JP7614745B2 - Cutting Blade - Google Patents

Description

The present invention relates to a cutting blade used to cut a substrate such as a semiconductor material into individual chips.

Conventionally, high quality has been required for processes such as groove processing on cutting materials made of brittle materials (hard and brittle materials) such as glass and ceramics used in semiconductor products, and for cutting substrates of semiconductor materials and other materials into individual pieces (in this specification, these processes are sometimes referred to as cutting processes or simply cutting).

In order to perform such cutting processing with high quality, for example, a cutting blade (thin blade grindstone) in which abrasive grains are dispersed in the bond phase is used.
As such cutting blades, for example, resin blades having a bond phase made of a resin material and metal blades having a bond phase made of a metal or a metal compound are widely used.

The cutting blade, for example, comprises a blade body in the shape of a circular plate and a cutting edge formed on the outer periphery of the blade body, and the blade body comprises a bond phase and abrasive grains (super abrasive grains) such as diamond and cBN (cubic boron nitride) dispersed in the bond phase.

The electronic material components that are cut and manufactured by the cutting blade include, like the semiconductor elements mentioned above, those that are cut from a semiconductor wafer, divided into individual pieces, and then mounted on a lead frame and resin molded. In addition, there are also processed materials made of composite materials such as QFN (quad flat non-leaded package), in which a large number of elements are mounted together on a lead frame and then molded before being cut, and IrDA (Infrared Data Association) standard optical transmission modules (hereinafter simply referred to as IrDA) that have a substrate with Ni, Au, Cu, etc. plated on the inner periphery of through holes formed in a glass epoxy resin base.

In recent years, the number of processed materials made of composite materials such as QFN (quad flat non-leaded package) and IrDA has been increasing.
When cutting and dividing the workpieces made of these composite materials, ductile materials such as Cu are cut in addition to ceramics, etc., so the cutting edge of the cutting blade is prone to wear and deterioration, resulting in a problem of shortening the lifespan of the cutting blade.

A cutting blade has been disclosed that reduces the impact and frictional resistance transmitted from the rotating cutting blade to the material being cut, suppresses the occurrence of chipping and electrode burrs, and reduces such chipping and electrode burrs, thereby increasing the rotation speed, increasing the cutting speed, and improving cutting performance (see, for example, Patent Documents 1 and 2).

JP 2012-223867 A JP 2012-223868 A

However, even if the cutting blades described in Patent Documents 1 and 2 are used, if the processing temperature increases when cutting the workpiece, the cutting performance (sharpness) of the cutting edge decreases, and the processing quality is likely to decrease.
Furthermore, if the cutting performance is degraded, processing heat is likely to increase, which may further deteriorate the processing quality.
In particular, composite materials such as QFN that contain highly ductile metals such as Cu tend to have a reduced sharpness and increased processing heat.

The present invention was made in consideration of these circumstances, and aims to provide a cutting blade that can prevent the deterioration of processing quality caused by the rise in temperature during cutting when cutting a workpiece.

In order to solve these problems and achieve the above object, the present invention proposes the following means.
(1) One aspect of the present invention is a cutting blade that cuts a workpiece with a cutting edge of a blade body that rotates about an axis, the blade body comprising a bond phase formed in a disk shape, abrasive grains dispersed in the bond phase, a filler dispersed in the bond phase, and a cutting edge formed on the outer peripheral edge of the bond phase, the filler containing an endothermic material that thermally decomposes and absorbs heat when the temperature increases.

According to the cutting blade of the present invention, the blade body comprises a bond phase formed in a disk shape, abrasive grains dispersed in the bond phase, a cutting edge formed on the outer peripheral edge of the bond phase, and filler dispersed in the bond phase. The filler contains a heat-absorbing material that thermally decomposes and absorbs heat when the temperature rises, making it possible to absorb processing heat generated during cutting.
As a result, the temperature rise of the cutting edge that accompanies cutting of the workpiece is mitigated, and deterioration of the cutting edge is suppressed, so that deterioration of the machining quality of the workpiece can be suppressed.
Furthermore, even if the cutting performance (sharpness) of the cutting blade deteriorates and the processing heat generated during cutting increases, the temperature of the heat-absorbing material rises and thermal decomposition is promoted, thereby suppressing the temperature rise of the cutting edge, and thereby suppressing the deterioration of the processing quality of the workpiece.
Furthermore, in the case where the heat absorbing material is a material that undergoes dehydration decomposition to generate water upon thermal decomposition, the temperature rise that accompanies the cutting process can be further suppressed.

Here, the filler may contain multiple types of heat absorbing materials. In addition, the filler may be composed of only heat absorbing materials, or may contain materials other than heat absorbing materials.

(2) In the cutting blade described in (1) above, the heat absorbing material preferably contains aluminum hydroxide (Al(OH) ₃ ).

According to the cutting blade of the present invention, the heat absorbing material contains aluminum hydroxide (Al(OH) ₃ ), so that it decomposes at about 220 to 260° C. and absorbs heat.
Therefore, even when diamond superabrasive grains are used as the abrasive grains, the abrasive grains are prevented from reaching their decomposition temperature due to the processing heat during cutting.
In addition, since the endothermic reaction of aluminum hydroxide (Al(OH) ₃ ) is due to dehydration decomposition, a large amount of heat is absorbed by the latent heat of the water produced.
As a result, the temperature rise of the cutting edge can be effectively suppressed.

(3) In the cutting blade described in (2) above, it is preferable that the aluminum hydroxide (Al(OH) ₃ ) is set to 10 vol % or more with respect to the volume of the blade body excluding the abrasive grains.

According to the cutting blade of the present invention, the filler is set to have aluminum hydroxide (Al(OH) ₃ ) of 10 vol% or more relative to the volume of the blade body excluding the abrasive grains, so that the heat absorption effect can be appropriately exhibited.

(4) In the cutting blade described in any one of (1) to (3) above, it is preferable that the filler is set to 50 vol % or less with respect to the volume of the blade body excluding the abrasive grains.

According to the cutting blade of the present invention, the filler is set to 50 vol % or less with respect to the volume of the blade body excluding the abrasive grains, so that sufficient binding strength is ensured in the bond phase even if the filler is dispersed.
As a result, the strength and rigidity of the blade body is prevented from decreasing, ensuring appropriate cutting ability and preventing a shortening of the blade life.

(5) In the cutting blade described in any one of (1) to (4) above, it is preferable that the bond phase is a resin bond phase formed from a resin material or a bond phase formed by plating.

According to the cutting blade of the present invention, the bond phase is a resin bond phase or a bond phase formed by plating (e.g., a dispersed nickel plating layer (nickel bond phase), an electroformed metal layer), so that the cutting blade can be manufactured without heating to high temperatures.
That is, when forming a bond phase by sintering at a high temperature, it is necessary to use a heat absorbing material that does not undergo thermal decomposition or whose thermal decomposition is not promoted at the sintering temperature, and sufficient heat absorption of the thermally decomposable material cannot be expected until the processing temperature during cutting becomes equal to or higher than the sintering temperature. Therefore, it can be said that the material is not suitable for sufficiently absorbing the processing heat generated during cutting.

The cutting blade of the present invention uses a heat absorbing material to reduce the temperature rise that occurs during cutting of the workpiece, preventing a decrease in the quality of the workpiece.

1 is a side view illustrating a schematic configuration of a cutting blade according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1 for explaining a schematic configuration of a cutting blade according to one embodiment. FIG. 3 is an enlarged view of a portion indicated by III in FIG. 2 for explaining a schematic configuration of a cutting blade according to one embodiment.

The cutting blade according to one embodiment of the present invention will be described below with reference to Figs. 1 to 3. Fig. 1 is a side view illustrating the schematic configuration of a cutting blade according to one embodiment of the present invention, and Fig. 2 is a cross-sectional view taken along the line II-II in Fig. 1, illustrating the schematic configuration of the cutting blade. Fig. 3 is a conceptual diagram showing an enlarged view of the part indicated by III in Fig. 2, illustrating the schematic configuration of the cutting blade.

In Figures 1 to 3, reference numeral 100 denotes the cutting blade, reference numeral 10 denotes the blade body, reference numeral 11 denotes the outer peripheral surface (outer peripheral edge), reference numeral 11A denotes the cutting edge, reference numeral 20 denotes the resin bond phase, reference numeral 30 denotes the diamond superabrasive grains (abrasive grains), and reference numeral 40 denotes the filler.

1 and 2, a cutting blade 100 according to one embodiment includes, for example, a blade body 10 that rotates around an axis O, and a cutting edge 11A formed on an outer peripheral surface (outer peripheral edge portion) 11 of the blade body 10. The cutting blade cuts a workpiece (not shown) with the cutting edge 11A.
As shown in Figures 1 to 3, the blade body 10 includes, for example, a resin bond phase 20 made of a resin material formed into a disk shape, diamond superabrasive grains (abrasive grains) 30 dispersed in the resin bond phase 20, and filler 40 dispersed in the resin bond phase 20.

The cutting blade 100 is also used for precision cutting (cutting processing) of workpieces such as brittle materials (hard and brittle materials) such as glass, ceramics, and quartz, which are used in semiconductor devices (electronic material components).

Although not specifically shown, the cutting blade 100 has its blade body 10 attached to the main shaft of a cutting device via a flange, and is rotated around the central axis O of the blade body 10 while moving in a direction perpendicular to the central axis O (e.g., in the height direction), whereby the cutting edge 11A of the outer peripheral surface 11 of the blade body 10, which protrudes radially outward from the flange, cuts the material to be cut (not shown).

Here, in this specification, the direction along the central axis O of the blade body 10 may be referred to as the width direction, the direction perpendicular to the central axis O may be referred to as the radial direction, and the direction rotating around the central axis O may be referred to as the circumferential direction.
1 to 3, for the purpose of explanation, the thickness of the blade body 10 is shown to be thicker than it actually is. Furthermore, a circular mounting hole 13 is formed in the radial center (on the central axis O) of the blade body 10, centered on the axis O and penetrating the blade body 10 in the width direction. That is, the blade body 10 is specifically formed in the shape of an annular plate.
Here, the "blade body 10 having a circular plate shape" as used in this specification is intended to include an annular plate shape. Furthermore, the numerical ranges indicated with "to" in this specification include the lower limit and the upper limit (i.e., indicates greater than or equal to and less than or equal to).

The dimensions of the cutting blade 100 can be set arbitrarily, but in this embodiment, the cutting blade 100 is set to, for example, an outer diameter of φ56 mm, an inner diameter (diameter of the mounting hole) of φ40 mm, and a thickness of t0.15 mm.

The resin material forming the resin bond layer 20 can be set arbitrarily, but in this embodiment, it is formed of, for example, a thermosetting resin such as a phenol resin.
As shown in Figs. 1 and 2, the resin bond phase 20 has a circular mounting hole 13 formed on the inner peripheral side (center) thereof, the mounting hole 13 being centered on the axis O, and is formed in an annular plate shape (disk shape).

The mounting hole 13 is formed centered on the axis O of the resin bond phase 20 .
The attachment hole 13 penetrates the resin bond phase 20 in the thickness direction. That is, the attachment hole 13 opens to both side surfaces 12A, 12B (12) of the resin bond phase 20 in the axis O direction.

The dimension in the thickness direction of the resin bond phase 20 (hereinafter referred to as thickness) can be set arbitrarily, but is set to, for example, 0.15 mm or more and 0.6 mm or less.
The cutting edge 11A is disposed on the outer peripheral surface 11 of the resin bond phase 20 and is formed in an annular shape. The cutting edge 11A is formed, for example, with a blade width that is the same as the thickness of the resin bond phase 20.

The abrasive grains can be of any material, but are preferably made of either diamond or cBN.
As the abrasive grains, a hard material other than diamond and cBN (as long as it is a material harder than the resin bond phase 20) may be used.
In this embodiment, for example, diamond superabrasive grains (abrasive grains) 30 are used as the abrasive grains.

The diamond superabrasive grains (first abrasive grains) 30 are set, for example, to have an average grain size of 3 to 10 μm (for example, 5 μm) and a content rate of 12.5 to 31.25 vol % (concentration degree of 50 to 125).
Moreover, the diamond superabrasive grains 30 are exposed, for example, by about 2 μm from the surface of the resin bond phase 20. It is possible to arbitrarily set whether or not the diamond superabrasive grains 30 are protruded from the surface of the resin bond phase 20.
Although not specifically shown, the outer surface (surface) of the diamond superabrasive grains (abrasive grains) 30 may be coated with a metal material such as Ti.

The "average particle size" refers to the average value of a large number of diamond superabrasive grains (abrasive grains) 30. For example, diamond superabrasive grains (abrasive grains) 30 with a certain particle size range are measured using a Microtrac (registered trademark) model MT3300EXII-SDC, and the average particle size is calculated using a particle size indication based on mesh size (see JIS B 4130:1998).

The "concentration" is an index that indicates the amount of abrasive grains in a tool. In the case of a cutting blade, the concentration is defined as 100 when the volume of the abrasive grains occupies 25 vol% of the total volume of the blade body. (Therefore, if the entire blade body is made up of abrasive grains, the concentration is 400.)

In this embodiment, the filler 40 is composed entirely of aluminum hydroxide (Al(OH) ₃ ).
The composition of the aluminum hydroxide (Al(OH) ₃ ) can be set arbitrarily, but the aluminum hydroxide (Al(OH) ₃ ) is, for example, in the form of powder or particles having an average particle size of 2 μm (1 to 3 μm).

The reason why the average particle size of aluminum hydroxide (Al(OH) ₃ ) is set to 1 μm or more is that it can be stably dispersed in the resin bond phase 20, and the reason why the average particle size is set to 3 μm or less is that it can be thermally decomposed and absorb heat in a short time when the temperature rises.
The average particle size of aluminum hydroxide (Al(OH) ₃ ) may be set to less than 1 μm or greater than 3 μm.

In addition, the volume ratio (vol %) of aluminum hydroxide (Al(OH) ₃ ) to the volume of the blade body 10 excluding the diamond superabrasive grains 30 can be set arbitrarily, but it is preferable to set it to, for example, 10 vol % or more and 50 vol % or less.

In this embodiment, the volume ratio of aluminum hydroxide (Al(OH) ₃ ) to the volume of the blade body 10 excluding the diamond superabrasive grains 30 is set to, for example, 20 vol %.
It is more preferable that the volume ratio of aluminum hydroxide (Al(OH) ₃ ) to the volume of the blade body 10 excluding the diamond superabrasive grains 30 is 20 vol % or more and 40 vol % or less.

In addition, the filler 40 may be formed by dispersing hollow particles such as molybdenum disulfide ( _MoS2 ), silica balloons or glass balloons, or fillers such as silicon carbide (SiC) or tungsten carbide (WC) (not shown) for the purpose of improving various functions of the blade body 10, such as the workability and rigidity.
It is possible to arbitrarily set whether or not a filler (not shown) is dispersed in the resin bond phase 20, and also the type, content, etc. of the dispersed filler.

Next, an example of a method for manufacturing the cutting blade 100 will be described.
The cutting blade 100 can be manufactured by a known method.

(1) First, a cutting blade blank (resin blade blank) is molded.
The cutting blade base plate (resin blade base plate) is formed, for example, by mixing powder that is the raw material of the resin bond phase 20, abrasive grains 30, and filler 40 to prepare a mixed powder.
This mixed powder is then filled into a mold (not shown) and cold pressed in the mold to form a disk-shaped resin blade base plate.

(2) Next, the cutting blade original plate is hot pressed and sintered.
The cutting blade original plate is hot pressed, for example, at a hot plate of 200° C., a heating time of 30 minutes, and a pressure of 10 MPa.

(3) After that, the inner and outer periphery of the sintered cutting blade original plate are ground to a predetermined diameter, thereby forming (manufacturing) the cutting blade 100.
The method for forming the cutting blade 100 can be set arbitrarily and is not limited to the above.

According to a cutting blade 100 of one embodiment, the blade body 10 comprises a resin bond phase 20 made of phenolic resin, diamond superabrasive grains (abrasive grains) 30 dispersed in the resin bond phase 20, and a filler 40 dispersed in the resin bond phase 20, and the filler 40 contains a heat-absorbing material that is thermally decomposed and absorbs heat when the temperature rises, so that the cutting blade 100 is able to absorb the processing heat generated in conjunction with cutting the workpiece.
As a result, the temperature rise of the cutting edge 11A that accompanies cutting of the workpiece is mitigated, and deterioration of the cutting edge 11A is suppressed, so that deterioration of the processing quality of the workpiece can be suppressed.

In addition, with the cutting blade 100 according to one embodiment, even if the cutting performance (sharpness) of the cutting edge 11A deteriorates and the processing heat generated during cutting increases, the temperature of the heat-absorbing material rises and thermal decomposition is promoted, suppressing the temperature rise of the cutting edge 11A, thereby preventing a decrease in the processing quality of the workpiece.

In addition, according to the cutting blade 100 of one embodiment, the heat absorbing material is made of aluminum hydroxide (Al(OH) ₃ ), and therefore, for example, it is thermally decomposed and absorbs heat at about 220 to 260° C. Therefore, the diamond superabrasive grains 30 are prevented from reaching the decomposition temperature due to the processing heat during cutting.
In addition, since the endothermic reaction of aluminum hydroxide (Al(OH) ₃ ) is caused by dehydration decomposition, a large amount of heat is absorbed by the latent heat of the generated water, and the temperature rise of the cutting edge 11A can be efficiently suppressed.

In addition, according to the cutting blade 100 of one embodiment, the volume ratio of the filler 40, which is aluminum hydroxide (Al(OH) ₃ ), to the volume of the blade body 10 excluding the abrasive grains is set to 20 vol % (10 vol % or more), so that the heat absorption effect can be sufficiently exhibited.

In addition, according to one embodiment of the cutting blade 100, the filler 40 is set to 20 vol % (50 vol % or less) of the volume of the blade body 10 excluding the diamond superabrasive grains 30, so that sufficient bonding strength is ensured in the resin bond phase 20 even when the filler 40 is dispersed.
As a result, the strength and rigidity of the blade body 10 are prevented from decreasing, and appropriate cutting ability can be ensured.

In addition, according to the cutting blade 100 of one embodiment, the blade body 10 is formed of the resin bond phase 20 and can be sintered at approximately 200° C., so that the cutting blade 100 can be manufactured while suppressing deterioration of the heat absorbing material (aluminum hydroxide (Al(OH) ₃ )).

The present invention is not limited to the above embodiment, and can be implemented in any manner that includes various modifications as long as they do not deviate from the spirit of the present invention, as exemplified below.

For example, in the above embodiment, the case where the filler 40 is entirely made of a heat absorbing material has been described, but the configuration of the filler 40 can be set arbitrarily. For example, the filler 40 may contain a filler (not shown) other than a heat absorbing material, such as molybdenum disulfide (MoS ₂ ), silicon carbide (SiC), alumina (Al ₂ O ₃ ), or tungsten carbide (WC), for the purpose of improving various functions such as processability and rigidity.

In the above embodiment, the case where the heat absorbing material is entirely aluminum hydroxide (Al(OH) ₃ ) has been described. However, for example, the filler 40 may contain a heat absorbing material other than aluminum hydroxide (Al(OH) ₃ ).

In the above embodiment, the case where the average particle size of the aluminum hydroxide (Al(OH) ₃ ) is 1 μm or more and 3 μm or less has been described. However, the average particle size of the aluminum hydroxide (Al(OH) ₃ ) can be set arbitrarily. For example, the average particle size may be set to be smaller than 1 μm or larger than 3 μm.

In addition, in the above embodiment, the case where aluminum hydroxide (Al(OH) ₃ ) is 20 vol % (10 to 50 vol % or more) of the volume of the blade body 10 excluding the diamond superabrasive grains (abrasive grains) 30 has been described, but the volume ratio of aluminum hydroxide (Al(OH) ₃ ) to the volume of the blade body 10 excluding the diamond superabrasive grains (abrasive grains) 30 can be set arbitrarily, and for example, it may be set to less than 10 vol % or higher than 50 vol % of the volume of the blade body 10 excluding the diamond superabrasive grains (abrasive grains) 30.

In the above embodiment, the abrasive grains are diamond superabrasive grains 30, and the average grain size of the diamond superabrasive grains 30 is 3 to 10 μm (for example, 5 μm), and the content is 12.5 to 31.25 vol% (concentration level is 50 to 125). However, the type of abrasive grains, average grain size, and concentration level can be set arbitrarily. For example, instead of the diamond superabrasive grains 30, other abrasive grains such as cBN may be dispersed in the resin bond phase 20. The average grain size and concentration level (content) of the abrasive grains can be set arbitrarily according to the purpose.

In the above embodiment, the resin constituting the resin bond phase 20 is described as a phenol resin, but the resin constituting the resin bond phase 20 can be set arbitrarily, and, for example, polyimide or the like may be used instead of the phenol resin.

In the above embodiment, the cutting blade 100 is a resin blade in which diamond superabrasive grains 30 are dispersed in the resin bond phase 20. However, the blade body (electroformed metal blade) may have a bond phase formed by plating a metal such as nickel (Ni) or a nickel alloy, copper (Cu), nickel-phosphorus (Ni-P), or nickel-cobalt (Ni-Co), or a metal compound such as nickel-boron (Ni-B), instead of the resin bond phase 20.

Here, the cutting blade having the bond phase formed by plating a metal or a metal compound can be formed by applying a known manufacturing method. For example, a SUS base metal is placed in a dispersion plating solution in which diamond superabrasive grains 30 are dispersed in a plating solution of a metal or a metal compound, and the SUS base metal is subjected to dispersion plating to form a cutting blade base plate (a dispersion nickel plating layer in which diamond superabrasive grains are dispersed).
Although the cutting blade base plate having a dispersed nickel plating layer does not require heat treatment, when the cutting blade base plate is formed using a Ni-P or Ni-B plating layer, heat treatment (for example, 250° C.×1 hr) may be performed.
Alternatively, a dispersed nickel plating layer may be formed by electroless plating.
If necessary, the original cutting blade plate is etched to expose the diamond superabrasive grains 30 from the bond phase and sharpened, and the inner and outer periphery are ground to the specified diameter dimensions to form (manufacture) the blade body 10.
The method for forming the blade body (electroformed metal blade) can be set arbitrarily and is not limited to the above.

In the above embodiment, the cutting blade 100 is described as having an outer diameter of φ56 mm, an inner diameter (diameter of the mounting hole) of 40 mm, and a thickness of 0.15 mm, but the outer diameter, inner diameter, and thickness of the cutting blade 100 may be set arbitrarily.

In the above embodiment, the cutting blade 100 is described as being used to cut hard and brittle materials such as glass and quartz (ceramics), but it may also be used to cut materials such as QFN (quadflat non-leaded package) and IrDA (Infrared Data Association) standard optical transmission modules and other electronic component materials.

In addition, the configurations (elements) described in the above-mentioned embodiments, modifications, and supplementary notes may be combined without departing from the spirit of the present invention, and additions, omissions, substitutions, and other modifications of configurations are possible. Furthermore, the present invention is not limited to the above-mentioned embodiments.

The cutting blade of the present invention has industrial applicability because the filler made of a heat absorbing material absorbs the heat generated during cutting of the workpiece, preventing the deterioration of the workpiece's processing quality.

O: axis line 10: blade body 11: outer peripheral surface (outer peripheral edge portion)
11A cutting edge 13 mounting hole 20 resin bond phase (bond phase)
30 Diamond super abrasive (abrasive)
40 Filler (heat absorbing material, aluminum hydroxide (Al(OH) ₃ ))
100 Cutting blade

Claims (3)

A cutting blade for cutting a workpiece with a cutting edge of a blade body rotated around an axis,
The blade body includes:
A bond phase formed in a disk shape;
abrasive grains dispersed in the bond phase;
A filler dispersed in the bond phase;
A cutting edge formed on an outer peripheral edge of the bond phase;
Equipped with
The filler is
The material contains an endothermic material that decomposes thermally and absorbs heat when the temperature rises,
The heat absorbing material includes aluminum hydroxide (Al(OH) ₃ ) ;
The bond phase is formed by plating.
A cutting blade characterized by: 2. The cutting blade of claim 1,
The aluminum hydroxide (Al(OH) ₃ ) is
A cutting blade, characterized in that the abrasive grains are set to a content of 10 vol % or more with respect to the volume of the blade body excluding the abrasive grains. A cutting blade according to claim 1 or 2,
A cutting blade characterized in that the filler is set to 50 vol % or less with respect to the volume of the blade body excluding the abrasive grains.

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