JP7637560B2 - Piping detachable member cleaning device, substrate processing system, substrate processing device, and piping detachable member cleaning method - Google Patents

Description

The present invention relates to a piping detachable member cleaning device, a substrate processing system, a substrate processing apparatus, and a piping detachable member cleaning method.
Substrates to be processed include, for example, semiconductor wafers, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, substrates for solar cells, and the like.

The following Patent Document 1 discloses a substrate processing apparatus that uses a diaphragm valve having a valve seat provided in a flow path and a fluororesin diaphragm that approaches the valve seat to close the flow path and moves away from the valve seat to open the flow path.

JP 2009-222189 A

When a piping attachment/detachment component having a resin part that comes into contact with the processing liquid, such as the diaphragm valve disclosed in Patent Document 1, is used in a substrate processing apparatus, there is a risk that the processing liquid will be contaminated by impurities such as particles that are present inside the resin that makes up the resin part.
SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a piping attachment/detachment member cleaning apparatus, a substrate processing system, a substrate processing apparatus, and a piping attachment/detachment member cleaning method that are capable of satisfactorily cleaning members having resin parts.

One embodiment of the present invention provides a piping detachable member cleaning device that cleans a piping detachable member that is detachable from a processing liquid piping that supplies processing liquid to a processing unit that processes a substrate, and that has a resin part that comes into contact with the processing liquid passing through the piping detachable member. The piping detachable member cleaning device includes a cleaning fluid piping that is connectable to the piping detachable member and through which a cleaning fluid flows, the cleaning fluid piping supplying the cleaning fluid to the piping detachable member and recovering the cleaning fluid from the piping detachable member, a heating unit that heats at least one of the cleaning fluid in the cleaning fluid piping and the piping detachable member, and a physical force applying unit that applies a physical force to the cleaning fluid in the cleaning fluid piping.

According to this device, the cleaning fluid pipe can supply the cleaning fluid to the piping detachable member and can collect the cleaning fluid from the piping detachable member, so that the piping detachable member is cleaned by the cleaning fluid.
The heating unit heats at least one of the cleaning fluid flowing through the cleaning fluid pipe and the pipe detachable member, thereby heating the resin part of the pipe detachable member. By heating the resin part, the resin constituting the resin part expands. As a result, the cleaning fluid enters the minute space generated by the expansion of the resin, and the cleaning fluid can remove impurities inside the resin part.

Furthermore, the physical force imparting unit can impart physical forces such as vibration and impact to the cleaning fluid, thereby facilitating the removal of impurities inside the resin part. The application of physical force can change the position of impurities inside the resin part, and impurities may appear at the contact interface between the cleaning fluid and the resin part. In particular, the removal of impurities can be promoted by applying a physical force to the cleaning fluid while the piping attachment/detachment member is heated.

As a result, the pipe attachment/detachment components having resin parts can be cleaned satisfactorily.
In one embodiment of the present invention, the heating unit executes a temperature control cycle multiple times, with one cycle consisting of starting and stopping heating . The heating by the heating unit may be heating the resin portion to heat the resin portion and expand the resin portion. The stopping of the heating by the heating unit may be stopping heating the resin portion to shrink the resin portion.
According to this device, the temperature control cycle is executed multiple times. Therefore, heating of the resin part of the piping attachment/detachment member and stopping of heating of the resin part of the piping attachment/detachment member are repeated. Therefore, expansion of the resin due to heating of the resin part and contraction of the resin due to stopping of heating of the resin part are repeated. By repeating the expansion and contraction of the resin, the position of the impurities inside the resin part changes, and the impurities may appear at the contact interface between the cleaning fluid and the resin part. Therefore, the cleaning fluid can promote the removal of impurities inside the resin part.

In one embodiment of the present invention, the piping detachable member cleaning device further includes a discharge pipe that is directly or indirectly connected to the cleaning fluid pipe and that discharges the cleaning fluid from the cleaning fluid pipe, and a supply unit that selectively supplies multiple types of cleaning fluid to the cleaning fluid pipe. The supply unit includes multiple supply pipes that are directly or indirectly connected to the cleaning fluid pipe, and multiple switching valves that open and close each of the supply pipes to switch the type of cleaning fluid added to the cleaning fluid pipe.

According to this device, the cleaning fluid in the cleaning fluid piping is discharged from the discharge piping, and then the type of cleaning fluid supplied to the cleaning fluid piping is changed by the switching valve, so that the type of cleaning fluid in the cleaning fluid piping can be changed. Therefore, multiple types of cleaning fluid can be used to clean the piping detachable member. In addition, a cleaning fluid suitable for the piping detachable member to be cleaned can be appropriately selected.

In one embodiment of the present invention, the physical force application unit includes a flow rate change valve that is provided in the cleaning fluid pipe and changes a flow rate of the cleaning fluid in the cleaning fluid pipe.
By changing the flow rate of the cleaning fluid in the cleaning fluid pipe with the flow rate changing valve, vibration or cavitation can be generated in the cleaning fluid flowing through the piping detachable member, and a physical force can be applied to the cleaning fluid. Therefore, a physical force can be applied to the impurities via the cleaning fluid that has entered the minute space generated by the expansion of the resin. This can promote the removal of the impurities inside the resin part. Cavitation means that the generation and disappearance of bubbles are repeated in a short period of time.

In one embodiment of the present invention, the physical force application unit includes an ultrasonic generator provided in the cleaning fluid pipe.
Therefore, ultrasonic waves can be applied to the cleaning fluid in the cleaning fluid pipe and to the cleaning fluid pipe by the ultrasonic generator provided in the cleaning fluid pipe. The ultrasonic waves are transmitted to the cleaning fluid flowing through the pipe attachment/detachment member via the cleaning fluid in the cleaning fluid pipe and the cleaning fluid pipe. In other words, a physical force can be applied to the cleaning fluid. Therefore, a physical force can be applied to the impurities via the cleaning fluid that has entered the minute space generated by the expansion of the resin. This can promote the removal of impurities inside the resin part.

In one embodiment of the present invention, the heating unit includes a pipe heater that heats the cleaning fluid in the cleaning fluid pipe through the cleaning fluid pipe.
According to this device, the cleaning fluid in the cleaning fluid pipe is heated by the pipe heater. When the cleaning fluid heated by the pipe heater flows through the pipe detachable member, the resin portion of the pipe detachable member is heated.

In one embodiment of the present invention, the heating unit includes a detachable member heater configured to directly heat the piping detachable member or to heat the piping detachable member via the atmosphere surrounding the piping detachable member, thereby making it possible to efficiently heat the piping detachable member to a desired temperature.
In one embodiment of the present invention, the cleaning fluid piping includes a first pipe that supplies cleaning fluid to the piping attachment/detachment member and a second pipe that recovers the cleaning fluid from the piping attachment/detachment member. The piping attachment/detachment member cleaning device further includes a cleaning fluid tank that supplies cleaning fluid to the first pipe and recovers the cleaning fluid from the second pipe.

Therefore, the cleaning fluid supplied to the piping detachable member from the first pipe returns to the cleaning fluid tank via the second pipe. The cleaning fluid returned to the cleaning fluid tank is again supplied to the piping detachable member from the first pipe. Therefore, the cleaning fluid supplied to the piping detachable member can be reused.
In one embodiment of the present invention, the cleaning fluid pipe is connectable to the pipe detachable member in a state where it is not attached to the processing liquid pipe.

Therefore, the piping detachable member can be connected to the cleaning fluid piping before being attached to the processing liquid piping, and the piping detachable member can be cleaned with the cleaning fluid. Therefore, the substrate can be processed in the processing unit with the piping detachable member, from which impurities inside the resin part have been sufficiently removed in advance, attached to the processing liquid piping.
In one embodiment of the present invention, the piping attachment/detachment member may include a filter unit, a valve unit, or a mixing valve.

One embodiment of the present invention provides a piping detachable member cleaning device that cleans a piping detachable member having a resin part that contacts the processing liquid passing through the piping detachable member, the piping detachable member being detachable from a processing liquid piping that supplies a processing liquid to a processing unit that processes a substrate. The piping detachable member cleaning device includes a cleaning fluid piping that is connectable to the piping detachable member and through which a cleaning fluid flows, the cleaning fluid piping supplying the cleaning fluid to the piping detachable member and recovering the cleaning fluid from the piping detachable member, and a heating unit that heats at least one of the cleaning fluid in the cleaning fluid piping and the piping detachable member. The heating unit executes a temperature control cycle multiple times, with one cycle consisting of starting and stopping heating . The heating by the heating unit may be heating the resin part, heating the resin part to expand the resin part. The stopping of the heating by the heating unit may be stopping heating the resin part, stopping heating to shrink the resin part.

According to this device, the cleaning fluid pipe can supply the cleaning fluid to the piping detachable member and can collect the cleaning fluid from the piping detachable member, so that the piping detachable member is cleaned by the cleaning fluid.
The heating unit heats at least one of the cleaning fluid flowing through the cleaning fluid pipe and the pipe detachable member, thereby heating the resin part of the pipe detachable member. By heating the resin part, the resin constituting the resin part expands. As a result, the cleaning fluid enters the minute space generated by the expansion of the resin, and the cleaning fluid can remove impurities inside the resin part.

Furthermore, with this device, a temperature control cycle is executed multiple times, with heating by the heating unit and stopping of heating by the heating unit being one cycle. Therefore, heating of the resin part of the piping attachment/detachment member and stopping of heating of the resin part of the piping attachment/detachment member are repeated. Therefore, expansion of the resin due to heating of the resin part and contraction of the resin due to stopping of heating of the resin part are repeated. Repeated expansion and contraction of the resin changes the position of impurities inside the resin part, and impurities may appear at the contact interface between the cleaning fluid and the resin. Therefore, the cleaning fluid can promote the removal of impurities inside the resin part.

As a result, the pipe attachment/detachment components having resin parts can be cleaned satisfactorily.
In one embodiment of the present invention, there is provided a substrate processing system including the piping detachable member cleaning device, the processing liquid piping, and the processing unit.
Another embodiment of the present invention provides a substrate processing apparatus including a processing unit for processing a substrate with a processing liquid, a first processing liquid pipe for supplying a first processing liquid toward the processing unit, the first processing liquid pipe having a first resin portion in contact with a fluid flowing through the first processing liquid pipe, a heating unit for heating the first processing liquid in the first processing liquid pipe, and a physical force application unit for applying a physical force to the first processing liquid, wherein the first processing liquid functions as a cleaning fluid for cleaning the first resin portion.

According to this apparatus, the first processing liquid, which functions as a cleaning fluid for cleaning the first resin portion of the first processing liquid pipe, flows through the first processing liquid pipe.
The heating unit heats the first processing liquid flowing through the first processing liquid pipe, thereby heating the first resin portion of the first processing liquid pipe. Heating the first resin portion causes the resin constituting the first resin portion to expand. As a result, the first processing liquid enters a minute space generated by the expansion of the resin, and impurities inside the first resin portion can be removed by the first processing liquid.

Furthermore, the removal of impurities inside the first resin part can be promoted by applying a physical force to the first treatment liquid using the physical force application unit. The application of a physical force can change the position of the impurities inside the resin part, and impurities may appear at the contact interface between the treatment liquid and the resin part. In particular, the removal of impurities can be promoted by applying a physical force to the first treatment liquid while the first treatment liquid piping is heated.

As a result, the first processing liquid pipe having the resin portion can be cleaned satisfactorily.
In another embodiment of the present invention, the substrate processing apparatus further includes a second processing liquid piping that supplies a second processing liquid toward the processing unit, the second processing liquid piping having a second resin portion that contacts a fluid flowing through the second processing liquid supply piping, and a connecting supply piping that connects the second processing liquid piping and the first processing liquid piping.

The first processing liquid supplied to the first processing liquid pipe via the connecting supply pipe flows into the second processing liquid pipe. By heating the first processing liquid by the heating unit and applying a physical force to the first processing liquid by the physical force application unit, cleaning of the second resin portion of the second processing liquid pipe with the first processing liquid can be promoted.
Another embodiment of the present invention provides a method for cleaning a piping detachable member, the method including a cleaning fluid supply step of supplying a cleaning fluid to the piping detachable member from a cleaning fluid piping connected to the piping detachable member, a heating step of heating at least one of the cleaning fluid passing through the cleaning fluid piping and the piping detachable member by a heater, and a physical force application step of applying a physical force to the cleaning fluid flowing through the cleaning fluid piping while performing the heating step. The piping detachable member may have a resin part that contacts the processing liquid passing through the piping detachable member. The method for cleaning a piping detachable member may further include a heating stop step of stopping heating by the heater after the heating step. A temperature control cycle, in which the heating step and the heating stop step are one cycle, may be performed multiple times. The heating step may include a step of heating the resin part to expand the resin part. The heating stop step may include a step of stopping heating the resin part to contract the resin part.

Another embodiment of the present invention provides a piping detachable member cleaning method, which includes a cleaning fluid supply step of supplying a cleaning fluid to the piping detachable member from a cleaning fluid piping connected to the piping detachable member, a heating step of heating at least one of the cleaning fluid passing through the cleaning fluid piping and the piping detachable member by a heater, and a heating stop step of stopping heating by the heater after the heating step, and executes a temperature control cycle, with the heating step and the heating stop step being one cycle, multiple times. The piping detachable member may have a resin part that contacts a treatment liquid passing through the piping detachable member. The heating step may include a step of heating the resin part to expand the resin part. The heating stop step may include a step of stopping heating the resin part to contract the resin part.

FIG. 1 is a plan view for explaining an example of the configuration of a substrate processing system including a piping detachable member cleaning device and a substrate processing apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic diagram for explaining the configuration of a processing unit provided in the substrate processing apparatus. FIG. 3 is a schematic diagram for explaining a piping configuration of the substrate processing apparatus. FIG. 4 is a block diagram for explaining the electrical configuration of the substrate processing apparatus. FIG. 5 is a schematic diagram for explaining the configuration of the piping detachable member cleaning device. FIG. 6 is a block diagram for explaining the electrical configuration of the piping detachable member cleaning device. FIG. 7 is a flow chart for explaining an example (first cleaning process) of the cleaning process performed by the piping detachable member cleaning device. FIG. 8A is a schematic diagram for explaining the first cleaning treatment. FIG. 8B is a schematic diagram for explaining the first cleaning treatment. FIG. 8C is a schematic diagram for explaining the first cleaning process. FIG. 9 is a time chart for explaining the first chemical liquid supplying step in the first cleaning process. FIG. 10A is a schematic diagram for explaining the state of the resin portion of the piping attachment/detachment member before the first chemical liquid supplying step is performed. FIG. FIG. 10B is a schematic diagram for explaining the state of the resin portion of the piping attachment/detachment member during the first chemical liquid supplying step, and is a schematic diagram showing a state in which the resin portion is heated. FIG. 10C is a schematic diagram for explaining the state of the resin part of the piping attachment/detachment member during the first chemical liquid supplying step, and is a schematic diagram showing the state of the resin part after it has been cooled. FIG. 11 is a flow chart for explaining another example (second cleaning process) of the cleaning process by the piping detachable member cleaning device. FIG. 12A is a schematic diagram for explaining the second cleaning process. FIG. 12B is a schematic diagram for explaining the second cleaning process. FIG. 13 is a time chart for explaining the first chemical liquid supplying step and the high-temperature rinsing liquid supplying step in the second cleaning process. FIG. 14A is a schematic diagram for explaining the state of the resin portion of the piping attachment/detachment member during the first chemical liquid supplying step of the second cleaning treatment. FIG. 14B is a schematic diagram for explaining the state of the resin portion of the piping attachment/detachment member during the heating and rinsing step in the second cleaning process. FIG. 15 is a schematic diagram for explaining a first modified example of the piping detachable member cleaning device. FIG. 16 is a schematic diagram for explaining a second modified example of the piping detachable member cleaning device. FIG. 17 is a schematic diagram for explaining a third modified example of the piping detachable member cleaning device. FIG. 18 is a schematic diagram for explaining a fourth modified example of the piping detachable member cleaning device. FIG. 19 is a schematic diagram for explaining a piping configuration of the piping detachable member cleaning device when a cleaning process is performed in a state where the piping detachable member is attached to the substrate processing apparatus. FIG. 20 is a schematic diagram for explaining a piping configuration in a substrate processing system according to a second embodiment of the present invention. FIG. 21A is a schematic view for explaining an example of a cleaning process in the substrate processing system according to the second embodiment. FIG. 21B is a schematic view for explaining an example of the cleaning process in the substrate processing system according to the second embodiment. FIG. 21C is a schematic view for explaining an example of a cleaning process in the substrate processing system according to the second embodiment. FIG. 21D is a schematic view for explaining an example of a cleaning process in the substrate processing system according to the second embodiment. FIG. 21E is a schematic view for explaining an example of a cleaning process in the substrate processing system according to the second embodiment. FIG. 21F is a schematic view for explaining an example of a cleaning process in the substrate processing system according to the second embodiment. FIG. 22 is a graph showing the results of a particle measurement experiment measuring the number of particles removed by a cleaning fluid.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.
<Configuration of the pipe attachment/detachment member according to the first embodiment>
FIG. 1 is a plan view for explaining an example of the configuration of a substrate processing system 1 according to a first embodiment of the present invention.
The substrate processing system 1 includes a substrate processing apparatus 2 for processing substrates W, and a piping component cleaning device 3 for cleaning piping components (piping parts) that are detachable from processing liquid piping provided in the substrate processing apparatus 2.

The substrate processing apparatus 2 processes substrates W. The substrate processing apparatus 2 performs processes on the substrates W, such as etching, surface processing, imparting properties, forming a processed film, removing at least a part of a film, cleaning, and the like.
The substrate W is, for example, a semiconductor substrate. The substrate W may be a wafer. The substrate W is, for example, substantially disk-shaped. In this embodiment, the substrate processing apparatus 2 is a single-wafer processing apparatus that processes the substrates W one by one.

The substrate processing apparatus 2 includes a plurality of processing units 4 that treat substrates W with a plurality of types of processing liquids, a load port LP on which a carrier CA that accommodates a plurality of substrates W to be processed in the processing units 4 is placed, transport robots IR and CR that transport the substrates W between the load port LP and the processing units 4, and a first controller 5 that controls the substrate processing apparatus 2.
The transport robot IR transports the substrate W between the carrier CA and the transport robot CR. The transport robot CR transports the substrate W between the transport robot IR and the processing units 4. The processing units 4 have, for example, the same configuration. The processing liquid supplied to the substrate W in the processing unit 4 includes a chemical liquid, a rinse liquid, etc.

The processing units 4 form four processing towers TW arranged at four horizontally spaced positions. Each processing tower TW includes a plurality of processing units 4 stacked vertically. The four processing towers TW are arranged, two on each side of a transport path TR extending from a load port LP toward the transport robots IR and CR.
The substrate processing apparatus 2 includes a plurality of fluid boxes 6 housing valves, piping, and the like, and a storage box 7 housing a tank for storing a processing liquid used in the processing units 4. The processing units 4, the fluid boxes 6, and the storage box 7 are arranged inside a frame 8 having a generally rectangular shape in a plan view. In the example of Fig. 1, the storage box 7 is arranged inside the frame 8. Unlike the example of Fig. 1, the storage box 7 may be arranged outside the frame 8.

The storage box 7 is configured to supply processing liquid to all of the fluid boxes 6. Unlike this embodiment, the storage boxes 7 may be provided in the same number as the number of fluid boxes 6, for example. The processing liquid stored in each storage box 7 is supplied to the processing units 4 constituting the processing tower TW corresponding to the fluid box 6 via the fluid box 6 corresponding to that storage box 7.

Each processing unit 4 includes a chamber 9 and a processing cup 10 disposed in the chamber 9, and performs processing on the substrate W in the processing cup 10. The chamber 9 is formed with an entrance (not shown) through which the transport robot CR loads and unloads the substrate W. The chamber 9 is provided with a shutter unit (not shown) that opens and closes this entrance.

The piping attachment/detachment member cleaning device 3 is disposed outside the frame 8 in a clean room together with the substrate processing apparatus 2. The piping attachment/detachment member cleaning device 3 includes a cleaning unit 15 that cleans the piping attachment/detachment members (described in detail below), a second controller 16 that controls the cleaning unit 15, and a housing 17 that houses the cleaning unit 15 and the second controller 16.
<Configuration of Processing Unit>
FIG. 2 is a schematic cross-sectional view for explaining an example of the configuration of the processing unit 4. As shown in FIG.

The processing unit 4 further includes a spin chuck 20 that rotates the substrate W about a rotation axis A1 (vertical axis) while holding the substrate W at a predetermined holding position. The rotation axis A1 is a vertical line passing through the center of the substrate W. The predetermined holding position is the position of the substrate W shown in FIG. 2, where the substrate W is held in a horizontal position.
The spin chuck 20 is an example of a substrate holding unit that holds the substrate W at a predetermined holding position, and is also an example of a substrate rotation unit that rotates the substrate W about the rotation axis A1. The spin chuck 20 is also called a substrate rotation and holding unit.

The spin chuck 20 includes a spin base 21 having a horizontally extending circular disk shape, a plurality of chuck pins 22 that grip the substrate W above the spin base 21 and hold the substrate W in a holding position, a rotation shaft 23 whose upper end is connected to the spin base 21 and extends vertically, and a spin motor 24 that rotates the rotation shaft 23 around its central axis (rotation axis A1).
The multiple chuck pins 22 are arranged on the upper surface of the spin base 21 at intervals in the circumferential direction of the spin base 21. The spin motor 24 is an electric motor. The spin motor 24 rotates the rotation shaft 23, thereby rotating the spin base 21 and the multiple chuck pins 22 about the rotation axis A1. As a result, the substrate W is rotated about the rotation axis A1 together with the spin base 21 and the multiple chuck pins 22.

The processing unit 4 further includes a first processing liquid nozzle 25 that supplies a processing liquid to the upper surface of the substrate W held on the spin chuck 20, and a second processing liquid nozzle 26 that supplies a processing liquid to the upper surface of the substrate W held on the spin chuck 20.
As described above, the processing liquid is, for example, a chemical liquid or a rinse liquid. The chemical liquid is, for example, hydrofluoric acid, ammonia water, a TMAH (tetramethylammonium hydroxide) aqueous solution, hydrogen peroxide water, hydrochloric acid, sulfuric acid, ozone water, an organic solvent, or a mixture thereof.

Examples of the mixed liquid include APM liquid (ammonia-hydrogen peroxide mixture), HPM liquid (hydrochloric acid-hydrogen peroxide mixture), and SPM liquid (sulfuric acid/hydrogen peroxide mixture). An example of the organic solvent is isopropyl alcohol (IPA), but is not limited to this.

The rinse liquid is, for example, a liquid containing at least one of deionized water (DIW), carbonated water, electrolytic ionized water, reduced water, ammonia water with a diluted concentration (e.g., about 10 ppm or more and 100 ppm or less), and hydrochloric acid water with a diluted concentration (e.g., about 10 ppm or more and 100 ppm or less).
The first processing liquid nozzle 25 is connected to a downstream end of a first processing liquid pipe 30 that supplies the processing liquid to the first processing liquid nozzle 25. The first processing liquid nozzle 25 has an outlet 25a that discharges the processing liquid downward. The second processing liquid nozzle 26 is connected to a downstream end of a second processing liquid pipe 40 that supplies the processing liquid to the second processing liquid nozzle 26. The second processing liquid nozzle 26 has an outlet 26a that discharges the processing liquid downward. The first processing liquid pipe 30 is an example of a processing liquid pipe that supplies the processing liquid to the processing unit 4. The second processing liquid pipe 40 is also an example of a processing liquid pipe.

The processing liquid discharged from the first processing liquid nozzle 25 is, for example, a chemical liquid such as hydrofluoric acid, and the processing liquid discharged from the second processing liquid nozzle 26 is, for example, a rinse liquid such as DIW, and a chemical liquid such as APM liquid. As will be described in detail later, the second processing liquid nozzle 26 is configured to selectively discharge a plurality of types of processing liquid.
The first processing liquid nozzle 25 and the second processing liquid nozzle 26 are movable nozzles that are movable at least in the horizontal direction. The first processing liquid nozzle 25 is moved in the horizontal direction by a first nozzle moving mechanism 27A. The first nozzle moving mechanism 27A includes an arm (not shown) that is connected to the first processing liquid nozzle 25 and extends horizontally, and an arm moving mechanism (not shown) that moves the arm in the horizontal direction. The arm moving mechanism may have an electric motor or an air cylinder, or may have an actuator other than these.

The first processing liquid nozzle 25 is moved by a first nozzle moving mechanism 27A between a central position facing the central region of the upper surface of the substrate W and a retracted position retracted outside the processing cup 10 in a plan view.
The second processing liquid nozzle 26 is moved in the horizontal direction by a second nozzle moving mechanism 27B having a configuration similar to that of the first nozzle moving mechanism 27A. The second processing liquid nozzle 26 is moved by the second nozzle moving mechanism 27B between a central position facing a central region of the upper surface of the substrate W and a retracted position retracted to the outside of the processing cup 10 in a plan view.

The processing unit 4 includes a first waste liquid receiving member 28 that is located outside the processing cup 10 in a planar view and receives the processing liquid ejected from the first processing liquid nozzle 25 that is located in a retracted position, and a second waste liquid receiving member 29 that is located outside the processing cup 10 in a planar view and receives the processing liquid ejected from the second processing liquid nozzle 26 that is located in a retracted position.
FIG. 3 is a schematic diagram for explaining a piping configuration of the substrate processing apparatus 2. As shown in FIG.

The substrate processing apparatus 2 further includes a mixing valve 50 attached to the first processing liquid pipe 30 for mixing a plurality of types of processing liquids.
The first processing liquid piping 30 includes a plurality of (four in this embodiment) first upstream processing liquid pipings 31 that respectively supply a plurality of types of processing liquid to the mixing valve 50, and a first downstream processing liquid piping 32 that supplies the processing liquid in the mixing valve 50 to the first processing liquid nozzle 25. A downstream end of the first downstream processing liquid piping 32 is connected to the first processing liquid nozzle 25.

In this embodiment, the downstream ends of all the first upstream processing liquid pipes 31 and the upstream end of one of the first downstream processing liquid pipes 32 are connected to the mixing valve 50. The mixing valve 50 includes a plurality of upstream branch pipes 51 connected to each of the first upstream processing liquid pipes 31, a downstream branch pipe 52 connected to the first downstream processing liquid pipe 32, a plurality of branch valves 53 respectively provided in the downstream branch pipes 52 and the plurality of upstream branch pipes 51, and a common pipe 54 connected to the downstream branch pipe 52 and the plurality of upstream branch pipes 51.

The branch valve 53 is composed of a valve body. The valve body includes, for example, a valve body (not shown) with a valve seat provided therein, a valve element that opens and closes the valve seat, a diaphragm (not shown) that supports the valve element, and an actuator (not shown) that moves the valve element together with the diaphragm between an open position and a closed position. The structure of the valve body is not limited to this.

By opening and closing the valve disc, the flow rate of the liquid flowing through the valve body can be changed between a predetermined flow rate and 0 L/min. The valve body may be configured not only to switch the valve disc between open and closed positions, but also to adjust the flow rate of the liquid in the valve body in a stepped or stepless manner. The valve body described below has a similar configuration to the valve body of the branch valve 53.

The substrate processing apparatus 2 includes a plurality of first upstream processing liquid valves 33 that open and close the plurality of first upstream processing liquid pipes 31, a plurality of first processing liquid pumps 34 that send the processing liquid in the plurality of first upstream processing liquid pipes 31 to the mixing valve 50, a plurality of first processing liquid heaters 35 that heat the processing liquid in the plurality of first upstream processing liquid pipes 31, and a plurality of first processing liquid filter units 36 that remove impurities such as particles from the processing liquid in the plurality of first upstream processing liquid pipes 31.

In Figure 3, the first upstream processing liquid valve 33, the first processing liquid pump 34, the first processing liquid heater 35, and the first processing liquid filter unit 36 provided in one of the four first upstream processing liquid pipes 31 are omitted from the illustration.
The first upstream processing liquid valve 33 is provided in the corresponding first upstream processing liquid pipe 31. The first processing liquid pump 34 is provided in the corresponding first upstream processing liquid pipe 31 on the downstream side of the first upstream processing liquid valve 33.

The phrase "a member is provided on a pipe" means that the member is either detachably attached to the pipe, or that the member is integrally connected to the pipe.
The first treatment liquid pump 34 is a device that sucks in liquid and discharges the liquid that has been sucked in. The other pumps described below also have a similar configuration to the first treatment liquid pump 34.

The first processing liquid heater 35 heats the processing liquid passing through the first upstream processing liquid pipe 31 by externally heating a portion of the first upstream processing liquid pipe 31 downstream of the first processing liquid pump 34 .
The first treatment liquid heater 35 starts heating when energized by an energization mechanism (not shown) such as a power source, and stops heating when the energization to the first treatment liquid heater 35 is stopped. Other heaters described below may also be configured to start heating when energized and stop heating when the energization is stopped, similar to the first treatment liquid heater 35.

The first treatment liquid filter unit 36 is detachably attached to the first upstream treatment liquid pipe 31 downstream of the first treatment liquid heater 35. The first treatment liquid filter unit 36 includes a filter body 36a having a resin filter, and two connection pipes 36b for connecting the filter body 36a to the first treatment liquid pipe 30. The length of the connection pipes 36b may be, for example, 1 cm or more and 100 cm or less, or 5 cm or more and 50 cm or less.

In the example shown in FIG. 3 , two of the multiple first upstream processing liquid pipes 31 are configured to supply ammonia water and hydrogen peroxide solution, which are raw materials for the APM liquid, to the mixing valve 50 as processing liquids, and one of the multiple first upstream processing liquid pipes 31 is configured to supply a rinsing liquid to the mixing valve 50 as processing liquid.
The substrate processing apparatus 2 includes two first processing liquid tanks 37 to which the upstream ends of the two first upstream processing liquid pipes 31 are respectively connected. One of the two first processing liquid tanks 37 is a first tank 37A in which ammonia water is stored, and the other of the two first processing liquid tanks 37 is a second tank 37B in which hydrogen peroxide water is stored.

3, the substrate processing apparatus 2 further includes a first return pipe 38 that returns the processing liquid in the first upstream processing liquid pipe 31 connected to the first processing liquid tank 37 to the corresponding first processing liquid tank 37. The first return pipe 38 is branched off and connected to the first upstream processing liquid pipe 31 downstream of the first processing liquid filter unit 36.
Ammonia water and hydrogen peroxide water are respectively supplied to the mixing valve 50 from the two first upstream processing liquid pipes 31 , whereby an APM liquid is formed in the mixing valve 50 .

The upstream end of the first upstream processing liquid piping 31 that supplies the rinsing liquid to the mixing valve 50 is not connected to a tank, but is connected to a piping that supplies the rinsing liquid to a clean room, etc. Unlike this embodiment, the upstream end of the first upstream processing liquid piping 31 that supplies the rinsing liquid to the mixing valve 50 may be connected to a tank that stores the rinsing liquid.
The substrate processing apparatus 2 includes a second processing liquid tank 42 that stores a processing liquid such as hydrofluoric acid and is connected to the upstream end of the second processing liquid piping 40, a second upstream processing liquid valve 43 that opens and closes the second processing liquid piping 40, a second processing liquid pump 44 that sends the processing liquid in the second processing liquid tank 42 to the second processing liquid piping 40, a second processing liquid heater 45 that heats the processing liquid in the second processing liquid piping 40, a second processing liquid filter unit 46 that removes particles in the processing liquid in the second processing liquid piping 40, and a second downstream processing liquid valve unit 47 that opens and closes the second processing liquid piping 40.

The second treatment liquid pump 44 is provided in the second treatment liquid piping 40 downstream of the second upstream treatment liquid valve 43. The second treatment liquid heater 45 heats the treatment liquid passing through the second treatment liquid piping 40 by externally heating a portion of the second treatment liquid piping 40 downstream of the second treatment liquid pump 44.
The second treatment liquid filter unit 46 is detachably attached to the second treatment liquid piping 40 downstream of the second treatment liquid heater 45. The second treatment liquid filter unit 46 includes a filter body 46a having a resin filter, and two connection pipes 46b for connecting the filter body 46a to the second treatment liquid piping 40. The length of the connection pipes 46b may be, for example, 1 cm or more and 100 cm or less, or 5 cm or more and 50 cm or less.

The second downstream processing liquid valve unit 47 is detachably attached to the second processing liquid piping 40 downstream of the second processing liquid filter unit 46. The second downstream processing liquid valve unit 47 includes a valve body 47a and two connection pipes 47b for connecting the valve body 47a to the second processing liquid piping 40. The length of the connection pipes 47b may be, for example, 1 cm or more and 100 cm or less, or 5 cm or more and 50 cm or less.

The substrate processing apparatus 2 further includes a second return pipe 48 that returns the processing liquid in the second processing liquid pipe 40 to the second processing liquid tank 42. The second return pipe 48 is branched and connected to the second processing liquid pipe 40 downstream of the second processing liquid filter unit 46 in the second processing liquid pipe 40 and upstream of the second downstream processing liquid valve unit 47 in the second processing liquid pipe 40.
Each pipe may be provided with a plurality of flow rate controllers 55 for adjusting the flow rate of the liquid in the pipe. In the example shown in Fig. 3, the plurality of flow rate controllers 55 are provided in each of the plurality of first upstream processing liquid pipes 31, the first return pipe 38, the second return pipe 48, and the second processing liquid pipe 40. Each pipe may be provided with a plurality of flow meters 56 for measuring the flow rate of the liquid in the pipe. In the example shown in Fig. 3, the plurality of flow meters 56 are provided in each of the plurality of first upstream processing liquid pipes 31, the second return pipe 48, and the second processing liquid pipe 40.

The mixing valve 50 is an example of a piping attachment/detachment member 100 that is detachable from the first processing liquid piping 30. The piping attachment/detachment member 100 is a member that can be removed from the substrate processing apparatus 2 and replaced.
Similarly, the first treatment liquid filter unit 36 is also an example of a piping detachable member 100 that is detachable from the first treatment liquid piping 30. The second downstream treatment liquid valve unit 47 is also an example of a piping detachable member 100 that is detachable from the second treatment liquid piping 40. The second treatment liquid filter unit 46 is also an example of a piping detachable member 100 that is detachable from the second treatment liquid piping 40.

Each pipe attachment/detachment member 100 has a resin portion that comes into contact with the treatment liquid passing through the pipe attachment/detachment member 100. The resin portion is formed of, for example, a fluororesin.
When the piping detachable member 100 is a valve unit (the second downstream processing liquid valve unit 47) or a mixing valve 50, the resin part is, for example, a valve body, a diaphragm, etc. When the piping detachable member 100 is a filter unit (the first processing liquid filter unit 36 or the second processing liquid filter unit 46), the resin part is, for example, a filter.

The substrate processing apparatus 2 includes a plurality of upstream connection parts 60 provided in the processing liquid piping (first processing liquid piping 30 or second processing liquid piping 40) upstream of the corresponding piping attachment/detachment member 100. The substrate processing apparatus 2 includes a plurality of downstream connection parts 61 provided in the processing liquid piping (first processing liquid piping 30 or second processing liquid piping 40) downstream of the corresponding piping attachment/detachment member 100.

The upstream connection 60 has three openings. For example, the upstream connection 60 is a three-way valve or a toggle valve. Alternatively, the upstream connection 60 can be a three-way pipe and valve.
The upstream connection 60 can switch the flow of the treatment liquid through two of the three openings. For example, the upstream connection 60 may switch the flow of the treatment liquid through two of the three openings to the flow of the treatment liquid through another two openings. Alternatively, the upstream connection 60 may block the flow of the treatment liquid through two openings.

The downstream connection portion 61 has three openings. The downstream connection portion 61 typically has a similar configuration to the upstream connection portion 60.
The two openings of the upstream connection part 60 are connected to the corresponding processing liquid pipe (the first processing liquid pipe 30 or the second processing liquid pipe 40) and the piping attachment/detachment member 100. The two openings of the downstream connection part 61 are connected to the corresponding processing liquid pipe (the first processing liquid pipe 30 or the second processing liquid pipe 40) and the piping attachment/detachment member 100. The remaining opening of the upstream connection part 60 is open and can be connected to another pipe (for example, the cleaning fluid pipe 70 shown in FIG. 5 described later).

Although not shown in FIG. 5, each processing liquid supply pipe is connected to a pipe for supplying the processing liquid to another processing unit 4 and another processing tower TW.
<Electrical configuration of the substrate processing apparatus>
4 is a block diagram for explaining the electrical configuration of the substrate processing apparatus 2. The first controller 5 includes a microcomputer and controls the control targets of the substrate processing apparatus 2 according to a predetermined control program. Specifically, the first controller 5 includes a processor (CPU) 5A and a memory 5B in which the control program is stored. The first controller 5 is configured to perform various controls for substrate processing by the processor 5A executing the control program.

In particular, the first controller 5 is programmed to control the transport robots IR, CR, the spin motor 24, the first nozzle moving mechanism 27A, the second nozzle moving mechanism 27B, the multiple first processing liquid heaters 35, the second processing liquid heater 45, the multiple flow controllers 55, the multiple flow meters 56, the first processing liquid pump 34, the second processing liquid pump 44, the first upstream processing liquid valve 33, the second upstream processing liquid valve 43, the second downstream processing liquid valve unit 47, the multiple branch valves 53, and the like. The first controller 5 controls these components to perform processing of the substrate W with the processing liquid.

<Configuration of the piping detachable member cleaning device>
FIG. 5 is a schematic diagram for explaining the configuration of the piping detachable member cleaning device 3. As shown in FIG.
In the example shown in FIG. 5 , the piping detachable member cleaning device 3 has a configuration for cleaning a mixing valve 50 .
The piping detachable member cleaning device 3 is connectable to the piping detachable member 100 and includes a cleaning fluid piping 70 through which a cleaning fluid flows, and a cleaning fluid tank 73 that supplies the cleaning fluid to the cleaning fluid piping 70 and stores the cleaning fluid collected from the cleaning fluid piping 70. In the example shown in Fig. 5, the cleaning fluid piping 70 is connected to the mixing valve 50 that is not attached to the first processing liquid piping 30.

As the cleaning fluid, for example, a processing liquid used for processing the substrate W in the processing unit 4 can be used. That is, as described above, the cleaning fluid is, for example, a chemical liquid or a rinse liquid. In the following, an example in which the cleaning fluid is a cleaning liquid will be described, but the cleaning fluid does not necessarily have to be a cleaning liquid and may be a cleaning gas such as water vapor.
The chemical liquid is, for example, hydrofluoric acid, ammonia water, a TMAH aqueous solution, hydrogen peroxide water, hydrochloric acid, sulfuric acid, ozone water, an organic solvent, or a mixture of these. The cleaning fluid is preferably an alkaline liquid such as ammonia water or a TMAH aqueous solution. Examples of the mixture include APM liquid, HPM liquid, and SPM liquid. Examples of the organic solvent include, but are not limited to, IPA.

The rinse liquid is, for example, a liquid containing at least one of DIW, carbonated water, electrolytic ionized water, reduced water, ammonia water with a diluted concentration (e.g., about 10 ppm or more and 100 ppm or less), and hydrochloric acid water with a diluted concentration (e.g., about 10 ppm or more and 100 ppm or less).
The cleaning fluid piping 70 includes a first pipe 71 that supplies cleaning fluid to the piping attachment/detachment member 100, and a second pipe 72 that recovers the cleaning fluid from the piping attachment/detachment member 100. The cleaning fluid tank 73 supplies the cleaning fluid to the first pipe 71 and recovers the cleaning fluid from the second pipe 72.

The first piping 71 includes a first upstream piping 74 connected to the cleaning fluid tank 73 , and a plurality of second upstream piping 75 connecting the first upstream piping 74 and the piping attachment/detachment member 100 .
The upstream end of the first upstream pipe 74 is connected to the cleaning fluid tank 73. The upstream ends of the multiple second upstream pipes 75 are connected near the downstream end of the first upstream pipe 74. The downstream end means the downstream end and its vicinity. The downstream ends of the multiple second upstream pipes 75 can be connected to multiple upstream branch pipes 51 of the mixing valve 50, which is the pipe attachment/detachment member 100, respectively.

The upstream end of the second pipe 72 is connected to the downstream branch pipe 52 of the mixing valve 50 which is the pipe attachment/detachment member 100. The downstream end of the second pipe 72 is connected to the cleaning fluid tank 73.
The piping detachable member cleaning device 3 further includes a cleaning fluid valve 80 that opens and closes the cleaning fluid piping 70, a cleaning fluid pump 81 that sends the cleaning fluid in the cleaning fluid piping 70 to the piping detachable member 100, a piping heater 82 that heats the cleaning fluid in the cleaning fluid piping 70 via the cleaning fluid piping 70, and a cleaning fluid filter 83 that removes particles from the cleaning fluid in the cleaning fluid piping 70.

The cleaning fluid valve 80 is provided in the first upstream pipe 74. By opening and closing the cleaning fluid valve 80, the flow rate of the cleaning fluid in the cleaning fluid pipe 70 can be changed between a predetermined flow rate and 0 L/min. The cleaning fluid valve 80 is an example of a flow rate change valve that changes the flow rate of the cleaning fluid in the cleaning fluid pipe 70. The cleaning fluid valve 80 may be configured not only to open and close the cleaning fluid pipe 70, but also to adjust the flow rate of the cleaning fluid in the cleaning fluid pipe 70 in a stepwise or stepless manner.

The cleaning fluid pump 81 is provided downstream of the cleaning fluid valve 80 in the first upstream piping 74. The piping heater 82 heats the cleaning fluid passing through the first upstream piping 74 by externally heating the portion of the first upstream piping 74 downstream of the cleaning fluid pump 81. The piping heater 82 is an example of a heating unit that heats the cleaning fluid in the cleaning fluid piping 70.

By operating the cleaning fluid pump 81 while the cleaning fluid valve 80 is open, cleaning fluid is supplied from the cleaning fluid tank 73 to the first pipe 71, and cleaning fluid is supplied from the second pipe 72 to the cleaning fluid tank 73. As a result, the cleaning fluid in the cleaning fluid tank 73 is supplied to the pipe attachment/detachment member 100 via the first pipe 71, and the cleaning fluid in the pipe attachment/detachment member 100 is collected in the cleaning fluid tank 73 via the second pipe 72.

The piping detachable member cleaning device 3 further includes a discharge pipe 85 for discharging the cleaning fluid from the cleaning fluid tank 73, a discharge valve 86 provided in the discharge pipe 85 for opening and closing the discharge pipe 85, and a supply unit 90 for selectively supplying multiple types of cleaning fluid to the cleaning fluid pipe 70.
In the example shown in FIG. 5 , the discharge pipe 85 is directly connected to the cleaning fluid tank 73 , and indirectly connected to the cleaning fluid pipe 70 via the cleaning fluid tank 73 .

The supply unit 90 includes a common supply pipe 91 connected to the cleaning fluid tank 73, a merging supply pipe 92 connected to the common supply pipe 91, and a plurality of supply pipes 93 indirectly connected to the cleaning fluid pipe 70 via the common supply pipe 91, the merging supply pipe 92, and the cleaning fluid tank 73.
The plurality of supply pipes 93 respectively supply cleaning fluid supplied from a plurality of cleaning fluid supply sources (not shown) to the joint supply pipe 92. The cleaning fluid supplied to the joint supply pipe 92 is supplied to the cleaning fluid tank 73 through the common supply pipe 91.

The supply unit 90 includes a plurality of supply valves 94 provided on the plurality of supply pipes 93, respectively, for opening and closing the corresponding supply pipes 93, and a common supply valve 95 provided on the common supply pipe 91 for opening and closing the common supply pipe 91. The plurality of supply valves 94 are an example of a plurality of switching valves for switching the type of cleaning fluid supplied to the cleaning fluid pipe 70.
In the example shown in FIG. 5, three supply pipes 93 are provided, and ammonia water as the first chemical liquid, DIW as the rinsing liquid, and ozone water as the second chemical liquid are respectively supplied to the three supply pipes 93.

<Electrical configuration of the piping detachable member cleaning device>
6 is a block diagram for explaining the electrical configuration of the piping detachable member cleaning device 3. The second controller 16 includes a microcomputer and controls the control targets included in the piping detachable member cleaning device 3 according to a predetermined control program. Specifically, the second controller 16 includes a processor (CPU) 16A and a memory 16B in which the control program is stored. The second controller 16 is configured to perform various controls for the cleaning process by the processor 16A executing the control program.

In particular, the second controller 16 is programmed to control a line heater 82, a cleaning fluid pump 81, a cleaning fluid valve 80, a drain valve 86, a supply valve 94, a common supply valve 95, and the like.
The steps in the following cleaning process are executed by controlling these components with the second controller 16. In other words, the second controller 16 is programmed to execute the following steps.

<First cleaning treatment>
Fig. 7 is a flow chart for explaining an example (first cleaning process) of the cleaning process by the piping detachable member cleaning device 3. Figs. 8A to 8C are schematic views for explaining the first cleaning process.
In the first cleaning process, a piping attachment/detachment member connecting step (step S1), a temperature-controlled cleaning step (step S2), a second chemical liquid supplying step (step S3), a rinsing step (step S4), and a piping attachment/detachment member removing step (step S5) are performed in this order, as shown in Fig. 7. Fig. 9 is a time chart for explaining the temperature-controlled cleaning step (step S2).

The first cleaning process executed by the piping detachable member cleaning device 3 will be described below mainly with reference to Fig. 5 and Fig. 7. Fig. 8A to Fig. 9 will also be referred to as appropriate.
First, before being used in the substrate processing apparatus 2, i.e., before a processing liquid flows inside, the mixing valve 50 is connected as a piping attachment/detachment member 100 to the cleaning fluid piping 70 of the piping attachment/detachment member cleaning apparatus 3 as shown in Fig. 8A (piping attachment/detachment member connecting step: step S1). The cleaning fluid tank 73 may previously store the first chemical liquid to be supplied from the supply unit 90.

Then, a temperature-controlled cleaning process (step S2) is performed in which the piping attachment/detachment member 100 is cleaned by repeatedly heating the piping attachment/detachment member 100 and stopping the heating of the piping attachment/detachment member 100 while supplying a first chemical liquid to the piping attachment/detachment member 100.
Specifically, the cleaning fluid valve 80 and the plurality of branch valves 53 are opened, and the first chemical liquid is supplied to the piping detachable member 100 (first chemical liquid supplying step, cleaning fluid supplying step). While the first chemical liquid is being supplied to the piping detachable member 100, the first chemical liquid in the cleaning fluid piping 70 is heated by the piping heater 82 (heating step), as shown in FIG.

The first chemical liquid is heated by the pipe heater 82 for a predetermined heating time T1 (see FIG. 9 ) until the temperature of the first chemical liquid reaches a predetermined first cleaning temperature. The heating time T1 is, for example, 10 minutes or more.
The first cleaning temperature is higher than the treatment temperature of the treatment liquid. The treatment temperature is the temperature of the treatment liquid passing through the piping detachable member 100 in a state in which the piping detachable member 100 is connected to the first treatment liquid piping 30. The first cleaning temperature is, for example, 80° C. or higher. However, when the cleaning fluid is a liquid, the first cleaning temperature is preferably lower than the boiling point of the liquid. The cleaning fluid piping 70 may be provided with a thermometer (not shown) for measuring the temperature of the cleaning fluid in the cleaning fluid piping 70.

After the heating of the first chemical liquid by the piping heater 82 has been performed for a predetermined heating time T1, the heating of the first chemical liquid (cleaning fluid) by the piping heater 82 is stopped (heating stop process) as shown in FIG. 8C while continuing to supply the first chemical liquid to the piping attachment/detachment member 100.
The heating of the first chemical liquid is stopped, so that the first chemical liquid is cooled. The state in which the heating of the first chemical liquid is stopped continues for a predetermined heating stop time T2 (see FIG. 9 ).

By stopping the heating, the temperature of the first chemical liquid gradually decreases, and the temperature of the first chemical liquid reaches a predetermined cooling temperature. The cooling temperature is, for example, room temperature (for example, 25° C.). The room temperature is, for example, the temperature in a clean room in which the piping attachment/detachment member cleaning device 3 is arranged together with the substrate processing apparatus 2, that is, room temperature.
9, the heating of the first chemical liquid in the cleaning fluid piping 70 and the cessation of the heating of the first chemical liquid are repeated at least once more. In this manner, a temperature control cycle, in which the heating of the first chemical liquid in the cleaning fluid piping 70 and the cessation of the heating of the first chemical liquid form one cycle, is executed multiple times. During the execution of the temperature control cycle, the supply of the first chemical liquid to the piping attachment/detachment member 100 continues.

After the temperature control cycle is performed multiple times, a second chemical liquid supplying step (step S3) of supplying a second chemical liquid such as ozone water to the piping detachable member 100 and a rinsing step (step S4) of supplying a rinsing liquid such as DIW to the piping detachable member 100 to remove the chemical liquid from the piping detachable member 100 are sequentially performed. The second chemical liquid supplying step and the rinsing step are also examples of the cleaning fluid supplying step.
After the first chemical liquid supplying step is completed and before the second chemical liquid supplying step is started, the first chemical liquid is discharged from the cleaning fluid tank 73 and the cleaning fluid piping 70 via the discharge piping 85, and the second chemical liquid is supplied from the supply unit 90 to the cleaning fluid tank 73 and the cleaning fluid piping 70. As a result, the cleaning fluid in the cleaning fluid piping 70 is switched from the first chemical liquid to the second chemical liquid, and the second chemical liquid step is started.

After the second chemical liquid supplying step is completed and before the rinsing liquid supplying step is started, the second chemical liquid is discharged from the cleaning fluid tank 73 and the cleaning fluid piping 70 via the discharge piping 85, and the rinsing liquid is supplied from the supply unit 90 to the cleaning fluid tank 73 and the cleaning fluid piping 70. As a result, the cleaning fluid in the cleaning fluid piping 70 is switched from the second chemical liquid to the rinsing liquid.
During the switch between types of cleaning fluid, the cleaning fluid valve 80 may be closed or open.

After the second chemical liquid supplying step (step S3) and the rinsing step (step S4) are performed, the mixing valve 50 serving as the piping attachment/detachment member 100 is removed from the cleaning fluid piping 70 (piping attachment/detachment member removal step: step S5).
This completes the first cleaning process by the piping attachment/detachment member cleaning apparatus 3. In the first cleaning process, the cleaning fluid piping 70 supplies the cleaning fluid to the piping attachment/detachment member 100, and can also collect the cleaning fluid from the piping attachment/detachment member 100. Therefore, the piping attachment/detachment member 100 is cleaned by the cleaning fluid. After the first cleaning process is performed, the mixing valve 50, which is the piping attachment/detachment member 100, is connected to the first processing liquid piping 30 of the substrate processing apparatus 2.

The piping detachable member 100 cleaned by a dedicated device called the piping detachable member cleaning device 3 is attached to the substrate processing apparatus 2. Therefore, it is possible to reduce downtime that occurs when the entire operation of the substrate processing apparatus 2 is stopped to clean the piping detachable member 100.
Furthermore, the piping detachable member 100 that has been thoroughly cleaned in advance by the piping detachable member cleaning device 3 is attached to the substrate processing apparatus 2. This makes it possible to shorten the time required for starting up the substrate processing apparatus 2 after replacing the piping detachable member 100. Starting up the substrate processing apparatus 2 means, for example, the start of substrate processing.

By using the piping detachable member cleaning device 3, the first chemical liquid in the cleaning fluid piping 70 is discharged from the discharge piping 85, and then the type of cleaning fluid supplied to the cleaning fluid piping 70 is changed by the multiple supply valves 94, thereby making it possible to change the type of cleaning fluid in the cleaning fluid piping 70. Therefore, multiple types of cleaning fluid can be used to clean the piping detachable member 100. In addition, it is possible to appropriately select a cleaning fluid suitable for the piping detachable member 100 to be cleaned.

When the piping detachable member cleaning device 3 is used, the cleaning fluid supplied from the first piping 71 to the piping detachable member 100 returns to the cleaning fluid tank 73 via the second piping 72. The cleaning fluid returned to the cleaning fluid tank 73 is supplied again to the piping detachable member 100 from the first piping 71. In other words, the cleaning fluid supplied to the piping detachable member 100 can be reused.
The piping detachable member 100 cleaned by the piping detachable member cleaning device 3 is preferably a member used in the substrate processing apparatus 2 to supply liquids having a relatively low cleaning power against organic matter, such as DIW, hot water, hydrochloric acid, hydrofluoric acid, etc.

In the first cleaning process, the temperature control cycle is executed only in the first chemical liquid supplying step. However, in addition to the first chemical liquid supplying step, the temperature control cycle may also be executed in at least one of the second chemical liquid supplying step and the rinsing liquid supplying step.
<Change in state of resin part of piping attachment/detachment member in first cleaning process>
10A to 10C are schematic diagrams for explaining the state of the resin part 101 of the piping attachment/detachment member 100. In detail, Fig. 10A shows the state of the resin part 101 before the first chemical liquid cleaning step is performed. Fig. 10B shows the state of the resin part 101 being heated, and Fig. 10C shows the state after heating of the resin part 101 is stopped and the resin part 101 has been sufficiently cooled.

10A , the resin portion 101 is composed of a plurality of lumps of resin 102. The lumps of resin 102 are composed of a single polymer molecule or a plurality of polymer molecules. Impurities 103 are attached to the surface of the resin portion 101. The impurities 103 are present not only on the surface of the resin portion 101 but also inside the resin portion 101.
Hereinafter, the impurities 103 attached to the surface of the resin portion 101 may be referred to as first impurities 103A, and the impurities 103 present inside the resin portion 101 may be referred to as second impurities 103B. The second impurities 103B are mainly attached to the lump resin 102. The second impurities 103B are mainly present between the lump resin 102.

For example, when the resin portion 101 is formed by injection molding, the impurities 103 get into the inside of the resin portion 101. The impurities 103 are also called particles, and are, for example, organic matter.
When the resin portion 101 is washed with the first chemical solution at room temperature, the first impurities 103A can be removed, but the second impurities 103B located inside the resin portion 101 are difficult to remove.

In the first cleaning process described above, the first chemical liquid flowing through the cleaning fluid pipe 70 is heated by the pipe heater 82, thereby heating the resin part 101 of the pipe detachable member 100. By heating the resin part 101, the lump resin 102 constituting the resin part 101 expands as shown in FIG. 10B. This allows the first chemical liquid to enter the minute space (gap 104) generated by the expansion of the lump resin 102, and the first chemical liquid can remove the impurities 103 (second impurities 103B) inside the resin part 101. In more detail, the impurities 103 can be removed by dissolving them in the first chemical liquid. Alternatively, the impurities 103 can be removed by the liquid flow of the first chemical liquid.

Furthermore, in the first cleaning process, a temperature control cycle is executed multiple times, with one cycle consisting of heating the first chemical liquid by the piping heater 82 and stopping the heating of the first chemical liquid by the piping heater 82. Therefore, heating of the resin portion 101 and stopping of heating of the resin portion 101 are repeated. Therefore, expansion of the lump resin 102 due to heating of the resin portion 101 and contraction of the lump resin 102 due to stopping of heating of the resin portion 101 are repeated.

The repeated expansion and contraction of the lump resin 102 pushes out the second impurities 103B inside the resin part 101, as shown in FIG. 10C. This causes the position of the second impurities 103B to change, and impurities 103 may appear at the contact interface between the first chemical liquid and the resin part 101. Therefore, the first chemical liquid can promote the removal of the impurities 103 (second impurities 103B) inside the resin part 101. As a result, the piping attachment/detachment member 100 having the resin part 101 can be well cleaned.

In addition, by using the piping detachable member cleaning device 3, the piping detachable member 100 can be connected to the cleaning fluid piping 70 before being attached to the processing liquid piping (the first processing liquid piping 30 or the second processing liquid piping 40 shown in FIG. 3), and the piping detachable member 100 can be cleaned with the cleaning fluid. Therefore, the piping detachable member 100 from which the impurities 103 inside the resin part 101 have been sufficiently removed in advance can be attached to the first processing liquid piping 30 or the second processing liquid piping 40 to perform substrate processing.

<Second cleaning treatment>
By using the piping detachable member cleaning device 3, it is possible to carry out a cleaning process different from the first cleaning process described above.
Fig. 11 is a flow chart for explaining another example (second cleaning process) of the cleaning process by the piping detachable member cleaning device 3. Fig. 12A and Fig. 12B are schematic views for explaining the second cleaning process.

In the second cleaning process, a piping detachable member connecting step (step S1), a physical cleaning step (step S10), a second chemical liquid supplying step (step S3), a rinsing step (step S4), and a piping detachable member removing step (step S5) are performed in this order, as shown in Fig. 11. Fig. 13 is a time chart for explaining the physical cleaning step (step S10).
The second cleaning process performed by the piping detachable member cleaning device 3 will be described below with reference to Fig. 5 and Fig. 11, focusing on differences from the first cleaning process. Figs. 12A to 13 will also be referenced as appropriate.

In the second cleaning process, after the piping attachment/detachment member connecting step (step S1), a physical force cleaning step (step S10) is executed in which the piping attachment/detachment member 100 is cleaned while applying a physical force to the first chemical liquid.
Specifically, the cleaning fluid valve 80 and the plurality of branch valves 53 are opened, and the first chemical liquid is supplied to the piping detachable member 100 (first chemical liquid supplying step, cleaning fluid supplying step). While the first chemical liquid is being supplied to the piping detachable member 100, the first chemical liquid in the cleaning fluid piping 70 is heated by the piping heater 82 (heating step), as shown in Fig. 12A. Heating of the first chemical liquid by the piping heater 82 continues until the physical force cleaning step (step S10) is completed.

The first chemical liquid is heated by the piping heater 82, and the temperature of the first chemical liquid reaches a predetermined second cleaning temperature. The second cleaning temperature is higher than the treatment temperature when the piping attachment/detachment member 100 is connected to the first treatment liquid piping 30. The second cleaning temperature is, for example, 80°C or higher. However, if the cleaning fluid is a liquid, it is preferable that the second cleaning temperature is lower than its boiling point.

While heating the first chemical liquid supplied to the piping attachment/detachment member 100, a physical force is applied to the first chemical liquid (physical force application process). Specifically, as shown in Figures 12A and 12B, a physical force is applied to the first chemical liquid by opening and closing the cleaning fluid valve 80 (valve opening and closing process). Figure 12A shows a state in which the cleaning fluid valve 80 is open, and Figure 12B shows a state in which the cleaning fluid valve 80 is closed.

More specifically, by opening and closing the cleaning fluid valve 80, vibration or cavitation is generated in the first chemical liquid, and thus a physical force such as an impact can be applied to the first chemical liquid. Cavitation means that air bubbles are repeatedly generated and disappeared in a short period of time. The cleaning fluid valve 80 is an example of a physical force application unit.
The cleaning fluid valve 80 is opened and closed at a predetermined time interval. For example, the cleaning fluid valve 80 is opened and closed at an interval of, for example, 10 seconds. Specifically, after the cleaning fluid valve 80 is closed, the cleaning fluid valve 80 is quickly opened, and after a predetermined time interval has elapsed, the cleaning fluid valve 80 is closed again.

The supply of the first chemical liquid to the piping attachment/detachment member 100 continues for a predetermined chemical liquid supply time T3 (see FIG. 13 ). The chemical liquid supply time is, for example, 10 minutes or more.
After the supply of the first chemical liquid during the chemical liquid supply time, the supply of the rinsing liquid to the piping detachable member 100 is started while maintaining heating by the piping heater 82 (heating rinsing process). As a result, the rinsing liquid is heated by the piping heater 82, and the temperature of the rinsing liquid reaches a predetermined second cleaning temperature. In the heating rinsing process as well, a physical force is applied to the rinsing liquid while heating the rinsing liquid supplied to the piping detachable member 100 (physical force application process). Specifically, as shown in Figures 12A and 12B, a physical force is applied to the first chemical liquid by opening and closing the cleaning fluid valve 80 (valve opening and closing process). The valve opening and closing operations are as described above.

The supply of the rinsing liquid to the piping attachment/detachment member 100 continues for a predetermined rinsing liquid supply time T4 (see FIG. 13 ). The rinsing liquid supply time is, for example, 10 minutes or more. After the first chemical liquid supply step is completed and before the heating and rinsing step is started, the cleaning fluid in the cleaning fluid piping 70 is switched from the first chemical liquid to the rinsing liquid.
Thereafter, a physical cleaning cycle is repeated multiple times, the cycle consisting of a first chemical liquid supplying process in which a first chemical liquid to which a physical force has been applied is supplied to the piping attachment/detachment member 100 while heating the piping attachment/detachment member 100, and a heating rinsing process in which a rinsing liquid to which a physical force has been applied is supplied to the piping attachment/detachment member 100 while heating the piping attachment/detachment member 100.

After the physical cleaning cycle is performed multiple times, a second chemical liquid supplying step (step S3), a rinsing step (step S4), and a piping attachment/detachment member removing step (step S5) are performed in sequence.
<Change in state of resin part of piping attachment/detachment member in second cleaning process>
14A and 14B are schematic diagrams for explaining the state of the resin part 101 of the piping attachment/detachment member 100. Fig. 14A shows the state of the resin part 101 during the first chemical liquid supplying step of the second cleaning process, and Fig. 14B shows the state of the resin part 101 during the heating and rinsing step during the execution of the second cleaning process.

In the second cleaning process described above, the first chemical liquid flowing through the cleaning fluid pipe 70 is heated by the pipe heater 82, thereby heating the resin part 101 of the pipe detachable member 100. By heating the resin part 101, the lump resin 102 constituting the resin part 101 expands as shown in FIG. 14A. This allows the first chemical liquid to enter the minute space (gap 104) generated by the expansion of the lump resin 102, and the first chemical liquid can remove the impurities 103 (second impurities 103B) inside the resin part 101.

Furthermore, in the second cleaning process, the cleaning fluid valve 80 applies a physical force such as vibration or impact to the first chemical liquid, thereby facilitating the removal of impurities 103 inside the resin part 101. The application of a physical force may cause the position of the impurities 103 inside the resin part 101 to change, and the impurities 103 may appear at the contact interface between the cleaning fluid and the resin part 101. In particular, the removal of impurities 103 can be promoted by applying a physical force while the piping detachable member 100 is heated. The physical force is also transmitted to the resin part 101 via the cleaning fluid flowing through the piping detachable member 100 or the cleaning fluid piping 70.

Then, as shown in FIG. 14B, by supplying a rinsing liquid to the piping attachment/detachment member 100, the impurities 103 that have newly appeared on the surface of the resin part 101 can be sufficiently removed. Even when the piping attachment/detachment member 100 is cleaned with the rinsing liquid, the application of heat and physical force to the resin part 101 continues. Therefore, the impurities 103 inside the resin part 101 can be removed more effectively.

The first and second cleaning processes can be combined, i.e. it is also possible to apply a physical force to the cleaning fluid while performing the temperature regulation cycle.
11 to 13, the application of physical force and heating of the cleaning fluid are continued in both the first chemical liquid supply step and the heating and rinsing step. However, unlike the above-mentioned cleaning process, the application of physical force may be performed in only one of the first chemical liquid supply step and the heating and rinsing step. It is preferable that the application of physical force is performed in the first chemical liquid supply step rather than the heating and rinsing step.

<Modification of the piping detachable member cleaning device>
In the following, modified examples of the piping detachable member cleaning device 3 will be described with reference to Figures 15 to 18. In each of the modified examples in Figures 15 to 18, the same reference numerals as in Figure 1 etc. will be used to designate the same components as those shown in Figures 1 to 14B described above, and the description thereof will be omitted.
15 is a schematic diagram for explaining a first modified example of the detachable piping member cleaning device 3. The detachable piping member cleaning device 3 according to the first modified example includes an ultrasonic generator 110 provided in the cleaning fluid filter 83 in the first upstream piping 74. The ultrasonic generator 110 is an example of a physical force application unit that applies a physical force to the cleaning fluid in the cleaning fluid piping 70.

The ultrasonic generator 110 includes, for example, a piezoelectric element, and is capable of generating ultrasonic waves by applying a voltage to the piezoelectric element.
In the physical force cleaning step (step S10) in the second cleaning process, ultrasonic waves can be applied to the cleaning fluid in the first upstream pipe 74 of the cleaning fluid pipe 70 and the cleaning fluid pipe 70 by the ultrasonic generator 110 (ultrasonic wave application step). Ultrasonic waves are transmitted to the cleaning fluid flowing through the piping detachable member 100 or the piping detachable member 100 through the cleaning fluid in the cleaning fluid pipe 70 and the cleaning fluid pipe 70. In other words, physical force can be applied to the cleaning fluid flowing through the piping detachable member 100 or the piping detachable member 100 (physical force application step). Therefore, physical force can be applied to the second impurity 103B through the cleaning fluid that has entered the gap 104 (microspace) generated by the expansion of the lump resin 102. This can promote the removal of the impurities 103 inside the resin part 101.

Even when applying a physical force using the piping detachable member cleaning device 3 according to the first modified example shown in FIG. 15, the application of a physical force and the heating of the cleaning fluid may be continued in both the first chemical liquid supply step and the heating rinsing step, as in the cleaning process shown in FIGS. 11 to 13. Also, the application of a physical force may be performed in only one of the first chemical liquid supply step and the heating rinsing step.

It is also possible to combine applying an impact to the cleaning fluid by opening and closing a valve such as the cleaning fluid valve 80, and applying ultrasonic waves generated by the ultrasonic generator 110 to the cleaning fluid. That is, in the physical force cleaning process (step S10), both the physical force by opening and closing a valve and the physical force by the ultrasonic generator 110 may be applied to the cleaning fluid. This allows a stronger physical force to be applied to the cleaning fluid, effectively removing the second impurity 103B from inside the resin portion 101.

Figure 16 is a schematic diagram for explaining a second modified example of the piping detachable member cleaning device 3. The piping detachable member cleaning device 3 according to the second modified example further includes a detachable member heater 111 configured to heat the mixing valve 50, which is the piping detachable member 100, instead of the piping heater 82. The detachable member heater 111 may be a direct heating heater that is attached directly to the outer surface of the piping detachable member 100 and directly heats the piping detachable member 100.

The detachable member heater 111 may be configured to heat the piping detachable member 100 via the atmosphere around the mixing valve 50. In other words, the detachable member heater 111 may be an atmosphere heater that is disposed apart from the piping detachable member 100 and heats the atmosphere around the piping detachable member 100.
The first cleaning process shown in Fig. 7 can be performed using the piping detachable member cleaning device 3 according to the second modified example. In the temperature-controlled cleaning step (step S2), the piping detachable member 100 is heated by the detachable member heater 111 for a predetermined heating time, and the temperature of the piping detachable member 100 reaches a predetermined first cleaning temperature. After the heating of the piping detachable member 100 by the detachable member heater 111 is performed for the predetermined heating time, the heating of the piping detachable member 100 by the detachable member heater 111 is stopped while the supply of the first chemical liquid to the piping detachable member 100 is continued (heating stop step).

The heating of the piping detachable member 100 by the detachable member heater 111 is stopped, whereby the piping detachable member 100 is cooled. The heating of the detachable member heater 111 is stopped for a predetermined heating stop time. By stopping the heating, the piping detachable member 100 reaches a predetermined cooling temperature.
Thereafter, heating of the piping detachable member 100 by the detachable member heater 111 and stopping of heating of the piping detachable member 100 by the detachable member heater 111 are repeated at least once more. In this manner, in the piping detachable member cleaning device 3 according to the second modified example, a temperature control cycle, in which heating of the piping detachable member 100 and stopping of heating of the piping detachable member 100 constitute one cycle, is executed multiple times. The supply of the first chemical liquid to the piping detachable member 100 continues during the execution of the temperature control cycle.

Similarly, the second cleaning process shown in FIG. 11 can be performed using the piping detachable member cleaning device 3 according to the second modified example.
In the physical force cleaning process (step S10), the pipe detachable member 100 is heated by the detachable member heater 111 while a cleaning fluid is supplied to the pipe detachable member 100 (heating process). Heating of the pipe detachable member 100 is continued until the physical force cleaning process (step S10) is completed. The pipe detachable member 100 is heated by the detachable member heater 111, and the temperature of the pipe detachable member 100 reaches a predetermined second cleaning temperature.

In the physical force cleaning process (step S10), a physical force is applied to the first chemical liquid while the piping detachable member 100 is heated (physical force application process). After the first chemical liquid is supplied for a predetermined chemical liquid supply time T3 (see FIG. 13), the supply of rinsing liquid to the piping detachable member 100 is started while maintaining the heating by the detachable member heater 111 and the application of physical force (heating rinsing process). As a result, the piping detachable member 100 is heated by the detachable member heater 111, and the temperature of the piping detachable member 100 reaches the predetermined second cleaning temperature. The supply of rinsing liquid to the piping detachable member 100 continues for a predetermined rinsing liquid supply time T4 (see FIG. 13).

Thereafter, a physical cleaning cycle is repeated multiple times, the cycle consisting of a first chemical liquid supplying process in which a first chemical liquid to which a physical force has been applied is supplied to the piping attachment/detachment member 100 while heating the piping attachment/detachment member 100, and a heating rinsing process in which a rinsing liquid to which a physical force has been applied is supplied to the piping attachment/detachment member 100 while heating the piping attachment/detachment member 100.
When the piping detachable member cleaning device 3 according to the second modification is used, the piping detachable member 100 is heated directly or via the atmosphere surrounding the piping detachable member 100. Therefore, the piping detachable member 100 can be efficiently heated to a desired temperature.

Although not shown, it is also possible to provide both the piping heater 82 and the detachable member heater 111. That is, it is sufficient that at least one of the piping heater 82 and the detachable member heater 111 is provided as the heating unit.
Fig. 17 is a schematic diagram for explaining a third modified example of the piping detachable member cleaning device 3. The piping configuration of the piping detachable member cleaning device 3 does not have to be the piping configuration shown in Fig. 5. For example, like the piping detachable member cleaning device 3 according to the third modified example shown in Fig. 17, the piping configuration may be different from that of the piping detachable member cleaning device 3 shown in Fig. 5.

For example, the discharge pipe 85 may be directly connected to the cleaning fluid pipe 70. In a third modified example shown in FIG.
In addition, in the piping configuration shown in FIG. 5, the multiple supply pipes 93 are indirectly connected to the cleaning fluid pipes 70, but as in the third modified example shown in FIG. 17, the multiple supply pipes 93 may be directly connected to the cleaning fluid pipes 70.

17 , the discharge pipe 85 may be directly connected to the cleaning fluid tank 73, and the multiple supply pipes 93 may be directly connected to the cleaning fluid pipe 70. Alternatively, the discharge pipe 85 may be directly connected to the cleaning fluid pipe 70, and the multiple supply pipes 93 may be directly connected to the cleaning fluid tank 73.
Fig. 18 is a schematic diagram for explaining a fourth modified example of the piping detachable member cleaning apparatus 3. Like the piping detachable member cleaning apparatus 3 according to the fourth modified example shown in Fig. 18, the cleaning fluid piping 70 may be configured suitable for cleaning the valve unit and the filter unit before being used in the substrate processing apparatus 2, i.e., before the processing liquid flows therethrough.

In more detail, the first pipe 71 of the cleaning fluid pipe 70 may not be branched and may have a single upstream end and a single downstream end. The upstream end of the first pipe 71 is connected to the cleaning fluid tank 73. The downstream end of the first pipe 71 can be connected to the valve unit. The downstream end of the first pipe 71 can also be connected to the filter unit. FIG. 18 illustrates an example in which the second downstream processing liquid valve unit 47 is connected to the downstream end of the first pipe 71 and the upstream end of the second pipe 72. In FIG. 18, a pipe heater 82 is provided, but as in the second modified example shown in FIG. 16, a removable member heater may be provided to directly heat the valve unit or the filter unit, or to heat the atmosphere around these units.

<Cleaning of piping attachment/detachment members attached to substrate processing apparatus>
Fig. 19 is a schematic diagram for explaining the piping configuration of the piping attachment/detachment member cleaning device 3 when cleaning processing is performed on the piping attachment/detachment member 100 in a state where it is attached to the substrate processing apparatus 2. As shown in Fig. 19, the piping attachment/detachment member cleaning device 3 may perform cleaning processing on the piping attachment/detachment member 100 in a state where it is attached to the substrate processing apparatus 2. In this case, the downstream end of the first piping 71 is connected to the opening of the upstream connection part 60, and the upstream end of the second piping 72 is connected to the opening of the downstream connection part 61. Fig. 19 illustrates an example in which the cleaning fluid piping 70 is connected to the upstream connection part 60 and the downstream connection part 61 corresponding to the first processing liquid filter unit 36.

As shown in Figure 19, when the downstream end of the first pipe 71 is connected to the opening of the upstream connection part 60 and the upstream end of the second pipe 72 is connected to the opening of the downstream connection part 61, only the target pipe attachment/detachment member 100 is cleaned, thereby suppressing the spread of contamination due to cleaning.
Furthermore, unlike the first embodiment, when the piping detachable member 100 is washed with the processing liquid flowing through the processing liquid piping toward the processing unit 4, it is not easy to change the type and concentration of the liquid used for washing. However, since a dedicated device (piping detachable member washing device 3) is used, it is easy to change the type and concentration of the washing fluid.

Although not shown, if the downstream end of the first pipe 71 is connected to the opening of the upstream connection part 60 without connecting the second pipe 72 to the downstream connection part 61, not only the pipe attachment/detachment member 100 but also the corresponding treatment liquid pipe (first treatment liquid pipe 30 or second treatment liquid pipe 40) and treatment liquid nozzle (first treatment liquid nozzle 25 or second treatment liquid nozzle 26) can be washed. If the treatment liquid nozzle is placed in the retracted position, the first waste liquid receiving member 28 or the second waste liquid receiving member 29 can also be washed.

<Substrate Processing System According to Second Embodiment>
The main difference between the substrate processing system 1P according to the second embodiment and the substrate processing system 1 according to the first embodiment (see FIG. 1) is that the substrate processing system 1P according to the second embodiment does not include a piping detachable member cleaning device 3 (see FIG. 1), and the processing liquid used to process the substrate W in the substrate processing device 2P functions as a cleaning fluid.

20, the same components as those shown in the above-mentioned Figures 1 to 19 are denoted by the same reference numerals as in Figure 1, etc., and the description thereof will be omitted. The same applies to Figures 21A to 21F described later.
The substrate processing apparatus 2P is configured to be able to supply a plurality of types (four types in this embodiment) of processing liquids to the processing units 4. The processing liquids used in the substrate processing apparatus 2P are APM liquid, DIW, HPM liquid, and hydrofluoric acid.

In the substrate processing apparatus 2P, three first upstream processing liquid pipes 31 are provided, and the three first upstream processing liquid pipes 31 are configured to supply APM liquid, DIW, and HPM liquid to the mixing valve 50 as processing liquids.
An APM liquid supply source 121, a DIW supply source 122, and an HPM liquid supply source 123 are connected to the upstream ends of the three first upstream processing liquid pipes 31, respectively. These supply sources may or may not have tanks. The APM liquid supply source 121 may have a tank for storing ammonia water, which is a raw material for the APM liquid, and a tank for storing hydrogen peroxide water. The HPM liquid supply source 123 may have a tank for storing hydrochloric acid, which is a raw material for the HPM liquid, and a tank for storing hydrogen peroxide water. These tanks are stored in a storage box 7 (see FIG. 1).

The substrate processing apparatus 2 further includes a connecting supply pipe 120 that connects the three first upstream processing liquid pipes 31 and the second processing liquid pipe 40 and supplies a processing liquid as a cleaning fluid from at least one of the first processing liquid pipes 30 to the second processing liquid pipe 40. The connecting supply pipe 120 is, for example, branched off from each of the first upstream processing liquid pipes 31 downstream of the first processing liquid heater 35 and upstream of the first processing liquid filter unit 36. The connecting supply pipe 120 is, for example, branched off from each of the second processing liquid pipes 40 downstream of the second processing liquid heater 45 and upstream of the second processing liquid filter unit 46.

The substrate processing apparatus 2 includes a switching unit 125 for switching the supply destination of each processing liquid. The switching unit 125 includes a plurality of switching valves 126 provided in the connection supply pipe 120.
The first treatment liquid pipe 30 has a first resin portion that contacts the liquid flowing through the first treatment liquid pipe 30. The second treatment liquid pipe 40 has a second resin portion that contacts the liquid flowing through the second treatment liquid pipe 40. The resin portion of the pipe is, for example, an inner wall, and is made of a fluororesin.

Referring to FIG. 4, each member included in the substrate processing apparatus 2P is controlled by a first controller 5.
<Cleaning Process by Substrate Processing Apparatus According to Second Embodiment>
21A to 21F are schematic views for explaining the cleaning process performed by the substrate processing apparatus 2. FIG.

The DIW as the rinsing liquid and the APM liquid as the chemical liquid function as cleaning fluids that clean the resin parts of the piping, the mixing valve 50, the valve unit, the filter unit, etc. In the substrate processing apparatus 2P, the supply destination of the APM liquid and the rinsing liquid can be switched to clean the processing liquid piping (the first processing liquid piping 30 and the second processing liquid piping 40) and the piping attachment/detachment member 100.

Specifically, as shown in FIG. 21A, with all switching valves 126 closed, the first upstream processing liquid valve 33 and the branch valve 53 are opened, and APM liquid flows into the mixing valve 50. This causes the mixing valve 50 to be cleaned with APM liquid. Furthermore, the first downstream processing liquid piping 32 and the first upstream processing liquid piping 31 corresponding to the APM liquid supply source 121 are cleaned.

21B, the first upstream processing liquid valve 33 and the branch valve 53 corresponding to the APM liquid supply source 121 are closed, and the first upstream processing liquid valve 33 and the branch valve 53 corresponding to the DIW supply source 122 are opened, so that the DIW flows into the mixing valve 50. As a result, the mixing valve 50 is washed with the DIW.
21C , by opening the multiple switching valves 126 to supply the APM liquid to all of the first upstream processing liquid pipes 31, not only the first upstream processing liquid pipes 31 corresponding to the APM liquid supply source 121 but also the first upstream processing liquid pipes 31 corresponding to the DIW supply source 122 and the HPM liquid supply source 123 can be washed with the APM liquid. The mixing valve 50, the first downstream processing liquid pipes 32, and the multiple first processing liquid filter units 36 are also washed with the APM liquid.

21D, the rinsing liquid in the first upstream processing liquid pipe 31 corresponding to the DIW supply source 122 is supplied to the three first upstream processing liquid pipes 31 by switching the open/close states of the multiple switching valves 126, thereby cleaning the three first upstream processing liquid pipes 31 with DIW. Furthermore, the mixing valve 50, the first downstream processing liquid pipe 32, and the multiple first processing liquid filter units 36 are also cleaned with DIW.

Furthermore, by using a similar operation, it is also possible to clean the second processing liquid pipe 40 with APM liquid as shown in FIG. 21E, or to clean the second processing liquid pipe 40 with rinsing liquid as shown in FIG. 21F. By opening and closing the multiple switching valves 126, it is possible to allow the APM liquid or rinsing liquid to flow into the second processing liquid pipe 40. This allows the second processing liquid pipe 40, the second processing liquid filter unit 46, and the second downstream processing liquid valve unit 47 to be cleaned.

When cleaning with the first treatment liquid (APM liquid or DIW), a temperature-controlled cleaning process may be executed to clean the mixing valve 50, etc., by repeatedly heating the first treatment liquid with the first treatment liquid heater 35 and stopping the heating of the first treatment liquid with the first treatment liquid heater 35.
Similarly, when cleaning with the first processing liquid, a physical force application step may be performed in which a physical force is applied to the first processing liquid while the first processing liquid is heated by the first processing liquid heater 35. Specifically, a physical force (impact) is applied to the APM liquid by opening and closing the first upstream processing liquid valve 33 (valve opening and closing step). The application of a physical force may be performed in both cleaning with the APM liquid and cleaning with the rinsing liquid, or the application of a physical force may be performed only during the supply of either one of the first processing liquids.

According to the second embodiment, the APM liquid and DIW (first processing liquid) functioning as a cleaning fluid for cleaning the first resin portion of the first processing liquid pipe 30 flow through the first processing liquid pipe 30. The APM liquid and the rinse liquid flowing through the first processing liquid pipe 30 are heated by the first processing liquid heater 35, whereby the first resin portion of the first processing liquid pipe 30 is heated.
Furthermore, the removal of impurities inside the first resin portion can be promoted by applying a physical force to the APM liquid or DIW using a physical force applying unit such as the first upstream processing liquid valve 33. In particular, the removal of impurities can be promoted by applying a physical force to the APM liquid or DIW while the first processing liquid piping 30 is heated.

In this manner, the first processing liquid pipe 30 having the resin portion can be cleaned satisfactorily.
According to the second embodiment, the DIW or APM liquid (first processing liquid) supplied to the first processing liquid pipe 30 via the connecting supply pipe 120 flows into the second processing liquid pipe 40. The hydrofluoric acid supplied from the second processing liquid pipe 40 toward the processing unit 4 is an example of the second processing liquid. By heating the DIW or APM liquid with the first processing liquid heater 35 and applying a physical force to at least one of the DIW and the APM liquid with the physical force application unit, cleaning of the second resin portion of the second processing liquid pipe 40 with the DIW and the APM liquid can be promoted.

According to the second embodiment, it is possible to clean almost the entire piping of the substrate processing apparatus 2 with the processing liquid. Therefore, it is possible to shorten the time required for starting up the substrate processing apparatus 2. In addition, by opening and closing the multiple switching valves 126, cleaning of the processing liquid piping with a desired processing liquid is realized.
20, each processing liquid supply pipe is connected to a pipe for supplying a processing liquid to another processing unit 4 and another processing tower TW. If the connection position of the connecting supply pipe 120 in each processing liquid supply pipe is set to a position (not shown) before branching from the processing liquid supply source to each processing tower TW, substrate processing can be continued in the processing units 4 constituting the processing towers TW other than the processing tower TW to be cleaned.

20 , as indicated by the two-dot chain line, two first upstream processing liquid pipes 31 supplying the first processing liquid (APM liquid and DIW) as a cleaning fluid may be provided with an ultrasonic generator 127. The ultrasonic generator 127 may be provided in either one of the two first upstream processing liquid pipes 31.
Unlike the second embodiment, the processing liquid supplied to the second processing liquid pipe 40 may function as a cleaning fluid. That is, the first processing liquid pipe 30, the second processing liquid pipe 40, and the pipe attachment/detachment member 100 may be cleaned using the processing liquid (here, hydrofluoric acid) supplied to a pipe to which the mixing valve 50 is not attached. In this case, the hydrofluoric acid functions as a cleaning fluid (first processing liquid). A temperature control cycle in which the heating of hydrofluoric acid by the second processing liquid heater 45 and the stopping of the heating of hydrofluoric acid by the second processing liquid heater 45 constitute one cycle may be executed multiple times.

In addition, in FIG. 20 , a connecting supply pipe 120 is provided to connect a plurality of first upstream processing liquid pipes 31 and a plurality of second processing liquid pipes 40, but a plurality of connecting supply pipes may be provided to connect the processing liquid pipes to each other.
Although not shown, the substrate processing apparatus 2P shown in FIG. 20 may also be provided with a flow controller 55, a flow meter 56, a plurality of first return pipes 38, and a second return pipe 48.

<Particle measurement experiment>
22 is a graph showing the results of a particle measurement experiment, which measures the number of particles removed by a cleaning fluid.
The particle measurement experiment was carried out according to the following procedure.
(1) A mixing valve (a piping attachment/detachment member) having a portion made of fluororesin was attached to a piping connected to the tip of the nozzle.
(2) A temperature control cycle in which ammonia water heated to 80° C. was supplied to the piping for 15 minutes, and then ammonia water at room temperature (about 25° C.) was supplied to the piping for 15 minutes was conducted for 6 hours.
(3) After the 6-hour temperature control cycle, two more 6-hour temperature control cycles were performed.
(4) After that, DIW was supplied into the piping to remove the ammonia water from the piping.
(5) After that, ozone water was supplied into the piping to remove the ammonia water from the piping.
(6) After steps (2) to (5) were completed, the number of particles on the main surface of the substrate was measured.

Sample A shown in Figure 22 shows the result of measuring the number of particles on the main surface of the substrate after supplying room temperature ammonia water into the piping. Samples B to E shown in Figure 22 show the result of measuring the number of particles after steps (2) to (5) above are respectively completed. Each measurement result is shown as a ratio to the number of particles after step (2) above is completed.

As shown in Figure 22, the particle count of sample B, which had undergone the temperature control cycle, was greater than the particle count of sample A, which had been thoroughly washed with ammonia water at room temperature. From this result, it is believed that in sample B, the execution of the temperature control cycle caused particles in the resin part of the mixing valve to flow into the ammonia water, thereby increasing the number of particles on the main surface of the substrate.

22, the particle counts of Samples C to E were smaller than that of Sample B. From this result, it is inferred that the temperature control cycle can remove particles from inside the resin part of the piping attachment/detachment component.
Also, the result was that the number of particles in sample E was smaller than the number of particles in sample A. From this result, it is presumed that the particles were sufficiently removed from the inside of the resin part of the mixing valve by repeating the temperature control cycle. Furthermore, in sample E, it is presumed that the number of particles generated on the main surface of the substrate was reduced because the ammonia water containing particles was sufficiently removed from the resin part of the mixing valve by removing the ammonia water with DIW and ozone water after the temperature control cycle.

<Other embodiments>
The present invention is not limited to the above-described embodiment, and can be embodied in other forms.
11 to 14B, a physical force may be applied to the cleaning fluid by opening and closing a valve provided in the piping attachment/detachment member 100. For example, a physical force may be applied to the cleaning fluid by opening and closing at least one of the branch valves 53 provided in the mixing valve 50 and the second downstream processing liquid valve unit 47. Also, a physical force may be applied to the cleaning fluid by adjusting the flow rate with the flow rate controller 55.

The piping detachable member 100 that can be cleaned by the piping detachable member cleaning device 3 is not limited to a filter unit, a valve unit, and a mixing valve, and may be, for example, a pipe. Specifically, a pipe constituting a part of the first processing liquid pipe 30 or the second processing liquid pipe 40, etc., can be mentioned.
In the piping detachable member cleaning device 3 shown in FIG. 5, a tank heater for heating the cleaning fluid in the cleaning fluid tank 73 may be provided in place of the piping heater 82 .

The piping detachable member cleaning device 3 may be provided with a cooler that cools the cleaning fluid in the cleaning fluid piping 70 or the piping detachable member 100. In the temperature control cycle, cooling by the cooler may be performed while heating of the cleaning fluid is stopped.
5, the cleaning fluid supplied to the piping attachment/detachment member 100 does not have to be configured to return to the cleaning fluid tank 73, and may be discharged from the cleaning fluid piping 70 without being reused. Also, the cleaning fluid tank 73 does not have to be provided. In other words, the cleaning fluid piping 70 may be connected to a piping connected to a supply source that supplies the cleaning fluid to the clean room.

In the substrate processing system 1 according to the first embodiment described above, the piping detachable member 100 can be cleaned using the piping detachable member cleaning device 3 before the piping detachable member 100 is connected to the piping (processing liquid piping) of the substrate processing apparatus 2. Therefore, the piping detachable member cleaning device 3 does not need to be located to the side of the substrate processing apparatus 2, and does not need to be located in the same clean room as the substrate processing apparatus 2.

Also, unlike the first cleaning process shown in FIG. 5, the second chemical liquid supplying step (step S3) may be omitted. Also, in the second chemical liquid supplying step (step S3) and the rinsing step (step S4), the heating of the cleaning fluid (second chemical liquid and rinsing liquid) by the piping heater 82, i.e., the heating of the resin part of the piping detachable member 100, may be continued (continued heating step). When the detachable member heater 111 is used instead of the piping heater 82, the heating of the piping detachable member 100 is continued in the second chemical liquid supplying step (step S3) and the rinsing step (step S4).

However, if heating of the rinsing liquid is to be continued in the rinsing process (step S4), it is preferable to stop heating the rinsing liquid while it is being supplied to the piping detachable member 100, and then continue supplying the rinsing liquid to the piping detachable member 100 until the rinsing liquid is sufficiently cooled (e.g., has reached room temperature) and is supplied to the piping detachable member 100. In other words, it is preferable to perform the room temperature rinsing process after the high temperature rinsing process.

Also, unlike the second cleaning process shown in FIG. 11, the second chemical liquid supplying step (step S3) may be omitted. Also, in the physical force cleaning step (step S10), a second chemical liquid such as ozone water may be used instead of the rinsing liquid. In that case, a first chemical liquid supplying step of supplying the first chemical liquid to which a physical force has been applied to the piping detachable member 100 while heating the piping detachable member 100 and a second chemical liquid supplying step of supplying the second chemical liquid to which a physical force has been applied to the piping detachable member 100 while heating the piping detachable member 100 are repeated. A physical cleaning cycle in which the first chemical liquid supplying step is performed and then the second chemical liquid supplying step is performed is repeated multiple times.

Also, unlike the substrate processing apparatus 2P according to the second embodiment, the substrate processing apparatus may be provided with a single processing liquid piping for supplying a processing liquid such as an APM liquid from a processing liquid supply source to the processing unit 4. In this substrate processing apparatus, the processing liquid can also be used as a cleaning fluid for cleaning a resin portion of the processing liquid piping.
In addition, in each of the above-described embodiments, some of the pipes, pumps, valves, actuators, etc. are omitted from the illustrations, but this does not mean that these components do not exist, and in reality, these components are provided in appropriate positions.

In the above embodiment, expressions such as "horizontal" and "vertical" are used, but they do not necessarily have to be "along", "horizontal", and "vertical" strictly. In other words, these expressions allow for deviations in manufacturing precision, installation precision, and the like.
Furthermore, although each component may be shown diagrammatically as a block, the shape, size, and positional relationship of each block do not represent the shape, size, and positional relationship of each component.

Various other modifications may be made within the scope of the claims.

1: Substrate processing system 1P: Substrate processing system 2: Substrate processing apparatus 2P: Substrate processing apparatus 3: Pipe detachable member cleaning apparatus 33: First upstream processing liquid valve (physical force application unit)
43: Second upstream processing liquid valve (physical force application unit)
35: First treatment liquid heater (heating unit)
36: First processing liquid filter unit 45: Second processing liquid heater 46: Second processing liquid filter unit 47: Second downstream processing liquid valve unit 50: Mixing valve 55: Flow rate controller (physical force application unit)
70: Cleaning fluid pipe 71: First pipe 72: Second pipe 73: Cleaning fluid tank 80: Cleaning fluid valve (physical force application unit)
81: Cleaning fluid pump (physical force imparting unit)
82: Pipe heater (heating unit)
85: Discharge pipe 90: Supply unit 93: Supply pipe 94: Supply valve 100: Pipe attachment/detachment member 101: Resin portion 110: Ultrasonic generator (physical force application unit)
111: Detachable member heater (heating unit)
127: Ultrasonic generator (physical force application unit)
W: Substrate

Claims (20)

A piping detachable member cleaning device that cleans a piping detachable member that is detachable from a processing liquid piping that supplies a processing liquid to a processing unit that processes a substrate, the piping detachable member having a resin portion that comes into contact with the processing liquid passing through the piping detachable member,
a cleaning fluid pipe that is connectable to the piping detachable member and through which a cleaning fluid flows, the cleaning fluid pipe supplying the cleaning fluid to the piping detachable member and recovering the cleaning fluid from the piping detachable member;
a heating unit for heating at least one of the cleaning fluid in the cleaning fluid pipe and the pipe attaching/detaching member;
a physical force applying unit that applies a physical force to the cleaning fluid in the cleaning fluid pipe ,
The heating unit executes a temperature control cycle multiple times, the temperature control cycle consisting of heating the resin portion to expand the resin portion, and stopping heating the resin portion to shrink the resin portion, as one cycle . a discharge pipe connected directly or indirectly to the cleaning fluid pipe and configured to discharge the cleaning fluid from the cleaning fluid pipe;
a supply unit for selectively supplying a plurality of types of cleaning fluid to the cleaning fluid pipe;
The piping detachable member cleaning device according to claim 1, wherein the supply unit includes a plurality of supply pipes directly or indirectly connected to the cleaning fluid pipes, and a plurality of switching valves for opening and closing each of the supply pipes and switching the type of cleaning fluid added to the cleaning fluid pipes. 3 . The piping detachable member cleaning device according to claim 1 , wherein the physical force application unit includes a flow rate change valve provided in the cleaning fluid pipe and configured to change a flow rate of the cleaning fluid in the cleaning fluid pipe. The piping detachable member cleaning device according to claim 1 , wherein the physical force application unit includes an ultrasonic generator provided in the cleaning fluid pipe. 5. The piping detachable member cleaning device according to claim 1 , wherein the heating unit includes a pipe heater that heats the cleaning fluid in the cleaning fluid pipe through the cleaning fluid pipe. The piping detachable member cleaning device according to any one of claims 1 to 5, wherein the heating unit includes a detachable member heater configured to directly heat the piping detachable member or to heat the piping detachable member via an atmosphere surrounding the piping detachable member . the cleaning fluid piping includes a first pipe that supplies cleaning fluid to the piping attachment/detachment member and a second pipe that recovers the cleaning fluid from the piping attachment/detachment member;
The piping detachable member cleaning device according to claim 1 , further comprising a cleaning fluid tank that supplies a cleaning fluid to the first pipe and recovers the cleaning fluid from the second pipe. The piping detachable member cleaning device according to claim 1 , wherein the cleaning fluid pipe is connectable to the piping detachable member in a state where the cleaning fluid pipe is not attached to the processing liquid pipe. The piping detachable member cleaning device according to claim 1 , wherein the piping detachable member includes a filter unit, a valve unit, or a mixing valve. A piping detachable member cleaning device that cleans a piping detachable member that is detachable from a processing liquid piping that supplies a processing liquid to a processing unit that processes a substrate, the piping detachable member having a resin portion that comes into contact with the processing liquid passing through the piping detachable member,
a cleaning fluid pipe that is connectable to the piping detachable member and through which a cleaning fluid flows, the cleaning fluid pipe supplying the cleaning fluid to the piping detachable member and recovering the cleaning fluid from the piping detachable member;
a heating unit configured to heat at least one of the cleaning fluid in the cleaning fluid pipe and the pipe attaching/detaching member,
The heating unit executes a temperature control cycle multiple times, the temperature control cycle consisting of heating the resin portion to expand the resin portion , and stopping heating the resin portion to shrink the resin portion , as one cycle. a discharge pipe connected directly or indirectly to the cleaning fluid pipe and configured to discharge the cleaning fluid from the cleaning fluid pipe;
a supply unit for selectively supplying a plurality of types of cleaning fluid to the cleaning fluid pipe;
The piping detachable member cleaning device according to claim 10, wherein the supply unit includes a plurality of supply pipes directly or indirectly connected to the cleaning fluid pipes, and a plurality of switching valves for opening and closing each of the supply pipes and switching the type of cleaning fluid added to the cleaning fluid pipes. The piping detachable member cleaning device according to claim 10 or 11 , wherein the heating unit includes a pipe heater that heats the cleaning fluid in the cleaning fluid pipe through the cleaning fluid pipe. The piping detachable member cleaning device according to claim 10 , wherein the heating unit includes a detachable member heater that heats the piping detachable member directly or via an atmosphere surrounding the piping detachable member. the cleaning fluid piping includes a first pipe that supplies cleaning fluid to the piping attachment/detachment member and a second pipe that recovers the cleaning fluid from the piping attachment/detachment member;
The piping detachable member cleaning device according to claim 10 , further comprising a cleaning fluid tank that supplies a cleaning fluid to the first pipe and recovers the cleaning fluid from the second pipe. The piping detachable member cleaning device according to claim 10 , wherein the cleaning fluid pipe is connectable to the piping detachable member in a state where the cleaning fluid pipe is not attached to the processing liquid pipe. The piping detachable member cleaning device according to claim 10 , wherein the piping detachable member includes a filter unit, a valve unit, or a mixing valve. A substrate processing system comprising: the piping detachable member cleaning device according to claim 1 ; the processing liquid piping; and the processing unit. a processing unit for processing a substrate with a processing liquid;
a first processing liquid pipe for supplying a first processing liquid toward the processing unit, the first processing liquid pipe having a first resin portion in contact with a fluid flowing through the first processing liquid pipe;
a heating unit configured to heat the first processing liquid in the first processing liquid pipe;
a physical force application unit that applies a physical force to the first treatment liquid ;
a second processing liquid pipe for supplying a second processing liquid toward the processing unit, the second processing liquid pipe having a second resin portion in contact with a fluid flowing through the second processing liquid pipe;
a connecting supply pipe connecting the second processing liquid pipe and the first processing liquid pipe ,
The first processing liquid functions as a cleaning fluid for cleaning the first resin portion. a cleaning fluid supply step of supplying a cleaning fluid to the piping detachable member from a cleaning fluid piping connected to the piping detachable member having a resin portion that contacts the treatment liquid passing through the piping detachable member;
a heating step of heating at least one of the cleaning fluid passing through the cleaning fluid pipe and the pipe attachment/detachment member by a heater, the heating step heating the resin portion to expand the resin portion ;
a physical force applying step of applying a physical force to the cleaning fluid flowing through the cleaning fluid pipe while performing the heating step ;
a heating stopping step of stopping the heating by the heater after the heating step, thereby stopping the heating of the resin portion and causing the resin portion to shrink ;
a temperature control cycle, the temperature control cycle being one cycle consisting of the heating step and the heating stop step, being performed a plurality of times ; a cleaning fluid supply step of supplying a cleaning fluid to the piping detachable member from a cleaning fluid piping connected to the piping detachable member having a resin portion that contacts the treatment liquid passing through the piping detachable member;
a heating step of heating at least one of the cleaning fluid passing through the cleaning fluid pipe and the pipe attachment/detachment member by a heater, the heating step heating the resin portion to expand the resin portion ;
a heating stopping step of stopping the heating by the heater after the heating step, thereby stopping the heating of the resin portion and causing the resin portion to shrink ;
a temperature control cycle, the temperature control cycle being one cycle consisting of the heating step and the heating stop step, being performed a plurality of times;

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