JP7612307B2 - Substrate working device and substrate working method - Google Patents

Description

This invention relates to a technology for supporting a substrate on which objects such as components or coating liquids are placed.

When mounting components on both sides of a board, the following procedure is carried out: first, with the board's front side facing up, the components are mounted on the front side, and then, with the back side of the board facing up, the components are mounted on the back side. When mounting components on a board in this way, the side facing downward is supported by backup pins. In particular, when mounting components on the back side of a board, interference between the component and the backup pins becomes an issue, since a component is already mounted on the front side of the board facing downward.

In response to this, in Patent Document 1, the presence or absence of interference between the component and the backup pin is confirmed as follows. In other words, if the backup pin, which supports the back surface of the board from below, interferes with the component mounted on the back surface, the board is pushed up and warped upward. Therefore, the presence or absence of interference between the component and the backup pin is confirmed based on the warping of the board, which is obtained by measuring the distance to the front surface of the board using a distance sensor provided on the top side of the board.

JP 2016-207912 A

The above method checks for interference between the components and the backup pins while the surface on which the components are mounted is supported from below by the backup pins. However, if it is possible to check for interference between the components and the backup pins before supporting them with the backup pins, appropriate measures, such as changing the position of the backup pins, can be taken in advance. This is also true when objects other than components, such as coating liquid, are placed on both sides of the board. Thus, there has been a demand for technology that can check for interference between the objects and backup members (backup pins) before supporting the surface of the board on which the objects (components, coating liquid, etc.) are placed from below by the backup members.

This invention was developed in consideration of the above problem, and aims to make it possible to check in advance whether or not there will be interference between an object and a backup member before the surface of a substrate on which the object is placed is supported from below by the backup member.

The substrate working device according to the present invention includes a substrate holding section that holds a substrate having a first surface and a second surface opposite to the first surface with the first surface facing upward, a working head that performs the task of placing an object on the first surface of the substrate held in the substrate holding section, and a control section that, after the task performed by the working head is completed, checks whether an object is present at the intended support position on the first surface of the substrate held in the substrate holding section.

The substrate processing method according to the present invention includes the steps of holding a substrate having a first surface and a second surface opposite to the first surface with a substrate holding unit with the first surface facing upward, performing an operation to place an object on the first surface of the substrate held by the substrate holding unit, and, after the operation is completed, confirming whether or not an object is present at the intended support position on the first surface of the substrate held by the substrate holding unit.

In the present invention (board working device and board working method) configured in this manner, when the work of placing an object on the first surface (first and second surfaces) of a board is completed with the first surface facing upward, it is confirmed whether or not the object is present at the intended support position on the first surface. In other words, when the placement of the object on the first surface is completed, the presence of the object at the intended support position on the first surface is confirmed while the first surface on which the object is placed is still facing upward, that is, the presence or absence of interference between the object and the backup member intended to support the intended support position is confirmed. As a result, it is possible to confirm whether or not the object interferes with the backup member before the surface (first surface) of the board on which the object is placed is supported from below by the backup member.

The circuit board working device may also be configured such that a test member is attached to the working head, the test member having a tip portion with the same shape as the tip portion of the backup member to be used to support the intended support position from below, and the control unit checks whether an object is present at the intended support position based on the result of moving the tip portion of the test member attached to the working head from above toward the intended support position until the tip portion of the test member abuts against the first surface or an object placed on the first surface. In this way, by checking whether an object is present at the intended support position using a test member having a tip shape in common with the backup member, it is possible to accurately check whether there is interference between the object and the backup member.

The substrate work device may also be configured to further include a test member storage section for storing the test member, the test member being detachable from the work head, the test member being detached from the work head and stored in the test member storage section before work begins, and the test member stored in the test member storage section being attached to the work head after work is completed. In this configuration, the test member is detached from the work head while the work head is performing work. Therefore, work can be performed by the work head while avoiding interference between the substrate or object and the test member.

The circuit board working device may also be configured to further include a camera attached to the working head, and the control unit may be configured to check whether or not an object is present at the intended support position based on a post-work image acquired by using the camera to capture an image of the intended support position from above after work by the working head is completed. In this configuration, it is possible to check in advance whether or not there is interference between the object and the backup member based on the post-work image captured by the camera.

The control unit may also be configured to check whether an object is present at the intended support position based on a comparison between a pre-work image, acquired by using a camera to capture an image of the intended support position from above before work is started by the work head, and a post-work image. In this configuration, it is possible to check in advance whether there is interference between the object and the backup member based on a comparison between the pre-work image and the post-work image captured by the camera.

The substrate working device may also be configured to further include a distance sensor attached to the working head, and the control unit may be configured to check whether or not an object is present at the intended support position based on a post-operation measured height obtained by measuring the height of the intended support position from above using the distance sensor after work by the working head is completed. In this configuration, it is possible to check in advance whether or not there is interference between the object and the backup member based on the post-operation measured height of the intended support position measured by the distance sensor.

The control unit may be configured to check whether an object is present at the intended support position based on a comparison between a pre-operation measured height, obtained by measuring the height of the intended support position from above using a distance sensor before the work head starts, and a post-operation measured height. In this configuration, it is possible to check in advance whether there is interference between the object and the backup member based on a comparison between the pre-operation measured height and the post-operation measured height of the intended support position measured by the distance sensor.

The circuit board working device may also be configured so that the control unit issues a warning to the worker when it determines that an object is present at the intended support position. In this configuration, the worker can know in advance that the object will interfere with the backup member before support by the backup member.

The control unit may also be configured to execute an instruction to change the intended support position upon notification. In this configuration, before the backup member supports the object, the worker can change the position supported by the backup member in advance to prevent interference between the object and the backup member.

It should be noted that various specific tasks may be performed by the work head in the board work apparatus. Thus, the board work apparatus may be configured so that the object is a component and the work head is a mounting head that mounts the component on a first surface of a board held by the board holding section. Alternatively, the board work apparatus may be configured so that the object is a coating liquid and the work head is a dispensing head that applies the coating liquid to a first surface of a board held by the board holding section.

As described above, according to the present invention, it is possible to check in advance whether or not there will be interference between the object and the backup member before supporting the surface of the substrate on which the object is placed from below with the backup member.

FIG. 1 is a block diagram showing an example of a component mounting system that mounts components on both sides of a substrate. FIG. 2 is a plan view showing a component mounter. FIG. 3 is a diagram showing an electrical configuration of the component mounter of FIG. 2 . FIG. 4 is a side view showing a schematic relationship between a nozzle, a test pin, and a backup pin. 4 is a flowchart showing a first example of double-sided mounting performed on a board in the component mounting system of FIG. 1 . FIG. 6 is a diagram showing an example of the height of a board measured in the double-sided mounting of FIG. 5 . 6 is a side view showing an example of an operation for checking whether or not components overlap with intended support positions in the double-sided mounting of FIG. 5 . 6 is a side view showing a schematic view of a support state of the board by the backup pins in the double-sided mounting of FIG. 5 . 10 is a flowchart showing a second example of double-sided mounting performed on a board in the component mounting system of FIG. 1 . 13 is a flowchart showing a third example of double-sided mounting performed on a board in the component mounting system of FIG. 1 . 11 is a side view showing an example of height measurement of a planned support position performed in the double-sided mounting of FIG. 10 .

Figure 1 is a block diagram showing an example of a component mounting system that mounts components on both sides of a board. In this figure and the following figures, the horizontal X direction, the horizontal Y direction perpendicular to the X direction, and the vertical Z direction are appropriately shown. As shown in Figure 1, the component mounting system 1 includes a control device 2 and two component mounters 4a and 4b arranged in series in the Y direction.

The control device 2 is a server computer and includes a calculation unit 21 configured with a processor such as a CPU (Central Processing Unit), a UI (User Interface) 22, and a communication unit 23, with the calculation unit 21 controlling the UI 22 and the communication unit 23. The UI 22 has an input device such as a keyboard or a mouse, and an output device such as a display. Note that the input device and the output device do not need to be configured separately, and may be configured integrally with a touch panel display. The communication unit 23 communicates with each of the component mounters 4a and 4b.

In this component mounting system 1, component mounter 4a mounts components on the front side of a board, and then component mounter 4b mounts components on the back side of the board. The loading of the board into component mounter 4a, the transportation of the board from component mounter 4a to component mounter 4b, and the removal of the board from component mounter 4b can be performed by a board transport mechanism such as a conveyor or an AGV (Automatic Guided Vehicle), or by an operator. These component mounters 4a and 4b have the following common configuration:

Fig. 2 is a plan view showing a schematic diagram of a component mounter, and Fig. 3 is a diagram showing the electrical configuration of the component mounter of Fig. 2. This component mounter 4 mounts a component P at a mounting location provided on a board B. The board B is, for example, a printed circuit board, and the mounting location is, for example, a land provided on the printed circuit board.

As shown in FIG. 3, the component mounter 4 includes a control unit 410, a memory unit 420, and a communication unit 430. The control unit 410 is a processor configured with a CPU (Central Processing Unit) and the like, and controls the entire component mounter 4. The memory unit 420 is a storage device such as a HDD (Hard Disk Drive) or SSD (Solid State Drive), and stores various data. The communication unit 430 communicates with the communication unit 23 of the control device 2.

As shown in FIG. 2, the component mounter 4 has a pair of conveyors 41 arranged in parallel in the Y direction. The component mounter 4 transports the board B from the upstream side (left side in FIG. 2) in the Y direction (board transport direction) to a mounting work position Lo (position of board B in FIG. 2) using the conveyor 41, mounts components P on the board B held at the mounting work position Lo, and transports the board B (component-mounted board B) with the mounting of components P completed from the mounting work position Lo to the downstream side in the Y direction using the conveyor 41. The transport and holding of the board B by this conveyor 41 is controlled by the control unit 410.

Note that backup pins, which will be described later, are arranged at the mounting work position Lo, and the board B held at the mounting work position Lo by the conveyor 41 is supported from below by the backup pins. The support by the backup pins corrects any warping of the board B due to its own weight.

In addition, in the component mounter 4, a pair of X-axis rails 421 parallel to the X direction, an X-axis ball screw 422 parallel to the X direction, and an X-axis motor Mx (servo motor) that rotates and drives the X-axis ball screw 422 are provided, and a Y-axis rail 424 parallel to the Y direction is fixed to the nut of the X-axis ball screw 422 while being supported by the pair of X-axis rails 421 so as to be movable in the X direction. A Y-axis ball screw 425 parallel to the Y direction and a Y-axis motor My (servo motor) that rotates and drives the Y-axis ball screw 425 are attached to the Y-axis rail 424, and the head unit 43 is fixed to the nut of the Y-axis ball screw 425 while being supported by the Y-axis rail 424 so as to be movable in the Y direction. Therefore, the control unit 410 can rotate the X-axis ball screw 422 by the X-axis motor Mx to move the head unit 43 in the X direction, and rotate the Y-axis ball screw 425 by the Y-axis motor My to move the head unit 43 in the Y direction. In this way, the X-axis motor Mx and the Y-axis motor My form an XY drive mechanism that moves the head unit 43 on the XY plane.

The head unit 43 has a so-called rotary type mounting head 431. That is, the mounting head 431 has a plurality (eight pieces) of shafts 432 arranged at equal angular intervals in a circle around the rotation axis, each of which is provided in the Z direction, and a nozzle (described later) is detachably attached to the lower end of each shaft 432. The plurality of shafts 432 can be rotated around the rotation axis by the driving force of an R-axis motor Mr (servo motor). In addition, the shaft 432 is raised and lowered in the Z direction by a Z-axis drive mechanism Mz composed of a servo motor or an actuator or the like. This Z-axis drive mechanism Mz can output the height of the shaft 432 detected by, for example, an encoder to the control unit 410. Therefore, the control unit 410 can adjust the rotation position of the shaft 432 by controlling the R-axis motor Mr, and can adjust the height of the shaft 432 by controlling the Z-axis drive mechanism Mz. In addition, the nozzle attached to the lower end of the shaft 432 rotates and rises and falls along with the shaft 432.

A board recognition camera C is also attached to the head unit 43. The board recognition camera C faces downward and captures the board B located at the mounting work position Lo from above. The image captured by the board recognition camera C is transferred to the control unit 410, which performs signal processing on the image received from the board recognition camera C to obtain predetermined information from the image. For example, when the board recognition camera C captures an image of a fiducial mark attached to the board B, the control unit 410 determines the position of the board B from the fiducial mark included in the image.

The nozzle is also connected to a pressure applying unit 433, which applies pressure to the nozzle attached to the lower end of the shaft 432 in response to commands from the control unit 410. Specifically, when the nozzle is used to pick up and hold a component P, the pressure applying unit 433 applies negative pressure to the nozzle. When the nozzle is used to place a component P on a mounting location (land) on the board B, the pressure applying unit 433 applies atmospheric pressure or positive pressure to the nozzle.

As shown in FIG. 2, two component supply units 44 are arranged in the X direction on each side of the pair of conveyors 41 in the Y direction. A plurality of tape feeders 441 are arranged in the Y direction and detachably attached to each component supply unit 44. The tape feeders 441 extend in the X direction and have a component supply point 442 at the tip of the conveyor 41 side in the X direction. A component supply reel around which a tape is wound containing small pieces of components P such as integrated circuits, transistors, and capacitors at predetermined intervals is arranged for each tape feeder 441, and the tape pulled out from the component supply reel is loaded into the tape feeder 441. The tape feeder 441 intermittently feeds the tape in the X direction toward the conveyor 41 side in response to a command from the control unit 410. As a result, the components P in the tape are fed in the X direction (feed direction) and supplied in order to the component supply points 442 of the tape feeder 441.

Then, the mounting head 431 mounts the component P on the board B by executing the following operation based on the command from the control unit 410. That is, the mounting head 431 moves above the tape feeder 441 and abuts the nozzle against the component P supplied to the component supply point 442 by the tape feeder 441. The mounting head 431 then adsorbs (picks up) the component P by the negative pressure applied to the nozzle. The mounting head 431 transfers the component P thus held by the nozzle to the mounting point (land) of the board B at the mounting work position Lo.

The component mounter 4 also has a test pin storage unit 45 that stores a test pin used to check the height of the top surface of the board B held at the mounting work position Lo by the conveyor 41. This test pin is attached to the mounting head 431 when used, and has a tip portion with a shape that is the same as the backup pin.

Figure 4 is a side view that shows a schematic diagram of the relationship between the nozzle, test pin, and backup pin. Of the nozzle 51, test pin 53, and backup pin 55 shown in Figure 4, the nozzle 51 and test pin 53 are used in the orientation shown in the figure in the Z direction, while the backup pin 55 is used in an orientation that is inverted from the orientation shown in the figure in the Z direction. The reason that the orientation of the backup pin 55 is inverted is to contrast the shapes of the test pin 53 and the backup pin 55.

The nozzle 51 is attached to the lower end of the shaft 432, and supplies negative pressure, atmospheric pressure, and positive pressure from a nozzle hole that opens at the tip 511 (lower end) of the nozzle 51. The test pin 53 is attached to the shaft 432 via the nozzle 51. That is, an insertion port for inserting the nozzle 51 from above is provided at the upper end of the test pin 53, and the nozzle 51 holds the test pin 53 by adsorbing the test pin 53 with negative pressure while inserted into the insertion port of the test pin 53. In this way, the test pin 53 can be attached to the shaft 432. The tip portion 532 of the test pin 53 in a predetermined range in the Z direction from the tip 531 (lower end) and the tip portion 552 of the backup pin 55 in a predetermined range in the Z direction from the tip 551 have the same shape.

Figure 5 is a flow chart showing a first example of double-sided mounting performed on a board in the component mounting system of Figure 1, Figure 6 is a diagram showing an example of the height of the board measured in double-sided mounting of Figure 5, Figure 7 is a side view showing an example of an operation to check whether or not a component overlaps with the intended support position in double-sided mounting of Figure 5, and Figure 8 is a side view showing an example of the support mode of the board by the backup pins in double-sided mounting of Figure 5. In this double-sided mounting, component mounter 4a mounts component P on the front surface Ba of board B, and then component mounter 4b mounts component P on the back surface Bb of board B opposite to front surface Ba.

In step S101, the board B is brought into the mounting work position Lo of the component mounter 4a with the front surface Ba facing upward. Next, in the component mounter 4a, the mounting head 431 moves in the XY plane to mount a component P on the front surface Ba of the board B held at the mounting work position Lo (step S102). When mounting of the component P on the front surface Ba is completed in step S102, it is confirmed whether the component P mounted on the front surface Ba overlaps with the intended support position S where the backup pin 55 supports the board B in the component mounter 4b that is scheduled to mount the component P on the back surface Bb of the board B (steps S103 to S107).

In other words, in the component mounter 4b, as shown in FIG. 8, the board B is held at the mounting work position Lo with the surface Ba facing downward, and the tip 551 of the backup pin 55 abuts from below against the intended support position S provided on the surface Ba. As shown in the table of FIG. 6, the intended support position S is a position in the XY plane (in other words, a position in a planar view) specified by a position in the X direction (X coordinate) and a position in the Y direction (Y coordinate). This intended support position S is set in advance for the surface Ba of the board B by calculation by the control device 2 or manual work by the operator. In the example of FIG. 6, multiple intended support positions S are provided for the surface Ba, and the component mounter 4b places the backup pin 55 for each of the multiple intended support positions S. However, the number of intended support positions S provided for the surface Ba is not limited to multiple, and may be one.

The overlapping check of the component P at the intended support position S is performed by the component mounter 4a using the test pin 53. That is, in step S103, the control unit 410 moves the nozzle 51 to the upper side of the test pin storage unit 45 and adsorbs the test pin 53 to the nozzle 51. In step S104, the control unit 410 makes the tip portion 532 of the test pin 53 face the intended support position S set on the surface Ba of the board B from above. Next, the control unit 410 lowers the shaft 432 by the Z-axis drive mechanism Mz, thereby lowering the test pin 53 toward the intended support position S until the tip portion 532 of the test pin 53 abuts against the board B or the component P. As shown in the "Component Present" column in FIG. 7, when the component P overlaps the intended support position S, the test pin 53 stops at the height at which the tip portion 532 of the test pin 53 contacts the component P. On the other hand, as shown in the "No Component" column in FIG. 7, when the component P does not overlap the intended support position S, the test pin 53 stops at the height at which the tip portion 532 of the test pin 53 contacts the surface Ba of the board B. In other words, the height at which the test pin 53 stops varies depending on whether the component P overlaps the intended support position S, and the height of the tip portion 532 when the test pin 53 stops indicates the height of the intended support position S. Therefore, the control unit 410 of the component mounter 4a measures the height H (Z coordinate) of the intended support position S based on the height of the shaft 432 indicated by the Z-axis drive mechanism Mz, and stores it in the storage unit 420. At this time, the height of the shaft 432 indicated by the Z-axis drive mechanism Mz may be treated as the height H of the intended support position S, or a value obtained by performing an operation such as subtracting the length of the test pin 53 from the height of the shaft 432 indicated by the Z-axis drive mechanism Mz may be treated as the height H of the intended support position S.

In step S106, it is determined whether the heights H of all the intended support positions S set on the surface Ba of the board B have been measured. Steps S104 to S105 are repeated until the heights H of all the intended support positions S have been measured. When the heights H of all the intended support positions S have been measured (YES in step S106), the presence or absence of interference is confirmed in step S107. Note that from the start of mounting of the component P in step S102 until it is determined in step S107 that measurement of the heights H of all the intended support positions S has been completed, the board B is continuously held at the mounting work position Lo by the conveyor 41 with the surface Ba facing upward.

When a component P overlaps the planned support position S, the tip portion 552 of the backup pin 55 arranged for the planned support position S by the component mounter 4b interferes with the component P, whereas when a component P does not overlap the planned support position S, the tip portion 552 of the backup pin 55 arranged for the planned support position S by the component mounter 4b does not interfere with the component P. Therefore, the presence or absence of interference between the component P and the backup pin 55 can be determined depending on whether the component P overlaps the planned support position S. Also, as described above, the presence or absence of overlap of the component P with the planned support position S can be determined from the height H of the planned support position S. Therefore, when the height H of the planned support position S is equal to or greater than a predetermined threshold value, it is determined that the component P overlaps the planned support position S and the backup pin 55 arranged for the planned support position S and the component P interfere with each other. On the other hand, when the height H of the planned support position S is less than the threshold value, it is determined that the component P does not overlap the planned support position S and the backup pin 55 arranged for the planned support position S and the component P do not interfere with each other. In step S107, if interference occurs with at least one of the multiple planned support positions S, it is determined that there is interference (YES). On the other hand, if interference does not occur with any of the multiple planned support positions S, it is determined that there is no interference (NO).

When interference is determined to exist in step S107, the control unit 410 of the component mounter 4a notifies the worker that interference will occur. This notification may be performed using the display of the UI 22 of the control device 2, or may be performed using the display of the worker's mobile terminal. In addition, in this notification, the control unit 410 instructs the worker to change the position supported by the backup pin 55 from the intended support position S where interference is determined to exist.

If it is determined in step S107 that there is no interference, the board B is carried out from the component mounter 4a (step S109), and the board B is carried into the mounting work position Lo of the component mounter 4b with the back surface Bb facing upward (step S110). As shown in FIG. 8, in the component mounter 4b, a table 46 supporting the backup pins 55 is provided below the board B that stops at the mounting work position Lo. Then, on this table 46, backup pins 55 are arranged to face each planned support position S of the front surface Ba of the board B, and the backup pins 55 abut against the front surface Ba of the board B at the facing planned support position S. In this way, in the component mounter 4b, the component P is mounted on the back surface Bb of the board B held at the mounting work position Lo while being supported by the backup pins 55 (step S111). Then, when the mounting of the component P in step S111 is completed, the board B is carried out from the component mounter 4b (step S112).

In this way, in the first example of double-sided mounting, when the work of mounting the component P (object) on the front surface Ba is completed with the front surface Ba (first surface) of the two surfaces (front surface Ba and back surface Bb) of the board B facing upward (step S102), it is confirmed whether the component P exists at the intended support position S on the front surface Ba (steps S103 to S107). In other words, when the mounting of the component P on the front surface Ba is completed (step S102), the presence of the component P at the intended support position S on the front surface Ba is confirmed with the front surface Ba on which the component P is mounted facing upward (steps S103 to S107), that is, the presence or absence of interference between the backup pin 55 (backup member) that is intended to support the intended support position S and the component P is confirmed. As a result, it is possible to confirm whether or not the component P interferes with the backup pin 55 before supporting the front surface Ba of the board B on which the component P is mounted from below with the backup pin 55.

Also, a test pin 53 (test member) is attached to the mounting head 431 (working head) (step S103). This test pin 53 has a tip portion 532 of the same shape as the tip portion 552 of the backup pin 55 that is to support the intended support position S from below. Then, the control unit 410 checks whether or not a component P is present at the intended support position S based on the result of moving the tip portion 532 of the test pin 53 attached to the mounting head 431 from above toward the intended support position S until the tip portion 532 of the test pin 53 abuts against the surface Ba or the component P mounted on the surface Ba (steps S104 to S107). In this way, by checking whether or not a component P is present at the intended support position S using the test pin 53 that has a tip shape common to the backup pin 55, it is possible to accurately check whether or not there is interference between the component P and the backup pin 55.

The component mounter 4a is also provided with a test pin storage unit 45 (test member storage section) that stores test pins 53 that are detachable from the mounting head 431. Before the component mounting (work) of step S102 begins, the test pins 53 are detached from the mounting head 431 and stored in the test pin storage unit 45. On the other hand, when the component mounting of step S102 is completed, the test pins 53 are attached to the mounting head 431 from the test pin storage unit 45 (step S103). In this configuration, the test pins 53 are detached from the mounting head 431 while the mounting head 431 is mounting the component. Therefore, the mounting head 431 can mount the component while avoiding interference between the board B or component P and the test pins 53.

When the control unit 410 determines that a component P is present at the intended support position S ("YES" in step S107), it notifies the worker (step S108). In this configuration, the worker can know in advance that the component P and the test pin 53 will interfere with each other before support by the test pin 53.

The control unit 410 also issues an instruction to change the intended support position S in the notification (step S108). In this configuration, before support by the test pin 53, the worker can change the position to be supported by the test pin 53 in advance to prevent interference between the component P and the test pin 53.

Figure 9 is a flow chart showing a second example of double-sided mounting performed on a board in the component mounting system of Figure 1. The following explanation focuses on the differences from the first example of double-sided mounting, and omits explanations of the commonalities with the first example as appropriate. In step S201, board B is brought into the mounting work position Lo of component mounter 4a with surface Ba facing upward.

Then, the control unit 410 faces the board recognition camera C from above toward the intended support positions S provided on the surface Ba of the board B held at the mounting work position Lo, and captures the intended support positions S with the board recognition camera C to obtain image data Ib showing the image of the intended support positions S (step S202), and stores this image data Ib in the storage unit 420 (step S203). In step S204, it is determined whether or not imaging of all intended support positions S set on the surface Ba of the board B has been completed. Then, steps S202 to S203 are repeated until imaging of all intended support positions S has been completed, and when imaging of all intended support positions S has been completed ("YES" in step S204), the process proceeds to step S205.

In step S205, in the component mounter 4a, the mounting head 431 moves in the XY plane while mounting a component P on the front surface Ba of the board B held at the mounting work position Lo. When mounting of the component P on the front surface Ba is completed in step S205, it is confirmed whether the component P mounted on the front surface Ba overlaps with the intended support position S where the backup pins 55 support the board B in the component mounter 4b that is scheduled to mount the component P on the back surface Bb of the board B (steps S206 to S209).

That is, in step S206, the control unit 410 faces the intended support position S from above, captures the intended support position S with the board recognition camera C, and obtains image data Ia showing the image of the intended support position S (step S206), and stores this image data Ia in the storage unit 420 (step S207). In step S208, it is determined whether or not the images of all the intended support positions S set on the surface Ba of the board B have been completed. Then, steps S206 to S207 are repeated until the images of all the intended support positions S have been completed, while when the images of all the intended support positions S have been completed ("YES" in step S208), the process proceeds to step S209. Note that from the start of the image capture of the intended support position S in step S202 until it is determined in step S208 that the image capture of the intended support position S has been completed, the board B is continuously held at the mounting work position Lo by the conveyor 41 with the surface Ba facing upward.

In step S209, the control unit 410 checks whether a component P overlaps the intended support position S by determining whether there is a difference between the image data Ib and image data Ia that capture the same intended support position S. That is, the image data Ib is acquired by capturing an image of the intended support position S before mounting the component P on the front surface Ba (step S205), and the image data Ia is acquired by capturing an image of the intended support position S after mounting the component P on the front surface Ba (step S205). Therefore, when the component P mounted in step S205 does not overlap the intended support position S, there is no difference between the image data Ib and image data Ia, whereas when the component P mounted in step S205 overlaps the intended support position S, there is a difference between the image data Ib and image data Ia. Therefore, it is determined that the component P does not overlap the intended support position S where there is no difference between the image data Ib and image data Ia, that is, there is no interference between the backup pin 55 that supports the intended support position S and the component P. On the other hand, it is determined that a component P overlaps with the intended support position S where there is a difference between the image data Ib and the image data Ia, that is, interference occurs between the backup pin 55 supporting the intended support position S and the component P. In step S209, if interference occurs with at least one of the multiple intended support positions S, it is determined that there is interference (YES). On the other hand, if interference does not occur with all of the multiple intended support positions S, it is determined that there is no interference (NO). Then, steps S210 to S214 are executed in the same manner as steps S108 to S112 described above.

In this way, in the second example of double-sided mounting, when the work of mounting component P on surface Ba of substrate B is completed with surface Ba facing upward (step S205), it is confirmed whether component P is present at the intended support position S on surface Ba (steps S206 to S209). In other words, when mounting of component P on surface Ba is completed (step S205), the presence of component P at the intended support position S on surface Ba is confirmed with surface Ba on which component P is mounted facing upward (steps S206 to S209), that is, the presence or absence of interference between the backup pin 55 intended to support the intended support position S and the component P is confirmed. As a result, it is possible to confirm whether or not there is interference between the component P and the backup pin 55 before supporting surface Ba of substrate B on which component P is mounted from below with the backup pin 55.

The mounting head 431 is also equipped with a board recognition camera C (camera), and the control unit 410 checks whether or not a component P is present at the intended support position S based on image data Ia (post-operation image) acquired by imaging the intended support position S from above with the board recognition camera C after component mounting by the mounting head 431 (step S205) is completed (steps S206 to S209). With this configuration, it is possible to check in advance whether or not there is interference between the component P and the backup pin 55 based on the image data Ia captured by the board recognition camera C.

The control unit 410 also acquires image data Ib (pre-operation image) by capturing an image of the intended support position S from above using the board recognition camera C before component mounting by the mounting head 431 (step S205) begins (steps S202-S203). The control unit 410 then checks whether or not a component P is present at the intended support position S based on a comparison between the image data Ib and image data Ia (step S209). With this configuration, it is possible to check in advance whether or not there will be interference between the component P and the backup pin 55 based on a comparison between the image data Ib captured by the board recognition camera C and the image data Ia.

Figure 10 is a flow chart showing a third example of double-sided mounting performed on a board in the component mounting system of Figure 1, and Figure 11 is a side view showing a schematic example of height measurement of the intended support position performed in the double-sided mounting of Figure 10. The following explanation focuses on the differences from the second example of double-sided mounting, and omits explanations of the points in common with the second example as appropriate.

In this third example, a distance sensor D shown in FIG. 11 is attached to the head unit 43. This distance sensor D faces downward and measures the height of the intended support position S by detecting the distance to the intended support position S of the board B located at the mounting work position Lo, and the height measured by the distance sensor D (measured height) is transferred to the control unit 410. The type of distance sensor D is not particularly limited, but a TOF (Time of Flight) type sensor can be used, for example.

In step S301, the board B is brought into the mounting work position Lo of the component mounter 4a with the surface Ba facing upward. Next, the control unit 410 measures the height of the intended support position S using the distance sensor D while facing the intended support position S provided on the surface Ba of the board B held at the mounting work position Lo from above, thereby obtaining the measured height Hb (step S302), and stores this measured height Hb in the memory unit 420 (step S303). In step S304, it is determined whether or not the measurement of the heights of all the intended support positions S set on the surface Ba of the board B has been completed. Then, steps S302 to S303 are repeated until the measurement of the heights of all the intended support positions S has been completed, while when the measurement of the heights of all the intended support positions S has been completed ("YES" in step S304), the process proceeds to step S305.

In step S305, in the component mounter 4a, the mounting head 431 moves in the XY plane while mounting a component P on the front surface Ba of the board B held at the mounting work position Lo. When mounting of the component P on the front surface Ba is completed in step S305, it is confirmed whether the component P mounted on the front surface Ba overlaps with the intended support position S where the backup pins 55 support the board B in the component mounter 4b that is scheduled to mount the component P on the back surface Bb of the board B (steps S306 to S309).

That is, in step S306, the control unit 410 measures the height of the intended support position S using the distance sensor D while facing the intended support position S from above, thereby obtaining the measured height Ha (step S306), and stores this measured height Ha in the memory unit 420 (step S307). In step S308, it is determined whether the measurement of the heights of all the intended support positions S set on the surface Ba of the board B has been completed. Then, steps S306 to S307 are repeated until the measurement of the heights of all the intended support positions S is completed, while when the measurement of the heights of all the intended support positions S is completed ("YES" in step S308), the process proceeds to step S309. Note that from the start of the measurement of the heights of the intended support positions S in step S302 until it is determined that the measurement of the heights of the intended support positions S is completed in step S308, the board B is continuously held at the mounting work position Lo by the conveyor 41 with the surface Ba facing upward.

In step S309, the control unit 410 checks whether a component P overlaps the intended support position S by determining whether there is a difference between the measured height Hb and the measured height Ha of the same intended support position S. That is, the measured height Hb is obtained by measuring the height of the intended support position S before mounting the component P on the front surface Ba (step S305), and the measured height Ha is obtained by measuring the height of the intended support position S after mounting the component P on the front surface Ba (step S305). Therefore, when the component P mounted in step S305 does not overlap the intended support position S, there is no difference between the measured height Hb and the measured height Ha, whereas when the component P mounted in step S305 overlaps the intended support position S, there is a difference between the measured height Hb and the measured height Ha (FIG. 11). Therefore, it is determined that the component P does not overlap the intended support position S where there is no difference between the measured height Hb and the measured height Ha, that is, there is no interference between the backup pin 55 supporting the intended support position S and the component P. On the other hand, it is determined that a component P overlaps the intended support position S where there is a difference between the measured height Hb and the measured height Ha, that is, interference occurs between the backup pin 55 supporting the intended support position S and the component P. In step S309, if interference occurs at at least one of the multiple intended support positions S, it is determined that there is interference (YES). On the other hand, if interference does not occur at any of the multiple intended support positions S, it is determined that there is no interference (NO). Then, steps S310 to S314 are executed in the same manner as steps S108 to S112 described above.

In this way, in the third example of double-sided mounting, when the work of mounting component P on surface Ba of substrate B is completed with surface Ba facing upward (step S305), it is confirmed whether component P is present at the intended support position S on surface Ba (steps S306 to S309). In other words, when mounting of component P on surface Ba is completed (step S305), the presence of component P at the intended support position S on surface Ba is confirmed with surface Ba on which component P is mounted facing upward (steps S306 to S309), that is, whether or not there is interference between the backup pin 55 intended to support the intended support position S and the component P is confirmed. As a result, whether or not there is interference between the component P and the backup pin 55 can be confirmed before the surface Ba of substrate B on which component P is mounted is supported from below by the backup pin 55.

A distance sensor D is also attached to the head unit 43, and the control unit 410 checks whether or not a component P is present at the intended support position S based on a measured height Ha (measured height after work) obtained by measuring the height of the intended support position S from above after component mounting by the head unit 43 (step S305) is completed using the distance sensor D (steps S306 to S309). In this configuration, the presence or absence of interference between the component P and the backup pin 55 can be confirmed in advance based on the measured height Ha of the intended support position S measured by the distance sensor D. Note that various sensors capable of measuring the distance to an object can be used as the distance sensor D, such as a laser sensor.

The control unit 410 also measures the height of the intended support position S from above using the distance sensor D before the head unit 43 starts mounting the component (step S305), thereby obtaining a measured height Hb (pre-operation measured height) (steps S302-S303). The control unit 410 then checks whether or not a component P is present at the intended support position S based on a comparison between the measured height Hb and the measured height Ha (step S309). With this configuration, it is possible to check in advance whether or not there will be interference between the component P and the backup pin 55 based on a comparison between the measured height Hb of the intended support position S measured by the distance sensor D and the measured height Ha.

As described above, in this embodiment, the component mounter 4 corresponds to an example of a "board work device" of the present invention, the conveyor 41 corresponds to an example of a "board holding section" of the present invention, the control section 410 corresponds to an example of a "control section" of the present invention, the mounting head 431 corresponds to an example of a "working head" or "mounting head" of the present invention, the test pin storage unit 45 corresponds to an example of a "test member storage section" of the present invention, the test pin 53 corresponds to an example of a "test member" of the present invention, the tip portion 532 corresponds to an example of a "tip portion" of the present invention, the backup pin 55 corresponds to an example of a "backup member" of the present invention, and the tip portion 552 corresponds to an example of a "backup member" of the present invention. the front surface Ba corresponds to an example of a "first surface" of the present invention, the back surface Bb corresponds to an example of a "second surface" of the present invention, the board recognition camera C corresponds to an example of a "camera" of the present invention, the distance sensor D corresponds to an example of a "distance sensor" of the present invention, the measured height Ha corresponds to an example of a "post-work measured height" of the present invention, the measured height Hb corresponds to an example of a "pre-work measured height" of the present invention, the image data Ia corresponds to an example of a "post-work image" of the present invention, the image data Ib corresponds to an example of a "pre-work image" of the present invention, and the part P corresponds to an example of an "object" or "part" of the present invention.

The present invention is not limited to the above embodiment, and various modifications can be made to the above without departing from the spirit of the present invention. For example, the method of attaching the test pin 53 to the shaft 432 is not limited to suction by the nozzle 51 at the lower end of the mounting head 431. In other words, the test pin 53 may be configured to be detachable from the shaft 432, so that the nozzle 51 is removed from the shaft 432 and then the test pin 53 is attached to the lower end of the shaft 432 in the same manner as the nozzle.

In the second example of double-sided mounting in FIG. 9, the presence or absence of interference in step S209 may be determined based only on the image data Ia acquired in steps S206 and S207 without executing steps S202 and S203. In this case, the control unit 410 executes image processing to search for an image of a component P overlapping the intended support position S from the image data Ia, and determines that interference will occur if the corresponding image is confirmed, and determines that interference will not occur if the corresponding image is not confirmed (step S209). Even in this modified example, the control unit 410 checks whether or not a component P exists at the intended support position S based on image data Ia (post-operation image) acquired by capturing an image of the intended support position S from above by the board recognition camera C after the mounting head 431 has completed component mounting. In this way, the presence or absence of interference between the component P and the backup pin 55 can be confirmed in advance based on the image data Ia captured by the board recognition camera C.

In addition, in the third example of double-sided mounting in FIG. 10, the presence or absence of interference in step S309 may be determined based only on the measured height Ha obtained in steps S306 and S307 without executing steps S302 and S303. In this case, if the measured height Ha is equal to or greater than a predetermined threshold, the control unit 410 determines that an overlapping component P exists at the intended support position S and interference will occur, and if the measured height Ha is less than the threshold, the control unit 410 determines that an overlapping component P does not exist at the intended support position S and interference will not occur (step S309). Even in such a modified example, the control unit 410 checks whether or not a component P exists at the intended support position S based on the measured height Ha (measured height after work) obtained by measuring the height of the intended support position S after component mounting by the mounting head 431 is completed from above using the distance sensor D. In this way, the presence or absence of interference between the component P and the backup pin 55 can be confirmed in advance based on the measured height Ha of the intended support position S measured by the distance sensor D.

Furthermore, in the above description, the component mounters 4a and 4b have a common configuration as shown in FIG. 2. However, even if the component mounters 4a and 4b have different configurations, the above embodiment can be similarly applied.

In addition, examples of the board working device are not limited to the component mounter 4 described above. Therefore, the board working device may be, for example, a coating device (dispenser) described in JP 2017-205710 A. In this coating device, a dispense head (working head) applies a liquid coating liquid such as adhesive or cream solder to a board held on a conveyor (board holding unit). The surface Ba of the board B on which the coating liquid has been applied by the coating device faces downward in a device (coating device or component mounter 4) that performs work on the board B after the coating device, and is supported by backup pins 55 at the intended support position S. Therefore, in the coating device, after the coating work of the coating liquid by the dispense head is completed, it can be confirmed as described above whether the coating liquid (target object) is present at the intended support position S of the surface Ba of the board B held on the conveyor.

4...Component mounting machine (substrate work device)
41...Conveyor (substrate holder)
410: Control unit 431: Mounting head (working head)
45...Test pin storage unit (test member storage section)
53...Test pin (test member)
532: Tip portion 55: Backup pin (backup member)
552: Tip portion B: Substrate Ba: Surface (first surface)
Bb…Back side (2nd side)
C... Board recognition camera (camera)
D: Distance sensor Ha: Measurement height (measurement height after work)
Hb: Measurement height (height measured before work)
Ia: Image data (image after processing)
Ib: Image data (image before operation)
P: Part (object)

Claims (13)

a substrate holder configured to hold a substrate having a first surface and a second surface opposite to the first surface with the first surface facing upward;
a work head that performs an operation of placing an object on the first surface of the substrate held by the substrate holding unit;
a control unit that, after the operation by the working head is completed, confirms whether or not the object is present at a planned support position on the first surface of the substrate held by the substrate holding unit ,
A test member is attached to the working head,
the test member has a tip portion having the same shape as a tip portion of a backup member to be used for supporting the intended support position from below,
The control unit of the board working device checks whether the object is present at the intended support position based on the result of moving the tip portion of the test member attached to the working head from above toward the intended support position until the tip portion of the test member abuts the first surface or the object placed on the first surface . The test member storage unit further includes a test member storage unit for storing the test member.
the test member is detachable from the work head;
The test member is detached from the work head and stored in the test member storage section before the start of the work,
2. The substrate processing device according to claim 1, wherein the test member stored in the test member storage section is attached to the processing head after the processing is completed. a substrate holder configured to hold a substrate having a first surface and a second surface opposite to the first surface with the first surface facing upward;
a work head that performs an operation of placing an object on the first surface of the substrate held by the substrate holding unit;
a control unit that checks whether or not the object is present at a planned support position on the first surface of the substrate held by the substrate holding unit after the operation by the working head is completed ; and
A camera attached to the work head;
Equipped with
The control unit of the board working device checks whether the object is present at the intended support position based on a post-work image obtained by capturing an image of the intended support position from above with the camera after the work by the work head is completed . The board working device of claim 3, wherein the control unit checks whether the object is present at the intended support position based on a comparison between a pre-work image obtained by capturing an image of the intended support position from above with the camera before the work head starts working and the post-work image. a substrate holder configured to hold a substrate having a first surface and a second surface opposite to the first surface with the first surface facing upward;
a work head that performs an operation of placing an object on the first surface of the substrate held by the substrate holding unit;
a control unit that checks whether or not the object is present at a planned support position on the first surface of the substrate held by the substrate holding unit after the operation by the working head is completed ; and
A distance sensor attached to the work head;
Equipped with
The control unit of the substrate working device checks whether the object is present at the intended support position based on a post-work measurement height obtained by measuring the height of the intended support position from above using the distance sensor after the work is completed by the work head . The control unit confirms whether the object is present at the intended support position based on a comparison between a pre-work measurement height obtained by measuring the height of the intended support position from above using the distance sensor before the work head starts the work and the post-work measurement height. The board working apparatus according to claim 1 , wherein the control unit notifies an operator when it determines that the object is present at the intended support position. The board working apparatus according to claim 7 , wherein the control unit issues an instruction to change the intended supporting position in the notification. the object is a part,
9. The board working device according to claim 1 , wherein the working head is a mounting head that mounts the components on the first surface of the board held by the board holding part. the object is a coating liquid,
9. The substrate working device according to claim 1 , wherein the working head is a dispense head that applies the coating liquid to the first surface of the substrate held by the substrate holding part. a step of holding a substrate having a first surface and a second surface opposite to the first surface, with the first surface facing upward, by a substrate holding part;
performing an operation of placing an object on the first surface of the substrate held by the substrate holding unit using a working head ;
and after the operation is completed, confirming by a control unit whether or not the object is present at a planned support position of the first surface of the substrate held by the substrate holder,
A test member is attached to the working head,
the test member has a tip portion having the same shape as a tip portion of a backup member to be used for supporting the intended support position from below,
The control unit of the circuit board working method checks whether the object is present at the intended support position based on the result of moving the tip portion of the test member attached to the work head from above toward the intended support position until the tip portion of the test member contacts the first surface or the object placed on the first surface . a step of holding a substrate having a first surface and a second surface opposite to the first surface, with the first surface facing upward, by a substrate holding part;
performing an operation of placing an object on the first surface of the substrate held by the substrate holding unit using a working head ;
and after the operation is completed, confirming by a control unit whether or not the object is present at a planned support position of the first surface of the substrate held by the substrate holder,
A camera is provided that is attached to the work head;
The control unit confirms whether the object is present at the intended support position based on a post-work image obtained by imaging the intended support position from above with the camera after the work by the work head is completed . a step of holding a substrate having a first surface and a second surface opposite to the first surface, with the first surface facing upward, by a substrate holding part;
performing an operation of placing an object on the first surface of the substrate held by the substrate holding unit using a working head ;
and after the operation is completed, confirming by a control unit whether or not the object is present at a planned support position of the first surface of the substrate held by the substrate holder,
A distance sensor is provided attached to the work head;
The control unit confirms whether the object is present at the intended support position based on a post-work measurement height obtained by measuring the height of the intended support position from above using the distance sensor after the work is completed by the work head .

Images