JP7615294B2 - Ceramic wiring materials - Google Patents

Description

This disclosure relates to ceramic wiring members.

Ceramic wiring members capable of mounting multiple electronic components are known (for example, Patent Documents 1 and 2). The ceramic wiring member of Patent Document 1 comprises a rectangular substrate and a frame body located on the main surface of the substrate. Four external terminals are provided on the bottom surface of the frame body. The ceramic wiring member of Patent Document 1 has recesses (castellations) at the four corners of the frame body that extend along the side surfaces of the frame body. The conductor layer formed in the recesses is connected to the external terminals via the connection parts. This configuration electrically connects the external terminals to the electronic components housed inside the frame body.

The ceramic wiring member of Patent Document 2 includes a substrate and a frame body provided on the underside of the substrate. External terminals are provided at the four corners of the underside of the frame body. The external terminals are connected to electronic components housed inside the frame body by vias that pass through the inside of the frame body.

JP 2020-88634 A JP 2016-72652 A

The ceramic wiring member on which the electronic components are mounted is mounted on a wiring board. For this reason, it is desirable for the ceramic wiring member to have excellent mountability. Specifically, it is desirable for the ceramic wiring member to be securely fixed on the wiring board, and for the shape of the solder fillet formed to connect between the ceramic wiring member and the wiring board to be easily visible. On the other hand, it is desirable for the ceramic wiring member to have a high degree of freedom in the arrangement of the wiring from the electronic components to the external terminals.

In view of this situation, one of the objectives of this disclosure is to provide a ceramic wiring member that is easy to mount and has a high degree of freedom in the arrangement of wiring provided in the ceramic wiring member.

The ceramic wiring member according to the present disclosure includes a ceramic body and a conductive portion arranged in contact with the body and made of a conductor. The body has a flat plate shape and includes a plate portion and a first frame portion rising from the plate portion so as to surround a first cavity, which is a space on a first main surface of the plate portion. The first frame portion has a first end face located on the opposite side to the plate portion in the thickness direction of the plate portion. The conductive portion includes two pairs of external connection terminals arranged on the first end face of the first frame portion and two pairs of internal wiring that penetrate the inside of the first frame portion and connect to each of the two pairs of external connection terminals. When the first end face of the first frame portion is viewed in a planar manner in the thickness direction of the first frame portion, one side of the outer edges of each of the two pairs of external connection terminals is located at a position that overlaps one of two pairs of opposite sides that define the outer edge of the first end face of the first frame portion. The other of the two pairs of opposite sides that define the outer edge of the first end face of the first frame portion is not in contact with the outer edges of any of the two pairs of external connection terminals. The center of a via at the connection position between each of the two pairs of external connection terminals and each of the two pairs of internal wiring is located within a region that includes the portion where the outer edge of the external connection terminals and the outer edge of the first frame portion overlap, within a region divided by the diagonal of the smallest imaginary rectangle that contains the external connection terminals. The length of the shortest straight line connecting the outer edge of the via and the outer edge of the first frame portion is at least one time the diameter of the via.

The ceramic wiring member according to the present disclosure includes a ceramic body and a conductive portion arranged in contact with the body and made of a conductor. The body has a flat plate shape and includes a plate portion and a first frame portion rising from the plate portion so as to surround a first cavity, which is a space on a first main surface of the plate portion. The first frame portion has a first end face located on the opposite side to the plate portion in the thickness direction of the plate portion. The conductive portion includes two pairs of external connection terminals arranged on the first end face of the first frame portion and two pairs of internal wiring that penetrate the inside of the first frame portion and connect to each of the two pairs of external connection terminals. When the first end face of the first frame portion is viewed in a planar manner in the thickness direction of the first frame portion, one side of the outer edges of each of the two pairs of external connection terminals is located at a position that overlaps one of two pairs of opposite sides that define the outer edge of the first end face of the first frame portion. The other of the two pairs of opposing sides that define the outer edge of the first end face of the first frame portion is not in contact with the outer edge of any of the two pairs of external connection terminals. The center of a via at a connection position between each of the two pairs of external connection terminals and each of the two pairs of internal wiring is located closer to the outer edge of the first frame portion than the center of an imaginary line that connects the inner edge of the first frame portion and the outer edge of the first frame portion at the shortest distance. The length of the shortest straight line connecting the outer edge of the via and the outer edge of the first frame portion is at least one time the diameter of the via.

The ceramic wiring member described above provides a ceramic wiring member that is easy to mount and has a high degree of freedom in the arrangement of the wiring provided in the ceramic wiring member.

FIG. 1 is a schematic cross-sectional view showing the structure of a ceramic wiring member according to a first embodiment. FIG. 2 is a schematic plan view showing the structure of the ceramic wiring member according to the first embodiment. FIG. 3 is a schematic plan view particularly showing the arrangement of components of the ceramic wiring member according to the first embodiment. FIG. 4 is a schematic plan view showing the structure of the ceramic wiring member according to the first embodiment. FIG. 5 is a schematic cross-sectional view showing a state in which the ceramic wiring member according to the first embodiment is used. FIG. 6 is a schematic plan view showing the structure of a ceramic wiring member according to the second embodiment. Fig. 7(a) is a schematic plan view showing the structure of a ceramic wiring member in accordance with embodiment 3. Fig. 7(b) is a schematic cross-sectional view showing a state cut along line bb shown in Fig. 7(a). FIG. 8 is a schematic plan view showing the structure of a ceramic wiring member according to the fourth embodiment. FIG. 9 is a schematic plan view showing the structure of a ceramic wiring member according to the fifth embodiment. FIG. 10 is a schematic cross-sectional view showing the structure of a ceramic wiring member according to the fifth embodiment. FIG. 11 is a schematic plan view showing the structure of a ceramic wiring member according to the sixth embodiment. FIG. 12 is a schematic cross-sectional view showing the structure of a ceramic wiring member according to the seventh embodiment. FIG. 13 is an enlarged view of a portion of FIG. FIG. 14 is a graph showing the relationship between the ratio of the diameter of a via to the distance from the outer edge of the via to the outer edge of the frame, and the stress acting on the outer edge.

[Overview of the embodiment]
First, the embodiments of the present disclosure will be described. The ceramic wiring member according to the present disclosure includes a ceramic body portion and a conductive portion arranged in contact with the body portion and made of a conductor. The body portion has a flat plate shape and includes a plate portion and a first frame portion rising from the plate portion so as to surround a first cavity, which is a space on a first main surface of the plate portion. The first frame portion has a first end face located on the opposite side to the plate portion in the thickness direction of the plate portion. The conductive portion includes two pairs of external connection terminals arranged on the first end face of the first frame portion and two pairs of internal wirings that penetrate the inside of the first frame portion and connect to each of the two pairs of external connection terminals. When the first end face of the first frame portion is viewed in a planar manner in the thickness direction of the first frame portion, one side of the outer edges of each of the two pairs of external connection terminals is located at a position overlapping one of two pairs of opposite sides that define the outer edge of the first end face of the first frame portion. The other of the two pairs of opposite sides that define the outer edge of the first end face of the first frame portion is not in contact with the outer edges of any of the two pairs of external connection terminals. The centers of vias at the connection positions between each of the two pairs of external connection terminals and each of the two pairs of internal wirings are located within a region that includes the portion where the outer edges of the external connection terminals and the outer edge of the first frame portion overlap, within a region divided by the diagonal lines of the smallest imaginary rectangle that contains the external connection terminals. The length of the shortest straight line connecting the outer edge of the via and the outer edge of the first frame portion is equal to or greater than one time the diameter of the via.

The ceramic wiring member according to the present disclosure includes a ceramic body and a conductive portion arranged in contact with the body and made of a conductor. The body has a flat plate shape and includes a plate portion and a first frame portion rising from the plate portion so as to surround a first cavity, which is a space on a first main surface of the plate portion. The first frame portion has a first end face located on the opposite side to the plate portion in the thickness direction of the plate portion. The conductive portion includes two pairs of external connection terminals arranged on the first end face of the first frame portion and two pairs of internal wiring that penetrate the inside of the first frame portion and connect to each of the two pairs of external connection terminals. When the first end face of the first frame portion is viewed in a planar manner in the thickness direction of the first frame portion, one side of the outer edges of each of the two pairs of external connection terminals is located at a position that overlaps one of two pairs of opposite sides that define the outer edge of the first end face of the first frame portion. The other of the two pairs of opposing sides that define the outer edge of the first end face of the first frame portion is not in contact with the outer edge of any of the two pairs of external connection terminals. The center of a via at a connection position between each of the two pairs of external connection terminals and each of the two pairs of internal wiring is located closer to the outer edge of the first frame portion than the center of an imaginary line that connects the inner edge of the first frame portion and the outer edge of the first frame portion at the shortest distance. The length of the shortest straight line connecting the outer edge of the via and the outer edge of the first frame portion is at least one time the diameter of the via.

Conventionally, there are known ceramic wiring components in which external connection terminals are provided on the end faces of a frame body that surrounds a cavity. The external connection terminals are often provided at the four corners of the end face. Some of these external connection terminals are arranged so that when the end face of the frame body is viewed in a plan view in the thickness direction of the frame body, two sides of the outer edge of the frame body overlap with the outer edge of the external connection terminal (e.g., Patent Document 2). On the other hand, there are also external connection terminals in which the outer edge of the external connection terminal is offset relative to the frame body, and the outer edge of the external connection terminal is located inside the outer edge of the frame body (e.g., Patent Document 1).

The external connection terminal in the ceramic wiring member is a connection point between the ceramic wiring member and the wiring board. In order to ensure adhesion (mounting strength) between the ceramic wiring member and the wiring board, it is desirable for the area of the external connection terminal to be large. In order to increase the area of the external connection terminal, the external connection terminal may be extended to the outer edge of the frame body. However, when the two outer edges of the external connection terminal are arranged at a position where they overlap with the two outer edges of the frame body, precise alignment between the external connection terminal and the main body of the ceramic wiring member is required in the manufacture of the ceramic wiring member, and detection of misalignment is necessary. For this reason, there is room for improvement in productivity. On the other hand, when the outer edge of the external connection terminal is offset from the outer edge of the frame body, it is easier to detect misalignment, but there is room for improvement in terms of increasing the area of the external connection terminal. In addition, since the external connection terminal and the wiring board are connected by solder, it is preferable that the state of the solder fillet is easily visible from the outside during mounting.

In addition, in ceramic wiring members, electronic components arranged in the cavities of the ceramic wiring member are connected to external connection terminals through wiring formed in vias that penetrate the frame in the thickness direction. Generally, vias have a diameter larger than the width of the wiring arranged along the main surface direction of the wiring member. For this reason, depending on the position and size of the vias, there are restrictions on the arrangement of wiring from the pads on which the electronic components are mounted to the vias, which can limit the miniaturization of the package.

In the ceramic wiring member according to the present disclosure, when the end face of the frame body on which the external connection terminals are provided is viewed in a planar manner in the thickness direction of the frame body, one side of the outer edge of each of the two pairs of external connection terminals is located at a position overlapping one of the two pairs of opposite sides that define the outer edge of the end face of the frame body. Also, none of the outer edges of the two pairs of external connection terminals is in contact with the other of the two pairs of opposite sides that define the outer edge of the end face. In other words, the outer edge of the external connection terminal is located at a position overlapping only the first opposite side or only the second opposite side of the two pairs of opposite sides of the frame body.
In addition, the center of the via at the connection position between each of the two pairs of external connection terminals and each of the two pairs of internal wiring is located within a region that includes the portion where the outer edge of the external connection terminal and the outer edge of the frame body overlap in the region divided by the diagonal of the virtual rectangle in the smallest virtual rectangle that includes the external connection terminal. In other words, the center of the via is located within a region that includes the portion where the outer edge of the external connection terminal and the outer edge of the frame body overlap in the region divided by the diagonal of the virtual rectangle in the smallest virtual rectangle that includes the external connection terminal. In addition, the length of the shortest straight line connecting the outer edge of the via and the outer edge of the first frame part is equal to or greater than the diameter of the via. According to the ceramic wiring member of the present disclosure having these configurations, it is possible to ensure a large area for the external connection terminal, and it is also possible to easily confirm that the external connection terminal is disposed in an appropriate position. In addition, since a part of the external connection terminal is located at a position that overlaps the outer edge of the frame body, it is easy to visually confirm the state of the solder fillet from the outside. In addition, the external connection terminal can be arranged with high symmetry, and thermal stress when mounted on a wiring board can be reduced. Furthermore, since the external connection terminal and the via are connected at a position away from the center of the ceramic wiring member, there is a high degree of freedom in the arrangement of the wiring provided in the ceramic wiring member. These configurations provide a ceramic wiring member that is excellent in mountability and has a high degree of freedom in the arrangement of the wiring provided in the ceramic wiring member. Furthermore, the stress generated at the outer edge of the first frame portion is stably reduced. As a result, it is possible to reduce stress on the first frame portion due to heat, and a ceramic wiring member with excellent reliability is provided.

In the ceramic wiring member, the center of the via at the connection position between each of the two pairs of external connection terminals and each of the two pairs of internal wiring can be located within a region that includes the portion where the outer edge of the external connection terminals and the outer edge of the first frame part overlap in the region divided by the diagonal line of the smallest imaginary rectangle that contains the external connection terminals, and can be located closer to the outer edge than the center of the imaginary line that connects the inner edge of the first frame part and the outer edge of the first frame part at the shortest distance. In addition, the length of the shortest straight line connecting the outer edge of the via and the outer edge of the first frame part is at least one time the diameter of the via. This configuration ensures greater freedom in wiring arrangement in the ceramic wiring member without hindering the miniaturization of the package.

In the ceramic wiring member, the length of the shortest straight line connecting the outer edge of the via and the outer edge of the first frame portion may be at least one time the diameter of the via, and this may be true at all of the connection positions between the two pairs of external connection terminals and the two pairs of internal wiring. In this case, the aforementioned effect can be obtained even more reliably.

In the ceramic wiring member, when the first end face of the first frame is viewed in a planar manner in the thickness direction of the first frame, and the width of the narrowest part between the inner edge of the first frame and the outer edge of the first frame is compared with the diameter of the via, the width of the narrowest part may be 2.5 to 10 times the diameter of the via. When it is in this range, the strength of the first frame is ensured and the ceramic wiring member can be made smaller.

In the ceramic wiring member, both of the two pairs of external connection terminals may be positioned so as to overlap the shorter side of the two pairs of opposing sides that define the outer edge of the first end face. In this case, when checking the shape of the solder fillets, the two solder fillets can be checked at shorter intervals, making it easier to check the two solder fillets simultaneously while magnifying them more with a camera.

In the ceramic wiring member, the main body may further include a second frame portion rising from the plate-shaped portion so as to surround a second cavity, which is a space on a second main surface located on the opposite side of the first main surface of the plate-shaped portion in the thickness direction. Of the two pairs of internal wires, a first pair of internal wires may be connected to a pair of first internal terminals arranged in contact with a surface of the main body facing the first cavity, and a second pair of internal wires may be connected to a pair of second internal terminals arranged in contact with a surface of the main body facing the second cavity. In a ceramic wiring member, a form in which an independent cavity is provided on each of both sides of the plate-shaped portion is known. In such a ceramic wiring member, the arrangement of the internal wiring tends to be complicated. According to the ceramic wiring member disclosed herein, a ceramic wiring member having a high degree of freedom in internal wiring and excellent mountability is provided in a ceramic wiring member in which an independent cavity is provided on each of both sides of the plate-shaped portion.

In the ceramic wiring member, the ceramic wiring member may have a ground terminal different from the two pairs of the external connection terminals on the first end surface of the first frame portion. The second frame portion may have a second end surface located on the opposite side of the plate-shaped portion in the thickness direction of the plate-shaped portion. The second frame portion may include a conductive region arranged to include the second end surface. The conductive region may be connected to any one of the first pair of internal wirings and the second pair of internal wirings, and the conductive region and the external connection terminal may be electrically connected. The conductive region may be electrically connected to the ground terminal without being connected to any one of the first pair of internal wirings and the second pair of internal wirings. With such a ceramic wiring member, the electrical connection from the conductive region of the second frame portion to the external connection terminal can be realized by an efficient wiring arrangement. With this configuration, the degree of freedom of the internal wiring is high, the mounting is excellent, and charging of the conductive member (typically a lid member) arranged in the second frame portion can be prevented.

[Specific Example of the Embodiment]
Next, specific embodiments of the ceramic wiring member of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference characters, and the description thereof will not be repeated.

(Embodiment 1)
Fig. 1 is a schematic cross-sectional view showing the structure of the ceramic wiring member in the first embodiment. Figs. 2 and 4 are schematic plan views showing the structure of the ceramic wiring member in the first embodiment. Fig. 3 is a diagram for explaining the arrangement of components of the ceramic wiring member in the first embodiment. Fig. 1 is a diagram corresponding to a cross section taken along line II shown in Figs. 2 to 4. Fig. 5 is a schematic cross-sectional view showing the use of the ceramic wiring member in the first embodiment.

(Main body)
1 to 4, the ceramic wiring member 1 includes a main body portion 10 and a conductive portion 30 made of a conductor and disposed in contact with the main body portion 10. The main body portion 10 includes a plate-like portion 11, a first frame portion 13, and a second frame portion 12. The plate-like portion 11 has a flat plate shape. The shape of the plate-like portion 11 is not particularly limited, but in this embodiment, the planar shape of the plate-like portion 11 (a direction perpendicular to the second main surface 11A; a shape viewed in the Z-axis direction) is a quadrangle (rectangle) (see FIGS. 2 to 4).

With reference to FIG. 1, the plate-shaped portion 11 has a second main surface 11A and a first main surface 11B. A second frame portion 12 is provided on the second main surface 11A, and a first frame portion 13 is provided on the first main surface 11B. The first frame portion 13 is an annular portion rising from the first main surface 11B of the plate-shaped portion 11. The first frame portion 13 surrounds a first cavity 22, which is a space on the first main surface 11B of the plate-shaped portion 11. The shape of the outer edge of the first frame portion 13 as viewed in the Z-axis direction is a rectangle (rectangle) that follows the outer edge (outer peripheral surface) of the plate-shaped portion 11 (see FIG. 2 and FIG. 3). The second frame portion 12 is an annular portion rising from the second main surface 11A of the plate-shaped portion 11. The second frame portion 12 surrounds a second cavity 21, which is a space on the second main surface 11A of the plate-shaped portion 11. When viewed in the Z-axis direction, the shape of the outer edge of the second frame portion 12 is a rectangle (oblong) that follows the outer edge (outer peripheral surface) of the plate-shaped portion 11 (see Figure 4).

The second frame portion 12 has a frame-like shape surrounding the second cavity 21, and includes a ceramic frame body 121 rising from the plate-like portion 11, and a conductive layer 122 as a conductive region arranged on the end face of the frame body 121 located on the opposite side to the plate-like portion 11. The conductive layer 122 is arranged to include the second end face 12A located on the opposite side to the plate-like portion 11 in the thickness direction (Z-axis direction) of the plate-like portion 11. In other words, the conductive layer 122 constitutes the second end face 12A.

The plate-shaped portion 11, the first frame portion 13, and the frame body 121 of the second frame portion 12 are made of ceramic. The ceramic constituting the plate-shaped portion 11, the frame body 121, and the first frame portion 13 is not particularly limited, but aluminum oxide (Al ₂ O ₃ ) can be used, for example. The ceramic constituting the main body portion 10 may contain at least one selected from the group consisting of silicon dioxide (SiO ₂ ), calcium oxide (CaO), magnesium oxide (MgO), and manganese oxide (MnO) as a sintering aid.

(Conductive part)
The conductive portion 30 is disposed in contact with the main body portion 10 and is made of a conductor. With reference to Figs. 1 and 2, the conductive portion 30 includes two pairs of external connection terminals, namely, a first pair of external connection terminals 31 (31A, 31B) and a second pair of external connection terminals 32 (32A, 32B). The first pair of external connection terminals 31 includes a first external input terminal 31A and a first external output terminal 31B. The second pair of external connection terminals 32 includes a second external input terminal 32A and a second external output terminal 32B. When the ceramic wiring member 1 is in use, the first pair of external connection terminals 31 and the second pair of external connection terminals 32 are placed on a wiring board and serve as connection portions between the wiring board and the ceramic wiring member 1. With reference to FIG. 2 , the first external input terminal 31A, the first external output terminal 31B, the second external input terminal 32A, and the second external output terminal 32B are arranged in contact with the first end surface 13A of the first frame portion 13.

1, 2, and 4, the conductive portion 30 includes two pairs of internal terminals, which are a first pair of internal terminals 36 (36A, 36B) and a second pair of internal terminals 37 (37A, 37B). The first pair of internal terminals 36 includes a first internal input terminal 36A and a first internal output terminal 36B. The second pair of internal terminals 37 includes a second internal input terminal 37A and a second internal output terminal 37B. With reference to FIGS. 1 and 4, the first internal input terminal 36A and the first internal output terminal 36B as the first internal terminals are arranged in contact with the surface of the main body portion 10 facing the second cavity 21. More specifically, the first internal input terminal 36A and the first internal output terminal 36B are arranged in contact with the second main surface 11A of the plate-shaped portion 11. The second internal input terminal 37A and the second internal output terminal 37B as the second internal terminals are arranged apart from the first internal input terminal 36A and the first internal output terminal 36B and in contact with the main body 10. More specifically, the second internal input terminal 37A and the second internal output terminal 37B are arranged in contact with the first main surface 11B of the plate-shaped portion 11.

Each of the first pair of internal terminals 36 (first internal input terminal 36A and first internal output terminal 36B) is connected to each of the first pair of external connection terminals 31 (first external input terminal 31A and first external output terminal 31B). Specifically, the first internal input terminal 36A and the first external input terminal 31A are electrically connected by wiring 51 as wiring for electronic components. The wiring 51 includes a wiring portion 51A formed on the second main surface 11A of the plate-shaped portion 11 and a wiring portion 51B formed inside the via 41A that penetrates the plate-shaped portion 11 and the first frame portion 13 and extends in the thickness direction (Z-axis direction). Although FIG. 4 is a schematic diagram and does not reflect the actual dimensions, the diameter of the via 41A (wiring portion 51B) can be larger than the width of the wiring portion 51A. The end of the wiring portion 51B is connected to the first external input terminal 31A. The first internal output terminal 36B and the first external output terminal 31B are electrically connected by a wiring 52 serving as an electronic component wiring (see FIG. 1 and FIG. 4). The wiring 52 includes a wiring portion 52A formed on the second main surface 11A of the plate-shaped portion 11 and a wiring portion 52B formed inside a via 41B that penetrates the plate-shaped portion 11 and the first frame portion 13 and extends in the thickness direction (Z-axis direction). The diameter of the via 41B (wiring portion 52B) can be larger than the width of the wiring portion 52A. The end of the wiring portion 52B is connected to the first external output terminal 31B.

1 and 2, each of the second pair of internal terminals 37 (the second internal input terminal 37A and the second internal output terminal 37B) is connected to each of the second pair of external connection terminals 32 (the second external input terminal 32A and the second external output terminal 32B). Specifically, the second internal input terminal 37A and the second external input terminal 32A are electrically connected by a wiring 53 as an electronic component wiring. The wiring 53 includes a wiring portion 53A formed on the first main surface 11B of the plate-shaped portion 11 and a wiring portion 53B formed inside the via 42A that penetrates the first frame portion 13 and extends in the thickness direction (Z-axis direction). The diameter of the via 42A (wiring portion 53B) can be made larger than the width of the wiring portion 53A. One end of the wiring portion 53B is connected to the second external input terminal 32A. The second internal output terminal 37B and the second external output terminal 32B are electrically connected by a wiring 54 as an electronic component wiring. The wiring 54 includes a wiring portion 54A formed on the first main surface 11B of the plate-shaped portion 11 and a wiring portion 54B formed inside the via 42B that penetrates the first frame portion 13 and extends in the thickness direction (Z-axis direction). The diameter of the via 42B (wiring portion 54B) can be larger than the width of the wiring portion 54A. The end of the wiring portion 54B is connected to the second external output terminal 32B. The wiring 54 is also connected to the wiring 55. The wiring 55 is interposed between the conductive layer 122 and the wiring 54. The conductive layer 122 and the second external output terminal 32B are electrically connected by the wiring 55. The connection of the wiring is not limited to the above-mentioned embodiment. For example, the wiring 55 may not be provided.

The conductive portion 30, the conductive layer 122 and the wirings 51, 52, 53, 54, and 55 are made of a conductor containing at least one of W (tungsten), Mo (molybdenum) and Cu (copper), for example.

Specific dimensions of the ceramic wiring member are not particularly limited, but may typically be as follows. With reference to FIG. 1, the thickness (thickness in the Z-axis direction) of the plate-shaped portion 11 may be 0.030 to 0.160 mm. The thickness (thickness in the Z-axis direction) of the first frame portion 13 may be 0.030 to 0.430 mm. The thickness (thickness in the Z-axis direction) of the second frame portion 12 may be 0.030 to 0.300 mm. With reference to FIG. 2, when the first frame portion 13 is viewed in a planar manner in the thickness direction (Z-axis direction), the length of the long side of the outer edge of the first frame portion 13 may be 1.0 to 4.0 mm. Similarly, the length of the short side may be 1.0 to 3.0 mm.

Referring to FIG. 2, the internal terminals 37 (37A, 37B) may be rectangular, and the length of their short sides (sides extending along the X-axis) may be 0.15 to 0.4 mm. Similarly, the length of their long sides (sides extending along the Y-axis) may be 0.25 to 0.5 mm. The distance k1 from the outer edge of the internal terminals 37 to the inner edge of the first frame portion 13 may be 0.05 to 0.20 mm. The distance k2 (offset length) between the external connection terminals 31, 32 and the outer edge of the first frame portion 13 may be 0.01 to 0.10 mm.

(Layout of external connection terminals and vias)
The arrangement of the first pair of external connection terminals 31 and the second pair of external connection terminals 32 in the ceramic wiring member 1 will be described with reference to Fig. 3. In Fig. 3, some of the configurations shown in Fig. 2 are omitted for ease of understanding. In the ceramic wiring member 1, when the first end face 13A of the first frame 13 is viewed in a planar manner in the thickness direction of the first frame 13 (i.e., the state shown in Fig. 3), the first pair of external connection terminals 31 and the second pair of external connection terminals 32 are arranged near each of the four corners of the first end face 13A. The first pair of external connection terminals 31 and the second pair of external connection terminals 32 are arranged on the first end face 13A of the first frame 13. The outer edge of the first end face 13A is defined by a pair of long sides L1 and L3 as first opposite sides and a pair of short sides L2 and L4 as second opposite sides. The inner edge of the first end face 13A faces the first cavity 22 and is defined by a pair of inner long sides M1, M3 as a third opposite side and a pair of inner short sides M2, M4 as a fourth opposite side.

Each of the first pair of external connection terminals 31 (31A, 31B) and the second pair of external connection terminals 32 (32A, 32B) has a rectangular shape with a portion close to the first cavity 22 cut out into a rectangular shape. One side of the outer edge of each of the first pair of external connection terminals 31 and the second pair of external connection terminals 32 is located at a position overlapping one of the pair of long sides L1, L3. Specifically, side 31a, which is one side of the outer edge of the first external input terminal 31A, and side 32a, which is one side of the outer edge of the second external input terminal 32A, are located at a position overlapping the long side L1 of the first end surface 13A. Also, side 31b, which is one side of the outer edge of the first external output terminal 31B, and side 32b, which is one side of the outer edge of the second external output terminal 32B, are located at a position overlapping the long side L3 of the first end surface 13A. The outer edges of the first pair of external connection terminals 31 (31A, 31B) and the second pair of external connection terminals 32 (32A, 32B) do not overlap the short sides L2, L4 of the first end surface 13A. The first pair of external connection terminals 31 (31A, 31B) and the second pair of external connection terminals 32 (32A, 32B) are offset from the short sides L2, L4 of the first end surface 13A. In other words, the outer edges of the first pair of external connection terminals 31 (31A, 31B) and the second pair of external connection terminals 32 (32A, 32B) are in contact with the long sides L1, L3 and are not in contact with the short sides L2, L4. With this configuration, the external connection terminals are configured to overlap a part of the outer edge of the frame body, so that the area of the external connection terminals can be increased. In addition, when the ceramic wiring member is mounted on the wiring board, the shape of the solder fillet formed between the external connection terminal and the wiring board can be easily seen from the outside. Furthermore, since the outer edge of each external connection terminal overlaps with only one side of the outer edge of the frame body, it is easy to check the positional deviation of the external connection terminal with respect to the first end face 13A during manufacturing.

The connection positions of the external connection terminals and the internal wiring in the ceramic wiring member according to the present disclosure will be described. As described above, the first pair of external connection terminals 31 (31A, 31B) and the second pair of external connection terminals 32 (32A, 32B) are connected to the wiring portions 51B, 52B, 53B, and 54B, respectively. The wiring portion 51B is provided to the via 41A, the wiring portion 52B is provided to the via 41B, the wiring portion 53B is provided to the via 42A, and the wiring portion 54B is provided to the via 42B, respectively. The conductor filled to fill the vias, which are through holes, constitutes the wiring. Therefore, the center of the via and the center of the wiring portion connected to the external connection terminal are in the same position. The positional relationship between the first external input terminal 31A and the via 41A is as follows. That is, in the smallest imaginary rectangle S containing the first external input terminal 31A, the center of the via 41A is located within region q1, which is a region including a portion where the outer edge (side 31a) of the first external input terminal 31A overlaps with the outer edge (L1) of the first frame portion 13, among four regions q1, q2, q3, q4 divided by diagonals X1, X2 of the imaginary rectangle S. Similarly, in the first external output terminal 31B, the center of the via 41B is located within region q1, which is a region including a portion where the outer edge (side 31b) of the first external output terminal 31B overlaps with the outer edge (L3) of the first frame portion 13, among regions divided by diagonals X1, X2 of the imaginary rectangle S in the smallest imaginary rectangle S containing the first external output terminal 31B. Similarly, in the second external input terminal 32A, the center of the via 42A is located within a region q1 that is a region that includes a portion where the outer edge (side 32a) of the second external input terminal 32A overlaps with the outer edge (L1) of the first frame portion 13, among the regions divided by the diagonals X1 and X2 of the virtual rectangle S in the smallest virtual rectangle S that contains the second external input terminal 32A. Similarly, in the second external output terminal 32B, the center of the via 42B is located within a region q1 that is a region that includes a portion where the outer edge (side 32b) of the second external output terminal 32B overlaps with the outer edge (L3) of the first frame portion 13, among the regions divided by the diagonals X1 and X2 of the virtual rectangle S in the smallest virtual rectangle S that contains the second external output terminal 32B.

By arranging the vias in the above-mentioned positional relationship, even if part of the outer edge of the external connection terminal is offset from the outer edge of the frame, it is possible to position the vias away from the center of the first end face 13A of the ceramic wiring member, allowing greater freedom in the routing of the internal wiring and enabling the realization of a compact package.

In addition, in the ceramic wiring member 1, the centers of the vias 41A, 41B, 42A, and 42B are located closer to the outer edges L1, L2, L3, and L4 than the center c0 of the imaginary line c1 that connects the inner edges M1, M2, M3, and M4 of the first frame portion 13 to the outer edges L1, L2, L3, and L4 at the shortest distance. FIG. 3 shows an imaginary line C1 that connects the centers c0 of the imaginary lines c1. The centers of the vias 41A, 41B, 42A, and 42B are located outside the imaginary line C1. By providing the vias in such a positional relationship, it is possible to arrange the vias at a position away from the center of the ceramic wiring member, even if a part of the outer edge of the external connection terminal is offset from the outer edge of the frame portion, which increases the degree of freedom in handling the internal wiring and enables a small package to be realized.

Figure 13 is a partially enlarged view showing the vicinity of the second external input terminal 32A in Figure 3. Referring to Figure 13, the length of the straight line n1, which is the shortest straight line connecting the outer edge of the via 42A to the outer edge L1, is at least one time the diameter r1 of the via 42A. In other words, the length of the straight line n1 is the distance from the outer edge of the via 42A to the outer edge L1 of the first frame portion 13. It has been found that when this distance is greater than the diameter r1 of the via 42A, the stress applied to the first frame portion 13 is stably low. This relationship may be satisfied in some of the vias at the connection position between the external connection terminal and the internal wiring, but it is preferable that this relationship be satisfied in all of the external connection terminals.

Figure 14 is a graph showing the relationship between the ratio of the via diameter to the distance from the outer edge of the via to the outer edge of the frame, and the stress applied to the outer edge. The horizontal axis of the graph shown in Figure 14 represents the case where the via diameter and the distance from the outer edge of the via to the outer edge of the frame are equal, with this being 100%. In other words, the horizontal axis of the graph shown in Figure 14 represents the value calculated by (distance from the outer edge of the via to the outer edge of the frame/via diameter) x 100. The vertical axis of the graph in Figure 14 represents the relative value when the stress generated when the value on the horizontal axis is 220% is set to 1.0.

As shown in the graph in Figure 14, when the distance from the outer edge of the via to the outer edge of the frame is greater than the diameter of the via (when the horizontal axis in Figure 14 is 100% or more), the stress applied to the outer edge of the frame is stable and small. In contrast, when the distance from the outer edge of the via to the outer edge of the frame is smaller than the diameter of the via (when the horizontal axis in Figure 14 is less than 100%), the stress applied to the outer edge of the frame is relatively large, and stress is likely to occur in the frame.

The graph shown in Fig. 14 was calculated by a simulation under the following conditions: The stress generated during thermal deformation caused by temperature change was calculated under the following settings.
Outer edge of ceramic wiring member: 1.7 mm x 1.3 mm
Outer edge of first frame: 1.7 mm x 1.3 mm
Inner edge of first frame: 1.0 mm x 0.7 mm
Thickness of ceramic wiring member: 0.5 mm (first frame portion: 0.25 mm, substrate portion 0.1 mm, second frame portion 0.15 mm)
Via diameter: 0.05 mm
-Temperature change: -90℃

The physical properties used in the simulation are shown in Table 1 below. The ceramic can have a Young's modulus of 250 to 350 GPa, a Poisson's ratio of 0.20 to 0.25, and a linear expansion coefficient of about 7.0 to 8.0 ppm/K. The external connection terminals and vias can have a Young's modulus of 100 to 400 GPa, a Poisson's ratio of 0.25 to 0.35, and a linear expansion coefficient of about 4.0 to 18.0 ppm/K.

Referring to FIG. 13, the width n2 of the first frame portion 13 is 5.6 times the diameter r1 of the via 42A. The width of the first frame portion is not necessarily uniform, but it is preferable that the width of the narrowest part between the inner edge of the first frame portion and the outer edge of the first frame portion is 2.5 to 10 times the diameter of the via. If the width of the frame body is 2.5 times or less the diameter of the via, the strength of the frame body may decrease. If the width of the frame body is 10 times or more the diameter of the via, it may be difficult to miniaturize the ceramic wiring member. The width of the frame body can be rephrased as the length of the imaginary line n2 that connects the inner edge of the first frame portion 13 and the outer edge of the first frame portion at the shortest distance.

(Use of ceramic wiring members)
The use of the ceramic wiring member 1 will be described with reference to FIG. 5. As described above, in the ceramic wiring member 1, the internal terminals 36A, 36B, 37A, and 37B are electrically connected to the external connection terminals 31A, 31B, 32A, and 32B in a one-to-one relationship. Therefore, as shown in FIG. 5, a crystal oscillator 71, which is a piezoelectric oscillator element, can be disposed on the first internal input terminal 36A and the first internal output terminal 36B. Also, a thermistor 72, for example, can be disposed on the second internal input terminal 37A and the second internal output terminal 37B. The ceramic wiring member 1 is a ceramic wiring member on which a plurality of electronic components can be mounted. Specifically, the ceramic wiring member 1 is a ceramic wiring member on which electronic components disposed in the second cavity 21 and the first cavity 22 can be mounted.

The oscillation frequency of the crystal oscillator 71 is affected by temperature. As shown in FIG. 5, by mounting the crystal oscillator 71 and a thermistor 72, which is an element that detects temperature, on a single ceramic wiring member 1, the crystal oscillator 71 can be driven based on the temperature detected by the thermistor 72, thereby allowing the crystal oscillator 71 to operate appropriately.

By placing a metal lid 81 on the first end surface 12A of the second frame portion 12, the crystal oscillator 71 can be sealed in the second cavity 21 in an airtight state. The lid 81 and the second end surface 12A (conductive layer 122) of the second frame portion 12 can be joined by any method such as welding, brazing, or pressure welding. When the metal lid 81 is placed on the second end surface 12A of the second frame portion 12, the lid 81 and the external connection terminal 32B are electrically connected via the conductive layer 122, the wiring 55, and the wiring portion 54B. The ceramic wiring member 1 can be mounted with a plurality of electronic components (crystal oscillator 71 and thermistor 72) including the crystal oscillator 71 mounted in the second cavity 21 that can be sealed with the metal lid 81, and can provide a ceramic wiring member that has excellent mountability on a wiring board and a high degree of freedom in the arrangement of the wiring provided in the ceramic wiring member.

(Method of manufacturing ceramic wiring member)
Next, an example of a method for manufacturing the ceramic wiring member 1 of this embodiment will be described briefly. In the method for manufacturing the ceramic wiring member 1 of this embodiment, first, a green sheet to be the main body 10 is prepared. Specifically, Al ₂ O ₃ powder, which is the main component of the ceramic constituting the main body 10, at least one powder selected from the group consisting of SiO ₂ , CaO, MgO and MnO, which is a sintering aid, resin, solvent, etc. are mixed in a ball mill to obtain a slurry. This slurry is processed into a green sheet by a doctor blade method. In this way, the green sheet to be the main body 10 is obtained. Here, referring to FIG. 1, a plurality of green sheets having a rectangular planar shape are prepared as the green sheet to be the plate-shaped portion 11. A plurality of green sheets to be the first frame portion 13 and the second frame portion 12 are also prepared. The green sheet to become the first frame portion 13 and the second frame portion 12 is prepared as an annular green sheet having a rectangular planar shape with the portion (central portion) corresponding to the first cavity 22 and the second cavity 21 removed.

Next, a paste that will become the conductive portion 30, conductive layer 122, and wiring 51, 52, 53, 54, and 55 is printed on the prepared green sheet. Specifically, at least one of the metal components W, Mo, and Cu is first mixed with additives, resin, solvent, etc., and ceramic powder is further added as necessary, and the mixture is kneaded to create a paste.

This paste is printed, for example by screen printing, on the green sheets prepared earlier. At this time, referring to Figures 1 to 4, for the conductive portion 30, conductive layer 122, and wiring 51, 52, 53, 54, 55 that spread or extend within the XY plane, the paste is printed on the surface of the green sheets, and for those that extend in the Z-axis direction, through holes (vias) are formed that penetrate the green sheets in the thickness direction, and the through holes are filled with the paste. The green sheets on which the paste has been printed are then dried and stacked to obtain a laminate. This laminate is then fired to obtain the ceramic wiring member 1.

(Embodiment 2)
Next, a second embodiment of the present disclosure will be described. Fig. 6 is a schematic plan view showing a structure of a ceramic wiring member in the second embodiment. Fig. 6 corresponds to Fig. 3 of the first embodiment.

The ceramic wiring member 101 of the second embodiment basically has the same configuration as that of the first embodiment, has the same effects, and can be manufactured in the same manner. However, referring to Figures 6 and 3, the ceramic wiring member 101 of the second embodiment differs from the ceramic wiring member 1 of the first embodiment in the arrangement of the external connection terminals and internal wiring (vias). In the ceramic wiring member 101, the configurations common to the ceramic wiring member 1 are given the same reference numerals, and the description may be omitted.

The ceramic wiring member 101 of the second embodiment has a body portion similar to the body portion 10 in the ceramic wiring member 1 of the first embodiment. With reference to FIG. 6, a first frame portion 13 is provided on the first main surface 11B of the plate-shaped portion 11. Two pairs of external connection terminals, a first pair of external connection terminals 131 (131A, 131B) and a second pair of external connection terminals 132 (132A, 132B), are provided on the first end surface 13A of the first frame portion 13. When the first end surface 13A is viewed in a planar manner in the thickness direction of the first frame portion 13 (i.e., the state shown in FIG. 6), the first pair of external connection terminals 131 and the second pair of external connection terminals 132 are each disposed near each of the four corners of the first end surface 13A.

Each of the first pair of external connection terminals 131 (131A, 131B) and the second pair of external connection terminals 132 (132A, 132B) has a rectangular shape with a rectangular cutout at a portion close to the first cavity 22. One side of the outer edge of each of the first pair of external connection terminals 131 and the second pair of external connection terminals 132 is located at a position overlapping one of a pair of short sides L2, L4. Specifically, side 131a, which is one side of the outer edge of the first external input terminal 131A, and side 132b, which is one side of the outer edge of the second external output terminal 132B, are located at a position overlapping the short side L2 of the first end surface 13A. In addition, a side 131b which is one side of the outer edge of the first external output terminal 131B and a side 132a which is one side of the outer edge of the second external input terminal 132A are located at a position overlapping with a short side L4 of the first end surface 13A. None of the outer edges of the first pair of external connection terminals 131 (131A, 131B) and the second pair of external connection terminals 132 (132A, 132B) overlaps with the pair of long sides L1, L3. In other words, the first pair of external connection terminals 131 (131A, 131B) and the second pair of external connection terminals 132 (132A, 132B) are offset from the pair of long sides L1, L3. In other words, the outer edges of the first pair of external connection terminals 131 (131A, 131B) and the second pair of external connection terminals 132 (132A, 132B) are in contact with the short sides L2, L4, but are not in contact with the long sides L1, L3. In this way, when the external connection terminals are in contact with the short sides of the first frame portion, the two solder fillets can be seen at a closer distance when checking the shape of the solder fillets, which is preferable as it makes it easier to check the two solder fillets simultaneously while magnifying them more with the camera.

Wiring portions 151B, 152B, 153B, and 154B are connected to the first pair of external connection terminals 131 (131A, 131B) and the second pair of external connection terminals 132 (132A, 132B), respectively. Wiring portion 151B is provided inside via 141A, wiring portion 152B is provided inside via 141B, wiring portion 153B is provided inside via 142A, and wiring portion 154B is provided inside via 142B. The positional relationship between first external input terminal 131A and via 141A is as follows. That is, the center of the via 141A is located in a region q1 that is a region including an overlapping portion of the outer edge (side 131a) of the first external input terminal 131A and the outer edge (L2) of the first frame portion 13 among four regions divided by diagonal lines X1 and X2 of the virtual rectangle S in the smallest virtual rectangle S that includes the first external input terminal 131A. Similarly, in the first external output terminal 131B, the center of the via 141B is located in a region q1 that is a region including an overlapping portion of the outer edge (side 131b) of the first external output terminal 131B and the outer edge (L4) of the first frame portion 13. In the second external input terminal 132A, the center of the via 142A is located in a region q1 that is a region including an overlapping portion of the outer edge (side 132a) of the second external input terminal 132A and the outer edge (L4) of the first frame portion 13. In the second external output terminal 132B, the center of the via 142B is located within region q1, which is a region including the portion where the outer edge (side 132b) of the second external output terminal 132B and the outer edge (L2) of the first frame portion 13 overlap.

In the ceramic wiring member 101, the centers of the vias 141A, 141B, 142A, and 142B are located closer to the outer edges L1, L2, L3, and L4 than the center of a virtual line that connects the inner edges M1, M2, M3, and M4 of the first frame portion 13 to the outer edges L1, L2, L3, and L4 at the shortest distance. FIG. 6 shows a virtual line C1 that connects the centers of the virtual lines that correspond to each point on the outer edge and inner edge of the first frame portion 13. The centers of the vias 141A, 141B, 142A, and 142B are located outside the virtual line C1.

The length of the shortest straight line connecting the outer edge of vias 142A, 142B, 142A, 142B and the outer edge of first frame portion 13 is at least one time the diameter of vias 142A, 142B, 142A, 142B. In other words, the distance from the outer edge of vias 142A, 142B, 142A, 142B to the outer edge of first frame portion 13 is greater than diameter r1 of vias 142A, 142B, 142A, 142B. This configuration allows the stress applied to first frame portion 13 to be stably low.

As with ceramic wiring member 1, ceramic wiring member 101 is configured so that part of the outer edge of the external connection terminal overlaps part of the outer edge of the frame, allowing the area of the external connection terminal to be increased. In addition, because the outer edge of the external connection terminal overlaps only one side of the outer edge of the frame, it is easy to check for misalignment of the external connection terminal during manufacturing. In addition, when the ceramic wiring member is mounted on a wiring board, the shape of the solder fillet formed between the external connection terminal and the wiring board can be easily seen from the outside.

In addition, by arranging the vias in the above-mentioned positional relationship, even if part of the outer edge of the external connection terminal is offset from the outer edge of the frame, it is possible to place the vias at a position away from the center of the ceramic wiring member, thereby increasing the freedom of arrangement of the internal wiring and enabling the realization of a small package.

(Embodiment 3)
Next, a third embodiment of the present disclosure will be described. Figures 7(a) and (b) are schematic plan views showing the structure of a ceramic wiring member in the third embodiment. Figure 7(a) is a view corresponding to Figure 2 of the first embodiment. Figure 7(a) shows a first end surface 213A of a first frame portion 213, a first main surface 211B of a plate-shaped portion 211, and related configurations in a ceramic wiring member 201. Figure 7(b) is a schematic cross-sectional view showing a state cut along line b-b shown in Figure 7(a).

The ceramic wiring member 201 of embodiment 3 basically has the same configuration as that of embodiment 1, has the same effects, and can be manufactured in the same manner. However, referring to Figures 7 and 2, the ceramic wiring member 201 of embodiment 3 differs from the ceramic wiring member 1 of embodiment 1 in the shape of the main body and the configuration of the wiring. In addition, in the ceramic wiring member 201, the configuration common to the ceramic wiring member 1 is given the same reference numerals, and the description may be omitted.

7(a), the main body 210 of the ceramic wiring member 201 has recesses formed at four corners. Specifically, when the first end face 213A of the first frame 213 is viewed in a planar manner in the thickness direction of the first frame 213 (i.e., the state shown in FIG. 7(a)), the ceramic wiring member 201 has recesses 261, 262, 263, 264 at each of the four corners of the main body 210. The recesses 261, 262, 263, 264 are recesses extending in the thickness direction (Z-axis direction) of the ceramic wiring member 201. The recess 261 has a side conductive portion 271 made of a conductor formed along the recess 261. Similarly, the recesses 262, 263, 264 have side conductive portions 272, 273, 274 formed therein, respectively. The side conductive parts 271, 272, 273, and 274 may be provided on the side of the plate-shaped part 211 and the side of the first frame part 213. The side conductive parts 271, 272, 273, and 274 may form part of the wiring in the ceramic wiring member 201. These recesses form solder fillets, thereby improving the joint reliability between the ceramic wiring member 201 and the wiring board.

7(a) and (b), the side conductive portion 271 is connected to the first external input terminal 31A on the first end surface 213A. Thus, the side conductive portion 271 is connected to the first internal input terminal 36A (not shown in the figure). Similarly, the side conductive portion 272 is connected to the second external input terminal 32B on the first end surface 213A. Thus, the side conductive portion 272 is connected to the second internal output terminal 37B and the conductive layer 122. Similarly, the side conductive portion 273 is connected to the first external output terminal 31B on the first end surface 213A. Thus, the side conductive portion 273 is connected to the first internal output terminal 36B. Similarly, the side conductive portion 274 is connected to the second external input terminal 32A on the first end surface 213A. Thus, the side conductive portion 274 is connected to the second internal input terminal 37A.

The arrangement of the external connection terminals and vias in the ceramic wiring member 201 is the same as that in the ceramic wiring member 1 in the first embodiment, except that the side conductive parts 271, 272, 273, and 274 are connected to each of the two pairs of external connection terminals (31A, 31B, 32A, and 32B) on the first end face 213A. In the third embodiment, the smallest imaginary rectangle S that includes each of the external connection terminals is defined as shown in FIG. 7. When the side conductive parts are formed as in the third embodiment, the external connection terminal (e.g., the first external input terminal 31A) and the side conductive parts (e.g., the side conductive part 271) can be reasonably distinguished from each other based on their shapes or functions. That is, the side conductive part 271 is distinguished as a different configuration from the first external input terminal 31A. When the imaginary rectangle S that includes the first external input terminal 31A is assumed, the imaginary rectangle S is assumed with the side conductive part 271 excluded.

(Embodiment 4)
Next, a fourth embodiment of the present disclosure will be described. Fig. 8 is a schematic plan view showing a structure of a ceramic wiring member according to the fourth embodiment. Fig. 8 corresponds to Fig. 3 of the first embodiment.

The ceramic wiring member 301 of the fourth embodiment basically has the same configuration as that of the third embodiment, has the same effects, and can be manufactured in the same manner. With reference to FIG. 8 and FIG. 7, the ceramic wiring member 301 of the fourth embodiment has a main body 210 common to the ceramic wiring member 201 of the third embodiment. The main body 210 has recesses 261, 262, 263, and 264 at the four corners. The recesses 261, 262, 263, and 264 have side conductive portions 271, 272, 273, and 274 formed therein, respectively. On the other hand, the ceramic wiring member 301 of the fourth embodiment differs from the ceramic wiring member 201 of the third embodiment in the arrangement of the external connection terminals and the internal wiring (vias). In the ceramic wiring member 301, the configuration common to the ceramic wiring members described above is given the same reference numerals, and the description may be omitted.

The arrangement of the first pair of external connection terminals 131 (131A, 131B) and the second pair of external connection terminals 132 (132A, 132B) in the ceramic wiring member 301 is the same as that of the ceramic wiring member 101 of the second embodiment, and the same reference numerals are used and most of the description is omitted. The side 131a, which is one side of the outer edge of the first external input terminal 131A, and the side 132b, which is one side of the outer edge of the second external output terminal 132B, are located at a position overlapping the short side L2 of the first end surface 213A. In addition, the side 131b, which is one side of the outer edge of the first external output terminal 131B, and the side 132a, which is one side of the outer edge of the second external input terminal 132A, are located at a position overlapping the short side L4 of the first end surface 213A. In addition, the first pair of external connection terminals 131 (131A, 131B) and the second pair of external connection terminals 132 (132A, 132B) are offset from a pair of long sides L1, L3. In addition, the arrangement of vias 141A, 141B, 142A, and 142B in ceramic wiring member 301 is the same as that of ceramic wiring member 101 in embodiment 2, and the same reference numerals are used and the description is omitted.

(Embodiment 5)
Next, a fifth embodiment of the present disclosure will be described. Fig. 9 is a schematic plan view showing the structure of a ceramic wiring member in the fifth embodiment. Fig. 10 is a schematic cross-sectional view showing the structure of a ceramic wiring member in the fifth embodiment. Fig. 10 is a view corresponding to a cross section taken along line segment X-X shown in Fig. 9. Fig. 9 is a view corresponding to Figs. 2 and 3 of the first embodiment. Fig. 10 is a view corresponding to Fig. 1 of the first embodiment.

The ceramic wiring member 401 of the fifth embodiment basically has the same configuration as that of the first embodiment, has the same effects, and can be manufactured in the same manner. However, referring to Figures 9, 10, and 1 to 3, the ceramic wiring member 401 of the fifth embodiment differs from the ceramic wiring member 1 of the first embodiment in the shape of the main body, the wiring, and the configuration of the external connection terminals. Note that in the ceramic wiring member 401, configurations that are common to the configurations already described are given the same reference numerals, and descriptions thereof may be omitted.

9 and 10, the main body 410 of the ceramic wiring member 401 includes a plate-shaped portion 411, a first frame portion 413, and a second frame portion 412. The plate-shaped portion 411 has a flat plate shape. The shape of the plate-shaped portion 411 is not particularly limited, but in the ceramic wiring member 401, the planar shape of the plate-shaped portion 411 (direction perpendicular to the second main surface 411A; state of FIG. 9) is a quadrangle (approximately square). In other words, the first pair of opposite sides L1, L3 and the second pair of opposite sides L2, L4 are approximately the same length. The main body 410 of the ceramic wiring member 401 has a configuration basically similar to that of the main body 10 of the ceramic wiring member 1, except for the planar shape.

The ceramic wiring member 401 differs from the ceramic wiring member 1 in the configuration of the external connection terminals and wiring. With reference to FIG. 9, when the first end face 413A of the first frame portion 413 is viewed planarly in the thickness direction of the first frame portion 413 (i.e., the state shown in FIG. 9), the ceramic wiring member 401 has a first pair of external connection terminals 431 (431A, 431B), a second pair of external connection terminals 432 (432A, 432B), and a ground terminal 433 disposed near each of the four corners of the first end face 413A. The ground terminal 433 is an external connection terminal provided separately from the first pair of external connection terminals 431 (431A, 431B) and the second pair of external connection terminals 432 (432A, 432B). The first pair of external connection terminals 431 (431A, 431B), the second pair of external connection terminals 432 (432A, 432B), and the ground terminal 433 are each disposed on the first end surface 413A of the first frame portion 413. The ground terminal 433 is disposed adjacent to the second external output terminal 432B without contacting the second external output terminal 432B.

Each of the first pair of external connection terminals 431 (431A, 431B), the second pair of external connection terminals 432 (432A, 432B), and the ground terminal 433 has a rectangular shape. The second external output terminal 432B and the ground terminal 433 are rectangular in shape with an area that is approximately half that of the other external connection terminals. In the ceramic wiring member 401, one side of the outer edge of each of the first pair of external connection terminals 431, the second pair of external connection terminals 432, and the ground terminal 433 is located at a position overlapping one of the pair of long sides L1 and L3. Specifically, the side 431a, which is one side of the outer edge of the first external input terminal 431A, and the side 432a, which is one side of the outer edge of the second external input terminal 432A, are located at a position overlapping the side L1 of the first end face 413A. In addition, side 431b, which is one side of the outer edge of the first external output terminal 431B, side 432b, which is one side of the outer edge of the second external output terminal 432B, and side 433a, which is one side of the outer edge of the ground terminal 433, are located at a position overlapping side L3 of the first end surface 413A. None of the outer edges of the first pair of external connection terminals 431 (31A, 31B), the second pair of external connection terminals 32 (32A, 32B), and the ground terminal 433 overlaps with the pair of sides L2 and L4. In other words, the first pair of external connection terminals 31 (31A, 31B), the second pair of external connection terminals 32 (32A, 32B), and the ground terminal 433 are offset from the pair of sides L2 and L4.

The first pair of external connection terminals 431 (431A, 431B) and the second pair of external connection terminals 432 (432A, 432B) are connected to wiring portions 451B, 452B, 453B, and 454B, respectively. The ground terminal 433 is connected to wiring 455. The wiring portion 451B is provided to the via 441A, the wiring portion 452B is provided to the via 441B, the wiring portion 453B is provided to the via 442A, the wiring portion 454B is provided to the via 442B, and the wiring 455 is provided to the via 445. The vias 441A, 441B, 442A, 442B, and 445 are through holes that penetrate the first frame portion 413 in the thickness direction (Z-axis direction). The conductors filled in the vias, which are through holes, form the wiring.

The center of the via 441A is located in region q1, which is a region including the portion where the outer edge (side 431a) of the first external input terminal 431A overlaps with the outer edge (side L1) of the first frame portion 413, among the four regions divided by the diagonals X1 and X2 of the virtual rectangle S in the smallest virtual rectangle S that contains the first external input terminal 431A. Similarly, in the first external output terminal 431B, the center of the via 441B is located in region q1, which is a region including the portion where the outer edge (side 431b) of the first external output terminal 431B overlaps with the outer edge (side L3) of the first frame portion 413, among the regions divided by the diagonals of the virtual rectangle S in the smallest virtual rectangle S that contains the first external output terminal 431B. Similarly, in the second external input terminal 432A, the center of the via 442A is located within a region q1 that is a region divided by the diagonals of the virtual rectangle S in the smallest virtual rectangle S that contains the second external input terminal 432A and includes a portion where the outer edge (side 432a) of the second external input terminal 432A overlaps with the outer edge (side L1) of the first frame portion 413. Similarly, in the second external output terminal 432B, the center of the via 442B is located within a region q1 that is a region divided by the diagonals of the virtual rectangle S in the smallest virtual rectangle S that contains the second external output terminal 432B and includes a portion where the outer edge (side 432b) of the second external output terminal 432B overlaps with the outer edge (L3) of the first frame portion 413. The center of the via 445 is located within region q1, which is a region that includes the portion where the outer edge (side 433A) of the ground terminal 433 and the outer edge (L3) of the first frame portion 413 overlap, within the region bounded by diagonals X1 and X2 of the smallest imaginary rectangle S that contains the ground terminal 433.

In addition, in the ceramic wiring member 401, the centers of the vias 441A, 441B, 442A, 442B, and 445 are located closer to the outer edges L1, L2, L3, and L4 than the center of a virtual line that connects the inner edges M1, M2, M3, and M4 of the first frame portion 13 to the outer edges L1, L2, L3, and L4 at the shortest distance. Figure 9 shows a virtual line C1 that connects the centers of the virtual lines mentioned above. The centers of the vias 441A, 441B, 442A, 442B, and 445 are located outside the virtual line C1.

The configuration of the main body 410 and the wiring in the ceramic wiring member 401 will be described with reference to FIG. 10. The configurations of the plate-shaped portion 411, the first frame portion 413, the second frame portion 412 (frame body 428, conductive layer 429), the first cavity 422, and the second cavity 421 are the same as the corresponding configurations in the ceramic wiring member 1 of embodiment 1, and description thereof will be omitted.

Referring to Figures 9 and 10, the conductive portion 430 includes a first external input terminal 431A, a first external output terminal 431B, a second external input terminal 432A, a second external output terminal 432B, a ground terminal 433, a first internal input terminal 436A (not shown in the figure), a first internal output terminal 436B, a second internal input terminal 437A, and a second internal output terminal 437B.

The ground terminal 433 is electrically connected to the conductive layer 429 by wiring 455 as a ground wiring, without being electrically connected to the first external input terminal 431A, the first external output terminal 431B, the second external input terminal 432A, the second external output terminal 432B, the first internal input terminal 436A, the first internal output terminal 436B, the second internal input terminal 437A, and the second internal output terminal 437B. In other words, the wiring 455 connects between the conductive layer 429 and the ground terminal 433.

The first internal output terminal 436B and the first external output terminal 431B are electrically connected by a wire 452. Although not shown in FIG. 10, the first internal input terminal 436A and the first external input terminal 431A are electrically connected by a wire 451 (see FIG. 9). Although not shown in FIG. 10, the second internal input terminal 437A and the second external input terminal 432A are electrically connected by a wire 453 (see FIG. 9). The second internal output terminal 437B and the second external output terminal 432B are electrically connected by a wire 454.

The ceramic wiring member 401 employs a structure in which wiring connects between terminals as described above, but instead of the above connection, the first internal input terminal 436A and the second external input terminal 432A may be electrically connected by wiring. The first internal output terminal 436B and the second external output terminal 432B may be electrically connected by wiring. The second internal input terminal 437A and the first external input terminal 431A may be electrically connected by wiring. The second internal output terminal 437B and the first external output terminal 431B may be electrically connected by wiring.

(Embodiment 6)
A sixth embodiment, which is another embodiment of the present disclosure, will be described. Fig. 11 is a schematic plan view showing a structure of a ceramic wiring member in the sixth embodiment. Fig. 11 is a view corresponding to Fig. 9 of the fifth embodiment.

The ceramic wiring member 501 of the sixth embodiment basically has the same configuration as that of the fifth embodiment, has the same effects, and can be manufactured in the same manner. However, referring to FIG. 11 and FIG. 9, the ceramic wiring member 501 of the sixth embodiment differs from the ceramic wiring member 401 of the fifth embodiment in the arrangement of the external connection terminals. In the ceramic wiring member 501, the configuration common to the ceramic wiring member 401 is given the same reference numerals, and the description may be omitted. Below, the differences between the ceramic wiring member 501 and the ceramic wiring member 401 will be mainly described.

The ceramic wiring member 501 differs from the ceramic wiring member 401 in the arrangement of the second external output terminal 432B and the ground terminal 533. That is, in the ceramic wiring member 401 shown in FIG. 9, the second external output terminal 432B and the ground terminal 433 are arranged adjacent to each other at one corner of the first frame portion 413, with the ground terminal 433 arranged at the corner. The second external output terminal 432B is arranged closer to the center of the first frame portion 413 along the X-axis than the ground terminal 433. In contrast, in the ceramic wiring member 501 shown in FIG. 11, the arrangement of the second external output terminal 532B and the ground terminal 533 is reversed. That is, in the ceramic wiring member 501, the second external output terminal 532B is arranged at the corner. The ground terminal 433 is arranged closer to the center of the first frame portion 413 along the X-axis direction than the second external output terminal 532B.

(Seventh embodiment)
Seventh embodiment, which is another embodiment of the present disclosure, will be described. Fig. 12 is a schematic plan view showing a structure of a ceramic wiring member in the seventh embodiment. Fig. 12 is a view corresponding to Fig. 11 of the sixth embodiment.

The ceramic wiring member 601 of the seventh embodiment has a configuration basically similar to that of the sixth embodiment, has the same effects, and can be manufactured in the same manner. With reference to Figures 12 and 11, the ceramic wiring member 601 of the seventh embodiment differs from the ceramic wiring member 501 of the sixth embodiment in the arrangement of the external connection terminals. Below, the differences between the ceramic wiring member 601 and the ceramic wiring member 501 will be mainly described.

11, in the ceramic wiring member 501, one side of the outer edge of each of the first pair of external connection terminals 431 (431A, 431B), the second pair of external connection terminals 532 (432A, 532B), and the ground terminal 533 is located at a position overlapping one of the first pair of opposite sides L1, L3. Also, the first pair of external connection terminals 431, the second pair of external connection terminals 532, and the ground terminal 533 are offset from the second pair of opposite sides L2, L4. In contrast, in the ceramic wiring member 601, referring to FIG. 12, one side of the outer edge of each of the first pair of external connection terminals 631 (631A, 631B), the second pair of external connection terminals 632 (632A, 632B), and the ground terminal 633 is located at a position overlapping one of the second pair of opposite sides L2, L4. In addition, the first pair of external connection terminals 631, the second pair of external connection terminals 632, and the ground terminal 633 are offset from the first pair of opposite sides L1, L3.

(Modification)
In the first embodiment, the crystal unit 71 and the thermistor 72 are illustrated as examples of electronic components that can be mounted on the ceramic wiring member 1, but the electronic components that can be mounted on the ceramic wiring member of the present disclosure are not limited to these. For example, instead of the thermistor 72, an integrated circuit (IC) may be mounted on the internal terminals 37A and 37B of the ceramic wiring member 1. The IC may have a built-in thermistor.

In the first to fourth embodiments, the number of external connection terminals provided on the end face of the frame body is four, and in the fifth to seventh embodiments, the number of external connection terminals is five, but the number of external connection terminals is not limited to these. For example, in addition to the external connection terminals arranged at the corners of the frame body, further external connection terminals may be provided near the center of the sides of the frame body.

It should be understood that the embodiments disclosed herein are illustrative in all respects and are not limiting in any respect. The scope of the present disclosure is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims.

1, 101, 201, 301, 401, 501, 601 Ceramic wiring member, 10, 210, 410 Main body portion, 11, 411 Plate-shaped portion, 12, 412 Second frame portion, 13, 213, 413 First frame portion, 21, 421 Second cavity, 22, 422 First cavity 30, 430 Conductive portion, 31 (31A, 31B), 131 (131A, 131B), 32 (32A, 32B), 132 (132A, 132B), 431 (431A, 431B), 432 (432A, 432B), 532 (532B), 631, 632 External connection terminals, 36 (36A, 36B), 37 (37A, 37B), 436A, 436B, 437A, 437B Internal terminals, 41A, 41B, 42A, 42B, 141A, 141B, 142A, 142B, 441A, 441B, 442A, 442B, 445 Vias, 51, 52, 53, 54, 55, 451, 452, 453, 454, 455 Wiring, 71 Crystal oscillator, 72 Thermistor, 81 Lid, 121, 428 Frame, 122, 429 Conductive layer, 261, 262, 263, 264 Recesses, 271, 272, 273, 274 Side conductive portions, 433, 533, 633 Ground terminals.

Claims (9)

A main body made of ceramic;
A conductive portion is disposed in contact with the main body portion and is made of a conductor,
The main body portion is
A plate-shaped portion having a flat plate shape;
a first frame portion rising from the plate-like portion so as to surround a first cavity which is a space on a first main surface of the plate-like portion;
the first frame portion has a first end surface located on the opposite side to the plate-like portion in a thickness direction of the plate-like portion,
The conductive portion is
two pairs of external connection terminals disposed on the first end surface of the first frame portion;
two pairs of internal wirings passing through the first frame portion and connected to the two pairs of external connection terminals, respectively;
When the first end surface of the first frame portion is viewed in a planar manner in a thickness direction of the first frame portion,
one side of each of the two pairs of outer edges of the external connection terminals is located at a position overlapping one of two pairs of opposite sides that define an outer edge of the first end face of the first frame portion;
the other of the two pairs of opposite sides defining an outer edge of the first end face of the first frame portion is not in contact with any outer edge of the two pairs of external connection terminals,
a center of a via at a connection position between each of the two pairs of external connection terminals and each of the two pairs of internal wirings is located within a region that includes an overlapping portion of an outer edge of the external connection terminals and an outer edge of the first frame portion, among a region that is divided by a diagonal line of a smallest imaginary rectangle that includes the external connection terminals;
The length of the shortest straight line connecting the outer edge of the via and the outer edge of the first frame portion is equal to or greater than the diameter of the via.
Ceramic wiring components. A main body made of ceramic;
A conductive portion is disposed in contact with the main body portion and is made of a conductor,
The main body portion is
A plate-shaped portion having a flat plate shape;
a first frame portion rising from the plate-like portion so as to surround a first cavity which is a space on a first main surface of the plate-like portion;
the first frame portion has a first end surface located on the opposite side to the plate-like portion in a thickness direction of the plate-like portion,
The conductive portion is
two pairs of external connection terminals disposed on the first end surface of the first frame portion;
two pairs of internal wirings passing through the first frame portion and connected to the two pairs of external connection terminals, respectively;
When the first end surface of the first frame portion is viewed in a planar manner in a thickness direction of the first frame portion,
one side of each of the two pairs of outer edges of the external connection terminals is located at a position overlapping one of two pairs of opposite sides that define an outer edge of the first end face of the first frame portion;
the other of the two pairs of opposite sides defining an outer edge of the first end face of the first frame portion is not in contact with any outer edge of the two pairs of external connection terminals,
a center of a via at a connection position between each of the two pairs of external connection terminals and each of the two pairs of internal wirings is located closer to the outer edge of the first frame portion than a center of an imaginary line connecting an inner edge of the first frame portion and an outer edge of the first frame portion at the shortest distance;
The length of the shortest straight line connecting the outer edge of the via and the outer edge of the first frame portion is equal to or greater than the diameter of the via.
Ceramic wiring components. a center of a via at a connection position between each of the two pairs of external connection terminals and each of the two pairs of internal wirings is located closer to the outer edge of the first frame portion than a center of an imaginary line connecting an inner edge of the first frame portion and an outer edge of the first frame portion at the shortest distance;
The ceramic wiring member according to claim 1 . The length of the shortest straight line connecting the outer edge of the via and the outer edge of the first frame portion is at least one time the diameter of the via,
The above-mentioned condition is satisfied at all of the connection positions between the two pairs of the external connection terminals and the two pairs of the internal wirings.
The ceramic wiring member according to claim 1 or 2. When the first end surface of the first frame portion is viewed in a planar manner in a thickness direction of the first frame portion,
When the width of the narrowest portion of the width between the inner edge of the first frame portion and the width between the outer edge of the first frame portion is compared with the diameter of the via,
The width of the narrowest portion is 2.5 to 10 times the diameter of the via.
The ceramic wiring member according to claim 1 or 2. each of the two pairs of external connection terminals is located at a position overlapping a shorter side of two pairs of opposite sides that define an outer edge of the first end surface;
The ceramic wiring member according to claim 1 or 2. the main body portion further includes a second frame portion rising from the plate-like portion so as to surround a second cavity, which is a space on a second main surface located on the opposite side in the thickness direction to the first main surface of the plate-like portion;
Of the two pairs of internal wiring,
a first pair of internal wirings are connected to a pair of first internal terminals arranged in contact with a surface of the body portion facing the first cavity;
a second pair of internal wirings connected to a pair of second internal terminals arranged in contact with a surface of the body portion facing the second cavity;
The ceramic wiring member according to claim 1 or 2. the second frame portion has a second end surface located on the opposite side to the plate-like portion in a thickness direction of the plate-like portion,
the second frame portion includes a conductive region arranged to include the second end surface,
the conductive region is connected to one of the first pair of internal wirings and the second pair of internal wirings;
The conductive region and the external connection terminal are electrically connected to each other.
The ceramic wiring member according to claim 7 . a ground terminal different from the two pairs of external connection terminals is provided on the first end surface of the first frame portion;
the second frame portion has a second end surface located on the opposite side to the plate-like portion in a thickness direction of the plate-like portion,
the second frame portion includes a conductive region arranged to include the second end surface,
the conductive region is not connected to any of the first pair of internal wirings and the second pair of internal wirings,
The conductive region and the ground terminal are electrically connected to each other.
The ceramic wiring member according to claim 7 .

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