JP7624616B2 - Temporary placement stage and parts mounting device - Google Patents

Description

The present invention relates to a temporary placement stage provided in a component mounting device and the component mounting device.

Conventionally, component mounting devices that mount components on a board are known and are used in the manufacture of various types of mounted boards. Among such component mounting devices, those that require particularly high precision in mounting components on a board temporarily place components taken from a component supply unit on a temporary placement stage and recognize them with a recognition camera, and then pick up the components again and mount them on the board (see, for example, Patent Document 1 below).

When a part temporarily placed on the temporary placement stage is recognized by a recognition camera, the part is usually illuminated from above and its outline recognized under that illumination light. At this time, the part is vacuum-adsorbed onto the temporary placement stage to prevent the part from shifting position while being recognized by the recognition camera or when the mounting head picks up the part.

JP 2015-119134 A

However, as mentioned above, when a part is illuminated from above, the illumination light may be diffused on the surface of the part, making it difficult to recognize the outer shape of the part. This can lead to part recognition errors or pickup errors due to the inability to pick up the center of the part.

The present invention aims to provide a temporary placement stage and component mounting device that can prevent misalignment of the placed component while allowing the external shape of the component to be clearly recognized.

The temporary placement stage of the present invention is a temporary placement stage on which components to be mounted on a substrate are temporarily placed, and comprises: an upper member which is breathable and has an upper surface on which components are placed; a plate-shaped member arranged on the underside of the upper member and having a plurality of suction holes penetrating in the thickness direction; a suction section which sucks air from below the plate-shaped member through the suction holes and the upper member, thereby adsorbing the components placed on the upper member to the upper surface of the upper member; a light source section which irradiates light onto the upper member from below; and a partition member arranged on the underside of the plate-shaped member, having area forming holes penetrating in the thickness direction, and partitioning the upper member by means of the area forming holes .

A component mounting device of the present invention includes a temporary placement stage as recited in any one of claims 1 to 14 , and a mounting head that mounts a component temporarily placed on the temporary placement stage onto a substrate.

The present invention makes it possible to clearly recognize the external shape of a part while preventing the part from shifting out of position.

FIG. 1 is a plan view of a component mounting device according to an embodiment of the present invention; FIG. 1 is a perspective view showing a temporary placement stage of a component mounting apparatus according to an embodiment of the present invention together with a mounting head; FIG. 1 is a front cross-sectional view of a temporary placement stage of a component mounting apparatus according to an embodiment of the present invention. FIG. 1 is an exploded perspective view of a temporary placement stage of a component mounting apparatus according to an embodiment of the present invention. FIG. 13 is a front cross-sectional view of another embodiment of the chamber provided in the temporary placement stage of the component mounting apparatus according to the embodiment of the present invention. FIG. 1A shows a relationship between a suction hole of a plate-shaped member provided on a temporary placement stage of a component mounting apparatus according to an embodiment of the present invention and an area forming hole of a partitioning member; FIG. 1B shows a relationship between the suction hole of the plate-shaped member and an 8-nozzle mounting head; FIG. 1C shows a relationship between the suction hole of the plate-shaped member and an area forming hole of a partitioning member; FIG. 1 is a block diagram showing a configuration of a component mounting device according to an embodiment of the present invention. FIG. 1 is a flow diagram of a component mounting method according to an embodiment of the present invention. FIG. 2 is a flow chart of a component re-suction method according to an embodiment of the present invention. 1A, 1B, and 1C are explanatory diagrams of a component mounting process using a component mounting device according to an embodiment of the present invention. 1A, 1B, and 1C are explanatory diagrams of a component mounting process using a component mounting device according to an embodiment of the present invention.

An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the component mounting device, temporary placement stage, and mounting head. In the following, the same reference numerals are used for corresponding elements in all drawings, and duplicated explanations will be omitted. In FIG. 1 and in some parts described below, the X-axis in the substrate transport direction (left-right direction in FIG. 1) and the Y-axis perpendicular to the substrate transport direction (up-down direction in FIG. 1) are shown as two axes that are perpendicular to each other in the horizontal plane. In FIG. 2 and in some parts described below, the Z-axis (up-down direction in FIG. 2) is shown as the height direction perpendicular to the horizontal plane.

First, the configuration of the component mounting device 1 will be described with reference to Figure 1. In the component mounting device 1, a board transport unit 2 is installed along the X-axis at the center of the base 1a. The board transport unit 2 transports the board 3 carried in from upstream along the X-axis, and positions and holds it at a mounting work position by the mounting head, which will be described below. The board transport unit 2 also carries the board 3 downstream after the component mounting work has been completed. A component supply unit 4 is installed on both sides of the board transport unit 2 (front and rear directions of the Y-axis).

A tape feeder 5 is attached to each component supply unit 4 along the X-axis. The tape feeder 5 feeds a carrier tape, on which pockets for storing components are formed, in a pitch direction from outside the component supply unit 4 toward the board transport unit 2 (tape feed direction) to supply components to a component removal position where the mounting head picks up the components. In addition, a temporary placement unit 6 is attached to the front component supply unit 4. The temporary placement unit 6 includes a temporary placement stage 7 on which components to be mounted on the board 3 are temporarily placed, and a vacuum source 8. The vacuum source 8 is composed of a vacuum pump, a vacuum ejector, etc., and supplies negative pressure to the temporary placement stage 7 (sucks in air). Details of the temporary placement stage 7 will be described later.

When the tape feeder 5 and the temporary placement unit 6 are attached to the component supply unit 4, they are each electrically connected to the control device 40 (see FIG. 7) provided in the component mounting device 1. In addition, the tape feeder 5 and the temporary placement unit 6 are each supplied with electricity and compressed air via the component supply unit 4.

In FIG. 1, a Y-axis table 9 equipped with a linear drive mechanism is disposed on both ends of the X-axis on the top surface of the base 1a. A beam 10 similarly equipped with a linear mechanism is connected to the Y-axis table 9 so as to be freely movable along the Y-axis. A mounting head 11 is attached to the beam 10 so as to be freely movable along the X-axis. The mounting head 11 is equipped with multiple (eight in this case) nozzle drive units 11a that can hold a component and move up and down, and rotate around a vertical axis (Z-axis). A suction nozzle 11b (see FIG. 2) that suctions and holds the component is attached to the bottom end of each nozzle drive unit 11a.

Note that multiple types of mounting heads 11 are prepared in advance, each with a different number of nozzle drive units 11a and different types of suction nozzles 11b that can be attached, and the mounting head 11 attached to the beam 10 is changed depending on the size of the component to be mounted on the board 3. Hereinafter, a mounting head 11 that has eight nozzle drive units 11a and can be equipped with eight suction nozzles 11b will be referred to as an "8-nozzle mounting head", etc.

In FIG. 1, the Y-axis table 9 and beam 10 constitute an XY unit 12 that moves the mounting head 11 along the X-axis and Y-axis. The XY unit 12 and mounting head 11 constitute a component mounting mechanism that performs a component mounting operation of picking up components from the component supply unit 4 and mounting them at component mounting positions on the board 3. In the component mounting operation, the mounting head 11 moves above the component supply unit 4, picks up specific components with each suction nozzle 11b, moves above the board 3, rotates the components held by each suction nozzle 11b in a specific direction, and repeats a series of turns to mount the components at their respective component mounting positions.

In FIG. 1, the beam 10 is equipped with a head camera 13 that is positioned on the underside of the beam 10 and moves integrally with the mounting head 11. As the mounting head 11 moves, the head camera 13 moves above the board 3 positioned at the mounting operation position of the board transport unit 2, and captures an image of a board mark (not shown) provided on the board 3 to recognize the position of the board 3. In addition, in the case of components that require high component mounting accuracy, each suction nozzle 11b of the mounting head 11 temporarily places the picked-up component on the temporary placement stage 7, and the head camera 13 moves above the temporary placement stage 7 to capture an image of the temporarily placed component and recognize the outer shape and top surface shape of the component.

A component recognition camera 14 is installed between the component supply unit 4 and the board transport unit 2. When the mounting head 11, which has taken a component from the component supply unit 4, is positioned above the component recognition camera 14, the component recognition camera 14 captures an image of the component held by the suction nozzle 11b from below. When the mounting head 11 mounts the component on the board 3, the component mounting position is corrected taking into account the recognition result of the board 3 by the head camera 13, the outer shape and top surface shape of the component recognized by temporarily placing it on the temporary placement stage 7, and the recognition result of the component by the component recognition camera 14 (positional misalignment between the nozzle and the component).

Next, the configuration of the temporary placement stage 7 provided in the temporary placement unit 6 will be described in detail with reference to Figures 2 to 4. In Figures 2 and 3, the temporary placement stage 7 is configured such that a box-shaped chamber 21 and a light source section 22 located below the chamber 21 are supported by a plurality of legs 23 extending in the vertical direction (the direction along the Z axis). The light source section 22 is equipped with a light emitting section 24 that irradiates light 22a toward the chamber 21 above. The light emitting section 24 is equipped with a light source such as an LED, and may be composed of one light source or multiple light sources. A diffusion member 25 is disposed above the light source section 22 and between it and the chamber 21, which transmits the light 22a irradiated from the light source section 22 and diffuses it toward the chamber 21.

In Figures 3 and 4, the chamber 21 comprises an upper member 26, a plate-like member 27, a partition member 28, a light-transmitting member 29, and a holder 30. The upper surface of the upper member 26 is a component mounting surface on which the component D is placed. The upper member 26 is made of a thin (e.g., about 1 to 2 mm) sheet-like member, and is made of a material that is light-transmitting and light-diffusing and also has air permeability, for example, a porous material made of a light-diffusing resin material. Here, the upper member 26 is formed in a thin sheet shape in order to improve the light transmittance in the thickness direction of the upper member 26 and to ensure air permeability and the holding force of the component D.

The plate-like member 27 is made of a plate-like member made of a resin material such as acrylic that has optical transparency. The plate-like member 27 is provided in contact with the lower surface side of the upper member 26, and supports the upper member 26 from below. The plate-like member 27 has a plurality of suction holes 27H that penetrate in the thickness direction and correspond to the positions of the parts D that are placed (temporarily placed) on the upper member 26.

In Figures 3 and 4, the partitioning member 28 is made of a plate-like member. The partitioning member 28 is provided in contact with the underside of the plate-like member 27, and supports the upper member 26 and the plate-like member 27 from below, maintaining them in a flat plate shape. For this reason, the thickness of the partitioning member 28 is greater than that of the upper member 26 (for example, about 3 mm), and the partitioning member 28 has a rigidity that makes it difficult to bend and deform. The partitioning member 28 has multiple region-forming holes 28H that penetrate in the thickness direction. When in contact with the plate-like member 27, the partitioning member 28 divides the upper member 26 and the plate-like member 27 into multiple regions.

In Figures 3 and 4, the holder 30 has an upper opening 31 that opens upward and a lower opening 32 that opens downward, and is provided with a light-transmitting member 29 on its underside. The light-transmitting member 29 is a plate-shaped member made of glass, a transparent resin material, or the like, and is provided to close the lower opening 32. A protruding edge 30F that protrudes inward from the upper opening 31 is provided in a portion of the holder 30 located slightly below the upper opening 31.

The peripheral portion of the partition member 28 is placed on this overhanging edge 30F, and the plate-like member 27 and upper member 26 are then placed on top of it, so that the upper member 26, plate-like member 27 and partition member 28 can be attached to the upper opening 31. The upper member 26, plate-like member 27 and partition member 28 may be attached to the overhanging edge 30F in a state where they are previously stacked and fixed to each other. In this way, the upper member 26, plate-like member 27 and partition member 28 are stacked and held on the top of the holder 30. If the plate-like member 27 is thicker and harder than the upper member 26 and can hold the upper member 26 in a flat plate shape, the partition member 28 can be omitted.

In FIG. 3, when the upper member 26, the plate-like member 27, the partition member 28, and the light-transmitting member 29 are attached to the holder 30, a hollow internal space 30P is formed inside the chamber 21. The internal space 30P of the chamber 21 is in communication with the upper surface side of the upper member 26 via the upper member 26, the plate-like member 27, and the partition member 28. A suction flow path 30S that leads from the outside to the internal space 30P is formed in the side wall of the holder 30. A suction pipe 33 that leads to the vacuum source 8 is connected to the position where the suction flow path 30S opens on the outer surface of the holder 30. In this way, the internal space 30P of the chamber 21 is in communication with the vacuum source 8 via the suction flow path 30S and the suction pipe 33.

When the vacuum source 8 is operated to suck in air, the vacuum source 8 sucks in air in the chamber 21 (inside the internal space 30P) through the suction line 33. This creates a negative pressure in the chamber 21, and the air on the upper side of the upper member 26 is sucked into the chamber 21 through the breathable upper member 26 (through the pores of the porous material that makes up the upper member 26). This generates an adsorption force on the upper surface of the upper member 26, and when a part D is placed on the upper side of the upper member 26, the part D is adsorbed and held on the upper surface of the upper member 26. Furthermore, by limiting the area where air is sucked through the upper member 26 with the suction holes 27H of the plate-shaped member 27, the part D can be efficiently adsorbed and held on the upper surface of the upper member 26.

In this way, the holder 30 and the light-transmitting member 29 form a suction section that sucks air from below the plate-like member 27 through the suction holes 27H and the upper member 26, thereby adsorbing the component D placed on the upper member 26 to the upper surface of the upper member 26. That is, the suction section includes the holder 30 that holds the upper member 26 and the plate-like member 27 to form a closed space (internal space 30P), and generates an adsorption force on the upper surface of the upper member 26 by sucking in the air within the space.

In FIG. 3, when light 22a is irradiated upward from the light emitting section 24 of the light source section 22 while a part D is held by suction on the upper surface of the upper member 26, the irradiated light 22a passes through the diffusion member 25 and is diffused to reach the light transmitting member 29 of the chamber 21. The light 22a that reaches the light transmitting member 29 passes through the light transmitting member 29, the area forming hole 28H of the partition member 28, and the plate-shaped member 27 to reach the upper member 26. The light 22a that reaches the upper member 26 passes through the upper member 26 or is diffused within the upper member 26 before reaching the upper surface of the upper member 26. The light 22a that reaches the upper surface of the upper member 26 is irradiated into the sky in places where there is no part D, and is blocked by the temporarily placed part D in places where there is part D.

In this state, the head camera 13 captures an image of the upper member 26 from above, allowing the external shape of the temporarily placed part D to be recognized with high accuracy (see FIG. 11(a)). The contrast (difference in light and dark) between the part D and the upper member 26 in the image captured by the head camera 13 is adjusted by the transmittance of the upper member 26, the transmittance of the diffusion member 25, the arrangement of the light-emitting unit 24, the brightness of the light 22a, the irradiation angle, the position of the diffusion member 25, etc. In other words, the illuminance of the light 22a at each position of the part D temporarily placed on the temporary placement stage 7 is adjusted to be approximately the same (uniform).

Thus, the holder 30 has an upper opening 31 to which the upper member 26 is attached, a lower opening 32 formed below the upper opening 31, and a light-transmitting member 29 that transmits the light 22a irradiated from the light source unit 22 to reach the upper member 26 at a position that closes the lower opening 32. In addition, the temporary placement stage 7 has a diffusing member 25 disposed between the light source unit 22 and the upper member 26 that diffuses the light 22a irradiated from the light source unit 22 toward the upper member 26. The upper member 26 also diffuses the light 22a irradiated from the light source unit 22 toward the upper surface side.

Next, referring to FIG. 5, another embodiment of the chamber constituting the temporary placement stage 7 will be described. In the chamber 34 of the other embodiment, the method of installing the upper member 26, the plate-like member 27, the partition member 28, and the light-transmitting member 29 on the holder 35 is different from that of the chamber 21 shown in FIG. 3. That is, the upper member 26, the plate-like member 27, and the partition member 28 are installed in layers on the upper surface of the upper opening 36 that opens upward from the holder 35. The light-transmitting member 29 is installed in contact with the lower surface of the lower opening 37 that opens downward from the holder 35. This forms a hollow internal space 35P inside the chamber 34. The internal space 35P is sucked by the vacuum source 8 through the suction flow path 35S and the suction pipe 33 formed in the side wall of the holder 35.

Next, the relationship between the upper member 26, the suction holes 27H of the plate-like member 27, and the area forming holes 28H of the partition member 28 will be described with reference to Figures 6(a) to 6(c). Figure 6(b) shows the positional relationship between the suction nozzles 11b (nozzle drive units 11a) and the suction holes 27Ha of an 8-nozzle mounting head (mounting head 11 having eight nozzle drive units 11a). Figure 6(c) shows the positional relationship between the suction nozzles 11b (nozzle drive units 11a) and the suction holes 27Hb of a 16-nozzle mounting head (mounting head 11 having 16 nozzle drive units 11a).

In FIG. 6(a), eight suction holes 27Ha corresponding to the eight suction nozzles 11b of the eight-nozzle head and sixteen suction holes 27Hb corresponding to the sixteen suction nozzles 11b of the sixteen-nozzle head are formed in the plate-like member 27. In addition, the multiple (eight in this example) area-forming holes 28H in the partition member 28 are formed so that the suction holes 27Ha and suction holes 27Hb are located therein. In this example, one area-forming hole 28H has one suction hole 27Ha and two suction holes 27Hb located therein. In other words, the multiple suction holes 27H (27Ha, 27Hb) are formed in the plate-like member 27 so as to be located inside the area-forming holes 28H.

In FIG. 6(b), an 8-nozzle mounting head with eight suction nozzles 11b each holding a component D is aligned above the temporary placement stage 7, and the eight suction nozzles 11b are lowered simultaneously, allowing eight components D to be placed (temporarily placed) on the upper member 26 at the suction holes 27Ha at one time (see FIG. 10). In FIG. 6(c), a 16-nozzle mounting head with 16 suction nozzles 11b each holding a component D is aligned above the temporary placement stage 7, and the 16 suction nozzles 11b are lowered simultaneously, allowing sixteen components D to be placed (temporarily placed) on the upper member 26 at the suction holes 27Hb at one time. In this way, the components D placed on the upper member 26 are placed in an area partitioned by the partition member 28.

In addition, when a component D temporarily placed on the temporary placement stage 7 is imaged by the head camera 13 and then re-adsorbed by the suction nozzles 11b, the mounting head 11 (8-nozzle mounting head, 16-nozzle mounting head) is positioned above the temporary placement stage 7, and all of the suction nozzles 11b are raised and lowered simultaneously, so that all of the components D can be re-adsorbed at once (simultaneous re-adsorption) (see FIG. 11).

When the imaging results of the temporarily placed components D taken by the head camera 13 show that the position of the components D relative to the suction nozzle 11b is inappropriate when simultaneously re-picking up the components D (the positional deviation of the temporarily placed components D relative to the suction nozzle 11b to be re-picked up is large), individual re-picking up is performed in which the position of the mounting head 11 is individually corrected and then the components D are re-picked up by the suction nozzle 11b. In the individual re-picking up, in addition to re-picking up the components D in order for each suction nozzle 11b, it is also possible to simultaneously re-pick up a group of components that have similar tendencies for misalignment of the temporarily placed components D.

In addition, if the component D held by each of the multiple suction nozzles 11b is imaged by the component recognition camera 14 before being placed (temporarily placed) on the upper member 26 and there is a component D whose position relative to the suction nozzle 11b is inappropriate (the positional deviation of the component D relative to the suction nozzle 11b is large), the component D may be placed (temporarily placed) individually at a position where simultaneous re-suction is possible on the upper member 26. In addition, if the component D held by each of the multiple suction nozzles 11b is imaged by the component recognition camera 14 before being placed (temporarily placed) on the upper member 26 and there is a component D whose position relative to the suction nozzle 11b is inappropriate (the component is standing, etc.), the component D may be placed (temporarily placed) individually so that simultaneous re-suction is possible on the upper member 26.

In this way, the multiple suction holes 27H (27Ha, 27Hb) are formed in the plate-like member 27 in correspondence with the shape (configuration) of the mounting head 11, which is the device that places the component D on the upper member 26. Also, the multiple suction holes 27H are formed in the plate-like member 27 in correspondence with different devices. In this example, multiple suction holes 27Ha and multiple suction holes 27Hb corresponding to different devices (8-nozzle mounting head, 16-nozzle mounting head) are formed in one plate-like member 27. Also, the partition member 28 can have a different number of area forming holes 28H. Note that it is desirable that the size of the area forming holes 28H is larger than the outer shape of the component D to be temporarily placed on the temporary placement stage 7 so as not to block the light 22a that illuminates the component D from below.

As described above, the temporary placement stage 7 on which the component D to be mounted on the board 3 is temporarily placed includes an upper member 26 that is breathable and on which the component D is placed, a plate-like member 27 that is disposed below the upper member 26 and has a plurality of suction holes 27H penetrating in the thickness direction, a suction section (holding body 30, light-transmitting member 29) that sucks air from below the plate-like member 27 through the suction holes 27H and the upper member 26 to adsorb the component D placed on the upper member 26 to the upper surface of the upper member 26, and a light source section 22 that irradiates the upper member 26 with light 22a from below. This makes it possible to clearly recognize the external shape of the component D while preventing the placed component D from shifting out of position.

Furthermore, by providing a partition member 28 that is disposed below the plate-like member 27 and has an area forming hole 28H penetrating in the thickness direction, and that partitions the upper member 26 with the area forming hole 28H, it is possible to prevent bending or deformation of the upper member 26 due to suction by the suction part or impact when the suction nozzle 11b places the component D. In this way, the component mounting device 1 to which the temporary placement unit 6 is attached includes a temporary placement stage 7 and a mounting head 11 that mounts the component D temporarily placed on the temporary placement stage 7 onto the substrate 3. Note that the component mounting device 1 may also be configured to include a temporary placement stage 7 on the base 1a.

Next, the configuration of the control system of the component mounting device 1 will be described with reference to FIG. 7. The component mounting device 1 includes a control device 40, a board transport unit 2, a tape feeder 5, a temporary placement unit 6, a mounting head 11, an XY unit 12, a head camera 13, and a component recognition camera 14. The control device 40 includes a memory unit 41, a mounting operation processing unit 42, and a positional deviation measurement processing unit 43. The memory unit 41 is a storage device, and stores mounting data 44, positional deviation data 45, and the like. The mounting data 44 stores various information such as the component type and size of the component D to be mounted on the board 3, and the coordinates of the component mounting position on the board 3, for each board type of mounting board to be produced.

The mounting operation processing unit 42 controls the board transport unit 2, tape feeder 5, mounting head 11, XY unit 12, head camera 13, and component recognition camera 14 based on the mounting data 44 to perform a component mounting operation in which the component D is mounted at a component mounting position on the board 3. In the component mounting operation, the mounting operation processing unit 42 corrects the amount of misalignment of the component D held by the suction nozzle 11b based on the misalignment data 45 and mounts it on the board 3. The misalignment measurement processing unit 43 controls the temporary placement unit 6, mounting head 11, XY unit 12, and head camera 13 to temporarily place the component D held by the suction nozzle 11b on the temporary placement stage 7, recognize the amount of misalignment of the component D, and store it in the memory unit 41 as misalignment data 45.

Next, the component mounting method by the component mounting device 1 will be described with reference to Figs. 10 and 11 along with the flow of Figs. 8 and 9. First, the mounting operation processing unit 42 causes the board transport unit 2 to carry in the board 3 and hold it at the mounting work position (ST1: board carrying process). Next, the mounting operation processing unit 42 causes each suction nozzle 11b of the mounting head 11 to pick up and hold a component D from the tape feeder 5 (ST2: component suction process). Below, the mounting head 11 will be described using an example of an eight-nozzle mounting head. That is, each of the eight suction nozzles 11b of the mounting head 11 holds a component D. Next, the position deviation measurement processing unit 43 activates the vacuum source 8 (ST3: vacuum source on process) (arrow a in Fig. 10(a)).

Then, the misalignment measurement processing unit 43 moves the mounting head 11 above the temporary placement stage 7 (FIG. 10(a)). Next, the misalignment measurement processing unit 43 simultaneously lowers the eight suction nozzles 11b to bring the bottom surfaces of the held components D into contact with the top surface of the upper member 26 (arrow b in FIG. 10(b)). Next, the misalignment measurement processing unit 43 stops the vacuum suction of all suction nozzles 11b and simultaneously raises the eight suction nozzles 11b (arrow c in FIG. 10(c)). As a result, the eight components D are placed (temporarily placed) on the top surface of the upper member 26 (ST4: Temporary component placement process).

In FIG. 8, the misalignment measurement processing unit 43 then irradiates light 22a from the light-emitting unit 24 of the light source unit 22 (ST5: light source on step) (FIG. 11(a)). Next, the misalignment measurement processing unit 43 moves the head camera 13 (arrow d in FIG. 11(a)) to capture an image of the part D temporarily placed on the upper member 26 (ST6: image capture step). The misalignment measurement processing unit 43 recognizes and processes the captured image, calculates the amount of misalignment in the XY directions and the amount of rotational misalignment for each of the eight parts D, and stores the calculated data in the memory unit 41 as misalignment data 45. Next, the misalignment measurement processing unit 43 stops irradiating light 22a from the light-emitting unit 24 (ST7: light source off step).

Next, the positional deviation measurement processing unit 43 moves the mounting head 11 to the same position as when the component D was temporarily placed on the upper member 26. Next, the positional deviation measurement processing unit 43 re-adsorbs the component D that was temporarily placed on the eight suction nozzles 11b (ST8: component re-adsorption process).

In FIG. 9, in the component re-adsorption process (ST8), first, the positional deviation measurement processing unit 43 determines whether simultaneous re-adsorption is possible based on the image of the temporarily placed components D captured in the imaging process (ST6) (ST21: simultaneous re-adsorption feasibility determination process). If the positional deviation of the temporarily placed components D relative to the suction nozzles 11b that will re-adsorb them is small, the positional deviation measurement processing unit 43 determines that simultaneous adsorption is possible (Yes in ST21), and the temporarily placed components D are simultaneously re-adsorbed by the eight suction nozzles 11b (ST22: simultaneous re-adsorption process).

That is, the misalignment measurement processing unit 43 simultaneously lowers the eight suction nozzles 11b (arrow e in FIG. 11(b)). When the lower ends of the suction nozzles 11b come into contact with the upper surface of the component D, the misalignment measurement processing unit 43 then starts vacuum suction with all of the suction nozzles 11b. The misalignment measurement processing unit 43 then simultaneously raises the eight suction nozzles 11b (arrow f in FIG. 11(c)).

In FIG. 9, if there is a temporarily placed component D with a large positional deviation relative to the suction nozzle 11b that will re-pick up the temporarily placed component D, the positional deviation measurement processing unit 43 determines that simultaneous pickup is not possible (No in ST21), and re-pickups the temporarily placed component D individually or for each group of components with similar tendency for positional deviation to the suction nozzle 11b (ST23: Individual re-pickup process). As a result, the component D is re-pickup to the eight suction nozzles 11b (ST22, ST23).

In FIG. 8, the positional deviation measurement processing unit 43 then stops the vacuum source 8 (ST9: vacuum source off process). In this way, the temporary component placement process (ST4) through the component re-suction process (ST8) are performed with the vacuum source 8 operating. Therefore, the suction force of the component D on the upper member 26 of the temporary placement stage 7 is adjusted to prevent the component D mounted on the upper member 26 from shifting out of position, and to be weaker than the suction force with which the suction nozzle 11b holds the component D.

If air is sucked from the upper member 26 without a component D placed on the upper member 26, there is a risk that dirt and dust may adhere to the upper surface of the upper member 26. Therefore, it is desirable to shorten the time from the vacuum source on step (ST3) to the component temporary placement step (ST4) and the time from the component re-adsorption step (ST8) to the vacuum source off step (ST9).

In the above example, turning on the vacuum source (ST3) and turning on the light source (ST5) are performed in separate processes, but they do not necessarily have to be performed in separate processes. For example, the vacuum source and light source may be turned on at the same time before the part temporary placement process (ST4). Similarly, turning off the light source (ST7) and turning off the vacuum source (ST9) do not necessarily have to be performed in separate processes, and the light source and vacuum source may be turned off at the same time after the part re-adsorption process (ST8).

Then, the mounting operation processing unit 42 mounts the component D re-adsorbed by the mounting head 11 at the component mounting position on the board 3 (ST10: component mounting process). In the component mounting process (ST10), the mounting operation processing unit 42 corrects the amount of positional deviation of each component D based on the positional deviation data 45 and mounts the component D on the board 3. The component pickup process (ST2) to the component mounting process (ST10) are repeated until all components D are mounted on the board 3 (No in ST11). When all components D are mounted on the board 3 (Yes in ST11), the mounting operation processing unit 42 causes the board transport unit 2 to unload the board 3 (ST12: board unloading process).

In this way, the component mounting device 1 equipped with the temporary placement stage 7 can prevent misalignment of the mounted component D, clearly recognize the external shape of the component D, measure the amount of misalignment, and correct the position and rotation angle of the suction nozzle 11b based on the measured amount of misalignment to mount the component D on the board 3, thereby achieving high mounting accuracy.

The temporary placement stage and component mounting device of the present invention have the effect of preventing misalignment of the mounted component while allowing the external shape of the component to be clearly recognized, and are useful in fields where components are mounted on substrates.

REFERENCE SIGNS LIST 1 component mounting device 3 substrate 7 temporary placement stage 11 mounting head 22 light source section 22a light 25 diffusion member 26 upper member 27 plate-like member 27H, 27Ha, 27Hb suction hole 28 partition member 28H area forming hole 29 light-transmitting member (suction section)
30, 35 Holding body (suction part)
30P, 35P Internal space (closed space)
31, 36 Upper opening 32, 37 Lower opening D Parts

Claims (15)

A temporary placement stage on which components to be mounted on a substrate are temporarily placed,
an upper member having air permeability and on whose upper surface a component is placed;
a plate-like member disposed below the upper member and having a plurality of suction holes penetrating therethrough in a thickness direction;
a suction unit that sucks air from below the plate-like member through the suction hole and the upper member to adsorb a component placed on the upper member onto an upper surface of the upper member;
A light source unit that irradiates light onto the upper member from below;
a partition member disposed below the plate-like member, the partition member having an area forming hole penetrating in a thickness direction, the partition member partitioning the upper member by the area forming hole ; The temporary placement stage according to claim 1 , wherein the plurality of suction holes are formed in the plate-like member so as to be positioned inside the region forming hole. The temporary placement stage according to claim 1 , wherein the component to be placed on the upper member is placed in an area defined by the partition member. The temporary placement stage according to claim 1 , wherein the partition member has a changeable number of the area forming holes. 5. The temporary placement stage according to claim 1, wherein the suction section includes a holder that holds the upper member and the plate-like member to form a closed space, and an adhesive force is generated on an upper surface of the upper member by sucking in air from within the space. 6. The temporary placement stage according to claim 5, wherein the holder has an upper opening to which the upper member is attached, a lower opening formed below the upper opening, and a light-transmitting member that transmits light irradiated from the light source unit to a position that closes the lower opening and allows the light to reach the upper member. The temporary placement stage according to claim 5 , wherein the upper member, the plate-like member and the partition member are stacked and held on the upper part of the holder. The temporary placement stage according to claim 1 , wherein the plurality of suction holes are formed in the plate-like member in accordance with a shape of a device on which a component is to be placed on the upper member. The temporary placement stage according to claim 8 , wherein the plurality of suction holes are formed in the plate-like member corresponding to different pieces of equipment. The temporary placement stage according to claim 1 , further comprising a diffusion member disposed between the light source unit and the upper member, the diffusion member diffusing the light emitted from the light source unit toward the upper member. The temporary placement stage according to claim 1 , wherein the upper member is made of a porous material and has air permeability. The temporary placement stage according to claim 1 , wherein the upper member diffuses the light emitted from the light source unit toward an upper surface thereof. The temporary placement stage according to claim 1 , wherein the plate-like member is thicker than the upper member. The temporary placement stage according to claim 1 , wherein the plate-like member is harder than the upper member. 15. A component mounting device comprising: the temporary placement stage according to claim 1; and a mounting head that mounts the component temporarily placed on the temporary placement stage onto a substrate.

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