JP7639944B2 - Laser processing machine and workpiece processing method - Google Patents

Description

The present invention relates to a laser processing machine and a method for processing a workpiece.

Some laser processing machines use a conveying device to transport a workpiece that has been laser-processed by a laser head, and perform secondary processing on the workpiece transported by the conveying device (see, for example, Patent Document 1). This type of laser processing machine may perform drilling to form holes in a plate-shaped workpiece as pilot holes for secondary processing such as shaping and tapping. Drilling is a process in which a laser head irradiates laser light along the contour of a hole to be formed in the workpiece while the plate-shaped workpiece is supported by a table having multiple protrusions.

Patent No. 6582552

The slag that corresponds to the hole formed in the workpiece normally falls from the workpiece and is removed. However, if the slug is located on a protrusion, the slug may be prevented from falling by the protrusion and become stuck in the hole, preventing it from falling. Also, if a cutting failure occurs, the slug may become welded to the workpiece and not fall. If the slug does not fall from the workpiece, it can cause poor processing, damage to the mold, or damage to the tap in secondary processing.

Therefore, when forming a hole by drilling, it is desirable to detect whether slag remains in the hole before performing secondary processing on the hole.

A first aspect of the present invention is a laser processing machine for laser processing a plate-shaped workpiece. The laser processing machine includes a table having a plurality of protrusions and supporting the workpiece at the upper end of the protrusions. The laser processing machine includes a laser head for performing a drilling process to form a hole by irradiating a laser beam along a predetermined closed path on the workpiece supported on the table. The laser processing machine includes a conveying device for conveying the workpiece laser-processed by the laser head. The laser processing machine includes a secondary processing tool for performing secondary processing on the hole. The laser processing machine includes an imaging unit for imaging a plate surface of the workpiece conveyed by the conveying device. The laser processing machine includes an image processing unit for image processing the image captured by the imaging unit. The conveying device is capable of conveying the workpiece that has been subjected to the drilling process to a position for performing secondary processing. The imaging unit is provided at a position where it can image the plate surface of the workpiece in the conveying path of the workpiece by the conveying device, and images the plate surface of the workpiece while the conveying device is conveying the workpiece. The image processing unit processes the image captured by the imaging unit to determine whether slag remains in the hole.

A second aspect of the present invention is a method for processing a workpiece by laser processing a plate-shaped workpiece. The method for processing a workpiece includes supporting the workpiece at the upper end of a protrusion by a table having a plurality of protrusions. The method for processing a workpiece includes performing a drilling process in which a laser head irradiates a laser beam along a predetermined closed path on the workpiece supported on the table to form a hole. The method for processing a workpiece includes transporting the workpiece that has been laser processed by the laser head by a transport device. The method for processing a workpiece includes performing secondary processing on the hole by a secondary processing tool. The method for processing a workpiece includes capturing an image of a plate surface of the workpiece transported by the transport device by an imaging unit. The method for processing a workpiece includes processing an image of the image captured by the imaging unit by an image processing unit. The transport device is capable of transporting the workpiece that has been subjected to the drilling process to a position for performing secondary processing. The imaging unit is provided at a position where it can capture an image of the plate surface of the workpiece on a transport path of the workpiece by the transport device, and captures an image of the plate surface of the workpiece while the transport device is transporting the workpiece. The image processing unit processes the image captured by the imaging unit and determines whether or not slag remains in the hole.

Note that the above summary of the invention does not list all of the necessary features of the present invention. Also, subcombinations of these features may also be inventions.

In one embodiment of the present invention, the laser processing machine and each workpiece method can detect whether slag remains in a hole portion when a hole is formed by drilling before performing secondary processing on the hole portion.

The laser processing machine may include a plurality of imaging units. The plurality of imaging units may be arranged side by side in a cross direction that crosses the conveying direction of the conveying device, and may image different areas in the cross direction. The image processing unit may determine whether slag remains in the hole using a plurality of images respectively captured by the plurality of imaging units. According to this aspect, the laser processing machine can detect whether slag remains in the hole without stopping conveying by the conveying device.

At least one of the multiple imaging units may be provided so as to be movable in the intersecting direction. The imaging unit provided so as to be movable in the intersecting direction may image an area corresponding to the range in which it can move in the intersecting direction. According to this aspect, the laser processing machine can reduce the cost of detection without reducing the accuracy of detecting whether slag remains in the hole.

The laser processing machine may be provided with a rod-shaped body that is provided at a position having a slag discharge space below and pushes down any slag remaining in the hole. When the image processing unit determines that slag remains, the rod-shaped body may perform an operation to push the slag down into the target hole. According to this aspect, the laser processing machine can properly remove slag when it remains in the hole.

When it is determined that slag remains in the hole, the image processing unit may identify the relative position coordinates of the position of the hole with respect to a predetermined point on the plate surface of the workpiece. The rod-shaped body may perform an operation to push the slag into the hole, targeting the hole located at the relative position coordinates identified by the image processing unit. According to this aspect, when multiple holes are formed, the laser processing machine can target only the holes in which slag remains and push the slag remaining in the holes down.

When it is determined that slag remains in a hole, the image processing unit may identify in which of a plurality of regions on the workpiece surface the position of the hole is located. The rod-shaped body performs an operation to push the slag into one or more holes located in the region identified by the image processing unit. According to this aspect, the laser processing machine can identify the position of the hole in which slag remains without taking into account errors in the relative position coordinates.

The laser processing machine may include an illumination unit that is provided at a position facing the back surface of the workpiece plate surface imaged by the imaging unit and illuminates the back surface with light. The imaging unit may capture an image when the back surface is illuminated with light by the illumination unit. According to this aspect, the laser processing machine can increase the accuracy of determining whether slag remains in the hole.

1 is a diagram showing an example of the configuration of a laser processing machine 1 according to an embodiment of the present invention. FIG. 2 is a diagram illustrating an example of a laser head 130. FIG. 2 is a diagram showing an example of an external perspective view of a push-off device. 3 is a diagram showing an example of an imaging area captured by an imaging section 340. FIG. 13 is a diagram showing an example of how a hole H appears from an imaging unit 340 depending on whether or not a slag S is present. FIG. FIG. 10 is a diagram illustrating an example of a procedure for controlling a drilling process. FIG. 10 is a diagram illustrating an example of a flow of a drilling process procedure. FIG. 10 is a diagram illustrating an example of a flow of a drilling process procedure. 10 is a diagram illustrating an example of a procedure for detecting whether slag remains in a hole H. FIG. 2 is a diagram illustrating an example of a hole H formed in a workpiece W. FIG. FIG. 13 is a diagram showing an example of a procedure for controlling the knock-down of a slug. FIG. 1 is a diagram illustrating an example of a procedure for pushing off a slug. FIG. 1 is a diagram illustrating an example of a procedure for pushing off a slug. FIG. 11 is a reference diagram for explaining the diameter of the rod-shaped body and the diameter of the annular member suitable for pushing off slag. 13 is a diagram showing another example of the imaging area captured by the imaging unit 340. FIG. 13 is a diagram showing another example of the imaging area captured by the imaging unit 340. FIG. 13 is a diagram showing another example of the imaging area captured by the imaging unit 340. FIG.

The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. Furthermore, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

The directions in the figures below are explained using the XYZ coordinate system. In this XYZ coordinate system, the vertical direction is the Z direction, and the horizontal directions are the X and Y directions. In addition, for the X, Y, and Z directions, the side indicated by the arrows will be referred to as the + side, and the opposite side as the - side.

Figure 1 is a diagram showing an example of the configuration of a laser processing machine 1 according to one embodiment of the present invention. The laser processing machine 1 is a device that performs laser processing, secondary processing, and slug knocking on a plate-shaped workpiece W. The laser processing machine 1 includes a laser processing device 100, a conveying device 200, a secondary processing device 300, a control unit 400, and an image processing unit 500.

The laser processing device 100 is a machine tool that uses laser energy to perform cutting, drilling, or hardening. The laser processing device 100 includes a frame 110A, a frame 110B, a lower frame 110C, a table 120, a laser head 130, and a head drive unit 140.

The laser processing device 100 performs laser processing on the workpiece W in the laser processing area R1. The laser processing area R1 is an area surrounded by frames 110A and 110B. Frames 110A and 110B are plate-shaped main frames that stand in the Z direction and extend in the X direction. Frames 110A and 110B are connected to each other by a lower frame 110C, and support the head drive unit 140. The lower frame 110C is provided below the laser processing area R1, and supports the table 120. Frame 110A has an opening 110AO through which the workpiece W transported by the transport device 200 can pass.

The table 120 is a member that supports the workpiece W in the laser processing region R1. The table 120 includes a rectangular base plate 121 and multiple support plates 122. The multiple support plates 122 are arranged side by side in the X direction while standing on the upper surface of the base plate 121. Multiple protrusions 122A are formed on the upper end of the support plate 122. The table 120 supports the lower surface of the workpiece W at the upper ends of the protrusions 122A. The protrusions 122A are, for example, sawtooth-shaped. The height from the upper surface of the base plate 121 to the apex of the protrusions 122A is the same for the multiple protrusions 122A.

The laser head 130 is a device that performs laser processing by irradiating a workpiece W supported on the table 120 with laser light. For example, the laser head 130 can perform drilling processing in which a hole is formed by irradiating a workpiece W supported on the table 120 with laser light along a predetermined closed path.

Figure 2 is a diagram showing an example of the laser head 130. The laser head 130 includes a nozzle 131, an optical fiber 132, a collimator 133, a beam splitter 134, and a focusing lens 135.

The laser head 130 irradiates the processing laser light L1 and the illumination laser light L2 from the emission port 131A of the nozzle 131 toward the workpiece W. The laser head 130 is provided so as to be movable in the X direction, Y direction, and Z direction relative to the workpiece W. The laser head 130 performs cutting by irradiating the processing laser light L1 along a cutting line to be formed on the workpiece W while moving relative to the workpiece W.

The optical fiber 132 is connected to the laser oscillator 150 and introduces the processing laser light L1 output from the laser oscillator 150 into the laser head 130.

The collimator 133 is positioned at a position where the focal point on the incident side of the processing laser light L1 coincides with the position of the end of the optical fiber 132, and converts the processing laser light L1 output from the laser oscillator 150 into parallel light.

The beam splitter 134 is provided at a position where the processing laser light L1 that has passed through the collimator 133 is incident, and reflects the processing laser light L1. The focusing lens 135 is provided at a position where the processing laser light L1 that has been reflected by the beam splitter 134 is incident, and focuses the incident processing laser light L1.

The laser head 130 is provided with an optical system drive unit 190. The optical system drive unit 190 moves the focusing lens 135 along the optical axis to adjust the focus on the workpiece W side.

The lighting unit 160 is detachably connected to the laser head 130. The lighting unit 160 includes a laser array 161 and a collimator 162. The laser array 161 emits illumination laser light L2 having a wavelength different from that of the processing laser light L1. The collimator 162 is provided at a position where the illumination laser light L2 is incident from the laser array 161, and converts the illumination laser light L2 incident from the laser array 161 into parallel light.

The laser head 130 is equipped with a half mirror 136. The half mirror 136 is provided at a position where the illumination laser light L2 that has passed through the collimator 162 is incident, and reflects a portion of the illumination laser light L2 and allows a portion of it to pass through.

The illumination laser light L2 reflected by the half mirror 136 passes through the beam splitter 134. The focusing lens 135 focuses the illumination laser light L2 that has passed through the beam splitter 134. The area of the workpiece W where the illumination laser light L2 is irradiated includes the area of the workpiece W where the processing laser light L1 is irradiated.

The laser head 130 is provided with an imaging unit 170. The imaging unit 170 is a device that images the area to which the processing laser light L1 is irradiated. The imaging unit 170 includes an imaging element 171. The imaging element 171 is an image sensor that detects return light that is reflected and scattered by the illumination of the illumination laser light L2 on the workpiece W, and generates image data.

The returning light from the workpiece W passes through the focusing lens 135 and enters the beam splitter 134. The returning light includes light that is the illumination laser light L2 reflected and scattered by the workpiece W, and light that is the processing laser light L1 reflected by the workpiece W. The light originating from the illumination laser light L2 passes through the beam splitter 134 and enters the half mirror 136. On the other hand, the light originating from the processing laser light L1 is reflected by the beam splitter 134.

When the molten metal from the workpiece W is welded to the cut surface of the workpiece W, the return light includes light in the infrared to near-infrared wavelength range emitted from the molten metal. The light caused by the molten metal passes through the beam splitter 134 and enters the half mirror 136.

The laser head 130 includes a wavelength selection filter 137 and an imaging lens 138. The wavelength selection filter 137 is, for example, a dichroic mirror, a notch filter, or the like. The return light incident on the half mirror 136 passes through the half mirror 136 and enters the wavelength selection filter 137. The light originating from the illumination laser light L2 is reflected by the wavelength selection filter 137 and enters the imaging lens 138. On the other hand, the light originating from the processing laser light L1 passes through the wavelength selection filter 137. The imaging lens 138 focuses the light reflected by the wavelength selection filter 137 onto the image sensor 171.

The image processing unit 500 is a device that performs image processing. The image processing unit 500 is connected to the imaging unit 170 and the control unit 400 so that they can communicate with each other. The imaging unit 170 transmits image data generated by the imaging element 171 to the image processing unit 500. When the image processing unit 500 receives image data from the imaging unit 170, it performs image processing on the image data and generates data related to the processing state. The image processing unit 500 generates data related to the processing state, for example, data indicating the kerf width. The kerf width can be calculated, for example, by detecting the edges at both ends of the kerf produced by laser processing and converting the distance between the edges in the image to a distance on a real scale. When the image processing unit 500 generates data related to the processing state, it transmits the data to the control unit 400.

In addition, an assist gas supply unit 180 is connected to the laser head 130. The assist gas supply unit 180 is a device that supplies assist gas into the nozzle 131. The assist gas is used to remove molten material in laser processing.

Returning to the explanation of Figure 1, the laser head 130 is provided on the head drive unit 140 and can be moved in the X direction, Y direction, and Z direction by the head drive unit 140. The head drive unit 140 includes a gantry 140A, a slider 140B, and an elevator unit 140C.

Gantry 140A is provided on top of frames 110A and 110B along the Y direction. Head drive unit 140 includes a drive mechanism such as a ball screw mechanism that moves gantry 140A in the X direction. Gantry 140A can be moved in the X direction by this drive mechanism. Guide 140AG that guides slider 140B is provided on the top surface of gantry 140A along the Y direction.

The slider 140B is provided across the top surface of the gantry 140A to the -X side surface. The head drive unit 140 is equipped with a drive mechanism such as a ball screw mechanism that moves the slider 140B in the Y direction. The slider 140B can be moved in the Y direction by this drive mechanism. A guide 140BG that guides the lift unit 140C is provided along the Z direction on the -X side surface of the slider 140B.

The lifting/lowering unit 140C is provided on the -X side surface of the slider 140B. The head driving unit 140 includes a driving mechanism such as a ball screw mechanism that moves the lifting/lowering unit 140C in the Z direction. The lifting/lowering unit 140C can be moved in the Z direction by this driving mechanism.

The laser head 130 is provided below the lifting unit 140C. The laser head 130 can be moved in the X direction above the laser processing area R1 by the movement of the gantry 140A in the X direction. The laser head 130 can be moved in the Y direction above the laser processing area R1 by the movement of the slider 140B in the Y direction. The laser head 130 can be moved in the Z direction above the laser processing area R1 by the movement of the lifting unit 140C in the Z direction.

The conveying device 200 is a device that conveys the workpiece W that has been laser-machined by the laser processing device 100. The conveying device 200 is capable of conveying the workpiece W that has been subjected to drilling to a position for performing secondary processing. The conveying device 200 includes a carriage 210, a plate 220, and a plurality of workpiece holders 230.

The carriage 210 is provided so as to be movable in the Y direction. The plate 220 is provided on the +Y side of the carriage 210. A plurality of work holders 230 are provided at intervals in the X direction, protruding from the +Y side surface of the plate 220. The work holders 230 are capable of clamping and gripping the end of the workpiece W.

The secondary processing device 300 is a device that performs secondary processing on the workpiece W and pushes off slag in the secondary processing area R2. In a plan view, the secondary processing area R2 is an area that is outside the table 120 and has a slag discharge space ES below.

The secondary processing device 300 comprises a frame 310, a secondary processing section 320, a push-off section 330, multiple imaging sections 340, and a lighting section 350.

The frame 310 comprises a vertical frame 310A and a horizontal frame 310B. The vertical frame 310A is a plate-like member that stands in the Z direction and extends in the X direction. The vertical frame 310A is formed from a single metal member and has sufficient strength to withstand the impacts that occur when performing secondary processing on the workpiece W and knocking down the slag. The vertical frame 310A supports each part of the secondary processing device 300. The vertical frame 310A is formed with an opening 310AO through which the workpiece W transported by the transport device 200 can pass. The horizontal frame 310B is provided on the -Y side of the vertical frame 310A and is a plate-like member that extends in the X direction. The horizontal frame 310B supports the secondary processing section 320 and the knock-down section 330 in a suspended state.

The secondary processing unit 320 is a device that performs secondary processing on the workpiece W. The secondary processing unit 320 is suspended from a guide provided along the X direction on the underside of the horizontal frame 310B, and can move in the X direction along the guide. The secondary processing unit 320 is equipped with a secondary processing tool 321 for performing secondary processing on the workpiece W. The secondary processing tool 321 is, for example, a tool for performing tapping to cut a thread into the cut surface of a hole formed in the workpiece W by drilling. When performing tapping on the hole in the workpiece W, the secondary processing unit 320 rotates the secondary processing tool 321 by contacting it with the cut surface of the hole in the workpiece W. In addition, the secondary processing unit 320 may be provided with a tool for performing tapping on the hole into which the slag has been pushed by the push-off unit 330.

Here, the slag corresponding to the hole formed in the workpiece W usually falls from the workpiece W and is removed. However, if the slag is located on top of the protrusion 122A, the slag may be prevented from falling by the protrusion 122A and may become stuck in the hole and not fall. Also, if a cutting failure occurs, the slag may become welded to the workpiece W and not fall.

The knock-down section 330 is a device that knocks down slag remaining in the hole formed in the workpiece W by the drilling process.

3 is a diagram showing an example of an external perspective view of the knock-off unit 330. The knock-off unit 330 includes a striker support 331, a striker 332, a tool support 333, a plurality of rod-shaped bodies 334, an annular member support 335, and a plurality of annular members 336.

The striker support 331 comprises a frame 331A and a lifting drive unit 331B. The frame 331A supports the lifting drive unit 331B. The frame 331A is suspended from a guide provided along the X direction on the underside of the horizontal frame 310B, and is movable in the X direction along the guide. The lifting drive unit 331B raises and lowers the striker 332 by the driving force of a drive device such as an electric motor.

Striker 332 drives rod-shaped body 334 by descending. Striker 332 is formed in a cylindrical shape and is driven by lifting drive unit 331B to rise and fall. The shape of the lower end of striker 332 corresponds to the shape of the upper end of rod-shaped body 334. Striker 332 descends to lower rod-shaped body 334, thereby knocking down the slag.

The tool support 333 is provided at a position that sandwiches the workpiece W relative to the annular member support 335, and supports multiple rod-shaped bodies 334 along the X direction. The multiple rod-shaped bodies 334 are tools for pushing out the slag remaining in the hole. The multiple rod-shaped bodies 334 are each formed in a rod shape and have different diameters.

The tool support 333 includes a drive unit 333A and a plurality of elastic members 333B. The tool support 333 is supported by a guide 310C provided on the wall surface of the vertical frame 310A, and is driven by the drive unit 333A to be movable in the X direction along the guide 310C . When the rod-shaped body 334 is lowered by the striker 332, the lower end of the rod-shaped body 334 protrudes downward. The plurality of elastic members 333B are provided corresponding to the rod-shaped bodies 334, respectively, and elastically support the rod-shaped bodies 334. The elastic members 333B are compressed when the striker 332 descends, and raise the rod-shaped body 334 to its original position before the descent by the elastic force when the striker 332 ascends.

The annular member support 335 is provided at a position sandwiching the workpiece W relative to the tool support 333, and supports a number of annular members 336 provided along the X direction. The multiple annular members 336 are members into which the rod-shaped body 334, which is driven down by the striker 332, can be inserted. The multiple annular members 336 are each formed in a hollow cylindrical shape and have different diameters.

The annular member support 335 includes a drive unit 335A. The annular member support 335 is supported by a guide 310D provided on the wall surface of the vertical frame 310A, and is driven by the drive unit 335A to move in the X direction along the guide 310D. The annular member support 335 supports the annular member 336. The slug pushed down by the rod 334 falls below the annular member support 335.

Returning to the explanation of FIG. 1, the imaging unit 340 is a device that uses a light-sensitive semiconductor element to receive light from the outside world through a lens, converts it into digital data, and records it on a storage medium. The imaging unit 340 is provided at a position where it can image the top surface of the workpiece W on the transport path of the workpiece W by the transport device 200. In this embodiment, the imaging unit 340 is provided on the underside of the horizontal frame 310B with the imaging surface facing downward.

Figure 4 is a diagram showing an example of an imaging area captured by the imaging unit 340. This embodiment includes eight imaging units 340, imaging units 340A to 340H, to enable imaging from one end to the other end of the workpiece W in a cross direction CD that crosses the transport direction TD of the workpiece W.

The imaging units 340A to 340H are arranged side by side in a cross direction CD that crosses the transport direction TD of the workpiece W by the transport device 200. The imaging units 340A to 340H then capture different areas AA to AH in the cross direction CD of the top surface of the workpiece W. For example, the imaging unit 340A captures area AA in the cross direction CD of the top surface of the workpiece W. Also, for example, the imaging unit 340B captures area AB in the cross direction CD of the top surface of the workpiece W. Also, for example, the imaging unit 340H captures area AH in the cross direction CD of the top surface of the workpiece W.

Here, the imaging unit 340 captures an image of the top surface of the workpiece W during the process of transporting the workpiece W by the transport device 200. By imaging units 340A to 340H capturing images at the same time, the image processing unit 500 can obtain an image of a predetermined area consisting of areas AA to AH, spanning from one end to the other end of the cross direction CD of the top surface of the workpiece W. Therefore, in this embodiment, during the process of transporting the workpiece W by the transport device 200, an image of a predetermined area in the cross direction CD of the top surface of the workpiece W can be obtained without stopping the transport of the workpiece W. By imaging units 340A to 340H repeatedly capturing images at the predetermined imaging timing, the image processing unit 500 can obtain an image of the entire area of the top surface of the workpiece W during the process of transporting the workpiece W by the transport device 200.

Returning to the explanation of Figure 1, the illumination unit 350 is a device that illuminates the underside of the workpiece W with light. The illumination unit 350 is provided in a position facing the underside of the workpiece W. The imaging unit 340 captures an image when the underside of the workpiece W is illuminated with light by the illumination unit 350.

Figure 5 is a diagram showing an example of how hole H appears from the imaging unit 340 depending on whether or not slug is present. The hatched areas in the figure indicate areas that appear bright when viewed from the imaging unit 340 due to the light shining from the illumination unit 350 passing through hole H.

Figure 5 (A) is a diagram showing an example of how hole H appears from the imaging unit 340 when no slag S remains in hole H. When no slag S remains in hole H, the light irradiated by the illumination unit 350 is not obstructed in the area corresponding to hole H, and almost the entire area appears bright.

Figure 5 (A) is a diagram showing an example of how hole H appears from the imaging unit 340 when slag S remains in hole H. When slag S remains in hole H, the light illuminating the illumination unit 350 is blocked from the area corresponding to hole H, and only a portion of the area appears bright.

In this way, the appearance of the hole H as viewed from the imaging unit 340 differs depending on whether slag S remains in the hole H. Therefore, in this embodiment, the appearance of the hole H as viewed from the imaging unit 340 is used as a parameter for determining whether slag S remains in the hole H.

Returning to the explanation of FIG. 1, the control unit 400 is a device that controls various devices in the laser processing machine 1. For example, the control unit 400 controls operations related to laser processing of the workpiece W by the laser processing device 100. Also, for example, the control unit 400 controls operations related to transporting the workpiece W by the transport device 200. Also, for example, the control unit 400 controls operations related to secondary processing of the workpiece W by the secondary processing device 300.

As described above, the image processing unit 500 is a device that performs image processing. The image processing unit 500 is communicatively connected to the imaging unit 340. When the image processing unit 500 receives image data from the imaging unit 340, it performs image processing on the image data and determines whether slag S remains in the hole H. When the image processing unit 500 determines whether slag S remains in the hole H, it transmits data indicating the determination result to the control unit 400.

Figure 6 is a diagram showing an example of a procedure flow for controlling a hole drilling process. Figures 7 and 8 are diagrams showing an example of a procedure flow for a hole drilling process.

The control unit 400 controls the laser processing device 100 to perform cutting processing by irradiating laser light along the closed path C1 (step S101). In step S101, the control unit 400 faces the nozzle 131 of the laser head 130 to the center position Q1 of the contour WC of the hole to be formed in the workpiece W as shown in FIG. 7 (A), and irradiates laser light from the nozzle 131. A spot LS of laser light having a diameter D1 is formed on the upper surface of the workpiece W. Then, the control unit 400 moves the laser head 130 to a position Q2 where the spot LS of laser light contacts the contour WC of the hole to be formed in the workpiece W.

The control unit 400 moves the laser head 130 so that the center of the spot LS follows a predetermined closed path C1, as shown in FIG. 7(B). As the center of the spot LS moves along the closed path C1, the spot LS moves while being in contact with the contour WC of the hole to be formed in the workpiece W. The portion of the workpiece W irradiated with the laser light melts. The slag S is separated from the workpiece W when the spot LS has completed one revolution of the closed path C1. A hole is then formed in the workpiece W along the closed path C1, which is the trajectory of the spot LS.

Here, the slag S is usually removed by dropping from the workpiece W. However, as mentioned above, the slag S that should have fallen may be prevented from falling by the protrusion 122A of the table 120 and may get stuck in a hole and not fall. Furthermore, if a cutting failure occurs, the slag S that should have fallen may become welded to the workpiece W and not fall.

Therefore, as shown in FIG. 8, the control unit 400 controls the laser processing device 100 to perform cutting processing by irradiating laser light along the closed path C2 inside the closed path C1 (step S102).

In step S102, the control unit 400 changes the diameter of the spot LS to a diameter D2 smaller than the diameter D1, as shown in FIG. 8 (A). Then, the control unit 400 moves the laser head 130 while aligning the center of the spot LS of the laser light along the closed path C2, as shown in FIG. 8 (B). As the center of the spot LS moves along the closed path C2, the laser light is irradiated along the periphery of the slug S. As the laser light is irradiated along the periphery of the slug S, the laser light is also irradiated to the portion where the slug S is in contact with the workpiece W, even if the slug S is stuck in the hole. In addition, as the laser light is irradiated along the periphery of the slug S, the laser light is also irradiated to the portion where the slug S is welded to the workpiece W, even if the slug S is welded to the workpiece W. As a result, the slag is more reliably dropped from the workpiece W and removed.

Here, a workpiece W without the slug S falling thereon can cause poor machining, damage to the die, or damage to the tap when forming and tapping the hole H. Since there is a possibility that the slug S has not fallen, the control unit 400 detects whether the slug S remains in the hole H before forming and tapping the hole H.

Figure 9 is a diagram that shows an example of a procedure for detecting whether slag remains in a hole H. Figure 10 is a diagram that shows an example of a hole H formed in a workpiece W. In the following explanation, the procedure for detecting whether slag S remains in a hole H will be described.

Here, in Figure 10, areas AA1 to AH4 indicate the imaging areas captured by multiple imaging units 340. For example, areas AA1, AA2, AA3 and AA4 are imaging areas captured by imaging unit 340A. Also, for example, areas AB1, AB2, AB3 and AB4 are imaging areas captured by imaging unit 340B. Also, for example, areas AH1, AH2, AH3 and AH4 are imaging areas captured by imaging unit 340H. Figure 10 shows an example in which holes H are formed in areas AA1, AB2, AD2, an area spanning areas AE3 and AF3, and area AG4.

When the hole drilling process by the laser processing device 100 is completed, the control unit 400 has the imager 340 image the top surface of the workpiece W while the conveying device 200 conveys the workpiece W (step S201). In step S201, the control unit 400 has the imager 340A to imager 340H intermittently image the workpiece W while the conveying device 200 conveys the workpiece W, thereby imaging the entire area of the top surface of the workpiece W. For example, first, the control unit 400 images the area AA1 to area AH1 at a timing when the area is imaged by the imager 340A to imager 340H. Next, the control unit 400 images the area AA2 to area AH2 at a timing when the area is imaged by the imager 340A to imager 340H. Next, the control unit 400 images the area AA3 to area AH3 at a timing when the area is imaged by the imager 340A to imager 340H. Finally, the control unit 400 causes imaging units 340A to 340H to capture an image at a timing when the area consisting of areas AA4 to AH4 becomes the imaging area of the imaging units 340A to 340H. The imaging unit 340 transmits image data to the image processing unit 500 each time it captures an image or when it has finished capturing an image of the entire area.

When the image processing unit 500 receives multiple image data from the imaging unit 340, it performs a synthesis process on the multiple image data (step S202). In step S202, the image processing unit 500 arranges the image data received from imaging units 340A to 340H in the cross direction CD and performs a synthesis process. The image processing unit 500 also arranges the image data received from the same imaging unit 340 in the transport direction TD and performs a synthesis process. The image processing unit 500 generates image data of the entire area on the top surface of the workpiece W by performing a synthesis process on all the image data received from the imaging unit 340.

Next, the image processing unit 500 judges whether slag S remains in the hole H based on the image data of the entire area on the top surface of the workpiece W obtained by the synthesis process in step S202 (step S203). In step S203, the image processing unit 500, for example, refers to the nesting data to identify the area corresponding to the hole H in the image data. Then, the image processing unit 500 judges whether slag S remains in the hole H based on the appearance of the area corresponding to the hole H, for example. For example, when the hole H is circular, the image processing unit 500 judges whether the shape of the area corresponding to the hole H that appears brighter than the surrounding areas is circular. Then, if the shape of the area that appears brighter than the surrounding areas is circular, the image processing unit 500 judges that no slag S remains in the hole H. On the other hand, if the shape of the area that appears brighter than the surrounding areas is not circular, the image processing unit 500 judges that slag S remains in the hole H.

If it is determined in step S203 that no slag S remains in the hole H (step S203; NO), the procedure shown in Figure 9 is terminated.

On the other hand, if it is determined in step S203 that slag S remains in the hole H (step S203; YES), the image processing unit 500 identifies the position of the hole H in which the slag S remains (step S204).

For example, the image processing unit 500 identifies the relative position coordinates of the position of the hole H in which the slag S remains with respect to a predetermined point on the plate surface of the workpiece W. The predetermined point on the plate surface of the workpiece W may be a corner of the workpiece W or a point at any position on the plate surface of the workpiece W.

For example, the image processing unit 500 determines which of the multiple regions on the plate surface of the workpiece W the hole H in which the slag S remains is located in. For example, the image processing unit 500 determines which of the multiple regions AA1 to AH4 that can be imaged by the multiple imaging units 340 the hole H in which the slag S remains is located. For example, when it is determined that the slag S remains in the hole H1, the image processing unit 500 determines that the hole H in which the slag S remains is the hole H located in the region AA1. For example, when it is determined that the slag S remains in the hole H4, the image processing unit 500 determines that the hole H in which the slag S remains is the hole H located in the region AE3 and the region AF3. For example, when it is determined that the slag S remains in the hole H5, the image processing unit 500 determines that the hole H in which the slag S remains is the hole H located in the region AG4. Here, in addition to the hole H5, a hole H6 is formed in the region AG4. When identifying the region of hole H in which slag S remains in step S204, the image processing unit 500 may omit the processing in step S203 for other holes H in the same region as the hole H in which slag S remains. In this example, when the image processing unit 500 determines in step S203 that slag remains in hole H5, it may omit the processing for determining whether slag S remains in hole H6 located in the same region as hole H5.

Then, the image processing unit 500 transmits the position information of the hole H in which the slag S remains to the control unit 400 (step S205). Then, the procedure shown in FIG. 9 ends. In step S205, the image processing unit 500 transmits, as the position information of the hole H in which the slag S remains, the relative position coordinates of the hole H in which the slag S remains, or information indicating the area in which the hole H in which the slag S remains is located.

When the control unit 400 receives position information of the hole H in which the slag S remains, it executes a process to push down the slag S remaining in the hole H before performing shaping and tapping on the hole H based on the position information.

Figure 11 is a diagram that shows an example of a procedure flow for controlling the pushing down of slag S. Figures 12 and 13 are diagrams that show an example of a procedure flow for pushing down slag S. Figure 14 is a reference diagram for explaining the diameter of rod-shaped body 334 and the diameter of annular member 336 that are suitable for pushing down slag S. In the following explanation, the procedure flow for pushing down slag S into hole H in which it has been determined that slag S remains will be explained.

The control unit 400 determines whether there is a hole H in which slag S remains (step S301). In step S301, when the control unit 400 receives position information of the hole H in which slag S remains, it determines that there is a hole H in which slag S remains.

If it is determined that there is no hole H in which slag S remains (step S301; NO), the control unit 400 terminates the processing shown in FIG. 11.

When it is determined that there is a hole H in which slag S remains (step S301; YES), the control unit 400 causes the conveying device 200 to convey the workpiece W and place the hole H at a processing position where the slag S is pushed down (step S302). In step S302, when there are multiple holes H in which slag S remains, the control unit 400 causes the conveying device 200 to convey the workpiece W and place one of the multiple holes H at the processing position. By executing the processing of step S302, as shown in FIG. 12 (A), the hole H in which slag S remains is placed at a predetermined processing position in the secondary processing area R2.

Next, the control unit 400 moves the tool support 333 to position the rod-shaped body 334 used to push down the slag S at the processing position (step S303). In step S303, the control unit 400 moves the secondary processing unit 320 to a position where it does not interfere when pushing down the slag S. Then, the control unit 400 selects the rod-shaped body 334 to be used to push down the slag S from among the multiple rod-shaped bodies 334 with different diameters according to the diameter of the hole H in which the slag S remains. The rod-shaped body 334 used to push down the slag S must have a diameter smaller than the diameter of the hole H in which the slag S remains. However, if the diameter of the rod-shaped body 334 is too small compared to the diameter of the hole H in which the slag S remains, the force with which the rod-shaped body 334 pushes down the slag S may be insufficient. If the force used to push down the slag S is insufficient, the slag S welded to the workpiece W may not be pushed down while remaining welded to the workpiece W, as shown in FIG. 14A. The control unit 400 then selects the rod 334 with the largest diameter among the rods 334 having a diameter smaller than the diameter of the hole H in which the slag S remains, as the rod 334 to be used to push down the slag S. The control unit 400 then moves the tool support 333 to position the selected rod 334 at the processing position. By executing the process of step S303, the selected rod 334 is positioned directly above the hole H in which the slag S remains, as shown in FIG. 12B.

Next, the control unit 400 moves the annular member support 335 to position the annular member 336 used to push down the slag S at the processing position (step S304). In step S304, the control unit 400 selects the annular member 336 to be used to push down the slag S from among the multiple annular members 336 having different diameters, depending on the diameter of the hole H in which the slag S remains. The annular member 336 used to push down the slag must have a diameter larger than the diameter of the hole H in which the slag S remains. However, if the diameter of the annular member 336 is too large compared to the diameter of the hole H in which the slag S remains, the force to support the work W around the hole H may be insufficient. If the force to support the work W is insufficient, the work W may be deformed because it cannot withstand the force when the rod-shaped body 334 pushes down the slag S, as shown in FIG. 14 (B). Therefore, the control unit 400 selects the annular member 336 with the smallest diameter among the annular members 336 with diameters larger than the diameter of the hole H in which the slag S remains, as the annular member 336 to be used to push down the slag S. Then, the control unit 400 moves the annular member support 335 to position the selected annular member 336 at the processing position. By executing the process of step S304, the selected annular member 336 is positioned directly below the hole H in which the slag S remains, as shown in FIG. 13A.

Next, the control unit 400 lowers the striker 332 and causes the rod-shaped body 334 to push down the slag S remaining in the hole H (step S305). In step S305, the secondary processing device 300 moves the striker 332 directly above the rod-shaped body 334 used to push down the slag S. Then, as shown in FIG. 13(B), the secondary processing device 300 lowers the striker 332 to drive the rod-shaped body 334 and push down the slag S with the rod-shaped body 334. When a rod-shaped body 334 having an appropriate diameter for the diameter of the hole H in which the slag S remains is used, the slag S welded to the work W is reliably pushed down by the rod-shaped body 334, as shown in FIG. 14(C). Also, when an annular member 336 having an appropriate diameter for the diameter of the hole H in which the slag S remains is used, the work W is not deformed, as shown in FIG. 14(C).

Next, the control unit 400 determines whether there is an unprocessed hole H in which it has been determined that the slag S remains (step S306). In step S306, the control unit 400 determines that there is an unprocessed hole H if there is a hole H corresponding to the position information received from the image processing unit 500 in addition to the hole H into which the slag S has been pushed.

If it is determined that there is an unprocessed hole (step S306; YES), the control unit 400 causes the conveying device 200 to convey the workpiece W and place the unprocessed hole H at the processing position where the slag S is pushed down (step S302). The control unit 400 then repeatedly executes the processes from step S302 to step S306 until it is determined in step S306 that there is no unprocessed hole H. As a result, the control unit 400 can execute the operation of pushing down the slag S with the rod-shaped body 334 for all holes determined to have slag S remaining.

If it is determined that there are no unprocessed holes (step S306; NO), the control unit 400 terminates the processing shown in FIG. 11.

As described above, the laser processing machine 1 performs laser processing on a plate-shaped workpiece W. The laser processing machine 1 has a plurality of protrusions 122A and includes a table 120 that supports the workpiece W at the upper end of the protrusion 122A. The laser processing machine 1 also includes a laser head 130 that performs drilling processing to form a hole H by irradiating the workpiece W supported on the table 120 with laser light along a predetermined closed path C1 and a closed path C2. The laser processing machine 1 also includes a conveying device 200 that conveys the workpiece W laser-processed by the laser head 130. The laser processing machine 1 also includes a secondary processing tool 321 that performs secondary processing on the hole H. The laser processing machine 1 also includes an imaging unit 340 that captures an image of the plate surface of the workpiece W conveyed by the conveying device 200. The laser processing machine 1 also includes an image processing unit 500 that processes the image captured by the imaging unit 340. The conveying device 200 can convey the workpiece W that has been subjected to drilling processing to a position for performing secondary processing. The imaging unit 340 is provided at a position where it can image the plate surface of the workpiece W on the transport path of the workpiece W by the transport device 200, and images the plate surface of the workpiece W in the process of transporting the workpiece W by the transport device 200. The image processing unit 500 processes the image captured by the imaging unit 340 and determines whether slag S remains in the hole H.

According to this embodiment, when forming a hole H by drilling, the laser processing machine 1 can detect whether slag S remains in the hole H before performing secondary processing on the hole H.

The laser processing machine 1 also includes a plurality of imaging units 340. The plurality of imaging units 340A to 340H are arranged side by side in a cross direction CD that crosses the conveying direction TD of the conveying device 200, and capture images of different areas AA to AH in the cross direction CD. The image processing unit 500 uses the images captured by the plurality of imaging units 340A to 340H, respectively, to determine whether slag S remains in the hole H.

According to this embodiment, the laser processing machine 1 can detect whether slag S remains in the hole H without stopping the transportation by the conveying device 200.

The laser processing machine 1 also includes a rod-shaped body 334 that is provided at a position having a discharge space ES for the slag S below and that pushes down the slag S remaining in the hole H. When the image processing unit 500 determines that slag S remains, the rod-shaped body 334 performs an operation to push down the slag S into the target hole H.

According to this aspect, the laser processing machine 1 can properly remove the slag S when the slag S remains in the hole H.

Furthermore, when the image processing unit 500 determines that slag S remains in the hole H, it identifies the relative position coordinates of the position of the hole H with respect to a predetermined point on the plate surface of the workpiece W. The rod-shaped body 334 targets the hole H located at the relative position coordinates identified by the image processing unit 500 and performs an operation to push the slag S into the hole H.

According to this aspect, when multiple holes H are formed, the laser processing machine 1 can target only the hole H in which slag S remains and push out the slag S remaining in the hole H.

Furthermore, when the image processing unit 500 determines that slag S remains in the hole H, it identifies in which of the multiple areas AA1 to AH4 on the plate surface of the workpiece W the hole H is located. The rod-shaped body 334 performs an operation to push the slag S into one or more holes H, targeting the one or more holes H located in the area identified by the image processing unit 500.

According to this embodiment, the laser processing machine 1 can identify the position of the hole in which the slag S remains without taking into account errors in the relative position coordinates.

The laser processing machine 1 also includes an illumination unit 350 that illuminates the underside of the workpiece W with light. The illumination unit 350 is provided at a position facing the underside of the workpiece W. The imaging unit 340 captures an image when the plate surface on the back side is illuminated with light by the illumination unit 350.

According to this aspect, the laser processing machine 1 can improve the accuracy of determining whether slag S remains in the hole H.

Although the present invention has been described above using an embodiment, the technical scope of the present invention is not limited to the scope described in the above embodiment. It is clear to those skilled in the art that various modifications or improvements can be made to the above embodiment. It is clear from the claims that such modifications or improvements may also be included in the technical scope of the present invention. In addition, to the extent permitted by law, the disclosures of Japanese patent application No. 2021-208057 and all documents cited in the above embodiment, etc. are incorporated by reference and made part of the description in this text.

For example, the above embodiment has described an aspect in which eight imaging units 340, imaging units 340A to 340H, are provided to enable imaging of the workpiece W from one end to the other in the cross direction CD. However, the number of imaging units 340 can be set arbitrarily as long as it is possible to image the workpiece W from one end to the other in the cross direction CD.

Figures 15 to 17 are diagrams showing other examples of the imaging area by the imaging unit 340. The embodiment shown in Figure 15 includes four imaging units 340, imaging units 340A, 340C, 340E, and 340G. The four imaging units 340 are supported by a guide (not shown) provided on the lower surface of the horizontal frame 310B, and are driven by a drive unit (not shown) to move along the guide in the cross direction CD. The four imaging units 340 move within a range in which they can image the imaging areas of two units. For example, imaging unit 340A moves within a range in which they can image areas AA and AB. When imaging unit 340A is in a position in which it can image area AA, it moves after imaging area AA to image area AB. Also, when imaging unit 340A is in a position in which it can image area AB, it moves after imaging area AB to image area AA. Similarly, imaging unit 340C images areas AC and AD. The imaging unit 340E images the area AE and the area AF. The imaging unit 340G4 images the area AG4 and the area AH. Thus, the embodiment shown in FIG. 15 takes more time for the series of operations for imaging than the above-mentioned embodiment. Therefore, when the series of operations for imaging by the four imaging units 340 are being performed, the control unit 400 temporarily stops the transport of the workpiece W by the transport device 200. Then, when the series of operations for imaging by the four imaging units 340 is completed, the control unit 400 resumes the transport of the workpiece W by the transport device 200 and transports it to a position where the next area can be imaged.

The embodiment shown in FIG. 16 includes two imaging units 340, imaging unit 340A and imaging unit 340E. The two imaging units 340 are supported by a guide (not shown) provided on the underside of the horizontal frame 310B, and are driven by a drive unit (not shown) to move along the guide in the cross direction CD. The two imaging units 340 move within a range in which they can image the imaging areas of the four units. For example, imaging unit 340A moves within a range in which they can image areas AA to AD. When imaging unit 340A is in a position in which it can image area AA, it images areas AA, AB, AC, and AD in that order while moving. Also, when imaging unit 340A is in a position in which it can image area AD, it images areas AD, AC, AB, and AA in that order while moving. Similarly, imaging unit 340E images areas AE to AH. Thus, the embodiment shown in FIG. 16 takes more time for a series of operations for imaging than the above embodiment. Therefore, when a series of operations for imaging by the two imaging units 340 is being performed, the control unit 400 temporarily stops the transport of the workpiece W by the transport device 200. Then, when the series of operations for imaging by the two imaging units 340 is completed, the control unit 400 restarts the transport of the workpiece W by the transport device 200 and transports the workpiece W to a position where the next area can be imaged.

The embodiment shown in FIG. 17 includes one imaging unit 340A. The imaging unit 340A is supported by a guide (not shown) provided on the lower surface of the horizontal frame 310B, and is driven by a drive unit (not shown) to move along the guide in the cross direction CD. The imaging unit 340A moves within a range in which it can image eight imaging areas. For example, the imaging unit 340A moves within a range in which it can image areas AA to AH. When the imaging unit 340A is in a position in which it can image area AA, it images areas AA, AB, AC, AD, AE, AF, AG, and AH in that order while moving. Also, when the imaging unit 340A is in a position in which it can image area AH, it images areas AH, AG, AF, AE, AD, AC, AB, and AA in that order while moving. Compared to the above embodiment, the embodiment shown in FIG. 17 requires more time for a series of operations for imaging. Therefore, when the imaging unit 340A is performing a series of operations for capturing images, the control unit 400 temporarily stops the transport of the workpiece W by the transport device 200. Then, when the imaging unit 340A has completed the series of operations for capturing images, the control unit 400 restarts the transport of the workpiece W by the transport device 200 and transports the workpiece W to a position where the next area can be captured.

As described above, at least one imaging unit 340 is provided so as to be movable in the cross direction CD. The imaging unit 340 provided so as to be movable in the cross direction CD images an area corresponding to the range within which it can move in the cross direction CD.

According to this aspect, the laser processing machine 1 can reduce the cost of detection without reducing the accuracy of detecting whether slag S remains in the hole H.

The order of execution of each process, such as operations, procedures, steps and stages in the devices, systems, programs and methods shown in the claims, specifications and drawings, is not specifically stated as "before" or "prior to". It should also be noted that each process may be realized in any order, unless the output of a previous process is used in a later process. Even if the operational flow in the claims, specifications and drawings is explained using "first", "next", etc. for convenience, it does not mean that it is necessary to perform the process in that order.

1 laser processing machine, 100 laser processing device, 110A frame, 110AO opening, 110B frame, 110C lower frame, 120 table, 121 base plate, 122 support plate, 122A protrusion, 130 laser head, 131 nozzle, 131A emission port, 132 optical fiber, 133 collimator, 134 beam splitter, 135 condenser lens, 136 half mirror, 137 wavelength selection filter, 138 imaging lens, 140 head drive unit, 140A gantry, 140AG guide, 140B slider, 140BG guide, 140C lift unit, 150 laser transmitter, 160 lighting unit, 161 laser array, 162 collimator, 170 imaging unit, 171 imaging element, 180 Assist gas supply unit, 190 Optical system drive unit, 200 Conveyor device, 210 Carriage, 220 Plate, 230 Work holder, 300 Secondary processing device, 310 Frame, 310A Vertical frame, 310AO Opening, 310B Horizontal frame, 310C Guide, 310D Guide, 320 Secondary processing unit, 321 Secondary processing tool, 330 Push-off unit, 331 Striker support, 331A Frame, 331B Lifting drive unit, 332 Striker, 333 Tool support, 333A Drive unit, 333B Elastic member, 334 Rod-shaped body, 335 Annular member support, 335A Drive unit, 336 Annular member, 340 Imaging unit, 340A Imaging unit, 340B Imaging unit, 340C Imaging unit, 340D Imaging unit, 340E Imaging unit, 340F Imaging unit, 340G Imaging unit, 340H Imaging unit, 350 Illumination unit, 400 Control unit, 500 Image processing unit, AA area, AA1 area, AA2 area, AA3 area, AA4 area, AB area, AB1 area, AB2 area, AB3 Area, AB4 area, AC area, AC1 area, AC2 area, AC3 area, AC4 area, AD area, AD1 area, AD2 area, AD3 area, AD4 area, AE area, AE1 area, AE2 area, AE3 area, AE4 area, AF area, AF1 area, AF2 area, AF3 area, AF4 area, AG area, AG1 area, AG2 area, AG3 area, AG4 area, AH area, AH1 area, AH2 area, AH3 area, AH4 area, C1 closed path, C2 closed path, CD cross direction, D1 diameter, D2 diameter, ES discharge space, H hole, H1 hole, H2 hole, H3 hole, H4 hole, H5 hole, H6 hole, L1 processing laser light, L2 illumination laser light, LS spot, Q1 center position, Q2 position, R1 laser processing area, R2 secondary processing area, S slug, TD transport direction, W workpiece, WC contour

Claims (8)

A laser processing machine for laser processing a plate-shaped workpiece,
a table having a plurality of protrusions and supporting a workpiece at upper ends of the protrusions;
a laser head that performs a drilling process to form a hole by irradiating a laser beam along a predetermined closed path on a workpiece supported on the table;
A conveying device that conveys a workpiece that has been laser machined by the laser head;
A secondary processing tool for performing secondary processing on the hole portion;
An imaging unit that images a plate surface of a workpiece transported by the transport device;
an image processing unit that processes an image captured by the imaging unit,
The transport device is capable of transporting the workpiece after the hole drilling process to a position for performing the secondary process,
The imaging unit is provided at a position where it can image a plate surface of the workpiece on a transport path of the workpiece by the transport device, and images the plate surface of the workpiece while the transport device is transporting the workpiece;
The image processing unit processes the image captured by the imaging unit and determines whether slag remains in the hole. A plurality of the imaging units are provided,
The plurality of imaging units are arranged side by side in a cross direction intersecting a conveying direction by the conveying device, and capture images of different areas in the cross direction,
The laser processing machine according to claim 1 , wherein the image processing unit determines whether or not slag remains in the hole by using a plurality of images captured by the plurality of imaging units, respectively. At least one imaging unit is provided to be movable in a cross direction intersecting a conveying direction of the conveying device,
The laser processing machine according to claim 1 , wherein the imaging section provided so as to be movable in the intersecting direction images an area corresponding to a range within which the imaging section is movable in the intersecting direction. A rod-shaped body is provided at a position having a slag discharge space below, and pushes down the slag remaining in the hole,
The laser processing machine according to any one of claims 1 to 3, wherein when the image processing unit determines that a slag remains, the rod-shaped body performs an operation to push the slag down into the hole in which the slag remains. When it is determined that slag remains in the hole, the image processing unit specifies a relative position coordinate of the position of the hole with respect to a predetermined point on the plate surface of the workpiece,
5. The laser processing machine according to claim 4, wherein the rod-shaped body performs an operation for thrusting a slug into the hole located at the relative position coordinates specified by the image processing unit. When it is determined that slag remains in the hole, the image processing unit identifies in which of a plurality of regions on the plate surface of the workpiece the position of the hole is located;
The laser processing machine according to claim 4, wherein the rod-shaped body performs an operation to push slag into one or more of the holes located in an area identified by the image processing unit. A lighting unit is provided at a position facing a plate surface corresponding to a back side of the plate surface of the workpiece imaged by the imaging unit, and illuminates the plate surface corresponding to the back side with light,
The laser processing machine according to claim 1 , wherein the imaging unit captures an image of the plate surface corresponding to the back side when the plate surface is illuminated with light from the illumination unit. A workpiece processing method for laser processing a plate-shaped workpiece, comprising the steps of:
Supporting a workpiece at an upper end of a plurality of protrusions on a table having the plurality of protrusions;
performing a drilling process in which a laser head irradiates a laser beam along a predetermined closed path on a workpiece supported on the table to form a hole;
Transporting the workpiece that has been laser machined by the laser head using a transport device;
performing a secondary processing on the hole portion by a secondary processing tool;
An imaging unit captures an image of a plate surface of a workpiece transported by the transport device;
and processing the image captured by the imaging unit using an image processing unit.
The transport device is capable of transporting the workpiece after the hole drilling process to a position for performing the secondary process,
The imaging unit is provided at a position where it can image a plate surface of the workpiece on a transport path of the workpiece by the transport device, and images the plate surface of the workpiece while the transport device is transporting the workpiece;
A method for machining a workpiece, wherein the image processing unit processes the image captured by the imaging unit and determines whether slag remains in the hole.

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