thermal conductivity of the heat transfer member 31 is preferably 1 W/m·K or greater, more preferably 2 W/m·K or greater, and even more preferably 5 W/m·K or greater.

The hardness of the heat transfer member 31 is preferably lower than that of the bottom 11b. The hardness of the bottom 11b is, for example, 100 Shore A or more, and the hardness of the heat transfer member 31 is, for example, 50 Shore A or less. This allows the heat transfer member 31 to be in closer contact with the heat-conductive member in contact with the heat transfer target 21a or the heat transfer target 21a, i.e., the adhesion of the heat transfer member 31 can be further improved. As a result, it is possible to further improve the heat dissipation (heat transfer) of the heat transfer member 31.

The thickness of the heat transfer member 31 is preferably set to a value greater than the thickness of the bottom 11b. The amount of protrusion of the heat transfer member 31 from the bottom 11b is set to a value that allows the upper and lower surfaces (contact surfaces) of the heat transfer member 31 to contact the contacted surfaces of the contact destinations. For example, the amount of protrusion is preferably set to a value obtained by adding the crushing margin of the heat transfer member 31 to the distance between the contact surface of the heat transfer member 31 and the contacted surface facing the contact surface. According to this, it is possible to arrange the heat transfer member 31 so that it protrudes from the front and back surfaces of the bottom 11b, so that the heat transfer member 31 can be directly contacted (closely attached) with the substrate 20, which is a heat conductive member, and thus the heat transfer member 31 can be contacted with the electronic component 21a, which is the heat transfer target 21a, in a state in which heat can be conducted. As a result, it is possible to further improve the heat dissipation (heat transfer) by the heat transfer member 31. In addition, it is possible to contact the heat transfer target 21a with a simple structure or at low cost without providing other components.

Even if the thickness of the heat transfer member 31 is set to a value greater than the thickness of the bottom 11b, the upper and lower surfaces (contact surfaces) of the heat transfer member 31 may protrude from the bottom 11b, or only one of the contact surfaces may protrude from the bottom 11b. In this case, since the other contact surface is recessed from the surface of the bottom 11b, it is preferable to set the contacted surface to protrude toward the heat transfer member 31 by at least the amount of recession.

The thickness of the heat transfer member 31 may be set to a value smaller than the thickness of the bottom 11b. In this case, since the contact surface of the heat transfer member 31 is recessed from the surface of the bottom 11b, it is preferable to set the contact surface to protrude toward the heat transfer member 31 by at least the amount of recession. This allows the contact surface of the heat transfer target 21a, which is the contact destination, or the heat conductive member (heat conductive member) in contact with the heat transfer target 21a to be reliably in contact with the surface of the heat transfer member 31, making it possible to reliably ensure contact (adhesion) between the heat transfer member 31 and the contact destination (heat transfer target 21a or heat conductive member).

As shown in FIG. 1B, a resin film 32 is provided on the lower surface of the bottom 11b so as to cover the through hole 11b1. The resin film 32 is a sheet member formed in a sheet shape and having an adhesive portion 32b that can be adhered to the adherend portion 11d of the bottom 11b, which is the attachment member. The size of the resin film 32 is set to be larger than the size of the through hole 11b1. The peripheral portion of the resin film 32 is adhered to the opening peripheral portion of the through hole 11b1 (the adherend portion 11d) via an adhesive member 32a such as an adhesive or double-sided tape. The peripheral portion of the resin film 32 may also be welded to the opening peripheral portion of the through hole 11b1. The peripheral portion of the resin film 32 is an adhesive portion 32b that can be adhered to the adherend portion 11d of the bottom 11b of the first casing 11. This makes it possible to seal (close) the through hole 11b1 with the resin film 32. The adhesive portion 32b is preferably provided so as to surround the placement portion 32c where the heat transfer member 31 is placed with the resin film 32. This allows the through hole 11b1 to be sealed (closed) with the resin film 32 while ensuring high heat transfer with the heat transfer member 31 placed in the through hole 11b1. The resin film 32 is for supporting the heat transfer member 31 formed in the through hole 11b1. The resin film 32 is preferably formed in a planar shape.

The resin film 32 is made of materials such as olefin-based polypropylene (PP), polyethylene (PE), olefin-based elastomer (TPO), polyethylene terephthalate (PET), urethane-based, ethylene vinyl acetate (EVA), polyvinyl chloride (PVC), and fluororesin (polytetrafluoroethylene (tetrafluorinated resin, PTFE), perfluoroalkoxy fluororesin (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), and polychlorotrifluoroethylene (trifluorinated resin, PCTFE)). The thickness of the resin film 32 is preferably set in the range of 0.1 to 1.0 mm, for example, taking into account thermal conductivity.

Like the bottom 11b, the wall 11c is made of a synthetic resin material and has a plate shape. The wall 11c is made of multiple walls 11c1 to 11c4, the number of which corresponds to the number of sides of the bottom 11b. The walls 11c1 to 11c4 are integrally formed into a frame shape.

As shown in FIG. 1A, the second casing 12 is a lid member formed to cover the opening 11a of the first casing 11. The second casing 12 is formed in a shape similar to the bottom 11b of the first casing 11 (i.e., a rectangular shape in this embodiment). The second casing 12 is formed of a synthetic resin material like the first casing 11. The lower peripheral edge of the second casing 12 is attached airtight or liquidtight to the upper end of the wall portion 11c of the first casing 11. The housing 10 is a housing with high sealing properties (airtightness) formed by the first casing 11 and the second casing 12.

As shown in FIG. 1A, the housing 10 is provided with a heat dissipation member 13 such as a heat sink. The heat dissipation member 13 is attached to the first casing 11 (for example, the bottom 11b of the first casing 11) via a support 13b. With this, the heat dissipation member 13 is attached to the bottom 11b, so that the resin film 32 can be sandwiched between the upper surface (rear surface) of the heat dissipation member 13 and the lower surface of the bottom 11b, and the heat transfer member 31 bonded (fixed) to the resin film 32 can be firmly and reliably fixed by the through hole 11b1. The heat dissipation member 13 may be directly bonded to the resin film 32 without using a separate member such as the support 13b. The heat dissipation member 13 may also be in contact with the resin film 32 via a heat dissipation material having adhesive properties such as a GAP filler or a heat dissipation sheet.

The heat dissipation member 13 is a member for dissipating and absorbing heat from an attachment destination or a contact destination (resin film 32 in this embodiment), and is formed of a metal material with high thermal conductivity, such as aluminum, iron, or copper. The heat dissipation member 13 is not limited to a metal material, and may be formed of other materials such as carbon (C), silicon (Si), carbon nanotubes (C), and quartz (SiO ₂ ) as long as the material has high thermal conductivity (for example, a material with thermal conductivity of 7 W/m·K or more). The heat dissipation member 13 is preferably formed in a shape that increases the surface area in order to increase the heat dissipation and absorption performance, and for example, a plate-shaped or rod-shaped fin 13a may be provided as a surface area increase portion. The surface area increase portion may be formed in a bellows shape.

The heat transfer member 31 is preferably provided so that it can be in contact with the heat transfer target 21a and the other party that conducts heat (exchanges heat) with it (in this embodiment, the heat dissipation member 13) in a heat conductive state. In this case, since the heat transfer member 31 is formed to include the resin film 32, in this embodiment, the heat conductive state can be said to be a state in which heat is transferred directly between the heat transfer target 21a and the heat transfer member 31 (resin film 32) without passing through a heat conductive member. In addition, when a heat conductive member such as a GAP filler or a heat dissipation sheet is used, it can be said to be a state in which heat is transferred indirectly between the heat transfer target 21a and the heat transfer member 31 (resin film 32) via this heat conductive member.

The manufacturing process (manufacturing method) of the heat transfer integral structure 30 described above will be described. First, the heat transfer structure 540 is manufactured (see FIG. 1E). The heat transfer structure 540 is manufactured by adhering the heat transfer member 31 to the resin film 32 by adhesion with an adhesive or fusion. Then, the heat transfer integral structure 30 is manufactured by attaching the heat transfer structure 540 to the separately molded first casing 11 (see FIG. 1D). At this time, the heat transfer member 31 of the heat transfer structure 540 is inserted (housed) in the attachment through hole 11b1, and the peripheral portion (adhered portion 32b) of the resin film 32 is adhered to the opening peripheral portion (adhered portion 11d) of the through hole 11b1 via the adhesive member 32a.

Second Embodiment
2A and 2B, a heat transfer integral structure 530 to which the heat transfer structure 40 according to the second embodiment is applied will be described. The heat transfer integral structure 530 differs from the heat transfer integral structure 30 according to the first embodiment in that the heat transfer integral structure 530 includes a heat transfer structure 40 instead of the heat transfer structure 540. As shown in Fig. 2A, the heat transfer integral structure 530 is formed to include a first casing 11 and a heat transfer structure 40 similar to those in the first embodiment.

As shown in FIG. 2A, the heat transfer structure 40 is attached to the first casing 11, which is the attachment member to which the heat transfer structure 40 is attached, so that the heat transfer member 41 is accommodated in the through hole 11b1 provided in the bottom 11b of the first casing 11. The heat transfer structure 40 (particularly the first heat transfer member 41a) is integrally provided in the through hole 11b1. The bottom 11b (and thus the first casing 11) and the heat transfer structure 40 are integrally formed to form a heat transfer integral structure 530.

2B, the heat transfer structure 40 mainly includes a sheet member 42 and a heat transfer member 41. The sheet member 42 is formed in a sheet shape and has an adhesive portion 42a that can be adhered to the adherend portion 11d (see FIG. 2A) of the first casing 11, which is the attachment member. The sheet member 42 is preferably formed in a planar shape. The sheet member 42 is provided so as to block the through hole 11b1, similar to the above-mentioned resin film 32. The size of the sheet member 42 is set to be larger than the size of the through hole 11b1. The peripheral portion of the sheet member 42 is adhered to the opening peripheral portion of the through hole 11b1 via an adhesive member 32a such as an adhesive or double-sided tape. The peripheral portion of the sheet member 42 is an adhesive portion 42a that can be adhered to the adherend portion 11d of the bottom 11b of the first casing 11. This makes it possible to seal (close) the through hole 11b1 with the sheet member 42. The adhesive portion 42a is preferably provided so as to surround the placement portion 42b where the heat transfer member 41 is placed in the sheet member 42. This makes it possible to seal (close) the through hole 11b1 with the sheet member 42 while ensuring high heat transfer with the heat transfer member 41 placed in the through hole 11b1.

The heat transfer member 41 is a heat transfer member that is formed of a material (e.g., a material similar to the heat transfer member 31 described above) that has a higher thermal conductivity than the first casing 11 (the member to which it is attached), is integrally provided in the arrangement portion 42b of the sheet member 42, and can be accommodated in the through hole 11b1, which is an attachment through hole formed to penetrate the first casing 11 in the thickness direction.

The heat transfer member 41 is formed of the same heat transfer material as the heat transfer member 31 described above. The heat transfer member 41 includes a first heat transfer member 41a provided on one side (upper side) of the sheet member 42 and a second heat transfer member 41b provided on the other side (lower side) of the sheet member 42. The first heat transfer member 41a and the second heat transfer member 41b are in close contact with the sheet member 42. Specifically, the first heat transfer member 41a is fixed to the arrangement portion 42b of the sheet member 42 by adhesion via an adhesive member 41a1. The second heat transfer member 41b is fixed to the arrangement portion 42b of the sheet member 42 by adhesion via an adhesive member 41b1. The first heat transfer member 41a and the second heat transfer member 41b are arranged to face each other with the adhesive member 41a1, the adhesive member 41b1, and the sheet member 42 in between.

The adhesive members 41a1, 41b1, and sheet member 42 are preferably set to a thickness and material that allows the heat transfer member 41 as a whole to maintain a thermal conductivity of a predetermined value (e.g., 2 W/m·K) or more. The predetermined value is preferably set to the same level as the thermal conductivity of the heat transfer member 31. In other words, the heat transfer member 41 is preferably formed so that the heat transfer member 41 as a whole, including the adhesive members 41a1, 41b1, and sheet member 42, has a higher thermal conductivity than the bottom 11b (plate-shaped portion). The first heat transfer member 41a and the second heat transfer member 41b may be directly attached (adhered) to the arrangement portion 42b of the sheet member 42 without the adhesive members 41a1 and 41b1, respectively.

As described above, the heat transfer member 41 is formed of a material with a higher thermal conductivity than the bottom 11b, and is a heat transfer section (similar to the heat transfer member 31 described above) that is provided in the through hole 11b1 so as to be in contact with the heat transfer target 21a and transfers heat between the heat transfer target 21a and the heat transfer member 41. Note that the portion of the heat transfer member 41 that is provided in the through hole 11b1 (in this embodiment, the first heat transfer member 41a) is not bonded to the through hole 11b1. The first heat transfer member 41a may also be bonded to the through hole 11b1 with an adhesive or the like, or may be in close contact with the through hole 11b1 with a sealant or the like.

The manufacturing process (manufacturing method) of the heat transfer integral structure 530 involves first manufacturing the heat transfer structure 40, and then attaching the heat transfer structure 40 to the separately molded first casing 11 to manufacture the heat transfer integral structure 530. The heat transfer structure 40 is manufactured by bonding the first heat transfer member 41a and the second heat transfer member 41b to the sheet member 42.

Third Embodiment
Further, a heat transfer structure 140 of the heat transfer integral structure according to the third embodiment will be described with reference to Fig. 3. The heat transfer integral structure according to the third embodiment differs from the heat transfer integral structure 530 according to the second embodiment described above in that the heat transfer integral structure according to the third embodiment includes a heat transfer structure 140 instead of the heat transfer structure 40. The heat transfer integral structure according to the third embodiment is formed to include a first casing 11 and a heat transfer structure 140 similar to those of the first embodiment.

The heat transfer structure 140 is attached to the first casing 11, which is the attachment member to which the heat transfer structure 140 is attached, so that the heat transfer member 141 is accommodated in the through hole 11b1 provided in the bottom 11b of the first casing 11. The heat transfer structure 140 (particularly the first heat transfer member 41a) is integrally provided in the through hole 11b1. The bottom 11b (and thus the first casing 11) and the heat transfer structure 140 are integrally formed, forming an integral heat transfer structure according to the third embodiment.

As shown in FIG. 3, the heat transfer structure 140 includes a sheet member 142 and a heat transfer member 141. The sheet member 142 is formed in a sheet shape and has an adhesive portion 42a that can be adhered to the adherend portion 11d of the first casing 11, which is the attachment member. The sheet member 142 is formed in the same manner as the sheet member 42 described above. The sheet member 142 is provided to block the through hole 11b1, similar to the sheet member 42 described above. The size of the sheet member 142 is set to be larger than the size of the through hole 11b1. The peripheral portion of the sheet member 142 is adhered to the opening peripheral portion of the through hole 11b1 via an adhesive member 32a such as an adhesive or double-sided tape. The peripheral portion of the sheet member 142 is an adhesive portion 42a that can be adhered to the adherend portion 11d of the bottom 11b of the first casing 11. The adhesive portion 42a is preferably provided so as to surround the arrangement portion 42b in which the heat transfer member 141 is arranged on the sheet member 142. The sheet member 142 has one or more sheet member through holes 142c that penetrate in the thickness direction. The sheet member through holes 142c are preferably provided within the range of the arrangement portion 42b.

The heat transfer member 141 is a heat transfer member that is formed of a material (e.g., a material similar to the heat transfer member 41) that has a higher thermal conductivity than the first casing 11 (the member to which it is attached), is integrally provided in the arrangement portion 42b of the sheet member 142, and can be accommodated in the through hole 11b1, which is an attachment through hole formed to penetrate the first casing 11 in the thickness direction.

The heat transfer member 141 is formed of the same heat transfer material as the heat transfer member 41 described above. The heat transfer member 141 includes a first heat transfer member 41a provided on one side (upper side) of the sheet member 142, a second heat transfer member 41b provided on the other side (lower side) of the sheet member 142, and one or more connecting portions 141c provided in the sheet member through holes 142c and connecting the first heat transfer member 41a and the second heat transfer member 41b. The first heat transfer member 41a and the second heat transfer member 41b are arranged to face each other with the sheet member 142 in between. The first heat transfer member 41a and the second heat transfer member 41b are in close contact (adhered) with the sheet member 142. The connecting portion 141c is formed in one or more sheet member through holes 142c. In this way, the first heat transfer member 41a and the second heat transfer member 41b sandwich the sheet member 142 via one or more connecting parts 141c, making it possible to firmly fix the heat transfer member 141 to the sheet member 142.

The sheet member 142 and the sheet member through hole 142c are preferably set to a thickness and shape that allows the heat transfer member 141 as a whole to maintain a thermal conductivity of a predetermined value (e.g., 2 W/m·K) or more. The predetermined value is preferably set to the same level as the thermal conductivity of the heat transfer member 31. In other words, the heat transfer member 141 is preferably formed so that the heat transfer member 141 as a whole, including the sheet member 142, has a higher thermal conductivity than the bottom 11b (plate-shaped portion). In addition, like the heat transfer member 41, the heat transfer member 141 is formed of a material with a higher thermal conductivity than the bottom 11b, and is provided in the through hole 11b1 so as to be in contact with the heat transfer target 21a, and can be said to be a heat transfer part (similar to the heat transfer part of the heat transfer member 31 described above) that transfers heat between the heat transfer target 21a and the heat transfer target 21a.

In addition, regarding the manufacturing process (manufacturing method) of the heat transfer integral structure according to the third embodiment, the heat transfer structure 140 is manufactured first, and then the heat transfer structure 140 is attached to the first casing 11 that is molded separately, thereby manufacturing the heat transfer integral structure according to the third embodiment. The heat transfer structure 140 is manufactured by placing a mold (jig) for forming the first heat transfer member 41a into a desired shape on the upper surface of the sheet member 142, placing a mold (jig) for forming the second heat transfer member 41b into a desired shape on the lower surface of the sheet member 142, and then pouring in a liquid heat transfer material. The heat transfer material is then hardened to form the heat transfer structure 140 (see FIG. 3). At this time, the heat transfer member 141 is adhesively fixed to the wall surface of the sheet member through hole 142c and the sheet member 142.

Fourth Embodiment
Further, a heat transfer structure 240 of the heat transfer integral structure according to the fourth embodiment will be described with reference to Fig. 4. The heat transfer integral structure according to the fourth embodiment differs from the heat transfer integral structure 530 according to the second embodiment described above in that the heat transfer integral structure according to the fourth embodiment includes a heat transfer structure 240 instead of the heat transfer structure 40. The heat transfer integral structure according to the fourth embodiment is formed to include a first casing 11 and a heat transfer structure 240 similar to those of the first embodiment.

The heat transfer structure 240 is attached to the first casing 11, which is the attachment member to which the heat transfer structure 240 is attached, so that the heat transfer member 241 is accommodated in the through hole 11b1 provided in the bottom 11b of the first casing 11. The heat transfer structure 240 is integrally provided in the through hole 11b1. The bottom 11b (and therefore the first casing 11) and the heat transfer structure 240 are integrally formed, forming the heat transfer integral structure according to the fourth embodiment.

As shown in FIG. 4, the heat transfer structure 240 includes a sheet member 42, a heat transfer member 241, and an encapsulation member 243. The sheet member 42 is formed in a sheet shape and has an adhesive portion 42a that can be adhered to the adherend portion 11d of the first casing 11, which is the attachment member. The sheet member 42 is provided so as to close the through hole 11b1. The size of the sheet member 42 is set to be larger than the size of the through hole 11b1.

The encapsulating member 243 is a member that forms a space S between the sheet member 42 and encapsulates the heat transfer member 241 in the space S. The encapsulating member 243 is formed of the same material as the sheet member 42. The encapsulating member 243 has an encapsulating portion 243a that forms the space S and is capable of accommodating the heat transfer member 241, and a connecting portion 243b that is integrally connected to the peripheral portion of the encapsulating portion 243a and is connected to the sheet member 42. It is preferable that the encapsulating portion 243a is set so as to cover the arrangement portion 42b in which the heat transfer member 241 is arranged. The connecting portion 243b is bonded to the peripheral portion of the sheet member 42 by adhesive, thermocompression, welding, etc. The connecting portion 243b is bonded to the opening peripheral portion of the through hole 11b1 via an adhesive member 32a such as an adhesive or double-sided tape. The peripheral portion of the sheet member 42 is an adhesive portion 42a for adhering to the adherend portion 11d of the bottom portion 11b of the first casing 11. It is preferable that the adhesive portion 42a is provided so as to surround the arrangement portion 42b in which the heat transfer member 241 is arranged on the sheet member 42.

The heat transfer member 241 is a heat transfer member that is formed of a material (e.g., a material similar to the heat transfer member 41) that has a higher thermal conductivity than the first casing 11 (the member to which it is attached), is integrally provided in the arrangement portion 42b of the sheet member 42, and can be accommodated in the through hole 11b1, which is an attachment through hole formed to penetrate the first casing 11 in the thickness direction.

The sheet member 42 and the encapsulation member 243 are preferably set to a thickness and shape that allows the thermal conductivity of the heat transfer member 241 as a whole to be maintained at a predetermined value (e.g., 2 W/m·K) or more. The predetermined value is preferably set to the same level as the thermal conductivity of the heat transfer member 31. In other words, the heat transfer member 241 is preferably formed so that the heat transfer member 241 as a whole, including the sheet member 42 and the encapsulation member 243, has a higher thermal conductivity than the bottom 11b (plate-shaped portion). In addition, like the heat transfer member 41, the heat transfer member 241 is formed of a material with a higher thermal conductivity than the bottom 11b, and is provided in the through hole 11b1 so as to be in contact with the heat transfer target 21a, and can be said to be a heat transfer part (similar to the heat transfer part of the heat transfer member 31 described above) that transfers heat between the heat transfer target 21a and the heat transfer target 21a.

In addition, in the manufacturing process (manufacturing method) of the heat transfer integral structure according to the fourth embodiment, the heat transfer structure 240 is manufactured first, and then the heat transfer structure 240 is attached to the first casing 11 that has been molded separately, thereby manufacturing the heat transfer integral structure according to the fourth embodiment. In the first manufacturing process (manufacturing method) of the heat transfer structure 240 according to the fourth embodiment, the encapsulating member 243 is attached and fixed while forming a space S in the sheet member 42, and then a liquid heat transfer material is poured into the space S and excess air is sucked out. The heat transfer material is then hardened to form the heat transfer structure 240 (see FIG. 4). At this time, the heat transfer member 241 is adhesively fixed to the sheet member 42 and the encapsulating member 243. Furthermore, in the second case, the heat transfer member 241 is first preformed into a predetermined shape (a shape corresponding to the through hole 11b1), and then the heat transfer member 241 is sandwiched between the sheet member 42 and the sealing member 243, and the peripheral portions of the sheet member 42 and the sealing member 243 are fused together while the air inside is sucked out (vacuum lamination). In either case, the heat transfer member 241 is fixed in close contact with the sheet member 42 and the sealing member 243.

In the fourth embodiment described above, a sheet member 42 formed in a flat shape is used, but a sheet member 242 provided with a convex portion 242c protruding downward may be used. In this case, as shown in FIG. 5, the convex portion 242c is preferably provided within the range of the arrangement portion 42b, and is preferably provided at a position corresponding to the encapsulation portion 243a. The convex portion 242c and the encapsulation portion 243a form a space S for accommodating the heat transfer member 241. According to this modification, by adjusting the amount of protrusion of the convex portion 242c, it is possible to adjust the amount of protrusion from the lower surface of the bottom portion 11b, and it is possible to adjust the degree of contact with the heat transfer structure 240.

(Actions and Effects of the Embodiments)
The heat transfer structure 40, 140, 240, 540 according to the above-mentioned embodiment includes a sheet member 32, 42, 142, 242 formed in a sheet shape and having an adhesive portion 32b, 42a that can be adhered to an adherend portion 11d of the attachment member (bottom) 11b, and a heat transfer member 31, 41, 141, 241 formed of a material having a higher thermal conductivity than the attachment member (bottom) 11b, integrally provided with the arrangement portion 32c, 42b of the sheet member 32, 42, 142, 242, and capable of being accommodated in an attachment through hole 11b1 formed to penetrate the attachment member (bottom) 11b in the thickness direction so as to be in contact with the heat transfer target 21a in a state capable of thermally conducting heat.

With this heat transfer structure 40, 140, 240, 540, it is possible to attach the heat transfer structure 40, 140, 240, 540 to the attachment member (bottom) 11b by accommodating the heat transfer member 31, 41, 141, 241 in the attachment through hole 11b1 provided in the attachment member (bottom) 11b so that it is in contact with the heat transfer target 21a in a thermally conductive state. As a result, it is possible to transfer heat from the heat transfer target 21a to the opposite side of the heat transfer target 21a via the heat transfer member 31, 41, 141, 241, i.e., across the attachment member (bottom) 11b. In other words, when the heat transfer target 21a is shielded by a shielding member with a relatively low thermal conductivity, by using the shielding member with a relatively low thermal conductivity as the attachment member (bottom) 11b and providing the heat transfer member 31, 41, 141, 241 on the shielding member, it is possible to transfer the heat of the heat transfer target 21a through the heat transfer member 31, 41, 141, 241, i.e., between the attachment member (bottom) 11b and the heat transfer target 21a. Furthermore, it is possible to provide a heat transfer structure 40, 140, 240, 540 that allows heat transfer between the heat transfer target 21a and the shielding member with a relatively low thermal conductivity.

In addition, in the heat transfer structure 40, 140, 240, 540, it is preferable that the adhesive portion 32b, 42a is provided so as to surround the arrangement portion 32c, 42b. This makes it possible to seal (close) the attachment through hole 11b1 with the sheet member 32, 42, 142, 242. Furthermore, it is possible to seal (close) the attachment through hole 11b1 with the sheet member 32, 42, 142, 242 while ensuring high heat transfer with the heat transfer member 31, 41, 141, 241 arranged in the attachment through hole 11b1.

In addition, it is preferable that the heat transfer structure 240 further includes an encapsulation member 243 that forms a space S between the sheet member 42 and encapsulates the heat transfer member 241 in the space S. This makes it possible to easily manufacture the heat transfer member 241 without providing a jig (mold) for forming the heat transfer member 241, and thus makes it possible to relatively easily manufacture the heat transfer structures 40, 140, 240, and 540.

In the heat transfer structure 40, 140, the heat transfer member 141, 241 includes a first heat transfer member 41a provided on one side of the sheet member 42, 142 and a second heat transfer member 41b provided on the other side of the sheet member 42, 142, and it is preferable that the first heat transfer member 41a and the second heat transfer member 41b are in close contact with the sheet member 42, 142. This makes it possible to manufacture the heat transfer structure 40, 140 relatively easily.

In the heat transfer structure 140, the sheet member 142 preferably has one or more sheet member through holes 142c penetrating in the thickness direction, and the heat transfer member 141 preferably has a first heat transfer member 41a provided on one side of the sheet member 142, a second heat transfer member 41b provided on the other side of the sheet member 142, and a connecting portion 141c provided in the sheet member through hole 142c and connecting the first heat transfer member 41a and the second heat transfer member 41b. This makes it possible to relatively easily manufacture a heat transfer structure 140 with relatively high thermal conductivity.

11b...attachment member (bottom), 11b1...attachment through hole (through hole), 11d...bonded portion, 21a...heat transfer target, 31, 41, 141, 241...heat transfer member, 32...resin film, 32, 42, 142, 242...sheet member, 32b, 42a...bonding portion, 32c, 42b...disposition portion, 40, 140, 240, 540...heat transfer structure, 41a...first heat transfer member, 41b...second heat transfer member, 141c...connecting portion, 243...enclosed member, S...space.

Claims (6)

A sheet member formed in a sheet shape and having an adhesive portion that can be adhered to an adherend portion of a target member;
a heat transfer member that is formed of a material having a higher thermal conductivity than the attachment member, that is integrally provided with the arrangement portion of the sheet member, and that can be accommodated in an attachment through hole that is formed so as to penetrate the attachment member in a thickness direction thereof so as to be in contact with a heat transfer target in a state in which heat can be transferred thereto;
Equipped with
A heat transfer structure, further comprising an enclosure member that forms a space between the sheet member and the heat transfer member and encloses the heat transfer member in the space. A sheet member formed in a sheet shape and having an adhesive portion that can be adhered to an adherend portion of a target member;
a heat transfer member that is formed of a material having a higher thermal conductivity than the attachment member, that is integrally provided with the arrangement portion of the sheet member, and that can be accommodated in an attachment through hole that is formed so as to penetrate the attachment member in a thickness direction thereof so as to be in contact with a heat transfer target in a state in which heat can be transferred thereto;
Equipped with
The sheet member has one or more sheet member through holes penetrating in a thickness direction,
The heat transfer structure is characterized in that the heat transfer member comprises a first heat transfer member provided on one side of the sheet member, a second heat transfer member provided on the other side of the sheet member, and a connecting portion provided in the sheet member through hole for connecting the first heat transfer member and the second heat transfer member. A sheet member formed in a sheet shape and having an adhesive portion that can be adhered to an adherend portion of a target member;
a heat transfer member that is formed of a material having a higher thermal conductivity than the attachment member, that is integrally provided with the arrangement portion of the sheet member, and that can be accommodated in an attachment through hole that is formed so as to penetrate the attachment member in a thickness direction thereof so as to be in contact with a heat transfer target in a state in which heat can be transferred thereto;
Equipped with
A heat transfer structure, wherein the heat transfer member is formed from a material in which a thermally conductive filler is added to a base material selected from the group consisting of silicone-based, urethane resin-based, and rubber-based materials. A sheet member formed in a sheet shape and having an adhesive portion that can be adhered to an adherend portion of a target member;
a heat transfer member that is formed of a material having a higher thermal conductivity than the attachment member, that is integrally provided with the arrangement portion of the sheet member, and that can be accommodated in an attachment through hole that is formed so as to penetrate the attachment member in a thickness direction thereof so as to be in contact with a heat transfer target in a state in which heat can be transferred thereto;
Equipped with
The heat transfer structure, wherein the sheet member is a resin film made only of a resin component . The heat transfer structure according to claim 4, characterized in that the resin film is formed from a material selected from an olefin-based material, an olefin-based elastomer (TPO), polyethylene terephthalate (PET), a urethane-based material, ethylene vinyl acetate (EVA), polyvinyl chloride (PVC), and a fluororesin. A sheet member formed in a sheet shape and having an adhesive portion that can be adhered to an adherend portion of a target member;
a heat transfer member formed of a material having a higher thermal conductivity than the target member, integrally provided on the installation portion of the sheet member, and capable of being accommodated in a target through hole formed to penetrate the target member in a thickness direction so as to be in contact with a heat transfer target in a state capable of thermally conducting therethrough;
The attachment member;
A method for producing an integral heat transfer structure formed by the following method:
a step of bonding the heat transfer member to the sheet member to manufacture the heat transfer structure;
Thereafter, attaching the heat transfer structure to the attachment member;
A method for producing an integral heat transfer structure comprising the steps of:

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