JP7613807B2 - Inspection device and inspection method - Google Patents

Description

This disclosure relates to an inspection device and an inspection method.

There is a known inspection device that places a wafer on which electronic devices are formed or a carrier on which electronic devices are arranged on a stage and contacts probes provided on a probe card with the electrodes of the electronic device to inspect the electrical characteristics of the electronic device.

Patent Document 1 discloses a substrate contact device for a probe card, which contacts a substrate with a probe card of a substrate inspection interface of a substrate inspection device having an inspection unit that inspects the electrical characteristics of a semiconductor device formed on a substrate and a substrate inspection interface arranged above the inspection unit, and which includes a transport mechanism that transports the substrate together with a plate-shaped member to a position facing the probe card, a contact mechanism that moves the substrate transported by the transport mechanism toward the probe card together with the plate-shaped member to contact multiple electrodes of a semiconductor device provided on the substrate with multiple probes provided on the probe card, and then moves the substrate further toward the probe card together with the plate-shaped member by a predetermined distance, a holding mechanism that reduces the pressure in the space between the probe card and the plate-shaped member to maintain the contact state between the multiple electrodes of the semiconductor device and the multiple probes of the probe card, and a detachment mechanism that detaches the transport mechanism from the plate-shaped member after the contact state is maintained by the holding mechanism.

JP 2014-29916 A

However, when the probe is brought into contact with the outer periphery of the wafer or carrier, an offset occurs between the center of gravity of the press load from the probe card and the center of the stage supporting it, which can cause the stage to tip over.

In one aspect, the present disclosure provides an inspection device and an inspection method that suppresses the stage from tipping.

In order to solve the above problem, according to one aspect, there is provided an inspection device comprising: a probe card having a probe that contacts a test object; an upper module having a mounting portion on which the test object is placed; a moving mechanism that supports the upper module so that it can be raised and lowered and can move the upper module horizontally; and a lifting mechanism that is provided below the moving mechanism and can push the upper module up toward the probe card, wherein the lifting mechanism is positioned at a position where an axis of a point of application of a pressing force when the lifting mechanism pushes up the upper module and an axis of a point of application of a load received by the probe card are common , and the moving mechanism has a first stage that is movable in a first direction relative to a base plate, and a second stage that is movable in a second direction different from the first direction relative to the upper module, and the upper module is supported on the first stage so that it can be raised and lowered, and the first stage has an opening .

According to one aspect, it is possible to provide an inspection device and an inspection method that suppresses the stage from falling.

FIG. 1 is a schematic cross-sectional view illustrating a configuration of an inspection device according to a first embodiment. FIG. 4 is a flowchart showing an example of the operation of the inspection apparatus. 5 is a schematic cross-sectional view of the inspection apparatus according to the first embodiment after horizontal movement when inspecting electronic devices at the center of the carrier. FIG. 5 is a schematic cross-sectional view of an electronic device at the center of a carrier in the inspection apparatus according to the first embodiment during inspection. FIG. 5 is a schematic cross-sectional view of the inspection apparatus according to the first embodiment after horizontal movement when inspecting electronic devices on the outer periphery of a carrier. FIG. 5 is a schematic cross-sectional view of the inspection apparatus according to the first embodiment during inspection of electronic devices on the outer periphery of a carrier. FIG. 5 is a schematic cross-sectional view of the inspection device according to the first embodiment after horizontal movement when the probe is brought into contact with the center of the needle grinding plate. FIG. 4 is a schematic cross-sectional view of the inspection device according to the first embodiment when a probe is brought into contact with the center of a needle grinding plate. FIG. 5 is a schematic cross-sectional view of the inspection device according to the first embodiment after horizontal movement when the probe is brought into contact with the outer periphery of the needle grinding plate. FIG. 4 is a schematic cross-sectional view of the inspection device according to the first embodiment when a probe is brought into contact with the outer periphery of a needle grinding plate. FIG. FIG. 13 is a schematic cross-sectional view of an electronic device at the center of a carrier in the inspection apparatus according to the reference example during inspection. 11 is a schematic cross-sectional view of an inspection device according to a reference example during inspection of electronic devices on the outer periphery of a carrier. FIG. FIG. 11 is a schematic cross-sectional view of the inspection device according to the reference example when a probe is brought into contact with the center of a needle grinding plate. 13 is a schematic cross-sectional view of the inspection device according to the reference example when a probe is brought into contact with the outer periphery of a needle grinding plate. FIG. FIG. 11 is a schematic cross-sectional view of the inspection apparatus according to the second embodiment after horizontal movement when inspecting electronic devices at the center of a carrier. FIG. 11 is a schematic cross-sectional view of an electronic device at the center of a carrier in the inspection apparatus according to the second embodiment during inspection. FIG. 11 is a schematic cross-sectional view illustrating the configuration of an inspection device according to a third embodiment. FIG. 13 is a plan view illustrating the configuration of an inspection device according to a fourth embodiment. FIG. 13 is a schematic cross-sectional view illustrating the configuration of an inspection device according to a fourth embodiment. FIG. 13 is an exploded perspective view of an inspection device according to a fourth embodiment. FIG. 13 is a schematic cross-sectional view of an electronic device at the center of a carrier in the inspection apparatus according to the fourth embodiment during inspection.

Below, a description will be given of a mode for carrying out the present disclosure with reference to the drawings. In each drawing, the same components are given the same reference numerals, and duplicate descriptions may be omitted.

The inspection device 1 according to the first embodiment will be described with reference to FIG. 1. FIG. 1 is a schematic cross-sectional view illustrating the configuration of the inspection device 1 according to the first embodiment.

The inspection device 1 is a device that inspects the electrical characteristics of each of a plurality of electronic devices arranged on a carrier (test object) C. The carrier C may be a wafer, a glass substrate, a single chip, etc.

The inspection device 1 has a probe chamber 2. A probe card 3 is arranged in the upper part of the probe chamber 2. The probe card 3 has a plurality of probes 4. A stage base 10 is provided in the lower part of the probe chamber 2. In the probe chamber 2, a Y stage 20, an X stage 30, an upper Z stage 40, a θ stage 41, a chuck 42, a lower camera 43, a needle grinding plate support stage 50, and a needle grinding plate 51 are provided.

The Y stage 20 moves the chuck 42 and the needle grinding plate 51 in the Y-axis direction. The Y stage 20 is attached to the stage base 10 via a linear guide 21. The linear guide 21 has, for example, a guide rail provided on the upper surface of the stage base 10 and extending in the Y-axis direction, and a slider provided on the lower surface of the Y stage 20 and sliding along the guide rail. This allows the Y stage 20 to be movable in the Y direction.

The Y drive mechanism 22 drives the Y stage 20 in the Y direction. The Y drive mechanism 22 includes, for example, a motor and a rotary-linear mechanism (for example, a ball screw) that converts the rotary motion of the motor into linear motion. The operation of the motor of the Y drive mechanism 22 is controlled by the control device 80.

The detection unit 23 detects the Y-direction position of the Y stage 20, in other words, the Y-direction positions of the chuck 42 and the needle grinding plate 51. The detection unit 23 is, for example, an encoder that detects the rotation of the motor of the Y drive mechanism 22, and the detection signal of the detection unit 23 is transmitted to the control device 80. The control device 80 calculates the Y-direction position of the Y stage 20 based on the detection signal of the detection unit 23.

The Y stage 20 is formed in a frame shape and has an opening 25 that penetrates in the Z-axis direction.

The X-stage 30 moves the chuck 42 and the needle grinding plate 51 in the X-axis direction. The X-stage 30 is attached to the Y-stage 20 via a linear guide 31. The linear guide 31 has, for example, a guide rail provided on the upper surface of the Y-stage 20 and extending in the X-axis direction, and a slider provided on the lower surface of the X-stage 30 and sliding along the guide rail. This allows the X-stage 30 to be movable in the X-direction.

The X-drive mechanism 32 drives the X-stage 30 in the X-direction. The X-drive mechanism 32 includes, for example, a motor and a rotary-linear mechanism (for example, a ball screw) that converts the rotary motion of the motor into linear motion. The operation of the motor of the X-drive mechanism 32 is controlled by the control device 80.

The detector 33 detects the X-direction position of the X-stage 30, in other words, the X-direction positions of the chuck 42 and the needle grinding plate 51. The detector 33 is, for example, an encoder that detects the rotation of the motor of the X-drive mechanism 32, and the detection signal of the detector 33 is transmitted to the control device 80. The control device 80 calculates the X-direction position of the X-stage 30 based on the detection signal of the detector 33.

The X-stage 30 has two openings that penetrate in the Z-axis direction. A guide 35 and a guide 36 are provided in each of the two openings.

The upper Z stage 40 is supported by guides 35 so that it can be inserted and removed in the Z direction, while its movement in the X and Y directions is restricted. This allows the upper Z stage 40 to move up and down relative to the X stage 30.

A θ stage 41, a chuck 42, and a lower camera 43 are provided on the upper Z stage 40. The θ stage 41 has the function of rotating the chuck 42 around the Z axis as the axis of rotation. A θ drive mechanism (not shown) that rotates the θ stage 41 is controlled by the control device 80. The chuck 42 carries the carrier C. The chuck 42 has a fixing mechanism (not shown) that fixes the carrier C to the chuck 42. This prevents the carrier C from shifting relative to the chuck 42. The lower camera 43 is provided on the side of the chuck 42. It moves and rotates together with the chuck 42.

The needle grinding plate support stage 50 is supported by guides 36 so that it can be inserted and removed in the Z-axis direction while its movement in the X-axis and Y-axis directions is restricted. This allows the needle grinding plate support stage 50 to move up and down relative to the X-stage 30.

A needle grinding plate 51 is provided on the needle grinding plate support stage 50. The needle grinding plate 51 abuts against the tip of the probe 4 and grinds the tip of the probe 4.

The stage base 10 has an opening 15 that penetrates in the Z-axis direction. A guide 61 is provided in the opening 15.

The lower Z stage 60 is supported by guides 61 such that movement in the X-axis and Y-axis directions is restricted and the lower Z stage 60 can be inserted and removed in the Z-axis direction. This allows the lower Z stage 60 to move up and down relative to the stage base 10.

The Z drive mechanism 62 drives the lower Z stage 60 in the Z direction. The Z drive mechanism 62 includes, for example, a motor and a rotary-linear mechanism (e.g., a ball screw) that converts the rotary motion of the motor into linear motion. The operation of the motor of the Z drive mechanism 62 is controlled by the control device 80.

Here, when the probe 4 is brought into contact with the carrier C or the needle grinding plate 51 placed on the chuck 42, the center of gravity of the press load of the probe card 3 and the center of gravity of the press load of the lower Z stage 60 are arranged so as to be on the same axis (see Figures 5, 7, 9, and 11 described later). In other words, the axis of the point of application of the pressing force when the lower Z stage 60 pushes up the upper Z stage 40 and the axis of the point of application of the load received by the probe card 3 are arranged at a common position. Here, the axis being common means that they are on the same axis (the axes are the same) and that they are almost the same (in the same direction). For example, the central axis of the probe card 3 and the central axis of the lower Z stage 60 are common. Also, the central axis of the probe card 3 and the central axis of the ball screw of the Z drive mechanism 62 are common.

The detection unit 63 detects the X-direction position of the lower Z stage 60, in other words, the Z-direction position of the chuck 42 provided on the upper Z stage 40 connected to the lower Z stage 60 or the needle grinding plate 51 connected to the needle grinding plate support stage 50. The detection unit 63 is, for example, an encoder that detects the rotation of the motor of the Z drive mechanism 62, and the detection signal of the detection unit 63 is transmitted to the control device 80. The control device 80 calculates the Z-direction position of the lower Z stage 60 based on the detection signal of the detection unit 63.

The load cell 64 detects the load applied to the lower Z stage 60. The detection signal of the load cell 64 is input to the control device 80. Note that a torque sensor that detects the torque of the Z drive mechanism 62 may be used instead of the load cell 64. Furthermore, when feedback control of the detected load is performed, the control device 80 simultaneously performs position control and load control.

The lower part of the upper Z stage 40 has a movable connection mechanism 71. The movable connection mechanism 71 is configured to be able to switch between a connected state in which the upper Z stage 40 and the lower Z stage 60 are connected, and a movable state in which the connection between the upper Z stage 40 and the lower Z stage 60 is released, allowing the upper Z stage 40 to move on the stage base 10.

The lower part of the needle grinding plate support stage 50 is provided with a movable connection mechanism 72. The movable connection mechanism 72 is configured to be able to switch between a connected state in which the needle grinding plate support stage 50 and the lower Z stage 60 are connected, and a movable state in which the connection between the needle grinding plate support stage 50 and the lower Z stage 60 is released, allowing the needle grinding plate support stage 50 to move freely on the stage base 10.

Figure 2 is a schematic diagram illustrating the movable connecting mechanism 71. The movable connecting mechanism 71 has a horizontal movement mechanism 701 and a connecting mechanism 702.

The horizontal movement mechanism 701 enables the upper Z stage 40 to move on the stage base 10. As the horizontal movement mechanism 701, for example, a free bearing, air bearing, or ball-type air bearing that can move in a planar direction can be used.

The coupling mechanism 702 detachably couples the upper Z stage 40 and the lower Z stage 60. For example, an electromagnet can be used as the coupling mechanism 702. The coupling mechanism 702 is controlled by the control device 80.

Returning to FIG. 1, the control device 80 controls the operation of the inspection device 1. The control device 80 receives detection signals from the detectors 23, 33, and 63 and the load cell 64. The control device 80 controls the Y drive mechanism 22, the X drive mechanism 32, the Z drive mechanism 62, the θ drive mechanism, and the movable linkage mechanisms 71 and 72.

Next, the operation of the inspection device 1 according to the first embodiment will be described with reference to FIG. 3. FIG. 3 is a flowchart showing an example of the operation of the inspection device 1 according to the first embodiment.

In step S101, the control device 80 controls the Y drive mechanism 22 and the X drive mechanism 32 to move the chuck 42 (needle grinding plate 51) to a predetermined position.

In step S102, the control device 80 controls the movable connecting mechanism 71 (72) to connect the upper Z stage 40 (needle grinding plate support stage 50) and the lower Z stage 60.

In step S103, the control device 80 controls the Z drive mechanism 62 to raise the lower Z stage 60. This causes the probe 4 to contact the electrodes of the electronic device placed on the carrier C. The control device 80 detects the load at the time of contact with the load cell 64, and controls the Z drive mechanism 62 to control the contact load. This causes the tester (not shown) to be connected to the electronic device via the probe 4.

In step S104, the control device 80 controls the tester to inspect the electrical characteristics of the electronic device.

In step S105, the control device 80 controls the Z drive mechanism 62 to lower the lower Z stage 60.

In step S106, the control device 80 controls the movable connection mechanism 71 (72) to release the connection. This releases the connection between the upper Z stage 40 (needle grinding plate support stage 50) and the lower Z stage 60. In addition, the upper Z stage 40 (needle grinding plate support stage 50) becomes movable in the horizontal direction.

Then, steps S101 to S106 are repeated for each electronic device.

Next, the stresses in each state of the inspection device 1 according to the first embodiment will be explained using Figures 4 to 11.

Figure 4 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment after horizontal movement when inspecting electronic devices in the center of a carrier C. Figure 5 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment when inspecting electronic devices in the center of a carrier C.

As shown in FIG. 4, the Y stage 20 and X stage 30 are moved to place the electronic device in the center of the carrier C under the probe 4. Next, the movable connecting mechanism 72 is brought into a connected state to connect the upper Z stage 40 and the lower Z stage 60. As shown in FIG. 5, the Z drive mechanism 62 is driven to raise the chuck 42 and press the probe 4 against the carrier C. At this time, the reaction forces received by the probe card 3 and the reaction forces received by the Z drive mechanism 62 are indicated by black arrows. Since the press load center position of the probe card 3 and the press load center position of the Z drive mechanism 62 are arranged on the same axis, tilting of the upper Z stage 40 can be prevented.

Figure 6 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment after horizontal movement when inspecting electronic devices on the outer periphery of a carrier C. Figure 7 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment when inspecting electronic devices on the outer periphery of a carrier C.

As shown in FIG. 6, the Y stage 20 and X stage 30 are moved to place the electronic device on the outer periphery of the carrier C under the probe 4. Next, the movable connecting mechanism 72 is brought into a connected state to connect the upper Z stage 40 and the lower Z stage 60. As shown in FIG. 7, the Z drive mechanism 62 is driven to raise the chuck 42 and press the probe 4 against the carrier C. At this time, the reaction forces received by the probe card 3 and the reaction forces received by the Z drive mechanism 62 are indicated by black arrows. Since the press load center position of the probe card 3 and the press load center position of the Z drive mechanism 62 are arranged on the same axis, tilting of the upper Z stage 40 can be prevented.

Figure 8 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment after horizontal movement when the probe 4 is brought into contact with the center of the needle grinding plate 51. Figure 9 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment when the probe 4 is brought into contact with the center of the needle grinding plate 51.

As shown in FIG. 8, the Y stage 20 and the X stage 30 are moved to position the center of the needle grinding plate 51 under the probe 4. Next, the movable connecting mechanism 72 is connected to connect the needle grinding plate support stage 50 and the lower Z stage 60. As shown in FIG. 9, the Z drive mechanism 62 is driven to raise the needle grinding plate 51 and press the probe 4 against the needle grinding plate 51. At this time, the reaction forces received by the probe card 3 and the reaction forces received by the Z drive mechanism 62 are indicated by black arrows. Since the press load center position of the probe card 3 and the press load center position of the Z drive mechanism 62 are arranged on the same axis, tilting of the needle grinding plate support stage 50 can be prevented.

Figure 10 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment after horizontal movement when the probe 4 is brought into contact with the outer periphery of the needle grinding plate 51. Figure 11 is a schematic cross-sectional view of the inspection device 1 according to the first embodiment when the probe 4 is brought into contact with the outer periphery of the needle grinding plate 51.

As shown in FIG. 10, the Y stage 20 and the X stage 30 are moved to position the outer periphery of the needle grinding plate 51 under the probe 4. Next, the movable connecting mechanism 72 is connected to connect the needle grinding plate support stage 50 and the lower Z stage 60. As shown in FIG. 11, the Z drive mechanism 62 is driven to raise the needle grinding plate 51 and press the probe 4 against the needle grinding plate 51. At this time, the reaction forces received by the probe card 3 and the reaction forces received by the Z drive mechanism 62 are indicated by black arrows. Since the press load center position of the probe card 3 and the press load center position of the Z drive mechanism 62 are arranged on the same axis, tilting of the needle grinding plate support stage 50 can be prevented.

Here, an example of the inspection device 1C according to the reference example will be described. FIG. 12 is a schematic cross-sectional view of the inspection device 1C according to the reference example when inspecting electronic devices in the center of the carrier C. FIG. 13 is a schematic cross-sectional view of the inspection device 1C according to the reference example when inspecting electronic devices in the outer periphery of the carrier C. FIG. 14 is a schematic cross-sectional view of the inspection device 1C according to the reference example when the probe 4 is brought into contact with the center of the needle grinding plate 51C. FIG. 15 is a schematic cross-sectional view of the inspection device 1C according to the reference example when the probe 4 is brought into contact with the outer periphery of the needle grinding plate 51C. The reaction forces received by the probe card 3 and the reaction forces received by the Z drive mechanism 62 are indicated by solid black arrows.

In the inspection device 1C according to the reference example, a Z drive mechanism (not shown) is provided on the X stage 30, and the Z stage 40C moves up and down relative to the X stage 30. In addition, the needle grinding plate 51C is fixed to the Z stage 40C via a beam structure 52C.

As shown in FIG. 12, when testing an electronic device in the center of carrier C, the reaction force received by probe card 3 and the reaction force received by the Z drive mechanism are arranged on the same axis. This makes it possible to prevent tilting of Z stage 40C.

On the other hand, as shown in FIG. 13, when inspecting electronic devices on the outer periphery of carrier C, the reaction forces received by the probe card 3 and the reaction forces received by the Z drive mechanism are arranged on different axes. Therefore, as shown by the white arrow, a tilt of the Z stage 40C occurs.

As shown in FIG. 14, when the probe 4 is brought into contact with the center of the needle grinding plate 51C, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism are arranged on different axes. Therefore, as shown by the white arrow, the beam structure 52C is deflected, causing the needle grinding plate 51C to tilt.

In addition, as shown in FIG. 15, when the probe 4 is brought into contact with the outer periphery of the needle grinding plate 51C, the reaction force received by the probe card 3 and the reaction force received by the Z drive mechanism are arranged on different axes. Therefore, as shown by the white arrow, further bending occurs in the beam structure 52C, and the inclination of the needle grinding plate 51C becomes even larger.

As described above, according to the inspection device 1 of the first embodiment, not only when the probe 4 is in contact with the center of the carrier C, but also when it is in contact with the outer periphery of the carrier C, the center of gravity of the press load of the probe card 3 and the center of gravity of the press load of the Z drive mechanism 62 (lower Z stage 60) can always be kept on the same axis (see Figures 5 and 7). This makes it possible to prevent the upper Z stage 40 from falling over even if the contact load is increased.

In addition, the inspection device 1 according to the first embodiment can prevent the needle grinding plate 51 from falling over (see Figures 9 and 11). In addition, the upper Z stage 40 and the needle grinding plate support stage 50 can be raised and lowered by a single Z drive mechanism 62, so the cost of the inspection device 1 can be reduced without providing separate drive mechanisms.

Next, the inspection device 1A according to the second embodiment will be described with reference to Figs. 16 and 17. Fig. 16 is a schematic cross-sectional view of the inspection device 1A according to the second embodiment after horizontal movement when inspecting electronic devices in the center of a carrier C. Fig. 17 is a schematic cross-sectional view of the inspection device 1A according to the second embodiment during inspection of electronic devices in the center of a carrier C.

Compared to the inspection device 1 according to the first embodiment, the inspection device 1A according to the second embodiment has a movable connecting mechanism 73 and a movable mechanism 74 instead of the movable connecting mechanisms 71 and 72. The rest of the configuration is similar, so duplicated explanations will be omitted.

The upper part of the lower Z stage 60 is provided with a movable coupling mechanism 73. The movable coupling mechanism 73 is configured to be able to switch between a coupling state in which the upper Z stage 40 or the needle grinding plate support stage 50 is coupled to the lower Z stage 60, and a movable state in which the upper Z stage 40 or the needle grinding plate support stage 50 is released from the lower Z stage 60 and the upper Z stage 40 or the needle grinding plate support stage 50 is movable on the lower Z stage 60. The movable coupling mechanism 73 has a horizontal movement mechanism and a coupling mechanism. The horizontal movement mechanism allows the upper Z stage 40 or the needle grinding plate support stage 50 to move on the lower Z stage 60. For example, a free bearing, an air bearing, or a ball-type air bearing that can move in a planar direction can be used as the horizontal movement mechanism. The coupling mechanism detachably couples the upper Z stage 40 or the needle grinding plate support stage 50 to the lower Z stage 60. For example, an electromagnet can be used as the coupling mechanism. The coupling mechanism is controlled by the control device 80.

The upper part of the stage base 10 has a movable mechanism 74. The movable mechanism 74 has a horizontal movement mechanism. The horizontal movement mechanism allows the upper Z stage 40 or the needle grinding plate support stage 50 to move on the stage base 10. As the horizontal movement mechanism, for example, a free bearing, air bearing, or ball-type air bearing that can move in a planar direction can be used.

As described above, according to the inspection device 1A of the second embodiment, like the inspection device 1 of the first embodiment, the press load center of gravity position of the probe card 3 and the press load center of gravity position of the Z drive mechanism 62 (lower Z stage 60) can always be kept on the same axis. This makes it possible to prevent the upper Z stage 40 from falling even if the contact load is increased. In addition, it is possible to prevent the needle grinding plate 51 from falling. In addition, since the upper Z stage 40 and the needle grinding plate support stage 50 can be raised and lowered with a single Z drive mechanism 62, the cost of the inspection device 1 can be reduced without providing separate drive mechanisms.

Next, the inspection device 1B according to the third embodiment will be described with reference to FIG. 18. FIG. 18 is a schematic cross-sectional view illustrating the configuration of the inspection device 1B according to the third embodiment.

Compared to the inspection device 1 according to the first embodiment, the inspection device 1B according to the third embodiment has a movable connecting mechanism 75 instead of the movable connecting mechanisms 71 and 72. The rest of the configuration is similar, and duplicated explanations will be omitted. In addition, the upper Z stage 40 and the needle grinding plate support stage 50 are configured to be suspended from the X stage 30 when lowered. As a result, the upper Z stage 40 and the needle grinding plate support stage 50 are configured to be out of contact with the stage base 10. The rest of the configuration is similar, and duplicated explanations will be omitted.

The upper part of the lower Z stage 60 is provided with a movable connection mechanism 75. The movable connection mechanism 75 is configured to be able to switch between a connection state in which the upper Z stage 40 or the needle grinding plate support stage 50 is connected to the lower Z stage 60, and a movable state in which the connection between the upper Z stage 40 or the needle grinding plate support stage 50 and the lower Z stage 60 is released and the upper Z stage 40 or the needle grinding plate support stage 50 is movable on the lower Z stage 60. The movable connection mechanism 75 has an O-ring provided on the upper surface of the lower Z stage 60 and an intake and exhaust mechanism that intakes and exhausts the space surrounded by the O-ring. The intake and exhaust mechanism intakes air from within the space surrounded by the O-ring to connect the upper Z stage 40 or the needle grinding plate support stage 50 to the lower Z stage 60 by vacuum suction. The intake and exhaust mechanism also supplies air into the space surrounded by the O-ring to release the connection between the upper Z stage 40 or the needle grinding plate support stage 50 and the lower Z stage 60. In addition, the supplied air causes the upper Z stage 40 or the needle grinding plate support stage 50 to float above the lower Z stage 60. This allows the upper Z stage 40 and the needle grinding plate support stage 50 to move horizontally.

The O-ring can also be used as a cushion to absorb the impact when the upper Z stage 40 or the needle grinding plate support stage 50 comes into contact with the lower Z stage 60. This makes it possible to suppress the impact when the upper Z stage 40 or the needle grinding plate support stage 50 is connected to the lower Z stage 60.

As described above, according to the inspection device 1B of the third embodiment, like the inspection device 1 of the first embodiment, the press load center of gravity position of the probe card 3 and the press load center of gravity position of the Z drive mechanism 62 (lower Z stage 60) can always be kept on the same axis. This makes it possible to prevent the upper Z stage 40 from falling over even if the contact load is increased. In addition, it is possible to prevent the needle grinding plate 51 from falling over. In addition, since the upper Z stage 40 and the needle grinding plate support stage 50 can be raised and lowered by a single Z drive mechanism 62, the cost of the inspection device 1 can be reduced without providing separate drive mechanisms.

Next, the inspection device 1D according to the fourth embodiment will be described with reference to Figs. 19 to 22. Fig. 19 is a plan view illustrating the configuration of the inspection device 1D according to the fourth embodiment. Fig. 20 is a schematic cross-sectional view illustrating the configuration of the inspection device 1D according to the fourth embodiment. Fig. 21 is an exploded perspective view of the inspection device 1D according to the fourth embodiment. Fig. 22 is a schematic cross-sectional view of the inspection device 1D according to the fourth embodiment during inspection of an electronic device in the center of the carrier C. Note that in Fig. 21, the direction of movement of each part is indicated by an arrow.

The inspection device 1D is a device that inspects the electrical characteristics of each of multiple electronic devices arranged on a carrier (test subject) C. The carrier C includes a wafer, a glass substrate, a single chip, etc.

The inspection device 1D has a probe chamber 2. A probe card 3 is arranged in the upper part of the probe chamber 2. The probe card 3 has a plurality of probes 4. A stage base 10 is provided in the lower part of the probe chamber 2. A Y stage 20A, an X stage 30A, an upper Z stage 40A, a θ stage 41, a chuck 42, and a lower camera 43 are provided in the probe chamber 2. In addition, a Y stage 20B, an X stage 30B, an upper Z stage 40B, and a needle grinding plate 51 are provided in the probe chamber 2.

The Y stage 20A moves the chuck 42 in the Y-axis direction. The Y stage 20A is attached to the stage base 10 via a linear guide 21. The linear guide 21 has, for example, a guide rail provided on the upper surface of the stage base 10 and extending in the Y-axis direction, and a slider provided on the lower surface of the Y stage 20A and sliding along the guide rail. This allows the Y stage 20A to be movable in the Y direction.

The Y drive mechanism 22A drives the Y stage 20A in the Y direction. The Y drive mechanism 22A includes, for example, a motor and a rotary-linear mechanism (for example, a ball screw) that converts the rotary motion of the motor into linear motion. The operation of the motor of the Y drive mechanism 22A is controlled by the control device 80.

The detector 23A detects the Y-direction position of the Y stage 20A, in other words, the Y-direction position of the chuck 42. The detector 23A is, for example, an encoder that detects the rotation of the motor of the Y drive mechanism 22A, and the detection signal of the detector 23A is transmitted to the control device 80. The control device 80 calculates the Y-direction position of the Y stage 20A based on the detection signal of the detector 23A.

The Y stage 20A has an opening that penetrates in the Z-axis direction. A guide 26A is provided in the opening.

The upper Z stage 40A has a protrusion 45A that protrudes downward. The protrusion 45A of the upper Z stage 40A is inserted into the guide 26A. The movement of the upper Z stage 40A in the X-axis direction and the Y-axis direction is restricted by the guide 26A, and the upper Z stage 40A is supported so as to be insertable and removable in the Z-axis direction. This allows the upper Z stage 40A to be movable in the vertical direction relative to the Y stage 20A. The upper Z stage 40A has a protrusion 45A that protrudes downward. In addition, a stopper 46A is provided on the top surface of the Y stage 20A against which the upper Z stage 40A abuts when it descends.

The X-stage 30A moves the chuck 42 in the X-axis direction. The X-stage 30A is attached to the upper Z-stage 40A via a linear guide 31A. The linear guide 31A has, for example, a guide rail provided on the underside of the X-stage 30A and extending in the X-axis direction, and a slider provided on the upper surface of the upper Z-stage 40A and sliding along the guide rail. This allows the X-stage 30A to be configured to move in the X-direction. In addition, it is preferable that the slider of the linear guide 31A is arranged symmetrically in the X-axis direction from the central axis of the lower Z-stage 60 when viewed from the side in the Y-axis direction (see FIG. 20).

The X-drive mechanism 32A drives the X-stage 30A in the X-direction. The X-drive mechanism 32A includes, for example, a motor and a rotary-linear mechanism (for example, a ball screw) that converts the rotary motion of the motor into linear motion. The operation of the motor of the X-drive mechanism 32A is controlled by the control device 80.

The detector 33A detects the X-direction position of the X-stage 30A, in other words, the X-direction position of the chuck 42. The detector 33A is, for example, an encoder that detects the rotation of the motor of the X-drive mechanism 32A, and the detection signal of the detector 33A is transmitted to the control device 80A. The control device 80 calculates the X-direction position of the X-stage 30A based on the detection signal of the detector 33A.

A θ stage 41, a chuck 42, and a lower camera 43 are provided on the X stage 30A. The θ stage 41 has the function of rotating the chuck 42 around the Z axis as the axis of rotation. The θ drive mechanism 44A that rotates the θ stage 41 is controlled by the control device 80. The chuck 42 carries the carrier C. The chuck 42 has a fixing mechanism (not shown) that fixes the carrier C to the chuck 42. This prevents the carrier C from shifting relative to the chuck 42. The lower camera 43 is provided on the side of the chuck 42. It moves and rotates together with the chuck 42.

The Y stage 20B moves the needle grinding plate 51 in the Y-axis direction. The upper Z stage 40B is configured to be movable in the vertical direction relative to the Y stage 20B. The X stage 30B moves the needle grinding plate 51 in the X-axis direction. Note that the configurations of the Y stage 20B, upper Z stage 40B, and X stage 30B are similar to those of the Y stage 20A, upper Z stage 40A, and X stage 30A, and therefore redundant explanations will be omitted.

A needle grinding plate 51 is provided on the X-stage 30B. The needle grinding plate 51 abuts against the tip of the probe 4 and grinds the tip of the probe 4. It also has the function of rotating the needle grinding plate 51 around the Z-axis as the rotation axis. The θ drive mechanism 44B that rotates the needle grinding plate 51 is controlled by the control device 80.

The stage base 10 has an opening 15 that penetrates in the Z-axis direction. A guide 61 is provided in the opening 15.

The lower Z stage 60 is supported by guides 61 such that movement in the X-axis and Y-axis directions is restricted and the lower Z stage 60 can be inserted and removed in the Z-axis direction. This allows the lower Z stage 60 to move up and down relative to the stage base 10.

The Z drive mechanism 62 drives the lower Z stage 60 in the Z direction. The Z drive mechanism 62 includes, for example, a motor and a rotary-linear mechanism (e.g., a ball screw) that converts the rotary motion of the motor into linear motion. The operation of the motor of the Z drive mechanism 62 is controlled by the control device 80.

Here, when the probe 4 is brought into contact with the carrier C or the needle grinding plate 51 placed on the chuck 42, the center of gravity of the press load of the probe card 3 and the center of gravity of the press load of the lower Z stage 60 are arranged so as to be on the same axis (see FIG. 22). In other words, the axis of the point of application of the pressing force when the lower Z stage 60 pushes up the upper Z stage 40A and the axis of the point of application of the load received by the probe card 3 are arranged at a common position. Here, the axis being common means being on the same axis (the axes being the same) and being almost the same (in the same direction). For example, the central axis of the probe card 3 and the central axis of the lower Z stage 60 are common. Also, the central axis of the probe card 3 and the central axis of the ball screw of the Z drive mechanism 62 are common.

The detector 63 detects the X-direction position of the lower Z stage 60, in other words, the Z-direction position of the chuck 42 provided on the upper Z stage 40A connected to the lower Z stage 60 or the needle grinding plate 51 connected to the needle grinding plate support stage 50. The detector 63 is, for example, an encoder that detects the rotation of the motor of the Z drive mechanism 62, and the detection signal of the detector 63 is transmitted to the control device 80. The control device 80 calculates the Z-direction position of the lower Z stage 60 based on the detection signal of the detector 63.

The load cell 64 detects the load applied to the lower Z stage 60. The detection signal of the load cell 64 is input to the control device 80. Note that a torque sensor that detects the torque of the Z drive mechanism 62 may be used instead of the load cell 64. Furthermore, when feedback control of the detected load is performed, the control device 80 simultaneously performs position control and load control.

The lower part of the upper Z stage 40A has a movable connection mechanism 75. The movable connection mechanism 75 is configured to be able to switch between a connected state in which the upper Z stage 40A and the lower Z stage 60 are connected, and a movable state in which the connection between the upper Z stage 40A and the lower Z stage 60 is released, allowing the upper Z stage 40A to move on the stage base 10.

Here, the case where the lower Z stage 60 pushes up the upper Z stage 40A has been described as an example, but the same applies when the lower Z stage 60 pushes up the upper Z stage 40B. That is, when the lower Z stage 60 pushes up the upper Z stage 40B, the Y stage 20A is retracted from above the lower Z stage 60, and the Y stage 20B is moved so that it is positioned above the lower Z stage 60. In this case, the movable connecting mechanism 75 is configured to be able to switch between a connected state in which the upper Z stage 40B and the lower Z stage 60 are connected, and a movable state in which the connection between the upper Z stage 40B and the lower Z stage 60 is released, allowing the upper Z stage 40B to move on the stage base 10.

As described above, according to the inspection device 1D of the fourth embodiment, not only when the probe 4 is in contact with the center of the carrier C, but also when it is in contact with the outer periphery of the carrier C, the center of gravity of the press load of the probe card 3 and the center of gravity of the press load of the Z drive mechanism 62 (lower Z stage 60) can always be kept on the same axis (see FIG. 22). This makes it possible to prevent the upper Z stage 40A from falling over even if the contact load is increased.

In addition, the slider of the linear guide 31A is provided on the top surface of the upper Z stage 40A and is arranged symmetrically in the X-axis direction from the central axis of the lower Z stage 60, which makes it possible to prevent the X stage 30A from falling over when the upper Z stage 40A is pushed up.

In addition, the inspection device 1D according to the fourth embodiment can prevent the needle grinding plate 51 from falling over. In addition, the upper Z stage 40A supporting the chuck 42 and the upper Z stage 40B supporting the needle grinding plate 51 can be raised and lowered by a single Z drive mechanism 62, so the cost of the inspection device 1D can be reduced without providing separate drive mechanisms.

The inspection devices 1, 1A to 1D have been described above, but the present disclosure is not limited to the above embodiments, and various modifications and improvements are possible within the scope of the gist of the present disclosure as described in the claims.

REFERENCE SIGNS LIST 1 Inspection device 2 Probe chamber 3 Probe card 4 Probe 10 Stage base 15 Opening 20 Y stage 21 Linear guide 22 Y drive mechanism 23 Detector 25 Opening 30 X stage 31 Linear guide 32 X drive mechanism 33 Detector 35, 36 Guide 40 Upper Z stage (upper module)
42 chuck (mounting part)
50 Needle grinding plate support stage 51 Needle grinding plate 60 Lower Z stage 61 Guide 62 Z drive mechanism 63 Detector 64 Load cells 71 to 73 Movable connecting mechanism 74 Movable mechanism 75 Movable connecting mechanism 80 Control device C Carrier (test object)

Claims (6)

a probe card having a probe that comes into contact with the test object;
an upper module having a placement portion on which the test object is placed;
a movement mechanism that supports the upper module so as to be able to rise and fall and that is able to move the upper module in a horizontal direction;
a lifting mechanism provided below the moving mechanism and capable of lifting up the upper module toward the probe card;
a pressing force applied to the upper module by the lifting mechanism and a load applied to the probe card are disposed at a common axis ;
The moving mechanism includes:
a first stage movable in a first direction relative to a base plate;
a second stage movable relative to the upper module in a second direction different from the first direction;
the upper module is supported on the first stage so as to be capable of ascending and descending;
the first stage having an opening;
Inspection equipment. Further comprising a connecting mechanism for detachably connecting the upper module and the lifting mechanism.
2. The inspection device according to claim 1. The connecting mechanism connects by magnetic attraction.
3. The inspection device according to claim 2. The connecting mechanism connects by vacuum suction.
3. The inspection device according to claim 2. Further provided with a needle grinding plate support stage for supporting the needle grinding plate,
the moving mechanism supports the needle grinding plate support stage so as to be capable of ascending and descending independently of the upper module;
The lifting mechanism pushes the needle grinding plate support stage toward the probe card.
The inspection device according to any one of claims 1 to 4 . a probe card having a probe that comes into contact with the test object;
an upper module having a placement portion on which the test object is placed;
a movement mechanism that supports the upper module so as to be able to rise and fall and that is able to move the upper module in a horizontal direction;
a lifting mechanism provided below the moving mechanism and capable of lifting up the upper module toward the probe card ;
The moving mechanism includes:
a first stage movable in a first direction relative to a base plate;
a second stage movable relative to the upper module in a second direction different from the first direction;
the upper module is supported on the first stage so as to be capable of ascending and descending;
1. A method for inspecting an inspection apparatus, the method comprising :
controlling the moving mechanism to move the object under test;
and controlling the lifting mechanism to bring the device under test into contact with the probes, so that a point of application of a pressing force applied when the lifting mechanism lifts up the upper module and a point of application of a load applied to the probe card are coaxially arranged.
Inspection method for inspection equipment.

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