JP7630828B2 - Visual inspection device and visual inspection method - Google Patents

Description

The present invention relates to an appearance inspection device and an appearance inspection method.

Conventionally, when electronic components are mounted on a substrate using conductive bonding materials, a visual inspection is carried out to check the mounting condition.

Patent Document 1 discloses an appearance inspection device that includes a back surface reflection mirror that is positioned away from directly below a workpiece guided to an inspection position in an inclined state and reflects light from the back surface of the workpiece, a back surface imaging camera that captures the light reflected from the back surface of the workpiece via the back surface reflection mirror, and a front surface imaging camera that captures the light reflected from the front surface of the workpiece, and that inspects the state of solder application on a ceramic capacitor through inspection processing by a control unit based on the images captured by the back surface imaging camera and the front surface imaging camera.

JP 2014-95574 A

The visual inspection device described in Patent Document 1 can prevent erroneous judgments in visual inspections caused by foreign objects that have fallen onto the lens of a back surface inspection camera, while also being able to determine whether a capacitor is electrically connected to a lead frame by inspecting the solder application condition, including the amount of solder overflow.

However, because the visual inspection device described in Patent Document 1 is configured to capture an image in which the solder can be recognized, it is not possible to capture a clear image of the capacitor and the lead frame, and it is sometimes not possible to inspect with sufficient accuracy for mounting defects other than poor electrical continuity between the capacitor and the lead frame, such as deviation of the capacitor from the normal mounting area on the lead frame.

The present invention was made in consideration of these circumstances, and the object of the present invention is to provide an appearance inspection device and an appearance inspection method that can improve inspection accuracy.

An appearance inspection device according to one aspect of the present invention is an appearance inspection device that inspects the appearance of a workpiece including a lead frame, electronic components mounted on the surface of the lead frame, and a conductive bonding member disposed between the lead frame and the electronic components, and is equipped with a first imaging unit configured to be able to image the workpiece from the side of the workpiece surface on which the electronic components are mounted, and a second imaging unit configured to be able to image the workpiece from the side of the workpiece back surface, which is the opposite side to the workpiece surface, the first imaging unit configured to capture at least one image that allows recognition of at least one of the position and angle of the electronic components relative to the lead frame when the workpiece surface is viewed in plan, and the second imaging unit configured to capture an image that allows recognition of the dimensions of the conductive bonding member protruding from the lead frame when the workpiece back surface is viewed in plan.

According to this aspect, it is possible to accurately inspect both the misalignment of the electronic components relative to the lead frame and the electrical continuity between the lead frame and the electronic components. In addition, by arranging the first imaging unit and the second imaging unit so that they face each other across the workpiece, it is possible to provide an appearance inspection device that enables efficient appearance inspection while preventing the device from becoming too large.

The above aspect may further include a first coaxial epi-illumination provided between the workpiece and the first imaging unit, a second coaxial epi-illumination provided between the workpiece and the second imaging unit, a ring illumination provided between the workpiece and the second coaxial epi-illumination, and a bar illumination provided between the workpiece and the ring illumination.

In the above aspect, the device may be configured to be capable of executing a first mode in which the lead frame and electronic components are illuminated by the first coaxial epi-illumination, and the first imaging unit captures a first captured image that allows the position of the electronic components relative to the lead frame when the work surface is viewed in a plan view; a second mode in which the lead frame and electronic components are darkened by the second coaxial epi-illumination, and the first imaging unit captures a second captured image that allows the angle of the electronic components relative to the lead frame when the work surface is viewed in a plan view; and a third mode in which the lead frame and electronic components are illuminated by the second coaxial epi-illumination and ring illumination, the conductive bonding member is illuminated by the bar illumination, and the second imaging unit captures a third captured image that allows the dimension of the conductive bonding member protruding from the lead frame when the back surface of the work is viewed in a plan view.

In the above embodiment, in the third mode, the electrical continuity between the lead frame and the electronic component may be inspected based on the ratio between the width W1 of the conductive bonding member protruding from the lead frame and the width W2 of the electronic component in the same direction as the width W1.

In the above aspect, in the first and second modes, the deviation of the electronic components from the normal mounting area in the in-plane direction of the work surface may be inspected based on the first and second captured images.

An appearance inspection method according to another aspect of the present invention is a method for inspecting the appearance of a workpiece including a lead frame, electronic components mounted on the surface of the lead frame, and a conductive bonding member provided between the lead frame and the electronic components, and includes imaging the workpiece from the workpiece surface side on which the electronic components are mounted, and imaging the workpiece from the workpiece back side opposite the workpiece surface, where imaging the workpiece from the workpiece surface side includes capturing at least one captured image that allows recognition of at least one of the position and angle of the electronic components relative to the lead frame when the workpiece surface is viewed in plan, and imaging the workpiece from the workpiece back side includes capturing an image that allows recognition of the dimensions of the conductive bonding member protruding from the lead frame when the workpiece back side is viewed in plan.

This aspect makes it possible to accurately inspect both the misalignment of the electronic component relative to the lead frame and the electrical continuity between the lead frame and the electronic component.

The present invention provides an appearance inspection device and an appearance inspection method that can improve inspection accuracy.

1 is a diagram illustrating a schematic configuration of a visual inspection apparatus according to an embodiment; 1 is a flowchart illustrating an example of a visual inspection method according to an embodiment. 10A to 10C are diagrams illustrating a process of acquiring a first captured image. FIG. 2 is a diagram illustrating an example of a first captured image. FIG. 11 is a diagram illustrating a process for acquiring a second captured image. FIG. 11 is a diagram illustrating an example of a second captured image. FIG. 11 is a diagram illustrating a process for acquiring a third captured image. FIG. 13 is a diagram illustrating an example of a third captured image.

The following describes an embodiment of the present invention with reference to the drawings. The drawings of this embodiment are illustrative, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be interpreted as being limited to this embodiment.

<Appearance inspection device>
The configuration of a visual inspection device 1 according to an embodiment of the present invention will be described with reference to Fig. 1. Fig. 1 is a diagram showing a schematic configuration of a visual inspection device according to an embodiment.

The visual inspection device 1 is a device that inspects the visual appearance of the workpiece W. The visual inspection device 1 is equipped with imaging units C1, C2, coaxial epi-illumination units V1, V2, ring illumination R2, bar illumination B2, a control unit 10, and an inspection unit 20. As shown in FIG. 4 described below, the workpiece W includes a lead frame LF, an electronic component PT provided on the surface of the lead frame LF, and a conductive bonding member CB provided between the lead frame LF and the electronic component PT.

Although not shown in the figure, the visual inspection device 1 may further include rails for guiding the workpiece W and a holder for fixing the workpiece W.

The electronic component PT is, for example, a ceramic capacitor, but is not particularly limited as long as it is mounted on the lead frame LF. The conductive bonding member CB is, for example, a conductive adhesive such as silver paste, but is not particularly limited as long as it electrically bonds the lead frame LF and the electronic component PT.

The imaging unit C1 is configured to be able to image the workpiece W from the side of the workpiece surface Wa on which the electronic components PT are mounted. The imaging unit C1 is configured to capture at least one image that allows recognition of at least one of the position and angle of the electronic components PT relative to the lead frame LF when the workpiece surface Wa is viewed in a plan view. The imaging unit C1 includes, for example, an objective lens and a camera. In the example shown in FIG. 1, the workpiece W is provided directly below the imaging unit C1 so that the workpiece surface Wa faces the objective lens of the imaging unit C1. The imaging unit C1 corresponds to an example of a "first imaging unit" according to the present invention.

The imaging unit C2 is configured to be able to image the workpiece W from the side of the workpiece back surface Wb on which the electronic component PT is mounted. The imaging unit C2 is configured to capture an image that allows recognition of the dimensions of the conductive bonding material CB protruding from the lead frame LF when the workpiece back surface Wb is viewed in plan. The imaging unit C2 includes, for example, an objective lens and a camera. In the example shown in FIG. 1, the workpiece W is provided directly above the imaging unit C2 so that the workpiece back surface Wb faces the objective lens of the imaging unit C2. In other words, the imaging units C1 and C2 are provided so that their objective lenses face each other. The imaging unit C2 corresponds to an example of a "second imaging unit" according to the present invention.

The configuration of the imaging units C1 and C2 is not limited to the above, and may further include optical elements such as a mirror or a refractive lens. For example, the imaging units C1 and C2 may be configured to capture an image of the workpiece W reflected on a mirror. In this case, the imaging unit C2 may be positioned so that the objective lens faces downward. This can prevent erroneous judgments in the appearance inspection caused by a foreign object falling onto the objective lens of the imaging unit C2.

The coaxial epi-illumination V1 is provided between the workpiece W and the imaging unit C1. The coaxial epi-illumination V1 is an illumination that irradiates light rays along the optical axis of the objective lens of the imaging unit C1 perpendicularly to the workpiece surface Wa of the workpiece W. The coaxial epi-illumination V1 illuminates the lead frame LF and electronic components PT for the imaging unit C1. The coaxial epi-illumination V1 includes, for example, a half mirror HM1 arranged in the space between the workpiece W and the imaging unit C1, and a light source LS1 that irradiates the workpiece surface Wa with light reflected by the half mirror HM1. The coaxial epi-illumination V1 corresponds to an example of the "first coaxial epi-illumination" according to the present invention.

The coaxial epi-illumination V2 is provided between the workpiece W and the imaging unit C2. The coaxial epi-illumination V2 is an illumination that irradiates light rays along the optical axis of the objective lens of the imaging unit C2 perpendicularly to the workpiece back surface Wb of the workpiece W. The coaxial epi-illumination V2 makes the lead frame LF and electronic components PT dark for the imaging unit C1. The coaxial epi-illumination V2 also illuminates the lead frame LF and electronic components PT for the imaging unit C2. The coaxial epi-illumination V2 includes, for example, a half mirror HM2 arranged in the space between the workpiece W and the imaging unit C2, and a light source LS2 that irradiates the workpiece back surface Wb with light reflected by the half mirror HM2. The coaxial epi-illumination V2 corresponds to an example of the "second coaxial epi-illumination" according to the present invention.

The ring illumination R2 is provided between the workpiece W and the coaxial epi-illumination V2. The ring illumination R2 is an illumination that irradiates the workpiece back surface Wb of the workpiece W with a light beam tilted with respect to the optical axis of the objective lens of the imaging unit C2. The ring illumination R2 illuminates the lead frame LF and electronic component PT with respect to the imaging unit C2.

The bar light B2 is provided between the workpiece W and the ring light R2. The ring light R2 is an illumination that irradiates the workpiece back surface Wb of the workpiece W with a light beam tilted with respect to the optical axis of the objective lens of the imaging unit C2. The bar light B2 illuminates the conductive bonding material CB that protrudes from the lead frame LF with respect to the imaging unit C2.

The control unit 10 controls the image capture units C1, C2, the coaxial epi-illumination units V1, V2, the ring illumination R2, and the bar illumination B2 to perform visual inspection in multiple modes. Specifically, the control unit 10 is configured to be able to execute a first mode for capturing an image MG1, a second mode for capturing an image MG2, and a third mode for capturing an image MG3. The captured image MG1 corresponds to an example of a "first captured image" according to the present invention, the captured image MG2 corresponds to an example of a "second captured image" according to the present invention, and the captured image MG3 corresponds to an example of a "third captured image" according to the present invention. Details of the captured images MG1 to MG3 and the first to third modes will be described later.

The inspection unit 20 is a device for inspecting the appearance of the workpiece W based on the captured images acquired from each of the imaging units C1 and C2. For example, the inspection unit 20 displays the captured images on a monitor, and an operator visually determines whether or not there are any abnormalities based on the displayed captured images. For example, the inspection unit 20 may compare an image of a normal workpiece W with the captured image, and automatically determine whether or not there are any abnormalities by image analysis.

The control unit 10 and the inspection unit 20 are configured with hardware having a CPU, ROM, RAM, etc., and software that operates the hardware. The control unit 10 and the inspection unit 20 may be configured with a common computer, or may be configured with separate computers.

The visual inspection device 1 may further include lighting. For example, a ring light or a bar light for illuminating the conductive bonding material CB protruding from the electronic component PT on the workpiece surface Wa side may be provided between the workpiece W and the coaxial epi-illumination light V1.

<Appearance inspection method>
Next, an outline of an appearance inspection method using the appearance inspection device 1 according to one embodiment of the present invention will be described with reference to FIGS. 2 to 8. FIG. 2 is a flowchart showing an example of an appearance inspection method according to one embodiment. FIG. 3 is a diagram showing a schematic process of acquiring a first captured image. FIG. 4 is a diagram showing a schematic example of a first captured image. FIG. 5 is a diagram showing a schematic process of acquiring a second captured image. FIG. 6 is a diagram showing a schematic example of a second captured image. FIG. 7 is a diagram showing a schematic process of acquiring a third captured image. FIG. 8 is a diagram showing a schematic example of a third captured image. In FIGS. 4, 6, and 8, the workpiece front surface Wa and the workpiece back surface Wb are assumed to extend along an XY plane defined by the X-axis and the Y-axis.

First, a first captured image is captured (S10). At this time, the visual inspection device 1 is operated in the first mode. As shown in FIG. 3, the control unit 10 illuminates the lead frame LF and the electronic components PT with a coaxial epi-illumination V1. Then, as shown in FIG. 4, the control unit 10 captures an image MG1 by the imaging unit C1, which allows the position of the electronic components PT relative to the lead frame LF when the work surface Wa is viewed in a plan view. That is, in the first mode, the work W is illuminated from the side of the work surface Wa, and the work W is captured from the side of the work surface Wa.

Next, the electronic component PT is inspected for misalignment based on the first captured image MG1 (S20). In the captured image MG1, the slits in the lead frame LF are dark, and the lead frame LF and the electronic component PT are bright. In the inspection unit 20, the electronic component PT is inspected for misalignment from the normal mounting area in the in-plane direction of the work surface Wa based on the captured image MG1. Specifically, the inspection unit 20 inspects the displacement of the electronic component PT in the X-axis direction and the Y-axis direction.

Next, a second captured image MG2 is captured (S30). At this time, the visual inspection device 1 is operated in the second mode. As shown in FIG. 5, the control unit 10 illuminates the lead frame LF and the electronic components PT with the coaxial epi-illumination V2. Then, as shown in FIG. 6, the control unit 10 captures an image MG2 by the imaging unit C1 that allows recognition of the angle of the electronic components PT relative to the lead frame LF when the workpiece surface Wa is viewed in a plan view. That is, in the second mode, the workpiece W is illuminated from the workpiece back surface Wb side, and the workpiece W is captured from the workpiece surface Wa side.

Next, the electronic component PT is inspected for misalignment based on the second captured image MG2 (S40). In the captured image MG2, the lead frame LF and the electronic component PT are dark, and the slits in the lead frame LF are bright. In the inspection unit 20, the electronic component PT is inspected for misalignment from the normal mounting area in the in-plane direction of the work surface Wa based on the captured image MG2. Specifically, the inspection unit 20 inspects the displacement of the electronic component PT in the rotational direction about an axis intersecting the XY plane.

Next, a third captured image MG3 is captured (S50). At this time, the visual inspection device 1 is operated in the third mode. As shown in FIG. 7, the control unit 10 illuminates the lead frame LF and electronic component PT with the coaxial epi-illumination V2 and ring illumination R2, and illuminates the conductive bonding material CB with the bar illumination B2. Then, as shown in FIG. 8, the control unit 10 captures an image MG3 with the imaging unit C2, which allows recognition of the dimensions of the conductive bonding material CB protruding from the lead frame LF when the workpiece back surface Wb is viewed in plan. In other words, in the third mode, the workpiece W is illuminated from the workpiece back surface Wb side, and the workpiece W is captured from the workpiece back surface Wb side.

Next, the continuity is inspected based on the third captured image MG3 (S60). In the captured image MG3, the slits of the lead frame LF are in a dark state, and the conductive bonding material CB is in a light state. The lead frame LF and the electronic component PT are in an intermediate state between the dark state and the light state. In the inspection unit 20, the ratio W1/W2 between the width W1 of the conductive bonding material CB protruding from the lead frame LF and the width W2 of the electronic component PT in the same direction as the width W1 (hereinafter referred to as the "width ratio") is obtained based on the captured image MG3. Here, the widths W1 and W2 are dimensions along the X-axis direction perpendicular to the Y-axis direction in which the conductive bonding material CB protrudes from the lead frame LF on the work back surface Wb. In the inspection unit 20, the continuity between the lead frame LF and the electronic component PT is inspected based on the width ratio W1/W2. If the width ratio W1/W2 is equal to or greater than a threshold value, it is determined that there is normal continuity. The threshold value is, for example, 1/3, but is not limited to this.

In the third mode, the inspection unit 20 may inspect for short circuits between the conductive bonding members CB. For example, the ratio L1/L2 between the length L1 of the conductive bonding member CB protruding from the lead frame LF and the length L2 of the electronic component PT protruding from the lead frame LF in the same direction as the length L1 (hereinafter referred to as the "length ratio") is obtained. Here, the lengths L1 and L2 are dimensions along the Y-axis direction, which is the direction in which the conductive bonding member CB protrudes from the lead frame LF on the work back surface Wb. In the inspection unit 20, the conductive bonding members CB are inspected for short circuits based on the length ratio L1/L2. If the length ratio L1/L2 is equal to or less than a threshold value, it is determined that there is no short circuit. The threshold value is, for example, 1/2, but is not limited to this. In addition, in the inspection unit 20, whether or not a short circuit has occurred may be determined based on whether or not the conductive bonding members CB are actually in contact with each other in the captured image MG3.

The determination of normality or abnormality in each of steps S20, S40, and S60 is performed by an operator based on, for example, each of the captured images MG1 to MG3 displayed on a monitor by the inspection unit 20. However, the determination of normality or abnormality in each of steps S20, S40, and S60 may also be performed by image analysis of each of the captured images MG1 to MG3 by a computer in the inspection unit 20. In this case, the inspection unit 20 that detects an abnormality may notify the operator by displaying the abnormality on a monitor, or may notify the mounting device that mounts the electronic components PT on the lead frame LF of the abnormality and have the mounting conditions adjusted.

Note that the order of steps S10 to S60 is not limited to the above. For example, image MG1 may be captured after image MG2 or image MG3, and image MG2 may be captured after image MG3. Visual inspection based on each of images MG1 and MG2 may be performed after capturing both images MG1 and MG2, and visual inspection based on each of images MG1 to MG3 may be performed after capturing all images MG1 to MG3. Furthermore, if one of the visual inspections based on images MG1 and MG2 is performed, the other visual inspection may be omitted.

As described above, there is provided an appearance inspection device 1 including an imaging unit C1 configured to capture at least one image capable of recognizing at least one of the position and angle of the electronic component PT relative to the lead frame LF when the work surface Wa is viewed in a plane, and an imaging unit C2 configured to obtain an image capable of recognizing the dimensions of the conductive bonding material CB protruding from the lead frame LF when the work surface Wb is viewed in a plane. In addition, there is provided an appearance inspection method using the appearance inspection device 1.

This allows for accurate inspection of both the misalignment of the electronic components PT relative to the lead frame LF and the electrical continuity between the lead frame LF and the electronic components PT. In addition, by arranging the imaging units C1 and C2 to face each other across the workpiece W, it is possible to provide an appearance inspection device that allows for efficient appearance inspection while preventing the device from becoming too large.

The visual inspection device 1 is also configured to control the coaxial epi-illumination lights V1, V2, the ring light R2, and the bar light B2 to execute a first mode for capturing an image MG1 that allows the position of the electronic component PT to be recognized, a second mode for capturing an image MG2 that allows the angle of the electronic component PT to be recognized, and a third mode for capturing an image MG3 that allows the dimensions of the conductive bonding material CB that protrudes from the lead frame LF to be recognized.

This allows for highly accurate appearance inspection by appropriately changing the imaging and lighting methods depending on the purpose of the inspection.

As described above, according to one aspect of the present invention, it is possible to provide an appearance inspection device and an appearance inspection method that can improve inspection accuracy.

The above-described embodiments are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangements, materials, conditions, shapes, sizes, etc., are not limited to those exemplified, and may be modified as appropriate. Furthermore, configurations shown in different embodiments may be partially substituted or combined.

1... Appearance inspection device 10... Control unit 20... Inspection unit C1, C2... Imaging unit V1, V2... Coaxial epi-illumination R2... Ring illumination B2... Bar illumination W... Work Wa... Surface of work Wb... Back surface of work LF... Lead frame PT... Electronic component CB... Conductive joining member Coaxial epi-illumination

Claims (4)

1. A visual inspection apparatus for inspecting the visual appearance of a workpiece including a lead frame, an electronic component provided on a surface of the lead frame, and a conductive bonding member provided between the lead frame and the electronic component, comprising:
A first imaging unit configured to be able to image the workpiece from a side of a workpiece surface on which the electronic components are mounted;
A second imaging unit configured to be able to image the workpiece from a back surface side of the workpiece opposite to the front surface of the workpiece;
A first coaxial epi-illumination unit provided between the workpiece and the first imaging unit;
A second coaxial epi-illumination unit provided between the workpiece and the second imaging unit;
a ring illumination provided between the workpiece and the second coaxial epi-illumination;
a bar light provided between the workpiece and the ring light ,
the first imaging unit is configured to capture at least one captured image capable of recognizing at least one of a position and an angle of the electronic component with respect to the lead frame when the work surface is viewed in a plan view;
The second imaging unit is configured to capture an image that allows a dimension of the conductive bonding member protruding from the lead frame to be recognized when the back surface of the workpiece is viewed in plan,
a first mode in which the lead frame and the electronic components are illuminated by the first coaxial epi-illumination, and a first captured image that enables recognition of positions of the electronic components relative to the lead frame when the work surface is viewed in a plan view is captured by the first imaging unit;
a second mode in which the lead frame and the electronic component are darkened by the second coaxial epi-illumination, and a second captured image is captured by the first imaging unit, which allows recognition of an angle of the electronic component relative to the lead frame when the work surface is viewed in a plan view;
a third mode in which the lead frame and the electronic component are illuminated by the second coaxial epi-illumination and the ring illumination, the conductive bonding member is illuminated by the bar illumination, and a third captured image is captured by the second imaging unit, which allows recognition of a dimension of the conductive bonding member protruding from the lead frame when the rear surface of the workpiece is viewed in a plan view;
is configured to run
Visual inspection equipment. In the third mode, the electrical continuity between the lead frame and the electronic component is inspected based on a ratio between a width W1 of the conductive bonding member protruding from the lead frame and a width W2 of the electronic component in the same direction as the width W1.
The visual inspection apparatus according to claim 1 . In the first mode and the second mode, a deviation of the electronic component from a normal mounting area in an in-plane direction of the work surface is inspected based on the first captured image and the second captured image.
3. The visual inspection apparatus according to claim 1 or 2 . 1. A visual inspection method for inspecting the visual appearance of a workpiece including a lead frame, an electronic component provided on a surface of the lead frame, and a conductive bonding member provided between the lead frame and the electronic component, comprising:
An image of the workpiece is captured from a side of the workpiece surface by a first imaging unit configured to be able to capture an image of the workpiece from a side of the workpiece surface on which the electronic components are mounted;
Imaging the workpiece from the back surface side of the workpiece by a second imaging unit configured to be able to image the workpiece from the back surface side of the workpiece, which is opposite to the workpiece front surface ;
Including,
Imaging the workpiece from the side of the workpiece surface includes capturing at least one captured image that allows recognition of at least one of a position and an angle of the electronic component with respect to the lead frame when the workpiece surface is viewed in a plan view;
Imaging the workpiece from the side of the back surface of the workpiece includes capturing an image in which a dimension of the conductive bonding member protruding from the lead frame when the back surface of the workpiece is viewed in plan view can be recognized,
Capturing at least one captured image that allows recognition of at least one of the position and the angle of the electronic component with respect to the lead frame when the work surface is viewed in a plan view,
a first mode in which the lead frame and the electronic components are illuminated by a first coaxial epi-illumination provided between the workpiece and the first imaging unit, and a first captured image is captured by the first imaging unit, which allows the position of the electronic components relative to the lead frame to be recognized when the workpiece surface is viewed in a plan view;
a second mode in which the lead frame and the electronic components are darkened by a second coaxial epi-illumination provided between the workpiece and the second imaging unit, and a second captured image is captured by the first imaging unit, which allows recognition of an angle of the electronic components relative to the lead frame when the workpiece surface is viewed in a plan view;
Including,
Capturing an image that allows a dimension of the conductive bonding member protruding from the lead frame when the rear surface of the workpiece is viewed in plan includes a third mode in which the lead frame and the electronic components are illuminated by the second coaxial epi-illumination and a ring illumination provided between the workpiece and the second coaxial epi-illumination, the conductive bonding member is illuminated by a bar illumination provided between the workpiece and the ring illumination, and a third image that allows a dimension of the conductive bonding member protruding from the lead frame when the rear surface of the workpiece is viewed in plan is captured by the second imaging unit.
Visual inspection method.

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