JP7626345B2 - Resin composition, film, near-infrared cut filter, near-infrared transmission filter, solid-state imaging device, image display device, and infrared sensor - Google Patents

Description

The present invention relates to a resin composition containing a squarylium compound. The present invention also relates to a film, a near-infrared cut filter, a near-infrared transmission filter, a solid-state imaging device, an image display device, and an infrared sensor using a composition containing a squarylium compound.

Video cameras, digital still cameras, and mobile phones with cameras use solid-state color image sensors such as CCDs (charge-coupled devices) and CMOSs (complementary metal-oxide semiconductors). These solid-state image sensors use silicon photodiodes that are sensitive to infrared light in their light receiving sections. For this reason, near-infrared cut filters are sometimes used to correct visibility.

Near-infrared cut filters are manufactured using a resin composition containing a near-infrared absorbing dye. Squarylium compounds are known as one type of near-infrared absorbing dye. Patent documents 1 and 2 describe squarylium compounds of specific structures that are near-infrared absorbing dyes.

International Publication No. 2018/230486 JP 2019-011455 A

The inventors have investigated films using resin compositions containing the squarylium compounds described in Patent Documents 1 and 2 and found that there is room for further improvement in the light resistance of films containing these squarylium compounds.

The object of the present invention is to provide a resin composition capable of forming a film having excellent light resistance and excellent storage stability. The object of the present invention is to provide a film, a near-infrared cut filter, a near-infrared transmission filter, a solid-state imaging device, an image display device, and an infrared sensor using the above-mentioned resin composition.

The present inventors have conducted extensive research into a film obtained using a resin composition containing a near-infrared absorbing dye represented by formula (SQ1), and have found that when light is irradiated to the film for a long period of time, the spectral characteristics in the near-infrared region tend to fluctuate, and that there is room for further improvement in light resistance. The reason why the spectral characteristics in the near-infrared region tend to fluctuate when light is irradiated to a film obtained using a resin composition containing a near-infrared absorbing dye represented by formula (SQ1) for a long period of time is presumed to be due to the following. Since the near-infrared absorbing dye represented by formula (SQ1) has a structure in which a bulky substituent is bonded to a squaric acid, it is presumed that association is unlikely to form in the film during film formation. For this reason, when light is irradiated to a film formed using a resin composition containing a near-infrared absorbing dye represented by formula (SQ1) for a long period of time, it is presumed that the site around the squaric acid of the near-infrared absorbing dye represented by formula (SQ1) is activated and decomposed by the light irradiation, and the spectral characteristics in the near-infrared region are likely to fluctuate. As a result of further investigations, the present inventors have found that by further incorporating 0.001 to 1000 ppm by mass of a compound represented by formula (AS1) into a resin composition containing a near-infrared absorbing dye represented by formula (SQ1) and a resin, the storage stability of the resin composition is good, generation of foreign matter during storage can be suppressed, and further a film with excellent light resistance can be formed, leading to the completion of the present invention. The present invention provides the following.
<1> A near infrared absorbing dye represented by the following formula (SQ1),
A compound represented by the following formula (AS1) in an amount of 0.001 to 1000 ppm by mass,
Resin and
A resin composition comprising:
In the formula, Rs ¹¹⁹ and Rs ¹²⁰ each independently represent a substituent.
A ¹ and A ² each independently represent an oxygen atom or -N(Rs ¹²⁵ )-;
Rs ¹²¹ to Rs ¹²⁵ each independently represent a hydrogen atom or a substituent;
^E1 and ^E2 each independently represent a carbon atom, a boron atom, or -C(=O)-;
When E ¹ is a carbon atom, ns32 is 2, when E 1 is a boron atom, ns32 is 1, and when E 1 is -C(=O)-, ns32 is 0;
When E ² is a carbon atom, ns33 is 2, when E 2 is a boron atom, ns33 is 1, and when E 2 is -C(=O)-, ns33 is 0;
ns30 and ns31 each independently represent an integer of 0 to 5;
when ns30 is 2 or more, a plurality of ^{Rs 119} may be the same or different, or two of the plurality of Rs ¹¹⁹ may be bonded to each other to form a ring,
when ns31 is 2 or more, a plurality of ^{Rs 120} may be the same or different, and two of the plurality of Rs ¹²⁰ may be bonded to each other to form a ring,
when ns32 is 2, two Rs ¹²¹ may be the same or different, or two Rs ¹²¹ may be bonded to each other to form a ring;
when ns33 is 2, two Rs ¹²² may be the same or different, or two Rs ¹²² may be bonded to each other to form a ring;
Ar ¹⁰⁰ represents an arylene group or a heteroarylene group;
ns100 represents an integer of 0 to 2.
In formula (AS1), ^R represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, or a heterocyclic group; ^R and ^R each independently represent an alkyl group, an alkenyl group, an ^aryl group, or a heterocyclic group, and R and ^R may be bonded to each other to form a ring, and ^R and ^R may be bonded to each other to form a ring.
<2> The resin composition according to <1>, wherein at least one of R ^A2 and R ^A3 in formula (AS1) is an alkyl group.
<3> The resin composition according to <1>, wherein R ^A1 to R ^A3 in formula (AS1) each independently represent an alkyl group, or R ^A3 represents an alkyl group, and R ^A2 and R ^A3 are bonded to each other to form a ring.
<4> The resin composition according to <1>, wherein the compound represented by formula (As1) is at least one selected from the group consisting of N-methylpyrrolidone and dimethylacetamide.
<5> The resin composition according to any one of <1> to <4>, in which the near infrared absorbing dye represented by formula (SQ1) is a near infrared absorbing dye represented by formula (SQ2).
In the formula, L ⁴¹ to L ⁴⁴ each independently represent an alkylene group, an alkynylene group, an arylene group, a heterocyclic group, or a divalent group formed by bonding two or more of these groups together;
Z ⁴¹ and Z ⁴² each independently represent a single bond, —O—, —C(═O)—, —S—, —N(R ^N1 )—, —S(═O)—, or —S(═O) ₂ —;
A ⁴¹ and A ⁴² each independently represent an oxygen atom or -N(R ^N2 )-;
R ^N1 and R ^N2 each independently represent a hydrogen atom, an alkyl group, or an aryl group;
Rs ¹⁴¹ and Rs ¹⁴² each independently represent a substituent;
ns41 and ns42 each independently represent an integer of 0 to 5;
when ns41 is 2 or more, a plurality of ^{Rs 141} may be the same or different, or two of the plurality of Rs ¹⁴¹ may be bonded to each other to form a ring;
When ns42 is 2 or more, a plurality of ^{Rs 142} may be the same or different, and two of the plurality of Rs ¹⁴² may be bonded to each other to form a ring;
However, when L ⁴¹ to L ⁴⁴ are alkylene groups, Z ⁴¹ and Z ⁴² are single bonds, and A ⁴¹ and A ⁴² are —N(R ^N2 )—, at least one of ns41 and ns42 is an integer of 1 to 5.
<6> The resin composition according to any one of <1> to <4>, in which the near infrared absorbing dye represented by formula (SQ1) is a near infrared absorbing dye represented by formula (SQ3).
In the formula, Q ¹ , Q ⁴ , Q ⁵ , Q ⁸ , Q ¹¹ , Q ¹⁴ , Q ¹⁵ and Q ¹⁸ each independently represent a carbon atom or a nitrogen atom;
Rs ¹ to Rs ⁵ and Rs ¹¹ to Rs ¹⁵ each independently represent a hydrogen atom, an alkyl group, a sulfo group, —SO ₃ M ¹ or a halogen atom, M ¹ represents an inorganic or organic cation, Rs ² and Rs ³ , and Rs ¹² and Rs ¹³ may be bonded to each other to form a ring;
Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ each independently represent a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, a hydroxy group, -NR ^X1 R ^X2 , a sulfo group, -SO ₃ M ² , -SO ₂ NR ^X1 R ^X2 , -COOR ^X3 , -CONR ^X1 R ^X2 , a nitro group, a cyano group, or a halogen atom, M ² represents an inorganic or organic cation, R ^X1 to R ^X3 each independently represent a hydrogen atom, an alkyl group, an aryl group, an acyl group, or a heterocyclic group, R ^X1 and R ^X2 may be bonded to each other to form a ring, and adjacent groups among Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ may be bonded to each other to form a ring;
When ^Q1 is a nitrogen atom, ^Rs21 is not present, when ^Q4 is a nitrogen atom, ^Rs24 is not present, when ^Q5 is a nitrogen atom, ^Rs25 is not present, when ^Q8 is a nitrogen atom, ^Rs28 is not present, when ^Q11 is a nitrogen atom, ^Rs31 is not present, when ^Q14 is a nitrogen atom, ^Rs34 is not present, when ^Q15 is a nitrogen atom, ^Rs35 is not present, and when ^Q18 is a nitrogen atom, ^Rs38 is not present.
<7> The resin composition according to any one of <1> to <6>, wherein the resin includes a resin having a basic group.
<8> The resin composition according to any one of <1> to <7>, wherein the resin includes an alkali-soluble resin.
<9> The resin composition according to any one of <1> to <8>, further comprising a polymerizable compound and a photopolymerization initiator.
<10> The resin composition according to any one of <1> to <9>, further comprising a coloring material that transmits near-infrared light and blocks visible light.
<11> A film obtained by using the resin composition according to any one of <1> to <10>.
<12> A near-infrared cut filter having the film according to <11>.
<13> A near-infrared transmission filter having the film according to <11>.
<14> A solid-state imaging device comprising the film according to <11>.
<15> An image display device having the film according to <11>.
<16> An infrared sensor having the film according to <11>.

According to the present invention, it is possible to provide a resin composition, a film, a near-infrared cut filter, a near-infrared transmission filter, a solid-state imaging element, an image display device, and an infrared sensor that can form a film having excellent light resistance and excellent storage stability.

FIG. 1 is a schematic diagram illustrating an embodiment of an infrared sensor.

The present invention will be described in detail below.
In this specification, the use of "to" means that the numerical values before and after it are included as the lower limit and upper limit.
In the description of groups (atomic groups) in this specification, when there is no indication of whether they are substituted or unsubstituted, the term encompasses both unsubstituted groups (atomic groups) and substituted groups (atomic groups). For example, the term "alkyl group" encompasses not only alkyl groups that have no substituents (unsubstituted alkyl groups) but also alkyl groups that have substituents (substituted alkyl groups).
In this specification, unless otherwise specified, the term "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. Examples of light used for exposure include the bright line spectrum of a mercury lamp, far ultraviolet light represented by an excimer laser, extreme ultraviolet light (EUV light), X-rays, active rays or radiation such as electron beams.
In this specification, "(meth)acrylate" refers to both or either of acrylate and methacrylate, "(meth)acrylic" refers to both or either of acrylic and methacrylic, and "(meth)acryloyl" refers to both or either of acryloyl and methacryloyl.
In this specification, the weight average molecular weight and the number average molecular weight are defined as values calculated in terms of polystyrene as measured by gel permeation chromatography (GPC).
In this specification, Me in the chemical formulae represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group.
In this specification, near-infrared radiation refers to light (electromagnetic waves) with a wavelength of 700 to 2500 nm.
In this specification, the total solids content refers to the total mass of all components of the composition excluding the solvent.
In this specification, the pigment means a compound that is difficult to dissolve in a solvent. For example, the solubility of the pigment in 100 g of water at 23° C. and in 100 g of propylene glycol monomethyl ether acetate at 23° C. is preferably less than 1 g, more preferably less than 0.1 g, and even more preferably less than 0.01 g.
In this specification, the term "process" refers not only to an independent process, but also to a process that cannot be clearly distinguished from other processes, as long as the intended effect of the process is achieved.

<Resin Composition>
The resin composition of the present invention is characterized by containing a near infrared absorbing dye represented by formula (SQ1), 0.001 to 1000 ppm by mass of a compound represented by formula (AS1), and a resin.

The resin composition of the present invention has good storage stability, can suppress the generation of foreign matter during storage, and can form a film with excellent light resistance in which the variation in spectral characteristics in the near-infrared region is suppressed even when light is irradiated for a long period of time. The detailed reason why such an effect is obtained is unknown, but it is presumed to be due to the following. In addition to the near-infrared absorbing dye represented by formula (SQ1) and the resin, the resin composition of the present invention further contains 0.001 to 1000 mass ppm of a compound represented by formula (AS1). This makes it easier for the near-infrared absorbing dyes represented by formula (SQ1) to form associations with each other due to the compound represented by formula (AS1) during film formation, or the compound represented by (AS1) is adsorbed to the surface of the near-infrared absorbing dye represented by formula (SQ1) in the film, so that even when the obtained film is irradiated with light for a long period of time, the activation of the site around the squaric acid of the near-infrared absorbing dye represented by formula (SQ1) can be suppressed, thereby stabilizing the excited state of the near-infrared absorbing dye represented by formula (SQ1), and as a result, it is presumed that the decomposition of the near-infrared absorbing dye represented by formula (SQ1) can be suppressed. For this reason, it is presumed that the resin composition of the present invention can form a film having excellent light resistance in which the variation in the spectral characteristics in the near infrared region is suppressed even when irradiated with light for a long period of time. In addition, since the content of the compound represented by formula (AS1) is 0.001 to 1000 mass ppm, it is presumed that the aggregation of the near infrared absorbing dye represented by formula (SQ1) in the resin composition can be suppressed, and as a result, excellent storage stability is obtained. Hereinafter, each component of the resin composition of the present invention will be described.

<<Near infrared absorbing dye represented by formula (SQ1)>>
The resin composition of the present invention contains a near infrared absorbing dye represented by formula (SQ1). The near infrared absorbing dye represented by formula (SQ1) is preferably a pigment.
In the formula, Rs ¹¹⁹ and Rs ¹²⁰ each independently represent a substituent.
A ¹ and A ² each independently represent an oxygen atom or -N(Rs ¹²⁵ )-;
Rs ¹²¹ to Rs ¹²⁵ each independently represent a hydrogen atom or a substituent;
^E1 and ^E2 each independently represent a carbon atom, a boron atom, or -C(=O)-;
When E ¹ is a carbon atom, ns32 is 2, when E 1 is a boron atom, ns32 is 1, and when E 1 is -C(=O)-, ns32 is 0;
When E ² is a carbon atom, ns33 is 2, when E 2 is a boron atom, ns33 is 1, and when E 2 is -C(=O)-, ns33 is 0;
ns30 and ns31 each independently represent an integer of 0 to 5;
when ns30 is 2 or more, a plurality of ^{Rs 119} may be the same or different, or two of the plurality of Rs ¹¹⁹ may be bonded to each other to form a ring,
when ns31 is 2 or more, a plurality of ^{Rs 120} may be the same or different, and two of the plurality of Rs ¹²⁰ may be bonded to each other to form a ring,
when ns32 is 2, two Rs ¹²¹ may be the same or different, or two Rs ¹²¹ may be bonded to each other to form a ring;
when ns33 is 2, two Rs ¹²² may be the same or different, or two Rs ¹²² may be bonded to each other to form a ring;
Ar ¹⁰⁰ represents an arylene group or a heteroarylene group;
ns100 represents an integer of 0 to 2.

Examples of the substituents represented by Rs ¹¹⁹ and Rs ¹²⁰ include the groups described in the substituent T described later, and halogen atoms, alkyl groups, sulfo groups, and -SO ₃ M are preferred. M represents an inorganic or organic cation. As the inorganic or organic cation represented by M, known cations can be used without limitation. For example, alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), ammonium ions, imidazolium ions, pyridinium ions, phosphonium ions, etc. are included. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms. The number of carbon atoms in the alkyl group is preferably 1 to 20, more preferably 1 to 15, even more preferably 1 to 8, even more preferably 1 to 5, and particularly preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, and is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent or may be unsubstituted. Examples of the substituent include the groups described in the substituent T described later.

A ¹ and A ² each independently represent an oxygen atom or -N(Rs ¹²⁵ )-, and preferably -N(Rs ¹²⁵ )-.

Examples of the substituent represented by Rs ¹²¹ to Rs ¹²⁵ include the groups described below for the substituent T. Rs ¹²³ to Rs ¹²⁵ are preferably a hydrogen atom, an alkyl group, or an aryl group, and more preferably a hydrogen atom. In addition, it is preferable that Rs ¹²¹ to Rs ¹²⁵ are each independently a substituent.

E ¹ and E ² each independently represent a carbon atom, a boron atom, or -C(=O)-, and preferably represent a carbon atom. In addition, it is more preferable that E ¹ is a carbon atom, and two Rs ¹²¹ are bonded together to form a ring, and E ² is a carbon atom, and two Rs ¹²² are bonded together to form a ring. The ring formed by bonding Rs ¹²¹ together and the ring formed by bonding Rs ¹²² together may be a hydrocarbon ring or a heterocycle. In addition, the hydrocarbon ring and the heterocycle may be an aromatic ring or a non-aromatic ring. In addition, the hydrocarbon ring and the heterocycle may be a monocycle or a condensed ring. The ring formed by bonding Rs ¹²¹ together and the ring formed by bonding Rs ¹²² together are preferably a condensed ring, and more preferably a condensed ring of three or more rings. In addition, the ring formed by bonding Rs ¹²¹ together and the ring formed by bonding Rs ¹²² together may further have a substituent. Examples of the substituent include the groups described later for the substituent T.

ns30 and ns31 each independently represent an integer of 0 to 5, preferably 0 to 4, more preferably 0 to 3, even more preferably 0 to 2, and even more preferably 0 or 1. When ns30 is ² or more, a plurality of Rs ¹¹⁹ may be the same or different, and two of the plurality of Rs ¹¹⁹ may be bonded to each other to form a ring ^{, and when ns31 is 2 or more, a plurality of Rs 120 may be the same or different, and two of the plurality of Rs 120 may be bonded to each other to form a ring. The ring formed by bonding Rs 119 together and the} ring formed by bonding Rs ¹²⁰ together may be a hydrocarbon ring or a heterocycle. In addition, the hydrocarbon ring and the heterocycle may be an aromatic ring or a non-aromatic ring. In addition, the hydrocarbon ring and the heterocycle may be a monocycle or a condensed ring. The ring formed by bonding Rs ¹¹⁹ together and the ring formed by bonding Rs ¹²⁰ together are preferably a 5- or 6-membered hydrocarbon ring or heterocycle, more preferably a 5- or 6-membered hydrocarbon ring.

Ar ¹⁰⁰ represents an arylene group or a heteroarylene group. The arylene group and the heteroarylene group may be a single ring or a condensed ring. The arylene group and the heteroarylene group are preferably a group represented by any one of the following formulae (Ar-1) to (Ar-7).
In the formula, Xa ¹ to Xa ⁸ each independently represent a sulfur atom, an oxygen atom, or NRx ^a , where Rx ^a represents a hydrogen atom or a substituent, and * represents a bond. Examples of the substituent represented by Rx ^a include the groups described below for the substituent T.

ns100 represents an integer from 0 to 2, with 0 or 1 being preferred, and 0 being more preferred.

The near infrared absorbing dye represented by formula (SQ1) is preferably a near infrared absorbing dye represented by formula (SQ2).
In the formula, L ⁴¹ to L ⁴⁴ each independently represent an alkylene group, an alkynylene group, an arylene group, a heterocyclic group, or a divalent group formed by bonding two or more of these groups together;
Z ⁴¹ and Z ⁴² each independently represent a single bond, —O—, —C(═O)—, —S—, —N(R ^N1 )—, —S(═O)—, or —S(═O) ₂ —;
A ⁴¹ and A ⁴² each independently represent an oxygen atom or -N(R ^N2 )-;
R ^N1 and R ^N2 each independently represent a hydrogen atom, an alkyl group, or an aryl group;
Rs ¹⁴¹ and Rs ¹⁴² each independently represent a substituent;
ns41 and ns42 each independently represent an integer of 0 to 5;
when ns41 is 2 or more, a plurality of ^{Rs 141} may be the same or different, or two of the plurality of Rs ¹⁴¹ may be bonded to each other to form a ring;
When ns42 is 2 or more, a plurality of ^{Rs 142} may be the same or different, and two of the plurality of Rs ¹⁴² may be bonded to each other to form a ring;
However, when L ⁴¹ to L ⁴⁴ are alkylene groups, Z ⁴¹ and Z ⁴² are single bonds, and A ⁴¹ and A ⁴² are —N(R ^N2 )—, at least one of ns41 and ns42 is an integer of 1 to 5.

L ⁴¹ to L ⁴⁴ each independently represent an alkylene group, an alkynylene group, an arylene group, a heterocyclic group, or a divalent group obtained by bonding two or more of these. The number of carbon atoms of the alkylene group is preferably 1 to 20, more preferably 1 to 15, even more preferably 1 to 8, even more preferably 1 to 5, and particularly preferably 1 to 3. The alkylene group may be linear, branched, or cyclic. The alkylene group may have a substituent or may be unsubstituted. Examples of the substituent include the groups described in the substituent T described below. The number of carbon atoms of the alkynylene group is preferably 2 to 20, more preferably 2 to 12, and particularly preferably 2 to 8. The alkynylene group may be linear or branched. The alkynylene group may have a substituent or may be unsubstituted. Examples of the substituent include the groups described in the substituent T described below. The number of carbon atoms of the arylene group is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 12. The arylene group may have a substituent or may be unsubstituted. Examples of the substituent include the groups described in the substituent T described later. The heterocyclic group is preferably a monocyclic heterocyclic group or a heterocyclic group of a condensed ring having 2 to 8 condensed rings, more preferably a monocyclic heterocyclic group or a heterocyclic group of a condensed ring having 2 to 4 condensed rings, and even more preferably a monocyclic heterocyclic group. The number of heteroatoms constituting the ring of the heterocyclic group is preferably 1 to 3. The heteroatoms constituting the ring of the heterocyclic group are preferably a nitrogen atom, an oxygen atom or a sulfur atom, and more preferably a nitrogen atom. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The number of carbon atoms constituting the ring of the heterocyclic group is preferably 3 to 30, more preferably 3 to 18, and more preferably 3 to 12. The heterocyclic group may have a substituent or may be unsubstituted. Examples of the substituent include the groups described in the substituent T described later.

L ⁴¹ to L ⁴⁴ each independently preferably represent an arylene group or a heterocyclic group, and more preferably an arylene group.

Z ⁴¹ and ^Z each independently represent a single bond, —O—, —C(═O)—, —S—, —N(R ^N1 )—, —S(═O)— or —S(═O) ₂ —, and preferably a single bond.

A ⁴¹ and A ⁴² each independently represent an oxygen atom or -N(R ^N2 )-, and preferably represent -N(R ^N2 )-. R ^N2 is preferably a hydrogen atom.

The number of carbon atoms of the alkyl group represented by R ^N1 and R ^N2 is preferably 1 to 20, more preferably 1 to 15, still more preferably 1 to 8, even more preferably 1 to 5, and particularly preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, preferably linear or branched, and more preferably linear. The alkyl group may have a substituent or may be unsubstituted. Examples of the substituent include the groups explained in the substituent T described below. The number of carbon atoms of the aryl group represented by R ^N1 and R ^N2 is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 12. The aryl group may have a substituent or may be unsubstituted. Examples of the substituent include the groups explained in the substituent T described below.

Examples of the substituents represented by Rs ¹⁴¹ and Rs ¹⁴² include the groups explained in the substituent T described below, and halogen atoms, alkyl groups, sulfo groups, and -SO ₃ M are preferred. M represents an inorganic or organic cation. As the inorganic or organic cation represented by M, known cations can be used without limitation. For example, alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), ammonium ions, imidazolium ions, pyridinium ions, phosphonium ions, etc. are included. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms. The number of carbon atoms in the alkyl group is preferably 1 to 20, more preferably 1 to 15, even more preferably 1 to 8, even more preferably 1 to 5, and particularly preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, and is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent or may be unsubstituted. Examples of the substituent include the groups explained in the substituent T described below.

ns41 and ns42 each independently represent an integer of 0 to 5, preferably 0 to 4, more preferably 0 to 3, even more preferably 0 to 2, and even more preferably 0 or ^1. When ns41 is 2 or more, a plurality of Rs ¹⁴¹ may be the same or different, and two of the plurality of Rs ¹⁴¹ may be bonded together to form a ring, and when ^ns42 is 2 or more, a plurality of Rs ¹⁴² may be the same or different, and two of the plurality of Rs ¹⁴² may be bonded together to form a ring. The ring formed by bonding Rs ¹⁴¹ together and the ring formed by bonding Rs ¹⁴² together may be a hydrocarbon ring or a heterocycle. In addition, the hydrocarbon ring and the heterocycle may be an aromatic ring or a non-aromatic ring. In addition, the hydrocarbon ring and the heterocycle may be a monocycle or a condensed ring. The ring formed by bonding Rs ¹⁴¹ together and the ring formed by bonding Rs ¹⁴² together are preferably a 5- or 6-membered hydrocarbon ring or heterocycle, more preferably a 5- or 6-membered hydrocarbon ring.

The near infrared absorbing dye represented by formula (SQ1) is preferably a near infrared absorbing dye represented by formula (SQ3).
In the formula, Q ¹ , Q ⁴ , Q ⁵ , Q ⁸ , Q ¹¹ , Q ¹⁴ , Q ¹⁵ and Q ¹⁸ each independently represent a carbon atom or a nitrogen atom;
Rs ¹ to Rs ⁵ and Rs ¹¹ to Rs ¹⁵ each independently represent a hydrogen atom, an alkyl group, a sulfo group, —SO ₃ M ¹ or a halogen atom, M ¹ represents an inorganic or organic cation, Rs ² and Rs ³ , and Rs ¹² and Rs ¹³ may be bonded to each other to form a ring;
Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ each independently represent a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, a hydroxy group, -NR ^X1 R ^X2 , a sulfo group, -SO ₃ M ² , -SO ₂ NR ^X1 R ^X2 , -COOR ^X3 , -CONR ^X1 R ^X2 , a nitro group, a cyano group, or a halogen atom, M ² represents an inorganic or organic cation, R ^X1 to R ^X3 each independently represent a hydrogen atom, an alkyl group, an aryl group, an acyl group, or a heterocyclic group, R ^X1 and R ^X2 may be bonded to each other to form a ring, and adjacent groups among Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ may be bonded to each other to form a ring;
When ^Q1 is a nitrogen atom, ^Rs21 is not present, when ^Q4 is a nitrogen atom, ^Rs24 is not present, when ^Q5 is a nitrogen atom, ^Rs25 is not present, when ^Q8 is a nitrogen atom, ^Rs28 is not present, when ^Q11 is a nitrogen atom, ^Rs31 is not present, when ^Q14 is a nitrogen atom, ^Rs34 is not present, when ^Q15 is a nitrogen atom, ^Rs35 is not present, and when ^Q18 is a nitrogen atom, ^Rs38 is not present.

It is preferable that Q ¹ , Q ⁴ , Q ⁵ , Q ⁸ , Q ¹¹ , Q ¹⁴ , Q ¹⁵ and Q ¹⁸ are carbon atoms from the viewpoint of various resistances such as heat resistance and light resistance.

The number of carbon atoms of the alkyl group represented by Rs ¹ to Rs ⁵ and Rs ¹¹ to Rs ¹⁵ is preferably 1 to 20, more preferably 1 to 15, still more preferably 1 to 8, even more preferably 1 to 5, and particularly preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, preferably linear or branched, and more preferably linear. The alkyl group may have a substituent or may be unsubstituted. Examples of the substituent include the groups explained in the substituent T described below.

In —SO ₃ M ¹ represented by Rs ¹ to Rs ⁵ and Rs ¹¹ to Rs ¹⁵ , known inorganic or organic cations can be used for M ¹ without any limitations, such as alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), ammonium ions, imidazolium ions, pyridinium ions, and phosphonium ions.

Examples of the halogen atom represented by Rs ¹ to Rs ⁵ and Rs ¹¹ to Rs ¹⁵ include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.

^Rs2 and ^Rs3 , and ^Rs12 and ^Rs13 may be bonded to each other to form a ring. The ring formed may be a hydrocarbon ring or a heterocycle. The hydrocarbon ring and the heterocycle may be an aromatic ring or a non-aromatic ring. The hydrocarbon ring and the heterocycle may be a monocycle or a condensed ring. The ring formed is preferably a 5- or 6-membered hydrocarbon ring or a heterocycle, and more preferably a 5- or 6-membered hydrocarbon ring.

From the viewpoint of imparting resistance, ^it is preferable ^{that Rs 1 to} Rs ⁵ are hydrogen atoms, or that four of Rs ¹ to Rs ⁵ are hydrogen atoms, and one is a sulfo group, -SO ₃ M ¹ , or a halogen atom. Among these, it is particularly preferable that Rs ¹ to Rs ⁵ are hydrogen atoms, or that four of Rs ¹ to Rs ⁵ are hydrogen atoms, and one is a sulfo group or a halogen atom. Furthermore, it is preferable that Rs ¹¹ to Rs ¹⁵ are hydrogen atoms, or that four of Rs ¹¹ to Rs ¹⁵ are hydrogen atoms, and one is a sulfo group, -SO ₃ M ^{1 ,} or a halogen atom, from ^the viewpoint of imparting resistance. Among these, it is particularly preferable that Rs ¹¹ to Rs ¹⁵ are hydrogen atoms, or that four of Rs ¹¹ to Rs ¹⁵ are hydrogen atoms, and one is a sulfo group or a halogen atom.

The number of carbon atoms of the alkyl group and alkoxy group represented by Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ is preferably 1 to 20, more preferably 1 to 15, still more preferably 1 to 8, even more preferably 1 to 5, and particularly preferably 1 to 3. The alkyl group and alkoxy group may be linear, branched, or cyclic, preferably linear or branched, and more preferably linear. The alkyl group and alkoxy group may have a substituent or may be unsubstituted. Examples of the substituent include the groups explained in the substituent T described below.

The number of carbon atoms of the alkenyl group represented by Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ is preferably 2 to 20, more preferably 2 to 12, and particularly preferably 2 to 8. The alkenyl group may be either linear or branched, and is preferably linear. The alkenyl group may have a substituent or may be unsubstituted. Examples of the substituent include the groups explained in the substituent T described below.

The number of carbon atoms of the aryl group and the aryloxy group represented by Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ is preferably 6 to 30, more preferably 6 to 20, and further preferably 6 to 12. The aryl group and the aryloxy group may have a substituent or may be unsubstituted. Examples of the substituent include the groups explained in the substituent T described later.

The aralkyl groups represented by Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ preferably have 7 to 40 carbon atoms, more preferably 7 to 30 carbon atoms, and even more preferably 7 to 25 carbon atoms.

In —SO ₃ M ² represented by Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ , known inorganic or organic cations can be used for M ² without any limitations, such as alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), ammonium ions, imidazolium ions, pyridinium ions, and phosphonium ions.

Examples of the halogen atom represented by Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.

In —NR ^X1 R ^X2 , —SO ₂ NR ^X1 R ^X2 , —COOR ^X3 and —CONR ^X1 R ^X2 represented by Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ , R ^X1 to R ^X3 each independently represent a hydrogen atom, an alkyl group, an aryl group, an acyl group or a heterocyclic group.

The number of carbon atoms of the alkyl group represented by R ^X1 to R ^X3 is preferably 1 to 20, more preferably 1 to 15, still more preferably 1 to 8, even more preferably 1 to 5, and particularly preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, preferably linear or branched, and more preferably linear. The alkyl group may have a substituent or may be unsubstituted. Examples of the substituent include the groups explained in the substituent T described below.

The number of carbon atoms of the aryl group represented by R ^X1 to R ^X3 is preferably 6 to 30, more preferably 6 to 20, and further preferably 6 to 12. The aryl group may have a substituent or may be unsubstituted. Examples of the substituent include the groups explained in the substituent T described later.

The heterocyclic group represented by R ^X1 to R ^X3 is preferably a monocyclic heterocyclic group or a heterocyclic group having a condensed ring with a number of 2 to 8, more preferably a monocyclic heterocyclic group or a heterocyclic group having a condensed ring with a number of 2 to 4, and even more preferably a monocyclic heterocyclic group. The number of heteroatoms constituting the ring of the heterocyclic group is preferably 1 to 3. The heteroatoms constituting the ring of the heterocyclic group are preferably a nitrogen atom, an oxygen atom, or a sulfur atom, and more preferably a nitrogen atom. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The number of carbon atoms constituting the ring of the heterocyclic group is preferably 3 to 30, more preferably 3 to 18, and more preferably 3 to 12. The heterocyclic group may have a substituent or may be unsubstituted. Examples of the substituent include the groups described in the substituent T described below. Specific examples of the heterocyclic group include a pyridinyl group. The pyridinyl group may have a substituent.

Examples of the acyl group represented by R ^X1 to R ^X3 include a formyl group, an alkylcarbonyl group, and an arylcarbonyl group. The number of carbon atoms in the alkylcarbonyl group is preferably 2 to 20, more preferably 2 to 15, and even more preferably 2 to 8. The number of carbon atoms in the arylcarbonyl group is preferably 7 to 30, more preferably 7 to 20, and even more preferably 7 to 12. The alkyl portion of the alkylcarbonyl group and the aryl portion of the arylcarbonyl group may have a substituent or may be unsubstituted. Examples of the substituent include the groups explained in the substituent T described below.

In -NR ^X1 R ^X2 , -SO ₂ NR ^X1 R ^X2 and -CONR ^X1 R ^X2 , R ^X1 and R ^X2 may be bonded to each other to form a ring. The ring thus formed is preferably a 5- or 6-membered ring.

Among Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ , adjacent groups may be bonded to each other to form a ring. The ring formed may be a hydrocarbon ring or a heterocycle. Furthermore, the hydrocarbon ring and the heterocycle may be an aromatic ring or a non-aromatic ring. Furthermore, the hydrocarbon ring and the heterocycle may be a monocycle or a condensed ring. The ring formed is preferably a 5- or 6-membered hydrocarbon ring or a heterocycle, and more preferably a 5- or 6-membered hydrocarbon ring.

Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ are each preferably independently a hydrogen atom, an alkyl group, a hydroxyl group, -NR ^X1 R ^X2 , a sulfo group, -SO ₃ M ² , -COOR ^X3 , a nitro group or a halogen atom, and more preferably a hydrogen atom.

(Substituent T)
Examples of the substituent T include a halogen atom, a cyano group, a nitro group, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heterocyclic group, -ORt ¹ , -CORt ¹ , -COORt ¹ , -OCORt ¹ , -NRt ¹ Rt ² , -NHCORt ¹ , -CONRt ¹ Rt ² , -NHCONRt ¹ Rt ² , -NHCOORt ¹ , -SRt ¹ , -SO ₂ Rt ¹ , -SO ₂ ORt ¹ , -NHSO ₂ Rt ¹ , -SO ₂ NRt ¹ Rt ² and -SO ₃ Mt ^1. Rt ¹ and Rt ² each independently represent a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heterocyclic group. Rt ¹ and Rt ² may be bonded to form a ring. Mt ¹ represents an inorganic or organic cation.

Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
The number of carbon atoms in the alkyl group is preferably 1 to 20, more preferably 1 to 15, and still more preferably 1 to 8. The alkyl group may be linear, branched, or cyclic, and is preferably linear or branched.
The number of carbon atoms in the alkenyl group is preferably from 2 to 20, more preferably from 2 to 12, and particularly preferably from 2 to 8. The alkenyl group may be either linear or branched.
The number of carbon atoms in the alkynyl group is preferably from 2 to 40, more preferably from 2 to 30, and particularly preferably from 2 to 25. The alkynyl group may be either linear or branched.
The aryl group preferably has 6 to 30 carbon atoms, more preferably 6 to 20 carbon atoms, and even more preferably 6 to 12 carbon atoms.
The heterocyclic group is preferably a monocyclic heterocyclic group or a heterocyclic group having 2 to 8 condensed rings, more preferably a monocyclic heterocyclic group or a heterocyclic group having 2 to 4 condensed rings. The number of heteroatoms constituting the ring of the heterocyclic group is preferably 1 to 3. The heteroatoms constituting the ring of the heterocyclic group are preferably nitrogen atoms, oxygen atoms, or sulfur atoms. The heterocyclic group is preferably a 5-membered or 6-membered ring. The number of carbon atoms constituting the ring of the heterocyclic group is preferably 3 to 30, more preferably 3 to 18, and more preferably 3 to 12.
The alkyl group, the alkenyl group, the alkynyl group, the aryl group and the heterocyclic group may have a substituent or may be unsubstituted. Examples of the substituent include the substituents described above for the substituent T.
Examples of inorganic or organic cations represented by ^Mt1 include alkali metal ions (Li ⁺ , Na ⁺ , K ^{+ ,} etc.), ammonium ions, imidazolium ions, pyridinium ions, and phosphonium ions.

In the formula (SQ1), the cation exists in a delocalized state. For example, in the compound having the following structure, the cation exists in a delocalized state as shown below.

The near-infrared absorbing dye represented by formula (SQ1) is preferably a compound having a maximum absorption wavelength in the wavelength range of 700 to 1,300 nm, and more preferably a compound having a maximum absorption wavelength in the wavelength range of 700 to 1,000 nm.

Specific examples of the near infrared absorbing dye represented by formula (SQ1) include compounds having the following structures, compounds described in paragraphs [0224] to [0341] of JP2019-011455A, and compounds described in paragraphs [0221] to [0377] of WO2018/230486A.

The content of the near-infrared absorbing dye represented by formula (SQ1) is preferably 1 mass% or more, more preferably 3 mass% or more, more preferably 5 mass% or more, and particularly preferably 10 mass% or more, based on the total solid content of the resin composition of the present invention. The upper limit of the content of the near-infrared absorbing dye represented by formula (SQ1) is preferably 50 mass% or less, more preferably 45 mass% or less, and even more preferably 40 mass% or less. The resin composition may contain only one type of near-infrared absorbing dye represented by formula (SQ1), or may contain two or more types. When two or more types are contained, it is preferable that the total amount thereof is within the above range.

<<Compound represented by formula (AS1)>>
The resin composition of the present invention contains a compound represented by formula (AS1).
In formula (AS1), ^R represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, or a heteroaryl group; ^R and ^R each independently represent an alkyl group, an alkenyl group, an ^aryl group, or a heteroaryl group, and R and ^R may be bonded to each other to form a ring, and ^R and ^R may be bonded to each other to form a ring.

The number of carbon atoms in the alkyl group represented by R ^A1 to R ^A3 is preferably 1 to 20, more preferably 1 to 15, even more preferably 1 to 8, and even more preferably 1 to 5. The alkyl group may be linear, branched, or cyclic, preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably unsubstituted.

The number of carbon atoms in the alkenyl group represented by R ^A1 to R ^A3 is preferably 2 to 20, more preferably 2 to 12, and still more preferably 2 to 8. The alkenyl group may be linear or branched, and is preferably linear. The alkenyl group may have a substituent, but is preferably unsubstituted.

The number of carbon atoms in the aryl group represented by R ^A1 to R ^A3 is preferably from 6 to 30, more preferably from 6 to 20, and even more preferably from 6 to 12. The aryl group may have a substituent, but is preferably unsubstituted.

The heterocyclic group represented by R ^X1 to R ^X3 is preferably a monocyclic heterocyclic group or a heterocyclic group having a condensed ring with a number of 2 to 8, more preferably a monocyclic heterocyclic group or a heterocyclic group having a condensed ring with a number of 2 to 4, and even more preferably a monocyclic heterocyclic group. The number of heteroatoms constituting the ring of the heterocyclic group is preferably 1 to 3. The heteroatoms constituting the ring of the heterocyclic group are preferably a nitrogen atom, an oxygen atom, or a sulfur atom, and more preferably a nitrogen atom. The heterocyclic group is preferably a 5-membered ring or a 6-membered ring. The number of carbon atoms constituting the ring of the heterocyclic group is preferably 3 to 30, more preferably 3 to 18, and more preferably 3 to 12. The heterocyclic group may have a substituent, but is preferably unsubstituted.

R ^A1 and R ^A2 may be bonded to each other to form a ring, and R ^A2 and R ^A3 may be bonded to each other to form a ring. The ring formed by bonding these groups to each other is preferably a 5-membered ring or a 6-membered ring. In addition, when R ^A1 and R ^A2 are bonded to form a ring in formula (AS1), formula (AS1) is a structure represented by formula (AS1-1). In addition, when R ^A2 and R ^A3 are bonded to form a ring in formula (AS1), formula (AS1) is a structure represented by formula (AS1-2).

In formula (AS1-1), R ^A3 represents an alkyl group, an alkenyl group, an aryl group or a heteroaryl group, and ring Z ^A1 represents a 5- or 6-membered ring.
In formula (AS1-2), R ^A1 represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group or a heteroaryl group, and ring Z ^A2 represents a 5- or 6-membered ring.

In formula (AS1), it is preferable that at least one of R ^A2 and R ^A3 is an alkyl group. In addition, as a more preferred embodiment, R ^A1 to R ^A3 each independently represent an alkyl group. According to this embodiment, the interaction with the near infrared absorbing dye represented by formula (SQ1) is not easily inhibited, and a remarkable effect can be expected. In addition, as another more preferred embodiment, R ^A3 represents an alkyl group, and R ^A2 and R ^A3 are bonded to each other to form a ring. According to this embodiment, the steric repulsion between the near infrared absorbing dye represented by formula (SQ1) and the compound represented by formula (AS1) is suppressed, and the compound represented by formula (AS1) is easily brought into close proximity to the near infrared absorbing dye represented by formula (SQ1), and a more remarkable effect can be expected.

The boiling point of the compound represented by formula (AS1) is preferably 50° C. to 350° C., more preferably 100° C. to 300° C., and even more preferably 150° C. to 250° C. If the boiling point is within the above range, separation from the near-infrared absorbing dye represented by formula (SQ1) due to heating during film formation or device fabrication is suppressed, resulting in a more significant effect.

The molecular weight of the compound represented by formula (AS1) is preferably 73 to 1000, more preferably 73 to 500, and even more preferably 73 to 300. If the molecular weight is within the above range, there is less steric congestion of the molecules, and the compound represented by formula (AS1) is more likely to come into close proximity to the near-infrared absorbing dye represented by formula (SQ1), resulting in a more significant effect.

Specific examples of compounds represented by formula (AS1) include N-methylpyrrolidone, dimethylacetamide, N-ethylpyrrolidone, etc., with N-methylpyrrolidone and dimethylacetamide being preferred.

The resin composition of the present invention contains 0.001 to 1000 ppm by mass of the compound represented by formula (AS1). The upper limit is preferably 950 ppm by mass or less, more preferably 500 ppm by mass or less, and even more preferably 200 ppm by mass or less, because this makes it easier to suppress the generation of gel-like foreign matter caused by acid-base interactions in the liquid and makes it easier to obtain excellent storage stability. The lower limit is preferably 0.005 ppm by mass or more, more preferably 0.01 ppm by mass or more, and even more preferably 0.1 ppm by mass or more, from the viewpoint of light resistance.

In addition, the resin composition of the present invention preferably contains 0.00000001 to 20 parts by mass of the compound represented by formula (AS1) per 100 parts by mass of the near-infrared absorbing dye represented by formula (SQ1). In this embodiment, the effects of the present invention can be obtained more significantly. The lower limit is preferably 0.00000005 parts by mass or more, more preferably 0.0000001 parts by mass or more, and even more preferably 0.000001 parts by mass or more. The upper limit is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 2 parts by mass or less.

<<Resin>>
The resin composition of the present invention contains a resin. The resin is blended, for example, for dispersing particles such as pigments in the resin composition or for use as a binder. Note that a resin used mainly for dispersing particles such as pigments is also called a dispersant. However, such uses of the resin are merely examples, and the resin can also be used for purposes other than such uses.

The weight average molecular weight (Mw) of the resin is preferably 2,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, and more preferably 500,000 or less. The lower limit is preferably 3,000 or more, and more preferably 5,000 or more.

Examples of resins include (meth)acrylic resins, epoxy resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyamideimide resins, polyolefin resins, cyclic olefin resins, polyester resins, and styrene resins. One of these resins may be used alone, or two or more may be mixed and used. As the cyclic olefin resin, norbornene resin is preferred from the viewpoint of improving heat resistance. Commercially available norbornene resins include, for example, the ARTON series (e.g., ARTON F4520) manufactured by JSR Corporation. Examples of epoxy resins include epoxy resins which are glycidyl ethers of phenolic compounds, epoxy resins which are glycidyl ethers of various novolac resins, alicyclic epoxy resins, aliphatic epoxy resins, heterocyclic epoxy resins, glycidyl ester epoxy resins, glycidyl amine epoxy resins, epoxy resins obtained by glycidylating halogenated phenols, condensates of silicon compounds having epoxy groups with other silicon compounds, copolymers of polymerizable unsaturated compounds having epoxy groups with other polymerizable unsaturated compounds, etc. Also, examples of epoxy resins that can be used include Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, and G-01758 (manufactured by NOF Corp., epoxy group-containing polymers). In addition, the resin may be the resin described in the examples of WO 2016/088645. In addition, when the resin has an ethylenically unsaturated bond-containing group, particularly a (meth)acryloyl group, in a side chain, it is also preferable that the main chain and the ethylenically unsaturated bond-containing group are bonded via a divalent linking group having an alicyclic structure.

The resin composition of the present invention preferably contains an alkali-soluble resin. By containing an alkali-soluble resin in the resin composition of the present invention, the developability of the resin composition is improved, and when a pattern is formed by a photolithography method using the resin composition of the present invention, the occurrence of development residues can be effectively suppressed. The alkali-soluble resin may be a resin having an acid group. Examples of the acid group include a carboxyl group, a phosphoric acid group, a sulfo group, and a phenolic hydroxyl group, and the carboxyl group is preferable. The acid group possessed by the alkali-soluble resin may be only one type or may be two or more types. The alkali-soluble resin may also be used as a dispersant.

The alkali-soluble resin preferably contains a repeating unit having an acid group on the side chain, and more preferably contains 5 to 70 mol% of the repeating units having an acid group on the side chain of all repeating units of the resin. The upper limit of the content of repeating units having an acid group on the side chain is preferably 50 mol% or less, and more preferably 30 mol% or less. The lower limit of the content of repeating units having an acid group on the side chain is preferably 10 mol% or more, and more preferably 20 mol% or more.

It is also preferable that the alkali-soluble resin is an alkali-soluble resin having a polymerizable group. Examples of the polymerizable group include a (meth)allyl group and a (meth)acryloyl group. It is preferable that the alkali-soluble resin having a polymerizable group is a resin containing a repeating unit having a polymerizable group in a side chain and a repeating unit having an acid group in a side chain.

It is also preferable that the alkali-soluble resin contains a repeating unit derived from a monomer component including a compound represented by the following formula (ED1) and/or a compound represented by the following formula (ED2) (hereinafter, these compounds may be referred to as "ether dimers").

In formula (ED1), R ¹ and R ² each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent.
In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. For details of formula (ED2), the description in JP2010-168539A can be referred to, the contents of which are incorporated herein by reference.

Specific examples of ether dimers can be found, for example, in paragraph 0317 of JP 2013-029760 A, the contents of which are incorporated herein by reference.

The alkali-soluble resin also preferably contains a repeating unit derived from a compound represented by the following formula (X).
In formula (X), _R1 represents a hydrogen atom or a methyl group, _R2 represents an alkylene group having 2 to 10 carbon atoms, _R3 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms which may contain a benzene ring, and n represents an integer of 1 to 15.

For details regarding alkali-soluble resins, please refer to the descriptions in paragraphs 0558 to 0571 of JP 2012-208494 A (corresponding paragraphs 0685 to 0700 of U.S. Patent Application Publication No. 2012/0235099) and paragraphs 0076 to 0099 of JP 2012-198408 A, the contents of which are incorporated herein by reference.

The acid value of the alkali-soluble resin is preferably 30 to 500 mgKOH/g. The lower limit is preferably 50 mgKOH/g or more, and more preferably 70 mgKOH/g or more. The upper limit is preferably 400 mgKOH/g or less, more preferably 300 mgKOH/g or less, and even more preferably 200 mgKOH/g or less.

Specific examples of the alkali-soluble resin include resins having the following structures: In the following structural formula, Me represents a methyl group.

The resin composition of the present invention also preferably contains a resin having a basic group. Examples of the basic group include an amino group and an ammonium base. The resin having a basic group may further have an acid group in addition to the basic group. The resin having a basic group is preferably used as a dispersant for the near-infrared absorbing dye represented by formula (SQ1). In addition, when the resin having a basic group further has an acid group, such a resin is also an alkali-soluble resin.

Examples of resins having a basic group include resins having a tertiary amino group and a quaternary ammonium base. Resins having a tertiary amino group and a quaternary ammonium base are preferably used as dispersants for near-infrared absorbing dyes represented by formula (SQ1). The resin having a tertiary amino group and a quaternary ammonium base is preferably a resin having a repeating unit having a tertiary amino group and a repeating unit having a quaternary ammonium base. The resin having a tertiary amino group and a quaternary ammonium base may further have a repeating unit having an acid group. It is also preferable that the resin having a tertiary amino group and a quaternary ammonium base has a block structure. The resin having a tertiary amino group and a quaternary ammonium base is preferably one having an amine value of 10 to 250 mgKOH/g and a quaternary ammonium salt value of 10 to 90 mgKOH/g, and more preferably one having an amine value of 50 to 200 mgKOH/g and a quaternary ammonium salt value of 10 to 50 mgKOH/g. The weight average molecular weight (Mw) of the resin having a tertiary amino group and a quaternary ammonium salt group is preferably 3000 to 300,000, more preferably 5000 to 30,000. The resin having a tertiary amino group and a quaternary ammonium salt group can be produced by copolymerizing an ethylenically unsaturated monomer having a tertiary amino group, an ethylenically unsaturated monomer having a quaternary ammonium salt group, and, if necessary, other ethylenically unsaturated monomers. Examples of the ethylenically unsaturated monomer having a tertiary amino group and the ethylenically unsaturated monomer having a quaternary ammonium salt group include those described in paragraphs 0150 to 0170 of WO 2018/230486, the contents of which are incorporated herein by reference.

In addition, the resin having a basic group is preferably a resin containing a nitrogen atom in the main chain. This resin is also preferably used as a dispersant for the near-infrared absorbing dye represented by formula (SQ1). The resin containing a nitrogen atom in the main chain (hereinafter also referred to as an oligoimine-based resin) preferably contains at least one repeating unit having a nitrogen atom selected from poly(lower alkyleneimine)-based repeating units, polyallylamine-based repeating units, polydiallylamine-based repeating units, metaxylenediamine-epichlorohydrin polycondensate-based repeating units, and polyvinylamine-based repeating units. In addition, the oligoimine-based resin is preferably a resin having a repeating unit having a partial structure X having a functional group with a pKa of 14 or less and a repeating unit having a side chain containing an oligomer chain or polymer chain Y having 40 to 10,000 atoms. The oligoimine-based resin may further have a repeating unit having an acid group. For the oligoimine resin, the description in paragraphs [0102] to [0166] of JP2012-255128A can be referred to, the contents of which are incorporated herein by reference.

The resin composition of the present invention may contain a resin as a dispersant, and preferably contains a resin as a dispersant. Examples of dispersants include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the acidic dispersant (acidic resin) refers to a resin in which the amount of acid groups is greater than the amount of basic groups. The acidic dispersant (acidic resin) is preferably a resin in which the amount of acid groups is 70 mol% or more when the total amount of the acid groups and the amount of the basic groups is 100 mol%, and more preferably a resin that is substantially composed of only acid groups. The acid group possessed by the acidic dispersant (acidic resin) is preferably a carboxyl group. Moreover, the basic dispersant (basic resin) refers to a resin in which the amount of basic groups is greater than the amount of acid groups. The basic dispersant (basic resin) is preferably a resin in which the amount of basic groups is greater than the amount of acid groups when the total amount of the acid groups and the amount of the basic groups is 100 mol%. The dispersant is preferably a resin having a basic group, and more preferably a basic dispersant.

Examples of the resin used as a dispersant include the above-mentioned resin having a tertiary amino group and a quaternary ammonium base, and oligoimine resin. It is also preferable that the resin used as a dispersant is a graft resin. Examples of the graft resin include a resin having a repeating unit with a graft chain. The graft resin may further have a repeating unit with an acid group. For details of the graft resin, refer to the description in paragraphs 0025 to 0094 of JP-A-2012-255128, the contents of which are incorporated herein by reference. It is also preferable that the resin used as a dispersant is a resin containing a repeating unit with an acid group. It is also preferable that the resin used as a dispersant is a resin having a structure in which multiple polymer chains are bonded to a core portion. Examples of such resins include dendrimers (including star-shaped polymers). Specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP-A-2013-043962. The above-mentioned alkali-soluble resin can also be used as a dispersant.

Dispersants are also available as commercially available products, and specific examples include Disperbyk-111 (manufactured by BYK Chemie) and Solsperse 76500 (manufactured by Lubrizol Nippon Co., Ltd.). Dispersants described in paragraphs 0041 to 0130 of JP 2014-130338 A can also be used, the contents of which are incorporated herein by reference.

The resin content is preferably 1 to 50% by mass of the total solid content of the resin composition. The lower limit is preferably 5% by mass or more, and more preferably 7% by mass or more. The upper limit is preferably 40% by mass or less, and more preferably 30% by mass or less.

In addition, when the resin composition of the present invention contains a resin having a basic group, the content of the resin having a basic group is preferably 1 to 100 parts by mass relative to 100 parts by mass of the near infrared absorbing dye represented by formula (SQ1). The upper limit is preferably 80 parts by mass or less, and more preferably 60 parts by mass or less. The lower limit is preferably 2.5 parts by mass or more, and more preferably 5 parts by mass or more. In addition, the content of the resin having a basic group in the resin contained in the resin composition is preferably 10 to 90% by mass, more preferably 20 to 80% by mass, and even more preferably 30 to 70% by mass.

In addition, when the resin composition of the present invention contains an alkali-soluble resin, the content of the alkali-soluble resin is preferably 1 to 50 mass% of the total solid content of the resin composition. The lower limit is preferably 5 mass% or more, and more preferably 7 mass% or more. The upper limit is preferably 40 mass% or less, and more preferably 30 mass% or less. In addition, the content of the alkali-soluble resin in the resin contained in the resin composition is preferably 10 to 100 mass%, more preferably 30 to 100 mass%, and even more preferably 50 to 100 mass%.

In addition, when the resin composition of the present invention contains a resin as a dispersant, the content of the resin as a dispersant is preferably 0.1 to 40 mass% of the total solid content of the resin composition. The upper limit is preferably 20 mass% or less, and more preferably 10 mass% or less. The lower limit is preferably 0.5 mass% or more, and more preferably 1 mass% or more. In addition, the content of the resin as a dispersant is preferably 1 to 100 parts by mass relative to 100 parts by mass of the near-infrared absorbing dye represented by formula (SQ1). The upper limit is preferably 80 parts by mass or less, and more preferably 60 parts by mass or less. The lower limit is preferably 2.5 parts by mass or more, and more preferably 5 parts by mass or more.

The resin composition of the present invention may contain only one type of resin, or may contain two or more types. When two or more types are contained, it is preferable that the total amount of the resins is within the above range.

<<Other near infrared absorbing agents>>
The resin composition of the present invention may contain other near-infrared absorbing agents other than the near-infrared absorbing dye represented by formula (SQ1). Examples of other near-infrared absorbing agents include pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, dithiolene metal complexes, metal oxides, and metal borides.

The content of the other near-infrared absorbent is preferably 400 parts by mass or less, more preferably 200 parts by mass or less, and even more preferably 100 parts by mass or less, relative to 100 parts by mass of the near-infrared absorbing dye represented by formula (SQ1). The total content of the near-infrared absorbing dye represented by formula (SQ1) and the other near-infrared absorbent is preferably 1% by mass or more, more preferably 3% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more, based on the total solid content of the resin composition of the present invention. The upper limit of the total content is preferably 50% by mass or less, more preferably 45% by mass or less, and even more preferably 40% by mass or less. The near-infrared absorbing layer may contain only one type of other near-infrared absorbent, or may contain two or more types. When two or more types are contained, it is preferable that the total amount thereof is within the above range.

It is also preferable that the resin composition of the present invention is substantially free of other near-infrared absorbents. Substantially free of other near-infrared absorbents means that the content of other near-infrared absorbents in the total solid content of the resin composition is preferably 0.5% by mass or less, more preferably 0.1% by mass or less, and even more preferably 0.05% by mass or less, and it is particularly preferable that the resin composition does not contain other near-infrared absorbents.

<<Dye derivatives>>
The resin composition of the present invention may contain a dye derivative. The dye derivative may be either an acidic dye derivative or a basic dye derivative, but is preferably an acidic dye derivative from the viewpoint of dispersibility of the near infrared absorbing dye represented by formula (SQ1).

The acidic dye derivative includes a compound in which an acid group is bonded to a dye skeleton. The acid group includes a sulfo group, a carboxyl group, a phosphoric acid group, a boronic acid group, a sulfonimide group, a sulfonamide group, and salts thereof. The atoms or atomic groups constituting the salt include alkali metal ions (Li ⁺ , Na ⁺ , K ^+, etc.), alkaline earth metal ions (Ca ²⁺ , Mg ²⁺ , etc.), ammonium ions, imidazolium ions, pyridinium ions, and phosphonium ions. The acid group of the acidic dye derivative is preferably a sulfo group, a carboxyl group, a phosphoric acid group, a boronic acid group, a sulfonimide group, a sulfonamide group, and salts thereof, more preferably a sulfo group, a carboxyl group, a phosphoric acid group, a sulfonimide group, a sulfonamide group, and salts thereof, even more preferably a sulfo group, a carboxyl group, and salts thereof, and particularly preferably a sulfo group.

Examples of basic dye derivatives include compounds in which a basic group is bonded to a dye skeleton. Examples of basic groups include amino groups, pyridinyl groups and their salts, salts of ammonium groups, and phthalimidomethyl groups. Examples of atoms or atomic groups that constitute the salts include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions. Examples of basic groups include amino groups, pyridinyl groups and their salts, salts of ammonium groups, and phthalimidomethyl groups, more preferably amino groups and phthalimidomethyl groups, and even more preferably amino groups.

The dye derivative is preferably a compound represented by formula (B1). The acidic dye derivative is preferably a compound in which X in formula (B1) is an acid group. The basic dye derivative is preferably a compound in which X in formula (B1) is a basic group.

In formula (B1), P represents a dye skeleton, L represents a single bond or a linking group, X represents an acid group or a basic group, m represents an integer of 1 or more, n represents an integer of 1 or more, and when m is 2 or more, multiple L's and X's may be different from each other, and when n is 2 or more, multiple X's may be different from each other.

Examples of the dye skeleton represented by P in formula (B1) include a squarylium dye skeleton, a pyrrolopyrrole dye skeleton, a diketopyrrolopyrrole dye skeleton, a quinacridone dye skeleton, an anthraquinone dye skeleton, a dianthraquinone dye skeleton, a benzisoindole dye skeleton, a thiazine indigo dye skeleton, an azo dye skeleton, a quinophthalone dye skeleton, a phthalocyanine dye skeleton, a naphthalocyanine dye skeleton, a dioxazine dye skeleton, a perylene dye skeleton, a perinone dye skeleton, a benzimidazolone dye skeleton, a benzothiazole dye skeleton, a benzimidazole dye skeleton, and a benzoxazole dye skeleton. At least one selected from the group consisting of a squarylium dye skeleton, a pyrrolopyrrole dye skeleton, a diketopyrrolopyrrole dye skeleton, a phthalocyanine dye skeleton, a quinacridone dye skeleton, and a benzimidazolone dye skeleton is preferred, and a squarylium dye skeleton is more preferred.

Examples of the linking group represented by L in formula (B1) include groups consisting of 1 to 100 carbon atoms, 0 to 10 nitrogen atoms, 0 to 50 oxygen atoms, 1 to 200 hydrogen atoms, and 0 to 20 sulfur atoms. Examples include hydrocarbon groups, heterocyclic groups, -O-, -S-, -CO-, -COO-, -OCO-, -SO ₂ -, -NR ^L -, -NR ^L CO-, -CONR ^L -, -NR ^L SO ₂ -, -SO ₂ NR ^L -, and groups consisting of combinations thereof. R ^L represents a hydrogen atom, an alkyl group, or an aryl group. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. Examples of the hydrocarbon group include an alkylene group, an arylene group, or a group obtained by removing one or more hydrogen atoms from these groups. The number of carbon atoms in the alkylene group is preferably 1 to 30, more preferably 1 to 15, and even more preferably 1 to 10. The alkylene group may be linear, branched, or cyclic. The cyclic alkylene group may be monocyclic or polycyclic. The number of carbon atoms in the arylene group is preferably 6 to 18, more preferably 6 to 14, and even more preferably 6 to 10. The heterocyclic group is preferably a monocyclic ring or a condensed ring having 2 to 4 condensed rings. The number of heteroatoms constituting the ring of the heterocyclic group is preferably 1 to 3. The heteroatoms constituting the ring of the heterocyclic group are preferably nitrogen atoms, oxygen atoms, or sulfur atoms. The number of carbon atoms constituting the ring of the heterocyclic group is preferably 3 to 30, more preferably 3 to 18, and even more preferably 3 to 12. The hydrocarbon group and the heterocyclic group may have a substituent. Examples of the substituent include the groups listed as the substituent T described above. The number of carbon atoms in the alkyl group represented by R ^L is preferably 1 to 20, more preferably 1 to 15, and even more preferably 1 to 8. The alkyl group may be linear, branched, or cyclic, and is preferably linear or branched, and more preferably linear. The alkyl group represented by R ^L may further have a substituent. Examples of the substituent include the substituent T described above. The number of carbon atoms in the aryl group represented by R ^L is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 12. The aryl group represented by R ^L may further have a substituent. Examples of the substituent include the substituent T described above.

X represents an acid group or a basic group, and preferably represents an acid group.

The dye derivative is preferably a compound having a maximum absorption wavelength in the wavelength range of 700 to 1200 nm, more preferably a compound having a maximum absorption wavelength in the wavelength range of 700 to 1100 nm, and even more preferably a compound having a maximum absorption wavelength in the wavelength range of 700 to 1000 nm. The dye derivative having a maximum absorption wavelength in the above wavelength range can easily bring the spread of the π plane close to that of the near infrared absorbing dye represented by formula (SQ1), and the adsorption of the near infrared absorbing dye represented by formula (SQ1) is improved, and more excellent dispersion stability is easily obtained. In addition, the dye derivative is also preferably a compound having a π conjugated plane of the same structure as the π conjugated plane contained in the near infrared absorbing dye represented by formula (SQ1). In addition, the number of π electrons contained in the π conjugated plane of the pigment derivative is preferably 8 to 100. The upper limit is preferably 90 or less, more preferably 80 or less. The lower limit is preferably 10 or more, more preferably 12 or more. In addition, the dye derivative is preferably a compound having a π-conjugated plane containing a partial structure represented by the following formula (SQ-a) or a compound having a π-conjugated plane containing a partial structure represented by the following formula (CR-a), and more preferably a compound having a π-conjugated plane containing a partial structure represented by the following formula (SQ-a):
In the above formula, the wavy line represents a bond.

The dye derivative is preferably at least one selected from a compound represented by the following formula (Syn1) and a compound represented by the following formula (Syn2), and more preferably a compound represented by the following formula (Syn1).

In formula (Syn1), ^Rsy1 and ^Rsy2 each independently represent an organic group, ^L1 represents a single bond or a group with a valence of p1+1, ^A1 represents an acid group or basicity, and p1 and q1 each independently represent an integer of 1 or more. When p1 is 2 or more, multiple ^A1s may be the same or different. When q1 is 2 or more, multiple ^L1s and ^A1s may be the same or different.

In formula (Syn2), ^Rsy3 and ^Rsy4 each independently represent an organic group, ^L2 represents a single bond or a group with a valence of p2+1, ^A2 represents an acid group or basicity, and p2 and q2 each independently represent an integer of 1 or more. When p2 is 2 or more, multiple ^A2s may be the same or different. When q2 is 2 or more, multiple ^L2s and ^A2s may be the same or different.

Examples of the organic groups represented by Rsy ¹ and Rsy ² in formula (Syn1) and the organic groups represented by Rsy ³ and Rsy ⁴ in formula (Syn2) include aryl groups, heteroaryl groups, and groups represented by the following formulae (R1) to (R7).

In formula (R1), R ¹ to R ³ each independently represent a hydrogen atom or a substituent, As ³ represents a heteroaryl group, n _r1 represents an integer of 0 or more, R ¹ and R ² may be bonded to each other to form a ring, R ¹ and As ³ may be bonded to each other to form a ring, R ² and R ³ may be bonded to each other to form a ring, when n _r1 is 2 or more, multiple R ^2s and R ^3s may be the same or different, and * represents a bond.

In formula (R2), ring ^Z1 represents an aromatic heterocycle or a fused ring containing an aromatic heterocycle, which may have one or more substituents, ring Z2 represents a 4- to 9-membered hydrocarbon ring or heterocycle, which may have one or more substituents, and when ring ^Z1 and ring ^{Z2 each} have multiple substituents, the multiple substituents may be the same or different, and * represents a bond.

In formula (R3), R ¹¹ to R ¹⁴ each independently represent a hydrogen atom or a substituent, adjacent two groups among R ¹¹ to R ¹⁴ may be bonded to each other to form a ring, R ²⁰ represents an aryl group or a heteroaryl group, R ²¹ represents a substituent, and X ¹⁰ represents CO or SO ₂ .

In formula (R4), R ²² and R ²³ each independently represent a hydrogen atom or a substituent, R ²² and R ²³ may be bonded to each other to form a ring, X ²⁰ represents an oxygen atom, a sulfur atom, NR ²⁴ , a selenium atom or a tellurium atom, R ²⁴ represents a hydrogen atom or a substituent, when X ²⁰ is NR ²⁴ , R ²⁴ and R ²² may be bonded to each other to form a ring, n _r2 represents an integer of 0 to 5, when n _r2 is 2 or more, a plurality of ^{R 22} may be the same or different, and two of the plurality of R ²² may be bonded to each other to form a ring, and * represents a bond.

In formula (R5), R ³⁵ to R ³⁸ each independently represent a hydrogen atom or a substituent, R ³⁵ and R ³⁶ , R ³⁶ and R ³⁷ , and R ³⁷ and R ³⁸ may be bonded to each other to form a ring, and * represents a bond.

In formula (R6), R ³⁹ to R ⁴⁵ each independently represent a hydrogen atom or a substituent, and R ³⁹ and R ⁴⁵ , R ⁴⁰ and R ⁴¹ , R ⁴⁰ and R ⁴² , R ⁴² and R ⁴³ , R ⁴³ and R ⁴⁴ , and R ⁴⁴ and R ⁴⁵ may be bonded to each other to form a ring, and * represents a bond.
In formula (R7), X ²¹ represents a ring structure, R ⁴⁶ to R ⁵⁰ each independently represent a hydrogen atom or a substituent, R ⁴⁷ and R ⁴⁸ may combine with each other to form a ring, and * represents a bond.

Examples of the p1+1-valent group represented by L ¹ in formula (Syn1) and the p2+1-valent group represented by L ² in formula (Syn2) include the groups described above as the linking group represented by L in formula (B1).

Specific examples of dye derivatives include compounds having the following structure. In the following structural formula, Ph is a phenyl group. Specific examples of dye derivatives include those disclosed in JP-A-56-118462, JP-A-63-264674, JP-A-01-217077, JP-A-03-009961, JP-A-03-026767, JP-A-03-153780, JP-A-03-045662, JP-A-04-285669, and JP-A-06-145546. , JP-A-06-212088, JP-A-06-240158, JP-A-10-030063, JP-A-10-195326, WO 2011/024896, paragraphs 0086 to 0098, and WO 2012/102399, paragraphs 0063 to 0094, the contents of which are incorporated herein by reference.

The content of the dye derivative is preferably 1 to 50 parts by mass relative to 100 parts by mass of the near-infrared absorbing dye represented by formula (SQ1). The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less. If the content of the dye derivative is within the above range, the dispersibility of the near-infrared absorbing dye represented by formula (SQ1) can be improved, and aggregation of the near-infrared absorbing dye represented by formula (SQ1) can be efficiently suppressed. Only one type of pigment derivative may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount is within the above range.

<<Chromatic colorants>>
The resin composition of the present invention may contain a chromatic colorant. In the present invention, the chromatic colorant means a colorant other than a white colorant and a black colorant. The chromatic colorant is preferably a colorant having absorption in the wavelength range of 400 nm or more and less than 650 nm.

Chromatic colorants include red, green, blue, yellow, purple and orange colorants. Chromatic colorants may be pigments or dyes. Pigments and dyes may be used in combination. Pigments may be either inorganic or organic pigments. Pigments may also be materials in which part of an inorganic pigment or an organic-inorganic pigment has been replaced with an organic chromophore. Substituting an inorganic pigment or an organic-inorganic pigment with an organic chromophore makes it easier to design the hue.

The average primary particle diameter of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. If the average primary particle diameter of the pigment is within the above range, the dispersion stability of the pigment in the resin composition is good. In the present invention, the primary particle diameter of the pigment can be determined from an image photograph obtained by observing the primary particles of the pigment with a transmission electron microscope. Specifically, the projected area of the primary particles of the pigment is determined, and the corresponding circle equivalent diameter is calculated as the primary particle diameter of the pigment. In the present invention, the average primary particle diameter is the arithmetic average value of the primary particle diameters of 400 primary particles of the pigment. In addition, the primary particles of the pigment refer to independent particles without aggregation.

It is preferable that the chromatic colorant contains a pigment. The content of the pigment in the chromatic colorant is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 80% by mass or more, and particularly preferably 90% by mass or more. Examples of pigments include those shown below.

Color Index (C.I.) Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126 , 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232 (methine type), 233 (quinoline type) and the like (all yellow pigments),
C.I. Pigment Orange 2,5,13,16,17:1,31,34,36,38,43,46,48,49,51,52,55,59,60,61,62,64,71,73, etc. (orange pigments)
C. I. Pigment Red 1,2,3,4,5,6,7,9,10,14,17,22,23,31,38,41,48:1,48:2,48:3,48:4,49,49:1,49:2,52:1,52:2 , 53:1, 57:1, 60:1, 63:1, 66, 67, 81: 1, 81: 2, 81: 3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178, 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 264, 270, 272, 279, 294 (xanthene type, Organo Ultramarine, Bluish Red), 295 (azo type), 296 (azo type) etc. (above, red pigments),
C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, etc. (all green pigments),
C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60 (triarylmethane type), 61 (xanthene type) etc. (all purple pigments),
C. I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87 (monoazo type), 88 (methine type), etc. (all blue pigments).

As a green pigment, a halogenated zinc phthalocyanine pigment having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms in one molecule can also be used. Specific examples include the compounds described in WO 2015/118720. As a green pigment, a compound described in Chinese Patent Application No. 106909027, a phthalocyanine compound having a phosphate ester as a ligand described in WO 2012/102395, and the like can also be used.

In addition, an aluminum phthalocyanine compound having a phosphorus atom can also be used as a blue pigment. Specific examples include the compounds described in paragraphs 0022 to 0030 of JP-A No. 2012-247591 and paragraph 0047 of JP-A No. 2011-157478.

In addition, as yellow pigments, the pigments described in JP-A-2008-074985, the compounds described in JP-A-2008-074987, the quinophthalone compounds described in JP-A-2013-061622, the quinophthalone compounds described in JP-A-2013-181015, the colorants described in JP-A-2014-085565, and the colorants described in JP-A-2016-14528 are also usable. 2, pigments described in JP-A-2017-201003, pigments described in JP-A-2017-197719, pigments described in JP-A-2017-171912, paragraphs 0011 to 0062 and 0137 to 0276, pigments described in JP-A-2017-171913, paragraphs 0010 to 0062 and 0138 to 0295, pigments described in JP-A-2017-171914, Pigments described in paragraphs 0011 to 0062, 0139 to 0190 of JP 017-171914 A, pigments described in paragraphs 0010 to 0065, 0142 to 0222 of JP 2017-171915 A, quinophthalone compounds described in JP 2017-197640 A, quinophthalone pigments described in JP 2018-040835 A, pigments described in JP 2018-203798 A, pigments described in JP 2018-062578 A, quinophthalone yellow pigments described in JP 2018-155881 A, compounds described in JP 2018-062644 A, quinophthalone compounds described in JP 6432077 A, and pigments described in JP 6443711 A can also be used.

In addition, the compound described in JP 2018-062644 A can also be used as a yellow pigment. This compound can also be used as a pigment derivative.

As the red pigment, a diketopyrrolopyrrole compound having at least one bromine atom substituted in the structure described in JP 2017-201384 A, a diketopyrrolopyrrole compound described in paragraphs 0016 to 0022 of Japanese Patent No. 6248838 A, a diketopyrrolopyrrole compound described in WO 2012/102399 A, a diketopyrrolopyrrole compound described in WO 2012/117965 A, a naphthol azo compound described in JP 2012-229344 A, etc. can also be used. In addition, as the red pigment, a compound having a structure in which an aromatic ring group having an oxygen atom, sulfur atom or nitrogen atom bonded to the aromatic ring is bonded to a diketopyrrolopyrrole skeleton can also be used.

In the present invention, dyes can also be used as coloring materials. There are no particular limitations on the dyes, and known dyes can be used. For example, pyrazole azo dyes, anilino azo dyes, triarylmethane dyes, anthraquinone dyes, anthrapyridone dyes, benzylidene dyes, oxonol dyes, pyrazolotriazole azo dyes, pyridone azo dyes, cyanine dyes, phenothiazine dyes, pyrrolopyrazole azomethine dyes, xanthene dyes, phthalocyanine dyes, benzopyran dyes, indigo dyes, and pyrromethene dyes. In addition, the thiazole compounds described in JP-A-2012-158649, the azo compounds described in JP-A-2011-184493, and the azo compounds described in JP-A-2011-145540 can also be preferably used. In addition, as the yellow dye, the quinophthalone compounds described in paragraphs 0011 to 0034 of JP-A-2013-054339 and the quinophthalone compounds described in paragraphs 0013 to 0058 of JP-A-2014-026228 can also be used.

When the resin composition of the present invention contains a chromatic colorant, the content of the chromatic colorant is preferably 1 to 50 mass% of the total solid content of the resin composition of the present invention. When the resin composition of the present invention contains two or more chromatic colorants, the total amount thereof is preferably within the above range.

<<Coloring material that transmits near-infrared light and blocks visible light>>
The resin composition of the present invention may also contain a coloring material that transmits near-infrared light (light with a wavelength in the near-infrared region) and blocks visible light (light with a wavelength in the visible region) (hereinafter, also referred to as a coloring material that blocks visible light). A resin composition containing a coloring material that blocks visible light is preferably used as a resin composition for forming a near-infrared transmission filter.

In the present invention, the coloring material that blocks visible light is preferably a coloring material that absorbs light in the purple to red wavelength region. Also, in the present invention, the coloring material that blocks visible light is preferably a coloring material that blocks light in the wavelength region of 450 to 650 nm. Also, the coloring material that blocks visible light is preferably a coloring material that transmits light in the wavelength region of 900 to 1300 nm. In the present invention, the coloring material that blocks visible light preferably satisfies at least one of the following requirements (A) and (B).
(A): Two or more types of chromatic colorants are included, and black is formed by a combination of two or more types of chromatic colorants.
(B): Contains an organic black colorant.

Examples of chromatic colorants include those mentioned above. Examples of organic black colorants include bisbenzofuranone compounds, azomethine compounds, perylene compounds, and azo compounds, with bisbenzofuranone compounds and perylene compounds being preferred. Examples of bisbenzofuranone compounds include compounds described in JP-T-2010-534726, JP-T-2012-515233, and JP-T-2012-515234, and are available as "Irgaphor Black" manufactured by BASF. Examples of perylene compounds include compounds described in paragraphs 0016 to 0020 of JP-A-2017-226821, C.I. Pigment Black 31, 32, and "Lumogen Black" manufactured by BASF. Examples of the azomethine compound include the compounds described in JP-A-01-170601 and JP-A-02-034664, and are available as "Chromofine Black A1103" manufactured by Dainichi Seika Chemicals Co., Ltd.

When black is formed by combining two or more chromatic colorants, examples of the combination of chromatic colorants include the following.
(1) An embodiment containing a yellow colorant, a blue colorant, a purple colorant, and a red colorant.
(2) An embodiment containing a yellow colorant, a blue colorant, and a red colorant.
(3) An embodiment containing a yellow colorant, a purple colorant, and a red colorant.
(4) An embodiment containing a yellow colorant and a purple colorant.
(5) An embodiment containing a green colorant, a blue colorant, a purple colorant, and a red colorant.
(6) An embodiment containing a purple colorant and an orange colorant.
(7) An embodiment containing a green colorant, a purple colorant, and a red colorant.
(8) An embodiment containing a green colorant and a red colorant.

When the resin composition of the present invention contains a colorant that blocks visible light, the content of the colorant that blocks visible light is preferably 1 to 50 mass % of the total solid content of the resin composition.

<<Polymerizable compound>>
The resin composition of the present invention preferably contains a polymerizable compound. The polymerizable compound is preferably a compound that can be polymerized by the action of radicals. That is, the polymerizable compound is preferably a radical polymerizable compound. The polymerizable compound is preferably a compound having one or more ethylenically unsaturated bond-containing groups, more preferably a compound having two or more ethylenically unsaturated bond-containing groups, and even more preferably a compound having three or more ethylenically unsaturated bond-containing groups. The upper limit of the number of ethylenically unsaturated bond-containing groups is, for example, preferably 15 or less, more preferably 6 or less. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a styrene group, a (meth)allyl group, and a (meth)acryloyl group, and the like, and the (meth)acryloyl group is preferred. The polymerizable compound is preferably a 3-15 functional (meth)acrylate compound, and more preferably a 3-6 functional (meth)acrylate compound. Specific examples of the polymerizable compound include compounds described in paragraphs 0095 to 0108 of JP-A-2009-288705, 0227 of JP-A-2013-029760, 0254 to 0257 of JP-A-2008-292970, 0034 to 0038 of JP-A-2013-253224, 0477 of JP-A-2012-208494, JP-A-2017-048367, JP-A-6057891, JP-A-6031807, and JP-A-2017-194662, the contents of which are incorporated herein by reference.

The polymerizable compound may be in the form of either a monomer or a polymer, but is preferably a monomer. The molecular weight of the monomer-type polymerizable compound is preferably 100 to 3000. The upper limit is preferably 2000 or less, more preferably 1500 or less. The lower limit is preferably 150 or more, more preferably 250 or more. It is also preferable that the polymerizable compound is a compound that does not substantially have a molecular weight distribution. Here, as a compound that does not substantially have a molecular weight distribution, a compound with a dispersity (weight average molecular weight (Mw)/number average molecular weight (Mn)) of 1.0 to 1.5 is preferable, and 1.0 to 1.3 is more preferable.

Preferred polymerizable compounds include dipentaerythritol triacrylate (commercially available product: KAYARAD D-330, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetraacrylate (commercially available product: KAYARAD D-320, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (commercially available product: KAYARAD D-310, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth)acrylate (commercially available products: KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., and NK Ester A-DPH-12E, manufactured by Shin-Nakamura Chemical Co., Ltd.), and compounds in which the (meth)acryloyl groups are bonded via ethylene glycol and/or propylene glycol residues (e.g., SR454 and SR499, commercially available from Sartomer Corporation). Examples of the polymerizable compound that can be used include diglycerol EO (ethylene oxide) modified (meth)acrylate (commercially available product is M-460; manufactured by Toagosei Co., Ltd.), pentaerythritol tetraacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., NK Ester A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Toagosei Co., Ltd.), NK Oligo UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), 8UH-1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), and light acrylate POB-A0 (manufactured by Kyoeisha Chemical Co., Ltd.).

It is also preferable to use trifunctional (meth)acrylate compounds such as trimethylolpropane tri(meth)acrylate, trimethylolpropane propyleneoxy-modified tri(meth)acrylate, trimethylolpropane ethyleneoxy-modified tri(meth)acrylate, isocyanuric acid ethyleneoxy-modified tri(meth)acrylate, and pentaerythritol tri(meth)acrylate as the polymerizable compound. Commercially available trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M-306, M-305, M-303, M-452, and M-450 (manufactured by Toagosei Co., Ltd.), NK Ester A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A-TMM-3L, A-TMM-3LM-N, A-TMPT, and TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, and PET-30 (manufactured by Nippon Kayaku Co., Ltd.).

The polymerizable compound may also be a compound having an acid group. By using a polymerizable compound having an acid group, the polymerizable compound in the unexposed area is easily removed during development, and the generation of development residues can be suppressed. Examples of the acid group include a carboxyl group, a sulfo group, and a phosphate group, and a carboxyl group is preferred. Commercially available polymerizable compounds having an acid group include Aronix M-305, M-510, M-520, and Aronix TO-2349 (manufactured by Toagosei Co., Ltd.). The acid value of the polymerizable compound having an acid group is preferably 0.1 to 40 mgKOH/g, and more preferably 5 to 30 mgKOH/g.

The polymerizable compound may also be a compound having a caprolactone structure. Polymerizable compounds having a caprolactone structure are commercially available, for example, from Nippon Kayaku Co., Ltd. as the KAYARAD DPCA series, and examples of such compounds include DPCA-20, DPCA-30, DPCA-60, and DPCA-120.

The polymerizable compound may also be a polymerizable compound having an alkyleneoxy group. The polymerizable compound having an alkyleneoxy group is preferably a polymerizable compound having an ethyleneoxy group and/or a propyleneoxy group, more preferably a polymerizable compound having an ethyleneoxy group, and even more preferably a trifunctional to hexafunctional (meth)acrylate compound having 4 to 20 ethyleneoxy groups. Commercially available polymerizable compounds having an alkyleneoxy group include, for example, SR-494, a tetrafunctional (meth)acrylate having four ethyleneoxy groups manufactured by Sartomer, and KAYARAD TPA-330, a trifunctional (meth)acrylate having three isobutyleneoxy groups.

The polymerizable compound may also be a polymerizable compound having a fluorene skeleton. Commercially available polymerizable compounds having a fluorene skeleton include OGSOL EA-0200 and EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., (meth)acrylate monomers having a fluorene skeleton).

It is also preferable to use a polymerizable compound that is substantially free of environmentally regulated substances such as toluene. Commercially available products of such compounds include KAYARAD DPHA LT and KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.).

As the polymerizable compound, urethane acrylates as described in JP-B-48-041708, JP-A-51-037193, JP-B-02-032293, and JP-B-02-016765, and urethane compounds having an ethylene oxide skeleton as described in JP-B-58-049860, JP-B-56-017654, JP-B-62-039417, and JP-B-62-039418 are also suitable. It is also preferable to use polymerizable compounds having an amino structure or a sulfide structure in the molecule as described in JP-A-63-277653, JP-A-63-260909, and JP-A-01-105238. In addition, commercially available polymerizable compounds such as UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600, and LINC-202UA (manufactured by Kyoeisha Chemical Co., Ltd.) can also be used.

The content of the polymerizable compound is preferably 0.1 to 40 mass% of the total solids content of the resin composition. The lower limit is preferably 0.5 mass% or more, and more preferably 1 mass% or more. The upper limit is preferably 30 mass% or less, and more preferably 20 mass% or less. The resin composition may contain only one type of polymerizable compound, or may contain two or more types. When two or more types are contained, it is preferable that the total amount thereof is within the above range.

<<Photopolymerization initiator>>
When the resin composition of the present invention contains a polymerizable compound, it is preferable that the resin composition of the present invention further contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, a compound having photosensitivity to light rays in the ultraviolet range to the visible range is preferable. The photopolymerization initiator is preferably a photoradical polymerization initiator.

Examples of photopolymerization initiators include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, α-aminoketone compounds, etc. From the viewpoint of exposure sensitivity, the photopolymerization initiator is preferably a trihalomethyltriazine compound, a benzyldimethylketal compound, an α-hydroxyketone compound, an α-aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a triarylimidazole dimer, an onium compound, a benzothiazole compound, a benzophenone compound, an acetophenone compound, a cyclopentadiene-benzene-iron complex, a halomethyloxadiazole compound, or a 3-aryl-substituted coumarin compound, more preferably a compound selected from an oxime compound, an α-hydroxyketone compound, an α-aminoketone compound, and an acylphosphine compound, and even more preferably an oxime compound. Examples of the photopolymerization initiator include compounds described in paragraphs 0065 to 0111 of JP-A-2014-130173 and Japanese Patent No. 6,301,489, the contents of which are incorporated herein by reference.

Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins B.V.). Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, and Omnirad 379EG (all manufactured by IGM Resins B.V.). Commercially available acylphosphine compounds include Omnirad 819 and Omnirad TPO (all manufactured by IGM Resins B.V.).

Examples of oxime compounds include compounds described in JP-A-2001-233842, compounds described in JP-A-2000-080068, compounds described in JP-A-2006-342166, compounds described in J. C. S. Perkin II (1979, pp. 1653-1660), compounds described in J. C. S. Perkin II (1979, pp. 156-162), compounds described in Journal of Photopolymer Science and Technology (1995, pp.202-232) described compounds, compounds described in JP-A-2000-066385, compounds described in JP-A-2000-080068, compounds described in JP-T-2004-534797, compounds described in JP-A-2006-342166, compounds described in JP-A-2017-019766, compounds described in Japanese Patent No. 6065596, compounds described in WO 2015/152153, compounds described in WO 2017/051680, compounds described in JP-A-2017-198865, compounds described in paragraphs 0025 to 0038 of WO 2017/164127, compounds described in WO 2013/167515, and the like. Specific examples of the oxime compound include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, and 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one. Commercially available products include IRGACURE-OXE01, IRGACURE-OXE02, IRGACURE-OXE03, and IRGACURE-OXE04 (manufactured by BASF), TR-PBG-304 (manufactured by Changzhou Strong Electronic New Materials Co., Ltd.), and ADEKA Optomer N-1919 (manufactured by ADEKA Corporation, photopolymerization initiator 2 described in JP-A-2012-014052). In addition, as the oxime compound, it is also preferable to use a compound that is not colorable or a compound that is highly transparent and does not easily discolor. Commercially available products include ADEKA Arcles NCI-730, NCI-831, and NCI-930 (manufactured by ADEKA Corporation).

In the present invention, an oxime compound having a fluorene ring can also be used as a photopolymerization initiator. Specific examples of oxime compounds having a fluorene ring include the compounds described in JP 2014-137466 A.

In addition, an oxime compound having a skeleton in which at least one benzene ring of a carbazole ring is replaced with a naphthalene ring can also be used as the photopolymerization initiator. Specific examples of such oxime compounds include the compounds described in WO 2013/083505.

In the present invention, an oxime compound having a fluorine atom can also be used as a photopolymerization initiator. Specific examples of oxime compounds having a fluorine atom include the compounds described in JP-A-2010-262028, compounds 24, 36 to 40 described in JP-A-2014-500852, and compound (C-3) described in JP-A-2013-164471.

In the present invention, an oxime compound having a nitro group can be used as a photopolymerization initiator. It is also preferable that the oxime compound having a nitro group is a dimer. Specific examples of oxime compounds having a nitro group include the compounds described in paragraphs 0031 to 0047 of JP 2013-114249 A, paragraphs 0008 to 0012 and 0070 to 0079 of JP 2014-137466 A, the compounds described in paragraphs 0007 to 0025 of Japanese Patent No. 4223071 A, and ADEKA ARCLES NCI-831 (manufactured by ADEKA Corporation).

In the present invention, an oxime compound having a benzofuran skeleton can also be used as a photopolymerization initiator. Specific examples include OE-01 to OE-75 described in WO 2015/036910.

Specific examples of oxime compounds that are preferably used in the present invention are shown below, but the present invention is not limited to these.

The oxime compound is preferably a compound having a maximum absorption wavelength in the wavelength range of 350 to 500 nm, more preferably a compound having a maximum absorption wavelength in the wavelength range of 360 to 480 nm. In addition, the molar absorption coefficient of the oxime compound at a wavelength of 365 nm or 405 nm is preferably high from the viewpoint of sensitivity, more preferably 1000 to 300,000, even more preferably 2000 to 300,000, and particularly preferably 5000 to 200,000. The molar absorption coefficient of the compound can be measured using a known method. For example, it is preferable to measure it using a spectrophotometer (Varian Cary-5 spectrophotometer) using ethyl acetate as a solvent at a concentration of 0.01 g/L.

As the photopolymerization initiator, a bifunctional or trifunctional or higher functional photoradical polymerization initiator may be used. By using such a photoradical polymerization initiator, two or more radicals are generated from one molecule of the photoradical polymerization initiator, so that good sensitivity can be obtained. In addition, when a compound with an asymmetric structure is used, the crystallinity is reduced and the solubility in a solvent or the like is improved, so that precipitation is less likely to occur over time, and the stability of the resin composition over time can be improved. Specific examples of bifunctional or trifunctional or higher functional photoradical polymerization initiators include dimers of oxime compounds described in JP-T-2010-527339, JP-T-2011-524436, WO-P-2015/004565, WO-P-2016-532675, paragraphs 0407 to 0412, and WO-P-2017/033680, paragraphs 0039 to 0055, and compounds described in JP-T-2013-522445. Compound (E) and compound (G), Cmpd1 to 7 described in WO 2016/034963, oxime ester photoinitiators described in JP-T 2017-523465, paragraph 0007, photoinitiators described in JP-A 2017-167399, paragraphs 0020 to 0033, and photopolymerization initiator (A) described in JP-A 2017-151342, paragraphs 0017 to 0026.

It is also preferable that the photopolymerization initiator contains an oxime compound and an α-aminoketone compound. By using both in combination, developability is improved and a pattern with excellent rectangularity is easily formed. When an oxime compound and an α-aminoketone compound are used in combination, the amount of the α-aminoketone compound is preferably 50 to 600 parts by mass, more preferably 150 to 400 parts by mass, per 100 parts by mass of the oxime compound.

The content of the photopolymerization initiator is preferably 0.1 to 40 mass% of the total solid content of the resin composition, more preferably 0.5 to 30 mass%, and even more preferably 1 to 20 mass%. The resin composition may contain only one type of photopolymerization initiator, or may contain two or more types. When two or more types are contained, it is preferable that the total amount thereof is within the above range.

<<Epoxy compounds>>
The resin composition of the present invention may contain a compound having an epoxy group (hereinafter, also referred to as an epoxy compound). Examples of the epoxy compound include monofunctional or polyfunctional glycidyl ether compounds, polyfunctional aliphatic glycidyl ether compounds, and compounds having an alicyclic epoxy group. The epoxy compound is preferably a compound having 1 to 100 epoxy groups per molecule. The upper limit of the epoxy groups may be 10 or less, or 5 or less. The lower limit is preferably 2 or more. The epoxy compound may be a low molecular weight compound (e.g., a molecular weight of less than 1000) or a high molecular weight compound (macromolecule) (e.g., a molecular weight of 1000 or more, and in the case of a polymer, a weight average molecular weight of 1000 or more). The weight average molecular weight of the epoxy compound is preferably 2000 to 100000. The upper limit of the weight average molecular weight is preferably 10000 or less, more preferably 5000 or less, and even more preferably 3000 or less.

Commercially available epoxy compounds include EHPE3150 (manufactured by Daicel Corporation), EPICLON N-695 (manufactured by DIC Corporation), and ADEKA GLYCILOR ED-505 (manufactured by ADEKA Corporation). In addition, the compounds described in paragraphs 0034 to 0036 of JP2013-011869A, paragraphs 0147 to 0156 of JP2014-043556A, and paragraphs 0085 to 0092 of JP2014-089408A can also be used as epoxy compounds.

The content of the epoxy compound is preferably 0.1 to 40 mass% of the total solid content of the resin composition. The lower limit is preferably 0.5 mass% or more, more preferably 1 mass% or more. The upper limit is preferably 30 mass% or less, more preferably 20 mass% or less. In addition, when the resin composition contains a polymerizable compound and an epoxy compound, the mass ratio of the two is preferably polymerizable compound:epoxy compound = 100:1 to 100:400, more preferably 100:1 to 100:100. The resin composition may contain only one type of epoxy compound, or may contain two or more types. When two or more types are contained, it is preferable that the total amount thereof is within the above range.

<<Epoxy hardener>>
When the resin composition of the present invention contains an epoxy compound, it is preferable that the resin composition of the present invention further contains an epoxy curing agent. Examples of the epoxy curing agent include amine compounds, acid anhydride compounds, amide compounds, phenol compounds, polycarboxylic acids, and thiol compounds. As the epoxy curing agent, polycarboxylic acids are preferable from the viewpoint of heat resistance and transparency of the cured product, and compounds having two or more carboxylic anhydride groups in the molecule are most preferable. Specific examples of the epoxy curing agent include butanedioic acid. As the epoxy curing agent, compounds described in paragraphs 0072 to 0078 of JP-A-2016-075720 can also be used, the contents of which are incorporated herein by reference. The content of the epoxy curing agent is preferably 0.01 to 20 parts by mass, more preferably 0.01 to 10 parts by mass, and even more preferably 0.1 to 6.0 parts by mass, relative to 100 parts by mass of the epoxy compound. The resin composition may contain only one type of epoxy curing agent, or may contain two or more types. When two or more types are contained, it is preferable that the total amount thereof is within the above range.

<<Solvent>>
The resin composition of the present invention preferably contains a solvent. The solvent is preferably an organic solvent. Examples of the organic solvent include ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents, and hydrocarbon solvents. For details, refer to paragraph 0223 of International Publication No. 2015/166779, the contents of which are incorporated herein by reference. In addition, ester solvents substituted with a cyclic alkyl group and ketone solvents substituted with a cyclic alkyl group can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate. However, aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents may be reduced for environmental reasons (for example, the amount of aromatic hydrocarbons may be 50 ppm (parts per million) by mass or less, 10 ppm by mass or less, or 1 ppm by mass or less, based on the total amount of organic solvent).

In the present invention, it is preferable to use an organic solvent with a low metal content, and the metal content of the organic solvent is preferably, for example, 10 parts per billion (ppb) by mass or less. If necessary, an organic solvent with a mass ppt (parts per trillion) level may be used, and such an organic solvent is provided, for example, by Toyo Gosei Co., Ltd. (The Chemical Daily, November 13, 2015).

Methods for removing impurities such as metals from organic solvents include, for example, distillation (molecular distillation, thin-film distillation, etc.) and filtration using a filter. The filter pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene, or nylon.

The organic solvent may contain isomers (compounds with the same number of atoms but different structures). In addition, the organic solvent may contain only one type of isomer or multiple types of isomers.

It is preferable that the peroxide content in the organic solvent is 0.8 mmol/L or less, and it is even more preferable that it is substantially free of peroxides.

The content of the solvent is preferably 10 to 97% by mass relative to the total amount of the resin composition. The lower limit is preferably 30% by mass or more, more preferably 40% by mass or more, even more preferably 50% by mass or more, even more preferably 60% by mass or more, and particularly preferably 70% by mass or more. The upper limit is preferably 96% by mass or less, and more preferably 95% by mass or less. The resin composition may contain only one type of solvent, or may contain two or more types. When two or more types are contained, it is preferable that the total amount thereof is within the above range.

<<Polymerization inhibitor>>
The resin composition of the present invention may contain a polymerization inhibitor. Examples of the polymerization inhibitor include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-t-butylphenol), and N-nitrosophenylhydroxyamine salts (ammonium salts, cerium salts, etc.), and p-methoxyphenol is preferred. The content of the polymerization inhibitor is preferably 0.0001 to 5 mass% of the total solid content of the resin composition. The resin composition may contain only one type of polymerization inhibitor, or may contain two or more types. When two or more types are contained, the total amount thereof is preferably within the above range.

<<Silane coupling agents>>
The resin composition of the present invention may contain a silane coupling agent. In the present invention, the silane coupling agent means a silane compound having a hydrolyzable group and other functional groups. The hydrolyzable group means a substituent that is directly bonded to a silicon atom and can generate a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, and an acyloxy group, and an alkoxy group is preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Examples of functional groups other than the hydrolyzable group include a vinyl group, a styryl group, a (meth)acryloyl group, a mercapto group, an epoxy group, an oxetanyl group, an amino group, a ureido group, a sulfide group, an isocyanate group, and a phenyl group, and a (meth)acryloyl group and an epoxy group are preferred. Examples of the silane coupling agent include compounds described in paragraphs 0018 to 0036 of JP-A-2009-288703 and compounds described in paragraphs 0056 to 0066 of JP-A-2009-242604, the contents of which are incorporated herein by reference. The content of the silane coupling agent is preferably 0.01 to 15.0 mass% of the total solid content of the resin composition, more preferably 0.05 to 10.0 mass%. The resin composition may contain only one type of silane coupling agent, or may contain two or more types. When two or more types are contained, it is preferable that the total amount thereof is within the above range.

<<Surfactants>>
The resin composition of the present invention preferably contains a surfactant. As the surfactant, various surfactants such as fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and silicon-based surfactants can be used. As the surfactant, the surfactants described in paragraphs 0238 to 0245 of WO 2015/166779 can be mentioned, the contents of which are incorporated herein by reference.

The surfactant is preferably a fluorosurfactant. By including a fluorosurfactant in the resin composition, the liquid properties (particularly fluidity) can be further improved, and liquid saving can be further improved. In addition, a film with less unevenness in thickness can be formed. Furthermore, there is also an effect of suppressing the volatilization of the compound of formula (AS1) due to heating.

The fluorine content in the fluorosurfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and particularly preferably 7 to 25% by mass. Fluorine surfactants with a fluorine content within this range are effective in terms of uniformity of the coating film thickness and liquid saving, and also have good solubility in the composition.

Examples of fluorine-based surfactants include those described in paragraphs 0060 to 0064 of JP 2014-041318 A (corresponding paragraphs 0060 to 0064 of WO 2014/017669 A) and those described in paragraphs 0117 to 0132 of JP 2011-132503 A, the contents of which are incorporated herein by reference. Commercially available fluorine-based surfactants include, for example, Megafac F171, F172, F173, F176, F177, F141, F142, F143, F144, R30, F437, F475, F479, F482, F554, F780, EXP, and MFS-330 (all manufactured by DIC Corporation), Fluorard FC430, FC431, and FC171 (all manufactured by Sumitomo 3M Limited), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, and KH-40 (all manufactured by Asahi Glass Co., Ltd.), Futerjet FTX-218 (manufactured by Neos Corporation), and PolyFox. Examples of such polysiloxanes include PF636, PF656, PF6320, PF6520, and PF7002 (all manufactured by OMNOVA).

In addition, acrylic compounds that have a molecular structure with a functional group containing a fluorine atom and that volatilize the fluorine atom when heated due to cleavage of the functional group containing the fluorine atom can also be suitably used as the fluorosurfactant. Examples of such fluorosurfactants include the Megafac DS series manufactured by DIC Corporation (The Chemical Daily (February 22, 2016), Nikkei Business Daily (February 23, 2016)), such as Megafac DS-21.

It is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound as the fluorine-based surfactant. Examples of such a fluorine-based surfactant include the fluorine-based surfactants described in JP 2016-216602 A, the contents of which are incorporated herein by reference.

The fluorosurfactant may be a block polymer. As the fluorosurfactant, a fluorine-containing polymer compound containing a repeating unit derived from a (meth)acrylate compound having a fluorine atom and a repeating unit derived from a (meth)acrylate compound having two or more (preferably five or more) alkyleneoxy groups (preferably ethyleneoxy groups, propyleneoxy groups) may also be preferably used. In addition, the fluorine-containing surfactants described in paragraphs 0016 to 0037 of JP-A-2010-032698 and the following compounds are also exemplified as the fluorosurfactant used in the present invention.
The weight average molecular weight of the above compound is preferably 3,000 to 50,000, for example, 14,000. In the above compound, % indicating the proportion of repeating units is mol %.

In addition, the fluorosurfactant may be a fluorine-containing polymer having an ethylenically unsaturated bond-containing group in the side chain. Specific examples include the compounds described in paragraphs 0050 to 0090 and 0289 to 0295 of JP 2010-164965 A, and Megafac RS-101, RS-102, RS-718K, and RS-72-K manufactured by DIC Corporation. In addition, the fluorosurfactant may be the compounds described in paragraphs 0015 to 0158 of JP 2015-117327 A.

Nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane and their ethoxylates and propoxylates (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fat, Examples of fatty acid esters include Pluronic L10, L31, L61, L62, 10R5, 17R2, and 25R2 (manufactured by BASF), Tetronic 304, 701, 704, 901, 904, and 150R1 (manufactured by BASF), Solsperse 20000 (manufactured by Lubrizol Japan Co., Ltd.), NCW-101, NCW-1001, and NCW-1002 (manufactured by Wako Pure Chemical Industries, Ltd.), Paionin D-6112, D-6112-W, and D-6315 (manufactured by Takemoto Oil Co., Ltd.), Olfine E1010, and Surfynol 104, 400, and 440 (manufactured by Nissin Chemical Industry Co., Ltd.).

Examples of silicone surfactants include Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, Toray Silicone SH8400 (all manufactured by Dow Corning Toray Co., Ltd.), TSF-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), KP-341, KF-6001, KF-6002 (all manufactured by Shin-Etsu Silicone Co., Ltd.), BYK307, BYK323, BYK330 (all manufactured by BYK-Chemie).

The content of the surfactant is preferably 0.01 to 1 mass% relative to the total amount of the resin composition. The upper limit is preferably 0.5 mass% or less, more preferably 0.1 mass% or less, and even more preferably 0.05 mass% or less. The lower limit is preferably 0.015 mass% or more. If the content of the surfactant is within the above range, it is easy to obtain excellent coatability while suppressing the volatilization of the compound of formula (AS1) due to heating. The resin composition may contain only one type of surfactant, or may contain two or more types. When two or more types are contained, it is preferable that the total amount thereof is within the above range.

<<Ultraviolet absorbing agent>>
The resin composition may contain an ultraviolet absorber. Examples of ultraviolet absorbers include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, and triazine compounds. Specific examples of such compounds include those described in paragraphs 0038 to 0052 of JP 2009-217221 A, paragraphs 0052 to 0072 of JP 2012-208374 A, paragraphs 0317 to 0334 of JP 2013-068814 A, and paragraphs 0061 to 0080 of JP 2016-162946 A, the contents of which are incorporated herein. Commercially available ultraviolet absorbers include, for example, UV-503 (manufactured by Daito Chemical Co., Ltd.). In addition, examples of the benzotriazole compound include the MYUA series manufactured by Miyoshi Oil & Fat (The Chemical Daily, February 1, 2016). In addition, the ultraviolet absorber may be a compound described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967. The content of the ultraviolet absorber is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass, based on the total solid content of the resin composition. The resin composition may contain only one type of ultraviolet absorber, or may contain two or more types. When two or more types are contained, it is preferable that the total amount thereof is within the above range.

<<Antioxidants>>
The resin composition of the present invention may contain an antioxidant. Examples of the antioxidant include phenolic compounds, phosphite compounds, and thioether compounds. As the phenolic compound, any phenolic compound known as a phenolic antioxidant may be used. As a preferred phenolic compound, a hindered phenolic compound may be used. A compound having a substituent at the site (ortho position) adjacent to the phenolic hydroxy group is preferred. As the aforementioned substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferred. In addition, as the antioxidant, a compound having a phenolic group and a phosphite ester group in the same molecule is also preferred. In addition, as the antioxidant, a phosphorus-based antioxidant may also be suitably used. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphepin-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphepin-2-yl)oxy]ethyl]amine, and ethylbis(2,4-di-tert-butyl-6-methylphenyl)phosphite. Commercially available antioxidants include, for example, Adeka STAB AO-20, Adeka STAB AO-30, Adeka STAB AO-40, Adeka STAB AO-50, Adeka STAB AO-50F, Adeka STAB AO-60, Adeka STAB AO-60G, Adeka STAB AO-80, and Adeka STAB AO-330 (manufactured by ADEKA Corporation). In addition, the antioxidant may be a compound described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, a compound described in International Publication No. WO 2017/006600, or a compound described in International Publication No. WO 2017/164024. The content of the antioxidant is preferably 0.01 to 20% by mass, more preferably 0.3 to 15% by mass, of the total solid content of the resin composition. The resin composition may contain only one type of antioxidant, or may contain two or more types. When two or more types are contained, the total amount thereof is preferably within the above range.

<<Other ingredients>>
The resin composition of the present invention may contain, as necessary, a sensitizer, a curing accelerator, a filler, a heat curing accelerator, a plasticizer, and other auxiliaries (for example, conductive particles, fillers, defoamers, flame retardants, leveling agents, peeling accelerators, fragrances, surface tension regulators, chain transfer agents, etc.). By appropriately incorporating these components, it is possible to adjust the properties of the film physical properties, etc. These components can be referred to, for example, in the description of paragraphs 0183 and onward of JP-A-2012-003225 (corresponding to paragraph 0237 of US Patent Application Publication No. 2013/0034812), and in the description of paragraphs 0101 to 0104, 0107 to 0109, etc. of JP-A-2008-250074, the contents of which are incorporated herein by reference. In addition, the resin composition of the present invention may contain, as necessary, a latent antioxidant. Examples of the latent antioxidant include a compound in which a site functioning as an antioxidant is protected with a protecting group, and the protecting group is removed by heating at 100 to 250° C. or at 80 to 200° C. in the presence of an acid/base catalyst, thereby functioning as an antioxidant. Examples of the latent antioxidant include the compounds described in WO 2014/021023, WO 2017/030005, and JP 2017-008219 A. Examples of commercially available latent antioxidants include ADEKA ARCLES GPA-5001 (manufactured by ADEKA CORPORATION).

The viscosity (23°C) of the resin composition of the present invention is preferably 1 to 100 mPa·s, for example, when forming a film by coating. The lower limit is more preferably 2 mPa·s or more, and even more preferably 3 mPa·s or more. The upper limit is more preferably 50 mPa·s or less, even more preferably 30 mPa·s or less, and particularly preferably 15 mPa·s or less.

<Containment container>
The container for storing the resin composition of the present invention is not particularly limited, and a known container can be used. In addition, it is also preferable to use a multi-layer bottle having an inner wall made of six types and six layers of resin or a bottle having a seven-layer structure made of six types of resin as the container, in order to suppress the incorporation of impurities into the raw materials and the resin composition. Examples of such containers include the containers described in JP-A-2015-123351. In addition, it is also preferable that the inner wall of the container is made of glass or stainless steel in order to prevent metal elution from the inner wall of the container, increase the storage stability of the resin composition, and suppress the deterioration of the components.

<Applications of resin composition>
The resin composition of the present invention can be preferably used as a resin composition for forming a near-infrared cut filter or a near-infrared transmission filter. When the resin composition of the present invention is used as a resin composition for forming a near-infrared transmission filter, the resin composition of the present invention preferably further contains a coloring material that blocks visible light. By using such a resin composition, a near-infrared transmission filter that blocks visible light and can transmit only near-infrared rays having a specific wavelength or more can be formed.

<Method for preparing resin composition>
The resin composition of the present invention can be prepared by mixing the above-mentioned components. When preparing the resin composition, all the components may be simultaneously dissolved or dispersed in a solvent to prepare the resin composition, or, if necessary, two or more solutions or dispersions in which the respective components are appropriately mixed may be prepared in advance, and these may be mixed at the time of use (at the time of application) to prepare the composition.

In addition, when the near-infrared absorbing dye represented by formula (SQ1) is a pigment, it is preferable to include a process of dispersing the pigment when preparing the resin composition. In the process of dispersing the pigment, examples of the mechanical force used to disperse the pigment include compression, squeezing, impact, shear, and cavitation. Specific examples of these processes include a bead mill, a sand mill, a roll mill, a ball mill, a paint shaker, a microfluidizer, a high-speed impeller, a sand grinder, a flow jet mixer, high-pressure wet atomization, and ultrasonic dispersion. In addition, in the grinding of the pigment in a sand mill (bead mill), it is preferable to use beads with a small diameter, increase the bead packing rate, and perform the process under conditions that increase the grinding efficiency. In addition, it is preferable to remove coarse particles by filtration, centrifugation, or the like after the grinding process. In addition, the process and dispersing machine for dispersing the pigment may be suitably used as described in "Dispersion Technology Encyclopedia, published by Information Technology Co., Ltd., July 15, 2005" or "Dispersion Technology and Industrial Application Practice Centered on Suspension (Solid/Liquid Dispersion System) Comprehensive Data Collection, published by Management Development Center Publishing Department, October 10, 1978" and the process and dispersing machine described in paragraph number 0022 of JP-A-2015-157893. In addition, in the process for dispersing the pigment, a salt milling process may be performed to refine the particles. The materials, equipment, processing conditions, etc. used in the salt milling process may be described in, for example, JP-A-2015-194521 and JP-A-2012-046629.

In addition, when preparing the resin composition, the compound represented by formula (AS1) may be added to the resin composition individually, or may be added to the resin composition in a form contained in any of the raw materials. Among them, it is preferable to add the compound represented by formula (AS1) to the resin composition in a form in which the compound represented by formula (AS1) is contained in the raw material containing the near-infrared absorbing pigment represented by formula (SQ1). According to this embodiment, the compound represented by formula (AS1) is more likely to approach the near-infrared absorbing pigment represented by formula (SQ1), and the effect of the present invention is more likely to be obtained. In addition, when the near-infrared absorbing pigment represented by formula (SQ1) is a pigment, if the compound represented by formula (AS1) is present during the crushing process represented by pigment dispersion, the compound represented by formula (AS1) is more likely to approach the near-infrared absorbing pigment represented by formula (SQ1), and the effect of the present invention is more likely to be obtained. In particular, by including formula (AS1) in the grinding process represented by salt milling of the pigment, an even more remarkable effect can be obtained.

When preparing a resin composition, it is preferable to filter the resin composition with a filter for the purpose of removing foreign matter and reducing defects. Any filter that has been conventionally used for filtering purposes can be used without any particular limitation. Examples include filters made of materials such as fluororesins such as polytetrafluoroethylene (PTFE), polyamide resins such as nylon (e.g. nylon-6, nylon-6,6), and polyolefin resins such as polyethylene and polypropylene (PP) (including high-density and ultra-high-molecular-weight polyolefin resins). Among these materials, polypropylene (including high-density polypropylene) and nylon are preferred.

The pore size of the filter is preferably 0.01 to 7.0 μm, more preferably 0.01 to 3.0 μm, and even more preferably 0.05 to 0.5 μm. If the pore size of the filter is within the above range, fine foreign matter can be removed more reliably. For the pore size value of the filter, the nominal value of the filter manufacturer can be referred to. Various filters provided by Nippon Pall Co., Ltd. (DFA4201NIEY, etc.), Advantech Toyo Co., Ltd., Nippon Integris Co., Ltd. (formerly Nippon Microlith Co., Ltd.), Kitz Microfilter Co., Ltd., etc. can be used.

It is also preferable to use a fibrous filter material as the filter. Examples of fibrous filter materials include polypropylene fiber, nylon fiber, and glass fiber. Commercially available products include the SBP type series (SBP008, etc.), TPR type series (TPR002, TPR005, etc.), and SHPX type series (SHPX003, etc.) manufactured by Roki Techno Co., Ltd.

When using a filter, different filters (e.g., a first filter and a second filter) may be combined. In this case, filtration with each filter may be performed only once or two or more times. Filters with different pore sizes within the above-mentioned range may be combined. Filtration with the first filter may be performed only on the dispersion liquid, and filtration with the second filter may be performed after mixing with other components.

<Membrane>
Next, the film of the present invention will be described. The film of the present invention is obtained from the above-mentioned resin composition of the present invention. The film of the present invention can be preferably used as a near-infrared cut filter or a near-infrared transmission filter. The film of the present invention can also be used as a heat ray shielding filter. The film of the present invention may have a pattern or may be a film (flat film) without a pattern. The film of the present invention may be used by laminating it on a support, or the film of the present invention may be used by peeling it off from the support. Examples of the support include a semiconductor substrate such as a silicon substrate and a transparent substrate.

The semiconductor substrate used as the support may have a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), a transparent conductive film, or the like formed thereon. The semiconductor substrate may also have a black matrix formed thereon to isolate each pixel. If necessary, the semiconductor substrate may also have an undercoat layer formed thereon to improve adhesion with the upper layer, prevent diffusion of substances, or flatten the substrate surface.

The transparent substrate used as the support is not particularly limited as long as it is made of a material that can transmit at least visible light. For example, the substrate may be made of a material such as glass or resin. Examples of resins include polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyolefin resins such as polyethylene, polypropylene, and ethylene-vinyl acetate copolymer, norbornene resins, acrylic resins such as polyacrylate and polymethyl methacrylate, urethane resins, vinyl chloride resins, fluororesins, polycarbonate resins, polyvinyl butyral resins, and polyvinyl alcohol resins. Examples of glass include soda-lime glass, borosilicate glass, alkali-free glass, quartz glass, and glass containing copper. Examples of glass containing copper include phosphate glass containing copper and fluorophosphate glass containing copper. Commercially available glass containing copper can also be used. Commercially available glass containing copper includes NF-50 (manufactured by AGC Technoglass Co., Ltd.).

The thickness of the film of the present invention can be adjusted appropriately depending on the purpose. The thickness of the film is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The lower limit of the thickness of the film is preferably 0.1 μm or more, and more preferably 0.2 μm or more.

When the film of the present invention is used as a near-infrared cut filter, the film of the present invention preferably has a maximum absorption wavelength in the range of 700 to 1800 nm (preferably 700 to 1300 nm, more preferably 700 to 1000 nm). In addition, the average transmittance of light having a wavelength of 400 to 600 nm is preferably 50% or more, more preferably 70% or more, even more preferably 80% or more, and particularly preferably 85% or more. In addition, the transmittance in the entire range of 400 to 600 nm is preferably 50% or more, more preferably 70% or more, and even more preferably 80% or more. In addition, the film of the present invention preferably has a transmittance of 15% or less at at least one point in the range of 700 to 1800 nm (preferably 700 to 1300 nm, more preferably 700 to 1000 nm), more preferably 10% or less, and even more preferably 5% or less. Furthermore, in the film of the present invention, the ratio _A1 / _A2 , which is the ratio of the maximum absorbance _A1 in the wavelength range of 400 to 600 nm to the absorbance _A2 at the maximum absorption wavelength, is preferably 0.30 or less, more preferably 0.20 or less, even more preferably 0.15 or less, and particularly preferably 0.10 or less.

When the film of the present invention is used as a near-infrared transmission filter, it is preferable that the film of the present invention has a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 830 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1300 nm. The film of the present invention used as a near-infrared transmission filter preferably satisfies either of the following spectral characteristics (1) or (2).
(1): The maximum transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1000 to 1300 nm is 70% or more (preferably 75% or more, more preferably 80% or more).
(2): The maximum transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1100 to 1300 nm is 70% or more (preferably 75% or more, more preferably 80% or more).

The film of the present invention can also be used in combination with a color filter containing a chromatic colorant. The color filter can be manufactured using a coloring composition containing a chromatic colorant. Examples of the chromatic colorant include the chromatic colorants listed as the colorants that may be contained in the resin composition of the present invention. In addition, the film of the present invention may contain a chromatic colorant to form a filter that functions as both a near-infrared cut filter and a color filter.

When the film of the present invention is used as a near-infrared cut filter and is used in combination with the film of the present invention and a color filter, it is preferable that the color filter is arranged on the optical path of the film of the present invention. For example, it is preferable to use the film of the present invention and a color filter as a laminate by laminating them. In the laminate, the film of the present invention and the color filter may or may not be adjacent to each other in the thickness direction. When the film of the present invention and the color filter are not adjacent to each other in the thickness direction, the film of the present invention may be formed on a support other than the support on which the color filter is formed, and other members constituting a solid-state imaging device (e.g., microlenses, planarization layers, etc.) may be interposed between the film of the present invention and the color filter.

The film of the present invention can be used in various devices such as solid-state imaging elements such as CCDs (charge-coupled devices) and CMOS (complementary metal-oxide semiconductors), infrared sensors, and image display devices.

<Membrane manufacturing method>
The film of the present invention can be produced via a step of applying the resin composition of the present invention.

Examples of the support include those mentioned above. Known methods can be used as a method for applying the resin composition. For example, the following can be used: a dropping method (drop casting); a slit coating method; a spray method; a roll coating method; a rotary coating method (spin coating); a casting coating method; a slit and spin method; a pre-wetting method (for example, the method described in JP-A-2009-145395); various printing methods such as ejection printing such as inkjet (for example, on-demand method, piezo method, thermal method), nozzle jet, flexographic printing, screen printing, gravure printing, reverse offset printing, and metal mask printing; a transfer method using a mold, etc.; and a nanoimprint method. The method of application in inkjet is not particularly limited, and examples thereof include the method described in “Expanding and Usable Inkjet - Infinite Possibilities Seen in Patents -”, published in February 2005 by Sumibe Techno Research (particularly pages 115 to 133) and the methods described in JP-A Nos. 2003-262716, 2003-185831, 2003-261827, 2012-126830, and 2006-169325.

The resin composition layer formed by applying the resin composition may be dried (prebaked). When prebaking is performed, the prebaking temperature is preferably 150°C or less, more preferably 120°C or less, and even more preferably 110°C or less. The lower limit can be, for example, 50°C or more, and can also be 80°C or more. The prebaking time is preferably 10 seconds to 3000 seconds, more preferably 40 to 2500 seconds, and even more preferably 80 to 220 seconds. Drying can be performed using a hot plate, oven, etc.

The film manufacturing method may further include a step of forming a pattern. Examples of the pattern forming method include a pattern forming method using a photolithography method and a pattern forming method using a dry etching method, and a pattern forming method using a photolithography method is preferred. When the film of the present invention is used as a flat film, the step of forming a pattern does not need to be performed. The step of forming a pattern will be described in detail below.

(When forming a pattern by photolithography)
The pattern forming method by photolithography preferably includes a step of exposing the resin composition layer formed by applying the resin composition of the present invention to light in a pattern (exposure step), and a step of developing and removing the unexposed resin composition layer to form a pattern (development step). If necessary, a step of baking the developed pattern (post-baking step) may be provided. Each step will be described below.

<<Exposure process>>
In the exposure step, the resin composition layer is exposed to light in a pattern. For example, the resin composition layer can be exposed to light in a pattern by using a stepper exposure machine or a scanner exposure machine through a mask having a predetermined mask pattern. This allows the exposed portion to be cured.

Examples of radiation (light) that can be used for exposure include g-line and i-line. Light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light with a wavelength of 300 nm or less include KrF line (wavelength 248 nm) and ArF line (wavelength 193 nm), with KrF line (wavelength 248 nm) being preferred. Long-wavelength light sources of 300 nm or more can also be used.

In addition, during exposure, light may be continuously irradiated to expose, or may be irradiated in a pulsed manner (pulse exposure). Incidentally, pulse exposure refers to an exposure method in which light irradiation and pause are repeated in a short cycle (for example, millisecond level or less). In the case of pulse exposure, the pulse width is preferably 100 nanoseconds (ns) or less, more preferably 50 nanoseconds or less, and even more preferably 30 nanoseconds or less. There is no particular limit to the lower limit of the pulse width, but it can be 1 femtosecond (fs) or more, and can also be 10 femtoseconds or more. The frequency is preferably 1 kHz or more, more preferably 2 kHz or more, and even more preferably 4 kHz or more. The upper limit of the frequency is preferably 50 kHz or less, more preferably 20 kHz or less, and even more preferably 10 kHz or less. The maximum instantaneous illuminance is preferably 50,000,000 W/m ² or more, more preferably 100,000,000 W/m ² or more, and even more preferably 200,000,000 W/m ² or more. The upper limit of the maximum instantaneous illuminance is preferably 100,000,000 W/m ² or less, more preferably 800,000,000 W/m ² or less, and even more preferably 500,000,000 W/m ² or less. The pulse width refers to the time during which light is irradiated in a pulse cycle. The frequency refers to the number of pulse cycles per second. The maximum instantaneous illuminance refers to the average illuminance during the time during which light is irradiated in a pulse cycle. The pulse cycle refers to a cycle in which light irradiation and pause in pulse exposure constitute one cycle.

The irradiation amount (exposure amount) is, for example, preferably 0.03 to 2.5 J/cm ² , more preferably 0.05 to 1.0 J/cm ^2. The oxygen concentration during exposure can be appropriately selected, and in addition to being performed under air, exposure may be performed under a low-oxygen atmosphere with an oxygen concentration of 19 volume% or less (e.g., 15 volume%, 5 volume%, or substantially oxygen-free), or under a high-oxygen atmosphere with an oxygen concentration of more than 21 volume% (e.g., 22 volume%, 30 volume%, or 50 volume%). The exposure illuminance can be appropriately set, and can usually be selected from the range of 1000 W/m ² to 100,000 W/m ² (e.g., 5,000 W/m ² , 15,000 W/m ² , or 35,000 W/m ² ). The oxygen concentration and exposure illuminance may be appropriately combined. For example, the oxygen concentration can be 10% by volume and the illuminance can be 10,000 W/m ² , and the oxygen concentration can be 35% by volume and the illuminance can be 20,000 W/m ² .

<<Developing process>>
Next, the resin composition layer in the unexposed portion of the resin composition layer after exposure is developed and removed to form a pattern. The resin composition layer in the unexposed portion can be developed and removed using a developer. As a result, the resin composition layer in the unexposed portion in the exposure step is dissolved into the developer, and only the photocured portion remains on the support. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. In addition, in order to improve the removability of residues, the process of shaking off the developer every 60 seconds and supplying new developer may be repeated several times.

Examples of the developer include organic solvents and alkaline developers, with alkaline developers being preferred. As the alkaline developer, an alkaline aqueous solution (alkaline developer) in which an alkaline agent is diluted with pure water is preferred. Examples of the alkaline agent include organic alkaline compounds such as ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, ethyltrimethylammonium hydroxide, benzyltrimethylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo[5.4.0]-7-undecene, and inorganic alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate, and sodium metasilicate. As the alkaline agent, compounds with a large molecular weight are preferred from the standpoint of environmental and safety. The concentration of the alkaline agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass. The developer may further contain a surfactant. As the surfactant, a nonionic surfactant is preferable. The developer may be produced as a concentrated solution once from the viewpoint of convenience of transportation and storage, and then diluted to a necessary concentration when used. The dilution ratio is not particularly limited, but can be set in the range of, for example, 1.5 to 100 times. It is also preferable to wash (rinse) with pure water after development. It is also preferable to rinse by supplying a rinsing liquid to the developed composition layer while rotating the support on which the developed composition layer is formed. It is also preferable to move the nozzle that ejects the rinsing liquid from the center of the support to the periphery of the support. In this case, the nozzle may be moved while gradually decreasing the moving speed when moving the nozzle from the center of the support to the periphery. By performing rinsing in this manner, it is possible to suppress in-plane variation in rinsing. The same effect can also be obtained by gradually decreasing the rotation speed of the support while moving the nozzle from the center to the periphery of the support.

After development and drying, it is preferable to perform additional exposure treatment or heating treatment (post-baking). Additional exposure treatment and post-baking are curing treatments after development to complete curing. The heating temperature in post-baking is preferably, for example, 100 to 240°C, more preferably 200 to 240°C. Post-baking can be performed continuously or batchwise using a heating means such as a hot plate, a convection oven (hot air circulation dryer), or a high-frequency heater to heat the developed film to the above conditions. When additional exposure treatment is performed, it is preferable that the light used for exposure has a wavelength of 400 nm or less. In addition, additional exposure treatment may be performed by the method described in Korean Patent Publication No. 10-2017-0122130.

(When forming a pattern by dry etching)
The pattern formation by the dry etching method can be performed by a method in which the above-mentioned resin composition is applied onto a support to form a resin composition layer, the resin composition layer is cured to form a cured layer, a patterned photoresist layer is formed on the cured layer, and the patterned photoresist layer is used as a mask to dry etch the cured layer using an etching gas. In forming the photoresist layer, it is preferable to perform a pre-bake treatment. For the pattern formation by the dry etching method, the description in paragraphs 0010 to 0067 of JP 2013-064993 A can be referred to, and the contents thereof are incorporated herein.

<Near infrared cut filter>
The near-infrared cut filter of the present invention has the film of the present invention described above. The near-infrared cut filter of the present invention preferably has an average transmittance of 70% or more, more preferably 80% or more, even more preferably 85% or more, and particularly preferably 90% or more for light having a wavelength of 400 to 600 nm. In addition, the transmittance in the entire range of wavelengths from 400 to 600 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. In addition, the preferred range of the near-infrared shielding property of the near-infrared cut filter varies depending on the application, but the transmittance at at least one point in the range of wavelengths from 700 to 1800 nm (preferably wavelengths from 700 to 1300 nm, more preferably wavelengths from 700 to 1000 nm) is preferably 20% or less, more preferably 15% or less, and even more preferably 10% or less.

In addition to the above-described film of the present invention, the near-infrared cut filter of the present invention may further include a copper-containing layer, a dielectric multilayer film, an ultraviolet absorbing layer, and the like. Examples of the ultraviolet absorbing layer include the absorbing layers described in paragraphs 0040 to 0070 and 0119 to 0145 of International Publication No. 2015/099060. Examples of the dielectric multilayer film include the dielectric multilayer film described in paragraphs 0255 to 0259 of JP-A-2014-041318. Examples of the copper-containing layer include a glass substrate (copper-containing glass substrate) made of glass containing copper, and a layer containing a copper complex (copper complex-containing layer). Examples of the copper-containing glass substrate include copper-containing phosphate glass and copper-containing fluorophosphate glass. Examples of commercially available copper-containing glass include NF-50 (manufactured by AGC Technoglass Co., Ltd.), BG-60, BG-61 (all manufactured by Schott Co., Ltd.), and CD5000 (manufactured by HOYA Co., Ltd.).

<Near infrared transmission filter>
The near-infrared transmission filter of the present invention has the above-mentioned film of the present invention. It is preferable that the near-infrared transmission filter of the present invention has a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 830 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1300 nm. It is preferable that the near-infrared transmission filter of the present invention satisfies either of the following spectral characteristics (1) or (2).
(1): The maximum transmittance in the wavelength range of 400 to 830 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1000 to 1300 nm is 70% or more (preferably 75% or more, more preferably 80% or more).
(2): The maximum transmittance in the wavelength range of 400 to 950 nm is 20% or less (preferably 15% or less, more preferably 10% or less), and the minimum transmittance in the wavelength range of 1100 to 1300 nm is 70% or more (preferably 75% or more, more preferably 80% or more).

<Solid-state imaging element>
The solid-state imaging device of the present invention includes the above-mentioned film of the present invention. The configuration of the solid-state imaging device is not particularly limited as long as it has the film of the present invention and functions as a solid-state imaging device. For example, the following configurations can be mentioned.

A configuration in which a plurality of photodiodes constituting the light receiving area of a solid-state imaging element and a transfer electrode made of polysilicon or the like are provided on a support, a light shielding film made of tungsten or the like with only the light receiving portion of the photodiode opened on the photodiode and the transfer electrode is provided on the light shielding film, a device protection film made of silicon nitride or the like formed on the light shielding film so as to cover the entire light shielding film and the light receiving portion of the photodiode is provided, and the film of the present invention is provided on the device protection film. Furthermore, a configuration in which a light collecting means (e.g., a microlens, etc.; the same applies below) is provided on the device protection film and below the film of the present invention (on the side closer to the support), or a configuration in which a light collecting means is provided on the film of the present invention, etc. may be provided. In addition, the color filter may have a structure in which a film forming each pixel is embedded in a space partitioned, for example, in a lattice shape by partition walls. In this case, it is preferable that the partition walls have a lower refractive index than each pixel. Examples of imaging devices having such a structure include the devices described in JP 2012-227478 A and JP 2014-179577 A.

<Image display device>
The image display device of the present invention includes the film of the present invention. Examples of the image display device include a liquid crystal display device and an organic electroluminescence (organic EL) display device. The definition and details of the image display device are described in, for example, "Electronic Display Device (written by Akio Sasaki, published by Kogyo Chosakai Co., Ltd. in 1990)" and "Display Device (written by Junsho Ibuki, published by Sangyo Tosho Co., Ltd. in 1989)". In addition, the liquid crystal display device is described in, for example, "Next Generation Liquid Crystal Display Technology (edited by Tatsuo Uchida, published by Kogyo Chosakai Co., Ltd. in 1994)". There is no particular limitation on the liquid crystal display device to which the present invention can be applied, and the present invention can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology". The image display device may have a white organic EL element. It is preferable that the white organic EL element has a tandem structure. The tandem structure of the organic EL element is described in, for example, JP 2003-045676 A and Akiyoshi Mikami (ed.), "The Frontline of Organic EL Technology Development - High Brightness, High Precision, Long Life, Know-How Collection", Technical Information Association, pp. 326-328, 2008. The spectrum of white light emitted by the organic EL element preferably has strong maximum emission peaks in the blue region (430-485 nm), green region (530-580 nm), and yellow region (580-620 nm). In addition to these emission peaks, it is more preferable that the spectrum has a maximum emission peak in the red region (650-700 nm).

<Infrared sensor>
The infrared sensor of the present invention includes the above-mentioned film of the present invention. The configuration of the infrared sensor is not particularly limited as long as it functions as an infrared sensor. Hereinafter, one embodiment of the infrared sensor of the present invention will be described with reference to the drawings.

In FIG. 1, reference numeral 110 denotes a solid-state imaging element. A near-infrared cut filter 111 and a near-infrared transmission filter 114 are disposed on the imaging region of the solid-state imaging element 110. A color filter 112 is disposed on the near-infrared cut filter 111. A microlens 115 is disposed on the incident light hν side of the color filter 112 and the near-infrared transmission filter 114. A planarization layer 116 is formed to cover the microlens 115.

The near-infrared cut filter 111 can be formed using the resin composition of the present invention. The spectral characteristics of the near-infrared cut filter 111 are selected according to the emission wavelength of the infrared light-emitting diode (infrared LED) to be used. The color filter 112 is a color filter in which pixels that transmit and absorb light of a specific wavelength in the visible range are formed, and is not particularly limited, and a conventionally known color filter for pixel formation can be used. For example, a color filter in which red (R), green (G), and blue (B) pixels are formed can be used. For example, the description in paragraphs 0214 to 0263 of JP 2014-043556 A can be referred to, and the contents of this specification can be incorporated herein. The characteristics of the near-infrared transmission filter 114 are selected according to the emission wavelength of the infrared LED to be used.

In the infrared sensor shown in FIG. 1, a near-infrared cut filter (another near-infrared cut filter) other than the near-infrared cut filter 111 may be further disposed on the planarization layer 116. Examples of the other near-infrared cut filter include those having a copper-containing layer and/or a dielectric multilayer film. Details of these are as described above. In addition, a dual bandpass filter may be used as the other near-infrared cut filter.

The present invention will be explained in more detail below with reference to examples. The materials, amounts used, ratios, processing contents, processing procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

<Preparation of Dispersion>
The raw materials shown in the table below were mixed in the amounts (parts by mass) shown in the table below, and 230 parts by mass of zirconia beads with a diameter of 0.3 mm were added. Dispersion treatment was carried out for 5 hours using a paint shaker, and the beads were separated by filtration to produce a dispersion. The values shown in the column of the amount of mixture in the table below are parts by mass. The values in the column of "NMP and DMAc content (ppm by mass)" in the table below are the values of the total content (ppm by mass) of N-methylpyrrolidone (NMP) and dimethylacetamide (DMAc) in the dispersion.

The abbreviations for the materials listed in the table above are as follows:
(Coloring material)

P-1, P-2, P-3, P-4, P-5, P-6, P-7, P-8, P-9, P-10, P-1, P-12, P-13, P-14, P-15, P-16: Compounds having the following structure (near-infrared absorbing dyes represented by any of formulas (SQ1))

P-1-A: Colorant P-1-A produced by the following method
550 parts by mass of N-methylpyrrolidone was added to 100 parts by mass of compound P-1, and the mixture was stirred at 25° C. for 3 hours. Next, 300 parts by mass of methanol was added and the mixture was stirred for 10 minutes. The resulting precipitate was filtered, washed with methanol, and dried under reduced pressure to produce a color material P-1-A containing compound P-1 and N-methylpyrrolidone. The content of N-methylpyrrolidone in the color material P-1-A was 250 ppm by mass.

P-1-B: Colorant P-1-B produced by the following method
550 parts by mass of N-methylpyrrolidone was added to 100 parts by mass of compound P-1, and the mixture was stirred at 25° C. for 3 hours. Next, 300 parts by mass of methanol was added and the mixture was stirred for 10 minutes. The resulting precipitate was filtered, washed with methanol, and dried under reduced pressure to produce a color material P-1-B containing compound P-1 and N-methylpyrrolidone. The content of N-methylpyrrolidone in the color material P-1-B was 2500 ppm by mass.

P-1-C: Colorant P-1-C produced by the following method
550 parts by mass of dimethylacetamide was added to 100 parts by mass of compound P-1, and the mixture was stirred at 25° C. for 3 hours. Next, 300 parts by mass of methanol was added and the mixture was stirred for 10 minutes. The resulting precipitate was filtered, washed with methanol, and dried under reduced pressure to produce a color material P-1-C containing compound P-1 and dimethylacetamide. The content of dimethylacetamide in the color material P-1-C was 250 ppm by mass.

P-1-D: Colorant P-1-D produced by the following method
550 parts by mass of N-methylpyrrolidone was added to 100 parts by mass of compound P-1, and the mixture was stirred at 25° C. for 3 hours. Next, 300 parts by mass of methanol was added and the mixture was stirred for 10 minutes. The resulting precipitate was filtered, washed with methanol, and dried under reduced pressure to produce color material P-1-D1 containing compound P-1 and N-methylpyrrolidone. The content of N-methylpyrrolidone in color material P-1-D1 was 2500 ppm by mass.
Next, 5.3 parts by mass of colorant P-1-D1, 74.7 parts by mass of grinding agent, and 14 parts by mass of binder were added to a Labo Plastomill (manufactured by Toyo Seiki Seisakusho Co., Ltd.), and the temperature of the kneaded material in the device was controlled to 70°C, and kneaded for 2 hours. The grinding agent was Osiomicron T-0 (average particle size (volume-based 50% diameter (D50)) = 10 μm, manufactured by Ako Kasei Co., Ltd.), and the binder was diethylene glycol. The kneaded material after kneading and grinding was washed with 10 L of water at 24°C to remove the grinding agent and the binder, and treated in a heating oven at 80°C for 24 hours to produce colorant P-1-D containing compound P-1 and N-methylpyrrolidone. The content of N-methylpyrrolidone in colorant P-1-D was 250 ppm by mass.

P-17: C.I. Pigment Red 254 (red pigment)
P-18: C.I. Pigment Blue 15:6 (blue pigment)
P-19: C.I. Pigment Yellow 139 (yellow pigment)
P-20: C.I. Pigment Violet 23 (purple pigment)
P-21: Irgaphor Black (manufactured by BASF, bisbenzofuranone compound, organic black colorant)
P-22: Limogen Black (manufactured by BASF, perylene compound, organic black colorant)

(Dye Derivatives)
Sy-1 to Sy-8: Compounds having the following structures

(resin)
D-1: Block type resin having the following structure (amine value = 90 mg KOH/g, quaternary ammonium salt value = 30 mg KOH/g, weight average molecular weight = 9800). The numbers added to the main chain indicate the molar ratio of the repeating unit.
D-4: Resin having the following structure (weight average molecular weight = 7500, the appended numbers indicate the molar ratio of repeating units)
B-1: Resin having the following structure (weight average molecular weight = 26,000, the appended numbers indicate the molar ratio of repeating units)
B-2: Resin having the following structure (weight average molecular weight = 10,000, the number added to the main chain indicates the molar ratio of the repeating unit.)

(solvent)
S-1: Propylene glycol methyl ether acetate (PGMEA)
X-1: N-methylpyrrolidone (NMP)

<Preparation of Resin Composition>
The raw materials shown in the table below were mixed to prepare a resin composition. The values shown in the column for blend amount in the table below are parts by mass. The values in the column for "NMP and DMAc content (ppm by mass)" in the table below are the values for the total content (ppm by mass) of N-methylpyrrolidone (NMP) and dimethylacetamide (DMAc) in the resin composition.

The abbreviations for the materials listed in the table above are as follows:

(Dispersion)
Dispersions 1 to 49: Dispersions 1 to 49 described above

(Polymerizable compound)
M-1: NK Ester A-TMPT (manufactured by Shin-Nakamura Chemical Co., Ltd.)
M-2: Aronix M-350 (manufactured by Toagosei Co., Ltd.)
M-3: NK Ester A-TMMT (manufactured by Shin-Nakamura Chemical Co., Ltd.)
M-4: Aronix M-403 (manufactured by Toagosei Co., Ltd.)
M-5: Aronix M-510 (manufactured by Toagosei Co., Ltd.)

(resin)
B-1, B-2: Resins B-1 and B-2 described above
B-3: Resin having the following structure (weight average molecular weight = 10,000, the number added to the main chain indicates the molar ratio of the repeating unit.)

(Photopolymerization initiator)
I-1: IRGACURE-907 (manufactured by BASF)
I-2: IRGACURE-OXE01 (manufactured by BASF)
I-3: IRGACURE-OXE02 (manufactured by BASF)
I-4 and I-5: Compounds having the following structures

(Additives)
A-1: 4,4'-bis(diethylamino)benzophenone (sensitizer)
A-2: Irganox 1010 (manufactured by BASF, antioxidant)
A-3: EX-611 (manufactured by Nagase ChemteX, epoxy hardener)
A-4: KBM-502 (Shin-Etsu Silicone Co., Ltd., silane coupling agent)

(Surfactant)
Su-1: Compound having the following structure (Mw=14,000, in the following formula, % indicating the proportion of repeating units is mol %)
Su-2: Futergent FTX218 (manufactured by Neos Co., Ltd.)
Su-3: Megafac F-554 (manufactured by DIC Corporation)
Su-4: KF-6001 (manufactured by Shin-Etsu Silicone Co., Ltd.)

(Polymerization inhibitor)
In-1: p-methoxyphenol In-2: 1,4-benzoquinone

(solvent)
S-1: Propylene glycol methyl ether acetate (PGMEA)
S-2: Propylene glycol methyl ether (PGME)
S-3: Cyclohexanone X-1: N-methylpyrrolidone (NMP)
X-2: Dimethylacetamide (DMAc)

<Performance evaluation>
(Light resistance)
Each resin composition was applied onto a glass substrate using a spin coater (manufactured by Mikasa Co., Ltd.) so that the film thickness after pre-baking was 0.8 μm to form a coating film. Next, after heating (pre-baking) at 100 ° C. for 120 seconds using a hot plate, the entire surface was exposed to light at an exposure dose of 1000 mJ / cm ² using an i-line stepper exposure device FPA-3000i5 + (manufactured by Canon Co., Ltd.), and then heating (post-baking) at 200 ° C. for 300 seconds using a hot plate was performed again to obtain a film. The obtained film was placed in a light resistance tester (illuminance 0.5 million Lx, temperature 50 ° C., humidity 50%) for 6 months, and a light resistance test was performed. The transmittance T% of light with a wavelength of 400 to 1300 nm was measured for the film before and after the light resistance test, and the difference ΔT% = | T% (before light resistance test) - T% (after light resistance test) | was obtained, and the light resistance was evaluated according to the following criteria.
5: ΔT% < 3%
4:3%≦ΔT%<5%
3:5%≦ΔT%<10%
2:10%≦ΔT%<20%
1: 20%≦ΔT%

(Storage stability)
The resin composition immediately after production was stored at 7°C for 9 months, and then spin-coated onto an 8-inch (20.32 cm) silicon wafer using CLEAN TRACK ACT-8 (Tokyo Electron Co., Ltd.), followed by pre-heating (pre-baking) at 100°C for 120 seconds to produce a film with a thickness of 0.8 μm. The silicon wafer on which the film was formed was inspected with a defect inspection device ComPLUS3 manufactured by Applied Materials Technology Co., Ltd. to detect defective portions, and the number of defects with a size of 1 μm or more per 2462 ^cm2 was extracted.
5: The number of defects is 5 or less. 4: The number of defects is more than 5 but not more than 20. 3: The number of defects is more than 20 but not more than 50. 2: The number of defects is more than 50 but not more than 100. 1: The number of defects is more than 100.

(Coating ability)
The resin composition immediately after production was spin-coated onto an 8-inch (20.32 cm) silicon wafer using a CLEAN TRACK ACT-8 (manufactured by Tokyo Electron Co., Ltd.), followed by pre-heating (pre-baking) at 100°C for 120 seconds to produce a film with a thickness of 0.8 μm. The entire surface was exposed to light at an exposure dose of 1000 mJ/ ^cm2 using an i-line stepper exposure device FPA-3000i5+ (manufactured by Canon Corporation), and then heated again at 200°C for 300 seconds (post-baking) using a hot plate to obtain a film. The film thickness of the obtained film at the center and at a portion 2 cm from the periphery was evaluated using a stylus film thickness measurement system DEKTAK (manufactured by Bluker), and the ratio (FTcenter/FTedge) of the film thickness at the center (FTcenter) to the film thickness at a portion 2 cm from the periphery was calculated, and the coatability was evaluated according to the following criteria.
A: 0.9<FTcenter/FTedge<1.1
B: 0.9 ≥ FTcenter / FTedge, or 1.1 ≤ FTcenter / FTedge

As shown in the table above, the examples were evaluated as excellent in terms of light resistance and storage stability. Furthermore, the coatability was also good. In Comparative Example 2, the content of N-methylpyrrolidone was changed to 0.0008 ppm and the evaluation was similar, but the results were similar to those of Comparative Example 2. In Comparative Example 3, the content of N-methylpyrrolidone was changed to 1500 ppm and the evaluation was similar, but the results were similar to those of Comparative Example 3.

(Example 1001)
The resin composition of Example 101 was applied by spin coating on a silicon wafer so that the film thickness after film formation was 1.0 μm. Then, using a hot plate, it was heated at 100 ° C. for 2 minutes. Then, using an i-line stepper exposure device FPA-3000i5 + (Canon Corporation), it was exposed at an exposure amount of 1000 mJ / cm ^2. Then, it was heated at 200 ° C. for 5 minutes to form a near-infrared cut filter. Next, on the near-infrared cut filter, the Red composition was applied by spin coating so that the film thickness after film formation was 1.0 μm. Then, using a hot plate, it was heated at 100 ° C. for 2 minutes. Then, using an i-line stepper exposure device FPA-3000i5 + (Canon Corporation), it was exposed at an exposure amount of 1000 mJ / cm ² through a mask having a 2 μm square Bayer pattern. Next, paddle development was performed at 23° C. for 60 seconds using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH). After that, rinsing was performed with a spin shower, and further washing with pure water was performed. Next, the Red composition was patterned on the near-infrared cut filter by heating at 200° C. for 5 minutes using a hot plate. Similarly, the Green composition and the Blue composition were patterned in sequence to form red, green and blue colored patterns, and a structure was manufactured. This structure was incorporated into a solid-state imaging device according to a known method. This solid-state imaging device had suitable image recognition ability. In addition, the incidence angle dependency was good.

The Red composition, Green composition and Blue composition used in Example 1001 are as follows.

(Red composition)
The following components were mixed and stirred, and then filtered through a nylon filter having a pore size of 0.45 μm (manufactured by Nippon Pall Co., Ltd.) to prepare a Red composition.
Red pigment dispersion: 51.7 parts by weight Resin 1: 0.6 parts by weight Polymerizable compound 2: 0.6 parts by weight Photopolymerization initiator 1: 0.4 parts by weight Surfactant 1: 4.2 parts by weight Ultraviolet absorber (UV-503, manufactured by Daito Chemical Co., Ltd.): 0.3 parts by weight Propylene glycol monomethyl ether acetate (PGMEA): 42.6 parts by weight

(Green composition)
The following components were mixed and stirred, and then filtered through a nylon filter having a pore size of 0.45 μm (manufactured by Nippon Pall Co., Ltd.) to prepare a Green composition.
Green pigment dispersion 73.7 parts by weight Resin 1 0.3 parts by weight Polymerizable compound 1 1.2 parts by weight Photopolymerization initiator 1 0.6 parts by weight Surfactant 1 4.2 parts by weight Ultraviolet absorber (UV-503, manufactured by Daito Chemical Co., Ltd.) 0.5 parts by weight PGMEA 19.5 parts by weight

(Blue Composition)
The following components were mixed and stirred, and then filtered through a nylon filter having a pore size of 0.45 μm (manufactured by Nippon Pall Co., Ltd.) to prepare a Blue composition.
Blue pigment dispersion 44.9 parts by weight Resin 1 2.1 parts by weight Polymerizable compound 1 1.5 parts by weight Polymerizable compound 2 0.7 parts by weight Photopolymerization initiator 1 0.8 parts by weight Surfactant 1 4.2 parts by weight Ultraviolet absorber (UV-503, manufactured by Daito Chemical Co., Ltd.) 0.3 parts by weight PGMEA 45.8 parts by weight

The raw materials used for the Red, Green and Blue compositions are as follows:

Red pigment dispersion A mixture of 9.6 parts by mass of C.I. Pigment Red 254, 4.3 parts by mass of C.I. Pigment Yellow 139, 6.8 parts by mass of dispersant (Disperbyk-161, manufactured by BYK Chemie), and 79.3 parts by mass of PGMEA was mixed and dispersed for 3 hours by a bead mill (zirconia beads 0.3 mm diameter) to prepare a pigment dispersion. Thereafter, a dispersion treatment was performed at a flow rate of 500 g/min under a pressure of 2000 kg/cm ³ using a high-pressure disperser NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) equipped with a pressure reducing mechanism. This dispersion treatment was repeated 10 times to obtain a red pigment dispersion.

Green pigment dispersion A mixture consisting of 6.4 parts by mass of C.I. Pigment Green 36, 5.3 parts by mass of C.I. Pigment Yellow 150, 5.2 parts by mass of a dispersant (Disperbyk-161, manufactured by BYK Chemie), and 83.1 parts by mass of PGMEA was mixed and dispersed for 3 hours using a bead mill (zirconia beads 0.3 mm diameter) to prepare a pigment dispersion. Thereafter, a dispersion treatment was performed using a high-pressure disperser NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) equipped with a pressure reducing mechanism at a flow rate of 500 g/min under a pressure of 2000 kg/cm ^3. This dispersion treatment was repeated 10 times to obtain a Green pigment dispersion.

・Blue pigment dispersion A mixture consisting of 9.7 parts by mass of C.I. Pigment Blue 15:6, 2.4 parts by mass of C.I. Pigment Violet 23, 5.5 parts by mass of dispersant (Disperbyk-161, manufactured by BYK Chemie), and 82.4 parts by mass of PGMEA was mixed and dispersed for 3 hours by a bead mill (zirconia beads 0.3 mm diameter) to prepare a pigment dispersion. Thereafter, a dispersion treatment was performed using a high-pressure disperser NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) with a pressure reducing mechanism at a flow rate of 500 g/min under a pressure of 2000 kg/cm ^3. This dispersion treatment was repeated 10 times to obtain a Blue pigment dispersion.

Polymerizable compound 1: KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.)
Polymerizable compound 2: a compound having the following structure

Resin 1: Resin having the following structure (acid value: 70 mg KOH/g, Mw=11,000, ratio of structural units is molar ratio)

Photopolymerization initiator 1: IRGACURE-OXE01 (manufactured by BASF)

Surfactant 1: 1 mass % PGMEA solution of the following mixture (Mw = 14,000): In the following formula, % indicating the proportion of repeating units is mol %.

110: solid-state imaging element, 111: near-infrared cut filter, 112: color filter, 114: near-infrared transmission filter, 115: microlens, 116: planarization layer

Claims (18)

A near infrared absorbing dye represented by the following formula (SQ1),
A compound represented by the following formula (AS1) in an amount of 0.1 to 10 ppm by mass,
Resin and
A resin composition comprising:
In the formula, Rs ¹¹⁹ and Rs ¹²⁰ each independently represent a substituent.
A ¹ and A ² each independently represent an oxygen atom or -N(Rs ¹²⁵ )-;
Rs ¹²¹ to Rs ¹²⁵ each independently represent a hydrogen atom or a substituent;
^E1 and ^E2 each independently represent a carbon atom, a boron atom, or -C(=O)-;
When E ¹ is a carbon atom, ns32 is 2, when E 1 is a boron atom, ns32 is 1, and when E 1 is -C(=O)-, ns32 is 0;
When E ² is a carbon atom, ns33 is 2, when E 2 is a boron atom, ns33 is 1, and when E 2 is -C(=O)-, ns33 is 0;
ns30 and ns31 each independently represent an integer of 0 to 5;
when ns30 is 2 or more, a plurality of ^{Rs 119} may be the same or different, or two of the plurality of Rs ¹¹⁹ may be bonded to each other to form a ring,
when ns31 is 2 or more, a plurality of ^{Rs 120} may be the same or different, and two of the plurality of Rs ¹²⁰ may be bonded to each other to form a ring,
when ns32 is 2, two Rs ¹²¹ may be the same or different, or two Rs ¹²¹ may be bonded to each other to form a ring;
when ns33 is 2, two Rs ¹²² may be the same or different, or two Rs ¹²² may be bonded to each other to form a ring;
Ar ¹⁰⁰ represents an arylene group or a heteroarylene group;
nslOO represents an integer of 0 to 2;
In formula (AS1), ^R represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, or a heterocyclic group; ^R and ^R each independently represent an alkyl group, an alkenyl group, an ^aryl group, or a heterocyclic group, and R and ^R may be bonded to each other to form a ring, and ^R and ^R may be bonded to each other to form a ring. The resin composition according to claim 1, wherein at least one of R ^A2 and R ^A3 in formula (AS1) is an alkyl group. The resin composition according to claim 1, wherein R ^A1 to R ^A3 in formula (AS1) each independently represent an alkyl group, or R ^A3 represents an alkyl group, and R ^A2 and R ^A3 are bonded to each other to form a ring. The resin composition according to claim 1, wherein the compound represented by formula (As1) is at least one selected from N-methylpyrrolidone and dimethylacetamide. A near infrared absorbing dye represented by the following formula (SQ1),
0.001 to 8 ppm by mass of dimethylacetamide;
Resin and
A resin composition comprising:
In the formula, Rs ¹¹⁹ and Rs ¹²⁰ each independently represent a substituent.
A ¹ and A ² each independently represent an oxygen atom or -N(Rs ¹²⁵ )-;
Rs ¹²¹ to Rs ¹²⁵ each independently represent a hydrogen atom or a substituent;
^E1 and ^E2 each independently represent a carbon atom, a boron atom, or -C(=O)-;
When E ¹ is a carbon atom, ns32 is 2, when E 1 is a boron atom, ns32 is 1, and when E 1 is -C(=O)-, ns32 is 0;
When E ² is a carbon atom, ns33 is 2, when E 2 is a boron atom, ns33 is 1, and when E 2 is -C(=O)-, ns33 is 0;
ns30 and ns31 each independently represent an integer of 0 to 5;
when ns30 is 2 or more, a plurality of ^{Rs 119} may be the same or different, or two of the plurality of Rs ¹¹⁹ may be bonded to each other to form a ring,
when ns31 is 2 or more, a plurality of ^{Rs 120} may be the same or different, and two of the plurality of Rs ¹²⁰ may be bonded to each other to form a ring,
when ns32 is 2, two Rs ¹²¹ may be the same or different, or two Rs ¹²¹ may be bonded to each other to form a ring;
when ns33 is 2, two Rs ¹²² may be the same or different, or two Rs ¹²² may be bonded to each other to form a ring;
Ar ¹⁰⁰ represents an arylene group or a heteroarylene group;
ns100 represents an integer of 0 to 2. The resin composition according to claim 5, containing 0.1 to 8 ppm by mass of dimethylacetamide. The resin composition according to any one of claims 1 to 6, wherein the near infrared absorbing dye represented by formula (SQ1) is a near infrared absorbing dye represented by formula (SQ2):
In the formula, L ⁴¹ to L ⁴⁴ each independently represent an alkylene group, an alkynylene group, an arylene group, a heterocyclic group, or a divalent group formed by bonding two or more of these groups together;
Z ⁴¹ and Z ⁴² each independently represent a single bond, —O—, —C(═O)—, —S—, —N(R ^N1 )—, —S(═O)—, or —S(═O) ₂ —;
A ⁴¹ and A ⁴² each independently represent an oxygen atom or -N(R ^N2 )-;
R ^N1 and R ^N2 each independently represent a hydrogen atom, an alkyl group, or an aryl group;
Rs ¹⁴¹ and Rs ¹⁴² each independently represent a substituent;
ns41 and ns42 each independently represent an integer of 0 to 5;
when ns41 is 2 or more, a plurality of ^{Rs 141} may be the same or different, or two of the plurality of Rs ¹⁴¹ may be bonded to each other to form a ring;
When ns42 is 2 or more, a plurality of ^{Rs 142} may be the same or different, and two of the plurality of Rs ¹⁴² may be bonded to each other to form a ring;
However, when L ⁴¹ to L ⁴⁴ are alkylene groups, Z ⁴¹ and Z ⁴² are single bonds, and A ⁴¹ and A ⁴² are —N(R ^N2 )—, at least one of ns41 and ns42 is an integer of 1 to 5. The resin composition according to any one of claims 1 to 6, wherein the near infrared absorbing dye represented by formula (SQ1) is a near infrared absorbing dye represented by formula (SQ3).
In the formula, Q ¹ , Q ⁴ , Q ⁵ , Q ⁸ , Q ¹¹ , Q ¹⁴ , Q ¹⁵ and Q ¹⁸ each independently represent a carbon atom or a nitrogen atom;
Rs ¹ to Rs ⁵ and Rs ¹¹ to Rs ¹⁵ each independently represent a hydrogen atom, an alkyl group, a sulfo group, —SO ₃ M ¹ or a halogen atom, M ¹ represents an inorganic or organic cation, Rs ² and Rs ³ , and Rs ¹² and Rs ¹³ may be bonded to each other to form a ring;
Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ each independently represent a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, a hydroxy group, -NR ^X1 R ^X2 , a sulfo group, -SO ₃ M ² , -SO ₂ NR ^X1 R ^X2 , -COOR ^X3 , -CONR ^X1 R ^X2 , a nitro group, a cyano group, or a halogen atom, M ² represents an inorganic or organic cation, R ^X1 to R ^X3 each independently represent a hydrogen atom, an alkyl group, an aryl group, an acyl group, or a heterocyclic group, R ^X1 and R ^X2 may be bonded to each other to form a ring, and adjacent groups among Rs ²¹ to Rs ²⁸ and Rs ³¹ to Rs ³⁸ may be bonded to each other to form a ring;
When ^Q1 is a nitrogen atom, ^Rs21 is not present, when ^Q4 is a nitrogen atom, ^Rs24 is not present, when ^Q5 is a nitrogen atom, ^Rs25 is not present, when ^Q8 is a nitrogen atom, ^Rs28 is not present, when ^Q11 is a nitrogen atom, ^Rs31 is not present, when ^Q14 is a nitrogen atom, ^Rs34 is not present, when ^Q15 is a nitrogen atom, ^Rs35 is not present, and when ^Q18 is a nitrogen atom, ^Rs38 is not present. The resin composition according to any one of claims 1 to 8, wherein the resin includes a resin having a basic group. The resin composition according to any one of claims 1 to 9, wherein the resin includes an alkali-soluble resin. The resin composition according to any one of claims 1 to 10, further comprising a polymerizable compound and a photopolymerization initiator. The resin composition according to any one of claims 1 to 11, further comprising a coloring material that transmits near-infrared light and blocks visible light. A film obtained using the resin composition according to any one of claims 1 to 12. A near-infrared cut filter having the film according to claim 13. A near-infrared transmission filter having the film according to claim 13. A solid-state imaging device having the film according to claim 13. An image display device having the film according to claim 13. An infrared sensor having the film according to claim 13.