JP7616783B2 - Substrate Processing System - Google Patents

Description

This disclosure relates to a substrate processing system and a substrate processing method.

Patent Document 1 discloses a technique for removing multiple substrates from a carrier and arranging the multiple substrates at an equal pitch. The multiple substrates arranged at an equal pitch are immersed in multiple processing solutions in sequence and subjected to multiple processes in sequence. The pitch of the substrates is not changed while the multiple processes are being performed.

Japanese Patent Application Publication No. 11-233591

One aspect of the present disclosure provides a technique for processing substrates at an appropriate substrate pitch for each substrate processing solution.

A substrate processing system according to an aspect of the present disclosure includes a substrate alignment device that arranges a plurality of substrates, a first liquid processing device including a first tank that immerses the plurality of substrates in a first processing liquid while the substrates are arranged at a first pitch, a second liquid processing device including a second tank that immerses the plurality of substrates in a second processing liquid different from the first processing liquid while the substrates are arranged at a second pitch different from the first pitch, and a warpage measurement device that measures the amount of warpage of the substrates . The substrate alignment device includes a plurality of holding parts that are aligned in the substrate arrangement direction and hold the substrates different from each other, a moving mechanism that moves the plurality of holding parts relatively in the substrate arrangement direction, and a control unit that controls the moving mechanism. After the substrates are immersed in the first processing liquid and before the substrates are immersed in the second processing liquid, the control unit controls the moving mechanism to change the pitch of the substrates from the first pitch to the second pitch. The control unit acquires a measurement result of the warpage measurement device, and controls the moving mechanism based on the acquired amount of warpage to correct the pitch of the substrates.

According to one aspect of the present disclosure, substrates can be processed at an appropriate substrate pitch for each substrate processing solution.

FIG. 1 is a cutaway view of a housing of a substrate alignment device according to one embodiment. FIG. 2 is a diagram showing the state of the substrate arranging apparatus of FIG. 1 after the pitch has been changed. FIG. 3 is a plan view showing the substrate alignment apparatus of FIG. FIG. 4 is a plan view showing a modification of the substrate aligning apparatus of FIG. FIG. 5 is a plan view illustrating a substrate processing system according to an embodiment. FIG. 6 is a cross-sectional view showing an example of the first liquid processing apparatus of FIG. FIG. 7 is a cross-sectional view showing an example of the second liquid processing apparatus of FIG. FIG. 8 is a plan view showing a substrate processing system according to a first modified example. FIG. 9 is a plan view showing a substrate processing system according to a second modified example. FIG. 10 is a plan view showing a substrate processing system according to a third modified example. 11A and 11B are cross-sectional views showing an example of the amount of warping of a substrate, where (A) is a cross-sectional view showing an example of two substrates with convex curved surfaces facing each other, and (B) is a cross-sectional view showing an example of two substrates with a convex curved surface and a concave curved surface facing each other. FIG. 12 is a diagram showing an example of a substrate alignment device in which the substrates are aligned vertically. FIG. 13 is a diagram showing the state of the substrate arranging device of FIG. 12 after the pitch has been changed.

Embodiments of the present disclosure will be described below with reference to the drawings. Note that the same or corresponding configurations in each drawing are given the same reference numerals, and descriptions thereof may be omitted.

The substrate alignment device 1 will be described with reference to Figures 1 to 3. The substrate alignment device 1 arranges multiple substrates W at an equal pitch. The substrate alignment device 1 also changes the pitch of the substrates W while holding multiple substrates W. The pitch of the substrates W is changed within the range of P0 to P0 x α, where α is a number greater than 1.

The substrate W includes, for example, a silicon wafer. The substrate W may further include a film formed on the silicon wafer. The film is, for example, an oxide film or a nitride film. Multiple types of films may be stacked. The substrate W may include, instead of a silicon wafer, a compound semiconductor wafer or a glass substrate.

As shown in FIG. 1, the substrate alignment device 1 includes a plurality of holding parts 10, a movement mechanism 20, and a control unit 40. The plurality of holding parts 10 are arranged at equal pitch in the alignment direction of the substrates W (e.g., the Y-axis direction) and hold different substrates W from each other. The movement mechanism 20, for example, moves the plurality of holding parts 10 relatively in the alignment direction of the substrates W. The control unit 40 controls the movement mechanism 20.

Each of the multiple holding parts 10 has a holding groove 11 that holds the periphery of the substrate W. The holding groove 11 has, for example, a V-shaped cross section and holds the substrate W by sandwiching it. It is sufficient that the multiple holding parts 10 move relatively in the Y-axis direction, and one holding part 10 may be fixed so as not to move in the Y-axis direction. For example, the holding part 10 in the center in the Y-axis direction is fixed so as not to move in the Y-axis direction.

The moving mechanism 20 has, for example, a plurality of support parts 21, a rotating shaft 22, and a rotary motor 23. The plurality of support parts 21 individually support the plurality of holding parts 10. The rotating shaft 22 includes a plurality of guide grooves 22a that individually guide the plurality of support parts 21. The guide grooves 22a are curved lines that move in the axial direction of the rotating shaft 22 as the rotating shaft 22 rotates in the circumferential direction.

The rotating shaft 22 is a cylindrical cam, and the support parts 21 are passive links of the cylindrical cam. The rotation of the rotating shaft 22 causes the multiple support parts 21 to move relatively in the Y-axis direction. When one support part 21 is fixed so as not to move in the Y-axis direction, the number of guide grooves 22a may be less than the number of support parts 21.

The rotation motor 23 rotates the rotating shaft 22 under the control of the control unit 40. The control unit 40 controls the pitch of the holding unit 10 by controlling the rotation angle of the rotating shaft 22. The pitch of the holding unit 10 is changed within the range of P0 to P0 x α. The pitch of the holding unit 10 is equal to the pitch of the substrate W.

The configuration of the moving mechanism 20 is not limited to the configuration shown in FIG. 1 etc. The moving mechanism 20 only needs to be able to relatively move the multiple holding parts 10 in the arrangement direction of the substrate W. In this embodiment, the moving mechanism 20 relatively moves the multiple holding parts 10 in the arrangement direction of the substrate W while maintaining an equal pitch, but the technology of the present disclosure is not limited to this. It is sufficient that the multiple holding parts 10 are arranged at an equal pitch after the multiple holding parts 10 have been moved relatively. Furthermore, depending on the state of the substrate W or the processing content of the substrate W, the multiple holding parts 10 may be arranged at an unequal pitch rather than an equal pitch.

The control unit 40 is, for example, a computer, and includes a CPU (Central Processing Unit) 41 and a storage medium 42 such as a memory. The storage medium 42 stores programs that control the various processes executed in the substrate alignment device 1. The control unit 40 controls the operation of the substrate alignment device 1 by having the CPU 41 execute the programs stored in the storage medium 42.

The control unit 40 controls the moving mechanism 20 based on the processing content of the next process while multiple substrates W are held by multiple holding units 10. Therefore, the substrates W can be processed at an appropriate pitch for each substrate W processing. For example, the substrates W can be processed at an appropriate pitch for each type of processing liquid in which the substrates W are immersed.

The pitch of the substrates W is determined, for example, by the processing uniformity of the substrates W and the amount of processing liquid used. In general, the wider the pitch of the substrates W, the greater the amount of processing liquid present in the gaps between adjacent substrates W, improving the processing uniformity of the substrates W. On the other hand, the narrower the pitch of the substrates W, the smaller the volume of the processing tank and the less processing liquid used.

According to this embodiment, the substrates W can be processed at an appropriate pitch for each type of processing liquid. Therefore, the processing uniformity of the substrates W can be improved while suppressing the amount of processing liquid used for each type of processing liquid. The pitch for the substrates W may be selected based on processing conditions such as the type of processing liquid, the temperature of the processing liquid, or the number of substrates W.

Types of processing liquid include, for example, a chemical liquid and a rinse liquid. The chemical liquid etches, for example, the substrate W or dirt on the substrate W. The chemical liquid is not particularly limited, but is, for example, a phosphoric acid solution. The chemical liquid may be DHF (dilute hydrofluoric acid), BHF (a mixture of hydrofluoric acid and ammonium fluoride), or SC1 (a mixture of ammonia, hydrogen peroxide, and water), etc. The rinse liquid washes away the chemical liquid remaining on the substrate W. The rinse liquid is, for example, DIW (deionized water).

When the substrates W are immersed in the chemical liquid, the substrates W are arranged at a different pitch than when the substrates W are immersed in the rinse liquid. For example, the pitch of the substrates W is widened so that the chemical liquid can easily penetrate between the substrates W.

The substrate alignment device 1 comprises a housing 30 and a cover 32. The housing 30 houses the sliding part 24 of the movement mechanism 20. The sliding part 24 is a part that slides against each other while rubbing against each other. The sliding part 24 includes, for example, an end 21a of the support part 21 and a guide groove 22a of the rotating shaft 22. The end 21a of the support part 21 is inserted into the guide groove 22a of the rotating shaft 22 and moves along the guide groove 22a.

The cover 32 covers the opening 31 of the housing 30, and expands and contracts in accordance with the relative movement of the multiple holding parts 10. For example, the cover 32 is a bellows. The cover 32 is disposed between adjacent support parts 21 in the Y-axis direction. The cover 32 is also disposed between the support part 21 at one end in the Y-axis direction and the housing 30. The cover 32 is further disposed between the support part 21 at the other end in the Y-axis direction and the housing 30.

The cover 32 expands and contracts in accordance with the relative movement of the multiple holding parts 10, so that the opening 31 of the housing 30 can always be covered. The cover 32 can restrict particles generated at the sliding part 24 of the moving mechanism 20 from being released to the outside through the opening 31 of the housing 30. This makes it possible to prevent particles from adhering to the substrate W.

The substrate alignment device 1 may include an exhaust section 35 that exhausts gas from inside the housing 30. The exhaust section 35 has an exhaust source 36, such as a vacuum pump, and a pipe 37 that connects the exhaust source 36 to the housing 30. The exhaust source 36 may be provided outside the substrate alignment device 1, and the exhaust section 35 may have only the pipe 37.

When exhausting gas from inside the housing 30, the exhaust section 35 exhausts particles along with the gas. This prevents particles generated at the sliding section 24 of the movement mechanism 20 from being released to the outside through the opening 31 of the housing 30.

As shown in FIG. 3, the substrate alignment device 1 may have a plurality of holding units 12, each consisting of a plurality of holding parts 10 arranged at equal pitch in the Y-axis direction, which is the alignment direction of the substrates W, spaced apart in the X-axis direction, which is the direction perpendicular to the alignment direction of the substrates W. In FIG. 3, the multiple holding units 12 are spaced apart in the X-axis direction and arranged below the substrates W, but they may also be spaced apart in the Z-axis direction and arranged on both the top and bottom sides of the substrates W.

The multiple substrates W are arranged at equal pitch in the horizontal direction, and are each held vertically by multiple holding units 12. Since each substrate W is held at multiple points, the substrate W can be held stably while limiting contact between the substrate W and the holding part 10, thereby preventing contamination and damage to the substrate W.

As shown in Figures 12 and 13, multiple substrates W may be arranged at equal pitch in the vertical direction and each may be held horizontally by multiple holding units 12. In this case, one substrate W is held at multiple points, so that the substrate W can be held stably while limiting contact between the substrate W and the holding part 10, thereby suppressing contamination and damage to the substrate W.

As shown in FIG. 4, the substrate arrangement device 1 may further include a plurality of second holding parts 15 and a second moving mechanism 25. The plurality of second holding parts 15 are arranged at equal pitch in the arrangement direction of the substrates W, and hold different substrates W from each other. The second holding parts 15 are configured similarly to the holding part 10. The second moving mechanism 25 moves the plurality of second holding parts 15 relatively in the arrangement direction of the substrates W. The second moving mechanism 25 is configured similarly to the moving mechanism 20. The moving mechanism 20 and the second moving mechanism 25 simultaneously change the pitch of the holding parts 10 and the pitch of the second holding parts 15 while maintaining the pitch of the holding parts 10 and the pitch of the second holding parts 15 at the same pitch.

The holder 10 and the second holder 15 alternately hold the substrates W. For example, the substrate W-2 held by the second holder 15 is disposed between the substrates W-1 held by the adjacent holders 10. Furthermore, the substrate W-1 held by the holder 10 is disposed between the substrates W-2 held by the adjacent second holders 15.

When the holders 10 and the second holders 15 alternately hold the substrates W, the pitch of the holders 10 and the pitch of the second holders 15 are more than twice the pitch of the substrates W (twice in FIG. 4). The pitch of the holders 10 has a lower limit due to the structural constraints of the movement mechanism 20, but the substrates W can be arranged at a pitch narrower than that lower limit.

Although not shown, the substrate alignment device 1 may further include a plurality of third holding parts and a third movement mechanism. The plurality of third holding parts are aligned in the arrangement direction of the substrates W and hold different substrates W from each other. The third holding parts are configured similarly to the holding part 10. The third movement mechanism moves the plurality of third holding parts relatively in the arrangement direction of the substrates W. The third movement mechanism is configured similarly to the movement mechanism 20.

The holding unit 10, the second holding unit 15, and the third holding unit repeatedly hold the substrate W in the desired order. In this case, the pitch of the holding unit 10, the pitch of the second holding unit 15, and the pitch of the third holding unit are three times the pitch of the substrate W.

Next, the substrate processing system 2 on which the substrate arrangement device 1 shown in FIG. 1 etc. is mounted will be described with reference to FIG. 5. The substrate processing system 2 includes a loading/unloading section 5, an interface section 6, and a processing section 7. The loading/unloading section 5 is used for loading and unloading a carrier C containing multiple substrates W. The interface section 6 connects the loading/unloading section 5 to the processing section 7. The processing section 7 processes multiple substrates W in a batch. Multiple substrates W processed in a batch are also called a lot LT.

The loading/unloading section 5 has a mounting table 51 on which the carrier C is placed. The carrier C stores multiple substrates W (e.g., 25 substrates W) and is loaded into and unloaded from the loading/unloading section 5. Multiple carriers C are placed on the mounting table 51. Note that there is no particular limit to the number of carriers C that can be loaded.

The interface section 6 includes a transport device 61, a lot formation device 62, and a lot release device 63. The transport device 61 receives multiple substrates W from the carrier C, and transports the received substrates W to the lot formation device 62. The transport device 61 also receives multiple substrates W from the lot release device 63, and stores the received substrates W in the carrier C.

The lot forming device 62 arranges multiple (e.g., 50) substrates W received from the transport device 61 at equal pitches to form a lot LT. On the other hand, the lot releasing device 63 arranges multiple (e.g., 50) substrates W processed in the processing unit 7 at equal pitches and passes the substrates W to the transport device 61 to release the lot LT.

The processing section 7 has a transport area 71 extending in the X-axis direction. A transport device 72 is provided in the transport area 71. The transport device 72 has a transport arm 72a that holds multiple substrates W at equal pitch. The transport arm 72a moves horizontally (in the X-axis direction and the Y-axis direction). The transport arm 72a transports substrates W between devices adjacent to the transport area 71.

The transport arm 72a has multiple holding grooves (not shown) that hold the periphery of the substrate W in the arrangement direction of the substrates W. The holding grooves are arranged at both a first pitch P1 and a second pitch P2 that is different from the first pitch P1. Therefore, the transport arm 72a can hold multiple substrates W at both the first pitch P1 and the second pitch P2. The number of transport arms 72a is not limited to two, and may be one or three or more.

The processing section 7 includes, for example, a drying device 73, a liquid processing unit 74, and a substrate alignment device 1 adjacent to the transport region 71. The drying device 73 dries a plurality of substrates W. A plurality of liquid processing units 74 are provided, and a lot LT is processed by one of the liquid processing units 74. In this embodiment, a plurality of liquid processing units 74 are provided, but only one may be provided. The liquid processing unit 74 has a first liquid processing device 75 and a second liquid processing device 76.

As shown in FIG. 6, the first liquid processing device 75 immerses multiple substrates W in a first processing liquid L1. The first processing liquid L1 is, for example, a chemical liquid such as a phosphoric acid solution. The first liquid processing device 75 includes a first tank 75a and a first lifting device 75b. The first tank 75a stores the first processing liquid L1. The first lifting device 75b raises and lowers the multiple substrates W, arranged at equal pitch, between a position where they are immersed in the first processing liquid L1 stored in the first tank 75a and a position where they are lifted up from the first processing liquid L1 stored in the first tank 75a.

The first lifting device 75b has a lifting arm 75c that holds multiple substrates W at an equal pitch. The lifting arm 75c has holding grooves 75d that hold the periphery of the substrate W at a first pitch P1 in the arrangement direction of the substrates W. Therefore, the lifting arm 75c can arrange multiple substrates W at the first pitch P1. The number of lifting arms 75c is not limited to two, and may be one or three or more.

As shown in FIG. 7, the second liquid processing device 76 immerses multiple substrates W in a second processing liquid L2. The second processing liquid L2 is, for example, a rinse liquid such as DIW (deionized water). The second liquid processing device 76 includes a second tank 76a and a second lifting device 76b, similar to the first liquid processing device 75. The second tank 76a stores the second processing liquid L2. The second lifting device 76b raises and lowers the multiple substrates W, arranged at equal pitch, between a position where they are immersed in the second processing liquid L2 stored in the second tank 76a and a position where they are lifted up from the second processing liquid L2 stored in the second tank 76a.

The second lifting device 76b has a lifting arm 76c that holds multiple substrates W at an equal pitch. The lifting arm 76c has holding grooves 76d that hold the periphery of the substrates W at a second pitch P2 in the arrangement direction of the substrates W. Therefore, the lifting arm 76c can arrange multiple substrates W at the second pitch P2. The number of lifting arms 76c is not limited to two, and may be one or three or more.

The substrate alignment device 1 changes the pitch of the substrates W from the first pitch P1 to the second pitch P2 after the substrates W are immersed in the first processing liquid L1 and before the substrates W are immersed in the second processing liquid L2. The substrate alignment device 1 is common to multiple liquid processing units 74 and is disposed adjacent to one liquid processing unit 74. Compared to the case where a substrate alignment device 1 is provided for each liquid processing unit 74, the number of substrate alignment devices 1 can be reduced, and the substrate processing system 2 can be made smaller.

The control device 9 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs that control various processes executed in the substrate processing system 2. The control device 9 controls the operation of the substrate processing system 2 by having the CPU 91 execute the programs stored in the storage medium 92. The control device 9 may include a control unit 40 of the substrate arrangement device 1.

Next, the operation of the substrate processing system 2 will be described. First, the carrier C, containing multiple (e.g., 25) substrates W, is loaded into the loading/unloading section 5 and placed on the loading platform 51. Next, the transport device 61 in the interface section 6 removes the multiple substrates W from the carrier C and transports the removed substrates W to the lot formation device 62.

Next, the lot forming device 62 arranges the multiple (e.g., 50) substrates W received from the transport device 61 at equal pitches to form a lot LT. Thereafter, the transport device 72 of the processing section 7 receives the lot LT from the lot forming device 62 and transports the received lot LT to the first liquid processing device 75.

Next, the first liquid processing device 75 receives the lot LT from the transport device 72 and immerses the received lot LT in the first processing liquid L1. In the first processing liquid L1, the multiple substrates W are arranged at a first pitch P1. The first liquid processing device 75 then lifts the lot LT from the first processing liquid L1 and passes the lifted lot LT to the transport device 72. The transport device 72 then transports the received lot LT to the substrate arrangement device 1.

Next, the substrate alignment device 1 receives the lot LT from the transport device 72 and changes the pitch of the substrates W of the received lot LT from the first pitch P1 to the second pitch P2. Thereafter, the transport device 72 receives the lot LT from the substrate alignment device 1 and transports the received lot LT to the second liquid processing device 76.

The second liquid processing device 76 then receives the lot LT from the transport device 72 and immerses the received lot LT in the second processing liquid L2. In the second processing liquid L2, the multiple substrates W are arranged at a second pitch P2. The second liquid processing device then lifts the lot LT from the second processing liquid L2 and passes the lifted lot LT to the transport device 72. The transport device 72 then transports the received lot LT to the drying device 73.

Next, the drying device 73 receives the lot LT from the transport device 72 and dries the received lot LT. After that, the transport device 72 receives the lot LT from the drying device 73 and transports the received lot LT to the lot release device 63.

Next, the lot release device 63 receives the lot LT from the transport device 72 and arranges the multiple substrates W at the second pitch P2. After that, the transport device 61 in the interface section 6 receives the multiple substrates W from the lot release device 63 and stores the received substrates W in a carrier C. Then, the carrier C is transported out of the load/unload section 5.

Next, a substrate processing system 2 according to a first modified example will be described with reference to FIG. 8. Below, the differences between this modified example and the above embodiment will be mainly described. In this modified example, a substrate arrangement device 1 is provided for each liquid processing unit 74, and is disposed between the first liquid processing device 75 and the second liquid processing device 76. According to this modified example, the first liquid processing device 75, the substrate arrangement device 1, and the second liquid processing device 76 are arranged in the order of processing of the substrates W. Therefore, the transport path of the substrates W can be shortened, and throughput can be improved.

Next, a substrate processing system 2 according to a second modified example will be described with reference to FIG. 9. The following mainly describes the differences between this modified example and the above-described embodiment. In this modified example, a transport device 72 has a substrate arrangement device 1. The transport device 72 includes a plurality of holders 10 and a moving mechanism 20 as shown in FIG. 1, etc., instead of the transport arm 72a as shown in FIG. 5, etc.

Since the transport device 72 has the substrate arrangement device 1, it can change the pitch of the substrates W while holding multiple substrates W, and can change the pitch of the substrates W during transport. Therefore, unlike when the transport device 72 and the substrate arrangement device 1 are provided separately, there is no need to transfer the substrates W between the transport device 72 and the substrate arrangement device 1. This improves throughput.

Next, a substrate processing system 2 according to a third modified example will be described with reference to FIG. 10. The following mainly describes the differences between this modified example and the above-described embodiment. In this modified example, the substrate processing system 2 has a warpage amount measuring device 64. The warpage amount measuring device 64 is provided in, for example, the interface unit 6.

The warpage measuring device 64 measures the warpage WA (see FIG. 11) of the substrate W. The warpage measuring device 64 may inspect all of the substrates W that make up a lot LT, or may inspect selected substrates. When the pitch of the substrates W is constant, as is clear from FIG. 11, the greater the warpage WA, the smaller the width FW of the flow F of the processing liquid passing between adjacent substrates W.

Adjacent substrates W are arranged so that the surfaces on which devices such as electronic circuits are formed face each other. Therefore, adjacent substrates W are arranged so that the convex curved surfaces face each other, as shown in FIG. 11(A). Alternatively, adjacent substrates W may be arranged so that the concave curved surfaces face each other.

In addition, adjacent substrates W may be arranged so that the surfaces on which devices are formed face the same direction. Therefore, adjacent substrates W may be arranged so that the convex curved surface and the concave curved surface face each other, as shown in FIG. 11(B).

The control unit 40 of the substrate alignment device 1 acquires the measurement results of the warpage measurement device 64, controls the movement mechanism 20 based on the acquired warpage amount WA, and corrects the pitch of the substrates W. For example, the larger the warpage amount WA, the larger the pitch of the substrates W is set. As a result, the width FW of the flow F can be adjusted to the desired width, and the processing uniformity of the substrates W can be improved.

In this modified example, the first liquid processing device 75 has a substrate alignment device 1. The first liquid processing device 75 includes a plurality of holding parts 10 and a moving mechanism 20 shown in FIG. 1 etc., instead of the lifting arm 75c shown in FIG. 6.

The first liquid processing device 75 has a substrate alignment device 1, so that the substrates W can be aligned in the first processing liquid L1 at a pitch according to the amount of warping WA. When the amount of warping WA is zero, the substrates W are aligned in the first processing liquid L1 at a first pitch P1. The first pitch P1 is the reference pitch, and a correction is made to an appropriate pitch according to the amount of warping WA. As a result, the width FW of the flow F of the first processing liquid L1 can be set to the desired width, improving the uniformity of processing of the substrates W.

While the substrate alignment device 1 is immersed in the first processing liquid L1, the control unit 40 may prohibit exhaust by the exhaust unit 35. This can prevent the inside of the housing 30 from becoming negative pressure, and can prevent the first processing liquid L1 from being drawn into the inside of the housing 30 through the gap between the cover 32 and the housing 30. The control unit 40 may carry out exhaust by the exhaust unit 35 when the substrate alignment device 1 is pulled up from the first processing liquid L1.

However, if the cover 32 can completely seal the inside of the housing 30, the control unit 40 does not need to prohibit exhaust by the exhaust unit 35 while the substrate alignment device 1 is immersed in the first processing liquid L1.

In this modification, like the second modification, the transport device 72 also has the substrate alignment device 1, but it does not have to have this. The first liquid processing device 75 only needs to have the substrate alignment device 1. In this case, the first liquid processing device 75 corrects the pitch of the substrate W to a pitch corresponding to the amount of warping WA after receiving the substrate W from the transport device 72 and before immersing the substrate W in the first processing liquid L1. Also, in this case, the first liquid processing device 75 returns the pitch of the substrate W to the pitch before correction after lifting the substrate W from the first processing liquid L1 and before transferring the substrate W to the transport device 72.

The second liquid processing device 76 of this modified example does not have the substrate alignment device 1, but may have the substrate alignment device 1. In the latter case, the second liquid processing device 76 includes a plurality of holders 10 and a moving mechanism 20 shown in FIG. 1, etc., instead of the lifting arm 76c shown in FIG. 7. Since the second liquid processing device 76 has the substrate alignment device 1, the substrates W can be aligned in the second processing liquid L2 at a pitch according to the amount of warping WA. When the amount of warping WA is zero, the substrates W are aligned in the second processing liquid L2 at the second pitch P2. The second pitch P2 is the reference pitch, and is corrected to an appropriate pitch according to the amount of warping WA. As a result, the width FW of the flow F of the second processing liquid L2 can be set to the desired width, and the processing uniformity of the substrates W can be improved.

Although the embodiments of the substrate alignment device, transport device, substrate processing system, and substrate processing method according to the present disclosure have been described above, the present disclosure is not limited to the above-mentioned embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. Naturally, these also fall within the technical scope of the present disclosure.

This application claims priority based on Patent Application No. 2020-073095, filed with the Japan Patent Office on April 15, 2020, and the entire contents of Patent Application No. 2020-073095 are incorporated herein by reference.

1 Substrate alignment device 10 Holding unit 20 Moving mechanism 40 Control unit W Substrate

Claims (10)

a substrate arranging device for arranging a plurality of substrates;
a first liquid processing apparatus including a first tank for immersing the plurality of substrates arranged at a first pitch in a first processing liquid;
a second liquid processing device including a second tank for immersing the plurality of substrates in a second processing liquid different from the first processing liquid while the substrates are arranged at a second pitch different from the first pitch;
a warpage measuring device for measuring the warpage of the substrate;
Equipped with
the substrate arranging device includes a plurality of holding units arranged in an arrangement direction of the substrates and holding different substrates from each other, a moving mechanism that moves the plurality of holding units relatively in the arrangement direction of the substrates, and a control unit that controls the moving mechanism;
the control unit controls the moving mechanism after the substrate is immersed in the first processing liquid and before the substrate is immersed in the second processing liquid to change a pitch of the substrate from the first pitch to the second pitch ;
The control unit acquires a measurement result of the warpage amount measuring device, controls the moving mechanism based on the acquired warpage amount, and corrects a pitch of the substrate . the first processing liquid is a chemical liquid, and the second processing liquid is a rinse liquid that washes away the chemical liquid remaining on the substrate,
The substrate processing system of claim 1 , wherein the first pitch is greater than the second pitch. the chemical solution is an etching solution that etches the substrate or dirt on the substrate,
The substrate processing system of claim 2 , wherein the rinsing liquid is deionized water. a transfer device that transfers a plurality of the substrates to the first liquid treatment device and the second liquid treatment device,
The substrate processing system according to any one of claims 1 to 3, wherein the transport device comprises the substrate alignment device. a transfer device that transfers a plurality of the substrates to the first liquid treatment device, the second liquid treatment device, and the substrate arrangement device;
a plurality of liquid processing units each including the first liquid processing device and the second liquid processing device are provided;
4. The substrate processing system according to claim 1, wherein the substrate aligning device is disposed between the first liquid processing device and the second liquid processing device for each of the liquid processing units. a transfer device that transfers a plurality of the substrates to the first liquid treatment device, the second liquid treatment device, and the substrate arrangement device;
a plurality of liquid processing units each including the first liquid processing device and the second liquid processing device are provided;
4. The substrate processing system according to claim 1, wherein the substrate aligning device is common to a plurality of liquid processing units and is disposed adjacent to one of the liquid processing units. The substrate processing system according to any one of claims 1 to 6, wherein the substrate alignment device comprises a housing that houses a sliding part of the moving mechanism, and a cover that covers an opening of the housing and expands and contracts in accordance with the relative movement of the multiple holding parts . The substrate processing system according to claim 7 , wherein the substrate aligning device includes an exhaust unit that exhausts gas from inside the housing. the substrate aligning device includes a plurality of second holding units arranged in an alignment direction of the substrates and holding different substrates from each other, and a second moving mechanism that relatively moves the plurality of second holding units in the alignment direction of the substrates;
9. The substrate processing system according to claim 1, wherein the holding part and the second holding part alternately hold the substrates. the substrate aligning device has a plurality of holding units, each of which is composed of a plurality of the holding parts aligned in a substrate aligning direction, spaced apart in a direction perpendicular to the substrate aligning direction;
10. The substrate processing system according to claim 1, wherein the plurality of substrates are arranged in a horizontal direction and are held vertically by the plurality of holding units, respectively.

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