JP7602115B2 - Method for manufacturing cylindrical or ring-shaped wavelength conversion member - Google Patents
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Description
本開示は、円柱状またはリング状の波長変換部材の製造方法に関する。 This disclosure relates to a method for manufacturing cylindrical or ring-shaped wavelength conversion members.
発光ダイオード（ＬＥＤ）等の発光素子を備える発光装置として、例えば、特許文献１に開示されたように、発光素子と、発光素子の上に配置された波長変換部材と、を組み合わせたものが知られている。 As a light-emitting device equipped with a light-emitting element such as a light-emitting diode (LED), for example, a combination of a light-emitting element and a wavelength conversion member disposed on the light-emitting element is known, as disclosed in Patent Document 1.
上記波長変換部材としては、発光装置の用途に応じて寸法精度の高い円柱状やリング状のものが求められる場合がある。本発明の実施形態は、寸法精度の高い円柱状またはリング状の波長変換部材を効率よく製造可能な方法を提供することを目的とする。 The wavelength conversion member may be required to be cylindrical or ring-shaped with high dimensional accuracy depending on the application of the light emitting device. An object of the present invention is to provide a method for efficiently manufacturing cylindrical or ring-shaped wavelength conversion members with high dimensional accuracy.
上記目的を達成するために、本発明の一態様は、
板状の波長変換部材を保持体上に保持する工程と、
保持した前記板状の波長変換部材に切削加工処理を施して、円柱状の波長変換部材の前駆体を含む波長変換部材ブロックを形成する工程と、
前記円柱状の波長変換部材の前駆体を個片化する工程と、
を含み、
前記切削加工処理として、粗加工および仕上げ加工の少なくとも２つを含む切削加工処理を行う、円柱状の波長変換部材の製造方法である。
In order to achieve the above object, one aspect of the present invention is to
A step of holding a plate-shaped wavelength conversion member on a holder;
a step of performing a cutting process on the held plate-like wavelength conversion member to form a wavelength conversion member block including a cylindrical wavelength conversion member precursor;
A step of singulating the cylindrical wavelength conversion member precursor;
Including,
The cutting process includes at least two processes, ie, rough processing and finish processing, in the manufacturing method of a cylindrical wavelength conversion member.
上記目的を達成するために、本発明の一態様は、
板状の波長変換部材を基材上に保持する工程と、
保持した前記板状の波長変換部材に対して略同心円でかつ互いに径寸法の異なる第１の切削加工処理と第２の切削加工処理をそれぞれ略円周状に施すことで、リング状の波長変換部材の前駆体を形成する工程と、
を含み、
前記第１の切削加工処理および前記第２の切削加工処理においてそれぞれ、粗加工および仕上げ加工の少なくとも２つを含む切削加工処理を行う、リング状の波長変換部材の製造方法である。
In order to achieve the above object, one aspect of the present invention is to
A step of holding a plate-shaped wavelength conversion member on a substrate;
a step of forming a ring-shaped precursor of the wavelength conversion member by subjecting the held plate-shaped wavelength conversion member to a first cutting process and a second cutting process, which are substantially concentric and have different diameters, in a substantially circumferential shape;
Including,
In the method for manufacturing a ring-shaped wavelength conversion member, each of the first cutting process and the second cutting process includes at least two cutting processes, namely, rough cutting and finishing.
本発明の一態様に従えば、寸法精度の高い円柱状またはリング状の波長変換部材を効率よく製造可能である。 According to one aspect of the present invention, it is possible to efficiently manufacture cylindrical or ring-shaped wavelength conversion members with high dimensional accuracy.
[円柱状またはリング状の波長変換部材の製造方法］
以下、図面に基づいて本発明の一態様に係る円柱状またはリング状の波長変換部材の製造方法について説明する。なお、以下の説明では、必要に応じて特定の方向や位置を示す用語を用いる。しかしながら、これらの用語の使用は図面を参照した発明の理解を容易にするためであって、これらの用語の意味によって本発明の技術的範囲が制限されるものではない。又、複数の図面に表れる同一符号の部分は同一または同等の部分を指す。なお、図面では下記実施形態で説明する所定の構成要素と関連するものだけでなく、当該所定の構成要素と直接関連しない構成要素にも符号を付している。
[Method of manufacturing cylindrical or ring-shaped wavelength conversion member]
Hereinafter, a method for manufacturing a cylindrical or ring-shaped wavelength conversion member according to one aspect of the present invention will be described with reference to the drawings. In the following description, terms indicating specific directions or positions will be used as necessary. However, the use of these terms is for the purpose of facilitating understanding of the invention with reference to the drawings, and the meanings of these terms do not limit the technical scope of the present invention. In addition, parts with the same reference numerals appearing in multiple drawings refer to the same or equivalent parts. In addition, in the drawings, not only those related to specific components described in the following embodiments, but also those components that are not directly related to the specific components are given reference numerals.
更に、以下に示す実施形態は、本発明の技術的思想を具体化するための円柱状またはリング状の波長変換部材の製造方法を例示するものであって、本発明を限定するものではない。また、以下に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限り、本発明の範囲をそれのみに限定する趣旨ではなく、例示することを意図したものである。また、図面が示す部材の大きさおよび位置関係等は、説明を明確にするため誇張している場合がある。 Furthermore, the embodiments shown below are illustrative of a method for manufacturing a cylindrical or ring-shaped wavelength conversion member to embody the technical ideas of the present invention, and are not intended to limit the present invention. Furthermore, unless otherwise specified, the dimensions, materials, shapes, relative positions, etc. of the components described below are intended to be illustrative and not to limit the scope of the present invention. Furthermore, the sizes and positional relationships of the components shown in the drawings may be exaggerated to clarify the explanation.
以下で具体的に述べるが、本発明の一態様に係る円柱状またはリング状の波長変換部材の製造方法はいずれも、板状の波長変換部材に切削加工処理を施す際に、粗加工および仕上げ加工の少なくとも２つの加工を含む切削加工処理を行うという点に特徴を有する。 As will be described in detail below, the manufacturing method of a cylindrical or ring-shaped wavelength conversion member according to one embodiment of the present invention is characterized in that when a cutting process is performed on a plate-shaped wavelength conversion member, the cutting process includes at least two processes, namely, rough processing and finishing processing.
これにより、第１段階で粗加工により所定形状の波長変換部材の前駆体を形成し、次いで第２段階で所望の寸法となるようにこの所定形状の波長変換部材の前駆体に対して仕上げ加工を行うため、１段階のみの切削加工処理を施す場合と比べて最終的に所望の寸法を有する波長変換部材を得やすくなる。その結果、本発明によれば、寸法精度の高い波長変換部材を効率よく得ることが可能となる。特に、かかる特徴に従い、少なくとも２つの円柱状の波長変換部材を製造する場合、各円柱状の波長変換部材の寸法のばらつきを小さくできる点で有利である。同様に、少なくとも２つのリング状の波長変換部材を製造する場合、リング状の波長変換部材の各々の寸法のばらつきを小さくできる点で有利である。 As a result, a precursor of the wavelength conversion member having a predetermined shape is formed by rough machining in the first stage, and then this precursor of the wavelength conversion member having a predetermined shape is finished to obtain the desired dimensions in the second stage, so that it is easier to obtain a wavelength conversion member having the desired dimensions in the end compared to a case where only one cutting process is performed. As a result, according to the present invention, it is possible to efficiently obtain a wavelength conversion member having high dimensional accuracy. In particular, when at least two cylindrical wavelength conversion members are manufactured according to this characteristic, it is advantageous in that the dimensional variation of each cylindrical wavelength conversion member can be reduced. Similarly, when at least two ring-shaped wavelength conversion members are manufactured, it is advantageous in that the dimensional variation of each ring-shaped wavelength conversion member can be reduced.
以下では、実施形態１から３にて円柱状の波長変換部材の製造方法について説明し、実施形態４から７にてリング状の波長変換部材の製造方法について説明する。 Below, a method for manufacturing a cylindrical wavelength conversion member is described in embodiments 1 to 3, and a method for manufacturing a ring-shaped wavelength conversion member is described in embodiments 4 to 7.
＜円柱状の波長変換部材の製造方法＞
実施形態１
以下、図面を参照しながら、本発明の実施形態１に係る円柱状の波長変換部材の製造方法について説明する。
<Method of manufacturing cylindrical wavelength conversion member>
EMBODIMENT 1
Hereinafter, a method for manufacturing a cylindrical wavelength conversion member according to a first embodiment of the present invention will be described with reference to the drawings.
（板状の波長変換部材の準備工程）
まず、板状の波長変換部材を準備する。板状の波長変換部材３０Ａとしては、板状の波長変換焼結体を用いることができる。板状の波長変換焼結体は、例えば、蛍光体粉末と無機物粉末との混合物を原料として、特開２０１８－１７２６２８号公報に開示された方法によって得たり、その他、蛍光体粉末と無機物粉末との混合物を、放電プラズマ焼結法（ＳＰＳ法）を用いて無機物粉末を溶融し冷却することにより得たりすることができる。ＳＰＳ法は、蛍光体粉末と無機物粉末との粉体混合物に対して低電圧でパルス状大電流を供給し、火花放電現象により発生する放電プラズマの高エネルギーにより無機物粉末を溶融させるものである。
(Preparation process of plate-shaped wavelength conversion member)
First, a plate-shaped wavelength conversion member is prepared. A plate-shaped wavelength conversion sintered body can be used as the plate-shaped wavelength conversion member 30A. The plate-shaped wavelength conversion sintered body can be obtained, for example, by using a mixture of phosphor powder and inorganic powder as a raw material, by the method disclosed in JP 2018-172628 A, or by melting and cooling the mixture of phosphor powder and inorganic powder using a discharge plasma sintering method (SPS method). The SPS method supplies a pulsed large current at a low voltage to a powder mixture of phosphor powder and inorganic powder, and melts the inorganic powder by the high energy of the discharge plasma generated by the spark discharge phenomenon.
蛍光体粉末としては、黄色系の発光をするＹＡＧ蛍光体（（Ｙ，Ｌｕ，Ｇｄ）３（Ａｌ，Ｇａ）５Ｏ１２：Ｃｅ）粉末、緑色系の発光をするβサイアロン蛍光体粉末、赤色系の発光をするフッ化物系蛍光体粉末（Ｋ２（Ｓｉ，Ｔｉ，Ｇｅ,Ａｌ）Ｆ６：Ｍｎ）、窒化物系蛍光体（例えば、（Ｓｒ，Ｃａ）ＡｌＳｉＮ３：Ｅｕ）粉末等が挙げられる。一例としては、蛍光体粉末としては、上記ＹＡＧ蛍光体粉末を用いることができる。かかる蛍光体粉末は、一種類でも、複数種から構成されていてもよい。無機物粉末としては、例えば酸化アルミニウム（Ａｌ２Ｏ３）を用いることができる。蛍光体粉末として上記ＹＡＧ蛍光体粉末を用い、無機物粉末として酸化アルミニウム（Ａｌ２Ｏ３）を用いる場合、上記焼結法により板状の焼結体を得ることができる。 Examples of the phosphor powder include a YAG phosphor ((Y, Lu, Gd) 3 (Al, Ga) 5 O 12 : Ce) powder that emits yellow light, a β-sialon phosphor powder that emits green light, a fluoride phosphor powder (K 2 (Si, Ti, Ge, Al) F 6 : Mn) that emits red light, and a nitride phosphor (e.g., (Sr, Ca) AlSiN 3 : Eu) powder. As an example, the YAG phosphor powder can be used as the phosphor powder. Such phosphor powder may be composed of one type or multiple types. As the inorganic powder, for example, aluminum oxide (Al 2 O 3 ) can be used. When the YAG phosphor powder is used as the phosphor powder and aluminum oxide (Al 2 O 3 ) is used as the inorganic powder, a plate-shaped sintered body can be obtained by the sintering method.
（板状の波長変換部材の保持工程）
図１に示すように、準備した板状の波長変換部材３０Ａを保持体１０Ａ上に保持する。具体的には、板状の波長変換部材３０Ａをワックス２０Ａ付きの保持体１０Ａに保持する。ワックス２０Ａとしては、常温において固体であり水に溶けず、加熱時に軟性を有する性質を有するものを選択することができる。ワックスは、高級脂肪酸と一価または二価の高級アルコールとのエステルであり、例えばロウであり得る。
(Step of holding plate-shaped wavelength conversion member)
As shown in Fig. 1, a prepared plate-shaped wavelength conversion member 30A is held on a holder 10A. Specifically, the plate-shaped wavelength conversion member 30A is held on the holder 10A with wax 20A. As the wax 20A, a material that is solid at room temperature, insoluble in water, and softens when heated can be selected. The wax is an ester of a higher fatty acid and a monohydric or dihydric higher alcohol, and can be, for example, wax.
（板状の波長変換部材への切削加工処理工程）
図１に示すように、板状の波長変換部材３０Ａを保持した後、図２に示すように、保持した板状の波長変換部材３０Ａに切削加工処理を施す。具体的には、切削工具４０Ａを用いて板状の波長変換部材３０Ａの表側主面３１Ａに切削加工を行い、所定の間隔をおいて円柱状の波長変換部材の前駆体５１Ａを有する波長変換部材ブロック５０Ａを形成する。かかる切削加工により、円柱状の波長変換部材の前駆体５１Ａと前駆体５１Ａに連続する波長変換部材のボディ部分５５Ａとから構成される波長変換部材ブロック５０Ａを形成する。実施形態１では、この円柱状の波長変換部材の前駆体５１Ａは、平面視すると円形であり、中心軸が波長変換部材ブロック５０Ａの主面５６Ａに直交している。
(Cutting process for plate-shaped wavelength conversion member)
As shown in Fig. 1, after holding the plate-shaped wavelength conversion member 30A, as shown in Fig. 2, a cutting process is performed on the held plate-shaped wavelength conversion member 30A. Specifically, a cutting tool 40A is used to cut the front main surface 31A of the plate-shaped wavelength conversion member 30A, and a wavelength conversion member block 50A having cylindrical wavelength conversion member precursors 51A at a predetermined interval is formed. By this cutting process, a wavelength conversion member block 50A is formed, which is composed of a cylindrical wavelength conversion member precursor 51A and a wavelength conversion member body portion 55A continuous with the precursor 51A. In the first embodiment, the cylindrical wavelength conversion member precursor 51A is circular in plan view, and the central axis is perpendicular to the main surface 56A of the wavelength conversion member block 50A.
特に、本実施形態では、図２に示すように、上記切削加工処理として粗加工および仕上げ加工の少なくとも２つを含む切削加工処理を行う。具体的には、第１段階として、第１の切削工具４１Ａを用いて板状の波長変換部材３０Ａに粗加工を行い、円柱状の波長変換部材の前駆体５１Ａに相当する凸部を形成する。第１の切削工具４１Ａとして粒度が＃２００～１０００のものが好ましく、例えば＃４００の電着工具を用いることができる。粗加工された円柱状の波長変換部材の前駆体５１Ａの側面は、８μｍ以上２０μｍ以下の算術平均粗さＲｚを有する。 In particular, in this embodiment, as shown in FIG. 2, the cutting process includes at least two of rough machining and finish machining. Specifically, in the first stage, rough machining is performed on the plate-shaped wavelength conversion member 30A using a first cutting tool 41A to form a convex portion corresponding to a cylindrical precursor 51A of the wavelength conversion member. The first cutting tool 41A preferably has a grain size of #200 to 1000, and for example, a #400 electroplating tool can be used. The side surface of the roughly machined cylindrical precursor 51A of the wavelength conversion member has an arithmetic mean roughness Rz of 8 μm or more and 20 μm or less.
ここでいう算術平均粗さＲｚとは、ＪＩＳ Ｂ０６０１で規定されている粗さＲｚのことを言う。つまり、Ｒｚは、粗さ曲線からその平均線の方向に基準長さだけを抜き取り、この抜取り部分の平均線から縦倍率の方向に測定した、最も高い山頂から５番目までの山頂の標高(Ｙｐ)の絶対値の平均値と、最も低い谷底から５番目までの谷底の標高(Ｙｖ)の絶対値の平均値との和を求め、この値をマイクロメートル(μｍ)で表したものをいう（ＪＩＳ Ｂ０６０１：１９９４参照）。 The arithmetic mean roughness Rz referred to here is the roughness Rz specified in JIS B0601. In other words, Rz is calculated by taking a reference length from the roughness curve in the direction of the mean line, measuring from the mean line of this taken portion in the direction of the longitudinal magnification, calculating the sum of the average of the absolute values of the elevations (Yp) of the five highest peaks and the average of the absolute values of the elevations (Yv) of the five lowest valleys, and expressing this value in micrometers (μm) (see JIS B0601:1994).
次に、第２段階として、上記粗加工により形成した円柱状の波長変換部材の前駆体５１Ａの表面に対して第２の切削工具４２Ａを用いて仕上げ加工を行う。第２の切削工具４２Ａとして粒度が♯２５００～５０００のものが好ましく、例えば＃３０００の電着工具を用いることができる。これにより、所望の寸法を有しかつ算術平均粗さＲｚが２μｍ以上８μｍ未満である円柱状の波長変換部材の前駆体５２Ａを得ることができる。仕上げ加工を行う箇所としては、例えば、粗加工により形成した円柱状の波長変換部材の前駆体５１Ａの側面５１Ａａを少なくとも含む前駆体５１Ａの表面である。 Next, in the second step, the surface of the cylindrical wavelength conversion member precursor 51A formed by the above rough processing is finished using a second cutting tool 42A. The second cutting tool 42A is preferably one with a grain size of #2500 to 5000, and for example, a #3000 electroplating tool can be used. This makes it possible to obtain a cylindrical wavelength conversion member precursor 52A having the desired dimensions and an arithmetic mean roughness Rz of 2 μm or more and less than 8 μm. The area where the finishing process is performed is, for example, the surface of precursor 51A including at least the side surface 51Aa of cylindrical wavelength conversion member precursor 51A formed by rough processing.
上述の少なくとも２つの切削加工により、第１段階で粗加工により円柱状の波長変換部材の前駆体を形成し、次いで第２段階で所望の寸法、具体的には所望の径寸法となるように円柱状の波長変換部材の前駆体に対して仕上げ加工を行うため、１段階のみの切削加工処理を施す場合と比べて、円柱状の波長変換部材の前駆体を所望の寸法としやすくなる。特に、少なくとも２つの円柱状の波長変換部材の前駆体を形成する場合、円柱状の波長変換部材の前駆体の各々の寸法のばらつきを小さくできる。更に、少なくとも２段階の切削加工により、円柱状の波長変換部材の前駆体の表面粗さも所定の範囲となるように制御しやすくなる。 By performing the at least two cutting processes described above, a cylindrical precursor of the wavelength conversion member is formed by rough processing in the first stage, and then the cylindrical precursor of the wavelength conversion member is finished to have the desired dimensions, specifically the desired diameter dimensions, in the second stage. This makes it easier to obtain the cylindrical precursor of the wavelength conversion member with the desired dimensions compared to a case where only one cutting process is performed. In particular, when at least two cylindrical precursors of the wavelength conversion member are formed, the variation in the dimensions of each of the cylindrical precursors of the wavelength conversion member can be reduced. Furthermore, by performing the at least two cutting processes, the surface roughness of the cylindrical precursor of the wavelength conversion member can be easily controlled to be within a predetermined range.
なお、上記第１の切削工具４１Ａおよび上記第２の切削工具４２Ｂを用いた切削加工については、コンピュータ上にて予め決定／制御した切削タイミング、切削領域、切削加工パス、および用いる切削工具の種類等の情報に基づき行うことができる。具体的には、数値制御（ＮＣ：Ｎｕｍｅｒｉｃａｌ Ｃｏｎｔｒｏｌ）工作機械またはそれに準ずるもの（以下、ＮＣ工作機械等という。）を用い、コンピュータ処理にて得た情報からプログラム変換した数値情報を、当該ＮＣ工作機械等に対して命令する。これにより、ＮＣ工作機械等として用いる切削工具（電着工具等）の動作を好適に制御し得る。 The cutting process using the first cutting tool 41A and the second cutting tool 42B can be performed based on information such as the cutting timing, cutting area, cutting path, and type of cutting tool to be used that are determined/controlled in advance on a computer. Specifically, a numerically controlled (NC) machine tool or an equivalent (hereinafter referred to as an NC machine tool, etc.) is used, and numerical information converted from information obtained by computer processing is used to command the NC machine tool, etc. This allows the operation of the cutting tool (electroplated tool, etc.) used as the NC machine tool, etc. to be suitably controlled.
特に限定されるものではないが、粗加工完了時の円柱状の波長変換部材の前駆体５１Ａは、高さが例えば３５０μｍ以上１０００μｍ以下、例えば４５０μｍであり、直径が例えば１９０μｍ以上３００μｍ以下、例えば２００μｍであり得る。又、仕上げ加工を終えた円柱状の波長変換部材の前駆体５２Ａは、高さが例えば３５０μｍ以上１０００μｍ以下、例えば４５０μｍであり、直径が例えば５０μｍ以上１９０μｍ以下、例えば１６０μｍであり得る。 Although not particularly limited, the cylindrical wavelength conversion member precursor 51A after rough processing may have a height of, for example, 350 μm to 1000 μm, for example 450 μm, and a diameter of, for example, 190 μm to 300 μm, for example 200 μm. Furthermore, the cylindrical wavelength conversion member precursor 52A after finishing processing may have a height of, for example, 350 μm to 1000 μm, for example 450 μm, and a diameter of, for example, 50 μm to 190 μm, for example 160 μm.
（波長変換部材ブロックの反転工程）
仕上げ加工済みの波長変換部材ブロック５０Ａの形成後、図３に示すように、この波長変換部材ブロック５０Ａを、ワックス２０Ａから一旦離して上下反転させ、波長変換部材の前駆体５２Ａがワックス２０Ａに埋設されるようにワックス２０Ａに再度貼り付ける。具体的には、（１）ワックス２０Ａから波長変換部材ブロック５０Ａを分離させて、（２）波長変換部材ブロック５０Ａを反転させ、（３）ワックス２０Ａを加熱して軟化させ、波長変換部材ブロック５０Ａの裏側主面５６Ａを上にして円柱状の波長変換部材の前駆体５２Ａをワックス２０Ａに対向させ、（４）波長変換部材ブロック５０Ａを押圧して円柱状の波長変換部材の前駆体５２Ａがワックス２０Ａに埋設されるように波長変換部材ブロック５０Ａをワックス２０Ａに再度貼り付ける。
(Inversion process of wavelength conversion member block)
After the finished wavelength conversion member block 50A is formed, as shown in Fig. 3, the wavelength conversion member block 50A is temporarily removed from the wax 20A and turned upside down, and is then attached again to the wax 20A so that the precursor 52A of the wavelength conversion member is embedded in the wax 20A. Specifically, (1) the wavelength conversion member block 50A is separated from the wax 20A, (2) the wavelength conversion member block 50A is turned upside down, (3) the wax 20A is heated and softened, and the cylindrical precursor 52A of the wavelength conversion member block 50A is placed facing the wax 20A with the back main surface 56A of the wavelength conversion member block 50A facing up, and (4) the wavelength conversion member block 50A is pressed to attach the wavelength conversion member block 50A again to the wax 20A so that the cylindrical precursor 52A of the wavelength conversion member is embedded in the wax 20A.
（波長変換部材ブロックの研削工程）
波長変換部材ブロック５０Ａの反転後、この波長変換部材ブロック５０Ａに研削加工処理を行う。実施形態１では、この研削加工処理によって波長変換部材ブロック５０Ａのボディ部分５５Ａを除去する。
(Grinding process of wavelength conversion member block)
After the wavelength conversion member block 50A is turned over, a grinding process is performed on the wavelength conversion member block 50A. In the first embodiment, the body portion 55A of the wavelength conversion member block 50A is removed by the grinding process.
具体的には、まず、図３および図４に示すように、波長変換部材ブロック５０Ａの裏側主面５６Ａに第１研削部材８１Ａを用いた研削加工処理を行う。第１研削部材８１Ａとして粒度が♯２００～１０００のものが好ましく、例えば♯６００のダイヤモンド砥石を用い、砥石回転数５００～１０００ｒｐｍの条件下で研削処理を行う。 Specifically, first, as shown in Figures 3 and 4, a grinding process is performed on the rear main surface 56A of the wavelength conversion member block 50A using a first grinding member 81A. The first grinding member 81A preferably has a grain size of #200 to 1000, and for example, a #600 diamond grinding wheel is used, and the grinding process is performed under conditions of a grinding wheel rotation speed of 500 to 1000 rpm.
研削加工処理で波長変換部材ブロック５０Ａのボディ部分５５Ａを除去することにより、円柱状の波長変換部材の前駆体５２Ａをワックス２０Ａに埋設された状態で分離することができる。これにより、ワックス２０Ａに埋設された円柱状の波長変換部材の前駆体５２Ａの表面の一部（上面に相当）を露出させることができる。実施形態１では、ワックス２０Ａの上面に露出された前駆体５２Ａの表面の一部は、円柱状の波長変換部材の前駆体５２Ａの一方の端面である。この際の円柱状の波長変換部材の前駆体５２Ａの高さは、例えば３５０μｍ以上１０００μｍ以下、例えば４５０μｍであり得る。 By removing the body portion 55A of the wavelength conversion member block 50A by a grinding process, the cylindrical wavelength conversion member precursor 52A can be separated while still embedded in the wax 20A. This allows a portion of the surface (corresponding to the upper surface) of the cylindrical wavelength conversion member precursor 52A embedded in the wax 20A to be exposed. In the first embodiment, the portion of the surface of the precursor 52A exposed to the upper surface of the wax 20A is one end surface of the cylindrical wavelength conversion member precursor 52A. In this case, the height of the cylindrical wavelength conversion member precursor 52A can be, for example, 350 μm or more and 1000 μm or less, for example, 450 μm.
その後、図５および図６に示すように、円柱状の波長変換部材の前駆体５２Ａが所定高さとなるように、ワックス２０Ａと円柱状の波長変換部材の前駆体５２Ａが一体化された状態で研削加工処理を行う。本実施形態では、一例として下記に示すように２段階の研削加工処理を施す場合を例に採る。しかしながら、これに限定されることなく３段階以上の研削処理を行うことができる。 Then, as shown in Figures 5 and 6, a grinding process is performed while the wax 20A and the cylindrical wavelength conversion member precursor 52A are integrated together so that the cylindrical wavelength conversion member precursor 52A has a predetermined height. In this embodiment, as an example, a two-stage grinding process is performed as shown below. However, the present invention is not limited to this, and three or more stages of grinding process can be performed.
具体的には、ワックス２０Ａと円柱状の波長変換部材の前駆体５２Ａが一体化された状態で、第２研削部材８２Ａを用いて研削加工処理を行う。この第２研削部材８２Ａとして粒度が♯１５００～３０００のものが好ましく、例えば♯２０００のダイヤモンド砥石を用い、砥石回転数５００～１０００ｒｐｍの条件下で研削処理を行う。この研削加工処理により、図５に示すように、ワックス２０Ａと一体化された状態で、図４に示す円柱状の波長変換部材の前駆体５２Ａよりも高さが低い、円柱状の波長変換部材の前駆体５３Ａを得ることができる。円柱状の波長変換部材の前駆体５３Ａの高さは例えば２００μｍ以上３５０μｍ未満、例えば１５０μｍであり得る。 Specifically, the wax 20A and the cylindrical wavelength conversion member precursor 52A are integrated together, and a grinding process is performed using the second grinding member 82A. The second grinding member 82A is preferably one having a grain size of #1500 to 3000, and for example, a #2000 diamond grinding wheel is used, and the grinding process is performed under conditions of a grinding wheel rotation speed of 500 to 1000 rpm. As a result of this grinding process, as shown in FIG. 5, a cylindrical wavelength conversion member precursor 53A can be obtained that is integrated with the wax 20A and has a lower height than the cylindrical wavelength conversion member precursor 52A shown in FIG. 4. The height of the cylindrical wavelength conversion member precursor 53A can be, for example, 200 μm or more and less than 350 μm, for example, 150 μm.
続けて、ワックス２０Ａと円柱状の波長変換部材の前駆体５３Ａが一体化された状態で第３研削部材８３Ａを用いて研削加工処理を行う。第３研削部材８３Ａとして粒度が♯５０００～１５０００のものが好ましく、例えば♯１００００のダイヤモンド砥石を用い、砥石回転数５００～１０００ｒｐｍの条件下で研削処理を行う。この研削加工処理により、図６に示すように、ワックス２０Ａと一体化された状態で、図５に示す円柱状の波長変換部材の前駆体５３Ａよりも高さが低い、円柱状の波長変換部材の前駆体５４Ａを得ることができる。円柱状の波長変換部材の前駆体５４Ａの高さは、例えば５０μｍ以上１５０μｍ未満、例えば１００μｍであり得る。 Then, a grinding process is performed using the third grinding member 83A while the wax 20A and the cylindrical wavelength conversion member precursor 53A are integrated. The third grinding member 83A is preferably one having a grain size of #5000 to 15000, and for example, a diamond grinding wheel of #10000 is used, and the grinding process is performed under conditions of a grinding wheel rotation speed of 500 to 1000 rpm. This grinding process can obtain a cylindrical wavelength conversion member precursor 54A, which is integrated with the wax 20A and has a lower height than the cylindrical wavelength conversion member precursor 53A shown in FIG. 5, as shown in FIG. 6. The height of the cylindrical wavelength conversion member precursor 54A can be, for example, 50 μm or more and less than 150 μm, for example, 100 μm.
（円柱状の波長変換部材の前駆体の個片化工程）
最後に、ホットプレート等を用いてワックスの融点以上の温度でワックスを加熱することでワックスを溶解させ、円柱状の波長変換部材の前駆体５４Ａに付着していたワックスを除去する。これにより、図６に示された円柱状の波長変換部材の前駆体５４Ａを図７に示すように個片化させ、それによって最終的に円柱状の波長変換部材６０Ａを得ることができる。
(Step of singulating precursor of cylindrical wavelength conversion member)
Finally, the wax is melted by heating the wax to a temperature equal to or higher than the melting point of the wax using a hot plate or the like, and the wax adhering to the cylindrical wavelength conversion member precursor 54A is removed. This causes the cylindrical wavelength conversion member precursor 54A shown in Fig. 6 to be divided into individual pieces as shown in Fig. 7, thereby finally obtaining the cylindrical wavelength conversion member 60A.
以上のように、実施形態１の円柱状の波長変換部材の製造方法は、切削加工処理工程にて粗加工および仕上げ加工の少なくとも２つの加工を含む切削加工処理を行う。これにより、１段階のみの切削加工処理を施す場合と比べて、波長変換部材ブロックに含まれる円柱状の波長変換部材の前駆体を所望の寸法としやすくなる。その結果、上記の個片化工程を経て最終的に得られる円柱状の波長変換部材を寸法精度の高いものとすることができる。 As described above, the manufacturing method of the cylindrical wavelength conversion member of the first embodiment performs cutting processing including at least two processes, rough processing and finish processing, in the cutting processing step. This makes it easier to cut the cylindrical wavelength conversion member precursor contained in the wavelength conversion member block to the desired dimensions compared to a case where only one cutting processing step is performed. As a result, the cylindrical wavelength conversion member finally obtained through the above-mentioned singulation process can have high dimensional accuracy.
また、少なくとも２段階の切削加工により円柱状の波長変換部材の前駆体の表面粗さも所定の範囲となるように制御しやすくなる。そのため、上記の個片化工程を経て最終的に得られる円柱状の波長変換部材の表面粗さも所定の範囲となるように制御しやすくなる。更に、かかる特徴に従い、切削加工処理工程にて少なくとも２つの円柱状の波長変換部材の前駆体を形成する場合、各円柱状の波長変換部材の前駆体の寸法のばらつきを小さくできる。その結果、上記の個片化工程を経て最終的に得られる各円柱状の波長変換部材の寸法のばらつきを小さくできる。 In addition, by performing at least two cutting steps, the surface roughness of the cylindrical wavelength conversion member precursor can be easily controlled to be within a predetermined range. Therefore, the surface roughness of the cylindrical wavelength conversion member finally obtained through the above-mentioned singulation process can also be easily controlled to be within a predetermined range. Furthermore, in accordance with this feature, when at least two cylindrical wavelength conversion member precursors are formed in the cutting process, the dimensional variation of each cylindrical wavelength conversion member precursor can be reduced. As a result, the dimensional variation of each cylindrical wavelength conversion member finally obtained through the above-mentioned singulation process can be reduced.
更に、実施形態１では、外周を加工した後の波長変換部材の前駆体５２Ａをワックス２０Ａに埋設した状態で、波長変換部材ブロック５０Ａのボディ部分５５Ａの除去及び波長変換部材の前駆体５２Ａの高さ調整を行っている。これにより、切削加工時における波長変換部材の前駆体５２Ａの欠けや破損を防ぐことができ、波長変換部材の前駆体５２Ａの外形寸法の高い形状精度を維持できる。 Furthermore, in the first embodiment, the body portion 55A of the wavelength conversion member block 50A is removed and the height of the wavelength conversion member precursor 52A is adjusted while the wavelength conversion member precursor 52A is embedded in the wax 20A after the outer periphery has been machined. This makes it possible to prevent chipping or damage to the wavelength conversion member precursor 52A during cutting, and maintains high shape accuracy of the outer dimensions of the wavelength conversion member precursor 52A.
実施形態２
以下、図面を参照しながら、本発明の実施形態２に係る円柱状の波長変換部材の製造方法について説明する。実施形態２は、特に切削加工処理工程において、波長変換部材の前駆体の一部とボディ部分を形成した後、ボディ部分を除去することにより前駆体の残りの部分を形成して中心軸が主面に平行な円柱状の波長変換部材の前駆体を形成する点で実施形態１とは異なる。
EMBODIMENT 2
Hereinafter, a method for producing a cylindrical wavelength conversion member according to embodiment 2 of the present invention will be described with reference to the drawings. Embodiment 2 differs from embodiment 1 in that, particularly in the cutting processing step, after a part of the precursor of the wavelength conversion member and a body part are formed, the body part is removed to form the remaining part of the precursor, thereby forming a cylindrical precursor of the wavelength conversion member whose central axis is parallel to the main surface.
（板状の波長変換部材の準備工程）
まず、図８に示すような板状の波長変換部材３０Ｂを準備する。準備する板状の波長変換部材３０Ｂとしては、上記実施形態１における板状の波長変換部材３０Ａと同じである。
(Preparation process of plate-shaped wavelength conversion member)
First, a plate-shaped wavelength conversion member 30B is prepared as shown in Fig. 8. The plate-shaped wavelength conversion member 30B to be prepared is the same as the plate-shaped wavelength conversion member 30A in the first embodiment.
（板状の波長変換部材の保持工程）
板状の波長変換部材３０Ｂの準備後、図８に示すように、板状の波長変換部材３０Ｂをワックス２０Ｂ付きの保持体１０Ｂに保持する。
(Step of holding plate-shaped wavelength conversion member)
After the plate-shaped wavelength conversion member 30B is prepared, as shown in FIG. 8, the plate-shaped wavelength conversion member 30B is held by a holder 10B with wax 20B.
（板状の波長変換部材への切削加工処理工程）
板状の波長変換部材３０Ｂを保持した後、図９に示すように、切削工具４０Ｂを用いて、図８に示した板状の波長変換部材３０Ｂの表側主面３１Ｂに切削加工を行うことにより、波長変換部材ブロック５０Ｂを形成する。具体的には、切削工具４０Ｂを用いて、所定の間隔をおいて断面視して略半円状の部分５１Ｂが形成されるように、板状の波長変換部材３０Ａの表側主面３１Ｂに切削加工を行う。かかる切削加工により、断面視して略半円状の部分５１Ｂと波長変換部材のボディ部分５５Ｂとから構成される波長変換部材ブロック５０Ｂを形成することができる。この略半円状の部分５１Ｂの中心軸は、形成する波長変換部材ブロック５０Ｂの主面（図９の裏側主面５７Ｂに対応）に対して平行となっている。
(Cutting process for plate-shaped wavelength conversion member)
After holding the plate-shaped wavelength conversion member 30B, as shown in Fig. 9, a cutting tool 40B is used to perform cutting on the front main surface 31B of the plate-shaped wavelength conversion member 30B shown in Fig. 8, thereby forming a wavelength conversion member block 50B. Specifically, the cutting tool 40B is used to perform cutting on the front main surface 31B of the plate-shaped wavelength conversion member 30A so that approximately semicircular portions 51B are formed at a predetermined interval when viewed in cross section. By this cutting process, a wavelength conversion member block 50B can be formed that is composed of the approximately semicircular portions 51B when viewed in cross section and the body portion 55B of the wavelength conversion member. The central axis of this approximately semicircular portion 51B is parallel to the main surface (corresponding to the back main surface 57B in Fig. 9) of the wavelength conversion member block 50B to be formed.
特に、本実施形態では、図９の右の図に示すように、上記切削加工処理として粗加工および仕上げ加工の少なくとも２つの加工を含む切削加工処理を行う。具体的には、第１段階として、第１の切削工具４１Ｂを用いて板状の波長変換部材３０Ｂに粗加工を行い、略半円状部分５１Ｂを形成する。第１の切削工具４１Ｂとして粒度が♯２００～１０００のものが好ましく、例えば♯４００の電着工具を用いることができる。図９に示す粗加工が付された略半円状部分の表面は８μｍ以上２０μｍ以下の算術平均粗さＲｚを有し得る。 In particular, in this embodiment, as shown in the right diagram of FIG. 9, the cutting process includes at least two processes, rough processing and finish processing. Specifically, in the first stage, the plate-shaped wavelength conversion member 30B is roughly processed using the first cutting tool 41B to form the approximately semicircular portion 51B. The first cutting tool 41B preferably has a grain size of #200 to 1000, and for example, an electroplated tool of #400 can be used. The surface of the roughly processed approximately semicircular portion shown in FIG. 9 can have an arithmetic mean roughness Rz of 8 μm or more and 20 μm or less.
次に、第２段階として、略半円状部分５１Ｂの表面に対して第２の切削工具４２Ｂを用いて仕上げ加工を行う。第２の切削工具４２Ｂとして粒度が♯２５００～５０００のものが好ましく、例えば♯３０００の電着工具を用いることができる。これにより、所望の寸法を有しかつ算術平均粗さＲｚが２μｍ以上８μｍ以下である略半円状部分５２Ｂを得ることができる。仕上げ加工を行う箇所は、粗加工により形成した略半円状部分５１Ｂの表面の少なくとも一部である。 Next, in the second step, the surface of the approximately semicircular portion 51B is finished using the second cutting tool 42B. The second cutting tool 42B preferably has a grain size of #2500 to 5000, and for example, an electroplated tool of #3000 can be used. This makes it possible to obtain the approximately semicircular portion 52B having the desired dimensions and an arithmetic mean roughness Rz of 2 μm or more and 8 μm or less. The area where the finishing is performed is at least a part of the surface of the approximately semicircular portion 51B formed by rough machining.
このような少なくとも２つの加工を含む切削加工により、第１段階で粗加工により略半円状の波長変換部材の前駆体を形成し、次いで第２段階で所望の寸法となるようにこの略半円状の波長変換部材の前駆体に対して仕上げ加工を行うため、１段階のみの切削加工処理を施す場合と比べて、断面視で略半円状の波長変換部材の前駆体を所望の寸法としやすくなる。 By using a cutting process that includes at least two processes, a roughly semicircular precursor of the wavelength conversion member is formed in the first stage by rough processing, and then the roughly semicircular precursor of the wavelength conversion member is finished in the second stage to obtain the desired dimensions. This makes it easier to obtain a roughly semicircular precursor of the wavelength conversion member in cross section with the desired dimensions compared to a case where only one cutting process is performed.
（波長変換部材ブロックの反転工程）
切削加工処理工程において仕上げ加工を終えた略半円状部分５２Ｂを含む波長変換部材ブロック５０Ｂについて、この波長変換部材ブロック５０Ｂを、ワックス２０Ｂから一旦離して上下反転させ、図１０に示すように、略半円状部分５２Ｂがワックス２０Ｂに埋設されるようにワックス２０Ｂに再度貼り付ける。具体的には、（１）ワックス２０Ｂから波長変換部材ブロック５０Ｂを分離させて、（２）波長変換部材ブロック５０Ｂを反転させ、（３）ワックス２０Ｂを加熱して軟化させ、波長変換部材ブロック５０Ｂの裏側主面５７Ｂを上にして略半円状部分５２Ｂをワックス２０Ｂに対向させ、（４）波長変換部材ブロック５０Ｂを押圧して略半円状部分５２Ｂがワックス２０Ｂに埋設されるように波長変換部材ブロック５０Ｂをワックス２０Ｂに再度貼り付ける。
(Inversion process of wavelength conversion member block)
The wavelength conversion member block 50B including the approximately semicircular portion 52B that has been finished in the cutting processing step is once separated from the wax 20B and turned upside down, and is then reattached to the wax 20B so that the approximately semicircular portion 52B is embedded in the wax 20B, as shown in Fig. 10. Specifically, (1) the wavelength conversion member block 50B is separated from the wax 20B, (2) the wavelength conversion member block 50B is turned upside down, (3) the wax 20B is heated and softened, and the back main surface 57B of the wavelength conversion member block 50B is turned upside down so that the approximately semicircular portion 52B faces the wax 20B, and (4) the wavelength conversion member block 50B is pressed to reattach the wavelength conversion member block 50B to the wax 20B so that the approximately semicircular portion 52B is embedded in the wax 20B.
（波長変換部材ブロックへの切削処理工程）
波長変換部材ブロック５０Ｂの反転後、図１１に示すように、反転させた波長変換部材ブロック５０Ｂに切削加工処理を施す。実施形態２では、この切削加工処理により、全体として円柱状の波長変換部材の前駆体５３Ｂをワックス２０Ｂと一体化された状態で得る。具体的には、切削工具４０Ｂを用いて波長変換部材ブロック５０Ｂの主面（反転前に裏面５７Ｂであった面に相当）に対し、上記略半円状部分５２Ｂと合せて断面視で円形となる、略半円状部分５８Ｂを形成するように切削加工を行う。すなわち、波長変換部材のボディ部分５５Ｂから、円柱状の波長変換部材の前駆体となる残りの部分５８Ｂを形成するとともに余分な波長変換部材のボディ部分５５Ｂを除去する。ここでは、図９に示す工程と同様に、上記切削加工処理として粗加工および仕上げ加工の少なくとも２つの切削加工処理を行う。かかる切削加工処理により、１段階のみの切削加工処理を施す場合と比べて形成する円柱状の波長変換部材の前駆体を所望の寸法、具体的には所望の径寸法としやすくすることができる。
(Cutting process for wavelength conversion material block)
After the wavelength conversion member block 50B is inverted, as shown in FIG. 11, the inverted wavelength conversion member block 50B is subjected to a cutting process. In the second embodiment, this cutting process obtains a cylindrical wavelength conversion member precursor 53B integrated with the wax 20B as a whole. Specifically, a cutting tool 40B is used to cut the main surface of the wavelength conversion member block 50B (corresponding to the surface that was the back surface 57B before inversion) to form a substantially semicircular portion 58B that becomes a circle in cross section together with the substantially semicircular portion 52B. That is, the remaining portion 58B that becomes the cylindrical wavelength conversion member precursor is formed from the body portion 55B of the wavelength conversion member, and the excess body portion 55B of the wavelength conversion member is removed. Here, as in the process shown in FIG. 9, at least two cutting processes, rough processing and finishing processing, are performed as the cutting process. This cutting process makes it easier to form the cylindrical wavelength conversion member precursor to the desired dimensions, specifically the desired diameter dimensions, compared to the case where only one cutting process is performed.
この略半円状部分５８Ｂについては、反転前に仕上げ加工した略半円状部分５２Ｂと半円の中心軸がほぼ一致するように形成する。かかる切削加工により、円柱状の波長変換部材の前駆体５３Ｂをワックス２０Ｂと一体化された状態で得ることができる。この円柱状の波長変換部材の前駆体５３Ｂは、断面視で円形であり、中心軸が保持体１０Ｂの主面に平行なものとなっている。 This approximately semicircular portion 58B is formed so that the central axis of the semicircle approximately coincides with that of the approximately semicircular portion 52B that was finished before inversion. This cutting process makes it possible to obtain a cylindrical wavelength conversion member precursor 53B that is integrated with the wax 20B. This cylindrical wavelength conversion member precursor 53B is circular in cross section, and its central axis is parallel to the main surface of the holder 10B.
（円柱状の波長変換部材の前駆体の個片化工程）
ワックス２０Ｂと円柱状の波長変換部材の前駆体５３Ｂとが一体化された状態で、ワックスの融点以上の温度で加熱することによりワックス溶解させ、円柱状の波長変換部材の前駆体５３Ｂからワックスを除去する。これにより、複数の円柱状の波長変換部材の前駆体５４Ｂを得る。
(Step of singulating precursor of cylindrical wavelength conversion member)
With wax 20B and cylindrical wavelength conversion member precursor 53B integrated together, the wax is melted by heating at a temperature equal to or higher than the melting point of the wax, and the wax is removed from cylindrical wavelength conversion member precursor 53B, thereby obtaining a plurality of cylindrical wavelength conversion member precursors 54B.
（円柱状の波長変換部材の前駆体の径調整工程）
さらに、仕上げ加工済みの円柱状の波長変換部材の前駆体５３Ｂの直径を調整するため、研削部材７０Ｂを用いて研削加工処理を行うこともできる。即ち、図１２に示すように、円柱状の波長変換部材の前駆体５３Ｂが所定の寸法を有するように円柱状の波長変換部材の前駆体５３Ｂに研削処理を施すこともできる。
(Diameter adjustment process of cylindrical wavelength conversion member precursor)
Furthermore, in order to adjust the diameter of the finished cylindrical precursor 53B of the wavelength conversion member, a grinding process can be performed using a grinding member 70B. That is, as shown in Fig. 12, the cylindrical precursor 53B of the wavelength conversion member can be ground so that the cylindrical precursor 53B of the wavelength conversion member has a predetermined dimension.
径調整工程は、例えば、研削部材７０Ｂとして粒度が♯２００～１０００のもの、例えば♯６００のダイヤモンド砥石を用い、砥石回転数５００～１０００ｒｐｍの条件下で研削処理を行う。なお、この径調整工程の有無にかかわらず、実施形態１と同様に、最終的に円柱状の波長変換部材の前駆体５３Ｂの直径は例えば５０μｍ以上１９０μｍ以下とすることが好ましく、例えば１６０μｍである。 In the diameter adjustment process, for example, a grinding member 70B having a grain size of #200 to 1000, such as a #600 diamond grinding wheel, is used, and grinding processing is performed under conditions of a grinding wheel rotation speed of 500 to 1000 rpm. Regardless of whether or not this diameter adjustment process is performed, as in embodiment 1, the final diameter of the cylindrical wavelength conversion member precursor 53B is preferably, for example, 50 μm to 190 μm, for example, 160 μm.
（円柱状の波長変換部材の前駆体の切断工程）
最後に、図１３に示すように、円柱状の波長変換部材の前駆体５４Ｂをダイシング部材９０Ｂによりダイシングにより所定の高さに切断する。具体的には、円柱状の波長変換部材の前駆体５４Ｂが所定高さとなるように、円柱状の波長変換部材の前駆体５４Ｂにダイシングを施す。これにより、最終的に所定の高さを有する円柱状の波長変換部材６０Ｂを得ることができる。
(Cutting process of cylindrical wavelength conversion member precursor)
13, the cylindrical wavelength conversion member precursor 54B is cut to a predetermined height by dicing with a dicing member 90B. Specifically, the cylindrical wavelength conversion member precursor 54B is diced so that the cylindrical wavelength conversion member precursor 54B has a predetermined height. This allows a cylindrical wavelength conversion member 60B having the predetermined height to be obtained.
以上のように、実施形態２の円柱状の波長変換部材の製造方法でも、切削加工処理工程にて粗加工および仕上げ加工の少なくとも２つの切削加工処理を行う。これにより、１段階のみの切削加工処理を施す場合と比べて円柱状の波長変換部材の前駆体を所望の寸法としやすくなる。その結果、最終的に得られる円柱状の波長変換部材を寸法精度の高いものとすることができる。又、かかる少なくとも２つの切削加工により円柱状の波長変換部材の前駆体の表面粗さも所定の範囲となるように制御しやすくなる。そのため、最終的に得られる円柱状の波長変換部材の表面粗さも所定の範囲となるように制御しやすくなる。 As described above, in the manufacturing method of the cylindrical wavelength conversion member of the second embodiment, at least two cutting processes, rough processing and finish processing, are performed in the cutting processing step. This makes it easier to cut the precursor of the cylindrical wavelength conversion member to the desired dimensions compared to the case where only one cutting process is performed. As a result, the finally obtained cylindrical wavelength conversion member can have high dimensional accuracy. Furthermore, by performing at least two cutting processes, the surface roughness of the precursor of the cylindrical wavelength conversion member can be easily controlled to be within a predetermined range. Therefore, the surface roughness of the finally obtained cylindrical wavelength conversion member can be easily controlled to be within a predetermined range.
実施形態３
以下、図面を参照しながら、本発明の実施形態３に係る円柱状の波長変換部材の製造方法について説明する。実施形態３は、特に保持体として、以下に説明する挿入孔付き保持体を用いる点で実施形態１および実施形態２とは異なる。
EMBODIMENT 3
Hereinafter, a method for manufacturing a cylindrical wavelength conversion member according to embodiment 3 of the present invention will be described with reference to the drawings. Embodiment 3 is different from embodiment 1 and embodiment 2 in that a holder with an insertion hole, which will be described below, is used as the holder.
（板状の波長変換部材の準備工程）
まず、図１４に示すような板状の波長変換部材３０Ｃを準備する。本実施形態では、作業効率の観点から、図１４に示すようにダイシング部材により切断して四角柱の形状を有する波長変換部材３０αＣを準備する。板状の波長変換部材３０Ｃは、上記実施形態１および２における板状の波長変換部材３０Ａ、３０Ｂと同じである。
(Preparation process of plate-shaped wavelength conversion member)
First, a plate-shaped wavelength conversion member 30C is prepared as shown in Fig. 14. In this embodiment, from the viewpoint of work efficiency, a wavelength conversion member 30αC having a rectangular prism shape is prepared by cutting with a dicing member as shown in Fig. 14. The plate-shaped wavelength conversion member 30C is the same as the plate-shaped wavelength conversion members 30A and 30B in the first and second embodiments.
（板状の波長変換部材の保持工程）
図１５に示すように、準備した波長変換部材３０αＣを保持体１０αＣ上に保持する。
(Step of holding plate-shaped wavelength conversion member)
As shown in FIG. 15, the prepared wavelength conversion member 30αC is held on a holder 10αC.
（板状の波長変換部材への切削加工処理工程）
波長変換部材３０αＣを保持した後、図１６に示すように、保持された波長変換部材３０αＣに切削加工処理を施す。具体的には、切削工具４０Ｃを用いて波長変換部材３０αＣの表側主面３１αＣに切削加工を行い、円柱状の波長変換部材の前駆体５１Ｃを含む波長変換部材ブロック５０Ｃを形成する。
(Cutting process for plate-shaped wavelength conversion member)
After the wavelength conversion member 30αC is held, a cutting process is performed on the held wavelength conversion member 30αC, as shown in Fig. 16. Specifically, a cutting tool 40C is used to cut the front main surface 31αC of the wavelength conversion member 30αC, to form a wavelength conversion member block 50C including a cylindrical wavelength conversion member precursor 51C.
この切削加工により、円柱状の波長変換部材の前駆体５１Ｃと波長変換部材のボディ部分５５Ｃとから構成される波長変換部材ブロック５０Ｃを形成する。実施形態３では、この円柱状の波長変換部材の前駆体５１Ｃは、平面視で円形であり、中心軸が波長変換部材ブロック５０Ｃの主面に直交する。 By this cutting process, a wavelength conversion member block 50C is formed, which is composed of a cylindrical wavelength conversion member precursor 51C and a body portion 55C of the wavelength conversion member. In the third embodiment, this cylindrical wavelength conversion member precursor 51C is circular in a plan view, and its central axis is perpendicular to the main surface of the wavelength conversion member block 50C.
上記切削加工処理として粗加工および仕上げ加工の少なくとも２つの切削加工処理を行う。具体的には、第１段階として、第１の切削工具を用いて板状の波長変換部材３０αＣに粗加工を行い、円柱状の波長変換部材の前駆体５１Ｃを形成する。第１の切削工具として粒度が♯２００～１０００のものが好ましく、例えば♯４００の電着工具を用いることができる。図１６に示す粗加工が付された円柱状の波長変換部材の前駆体５１Ｃの側面は８μｍ以上２０μｍ以下の算術平均粗さＲｚを有し得る。 The cutting process includes at least two cutting processes, rough machining and finish machining. Specifically, in the first stage, a first cutting tool is used to roughly machine the plate-shaped wavelength conversion member 30αC to form a cylindrical precursor 51C of the wavelength conversion member. The first cutting tool preferably has a grain size of #200 to 1000, and for example, an electroplating tool of #400 can be used. The side surface of the roughly machined cylindrical precursor 51C of the wavelength conversion member shown in FIG. 16 can have an arithmetic mean roughness Rz of 8 μm or more and 20 μm or less.
次に、第２段階として、粗加工により形成した円柱状の波長変換部材の前駆体５１Ｃの表面に対して第２の切削工具を用いて仕上げ加工を行う。第２の切削工具として粒度が♯２５００～５０００のものが好ましく、例えば♯３０００の電着工具を用いることができる。これにより、所望の径寸法を有しかつ算術平均粗さＲｚが２μｍ以上８μｍ以下である円柱状の波長変換部材の前駆体５２Ｃを得ることができる。仕上げ加工を行う箇所としては、粗加工により形成した円柱状の波長変換部材の前駆体５１Ｃの側面５１Ｃａを少なくとも含む前駆体５２Ｃの表面である。 Next, in the second step, a second cutting tool is used to perform finish machining on the surface of the cylindrical wavelength conversion member precursor 51C formed by rough machining. The second cutting tool preferably has a grain size of #2500 to 5000, and for example, an electroplated tool of #3000 can be used. This makes it possible to obtain a cylindrical wavelength conversion member precursor 52C having the desired diameter dimension and an arithmetic mean roughness Rz of 2 μm or more and 8 μm or less. The area where finish machining is performed is the surface of precursor 52C including at least the side surface 51Ca of cylindrical wavelength conversion member precursor 51C formed by rough machining.
なお、図１６内に矢印で示す進行方向に、切削工具４０Ｃ（上記第１の切削工具および上記第２の切削工具を含む。）を移動させるとして、粗加工および仕上げ加工の両方を施して得られた円柱状の波長変換部材の前駆体を符号５２Ｃで示している。一方、粗加工は施しているが、仕上げ加工は施していない円柱状の波長変換部材の前駆体は、切削工具４０Ｃの進行方向の先に符号５１Ｃで示している。 The cutting tool 40C (including the first cutting tool and the second cutting tool) is moved in the direction of travel indicated by the arrow in FIG. 16, and the cylindrical precursor of the wavelength conversion member obtained by both rough processing and finishing is indicated by the reference symbol 52C. On the other hand, the cylindrical precursor of the wavelength conversion member that has been rough processed but not finished is indicated by the reference symbol 51C at the end of the direction of travel of the cutting tool 40C.
実施形態１と同様に、粗加工を施した円柱状の波長変換部材の前駆体５１Ｃは、高さが３５０μｍ以上１０００μｍ以下であることが好ましく、例えば４５０μｍであり、円の直径が１９０μｍ以上３００μｍ以下であることが好ましく、例えば２００μｍであり得る。又、仕上げ加工を施した円柱状の波長変換部材の前駆体５２Ｃは、高さが３５０μｍ以上１０００μｍ以下であることが好ましく、例えば４５０μｍであり、円の直径が５０μｍ以上１９０μｍ以下であることが好ましく、例えば１６０μｍであり得る。 Similar to embodiment 1, the cylindrical wavelength conversion member precursor 51C that has been subjected to rough processing preferably has a height of 350 μm or more and 1000 μm or less, for example 450 μm, and a circular diameter of 190 μm or more and 300 μm or less, for example 200 μm. Furthermore, the cylindrical wavelength conversion member precursor 52C that has been subjected to finish processing preferably has a height of 350 μm or more and 1000 μm or less, for example 450 μm, and a circular diameter of 50 μm or more and 190 μm or less, for example 160 μm.
（挿入孔付き保持体の準備工程）
図１７に示すように、円柱状の波長変換部材の前駆体５２Ｃを挿入するための、挿入孔１１Ｃが形成された保持体１０Ｃを準備する。本実施形態では、この挿入孔１１Ｃは、複数の円柱状の波長変換部材の前駆体５１Ｃがボディ部分５５Ｃと一体化された波長変換部材ブロック５０Ｃの状態で、円柱状の波長変換部材の前駆体５２Ｃを挿入できるように形成されている。この挿入孔１１Ｃの内径は、仕上げ加工を終えた円柱状の波長変換部材の前駆体５２Ｃが挿入可能な径寸法を有する。なお、図１７では図示していないが、挿入孔付き保持体１０Ｃの上面１０Ｃａには挿入孔１１Ｃの表面を覆うようにワックスを塗布し得る。
(Preparation process of holder with insertion hole)
As shown in FIG. 17, a holder 10C having an insertion hole 11C formed therein is prepared for inserting a cylindrical wavelength conversion member precursor 52C. In this embodiment, the insertion hole 11C is formed so that the cylindrical wavelength conversion member precursor 52C can be inserted in a state where a plurality of cylindrical wavelength conversion member precursors 51C are integrated with a body portion 55C to form a wavelength conversion member block 50C. The inner diameter of the insertion hole 11C has a diameter dimension that allows the cylindrical wavelength conversion member precursor 52C that has been subjected to finishing processing to be inserted. Although not shown in FIG. 17, wax can be applied to the upper surface 10Ca of the holder 10C with the insertion hole so as to cover the surface of the insertion hole 11C.
（挿入孔付き保持体への波長変換部材ブロックの保持工程）
波長変換部材ブロックを、挿入孔付き保持体へ保持する。例えば、図１７に示す挿入孔１１Ｃ付き保持体１０Ｃの準備後、図１８に示すように仕上げ加工を終えた波長変換部材ブロック５０Ｃを上下反転させる。具体的には、波長変換部材ブロック５０Ｃの裏側主面５６Ｃが上方向に方向づけられるように波長変換部材ブロック５０Ｃを上下反転させる。
(Step of holding wavelength conversion member block on holder with insertion hole)
The wavelength conversion member block is held by a holder with an insertion hole. For example, after preparation of a holder 10C with an insertion hole 11C as shown in Fig. 17, a wavelength conversion member block 50C that has been subjected to finishing processing is turned upside down as shown in Fig. 18. Specifically, the wavelength conversion member block 50C is turned upside down so that a back main surface 56C of the wavelength conversion member block 50C is oriented upward.
上下反転させた波長変換部材ブロック５０Ｃを、図１８に示すように、円柱状の波長変換部材の前駆体５２Ｃと挿入孔付保持体１０Ｃの挿入孔１１Ｃとが直接対向するように位置合わせする。その後、仕上げ加工を終えた円柱状の波長変換部材の前駆体５２Ｃを当該挿入孔１１Ｃに挿入する。 The wavelength conversion member block 50C is turned upside down and aligned so that the cylindrical wavelength conversion member precursor 52C and the insertion hole 11C of the holder 10C with insertion hole directly face each other, as shown in FIG. 18. After that, the cylindrical wavelength conversion member precursor 52C that has been finished is inserted into the insertion hole 11C.
挿入孔１１Ｃへ円柱状の波長変換部材の前駆体５２Ｃを挿入して、円柱状の波長変換部材の前駆体５２Ｃの端面５２Ｃａが挿入孔１１Ｃの底部１１Ｃａに当接させる。これにより、図１９に示すように、波長変換部材ブロック５０Ｃを挿入孔付き保持体１０Ｃに保持する。 A cylindrical wavelength conversion member precursor 52C is inserted into the insertion hole 11C so that the end face 52Ca of the cylindrical wavelength conversion member precursor 52C abuts against the bottom 11Ca of the insertion hole 11C. This causes the wavelength conversion member block 50C to be held in the holder 10C with an insertion hole, as shown in FIG. 19.
（波長変換部材ブロックの研削工程）
波長変換部材ブロック５０Ｃを挿入孔付き保持体１０Ｃに保持した後、図２０、図２１（ａ）および図２１（ｂ）に示すように、波長変換部材ブロック５０Ｃに対して研削加工処理を行う。実施形態３では、この研削加工処理によって、円柱状の波長変換部材の前駆体５２Ｃを残して、波長変換部材ブロック５０Ｃのボディ部分５５Ｃを除去する。なお、図２１では、挿入孔１１Ｃへの円柱状の波長変換部材の前駆体５２Ｃの挿入が容易となるように挿入孔内にもワックス２０Ｃが配置されていることが好ましい。
(Grinding process of wavelength conversion member block)
After the wavelength conversion material block 50C is held by the holder 10C with the insertion hole, a grinding process is performed on the wavelength conversion material block 50C, as shown in Figures 20, 21(a) and 21(b). In the third embodiment, this grinding process removes the body portion 55C of the wavelength conversion material block 50C, leaving behind a cylindrical wavelength conversion material precursor 52C. In Figure 21, it is preferable that wax 20C is also disposed in the insertion hole 11C to facilitate the insertion of the cylindrical wavelength conversion material precursor 52C into the insertion hole 11C.
具体的には、まず、図２０に示すように、波長変換部材ブロック５０Ｃの裏側主面５６Ｃに相当する主面に研削部材８０Ｃを用いた研削加工処理を行う。例えば、研削部材８０Ｃとして粒度が♯２００～１０００のものが好ましく、例えば♯６００のダイヤモンド砥石を用い、砥石回転数５００～１０００ｒｐｍの条件下で研削処理を行う。 Specifically, first, as shown in FIG. 20, a grinding process is performed using a grinding member 80C on the main surface corresponding to the rear main surface 56C of the wavelength conversion member block 50C. For example, a grinding member 80C having a grain size of #200 to 1000 is preferable, and a diamond grinding wheel of #600 is used, and the grinding process is performed under conditions of a grinding wheel rotation speed of 500 to 1000 rpm.
かかる研削加工処理で波長変換部材ブロック５０Ｃのボディ部分５５Ｃを除去する。これにより、挿入孔付き保持体１０Cの挿入孔１１Cに挿入された状態で、円柱状の波長変換部材の前駆体５２Ｃを得ることができる。当該研削面には、円柱状の波長変換部材の前駆体５２Ｃの端面が露出している。実施形態３では、露出させた前駆体５２Ｃの端面は、最終的に得られる円柱状の波長変換部材の前駆体５２Ｃの一方の端面となる。この際の円柱状の波長変換部材の前駆体５２Ｃの高さは３５０μｍ以上１０００μｍ以下であることが好ましく、例えば４５０μｍであり得る。 This grinding process removes the body portion 55C of the wavelength conversion member block 50C. As a result, a cylindrical wavelength conversion member precursor 52C can be obtained in a state where it is inserted into the insertion hole 11C of the insertion hole-equipped holder 10C. An end face of the cylindrical wavelength conversion member precursor 52C is exposed on the grinding surface. In the third embodiment, the exposed end face of the precursor 52C becomes one end face of the cylindrical wavelength conversion member precursor 52C that is finally obtained. In this case, the height of the cylindrical wavelength conversion member precursor 52C is preferably 350 μm or more and 1000 μm or less, and can be, for example, 450 μm.
次に、図２１（ｂ）に示す円柱状の波長変換部材の前駆体５２Ｃが、図２１（ｃ）および（ｄ）に示すように、所定の高さを有する円柱状の波長変換部材の前駆体５４Ｃとなるように、円柱状の波長変換部材の前駆体５２Ｃを挿入孔付き保持体１０Cの一部とともに、上述したのと同様に、少なくとも２段階の研削加工処理を行う。 Next, the cylindrical wavelength conversion member precursor 52C shown in FIG. 21(b) is subjected to at least two stages of grinding processing together with a portion of the holder 10C with an insertion hole in the same manner as described above, so that the cylindrical wavelength conversion member precursor 52C shown in FIG. 21(b) becomes a cylindrical wavelength conversion member precursor 54C having a predetermined height as shown in FIG. 21(c) and (d).
具体的には、研削加工前の円柱状の波長変換部材の前駆体５２Ｃの高さは３５０μｍ以上１０００μｍ以下の範囲、例えば４５０μｍであったのに対して、研削加工を終えた円柱状の波長変換部材の前駆体５４Ｃの高さは５０μｍ以上１５０μｍ以下の範囲、例えば１００μｍとすることができる。 Specifically, the height of the cylindrical wavelength conversion member precursor 52C before grinding is in the range of 350 μm to 1000 μm, for example 450 μm, whereas the height of the cylindrical wavelength conversion member precursor 54C after grinding can be in the range of 50 μm to 150 μm, for example 100 μm.
（円柱状の波長変換部材の前駆体の個片化工程）
最後に、図２２に示すように、挿入孔付き保持体１０Ｃの挿入孔１１Ｃから円柱状の波長変換部材の前駆体５４Ｃを取り出す。例えば、挿入を容易にするためにワックスを使用している場合には、ホットプレート等を用いてワックスの融点以上の温度でワックスを加熱して挿入孔１１Ｃから円柱状の波長変換部材の前駆体５４Ｃを取り出す。以上のようにして、円柱状の波長変換部材６０Ｃを得ることができる。
(Step of singulating precursor of cylindrical wavelength conversion member)
Finally, as shown in Fig. 22, cylindrical precursor 54C of wavelength conversion member is taken out from insertion hole 11C of holder 10C with insertion hole. For example, if wax is used to facilitate insertion, the wax is heated to a temperature equal to or higher than the melting point of the wax using a hot plate or the like, and cylindrical precursor 54C of wavelength conversion member is taken out from insertion hole 11C. In this manner, cylindrical wavelength conversion member 60C can be obtained.
以上のように、実施形態３の円柱状の波長変換部材の製造方法では、切削加工処理工程にて粗加工および仕上げ加工の少なくとも２つの切削加工処理を行い、それによって円柱状の波長変換部材の前駆体を含む波長変換部材ブロックを形成する。そのため、１段階のみの切削加工処理を施す場合と比べて形成する円柱状の波長変換部材の前駆体を所望の寸法としやすくなる。その結果、最終的に得られる円柱状の波長変換部材を寸法精度の高いものとすることができる。 As described above, in the manufacturing method of the cylindrical wavelength conversion member of the third embodiment, at least two cutting processes, rough processing and finish processing, are performed in the cutting processing step, thereby forming a wavelength conversion member block containing a precursor of the cylindrical wavelength conversion member. Therefore, compared to the case where only one cutting processing step is performed, it is easier to form the cylindrical wavelength conversion member precursor to the desired dimensions. As a result, the finally obtained cylindrical wavelength conversion member can be made to have high dimensional accuracy.
なお、上記実施形態１から３においては、粗加工と仕上げ加工の２つの加工を有する切削加工処理を説明したが、算術平均粗さＲｚをより低減させるため、粗加工と仕上げ加工との間に中仕上げ加工を加えることもできる。 In the above embodiments 1 to 3, a cutting process that includes two processes, rough processing and finishing processing, has been described. However, in order to further reduce the arithmetic mean roughness Rz, a semi-finishing process can be added between the rough processing and finishing processing.
＜リング状の波長変換部材の製造方法＞
実施形態４
次に、図面を参照しながら、本発明の実施形態４に係るリング状の波長変換部材の製造方法について説明する。なお、図示していないが、板状の波長変換部材と基材との間にはワックスが存在し得る。
<Method of manufacturing ring-shaped wavelength conversion member>
EMBODIMENT 4
Next, a method for manufacturing a ring-shaped wavelength conversion member according to embodiment 4 of the present invention will be described with reference to the drawings. Although not shown, wax may be present between the plate-shaped wavelength conversion member and the substrate.
（板状の波長変換部材の準備工程）
まず、図２３に示すような板状の波長変換部材１３０Ａを準備する。準備する板状の波長変換部材１３０Ａとしては、上記実施形態１における板状の波長変換部材３０Ａと同じである。
(Preparation process of plate-shaped wavelength conversion member)
First, a plate-shaped wavelength conversion member 130A is prepared as shown in Fig. 23. The plate-shaped wavelength conversion member 130A to be prepared is the same as the plate-shaped wavelength conversion member 30A in the first embodiment described above.
（板状の波長変換部材の保持工程）
準備した板状の波長変換部材１３０Ａを、図２３に示すように、基材１１０Ａ上に保持する。ここで、板状の波長変換部材１３０Ａは、ワックス付きの基材１１０Ａに保持することが好ましい。基材１１０Ａは、ガラス基材を用いることができる。
(Step of holding plate-shaped wavelength conversion member)
The prepared plate-shaped wavelength conversion member 130A is held on a base material 110A as shown in Fig. 23. Here, the plate-shaped wavelength conversion member 130A is preferably held on the base material 110A with wax. The base material 110A can be a glass base material.
（リング状の波長変換部材の前駆体の形成工程）
板状の波長変換部材１３０Ａを保持した後、板状の波長変換部材１３０Ａに対して、略同心円でかつ切削加工処理の範囲の内径寸法が異なる第１の切削加工処理と第２の切削加工処理を施して、リング状の波長変換部材の前駆体を形成する。すなわち、第１の切削加工処理でリング状の波長変換部材の前駆体の外周又は内周の一方を形成するように研削加工した後、第２の切削加工処理で内周又は外周の他方を形成するように研削加工する。
(Formation process of precursor of ring-shaped wavelength conversion member)
After holding the plate-shaped wavelength conversion member 130A, a first cutting process and a second cutting process, which are substantially concentric and have different inner diameter dimensions within the cutting process range, are performed on the plate-shaped wavelength conversion member 130A to form a precursor of a ring-shaped wavelength conversion member. That is, the first cutting process is performed by grinding to form one of the outer periphery or the inner periphery of the precursor of the ring-shaped wavelength conversion member, and the second cutting process is performed by grinding to form the other of the inner periphery or the outer periphery.
なお、以下の説明では、第１の切削加工処理ではリング状の波長変換部材の前駆体の外周を形成するように研削加工し、第２の切削加工処理ではリング状の波長変換部材の前駆体の内周を形成するように研削加工するものとして説明する。ここで、後述するように、第１の切削加工処理および第２の切削加工処理のそれぞれにおいて粗加工および仕上げ加工の少なくとも２つを含む切削加工処理を行う。 In the following description, the first cutting process is performed by grinding to form the outer periphery of the ring-shaped precursor of the wavelength conversion member, and the second cutting process is performed by grinding to form the inner periphery of the ring-shaped precursor of the wavelength conversion member. Here, as described below, the first cutting process and the second cutting process each include cutting processes that include at least two of rough processing and finishing processing.
この少なくとも２つを含む段階の切削加工によれば、１段階のみの切削加工処理を施す場合と比べて、リング状の波長変換部材の前駆体を所望の寸法としやすくなる。又、下記のとおり、かかる少なくとも２段階の切削加工によりリング状の波長変換部材の前駆体の表面粗さも所定の範囲となるように制御しやすくなる。 This cutting process with at least two stages makes it easier to cut the precursor of the ring-shaped wavelength conversion member to the desired dimensions compared to a cutting process with only one stage. In addition, as described below, the cutting process with at least two stages makes it easier to control the surface roughness of the precursor of the ring-shaped wavelength conversion member to be within a specified range.
又、以下の説明では、（１）第１の切削加工処理の粗加工、（２）第２の切削加工処理の粗加工、（３）第１の切削加工処理の仕上げ加工、（４）第２の切削加工処理の仕上げ加工、を順に説明するが本実施形態はこの順番に限定されるものではない。 In addition, in the following explanation, (1) rough machining of the first cutting process, (2) rough machining of the second cutting process, (3) finishing machining of the first cutting process, and (4) finishing machining of the second cutting process will be explained in that order, but this embodiment is not limited to this order.
以下、リング状の波長変換部材の前駆体の形成工程について図面を参照しながら詳細に説明する。まず、図２３に示すように保持した板状の波長変換部材１３０Ａの外周面に対して第１の切削加工処理の粗加工を行う。具体的には、第１の切削工具１４１Ａを用いて、板状の波長変換部材１３０Ａの側面１３１Ａ（即ち外縁部に相当）に対して平面視して略円状に粗加工を施す。例えば、図２４に示すように、第１の切削工具１４１Ａが略円状の軌跡を描くように回転させながら矢印の方向に移動させることで、板状の波長変換部材１３０Ａの側面１３１Ａに粗加工を行う。これにより、図２４に示すように、第１の円盤状（又は円形状）の波長変換部材１５０Ａを形成する。第１の切削工具１４１Ａとして粒度が♯２００～１０００のものが好ましく、例えば♯４００の電着工具を用いることができる。本明細書でいう「円盤状」とは外周が真円だけでなく楕円も包含するものを指す。 The process of forming the precursor of the ring-shaped wavelength conversion member will be described in detail below with reference to the drawings. First, as shown in FIG. 23, the outer peripheral surface of the plate-shaped wavelength conversion member 130A is roughly machined by the first cutting process. Specifically, the side surface 131A (i.e., the outer edge portion) of the plate-shaped wavelength conversion member 130A is roughly machined into a substantially circular shape in plan view using the first cutting tool 141A. For example, as shown in FIG. 24, the side surface 131A of the plate-shaped wavelength conversion member 130A is roughly machined by rotating the first cutting tool 141A so as to draw a substantially circular trajectory while moving it in the direction of the arrow. As a result, as shown in FIG. 24, a first disk-shaped (or circular) wavelength conversion member 150A is formed. The first cutting tool 141A is preferably one with a grain size of #200 to 1000, and for example, an electroplating tool with #400 can be used. In this specification, "disk-shaped" refers to a shape whose outer periphery is not only a perfect circle but also an ellipse.
第１の円盤状の波長変換部材１５０Ａの形成後、第１の円盤状の波長変換部材１５０Ａに第２の切削加工処理としての粗加工を施す。具体的には、図２５に示すように第２の切削加工処理の粗加工では、上記第１の切削加工処理時における第１の切削工具１４１Ａの軌跡と同心円でかつ小さい内径で軌跡を描くように、第１の切削工具１４１Ａを矢印の方向に移動させて波長変換部材１５０Ａをリング状に加工する。 After the first disk-shaped wavelength conversion member 150A is formed, the first disk-shaped wavelength conversion member 150A is subjected to rough machining as a second cutting process. Specifically, as shown in FIG. 25, in the rough machining of the second cutting process, the first cutting tool 141A is moved in the direction of the arrow so as to trace a path that is concentric with the path of the first cutting tool 141A during the first cutting process and has a smaller inner diameter, thereby machining the wavelength conversion member 150A into a ring shape.
これにより、平面視してリング状の波長変換部材の前駆体１６０Ａを得ることができる。本実施形態では、粗加工により得られるリング状の波長変換部材の前駆体１６０Ａは、算術平均粗さＲｚが８μｍ以上２０μｍ以下の外側面１６１Ａと内側面１６２Ａを有し得る。 This makes it possible to obtain a precursor 160A of the wavelength conversion member that is ring-shaped when viewed in a plan view. In this embodiment, the precursor 160A of the ring-shaped wavelength conversion member obtained by rough processing can have an outer surface 161A and an inner surface 162A with an arithmetic mean roughness Rz of 8 μm or more and 20 μm or less.
リング状の波長変換部材の前駆体１６０Ａの形成後、リング状の波長変換部材の前駆体１６０Ａに対して第１の切削加工処理の仕上げ加工を行う。具体的には、第２の切削工具１４２Ａを略円状の軌跡を描くように移動させて、リング状の波長変換部材の前駆体１６０Ａの外側面１６１Ａ（即ち外縁部に相当）に対して仕上げ加工を施す。第２の切削工具１４２Ａとして粒度が♯２５００～５０００のものが好ましく、例えば♯３０００の電着工具を用いることができる。かかる仕上げ加工処理により、図２６に示すように外側面の算術平均粗さＲｚが小さいリング状の波長変換部材の前駆体１７０Ａを得ることができる。 After the ring-shaped wavelength conversion member precursor 160A is formed, a first cutting process is performed to finish the ring-shaped wavelength conversion member precursor 160A. Specifically, the second cutting tool 142A is moved to draw a substantially circular trajectory to perform finishing on the outer surface 161A (i.e., the outer edge) of the ring-shaped wavelength conversion member precursor 160A. The second cutting tool 142A preferably has a grain size of #2500 to 5000, and for example, an electroplated tool of #3000 can be used. This finishing process makes it possible to obtain a ring-shaped wavelength conversion member precursor 170A with a small arithmetic mean roughness Rz of the outer surface, as shown in FIG. 26.
リング状の波長変換部材の前駆体１７０Ａの形成後、リング状の波長変換部材の前駆体１７０Ａの内周面に対して第２の切削加工処理の仕上げ加工を行う。具体的には、図２７に示すように、第２の切削工具１４２Ａを前駆体１７０Ａの内周面に沿って略円状の軌跡を描くように矢印の方向に移動させて、図２６に示したリング状の波長変換部材の前駆体１７０Ａの内側面１７２Ａに対して仕上げ加工を施す。 After the ring-shaped wavelength conversion member precursor 170A is formed, a second cutting process is performed to finish the inner surface of the ring-shaped wavelength conversion member precursor 170A. Specifically, as shown in FIG. 27, the second cutting tool 142A is moved in the direction of the arrow so as to draw a substantially circular trajectory along the inner surface of the precursor 170A, and the inner surface 172A of the ring-shaped wavelength conversion member precursor 170A shown in FIG. 26 is finished.
かかる仕上げ加工処理により、内側面の算術平均粗さＲｚが小さいリング状の波長変換部材の前駆体１８０Ａを得ることができる。本実施形態では、仕上げ加工により得られるリング状の波長変換部材の前駆体１８０Ａは、算術平均粗さＲｚが２μｍ以上８μｍ以下の外側面１８１Ａと内側面１８２Ａを有し得る。即ち、粗加工に加えて仕上げ加工を行うことで、リング状の波長変換部材の前駆体の表面粗さも所定の範囲となるように制御しやすくなる。 By this finishing process, a ring-shaped precursor 180A of the wavelength conversion member can be obtained, the inner surface of which has a small arithmetic mean roughness Rz. In this embodiment, the ring-shaped precursor 180A of the wavelength conversion member obtained by the finishing process can have an outer surface 181A and an inner surface 182A with an arithmetic mean roughness Rz of 2 μm or more and 8 μm or less. In other words, by performing the finishing process in addition to the rough processing, it becomes easier to control the surface roughness of the ring-shaped precursor of the wavelength conversion member to be within a specified range.
（リング状の波長変換部材の前駆体の取外し工程）
最後に、基材１１０Ａから図２７に示したリング状の波長変換部材の前駆体１８０Ａを取り外す。以上により、図２８に示すように、最終的に所望の外径寸法および内径寸法を有するリング状の波長変換部材１９０Ａを得ることができる。
なお、図２４から図２８に示すように、上記第１の切削加工処理および上記第２の切削加工処理において、第１の切削工具１４１Ａおよび第２の切削工具１４２Ａの先端が基材１１０Ａの表面に接するように切削加工処理を行っている。そのため、図２８に示すように、基材１１０Ａからリング状の波長変換部材の前駆体１８０Ａを取り外すと、基材１１０Ａの表面に、第１の切削工具１４１Ａおよび第２の切削工具１４２Ａの先端が通過した軌跡に沿った溝が、平面視して同心円のリング状に形成される。なお、第１の切削工具１４１Ａおよび第２の切削工具１４２Ａの先端が基材１１０Ａの表面に接し、基材１１０Ａの表面の一部を切削するように切削加工処理を行うことにより、リング状の波長変換部材の前駆体１８０Ａの側面に発生する虞があるバリを抑制することができる。
(Step of Removing Precursor of Ring-Shaped Wavelength Conversion Member)
Finally, precursor 180A of the ring-shaped wavelength conversion member shown in Fig. 27 is removed from substrate 110A. As a result of the above, ring-shaped wavelength conversion member 190A having the desired outer diameter and inner diameter dimensions can be obtained, as shown in Fig. 28.
As shown in Fig. 24 to Fig. 28, in the first cutting process and the second cutting process, the cutting process is performed so that the tips of the first cutting tool 141A and the second cutting tool 142A come into contact with the surface of the substrate 110A. Therefore, as shown in Fig. 28, when the precursor 180A of the ring-shaped wavelength conversion member is removed from the substrate 110A, grooves along the trajectories passed by the tips of the first cutting tool 141A and the second cutting tool 142A are formed in the surface of the substrate 110A in a concentric ring shape in plan view. By performing the cutting process so that the tips of the first cutting tool 141A and the second cutting tool 142A come into contact with the surface of the substrate 110A and cut a part of the surface of the substrate 110A, it is possible to suppress burrs that may occur on the side of the precursor 180A of the ring-shaped wavelength conversion member.
以上に説明したように、実施形態４のリング状の波長変換部材の製造方法は、少なくとも２つの切削加工処理工程にて、それぞれ粗加工および仕上げ加工の少なくとも２段階の切削加工処理を行う。これにより、１段階のみの切削加工処理を施す場合と比べて、リング状の波長変換部材の前駆体を所望の寸法としやすくなる。その結果、最終的に得られるリング状の波長変換部材を寸法精度の高いものとすることができる。 As described above, the manufacturing method of the ring-shaped wavelength conversion member of the fourth embodiment involves at least two cutting steps, each of which is a rough cut and a finish cut. This makes it easier to cut the precursor of the ring-shaped wavelength conversion member to the desired dimensions compared to a case where only one cutting step is performed. As a result, the final ring-shaped wavelength conversion member can be made to have high dimensional accuracy.
又、かかる少なくとも２段階の切削加工によりリング状の波長変換部材の前駆体の表面粗さも所定の範囲となるように制御しやすくなるため、最終的に得られるリング状の波長変換部材の表面粗さも所定の範囲となるように制御しやすくなる。 In addition, this at least two-stage cutting process makes it easier to control the surface roughness of the precursor of the ring-shaped wavelength conversion member to be within a specified range, and therefore makes it easier to control the surface roughness of the final ring-shaped wavelength conversion member to be within a specified range.
実施形態４の上記第１の切削加工処理および上記第２の切削加工処理におけるそれぞれの粗加工と仕上げ加工との間に中仕上げ加工を更に採り入れてもよい。粗加工と仕上げ加工との間に中仕上げ加工を更に採り入れることで、最終的に得られるリング状の波長変換部材の寸法をより所望のものとしやすくなり、かつその表面粗さも所定の範囲となるようにより制御しやすくすることができる。 A semi-finishing process may be further performed between the rough machining and the finishing process in each of the first cutting process and the second cutting process of the fourth embodiment. By further performing a semi-finishing process between the rough machining and the finishing process, it becomes easier to obtain a more desired size for the ring-shaped wavelength conversion member that is finally obtained, and it is also easier to control the surface roughness so that it falls within a predetermined range.
実施形態５
以下、図面を参照しながら、本発明の実施形態５に係るリング状の波長変換部材の製造方法について説明する。実施形態５は、少なくとも２枚の板状の波長変換部材から成る積層体に対して切削加工処理を施す点で、実施形態４とは異なる。これにより、最終的に所望の寸法を有するリング状の波長変換部材を効率よく製造することができる。
EMBODIMENT 5
Hereinafter, a method for manufacturing a ring-shaped wavelength conversion member according to embodiment 5 of the present invention will be described with reference to the drawings. Embodiment 5 differs from embodiment 4 in that a cutting process is performed on a laminate consisting of at least two plate-shaped wavelength conversion members. This makes it possible to efficiently manufacture a ring-shaped wavelength conversion member having a final desired dimension.
以下では、上記の実施形態４のリング状の波長変換部材の製造方法の欄で述べた内容と同様の内容となる部分については、内容の重複を避けるため記載を簡略化又は省略する。 In the following, the same content as that described in the section on the manufacturing method of the ring-shaped wavelength conversion member of embodiment 4 above will be simplified or omitted to avoid duplication of content.
（少なくとも２枚の板状の波長変換部材の準備工程）
まず、少なくとも２枚の板状の波長変換部材１３０Ｃを準備する。準備する板状の波長変換部材１３０Ｃとしては、上記の本発明の実施形態１の円柱状の波長変換部材の製造方法の欄で述べた板状の波長変換部材３０Ａと同じである。
(Preparation of at least two plate-shaped wavelength conversion members)
First, at least two plate-shaped wavelength conversion members 130C are prepared. The plate-shaped wavelength conversion members 130C to be prepared are the same as the plate-shaped wavelength conversion members 30A described in the section on the manufacturing method of the cylindrical wavelength conversion member of the first embodiment of the present invention.
（板状の波長変換部材の積層体の保持工程）
図２９に示すように、準備した少なくとも２枚の板状の波長変換部材１３０Ｃを、基材１１０Ｃ上に積層させた積層体１３０αＣを形成する。これにより、基材１１０Ｃ上に板状の波長変換部材の積層体１３０αＣを保持することができる。なお、基材１１０Ｃと板状の波長変換部材１３０Ｃとの間および複数の板状の波長変換部材１３０Ｃの間にはそれぞれワックス１２０Ｃを配置させることが好ましい。
(Step of holding stack of plate-shaped wavelength conversion members)
As shown in Fig. 29, at least two prepared plate-shaped wavelength conversion members 130C are laminated on a base material 110C to form a laminate 130αC. This allows the laminate 130αC of plate-shaped wavelength conversion members to be held on the base material 110C. It is preferable to place wax 120C between the base material 110C and the plate-shaped wavelength conversion members 130C and between the plurality of plate-shaped wavelength conversion members 130C.
（リング状の波長変換部材の前駆体の形成工程）
波長変換部材の積層体１３０αＣの保持後、板状の波長変換部材の積層体１３０αＣに対して略同心円でかつ互いに径寸法の異なる第１の切削加工処理と第２の切削加工処理をそれぞれ略円周状に施して、リング状の波長変換部材積層体の前駆体を形成する。
(Formation process of precursor of ring-shaped wavelength conversion member)
After holding the wavelength conversion material laminate 130αC, a first cutting process and a second cutting process, which are approximately concentric and have different diameter dimensions, are each performed in an approximately circumferential shape on the plate-shaped wavelength conversion material laminate 130αC to form a precursor of a ring-shaped wavelength conversion material laminate.
実施形態５では、以下の工程を経て最終的にリング状の波長変換部材の前駆体を形成することができる。なお、実施形態５では、第１の切削加工処理を施してリング状の波長変換部材積層体の前駆体の外側面をなす部分を形成し、次いで第２の切削加工処理を施してリング状の波長変換部材積層体の前駆体の内側面をなす部分を形成する。 In the fifth embodiment, the precursor of the ring-shaped wavelength conversion member can be finally formed through the following steps. In the fifth embodiment, a first cutting process is performed to form a portion that forms the outer surface of the precursor of the ring-shaped wavelength conversion member laminate, and then a second cutting process is performed to form a portion that forms the inner surface of the precursor of the ring-shaped wavelength conversion member laminate.
まず、保持した波長変換部材の積層体１３０αＣに対して第１の切削加工処理の粗加工を行う。具体的には、切削工具１４０Ｃ（具体的には実施形態４の第１の切削工具１４１Ａに対応）を用いて、図２９に示す波長変換部材の積層体１３０αＣの側面１３１αＣに対して一括して粗加工を施す。かかる粗加工処理により、図２９に示すように、積層された複数の板状の波長変換部材１３０Ｃそれぞれの側面により形成されていた凹凸形状が平坦化された側面を有する、図３０に示すような第１の円盤状（又は円形状）の波長変換部材の積層体１５０αＣを形成し得る。第１の円盤状の波長変換部材の積層体１５０αＣは、２枚以上の第１の円盤状の波長変換部材１５０Ｃから構成され得る。なお、「第１の円盤状の波長変換部材の積層体１５０αＣ」は全体としては円柱状の形態をなしている。
First, the first cutting process is performed on the held wavelength conversion member stack 130αC. Specifically, the side surface 131αC of the wavelength conversion member stack 130αC shown in FIG. 29 is roughly processed at once using a cutting tool 140C (specifically, corresponding to the first cutting tool 141A in the fourth embodiment). This rough processing can form a first disk-shaped (or circular) wavelength conversion member stack 150αC as shown in FIG. 30, which has a flattened side surface in which the uneven shape formed by the side surfaces of each of the stacked plate-shaped wavelength conversion members 130C is flattened, as shown in FIG. The first disk-shaped wavelength conversion member stack 150αC can be composed of two or more first disk-shaped
第１の円盤状の波長変換部材の積層体１５０αＣに第２の切削加工処理の粗加工を施す。この第２切削加工処理については、第１の円盤状の波長変換部材の積層体１５０αＣの側面に一括して行うことができる。２枚以上のリング状の波長変換部材も一括して得ることができるため製造効率の観点から好ましい。 The second cutting process is performed on the first disc-shaped wavelength conversion member stack 150αC as a rough cutting process. This second cutting process can be performed on the side of the first disc-shaped wavelength conversion member stack 150αC in one go. This is preferable from the viewpoint of manufacturing efficiency, since two or more ring-shaped wavelength conversion members can also be obtained in one go.
以下では、第１の円盤状の波長変換部材の積層体１５０αＣに第２の切削加工処理を一括して行う場合を説明する。具体的には、第１の円盤状の波長変換部材の積層体１５０αＣの形成後、同積層体１５０αＣに一括して第２の切削加工処理としての粗加工を施す。具体的には、第１の切削加工処理時における第１の切削工具の軌跡を基準として、第１の切削工具が略同心円でかつ径寸法の小さい軌跡をえがくように第１の切削工具を動作させる。 The following describes a case where the second cutting process is performed all at once on the first disc-shaped laminate 150αC of the wavelength conversion material. Specifically, after the first disc-shaped laminate 150αC of the wavelength conversion material is formed, the laminate 150αC is subjected to rough machining as the second cutting process all at once. Specifically, the first cutting tool is operated so that it draws a substantially concentric trajectory with a small diameter based on the trajectory of the first cutting tool during the first cutting process.
これにより、第１の円盤状の波長変換部材の積層体１５０αＣの径寸法よりも小さい径寸法の第２の円盤状の波長変換部材の積層体を第１の円形状の波長変換部材の積層体１５０αＣから形成することができる。その結果、図３１に示すようにリング状の波長変換部材積層体の前駆体１６０αＣを得ることができる。本実施形態では、粗加工により得られるリング状の波長変換部材積層体の前駆体１６０αＣは、算術平均粗さＲｚが８μｍ以上２０μｍ以下の外側面１６１αＣと内側面１６２αＣを有し得る。 This allows a second disk-shaped wavelength conversion member laminate having a diameter smaller than the diameter of the first disk-shaped wavelength conversion member laminate 150αC to be formed from the first circular wavelength conversion member laminate 150αC. As a result, a precursor 160αC of a ring-shaped wavelength conversion member laminate can be obtained as shown in FIG. 31. In this embodiment, the precursor 160αC of a ring-shaped wavelength conversion member laminate obtained by rough processing can have an outer surface 161αC and an inner surface 162αC with an arithmetic mean roughness Rz of 8 μm or more and 20 μm or less.
リング状の波長変換部材の積層体の前駆体１６０αＣの形成後、実施形態４と同様に、リング状の波長変換部材積層体の前駆体１６０αＣに対して第１の切削加工処理および第２切削加工処理としての仕上げ加工を行う。具体的には、実施形態４の第２の切削工具１４２Ａに対応する切削工具を用いて、図３１に示すリング状の波長変換部材積層体の前駆体１６０αＣの外側面１６１αＣおよび内側面１６２αＣに対してそれぞれ一括して略円周状に仕上げ加工を施す。かかる一括的な仕上げ加工処理により、外側面および内側面の算術平均粗さＲｚが小さいリング状の波長変換部材積層体の前駆体を得ることができる。 After the precursor 160αC of the ring-shaped wavelength conversion member laminate is formed, the precursor 160αC of the ring-shaped wavelength conversion member laminate is subjected to a first cutting process and a second cutting process as a finishing process, as in the fourth embodiment. Specifically, a cutting tool corresponding to the second cutting tool 142A in the fourth embodiment is used to perform a finishing process in a substantially circumferential manner on the outer surface 161αC and the inner surface 162αC of the precursor 160αC of the ring-shaped wavelength conversion member laminate shown in FIG. 31 . This finishing process in a single process can produce a precursor of the ring-shaped wavelength conversion member laminate having a small arithmetic mean roughness Rz on the outer surface and the inner surface.
（リング状の波長変換部材の前駆体の取外し工程）
仕上げ加工を終えたリング状の波長変換部材積層体の前駆体の形成後、ワックスの融点以上の温度でワックスを加熱することでワックスを溶解させて除去する。これにより、図３２に示すように基材１１０Ｃからリング状の波長変換部材の積層体の前駆体を取り外し、その後当該積層体の前駆体の構成要素であるリング状の波長変換部材の前駆体を個片化する。以上により、最終的に２枚以上のリング状の波長変換部材を形成することができる。
(Step of Removing Precursor of Ring-Shaped Wavelength Conversion Member)
After the ring-shaped wavelength conversion member laminate precursor is formed after finishing processing, the wax is heated at a temperature equal to or higher than the melting point of the wax to melt and remove the wax. As a result, the ring-shaped wavelength conversion member laminate precursor is removed from the substrate 110C as shown in Fig. 32, and then the ring-shaped wavelength conversion member precursor, which is a component of the laminate precursor, is divided into individual pieces. As a result of the above, two or more ring-shaped wavelength conversion members can be finally formed.
以上のように、実施形態５のリング状の波長変換部材の製造方法は、切削加工処理工程にて板状の波長変換部材の“積層体”に粗加工および仕上げ加工の少なくとも２つの加工を含む切削加工処理を行う。これにより、所望の寸法を有するリング状の波長変換部材の前駆体を一括して２枚以上形成することができる。その結果、最終的に所望の寸法を有するリング状の波長変換部材を一括して２枚以上形成することができる。少なくとも２段階の切削加工により、２枚以上のリング状の波長変換部材の前駆体の表面粗さも所定の範囲となるように制御しやすくなるため、最終的に得られる２枚以上のリング状の波長変換部材の表面粗さも所定の範囲となるように制御しやすくなる。 As described above, in the manufacturing method of the ring-shaped wavelength conversion member of the fifth embodiment, a cutting process including at least two processes, rough processing and finishing processing, is performed on a "stack" of plate-shaped wavelength conversion members in a cutting process step. This makes it possible to form two or more precursors of ring-shaped wavelength conversion members having desired dimensions at once. As a result, it is possible to form two or more ring-shaped wavelength conversion members having the final desired dimensions at once. By performing at least two cutting steps, it becomes easier to control the surface roughness of the precursors of the two or more ring-shaped wavelength conversion members to be within a predetermined range, and therefore it becomes easier to control the surface roughness of the two or more ring-shaped wavelength conversion members finally obtained to be within a predetermined range.
実施形態６
以下、図面を参照しながら、本発明の実施形態７に係るリング状の波長変換部材の製造方法について説明する。実施形態６は、相対的に厚みの大きい板状の波長変換部材に対して切削加工処理を施し、その後にスライス加工する点が実施形態４とは異なる。これにより、相対的に厚みの大きい１枚の板状の波長変換部材から、最終的に所望の寸法を有するリング状の波長変換部材を２枚以上形成することができる。
EMBODIMENT 6
Hereinafter, a method for manufacturing a ring-shaped wavelength conversion member according to a seventh embodiment of the present invention will be described with reference to the drawings. The sixth embodiment differs from the fourth embodiment in that a relatively thick plate-shaped wavelength conversion member is cut and then sliced. This makes it possible to finally form two or more ring-shaped wavelength conversion members having desired dimensions from one relatively thick plate-shaped wavelength conversion member.
以下では、上記の実施形態４のリング状の波長変換部材の製造方法の欄で述べた内容と同様の内容となる部分については、内容の重複を避けるため記載を簡略化又は省略する。 In the following, the same content as that described in the section on the manufacturing method of the ring-shaped wavelength conversion member of embodiment 4 above will be simplified or omitted to avoid duplication of content.
（円柱状の波長変換部材の準備工程）
まず、相対的に厚みの大きい板状の波長変換部材として円柱状の波長変換部材１３０Ｄを準備する。準備する円柱状の波長変換部材１３０Ｄは、上記の本発明の実施形態１の円柱状の波長変換部材の製造方法の欄で述べた板状の波長変換部材３０Ａの構成材料が同じである一方、板状の波長変換部材３０Ａの厚みよりも大きい点で相違する。なお、上記の本発明の実施形態１の円柱状の波長変換部材の製造方法の欄で述べた板状の波長変換部材３０Ａの説明内容と同じ部分については、内容の重複を避けるため記載を省略する。
(Preparation process of cylindrical wavelength conversion member)
First, a cylindrical wavelength conversion member 130D is prepared as a plate-shaped wavelength conversion member having a relatively large thickness. The cylindrical wavelength conversion member 130D to be prepared is made of the same material as the plate-shaped wavelength conversion member 30A described in the section on the manufacturing method of the cylindrical wavelength conversion member of the first embodiment of the present invention, but is different in that it is thicker than the plate-shaped wavelength conversion member 30A. Note that the same parts as those described in the section on the manufacturing method of the cylindrical wavelength conversion member of the first embodiment of the present invention will be omitted to avoid duplication of content.
（円柱状の波長変換部材の保持工程）
次に、図３３に示すように、準備した円柱状の波長変換部材１３０Ｄを基材１１０Ｄ上にワックス１２０Ｄを介して保持する。
(Step of holding cylindrical wavelength conversion member)
Next, as shown in FIG. 33, the prepared cylindrical wavelength conversion member 130D is held on the base material 110D via wax 120D.
（円柱状の波長変換部材に対する切削加工処理工程）
円柱状の波長変換部材１３０Ｄの保持後、図３４および図３５に示すように、円柱状の波長変換部材１３０Ｄに対して略同心円でかつ互いに径寸法の異なる第１の切削加工処理の粗加工と第２の切削加工処理の粗加工をそれぞれ略円周状に施す。なお、少なくとも２枚のリング状の波長変換部材を一括して研削する切削工具として、単一枚の板状の波長変換部材又は第１の円盤状の波長変換部材を切削加工処理する際に用いる切削工具よりも有効刃長さが長いものを用いることはいうまでもない。
(Cutting process for cylindrical wavelength conversion member)
After the cylindrical wavelength conversion member 130D is held, a first rough cutting process and a second rough cutting process, which are substantially concentric and have different diameters, are each performed substantially circumferentially on the cylindrical wavelength conversion member 130D, as shown in Figures 34 and 35. It goes without saying that the cutting tool used for collectively grinding at least two ring-shaped wavelength conversion members has an effective blade length longer than that of the cutting tool used when cutting a single plate-shaped wavelength conversion member or the first disk-shaped wavelength conversion member.
まず、保持した円柱状の波長変換部材１３０Ｄに対して第１の切削加工処理の粗加工を行う。かかる粗加工により、図３４に示すように第１の円柱状の波長変換部材１５０Ｄを形成し得る。 First, the first rough cutting process is performed on the held cylindrical wavelength conversion member 130D. This rough cutting process forms the first cylindrical wavelength conversion member 150D as shown in FIG. 34.
第１の円柱状の波長変換部材１５０Ｄに第２の切削加工処理の粗加工を施す。これにより、図３５に示すように、円筒状の波長変換部材の前駆体１６０Ｄ（相対的に厚みの大きいリング状の波長変換部材の前駆体に対応）を得ることができる。 The first cylindrical wavelength conversion member 150D is subjected to a second rough cutting process. This makes it possible to obtain a cylindrical wavelength conversion member precursor 160D (corresponding to a ring-shaped wavelength conversion member precursor with a relatively large thickness) as shown in FIG. 35.
実施形態４と同様に、円筒状の波長変換部材の前駆体１６０Ｄに対して第１の切削加工処理の仕上げ加工と第２の切削加工処理の仕上げ加工を行う。これにより、外側面および内側面の算術平均粗さＲｚが小さい円筒状の波長変換部材の前駆体を得ることができる。 As in the fourth embodiment, a cylindrical precursor 160D of the wavelength conversion member is subjected to a first finishing cutting process and a second finishing cutting process. This makes it possible to obtain a cylindrical precursor of the wavelength conversion member having a small arithmetic mean roughness Rz of the outer surface and the inner surface.
（円筒状の波長変換部材の前駆体のスライス加工工程）
円筒状の波長変換部材の前駆体にスライス加工を行う。スライス加工としては、厚み方向に対して略垂直な方向に沿ってダイシング装置を用いて厚み寸法が大きいリング状の波長変換部材の前駆体を切断する態様を挙げることができる。かかるスライス加工により、図３６に示すように、最終的に少なくとも２枚のリング状の波長変換部材１７０Ｄを得ることができる。
(Slicing process of cylindrical wavelength conversion member precursor)
A cylindrical precursor of the wavelength conversion member is sliced. As an example of the slice process, a ring-shaped precursor of the wavelength conversion member having a large thickness dimension is cut using a dicing device along a direction substantially perpendicular to the thickness direction. By this slice process, at least two ring-shaped wavelength conversion members 170D can be finally obtained, as shown in FIG.
以上のように、実施形態６のリング状の波長変換部材の製造方法は、切削加工処理工程にて円筒状の波長変換部材に対して粗加工および仕上げ加工の少なくとも２つを含む切削加工処理を行い、かつ得られた円筒状の波長変換部材の前駆体に対してスライス加工を行うという特徴を含む。 As described above, the method for manufacturing a ring-shaped wavelength conversion member of the sixth embodiment includes the features of performing a cutting process including at least two processes, rough processing and finishing, on a cylindrical wavelength conversion member in a cutting process step, and performing a slicing process on the obtained precursor of the cylindrical wavelength conversion member.
これにより、円筒状の波長変換部材から、所望の寸法を有するリング状の波長変換部材の前駆体を形成することができる。そのため、この前駆体にスライス加工を施すことで、最終的に所望の寸法を有するリング状の波長変換部材を２枚以上形成することができる。又、かかる少なくとも２段階の切削加工により、相対的に厚みの大きい１枚の板状の波長変換部材から得られるリング状の波長変換部材の前駆体の表面粗さを所定の範囲となるように制御しやすくなる。そのため、この前駆体にスライス加工を施すことで最終的に得られる２枚以上のリング状の波長変換部材の表面粗さも所定の範囲となるように制御しやすくなる。 This allows a precursor of a ring-shaped wavelength conversion member having the desired dimensions to be formed from a cylindrical wavelength conversion member. Therefore, by slicing this precursor, two or more ring-shaped wavelength conversion members having the desired dimensions can be finally formed. Furthermore, by performing at least two-stage cutting, it becomes easier to control the surface roughness of the precursor of the ring-shaped wavelength conversion member obtained from a single plate-shaped wavelength conversion member with a relatively large thickness to be within a predetermined range. Therefore, it becomes easier to control the surface roughness of two or more ring-shaped wavelength conversion members finally obtained by slicing this precursor to be within a predetermined range.
なお、最終的に得られるリング状の波長変換部材１７０Ｄの厚み寸法およびスライス枚数、即ちリング状の波長変換部材１７０Ｄの枚数を考慮して、上記円筒状の波長変換部材１６０Ｄの厚みを予め決定することが好ましい。円筒状の波長変換部材１６０Ｄの厚みを予め決定することで、最終的に得られる２枚以上のリング状の波長変換部材１７０Ｄを効率的に生産することが可能となる。 It is preferable to predetermine the thickness of the cylindrical wavelength conversion member 160D in consideration of the thickness dimension and the number of slices of the final ring-shaped wavelength conversion member 170D, i.e., the number of ring-shaped wavelength conversion members 170D. By predetermining the thickness of the cylindrical wavelength conversion member 160D, it becomes possible to efficiently produce two or more final ring-shaped wavelength conversion members 170D.
最後に、実施形態４から６のいずれにおいても、第１の切削加工処理時および第２の切削加工処理時に、基材の一部を共削り加工することが好ましい。本明細書でいう「共削り加工」とは、切削工具を用いて板状の波長変換部材等の側面と当該波長変換部材を保持する基材の両方を切削する加工を指す。 Finally, in any of the fourth to sixth embodiments, it is preferable to co-cut a part of the substrate during the first cutting process and the second cutting process. In this specification, "co-cutting" refers to a process in which a cutting tool is used to cut both the side of a plate-shaped wavelength conversion member or the like and the substrate that holds the wavelength conversion member.
実施形態４を例に採ると、第１切削工具１４１Ａおよび第２の切削工具１４２Ａを用いて、基材１１０Ａ上に保持された板状の波長変換部材１３０Ａ、第１の円盤状の波長変換部材１５０Ａ等の側面に対して切削加工処理を行う。この際、切削工具の有効刃部分（又は首下部分）を波長変換部材の側面の上端から下端に至る領域に接触させることができないと、波長変換部材の側面の下端側にて波長変換部材の削り残し部分が生じ、波長変換部材の側面の下端側の形状が裾拡がり形状となるおそれがある。 Taking the fourth embodiment as an example, a cutting process is performed on the side surfaces of the plate-shaped wavelength conversion member 130A, the first disk-shaped wavelength conversion member 150A, etc., held on the substrate 110A using the first cutting tool 141A and the second cutting tool 142A. At this time, if the effective blade portion (or the neck portion) of the cutting tool cannot be brought into contact with the region extending from the upper end to the lower end of the side surface of the wavelength conversion member, there is a risk that the wavelength conversion member will remain partially cut at the lower end side of the side surface of the wavelength conversion member, and the lower end side of the side surface of the wavelength conversion member will have a flared shape.
そこで、上記波長変換部材の側面の切削加工処理時に、波長変換部材と共に当該波長変換部材を保持する基材１１０Ａの一部も共削り加工することで、波長変換部材を保持する基材１１０Ａの一部にまで切削工具の先端部（非有効刃部分に対応）を入り込ませることができる。これにより、切削工具の当該先端部を除く有効刃部分（又は首下部分）を波長変換部材の側面の上端から下端に至る領域に接触させることができる。 Therefore, by cutting the wavelength conversion member together with a portion of the base material 110A that holds the wavelength conversion member during cutting processing of the side surface of the wavelength conversion member, the tip of the cutting tool (corresponding to the non-effective blade portion) can be inserted into the portion of the base material 110A that holds the wavelength conversion member. This allows the effective blade portion (or neck portion) excluding the tip of the cutting tool to come into contact with the region from the top to the bottom of the side surface of the wavelength conversion member.
その結果、切削工具使用時における波長変換部材の側面の削り残し部分の発生を回避できる。それ故、波長変換部材の側面の下端側の形状が裾拡がり形状となることが回避され、それによって、切削加工後に得られるリング状の波長変換部材の側面形状を所望の形状にすることができる。なお、基材の一部も切削加工可能とする観点から、上述のように基材としてガラス基材を用いることが好ましい。 As a result, it is possible to avoid leaving uncut portions on the side of the wavelength conversion member when using a cutting tool. This prevents the lower end of the side of the wavelength conversion member from becoming flared at the bottom, and therefore the side shape of the ring-shaped wavelength conversion member obtained after cutting can be made into the desired shape. From the viewpoint of being able to cut a portion of the substrate as well, it is preferable to use a glass substrate as the substrate as described above.
上記製造方法により得られた円柱状またはリング状の波長変換部材については、少なくとも発光素子と組み合わせることで発光装置を得ることができる。具体的には、発光素子の発光面と対向するように上記円柱状又はリング状の波長変換部材を配置することで、発光装置が得られる。かかる構成により、上記波長変換部材により、発光素子から発せられる光を吸収して異なる波長の光に変換することができる。又、得られた円柱状またはリング状の波長変換部材の発光面側にエッチング加工により凹凸形状を設けることで、配光色度ムラの低減を図ることができる。 A light emitting device can be obtained by combining the cylindrical or ring-shaped wavelength conversion member obtained by the above manufacturing method with at least a light emitting element. Specifically, a light emitting device can be obtained by arranging the cylindrical or ring-shaped wavelength conversion member so as to face the light emitting surface of the light emitting element. With this configuration, the wavelength conversion member can absorb the light emitted from the light emitting element and convert it into light of a different wavelength. In addition, unevenness in the light distribution chromaticity can be reduced by providing an uneven shape by etching the light emitting surface side of the obtained cylindrical or ring-shaped wavelength conversion member.
以上、本発明の一態様について説明してきたが、本発明はこれに限定されず、種々の改変がなされ得ることを当業者は容易に理解されよう。 Although one aspect of the present invention has been described above, those skilled in the art will readily understand that the present invention is not limited thereto and that various modifications can be made.
本態様に係る円柱状またはリング状の波長変換部材は、プロジェクタ、医療機器等に好適に利用できる。 The cylindrical or ring-shaped wavelength conversion member according to this embodiment can be suitably used in projectors, medical equipment, etc.
１０Ａ、１０Ｂ、１０Ｃ 保持体
１１０Ａ、１１０Ｂ、１１０Ｃ、１１０Ｄ 基材
２０Ａ、２０Ｂ、２０Ｃ、１２０Ｃ、１２０Ｄ ワックス
３０Ａ、３０Ｂ、３０Ｃ、１３０Ａ、１３０Ｂ、１３０Ｃ、１３０Ｄ 板状の波長変換部材
４０Ａ、４０Ｂ、４０Ｃ、１４０Ｃ、１４０Ｄ 切削工具
４１Ａ、４１Ｂ、１４１Ａ、１４２Ｂ 第１の切削工具
４２Ａ、４２Ｂ、１４２Ａ、１４２Ｂ 第２の切削工具
５０Ａ、５０Ｂ、５０Ｃ 波長変換部材ブロック
５１Ａ、５１Ｂ、５１Ｃ 円柱状の波長変換部材の前駆体
５２Ａ、５２Ｂ、５２Ｃ 円柱状の波長変換部材の前駆体
５３Ａ、５３Ｂ、５３Ｃ 円柱状の波長変換部材の前駆体
５４Ａ、５４Ｂ、５４Ｃ 円柱状の波長変換部材の前駆体
６０Ａ、６０Ｂ、６０Ｃ 円柱状の波長変換部材
７０Ｂ 研削部材
１４０αＤ 切削工具の有効刃部分（又は首下部分）
１４０βＤ 切削工具の非有効刃部分（又は非首下部分）
１５０Ａ、１５０Ｂ、１５０Ｃ、１５０Ｄ 第１の円盤状の波長変換部材
１６０Ａ、１６０Ｂ、１６０Ｄ、１７０Ａ、１７０Ｂ、１８０Ａ、１８０Ｂ、１９０Ｂ、１６０αＣ リング状の波長変換部材積層体の前駆体
１７０Ｃ、１７０Ｄ、１９０Ａ リング状の波長変換部材
２００Ｂ リング状の波長変換部材の前駆体
Reference Signs List 10A, 10B, 10C Holding body 110A, 110B, 110C, 110D Substrate 20A, 20B, 20C, 120C, 120D Wax 30A, 30B, 30C, 130A, 130B, 130C, 130D Plate-shaped wavelength conversion member 40A, 40B, 40C, 140C, 140D Cutting tool 41A, 41B, 141A, 142B First cutting tool 42A, 42B, 142A, 142B Second cutting tool 50A, 50B, 50C Wavelength conversion member block 51A, 51B, 51C Cylindrical wavelength conversion member precursor 52A, 52B, 52C Cylindrical wavelength conversion member precursor 53A, 53B, 53C Cylindrical wavelength conversion member precursor 54A, 54B, 54C Cylindrical wavelength conversion member precursor 60A, 60B, 60C Cylindrical wavelength conversion member 70B Grinding member 140αD Effective blade portion (or neck portion) of cutting tool
140βD Non-effective cutting edge portion (or non-neck portion) of cutting tool
150A, 150B, 150C, 150D First disk-shaped wavelength converting member 160A, 160B, 160D, 170A, 170B, 180A, 180B, 190B, 160αC Precursor of ring-shaped wavelength converting member laminate 170C, 170D, 190A Ring-shaped wavelength converting member 200B Precursor of ring-shaped wavelength converting member
Claims (17)
保持した前記板状の波長変換部材に切削加工処理を施して、円柱状の波長変換部材の前駆体と前記前駆体に連続する波長変換部材のボディ部分とから構成される波長変換部材ブロックを形成する工程と、
前記波長変換部材ブロックの形成後に前記円柱状の波長変換部材の前駆体と前記ボディ部分とを互いに分離させる工程と、
前記円柱状の波長変換部材の前駆体を個片化する工程と、
を含み、
前記切削加工処理として、粗加工および仕上げ加工の少なくとも２つを含む切削加工処理を行う、円柱状の波長変換部材の製造方法。 A step of holding a plate-shaped wavelength conversion member on a holder;
a step of performing a cutting process on the held plate-like wavelength conversion member to form a wavelength conversion member block including a cylindrical precursor of the wavelength conversion member and a body portion of the wavelength conversion member continuous with the precursor ;
separating the cylindrical wavelength converting material precursor and the body portion from each other after forming the wavelength converting material block;
A step of singulating the cylindrical wavelength conversion member precursor;
Including,
The method for producing a cylindrical wavelength conversion member, in which the cutting process includes at least two of rough processing and finish processing.
保持した前記板状の波長変換部材に切削加工処理を施して、円柱状の波長変換部材の前駆体の一部とボディ部分とから構成される波長変換部材ブロックを形成する工程と、a step of performing a cutting process on the held plate-like wavelength conversion member to form a wavelength conversion member block including a part of a precursor of a cylindrical wavelength conversion member and a body part;
前記ボディ部分に前記前駆体の残りの部分を形成するとともに前記ボディ部分を除去することにより前記円柱状の波長変換部材の前駆体を形成する工程と、forming a cylindrical wavelength converting member precursor by forming a remaining portion of the precursor on the body portion and removing the body portion;
前記円柱状の波長変換部材の前駆体を個片化する工程と、A step of singulating the cylindrical wavelength conversion member precursor;
を含み、Including,
前記切削加工処理として、粗加工および仕上げ加工の少なくとも２つを含む切削加工処理を行う、円柱状の波長変換部材の製造方法。The method for producing a cylindrical wavelength conversion member, in which the cutting process includes at least two of rough processing and finish processing.
保持した前記板状の波長変換部材の表側主面および裏側主面の両方に切削加工処理を施して、前記ワックスと一体となった円柱状の波長変換部材の前駆体を含む波長変換部材ブロックを形成する工程と、a step of performing a cutting process on both a front main surface and a back main surface of the held plate-like wavelength conversion member to form a wavelength conversion member block including a cylindrical precursor of the wavelength conversion member integrated with the wax;
前記ワックスを除去して前記円柱状の波長変換部材の前駆体を個片化する工程と、removing the wax to separate the cylindrical wavelength conversion member precursor;
を含み、Including,
前記切削加工処理として、粗加工および仕上げ加工の少なくとも２つを含む切削加工処理を行う、円柱状の波長変換部材の製造方法。The method for producing a cylindrical wavelength conversion member, in which the cutting process includes at least two of rough processing and finish processing.
保持した前記板状の波長変換部材の表側主面に切削加工処理を施して、前記ワックスと一体となった円柱状の波長変換部材の前駆体を含む波長変換部材ブロックを形成する工程と、a step of performing a cutting process on a front main surface of the held plate-like wavelength conversion member to form a wavelength conversion member block including a cylindrical precursor of the wavelength conversion member integrated with the wax;
得られた前記波長変換ブロックの裏側主面に研削加工処理を行い、中心軸が前記保持体の主面に直交する円柱状の波長変換部材の前駆体を形成する工程と、a step of performing a grinding process on a back main surface of the obtained wavelength conversion block to form a cylindrical precursor of a wavelength conversion member having a central axis perpendicular to the main surface of the holder;
前記ワックスを除去して前記円柱状の波長変換部材の前駆体を個片化する工程と、removing the wax to separate the cylindrical wavelength conversion member precursor;
を含み、Including,
前記切削加工処理として、粗加工および仕上げ加工の少なくとも２つを含む切削加工処理を行う、円柱状の波長変換部材の製造方法。The method for producing a cylindrical wavelength conversion member, in which the cutting process includes at least two of rough processing and finish processing.
保持した前記板状の波長変換部材の積層体に対して一括して略同心円でかつ互いに径寸法の異なる第１の切削加工処理と第２の切削加工処理をそれぞれ略円周状に施すことで、リング状の波長変換部材の前駆体を形成する工程と、
を含み、
前記第１の切削加工処理および前記第２の切削加工処理においてそれぞれ、粗加工および仕上げ加工の少なくとも２つを含む切削加工処理を行う、リング状の波長変換部材の製造方法。 a step of holding a laminate of plate-shaped wavelength conversion members, in which a plurality of plate-shaped wavelength conversion members are laminated, on a base material;
a step of forming a ring-shaped precursor of the wavelength conversion member by collectively performing a first cutting process and a second cutting process, which are substantially concentric and have different diameters, in a substantially circumferential shape on the held laminate of the plate-shaped wavelength conversion members;
Including,
The manufacturing method of a ring-shaped wavelength conversion member, wherein the first cutting process and the second cutting process each include at least two of rough cutting and finish cutting.
保持した前記板状の波長変換部材に対して略同心円でかつ互いに径寸法の異なる第１の切削加工処理と第２の切削加工処理をそれぞれ略円周状に施すことで、リング状の波長変換部材の前駆体を形成する工程と、a step of forming a ring-shaped precursor of the wavelength conversion member by subjecting the held plate-shaped wavelength conversion member to a first cutting process and a second cutting process, which are substantially concentric and have different diameters, in a substantially circumferential shape;
を含み、Including,
前記第１の切削加工処理および前記第２の切削加工処理においてそれぞれ、粗加工および仕上げ加工の少なくとも２つを含む切削加工処理を行い、In the first cutting process and the second cutting process, a cutting process including at least two of rough cutting and finishing is performed,
前記第１の切削加工処理または前記第２の切削加工処理の少なくとも一方を行う際に、前記基材の一部を共削り加工する、リング状の波長変換部材の製造方法。A method for manufacturing a ring-shaped wavelength conversion member, wherein a part of the base material is co-cut during at least one of the first cutting process or the second cutting process.
保持した前記板状の波長変換部材に対して略同心円でかつ互いに径寸法の異なる第１の切削加工処理と第２の切削加工処理をそれぞれ略円周状に施すことで、リング状の波長変換部材の前駆体を形成する工程と、a step of forming a ring-shaped precursor of the wavelength conversion member by subjecting the held plate-shaped wavelength conversion member to a first cutting process and a second cutting process, which are substantially concentric and have different diameters, in a substantially circumferential shape;
を含み、Including,
前記第１の切削加工処理および前記第２の切削加工処理においてそれぞれ、粗加工および仕上げ加工の少なくとも２つを含む切削加工処理を行う、リング状の波長変換部材の製造方法。The manufacturing method of a ring-shaped wavelength conversion member, wherein the first cutting process and the second cutting process each include at least two of rough cutting and finish cutting.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011165687A (en) | 2010-02-04 | 2011-08-25 | Panasonic Corp | Method of dividing ceramic substrate aggregate |
| CN102720957A (en) | 2011-12-04 | 2012-10-10 | 深圳市光峰光电技术有限公司 | Light emitting device, projection device and illuminating device |
| US20140057375A1 (en) | 2012-08-24 | 2014-02-27 | Luminus Devices, Inc. | Wavelength converting material deposition methods and associated articles |
| JP2016089181A (en) | 2014-10-29 | 2016-05-23 | 住友金属鉱山株式会社 | Cylindrical target material and method for manufacturing the same, and cylindrical sputtering target and method for manufacturing the same |
| JP2017148874A (en) | 2016-02-22 | 2017-08-31 | 株式会社ディスコ | Grinding wheel, grinding wheel and grinding method |
| JP2017151350A (en) | 2016-02-26 | 2017-08-31 | セイコーエプソン株式会社 | Wavelength conversion device, method for manufacturing wavelength conversion device, illumination device, and projector |
-
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- 2020-11-30 JP JP2020198430A patent/JP7602115B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011165687A (en) | 2010-02-04 | 2011-08-25 | Panasonic Corp | Method of dividing ceramic substrate aggregate |
| CN102720957A (en) | 2011-12-04 | 2012-10-10 | 深圳市光峰光电技术有限公司 | Light emitting device, projection device and illuminating device |
| US20140057375A1 (en) | 2012-08-24 | 2014-02-27 | Luminus Devices, Inc. | Wavelength converting material deposition methods and associated articles |
| JP2016089181A (en) | 2014-10-29 | 2016-05-23 | 住友金属鉱山株式会社 | Cylindrical target material and method for manufacturing the same, and cylindrical sputtering target and method for manufacturing the same |
| JP2017148874A (en) | 2016-02-22 | 2017-08-31 | 株式会社ディスコ | Grinding wheel, grinding wheel and grinding method |
| JP2017151350A (en) | 2016-02-26 | 2017-08-31 | セイコーエプソン株式会社 | Wavelength conversion device, method for manufacturing wavelength conversion device, illumination device, and projector |
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