JP7602200B2 - Ultraviolet irradiation equipment - Google Patents

Description

An embodiment of the present invention relates to an ultraviolet irradiation device.

There are ultraviolet irradiation devices that irradiate ultraviolet rays onto a workpiece in order to harden or dry resins or inks applied to the workpiece, modify the workpiece surface, break down foreign matter adhering to the workpiece surface, and sterilize or inactivate bacteria or viruses adhering to the workpiece surface.

As the light source provided in such an ultraviolet irradiation device, a high pressure mercury lamp, a metal halide lamp, or the like has been used.
In recent years, from the viewpoints of longer life, energy saving, and compact size, light-emitting diodes that irradiate ultraviolet light have come to be used in place of high-pressure mercury lamps and metal halide lamps.

When an LED is turned on, it emits ultraviolet light, but also generates heat. If the temperature of the LED rises due to the generated heat, the amount of light emitted decreases as the temperature rises. Furthermore, if the temperature of the LED exceeds the maximum junction temperature, the lifespan of the LED may be shortened or the LED may break down.
For this reason, an ultraviolet irradiation device has been proposed that includes a heat dissipation section having a plurality of fins, and a substrate on which a light emitting diode is mounted, the substrate being provided on an end surface of the heat dissipation section.

Here, the light-emitting diode mounted on the substrate is electrically connected to the circuit board, the power supply, etc. via a cable. However, since the substrate on which the light-emitting diode is mounted is provided on the end face of the heat dissipation section, the cable wraps around the outside of the heat dissipation section and is electrically connected to the circuit board, the power supply, etc. Therefore, space is required around the heat dissipation section to accommodate the cable, making it difficult to miniaturize the ultraviolet irradiation device.
Therefore, there has been a demand for the development of a technique that can reduce the size of an ultraviolet irradiation device even when a heat dissipation section is provided.

Utility Model Registration No. 3194269

The problem that this invention aims to solve is to provide an ultraviolet irradiation device that can be made compact even when a heat dissipation unit is provided.

The ultraviolet irradiation device according to the embodiment includes a storage section, a heat dissipation section provided inside the storage section, and a light emitting section provided at one end of the heat dissipation section and having a light emitting element capable of emitting ultraviolet light. The heat dissipation section has a base on which the light emitting section is provided, a plurality of fins arranged in one direction on the side of the base opposite to the side on which the light emitting section is provided , and a plurality of holes through which a plurality of cables, one end of which is electrically connected to the light emitting section , are inserted. The plurality of holes are arranged in the direction in which the plurality of fins are arranged.

According to an embodiment of the present invention, it is possible to provide an ultraviolet irradiation device that can be made compact even when a heat dissipation unit is provided.

1 is a schematic perspective view illustrating an ultraviolet irradiation device according to an embodiment of the present invention; 2 is a cross-sectional view of the ultraviolet irradiation device shown in FIG. 1 along line AA. 1 is a schematic perspective view illustrating a light-emitting module. 4 is a schematic perspective view of the light-emitting module in FIG. 3 as viewed from direction B.

Below, an embodiment will be illustrated with reference to the drawings. Note that in each drawing, similar components are given the same reference numerals and detailed explanations are omitted as appropriate.

The ultraviolet irradiation device 1 according to this embodiment can be used in a wide range of fields, such as curing and drying ultraviolet-curable resins (e.g., adhesives and inks), surface modification in the manufacturing process of semiconductor devices and liquid crystal panels, various processes such as dry cleaning and photo-alignment, and sterilization and inactivation of bacteria and viruses. Note that the uses of the ultraviolet irradiation device 1 are not limited to those exemplified.

FIG. 1 is a schematic perspective view illustrating an ultraviolet irradiation device 1 according to the present embodiment.
FIG. 2 is a cross-sectional view of the ultraviolet irradiation device 1 shown in FIG. 1 taken along line AA.
FIG. 3 is a schematic perspective view illustrating the light-emitting module 2. As shown in FIG.
FIG. 4 is a schematic perspective view of the light-emitting module 2 in FIG. 3 as viewed from the direction B.

As shown in FIGS. 1 and 2 , an ultraviolet irradiation device 1 includes, for example, a light emitting module 2, a circuit board 3, and a housing 4.
As shown in FIG. 2 , the light emitting module 2 can be provided inside a storage section 40 of a housing 4 .
As shown in FIGS. 2 to 4, the light-emitting module 2 includes, for example, a light-emitting unit 21 and a cooling unit 22.

The light-emitting unit 21 is provided at one end of the heat dissipation unit 22a and has a light-emitting element 21b capable of emitting ultraviolet light. The light-emitting unit 21 is provided, for example, near the window 45.

As shown in Figures 3 and 4, for example, a plurality of light-emitting units 21 can be provided. When a plurality of light-emitting units 21 are provided, the plurality of light-emitting units 21 can be arranged in one direction. For example, the plurality of light-emitting units 21 are arranged in the direction in which the plurality of heat dissipation units 22a are arranged.

Although the above embodiment illustrates an example in which a plurality of light-emitting sections 21 are provided, it is also possible to provide one light-emitting section 21. That is, at least one light-emitting section 21 can be provided.
However, if a plurality of light-emitting units 21 of a predetermined size are provided, it becomes possible to use the same light-emitting unit 21 for ultraviolet irradiation devices 1 of different sizes. Furthermore, when a light-emitting element 21b breaks down, it is possible to replace only the light-emitting unit 21 in which the broken light-emitting element 21b is provided. This makes it possible to reduce manufacturing costs, facilitate inventory management, improve maintainability, and reduce maintenance costs. Furthermore, since the size of the light-emitting unit 21 does not become excessively large, it becomes easier to manufacture the light-emitting unit 21 and easier to handle the light-emitting unit 21.

The light emitting section 21 includes, for example, a substrate 21a and a plurality of light emitting elements 21b.
The substrate 21a has a plate shape. The planar shape of the substrate 21a can be, for example, a rectangle. The substrate 21a may have a single-layer structure or a multi-layer structure. A wiring pattern (not shown) can be provided on the surface of the substrate 21a opposite to the heat dissipation portion 22a. The wiring pattern is formed of a metal such as a silver alloy or a copper alloy.

The material of the substrate 21a can be, for example, an inorganic material such as aluminum oxide or aluminum nitride, an organic material such as paper phenol or glass epoxy, or a metal core substrate in which the surface of a metal plate is coated with an insulating material. In this case, in consideration of the dissipation of heat generated in the light-emitting element 21b, it is preferable to form the substrate 21a using a material with high thermal conductivity. For example, the substrate 21a can be formed from ceramics such as aluminum oxide or aluminum nitride, a highly thermally conductive resin, a metal core substrate, or the like. The highly thermally conductive resin is, for example, a resin such as PET (polyethylene terephthalate) or nylon mixed with a filler containing aluminum oxide or the like.

As shown in FIG. 4, the substrate 21a can be attached to the base 22a1 of the heat dissipation unit 22a using, for example, a fastening member such as a screw. In this case, an elastic heat transfer sheet can be provided between the substrate 21a and the base 22a1. Also, a layer made of silicone grease or the like can be provided between the substrate 21a and the base 22a1.

If an elastic heat transfer sheet or a layer made of silicone grease is provided, it is possible to prevent a gap from being formed between the substrate 21a and the base 22a1, so that the heat generated in the light emitting element 21b is easily transferred to the heat dissipation section 22a. This improves the heat dissipation effect of the heat dissipation section 22a.

The light-emitting element 21b has a longer life than a high-pressure mercury lamp, but the amount of light it emits decreases over time. It is also possible that the light-emitting element 21b may break down. If the substrate 21a is detachably attached to the base 22a1 of the heat dissipation unit 22a using a fastening member, it will be easier to replace the light-emitting unit 21.

The substrate 21a can also be attached to the base 22a1 of the heat dissipation section 22a using, for example, an adhesive with high thermal conductivity. The adhesive with high thermal conductivity can be, for example, an adhesive mixed with a filler containing an inorganic material. The inorganic material can be, for example, a ceramic such as aluminum oxide or aluminum nitride.

If the substrate 21a is bonded to the base 22a1 of the heat dissipation section 22a using an adhesive with high thermal conductivity, it is possible to prevent a gap from being formed between the substrate 21a and the base 22a1, so that the heat generated in the light-emitting element 21b is easily transferred to the heat dissipation section 22a. In addition, the configuration of the light-emitting section 21 is simplified.

The multiple light-emitting elements 21b are provided on the surface of the substrate 21a opposite to the heat dissipation section 22a. The multiple light-emitting elements 21b are electrically connected to a wiring pattern provided on the surface of the substrate 21a. The light emission surface of the multiple light-emitting elements 21b faces the window 45. The ultraviolet light emitted from the multiple light-emitting elements 21b is irradiated to the outside of the ultraviolet light irradiation device 1 through the window 45 (translucent section 45b).

The multiple light-emitting elements 21b are arranged in a row. For example, as shown in FIG. 4, the multiple light-emitting elements 21b can be arranged in a matrix. The multiple light-emitting elements 21b arranged on one substrate 21a can be connected in series. The arrangement and number of the multiple light-emitting elements 21b are not limited to those illustrated in FIG. 4, and can be changed as appropriate depending on the size and use of the ultraviolet irradiation device 1.

There are no particular limitations on the number of light-emitting elements 21b as long as they are capable of emitting ultraviolet light.
The plurality of light-emitting elements 21b may be, for example, light-emitting diodes, laser diodes, or the like.

The multiple light-emitting elements 21b can be, for example, chip-shaped light-emitting elements. In this case, the multiple light-emitting elements 21b can be mounted on mounting pads of a wiring pattern by COB (Chip On Board). In addition, a sealing portion can be provided to cover the multiple light-emitting elements 21b.

The light emitting elements 21b may be surface-mounted light emitting elements, or may be bullet-shaped light emitting elements having leads.
However, if the plurality of light-emitting elements 21b are chip-shaped light-emitting elements, it is possible to provide many light-emitting elements 21b in a small area, which makes it possible to reduce the size of the light-emitting unit 21 and, in turn, the size of the ultraviolet irradiation device 1.

The cooling unit 22 includes, for example, a heat dissipation unit 22a and a blower unit 22b.
3 and 4, for example, a plurality of heat dissipation portions 22a may be provided. When a plurality of heat dissipation portions 22a are provided, the plurality of heat dissipation portions 22a may be arranged in one direction.

Although the example shows a case where multiple heat dissipation parts 22a are provided, one heat dissipation part 22a may be provided. That is, at least one heat dissipation part 22a can be provided. However, if multiple heat dissipation parts 22a of a predetermined size are provided, it becomes possible to use the same heat dissipation part 22a for ultraviolet irradiation devices 1 of different sizes. This makes it possible to reduce manufacturing costs and facilitate inventory management. In addition, since the size of the heat dissipation part 22a does not become excessively large, it becomes easier to manufacture the heat dissipation part 22a and to handle the heat dissipation part 22a.

The heat dissipation section 22a has, for example, a base 22a1 and multiple fins 22a2. The base 22a1 and multiple fins 22a2 are formed from a material with high thermal conductivity. For example, the base 22a1 and multiple fins 22a2 can be formed from a metal such as an aluminum alloy. The base 22a1 and multiple fins 22a2 can be formed integrally using, for example, a die casting method.

The base 22a1 has a plate shape. The planar shape of the base 22a1 can be, for example, a substantially rectangular shape. The base 22a1 is attached, for example, to the inner wall of the storage section 40 of the housing 4. The light-emitting section 21 (substrate 21a) is provided on the base 22a1.

The multiple fins 22a2 are thin plate-shaped and are provided on the side of the base 22a1 opposite to the side on which the light-emitting units 21 are provided. The multiple fins 22a2 are arranged in one direction. For example, as shown in Figures 3 and 4, the multiple fins 22a2 can be arranged in the same direction as the multiple light-emitting units 21 are arranged.

The blower 22b supplies gas to the multiple fins 22a2. The gas is, for example, a gas contained in the atmosphere in which the ultraviolet irradiation device 1 is installed. The gas is, for example, air.

As shown in FIG. 2, the blower 22b can be provided inside the storage section 40. The blower 22b is attached to the inner wall of the storage section 40, for example, via a bracket 22b1. The blower 22b can be provided on the side of the fins 22a2 opposite the base 22a1 side. In this case, a predetermined gap can be provided between the blower 22b and the fins 22a2. If a gap is provided between the blower 22b and the fins 22a2, it is possible to prevent unevenness in the amount of gas supplied to the fins 22a2.

The blower 22b can be provided, for example, outside the storage section 40. However, if the blower 22b is provided inside the storage section 40, the distance between the blower 22b and the heat dissipation section 22a can be shortened, and the cooling efficiency can be improved. In addition, the gas discharged from the blower 22b can be guided to the heat dissipation section 22a by the inner wall of the storage section 40. In other words, the gas discharged from the blower 22b can be prevented from diffusing. Therefore, the gas discharged from the blower 22b can be efficiently supplied to the multiple fins 22a2.

There are no particular limitations on the blower 22b, but it can be, for example, an axial fan. If the blower 22b is an axial fan, the amount of gas supplied will be increased, improving the cooling efficiency.

For example, at least one air blowing section 22b can be provided for each heat dissipation section 22a. For example, in the example shown in FIG. 3, one air blowing section 22b is provided for each heat dissipation section 22a. However, the number of air blowing sections 22b can be changed as appropriate depending on the size of the heat dissipation section 22a, the amount of heat generated in the light emitting section 21, etc.

As shown in FIG. 2, the circuit board 3 can be provided inside the storage section 40. The circuit board 3 can be provided, for example, on the side of the light-emitting module 2 opposite the window 45. The circuit board 3 is attached, for example, to the inner wall of the storage section 40.

The circuit board 3 controls, for example, the elements provided in the ultraviolet irradiation device 1. For example, the circuit board 3 switches the multiple light-emitting elements 21b on and off, and switches the supply of gas by the blower 22b on and off.

The housing 4 has, for example, a storage section 40 , a lid 41 , a connector 42 , a connector 43 , a filter 44 , a window 45 , and a blade 46 .
The storage unit 40 has a box shape and has a space therein for storing, for example, the light emitting module 2 and the circuit board 3 .

As shown in Figs. 1 and 2, the external appearance of the storage unit 40 can be, for example, a substantially rectangular parallelepiped or substantially cubic. If the storage unit 40 has such a shape, it becomes easy to install multiple ultraviolet irradiation devices 1 in close proximity. For example, as shown in Fig. 1, the storage unit 40 may be formed by screwing a panel to a framework structure, or the cylindrical storage unit 40 may be integrally molded using a method such as injection molding.

At least one hole 40b can be provided in each of the pair of side surfaces 40a of the storage section 40 in a direction intersecting the direction in which the multiple fins 22a2 are arranged. When multiple holes 40b are provided, the multiple holes 40b can be arranged in at least one of the directions in which the multiple fins 22a2 are arranged and the direction intersecting the direction in which the multiple fins 22a2 are arranged. The multiple holes 40b illustrated in Figures 1 and 2 are arranged in a direction intersecting the direction in which the multiple fins 22a2 are arranged (e.g., the up-down direction).

The gas supplied from the blower 22b to the fins 22a2 flows through the gaps between the fins 22a2 and is discharged to the outside of the ultraviolet irradiation device 1 through the holes 40b. For this reason, it is preferable to provide the holes 40b at a position that allows the gas flow 101 to be smooth. For example, the holes 40b can be provided at a position on the side surface 40a of the storage section 40 that faces the fins 22a2. When viewed from a direction perpendicular to the side surface 40a, the fins 22a2 can be exposed inside the holes 40b.

The hole 40b has a shape that extends in the direction in which the multiple fins 22a2 are arranged. The planar shape of the hole 40b can be, for example, approximately rectangular. In this way, when viewed from a direction perpendicular to the side surface 40a, the multiple fins 22a2 can be exposed inside the hole 40b, thereby improving the cooling efficiency.

There is no particular limitation on the material of the storage section 40. For example, the storage section 40 can be formed from a material with high thermal conductivity such as metal. If the storage section 40 is formed from a material with high thermal conductivity, it becomes easy to release the heat generated in the light emitting section 21 to the outside via the storage section 40.
Moreover, the storage section 40 can be formed from a resin or the like. If the storage section 40 is formed from a resin or the like, it is possible to achieve a reduction in weight and manufacturing costs.

The lid 41 can be provided at the end of the storage section 40 opposite the side where the light-emitting module 2 is provided. The lid 41 is, for example, plate-shaped and is provided so as to cover the opening at the end of the storage section 40. There are no particular limitations on the material of the lid 41. The lid 41 can be made of, for example, metal or resin.

The lid 41 may be provided with, for example, a connector 42, a connector 43, and a filter 44, etc.
The connector 42 is provided, for example, to electrically connect a control device or the like provided outside the ultraviolet irradiating device 1 to the circuit board 3. The connector 42 is, for example, a connector for communication.

The connector 43 is provided, for example, to electrically connect a power source provided outside the ultraviolet irradiation device 1 to the circuit board 3. The connector 43 is, for example, a power connector.

Although the connectors 42, 43 are provided on the lid 41 in the above example, the connectors 42, 43 may be provided on the side surface 40a of the storage section 40, for example. However, if the connectors 42, 43 are provided on the lid 41, it is easier to provide multiple ultraviolet irradiation devices 1 in close proximity to each other.

At least one filter 44 can be provided. When gas is supplied by the blower 22b, gas outside the storage unit 40 is introduced into the storage unit 40 through the filter 44. If the filter 44 is provided, it is possible to prevent dust and other particles contained in the atmosphere in which the ultraviolet irradiation device 1 is installed from entering the storage unit 40. Furthermore, if it is possible to prevent dust and other particles from entering the storage unit 40, it is possible to prevent dust and other particles from being included in the exhaust gas from the ultraviolet irradiation device 1. This makes it possible to prevent dust and other particles from adhering to the workpiece 100.

The window 45 is provided at the end of the storage section 40 on the side where the light emitting section 21 is provided. The window 45 is provided so as to cover the opening at the end of the storage section 40.
As shown in FIG. 2, the window 45 has, for example, a frame portion 45a and a light transmitting portion 45b.

The frame portion 45a is, for example, plate-shaped and is attached to the end of the storage portion 40. A hole 45a1 is provided in the center of the frame portion 45a. The hole 45a1 penetrates the frame portion 45a in the thickness direction. The hole 45a1 can be provided in a position facing the area in which the multiple light-emitting elements 21b are provided.

The frame portion 45a is formed, for example, from a material that does not transmit ultraviolet light and is resistant to ultraviolet light. The frame portion 45a can be formed, for example, from metal or resin.

The light-transmitting portion 45b is provided inside the hole 45a1. The light-transmitting portion 45b is formed, for example, from a material that transmits ultraviolet light and is resistant to ultraviolet light. The light-transmitting portion 45b can be formed, for example, from ultraviolet transmitting glass, acrylic resin, etc.

The light-transmitting portion 45b can be, for example, glued or screwed to the frame portion 45a. The frame portion 45a and the light-transmitting portion 45b can also be integrally formed using insert molding, two-color molding, or the like.

As shown in FIG. 2, the blades 46 are plate-shaped and multiple blades 46 can be provided inside the storage section 40. One blade 46 can be provided in a position facing one hole 40b. The blades 46 are inclined in a direction away from the surface of the workpiece 100 as they approach the hole 40b.

If vanes 46 with such an inclination are provided, the flow 101 of gas discharged from the ultraviolet irradiation device 1 can be directed in a direction away from the workpiece 100. This makes it possible to prevent a portion of the discharged gas from reaching the workpiece 100 directly. If the gas can be prevented from reaching the workpiece 100 directly, it is possible to prevent the position of resin, ink, etc. provided on the workpiece 100 from shifting, the effect of ultraviolet irradiation from being reduced, and dust caught in the discharged gas from adhering to the workpiece 100.

As described above, the light-emitting unit 21 is provided with a plurality of light-emitting elements 21b. The plurality of light-emitting elements 21b are electrically connected to the circuit board 3 via the cable 5. The light-emitting unit 21 is provided at the end of the heat dissipation unit 22a opposite to the side on which the plurality of fins 22a2 are provided. The circuit board 3 is provided on the side of the heat dissipation unit 22a on which the plurality of fins 22a2 are provided.

In this case, if the cable 5 is routed around the outside of the heat dissipation portion 22 a , the light emitting portion 21 (the plurality of light emitting elements 21 b ) and the circuit board 3 can be electrically connected.
However, this requires space around the heat dissipation portion 22a to accommodate the cable 5. This makes it difficult to reduce the size of the housing 4 (storage portion 40) and therefore the size of the ultraviolet irradiation device 1.

As shown in Figs. 3 and 4, the heat dissipation section 22a is provided with a hole 22a3 for inserting the cable 5. For example, the hole 22a3 penetrates at least the base 22a1 in the thickness direction. When fins 22a2 are provided in the region of the base 22a1 where the hole 22a3 is provided, the hole 22a3 penetrates, for example, between the end of the base 22a1 on the light emitting section 21 side and the ends of the multiple fins 22a2 on the opposite side to the light emitting section 21 side (the ends on the circuit board 3 side).

In this case, the hole 22a3 can also be opened on the side surface 22aa of the heat dissipation section 22a. The hole 22a3 can also be provided on one side surface 22aa of the heat dissipation section 22a, the other side surface 22aa of the heat dissipation section 22a, or both side surfaces 22aa of the heat dissipation section 22a. If the hole 22a3 is open on the side surface 22aa of the heat dissipation section 22a, the wiring work of the cable 5 and the installation work of the light emitting section 21 can be facilitated.

For example, at least one hole 22a3 may be provided for each heat dissipation portion 22a. For example, at least one hole 22a3 may be provided for each light emitting portion 21.
That is, the heat dissipation unit 22a has at least one hole 22a3 through which the multiple cables 5 are inserted, one end of which is electrically connected to the light emitting unit 21. When multiple holes 22a3 are provided, the multiple holes 22a3 can be arranged in the direction in which the multiple fins 22a2 are arranged.
The number, shape, size, and installation position of the holes 22a3 can be appropriately changed depending on the number, shape, size, and installation position of the light-emitting units 21 and cables 5.

If hole 22a3 is provided, cable 5 can be stored inside hole 22a3, so there is no need to provide space around heat dissipation section 22a for cable 5. This allows for a smaller housing 4 (storage section 40), and therefore a smaller ultraviolet irradiation device 1.

In addition, if the cable 5 is stored inside the hole 22a3, it is possible to prevent the cable 5 from being pinched or bent by an external force when storing the light-emitting unit 21 inside the storage unit 40. For example, the hole 22a3 can have the function of securing space for installing the cable 5 and the function of protecting the cable 5.

A tube 5a that covers the multiple cables 5 can also be provided. The tube 5a may be, for example, a tube having a cylindrical shape or a spiral tube. The multiple cables 5 covered by the tube 5a are inserted into the hole 22a3. If the tube 5a that covers the multiple cables 5 is provided, it is possible to prevent the cables 5 from coming into direct contact with the inner surface of the hole 22a3, or the cables 5 from coming into direct contact with the inner wall of the storage section 40. Therefore, for example, when the ultraviolet irradiation device 1 is subjected to vibration, it is possible to prevent damage to the cables 5. Furthermore, if the tube 5a that covers the multiple cables 5 is provided, the multiple cables 5 can be bundled, which makes it easier to install the light emitting section 21 and perform maintenance work.

Although several embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their variations are included within the scope and gist of the invention, as well as within the scope of the invention and its equivalents described in the claims. Furthermore, the above-mentioned embodiments can be implemented in combination with each other.

1 UV irradiation device, 2 Light emitting module, 3 Circuit board, 4 Housing, 21 Light emitting section, 21a Board, 21b Light emitting element, 22 Cooling section, 22a Heat dissipation section, 22a1 Base, 22a2 Fin, 22a3 Hole, 40 Storage section, 5 Cable, 5a Tube

Claims (2)

A storage section;
A heat dissipation section provided inside the storage section;
a light emitting unit provided at one end of the heat dissipation unit and having a light emitting element capable of emitting ultraviolet light;
Equipped with
the heat dissipation unit has a base on which the light emitting unit is provided, a plurality of fins arranged in one direction on a side of the base opposite to the side on which the light emitting unit is provided , and a plurality of holes through which a plurality of cables, one end of which is electrically connected to the light emitting unit, are inserted ;
The ultraviolet irradiation device , wherein the plurality of holes are arranged in a direction in which the plurality of fins are arranged . a tube covering the cables;
2. The ultraviolet irradiation device according to claim 1, wherein the plurality of cables covered by the tube are inserted through the inside of the hole.

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