JP7629790B2 - Cleaning tool and method for cleaning cover member - Google Patents

Description

The present invention relates to a cleaning tool for removing foreign matter adhering to the cover member of a tape expansion device and a method for cleaning the cover member.

A wafer with multiple devices formed on its surface is divided into multiple device chips corresponding to each device by, for example, cutting or laser processing along the planned division lines (streets). In order to stack and fix this device chip on top of another device chip, an adhesive layer for fixing may be provided on the back side of the device chip. The adhesive layer on the back side is brought into close contact with the object to be fixed, and an external stimulus such as heat or light is applied, thereby hardening the adhesive layer and fixing the device chip. For example, a film-like adhesive for die bonding called a die attach film (DAF) is used as the adhesive layer.

This film adhesive is formed to a size that covers the entire back surface of the wafer, and is attached to the back surface of the wafer before it is divided. After the film adhesive is attached to the back surface of the wafer, this film adhesive is cut together with the wafer to form a device chip with an adhesive layer on the back surface.

However, when processing methods such as DBG (Dicing Before Grinding), which does not fully cut the wafer, or SDBG (Stealth Dicing Before Grinding), which focuses a laser beam inside the wafer to form a modified layer by multiphoton absorption, are used, there is no process of dividing the film-like adhesive together with the wafer. Therefore, a method of breaking a film-like adhesive has been proposed in which the film-like adhesive is attached to an expanding tape, cooled sufficiently, and then the expanding tape is expanded (see, for example, Patent Document 1). In this breaking method, the elasticity of the film-like adhesive is reduced by cooling, so that the film-like adhesive can be easily broken simply by expanding the expanding tape. In order to prevent the broken pieces of the film-like adhesive outside the wafer from adhering to the wafer device (particularly the electrode portion) when the film-like adhesive is expanded, it has been proposed to provide a cover member that covers the film-like adhesive from above on the tape expanding device (see, for example, Patent Document 2).

JP 2007-027250 A JP 2016-012585 A

However, there was a problem in that scraps of the film-like adhesive attached to the cover member could fall off and adhere to the wafer.

The present invention was made in consideration of these problems, and its purpose is to provide a cleaning tool and a method for cleaning a cover member that can clean a cover member to which a film-like adhesive has adhered.

In order to solve the above problems and achieve the object, the cleaning tool of the present invention is a tape expansion device that breaks a film-like adhesive attached to the backside of a wafer in which a break origin is formed along a planned division line or a wafer divided into individual chips along a planned division line, while the film-like adhesive is attached to an expanding tape attached to an opening of an annular frame, along the planned division line. The tape expansion device includes a frame holding unit that holds the annular frame, a push-up unit that pushes up the expanding tape attached to the annular frame held by the frame holding unit to break the film-like adhesive, and a cover member that prevents the film-like adhesive from scattering when the portion of the film-like adhesive protruding from the wafer breaks. The cleaning tool removes fragments of the film-like adhesive attached to the cover member, and is characterized in that it includes the annular frame and an adhesive annular capture sheet attached to the opening of the annular frame.

In order to solve the above-mentioned problems and achieve the object, the method for cleaning a cover member of the present invention is a method for cleaning a cover member using the above-mentioned cleaning tool, characterized in that it has a holding step in which the annular frame of the cleaning tool is held by the frame holding unit, and a moving step in which the push-up unit relatively moves the capture sheet and the cover member between a standby position where they are spaced apart from each other and a contact position where they come into contact with each other and the capture sheet captures the film-like adhesive debris adhering to the cover member.

In the moving step, the push-up unit may move the capture sheet and the cover member relatively multiple times between the standby position and the contact position while changing the speed.

The present invention can clean cover members that have film-like adhesive attached to them.

FIG. 1 is a perspective view showing an example of the configuration of a cleaning tool according to an embodiment. FIG. 2 is a perspective view illustrating the fabrication of the cleaning jig of FIG. FIG. 3 is an exploded perspective view showing an example of the configuration of a tape expanding device in which the cleaning tool of FIG. 1 is used. FIG. 4 is a perspective view showing an example of the configuration of a wafer to which an expandable tape, which is an object to be expanded by the tape expanding device of FIG. 3, is attached. FIG. 5 is a cross-sectional view showing the main part of the tape expanding device of FIG. 3 in a state before the expanding tape is expanded. FIG. 6 is a cross-sectional view showing a state in which the expanding tape of the main part of the tape expanding device of FIG. 3 is being expanded. FIG. 7 is a flowchart illustrating an example of a process of a method for cleaning a cover member according to the embodiment. FIG. 8 is a cross-sectional view illustrating a method for cleaning the cover member according to the embodiment. FIG. 9 is a cross-sectional view illustrating a method for cleaning the cover member according to the embodiment. FIG. 10 is a cross-sectional view illustrating a method for cleaning the cover member according to the embodiment.

The following describes in detail the form (embodiment) for carrying out the present invention with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. The components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Various omissions, substitutions, or modifications of the configuration can be made without departing from the spirit of the present invention.

[Embodiment]
A cleaning tool 1 according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the cleaning tool 1 according to the embodiment. FIG. 2 is a perspective view explaining the fabrication of the cleaning tool 1 of FIG. 1. As shown in FIG. 1, the cleaning tool 1 according to the embodiment includes an annular frame 2 and an annular capture sheet 3. The cleaning tool 1 is for removing pieces of a film-like adhesive 205 (see FIG. 4) attached to a cover member 130 (see FIG. 3, etc.) of a tape expansion device 100 (see FIG. 3, etc.) described later.

The annular frame 2 has the same shape as the annular frame 207 (see FIG. 4) used to support the wafer 200 (see FIG. 4) that is attached via a film-like adhesive 205 to the expanding tape 206 (see FIG. 4) expanded by the tape expanding device 100 in which the cleaning jig 1 is used, and as shown in FIG. 1, is formed in a plate shape with a circular opening 5 in the center whose inner diameter is larger than the outer diameter of the wafer 200. In this embodiment, the annular frame 2 is made of metal, for example, SUS (Steel Use Stainless).

As shown in FIG. 1, the annular capture sheet 3 has adhesiveness on one side and is attached to the opening 5 of the annular frame 2. The annular capture sheet 3 covers the outer peripheral area inside the opening 5 of the annular frame 2. The annular capture sheet 3 has a circular opening 6 in the center, the inner diameter of which is smaller than or equal to the outer diameter of the wafer 200. The upper surface 7 of the capture sheet 3 on the outer peripheral side of the opening 5 and the inner peripheral side of the opening 6 to which the annular frame 2 is attached is an adhesive surface. In this embodiment, the annular capture sheet 3 is an adhesive tape having a glue layer formed on one side of the base layer, but the present invention is not limited to this, and may be a tape similar to the expand tape 206, or may be a sheet that does not have an adhesive layer and is formed only of a base layer of a thermoplastic resin such as polyolefin, polyethylene, polypropylene, polystyrene, a copolymer of propylene and ethylene, or an olefin-based elastomer, and exhibits adhesion in response to heating or pressure bonding.

The cleaning tool 1 is prepared by preparing an annular frame 2, attaching a capture sheet 3 to one side of the annular frame 2 so as to cover the entire opening 5 of the annular frame 2, and cutting the attached capture sheet 3 into a circle with a cutter 19 or the like to form an opening 6. A cutting tool 10 is used to cut the capture sheet 3. As shown in FIG. 2, the cutting tool 10 includes a main body 11 in which a cross-shaped portion 15 inscribed in the opening 5 of the annular frame 2 and a circular portion 16 inscribed in the opening 6 of the annular capture sheet 3 are integrally formed in a flat plate shape, and a handle portion 12 formed on one side of the main body 11. In this embodiment, the main body 11 is made of metal, for example, SUS. A special coating is applied to the side of the main body 11 opposite to the side on which the handle portion 12 is formed, and this special coating makes it difficult for the main body 11 to be attached to the capture sheet 3. The opening 6 of the cleaning jig 1 is formed by attaching the capture sheet 3 to the annular frame 2, and then, as shown in FIG. 2, placing the cutting jig 10 with the specially coated side facing the capture sheet 3, in a position where the cross-shaped portion 15 is inscribed in the opening 5 of the annular frame 2, and moving the cutter 19 along the outer periphery of the circular portion 16 to cut the capture sheet 3.

The cutting jig 10 comes into contact with the adhesive surface of the capture sheet 3, so a small contact area with the capture sheet 3 is preferable because it is easier to peel off and does not reduce the adhesive strength of the capture sheet 3. Also, since it is necessary to position the cutout position based on the inner diameter of the annular frame 2, the cross-shaped portion 15 plays the role of positioning, and the circular portion indicates the cutout line. However, the shape of the cutting jig is not limited to this. For example, the cutting jig may be an annular plate-like object, the outer diameter of which comes into contact with the inner diameter of the annular frame 2, the inner diameter of which is the same shape as the inner diameter of the annular capture sheet 3, and the capture sheet 3 may be cut out in a circle along the inner diameter of the annular plate-like object. In this case, the cutting jig is easier to create, but the adhesive area with the capture sheet 3 is larger than in a form having a cross-shaped portion 15 and a circular portion 16, so it is particularly preferable when using a capture sheet 3 that does not have a glue layer.

Next, the tape expansion device 100 in which the cleaning jig 1 is used will be described with reference to the drawings. FIG. 3 is an exploded perspective view showing an example of the configuration of the tape expansion device 100 in which the cleaning jig 1 of FIG. 1 is used. FIG. 4 is a perspective view showing an example of the configuration of a wafer 200 to which an expandable tape 206, which is the expansion target of the tape expansion device 100 of FIG. 3, is attached. FIG. 5 is a cross-sectional view showing the state before the expandable tape 206 of the main part of the tape expansion device 100 of FIG. 3 is expanded. FIG. 6 is a cross-sectional view showing the state during the expandable tape 206 of the main part of the tape expansion device 100 of FIG. 3. As shown in FIG. 3, FIG. 5, and FIG. 6, the tape expansion device 100 includes a housing 101, a frame holding unit 110, a push-up unit 120, a cover member 130, and a control unit 140.

In this embodiment, the wafer 200 that is attached to the expanding tape 206 expanded by the tape expansion device 100 via a film-like adhesive 205 is, for example, a disk-shaped semiconductor wafer or an optical device wafer whose base material is silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, or the like. As shown in FIG. 4, the wafer 200 has devices 203 formed in areas partitioned by a plurality of planned division lines 202 formed in a lattice pattern on the surface 201.

In this embodiment, as shown in FIG. 4, the wafer 200 is further cut along the planned dividing line 202 by a rotating cutting blade, or ablated by irradiating the wafer 200 with a laser beam having an absorbent wavelength, and a groove 210 having a depth equal to or greater than the finished thickness of the device 203 is formed along the planned dividing line 202. The back surface 204 on the back side of the front surface 201 is then ground by a rotating grinding wheel, and the wafer 200 is divided into chips of the individual devices 203. Note that the wafer 200 is not limited to the form in which the groove 210 is formed and the wafer 200 is divided into chips of the individual devices 203, and a laser beam having a wavelength that is transparent to the wafer 200 is irradiated along the planned dividing line 202 to form a modified layer that is a fracture origin inside the wafer 200 along the planned dividing line 202. Here, the modified layer refers to a region whose density, refractive index, mechanical strength, and other physical properties are different from those of the surrounding area, and examples of such regions include a melting process region, a crack region, an insulation breakdown region, a refractive index change region, and a region in which these regions are mixed. The modified layer has a lower mechanical strength than other parts of the wafer 200.

As shown in FIG. 4, the wafer 200 has an expandable tape (dicing tape) 206, which has an even larger planar area than the film-like adhesive 205, attached to the back surface 204 via a film-like adhesive 205, which has a larger planar area than the wafer 200 for die bonding, called a die attach film (DAF), and an annular frame 207 is attached to the outer edge of the expandable tape 206 where the film-like adhesive 205 is not attached. As a result, the wafer 200 is supported by the expandable tape 206 via the film-like adhesive 205 at the opening 208 of the annular frame 207.

As shown in Figures 5 and 6, the housing 101 covers the frame holding unit 110, the push-up unit 120, the cover member 130 and the control unit 140. The housing 101 is omitted in Figure 3. The housing 101 forms a processing space 102 inside in which the tape expansion device 100 performs processing such as expanding the expand tape 206. The housing 101 is formed with an opening (not shown) for carrying the wafer 200 in and out of the processing space 102, and a shutter (not shown) for opening and closing the opening (not shown). As shown in Figures 5 and 6, the housing 101 is formed with a cold air supply section 103 that supplies cold air into the processing space 102 to cool the processing space 102 to, for example, below 0°C. The tape expansion device 100 reduces the elasticity of the film-like adhesive 205 in the processing space 102 cooled by the cold air supply unit 103, so that the film-like adhesive 205 attached to the expanding tape 206 can be easily broken simply by expanding the expanding tape 206.

As shown in Figures 3, 5, and 6, the frame holding unit 110 has a frame support part 111 that supports the annular frame 2 of the placed cleaning jig 1 and the annular frame 207 attached to the wafer 200 from below on the upper side, and a frame pressing part 112 that presses the annular frames 2, 207 from above on the lower side.

The frame support part 111 has a square shape on the upper surface side, and a circular opening 113 is formed in the center with an inner diameter equivalent to that of the openings 5 and 208 of the annular frame 2 and 207. The frame holding part 112 is a square plate shape, and a circular opening 114 is formed in the center with an inner diameter equivalent to that of the openings 5 and 208 of the annular frame 2 and 207. Both the frame support part 111 and the frame holding part 112 are made of metal such as SUS. The frame holding part 112 can be freely raised and lowered in the Z-axis direction of Figures 3, 5, and 6, which is parallel to the vertical direction, by a lifting part not shown. The frame holding part 112 is arranged above the frame support part 111. The frame support part 111 and the frame holding part 112 are arranged in a positional relationship such that the openings 113 and 114 overlap vertically. The frame pressing portion 112 has multiple pins 115 (three in the example shown in FIG. 3) that are arranged at equal intervals in the circumferential direction on the outer periphery of the opening 114 on the top surface.

The frame holding unit 110 places the annular frame 2, 207 on the frame support part 111 so that the opening 113 of the frame support part 111 and the openings 5, 208 of the annular frame 2, 207 overlap vertically, and then lowers the frame pressing part 112 using a lifting part (not shown), thereby holding the annular frame 2, 207 by sandwiching it between the frame support part 111 and the frame pressing part 112, as shown in FIG. 5 etc.

As shown in Figures 5 and 6, the push-up unit 120 has a push-up member 121, a roller member 122, and a lifting section 123. The push-up member 121 is cylindrical and is provided coaxially with the inner circumference of the opening 113 of the frame support section 111. The roller member 122 is provided at the upper end of the push-up member 121 so as to be able to rotate freely. The lifting section 123 is provided connected to the lower part of the push-up member 121 and lifts and lowers the push-up member 121.

With the annular frame 207 fixed to the frame holding unit 110, the push-up unit 120, as shown in FIG. 6, uses the lifting section 123 to raise the push-up member 121 in the vertical direction (Z-axis direction in FIG. 6) relative to the frame holding unit 110, thereby pushing up the annular region 209 of the expanding tape 206 between the outer periphery of the wafer 200 and the inner periphery of the opening 208 of the annular frame 207 in the thickness direction (Z-axis direction in FIG. 6) perpendicular to the front surface 201 and back surface 204 of the wafer 200, thereby expanding the expanding tape 206 in the planar direction.

By pushing up the annular region 209 of the expanding tape 206 and expanding it in the surface direction in this manner, when the wafer 200 is divided into chips of individual devices 203 along the planned division lines 202, the pushing-up unit 120 breaks the film-like adhesive 205 along the planned division lines 202 in order to expand the region of the expanding tape 206 that corresponds to the planned division lines 202 in particular. In addition, when a modified layer that is the starting point of the break is formed inside the wafer 200 along the planned division lines 202, the pushing-up unit 120 divides the wafer 200 into each device 203 along the modified layer and breaks the film-like adhesive 205 along the planned division lines 202 in order to expand the region of the expanding tape 206 that corresponds to the planned division lines 202 in particular.

The cover member 130 is annular, and has a circular opening 131 in the center, the inner diameter of which is smaller than the opening 114 of the frame holding part 112 and slightly larger than or equal to the outer diameter of the wafer 200. The cover member 130 is concentric with the opening 131 in a plan view, and has a stepped shape that gradually rises upward toward the outer periphery in a cross-sectional view along the central axis. The corner portion 132 of the stepped shape formed on the cover member 130, which is bent from the horizontal direction to the vertical direction toward the outer periphery at the innermost side of the step shape formed on the cover member 130, is formed so that its outer diameter is slightly on the inner side of the opening 114 of the frame holding part 112. The cover member 130 is made of a metal such as SUS, and is grounded as shown in Figures 5 and 6.

The cover member 130 has a plurality of (three in the example shown in FIG. 3) through holes 133 arranged at equal intervals in the circumferential direction on the outer periphery of the stepped corners 132. The pins 115 of the frame clamping part 112 are inserted into the through holes 133 of the cover member 130, and the opening 131 is regulated to be coaxial with the opening 114 of the frame clamping part 112, so that the cover member 130 can be raised and lowered in the vertical direction relative to the frame clamping part 112. The cover member 130 is biased downward in the vertical direction by gravity. The cover member 130 has a plurality of (three in the example shown in FIG. 3) screw holes 134 arranged at equal intervals in the circumferential direction on the outer periphery of the through holes 133.

5 and 6, when the annular frame 207 is fixed to the frame holding unit 110, the underside 135 of the cover member 130, which is on the outer periphery side of the opening 131 and on the inner periphery side of the corner portion 132, is positioned above the portion 211 of the film-like adhesive 205 that protrudes from the wafer 200, and covers the upper side of this protruding portion 211. Therefore, when the annular region 209 of the expand tape 206 is pushed up by the push-up unit 120 to break the film-like adhesive 205, the underside 135 of the cover member 130 comes into contact with the upper surface of the protruding portion 211 of the film-like adhesive 205 and the cover member 130 is pushed up, preventing the protruding portion 211 of the film-like adhesive 205 from scattering. As a result, debris 300 (see Figures 8, 9, and 10), such as broken pieces of the protruding portion 211 of the film-like adhesive 205 that was prevented from scattering, adheres to the underside 135 of the cover member 130.

A movement suppression member 136 is attached above the cover member 130. The movement suppression member 136 is annular, and has a circular opening 137 in the center, the inner diameter of which is sufficiently smaller than the outer diameter of the wafer 200. The movement suppression member 136 is made of a lightweight resin with appropriate strength, such as polyethylene terephthalate (PET) or polycarbonate.

The movement suppression member 136 has a plurality of through holes 138 (three in the example shown in FIG. 3) arranged at equal intervals in the circumferential direction. The movement suppression member 136 has a plurality of through holes 139 (three in the example shown in FIG. 3) arranged at equal intervals in the circumferential direction in a portion of the outer periphery of the through holes 138. The movement suppression member 136 is attached to the cover member 130 by inserting screws into each through hole 139 and screwing them into the screw holes 134, and is integrated with the cover member 130. The pins 115 of the frame holding part 112 are inserted into each through hole 138, and the movement suppression member 136 is supported so that it can be raised and lowered in the vertical direction relative to the frame holding part 112 while being restricted together with the cover member 130 in a state in which the opening 137 is coaxial with the opening 114 of the frame holding part 112.

The movement suppression member 136 suppresses the upward movement of the cover member 130 caused by the impact when the annular region 209 of the expanding tape 206 is pushed up by the push-up unit 120 because the opening 137 formed in the center is sufficiently small to create a large air resistance when moving up and down.

The control unit 140 controls the operation of various components of the tape expansion device 100 to cause the tape expansion device 100 to perform a series of processes for dividing the film-like adhesive 205 by expanding the expanding tape 206 and a method for cleaning the cover member according to the embodiment. In this embodiment, the control unit 140 includes a computer system. The computer system included in the control unit 140 includes an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input/output interface device. In this embodiment, the function of the control unit 140 is realized by the arithmetic processing device of the computer system included in the control unit 140 executing a computer program stored in the storage device of the computer system included in the control unit 140. The arithmetic processing device of the control unit 140 performs arithmetic processing according to the computer program stored in the storage device of the control unit 140, and outputs a control signal for controlling the tape expansion device 100 to each component of the tape expansion device 100 via the input/output interface device of the control unit 140.

Next, this specification describes a method for cleaning a cover member according to an embodiment with reference to the drawings. The method for cleaning a cover member according to an embodiment is carried out by using a cleaning jig 1 according to an embodiment in a tape expansion device 100. FIG. 7 is a flowchart showing an example of a processing procedure of the method for cleaning a cover member according to an embodiment. FIGS. 8, 9, and 10 are cross-sectional views each explaining the method for cleaning a cover member according to an embodiment. As shown in FIG. 7, the method for cleaning a cover member according to an embodiment includes a holding step 1001 and a moving step 1002.

In the holding step 1001, the annular frame 2 of the cleaning jig 1 is held by the frame holding unit 110. Specifically, in the holding step 1001, the control unit 140 transports the cleaning jig 1 into the processing space 102 by a transport unit (not shown), places the annular frame 2 of the cleaning jig 1 on the frame support part 111 so that the opening 113 of the frame support part 111 of the frame holding unit 110 and the opening 5 of the annular frame 2 of the cleaning jig 1 overlap vertically, and then lowers the frame holding part 112 of the frame holding unit 110 by a lifting part (not shown), thereby holding the annular frame 2 of the cleaning jig 1 by sandwiching it between the frame support part 111 and the frame holding part 112, as shown in FIG. 8.

The moving step 1002 is a step that is performed after the holding step 1001, in which the push-up unit 120 relatively moves the capture sheet 3 of the cleaning jig 1 and the cover member 130 of the tape expansion device 100 between a standby position 21 (see Figures 8 and 10) in which they are spaced apart from each other, and a contact position 22 (see Figure 9) in which the capture sheet 3 captures the debris 300 of the film-like adhesive 205 that is in contact with each other and adheres to the cover member 130.

In the movement step 1002, specifically, with the annular frame 2 of the cleaning jig 1 fixed to the frame holding unit 110, the control unit 140 causes the lifting unit 123 to raise the push-up member 121 vertically relative to the frame holding unit 110 as shown in FIG. 9, thereby pushing up the capture sheet 3 of the cleaning jig 1 in the thickness direction of the cleaning jig 1 (Z-axis direction in FIG. 9) and positioning the capture sheet 3 at the contact position 22 where the upper surface 7 of the capture sheet 3 contacts the lower surface 135 of the cover member 130. As a result, the debris 300 of the film-like adhesive 205 adhering to the lower surface 135 of the cover member 130 is captured by the upper surface 7 of the capture sheet 3, which is more adhesive than the lower surface 135 of the cover member 130.

In the moving step 1002, the capture sheet 3 is positioned at the contact position 22 to capture the scraps 300 of the film-like adhesive 205 adhering to the underside 135 of the cover member 130, and then the control unit 140, as shown in FIG. 10, uses the lifting unit 123 to lower the push-up member 121 in the vertical direction relative to the frame holding unit 110 to position the capture sheet 3 at the standby position 21 where the upper surface 7 of the capture sheet 3 is separated from the underside 135 of the cover member 130. As a result, the scraps 300 of the film-like adhesive 205 captured by the capture sheet 3 are separated from the underside 135 of the cover member 130 and removed. In this way, the cleaning jig 1 cleans the underside 135 of the cover member 130 by capturing and removing the scraps 300 of the film-like adhesive 205 adhering to the underside 135 of the cover member 130 with the capture sheet 3.

The opening 6 of the capture sheet 3 has an inner diameter smaller than or equal to that of the opening 131 of the cover member 130. Therefore, the upper surface 7 of the capture sheet 3 has a radial width larger than or equal to that of the lower surface 135 of the cover member 130, so that in the moving step 1002, the debris 300 of the film-like adhesive 205 can be captured and removed from the entire surface of the lower surface 135 of the cover member 130.

In the moving step 1002, it is preferable that the control unit 140 causes the push-up unit 120 to move the capture sheet 3 and the cover member 130 relative to each other multiple times between the standby position 21 and the contact position 22 by changing the push-up speed and the descent speed of the capture sheet 3. In the moving step 1002, the horizontal position at which the upper surface 7 of the capture sheet 3 contacts the lower surface 135 of the cover member 130 when the capture sheet 3 is at the contact position 22 changes depending on the push-up speed and the descent speed of the capture sheet 3 by the push-up unit 120, so that the lower surface 135 of the cover member 130 can be cleaned evenly after the capture sheet 3 moves multiple times.

The cleaning tool 1 and the method for cleaning a cover member according to the embodiment having the above-mentioned configuration have the effect of cleaning the underside 135 of the cover member 130 to which the film-like adhesive 205 is attached, by removing the debris 300 of the film-like adhesive 205 attached to the underside 135 of the cover member 130 by making the upper surface 7 of the capture sheet 3 of the cleaning tool 1 adhere closely to the underside 135 of the cover member 130.

In addition, the cleaning tool 1 and the method for cleaning the cover member according to the embodiment do not require the operator of the tape expansion device 100 to stop cooling by the cold air supply unit 103 and open the processing space 102 for a long period of time in order to clean the cover member 130, so that the underside 135 of the cover member 130 to which the film-like adhesive 205 is attached can be efficiently cleaned.

In addition, the cleaning jig 1 and the method for cleaning the cover member according to the embodiment use an annular frame 2 of the same shape as the annular frame 207 attached to the expanding tape 206 together with the wafer 200. Therefore, in the case of a tape expansion device 100 equipped with a transport unit, the cleaning jig 1 can be automatically transported in the same manner as the wafer 200 to which the annular frame 207 is attached is transported, and the capture sheet 3 can be automatically pushed up in the same manner as the expanding tape 206 attached to the wafer 200 is pushed up, thereby automatically carrying out the method for cleaning the cover member.

In addition, in the cleaning tool 1 and the cleaning method for the cover member according to the embodiment, the capture sheet 3 has an opening 6 formed in the center and is annular, so that the capture sheet 3 is easily lifted upward by being pushed up by the push-up unit 120, and is more closely attached to the underside 135 of the cover member 130, and the debris 300 of the film-like adhesive 205 adhering to the underside 135 of the cover member 130 can be efficiently removed.

The present invention is not limited to the above embodiment. In other words, the present invention can be implemented in various modifications without departing from the gist of the invention.

REFERENCE SIGNS LIST 1 cleaning jig 2, 207 annular frame 3 capture sheet 5, 6, 131, 208 opening 21 standby position 22 contact position 100 tape expansion device 110 frame holding unit 120 push-up unit 130 cover member 200 wafer 202 planned division line 205 film-like adhesive 206 expandable tape

Claims (3)

A tape expanding device which breaks a wafer having breakage start points formed along a planned dividing line or a wafer divided into individual chips along the planned dividing line, while a film-like adhesive attached to a back surface of the wafer is attached to an expandable tape attached to an opening of an annular frame, the tape expanding device comprising:
A frame holding unit for holding the annular frame;
a push-up unit that pushes up the expandable tape attached to the annular frame held by the frame holding unit to break the film-like adhesive;
a cover member that prevents the film-like adhesive from scattering when a portion of the film-like adhesive protruding from the wafer is broken; and
a cleaning tool for removing fragments of the film-like adhesive attached to the cover member in a tape expanding device comprising:
The cleaning tool is
The annular frame;
an annular adhesive capture sheet mounted in the opening of the annular frame;
A cleaning tool comprising: A method for cleaning a cover member using the cleaning tool according to claim 1, comprising the steps of:
a holding step of holding the annular frame of the cleaning jig with the frame holding unit;
a moving step of relatively moving the capture sheet and the cover member by the push-up unit between a standby position where the capture sheet and the cover member are spaced apart from each other and a contact position where the capture sheet contacts the cover member and captures the waste of the film-like adhesive adhering to the cover member;
A method for cleaning a cover member, comprising the steps of: The method for cleaning a cover member according to claim 2, characterized in that in the moving step, the push-up unit moves the capture sheet and the cover member relatively multiple times between the standby position and the contact position while changing the speed.

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