JP7619924B2 - Component mounting device and component mounting system - Google Patents

Description

This invention relates to a component mounting device and a component mounting system, and in particular to a component mounting device and a component mounting system that mounts components on a substrate.

Conventionally, component mounting systems that mount components on a substrate are known (see, for example, Patent Document 1).

The above-mentioned Patent Document 1 discloses a component mounting system that mounts components on a board. This component mounting system includes multiple component mounting lines. In this component mounting system, the multiple component mounting lines include a printer, multiple mounting machines, and a reflow oven. In this component mounting system, a bypass conveyor is provided that connects from the middle of one component mounting line to the middle of the other component mounting line. In addition, this component mounting system is configured to produce boards by connecting one component mounting line to the other component mounting line via the bypass conveyor when a failure occurs in the mounting machine of one component mounting line.

JP 2013-8930 A

However, in the component mounting system described in Patent Document 1, if a failure occurs in the mounting machine on one component mounting line, the one component mounting line can be connected to the other component mounting line via a bypass conveyor to produce boards, reducing the time that board production is stopped due to the failure. However, there is a problem in that the configuration of the component mounting line becomes complicated because it is necessary to provide a bypass conveyor that connects one component mounting line to the other component mounting line.

This invention has been made to solve the problems described above, and one object of the invention is to provide a component mounting device and a component mounting system that, even if a failure occurs in the component mounting device, can reduce the time that board production is stopped due to a failure while preventing the configuration of the component mounting line from becoming complicated.

A component mounting device according to a first aspect of the present invention includes a board transport unit that transports a board, a head unit that mounts components on the board, a component supply unit that supplies components to the head unit, and a control unit that, when a failure occurs in the device, determines whether the board can be produced by relocating the component supply unit related to the failure within the device or to another component mounting device on the same component mounting line, and, if it is determined that the board can be produced, notifies relocation information for relocating the component supply unit.

In the component mounting device according to the first aspect of the present invention, as described above, when a failure occurs in the own device, a control unit is provided that determines whether a board can be produced by relocating a component supply unit related to the failure within the own device or to another component mounting device on the same component mounting line, and if it is determined that the board can be produced, notifies relocation information for relocating the component supply unit. As a result, since the component supply unit can be relocated to another component mounting device within the own device or on the same component mounting line to produce the board, there is no need to provide a bypass conveyor to the other component mounting line. As a result, the configuration of the component mounting line can be prevented from becoming complicated. In addition, since the board can be produced by relocating the component supply unit to another component mounting device on the same component mounting line, the time during which the production of the board is stopped can be reduced compared to the case where the production of the board is stopped until the failure is repaired. As a result, even when a failure occurs in the component mounting device, the time during which the production of the board is stopped due to the failure can be reduced while preventing the configuration of the component mounting line from becoming complicated.

In the component mounting device according to the first aspect, the control unit is preferably configured to determine whether the board can be produced by relocating the component supply unit when the board can be transported by the board transport unit. With this configuration, it is possible to determine whether the board can be produced by relocating the component supply unit when the board can be transported by the board transport unit, and therefore it is possible to avoid unnecessary processing of determining whether the board can be produced by relocating the component supply unit when the board cannot be transported by the board transport unit (when the board cannot be produced even if the component supply unit is relocated).

In the component mounting device according to the first aspect, the control unit is preferably configured to determine whether the board can be produced by relocating the component supply unit within the device itself, and if it is determined that the board cannot be produced by relocating the component supply unit within the device itself, to determine whether the board can be produced by relocating the component supply unit to another component mounting device. With this configuration, it is possible to determine with priority that the component supply unit should be relocated within the device itself, so that the component supply unit can be relocated to the device itself as much as possible. As a result, the labor required to relocate the component supply unit can be reduced compared to relocating the component supply unit to another component mounting device. In addition, if the component supply unit cannot be relocated within the device itself, it can be determined that the component supply unit should be relocated to another component mounting device, so that the board can be produced as much as possible.

In the component mounting device according to the first aspect, preferably, a plurality of head units are provided, and the control unit is configured to determine whether or not the board can be produced by relocating the component supply unit associated with the head unit designated by the user as being faulty from among the plurality of head units, within the device itself or to another component mounting device. With this configuration, it is possible to determine to relocate the component supply unit associated with the head unit designated by the user as being faulty from among the plurality of head units, so that it is also possible to deal with faults in some of the head units among the plurality of head units. In addition, since it is only necessary to deal with faults in some of the head units among the plurality of head units, the number of component supply units to be relocated can be reduced. As a result, it is possible to increase the possibility that the board can be produced by relocating the component supply unit, and it is also possible to reduce the effort required to relocate the component supply unit when the board can be produced by relocating the component supply unit.

In the component mounting device according to the first aspect, preferably, the device further includes a plurality of carts on which the component supply units are arranged, and the control unit is configured to determine whether or not the board can be produced by relocating the component supply unit associated with the cart designated by the user as being faulty from among the plurality of carts to within the device itself or to another component mounting device. With this configuration, it is possible to determine to relocate the component supply unit associated with the cart designated by the user as being faulty from among the plurality of carts, so that the failure of some of the carts can be dealt with. In addition, since it is only necessary to deal with the failure of some of the plurality of carts, the number of component supply units to be relocated can be reduced. As a result, the possibility that the board can be produced by relocating the component supply unit can be increased, and the labor required to relocate the component supply unit can be reduced when the board can be produced by relocating the component supply unit.

In the component mounting device according to the first aspect, preferably, when the board can be produced by relocating the component supply unit, the control unit is configured to display on the display unit whether to relocate the component supply unit within the device itself or to relocate the component supply unit to another component mounting device. With this configuration, it is possible to easily confirm whether to relocate the component supply unit within the device itself or to relocate the component supply unit to another component mounting device, based on the information displayed on the display unit.

In the component mounting device according to the first aspect, the control unit is preferably configured to display relocation information on the display unit, the relocation information including information representing the component supply unit to be relocated and information representing the empty slot at the relocation destination in which the component supply unit to be relocated will be placed. With this configuration, the relocation information displayed on the display unit makes it easy to confirm the component supply unit to be relocated and the empty slot at the relocation destination in which the component supply unit to be relocated will be placed, making it easy to relocate the component supply unit.

In the component mounting device according to the first aspect, the control unit is preferably configured to perform a transport feasibility confirmation operation to confirm whether the board can be transported by the board transport unit. With this configuration, the user does not need to perform the task of confirming (inspecting) whether the board can be transported by the board transport unit, thereby eliminating the need for the user to perform the task of confirming whether the board can be transported by the board transport unit.

In this case, the control unit is preferably configured to perform a transport feasibility confirmation operation based on a user's operation. With this configuration, the user can decide whether or not to perform the transport feasibility confirmation operation, so that in cases where it is clear that the substrate can be transported by the substrate transport unit, the transport feasibility confirmation operation can be avoided unnecessarily, and in cases where it is not clear that the substrate can be transported by the substrate transport unit, the transport feasibility confirmation operation can be effectively used to confirm whether the substrate transport unit can transport the substrate while saving the user effort.

A component mounting system according to a second aspect of the present invention includes a component mounting device including a board transport unit that transports a board, a head unit that mounts components on the board, and a component supply unit that supplies components to the head unit, and a control device that, when a failure occurs in the component mounting device, determines whether the board can be produced by relocating the component supply unit related to the failure within the component mounting device or to another component mounting device on the same component mounting line, and notifies relocation information for relocating the component supply unit if it is determined that the board can be produced.

In the component mounting system according to the second aspect of the present invention, as described above, a control device is provided that determines whether the board can be produced by relocating the component supply unit related to the failure within the component mounting device or to another component mounting device on the same component mounting line, and notifies relocation information for relocating the component supply unit if it is determined that the board can be produced. This makes it possible to provide a component mounting system that, like the component mounting device according to the first aspect described above, can reduce the time that board production is stopped due to a failure, while preventing the component mounting line configuration from becoming complicated, even when a failure occurs in the component mounting device.

According to the present invention, as described above, it is possible to provide a component mounting device and a component mounting system that can reduce the time that board production is stopped due to a failure, while preventing the configuration of the component mounting line from becoming complicated, even if a failure occurs in the component mounting device.

FIG. 1 illustrates a component mounting system according to an embodiment. FIG. 1 is a diagram showing a component mounting apparatus according to an embodiment. FIG. 2 is a diagram illustrating a control configuration of the component mounting apparatus according to an embodiment. FIG. 1 is a first diagram showing a setting screen of a component mounting device according to an embodiment. FIG. 1 is a first diagram showing relocation information of a component mounting apparatus according to an embodiment. FIG. 2 is a second diagram showing a setting screen of the component mounting device according to the embodiment. FIG. 2 is a second diagram showing relocation information of the component mounting apparatus according to the embodiment. FIG. 3 is a third diagram showing a setting screen of the component mounting device according to the embodiment. FIG. 4 is a diagram showing a setting screen of the component mounting device according to the embodiment. FIG. 3 is a third diagram showing relocation information of a component mounting apparatus according to an embodiment. 10 is a flowchart for explaining a control process regarding a failure of the component mounting device according to an embodiment.

The following describes an embodiment of the present invention with reference to the drawings.

First, the configuration of a component mounting system 100 according to one embodiment will be described with reference to FIG.

(Component mounting system configuration)
The component mounting system 100 is a system that mounts components E (electronic components) such as ICs, transistors, capacitors, and resistors on a substrate P such as a printed circuit board, to produce the substrate P on which the components E are mounted.

As shown in FIG. 1, the component mounting system 100 includes a component mounting line 10 for producing a substrate P and a production management device 20 for managing the production of the substrate P.

The component mounting line 10 includes a printing device 11, a print inspection device 12, a component mounting device 13, a pre-reflow appearance inspection device 14, and a reflow furnace 15. The component mounting line 10 is configured so that the substrate P is transported from the upstream side to the downstream side along the manufacturing line. Note that the equipment configuration of the component mounting line 10 is not limited to the equipment configuration shown in FIG. 1.

The printing device 11 is a screen printer and has the function of applying cream solder onto the mounting surface of the substrate P.

The print inspection device 12 has the function of inspecting the condition of the cream solder printed by the printing device 11.

The component mounting device 13 has the function of mounting components E at predetermined mounting positions on the substrate P on which cream solder has been printed. In addition, multiple component mounting devices 13 are provided along the transport direction of the substrate P. The multiple component mounting devices 13 have the same configuration.

The appearance inspection device 14 has the function of inspecting the appearance of the substrate P on which the component E is mounted by the component mounting device 13.

The reflow furnace 15 has the function of melting the solder through a heat treatment to join the component E to the electrode portion of the substrate P.

The production management device 20 has the function of managing the production plan for the board P. The production management device 20 is configured, for example, to create a component mounting program used by the component mounting device 13. The production management device 20 is a personal computer configured to be able to perform various calculations.

(Configuration of component mounting device)
2 and 3, the configuration of the component mounting device 13 will be described. In the following description, the board transport direction is defined as the X direction, the direction perpendicular to the X direction in a horizontal plane is defined as the Y direction, and the up-down direction perpendicular to the X direction and Y direction is defined as the Z direction.

As shown in Figures 2 and 3, the component mounting device 13 includes a base 1, a board transport unit 2, a head unit 3, a head horizontal movement mechanism unit 4, a component imaging unit 5, a board imaging unit 6, a control unit 7, a display unit 8, and a memory unit 9. The control unit 7 is an example of a "control device" in the claims.

The base 1 is a base on which each component is placed in the component mounting device 13. The base 1 is provided with a board transport unit 2, a nozzle stocker 3a, a rail unit 42, and a component imaging unit 5. The base 1 also has a control unit 7. The base 1 also has a plurality of setting units 101 for setting carts 120 on which the component supply units 110 can be placed. Specifically, the base 1 has setting units 101 on both sides in the Y direction (the Y1 direction side and the Y2 direction side).

The component supply unit 110 is a tape feeder that supplies components E to be mounted on the substrate P. Specifically, the component supply unit 110 is configured to supply components E by feeding a component supply tape (not shown) that stores the components E. The component supply unit 110 is configured to feed the component supply tape intermittently in response to the component holding operation by the head unit 3.

The component supply units 110 are arranged in a line on the cart 120 and are configured to be set in the setting unit 101. The cart 120 is provided with a plurality of slots 120a in which the component supply units 110 are arranged. The plurality of slots 120a may have an empty slot 120a (indicated by a broken line) in which no component supply unit 110 is arranged, for example, for the preparation of the next type of board P. The cart 120 is also provided with a connector electrically connected to the connector of the component supply unit 110 and a connector electrically connected to the connector of the base 1. The component supply unit 110 is connected to the control unit 7 in the base 1 via the cart 120 so as to be able to communicate with each other, and is configured to perform an operation of supplying components E under the control of the control unit 7. In the example shown in FIG. 2, two carts 120 are set on the base 1.

The board transport unit 2 is configured to carry in the board P before mounting, transport it in the board transport direction (X direction), and carry out the board P after mounting. The board transport unit 2 is also configured to transport the carried-in board P to the board fixing position Pa and fix it at the board fixing position Pa by a board fixing mechanism (not shown). The board transport unit 2 also includes a pair of transport belts. The board transport unit 2 is configured to transport the board P in the board transport direction while supporting both ends of the board P in the width direction (Y direction) from the lower side (Z2 direction side) by the pair of transport belts. The board transport unit 2 also includes a board detection unit 21 for detecting the board P on the pair of transport belts. The board detection unit 21 is configured to include, for example, a photosensor and detect the presence or absence of the board P by utilizing a change in the optical path caused by the board P.

The head unit 3 is a head unit for mounting components. Multiple (two) are provided. The head unit 3 mounts components E on the substrate P fixed at the substrate fixing position Pa. The head unit 3 includes multiple (five) mounting heads 31. A nozzle (not shown) for holding (sucking) the component E is attached to the tip of the mounting head 31. The nozzle is replaced in a nozzle stocker 3a that holds multiple types of nozzles depending on the type of component E to be mounted. The mounting head 31 is also configured to be able to hold (suck) the component E on the nozzle by negative pressure supplied from a negative pressure supply unit (not shown). The mounting head 31 is also configured to be able to move up and down between a lowered position for holding the component E or for mounting the held component E, and an elevated position for transporting the held component E to the substrate P.

The head unit 3 also includes a Z-axis motor 32 that moves the mounting head 31 up and down (Z direction), and an R-axis motor 33 that rotates the mounting head 31 around a rotation axis that extends in the up and down direction. The mounting head 31 is configured to be movable in the up and down direction between a predetermined lowered position and a predetermined raised position by the Z-axis motor 32. The mounting head 31 is also configured to be able to adjust the orientation of the component E that is being adsorbed by being rotated by the R-axis motor 33 while holding the component E.

The head horizontal movement mechanism 4 is configured to move the head unit 3 in the horizontal direction (X direction and Y direction). The head horizontal movement mechanism 4 includes a support part 41 that supports the head unit 3 so that it can move in the X direction, and a rail part 42 that supports the support part 41 so that it can move in the Y direction. A plurality of (two) support parts 41 are provided to correspond to a plurality of (two) head units 3. The support part 41 is configured to move the head unit 3 in the X direction, for example, by an X-axis motor 41a and a ball screw shaft mechanism. The rail part 42 supports both ends of the support part 41 in the X direction so that it can move in the Y direction. The rail part 42 is configured to move the support part 41 in the Y direction, for example, by a Y-axis motor 42a and a ball screw shaft mechanism.

The two head units 3 are configured to be able to move horizontally independently of each other on the base 1 by the two support parts 41 and rail parts 42 of the head horizontal movement mechanism part 4. This allows the head unit 3 to move above the component supply part 110 and hold (suck) the component E supplied from the component supply part 110. The head unit 3 can also move above the substrate P fixed at the substrate fixing position Pa and mount the held (sucked) component E on the substrate P. The head unit 3 on the Y1 direction side is configured to obtain the component E from the component supply part 110 on the Y1 direction side. The head unit 3 on the Y2 direction side is configured to obtain the component E from the component supply part 110 on the Y2 direction side.

The component imaging unit 5 is a camera for component recognition. The component imaging unit 5 images the component E held (adsorbed) by the nozzle of the mounting head 31 while the head unit 3 transports the component E to the substrate P. The component imaging unit 5 is fixed on the upper surface of the base 1, and images the component E held (adsorbed) by the nozzle of the mounting head 31 from the underside (Z2 direction side) of the component E. Based on the image of the component E captured by the component imaging unit 5, the control unit 7 acquires (recognizes) the holding state of the component E (rotational posture and holding position relative to the mounting head 31).

The board imaging unit 6 is a camera for board recognition. Before the head unit 3 starts mounting components E on the board P, the board imaging unit 6 captures an image of a position recognition mark F (fiducial mark) attached to the top surface of the board P, from above, with the board P fixed at the board fixing position Pa. The position recognition mark F is a mark for recognizing the position of the board P. Based on the image of the position recognition mark F captured by the board imaging unit 6, the control unit 7 acquires (recognizes) the exact position and attitude of the board P fixed at the board fixing position Pa. The board imaging unit 6 is also attached to the head unit 3. The board imaging unit 6 is configured to be movable horizontally together with the head unit 3.

The control unit 7 is a control circuit that controls the operation of the component mounting device 13. The control unit 7 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The control unit 7 is configured to control the board transport unit 2, the component supply unit 110, the X-axis motor 41a, the Y-axis motor 42a, etc. based on a component mounting program, thereby causing the head unit 3 to mount components E on the board P and control the production of the board P.

The display unit 8 includes a monitor such as a liquid crystal monitor and is configured to be able to display information. The display unit 8 displays various information related to component mounting. The storage unit 9 includes a recording medium such as a hard disk drive and is configured to be able to store information. The storage unit 9 stores resource information 91. The resource information 91 includes information on the component supply units 110 used by the multiple component mounting devices 13 on the component mounting line 10. Specifically, the resource information 91 includes information on the component supply units 110 for each slot 120a of the cart 120 (information on the presence or absence, component type, and position of the component supply unit 110). Based on the resource information 91, the component mounting device 13 can grasp information on not only the component supply unit 110 in its own device, but also the component supply units 110 of other component mounting devices 13 on the same component mounting line 10.

If a malfunction occurs in the component mounting device 13 of the component mounting line 10, and production of the board P is halted until the malfunction of the component mounting device 13 is repaired, the time that production of the board P is halted increases, and the operating rate of the component mounting line 10 decreases.

In this embodiment, as shown in Figs. 4 to 10, the control unit 7 of the component mounting device 13 in which a failure has occurred is configured to determine whether the substrate P can be produced by relocating the component supply unit 110 related to the failure within the device itself or to another component mounting device 13 in the same component mounting line 10 if the substrate P can be transported by the substrate transport unit 2 when a failure occurs in the device itself, and to notify relocation information 130 for relocating the component supply unit 110 if it is determined that the substrate P can be produced, as shown in Figs. 4 to 10. Specifically, the control unit 7 is configured to display on the display unit 8 relocation information 130 including information representing the component supply unit 110 to be relocated and information representing the empty slot 120a at the relocation destination where the component supply unit 110 to be relocated will be placed.

The control unit 7 is also configured to determine whether or not the board P can be produced by relocating the component supply unit 110 based on the resource information 91. Specifically, the control unit 7 is configured to extract the component supply unit 110 to be relocated that needs to be relocated based on the resource information 91, extract the empty slot 120a that can be relocated, and determine whether or not the empty slot 120a required for relocating the component supply unit 110 to be relocated exists. The control unit 7 is configured to determine that the board P can be produced by relocating the component supply unit 110 when it is determined that the empty slot 120a required for relocating the component supply unit 110 to be relocated exists. The control unit 7 is also configured to determine that the board P cannot be produced by relocating the component supply unit 110 when it is determined that the empty slot 120a required for relocating the component supply unit 110 to be relocated does not exist.

In addition, in this embodiment, when it is determined that the board P can be produced by relocating the component supply unit 110, the control unit 7 is configured to display on the display unit 8 the result of the determination as to whether to relocate the component supply unit 110 within its own device or to relocate the component supply unit 110 to another component mounting device 13.

In addition, in this embodiment, the control unit 7 is configured to determine with priority whether or not the board P can be produced by relocating the component supply unit 110 within its own device. In other words, the control unit 7 is configured to determine whether or not the board P can be produced by relocating the component supply unit 110 within its own device, and, if it is determined that the board P cannot be produced by relocating the component supply unit 110 within its own device, to determine whether or not the board P can be produced by relocating the component supply unit 110 to another component mounting device 13.

In addition, in this embodiment, the control unit 7 is configured to determine whether or not the substrate P can be produced by relocating the component supply unit 110 associated with a head unit 3 designated by the user (operator) as being faulty from among the multiple head units 3 to within the device itself or to another component mounting device 13.In addition, in this embodiment, the control unit 7 is configured to determine whether or not the substrate P can be produced by relocating the component supply unit 110 associated with a cart 120 designated by the user (operator) as being faulty from among the multiple carts 120 to within the device itself or to another component mounting device 13.

Specifically, the control unit 7 is configured to display a setting screen 140 operated by a user (operator) on the display unit 8. The setting screen 140 has a fault location specification field 140a, a production feasibility determination button 140b, a result display field 140c, a relocation information display button 140d, and a confirmation operation specification field 140e.

The fault location designation field 140a displays the head unit 3 and the cart 120 of the device as locations that can be designated as fault locations. When the user (worker) is notified of an abnormality from the component mounting device 13, the user (worker) inspects the component mounting device 13. Then, based on the results of the user's inspection of the component mounting device 13, the user (worker) designates the faulty head unit 3 or cart 120 from among the head units 3 and carts 120 displayed in the fault location designation field 140a.

If the cart 120 fails, for example, communication with the component supply unit 110 via the cart 120 becomes impossible, and component mounting using the component supply unit 110 arranged on the cart 120 becomes impossible. Also, if the head unit 3 fails, component mounting using the failed head unit 3 becomes impossible. For this reason, the failed head unit 3 or cart 120 can be specified in the failure location specification field 140a to skip component mounting using the failed head unit 3 or cart 120.

The production feasibility determination button 140b is a display button for causing the control unit 7 to perform a process of determining whether or not the board P can be produced by relocating it within the device itself or to another component mounting device 13. The user (operator) operates the production feasibility determination button 140b with the fault location (head unit 3, cart 120) specified in the fault location specification field 140a. Then, when the production feasibility determination button 140b is operated, the control unit 7 performs a process of determining whether or not the board P can be produced by relocating the component supply unit 110 associated with the fault location (head unit 3, cart 120) specified by the user (operator) within the device itself or to another component mounting device 13.

The result display field 140c displays the result of the judgment made by the control unit 7 as to whether production is possible. Specifically, the result display field 140c displays information indicating whether the board P can be produced by relocating the component supply unit 110, and information indicating whether the relocation is to be made within the device itself or to another component mounting device 13, as the judgment result.

The relocation information display button 140d is a display button for displaying the relocation information 130 when production is possible by relocating the parts supply unit 110. When the words "Producible" are displayed in the result display field 140c, the user (worker) operates the relocation information display button 140d. Then, when the relocation information display button 140d is operated, the control unit 7 transitions the screen from the setting screen 140 to display the relocation information 130 on the display unit 8, which indicates the parts supply unit 110 to be relocated and the empty slot 120a at the relocation destination. Then, the user (worker) performs the work of relocating the parts supply unit 110 based on the relocation information 130 displayed on the display unit 8.

The confirmation operation specification field 140e displays information for specifying whether or not the component mounting device 13 should perform a transport feasibility confirmation operation to confirm whether or not the board P can be transported by the board transport unit 2. When the user specifies that the component mounting device 13 should perform the transport feasibility confirmation operation, the control unit 7 performs the transport feasibility confirmation operation based on the operation of the production feasibility judgment button 140b. That is, the control unit 7 performs the transport feasibility confirmation operation based on the operation of the user (operator). Note that, when the control unit 7 determines that the board P can be transported by the board transport unit 2 as a result of the transport feasibility confirmation operation, the control unit 7 performs a process to determine whether or not the board P can be produced by relocating the component supply unit 110. On the other hand, when the control unit 7 determines that the board P cannot be transported by the board transport unit 2 as a result of the transport feasibility confirmation operation, the control unit 7 notifies the display unit 8 that the board transport unit 2 is broken without performing a process to determine whether or not the board P can be produced by relocating the component supply unit 110. In addition, if the user specifies that the component mounting device 13 should not perform the transport feasibility check operation, the control unit 7 will not perform the transport feasibility check operation based on the operation of the production feasibility determination button 140b.

In the transport feasibility confirmation operation, the control unit 7 is configured to perform control processing to transport the substrate P by the substrate transport unit 2 to a predetermined position (such as a discharge position) that can be detected by the substrate detection unit 21, and to detect the substrate P by the substrate detection unit 21. The control unit 7 is configured to determine that the substrate P can be transported by the substrate transport unit 2 if the substrate detection unit 21 is able to detect the presence of the substrate P. The control unit 7 is also configured to determine that the substrate P cannot be transported by the substrate transport unit 2 (substrate transport unit 2 is broken) if the substrate detection unit 21 is unable to detect the presence of the substrate P despite having performed control processing to transport the substrate P by the substrate transport unit 2.

<Cart skip: When moving to own device>
Next, a case will be described with reference to Fig. 4 and Fig. 5, in which a user (operator) determines that one of the multiple (two) carts 120 has broken down and the control unit 7 determines that the component supply unit 110 should be moved into the device itself. Note that Fig. 4 and Fig. 5 describe a case in which the user specifies that the transport feasibility check operation should not be performed.

In this case, as shown in FIG. 4, the user (operator) designates "Cart 1" as the fault location in the fault location designation field 140a of the setting screen 140, designates that the transport feasibility check operation is not to be performed in the check operation designation field 140e, and operates the production feasibility determination button 140b. Then, the control unit 7 determines whether the board P can be produced by relocating the component supply unit 110 within the device or to another component mounting device 13 without performing the transport feasibility check operation. At this time, the control unit 7 determines with priority whether the board P can be produced by relocating the component supply unit 110 within the device. Specifically, the control unit 7 determines whether the board P can be produced by relocating the component supply unit 110 from "Cart 1" to "Cart 2" of the device. In addition, information about the part supply units 110 of the device's "cart 1" and "cart 2" (presence or absence of a part supply unit 110, part type, and location information) can be obtained based on the resource information 91.

In the example shown in FIG. 4 and FIG. 5, five component supply units 110 corresponding to five components E, "AA", "BB", "CC", "DD", and "EE", are arranged on "cart 1". Also, five component supply units 110 corresponding to five components E, "AA", "FF", "GG", "HH", and "II", are arranged on "cart 2". In this case, for the component E "AA" that overlaps between "cart 1" and "cart 2", it is possible to mount the component using "cart 2", so there is no need to relocate the component supply unit 110. Therefore, of the five component supply units 110 on "cart 1", the four component supply units 110 corresponding to the four components E other than "AA", "BB", "CC", "DD", and "EE", are extracted by the control unit 7 as component supply units 110 to be relocated.

In addition, since there are four slots 120a in "cart 2" in which a part supply unit 110 is not located, the control unit 7 extracts the four slots 120a as vacant slots 120a that can be relocated.

Then, since the number of available free slots 120a that can be relocated is greater than or equal to the number of target component supply units 110 that need to be relocated (here, the same number), the control unit 7 determines that there are free slots 120a required to relocate the target component supply units 110.Then, the control unit 7 determines that the board P can be produced by relocating the component supply units 110 within its own device.

Then, the control unit 7 displays in the result display area 140c as a judgment result that the board P can be produced by relocating the component supply unit 110, and that the relocation is to the own device. Then, when the user (operator) operates the relocation information display button 140d, the control unit 7 displays the relocation information 130 on the display unit 8. As shown in FIG. 5, the relocation information 130 includes information representing the component supply unit 110 to be relocated (the component supply units 110 in "slot 102", "slot 103", "slot 104", and "slot 105" of "cart 1") and information representing the empty slots 120a to which the component supply unit 110 is to be relocated (the component supply units 110 in "slot 206", "slot 207", "slot 208", and "slot 209" of "cart 2").

<Cart skip: When moving to another component mounting device>
6 and 7, a case will be described in which a user (operator) determines that one of the multiple (two) carts 120 has broken down and the control unit 7 determines that the component supply unit 110 should be moved to another component mounting device 13. Note that in Figs. 6 and 7, a case will be described in which a user specifies that the transport feasibility confirmation operation should not be performed.

In this case, as shown in FIG. 6, the user (operator) specifies "Cart 1" as the fault location in the fault location specification field 140a on the setting screen 140, specifies that the transport feasibility confirmation operation is not to be performed in the confirmation operation specification field 140e, and operates the production feasibility determination button 140b. Then, the control unit 7 determines whether the board P can be produced by relocating the component supply unit 110 within its own device or to another component mounting device 13 without performing the transport feasibility confirmation operation.

At this time, the control unit 7 determines first whether the board P can be produced by relocating the component supply unit 110 within the own device, but in the example shown in Figures 6 and 7, since there is no free slot 120a in "cart 2" of the own device, the control unit 7 determines that the board P cannot be produced by relocating the component supply unit 110 within the own device. Then, the control unit 7 determines whether the board P can be produced by relocating the component supply unit 110 to another component mounting device 13. Note that information on the component supply units 110 of "cart 1" and "cart 2" of the own device and information on the component supply units 110 of "cart 1" and "cart 2" of the other component mounting device 13 can be obtained based on the resource information 91.

In the example shown in Figures 6 and 7, five component supply units 110 corresponding to five components E, "AA", "BB", "CC", "DD", and "EE", are arranged on "Cart 1" of the own device. Nine component supply units 110 corresponding to nine components E, "AA", "FF", "GG", "HH", "II", "JJ", "KK", "LL", and "MM", are arranged on "Cart 2" of the own device. Five component supply units 110 corresponding to five components E, "BB", "PP", "QQ", "RR", and "EE", are arranged on "Cart 1" of another component mounting device 13.

In this case, for the part E "AA" that overlaps between "Cart 1" and "Cart 2" of the own device, it is possible to mount the part using "Cart 2" of the own device, so there is no need to relocate the part supply unit 110. Similarly, for the part E "BB" that overlaps between "Cart 1" of the own device and "Cart 1" of another component mounting device 13, it is possible to mount the part using "Cart 1" of the other component mounting device 13, so there is no need to relocate the part supply unit 110. Therefore, of the five part supply units 110 of "Cart 1" of the own device, the three part supply units 110 corresponding to the three parts E "CC", "DD", and "EE" other than "AA" and "BB" are extracted by the control unit 7 as part supply units 110 to be relocated that need to be relocated.

In addition, since there are three slots 120a in the "cart 1" of another component mounting device 13 where a component supply unit 110 is not located, the control unit 7 extracts the three slots 120a as vacant slots 120a that can be relocated.

Then, since the number of available free slots 120a that can be relocated is greater than or equal to the number of target component supply units 110 that need to be relocated (here, the same number), the control unit 7 determines that there are free slots 120a required to relocate the target component supply units 110.Then, the control unit 7 determines that the board P can be produced by relocating the component supply units 110 to another component mounting device 13.

Then, the control unit 7 displays in the result display area 140c as a judgment result that the board P can be produced by relocating the component supply unit 110 and that the relocation is to another component mounting device 13. Then, when the user (operator) operates the relocation information display button 140d, the control unit 7 displays the relocation information 130 on the display unit 8. As shown in FIG. 7, the relocation information 130 includes information representing the component supply unit 110 to be relocated (the component supply units 110 in "slot 103", "slot 104", and "slot 105" of "cart 1" of the own device) and information representing the empty slots 120a to be relocated (the "slot 106", "slot 107", and "slot 108" of "cart 1" of the other component mounting device 13).

In the examples shown in Figures 4 to 7, for the sake of convenience, we have described the case where "Carriage 1" fails, but the same applies to the case where "Carriage 2," "Head 1," or "Head 2" fails.

<Equipment skip: When the board transport unit is broken>
Next, referring to Figure 8, a case will be described in which a user (operator) determines that a component mounting device 13 including multiple head units 3 and multiple (two) carts 120 has failed, the user specifies that a transport feasibility check operation should be performed, and the control unit 7 determines that the board transport unit 2 has failed.

In this case, as shown in FIG. 8, the user (operator) specifies "Cart 1", "Cart 2", "Head 1" and "Head 2" as the fault locations in the fault location specification field 140a on the setting screen 140, specifies that a transport feasibility confirmation operation is to be performed in the confirmation operation specification field 140e, and operates the production feasibility determination button 140b. Then, the control unit 7 performs the transport feasibility confirmation operation.

In the example shown in FIG. 8, even though a control process was performed to transport the board P to a predetermined position by the board transport unit 2, the board detection unit 21 was unable to detect the presence of the board P at the predetermined position, and therefore the control unit 7 determines that the board transport unit 2 cannot transport the board P (the board transport unit 2 has broken down). The control unit 7 then displays in the result display area 140c as a determination result that the board P cannot be produced by relocating the component supply unit 110, and that the board transport unit 2 has broken down.

<Equipment skip: When transferring to another component mounting device>
9 and 10, a case will be described in which a user (operator) determines that a component mounting device 13 including multiple head units 3 and multiple (two) carts 120 has broken down, and the control unit 7 determines that the component supply unit 110 should be moved to another component mounting device 13. Note that in Figs. 9 and 10, a case will be described in which a user specifies that a transport feasibility check operation should be performed, and the control unit 7 determines that the board P can be transported by the board transport unit 2.

In this case, as shown in FIG. 9, the user (operator) specifies "Cart 1," "Cart 2," "Head 1," and "Head 2" as the faulty locations in the fault location specification field 140a on the setting screen 140, specifies in the confirmation operation specification field 140e that a transport feasibility confirmation operation will be performed, and operates the production feasibility determination button 140b. Then, the control unit 7 performs the transport feasibility confirmation operation.

9, as a result of performing a control process to transport the board P to a predetermined position by the board transport unit 2, the board detection unit 21 can detect the presence of the board P at the predetermined position, and the control unit 7 determines that the board P can be transported by the board transport unit 2. The control unit 7 then determines whether the board P can be produced by relocating the component supply unit 110 within the own device or to another component mounting device 13. In the example shown in FIG. 9 and FIG. 10, since all of the "cart 1", "cart 2", "head 1" and "head 2" of the own device are broken, the control unit 7 determines whether the board P can be produced by relocating the component supply unit 110 to another component mounting device 13. Note that information on the component supply units 110 of the "cart 1" and "cart 2" of the own device and information on the component supply units 110 of the "cart 1" and "cart 2" of the other component mounting device 13 can be acquired based on the resource information 91.

Although a detailed description will be omitted, similar to the examples shown in Figures 3 to 7, the control unit 7 extracts the component supply unit 110 that is the relocation target and needs to be relocated, and also extracts the vacant slot 120a that can be relocated.

Then, since the number of available free slots 120a that can be relocated is greater than or equal to the number of target component supply units 110 that need to be relocated (here, the same number), the control unit 7 determines that there are free slots 120a required to relocate the target component supply units 110.Then, the control unit 7 determines that the board P can be produced by relocating the component supply units 110 to another component mounting device 13.

Then, the control unit 7 displays in the result display area 140c the judgment result that the board P can be produced by relocating the component supply unit 110, and that the relocation is to another component mounting device 13. Then, when the user (operator) operates the relocation information display button 140d, the control unit 7 displays the relocation information 130 on the display unit 8. As shown in FIG. 10, the relocation information 130 includes information representing the component supply unit 110 to be relocated and information representing the empty slot 120a to which it is to be relocated.

(Control process regarding failure of component mounting device)
Next, a control process regarding a failure of the component mounting device 13 will be described based on a flowchart with reference to Fig. 11. Each process in the flowchart is performed by the control unit 7 of the component mounting device 13 in which the failure has occurred.

When the user (operator) inputs information into the fault location specification field 140a and the verification operation specification field 140e and operates the production feasibility determination button 140b, the control process is started.

As shown in FIG. 11, first, in step S101, it is determined whether or not to perform the transport feasibility confirmation operation. If the user (operator) has specified in the confirmation operation specification field 140e that the transport feasibility confirmation operation is not to be performed, it is determined that the transport feasibility confirmation operation is not to be performed, and the process proceeds to step S105. On the other hand, if the user (operator) has specified in the confirmation operation specification field 140e that the transport feasibility confirmation operation is to be performed, it is determined that the transport feasibility confirmation operation is to be performed, and the process proceeds to step S102.

Then, in step S102, a control process is performed in which the substrate P on the substrate transport unit 2 is transported to a predetermined position (such as a discharge position) by the substrate transport unit 2. Then, a detection operation of the substrate P is performed by the substrate detection unit 21.

Then, in step S103, it is determined whether or not the substrate P has been detected by the substrate detection unit 21. If it is determined that the substrate P has not been detected by the substrate detection unit 21, the process proceeds to step S104.

Then, in step S104, a failure of the board transport unit 2 is notified. Specifically, the result display field 140c displays that the board P cannot be produced by relocating the component supply unit 110, and that the board transport unit 2 has failed. Then, the control process ends.

Also, if it is determined in step S103 that the substrate P has been detected by the substrate detection unit 21, the process proceeds to step S105.

Then, in step S105, it is determined whether or not the device has been skipped. Specifically, it is determined whether or not all of the multiple head units 3 and multiple carts 120 have been specified by the user (operator) in the fault location specification field 140a. If all of the multiple head units 3 and multiple carts 120 have been specified by the user in the fault location specification field 140a, it is determined that the device has been skipped, and the process proceeds to step S108. On the other hand, if not all of the multiple head units 3 and multiple carts 120 have been specified by the user in the fault location specification field 140a, it is determined that the device has not been skipped, and the process proceeds to step S106.

Then, in step S106, it is determined whether or not an individual skip has been selected. Specifically, it is determined whether or not any of the multiple head units 3 and multiple carts 120 have been specified by the user (operator) in the fault location specification field 140a. If none of the multiple head units 3 and multiple carts 120 have been specified by the user (operator) in the fault location specification field 140a, it is determined that an individual skip has not been selected, and the control process is terminated. Also, if any of the multiple head units 3 and multiple carts 120 have been specified by the user in the fault location specification field 140a, it is determined that an individual skip has been selected, and the process proceeds to step S107.

Then, in step S107, it is determined whether or not the board P can be produced by relocating the component supply unit 110 within the own device. If an empty slot 120a necessary for relocating the component supply unit 110 to be relocated exists within the own device, it is determined that the board P can be produced by relocating the component supply unit 110 within the own device, and the process proceeds to step S110. On the other hand, if an empty slot 120a necessary for relocating the component supply unit 110 to be relocated does not exist within the own device, it is determined that the board P cannot be produced by relocating the component supply unit 110 within the own device, and the process proceeds to step S108.

Then, in step S108, it is determined whether the board P can be produced by relocating the component supply unit 110 to another component mounting device 13. If an empty slot 120a necessary for relocating the component supply unit 110 to be relocated exists in the other component mounting device 13, it is determined that the board P can be produced by relocating the component supply unit 110 to the other component mounting device 13, and the process proceeds to step S110. On the other hand, if an empty slot 120a necessary for relocating the component supply unit 110 to be relocated does not exist in the other component mounting device 13, it is determined that the board P cannot be produced by relocating the component supply unit 110 to the other component mounting device 13, and the process proceeds to step S109.

Then, in step S109, the result display field 140c displays that the board P cannot be produced by relocating the component supply unit 110. Then, the control process ends.

If the process proceeds to step S110, the result display field 140c in step S110 displays as a judgment result that the board P can be produced by relocating the component supply unit 110, and that the relocation is within the device itself or to another component mounting device 13. When the user (operator) operates the relocation information display button 140d, relocation information 130 including information representing the component supply unit 110 to be relocated and information representing the empty slot 120a to which it is to be relocated is displayed on the display unit 8. Then, the control process is terminated.

(Effects of this embodiment)
In this embodiment, the following effects can be obtained.

In this embodiment, as described above, when a failure occurs in the own device, the control unit 7 is provided to determine whether or not the board P can be produced by relocating the component supply unit 110 related to the failure to another component mounting device 13 in the own device or the same component mounting line 10, and to notify relocation information 130 for relocating the component supply unit 110 if it is determined that the board P can be produced. As a result, since the component supply unit 110 can be relocated to another component mounting device 13 in the own device or the same component mounting line 10 to produce the board P, there is no need to provide a bypass conveyor to the other component mounting line 10. As a result, the configuration of the component mounting line 10 can be prevented from becoming complicated. In addition, since the board P can be produced by relocating the component supply unit 110 to another component mounting device 13 in the own device or the same component mounting line 10, the time during which the production of the board P is stopped can be reduced compared to the case where the production of the board P is stopped until the failure is repaired. As a result, even when a failure occurs in the component mounting device 13, the time during which the production of the board P is stopped due to the failure can be reduced while preventing the configuration of the component mounting line 10 from becoming complicated.

In addition, in this embodiment, as described above, the control unit 7 is configured to determine whether or not the board P can be produced by relocating the component supply unit 110 when the board P can be transported by the board transport unit 2. This makes it possible to determine whether or not the board P can be produced by relocating the component supply unit 110 when the board P can be transported by the board transport unit 2, thereby avoiding the unnecessary process of determining whether or not the board P can be produced by relocating the component supply unit 110 when the board P cannot be transported by the board transport unit 2 (when the board P cannot be produced even if the component supply unit 110 is relocated).

In addition, in this embodiment, as described above, the control unit 7 is configured to determine whether the board P can be produced by relocating the component supply unit 110 within its own device, and if it is determined that the board P cannot be produced by relocating the component supply unit 110 within its own device, to determine whether the board P can be produced by relocating the component supply unit 110 to another component mounting device 13. This allows the control unit 7 to determine whether the board P can be produced by relocating the component supply unit 110 to its own device with priority, so that the component supply unit 110 can be relocated to its own device as much as possible. As a result, the work of relocating the component supply unit 110 can be reduced compared to the case of relocating the component supply unit 110 to another component mounting device 13. In addition, if the component supply unit 110 cannot be relocated within its own device, it can determine that the component supply unit 110 should be relocated to another component mounting device 13, so that the board P can be produced as much as possible.

In addition, in this embodiment, as described above, a plurality of head units 3 are provided. The control unit 7 is also configured to determine whether or not the board P can be produced by relocating the component supply unit 110 associated with the head unit 3 designated by the user as being faulty from among the plurality of head units 3 to within the device itself or another component mounting device 13. This allows the control unit 7 to determine whether or not to relocate the component supply unit 110 associated with the head unit 3 designated by the user as being faulty from among the plurality of head units 3, so that the control unit 7 can also respond to the failure of some of the head units 3 among the plurality of head units 3. In addition, since it is only necessary to respond to the failure of some of the head units 3 among the plurality of head units 3, the number of component supply units 110 to be relocated can be reduced. As a result, the possibility that the board P can be produced by relocating the component supply unit 110 can be increased, and the labor required for relocating the component supply unit 110 can be reduced when the board P can be produced by relocating the component supply unit 110.

In addition, in this embodiment, as described above, the component mounting device 13 includes a plurality of carts 120 on which the component supply units 110 are arranged. The control unit 7 is configured to determine whether or not the board P can be produced by relocating the component supply unit 110 associated with the cart 120 designated by the user as being faulty from among the plurality of carts 120 to within the device itself or to another component mounting device 13. This allows the control unit 7 to determine whether or not to relocate the component supply unit 110 associated with the cart 120 designated by the user as being faulty from among the plurality of carts 120, so that the control unit 7 can also respond to the failure of some of the carts 120 among the plurality of carts 120. In addition, since it is only necessary to respond to the failure of some of the carts 120 among the plurality of carts 120, the number of component supply units 110 to be relocated can be reduced. As a result, the possibility that the board P can be produced by relocating the component supply unit 110 can be increased, and the labor required for relocating the component supply unit 110 can be reduced when the board P can be produced by relocating the component supply unit 110.

In addition, in this embodiment, as described above, when the board P can be produced by relocating the component supply unit 110, the control unit 7 is configured to display on the display unit 8 whether to relocate the component supply unit 110 within the own device or to relocate the component supply unit 110 to another component mounting device 13. This makes it easy to confirm, based on the information displayed on the display unit 8, whether to relocate the component supply unit 110 within the own device or to relocate the component supply unit 110 to another component mounting device 13.

In addition, in this embodiment, as described above, the control unit 7 is configured to display on the display unit 8 relocation information 130 including information representing the component supply unit 110 to be relocated and information representing the empty slot 120a at the relocation destination in which the component supply unit 110 to be relocated will be placed. As a result, the relocation information 130 displayed on the display unit 8 makes it easy to confirm the component supply unit 110 to be relocated and the empty slot 120a at the relocation destination in which the component supply unit 110 to be relocated will be placed, and therefore the task of relocating the component supply unit 110 can be easily performed.

In addition, in this embodiment, as described above, the control unit 7 is configured to perform a transport feasibility confirmation operation to confirm whether or not the substrate P can be transported by the substrate transport unit 2. This eliminates the need for the user to perform the task of confirming (inspecting) whether or not the substrate P can be transported by the substrate transport unit 2, thereby eliminating the need for the user to perform the task of confirming whether or not the substrate P can be transported by the substrate transport unit 2.

In addition, in this embodiment, as described above, the control unit 7 is configured to perform a transport feasibility confirmation operation based on user operation. This allows the user to decide whether or not to perform the transport feasibility confirmation operation, so that in cases such as when it is clear that the substrate P can be transported by the substrate transport unit 2, the transport feasibility confirmation operation can be avoided unnecessarily, and in cases such as when it is not clear that the substrate P can be transported by the substrate transport unit 2, the transport feasibility confirmation operation can be effectively used to confirm whether the substrate transport unit 2 can transport the substrate while saving the user effort.

[Modification]
It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope of the claims.

For example, in the above embodiment, an example was shown in which the control unit of the component mounting device performs the control processing of the present invention, but the present invention is not limited to this. In the present invention, the production management device may perform the control processing of the present invention. That is, when a failure occurs in the component mounting device, the production management device may be configured to determine whether or not a board can be produced by relocating a component supply unit related to the failure within the component mounting device or to another component mounting device on the same component mounting line, and, if it is determined that the board can be produced, to notify relocation information for relocating the component supply unit. In this case, the production management device is an example of a "control device" in the claims.

In the above embodiment, an example was shown in which the component supply unit is relocated when a failure occurs in the component mounting device, but the present invention is not limited to this. In the present invention, when a failure occurs in the component mounting device, the component supply unit and the nozzle stocker may be relocated. In this case, the relocation information may include information representing the component supply unit to be relocated, information representing an empty slot in the relocation destination in which the component supply unit to be relocated will be placed, information representing the nozzle stocker to be relocated, and information representing the relocation destination of the nozzle stocker. By relocating the nozzle stocker, it is possible to easily supply nozzles suitable for the component type.

In the above embodiment, an example was shown in which the control unit is configured to determine whether or not a board can be produced by relocating the component supply unit within the device itself or to another component mounting device on the same component mounting line, but the present invention is not limited to this. In the present invention, the control unit may be configured to determine only whether or not a board can be produced by relocating the component supply unit within the device itself, or may be configured to determine only whether or not a board can be produced by relocating the component supply unit to another component mounting device.

In the above embodiment, an example was shown in which the control unit is configured to determine with priority whether or not the board can be produced by relocating the component supply unit within the device itself, but the present invention is not limited to this. In the present invention, the control unit may be configured to determine in parallel whether or not the board can be produced by relocating the component supply unit within the device itself or to another component mounting device. Also, the control unit may be configured to determine with priority whether or not the board can be produced by relocating the component supply unit to another component mounting device.

In addition, in the above embodiment, an example of applying the present invention to a component mounting device equipped with two head units is shown, but the present invention is not limited to this. The present invention may be applied to a component mounting device equipped with one head unit or three or more head units.

In addition, in the above embodiment, an example of applying the present invention to a component mounting device equipped with two carts is shown, but the present invention is not limited to this. The present invention may be applied to a component mounting device equipped with one cart or three or more carts.

In addition, in the above embodiment, an example was shown in which the component mounting device allows the user (operator) to specify the head unit or the dolly as the faulty location, but the present invention is not limited to this. In the present invention, the component mounting device does not need to allow the user (operator) to specify the head unit or the dolly as the faulty location.

In addition, in the above embodiment, an example was shown in which the setting screen and relocation information were displayed on the display unit of the component mounting device, but the present invention is not limited to this. In the present invention, the setting screen and relocation information may be displayed on a display unit such as the display unit of a production management device, the display unit of a mobile terminal carried by a user (worker), or a display unit provided in a work area of a component mounting factory where the component mounting device is located.

In the above embodiment, an example was shown in which relocation information was displayed by transitioning the settings screen, but the present invention is not limited to this. In the present invention, the relocation information may be displayed on the settings screen.

In the above embodiment, an example was shown in which the component mounting device is configured to perform a transport feasibility check operation based on a user's operation, but the present invention is not limited to this. In the present invention, the component mounting device may be configured to perform a transport feasibility check operation regardless of a user's operation. Also, the component mounting device may not have the function of performing a transport feasibility check operation.

In addition, in the above embodiment, for convenience of explanation, the processing operation of the control unit is explained using a flow-driven flowchart in which the processing is performed in order according to a processing flow, but the present invention is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the processing may be performed completely event-driven, or event-driven and flow-driven may be combined.

2 Substrate conveying unit 3 Head unit 7 Control unit (control device)
8 Display unit 13 Component mounting device 100 Component mounting system 110 Component supply unit 120 Cart 120a Slot 130 Relocation information E Component P Substrate

Claims (10)

a substrate transport unit that transports a substrate;
a head unit for mounting components on the substrate;
a component supply unit that supplies the components to the head unit;
a control unit that, when a failure occurs in the device, determines whether the board can be produced by relocating the component supply unit related to the failure within the device or to another component mounting device on the same component mounting line, and, if it is determined that the board can be produced, notifies relocation information for relocating the component supply unit. The component mounting device according to claim 1, wherein the control unit is configured to determine whether the board can be produced by relocating the component supply unit when the board can be transported by the board transport unit. The component mounting device according to claim 1 or 2, wherein the control unit is configured to determine whether the board can be produced by relocating the component supply unit within the device itself, and, if it is determined that the board cannot be produced by relocating the component supply unit within the device itself, to determine whether the board can be produced by relocating the component supply unit to the other component mounting device. The head unit is provided in plurality,
The component mounting device according to any one of claims 1 to 3, wherein the control unit is configured to determine whether the board can be produced by relocating the component supply unit associated with the head unit designated by the user as faulty from among the multiple head units to the device itself or to the other component mounting device. The part supply unit further includes a plurality of carriages on which the part supply unit is disposed,
The component mounting device according to any one of claims 1 to 4, wherein the control unit is configured to determine whether or not the board can be produced by relocating the component supply unit associated with a cart that a user has designated as faulty from among the multiple carts to within the device itself or to the other component mounting device. The component mounting device according to any one of claims 1 to 5, wherein the control unit is configured to display on a display unit whether to relocate the component supply unit within the device itself or to relocate the component supply unit to the other component mounting device when the board can be produced by relocating the component supply unit. The component mounting device according to any one of claims 1 to 6, wherein the control unit is configured to display on a display unit the relocation information including information representing the component supply unit to be relocated and information representing an empty slot at the relocation destination in which the component supply unit to be relocated is to be placed. The component mounting device according to any one of claims 1 to 7, wherein the control unit is configured to perform a transport feasibility check operation to check whether the substrate can be transported by the substrate transport unit. The component mounting device according to claim 8, wherein the control unit is configured to perform the transport feasibility confirmation operation based on a user's operation. a component mounting device including a substrate transport unit that transports a substrate, a head unit that mounts components on the substrate, and a component supply unit that supplies the components to the head unit;
a control device that, when a failure occurs in the component mounting device, determines whether the board can be produced by relocating the component supply unit related to the failure within the component mounting device or to another component mounting device on the same component mounting line, and if it is determined that the board can be produced, notifies relocation information for relocating the component supply unit.

Images