JP7630873B2 - Expanding Device - Google Patents

Description

The present invention relates to an expansion device.

Chips containing devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are manufactured by dividing a workpiece such as a wafer made of silicon (Si) on which devices are formed in each area defined by planned division lines (streets) on the surface. Such a workpiece is divided, for example, in the following order:

First, a laser beam is irradiated along the planned dividing line of the workpiece to form a modified layer inside the workpiece, and an expandable sheet (dicing tape) is attached to the workpiece on which the modified layer has been formed. Next, an expandable device is used to expand the expandable sheet, and an external force is applied to the workpiece attached to the expandable sheet. As a result, the modified layer becomes the starting point of breakage, and the workpiece is divided along the planned dividing line.

Furthermore, the chips produced by dividing the workpiece may be fixed to other chips or a substrate, etc. In such cases, it may be necessary to divide the workpiece with an adhesive film attached to fix the chip to the substrate, etc.

However, such adhesive films are generally made of materials with a low elastic modulus, such as resin. Therefore, even if an expansion device is used to expand an expandable sheet attached to a workpiece via an adhesive film, the adhesive film may not stretch and break.

In such cases, a method for dividing the adhesive film while suppressing deformation thereof is known in which an expandable sheet (protective tape) attached to the workpiece via the adhesive film is expanded while the adhesive film is cooled (see, for example, Patent Document 1). Specifically, in this method, the area of the expandable sheet where the adhesive film is attached is brought into contact with a cooling table, and the cooling table is cooled to cool the adhesive film.

JP 2006-49591 A

In order to expand the expand sheet and break the adhesive film, for example, it is necessary to cool the adhesive film to 0 degrees. Therefore, in the above-mentioned method, the cooling table that comes into contact with the adhesive film is cooled to below 0 degrees.

In this case, condensation may occur on the surface of the cooling table and/or on the surfaces of components of the expanding device that are close to the cooling table. The water droplets caused by this condensation may wet the device formed on the surface of the workpiece, causing the device to malfunction and possibly causing the expanding device to break down.

In view of this, the object of the present invention is to provide an expansion device that breaks an adhesive film attached to a workpiece while it is cooled, and that can suppress the occurrence of condensation when breaking the adhesive film.

According to one aspect of the present invention, there is provided an expanding device that expands an expandable sheet that closes an opening of a ring-shaped frame of a workpiece unit attached to an expandable sheet, which has a device formed in an area partitioned by a planned division line on the surface, via an adhesive film attached to the back surface of the workpiece, and breaks the adhesive film along the planned division line. The expanding device includes an expansion unit that holds the frame of the workpiece unit and expands the expandable sheet, a disk-shaped cooling table having a contact surface that contacts the area attached to the workpiece via the adhesive film of the expandable sheet while the frame is held by the expansion unit, a back surface that is the back surface of the contact surface, and an outer peripheral surface located between the contact surface and the back surface, and a dry gas supply unit that supplies gas that is adjusted to have a dew point lower than the temperature of the cooling table when the adhesive film is broken and a temperature higher than the dew point of the atmosphere to the contact surface, the back surface, and the outer peripheral surface of the cooling table.

Preferably, the expansion device is fixed to the cooling table and includes a cover member that faces the back surface and the outer peripheral surface through a gap, the cooling table has a through hole that penetrates from the back surface to the corresponding contact surface, and the gas is supplied to the gap and the through hole.

The expansion device preferably includes a dew point measurement unit that measures the dew point of the gas, a cooling unit that cools the cooling table, and a control unit that controls the cooling unit to stop cooling the cooling table when the dew point of the gas measured by the dew point measurement unit exceeds a threshold value.

Alternatively, the expansion device preferably includes a dew point measurement unit that measures the dew point of the gas, an alarm unit that notifies information related to the dew point of the gas, and a control unit that controls the alarm unit to notify the dew point of the gas that has exceeded the threshold value when the dew point of the gas measured by the dew point measurement unit exceeds the threshold value.

Preferably, the expansion device includes a hot air injection unit that injects hot air toward the area of the expansion sheet between the outer peripheral edge of the workpiece and the inner peripheral edge of the frame.

In the expanding device of the present invention, gas can be supplied to the contact surface, back surface, and outer peripheral surface of the cooling table for cooling the adhesive film attached to the workpiece, with the dew point adjusted to be lower than the temperature of the cooling table when the adhesive film is broken, and higher than the dew point of the atmosphere.

As a result, when the expand sheet attached to the adhesive film is expanded to break the adhesive film, and before and after, condensation is less likely to occur on the contact surface, back surface, and outer peripheral surface of the cooling table, as well as on the surfaces of the components of the expansion device adjacent to the cooling table. As a result, the probability of malfunction of devices formed on the surface of the workpiece and failure of the expansion device due to water droplets caused by condensation is reduced.

FIG. 1 is a perspective view showing a schematic diagram of a workpiece unit including a workpiece. FIG. 2 is a functional block diagram illustrating an example of components of the expanding device. FIG. 3 is a cross-sectional view showing a schematic diagram of the expansion unit, the cooling table, and the like. FIG. 4 is a bottom view diagrammatically illustrating the contact surface of the cooling table. FIG. 5 is a block diagram showing a schematic diagram of the connection relationship between the cooling table, the dry gas supply unit, the lifting unit, and the cooling unit. FIG. 6 is a functional block diagram illustrating another example of components of the expanding device. FIG. 7 is a functional block diagram illustrating another example of components of the expanding device. FIG. 8 is a block diagram showing a schematic diagram of the connection relationship between the cooling table and the suction unit and the like. FIG. 9 is a cross-sectional view that typically shows the hot air injection unit and the like.

An embodiment of the present invention will be described with reference to the attached drawings. Figure 1 is a perspective view showing a workpiece unit including a workpiece to be divided by the expanding device of this embodiment.

The workpiece unit 1 shown in FIG. 1 includes a workpiece 11 having a disk-like shape. The workpiece 11 is, for example, a wafer made of a semiconductor material such as silicon (Si). The surface 11a of the workpiece 11 is partitioned into a plurality of regions by a plurality of mutually intersecting division lines (streets) 13, and a device 15 such as an IC is formed in each region.

In this embodiment, a disk-shaped wafer made of a semiconductor material such as silicon is used as the workpiece 11, but there are no limitations on the material, shape, structure, size, etc. of the workpiece 11. For example, a substrate made of other materials such as semiconductors, ceramics, resins, and metals can also be used as the workpiece 11. Similarly, there are no limitations on the type, number, shape, structure, size, arrangement, etc. of the devices 15. In addition, the devices 15 do not have to be formed on the workpiece 11.

In addition, inside the workpiece 11, a modified layer 17 is formed along the planned division line 13. The modified layer 17 is formed, for example, by irradiating the workpiece 11 along the planned division line 13 with a laser beam that has a wavelength that transmits through the workpiece 11 and has a focal point positioned inside the workpiece 11.

An expandable sheet 23 is attached to the back surface 11b of the workpiece 11 via an adhesive film 21. The adhesive film 21 is a film-like adhesive typically called a die attach film (DAF) or the like, and generally has a disk-like shape with a diameter larger than that of the workpiece 11. The adhesive film 21 is formed, for example, using a resin that hardens with heat or light, and has the function of fixing chips obtained by dividing the workpiece 11 to any target (for example, another chip or a substrate).

The expandable sheet 23, which is attached to the back surface 11b of the workpiece 11 via the adhesive film 21, is a resin film that expands when force is applied, and has, for example, a disk-like shape with a larger diameter than the adhesive film 21. Furthermore, the outer peripheral portion of the expandable sheet 23 is attached to an annular frame 25 whose inner diameter is larger than the diameters of the workpiece 11 and the adhesive film 21.

In the workpiece unit 1 shown in FIG. 1, the adhesive film 21 and the expandable sheet 23 are overlapped and attached to the workpiece 11 so that the adhesive film 21 contacts the back surface 11b of the workpiece 11. Furthermore, the outer periphery of the expandable sheet 23 is attached to the frame 25 to close the opening of the frame 25. As a result, the workpiece 11 is supported by the frame 25 via the adhesive film 21 and the expandable sheet 23.

Figure 2 is a functional block diagram showing an example of components of an expansion device. The expansion device 2 shown in Figure 2 has an expansion unit 10 for expanding the expansion sheet 23 of the workpiece unit 1 shown in Figure 1 to divide the workpiece 11 and the adhesive film 21 along the planned division line 13, and a cooling table 22 for cooling the adhesive film 21 of the workpiece unit 1.

Figure 3 is a cross-sectional view showing the expansion unit 10 and cooling table 22 included in the expansion device 2. The expansion unit 10 has multiple (e.g., four) cylinder cases 12, each of which is fixed to the housing (not shown) of the expansion device 2.

The lower end of the piston rod 14 is inserted into the upper surface of the cylinder case 12. Note that FIG. 3 shows the piston rod 14 positioned at a loading position, which is a position where the workpiece unit 1 can be loaded into the expansion device 2. The piston rod 14 can also be moved upward from the loading position.

An annular support table 16 capable of supporting the frame 25 of the workpiece unit 1 shown in FIG. 1 is fixed to the upper end of the piston rod 14. Furthermore, an annular fixed plate 18 is disposed above the support table 16.

The fixed plate 18 is supported on the housing (not shown) of the expansion device 2 so that it can move upward. Specifically, the fixed plate 18 is supported so that it is separated from the support table 16 when the piston rod 14 is in the loading position.

When the piston rod 14 moves upward with the frame 25 of the workpiece unit 1 supported on the support table 16, the fixing plate 18 comes into contact with the frame 25 and fixes the frame 25 on the support table 16. When the piston rod 14 moves further upward, the fixing plate 18 moves upward together with the support table 16 and the frame 25.

A cylindrical drum 20 is provided inside the fixed plate 18 and is fixed to the housing (not shown) of the expansion device 2. The lower end of the drum 20 is located at approximately the same height as the lower surface of the fixed plate 18 when the piston rod 14 is in the loading position, for example.

In the expansion unit 10 shown in FIG. 3, the piston rod 14 can be moved upward while the frame 25 of the workpiece unit 1 is fixed between the support table 16 and the fixed plate 18. The expansion unit 10 can also maintain the position of the piston rod 14 when the cooling table 22 is lowered.

That is, the expansion unit 10 can move the frame 25 of the workpiece unit 1 and the cooling table 22 relative to one another. By moving the cooling table 22 and the frame 25 in contact with the fixed plate 18 away from each other, the expand sheet 23 of the workpiece unit 1 is expanded.

A cylindrical support rod 30 made of metal or the like is disposed inside the drum 20. As described below, the support rod 30 is supported by the housing (not shown) of the expansion device 2 in a manner that allows it to be raised and lowered. The lower end of the support rod 30 is fixed to the cooling table 22. As described below, the support rod 30 also functions as a medium that absorbs heat from the cooling table 22 and cools the cooling table 22.

The cooling table 22 is made of a metal (e.g., aluminum (Al)) and has a disk-like shape. The lower surface of the cooling table 22 serves as a contact surface (lower surface) 22a that contacts the area of the expand sheet 23 attached to the workpiece 11 via the adhesive film 21.

Figure 4 is a schematic bottom view of the contact surface 22a of the cooling table 22. As shown in Figure 4, the contact surface 22a of the cooling table 22 is provided with a plurality of concentric circular grooves 24 and a plurality of radial grooves 26 connecting pairs of adjacent circular grooves 24. The circular grooves 24 and the radial grooves 26 are provided to have the same depth (e.g., 2.3 mm). The circular grooves 24 are also provided so that the distance between adjacent pairs of circular grooves 24 is one of two predetermined distances (e.g., 3 mm and 5 mm).

Furthermore, a plurality of through holes 28 are opened in the bottom surface of the radial grooves 26. Each of the plurality of through holes 28 penetrates from the back surface 22b, which is the back surface of the contact surface 22a of the cooling table 22, to the contact surface 22a. Note that the plurality of through holes 28 function as a supply path for supplying dry gas to the contact surface 22a, as described below.

A cover member 34 made of resin or the like is fixed to the cooling table 22. The cover member 34 has a disk-shaped rear cover portion 34a with a circular underside. The underside of the rear cover portion 34a faces the rear surface 22b of the cooling table 22 via a gap 32. An opening 34b is provided in the central area of the rear cover portion 34a, penetrating the rear cover portion 34a in the thickness direction, and the support rod 30 is inserted into the opening 34b.

In each of the multiple areas of the rear cover part 34a located directly above the multiple through holes 28 of the cooling table 22, a joint hole is provided that penetrates the rear cover part 34a in the thickness direction. A cylindrical joint 36 is inserted into this joint hole, and the inside of the joint 36 is connected to the through hole 28.

The cover member 34 further has a cylindrical outer peripheral surface cover portion 34c that extends downward from the outer peripheral edge of the rear cover portion 34a. The inner peripheral surface of the outer peripheral surface cover portion 34c faces the outer peripheral surface 22c between the contact surface 22a and the rear surface 22b of the cooling table 22 through the gap 32.

The cover member 34 also has a cylindrical joint insertion portion 34d that extends upward from the inner peripheral edge of the rear cover portion 34a. The upper portion of the joint insertion portion 34d is fixed to the support rod 30 so as to close the gap 32. The joint insertion portion 34d also has a joint hole that penetrates the joint insertion portion 34d in the radial direction. A cylindrical joint 38 is inserted into this joint hole, and the inside of the joint 38 communicates with the gap 32.

The cooling table 22 is connected to a dry gas supply unit 40, a lifting unit 42, and a cooling unit 44. FIG. 5 is a block diagram showing the connection relationship between the cooling table 22, the dry gas supply unit 40, the lifting unit 42, and the cooling unit 44.

The dry gas supply unit 40 is connected to the valve 46 and the joint 36 via piping (not shown) or the like. Therefore, by opening the valve 46, the dry gas supply unit 40 can provide dry gas to the contact surface 22a of the cooling table 22 via the valve 46, the joint 36, and the through hole 28.

The dry gas supply unit 40 is also connected to the valve 48 and the joint 38 via piping (not shown) or the like. Therefore, by opening the valve 48, the dry gas supply unit 40 can supply dry gas to the back surface 22b and the outer peripheral surface 22c of the cooling table 22 via the valve 48, the joint 38, and the gap 32.

The dry gas is adjusted so that its dew point is lower than the temperature of the cooling table 22 when the expansion unit 10 expands the expand sheet 23 of the workpiece unit 1 held on the contact surface of the cooling table 22 to break the adhesive film 21, and is higher than the dew point of the atmosphere. The dry gas supply unit 40 is composed of, for example, a cylinder containing dry gas and a compressor that adjusts the pressure of the dry gas.

The lifting unit 42 is connected to the cooling table 22 via the support rods 30, etc. The lifting unit 42 can lower the cooling table 22 via the support rods 30, etc., to bring the contact surface 22a of the cooling table 22 into contact with the expand sheet 23 of the workpiece unit 1. The lifting unit 42 is composed of, for example, a motor and a ball screw driven by the motor.

The cooling unit 44 is connected to the cooling table 22 via the support rods 30 and the like. The cooling unit 44 can cool the adhesive film 21 via the expand sheet 23, for example, by absorbing heat from the support rods 30 and cooling the cooling table 22 while the workpiece unit 1 is held on the contact surface 22a of the cooling table 22. The cooling unit 44 can be configured, for example, by a piston cooler or the like.

The operations of the expansion unit 10, the dry gas supply unit 40, the lifting unit 42, and the cooling unit 44 are controlled by a control unit 50. The control unit 50 has, for example, a processing unit 52 that generates signals for controlling the components of the expansion device 2, and a memory unit 54 that stores various information (data, programs, etc.) used in the processing unit 52.

The functions of the processing unit 52 are realized by a CPU (Central Processing Unit) that reads and executes programs stored in the memory unit 54. The functions of the memory unit 54 are realized by at least one of semiconductor memories such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), and NAND flash memory, and magnetic storage devices such as HDD (Hard Disk Drive).

The control unit 50 controls the operation of the components included in the expansion device 2 in response to signals input from the input unit 56. The input unit 56 is composed of at least one of a touch panel, a keyboard, a mouse, a button, a microphone, etc.

The input unit 56 can input a signal to the control unit 50 instructing the suppression of condensation, for example, in response to an operator's operation before the workpiece unit 1 is brought into contact with the contact surface 22a of the cooling table 22.

When this signal is input, the control unit 50 opens the valves 46 and 48. The control unit 50 then controls the dry gas supply unit 40 so that dry gas is supplied to the cooling table 22.

In this case, the dry gas supplied from the dry gas supply unit 40 is supplied to the contact surface 22a of the cooling table 22 via the valve 46, the joint 36, and the through hole 28, and is also supplied to the back surface 22b and the outer peripheral surface 22c of the cooling table 22 via the valve 48, the joint 38, and the gap 32.

Furthermore, the input unit 56 can input a signal to the control unit 50 instructing the control unit 50 to hold the workpiece unit 1 against the contact surface 22a of the cooling table 22 and expand the expand sheet 23 in response to an operator's operation.

When this signal is input, the control unit 50 controls the lifting unit 42 so that the contact surface 22a of the cooling table 22 contacts the expand sheet 23 of the workpiece unit 1. Next, the control unit 50 controls the cooling unit 44 so that the cooling table 22 is cooled.

Then, the control unit 50 controls the expansion unit 10 and/or the lifting unit 42 to expand the expand sheet 23 of the workpiece unit 1. Specifically, the control unit 50 controls the expansion unit 10 and/or the lifting unit 42 to move the piston rod 14 of the expansion unit 10 upward and/or to lower the cooling table 22. As a result, the workpiece 11 and adhesive film 21 of the workpiece unit 1 are divided along the planned division line 13.

In the expanding device 2, dry gas can be supplied to the contact surface 22a, back surface 22b and outer peripheral surface 22c of the cooling table 22 for cooling the adhesive film 21 attached to the workpiece 11. The dry gas is adjusted so that its dew point is lower than the temperature of the cooling table 22 when the adhesive film 21 is broken, and its temperature is higher than the dew point of the atmosphere.

As a result, when the expand sheet 23 attached to the adhesive film 21 is expanded to break the adhesive film 21, and before and after this, condensation is less likely to occur on the contact surface 22a, back surface 22b, and outer peripheral surface 22c of the cooling table 22, as well as on the surfaces of the components of the expansion device 2 that are close to the cooling table 22. As a result, the probability of malfunction of the device 15 formed on the surface of the workpiece 11 and failure of the expansion device 2 due to water droplets caused by condensation is reduced.

Furthermore, the expansion device according to the present invention may include components other than those of the expansion device 2 shown in FIG. 2. FIGS. 6 and 7 are functional block diagrams that show an example of the components of such an expansion device. Note that among the components of the expansion devices 60 and 66 shown in FIGS. 6 and 7, the same components as those of the expansion device 2 are given the same reference numerals, and the description of these components will be omitted.

The expansion device 60 shown in FIG. 6 has a dew point measurement unit 62 that measures the dew point of the dry gas supplied from the dry gas supply unit 40, and an alarm unit 64 that notifies the operator of various information. The dew point measurement unit 62 is, for example, composed of a dew point meter. The alarm unit 64 is, for example, composed of at least one of a display, a pilot lamp, a printer, and a speaker.

The dew point measurement unit 62 measures the dew point of the dry gas present in the gap 32 between the cooling table 22 and the cover member 34 shown in FIG. 3, for example, and inputs the measured dew point to the control unit 50. The notification unit 64 also notifies the operator of information related to the dew point of the dry gas.

The temperature of the cooling table 22 when it is cooled to break the adhesive film 21 is stored in advance in the memory unit 54 of the control unit 50 shown in FIG. 6. If this temperature varies depending on the type of adhesive film 21, the memory unit 54 may store the type of adhesive film 21 and this temperature in association with each other.

The processing unit 52 of the control unit 50 then sets a threshold dew point for the dry gas required to prevent condensation from occurring in advance. For example, if the temperature of the cooling table 22 when it is cooled to break the adhesive film 21 is T, the processing unit 52 sets any temperature in the range of T-5°C to T-2°C as the dew point threshold.

Here, when the dew point of the dry gas measured by the dew point measuring unit 62 is input to the control unit 50, the processing unit 52 compares this dew point with a threshold value. Then, if this dew point exceeds the threshold value, the processing unit 52 controls the cooling unit 44 to stop cooling the cooling table 22 and/or controls the notification unit 64 to notify the operator that this dew point has exceeded the threshold value.

Therefore, in the expansion device 60 shown in FIG. 6, when the dew point of the dry gas measured by the dew point measuring unit 62 exceeds a threshold value, cooling of the cooling table 22 is stopped and/or the operator is notified that the dew point has exceeded the threshold value.

This prevents condensation from occurring on the contact surface 22a, back surface 22b, and outer peripheral surface 22c of the cooling table 22, as well as on the surfaces of the components of the expanding device 60 that are close to the cooling table 22. As a result, malfunction of the device 15 formed on the surface of the workpiece 11 and failure of the expanding device 60 due to water droplets caused by condensation are prevented.

The expansion device 66 shown in FIG. 7 has a suction unit 68 that generates negative pressure on the contact surface 22a of the cooling table 22, and a hot air injection unit that injects hot air toward the area of the expansion sheet 23 between the outer periphery of the workpiece 11 of the workpiece unit 1 and the inner periphery of the frame 25.

Figure 8 is a block diagram showing the connection relationship between the cooling table 22 and the suction unit 68, etc. Note that Figure 8 also shows the dry gas supply unit 40, the lifting unit 42, and the cooling unit 44, etc., but the description of these components is omitted.

The suction unit 68 is connected to the valve 69 and the joint 36 via piping (not shown) or the like. In the expansion device 66 shown in FIG. 7, the through hole 28 functions not only as a supply path for supplying dry gas to the contact surface 22a, but also as a suction path for sucking in gas and generating negative pressure on the contact surface 22a.

Therefore, by closing the valve 46 and opening the valve 69, the suction unit 68 can generate negative pressure on the contact surface 22a of the cooling table 22 via the valve 69, the joint 36, and the through hole 28. The suction unit 68 is, for example, configured by an ejector.

Figure 9 is a cross-sectional view that shows a schematic of the hot air injection unit, etc. Note that Figure 9 also shows the expansion unit 10 and the cooling table 22, etc., but the description of these components is omitted.

The hot air injection unit 70 shown in FIG. 9 has a heater plate 72. The heater plate 72 has a disk-like shape and is disposed inside the support table 16. The upper surface of the heater plate 72 is disposed lower than the lower surface of the support table. The heater plate 72 is rotated by a heater plate rotation motor 74 fixed to the housing (not shown) of the expansion device.

On the upper surface of the heater plate 72, a plurality of hot air injection sections 76 are provided that inject hot air toward the expand sheet 23 between the outer peripheral edge of the workpiece 11 of the workpiece unit 1 and the inner peripheral edge of the frame 25. Specifically, the plurality of hot air injection sections 76 are provided at approximately equal intervals in the circumferential direction on the outer peripheral portion of the upper surface of the heater plate 72.

The hot air injection unit 76 comprises an injection unit body 78 that is cylindrical and has an open top and a closed bottom, and a coil heater 80 housed within the injection unit body 78. The hot air injection unit 76 is connected to an air supply source (not shown) that supplies air into the injection unit body 78. The two terminals of the coil heater 80 are connected to a switch (not shown) and a DC power source (not shown), and when this switch is in a conductive state, power is supplied from the DC power source to the coil heater 80, causing the coil heater 80 to generate heat.

A shutter plate 82 is provided above the hot air injection section 76. The shutter plate 82 has a disk-like shape with a diameter slightly smaller than the inner diameter of the support table 16, and is disposed inside the support table 16. The shutter plate 82 is rotated by a shutter plate rotation motor 84 attached to the heater plate 72. In addition, an opening 86 is provided on the outer periphery of the shutter plate 82, through which the hot air injection section 76 can be exposed.

The suction unit 68 and hot air injection unit 70 shown in Figures 7 to 9 operate after the expansion sheet 23 of the workpiece unit 1 is expanded by the expansion unit 10. That is, in the expansion device 66 shown in Figure 7, after sucking the circular area of the expansion sheet 23 held on the contact surface 22a of the cooling table 22, the slack that has occurred in the annular area surrounding this circular area is relieved.

Specifically, first, valve 46 is closed and valve 69 is opened, and suction unit 68 generates negative pressure on contact surface 22a of cooling table 22. As a result, the circular area of expanded sheet 23 that is held on contact surface 22a is sucked onto contact surface 22a.

Next, the shutter plate rotation motor 84 rotates the shutter plate 82 so that the opening 86 of the shutter plate 82 is positioned directly above the hot air injection unit 76. Next, an air supply source (not shown) connected to the hot air injection unit 76 supplies air into the injection unit main body 78.

At this time, the air supplied to the injection unit main body 78 is heated by the energized coil heater 80 to become hot air, which is then injected upward through the opening 86 of the shutter plate 82. As a result, the hot air is injected into the area of the expand sheet 23 between the outer periphery of the workpiece 11 of the workpiece unit 1 located above the opening 86 and the inner periphery of the frame 25.

Next, the heater plate rotation motor 74 rotates the heater plate 72 together with the shutter plate 82 so that hot air is sprayed in the circumferential direction of the expand sheet 23.

As a result, the annular area of the expand sheet 23 where the hot air is sprayed is heated and contracts. In other words, the slack that has occurred in that area of the expand sheet 23 expanded by the expansion unit 10 is relieved.

The expansion device according to the present invention may include all of the components shown in FIG. 2, the dew point measuring unit 62 and the notification unit 64 shown in FIG. 6, and the suction unit 68 and the hot air injection unit 70 shown in FIG. 7.

In addition, the structures and methods of the above-described embodiments and variations can be modified as appropriate without departing from the scope of the present invention.

1: Workpiece unit 11: Workpiece 13: Planned division line (street)
15: Device 17: Modified layer 21: Adhesive film 23: Expand sheet 25: Frame 2: Expanding device 10: Expansion unit 12: Cylinder case 14: Piston rod 16: Support table 18: Fixed plate 20: Drum 22: Cooling table 22a: Contact surface 22b: Back surface 22c: Outer circumferential surface 24: Circular groove 26: Radial groove 28: Through hole 30: Support rod 32: Gap 34: Cover member 34a: Back cover portion 34b: Opening 34c: Outer circumferential surface cover portion 34d: Joint insertion portion 36: Joint 38: Joint 40: Dry gas supply unit 42: Lifting unit 44: Cooling unit 46: Valve 48: Valve 50 : Control unit 52 : Processing unit 54 : Memory unit 56 : Input unit 60 : Expanding device 62 : Dew point measuring unit 64 : Notification unit 66 : Expanding device 68 : Suction unit 69 : Valve 70 : Hot air injection unit 72 : Heater plate 74 : Motor for rotating heater plate 76 : Hot air injection unit 78 : Injection unit main body 80 : Coil heater 82 : Shutter plate 84 : Motor for rotating shutter plate 86 : Opening

Claims (5)

An expanding device which, in a state in which a workpiece having a device formed in an area partitioned by a planned division line on the surface is attached to an expandable sheet that closes an opening of an annular frame via an adhesive film attached to the back surface of the workpiece as a workpiece unit, expands the expandable sheet, and breaks the adhesive film along the planned division line,
an expansion unit that holds the frame of the workpiece unit and expands the expand sheet;
a disk-shaped cooling table having a contact surface that contacts the area of the expand sheet attached to the workpiece via the adhesive film when the frame is held by the expansion unit, a back surface that is the back side of the contact surface, and an outer peripheral surface located between the contact surface and the back surface;
and a dry gas supply unit that supplies a gas adjusted to have a dew point lower than the temperature of the cooling table and a temperature higher than the dew point of the atmosphere when the adhesive film is broken to the corresponding contact surface, back surface and outer peripheral surface of the cooling table. a cover member fixed to the cooling table and facing the back surface and the outer circumferential surface through a gap;
The cooling table has a through hole formed therein, the through hole passing through from the back surface to the corresponding contact surface,
The expanding apparatus according to claim 1 , wherein the gas is supplied to the gap and the through hole. a dew point measuring unit for measuring the dew point of the gas;
a cooling unit for cooling the cooling table;
The expanding device according to claim 1 or 2, further comprising: a control unit that controls the cooling unit to stop cooling the cooling table when the dew point of the gas measured by the dew point measuring unit exceeds a threshold value. a dew point measuring unit for measuring the dew point of the gas;
an alarm unit for alarming information regarding the dew point of the gas;
3. The expansion device according to claim 1 or 2, further comprising: a control unit that controls the alarm unit to notify the user that the dew point of the gas measured by the dew point measuring unit exceeds a threshold value when the dew point of the gas measured by the dew point measuring unit exceeds a threshold value. The expansion device according to any one of claims 1 to 4, further comprising a hot air injection unit that injects hot air toward the area of the expanding sheet between the outer peripheral edge of the workpiece and the inner peripheral edge of the frame.

Images