JP7621794B2 - TRANSFER MACHINE, CLEANING MODULE, AND SUBSTRATE PROCESSING APPARATUS - Google Patents

Description

This application relates to a transfer machine, a cleaning module, and a substrate processing apparatus.

Substrate processing equipment is used to planarize the surfaces of substrates used in the manufacture of semiconductor devices. Substrates are often disk-shaped. In addition to semiconductor devices, there is also an increasing demand for flatness when planarizing the surfaces of rectangular substrates such as copper clad laminate (CCL) substrates, printed circuit board (PCB) substrates, photomask substrates, and display panels.

For example, Patent Document 1 discloses a substrate processing apparatus that performs a polishing process with the surface to be polished of the substrate facing downward. This substrate processing apparatus is configured to perform a cleaning process by spraying a cleaning liquid onto both sides of the substrate while transporting the substrate with the surface to be polished facing downward after the polishing process on a roller conveyor. As disclosed in Patent Document 1, when transporting the substrate on a roller conveyor, it is known that the transport of the substrate is guided by providing guide rollers above the substrate.

JP 2020-9987 A

As described in Patent Document 1, simply spraying cleaning liquid onto both sides of a substrate being transported by a roller conveyor may not be enough to remove all dirt adhering to the substrate.

One way to deal with this is to provide a separate cleaning tank for cleaning the substrates, transfer the substrates from the roller conveyor to the cleaning tank using a transfer machine, and then immerse the substrates in the cleaning tank for cleaning. In this case, it is possible to provide guide rollers that contact the top surface of the substrate to guide it, so that the substrates transported by the roller conveyor are stably accommodated in the storage space of the transfer machine. However, if the top surface of the substrate is guided by guide rollers, there is a risk that some part of the substrate will not be cleaned when the transfer machine and substrates are immersed in the cleaning tank for cleaning.

Therefore, one of the objectives of this application is to realize a transfer machine that can stably guide substrates into the storage space and prevent residual cleaning.

As one embodiment, the present application discloses a transfer machine for transferring a substrate between a transfer position of a substrate transport path and a cleaning tank disposed at a position spaced apart from the transport path, the transfer machine including a guide roller configured to contact an upper surface of the substrate transported to the transfer position to guide the substrate, and a guide release mechanism configured to release the guide roller from the substrate after the substrate is transported to the transfer position.

1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment; FIG. 2 is a schematic side view of a transfer module according to an embodiment; FIG. 2 illustrates a perspective view of a transport module according to one embodiment. FIG. 2 is a perspective view showing a polishing module according to an embodiment; FIG. 2 is a schematic plan view of a cleaning module according to one embodiment. FIG. 2 is a schematic perspective view of a cleaning module according to one embodiment. FIG. 7 is a perspective view showing in detail the transfer machine shown in FIG. 6 . 8 is a perspective view of a part of the transfer machine shown in FIG. 7 as viewed from another direction. FIG. 2 is a plan view showing a transfer machine according to one embodiment. FIG. 10 is an enlarged plan view of an area AD of the transfer machine shown in FIG. 9 . FIG. 10 is an enlarged perspective view of an area AD of the transfer machine shown in FIG. 9 . 1A and 1B are diagrams illustrating a process of receiving a substrate in a transfer machine and then lifting it up. 13 is a side view showing a state in which a guide roller of the transfer machine contacts the substrate. FIG. 11 is a perspective view showing a state in which a guide roller of a transfer machine is in contact with a substrate. FIG. 13 is a side view showing a state in which the guide roller of the transfer machine is separated from the substrate. FIG. 11 is a perspective view showing a state in which the guide rollers of the transfer machine are separated from the substrate. FIG. 13A and 13B are diagrams illustrating a process of receiving a substrate in a transfer machine of a modified example and then lifting the substrate.

Below, embodiments of the transfer machine, cleaning module, and substrate processing apparatus according to the present invention will be described with reference to the attached drawings. In the attached drawings, identical or similar elements are given identical or similar reference symbols, and duplicate descriptions of identical or similar elements may be omitted in the description of each embodiment. Furthermore, the features shown in each embodiment can be applied to other embodiments as long as they are not mutually inconsistent.

1 is a plan view showing the overall configuration of a substrate processing apparatus 1000 according to one embodiment. The substrate processing apparatus 1000 shown in FIG. 1 has a load module 100, a transfer module 200, a polishing module 300, a cleaning module 400, a drying module 500, and an unload module 600. In the illustrated embodiment, the transfer module 200 has two transfer modules 200A and 200B, and the polishing module 300 has two polishing modules 300A and 300B. In one embodiment, each of these modules can be formed independently. By forming these modules independently, substrate processing apparatuses 1000 with different configurations can be easily formed by arbitrarily combining the number of each module. In addition, the substrate processing apparatus 1000 includes a control device 900, and each component of the substrate processing apparatus 1000 is controlled by the control device 900. In one embodiment, the control device 900 can be configured from a general computer including an input/output device, a calculation device, a storage device, and the like.

<Load module>
The load module 100 is a module for introducing a substrate WF before processing such as polishing and cleaning is performed into the substrate processing apparatus 1000. In one embodiment, the load module 100 is configured to comply with the machine interface standard (IPC-SMEMA-9851) of the Surface Mount Equipment Manufacturers Association (SMEMA).

In the illustrated embodiment, the transport mechanism of the load module 100 has a plurality of transport rollers 202 (first transport rollers) and a plurality of roller shafts 204 to which the transport rollers 202 are attached. In the embodiment shown in FIG. 1, three transport rollers 202 are attached to each roller shaft 204. The substrate WF is placed on the transport rollers 202, and the substrate WF is transported by the rotation of the transport rollers 202. The attachment position of the transport rollers 202 on the roller shaft 204 can be any position as long as the substrate WF can be transported stably. However, since the transport rollers 202 come into contact with the substrate WF,
The transport rollers 202 should be positioned so that they come into contact with an area where there is no problem even if they come into contact with the substrate WF to be processed. In one embodiment, the transport rollers 202 of the load module 100 can be made of a conductive polymer. In one embodiment, the transport rollers 202 are electrically grounded via a roller shaft 204 or the like. This is to prevent the substrate WF from being charged and damaging electronic devices or the like on the substrate WF. In one embodiment, the load module 100 may also be provided with an ionizer (not shown) to prevent the substrate WF from being charged.

<Transport module>
1 includes two transfer modules 200 A and 200 B. The two transfer modules 200 A and 200 B may have the same configuration, and therefore will be collectively referred to as the transfer module 200 in the following description.

2 is a side view of a transport module 200 according to an embodiment. FIG. 3 is a perspective view of a transport module 200 according to an embodiment. In FIG. 3, an upper transport roller (second transport roller) 290 and its driving mechanism are omitted for clarity. The transport module 200 shown in the figure includes a plurality of transport rollers (first transport rollers) 202 for transporting the substrate WF. By rotating the transport rollers 202, the substrate WF on the transport rollers 202 can be transported in a predetermined direction. The transport rollers 202 of the transport module 200 may be formed from a conductive polymer or a non-conductive polymer. The transport rollers 202 are attached to a roller shaft (first roller shaft) 204 and driven by a motor 208 via a gear 206. In one embodiment, the motor 208 can be a servo motor, and the gear 206 can be a gear type, but can also be a magnet gear. The illustrated transport module 200 also includes guide rollers 212 that support the sides of the substrate WF during transport.

As shown in Figures 2 and 3, the transport module 200 has a pusher 230. The pusher 230 is configured to be able to lift the substrate WF on the multiple transport rollers 202 away from the multiple transport rollers 202. The pusher 230 is also configured to be able to transfer the substrate WF it holds to the transport rollers 202 of the transport module 200.

2, the transport module 200 has a stopper 220. The stopper 220 is connected to a stopper moving mechanism 222, and the stopper 220 can enter the transport path of the substrate WF moving on the transport rollers 202. When the stopper 220 is located in the transport path of the substrate WF, the side of the substrate WF moving on the transport rollers 202 contacts the stopper 220, and the substrate WF can be stopped at the position of the stopper 220 during movement. When the stopper 220 is in a position retracted from the transport path of the substrate WF, the substrate WF can move on the transport rollers 202. The position at which the substrate WF is stopped by the stopper 220 is a position (transfer position) at which the pusher 230 can receive the substrate WF on the transport rollers 202.

The transport module 200 of this embodiment has a sensor 216 for detecting the presence or absence of the substrate WF at a predetermined position on the transport roller 202. The sensor 216 may be of any type, for example, an optical sensor. In the embodiment shown in FIG. 2, seven sensors 216 (216a to 216g) are provided in the transport module 200. In one embodiment, the operation of the transport module 200 can be controlled in response to the detection of the substrate WF by these sensors 216a to 216g. As shown in FIG. 2, the transport module 200 has an entrance shutter 218 that can be opened and closed to receive the substrate WF into the transport module 200.

The sensor 216a is provided on the entrance side of the transport module 200. When the sensor 216a confirms that the rear of the substrate WF has passed, the entrance shutter 218 can be closed. After that, the substrate WF is transported by the transport rollers 202 while the position of the substrate WF is monitored by the sensor 216b arranged downstream of the sensor 216a. At this time, the stopper 220 is moved into the transport path of the substrate WF by the stopper moving mechanism 222. The substrate WF transported on the transport rollers 202 comes into contact with the stopper 220 and stops. In addition, the sensor 216c is arranged at the position of the stopper 220, and when the sensor 216c detects the substrate WF, it stops the operation of the transport rollers 202. The substrate WF stopped at the position of the stopper 220 (transfer position) is transferred to the top ring 302 of the polishing module 300 via the pusher 230.

The transport module 200 shown in Figures 2 and 3 has a cleaning mechanism. As shown in Figures 2 and 3, the cleaning mechanism has a cleaning nozzle 284. The cleaning nozzle 284 has an upper cleaning nozzle 284a arranged above the transport roller 202 and a lower cleaning nozzle 284b arranged below. The upper cleaning nozzle 284a and the lower cleaning nozzle 284b are connected to a cleaning liquid supply source (not shown). The upper cleaning nozzle 284a is configured to supply cleaning liquid to the upper surface of the substrate WF transported on the transport roller 202. The lower cleaning nozzle 284b is configured to supply cleaning liquid to the lower surface of the substrate WF transported on the transport roller 202. The upper cleaning nozzle 284a and the lower cleaning nozzle 284b have a width approximately equal to or greater than the width of the substrate WF transported on the transport roller 202, and are configured so that the entire surface of the substrate WF is cleaned by transporting the substrate WF on the transport roller 202. As shown in Figures 2 and 3, the cleaning mechanism is located downstream of the substrate transfer area of the transfer module 200.

As shown in FIG. 2, in an area where the pusher 230 does not transfer the substrate WF, an upper transport roller 290 is disposed above the transport roller 202. The upper transport roller 290 is connected to a power source and configured to be rotatable. In one embodiment, the upper transport roller 290 is configured to be driven by the gear 206 and the motor 208 in the same manner as the transport roller 202.

<Polishing module>
Fig. 4 is a perspective view showing a polishing module 300 according to an embodiment. The substrate processing apparatus 1000 shown in Fig. 1 includes two polishing modules 300A and 300B. The two polishing modules 300A and 300B may have the same configuration, and therefore will be collectively referred to as the polishing module 300 below.

As shown in FIG. 4, the polishing module 300 includes a polishing table 350 and a top ring 302. The polishing table 350 is supported by a table shaft 351. The polishing table 350 is rotated around the axis of the table shaft 351 as indicated by the arrow AC by a drive unit (not shown). A polishing pad 352 is attached to the polishing table 350. The top ring 302 holds the substrate WF and presses it against the polishing pad 352. The top ring 302 is rotated by a drive source (not shown). The substrate WF is polished by being held by the top ring 302 and pressed against the polishing pad 352.

4, the polishing module 300 includes a polishing liquid supply nozzle 354 for supplying a polishing liquid or a dressing liquid to the polishing pad 352. The polishing liquid is, for example, a slurry. The dressing liquid is, for example, pure water. Also, as shown in FIG. 4, the polishing table 350 and the table shaft 351 are provided with a passage 353 for supplying the polishing liquid.
is provided. The passage 353 communicates with an opening 355 on the surface of the polishing table 350. A through hole 357 is formed in the polishing pad 352 at a position corresponding to the opening 355 of the polishing table 350, and the polishing liquid passing through the passage 353 is supplied to the surface of the polishing pad 352 from the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352. The polishing module 300 also includes a dresser 356 for conditioning the polishing pad 352. The polishing module 300 also includes an atomizer 358 for spraying a liquid or a mixed fluid of a liquid and a gas toward the polishing pad 352. The liquid sprayed from the atomizer 358 is, for example, pure water, and the gas is, for example, nitrogen gas.

The top ring 302 is supported by a top ring shaft 304. The top ring 302 is rotated around the axis of the top ring shaft 304 as indicated by the arrow AB by a drive unit (not shown). The top ring shaft 304 can also be moved in the vertical direction by a drive mechanism (not shown).

The substrate WF is held by vacuum suction on the surface of the top ring 302 facing the polishing pad 352. During polishing, polishing liquid is supplied to the polishing surface of the polishing pad 352 from a polishing liquid supply nozzle 354 and/or from a through hole 357 in the polishing pad 352. During polishing, the polishing table 350 and the top ring 302 are rotated. The substrate WF is polished by being pressed against the polishing surface of the polishing pad 352 by the top ring 302.

4, the top ring shaft 304 is connected to an arm 360, which can swing around a rotation axis 362. During polishing of the substrate WF, the arm 360 can be swung or fixed so that the substrate WF covers the through-hole 357 of the polishing pad 352. As shown in FIG. 1, the swingable arm 360 allows the top ring 302 to move toward the transfer module 200. When the top ring 302 moves to the transfer position of the transfer module 200, the top ring 302 can receive the substrate WF from the pusher 230. After the substrate WF is polished in the polishing module 300, the top ring 302 can transfer the substrate WF to the pusher 230.

<Cleaning module> The substrate processing apparatus 1000 of this embodiment includes a cleaning module 400 for removing residues such as slurry from the substrate WF that cannot be completely cleaned by the cleaning mechanism (upper cleaning nozzle 284a and lower cleaning nozzle 284b) of the transfer module 200. FIG. 5 is a plan view showing a schematic diagram of a cleaning module according to one embodiment. FIG. 6 is a perspective view showing a schematic diagram of a cleaning module according to one embodiment. FIG. 7 is a perspective view showing in detail the transfer machine shown in FIG. 6. FIG. 8 is a perspective view showing a part of the transfer machine shown in FIG. 7 from a different direction.

As shown in FIG. 5, the substrate WF polished by the polishing module 300 is carried into the cleaning module 400 through the entrance shutter 410 with the surface to be polished facing downward. As shown in FIG. 6, the cleaning module 400 includes a transport mechanism 210 for transporting the substrate WF with the surface to be polished facing downward along the linear transport path 405 to a substrate transfer position 418 on the downstream side. The transport mechanism 210 has a configuration similar to that of the load module 100 and the transport module 200, and therefore a detailed description thereof will be omitted. The cleaning module 400 includes an ultrasonic cleaning tank 440 disposed at a position spaced apart from the transport path 405 in a direction perpendicular to the transport path 405. The ultrasonic cleaning tank 440 is a cleaning tank for cleaning the substrate WF with the surface to be polished facing downward. The cleaning module 400 includes a transfer machine 420 for transferring the substrate WF between the substrate transfer position 418 of the transport path 405 and the ultrasonic cleaning tank 440. The transfer mechanism 210 transfers the substrate 41 from the ultrasonic cleaning tank 440 to the substrate transfer position 41 by the transfer machine 420.
8, further downstream along the transport path 405. In an area where the transfer machine 420 does not transfer the substrate WF, upper transport rollers 290 are disposed above the transport rollers 202, but for clarity of illustration, the upper transport rollers 290 and their drive mechanism are omitted in FIGS.

As shown in FIG. 5, the ultrasonic cleaning tank 440 includes an ultrasonic irradiator 442 for applying ultrasonic waves to the substrate WF immersed in the cleaning liquid contained in the ultrasonic cleaning tank 440. The ultrasonic cleaning tank 440 can clean residues such as slurry adhering to the polished surface and back surface of the substrate WF by irradiating ultrasonic waves from the ultrasonic irradiator 442. According to this embodiment, in addition to cleaning by the cleaning mechanism (upper cleaning nozzle 284a and lower cleaning nozzle 284b) of the transfer module 200, cleaning is also performed in the ultrasonic cleaning tank 440, thereby improving the cleaning power of the substrate WF.

As shown in Figures 6 to 8, the transfer machine 420 includes a storage mechanism 430 that forms a storage space 435 for storing the substrate WF transported by the transport mechanism 210 along the transport path 405 to the transfer position 418. The storage mechanism 430 includes a support member 431 for supporting the polished surface of the substrate WF, an upper member 432 that faces the support member 431 above and at a distance from the support member 431, and a pillar member 433 that connects the support member 431 and the upper member 432. The storage space 435 is formed by the support member 431, the upper member 432, and the pillar member 433.

The transfer machine 420 includes a lifting mechanism 428 configured to lift and lower the storage mechanism 430. The lifting mechanism 428 can be realized by a known mechanism such as an actuator. The transfer machine 420 includes a bracket 427 fixed to the lifting mechanism 428 and a hanging shaft 429 extending downward from the bracket 427. The storage mechanism 430 is attached to the hanging shaft 429. The lifting mechanism 428 is configured to lift and lower the storage mechanism 430 along the lifting shaft 425 extending in the vertical direction. The transfer machine 420 also includes a moving mechanism 424 configured to move the storage mechanism 430 along a transfer shaft 422 extending in a direction perpendicular to the conveying path 405 so as to move the storage mechanism 430 between the delivery position 418 and the ultrasonic cleaning tank 440. The moving mechanism 424 can be realized by a known mechanism such as an actuator. The moving mechanism 424 is connected to the lifting shaft 425 and is configured to move the lifting shaft 425, the lifting mechanism 428, the bracket 427, the hanging shaft 429, and the storage mechanism 430 together in a direction perpendicular to the transport path 405. The transfer machine 420 is configured to hold the substrate WF transported to the transfer position 418 by the storage mechanism 430, raise it by the lifting mechanism 428, and transport it by the moving mechanism 424 to directly above the ultrasonic cleaning tank 440.

As shown in FIG. 8, the transfer machine 420 includes a tilting mechanism 426 for tilting the accommodation mechanism 430. In this embodiment, the tilting mechanism 426 is attached to the lower part of a hanging shaft 429 so that the upper part of the upper member 432 is rotatable around an axis parallel to the transport path 405. The tilting mechanism 426 includes an arm 426-1 fixed to the upper surface of the upper member 432, and a cylinder 426-2 connected to the top of the arm 426-1 and the lower part of the bracket 427 via a rotation axis (also parallel to the transport path 405), and can adjust the angle of the accommodation mechanism 430 by pushing and pulling the piston rod of the cylinder 426-2. However, the tilting mechanism 426 is not limited to the above configuration, and can be realized by a known mechanism such as a tilting mechanism. After the transfer machine 420 carries the substrate WF to directly above the ultrasonic cleaning tank 440, the tilting mechanism 426 tilts the substrate WF. The tilt mechanism 426 does not tilt the substrate WF so that it is vertical, but tilts the substrate WF within a range of, for example, 20 degrees or less, preferably 10 degrees or less, so that the surface to be polished of the substrate WF faces downward. With the substrate WF tilted, the transfer machine 420 lowers the accommodation mechanism 430 by the lift mechanism 428 to immerse the substrate WF in the ultrasonic cleaning tank 440. By slightly tilting the substrate WF and controlling the speed at which the substrate is put into the ultrasonic cleaning tank 440 to a relatively slow speed by the lift mechanism 428, the transfer machine 420 can immerse the substrate WF in the ultrasonic cleaning tank 440 while reducing the resistance of the cleaning liquid to the substrate when the substrate is immersed. Therefore, even a substrate with a side length of more than 500 mm can be cleaned with little damage to the substrate.

When the substrate WF is being cleaned in the ultrasonic cleaning tank 440, the transfer machine 420 can use the tilt mechanism 426 to move the storage mechanism 430 in the roll direction indicated by the arrow Ro. This can shift the point at which the substrate WF comes into contact with the pad 434 of the storage mechanism 430, which will be described later, and therefore can prevent residual cleaning. For the same purpose of preventing residual cleaning, the storage mechanism 430 can be swung by moving it back and forth along the transfer shaft 422 using the movement mechanism 424.

7, the accommodation mechanism 430 includes an entrance 437 for carrying the substrate WF into the accommodation space 435, an entrance shutter 436 provided at the entrance 437, and an entrance opening/closing mechanism 480 for opening and closing the entrance 437 by raising and lowering the entrance shutter 436. The entrance opening/closing mechanism 480 includes an opening/closing member 485 extending in a rod shape in the transport direction of the substrate WF, a bracket 483 fixed to the upper surface of the opening/closing member 485, and an entrance lifting mechanism 481 for lifting and lowering the opening/closing member 485 via the bracket 483. The opening/closing member 485 is configured to hold the entrance shutter 436. Specifically, the entrance shutter 436 is attached to the end of the opening/closing member 485 on the substrate transport entrance side, and extends downward from the lower surface of the opening/closing member 485. The entrance lifting mechanism 481 can be realized by a known mechanism such as a cylinder. The entrance lifting mechanism 481 can lift and lower the entrance shutter 436 via the bracket 483 and the opening/closing member 485. The entrance lift mechanism 481 is configured to open the entrance 437 by raising the entrance shutter 436 and to close the entrance 437 by lowering the entrance shutter 436.

The accommodation mechanism 430 includes an exit 439 for unloading the substrate WF from the accommodation space 435, an exit shutter 438 provided at the exit 439, and an opening/closing member 486 for holding the exit shutter 438. The accommodation mechanism 430 also includes a bracket 484 fixed to the upper surface of the opening/closing member 486, and an exit lifting mechanism 482 for lifting and lowering the opening/closing member 486 via the bracket 484. The exit shutter 438 is attached to the end of the opening/closing member 486 on the substrate unloading side, and extends downward from the lower surface of the opening/closing member 486. The exit lifting mechanism 482 can be realized by a known mechanism such as a cylinder. The exit lifting mechanism 482 can lift and lower the exit shutter 438 via the bracket 484 and the opening/closing member 486. The exit lifting mechanism 482 is configured to open the exit 439 by lifting the exit shutter 438, and close the exit 439 by lowering the exit shutter 438.

When the substrate WF is carried into the storage space 435, the storage mechanism 430 is configured to move the exit shutter 438 downward to close the exit 439, and to have the entrance shutter 436 wait above to open the entrance 437. The storage mechanism 430 is also configured to move the entrance shutter 436 downward to close the entrance 437 once the substrate WF has been carried into the storage space 435. The transfer machine 420 is configured to move the storage mechanism 430 upward using the lifting mechanism 428 to hold the substrate WF, and to transport the substrate WF to directly above the ultrasonic cleaning tank 440 using the moving mechanism 424 once the substrate WF has been carried into the storage space 435 and the entrance 437 has been closed.

9 is a plan view showing a transfer machine according to an embodiment. FIG. 10 is a plan view showing an area AD of the transfer machine shown in FIG. 9 in an enlarged manner. FIG. 11 is a perspective view showing an area AD of the transfer machine shown in FIG. 9 in an enlarged manner. The transport mechanism 210 is provided with a sensor (not shown) for monitoring the presence or absence of the substrate WF at a monitoring position 488a near the exit of the accommodation mechanism 430 shown in FIG. 9. When the transfer machine 420 transports the substrate WF into the accommodation space 435, if the sensor installed in the transport mechanism 210 detects the presence of the substrate WF, the transfer machine 420 can determine that the entire substrate WF has been transported to the transfer position 418. On the other hand, when the transfer machine 420 transports the substrate WF out of the accommodation space 435, if the sensor detects the absence of the substrate WF, the transfer machine 420 can determine that the entire substrate WF has been transported out of the transfer position 418.

As shown in FIG. 9, the transfer machine 420 includes guide rollers 494 configured to contact the upper surface of the substrate WF transported to the transfer position 418 and guide the substrate WF. In this embodiment, a plurality of guide rollers 494 are provided so as to contact a plurality of points on the upper surface of the substrate WF. Specifically, three guide rollers 494 are provided along the transport direction of the substrate WF, and three guide rollers 494 are provided along a direction intersecting (perpendicular to) the transport direction of the substrate WF. In this embodiment, an example in which a total of nine guide rollers 494 are provided is shown, but the number and arrangement of the guide rollers 494 are arbitrary.

For example, if the substrate WF is warped, there is a risk that the substrate WF may get caught on the storage mechanism 430 of the transfer machine 420 while being transported to the storage space 435, resulting in damage to the substrate WF. By providing guide rollers 494, the substrate WF can be transported while being guided by the guide rollers 494, so that the substrate WF can be stably guided into the storage space 435.

The transfer machine 420 also includes a guide release mechanism 490 configured to move the guide roller 494 away from the substrate WF when the substrate WF is transported to the transfer position 418. The guide release mechanism 490 is configured to move the guide roller 494 away from the substrate WF in conjunction with the operation of lowering the entrance shutter 436 by the entrance opening/closing mechanism 480 to close the entrance 437.

10 and 11, the guide release mechanism 490 includes a link 492 to which a guide roller 494 is attached, and a rotating shaft 493 that rotatably supports the link 492. The rotating shaft 493 is attached to an L-shaped bracket 497 fixed to the upper surface of the upper member 432 of the storage mechanism 430. The rotating shaft 493 is configured to support between a first end 492a to which the guide roller 494 of the link 492 is attached, and a second end 492b opposite to the first end 492a. The guide release mechanism 490 is configured to separate the guide roller 494 from the substrate WF by pushing down the second end 492b of the link 492 in conjunction with the operation of the entrance opening/closing mechanism 480 to lower the entrance shutter 436. That is, when the second end 492b of the link 492 is pressed down, the link 492 rotates counterclockwise around the rotation shaft 493, and the first end 492a of the link 492 moves in a direction away from the substrate WF, thereby pulling the guide roller 494 away from the substrate WF. The link 492, bracket 497, and rotation shaft 493 are provided in the same manner for each of the nine guide rollers 494.

The guide release mechanism 490 further includes a shaft 491 that connects the second ends 492b of the multiple links 492. Specifically, the shaft 491 includes a first shaft 491-1, a second shaft 491-2, and a third shaft 491-3 that connect the three links 492 of the three guide rollers 494 provided along a direction intersecting (perpendicular to) the transport direction of the substrate WF. The first shaft 491-1 connects the second ends 492b of the three links 492 on the upstream side in the transport direction of the substrate WF, the second shaft 491-2 connects the second ends 492b of the three links 492 on the downstream side in the transport direction of the substrate WF, and the third shaft 491-3 connects the second ends 492b of the three links 492 between the upstream side and downstream side in the transport direction of the substrate WF. The opening/closing member 485 extends across the three shafts 491 in the transport direction of the substrate WF, and is disposed on the three shafts 491. The opening/closing member 485 is provided so as to be able to come into contact with the three shafts 491 and press the three shafts 491 downward when the opening/closing member 485 is lowered by the entrance lifting mechanism 481.

The guide release mechanism 490 includes a weight 495 attached to the first end 492a of the link 492 so that the guide roller 494 is lowered to a position where it contacts the upper surface of the substrate WF when the second end 492b of the link 492 is not pressed down. By providing the weight 495, when the substrate WF is being transported to the transfer position 418 of the transport path 405 (when the entrance shutter 436 is waiting above), the guide roller 494 is lowered to a position where it contacts the upper surface of the substrate WF, so that the substrate WF can be guided reliably. On the other hand, after the substrate WF is transported to the transfer machine 420, the transfer machine 420 is immersed in the ultrasonic cleaning tank 440 with the substrate WF accommodated therein, and the substrate WF is ultrasonically cleaned. At this time, if the guide roller 494 remains in contact with the upper surface of the substrate WF, ultrasonic waves are not irradiated to the portion of the substrate WF where the guide roller 494 contacts, so that cleaning residue may occur. In this regard, according to the transfer machine 420 of this embodiment, after the substrate WF is transported to the transfer position 418, the guide roller 494 can be separated from the substrate WF by the guide release mechanism 490. Therefore, ultrasonic cleaning can be performed in a state where the guide roller 494 is separated from the substrate WF, so that the occurrence of uncleaned portions can be suppressed.

Next, the operation of the guide release mechanism 490 to separate the guide roller 494 will be described. FIG. 12 is a diagram showing a schematic flow from storing a substrate in the transfer machine to lifting it up. FIG. 13 is a side view showing the state in which the guide roller of the transfer machine is in contact with the substrate. FIG. 14 is a perspective view showing the state in which the guide roller of the transfer machine is in contact with the substrate. FIG. 15 is a side view showing the state in which the guide roller of the transfer machine has been released from the substrate. FIG. 16 is a perspective view showing the state in which the guide roller of the transfer machine has been released from the substrate.

When the substrate WF is loaded into the storage space 435 of the transfer machine 420, as shown in FIG. 12(A), the transfer machine 420 lowers the opening/closing member 486 by the exit lifting mechanism 482 and closes the exit 439 of the storage mechanism 430 by the exit shutter 438. At this time, as shown in FIGS. 12(A), 13, and 14, the transfer machine 420 raises the opening/closing member 485 by the entrance lifting mechanism 481, so that the entrance shutter 436 waits above and opens the entrance 437. In this state, the three shafts 491 are not pressed by the opening/closing member 485, so that the substrate is transported to the storage space by the transport rollers 202, and the guide rollers 494 come into contact with the upper surface of the substrate WF.

As shown in FIG. 12(B), the substrate WF is transported until it contacts the exit shutter 438, and when the sensor 488 detects that the substrate WF is in the storage mechanism 430, the rotation of the transport roller 202 is stopped. Next, as shown in FIG. 12(C), FIG. 15, and FIG. 16, the transfer machine 420 lowers the opening/closing member 485 by the entrance lifting mechanism 481. This lowers the entrance shutter 436 and closes the entrance 437. Closing the entrance 437 and the exit 439 of the storage mechanism 430 can prevent the substrate WF from falling out of the storage mechanism 430 when the substrate WF is transported to the ultrasonic cleaning tank 440 and when the substrate WF is cleaned in the ultrasonic cleaning tank 440.

Moreover, the transfer machine 420 lowers the opening/closing member 485 to close the entrance 437, thereby bringing the opening/closing member 485 into contact with the three shafts 491 and pushing down the three shafts 491. As a result, the link 492 rotates counterclockwise about the rotation axis 493, and the guide roller 494 is separated from the upper surface of the substrate WF. With the guide roller 494 separated from the upper surface of the substrate WF, the transfer machine 420 raises the substrate WF as shown in FIG. 12(D). Then, the substrate WF guided to the accommodation space 435 is supported by the pad 434 provided on the support member 431 and rises. Next, the transfer machine 420 carries the substrate WF to the ultrasonic cleaning tank 440, and immerses the substrate WF together with the accommodation mechanism 430 in the ultrasonic cleaning tank 440 for ultrasonic cleaning. According to this embodiment, since the guide roller 494 does not contact the upper surface of the substrate WF, ultrasonic waves can be applied to the entire upper surface of the substrate WF, and as a result, the occurrence of uncleaned portions of the substrate WF can be suppressed. In the above embodiment, one entrance shutter 436 and two exit shutters 438 are provided, and the entrance shutter 436 and the exit shutter 438 are cylindrical in shape, but there is no limit to the number and shape as long as the ultrasonic cleaning action is not hindered and the substrate is prevented from falling off and being damaged. In addition, the accommodation mechanism 430 is provided with the column members 433 with which the side edge of the substrate WF can come into contact in the direction perpendicular to the direction of the transport path 405, so that the provision of guides on all four sides of the substrate WF makes it possible to achieve both stable transport and cleaning of the substrate WF. Furthermore, by providing cylindrical guides (side rollers) for guiding the side edge of the substrate WF near the column members 433, the substrate WF can be transported more stably.

In the above embodiment, an example is shown in which the entrance shutter 436 and the exit shutter 438 are raised and lowered separately, but the present invention is not limited to this embodiment. FIG. 17 is a diagram showing a schematic diagram of the process from storing a substrate in a modified transfer machine to raising it. The modified transfer machine shown in FIG. 17 differs from the above transfer machine in that the entrance shutter 436 and the exit shutter 438 are raised and lowered simultaneously and that a stopper 487 is provided. The rest of the configuration is similar, so a description of the similar configuration is omitted.

As shown in FIG. 17, in the transfer machine of the modified example, an entrance shutter 436 is attached to the end of the opening/closing member 485 on the substrate transport entrance side, and an exit shutter 438 is attached to the end of the opening/closing member 485 on the substrate transport exit side. As a result, by raising and lowering the opening/closing member 485 by the entrance lifting mechanism 481, the entrance shutter 436 and the exit shutter 438 are raised and lowered simultaneously. Also, as shown in FIG. 17, the transfer machine of the modified example has a stopper 487. The stopper 487 is connected to a stopper moving mechanism 489. The stopper 487 can enter the transport path of the substrate WF at the exit 439. When the stopper 487 is located in the transport path of the substrate WF, the side of the substrate WF moving on the transport roller 202 comes into contact with the stopper 487, and the substrate WF during the movement can be stopped at the position of the stopper 487.

As shown in FIG. 17(A), when the substrate WF is loaded into the transfer machine, the transfer machine is configured to open the entrance 437 and the exit 439 by raising the opening/closing member 485 with the entrance lifting mechanism 481 and having the entrance shutter 436 and the exit shutter 438 waiting at the top. Meanwhile, the transfer machine closes the exit 439 by moving the stopper 487 into the transport path of the exit 439 with the stopper moving mechanism 489. As a result, as shown in FIG. 17(B), the substrate WF comes into contact with the stopper 487, and the rotation of the transport roller 202 is stopped, thereby stopping the transfer position.

Then, as shown in FIG. 17(C), the transfer machine retracts the stopper 487 from the transport path by the stopper moving mechanism 489, and lowers the opening/closing member 485 by the entrance lifting mechanism 481. As a result, as in the above embodiment, the link 492 rotates counterclockwise around the rotation shaft 493, and the guide roller 494 is pulled away from the upper surface of the substrate WF. Next, the transfer machine raises the substrate WF as shown in FIG. 17(D) with the guide roller 494 pulled away from the upper surface of the substrate WF. According to this modified example, the entrance shutter 436 and the exit shutter 438 are raised and lowered by a single lifting mechanism, so that the configuration of the transfer machine can be simplified compared to the case where the entrance shutter 436 and the exit shutter 438 are raised and lowered separately.

<Scrubbing mechanism>
5, the cleaning module 400 includes two scrub cleaning mechanisms 450A, 450B arranged downstream of the substrate transport from the transfer position of the transport path 405. Each of the scrub cleaning mechanisms 450A, 450B includes a roll sponge (not shown) that rotates in contact with both sides of the substrate WF transported by the transport mechanism 210, and is configured to roll-clean both sides of the substrate WF with the roll sponge.

<Rinse cleaning mechanism>
As shown in FIG. 5, the cleaning module 400 includes a rinse cleaning mechanism 460 disposed downstream of the scrub cleaning mechanisms 450A and 450B of the transport path 405 in the substrate transport direction. The rinse cleaning mechanism 460 is configured to rinse both sides of the substrate WF cleaned by the scrub cleaning mechanism 450 by supplying a rinse liquid (e.g., pure water) to both sides of the substrate WF. The substrate WF cleaned by the rinse cleaning mechanism 460 is transported out of the cleaning module 400 via the exit shutter 470 shown in FIG. 5. Note that, in this embodiment, an example is shown in which the substrate WF is subjected to both ultrasonic cleaning by the ultrasonic cleaning tank 440 and roll cleaning by the scrub cleaning mechanism 450, and then rinse cleaning by the rinse cleaning mechanism 460, but this is not limiting. The cleaning module 400 may perform only ultrasonic cleaning and then rinse cleaning, or may perform only roll cleaning and then rinse cleaning, depending on the material of the substrate WF, the type of dirt attached to the substrate WF, or the size of the substrate WF. Moreover, the ultrasonic cleaning tank 440 and the scrub cleaning mechanism 450 may include a system for supplying a chemical solution. This makes it possible to realize the cleaning module 400 that can use both physical and chemical cleaning methods. Furthermore, the cleaning module 400 may include a plurality of ultrasonic cleaning tanks 440. This makes it possible to increase the types of cleaning solutions that can be used, making it possible to deal with various types of residues attached to the substrate, and also to improve the throughput of the cleaning module 400.

<Drying module>
The drying module 500 shown in Fig. 1 is an apparatus for drying the substrate WF. In the substrate processing apparatus 1000 shown in Fig. 1, the drying module 500 dries the substrate WF that has been polished in the polishing module 300 and then cleaned in the cleaning module 400. As shown in Fig. 1, the drying module 500 is disposed downstream of the cleaning module 400.

The drying module 500 has a nozzle 530 for spraying gas toward the substrate WF being transported on the transport rollers 202. The gas can be, for example, compressed air or nitrogen. The drying module 500 can blow away water droplets on the substrate WF being transported, thereby drying the substrate WF.

<Unload module>
The unload module 600 shown in Fig. 1 is a module for unloading the substrate WF after processing such as polishing and cleaning to the outside of the substrate processing apparatus 1000. In the substrate processing apparatus 1000 shown in Fig. 1, the unload module 600 receives the substrate after drying in the drying module 500. As shown in Fig. 1, the unload module 600 is disposed downstream of the drying module 500. In one embodiment, the unload module 600 is configured to comply with the machine interface standard (IPC-SMEMA-9851) of the Surface Mount Equipment Manufacturers Association (SMEMA).

Although several embodiments of the present invention have been described above, the above-mentioned embodiments of the present invention are intended to facilitate understanding of the present invention and do not limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. Furthermore, any combination or omission of each component described in the claims and specification is possible within the scope of solving at least a part of the above-mentioned problems or achieving at least a part of the effects.

As one embodiment, the present application discloses a transfer machine for transferring a substrate between a transfer position of a substrate transport path and a cleaning tank disposed at a position spaced apart from the transport path, the transfer machine including a guide roller configured to contact an upper surface of the substrate transported to the transfer position to guide the substrate, and a guide release mechanism configured to release the guide roller from the substrate after the substrate is transported to the transfer position.

Furthermore, as one embodiment, the present application discloses a transfer machine further including a storage mechanism that forms a storage space for storing the substrate transported to the transfer position, a lifting mechanism configured to lift and lower the storage mechanism, and a moving mechanism configured to move the storage mechanism between the transfer position and the cleaning tank.

Furthermore, as one embodiment, the present application discloses a transfer machine in which the storage mechanism includes an entrance for carrying the substrate into the storage space, an entrance shutter provided at the entrance, and an entrance opening/closing mechanism for opening and closing the entrance by raising and lowering the entrance shutter, and the guide release mechanism is configured to move the guide roller away from the substrate in conjunction with the entrance opening/closing mechanism's operation to close the entrance.

Furthermore, as one embodiment, the present application discloses a transfer machine in which the guide release mechanism includes a link that holds the guide roller and a rotating shaft that supports the link between a first end to which the guide roller is attached and a second end opposite the first end, and the entrance opening/closing mechanism is configured to push down the second end of the link in conjunction with the operation of lowering the entrance shutter, thereby separating the guide roller from the substrate.

Furthermore, as one embodiment, the present application discloses a transfer machine in which the guide rollers are arranged in a direction intersecting the transport direction of the substrate, the link and the rotation shaft are provided for each of the guide rollers, the guide release mechanism further includes a shaft connecting the second ends of the links provided for the guide rollers, and the entrance opening and closing mechanism includes an opening and closing member that holds the entrance shutter and is arranged on the upper part of the shaft so as to be able to press the shaft, and an entrance lifting mechanism for lifting and lowering the opening and closing member.

Furthermore, as one embodiment, the present application discloses a transfer machine in which the multiple guide rollers and the multiple guide release mechanisms provided for the multiple guide rollers are arranged along the transport direction of the substrate, and the opening/closing member extends across multiple shafts of the multiple guide release mechanisms arranged along the transport direction of the substrate and is arranged so as to be able to press the multiple shafts.

Furthermore, as one embodiment, the present application discloses a transfer machine in which the guide release mechanism further includes a weight attached to the link so that the guide roller is lowered to a position where it contacts the upper surface of the substrate when the second end of the link is not pressed down.

Furthermore, as one embodiment, the present application discloses a transfer machine in which the storage mechanism further includes an exit for transporting the substrate out of the storage space, an exit shutter provided at the exit, and an exit lifting mechanism for raising and lowering the exit shutter.

Furthermore, as one embodiment, the present application discloses a cleaning module including a transport mechanism for transporting a substrate with its polished surface facing downward along a transport path, a cleaning tank disposed at a position away from the transport path for cleaning the substrate with its polished surface facing downward, and any of the above-mentioned transfer machines for transferring the substrate between a transfer position on the transport path and the cleaning tank.

Furthermore, as one embodiment, the present application discloses a cleaning module in which the cleaning tank includes an ultrasonic irradiator for applying ultrasonic waves to a substrate immersed in the cleaning liquid contained in the cleaning tank.

Furthermore, as an embodiment, the present application discloses a substrate processing apparatus including a polishing module configured to polish a substrate, the above-described cleaning module configured to clean the substrate polished by the polishing module, and a drying module configured to dry the substrate cleaned by the cleaning module.

210 Transport mechanism 300 Polishing module 400 Cleaning module 405 Transport path 418 Delivery position 420 Transfer machine 424 Movement mechanism 426 Tilting mechanism 428 Elevation mechanism 430 Storage mechanism 431 Support member 432 Upper member 433 Pillar member 435 Storage space 436 Entrance shutter 437 Entrance 438 Exit shutter 439 Exit 440 Ultrasonic cleaning tank 480 Entrance opening/closing mechanism 481 Entrance elevating mechanism 485 Opening/closing member 490 Guide release mechanism 491 Shaft 492 Link 492a First end 492b Second end 493 Rotation shaft 494 Guide roller 495 Weight 500 Drying module 1000 Substrate processing apparatus WF Substrate

Claims (11)

A transfer machine for transferring a substrate between a transfer position of a substrate transport path and a cleaning tank disposed at a position separated from the substrate transport path,
a guide roller configured to contact an upper surface of the substrate transported to the transfer position to guide the substrate;
a guide release mechanism configured to move the guide roller away from the substrate after the substrate is transported to the transfer position;
Including, transfer machine. a receiving mechanism for forming a receiving space for receiving the substrate transported to the transfer position;
a lifting mechanism configured to lift and lower the storage mechanism;
a moving mechanism configured to move the accommodation mechanism between the transfer position and the cleaning tank;
Further comprising:
The transfer machine according to claim 1. the accommodation mechanism includes an entrance for carrying the substrate into the accommodation space, an entrance shutter provided at the entrance, and an entrance opening/closing mechanism for opening and closing the entrance by raising and lowering the entrance shutter,
The guide release mechanism is configured to move the guide roller away from the substrate in cooperation with an operation of the inlet opening/closing mechanism to close the inlet.
The transfer machine according to claim 2. the guide release mechanism includes a link that holds the guide roller, and a rotating shaft that supports a portion between a first end of the link to which the guide roller is attached and a second end opposite the first end, and is configured to separate the guide roller from the substrate by pushing down the second end of the link in conjunction with an operation of the entrance opening/closing mechanism to lower the entrance shutter.
The transfer machine according to claim 3. The guide rollers are arranged in a direction intersecting the transport direction of the substrate,
the link and the rotation shaft are provided for each of the plurality of guide rollers,
the guide release mechanism further includes a shaft connecting the second ends of the links provided to the guide rollers,
The entrance opening and closing mechanism includes an opening and closing member that holds the entrance shutter and is arranged on an upper portion of the shaft so as to be able to press the shaft, and an entrance lifting mechanism for lifting and lowering the opening and closing member.
The transfer machine according to claim 4. the plurality of guide rollers and the plurality of guide release mechanisms provided for the plurality of guide rollers are arranged along a transport direction of the substrate,
the opening/closing member extends across a plurality of shafts of the plurality of guide release mechanisms arranged along a transport direction of the substrate, and is arranged to be able to press the plurality of shafts.
The transfer machine according to claim 5. the guide release mechanism further includes a weight attached to the link so as to lower the guide roller to a position where the guide roller contacts the upper surface of the substrate when the second end of the link is not pressed down.
The transfer machine according to any one of claims 4 to 6. the accommodation mechanism further includes an outlet for unloading the substrate from the accommodation space, an outlet shutter provided at the outlet, and an outlet lifting mechanism for lifting and lowering the outlet shutter.
A transfer machine according to any one of claims 2 to 7. a transport mechanism for transporting the substrate with the surface to be polished facing downward along a transport path;
a cleaning tank disposed at a position separated from the transport path for cleaning the substrate with the polishing surface facing downward;
A transfer machine according to claim 1 for transferring a substrate between a transfer position of the transport path and the cleaning tank;
a cleaning module including: The cleaning tank includes an ultrasonic irradiator for applying ultrasonic waves to a substrate immersed in a cleaning liquid contained in the cleaning tank.
The cleaning module of claim 9. a polishing module configured to polish a substrate;
A cleaning module according to claim 9 or 10, configured to clean the substrate polished by the polishing module;
a drying module configured to dry the substrate cleaned by the cleaning module;
A substrate processing apparatus comprising:

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