JP7632183B2 - Substrate, substrate connection structure, and substrate manufacturing method - Google Patents

Description

The present invention relates to a substrate, a substrate connection structure, and a substrate manufacturing method.

A conductive terminal is pressed into a through hole provided in the substrate to electrically connect the conductive layer (circuit pattern) of the substrate and the terminal. Such a connection configuration is described, for example, in Patent Document 1. In the configuration described in Patent Document 1, plating is applied inside a through hole provided in a resin portion of the substrate, and the plating in the through hole is electrically connected to the conductive layer on the substrate surface. As a result, the terminal pressed into the through hole of the substrate is electrically connected to the conductive layer via the plating in the through hole.

JP 2009-16661 A

Here, a metal-based substrate based on an aluminum (Al) plate is one example of a substrate with high heat dissipation performance. In such a metal-based substrate, a terminal can be pressed into a hole in the aluminum plate and held by the inner surface of the hole in the aluminum plate. In this case, the contact area between the outer peripheral surface of the terminal and the inner peripheral surface of the hole for inserting the terminal in the conductive layer becomes the electrical path from the terminal to the conductive layer. However, it is difficult to ensure contact between the two, and it is easy to have difficulty in securing the electrical path. Also, as described in Patent Document 1, it is possible to secure an electrical path from the terminal to the conductive layer by plating the inner surface of the hole in the aluminum plate, but plating aluminum is difficult.

The present invention aims to provide a substrate, a substrate connection structure, and a substrate manufacturing method that can ensure an electrical path between a terminal inserted into a substrate having a metal plate and a conductive layer provided on the substrate.

One aspect of the present invention is a substrate having a substrate hole into which a conductive terminal is inserted, the substrate portion having a metal plate, an insulating layer, and a conductive layer provided on the insulating layer, and a current-carrying portion electrically connecting the conductive layer and the metal plate, the metal plate being provided with a metal plate hole that constitutes the substrate hole and holds the terminal by its inner surface, and the current-carrying portion connecting the conductive layer and the metal plate at a position radially outward of the inner surface of the metal plate hole.

In this board, the conductive layer and the metal plate are connected by a current-carrying portion provided on the outside of the metal plate hole. This allows the terminal inserted into the board hole to be electrically connected to the conductive layer via the metal plate that holds the terminal and the current-carrying portion. In this way, by providing a current-carrying portion, this board can ensure a current path between the terminal inserted into the board having a metal plate and the conductive layer provided on the board.

In the above substrate, the insulating layer and the conductive layer may have an insulating layer hole and a conductive layer hole, respectively, and the metal plate hole, the insulating layer hole, and the conductive layer hole may form a substrate hole. This allows the current path between the terminal and the conductive layer to be secured by the current-carrying part, even when a terminal is inserted at a position where the conductive layer and the insulating layer are provided.

In the above substrate, the insulating layer has an insulating layer slit, the conductive layer has a conductive layer slit that communicates with the insulating layer slit, and the conductive portion may be formed of solder provided in the insulating layer slit and the conductive layer slit. In this case, the conductive portion can be easily formed in this substrate by using solder.

In the above-mentioned board, the length of the conductive layer slit may be more than half the circumference of the board hole. In this case, the board can ensure a conductive area equal to or greater than that when the inner peripheral surface of the conductive layer hole is in contact with the outer peripheral surface of the terminal inserted into the board hole. This allows the board to further ensure the conductive performance of the current path between the terminal and the conductive layer.

In the above-mentioned board, the current-carrying portion may be constituted by a bolt that passes through a bolt hole provided in the conductive layer and the insulating layer and engages with a screw hole provided in the metal plate. In this case, in this board, the current-carrying path between the terminal and the conductive layer can be easily secured by engaging the bolt with the screw hole in the metal plate.

In the above-mentioned substrate, the metal plate may have a first metal plate in which a metal plate hole is provided and a second metal plate electrically insulated from the first metal plate, and the current-carrying portion may connect the first metal plate to the conductive layer. In this case, in this substrate, even if a current is applied around the metal plate hole of the first metal plate into which the terminal is inserted, the first metal plate and the second metal plate are insulated from each other, so that a short circuit of the current from the second metal plate to the surroundings can be prevented.

Another aspect of the present invention is a substrate connection structure including a substrate portion having a metal plate, an insulating layer, and a conductive layer provided on the insulating layer, a conductive terminal inserted into a substrate hole provided in the substrate portion, and a current-carrying portion electrically connecting the conductive layer and the metal plate, in which the metal plate is provided with a metal plate hole that constitutes the substrate hole and holds the terminal by its inner surface, and the current-carrying portion connects the conductive layer and the metal plate at a position radially outward of the inner surface of the metal plate hole.

In this board connection structure, the conductive layer and the metal plate are connected by a current-carrying portion provided on the outside of the metal plate hole. This allows the terminal inserted into the board hole to be electrically connected to the conductive layer via the metal plate that holds the terminal and the current-carrying portion. In this way, by providing a current-carrying portion, this board connection structure can ensure an electrical path between the terminal inserted into the board having the metal plate and the conductive layer provided on the board.

Yet another aspect of the present invention is a method for manufacturing a substrate having a substrate hole into which a conductive terminal is inserted, the method including a preparation step of preparing a substrate portion having a metal plate, an insulating layer, and a conductive layer provided on the insulating layer, and a conductive portion forming step of electrically connecting the conductive layer and the metal plate to form a conductive portion, the metal plate being provided with a metal plate hole that constitutes the substrate hole and holds the terminal by its inner surface, and the conductive portion forming step forming the conductive portion at a position radially outward of the metal plate hole relative to the inner surface of the metal plate hole.

In this circuit board manufacturing method, a current-carrying portion is formed on the outside of the metal plate hole, thereby connecting the conductive layer and the metal plate. This allows the terminal inserted into the board hole to be electrically connected to the conductive layer via the metal plate that holds the terminal and the current-carrying portion. In this way, by providing a current-carrying portion, this circuit board manufacturing method can manufacture a board that can ensure a current path between the terminal inserted into the board having a metal plate and the conductive layer provided on the board.

Various aspects of the present invention make it possible to ensure an electrical path between a terminal inserted into a substrate having a metal plate and a conductive layer provided on the substrate.

FIG. 1 is a cross-sectional view showing a board connection structure according to an embodiment. FIG. 2 is a plan view of the substrate connection structure of FIG. FIG. 3 is a perspective view showing only the inner walls of the conductive layer holes and the inner walls of the conductive layer slits. FIG. 4 is a flow chart showing the process steps of a substrate manufacturing method. FIG. 5 is a plan view of a substrate connection structure including a conductive portion according to a modified example. FIG. 6 is a cross-sectional view showing a substrate connection structure including a substrate portion according to a modified example. FIG. 7 is a cross-sectional view showing a board connection structure including a current-carrying portion according to another modified example.

The following describes an embodiment of the present invention with reference to the drawings. In each drawing, the same or corresponding elements are given the same reference numerals, and duplicate explanations are omitted.

As shown in Figures 1 and 2, the substrate connection structure 100 includes a substrate 1 and a press-fit terminal (terminal) 2. In the substrate connection structure 100, the press-fit terminal 2 is inserted into the substrate 1, and the press-fit terminal 2 is electrically connected to a conductive layer 13 provided on the substrate 1. The substrate connection structure 100 may be applied to, for example, a circuit through which a large current flows.

The press-fit terminal 2 is conductive. One end of the press-fit terminal 2 is inserted into and held in a board hole 10h provided in the board 1. In this embodiment, one end of the press-fit terminal 2 is pressed into and held in the board hole 10h. The other end of the press-fit terminal 2 is connected to wiring or the like (not shown). There are no particular limitations on the configuration of the press-fit terminal 2, as long as it is configured to be pressed into the board hole 10h.

The substrate 1 includes a substrate portion 10 and a current-carrying portion 20. The substrate portion 10 of the substrate 1 includes a substrate hole 10h into which the press-fit terminal 2 is pressed (inserted). The substrate portion 10 includes a metal plate 11, an insulating layer 12, and a conductive layer 13 provided on the insulating layer 12. The insulating layer 12 is provided on the metal plate 11. Note that other members may be interposed between the metal plate 11 and the insulating layer 12. Also, other members may be interposed between the insulating layer 12 and the conductive layer 13.

The metal plate 11 is a plate-shaped member having electrical conductivity. The metal plate 11 may have a function of dissipating heat generated at the connection portion with the press-fit terminal 2, etc. The metal plate 11 may be, for example, an aluminum plate. However, the metal material of the metal plate 11 is not particularly limited. The metal plate 11 has a metal plate hole 11h.

The insulating layer 12 is provided on the metal plate 11 and electrically insulates the conductive layer 13 from the metal plate 11. The material of the insulating layer 12 is not particularly limited. The insulating layer 12 has an insulating layer hole 12h that communicates with the metal plate hole 11h of the metal plate 11.

The conductive layer 13 is provided on the insulating layer 12. The conductive layer 13 may be, for example, a circuit pattern provided on the surface of the substrate. Although the conductive layer 13 is flat in FIG. 2, it may have a predetermined pattern shape. The conductive layer 13 may be made of, for example, copper. The conductive layer 13 has a conductive layer hole 13h that communicates with the insulating layer hole 12h of the insulating layer 12.

The metal plate hole 11h, the insulating layer hole 12h, and the conductive layer hole 13h constitute the substrate hole 10h of the substrate portion 10. In this embodiment, the metal plate hole 11h, the insulating layer hole 12h, and the conductive layer hole 13h have the same diameter. For example, in the substrate portion 10, the substrate hole 10h may be formed by drilling the conductive layer 13, the insulating layer 12, and the metal plate 11. Note that in FIG. 1, the substrate hole 10h is shown as a through hole, but the substrate hole 10h may be a non-through hole (recess). In other words, the metal plate hole 11h may not be a through hole, but may be a non-through hole (recess).

The end of the press-fit terminal 2 is inserted into the board hole 10h. The end of the current-carrying portion 20 is held by the inner surface of the metal plate hole 11h of the metal plate 11. Here, the end of the press-fit terminal 2 is pressed into the metal plate hole 11h and is gripped by the inner surface of the metal plate 11. The outer peripheral surface of the press-fit terminal 2 and the inner peripheral surface of the metal plate hole 11h are in contact with each other, so that the press-fit terminal 2 and the metal plate 11 are electrically connected.

The inner surface of the conductive layer hole 13h of the conductive layer 13 may be in partial or complete contact with the outer surface of the press-fit terminal 2, or may not be in contact with the outer surface of the press-fit terminal 2.

The current-carrying portion 20 electrically connects the conductive layer 13 and the metal plate 11. As a result, the conductive layer 13 is electrically connected to the press-fit terminal 2 via the current-carrying portion 20 and the metal plate 11. More specifically, the current-carrying portion 20 connects the conductive layer 13 and the metal plate 11 at a position radially outward of the metal plate hole 11h (substrate hole 10h) relative to the inner surface of the metal plate hole 11h (substrate hole 10h). In other words, the current-carrying portion 20 is formed at a position radially outward of the metal plate hole relative to the inner surface of the metal plate hole 11h. In this embodiment, the current-carrying portion 20 extends linearly in the vicinity of the substrate hole 10h, as shown in FIG. 2.

In this embodiment, the insulating layer 12 is provided with an insulating layer slit 12s that extends linearly. The conductive layer 13 is provided with a conductive layer slit 13s that extends linearly. The conductive layer slit 13s is connected to the insulating layer slit 12s. In this embodiment, the conductive layer slit 13s and the insulating layer slit 12s have the same length in the extension direction. In other words, when the substrate portion 10 is viewed from the conductive layer 13 side, the surface of the metal plate 11 is exposed through the conductive layer slit 13s and the insulating layer slit 12s when the current-carrying portion 20 is not provided.

In this embodiment, the current-carrying portion 20 is composed of conductive solder provided in the insulating layer slits 12s and the conductive layer slits 13s. That is, a portion of the current-carrying portion 20 abuts against the inner wall of the conductive layer slits 13s of the conductive layer 13, and another portion of the current-carrying portion 20 abuts against the surface of the metal plate 11. In this way, the current-carrying portion 20 electrically connects the conductive layer 13 and the metal plate 11.

Here, the path of the current flowing between the press-fit terminal 2 and the conductive layer 13 will be described with reference to Figures 1 and 3. Here, the path of the current flowing from the press-fit terminal 2 to the conductive layer 13 will be described. Note that Figure 3 only shows the inner wall of the conductive layer hole 13h and the inner wall of the conductive layer slit 13s provided in the conductive layer 13.

As shown in Figures 1 and 3, the current flowing from the press-fit terminal 2 to the conductive layer 13 flows from the press-fit terminal 2 to the metal plate 11 as described above, and then flows from the metal plate 11 to the conductive layer 13 via the current-carrying portion 20. In particular, as shown by arrow A, the current flows from the current-carrying portion 20 to the conductive layer 13 from the side surface of the current-carrying portion 20 in a direction perpendicular to the extension direction to the conductive layer 13 through the wall surface of the conductive layer slit 13s.

That is, at the connection portion between the current-carrying portion 20 and the conductive layer slit 13s of the conductive layer 13, the conduction area D of the current flowing from the current-carrying portion 20 to the conductive layer 13 is expressed by the following formula (1).
Conduction area D =
(Circumference of current-carrying portion 20 (length of outer periphery))×(Thickness T of conductive layer 13) (1)

In this embodiment, the width of the current-carrying portion 20 (the width of the conductive layer slit 13s) is small. Therefore, the width of the current-carrying portion 20 is ignored in the calculation of the conduction area. As a result, the conduction area D can be expressed by the following formula (2).
Conduction area D =
(Length L of conductive layer slit 13s)×(Thickness T of conductive layer 13)×2 (2)

The length L of the conductive layer slit 13s is the length along the extension direction of the conductive layer slit 13s. The length of the conductive layer slit 13s is the same as the length along the extension direction of the current-carrying section 20. The value of (length L x thickness T) is doubled because current flows from both sides of the current-carrying section 20 toward the conductive layer 13, as shown by arrow A. In other words, if the length L of the conductive layer slit 13s is short, the conduction area D also becomes small. For this reason, it is necessary to ensure a conduction area D according to the required amount of current.

Here, the path of current flowing from the press-fit terminal 2 to the conductive layer 13 when the current-carrying portion 20 is not provided will be considered. In this case, in the example of the present embodiment, as shown by the arrow B in Figs. 1 and 3, current flows from the outer peripheral surface of the press-fit terminal 2 to the conductive layer 13 via the inner peripheral surface of the conductive layer hole 13h of the conductive layer 13. In this current path, the maximum conduction area at the connection between the outer peripheral surface of the press-fit terminal 2 and the conductive layer hole 13h of the conductive layer 13 is obtained when the inner peripheral surface of the conductive layer hole 13h is in complete contact with the outer peripheral surface of the press-fit terminal 2. In other words, the maximum conduction area through the conductive layer hole 13h is the area of the inner peripheral surface of the conductive layer hole 13h. This maximum conduction area D1 through the conductive layer hole 13h is expressed by the following formula (3).
Conduction area D1 =
(Circumference L1 of conductive layer hole 13h)×(Thickness T of conductive layer 13) (3)

The conductive layer hole 13h, the insulating layer hole 12h, and the metal plate hole 11h have the same diameter. In other words, the substrate hole 10h and the conductive layer hole 13h have the same diameter. Therefore, the maximum conduction area D1 through the conductive layer hole 13h can also be expressed by the following formula (4).
Conduction area D1 =
(Circumference L1 of substrate hole 10h)×(Thickness T of conductive layer 13) (4)

In the substrate 1 of this embodiment, the conductive performance from the press-fit terminal 2 to the conductive layer 13 via the current-carrying portion 20 is ensured to be equal to or greater than the conductive performance from the press-fit terminal 2 to the conductive layer 13 via the conductive layer hole 13h. For this reason, the conduction area D of the current flowing from the current-carrying portion 20 to the conductive layer 13 is set to be equal to or greater than the maximum conduction area D1 via the conductive layer hole 13h. In other words, the following formula (5) can be obtained from the above-mentioned formulas (2) and (3).
Length L of conductive layer slit 13s ≧ Circumference L1 of conductive layer hole 13h × (½) (5)

In this manner, in this embodiment, the length L of the conductive layer slit 13s is more than half the circumferential length L1 of the conductive layer hole 13h. The diameter of the conductive layer hole 13h is the same as the diameter of the substrate hole 10h. Therefore, in other words, the length L of the conductive layer slit 13s is more than half the circumferential length of the substrate hole 10h.

Next, a method for manufacturing the substrate 1 will be described. As shown in FIG. 4, first, the substrate 10 is prepared by providing the substrate portion 10 (S101: preparation step). Next, the conductive portion 20 is formed to electrically connect the conductive layer 13 of the substrate portion 10 and the metal plate 11 (S102: conductive portion forming step). In the conductive portion forming step, the conductive portion 20 is formed at a position radially outward of the metal plate hole 11h relative to the inner surface of the metal plate hole 11h. This results in the substrate 1 being obtained.

The process of forming the substrate hole 10h in the substrate portion 10 may be performed after the current-carrying portion 20 has been formed. That is, in the preparation process of S101, the substrate portion is prepared before the substrate hole 10h is provided. Then, after the current-carrying portion 20 is formed in the current-carrying portion forming process, the substrate hole 10h may be formed in this substrate portion. Even in this case, the substrate 1 can be obtained.

As described above, in the substrate 1 and substrate connection structure 100, the conductive layer 13 and the metal plate 11 are connected by the conductive part 20 provided outside the metal plate hole 11h. As a result, in the substrate 1 and substrate connection structure 100, the press-fit terminal 2 inserted into the substrate hole 10h can be electrically connected to the conductive layer 13 via the metal plate 11 that holds the press-fit terminal 2 and the conductive part 20. In this way, the substrate 1 and substrate connection structure 100 can ensure a conductive path between the press-fit terminal 2 inserted into the substrate 1 having the metal plate 11 and the conductive layer 13 provided on the substrate 1 by providing the conductive part 20. In addition, according to the substrate manufacturing method described above, the substrate 1 can be manufactured by providing the conductive part 20, which can ensure a conductive path between the press-fit terminal 2 inserted into the substrate 1 having the metal plate 11 and the conductive layer 13 provided on the substrate 1.

Furthermore, by using such a substrate 1, the conductive layer 13 of the substrate portion 10 and the press-fit terminal 2 can be easily connected to each other without directly connecting them with solder. Furthermore, the current-carrying portion 20 that connects the metal plate 11 and the conductive layer 13 is provided at a position outside the substrate hole 10h. As a result, even if force is applied to the press-fit terminal 2, the current-carrying portion 20 is less likely to be affected by this force. In this way, since the current-carrying portion 20 is located at a position that is less likely to be affected by surrounding forces, the connection state between the metal plate 11 and the conductive layer 13 can be maintained even if the mechanical strength is low, such as when the current-carrying portion 20 is formed by solder.

In the substrate 1, the substrate hole 10h is formed by the metal plate hole 11h, the insulating layer hole 12h, and the conductive layer hole 13h. This allows the current path between the press-fit terminal 2 and the conductive layer 13 to be secured by the current-carrying part 20, even when the press-fit terminal 2 is inserted into the position where the conductive layer 13 and the insulating layer 12 are provided.

The current-carrying portion 20 is formed by solder provided in the insulating layer slits 12s and the conductive layer slits 13s. In this case, the current-carrying portion 20 can be easily formed in this substrate 1 by using solder.

The length of the conductive layer slit 13s is more than half the circumference of the board hole 10h. In this case, with this board 1, a conductive area equal to or greater than that when the inner surface of the conductive layer hole 13h is abutted against the outer surface of the press-fit terminal 2 inserted into the board hole 10h can be ensured. This allows this board 1 to further ensure the conductive performance of the current path between the press-fit terminal 2 and the conductive layer 13.

Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment. For example, the current-carrying portion 20 may be provided in a plurality of portions around the substrate hole 10h. The current-carrying portion 20 is not limited to extending linearly. The current-carrying portion 20 may be curved in the extending direction. The shape of the current-carrying portion 20 is not limited to being linear. For example, the current-carrying portion may be rectangular like the current-carrying portion 20A shown in FIG. 5, or may be a shape other than rectangular. Even in this case, as represented by the following formula (6), it is sufficient that the conduction area D2 to the conductive layer 13 when these current-carrying portions are used is equal to or larger than the maximum conduction area D1 through the conductive layer hole 13h described above.
Conduction area D2 =
(Circumference of the conductive portion (length of the outer periphery))×(Thickness T of the conductive layer 13) (6)

The metal plate 11 constituting the substrate portion 10 may have a configuration for avoiding short-circuiting of current with the surroundings. Specifically, for example, the substrate connection structure 100A shown in FIG. 6 includes a substrate 1A and a press-fit terminal 2. The substrate 1A includes a substrate portion 10A and a current-carrying portion 20. The substrate portion 10A includes a metal plate portion 11A instead of the metal plate 11 of the substrate portion 10 described above. The metal plate portion 11A includes a first metal plate 111, a second metal plate 112, and an insulating member 113.

The first metal plate 111 has a metal plate hole 11h that constitutes the board hole 10h. The second metal plate 112 is electrically insulated from the first metal plate 111 by an insulating member 113. The current-carrying section 20 electrically connects the first metal plate 111 and the conductive layer 13. In this case, in this board 1A, even if a current is applied around the metal plate hole 11h of the first metal plate 111 into which the press-fit terminal 2 is inserted, the first metal plate 111 and the second metal plate 112 are insulated from each other, so that a short circuit of the current from the second metal plate 112 to the surroundings can be prevented.

In the above, solder is used as the current-carrying portion 20, but a material other than solder may be used. Specifically, for example, as shown in FIG. 7, the board connection structure 100B includes a board 1B and a press-fit terminal 2. The board 1B includes a current-carrying portion 20B instead of the current-carrying portion 20 described above. Here, the current-carrying portion 20B is configured by a bolt 30 having electrical conductivity. The bolt 30 passes through a bolt hole 13b provided in the conductive layer 13 and a bolt hole 12b provided in the insulating layer 12, and engages with a screw hole 11b provided in the metal plate 11.

The lower surface of the head 30a of the bolt 30 abuts against the upper surface of the conductive layer 13. The threaded portion 30b of the bolt 30 abuts against the metal plate 11. This allows the bolt 30 to electrically connect the conductive layer 13 and the metal plate 11. Even when the bolt 30 is used, it is sufficient that the conduction area to the conductive layer 13 when the bolt 30 is used is equal to or greater than the maximum conduction area D1 through the conductive layer hole 13h described above. For example, the contact area between the head 30a of the bolt 30 and the upper surface of the conductive layer 13 may be used as the conduction area to the conductive layer 13 when the bolt 30 is used.

In this way, the current-carrying portion 20B may be formed by the bolt 30. In this case, in this substrate 1B, the current-carrying path between the press-fit terminal 2 and the conductive layer 13 can be easily secured by engaging the bolt 30 with the screw hole 11b of the metal plate 11.

Although the above describes the case where solder is used as the current-carrying portion 20 and the case where a bolt 30 is used as the current-carrying portion 20B, the current-carrying portion may be formed of other materials. For example, instead of solder, the current-carrying portion 20 may be formed of a conductive member formed by a metallic joining method such as brazing, ultrasonic bonding, laser welding, or arc welding. Also, instead of bolt 30, the current-carrying portion 20B may be formed of a conductive member formed by a mechanical joining method such as press-fitting or crimping.

The formation of the electrical path between the conductive layer 13 and the metal plate 11 (first metal plate 111) by the electrical current conducting portion 20 or the like may be performed before or after the wiring connection process in which the press-fit terminal 2 is inserted into the substrate 1. In addition, when the electrical current conducting portion 20 is formed by soldering, the electrical current conducting portion 20 may be formed at the same time as the soldering when mounting the chip on the substrate 1.

In addition, although the press-fit terminal 2 has been described as an example of the terminal connected to the substrate 1, the use of the press-fit terminal 2 is not limited thereto. For example, the terminal connected to the substrate 1 may be configured to be held by the inner wall of the metal plate hole 11h and to be electrically connected to the metal plate 11.

In addition, the conductive layer 13 does not have to be provided at the position of the substrate hole 10h. In other words, the substrate hole 10h may be composed of only the metal plate hole 11h, or of the metal plate hole 11h and the insulating layer hole 12h.

1, 1A, 1B Board 2 Press-fit terminal (terminal)
10, 10A Board portion 10h Board hole 11 Metal plate 11b Screw hole 11h Metal plate hole 12 Insulating layer 12b Bolt hole 12h Insulating layer hole 12s Insulating layer slit 13 Conductive layer 13b Bolt hole 13h Conductive layer hole 13s Conductive layer slit 20, 20B Current-carrying portion 30 Bolt 100, 100A, 100B Board connection structure 111 First metal plate 112 Second metal plate

Claims (8)

A substrate having a substrate hole into which a conductive terminal is inserted,
a substrate portion having a metal plate, an insulating layer, and a conductive layer provided on the insulating layer;
a current-carrying portion that electrically connects the conductive layer and the metal plate;
Equipped with
the metal plate is provided with a metal plate hole that constitutes the board hole and holds the terminal by its inner surface;
The conductive portion connects the conductive layer and the metal plate at a position radially outward of the metal plate hole relative to the inner surface of the metal plate hole. the insulating layer and the conductive layer are provided with an insulating layer hole and a conductive layer hole, respectively;
The substrate of claim 1 , wherein the metal plate hole, the insulating layer hole, and the conductive layer hole define the substrate hole. The insulating layer has an insulating layer slit,
the conductive layer is provided with a conductive layer slit communicating with the insulating layer slit,
3. The substrate according to claim 1, wherein the conductive portion is formed by solder provided in the insulating layer slits and the conductive layer slits. The substrate according to claim 3, wherein the length of the conductive layer slit is equal to or greater than half the perimeter of the substrate hole. The substrate according to claim 1 or 2, wherein the current-carrying portion is constituted by a bolt that passes through a bolt hole provided in the conductive layer and the insulating layer and engages with a screw hole provided in the metal plate. the metal plate includes a first metal plate in which the metal plate hole is provided and a second metal plate electrically insulated from the first metal plate,
The substrate according to claim 1 , wherein the conductive portion connects the first metal plate and the conductive layer. A substrate connection structure comprising: a substrate portion having a metal plate, an insulating layer, and a conductive layer provided on the insulating layer; a conductive terminal inserted into a substrate hole provided in the substrate portion; and a current-carrying portion electrically connecting the conductive layer and the metal plate,
the metal plate is provided with a metal plate hole that constitutes the board hole and holds the terminal by its inner surface;
A substrate connection structure, wherein the conductive portion connects the conductive layer and the metal plate at a position radially outward of the metal plate hole relative to the inner surface of the metal plate hole. A method for manufacturing a substrate having a substrate hole into which a conductive terminal is inserted, comprising the steps of:
A preparation step of preparing a substrate portion having a metal plate, an insulating layer, and a conductive layer provided on the insulating layer;
a current-carrying portion forming step of electrically connecting the conductive layer and the metal plate to form a current-carrying portion;
Including,
the metal plate is provided with a metal plate hole that constitutes the board hole and holds the terminal by its inner surface;
In the current-carrying portion forming step, the current-carrying portion is formed at a position radially outward of the metal plate hole relative to the inner surface of the metal plate hole.

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