JP7606902B2 - Workpiece machining device, workpiece machining system, and workpiece machining method - Google Patents

Description

The present invention relates to a workpiece processing device that performs cutting or other processing on a workpiece, and a workpiece processing system and workpiece processing method that use the same.

In workpiece processing equipment such as machining centers, chips are generated when a workpiece is processed. If these chips accumulate on or around the workpiece, not only does this reduce the machining accuracy of the workpiece, but it can also lead to breakdowns in the workpiece processing equipment. In addition, because wooden workpieces are processed in an environment without the use of coolant (dry processing), chips are likely to fly around during processing, which can lead to deterioration of the surrounding environment. In light of this situation, mechanisms for collecting chips from the workpiece have been incorporated into workpiece processing equipment.

For example, Patent Document 1 discloses a chip cleaning device (claim 2 of the same document) that can be incorporated into a machine tool, which is equipped with a cleaning robot (claim 1 of the same document) having a nozzle at its tip for sucking up chips. In the chip cleaning device of Patent Document 1, the cleaning robot is controlled based on cleaning operation information stored in a cleaning operation information storage unit. Patent Document 1 describes that the above-mentioned cleaning operation information is based on teaching data obtained using a teaching means and image processing data obtained by image processing (paragraph 0033 of the same document).

Patent Document 2 also discloses a processing machine system (claims 1 and 3 of the same document) that includes a robot equipped with a chip collection hand for collecting chips accumulated on a processing table to which a workpiece is fixed, and a visual sensor for acquiring the amount and area of chips accumulated on the processing table. In the processing machine system of Patent Document 2, the chip collection hand is operated when it is determined that chip collection is necessary based on the acquired amount of chip accumulation.

JP 2001-322049 A JP 2016-168661 A

However, the chip cleaning device in Patent Document 1 requires teaching and image processing to generate cleaning operation information to control the cleaning robot. This means that generating the cleaning operation information takes time, which makes it difficult to increase productivity.

In addition, in the workpiece processing machine system of Patent Document 2, in order to increase the chip collection efficiency, it is necessary to use a highly accurate visual sensor or multiple visual sensors. This has the disadvantage of increasing costs. In addition, in the workpiece processing machine system of Patent Document 2, chips are collected by having the chip collection hand perform a gripping or scooping action (paragraph 0029 of the same document). This has the disadvantage of making it difficult to collect fine chips.

The present invention has been made to solve the above problems, and provides a workpiece processing device that can efficiently collect chips from a workpiece without requiring teaching or the like. Another object of the present invention is to provide a workpiece processing device that can collect chips without using an expensive visual sensor. Furthermore, it is also an object of the present invention to provide a workpiece processing device that can efficiently collect fine chips. In addition, it is also an object of the present invention to provide a workpiece processing system and a workpiece processing method that use this workpiece processing device.

The above issues are:
a workpiece processing unit that processes a workpiece;
a workpiece machining moving means for three-dimensionally moving the workpiece machining unit in accordance with path data for machining the workpiece;
A chip suction unit that sucks up chips generated by machining the workpiece;
a chip suction moving means for three-dimensionally moving the chip suction unit in accordance with path data for chip suction,
The path data for chip suction is obtained by offsetting the path data for workpiece machining by a predetermined distance.
This problem is solved by providing a workpiece machining device characterized in that, when the workpiece is machined, a chip suction section sucks in chips while following the workpiece machining section.

In the workpiece machining device of the present invention, path data for chip suction is obtained by offsetting path data for workpiece machining. This offset process can be performed automatically by a computer without the need for operations such as teaching. In addition, because the chip suction section sucks in chips while following the workpiece machining section, chips can be efficiently collected without using expensive visual sensors, etc. Furthermore, because chips are collected by suction, even small chips can be efficiently collected.

In the workpiece machining device of the present invention, the type of the moving means for suctioning chips is not particularly limited as long as it can move the chip suction section three-dimensionally. Examples of such moving means for suctioning chips include an articulated robot and a gantry loader.

In the workpiece machining device of the present invention, it is also preferable that the moving means for suctioning chips is capable of switching the chip suction section attached thereto to a workpiece gripping section capable of gripping the workpiece, and that the orientation of the workpiece can be changed or the workpiece can be loaded or unloaded by gripping the workpiece with the workpiece gripping section switched from the chip suction section and operating the moving means for suctioning chips. This allows the moving means for suctioning chips to be used as a means for changing the orientation of the workpiece (moving means for changing the orientation of the workpiece).

The above problem can also be solved by providing a workpiece machining system including the above workpiece machining device and a CAM device that generates path data for workpiece machining and path data for chip suction used by the workpiece machining device based on three-dimensional shape data of the workpiece. The above problem can also be solved by providing a workpiece machining method that uses the above workpiece machining device to machine a workpiece.

As described above, the present invention makes it possible to provide a workpiece processing device that can efficiently collect chips from a workpiece without the need for teaching or the like. It also makes it possible to provide a workpiece processing device that can collect chips without using an expensive visual sensor. It also makes it possible to provide a workpiece processing device that can efficiently collect fine chips. In addition, it makes it possible to provide a workpiece processing system and a workpiece processing method that use this workpiece processing device.

FIG. 2 is a front view of the workpiece machining device of the present invention. FIG. 2 is a side view of the workpiece machining apparatus of the present invention. 1A and 1B are diagrams showing a workpiece machining section and a chip suction section during machining of the workpiece, respectively viewed from above and from the side. 1 is a block diagram showing a workpiece machining system using a workpiece machining device of the present invention.

The workpiece processing device of the present invention will be described in more detail with reference to the drawings. The configuration described below is merely a preferred embodiment, and the technical scope of the workpiece processing device of the present invention is not limited to the configuration described below. The workpiece processing device of the present invention can be modified as appropriate within the scope that does not impair the spirit of the invention.

Figure 1 is a front view of the workpiece machining device 10 of the present invention, and Figure 2 is a side view of the workpiece machining device 10 of the present invention. Figures 1 and 2 show orthogonal coordinates consisting of the x-axis, y-axis, and z-axis. The orientation of these orthogonal coordinates is common to Figures 1 and 2 and to Figure 3 shown later. In the following, for convenience of explanation, the positive side in the x-axis direction is sometimes called the "right" side, the negative side in the x-axis direction is sometimes called the "left" side, the positive side in the y-axis direction is sometimes called the "rear" side, the negative side in the y-axis direction is sometimes called the "front" side, the positive side in the z-axis direction is sometimes called the "upper" side, and the negative side in the z-axis direction is sometimes called the "lower" side.

As shown in Figures 1 and 2, the workpiece machining device 10 of the present invention includes a workpiece machining section 11 for machining a workpiece W, a workpiece machining movement means 12 for moving the workpiece machining section 11 three-dimensionally (x-axis, y-axis, and z-axis directions), a chip suction section 13 for collecting chips generated by machining the workpiece W by suction, and a chip suction movement means 14 for moving the chip suction section 13 three-dimensionally (x-axis, y-axis, and z-axis directions).

The workpiece processing device 10 has a base 15 that is installed on the floor surface, and this base 15 is provided with a workpiece holding means 16 for holding the workpiece W. The structure of the workpiece holding means 16 is not particularly limited as long as it can stably hold the workpiece W when the workpiece W is processed. In this embodiment, as shown in FIG. 2, a clamp device that clamps the workpiece W between lower claws 16a and upper claws 16b is used as the workpiece holding means 16. As shown in FIG. 1, this clamp device (workpiece holding means 16) is provided at multiple locations (three locations in the example shown) spaced apart at a predetermined interval in the left-right direction (x-axis direction).

The type of workpiece W is appropriately determined depending on the type of product to be processed. Examples of workpiece W include wood, metal, and resin materials. As described below, the workpiece processing device 10 of the present invention is characterized by a method for collecting chips generated when processing the workpiece W. When processing (cutting, etc.) wood, a large amount of fine, light chips are generated, which tend to scatter. For this reason, the workpiece processing device 10 of the present invention is suitable for processing wood. In this embodiment, the workpiece W is a plank-shaped piece of wood (wooden board), and the workpiece processing device 10 processes the edge of this board into a predetermined curved shape.

The workpiece processing unit 11 may be any device capable of performing a predetermined processing on the workpiece W. Examples of the workpiece processing unit 11 include cutting tools such as an end mill, a drill, and a rotary saw blade. In this embodiment, an end mill is used as the workpiece processing unit 11. The workpiece processing unit 11 is detachably attached to the operating end of the workpiece processing moving means 12. Therefore, it is possible to switch the type of workpiece processing unit 11 depending on the type of workpiece W, the processing mode, etc.

The workpiece machining movement means 12 may be any means capable of moving the workpiece machining unit 11 in the x-axis, y-axis, and z-axis directions relative to the workpiece W. In this embodiment, the workpiece machining movement means 12 is a gate-type machining center.

Specifically, as shown in FIG. 2, the workpiece machining moving means 12 is composed of a running platform 12a for the workpiece W, a slider 12b provided on the beam portion of the gate-shaped structural material, a vertical movement mechanism 12c attached to the slider 12b, and a rotating mechanism 12d attached to the vertical movement mechanism 12c. The running platform 12a moves the workpiece W in the left-right direction (x-axis direction), the slider 12b can move in the front-back direction (y-axis direction) relative to the beam portion of the running platform 12a, and the vertical movement mechanism 12c can expand and contract in the up-down direction (z-axis direction). The rotating mechanism 12d can rotate around the vertical axis _L1 and horizontal axis _L2 shown in FIG. 1. Therefore, not only can the workpiece machining unit 11 be moved in the x-axis direction, y-axis direction, and z-axis direction relative to the workpiece W, but also the orientation of the workpiece machining unit 11 can be controlled.

The chip suction unit 13 is usually a nozzle. This nozzle (chip suction unit 13) is connected to a suction pump (not shown) and a collection tank (not shown) via a duct (not shown) made of a flexible tube (such as a corrugated tube). The chips sucked into the nozzle (chip suction unit 13) are transferred to the collection tank through the duct. In this embodiment, the chip suction unit 13 is detachably attached to the operating end of the chip suction moving means 14. Therefore, the type of chip suction unit 13 can be switched depending on the processing state of the workpiece W, etc.

The chip suction moving means 14 may be any means capable of moving the chip suction section 13 in the x-axis, y-axis, and z-axis directions. A gantry loader may be used as the chip suction moving means 14. However, if the chip suction moving means 14 is a gantry loader, it becomes difficult to avoid interference between the workpiece machining moving means 12 and the chip suction moving means 14. For this reason, in this embodiment, the chip suction moving means 14 is a multi-joint robot. A multi-joint robot is more maneuverable than a gantry loader, and therefore the chip suction section 13 can be moved to an appropriate location while avoiding interference with the workpiece machining moving means 12.

Although 4-7 axes are known as articulated robots, 6 axes or more are suitable for the chip suction moving means 14. An example of a 6-axis articulated robot is one that, when likened to a human body, rotates around the "S axis" corresponding to the rotation of the waist, rotates around the "L axis" corresponding to the movement of the upper body back and forth, rotates around the "U axis" corresponding to the movement of the arms up and down, rotates around the "R axis" corresponding to the rotation of the arms, rotates around the "B axis" corresponding to the movement of the arm tips up and down, and rotates around the "T axis" corresponding to the rotation of the arm tips. An example of a 7-axis articulated robot is one that, in addition to the above 6 axes (S axis, L axis, U axis, R axis, B axis, and T axis), also rotates around the "E axis" corresponding to the movement of twisting the arms. Increasing the number of axes of the articulated robot allows the articulated robot to operate with a higher degree of freedom.

By controlling this chip suction moving means 14, as shown in Figure 3, when the workpiece W is being machined, the chip suction section 13 sucks in chips C while following the workpiece processing section 11. Figure 3 shows the workpiece processing section 11 and the chip suction section 13 when the workpiece is being machined, with Figure 3(a) showing the workpiece processing section 11 and the chip suction section 13 as viewed from above (positive side in the z-axis direction), and Figure 3(b) showing the workpiece processing section 11 and the chip suction section 13 as viewed from the side (positive side in the y-axis direction).

As shown in Fig. 3, the chip suction unit 13 is positioned at a predetermined distance behind the workpiece machining unit 12 in the direction of travel. In other words, the chip suction unit 13 is controlled to be positioned at a point P _B (x-δx, y-δy, z-δz) offset by a predetermined distance (distance δx in the x-axis direction, distance δy in the y-axis direction, distance δz in the z-axis direction) from a point P _A (coordinates of which are (x, y, z)) at which the workpiece machining unit 12 is located. The suction port of the chip suction unit 13 is always directed toward the workpiece machining unit 12. This allows the chips C of the workpiece W generated by machining by the workpiece machining unit 12 to be sucked in by the chip suction unit 13 as they are, preventing the chips C from accumulating around the workpiece W.

In this way, in the workpiece machining device 10 of the present invention, the chip suction section 13 sucks up the chips C while following the workpiece machining section 11, and this following operation is realized by performing the following control. That is, in the workpiece machining device 10 of the present invention, as shown in Fig. 4, the workpiece machining moving means 12 is controlled based on the path data _D1 for workpiece machining, and the chip suction moving means 14 is controlled based on the path data _D2 for chip suction, and the path data _D2 for chip suction is obtained by offsetting the path data _D1 for workpiece machining by a predetermined distance. Fig. 4 is a block diagram showing a workpiece machining system using the workpiece machining device 10 of the present invention.

The method of generating the path data _D1 for machining the workpiece and the path data _D2 for chip suction is not particularly limited. In this embodiment, as shown in FIG. 4, a CAM device 20 is provided in front of the workpiece machining device 10, and the CAM device 20 automatically generates the path data _D1 for machining the workpiece and the path data _D2 for chip suction on a computer. This reduces the effort required to generate the path data _D1 for machining the workpiece and the path data _D2 for chip suction. The CAM device 20 includes a workpiece machining path data generating means 21, a workpiece machining program generating means 22, a chip suction path data generating means 23, and a chip suction program generating means 24. These generating means 21, 22, 23, and 24 are usually implemented as programs in the CAM device 20 (computer).

The workpiece machining path data generating means 21 receives the three-dimensional shape data _D0 of the workpiece W, compares the shape of the workpiece W defined by the three-dimensional shape data _D0 with the shape of the workpiece machining section 11, and automatically calculates how the workpiece machining section 11 should be moved relative to the workpiece W (the path of the workpiece machining section 11) in order to machine the workpiece W into the shape defined by the three-dimensional shape data _D0 . For this reason, the workpiece machining path data generating means 21 also stores data relating to the shape of the workpiece machining section 11 and the like in advance.

The above calculation results are output as workpiece machining path data _D1 from the workpiece machining path data generating means 21. When there are multiple patterns of paths that the workpiece machining unit 11 can take, the path that can most efficiently machine the workpiece W (for example, the path that has the shortest travel distance of the workpiece machining unit 11) is automatically selected by the workpiece machining path data generating means 21.

The workpiece machining path data _D1 generated by the workpiece machining path data generating means 21 includes time-series parameters of the position of the workpiece machining unit 11 (three-dimensional coordinates of point P- _A in FIG. 3), as well as parameters such as the rotational speed and orientation of the workpiece machining unit 11. This workpiece machining path data _D1 is expressed as digital data that can be handled by a computer. The workpiece machining path data _D1 is expressed in the form of, for example, G-code or M-code standardized in "JIS 6315-2".

The three-dimensional shape data _D0 of the workpiece W input to the workpiece machining path data generating means 21 is also expressed as digital data so that it can be handled by a computer such as the CAM device _20. In this embodiment, parasolid data output from a three-dimensional CAD is used as the three-dimensional shape data _D0 .

The path data _D1 for workpiece machining output from the workpiece machining path data generating means 21 is input to the workpiece machining program generating means 22. The path data _D1 for workpiece machining is converted into a workpiece machining program _P1 by the workpiece machining program generating means 22. The workpiece machining program P1 output from the workpiece machining program generating means 22 is input to a control unit of the workpiece machining moving means 12 in the workpiece machining device _10. The workpiece machining moving means 12 moves the workpiece machining unit 11 along a predetermined path based on the workpiece machining program _P1 . As a result, the workpiece W is machined into a desired three-dimensional shape.

The path data _D1 for workpiece machining output from the path data generating means 21 is input not only to the workpiece machining program generating means 22 but also to the path data generating means 23 for chip suction. The path data generating means 23 for chip suction offsets the coordinate parameters constituting the received path data _D1 for workpiece machining by a predetermined distance (the above-mentioned distances δx, δy, δz) and outputs this as path data _D2 for chip suction. If the path data _D1 for workpiece machining is simply offset such that the chip suction unit 13 interferes with the workpiece W or the like, the offset distances δx, δy, δz are automatically adjusted so that the interference does not occur. For this reason, the path data generating means 23 for chip suction also stores data on the shape of the chip suction unit 13 and the shape of the workpiece W in advance.

The path data _D2 for chip suction generated by the chip suction path data generating means 23 includes time-series parameters for the position of the chip suction unit 13 (three-dimensional coordinates of point P _B in FIG. 3) as well as parameters such as the orientation of the chip suction unit 13. This path data _D2 for chip suction, like the path data _D1 for workpiece machining described above, is expressed as digital data, for example, in the form of G code or M code standardized in "JIS 6315-2".

The path data _D2 for chip suction output from the chip suction path data generating means 23 is input to the chip suction program generating means 24. The path data _D2 for chip suction is converted into a chip suction program _P2 by the chip suction program generating means 24. The chip suction program _P2 output from the chip suction program generating means 24 is input to a control unit of the chip suction movement means 14 in the workpiece machining device 10. The chip suction movement means 14 moves the chip suction unit 13 along a predetermined path based on the chip suction program _P2 . This makes it possible to suck in chips C of the workpiece W while having the chip suction unit 13 follow the workpiece machining unit 11.

As described above, in the workpiece machining device 10 of the present invention, the chip suction moving means 14 is controlled based on the chip suction path data _D2 obtained by offsetting the workpiece machining path data _D1 . Therefore, there is no need to perform teaching or the like to operate the chip suction moving means 14. Also, there is no need to use an expensive visual sensor or the like to detect the chips C. In addition, the chip suction path data _D1 is automatically generated when the three-dimensional shape data _D0 of the workpiece W is input to the CAM device 20. Therefore, no special effort is required to generate the chip suction path data _D1 . This also makes it possible to increase the productivity of products using the workpiece W.

As already mentioned, in this embodiment, an end mill is used as the workpiece processing unit 11. When using a workpiece processing unit 11 that cuts the workpiece W while rotating, such as an end mill, it is preferable to down-cut the workpiece W. That is, in cutting using a rotary cutting tool (workpiece processing unit 11) such as an end mill, there are "up-cutting" in which the rotation direction of the rotary cutting tool (workpiece processing unit 11) and the direction of travel of the rotary cutting tool (workpiece processing unit 11) relative to the workpiece W are the same, and "down-cutting" in which they are opposite. Of these, it is recommended to use down-cutting.

This is because in up-cutting, chips C from the workpiece W scatter in the forward direction of the rotating cutting tool (workpiece processing section 11), making it difficult for the chip suction section 13, which follows behind the rotating cutting tool (workpiece processing section 11) in the forward direction, to suck up the chips C. In contrast, in down-cutting, as shown in Figure 3, chips C from the workpiece W scatter in the backward direction of the rotating cutting tool (workpiece processing section 11), making it easier for the chip suction section 13, which follows behind the rotating cutting tool (workpiece processing section 11) in the forward direction, to suck up the chips C.

As shown in FIG. 3(a), when processing both side edges of the workpiece W (a pair of side edges along a direction approximately parallel to the x-axis direction) into a curved shape, for example, one side edge is processed first, and then the other side edge is processed. In this case, the workpiece holding means 16 that has been holding the other side edge of the workpiece W is released, the orientation of the workpiece W is reversed (the workpiece W is rotated 180° around an axis parallel to the x-axis in FIG. 3(a)), and the side edge that has already been processed (the one side edge) is held again by the workpiece holding means 16. This makes it possible to process the other side edge of the workpiece W with the workpiece processing unit 11 without significantly changing the position of the workpiece holding means 16, etc.

However, if the operation of reversing the orientation of the workpiece W is performed manually, not only is it time-consuming, but there is also a risk that the workpiece W may not be positioned accurately after being reversed. For this reason, it is preferable to perform the operation of reversing the orientation of the workpiece W mechanically using a robot or the like. However, providing a separate robot such as an articulated robot just for the purpose of reversing the orientation of the workpiece W is disadvantageous in terms of cost and space. For this reason, in this embodiment, the operation of reversing the orientation of the workpiece W associated with switching the machining location of the workpiece W is performed using the chip suction moving means 14.

That is, in this embodiment, as already described, the chip suction unit 13 is detachably attached to the operating end of the moving means for chip suction 14, and by removing the chip suction unit 13 and switching to a workpiece gripping unit (not shown) capable of gripping the workpiece W, the workpiece gripping unit can grip and invert the workpiece W. The moving means for chip suction 14 at this time is controlled independently of the moving means for workpiece machining 12 (it is not controlled based on the path data for chip suction _D2 obtained by offsetting the path data for workpiece machining _D1 ). Examples of the workpiece gripping unit include a chuck device (gripper, etc.) equipped with chuck jaws and a multi-fingered hand device equipped with multiple movable fingers.

After the workpiece W has been turned over, the workpiece W side edge (the side edge that has already been machined (the one side edge)) is held by the workpiece holding means 16, and the workpiece gripping part attached to the operating end of the chip suction moving means 14 is removed and switched to the chip suction part 13. This makes it possible to machine the remaining side edge (the other side edge) of the workpiece W. Switching from the chip suction part 13 to the workpiece gripping part and switching from the workpiece gripping part to the chip suction part 13 can be done manually, but in this embodiment, it is done automatically using a robot hand changer that is attached to or incorporated in the workpiece processing device 10.

In this way, by using the moving means for suctioning chips 14 as a means for changing the orientation of the workpiece W (moving means for changing the orientation of the workpiece W), there is no need to provide a separate mechanism for this purpose in the workpiece processing device 10. This makes it possible to reduce the cost of the workpiece processing device 10. It also makes it easier to ensure sufficient space for moving the moving means for suctioning chips 14. In addition, when the workpiece gripping unit is attached, the moving means for suctioning chips 14 can also be used when loading or unloading the workpiece W into or from the workpiece processing device 10.

REFERENCE SIGNS LIST 10 Workpiece machining device 11 Workpiece machining section 12 Workpiece machining moving means 13 Chip suction section 14 Chip suction moving means 20 CAM device C Chip D ₀ Workpiece three-dimensional shape data D ₁ Workpiece machining path data D ₂ Chip suction path data W Workpiece

Claims (5)

a workpiece processing unit that processes a workpiece;
a workpiece machining movement means for three-dimensionally moving the workpiece machining unit relative to the workpiece and controlling the orientation of the workpiece machining unit in accordance with path data for machining the workpiece;
A chip suction unit that sucks up chips generated by machining the workpiece;
a chip suction moving means for three-dimensionally moving the chip suction unit in accordance with path data for chip suction,
The path data for chip suction includes a parameter for the direction of the chip suction unit, and the path data for workpiece machining is offset a predetermined distance backward in the direction of travel of the workpiece machining unit .
A workpiece machining device characterized in that, when the workpiece is machined, a chip suction section sucks in chips while following a workpiece machining section.
2. The workpiece machining apparatus according to claim 1, wherein the chip suction moving means is an articulated robot or a gantry loader.
The chip suction moving means is capable of switching the chip suction unit attached thereto to a workpiece gripping unit capable of gripping a workpiece,
A workpiece machining device as described in claim 1 or 2, in which the orientation of the workpiece can be changed or the workpiece can be loaded or unloaded by gripping the workpiece with the workpiece gripping section switched from the chip suction section and operating the chip suction moving means.
A workpiece machining device according to any one of claims 1 to 3,
A workpiece machining system including a CAM device that generates path data for workpiece machining and path data for chip suction used by a workpiece machining device based on three-dimensional shape data of the workpiece.
A method for machining a workpiece using the workpiece machining device according to any one of claims 1 to 3.

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