JP7619792B2 - Substrate Processing Equipment - Google Patents

Description

This application relates to a substrate processing apparatus.

Conventionally, substrate cleaning apparatuses have been proposed that clean substrates by immersing the substrates in a cleaning liquid and ultrasonically vibrating the cleaning liquid (for example, Patent Document 1). In this substrate cleaning apparatus, an ultrasonic vibrator is provided in a cleaning tank that stores the cleaning liquid. The ultrasonic vibrator is immersed in the cleaning liquid and is provided in the cleaning liquid at a distance from the substrate. The ultrasonic vibrator vibrates the cleaning liquid to generate cavitation, which is then applied to the substrate. This can improve the cleaning effect on the substrate.

In recent years, substrates with complex three-dimensional structures have appeared. For example, as MEMS (microelectromechanical systems) devices become more sophisticated, they are becoming more miniaturized, layered, and three-dimensional. A three-dimensional structure is formed on the surface of the substrate during the manufacture of the device, and a space may be formed inside the three-dimensional structure.

If the substrate cleaning device of Patent Document 1 is applied to such a substrate, there is a risk that the three-dimensional structure will collapse due to cavitation.

In response to this, substrate processing apparatuses that do not utilize cavitation have also been proposed (for example, Patent Document 2). Patent Document 2 discloses a batch-type substrate processing apparatus that processes multiple substrates at once. This substrate processing apparatus includes a storage tank in which a processing liquid is stored. A carrier containing multiple substrates is carried into the storage tank. The carrier is immersed in the processing liquid, causing the processing liquid to act on the multiple substrates, and processing according to the processing liquid is performed on the multiple substrates at once.

JP 2000-107710 A JP 2012-199371 A

However, with the technology described in Patent Document 2, when the processing liquid enters the internal space of the three-dimensional structure of the substrate, the processing liquid is likely to remain in the internal space because the internal space is narrow. Therefore, it is difficult to replace old processing liquid with new processing liquid in the internal space, and there is a risk that the processing of the substrate will be insufficient.

Therefore, the present application aims to provide a substrate processing apparatus that can more appropriately process multiple substrates at the same time.

A first aspect of a substrate processing apparatus is a substrate processing apparatus for processing a plurality of substrates simultaneously, comprising: a storage tank for storing a processing liquid; a supply pipe for supplying the processing liquid into the storage tank; a mounting member having a pair of support legs, for storing a plurality of substrates in an upright position, and having an opening at its bottom, on which a carrier is placed while immersed in the processing liquid in the storage tank, the mounting member having an abutment member that abuts against the carrier; and a vibrator provided on the mounting member, the supply pipe being positioned below the mounting member and supplying the processing liquid toward above the storage tank , the abutment member abutting against an end of the support leg below the carrier so that the opening is not blocked in a plan view.

The second aspect of the substrate processing apparatus is the substrate processing apparatus according to the first aspect, in which the vibrator vibrates at a frequency of 1 MHz or more and 3 MHz or less.

A third aspect of the substrate processing apparatus is a substrate processing apparatus according to the first or second aspect , in which a plurality of the vibrators are provided, a first vibrator of the plurality of vibrators is provided on the mounting member near one of the pair of support legs, and a second vibrator of the plurality of vibrators is provided on the mounting member near the other of the pair of support legs.

A fourth aspect of the substrate processing apparatus is a substrate processing apparatus according to any one of the first to third aspects, in which at least one of the mounting member and the carrier is made of quartz.

A fifth aspect of the substrate processing apparatus is a substrate processing apparatus according to any one of the first to fourth aspects, further comprising a rocking mechanism for rocking the placement member.

A sixth aspect of the substrate processing apparatus is the substrate processing apparatus according to the fifth aspect, in which the rocking mechanism rocks the placement member along the thickness direction of the plurality of substrates.

According to the first aspect of the substrate processing apparatus, the vibration of the vibrator is transmitted to the carrier and the multiple substrates via the mounting member. In other words, the vibration is transmitted to the multiple substrates only through solid objects. This allows the vibration to be transmitted to the substrates without significant degradation. Therefore, the substrates can be vibrated at the desired frequency and amplitude.

The substrate is vibrated within the processing liquid, allowing the processing liquid to act on the substrate more effectively. For example, even if a three-dimensional structure is formed on the substrate, the processing liquid can easily enter and exit the internal space of the three-dimensional structure, so that old processing liquid is replaced with new processing liquid in the internal space, allowing the substrate to be appropriately processed.

According to the second aspect of the substrate processing apparatus, cavitation is less likely to occur, so that defects such as the collapse of three-dimensional structures or pattern collapse on the substrate caused by cavitation can be suppressed.

According to the third aspect of the substrate processing apparatus, vibrations can be transmitted to the substrate more uniformly.

According to the fourth aspect of the substrate processing apparatus, vibrations can be transmitted to the substrate quickly without causing significant degradation.

According to the fifth aspect of the substrate processing apparatus, the replacement of the processing liquid within the three-dimensional structure of the substrate can be further promoted.

According to the sixth aspect of the substrate processing apparatus, the main surface of the substrate is pressed against the processing liquid with high pressure by the oscillation in the thickness direction, which further promotes replacement of the processing liquid within the three-dimensional structure of the substrate.

1 is a side cross-sectional view roughly illustrating an example of a configuration of a substrate processing apparatus according to a first embodiment. 2 is a diagram illustrating an example of a configuration of a carrier C and a mounting member. FIG. FIG. 2 is a plan view illustrating an example of a configuration of a mounting member. 2 is a diagram illustrating an example of an internal configuration of a control unit. FIG. FIG. 11 is a side cross-sectional view illustrating an example of a configuration of a substrate processing apparatus according to a second embodiment. FIG. 2 is a diagram illustrating an example of a configuration of a swing mechanism.

The following describes the embodiments with reference to the attached drawings. The drawings are schematic, and for the sake of convenience, configurations are omitted and simplified as appropriate. The size and positional relationship of the components shown in the drawings are not necessarily described accurately, and may be changed as appropriate. In each drawing, an XYZ orthogonal coordinate system is appropriately attached, with the Z axis direction being the vertical direction and the XY plane being the horizontal plane, in order to clarify the positional relationship of the components. Hereinafter, one side in the Z axis direction (here, the vertical upper side) will be referred to as the +Z side, and the other side in the Z axis direction (here, the vertical lower side) will also be referred to as the -Z side. The same applies to the X axis and Y axis.

In addition, in the following description, similar components are illustrated with the same reference symbols, and their names and functions are also similar. Therefore, detailed descriptions of them may be omitted to avoid duplication.

In addition, even if ordinal numbers such as "first" or "second" are used in the following description, these terms are used for convenience to facilitate understanding of the contents of the embodiments, and are not limited to the ordering that may result from these ordinal numbers.

Expressions showing relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) not only strictly express that positional relationship, but also express a state in which the two are relatively displaced in terms of angle or distance within a range in which a tolerance or similar function is obtained, unless otherwise specified. Expressions showing an equal state (e.g., "same," "equal," "homogeneous," etc.) not only strictly express a state in which the two are quantitatively equal, but also express a state in which there is a difference in which a tolerance or similar function is obtained, unless otherwise specified. Expressions showing a shape (e.g., "square shape" or "cylindrical shape," etc.) not only strictly express that shape geometrically, but also express a shape that has, for example, irregularities or chamfers, within a range in which a similar effect is obtained, unless otherwise specified. The expressions "comprise," "include," "have," "includes," "includes," or "has" a component are not exclusive expressions that exclude the presence of other components. The expression "at least one of A, B, and C" includes only A, only B, only C, any two of A, B, and C, and all of A, B, and C.

First Embodiment
1 is a side cross-sectional view showing an example of the configuration of a substrate processing apparatus 10 according to a first embodiment. The substrate processing apparatus 10 is a batch-type processing apparatus that processes a plurality of substrates W collectively.

The substrate W to be processed has a flat plate shape, and has, for example, a substantially circular shape when viewed along the thickness direction of the substrate W. The substrate W is, for example, a semiconductor substrate. As the semiconductor substrate, for example, a silicon substrate or a silicon carbide substrate can be used. Various three-dimensional structures can be formed on the main surface of the substrate W. The substrate W is, for example, a substrate in the process of manufacturing a MEMS device. A space into which liquid can enter can be formed inside this three-dimensional structure.

Multiple substrates W are transported into the substrate processing apparatus 10 while being accommodated in a carrier (substrate container) C. FIG. 2 is a front view showing a schematic configuration of an example of a carrier C. Below, an example of a carrier C will first be described.

<Career>
The carrier C has a box shape with openings on the +Z side and the -Z side. Hereinafter, the opening on the +Z side and the opening on the -Z side of the carrier C are also referred to as the upper opening 9a and the lower opening 9b, respectively. Each of the multiple substrates W is inserted into the inside of the carrier C from the upper opening 9a of the carrier C in an upright position. The upright position here means a position in which the thickness direction of the substrate W is aligned horizontally. The multiple substrates W are accommodated inside the carrier C in a state lined up along their thickness direction.

1 and 2, the carrier C includes a front wall 91, a rear wall 92, a side wall 93, a side wall 94, and a pair of support legs 95, 96. The front wall 91 and the rear wall 92 face each other with a gap in the thickness direction of the substrate W (here, the Y direction). Here, the front wall 91 is provided on the -Y side of the rear wall 92. The side walls 93 and 94 face each other with a gap in a direction perpendicular to the thickness direction of the substrate W and horizontally (here, the X direction). Here, the side wall 93 is provided on the -X side of the side wall 94. The side wall 94 connects the +X side end of the front wall 91 and the +X side end of the rear wall 92, and the side wall 93 connects the -X side end of the front wall 91 and the -X side end of the rear wall 92. As a result, the front wall 91, the rear wall 92, the side wall 93, and the side wall 94 form an internal space of the carrier C. The internal space of the carrier C, surrounded by the front wall 91, the rear wall 92, the side wall 93, and the side wall 94, is open at its upper part to form an upper opening 9a, and at its lower part to form a lower opening 9b.

The inner surfaces of sidewalls 93 and 94 are inclined at their -Z ends (lower portions) so that they approach each other as they move toward the -Z side. Multiple substrates W abut against the -Z side portions of the inner surfaces of sidewalls 93 and 94, and are thereby supported within carrier C.

The inner surface of the sidewall 93 and the inner surface of the sidewall 94 are formed with protrusions (not shown) for sandwiching each substrate W along the thickness direction. More specifically, the inner surface of the sidewall 93 has a plurality of protrusions formed in a line along the thickness direction of the substrate W, and the inner surface of the sidewall 94 has a plurality of protrusions formed in a line along the thickness direction of the substrate W. As a result, a groove is formed between two adjacent protrusions on each of the sidewalls 93 and 94. The -X side portion of the periphery of each substrate W is inserted into the groove of the sidewall 93, and the +X side portion of the periphery of each substrate W is inserted into the groove of the sidewall 94. As a result, each substrate W abuts against the protrusion of the carrier C and is stored in the carrier C in an upright position.

Support leg 95 is provided at the -Z end (lower end) of side wall 93, and support leg 96 is provided at the -Z end (lower end) of side wall 94. Support leg 95 and support leg 96 face each other with a gap in between in the X direction.

<Substrate Processing Apparatus>
The substrate processing apparatus 10 includes a storage tank 2, a processing liquid supply unit 3, a mounting member 41, an oscillator 5, and a control unit 6. Each component will be generally described below, and then a specific example will be described in detail.

The storage tank 2 stores a processing liquid. The processing liquid is a liquid for performing processing on a plurality of substrates W. As the processing liquid, for example, a rinse liquid such as pure water and isopropyl alcohol, or a chemical liquid such as hydrofluoric acid can be used. Here, a chemical liquid is used as an example.

The processing liquid supply unit 3 is controlled by the control unit 6 and supplies processing liquid to the storage tank 2. The processing liquid supply unit 3 includes a supply pipe 31, which has an outlet 31a. The outlet 31a of the supply pipe 31 opens in the storage tank 2, and the processing liquid is discharged from the outlet 31a into the storage tank 2. This causes the processing liquid to be stored in the storage tank 2.

The mounting member 41 is a member on which the carrier C is placed. The mounting member 41 is provided inside the storage tank 2 and supports the carrier C. Specifically, the -Z side end (lower end) of the carrier C abuts against the +Z side surface (upper surface) of the mounting member 41. With the carrier C placed on the mounting member 41, the carrier C and the multiple substrates W are immersed in the processing liquid in the storage tank 2.

The vibrator 5 is provided on the mounting member 41. The vibrator 5 vibrates under the control of the control unit 6. The vibrator 5 is in contact with the mounting member 41, and as a specific example, the vibrator 5 is embedded in the mounting member 41.

The vibration of the vibrator 5 is transmitted to the multiple substrates W via the mounting member 41 and the carrier C. The vibrator 5 is in contact with the mounting member 41, which is in contact with the lower end of the carrier C (the lower ends of the support legs 95, 96 in the figure), and the carrier C is in contact with the multiple substrates W inside it, so that the vibration from the vibrator 5 can be transmitted to the substrates W only via the solid bodies of the mounting member 41 and the carrier C. In other words, no processing liquid is present in this vibration transmission path.

The control unit 6 controls the entire substrate processing apparatus 10. Specifically, the control unit 6 controls the processing liquid supply unit 3 and the vibrator 5.

Specifically, first, the control unit 6 controls the processing liquid supply unit 3 to supply the processing liquid into the storage tank 2. As a result, the processing liquid is stored in the storage tank 2. Then, the carrier C is transported onto the mounting member 41 by a transport device (not shown). As a result, the carrier C and the multiple substrates W are immersed in the processing liquid in the storage tank 2. In this state, the control unit 6 vibrates the vibrator 5.

The vibration of the vibrator 5 is transmitted to the multiple substrates W via the vibration transmission path, so that the multiple substrates W vibrate relative to the processing liquid. Moreover, since the vibration transmission path is composed only of solids, the vibration can be transmitted to the substrates W with reduced deterioration. In other words, the vibration can be rapidly transmitted to the substrates W while reducing the decrease in frequency and amplitude.

Since the substrate W vibrates with respect to the processing liquid at a predetermined frequency and amplitude, the processing liquid can easily enter and exit the internal space of the three-dimensional structure of the substrate W. In other words, it is possible to prevent the processing liquid from stagnating in the internal space of the three-dimensional structure, and to promote the replacement of old processing liquid with new processing liquid in the internal space. As a result, it is possible to prevent or avoid insufficient processing of the substrate W in the internal space. In other words, the substrate W can be appropriately processed.

A specific example of each component of the substrate processing apparatus 10 is described in detail below.

<Storage tank>
In the example of Fig. 1, the storage tank 2 has a double structure including an inner tank space 2a and an outer tank space 2b. In the example of Fig. 1, the storage tank 2 includes a bottom 21, a peripheral wall 22, and a partition member 23. The bottom 21 has a plate-like shape and is provided with its thickness direction along the Z direction. The peripheral wall 22 is erected on the periphery of the bottom 21 and extends along the +Z side.

The partition member 23 divides the internal space of the storage tank 2 surrounded by the bottom 21 and the peripheral wall 22 into an inner tank space 2a and an outer tank space 2b. The partition member 23 extends along the Z direction in the internal space of the storage tank 2, and its -Z end (lower end) is connected to the bottom 21. In the example of FIG. 1, the space on the -X side of the partition member 23 corresponds to the inner tank space 2a, and the space on the +X side corresponds to the outer tank space 2b. The +Z end (upper end) of the partition member 23 is located on the -Z side of the +Z end (upper end) of the peripheral wall 22. In other words, the partition member 23 is lower than the peripheral wall 22. The treatment liquid is supplied into the storage tank 2 until the liquid level becomes higher than the +Z end of the partition member 23. In other words, the treatment liquid is stored in both the inner tank space 2a and the outer tank space 2b.

<Processing liquid supply unit>
In the example of Fig. 1, the processing liquid supply unit 3 includes a supply pipe 31 and a valve 32. In the example of Fig. 1, a downstream portion of the supply pipe 31 is provided in the inner tank space 2a of the storage tank 2 near the bottom 21. In the example of Fig. 1, a mounting member 41 is also provided in the inner tank space 2a of the storage tank 2, and the downstream portion of the supply pipe 31 is provided on the -Z side of the mounting member 41. The downstream portion of the supply pipe 31 extends, for example, along the Y direction, and a plurality of discharge ports 31a are formed on its outer circumferential surface. The plurality of discharge ports 31a are formed side by side in the Y direction, and the processing liquid is discharged from each of the discharge ports 31a.

The supply pipe 31 is connected at its upstream end to a processing liquid supply source 33. The processing liquid supply source 33 supplies processing liquid to the upstream end of the supply pipe 31.

The valve 32 is disposed in the upstream portion of the supply pipe 31. The valve 32 is controlled by the control unit 6, and when the valve 32 is opened, the processing liquid is supplied from the processing liquid supply source 33 through the supply pipe 31 into the inside of the storage tank 2. Specifically, the processing liquid is supplied to the inner tank space 2a. As a result, the liquid level of the processing liquid gradually rises in the inner tank space 2a and exceeds the +Z end of the partition member 23. As a result, the processing liquid overflows into the outer tank space 2b. Then, the liquid level of the processing liquid gradually rises in the outer tank space 2b as well, and eventually exceeds the +Z end of the partition member 23.

A drain pipe (not shown) is connected to the storage tank 2 as appropriate, and the treatment liquid in the storage tank 2 can be discharged to the outside by opening a valve installed in the drain pipe.

<Circulation section>
1, the substrate processing apparatus 10 is provided with a circulation unit 7. The circulation unit 7 includes a circulation pipe 71, a pump 72, and a filter 73. An upstream end of the circulation pipe 71 is connected to the bottom 21 in the outer bath space 2b, and a downstream end of the circulation pipe 71 is connected to the bottom 21 in the inner bath space 2a. The filter 73 is provided in the circulation pipe 71 and captures impurities in the processing liquid in the circulation pipe 71. The pump 72 is provided in the circulation pipe 71. The pump 72 is controlled by the control unit 6 and sends the processing liquid in the circulation pipe 71 from the upstream end to the downstream end.

As a result, the treatment liquid in the storage tank 2 returns to the storage tank 2 through the circulation pipe 71. In other words, the treatment liquid circulates through the storage tank 2 and the circulation pipe 71.

<Placement Member>
Fig. 3 is a plan view that shows a schematic example of the configuration of the mounting member 41. In the example of Fig. 3, an opening 41a is formed in the mounting member 41. The opening 41a penetrates the mounting member 41 along the Z direction.

In the example of FIG. 3, the mounting member 41 includes a frame body 411 and four abutment members 412. The frame body 411 has a rectangular frame shape in a plan view (i.e., when viewed along the Z direction). The frame body 411 is disposed with one side aligned along the X direction.

The four abutment members 412 are provided near the four vertices of the frame body 411, and more specifically, are connected to the inner surfaces of the vertices of the frame body 411. In the example of FIG. 3, each abutment member 412 has a rectangular shape in a plan view, and two mutually perpendicular sides of each abutment member 412 are connected to the inner surface of the frame body 411. These abutment members 412 protrude inward from the inner surface of the frame body 411.

The four abutment members 412 are also referred to as abutment members 412a to 412d. The abutment members 412a and 412b are spaced apart in the Y direction, with the abutment member 412a located on the +Y side of the abutment member 412b. The abutment members 412c and 412d are spaced apart in the Y direction, with the abutment member 412c located on the +Y side of the abutment member 412d. The abutment members 412a and 412c are spaced apart in the X direction, with the abutment member 412a located on the -X side of the abutment member 412c. The abutment members 412b and 412d are spaced apart in the X direction, with the abutment member 412b located on the -X side of the abutment member 412d.

In such a mounting member 41, the space surrounded by the structure consisting of the frame body 411 and the four abutment members 412 corresponds to the opening 41a.

Support legs 95, 96 of carrier C are placed on abutment members 412. Specifically, the +Y side and -Y side portions of support leg 95 contact abutment members 412a, 412b, respectively, and the +Y side and -Y side portions of support leg 96 contact abutment members 412c, 412d, respectively.

In the example of FIG. 1, the mounting member 41 is supported by a hanging member 42. The hanging member 42 extends in the Z direction, and its -Z end (lower end) is connected to the +Y end of the mounting member 41. The hanging member 42 protrudes further toward the +Z side than the storage tank 2, and is fixed within the substrate processing apparatus 10. For example, if a chamber is provided to house the storage tank 2, the hanging member 42 is fixed to the chamber.

In addition, the mounting member 41 may be appropriately provided with a positioning structure for determining the horizontal position of the carrier C, or a holding mechanism for holding the carrier C.

<Transducer>
The transducer 5 is an ultrasonic transducer, and includes, for example, a piezoelectric element. As a specific example, the transducer 5 includes a piezoelectric body such as a piezoelectric ceramic, and a pair of electrodes provided on the piezoelectric body. The pair of electrodes are in contact with the piezoelectric body, and a driving voltage is applied between the pair of electrodes, so that the driving voltage is applied to the piezoelectric body. The piezoelectric body contracts or expands in response to the driving voltage. In the example of FIG. 1, the pair of electrodes are electrically connected to an oscillator 51. The oscillator 51 is controlled by the control unit 6, and applies a driving voltage between the electrodes of the transducer 5. The oscillator 51 outputs, for example, a high-frequency voltage as a driving voltage to the transducer 5. The piezoelectric body of the transducer 5 vibrates by alternately repeating contraction and expansion in response to the driving voltage from the oscillator 51.

The vibrator 5 is embedded, for example, inside the mounting member 41, and at least a portion of it is in contact with the mounting member 41. This allows the vibration of the piezoelectric body to be transmitted directly to the mounting member 41 via the contact point.

In addition, since the mounting member 41 is made of a material that is chemically resistant to the processing liquid, when the vibrator 5 is embedded in the mounting member 41, the mounting member 41 can protect the vibrator 5 from the processing liquid. Examples of the chemically resistant material that can be used include resins such as polyvinyl chloride resin or fluorine-based resin, or quartz.

When the vibrator 5 is not embedded in the mounting member 41, the vibrator 5 may further include a protective member (package) for surrounding and sealing the piezoelectric body and the pair of electrodes. The material of the protective member may be a material that is chemically resistant to the processing liquid, such as a resin such as polyvinyl chloride resin or a fluororesin, or quartz. The protective member contacts at least one of the piezoelectric body and the pair of electrodes. Such a vibrator 5 is attached to the surface of the mounting member 41, and at least a part of the package of the vibrator 5 contacts the surface of the mounting member 41. This allows the vibration of the piezoelectric body to be transmitted to the mounting member 41 via the package. In other words, the vibration of the piezoelectric body can be transmitted to the mounting member 41 only via a solid.

In the example of FIG. 3, a plurality of (four in the example shown) vibrators 5a to 5d are provided as the vibrator 5. The four vibrators 5a to 5d are provided on the four abutment members 412, respectively. This allows the four vibrators 5a to 5d to be provided near the support legs 95, 96 of the carrier C. Specifically, the vibrators 5a and 5b (corresponding to the first vibrator) are provided near the support leg 95 of the carrier C, and the vibrators 5c and 5d (corresponding to the second vibrator) are provided near the support leg 96 of the carrier C. In other words, the vibrators 5a and 5b are provided at a position closer to the support leg 95 than the support leg 96, and the vibrators 5c and 5d are provided at a position closer to the support leg 96 than the support leg 95.

Also, the vibrator 5a is provided near the +Y side end of the support leg 95, and the vibrator 5b is provided near the -Y side end of the support leg 95. In other words, the vibrator 5a is provided at a position closer to the +Y side end of the support leg 95 than the -Y side end, and the vibrator 5b is provided at a position closer to the -Y side end of the support leg 95 than the +Y side end. The vibrator 5c is provided near the +Y side end of the support leg 96, and the vibrator 5d is provided near the -Y side end of the support leg 96. In other words, the vibrator 5c is provided at a position closer to the +Y side end of the support leg 96 than the -Y side end, and the vibrator 5d is provided at a position closer to the -Y side end of the support leg 96 than the +Y side end.

This arrangement allows the four vibrators 5a to 5d to transmit vibrations more evenly to the carrier C. As a result, multiple substrates W can be vibrated more evenly, improving the uniformity of processing of the substrates W.

<Control Unit>
FIG. 4 is a block diagram showing an example of the configuration of the control unit 6. The control unit 6 is an electronic circuit device and may have, for example, a data processing device 61 and a storage medium 62. The data processing device 61 may be, for example, an arithmetic processing device such as a CPU (Central Processor Unit). The storage medium 62 may have a non-transient storage medium 621 (for example, a ROM (Read Only Memory) or a hard disk) and a temporary storage medium 622 (for example, a RAM (Random Access Memory)). The non-transient storage medium 621 may store, for example, a program that specifies the processing to be executed by the control unit 6. The data processing device 61 executes this program, so that the control unit 6 can execute the processing specified in the program. Of course, a part or all of the processing executed by the control unit 6 may be executed by a hardware circuit such as a logic circuit.

<Operation of the Substrate Processing Apparatus>
Next, a specific example of the operation of the substrate processing apparatus 10 will be described again. First, the processing liquid supply unit 3 supplies the processing liquid into the storage tank 2. Specifically, the control unit 6 opens the valve 32, so that the processing liquid is discharged from the discharge port 31a of the supply pipe 31. When the liquid level of the processing liquid becomes higher than the partition member 23, the control unit 6 closes the valve 32. This stops the supply of the processing liquid, and the processing liquid is stored in both the inner tank space 2a and the outer tank space 2b.

Next, a transport device (not shown) moves the carrier C into the storage tank 2 and places the carrier C on the placement member 41. As a result, the carrier C and the multiple substrates W are immersed in the processing liquid in the storage tank 2. Next, the control unit 6 operates the pump 72. As a result, the processing liquid circulates through the circulation pipe 71. Note that the pump 72 may be operating before the carrier C is loaded.

Next, the control unit 6 vibrates the vibrator 5. Specifically, the control unit 6 causes the oscillator 51 to output a drive voltage. This causes the vibrator 5 to vibrate at a frequency corresponding to the drive voltage. Here, the frequency of vibration oscillated by the vibrator 5 is set to 1 MHz or more and 3 MHz or less. In other words, the control unit 6 adjusts the output voltage of the oscillator 51 so that the vibrator 5 vibrates at a frequency of 1 MHz or more and 3 MHz or less.

In this type of substrate processing, the pump 72 is operating, and the processing liquid that has flowed from the downstream end of the circulation piping 71 into the inner tank space 2a of the storage tank 2 passes sequentially through the opening 41a of the mounting member 41 and the lower opening 9b of the carrier C, and flows between the multiple substrates W in the +Z direction. The processing liquid acts on the surfaces of the substrates W as they pass between each other. This allows the substrates W to be processed in accordance with the type of processing liquid.

The processing liquid flows out from the upper opening 9a of the carrier C, passes over the partition member 23, and flows into the outer bath space 2b. The processing liquid then flows through the outer bath space 2b to the -Z side and flows into the upstream end of the circulation pipe 71. Impurities are removed from the processing liquid by the filter 73 in the circulation pipe 71, and the processing liquid flows back into the inner bath space 2a. This allows cleaner processing liquid to flow toward multiple substrates W.

In addition, in the above-mentioned operation, the vibrator 5 vibrates. This vibration is transmitted to the multiple substrates W via the mounting member 41 and the carrier C. As a result, each substrate W vibrates relative to the processing liquid, and the processing liquid can easily enter and exit the internal space of the three-dimensional structure of the substrate W. In other words, old processing liquid that has acted on the substrate W in the internal space is easily replaced by new processing liquid. Therefore, insufficient processing in the internal space can be suppressed or avoided, and the substrates W can be appropriately processed in the internal space.

When the processing of the multiple substrates W has been completed sufficiently, the control unit 6 stops the vibration of the vibrator 5 and the operation of the pump 72. Next, the transport device transports the carrier C out of the storage tank 2.

In this manner, multiple substrates W can be processed simultaneously.

When using a chemical solution such as hydrofluoric acid as the processing liquid, it is necessary to wash away the chemical solution adhering to the substrates W. Therefore, a rinsing tank (not shown) may be provided in the substrate processing apparatus 10. In this case, after the chemical processing in the storage tank 2, the transport device transports the carrier C from the storage tank 2 to the rinsing tank. A rinsing liquid such as pure water is stored in the rinsing tank, and the carrier C and the multiple substrates W are immersed in the rinsing liquid, thereby washing away the chemical solution adhering to the carrier C and the multiple substrates W (rinsing process).

Alternatively, the storage tank 2 may be used as a rinsing tank. Specifically, the substrate processing apparatus 10 may supply a rinsing liquid into the storage tank 2 after discharging the processing liquid from the storage tank 2. This also allows the carrier C and the multiple substrates W to be immersed in the rinsing liquid, and the chemical liquid adhering to the carrier C and the multiple substrates W to be washed away.

After the rinsing process, a drying process is performed on the carrier C and the multiple substrates W. For example, the substrate processing apparatus 10 is provided with a gas supply unit that discharges a high-temperature inert gas. Then, the transport device raises the carrier C out of the rinsing liquid, or after the substrate processing apparatus 10 discharges the rinsing liquid, the gas supply unit supplies the high-temperature inert gas to the carrier C and the multiple substrates W. This dries the carrier C and the multiple substrates W.

As described above, the substrate processing apparatus 10 can process and dry multiple substrates W at the same time.

Moreover, according to the substrate processing apparatus 10, the substrate W is vibrated by the vibration of the vibrator 5, so that the replacement of the processing liquid in the internal space of the three-dimensional structure of the substrate W can be promoted. In other words, the stagnation of the processing liquid in the internal space can be suppressed. Furthermore, the vibration of the vibrator 5 is transmitted to the multiple substrates W via the mounting member 41 and the carrier C. In other words, the vibration can be transmitted to the multiple substrates W through a solid. Since the deterioration (attenuation) of vibration in a solid is smaller than the deterioration of vibration in a liquid, the vibration of the vibrator 5 can be transmitted to the substrate W without significant deterioration. Therefore, the substrate W can be vibrated at a desired frequency and amplitude.

In the above example, the vibrator 5 vibrates at a high frequency of 1 MHz or more and 3 MHz or less. This allows the substrate W to be vibrated without causing cavitation in the processing liquid stored in the storage tank 2. Therefore, it is possible to suppress or avoid the collapse of the three-dimensional structure or pattern of the substrate W caused by cavitation.

In the above example, the four vibrators 5 are provided near the contact points between the support legs 95, 96 of each carrier C and the mounting member 41. This allows the vibrations to be transmitted more evenly by the carrier C, and ultimately to the multiple substrates W. This allows the multiple substrates W to be processed more evenly.

<Material of mounting member>
Considering the vibration transmission, it is preferable to use a material with a high ultrasonic propagation speed as the material for the mounting member 41. More specifically, it is preferable to use quartz. The propagation speed in quartz is 4400 m/sec, which is nearly four times that of water. When the mounting member 41 is made of quartz, the mounting member 41 can transmit the vibration from the vibrator 5 to the carrier C without significant deterioration. In other words, the vibration can be quickly transmitted to the carrier C while suppressing a decrease in frequency and amplitude.

Note that the entire mounting member 41 does not necessarily need to be made of quartz, and at least the portion of the mounting member 41 between the contact portion with the vibrator 5 and the contact portion with the carrier C may be made of quartz. For example, only the abutment member 412 may be made of quartz.

<Carrier material>
The carrier C may be made of a material that is chemically resistant to the processing liquid. For example, a resin such as polyvinyl chloride resin or a fluororesin, or quartz may be used. From the viewpoint of vibration transmission, a material that has a high ultrasonic wave propagation speed may be used, and specifically, quartz may be used. When the carrier C is made of quartz, the carrier C can transmit vibrations to a plurality of substrates W without significant degradation.

Note that it is not necessary for the entire carrier C to be made of quartz; at least the portions of the carrier C between the contact portion with the mounting member 41 and the contact portions with each of the multiple substrates W must be made of quartz. For example, only the support legs 95, 96 and the side walls 93, 94 of the carrier C may be made of quartz.

When a rinsing tank is provided in the substrate processing apparatus 10, it is advisable to provide a mounting member and an oscillator similar to the mounting member 41 and the oscillator 5 inside the rinsing tank. The oscillator vibrates, making it easier for the rinsing liquid to enter and exit the internal space of the three-dimensional structure of the substrate W, so that the chemical liquid inside the three-dimensional structure can be appropriately replaced with the rinsing liquid.

Second Embodiment
5 is a side cross-sectional view showing an example of a configuration of a substrate processing apparatus 10A according to the second embodiment. The substrate processing apparatus 10A has a similar configuration to the substrate processing apparatus 10, except for the presence or absence of a swing mechanism 4.

The rocking mechanism 4 rocks the mounting member 41. In the example of FIG. 5, the rocking mechanism 4 includes a hanging member 42 and a lifting mechanism 43. The lifting mechanism 43 is controlled by the control unit 6, and moves the hanging member 42 back and forth in the Z direction. As a result, the mounting member 41 connected to the hanging member 42 also moves back and forth in the Z direction. In other words, the lifting mechanism 43 lifts and lowers the mounting member 41. The lifting mechanism 43 has a mechanism such as an air cylinder or a ball screw mechanism.

The oscillation mechanism 4 oscillates the mounting member 41 while the carrier C and the multiple substrates W are immersed in the processing liquid. Oscillation here refers to a reciprocating movement with an amplitude (distance) greater than the vibration of the oscillator 5, and a reciprocating movement with a frequency lower than the vibration frequency of the oscillator 5, for example, less than 100 Hz.

The rocking mechanism 4 moves the mounting member 41, the carrier C, and the multiple substrates W back and forth along the Z direction relatively slowly and widely relative to the processing liquid. This rocking motion can further promote the flow of processing liquid into and out of the internal space of the substrates W.

In addition, since the frequency of the oscillation caused by the oscillation mechanism 4 is very low, cavitation hardly occurs. Therefore, the collapse of the three-dimensional structure or the pattern of the substrate W caused by cavitation is suppressed or avoided.

Figure 6 is a schematic diagram showing another example of the configuration of the rocking mechanism 4. The rocking mechanism 4 in Figure 6 rocks the mounting member 41 along the thickness direction of the substrate W. In the example of Figure 6, the rocking mechanism 4 includes a hanging member 42, a shaft 44, and a rotating mechanism 45. In the example of Figure 6, the -Z side end of the hanging member 42 is connected to the center of the mounting member 41 in the Y direction. The hanging member 42 has an elongated shape that is long in the Z direction, and in the example of Figure 6, its +Z side end is provided at a position higher than the storage tank 2. The hanging member 42 is connected to the shaft 44 at its +Z side end. The shaft 44 is provided so as to be rotatable around the rotation axis Q1, which is its central axis. The rotation axis Q1 is an axis along the X direction. This shaft 44 is fixed to the chamber via a bearing not shown.

The rotation mechanism 45 is controlled by the control unit 6 and rotates the shaft 44 around the rotation axis Q1. Here, the rotation angle when the mounting member 41 is in a horizontal position is set to zero. The rotation mechanism 45 rotates the shaft 44 in opposite directions, alternately, within a predetermined angle range, for example, with zero as the center. As a result, the mounting member 41 moves back and forth within a predetermined angle range along the circumferential direction about the rotation axis Q1. The movement direction of the mounting member 41 at this time can be said to be approximately the Y direction.

In the example of FIG. 6, the rotation mechanism 45 includes a link mechanism 451 and a moving mechanism 452. The link mechanism 451 is provided between the shaft 44 and the moving mechanism 452, and converts the movement in the Y direction by the moving mechanism 452 into movement in the rotation direction of the shaft 44, causing the shaft 44 to rotate around the rotation axis Q1. The moving mechanism 452 is, for example, a linear mechanism such as an air cylinder, and is controlled by the control unit 6.

Since this type of rocking mechanism 4 rocks the mounting member 41 along the thickness direction (Y direction), the carrier C and multiple substrates W mounted on the mounting member 41 also rock along the thickness direction. As a result, the substrates W move back and forth over a large area relative to the processing liquid, so that the main surface of the substrate W presses against the processing liquid with high pressure. This further promotes the entry and exit of the processing liquid into and out of the internal space of the three-dimensional structure of the substrate W.

As described above, the substrate processing apparatus 10, 10A has been described in detail, but the above description is merely an example in all respects, and the substrate processing apparatus 10, 10A is not limited thereto. It is understood that countless variations not illustrated can be envisioned without departing from the scope of this disclosure. The configurations described in the above embodiments and variations can be combined or omitted as appropriate, as long as they are not mutually contradictory.

For example, the circulation section 7 does not have to be provided. In addition, in the above example, the storage tank 2 has a double structure of the inner tank space 2a and the outer tank space 2b, but it may have a single structure.

In the example of FIG. 6, the rocking mechanism 4 reciprocates the mounting member 41 in the circumferential direction about the rotation axis Q1 by the rotation mechanism 45. However, instead of the rotation mechanism 45, the rocking mechanism 4 may have a linear mechanism that moves the mounting member 41 in the Y direction.

REFERENCE SIGNS LIST 10, 10A SUBSTRATE PROCESSING APPARATUS 2 STORAGE TANK 31 SUPPLY PIPE 4 SWINGING MECHANISM 41 PLACING MEMBER 5 TRANSDUCER 5a, 5b FIRST TRANSDUCER (TRANSDUCER)
5c, 5d Second vibrator (vibrator)
95, 96 Support leg C Carrier W Board

Claims (6)

A substrate processing apparatus that performs processing on a plurality of substrates at once,
a storage tank for storing a processing liquid;
a supply pipe for supplying a treatment liquid into the storage tank;
a carrier having a pair of support legs, the carrier storing a plurality of substrates in an upright position, the carrier having an opening at a bottom, the carrier being placed thereon in a state immersed in the processing liquid in the storage tank, the carrier having an abutment member abutting against the carrier;
a vibrator provided on the mounting member,
the supply pipe is disposed below the placement member and supplies the treatment liquid toward an upper portion of the storage tank ;
The abutment member abuts against an end of the support leg below the carrier so that the opening is not blocked in a plan view. The substrate processing apparatus according to claim 1 ,
The substrate processing apparatus, wherein the vibrator vibrates at a frequency of 1 MHz or more and 3 MHz or less. 3. The substrate processing apparatus according to claim 1,
The transducer is provided in plurality,
a first vibrator of the plurality of vibrators is provided on the mounting member near one of the pair of support legs, and a second vibrator of the plurality of vibrators is provided on the mounting member near the other of the pair of support legs. 4. The substrate processing apparatus according to claim 1,
At least one of the mounting member and the carrier is made of quartz. 5. The substrate processing apparatus according to claim 1,
The substrate processing apparatus further comprises a swinging mechanism for swinging the mounting member. The substrate processing apparatus according to claim 5 ,
The substrate processing apparatus, wherein the swing mechanism swings the placement member along a thickness direction of the plurality of substrates.

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