JP7606401B2 - Heat Transfer Device - Google Patents

Description

The present invention relates to a heat transfer device.

A conventional heat transfer device is described in Patent Document 1 below. This heat transfer device includes a container holder, a thermistor as a heat source, a metal thermistor case, and a spring. The container holder has an insertion portion into which a beverage can is inserted. The insertion portion has a cylindrical side wall and a disk-shaped bottom. The thermistor is housed within the thermistor case and abuts against the upper side of the thermistor case. The thermistor case is biased by a spring and abuts against the bottom of the container holder.

Japanese Patent Application Publication No. 01-190320

In conventional heat transfer devices, heat from the thermistor is transferred to the beverage can via the thermistor case and the bottom of the container holder. As a result, the part of the thermistor case and the bottom of the container holder located directly above the thermistor becomes locally hotter than other parts, and only the center of the bottom of the beverage can that comes into contact with this part becomes hotter than the peripheral part of the bottom of the beverage can.

The present invention provides a heat transfer device that can suppress localized heat transfer.

The heat transfer device of one aspect of the present invention includes a heat source, a thermally conductive contact part that can come into contact with a heat transfer target, and a first heat transfer part that is disposed between the heat source and the contact part.

The first heat transfer section can be configured to have a first section and a second section having thermal conductivity. The first section can be configured to be in direct contact with the heat source, in direct or indirect contact with the contact section, and to have at least one first gap provided inside the first section. The second section can be configured to be in direct contact with the heat source but in direct or indirect contact with the contact section.

In the case of a heat transfer device of this type, the heat of the heat source is received by the first part of the first heat transfer section, and is transferred to the contact section via the first heat transfer section. Since at least one first gap is provided in the first part of the first heat transfer section, the heat transfer from the first part of the first heat transfer section to the contact section is suppressed compared to the heat transfer from the second part of the first heat transfer section to the contact section. Therefore, the heat of the heat source is less likely to be transferred locally to the contact section via the first part of the first heat transfer section.

At least one first gap in the first part of the first heat transfer section may be open to the contact part side or may be a sealed space.

When at least one first void is open, the at least one first void may be one. In this case, the first portion of the first heat transfer portion may be substantially U-shaped in cross section in the first direction. The first direction may be the direction in which the heat source, the first heat transfer portion, and the contact portion are arranged.

The heat transfer device may further include at least one second heat transfer section (one second heat transfer section or multiple second heat transfer sections) that is thermally conductive.

The second heat transfer section is disposed between the first heat transfer section and the contact section, and can be configured to be in direct contact with the first heat transfer section and in direct contact with the contact section.

When at least one first gap is open, one second heat transfer section can be configured to close at least one first gap from the contact portion side.

The second heat transfer section may be configured to have a first section and a second section having thermal conductivity. The first section of the second heat transfer section may be configured to be in direct contact with the first heat transfer section and the contact section and to have at least one second gap provided inside the first section of the second heat transfer section. The second section of the second heat transfer section may be configured to be in direct contact with the contact section while not in direct contact with the first heat transfer section.

The multiple second heat transfer sections may be stacked in the first direction. In this case, the multiple second heat transfer sections may include a first second heat transfer section that is in direct contact with the first heat transfer section, and a second second heat transfer section that is in direct contact with the contact section.

The first second heat transfer section can be configured to block at least one first gap of the first part of the first heat transfer section from the contact side.

The first second heat transfer section can be configured to have a first section and a second section having thermal conductivity. The first section of the first second heat transfer section can be configured to be in direct contact with the first heat transfer section, in direct contact with a second heat transfer section of the plurality of second heat transfer sections that is located on the contact section side with respect to the first second heat transfer section, and to have at least one second gap provided inside the first section of the first second heat transfer section. The second section of the first second heat transfer section can be configured to be in direct contact with a second heat transfer section of the plurality of second heat transfer sections that is located on the contact section side with respect to the first second heat transfer section, while not in direct contact with the first heat transfer section.

The second second heat transfer section can be configured to have a first section and a second section having thermal conductivity. The first section of the second second heat transfer section can be configured to be in direct contact with a second heat transfer section located on the heat source side relative to the second second heat transfer section among the plurality of second heat transfer sections, and to be in direct contact with the contact section and to have at least one second gap provided inside the first section of the second second heat transfer section. The second section of the second second heat transfer section can be configured to be in direct contact with the contact section while not in direct contact with the second heat transfer section located on the heat source side relative to the second second heat transfer section.

The plurality of second heat transfer sections may further include a third second heat transfer section located between the first second heat transfer section and the second second heat transfer section.

The third second heat transfer section can be configured to have a first section and a second section having thermal conductivity. The first section of the third second heat transfer section can be configured to be in direct contact with the second heat transfer section located on the heat source side relative to the third second heat transfer section among the plurality of second heat transfer sections, in direct contact with the second heat transfer section located on the contact section side relative to the third second heat transfer section among the plurality of second heat transfer sections, and to have at least one second gap provided inside the first section of the third second heat transfer section. The second section of the third second heat transfer section can be configured to be in direct contact with the second heat transfer section located on the contact section side relative to the third second heat transfer section, while not in direct contact with the second heat transfer section located on the heat source side relative to the third second heat transfer section.

The first heat transfer section described above may be configured to not have the first and second parts of the first heat transfer section, and to be in direct contact with the heat source. In this case, the heat transfer device may be configured to include the one second heat transfer section, and the one second heat transfer section may have the first and second parts of the one second heat transfer section. In this case, the heat of the heat source is received by the first heat transfer section and is transferred to the contact section via the first heat transfer section and the one second heat transfer section. Since the first section of the one second heat transfer section has at least one second gap, the heat transfer from the first section of the one second heat transfer section to the contact section is suppressed compared to the heat transfer from the second section of the one second heat transfer section to the contact section. For this reason, the heat of the heat source is less likely to be locally transferred to the contact section via the first heat transfer section and the first section of the one second heat transfer section. Alternatively, the heat transfer device may include the first second heat transfer section and the second second heat transfer section, and the first second heat transfer section may have the first and second parts of the first second heat transfer section, and/or the second second heat transfer section may have the first and second parts of the second second heat transfer section. In this case, heat from the heat source is received by the first heat transfer section and is transferred to the contact section via the first heat transfer section, the first second heat transfer section, and the second second heat transfer section. Since at least one of the first and second heat transfer sections has at least one second gap, heat transfer from the first section of the first second heat transfer section to a section of the second second heat transfer section that contacts the first section is suppressed compared to heat transfer from the second section of the first second heat transfer section to a section of the second second heat transfer section that contacts the second section, and/or heat transfer from the first section of the second second heat transfer section to a section of the contact section that contacts the first section is suppressed compared to heat transfer from the second section of the second second heat transfer section to a section of the contact section that contacts the second section. Therefore, heat from the heat source is less likely to be locally transferred to the contact section via the first heat transfer section and at least one of the first section of the first and second second heat transfer sections. Alternatively, the heat transfer device may include the first second heat transfer section, the second second heat transfer section, and the third second heat transfer section, and may have at least one of the following configurations: the first second heat transfer section has the first and second parts of the first second heat transfer section, the second second heat transfer section has the first and second parts of the second second heat transfer section, and the third second heat transfer section has the first and second parts of the third second heat transfer section. In this case, heat from the heat source is received by the first heat transfer section and is transferred to the contact section via at least the first heat transfer section, the first second heat transfer section, the second second heat transfer section, and the third second heat transfer section. Since at least one first part of the first second heat transfer part, the second second heat transfer part, and the third second heat transfer part is provided with at least one second gap, at least one of the following occurs: heat transfer from the first part of the first second heat transfer part to a part of the second heat transfer part located on the contact part side that contacts the first part is suppressed compared to heat transfer from the second part of the first second heat transfer part to a part of the second heat transfer part located on the contact part side that contacts the second part, heat transfer from the first part of the second second heat transfer part to a part of the contact part that contacts the first part is suppressed compared to heat transfer from the second part of the second second heat transfer part to a part of the contact part that contacts the second part, and heat transfer from the first part of the third second heat transfer part to a part of the second heat transfer part located on the contact part side that contacts the first part is suppressed compared to heat transfer from the second part of the third second heat transfer part to a part of the second heat transfer part located on the contact part side that contacts the second part. As a result, the heat from the heat source is less likely to be locally transferred to the contact portion via the first heat transfer portion and at least one of the first portion of the first second heat transfer portion, the first portion of the second second heat transfer portion, and the first portion of the third second heat transfer portion.

The heat transfer device can be configured to include a first terminal and a second terminal electrically connected to a heat source. The first terminal may also serve as the first heat transfer section, or may be separate from the first heat transfer section.

The heat source can be, for example, a PTC heater, a heating wire, or a Peltier element.

1 is a front, top and right side perspective view of a heat transfer device according to a first embodiment of the present invention; 1 is a front, bottom and right side perspective view of a heat transfer device according to a first embodiment of the present invention. FIG. 2A-2A cross-sectional view of the heat transfer device of Example 1 in FIG. 1A. 2B-2B cross-sectional view of the heat transfer device of Example 1 in FIG. 1A. 1 is an exploded perspective view of a heat transfer device according to a first embodiment, as viewed from the front, top, and right side; FIG. 1 is an exploded perspective view of a heat transfer device according to a first embodiment, as viewed from the front, bottom, and right side; FIG. FIG. 2 is a cross-sectional view showing a first design modification of the heat transfer device according to the first embodiment. FIG. 4 is a cross-sectional view showing a second design modification of the heat transfer device according to the first embodiment. FIG. 11 is a cross-sectional view showing a third design modification of the heat transfer device according to the first embodiment. FIG. 11 is a cross-sectional view showing a fourth design modification of the heat transfer device according to the first embodiment. FIG. 6 is a cross-sectional view of a heat transfer device according to a second embodiment of the present invention. FIG. 11 is a cross-sectional view showing a first design modification of the heat transfer device of the second embodiment.

Below, we will explain several examples of the present invention, including Examples 1 and 2 and their design variations. Please note that the components of the examples and design variations described below can be combined with each other as long as they are not inconsistent with each other. Please also note that the materials, shapes, dimensions, numbers, and arrangements of the components in each aspect of the examples and design variations described below are merely examples, and that the design can be changed as desired as long as the same functions can be realized.

Hereinafter, the heat transfer device D1 according to a number of embodiments including the first embodiment and its design variations of the present invention will be described with reference to Figs. 1A to 7. Figs. 1A to 3B show the heat transfer device D1 of the first embodiment. Fig. 4 shows a first design variation of the heat transfer device D1 of the first embodiment. Fig. 5 shows a second design variation of the heat transfer device D1 of the first embodiment. Fig. 6 shows a third design variation of the heat transfer device D1 of the first embodiment. Fig. 7 shows a fourth design variation of the heat transfer device D1 of the first embodiment. Figs. 2A, 2B, and 4 to 7 show the Z-Z' direction (first direction). The Z-Z' direction includes the Z direction and the Z' direction.

The heat transfer device D1 has a contact part 200. The contact part 200 may be made of a thermally conductive material (e.g., synthetic resin (e.g., polypropylene (see Figures 2A, 2B, and 4 to 6), silicone resin, etc.), elastomer (e.g., silicone rubber, etc.), metal (e.g., aluminum (see Figure 7), copper), or carbon fiber, etc.) and may be configured to contact the heat transfer target. For example, when the heat transfer device D1 is a beverage holder with a heat retention and/or cold retention function and the heat transfer target is a can or a plastic bottle containing a beverage, the heat transfer device D1 has a bottomed tube that opens in the Z direction and can accommodate the can or plastic bottle, and this bottomed tube has a side wall extending in the Z-Z' direction and a bottom that closes the opening of the side wall on the Z' direction side. In this case, the contact part 200 may be the bottomed tube itself, or may be the side wall or bottom of the bottomed tube. When the heat transfer device D1 is a food storage container such as a lunch box with a heat retention and/or cold retention function and the heat transfer target is food inside the food storage container (not shown), the heat transfer device D1 has a bottomed tube (e.g., a bottomed cylinder or polygonal tube) that opens in the Z direction and can accommodate food, and this bottomed tube has a sidewall that extends in the Z-Z' direction and a bottom that closes the opening of the sidewall on the Z' direction side. In this case, the contact part 200 may be the bottomed tube itself, or the sidewall or bottom of the bottomed tube. The contact part 200 may also be a plate on which the heat transfer target can be placed (contacted).

The heat transfer device D1 further includes a heat source 100. The heat source 100 is composed of a PTC (Positive Temperature Coefficient) heater, a heating wire, a thermistor, a Peltier element, or the like. The PTC heater can be a ceramic PTC heater or an organic PTC heater, or the like.

Ceramic PTC heaters are composed of elements whose main components are barium titanate (BaTiO3) and vanadium oxide (V2O3), and the Curie temperature of the element is set to a specified temperature. When electricity is applied to a ceramic PTC heater while the temperature of the element is below the Curie temperature, the element has a low resistance, so current flows through the element, generating heat and causing the element temperature to rise until it approaches the Curie temperature. When the element temperature rises to the Curie temperature, the element's resistance increases, suppressing the current flowing through the element and causing the element temperature to drop. This repeated rise and fall in the element temperature keeps the element temperature of the ceramic PTC heater at around the Curie temperature. The Curie temperature can be freely set by changing the material composition of the element.

An organic PTC heater has a pair of electrodes and an element formed by dispersing conductive particles such as carbon black or metal in a crystalline polymer between the pair of electrodes. Until the temperature of the element reaches a specific temperature of the element, the crystalline polymer of the element does not thermally expand, the conductive particles of the element are dispersed uniformly, numerous conductive paths are formed between the pair of electrodes, and the resistance of the element is low. Therefore, when electricity is applied to the organic PTC heater, a current flows through the pair of electrodes and the element, the element heats up, and the temperature of the element rises until it reaches a specific temperature. When the temperature of the element rises to a specific temperature, the crystalline polymer of the element thermally expands, the conductive particles of the element are unevenly dispersed, the conductive paths between the pair of electrodes are cut off, and the resistance of the element increases, so the temperature of the element drops. The temperature of the element of the organic PTC heater is maintained near a specific temperature by repeating the temperature rise and fall of the element. Furthermore, the specific temperature can be freely set by adjusting the compounding ratio of the crystalline polymer and the conductive particles.

The heating wire generates heat when electricity is passed through it. Thermistors generate heat when electricity is passed through them.

A Peltier element has a pair of substrates (e.g., ceramic substrates or metal plates) and N-type and P-type semiconductors alternately arranged between the pair of substrates. When a current is applied to the Peltier element, one of the pair of substrates is heated and the other is cooled by the Peltier effect. When the Peltier element is used as a heating element, the Peltier element is arranged so that one substrate faces the Z direction (contact portion 200 side) and the other substrate faces the Z' direction. When the Peltier element is used as a cooling element, the Peltier element is arranged so that the other substrate faces the Z direction (contact portion 200 side) and one substrate faces the Z' direction. When the Peltier element is used as a switchable heating element and cooling element, the Peltier element is arranged so that one substrate faces the Z direction (contact portion 200 side) and the other substrate faces the Z' direction. In this case, when the direction of the direct current applied to the Peltier element by passing current is in a first direction, one substrate is heated and the other substrate is cooled by the Peltier effect, while when the direction of the direct current applied to the Peltier element by passing current is in a second direction opposite to the first direction, one substrate is cooled and the other substrate is heated. By switching the direction of the direct current in this way, the Peltier element can switch between heating and cooling.

The heat transfer device D1 further includes a first heat transfer section 300. The first heat transfer section 300 is disposed between the heat source 100 and the contact section 200. The first heat transfer section 300 includes a first section 310 and a second section 320. The first section 310 and the second section 320 are made of a thermally conductive material (e.g., metal (e.g., aluminum or copper)). The Z-Z' direction corresponds to the arrangement direction of the heat source 100, the first heat transfer section 300, and the contact section 200.

The first part 310 is a column or a protrusion extending from the second part 320 in the Z' direction, and is in direct contact with the heat source 100 from the Z direction side (contact part 200 side) and in direct or indirect contact with the contact part 200. The first part 310 has at least one first void 301 provided inside the first part 310. The at least one first void 301 may be one or more, and may be open to the Z direction side (contact part 200 side), or may be a sealed space that does not open to the outside of the first part 310. Air is present in the at least one open first void 301. The at least one first void 301, which is a sealed space, is filled with air or other gas. The thermal conductivity of this air or other gas is lower than the thermal conductivity of the first part 310 and the second part 320 of the first heat transfer part 300. When there is at least one first void 301, the first portion 310 can be roughly U-shaped in cross section in the Z-Z' direction. This first portion 310 has a cylindrical sidewall extending in the Z-Z' direction and a bottom portion that closes the opening of the sidewall on the Z' direction side, and the bottom portion is in direct contact with the heat source 100 from the Z direction side (contact portion 200 side) relative to the heat source 100. The first portion 310 is heated or cooled by the heat source 100. In other words, the first portion 310 is adapted to receive heat from the heat source 100.

For example, when the first part 310 is heated by the heat source 100, the first part 310 is in direct contact with one of the substrates of the PTC heater, heating wire, thermistor, or Peltier element, which is the heat source 100, from the Z direction side (contact part 200 side) of the PTC heater, heating wire, thermistor, or Peltier element. When the first part 310 is cooled by the heat source 100, the first part 310 is in direct contact with the other substrate of the Peltier element, which is the heat source 100, from the Z direction side (contact part 200 side). When the first part 310 is switched between heating and cooling, the first part 310 is in direct contact with one of the substrates of the Peltier element, which is the heat source 100, from the Z direction side (contact part 200 side).

The second section 320 can be configured, for example, to have a plate extending in a flange-like manner from the first section 310 in a direction substantially perpendicular to the Z-Z' direction (see Figures 2A to 7), or one or more plates (not shown) extending in a cantilever-like manner from the first section 310 in the perpendicular direction. The second section 320 is not in direct contact with the heat source 100, but is in direct or indirect contact with the contact section 200.

The heat transfer device D1 can be further configured to include at least one second heat transfer section 400. The at least one second heat transfer section 400 is disposed between the first heat transfer section 300 and the contact section 200. The at least one second heat transfer section 400 can be one or more. Hereinafter, for convenience of explanation, the at least one second heat transfer section 400 is also referred to as "one or each second heat transfer section 400". One second heat transfer section 400 among the "one or each second heat transfer section 400" corresponds to one second heat transfer section 400 when there is one second heat transfer section 400, and each second heat transfer section 400 corresponds to each second heat transfer section 400 when there are multiple second heat transfer sections 400. One or each of the second heat transfer units 400 is made of a thermally conductive material (e.g., synthetic resin (e.g., polypropylene or silicone resin), elastomer (e.g., silicone rubber or silicone pad), metal (e.g., aluminum or copper), adhesive (e.g., silicone-based adhesive), adhesive tape (e.g., thermally conductive double-sided silicone tape), or carbon fiber). The thermal conductivity of the second heat transfer unit 400 may be the same as, lower than, or higher than the thermal conductivity of the first heat transfer unit 300.

When there is at least one second heat transfer section 400, the second heat transfer section 400 is located on the Z-direction side relative to the first heat transfer section 300 and on the Z'-direction side relative to the contact section 200. The second heat transfer section 400 can have any of the following configurations (1) to (3), for example.

(1) One second heat transfer section 400 is a flat plate extending in the perpendicular direction (see FIG. 7). In this case, one second heat transfer section 400 is in direct contact with the first heat transfer section 300 (e.g., the first section 310 and/or the second section 320) and is in direct contact with the contact section 200.

(2) The second heat transfer section 400 is generally U-shaped in cross section in the Z-Z' direction (not shown). In this case, the second heat transfer section 400 has a cylindrical side wall extending in the Z-Z' direction and a bottom that closes the opening of the side wall on the Z' direction side. The bottom of the second heat transfer section 400 is in direct contact with the first heat transfer section 300 (e.g., the first section 310 and/or the second section 320), and the side wall and/or the bottom of the second heat transfer section 400 is in direct contact with the contact section 200.

(3) The second heat transfer section 400 has a first part 410 and a second part 420 (see FIG. 6). The first part 410 and the second part 420 of the second heat transfer section 400 are made of a material having the above-mentioned thermal conductivity. The first part 410 of the second heat transfer section 400 can be configured similarly to the first part 310 of the first heat transfer section 300, except that the first part 410 of the second heat transfer section 400 is in direct contact with the first part 310 of the first heat transfer section 300 (e.g., the first part 310 and/or the second part 320) and the contact part 200. When the first part 410 of the second heat transfer section 400 is in direct contact with the first part 310 of the first heat transfer section 300, the first part 410 of the second heat transfer section 400 is located on the Z-direction side with respect to the heat source 100. The second part 420 of the first heat transfer part 400 is not in direct contact with the first heat transfer part 300, but is in direct contact with the contact part 200, and can be configured similarly to the second part 320 of the first heat transfer part 300. At least one second void 401 is provided in the first part 410 of the second heat transfer part 400. The at least one second void 401 may be one or more, and may be open on the Z direction side (contact part 200 side), or may be a sealed space that does not open to the outside of the first part 410 of the second heat transfer part 400. Air is present in the at least one open second void 401. The at least one second void 401, which is a sealed space, is filled with air or other gas. The thermal conductivity of this air or other gas is lower than the thermal conductivity of the first part 410 and the second part 420 of the second heat transfer part 400. When the contact portion 200 is a bottomed tube, the first second heat transfer portion 400 can be configured to further include a third portion 430 (see FIGS. 2A to 3B). The third portion 430 of the first second heat transfer portion 400 can be configured to extend in the Z direction from the outer periphery of the second portion 420 of the first second heat transfer portion 400 and to fit onto the side wall of the contact portion 200. The third portion 430 of the first second heat transfer portion 400 can be omitted.

When at least one first gap 301 of the first heat transfer section 300 is open, one second heat transfer section 400 may be arranged so as to block at least one first gap 301 from the Z direction side, but may also be arranged so as not to block at least one first gap 301.

When there are multiple at least one second heat transfer section 400, the multiple second heat transfer sections 400 are stacked in the Z-Z' direction. The multiple second heat transfer sections 400 include a first second heat transfer section 400 that is in direct contact with the first heat transfer section 300 and a second second heat transfer section 400 that is in direct contact with the contact section 200. The first second heat transfer section 400 is located on the Z-direction side relative to the first heat transfer section 300, and the second second heat transfer section 400 is located on the Z'-direction side relative to the contact section 200. The multiple second heat transfer sections 400 may further include a third second heat transfer section 400 (not shown) located between the first second heat transfer section 400 and the second second heat transfer section 400.

The multiple second heat transfer sections 400 include at least one set of two second heat transfer sections 400 that are adjacent to and in contact with each other in the Z-Z' direction. When there is at least one set (i.e., when there are two second heat transfer sections 400), one of the two adjacent second heat transfer sections 400 is a first second heat transfer section 400, and the other is a second second heat transfer section 400 located on the Z direction side (contact section 200 side) of the first second heat transfer section 400. In this case, the third second heat transfer section 400 is omitted.

When at least one set is two sets (i.e., when there are three second heat transfer sections 400), the two sets include a first set and a second set. One of the two adjacent second heat transfer sections 400 in the first set is the first second heat transfer section 400, and the other is the third second heat transfer section 400 located in the Z direction relative to the first second heat transfer section 400. One of the two adjacent second heat transfer sections 400 in the second set is the third second heat transfer section 400, and the other is the second second heat transfer section 400 located in the Z direction relative to the third second heat transfer section 400.

When the number of the above groups is three or more (i.e., when the number of the second heat transfer sections 400 is four or more), the three or more groups include at least a first group, a second group, and a third group. One of the two adjacent second heat transfer sections 400 in the first group is the first second heat transfer section 400, and the other is the second heat transfer section 400 located in the Z direction relative to the first second heat transfer section 400 (the third second heat transfer section 400 or the second heat transfer section 400 other than the third second heat transfer section 400). One of the two adjacent second heat transfer sections 400 in the second group is the third second heat transfer section 400, and the other is the second heat transfer section 400 located in the Z direction relative to the third second heat transfer section 400 (the second second heat transfer section 400 or the second second heat transfer section 400 other than the second second heat transfer section 400). One of the two adjacent second heat transfer sections 400 in the third set is the second second heat transfer section 400, and the other is the second heat transfer section 400 located in the Z' direction relative to the second second heat transfer section 400 (the third second heat transfer section 400 or a second heat transfer section 400 other than the third second heat transfer section 400).

The first second heat transfer section 400 can have, for example, any of the following configurations (4) to (6).

(4) The first second heat transfer section 400 is a flat plate extending in the perpendicular direction (see Figures 2A to 3B and 5). In this case, the first second heat transfer section 400 is in direct contact with the first heat transfer section 300 (e.g., the first section 310 and/or the second section 320) and is in direct contact with a second heat transfer section 400 located on the Z-direction side of the first second heat transfer section 400 among the multiple second heat transfer sections 400.

(5) The first second heat transfer section 400 is generally U-shaped in cross section in the Z-Z' direction (not shown). In this case, the first second heat transfer section 400 has a cylindrical side wall extending in the Z-Z' direction and a bottom that closes the opening of the side wall on the Z' direction side. The bottom of the first second heat transfer section 400 is in direct contact with the first heat transfer section 300 (e.g., the first section 310 and/or the second section 320), and the side wall and/or the bottom of the first second heat transfer section 400 is in direct contact with a second heat transfer section 400 located on the Z direction side of the first second heat transfer section 400 among the multiple second heat transfer sections 400.

(6) The first second heat transfer section 400 has a first part 410 and a second part 420 (see FIG. 4). The first part 410 and the second part 420 of the first second heat transfer section 400 are made of a material having the above-mentioned thermal conductivity. The first part 410 of the first second heat transfer section 400 can be configured similarly to the first part 310 of the first heat transfer section 300, except that the first part 410 of the first second heat transfer section 400 is in direct contact with the first heat transfer section 300 (e.g., the first part 310 and/or the second part 320) and the second heat transfer section 400 located on the Z-direction side of the first second heat transfer section 400 among the plurality of second heat transfer sections 400. When the first part 410 of the first second heat transfer section 400 is in direct contact with the first part 310 of the first heat transfer section 300, the first part 410 of the first second heat transfer section 400 is located on the Z-direction side with respect to the heat source 100. The second part 420 of the first second heat transfer part 400 is not in direct contact with the first heat transfer part 300, but is in direct contact with the second heat transfer part 400 located on the Z-direction side of the first second heat transfer part 400 among the plurality of second heat transfer parts 400. The first part 410 of the first second heat transfer part 400 is provided with at least one second void 401. The at least one second void 401 may be one or more, and may be open on the Z-direction side (contact part 200 side), or may be a sealed space that does not open to the outside of the first part 410 of the first second heat transfer part 400. Air is present in the at least one open second void 401. Air or other gas is filled in the at least one second void 401, which is a sealed space. The thermal conductivity of this air or other gas is lower than the thermal conductivity of the first portion 410 and the second portion 420 of the first second heat transfer section 400.

When at least one open first gap 301 is provided in the first heat transfer section 300, the first second heat transfer section 400 may be arranged so as to block at least one first gap 301 from the Z direction side, but may also be arranged so as not to block at least one first gap 301.

The second second heat transfer section 400 can have, for example, any of the following configurations (7) to (9).

(7) The second second heat transfer section 400 is a flat plate extending in the perpendicular direction (see FIG. 4). In this case, the second second heat transfer section 400 is in direct contact with the second heat transfer section 400 located on the Z' direction side of the second second heat transfer section 400 among the multiple second heat transfer sections 400, and is in direct contact with the contact section 200.

(8) The second second heat transfer section 400 is generally U-shaped in cross section in the Z-Z' direction (not shown). In this case, the second second heat transfer section 400 has a cylindrical side wall extending in the Z-Z' direction and a bottom that closes the opening of the side wall on the Z' direction side. The bottom of the second second heat transfer section 400 contacts a second heat transfer section 400 located on the Z' direction side of the second second heat transfer section 400 among the multiple second heat transfer sections 400, and the side wall and/or bottom of the second second heat transfer section 400 directly contacts the contact section 200.

(9) The second second heat transfer section 400 has a first part 410 and a second part 420 (see Figures 2A to 3B and Figure 5). The first part 410 and the second part 420 of the second second heat transfer section 400 are made of a material having the above-mentioned thermal conductivity. The first part 410 of the second second heat transfer section 400 can be configured similarly to the first part 310 of the first heat transfer section 300, except that it is in direct contact with the second heat transfer section 400 and the contact part 200 located on the Z' direction side with respect to the second second heat transfer section 400 of the multiple second heat transfer sections 400. The first part 410 of the second second heat transfer section 400 can be configured to be located on the Z direction side with respect to the heat source 100. The second part 420 of the second second heat transfer part 400 is not in direct contact with the second heat transfer part 400 located on the Z'-direction side of the second second heat transfer part 400 among the plurality of second heat transfer parts 400, but is in direct contact with the contact part 200, and can be configured similarly to the second part 320 of the first heat transfer part 300. At least one second void 401 is provided in the first part 410 of the second second heat transfer part 400. The at least one second void 401 may be one or more, and may be open on the Z-direction side (contact part 200 side), or may be a sealed space that does not open to the outside of the first part 410 of the second second heat transfer part 400. Air is present in the at least one open second void 401. Air or other gas is filled in the at least one second void 401, which is a sealed space. The thermal conductivity of the air or other gas is lower than that of the first portion 410 and the second portion 420 of the second second heat transfer portion 400. When at least one open second gap 401 is provided in the second second heat transfer portion 400, the contact portion 200 may be arranged so as to block at least one second gap 401 from the Z direction side (see FIG. 2A, FIG. 2B, and FIG. 5), but may be arranged so as not to block at least one second gap 401. The second second heat transfer portion 400 may further include a third portion 430. The third portion 430 of the second second heat transfer portion 400 may extend in the Z direction from the outer periphery of the second portion 420 of the second second heat transfer portion 400 and may be configured to fit on the side wall of the contact portion 200. The third portion 430 of the second second heat transfer portion 400 may be omitted.

The third second heat transfer section 400 can have, for example, any of the following configurations (10) to (12).

(10) The third second heat transfer section 400 is a flat plate extending in the perpendicular direction (not shown). In this case, the third second heat transfer section 400 is in direct contact with the second heat transfer section 400 located on the Z' direction side of the third second heat transfer section 400 among the multiple second heat transfer sections 400 and is in direct contact with the second heat transfer section 400 located on the Z direction side of the third second heat transfer section 400 among the multiple second heat transfer sections 400.

(11) The third second heat transfer section 400 is generally U-shaped in cross section in the Z-Z' direction (not shown). In this case, the third second heat transfer section 400 has a cylindrical side wall extending in the Z-Z' direction and a bottom that closes the opening of the side wall on the Z' direction side. The bottom of the third second heat transfer section 400 is in direct contact with the second heat transfer section 400 located on the Z' direction side of the third second heat transfer section 400 among the multiple second heat transfer sections 400, and the side wall and/or bottom of the third second heat transfer section 400 is in direct contact with the second heat transfer section 400 located on the Z direction side of the third second heat transfer section 400 among the multiple second heat transfer sections 400.

(12) The third second heat transfer section 400 has a first part 410 and a second part 420 (not shown). The first part 410 and the second part 420 of the third second heat transfer section 400 are made of a material having the above-mentioned thermal conductivity. The first part 410 of the third second heat transfer section 400 can be configured similarly to the first part 310 of the first heat transfer section 300, except that the first part 410 of the third second heat transfer section 400 is in direct contact with the second heat transfer section 400 located on the Z' direction side relative to the third second heat transfer section 400 of the multiple second heat transfer sections 400 and the second heat transfer section 400 located on the Z direction side relative to the third second heat transfer section 400 of the multiple second heat transfer sections 400. The first part 410 of the third second heat transfer section 400 can be configured to be located on the Z direction side relative to the heat source 100. The second part 420 of the third second heat transfer part 400 is not in direct contact with the second heat transfer part 400 located on the Z'-direction side relative to the third second heat transfer part 400 among the plurality of second heat transfer parts 400, while being in direct contact with the second heat transfer part 400 located on the Z-direction side relative to the third second heat transfer part 400 among the plurality of second heat transfer parts 400. The first part 410 of the third second heat transfer part 400 is provided with at least one second gap 401. The at least one second gap 401 may be one or more, and may be open on the Z-direction side (contact part 200 side), or may be a sealed space that does not open to the outside of the first part 410 of the third second heat transfer part 400. Air is present in the at least one open second gap 401. Air or other gas is filled in the at least one second gap, which is a sealed space. The thermal conductivity of this air or other gas is lower than the thermal conductivity of the first portion 410 and the second portion 420 of the third second heat transfer section 400. When at least one open second gap 401 is provided in the third second heat transfer section 400, the second heat transfer section 400 located on the Z-direction side of the third second heat transfer section 400 may be arranged so as to block at least one second gap 401 from the Z-direction side, but may also be arranged so as not to block at least one second gap 401.

In addition, at least one second heat transfer section 400 can be omitted.

The heat transfer device D1 can be configured to include a first terminal. The first terminal may also serve as the first heat transfer section 300 (see Figures 2A to 7). In this case, the first heat transfer section 300 not only directly contacts the heat source 100 to receive heat from the heat source 100, but also electrically connects to the heat source 100 by directly contacting the heat source 100. The first terminal may be separate from the first heat transfer section 300 (not shown). In this case, the separate first terminal is connected to the heat source 100, and the first heat transfer section 300 directly contacts the heat source 100 to receive heat from the heat source 100, but is not electrically connected to the heat source 100.

The heat transfer device D1 may be further configured to include a second terminal 500 (see Figures 2A to 4 and 6 to 7). The second terminal 500 is electrically connected to the heat source 100 by directly contacting the heat source 100. The second terminal 500 may be configured to include at least one contact portion 510. The at least one contact portion 510 is a contact spring, which may be one or more, and which is in elastic contact with the heat source 100 from the Z' direction side. When the first heat transfer section 300 also serves as the first terminal and at least one contact section 510 of the second terminal 500 is a contact spring, the first section 310 of the first heat transfer section 300 directly contacts the heat source 100 from the Z direction side, and at least one contact section 510 of the second terminal 500 elastically contacts the heat source 100 from the Z' direction side, so that the heat source 100 is elastically sandwiched in the Z-Z' direction by the first heat transfer section 300 and the second terminal 500. When the first heat transfer section 300 is separate from the first terminal, the first terminal directly contacts the heat source 100 from the Z direction side, and at least one contact section 510 of the second terminal 500 elastically contacts the heat source 100 from the Z' direction side, so that the heat source 100 is elastically sandwiched in the Z-Z' direction by the first terminal and the second terminal 500. At least one contact portion 510 may be a protrusion that simply contacts (does not elastically contact) the heat source 100 from the Z' direction side. Note that the second terminal 500 is omitted in FIG. 5.

The heat transfer device D1 can be further configured to include a first substrate 600, a first cable 700, and a second cable 700. The first substrate 600 may be provided with a storage hole 610 for storing the heat source 100. This storage hole 610 can be omitted. In this case, the first substrate 600 is arranged so as not to interfere with the heat source 100. The first cable 700 can be configured to be connected to the first substrate 600 and electrically connected to a first terminal (which also serves as the first heat transfer section 300 or is separate from the first heat transfer section 300) via the first substrate 600. The second cable 700 can be configured to be connected to the first substrate 600 and electrically connected to a second terminal 500 via the first substrate 600. In this case, the first terminal has a connection portion (connection portion 330 when also serving as the first heat transfer section 300) electrically connected to the first substrate 600. The second terminal 500 has a connection portion 520 that is electrically connected to the first substrate 600.

The heat transfer device D1 can be configured to further include a case 1000. This case 1000 is fixed to the contact portion 200 in the Z-Z' direction. Between the case 1000 and the contact portion 200, the heat source 100, the first heat transfer portion 300 that also serves as the first terminal, at least one second heat transfer portion 400, the first substrate 600, the second terminal 500, and parts of the first and second cables 700 are housed. If the first terminal and the first heat transfer portion 300 are separate, the first terminal is also housed between the case 1000 and the contact portion 200.

It is also possible to omit the first substrate 600, and have the first cable 700 connected to the first terminal and the second cable 700 connected to the second terminal 500. Alternatively, the first terminal separate from the first heat transfer unit 300, the second terminal 500, and the first substrate 600 may be omitted, and the first cable 700 and the second cable 700 may be connected to the heat source 100.

The heat transfer device D1 can be further configured to include a second substrate 800, an operation unit 900, a connector C, and a control unit (not shown) (see Figures 2A to 3B). In this case, the second substrate 800 is held by a holding unit provided on the contact unit 200. The second substrate 800 is connected to the first cable 700 and the second cable 700. The second substrate 800 is also equipped with an operation unit 900, a connector C, and a control unit. The connector C is capable of connecting to a mating connector electrically connected to a power source. The operation unit 900 can be configured to include an operation unit main body 910 and a cover 920. The operation unit main body 910 is a push switch, a slide switch, a capacitive touch switch, a resistive film touch switch, an optical touch switch, or the like, and is configured to output an electrical signal or change the electrical signal (e.g., voltage) of the operation unit main body 910 by being operated. The cover 920 covers the operation unit main body 910. The operation unit body 910 can be operated via the cover 920. The cover 920 can be omitted. The control unit is a logic circuit such as an IC, and is configured to control the on/off of the power supply to the heat source 100 in response to the input of an electrical signal to the operation unit body 910 or a change in the electrical signal (e.g., voltage) of the operation unit body 910, and/or to switch the direction of the direct current applied to the heat source 100 by the power supply from a first direction to a second direction or vice versa.

The heat transfer device D1 can be configured to include a third board 800a and a fourth board 800b instead of the second board 800 (see Figures 5 and 7). The third board 800a is equipped with a connector C, and the fourth board 800b is equipped with a control unit and an operation unit 900. The third board 800a and the first board 600 are connected by the first cable 700a and the second cable 700a. The fourth board 800b and the first board 600 are connected by the third cable 700b and the fourth cable 700b.

The heat transfer device D1 can be configured to include first and second cases 1000a and 1000b instead of the case 1000 (see FIG. 7). The first and second cases 1000a and 1000b are combined in the Z-Z' direction, and the contact portion 200 is held between the first and second cases 1000a and 1000b. Between the first case 1000a and the contact portion 200, the heat source 100, the first heat transfer portion 300 that also serves as the first terminal, at least one second heat transfer portion 400, the first substrate 600, the second terminal 500, and a portion of the first and second cables 700 or a portion of the first and second cables 700a and the third and fourth cables 700b are accommodated. When the first terminal and the first heat transfer portion 300 are separate, the first terminal is also accommodated between the case 1000 and the contact portion 200.

Instead of the connector C, a battery may be provided. In this case, the first cable 700 and the second cable 700 are connected to the battery. The connector C can be omitted. In this case, it is sufficient that the first cable 700 and the second cable 700 can be electrically connected to a power source.

The second substrate 800, the operation unit 900, the connector C, and the control unit, or the third substrate 800a, the fourth substrate 800b, the operation unit 900, the connector C, and the control unit can be omitted. In this case, the first cable 700 and the second cable 700 can be electrically connected to a power source, and the control unit and the operation unit of the electronic device to which the heat transfer device D1 is connected can be used instead of the control unit and the operation unit 900 of the heat transfer device D1. When the heat transfer device D1 is mounted on an electronic device and the contact unit 200 is exposed from the electronic device, the case 1000 and the first and second cases 1000a and 1000b can also be omitted. The above electronic devices also include vehicles such as automobiles.

The heat transfer device D1 described above provides the following technical features and effects.

(A) When at least one second heat transfer section 400 is not provided and the first section 310 and the second section 320 of the first heat transfer section 300 are in direct contact with the contact section 200, the heat (heating or cooling heat) of the heat source 100 received by the first section 310 of the first heat transfer section 300 is transferred to the contact section 200 via the first heat transfer section 300. Since the first section 310 of the first heat transfer section 300 has at least one first gap 301, the heat transfer from the first section 310 of the first heat transfer section 300 to the portion of the contact section 200 that contacts the first section 310 is suppressed compared to the heat transfer from the second section 320 of the first heat transfer section 300 to the portion of the contact section 200 that contacts the second section 320. As a result, heat from the heat source 100 is less likely to be locally transferred through the first portion 310 of the first heat transfer section 300 to the portion of the contact section 200 that is in contact with the first portion 310.

(B) When one second heat transfer section 400 is provided, the heat (heating or cooling heat) of the heat source 100 received by the first part 310 of the first heat transfer section 300 is transferred to the contact part 200 via the first heat transfer section 300 and one second heat transfer section 400. (B-1) Since at least one first gap 301 is provided in the first part 310 of the first heat transfer section 300, the heat transfer from the first part 310 of the first heat transfer section 300 to a part contacting the first part 310 of one second heat transfer section 400 is suppressed compared to the heat transfer from the second part 320 of the first heat transfer section 300 to a part contacting the second part 320 of one second heat transfer section 400 (hereinafter, this suppression of heat transfer is also referred to as the suppression of first heat transfer). As a result, the heat from the heat source 100 is less likely to be locally transferred to the portion of the contact portion 200 on the Z-direction side relative to the first portion 310 of the first heat transfer portion 300 through the first portion 310 of the first heat transfer portion 300 and one of the second heat transfer portions 400.

(B-2) In addition to the configuration of (B-1), when a second heat transfer section 400 has a first part 410 and a second part 420, and the first part 410 of the second heat transfer section 400 is located on the Z-direction side relative to the heat source 100 and has at least one second gap 401, the first heat transfer of (B-1) is suppressed, and heat transfer from the first part 410 of the second heat transfer section 400 to a portion of the contact section 200 that contacts the first part 410 is suppressed compared to heat transfer from the second part 420 of the second heat transfer section 400 to a portion of the contact section 200 that contacts the second part 420. In this case, the heat of the heat source 100 is less likely to be locally transferred to a portion of the contact portion 200 that is located on the Z-direction side of the first portion 310 and that is in contact with the first portion 410 via the first portion 310 of the first heat transfer portion 300 and the first portion 410 of one of the second heat transfer portions 400.

(C) When two second heat transfer sections 400 (a first second heat transfer section 400 and a second second heat transfer section 400) are provided, the heat (heating or cooling heat) of the heat source 100 received by the first section 310 of the first heat transfer section 300 is transferred to the contact section 200 via the first heat transfer section 300, the first second heat transfer section 400 and the second second heat transfer section 400. (C-1) At least one first gap 301 is provided in the first portion 310 of the first heat transfer portion 300, so that heat transfer from the first portion 310 of the first heat transfer portion 300 to the portion of the first second heat transfer portion 400 that contacts the first portion 310 is suppressed compared to heat transfer from the second portion 320 of the first heat transfer portion 300 to the portion of the first second heat transfer portion 400 that contacts the second portion 320 (hereinafter, this suppression of heat transfer is also referred to as suppression of second heat transfer). For this reason, the heat of the heat source 100 is locally less likely to be transferred to the portion of the contact portion 200 on the Z-direction side relative to the first portion 310 through the first portion 310 of the first heat transfer portion 300, the first second heat transfer portion 400, and the second second heat transfer portion 400.

(C-2) In addition to the configuration of (C-1), when the first second heat transfer section 400 has a first section 410 and a second section 420, and the first section 410 of the first second heat transfer section 400 is located on the Z-direction side relative to the heat source 100 and has at least one second gap 401, the second heat transfer suppression of (C-1) is performed, and the heat transfer from the first section 410 of the first second heat transfer section 400 to a portion of the second second heat transfer section 400 that contacts the first section 410 of the first second heat transfer section 400 is suppressed compared to the heat transfer from the second section 420 of the first second heat transfer section 400 to a portion of the second second heat transfer section 400 that contacts the second section 420 of the first second heat transfer section 400 (hereinafter, this suppression of heat transfer is also referred to as the third suppression of heat transfer). In this case, the heat of the heat source 100 is locally difficult to be transferred through the first part 310 of the first heat transfer part 300, the first part 410 of the first second heat transfer part 400, and the second second heat transfer part 400 to a part of the contact part 200 located on the Z-direction side of the first part 310 of the first heat transfer part 300 and the first part 410 of the first second heat transfer part 400.

(C-3) In addition to the configuration of (C-1), when the second second heat transfer section 400 has a first section 410 and a second section 420, and the first section 410 of the second second heat transfer section 400 is located on the Z-direction side relative to the heat source 100 and has at least one second gap 401, the second heat transfer suppression of (C-1) is performed, and the heat transfer from the first section 410 of the second second heat transfer section 400 to the portion of the contact section 200 that contacts the first section 410 is suppressed compared to the heat transfer from the second section 420 of the second second heat transfer section 400 to the portion of the contact section 200 that contacts the second section 420 (hereinafter, this suppression of heat transfer is also referred to as the fourth suppression of heat transfer). In this case, the heat of the heat source 100 is locally difficult to be transferred through the first part 310 of the first heat transfer part 300, the first second heat transfer part 400, and the first part 410 of the second second heat transfer part 400 to a part of the contact part 200 located on the Z-direction side of the first part 310 of the first heat transfer part 300 and in contact with the first part 410 of the second second heat transfer part 400.

(C-4) In addition to the configuration of (C-1), when the configurations of (C-2) and (C-3) are provided, the second heat transfer suppression of (C-1) is performed, the third heat transfer suppression of (C-2) is performed, and the fourth heat transfer suppression of (C-4) is performed. In this case, the heat of the heat source 100 is locally difficult to be transferred through the first part 310 of the first heat transfer part 300, the first part 410 of the first second heat transfer part 400, and the first part 410 of the second second heat transfer part 400 to a part of the contact part 200 located on the Z-direction side of the first part 310 of the first heat transfer part 300 and the first part 410 of the first second heat transfer part 400 and in contact with the first part 410 of the second second heat transfer part 400.

(D) When three or more second heat transfer sections 400 (including the first second heat transfer section 400, the second second heat transfer section 400, and the third second heat transfer section 400) are provided, the heat (heating or cooling heat) of the heat source 100 received by the first section 310 of the first heat transfer section 300 is transferred to the contact section 200 via the first heat transfer section 300 and the three or more second heat transfer sections 400. (D-1) Since at least one first gap 301 is provided in the first section 310 of the first heat transfer section 300, the second heat transfer of (C-1) is suppressed. Therefore, the heat of the heat source 100 is less likely to be locally transferred to the portion of the contact section 200 on the Z-direction side relative to the first section 310 via the first section 310 of the first heat transfer section 300 and the three or more second heat transfer sections 400.

(D-2) In addition to the configuration of (D-1), when the first second heat transfer section 400 has a first section 410 and a second section 420, and the first section 410 of the first second heat transfer section 400 is located on the Z-direction side with respect to the heat source 100 and has at least one second gap 401, the second heat transfer suppression of (C-1) is performed, and the first section 410 of the first second heat transfer section 400 is located on the Z-direction side with respect to the first second heat transfer section 400. Heat transfer to a portion of the second heat transfer section 400 that contacts the first portion 410 of the first second heat transfer section 400 is suppressed compared to heat transfer from the second portion 420 of the first second heat transfer section 400 to a portion of the second heat transfer section 400 that contacts the second portion 420 of the first second heat transfer section 400 located on the Z-direction side of the first second heat transfer section 400 (hereinafter, this suppression of heat transfer is also referred to as the fifth suppression of heat transfer). In this case, the heat of the heat source 100 is locally difficult to be transferred to a portion of the contact section 200 that is located on the Z-direction side of the first portion 310 of the first heat transfer section 300 and the first portion 410 of the first second heat transfer section 400 via the first portion 310 of the first heat transfer section 300, the first portion 410 of the first second heat transfer section 400, and two or more second heat transfer sections 400 located on the Z-direction side of the first second heat transfer section 400.

(D-3) In addition to the configuration of (D-1), when the third second heat transfer section 400 has a first section 410 and a second section 420, and the first section 410 of the third second heat transfer section 400 is located on the Z-direction side with respect to the heat source 100 and has at least one second gap 401, the second heat transfer suppression of (C-1) is performed, and the first section 410 of the third second heat transfer section 400 is located on the Z-direction side with respect to the third second heat transfer section 400. Heat transfer to the portion of the second heat transfer section 400 that contacts the first portion 410 of the third second heat transfer section 400 is suppressed compared to heat transfer from the second portion 420 of the third second heat transfer section 400 to the portion of the second heat transfer section 400 that contacts the second portion 420 of the third second heat transfer section 400 located on the Z-direction side of the third second heat transfer section 400 (hereinafter, this suppression of heat transfer is also referred to as the sixth suppression of heat transfer). In this case, the heat of the heat source 100 is locally difficult to be transferred to the portion of the contact section 200 that is located on the Z-direction side of the first portion 310 of the first heat transfer section 300 and the first portion 410 of the third second heat transfer section 400 through the first portion 310 of the first heat transfer section 300, the first portion 410 of the third second heat transfer section 400, and two or more second heat transfer sections 400 other than the third second heat transfer section 400.

(D-4) In addition to the configuration of (D-1), when the second second heat transfer section 400 has a first section 410 and a second section 420, and the first section 410 of the second second heat transfer section 400 is located on the Z-direction side with respect to the heat source 100 and has at least one second gap 401, the second heat transfer suppression of (C-1) is performed, and the fourth heat transfer suppression of (C-3) is performed. In this case, the heat of the heat source 100 is locally difficult to be transferred to a portion of the contact section 200 that is located on the Z-direction side with respect to the first section 310 of the first heat transfer section 300 and in contact with the first section 410 of the second second heat transfer section 400 through the first section 310 of the first heat transfer section 300, two or more second heat transfer sections 400 other than the second second heat transfer section 400, and the first section 410 of the second second heat transfer section 400.

(D-5) In addition to the configuration of (D-1), when the configurations of (D-2) and (D-3) are provided, the second heat transfer suppression of (C-1) is performed, the fifth heat transfer suppression of (D-2) is performed, and the sixth heat transfer suppression of (D-3) is performed. In this case, the heat of the heat source 100 is locally difficult to be transferred to the portion of the contact portion 200 located on the Z-direction side with respect to the first portion 310 of the first heat transfer portion 300, the first portion 410 of the first second heat transfer portion 400, the first portion 410 of the third second heat transfer portion 400, and one or more second heat transfer portions 400 excluding the first second heat transfer portion 400 and the third second heat transfer portion 400.

(D-6) In addition to the configuration of (D-1), when the configurations of (D-2) and (D-4) are provided, the second heat transfer suppression of (C-1) is performed, the fifth heat transfer suppression of (D-2) is performed, and the fourth heat transfer suppression of (C-3) is performed. In this case, the heat of the heat source 100 is locally difficult to be transferred to a portion of the contact portion 200 located on the Z-direction side of the first portion 310 of the first heat transfer portion 300 and the first portion 410 of the first second heat transfer portion 400 and in contact with the first portion 410 of the second second heat transfer portion 400 through the first portion 310 of the first heat transfer portion 300, the first portion 410 of the first second heat transfer portion 400, one or more second heat transfer portions 400 other than the first second heat transfer portion 400 and the second second heat transfer portion 400, and the first portion 410 of the second second heat transfer portion 400.

(D-7) In addition to the configuration of (D-1), when the configurations of (D-3) and (D-4) are provided, the second heat transfer suppression of (C-1) is performed, the sixth heat transfer suppression of (D-3) is performed, and the fourth heat transfer suppression of (C-3) is performed. In this case, the heat of the heat source 100 is locally difficult to be transferred to a portion of the contact portion 200 located on the Z-direction side of the first portion 310 of the first heat transfer portion 300 and the first portion 410 of the third second heat transfer portion 400 and in contact with the first portion 410 of the second second heat transfer portion 400 through the first portion 310 of the first heat transfer portion 300, the first portion 410 of the third second heat transfer portion 400, one or more second heat transfer portions 400 excluding the third second heat transfer portion 400 and the second second heat transfer portion 400, and the first portion 410 of the second second heat transfer portion 400.

(D-8) When the configurations (D-2) to (D-4) are provided in addition to the configuration (D-1), the second heat transfer is suppressed as in (C-1), the fifth heat transfer is suppressed as in (D-2), the sixth heat transfer is suppressed as in (D-3), and the fourth heat transfer is suppressed as in (C-3). In this case, the heat of the heat source 100 is difficult to be locally transferred through at least the first part 310 of the first heat transfer part 300, the first part 410 of the first second heat transfer part 400, the first part 410 of the third second heat transfer part 400, and the first part 410 of the second second heat transfer part 400 to a part of the contact part 200 located on the Z-direction side of the first part 310 of the first heat transfer part 300, the first part 410 of the first second heat transfer part 400, and the first part 410 of the third second heat transfer part 400, and in contact with the first part 410 of the second second heat transfer part 400.

When the first heat transfer section 300 also serves as the first terminal, the number of parts of the heat transfer device D1 is reduced compared to when the first heat transfer section 300 is provided separately from the first terminal.

When the heat source 100 is configured as a PTC heater, the temperature of the heat source 100 when energized is automatically maintained near the Curie temperature or the specific temperature.

Hereinafter, heat transfer device D2 according to several embodiments of the present invention, including embodiment 2 and its design variations, will be described with reference to Figs. 8 to 9. Figs. 8 to 9 show the Z-Z' direction, similar to heat transfer device D1.

Heat transfer device D2 has the same configuration as heat transfer device D1, except that heat transfer device D2 differs from heat transfer device D1 in that the first heat transfer section 300 of heat transfer device D2 does not have a first section 310 and a second section 320, but has at least one second heat transfer section 400. Below, only this difference will be described in detail, and any explanation of heat transfer device D2 that overlaps with the explanation of heat transfer device D1 will be omitted.

The first heat transfer section 300 of the heat transfer device D2 is, for example, a flat plate extending in a direction perpendicular to the Z-Z' direction. If a first terminal (not shown) of the heat transfer device D2 is provided, the first terminal is separate from the first heat transfer section 300.

When there is at least one second heat transfer section 400 in the heat transfer device D2, the one second heat transfer section 400 in the heat transfer device D2 has the same configuration as the configuration in (3) above, except for the following points.

The first part 410 of one of the second heat transfer parts 400 of the heat transfer device D2 is in direct contact with the first heat transfer part 300 and the contact part 200. The first part 410 of one of the second heat transfer parts 400 is located on the Z direction side with respect to the heat source 100.

When at least one second heat transfer section 400 of the heat transfer device D2 is multiple and includes a first second heat transfer section 400 and a second second heat transfer section 400, the first second heat transfer section 400 has at least one of the following configurations: a configuration having a first section 410 and a second section 420 having substantially the same configuration as the configuration in (6) above, except for the following points (see FIG. 9); and a configuration having a first section 410 and a second section 420 having substantially the same configuration as the configuration in (9) above, except for the following points (see FIG. 8).

The first part 410 of the first second heat transfer part 400 is in direct contact with the first heat transfer part 300 and the second heat transfer part 400 located on the Z-direction side of the first second heat transfer part 400 among the multiple second heat transfer parts 400. The first part 410 of the first second heat transfer part 400 is located on the Z-direction side of the heat source 100. Note that if the first second heat transfer part 400 does not have the first part 410 and the second part 420, the first second heat transfer part 400 can have the above configuration (4) (see FIG. 8) or the above configuration (5).

The first portion 410 of the second second heat transfer portion 400 is in direct contact with the second heat transfer portion 400 located on the Z'-direction side of the second second heat transfer portion 400 among the plurality of second heat transfer portions 400 and the contact portion 200. The first portion 410 of the first second heat transfer portion 400 is located on the Z-direction side of the heat source 100. Note that if the second second heat transfer portion 400 does not have the first portion 410 and the second portion 420, the first second heat transfer portion 400 can have the above-mentioned configuration (7) (see FIG. 9) or the above-mentioned configuration (8).

When the multiple second heat transfer sections 400 of the heat transfer device D2 include a third second heat transfer section 400, the heat transfer device D2 has at least one of the following configurations: a configuration in which the first second heat transfer section 400 has the first part 410 and the second part 420 of the first second heat transfer section 400 described above, a configuration in which the second second heat transfer section 400 has the first part 410 and the second part 420 of the second second heat transfer section 400 described above, and a configuration in which the third second heat transfer section 400 has the first part 410 and the second part 420 of substantially the same configuration as the configuration (12) above, except for the following points.

The first part 410 of the third second heat transfer part 400 is located on the Z-direction side relative to the heat source 100. If the third second heat transfer part 400 does not have the first part 410 and the second part 420, the third second heat transfer part 400 can have the configuration (10) or (11) described above.

The heat transfer device D2 described above provides the following technical features and effects.

(B') When one second heat transfer section 400 is provided, the heat (heating or cooling heat) of the heat source 100 received by the first heat transfer section 300 is transferred to the contact section 200 via the first heat transfer section 300 and one second heat transfer section 400. Since the first section 410 of one second heat transfer section 400 is located on the Z-direction side with respect to the heat source 100 and has at least one second gap 401, the heat transfer from the first section 410 of one second heat transfer section 400 to the portion of the contact section 200 that contacts the first section 410 is suppressed compared to the heat transfer from the second section 420 of one second heat transfer section 400 to the portion of the contact section 200 that contacts the second section 420. In this case, the heat of the heat source 100 is less likely to be locally transferred to the portion of the contact portion 200 that contacts the first portion 410 via the first heat transfer portion 300 and the first portion 410 of one of the second heat transfer portions 400.

(C') When two second heat transfer units 400 (a first second heat transfer unit 400 and a second second heat transfer unit 400) are provided, the heat (heating or cooling heat) of the heat source 100 received by the first heat transfer unit 300 is transferred to the contact unit 200 via the first heat transfer unit 300, the first second heat transfer unit 400 and the second second heat transfer unit 400. Specifically, it is as shown in (C-2'), (C-3') or (C-4').

(C-2') When the first second heat transfer section 400 has a first section 410 and a second section 420, and the first section 410 of the first second heat transfer section 400 is located on the Z-direction side relative to the heat source 100 and has at least one second gap 401, heat transfer from the first section 410 of the first second heat transfer section 400 to a section of the second second heat transfer section 400 that contacts the first section 410 of the first second heat transfer section 400 is suppressed compared to heat transfer from the second section 420 of the first second heat transfer section 400 to a section of the second second heat transfer section 400 that contacts the second section 420 of the first second heat transfer section 400 (hereinafter, this suppression of heat transfer is also referred to as the third suppression of heat transfer). In this case, the heat of the heat source 100 is less likely to be locally transferred to a portion of the contact portion 200 located on the Z-direction side of the first portion 410 of the first second heat transfer portion 400 via the first heat transfer portion 300, the first portion 410 of the first second heat transfer portion 400, and the second second heat transfer portion 400.

(C-3') When the second second heat transfer section 400 has a first part 410 and a second part 420, and the first part 410 of the second second heat transfer section 400 is located on the Z-direction side relative to the heat source 100 and has at least one second gap 401, heat transfer from the first part 410 of the second second heat transfer section 400 to a portion of the contact section 200 that contacts the first part 410 is suppressed compared to heat transfer from the second part 420 of the second second heat transfer section 400 to a portion of the contact section 200 that contacts the second part 420 (hereinafter, this suppression of heat transfer is also referred to as the fourth suppression of heat transfer). In this case, the heat of the heat source 100 is less likely to be locally transferred to the portion of the contact portion 200 that contacts the first portion 410 of the second heat transfer portion 400 via the first heat transfer portion 300, the first second heat transfer portion 400, and the first portion 410 of the second second heat transfer portion 400.

When the configurations (C-4'), (C-2'), and (C-3') are provided, the third heat transfer suppression of (C-2') is performed, and the fourth heat transfer suppression of (C-4') is performed. In this case, the heat of the heat source 100 is locally difficult to be transferred through the first heat transfer section 300, the first part 410 of the first second heat transfer section 400, and the first part 410 of the second second heat transfer section 400 to a portion of the contact section 200 located on the Z-direction side of the first part 410 of the first second heat transfer section 400 and in contact with the first part 410 of the second second heat transfer section 400.

(D') When three or more second heat transfer sections 400 (including the first second heat transfer section 400, the second second heat transfer section 400, and the third second heat transfer section 400) are provided, the heat (heating or cooling heat) of the heat source 100 received by the first heat transfer section 300 is transferred to the contact section 200 via the first heat transfer section 300 and the three or more second heat transfer sections 400. Specifically, this is as shown in (D-2'), (D-3'), (D-4'), (D-5'), (D-6'), (D-7'), or (D-8').

(D-2') When the first second heat transfer section 400 has a first section 410 and a second section 420, and the first section 410 of the first second heat transfer section 400 is located on the Z-direction side relative to the heat source 100 and has at least one second gap 401, heat transfer from the first section 410 of the first second heat transfer section 400 to a portion of the second heat transfer section 400 located on the Z-direction side relative to the first second heat transfer section 400 that contacts the first section 410 of the first second heat transfer section 400 is suppressed compared to heat transfer from the second section 420 of the first second heat transfer section 400 to a portion of the second heat transfer section 400 located on the Z-direction side relative to the first second heat transfer section 400 that contacts the second section 420 of the first second heat transfer section 400 (hereinafter, this suppression of heat transfer is also referred to as the fifth suppression of heat transfer). In this case, the heat of the heat source 100 is less likely to be locally transferred to a portion of the contact portion 200 located on the Z-direction side of the first portion 410 of the first second heat transfer portion 400 via the first heat transfer portion 300, the first portion 410 of the first second heat transfer portion 400, and two or more second heat transfer portions 400 located on the Z-direction side of the first second heat transfer portion 400.

(D-3') When the third second heat transfer section 400 has a first section 410 and a second section 420, and the first section 410 of the third second heat transfer section 400 is located on the Z-direction side relative to the heat source 100 and has at least one second gap 401, heat transfer from the first section 410 of the third second heat transfer section 400 to a portion of the second heat transfer section 400 located on the Z-direction side relative to the third second heat transfer section 400 that contacts the first section 410 of the third second heat transfer section 400 is suppressed compared to heat transfer from the second section 420 of the third second heat transfer section 400 to a portion of the second heat transfer section 400 located on the Z-direction side relative to the third second heat transfer section 400 that contacts the second section 420 of the third second heat transfer section 400 (hereinafter, this suppression of heat transfer is also referred to as the sixth suppression of heat transfer). In this case, the heat of the heat source 100 is less likely to be locally transferred to a portion of the contact portion 200 located on the Z-direction side of the first portion 410 of the third second heat transfer portion 400 via the first heat transfer portion 300, the first portion 410 of the third second heat transfer portion 400, and two or more second heat transfer portions 400 excluding the third second heat transfer portion 400.

(D-4') When the second second heat transfer section 400 has a first section 410 and a second section 420, and the first section 410 of the second second heat transfer section 400 is located on the Z-direction side relative to the heat source 100 and has at least one second gap 401, the fourth heat transfer suppression of (C-3') is performed. In this case, the heat of the heat source 100 is locally difficult to be transferred to the portion of the contact section 200 that contacts the first section 410 of the second second heat transfer section 400 via the first heat transfer section 300, two or more second heat transfer sections 400 excluding the second second heat transfer section 400, and the first section 410 of the second second heat transfer section 400.

When the configurations (D-5'), (D-2'), and (D-3') are provided, the fifth heat transfer suppression of (D-2') is performed, and the sixth heat transfer suppression of (D-3') is performed. In this case, the heat of the heat source 100 is locally difficult to be transferred to a portion of the contact portion 200 located on the Z-direction side of the first portion 410 of the first second heat transfer portion 400 and the first portion 410 of the third second heat transfer portion 400 through the first heat transfer portion 300, the first portion 410 of the first second heat transfer portion 400, the first portion 410 of the third second heat transfer portion 400, and one or more second heat transfer portions 400 excluding the first second heat transfer portion 400 and the third second heat transfer portion 400.

When the configurations (D-6'), (D-2'), and (D-4') are provided, the fifth heat transfer suppression of (D-2') is performed, and the fourth heat transfer suppression of (C-3') is performed. In this case, the heat of the heat source 100 is locally difficult to be transferred to a portion of the contact portion 200 located on the Z-direction side of the first portion 410 of the first second heat transfer portion 400 and in contact with the first portion 410 of the second second heat transfer portion 400 via the first heat transfer portion 300, the first portion 410 of the first second heat transfer portion 400, one or more second heat transfer portions 400 excluding the first second heat transfer portion 400 and the second second heat transfer portion 400, and the first portion 410 of the second second heat transfer portion 400.

When the configurations (D-7'), (D-3'), and (D-4') are provided, the sixth heat transfer suppression of (D-3') is performed, and the fourth heat transfer suppression of (C-3') is performed. In this case, the heat of the heat source 100 is locally difficult to be transferred to a portion of the contact portion 200 located on the Z-direction side of the first portion 410 of the third second heat transfer portion 400 and in contact with the first portion 410 of the second second heat transfer portion 400 via the first heat transfer portion 300, the first portion 410 of the third second heat transfer portion 400, one or more second heat transfer portions 400 excluding the third second heat transfer portion 400 and the second second heat transfer portion 400, and the first portion 410 of the second second heat transfer portion 400.

When the configurations (D-8'), (D-2') to (D-4') are provided, the fifth heat transfer suppression of (D-2') is performed, the sixth heat transfer suppression of (D-3') is performed, and the fourth heat transfer suppression of (C-3') is performed. In this case, the heat of the heat source 100 is locally difficult to be transferred through at least the first heat transfer section 300, the first part 410 of the first second heat transfer section 400, the first part 410 of the third second heat transfer section 400, and the first part 410 of the second second heat transfer section 400 to a portion of the contact section 200 located on the Z-direction side of the first part 410 of the first second heat transfer section 400 and the first part 410 of the third second heat transfer section 400 and contacting the first part 410 of the second second heat transfer section 400.

When the heat source 100 is configured as a PTC heater, the temperature of the heat source 100 when energized is automatically maintained near the Curie temperature or the specific temperature.

The heat transfer device described above is not limited to the above embodiment, and can be modified in any way within the scope of the claims. This is described in detail below.

The heat transfer device of any of the above aspects is not limited to a beverage holder or food storage container with a heat retention or cooling function, and may be configured to transfer heat from a heat source to the contact part in any of the above ways. For example, if the heat transfer device of any of the above aspects is a heat retention device for preventing freezing and the heat transfer target is a running water pipe such as a water pipe, the contact part 200 may be configured as at least a part of a valve connected to the running water pipe or a cylindrical or arc-shaped cover that covers the running water pipe.

The first direction of the present invention can be set arbitrarily as long as it is the arrangement direction of the heat source, first heat transfer portion, and contact portion of the present invention.

D1, D2: Heat transfer device 100: Heat source 200: Contact portion 300: First heat transfer portion 310: First portion 301: First gap 320: Second portion 400: Second heat transfer portion (first second heat transfer portion, second second heat transfer portion, third second heat transfer portion)
410: First section 401: Second gap 420: Second section 430: Third section 500: Second terminal 510: Contact section 600: First board 700: First and second cables 800: Second board 800a: Third board 800b: Fourth board 900: Operation section 910: Operation section main body 920: Cover C: Connector

Claims (17)

A heat source;
a contact portion having thermal conductivity and capable of coming into contact with a heat transfer target;
A first heat transfer portion disposed between the heat source and the contact portion ;
and a second heat transfer portion having thermal conductivity ,
The first heat transfer portion has a first portion and a second portion having thermal conductivity,
the first portion is in direct contact with the heat source and indirectly in contact with the contact portion and has at least one first gap provided inside the first portion, the at least one first gap being open to the contact portion;
the second portion is not in direct contact with the heat source but in indirect contact with the contact portion ;
The second heat transfer part is arranged between the first heat transfer part and the contact part, directly contacts the first part and the second part of the first heat transfer part, directly contacts the contact part, and blocks at least one first gap of the first part of the first heat transfer part from the contact part side . A heat source;
a contact portion having thermal conductivity and capable of coming into contact with a heat transfer target;
A first heat transfer portion disposed between the heat source and the contact portion;
and a second heat transfer portion having thermal conductivity,
The first heat transfer portion has a first portion and a second portion having thermal conductivity,
the first portion has a generally U-shaped cross section in a first direction, is in direct contact with the heat source and indirect contact with the contact portion, and has at least one first gap provided inside the first portion, the at least one first gap is one, and the first direction is an arrangement direction of the heat source, the first heat transfer portion, and the contact portion,
the second portion is not in direct contact with the heat source but in indirect contact with the contact portion;
The second heat transfer part is arranged between the first heat transfer part and the contact part, directly contacts the first part and the second part of the first heat transfer part, directly contacts the contact part, and blocks at least one first gap of the first part of the first heat transfer part from the contact part side . A heat source;
a contact portion having thermal conductivity and capable of coming into contact with a heat transfer target;
A first heat transfer portion disposed between the heat source and the contact portion;
and a second heat transfer portion having thermal conductivity,
The first heat transfer portion has a first portion and a second portion having thermal conductivity,
the first portion is in direct contact with the heat source, is in direct or indirect contact with the contact portion, and has at least one first gap provided inside the first portion;
the second portion is not in direct contact with the heat source, but is in direct or indirect contact with the contact portion;
the second heat transfer portion is disposed between the first heat transfer portion and the contact portion,
The second heat transfer portion has a first portion and a second portion having thermal conductivity,
the first portion of the second heat transfer portion is in direct contact with the first heat transfer portion and the contact portion and has at least one second gap disposed within the first portion of the second heat transfer portion;
A heat transfer device , wherein the second portion of the second heat transfer portion is not in direct contact with the first heat transfer portion but is in direct contact with the contact portion . A heat source;
a contact portion having thermal conductivity and capable of coming into contact with a heat transfer target;
A first heat transfer portion disposed between the heat source and the contact portion;
and a plurality of second heat transfer portions having thermal conductivity,
The first heat transfer portion has a first portion and a second portion having thermal conductivity,
the first portion is in direct contact with the heat source, is in direct or indirect contact with the contact portion, and has at least one first gap provided inside the first portion;
the second portion is not in direct contact with the heat source, but is in direct or indirect contact with the contact portion;
the second heat transfer units are stacked in a first direction, the first direction being an arrangement direction of the heat source, the first heat transfer units, and the contact unit;
A heat transfer device, wherein the plurality of second heat transfer portions include a first second heat transfer portion in direct contact with the first heat transfer portion and a second second heat transfer portion in direct contact with the contact portion . 5. The heat transfer device according to claim 3 ,
A heat transfer device , wherein the at least one first gap of the first portion of the first heat transfer section is open to the contact portion side . 5. The heat transfer device according to claim 3 ,
The at least one first gap of the first portion of the first heat transfer portion is one,
The first portion of the first heat transfer portion has a generally U-shaped cross section in a first direction,
A heat transfer device , wherein the first direction is an arrangement direction of the heat source, the first heat transfer portion, and the contact portion . 5. The heat transfer device according to claim 3 ,
A heat transfer device , wherein the at least one first gap of the first portion of the first heat transfer unit is an enclosed space . 3. The heat transfer device according to claim 1 ,
The second heat transfer portion has a first portion and a second portion having thermal conductivity,
the first portion of the second heat transfer portion is in direct contact with the first heat transfer portion and the contact portion and has at least one second gap disposed within the first portion of the second heat transfer portion;
A heat transfer device , wherein the second portion of the second heat transfer portion is not in direct contact with the first heat transfer portion but is in direct contact with the contact portion . A heat source;
a contact portion having thermal conductivity and capable of coming into contact with a heat transfer target;
A first heat transfer portion disposed between the heat source and the contact portion;
and a plurality of second heat transfer portions having thermal conductivity,
The first heat transfer portion has a first portion and a second portion having thermal conductivity,
the first portion is in direct contact with the heat source, is in direct or indirect contact with the contact portion, and has at least one first gap provided inside the first portion, the at least one first gap being open to the contact portion;
the second portion is not in direct contact with the heat source, but is in direct or indirect contact with the contact portion;
the second heat transfer units are stacked in a first direction, the first direction being an arrangement direction of the heat source, the first heat transfer units, and the contact unit;
The heat transfer device includes a first second heat transfer part that directly contacts the first heat transfer part and blocks at least one first gap of the first part of the first heat transfer part from the contact part side, and a second second heat transfer part that directly contacts the contact part. A heat source;
a contact portion having thermal conductivity and capable of coming into contact with a heat transfer target;
A first heat transfer portion disposed between the heat source and the contact portion;
and a plurality of second heat transfer portions having thermal conductivity,
The first heat transfer portion has a first portion and a second portion having thermal conductivity,
the first portion has a generally U-shaped cross section in a first direction, is in direct contact with the heat source, is in direct or indirect contact with the contact portion, and has at least one first gap provided inside the first portion, the at least one first gap is one, and the first direction is an arrangement direction of the heat source, the first heat transfer portion, and the contact portion,
the second portion is not in direct contact with the heat source, but is in direct or indirect contact with the contact portion;
The plurality of second heat transfer parts are stacked in the first direction,
The heat transfer device includes a first second heat transfer part that directly contacts the first heat transfer part and blocks at least one first gap of the first part of the first heat transfer part from the contact part side, and a second second heat transfer part that directly contacts the contact part . 11. The heat transfer device according to claim 4, 9 or 10 ,
The first second heat transfer portion has a first portion and a second portion having thermal conductivity,
the first portion of the first second heat transfer portion is in direct contact with the first heat transfer portion, is in direct contact with a second heat transfer portion of the plurality of second heat transfer portions that is located on the contact portion side with respect to the first second heat transfer portion, and has at least one second gap provided inside the first portion of the first second heat transfer portion;
A heat transfer device in which the second portion of the first second heat transfer portion is not in direct contact with the first heat transfer portion, but is in direct contact with the second heat transfer portion among the plurality of second heat transfer portions that is located on the contact portion side relative to the first second heat transfer portion . 11. The heat transfer device according to claim 4, 9 or 10 ,
The second heat transfer portion has a first portion and a second portion having thermal conductivity,
the first portion of the second second heat transfer portion is in direct contact with a second heat transfer portion of the plurality of second heat transfer portions that is located on the heat source side with respect to the second second heat transfer portion, and has at least one second gap that is in direct contact with the contact portion and is provided inside the first portion of the second second heat transfer portion;
A heat transfer device in which the second part of the second heat transfer section is not in direct contact with the second heat transfer section located on the heat source side of the second heat transfer section, but is in direct contact with the contact section . 11. The heat transfer device according to claim 4, 9 or 10 ,
the plurality of second heat transfer portions further includes a third second heat transfer portion located between the first second heat transfer portion and the second second heat transfer portion,
The third second heat transfer portion has a first portion and a second portion having thermal conductivity,
the first portion of the third second heat transfer portion is in direct contact with a second heat transfer portion of the plurality of second heat transfer portions that is located on the heat source side with respect to the third second heat transfer portion, and has at least one second gap that is in direct contact with a second heat transfer portion of the plurality of second heat transfer portions that is located on the contact portion side with respect to the third second heat transfer portion and is provided inside the first portion of the third second heat transfer portion;
A heat transfer device in which the second part of the third second heat transfer part is not in direct contact with the second heat transfer part located on the heat source side of the third second heat transfer part, but is in direct contact with the second heat transfer part located on the contact part side of the third second heat transfer part . A heat source;
a contact portion having thermal conductivity and capable of coming into contact with a heat transfer target;
a first heat transfer portion having thermal conductivity, the first heat transfer portion being disposed between the heat source and the contact portion and in direct contact with the heat source;
and a plurality of second heat transfer portions having thermal conductivity,
the second heat transfer units are stacked in a first direction, the first direction being an arrangement direction of the heat source, the first heat transfer units, and the contact unit;
the plurality of second heat transfer portions include a first second heat transfer portion in direct contact with the first heat transfer portion and a second second heat transfer portion in direct contact with the contact portion;
the first second heat transfer portion and/or the second second heat transfer portion have a first portion and a second portion having thermal conductivity,
the first portion of the first second heat transfer portion is in direct contact with the first heat transfer portion, is in direct contact with a second heat transfer portion of the plurality of second heat transfer portions that is located on the contact portion side with respect to the first second heat transfer portion, and has at least one second gap provided inside the first portion of the first second heat transfer portion;
the second portion of the first second heat transfer portion is not in direct contact with the first heat transfer portion, but is in direct contact with the second heat transfer portion of the plurality of second heat transfer portions that is located on the contact portion side with respect to the first second heat transfer portion,
the first portion of the second second heat transfer portion is in direct contact with a second heat transfer portion of the plurality of second heat transfer portions that is located on the heat source side with respect to the second second heat transfer portion, and has at least one second gap that is in direct contact with the contact portion and is provided inside the first portion of the second second heat transfer portion;
A heat transfer device in which the second part of the second heat transfer section is not in direct contact with the second heat transfer section located on the heat source side of the second heat transfer section, but is in direct contact with the contact section. A heat source;
a contact portion having thermal conductivity and capable of coming into contact with a heat transfer target;
a first heat transfer portion having thermal conductivity, the first heat transfer portion being disposed between the heat source and the contact portion and in direct contact with the heat source;
and a plurality of second heat transfer portions having thermal conductivity,
the second heat transfer units are stacked in a first direction, the first direction being an arrangement direction of the heat source, the first heat transfer units, and the contact unit;
the plurality of second heat transfer portions include a first second heat transfer portion in direct contact with the first heat transfer portion, a second second heat transfer portion in direct contact with the contact portion, and a third second heat transfer portion located between the first second heat transfer portion and the second second heat transfer portion;
At least one of the first second heat transfer portion, the second second heat transfer portion, and the third second heat transfer portion has a first portion and a second portion having thermal conductivity,
the first portion of the first second heat transfer portion is in direct contact with the first heat transfer portion, is in direct contact with a second heat transfer portion of the plurality of second heat transfer portions that is located on the contact portion side with respect to the first second heat transfer portion, and has at least one second gap provided inside the first portion of the first second heat transfer portion;
the second portion of the first second heat transfer portion is not in direct contact with the first heat transfer portion, but is in direct contact with the second heat transfer portion of the plurality of second heat transfer portions that is located on the contact portion side with respect to the first second heat transfer portion,
the first portion of the second second heat transfer portion is in direct contact with a second heat transfer portion of the plurality of second heat transfer portions that is located on the heat source side with respect to the second second heat transfer portion, and has at least one second gap that is in direct contact with the contact portion and is provided inside the first portion of the second second heat transfer portion;
the second portion of the second heat transfer portion is not in direct contact with the second heat transfer portion located on the heat source side with respect to the second heat transfer portion, and is in direct contact with the contact portion,
the first portion of the third second heat transfer portion is in direct contact with a second heat transfer portion of the plurality of second heat transfer portions that is located on the heat source side with respect to the third second heat transfer portion, and has at least one second gap that is in direct contact with a second heat transfer portion of the plurality of second heat transfer portions that is located on the contact portion side with respect to the third second heat transfer portion and is provided inside the first portion of the third second heat transfer portion;
A heat transfer device in which the second part of the third second heat transfer part is not in direct contact with the second heat transfer part located on the heat source side of the third second heat transfer part, but is in direct contact with the second heat transfer part located on the contact part side of the third second heat transfer part. The heat transfer device according to any one of claims 1 to 15,
a first terminal and a second terminal electrically connected to the heat source;
The first terminal also serves as the first heat transfer portion. The heat transfer device according to any one of claims 1 to 16,
The heat transfer device, wherein the heat source is a PTC heater.