JP7640256B2 - Metal powder for additive manufacturing and additively manufactured object produced using said metal powder - Google Patents
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Description
本発明は、積層造形用金属粉末及び該金属粉末を用いて作製した積層造形物に関する。 The present invention relates to a metal powder for additive manufacturing and an additive manufactured object produced using the metal powder.
近年、金属３Ｄプリンタ技術を用いて、複雑形状で、造形が難しいとされる立体構造の金属部品を作製する試みが行われている。３Ｄプリンタは積層造形法（ＡＭ）とも呼ばれ、プレート上に金属粉を薄く敷き詰めて金属粉末層を形成し、この金属粉末層に電子ビームやレーザー光を走査させて溶融、凝固させ、その上に、また新たな粉末を薄く敷き詰めて、同様に所定の部分をレーザー光で溶融、凝固させ、この工程を繰り返し行っていくことで、複雑形状の積層造形物を作製していく方法である。 In recent years, attempts have been made to use metal 3D printer technology to create complex, three-dimensional metal parts that are considered difficult to create. 3D printers are also known as additive manufacturing (AM), and involve the process of forming a metal powder layer by thinly spreading metal powder on a plate, scanning this metal powder layer with an electron beam or laser light to melt and solidify it, and then spreading a thin layer of new powder on top of that, and similarly melting and solidifying the specified parts with laser light, and repeating this process to create additively manufactured objects with complex shapes.
積層造形用の金属の１つとしては、機械強度が高く、導電率が高い銅をベースとした材料が使用されている。例えば、特許文献１には、Ｃｒ：１．１～２０質量％、Ｚｒ：０～０．２質量％、残部がＣｕ及び不可避的不純物からなる銅合金粉末が開示され、銅合金造形物の電気伝導率が６５％ＩＡＣＳ以上であり、０．２％耐力が１５０ＭＰａ上で、引張強さが３００ＭＰａ以上であることが開示されている。また、特許文献２には、１．００質量％より多く２．８０質量％以下のクロム、および残部の銅を含有する銅合金粉末が開示されている。 One of the metals used for additive manufacturing is a copper-based material with high mechanical strength and electrical conductivity. For example, Patent Document 1 discloses a copper alloy powder containing 1.1-20 mass% Cr, 0-0.2 mass% Zr, and the balance Cu and unavoidable impurities, and discloses that the copper alloy molded product has an electrical conductivity of 65% IACS or more, a 0.2% proof stress of 150 MPa or more, and a tensile strength of 300 MPa or more. Patent Document 2 discloses a copper alloy powder containing more than 1.00 mass% to 2.80 mass% chromium, and the balance copper.
銅合金粉末を用いた造形物は、ここ最近製造できるようになりつつあるが、未だ純銅による積層造形物に匹敵する導電率を有し、かつ、純銅による積層造形物に勝る機械強度を有する積層造形物は得られていない。このようなことから、本発明は、積層造形用金属粉末であって、高い導電率と高い機械強度を兼ね備えた積層造形物の形成に適した金属粉末、及び該金属粉末を用いて作製した積層造形物を提供することを課題とする。 Although it has become possible to manufacture objects using copper alloy powder in recent years, no additively manufactured objects have been obtained that have electrical conductivity comparable to that of additively manufactured objects made from pure copper and mechanical strength superior to that of additively manufactured objects made from pure copper. For this reason, the objective of the present invention is to provide a metal powder for additive manufacturing that is suitable for forming additively manufactured objects that combine high electrical conductivity and high mechanical strength, and an additively manufactured object made using the metal powder.
この部分は請求項を参照に修正願います。＞修正しました。
上記課題を解決するために、本発明者らは鋭意研究を行ったところ、積層造形用の金属粉末として、銅に添加する元素を適切に選定することにより、得られる積層造形物において、銅の特徴である導電性が大幅に損なうことなく、また、銅を大きく上回る機械強度が得られるとの知見が得られた。
この知見に基づき、以下の実施形態を提供するものである。
１）Ｃｕ粉末、Ａｌ粉末、Ｘ１（Ｘ１＝Ｃｏ、Ｆｅ、Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）粉末の混合粉からなり、混合粉の組成としてＡｌとＸ１の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
２）Ｃｕ－Ａｌ合金粉末、Ｃｕ－Ｘ１（Ｘ１＝Ｃｏ、Ｆｅ、Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）合金粉末の混合粉からなり、混合粉の組成としてＡｌとＸ１の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
３）Ｃｕ－Ａｌ－Ｘ１（Ｘ１＝Ｃｏ、Ｆｅ、Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）合金粉末からなり、合金粉の組成としてＡｌとＸ１の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
４）Ｃｕ粉末、Ａｌ粉末、Ｘ１（Ｘ１＝Ｃｏ、Ｆｅ、Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）粉末、Ｃｕ－Ａｌ合金粉末、Ｃｕ－Ｘ１（Ｘ１＝Ｃｏ、Ｆｅ、Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）合金粉末、Ｃｕ－Ａｌ－Ｘ１（Ｘ１＝Ｃｏ、Ｆｅ、Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＡｌとＸ１の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
５）Ｃｕ粉末、Ｂｉ粉末、Ｘ２（Ｘ２＝Ｓｃ又はＺｒ）粉末の混合粉からなり、混合粉の組成としてＢｉとＸ２の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
６）Ｃｕ－Ｂｉ合金粉末、Ｃｕ－Ｘ２（Ｘ２＝Ｓｃ又はＺｒ）合金粉末の混合粉からなり、混合粉の組成としてＢｉとＸ２の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
７）Ｃｕ－Ｂｉ－Ｘ２（Ｘ２＝Ｓｃ又はＺｒ）合金粉末からなり、合金粉の組成としてＢｉとＸ２の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
８）Ｃｕ粉末、Ｂｉ粉末、Ｘ２（Ｘ２＝Ｓ又はＺｒ）粉末、Ｃｕ－Ｂｉ合金粉末、Ｃｕ－Ｘ２（Ｘ２＝Ｓ又はＺｒ）合金粉末、Ｃｕ－Ｂｉ－Ｘ２（Ｘ２＝Ｓ又はＺｒ）合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＢｉとＸ２の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
９）Ｃｕ粉末、Ｃｏ粉末、Ｘ３（Ｘ３＝Ｐ、Ｓｉ又はＨｆ）粉末の混合粉からなり、混合粉の組成としてＣｏとＸ３の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
１０）Ｃｕ－Ｃｏ合金粉末、Ｃｕ－Ｘ３（Ｘ３＝Ｐ、Ｓｉ又はＨｆ）合金粉末の混合粉からなり、混合粉の組成としてＣｏとＸ３の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
１１）Ｃｕ－Ｃｏ－Ｘ３（Ｘ３＝Ｐ、Ｓｉ又はＨｆ）合金粉末からなり、合金粉の組成としてＣｏとＸ３の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
１２）Ｃｕ粉末、Ｃｏ粉末、Ｘ３（Ｘ３＝Ｐ、Ｓｉ又はＨｆ）粉末、Ｃｕ－Ｃｏ合金粉末、Ｃｕ－Ｘ３（Ｘ３＝Ｐ、Ｓｉ又はＨｆ）合金粉末、Ｃｕ－Ｃｏ－Ｘ３（Ｘ３＝Ｐ、Ｓｉ又はＨｆ）合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＣｏとＸ３の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
１３）Ｃｕ粉末、Ｃｒ粉末、Ｘ４（Ｘ４＝Ｐ又はＳｉ）粉末の混合粉からなり、混合粉の組成としてＣｒとＸ４の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
１４）Ｃｕ－Ｃｒ合金粉末、Ｃｕ－Ｘ４（Ｘ４＝Ｐ又はＳｉ）合金粉末の混合粉からなり、混合粉の組成としてＣｒとＸ４の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
１５）Ｃｕ－Ｃｒ－Ｘ４（Ｘ４＝Ｐ又はＳｉ）合金粉末からなり、合金粉の組成としてＣｒとＸ４の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
１６）Ｃｕ粉末、Ｃｒ粉末、Ｘ４（Ｘ４＝Ｐ又はＳｉ）粉末、Ｃｕ－Ｃｒ合金粉末、Ｃｕ－Ｘ４（Ｘ４＝Ｐ又はＳｉ）合金粉末、Ｃｕ－Ｃｒ－Ｘ４（Ｘ４＝Ｐ又はＳｉ）合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＣｒとＸ４の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
１７）Ｃｕ粉末、Ｆｅ粉末、Ｘ５（Ｘ５＝Ｐ、Ｓｉ、Ｔｉ又はＨｆ）粉末の混合粉からなり、混合粉の組成としてＦｅとＸ５の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
１８）Ｃｕ－Ｆｅ合金粉末、Ｃｕ－Ｘ５（Ｘ５＝Ｐ、Ｓｉ、Ｔｉ又はＨｆ）合金粉末の混合粉からなり、混合粉の組成としてＦｅとＸ５の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
１９）Ｃｕ－Ｆｅ－Ｘ５（Ｘ５＝Ｐ、Ｓｉ、Ｔｉ又はＨｆ）合金粉末からなり、合金粉の組成としてＦｅとＸ５の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
２０）Ｃｕ粉末、Ｆｅ粉末、Ｘ５（Ｘ５＝Ｐ、Ｓｉ、Ｔｉ又はＨｆ）粉末、Ｃｕ－Ｆｅ合金粉末、Ｃｕ－Ｘ５（Ｘ５＝Ｐ、Ｓｉ、Ｔｉ又はＨｆ）合金粉末、Ｃｕ－Ｆｅ－Ｘ５（Ｘ５＝Ｐ、Ｓｉ、Ｔｉ又はＨｆ）合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＦｅとＸ５の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
２１）Ｃｕ粉末、Ｇａ粉末、Ｘ６（Ｘ６＝Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）粉末の混合粉からなり、混合粉の組成としてＧａとＸ６の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
２２）Ｃｕ－Ｇａ合金粉末、Ｃｕ－Ｘ６（Ｘ６＝Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）合金粉末の混合粉からなり、混合粉の組成としてＧａとＸ６の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
２３）Ｃｕ－Ｇａ－Ｘ６（Ｘ６＝Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）合金粉末からなり、合金粉の組成としてＧａとＸ６の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
２４）Ｃｕ粉末、Ｇａ粉末、Ｘ６（Ｘ６＝Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）粉末、Ｃｕ－Ｇａ合金粉末、Ｃｕ－Ｘ６（Ｘ６＝Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）合金粉末、Ｃｕ－Ｇａ－Ｘ６（Ｘ６＝Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＧａとＸ６の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
２５）Ｃｕ粉末、Ｉｎ粉末、Ｓｃ粉末の混合粉からなり、混合粉の組成としてＩｎとＳｃの合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
２６）Ｃｕ－Ｉｎ合金粉末、Ｃｕ－Ｓｃ合金粉末の混合粉からなり、混合粉の組成としてＩｎとＳｃの合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
２７）Ｃｕ－Ｉｎ－Ｓｃ合金粉末からなり、合金粉の組成としてＩｎとＳｃの合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
２８）Ｃｕ粉末、Ｉｎ粉末、Ｓｃ粉末、Ｃｕ－Ｉｎ合金粉末、Ｃｕ－Ｓｃ合金粉末、Ｃｕ－Ｉｎ－Ｓｃ合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＩｎとＳｃの合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
２９）Ｃｕ粉末、Ｎｉ粉末、Ｘ６（Ｘ６＝Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）粉末の混合粉からなり、混合粉の組成としてＮｉとＸ６の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
３０）Ｃｕ－Ｎｉ合金粉末、Ｃｕ－Ｘ６（Ｘ６＝Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）合金粉末の混合粉からなり、混合粉の組成としてＮｉとＸ６の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
３１）Ｃｕ－Ｎｉ－Ｘ６（Ｘ６＝Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）合金粉末からなり、合金粉の組成としてＮｉとＸ６の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
３２）Ｃｕ粉末、Ｎｉ粉末、Ｘ６（Ｘ６＝Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）粉末、Ｃｕ－Ｎｉ合金粉末、Ｃｕ－Ｘ６（Ｘ６＝Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）合金粉末、Ｃｕ－Ｎｉ－Ｘ６（Ｘ６＝Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＮｉとＸ６の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
３３）Ｃｕ粉末、Ｐ粉末、Ｘ７（Ｘ７＝Ｓｃ、Ｔｉ、Ｖ又はＺｒ）粉末の混合粉からなり、混合粉の組成としてＰとＸ７の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
３４）Ｃｕ－Ｐ合金粉末、Ｃｕ－Ｘ７（Ｘ７＝Ｓｃ、Ｔｉ、Ｖ又はＺｒ）合金粉末の混合粉からなり、混合粉の組成としてＰとＸ７の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
３５）Ｃｕ－Ｐ－Ｘ７（Ｘ７＝Ｓｃ、Ｔｉ、Ｖ又はＺｒ）合金粉末からなり、合金粉の組成としてＰとＸ７の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
３６）Ｃｕ粉末、Ｐ粉末、Ｘ７（Ｘ７＝Ｓｃ、Ｔｉ、Ｖ又はＺｒ）粉末、Ｃｕ－Ｐ合金粉末、Ｃｕ－Ｘ７（Ｘ７＝Ｓｃ、Ｔｉ、Ｖ又はＺｒ）合金粉末、Ｃｕ－Ｐ－Ｘ７（Ｘ７＝Ｓｃ、Ｔｉ、Ｖ又はＺｒ）合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＰとＸ７の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
３７）Ｃｕ粉末、Ｓｃ粉末、Ｘ８（Ｘ８＝Ｓｉ、Ｓｎ又はＴｉ）粉末の混合粉からなり、混合粉の組成としてＳｃとＸ８の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
３８）Ｃｕ－Ｓｃ合金粉末、Ｃｕ－Ｘ８（Ｘ８＝Ｓｉ、Ｓｎ又はＴｉ）合金粉末の混合粉からなり、混合粉の組成としてＳｃとＸ８の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
３９）Ｃｕ－Ｓｃ－Ｘ８（Ｘ８＝Ｓｉ、Ｓｎ又はＴｉ）合金粉末からなり、合金粉の組成としてＳｃとＸ７の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
４０）Ｃｕ粉末、Ｓｃ粉末、Ｘ８（Ｘ８＝Ｓｉ、Ｓｎ又はＴｉ）粉末、Ｃｕ－Ｓｃ合金粉末、Ｃｕ－Ｘ８（Ｘ８＝Ｓｉ、Ｓｎ又はＴｉ）合金粉末、Ｃｕ－Ｓｃ－Ｘ８（Ｘ８＝Ｓｉ、Ｓｎ又はＴｉ）合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＳｃとＸ８の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
４１）Ｃｕ粉末、Ｓｉ粉末、Ｘ９（Ｘ９＝Ｔｉ、Ｖ又はＺｒ）粉末の混合粉からなり、混合粉の組成としてＳｉとＸ９の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
４２）Ｃｕ－Ｓｉ合金粉末、Ｃｕ－Ｘ９（Ｘ９＝Ｔｉ、Ｖ又はＺｒ）合金粉末の混合粉からなり、混合粉の組成としてＳｉとＸ９の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
４３）Ｃｕ－Ｓｉ－Ｘ９（Ｘ９＝Ｔｉ、Ｖ又はＺｒ））合金粉末からなり、合金粉の組成としてＳｉとＸ９の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
４４）Ｃｕ粉末、Ｓｉ粉末、Ｘ９（Ｘ９＝Ｔｉ、Ｖ又はＺｒ）粉末、Ｃｕ－Ｓｉ合金粉末、Ｃｕ－Ｘ９（Ｘ９＝Ｔｉ、Ｖ又はＺｒ）合金粉末、Ｃｕ－Ｓｉ－Ｘ９（Ｘ９＝Ｔｉ、Ｖ又はＺｒ）合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＳｉとＸ９の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
４５）Ｃｕ粉末、Ｓｎ粉末、Ｘ１０（Ｘ１０＝Ｔｉ又はＺｒ）粉末の混合粉からなり、混合粉の組成としてＳｎとＸ１０の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
４６）Ｃｕ－Ｓｎ合金粉末、Ｃｕ－Ｘ１０（Ｘ１０＝Ｔｉ又はＺｒ）合金粉末の混合粉からなり、混合粉の組成としてＳｎとＸ１０の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
４７）Ｃｕ－Ｓｎ－Ｘ１０（Ｘ１０＝Ｔｉ又はＺｒ）合金粉末からなり、合金粉の組成としてＳｎとＸ１０の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
４８）Ｃｕ粉末、Ｓｎ粉末、Ｘ１０（Ｘ１０＝Ｔｉ又はＺｒ）粉末、Ｃｕ－Ｓｎ合金粉末、Ｃｕ－Ｘ１０（Ｘ１０＝Ｔｉ又はＺｒ）合金粉末、Ｃｕ－Ｓｎ－Ｘ１０（Ｘ１０＝Ｔｉ又はＺｒ）合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＳｎとＸ１０の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
４９）Ｃｕ粉末、Ｈｆ粉末、Ｘ１１（Ｘ１１＝Ｎｉ、Ｐ、Ｓｉ又はＳｎ）粉末の混合粉からなり、混合粉の組成としてＨｆとＸ１１の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
５０）Ｃｕ－Ｈｆ合金粉末、Ｃｕ－Ｘ１１（Ｘ１１＝Ｎｉ、Ｐ、Ｓｉ又はＳｎ）合金粉末の混合粉からなり、混合粉の組成としてＨｆとＸ１１の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
５１）Ｃｕ－Ｈｆ－Ｘ１１（Ｘ１１＝Ｎｉ、Ｐ、Ｓｉ又はＳｎ）合金粉末からなり、合金粉の組成としてＨｆとＸ１１の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
５２）Ｃｕ粉末、Ｈｆ粉末、Ｘ１１（Ｘ１１＝Ｎｉ、Ｐ、Ｓｉ又はＳｎ）粉末、Ｃｕ－Ｈｆ合金粉末、Ｃｕ－Ｘ１１（Ｘ１１＝Ｎｉ、Ｐ、Ｓｉ又はＳｎ）合金粉末、Ｃｕ－Ｈｆ－Ｘ１１（Ｘ１１＝Ｎｉ、Ｐ、Ｓｉ又はＳｎ）合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＨｆとＸ１１（Ｘ１１＝Ｎｉ、Ｐ、Ｓｉ又はＳｎ）の合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
５３）Ｃｕ粉末、Ｎｄ粉末、Ｓｉ粉末の混合粉からなり、混合粉の組成としてＮｄとＳｉの合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
５４）Ｃｕ－Ｎｄ合金粉末、Ｓｉ合金粉末の混合粉からなり、混合粉の組成としてＮｄとＳｉの合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
５５）Ｃｕ－Ｎｄ－Ｓｉ合金粉末からなり、合金粉の組成としてＮｄとＮｄの合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
５６）Ｃｕ粉末、Ｎｄ粉末、Ｓｉ粉末、Ｃｕ－Ｎｄ合金粉末、Ｃｕ－Ｓｉ合金粉末、Ｃｕ－Ｎｄ－Ｓｉ合金粉末のうち、いずれか２種以上を選択して混合した混合粉であって、混合粉の組成としてＮｄとＳｉの合計が０．０１ａｔ％以上０．３ａｔ％未満、残部がＣｕである積層造形用金属粉末。
５７）前記金属粉末の平均粒子径Ｄ５０（メジアン径）が１０～１５０μｍであることを特徴とする上記１）～５６）のいずれか一に記載の積層造形用金属粉末。
５８）上記１）～５７）のいずれか一に記載の金属粉末を用いて積層造形法により積層造形物を製造する積層造形物の製造方法。
５９）上記５８）に記載の製造方法により製造された銅合金積層造形物。
Please amend this section by referring to the claims. > Amended.
In order to solve the above problems, the inventors conducted intensive research and discovered that by appropriately selecting elements to be added to copper as metal powder for additive manufacturing, the resulting additive manufacturing product can have mechanical strength that significantly exceeds that of copper without significantly impairing the electrical conductivity that is characteristic of copper.
Based on this finding, the following embodiments are provided.
1) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu powder, Al powder, and X1 (X1 = Co, Fe, Sc, Ti, Zr, or Hf) powder, and the composition of the mixed powder is such that the sum of Al and X1 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
2) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu-Al alloy powder and Cu-X1 (X1 = Co, Fe, Sc, Ti, Zr or Hf) alloy powder, in which the total of Al and X1 in the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
3) A metal powder for additive manufacturing, which is made of a Cu-Al-X1 (X1 = Co, Fe, Sc, Ti, Zr, or Hf) alloy powder, in which the total of Al and X1 in the composition of the alloy powder is 0.01 at% or more and less than 0.3 at%, and the balance is Cu.
4) A mixed powder obtained by selecting and mixing two or more of Cu powder, Al powder, X1 (X1 = Co, Fe, Sc, Ti, Zr, or Hf) powder, Cu-Al alloy powder, Cu-X1 (X1 = Co, Fe, Sc, Ti, Zr, or Hf) alloy powder, and Cu-Al-X1 (X1 = Co, Fe, Sc, Ti, Zr, or Hf) alloy powder, wherein the total of Al and X1 in the composition of the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. Metal powder for additive manufacturing.
5) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu powder, Bi powder, and X2 (X2 = Sc or Zr) powder, and the composition of the mixed powder is such that the sum of Bi and X2 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
6) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu-Bi alloy powder and Cu-X2 (X2 = Sc or Zr) alloy powder, and the composition of the mixed powder is such that the total of Bi and X2 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu.
7) A metal powder for additive manufacturing consisting of a Cu-Bi-X2 (X2 = Sc or Zr) alloy powder, in which the composition of the alloy powder is such that the sum of Bi and X2 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu.
8) A mixed powder obtained by selecting and mixing two or more of Cu powder, Bi powder, X2 (X2 = S or Zr) powder, Cu-Bi alloy powder, Cu-X2 (X2 = S or Zr) alloy powder, and Cu-Bi-X2 (X2 = S or Zr) alloy powder, wherein the total of Bi and X2 in the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. Metal powder for additive manufacturing.
9) A metal powder for additive manufacturing consisting of a mixed powder of Cu powder, Co powder, and X3 (X3 = P, Si, or Hf) powder, in which the total of Co and X3 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
10) A metal powder for additive manufacturing, comprising a mixed powder of Cu-Co alloy powder and Cu-X3 (X3 = P, Si, or Hf) alloy powder, in which the total of Co and X3 in the mixed powder is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.
11) A metal powder for additive manufacturing, comprising a Cu-Co-X3 (X3 = P, Si, or Hf) alloy powder, in which the composition of the alloy powder is such that the sum of Co and X3 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu.
12) A mixed powder obtained by selecting and mixing two or more of Cu powder, Co powder, X3 (X3 = P, Si or Hf) powder, Cu-Co alloy powder, Cu-X3 (X3 = P, Si or Hf) alloy powder, and Cu-Co-X3 (X3 = P, Si or Hf) alloy powder, wherein the total of Co and X3 in the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. Metal powder for additive manufacturing.
13) A metal powder for additive manufacturing consisting of a mixed powder of Cu powder, Cr powder, and X4 (X4 = P or Si) powder, in which the total of Cr and X4 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
14) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu-Cr alloy powder and Cu-X4 (X4 = P or Si) alloy powder, and the total of Cr and X4 in the mixed powder is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.
15) A metal powder for additive manufacturing, which is made of a Cu-Cr-X4 (X4 = P or Si) alloy powder, in which the total of Cr and X4 in the composition of the alloy powder is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu.
16) A mixed powder obtained by selecting and mixing two or more of Cu powder, Cr powder, X4 (X4 = P or Si) powder, Cu-Cr alloy powder, Cu-X4 (X4 = P or Si) alloy powder, and Cu-Cr-X4 (X4 = P or Si) alloy powder, wherein the total of Cr and X4 in the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. Metal powder for additive manufacturing.
17) A metal powder for additive manufacturing consisting of a mixed powder of Cu powder, Fe powder, and X5 (X5 = P, Si, Ti, or Hf) powder, in which the total of Fe and X5 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
18) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu-Fe alloy powder and Cu-X5 (X5 = P, Si, Ti or Hf) alloy powder, and the total of Fe and X5 in the mixed powder is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.
19) A metal powder for additive manufacturing, which is made of a Cu-Fe-X5 (X5 = P, Si, Ti, or Hf) alloy powder, in which the total of Fe and X5 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
20) A mixed powder obtained by selecting and mixing two or more of Cu powder, Fe powder, X5 (X5 = P, Si, Ti or Hf) powder, Cu-Fe alloy powder, Cu-X5 (X5 = P, Si, Ti or Hf) alloy powder, and Cu-Fe-X5 (X5 = P, Si, Ti or Hf) alloy powder, wherein the total of Fe and X5 in the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. A metal powder for additive manufacturing.
21) A metal powder for additive manufacturing consisting of a mixed powder of Cu powder, Ga powder, and X6 (X6 = Sc, Ti, Zr or Hf) powder, in which the total of Ga and X6 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
22) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu-Ga alloy powder and Cu-X6 (X6 = Sc, Ti, Zr or Hf) alloy powder, and the total of Ga and X6 in the mixed powder is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.
23) A metal powder for additive manufacturing, which is made of a Cu-Ga-X6 (X6 = Sc, Ti, Zr, or Hf) alloy powder, in which the total of Ga and X6 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
24) A mixed powder obtained by selecting and mixing two or more of Cu powder, Ga powder, X6 (X6 = Sc, Ti, Zr or Hf) powder, Cu-Ga alloy powder, Cu-X6 (X6 = Sc, Ti, Zr or Hf) alloy powder, and Cu-Ga-X6 (X6 = Sc, Ti, Zr or Hf) alloy powder, wherein the total of Ga and X6 in the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. A metal powder for additive manufacturing.
25) A metal powder for additive manufacturing comprising a mixed powder of Cu powder, In powder, and Sc powder, the mixed powder having a composition in which the total of In and Sc is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.
26) A metal powder for additive manufacturing comprising a mixed powder of Cu-In alloy powder and Cu-Sc alloy powder, the mixed powder having a composition in which the total of In and Sc is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu.
27) A metal powder for additive manufacturing comprising a Cu-In-Sc alloy powder, the composition of the alloy powder being such that the sum of In and Sc is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu.
28) A mixed powder obtained by selecting and mixing two or more of Cu powder, In powder, Sc powder, Cu-In alloy powder, Cu-Sc alloy powder, and Cu-In-Sc alloy powder, wherein the total of In and Sc in the mixed powder is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.
29) A metal powder for additive manufacturing consisting of a mixed powder of Cu powder, Ni powder, and X6 (X6 = Sc, Ti, Zr or Hf) powder, in which the total of Ni and X6 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
30) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu-Ni alloy powder and Cu-X6 (X6 = Sc, Ti, Zr or Hf) alloy powder, and the total of Ni and X6 in the mixed powder is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.
31) A metal powder for additive manufacturing, which is made of a Cu-Ni-X6 (X6 = Sc, Ti, Zr, or Hf) alloy powder, in which the total of Ni and X6 is 0.01 at% or more and less than 0.3 at%, and the balance is Cu.
32) Cu powder, Ni powder, X6 (X6 = Sc, Ti, Zr or Hf) powder, Cu-Ni alloy powder, Cu-X6 (X6 = Sc, Ti, Zr or Hf) alloy powder, Cu-Ni-X6 (X6 = Sc, Ti, Zr or Hf) alloy powder. A mixed powder obtained by selecting and mixing two or more of these, in which the total of Ni and X6 in the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. Metal powder for additive manufacturing.
33) A metal powder for additive manufacturing consisting of a mixed powder of Cu powder, P powder, and X7 (X7 = Sc, Ti, V or Zr) powder, in which the total of P and X7 in the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
34) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu-P alloy powder and Cu-X7 (X7 = Sc, Ti, V or Zr) alloy powder, and the total of P and X7 in the mixed powder is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.
35) A metal powder for additive manufacturing, which is made of a Cu-P-X7 (X7 = Sc, Ti, V, or Zr) alloy powder, in which the total of P and X7 in the composition of the alloy powder is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu.
36) A mixed powder obtained by selecting and mixing two or more of Cu powder, P powder, X7 (X7 = Sc, Ti, V or Zr) powder, Cu-P alloy powder, Cu-X7 (X7 = Sc, Ti, V or Zr) alloy powder, and Cu-P-X7 (X7 = Sc, Ti, V or Zr) alloy powder, wherein the total of P and X7 in the composition of the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. Metal powder for additive manufacturing.
37) A metal powder for additive manufacturing consisting of a mixed powder of Cu powder, Sc powder, and X8 (X8 = Si, Sn or Ti) powder, in which the total of Sc and X8 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
38) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu-Sc alloy powder and Cu-X8 (X8 = Si, Sn or Ti) alloy powder, and the total of Sc and X8 in the mixed powder is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.
39) A metal powder for additive manufacturing consisting of a Cu-Sc-X8 (X8 = Si, Sn or Ti) alloy powder, in which the total of Sc and X7 in the alloy powder composition is 0.01 at% or more and less than 0.3 at%, and the balance is Cu.
40) A mixed powder obtained by selecting and mixing two or more of Cu powder, Sc powder, X8 (X8 = Si, Sn or Ti) powder, Cu-Sc alloy powder, Cu-X8 (X8 = Si, Sn or Ti) alloy powder, and Cu-Sc-X8 (X8 = Si, Sn or Ti) alloy powder, wherein the total of Sc and X8 in the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. Metal powder for additive manufacturing.
41) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu powder, Si powder, and X9 (X9 = Ti, V, or Zr) powder, and the mixed powder has a composition in which the total of Si and X9 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
42) A metal powder for additive manufacturing, comprising a mixed powder of Cu-Si alloy powder and Cu-X9 (X9 = Ti, V, or Zr) alloy powder, in which the total of Si and X9 in the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
43) A metal powder for additive manufacturing, comprising a Cu-Si-X9 (X9 = Ti, V, or Zr) alloy powder, in which the total of Si and X9 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu.
44) A mixed powder obtained by selecting and mixing two or more of Cu powder, Si powder, X9 (X9 = Ti, V or Zr) powder, Cu-Si alloy powder, Cu-X9 (X9 = Ti, V or Zr) alloy powder, and Cu-Si-X9 (X9 = Ti, V or Zr) alloy powder, wherein the total of Si and X9 in the mixed powder is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. A metal powder for additive manufacturing.
45) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu powder, Sn powder, and X10 (X10 = Ti or Zr) powder, and the composition of the mixed powder is such that the total of Sn and X10 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
46) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu-Sn alloy powder and Cu-X10 (X10 = Ti or Zr) alloy powder, and the composition of the mixed powder is such that the total of Sn and X10 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
47) A metal powder for additive manufacturing, comprising a Cu-Sn-X10 (X10 = Ti or Zr) alloy powder, in which the composition of the alloy powder is such that the sum of Sn and X10 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu.
48) Cu powder, Sn powder, X10 (X10 = Ti or Zr) powder, Cu-Sn alloy powder, Cu-X10 (X10 = Ti or Zr) alloy powder, Cu-Sn-X10 (X10 = Ti or Zr) alloy powder. A mixed powder obtained by selecting and mixing two or more of these, in which the total of Sn and X10 in the composition of the mixed powder is 0.01 at% or more and less than 0.3 at%, and the balance is Cu. A metal powder for additive manufacturing.
49) A metal powder for additive manufacturing, comprising a mixed powder of Cu powder, Hf powder, and X11 (X11 = Ni, P, Si, or Sn) powder, in which the total of Hf and X11 is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu.
50) A metal powder for additive manufacturing, which is composed of a mixed powder of Cu-Hf alloy powder and Cu-X11 (X11 = Ni, P, Si or Sn) alloy powder, and the composition of the mixed powder is such that the total of Hf and X11 is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu.
51) A metal powder for additive manufacturing, comprising a Cu-Hf-X11 (X11 = Ni, P, Si, or Sn) alloy powder, in which the composition of the alloy powder is such that the sum of Hf and X11 is 0.01 at% or more but less than 0.3 at%, and the remainder is Cu.
52) Cu powder, Hf powder, X11 (X11 = Ni, P, Si or Sn) powder, Cu-Hf alloy powder, Cu-X11 (X11 = Ni, P, Si or Sn) alloy powder, Cu-Hf-X11 (X11 = Ni, P, Si or Sn) alloy powder. A mixed powder obtained by selecting and mixing two or more of these, in which the total of Hf and X11 (X11 = Ni, P, Si or Sn) is 0.01 at% or more and less than 0.3 at%, and the remainder is Cu. A metal powder for additive manufacturing.
53) A metal powder for additive manufacturing comprising a mixed powder of Cu powder, Nd powder, and Si powder, the mixed powder having a composition in which the sum of Nd and Si is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu.
54) A metal powder for additive manufacturing comprising a mixed powder of Cu-Nd alloy powder and Si alloy powder, the mixed powder having a composition in which the sum of Nd and Si is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu.
55) A metal powder for additive manufacturing comprising a Cu-Nd-Si alloy powder, the composition of the alloy powder being such that the sum of Nd and Nd is 0.01 at% or more but less than 0.3 at%, with the remainder being Cu.
56) A metal powder for additive manufacturing, comprising a mixed powder obtained by selecting and mixing two or more of Cu powder, Nd powder, Si powder, Cu-Nd alloy powder, Cu-Si alloy powder, and Cu-Nd-Si alloy powder, wherein the total of Nd and Si is 0.01 at% or more and less than 0.3 at%, with the remainder being Cu.
57) The metal powder for additive manufacturing described in any one of 1) to 56) above, characterized in that the average particle diameter D50 (median diameter) of the metal powder is 10 to 150 μm.
58) A method for producing an additive manufacturing method for producing an additive manufacturing object by an additive manufacturing method using the metal powder according to any one of 1) to 57) above.
59) A copper alloy laminated object produced by the method described in 58) above.
本発明によれば、銅に添加する元素を適切に選定した積層造形用金属粉末であって、該金属粉末を用いて作製した積層造形物は、高い導電率と高い機械強度を兼ね備えるという優れた効果を有する。 The present invention provides a metal powder for additive manufacturing in which the elements added to copper are appropriately selected, and additive manufacturing products produced using the metal powder have the excellent effect of combining high electrical conductivity with high mechanical strength.
積層造形用の金属粉末として、純銅粉末を用いた場合、レーザーの吸収率が他の元素と比較して低いため、添加元素にもよるが銅合金粉末又は混合粉末にすることで、純銅粉末よりもレーザーの吸収率が高まり、積層造形性を向上することができる。一方、積層造形物としては、高強度且つ高導電率であることが求められ、銅合金は、添加元素を析出させることで析出強化による機械強度の向上が期待できるものの、純銅の導電率は、他の元素と比較して高いため、銅合金は、添加元素の固溶により導電性が損なわれる。 When pure copper powder is used as the metal powder for additive manufacturing, its laser absorption rate is lower than that of other elements, so by using copper alloy powder or mixed powder, although this depends on the added elements, the laser absorption rate is higher than that of pure copper powder, and additive manufacturing properties can be improved. On the other hand, additive manufacturing objects are required to have high strength and high conductivity, and although copper alloys can be expected to improve their mechanical strength through precipitation strengthening by precipitating added elements, the conductivity of pure copper is higher than that of other elements, so the conductivity of copper alloys is impaired by the solid solution of added elements.
このようなことから本発明は、銅の積層造形物において、純銅の特徴である高導電率の特性を活かしつつ、添加元素同士で安定な化合物を形成させて、添加元素の固溶を抑え、この化合物を銅（母相）に析出させることで積層造形物を析出強化し、高強度を有する積層造形物を得ようとするものである。より詳細には、積層造形物において、添加元素同士で安定な化合物を生成する基準として、Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙを用い、Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下のとき、母相の銅から、添加元素の化合物が析出して、析出強化を期待できるとの知見に基づくものである。 In light of this, the present invention aims to obtain a high-strength additive product by forming stable compounds between additive elements in an additive product while taking advantage of the high electrical conductivity characteristic of pure copper, suppressing solid solubility of the additive elements, and precipitating these compounds in the copper (parent phase), thereby precipitation strengthening the additive product. More specifically, the present invention uses formation energy as a criterion for generating stable compounds between additive elements in an additive product, and is based on the finding that when formation energy is -0.3 eV or less, compounds of the additive elements precipitate from the copper parent phase, and precipitation strengthening can be expected.
（添加元素の選定）
銅に対する固溶量は添加元素の固有の性質であり、一般的に「相図」と呼ばれる二つの元素の温度に対する相関係を示す図から抽出することができる。たとえば、ＡＳＭ Ｉｎｔｅｒｎａｔｉｏｎａｌ社発行のＰｈａｓｅ Ｄｉａｇｒａｍｓ ｆｏｒ Ｂｉｎａｒｙ Ａｌｌｏｙｓ （ＩＳＢＮ： ０－８７１７０－６８２－２） を参考にして判断することができる。この相図から、Ｃｕ側の固溶量を参照し、高導電率を考慮して、各種添加元素を選定した。
・銅に対して、１．０ｗｔ％以上固溶する１１元素（Ｚｎ、Ｓｉ、Ｐｔ、Ｐｄ、Ｎｉ、Ｍｎ、Ｇｅ、Ｇａ、Ａｕ、Ａｓ、Ａｌ）を抽出した。
・銅に対して、０．１ｗｔ％以上１．０ｗｔ％未満固溶する２５元素（Ｚｒ、Ｖ、Ｔｉ、Ｔｌ、Ｓｎ、Ｓｃ、Ｓｂ、Ｒｈ、Ｐｂ、Ｐ、Ｍｇ、Ｌｉ、Ｉｒ、Ｉｎ、Ｈｇ、Ｈｆ、Ｈ、Ｆｅ、Ｃｒ、Ｃｏ、Ｃｄ、Ｂｉ、Ｂｅ、Ｂ、Ａｇ）を抽出した。
・さらに、銅に対して、０．２ａｔ％以下固溶する元素を対象として、３２元素（Ｂａ、Ｂｉ、Ｃａ、Ｇｄ、Ｅｕ、Ｈｏ、Ｌａ、Ｌｕ、Ｍｏ、Ｎｄ、Ｎｂ、Ｏｓ、Ｐｂ、Ｐｍ、Ｐｕ、Ｒｅ、Ｒｕ、Ｓ、Ｓｅ、Ｓｒ、Ｓｍ、Ｔｂ、Ｔｃ、Ｔｅ、Ｔｈ、Ｔｍ、Ｕ、Ｖ、Ｗ、Ｙ、Ｙｂ、Ｚｒ）を選択し、機械強度及び導電率を両立させる観点から、前記３２元素の中から、Ｗ、Ｚｒ、Ｎｂ、Ｎｄ、Ｙ、Ｍｏ、Ｏｓ、Ｒｕの８元素を、新たな観点で抽出した。
(Selection of additive elements)
The amount of solid solution in copper is an inherent property of the additive element, and can be extracted from a diagram showing the phase relationship of two elements with respect to temperature, generally called a "phase diagram." For example, it can be determined by referring to Phase Diagrams for Binary Alloys (ISBN: 0-87170-682-2) published by ASM International. From this phase diagram, various additive elements were selected by referring to the amount of solid solution on the Cu side and taking into consideration high electrical conductivity.
Eleven elements (Zn, Si, Pt, Pd, Ni, Mn, Ge, Ga, Au, As, Al) that form a solid solution of 1.0 wt% or more in copper were extracted.
- 25 elements that form a solid solution in copper at 0.1 wt% or more and less than 1.0 wt% (Zr, V, Ti, Tl, Sn, Sc, Sb, Rh, Pb, P, Mg, Li, Ir, In, Hg, Hf, H, Fe, Cr, Co, Cd, Bi, Be, B, Ag) were extracted.
Furthermore, 32 elements (Ba, Bi, Ca, Gd, Eu, Ho, La, Lu, Mo, Nd, Nb, Os, Pb, Pm, Pu, Re, Ru, S, Se, Sr, Sm, Tb, Tc, Te, Th, Tm, U, V, W, Y, Yb, Zr) were selected as elements that form a solid solution in copper at 0.2 at% or less, and from the viewpoint of achieving both mechanical strength and electrical conductivity, eight elements, namely W, Zr, Nb, Nd, Y, Mo, Os, and Ru, were extracted from the above 32 elements from a new perspective.
次に、上記抽出した元素のうち、以下の観点から元素を排除し、２０元素（Ｚｒ、Ｎｄ、Ｓｉ、Ｎｉ、Ｍｎ、Ｖ、Ｔｉ、Ｓｃ、Ｆｅ、Ｃｒ、Ｃｏ、Ｐ、Ｚｎ、Ｇａ、Ａｌ、Ｓｎ、Ｉｎ、Ｍｇ、Ｂｉ、Ｈｆ）を抽出した。
・非金属元素（Ｈ）
・貴金属元素（Ｏｓ、Ｒｕ、Ｐｔ、Ｐｄ、Ａｕ、Ｒｈ、Ａｇ）
・有害性のある元素（Ｐｂ、Ｈｇ、Ｃｄ、Ｂｅ、Ｇｅ、Ａｓ、Ｔｌ、Ｓｂ）
・危険性のある元素（Ｙ、Ｌｉ）
・単一金属の融点が１８００℃以上のアトマイズし難い元素
（Ｗ、Ｎｂ、Ｍｏ、Ｉｒ、Ｂ）
Next, from the extracted elements, elements were excluded from the following viewpoints, and 20 elements (Zr, Nd, Si, Ni, Mn, V, Ti, Sc, Fe, Cr, Co, P, Zn, Ga, Al, Sn, In, Mg, Bi, Hf) were extracted.
-Non-metallic elements (H)
・Precious metal elements (Os, Ru, Pt, Pd, Au, Rh, Ag)
- Harmful elements (Pb, Hg, Cd, Be, Ge, As, Tl, Sb)
Hazardous elements (Y, Li)
・Elements that are difficult to atomize because their single metal melting points are 1800°C or higher (W, Nb, Mo, Ir, B)
前記２０元素に対し、Ｍａｔｅｒｉａｌｓ Ｐｒｏｊｅｃｔデータベースにより、Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせと化合物の組成を抽出した。さらに抽出した二元系の添加元素より、それぞれの添加元素が０．１ａｔ％以上、銅に固溶するものを抽出した。その結果を以下に示す。 For the 20 elements mentioned above, the Materials Project database was used to extract combinations of additive elements that produce compounds with a formation energy of -0.3 eV or less, and the composition of the compounds. Furthermore, from the extracted binary additive elements, those in which each additive element is soluble in copper at 0.1 at% or more were extracted. The results are shown below.
（Ｃｕ－Ａｌ－Ｘ１系：Ｘ１は、Ｃｏ、Ｆｅ、Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＡｌとＸ１が挙げられる。ＡｌとＸ１の合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ａｌ－Ｘ１合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ａｌ粉末、Ｘ１粉末の混合粉末や、Ｃｕ－Ｎｉ合金、Ｃｕ－Ｘ１合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-Al-X1 system: X1 is Co, Fe, Sc, Ti, Zr or Hf)
A combination of additive elements that produces a compound with a formation energy of -0.3 eV or less is Al and X1. The total content of Al and X1 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-Al-X1 alloy, it is also possible to use a mixture of Cu powder, Al powder, and X1 powder, or a Cu-Ni alloy and a Cu-X1 alloy in appropriate combination as the metal powder, in consideration of alloying by an electron beam or a laser beam during modeling. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｂｉ－Ｘ２系：Ｘ２は、Ｓｃ又はＺｒ）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＢｉとＸ２が挙げられる。ＢｉとＸ２の合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｂｉ－Ｘ２合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｂｉ粉末、Ｘ２粉末の混合粉末や、Ｃｕ－Ｂｉ合金、Ｃｕ－Ｘ２合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-Bi-X2 system: X2 is Sc or Zr)
A combination of additive elements that produces a compound with a formation energy of -0.3 eV or less includes Bi and X2. The total content of Bi and X2 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-Bi-X2 alloy, it is also possible to use a mixture of Cu powder, Bi powder, and X2 powder, or a Cu-Bi alloy and a Cu-X2 alloy in appropriate combination as the metal powder, in consideration of alloying by an electron beam or a laser beam during modeling. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｃｏ－Ｘ３系：Ｘ３は、Ｐ、Ｓｉ又はＨｆ）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＣｏとＸ３が挙げられる。ＣｏとＸ３の合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｃｏ－Ｘ３合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｃｏ粉末、Ｘ３粉末の混合粉末や、Ｃｕ－Ｃｏ合金、Ｃｕ－Ｘ３合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-Co-X3 system: X3 is P, Si or Hf)
Co and X3 are examples of combinations of additive elements that produce a compound with a formation energy of -0.3 eV or less. The total content of Co and X3 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-Co-X3 alloy, if alloying is performed by an electron beam or laser beam during modeling, a mixture of Cu powder, Co powder, and X3 powder, or a Cu-Co alloy and a Cu-X3 alloy can be used as the metal powder in appropriate combination. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｃｒ－Ｘ４系：Ｘ４は、Ｐ又はＳｉ）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＣｒとＸ３が挙げられる。ＣｒとＸ４の合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｃｒ－Ｘ４合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｃｒ粉末、Ｘ４粉末の混合粉末や、Ｃｕ－Ｃｒ合金、Ｃｕ－Ｘ４合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-Cr-X4 system: X4 is P or Si)
Cr and X3 are examples of combinations of additive elements that produce a compound with a formation energy of -0.3 eV or less. The total content of Cr and X4 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-Cr-X4 alloy, if alloying is performed by an electron beam or laser beam during modeling, a mixed powder of Cu powder, Cr powder, and X4 powder, or a Cu-Cr alloy and a Cu-X4 alloy can be used as the metal powder in appropriate combination. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｆｅ－Ｘ５系：Ｘ５は、Ｐ、Ｓｉ、Ｔｉ又はＨｆ）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＦｅとＸ５が挙げられる。ＦｅとＸ５の合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｆｅ－Ｘ５合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｆｅ粉末、Ｘ５粉末の混合粉末や、Ｃｕ－Ｆｅ合金、Ｃｕ－Ｘ５合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-Fe-X5 system: X5 is P, Si, Ti or Hf)
Combinations of additive elements that produce compounds with a formation energy of -0.3 eV or less include Fe and X5. The total content of Fe and X5 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-Fe-X5 alloy, if alloying is performed by an electron beam or laser beam during modeling, a mixture of Cu powder, Fe powder, and X5 powder, or a Cu-Fe alloy and a Cu-X5 alloy can be used as the metal powder in appropriate combination. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｇａ－Ｘ６系：Ｘ６は、Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＧａとＸ６が挙げられる。ＧａとＸ６の合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｇａ－Ｘ６合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｇａ粉末、Ｘ６粉末の混合粉末や、Ｃｕ－Ｇａ合金、Ｃｕ－Ｘ６合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-Ga-X6 system: X6 is Sc, Ti, Zr or Hf)
Ga and X6 are examples of combinations of additive elements that produce a compound with a formation energy of -0.3 eV or less. The total content of Ga and X6 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-Ga-X6 alloy, if alloying is performed by an electron beam or laser beam during modeling, a mixture of Cu powder, Ga powder, and X6 powder, or a Cu-Ga alloy and a Cu-X6 alloy can be used as the metal powder in appropriate combination. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｉｎ－Ｓｃ系）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＩｎとＳｃが挙げられる。ＩｎとＳｃの合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｉｎ－Ｓｃ合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｉｎ粉末、Ｓｃ粉末の混合粉末や、Ｃｕ－Ｉｎ合金、Ｃｕ－Ｓｃ合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-In-Sc system)
In and Sc are examples of combinations of additive elements that produce a compound with a formation energy of -0.3 eV or less. The total content of In and Sc is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-In-Sc alloy, if alloying is performed by an electron beam or laser beam during modeling, a mixed powder of Cu powder, In powder, and Sc powder, a Cu-In alloy, and a Cu-Sc alloy can be appropriately combined as the metal powder. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｎｉ－Ｘ６系：Ｘ６は、Ｓｃ、Ｔｉ、Ｚｒ又はＨｆ）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＮｉとＸ６が挙げられる。ＮｉとＸ５の合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｎｉ－Ｘ６合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｎｉ粉末、Ｘ６粉末の混合粉末や、Ｃｕ－Ｎｉ合金、Ｃｕ－Ｘ６合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-Ni-X6 system: X6 is Sc, Ti, Zr or Hf)
Ni and X6 are examples of combinations of additive elements that produce a compound with a formation energy of -0.3 eV or less. The total content of Ni and X5 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-Ni-X6 alloy, if alloying is performed by an electron beam or laser beam during modeling, a mixed powder of Cu powder, Ni powder, and X6 powder, or a Cu-Ni alloy and a Cu-X6 alloy can be used as the metal powder in appropriate combination. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｐ－Ｘ７系：Ｘ７は、Ｎｂ、Ｓｃ、Ｔｉ、Ｖ又はＺｒ）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＰとＸ７が挙げられる。ＰとＸ７の合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｐ－Ｘ７合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｐ粉末、Ｘ７粉末の混合粉末や、Ｃｕ－Ｐ合金、Ｃｕ－Ｘ７合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-P-X7 system: X7 is Nb, Sc, Ti, V or Zr)
P and X7 are examples of combinations of additive elements that produce a compound with a formation energy of -0.3 eV or less. The total content of P and X7 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-P-X7 alloy, if alloying is performed by an electron beam or laser beam during modeling, a mixed powder of Cu powder, P powder, and X7 powder, or a Cu-P alloy and a Cu-X7 alloy can be used as the metal powder in appropriate combination. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｓｃ－Ｘ８系：Ｘ８は、Ｓｉ、Ｓｎ又はＺｎ）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＳｃとＸ８が挙げられる。ＳｃとＸ８の合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｓｃ－Ｘ８合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｓｃ粉末、Ｘ８粉末の混合粉末や、Ｃｕ－Ｓｃ合金、Ｃｕ－Ｘ８合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-Sc-X8 system: X8 is Si, Sn or Zn)
Sc and X8 are examples of combinations of additive elements that produce a compound with a formation energy of -0.3 eV or less. The total content of Sc and X8 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-Sc-X8 alloy, if alloying is performed by an electron beam or laser beam during modeling, a mixed powder of Cu powder, Sc powder, and X8 powder, or a Cu-Sc alloy and a Cu-X8 alloy can be used as the metal powder in appropriate combination. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｓｉ－Ｘ９系：Ｘ９は、Ｔｉ、Ｖ又はＺｒ）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＳｉとＸ９が挙げられる。ＳｉとＸ９の合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｓｉ－Ｘ９合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｓｉ粉末、Ｘ９粉末の混合粉末や、Ｃｕ－Ｓｉ合金、Ｃｕ－Ｘ９合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-Si-X9 system: X9 is Ti, V or Zr)
Examples of combinations of additive elements that produce compounds with a formation energy of -0.3 eV or less include Si and X9. The total content of Si and X9 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-Si-X9 alloy, if alloying is performed by an electron beam or laser beam during modeling, a mixture of Cu powder, Si powder, and X9 powder, or a Cu-Si alloy and a Cu-X9 alloy can be used as the metal powder in appropriate combination. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｓｎ－Ｘ１０系：Ｘ１０は、Ｔｉ又はＺｒ）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＳｎとＸ１０が挙げられる。ＳｎとＸ１０の合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｓｎ－Ｘ１０合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｓｎ粉末、Ｘ１０粉末の混合粉末や、Ｃｕ－Ｓｎ合金、Ｃｕ－Ｘ１０合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-Sn-X10 system: X10 is Ti or Zr)
As a combination of additive elements that generates a compound with a formation energy of -0.3 eV or less, Sn and X10 can be mentioned. The total content of Sn and X10 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-Sn-X10 alloy, if alloying is performed by an electron beam or a laser beam during modeling, a mixed powder of Cu powder, Sn powder, and X10 powder, a Cu-Sn alloy, and a Cu-X10 alloy can be appropriately combined as the metal powder. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｈｆ－Ｘ１１系：Ｘ１１は、Ｎｉ、Ｐ、Ｓｉ又はＳｎ）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＨｆとＸ１１が挙げられる。ＨｆとＸ１１の合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｈｆ－Ｘ１１合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｈｆ粉末、Ｘ１１粉末の混合粉末や、Ｃｕ－Ｈｆ合金、Ｃｕ－Ｘ１１合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-Hf-X11 system: X11 is Ni, P, Si or Sn)
Hf and X11 are examples of combinations of additive elements that produce a compound with a formation energy of -0.3 eV or less. The total content of Hf and X11 is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-Hf-X11 alloy, if alloying is performed by an electron beam or laser beam during modeling, a mixed powder of Cu powder, Hf powder, and X11 powder, a Cu-Hf alloy, and a Cu-X11 alloy can be used as the metal powder in appropriate combination. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
（Ｃｕ－Ｎｄ－Ｓｉ系）
Ｆｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙが－０．３ｅＶ以下の化合物を生成する添加元素の組み合わせとして、ＮｄとＳｉが挙げられる。ＮｄとＳｉの合計含有量は、０．０１ａｔ％以上０．３ａｔ％未満とする。ここで、積層造形物が、Ｃｕ－Ｎｄ－Ｓｉ合金になっていればよいので、造形時の電子ビーム又はレーザービームにより合金化することを考慮すれば、金属粉末として、Ｃｕ粉末、Ｎｄ粉末、Ｓｉ粉末の混合粉末や、Ｃｕ－Ｎｄ合金、Ｃｕ－Ｓｉ合金を適宜組み合わせて用いることもできる。その場合、合金後の組成が上記範囲となるように調整する必要がある。以下に、添加元素の濃度を変更したときのＦｏｒｍａｔｉｏｎ Ｅｎｅｒｇｙ計算結果を示す。
(Cu-Nd-Si system)
Nd and Si are examples of combinations of additive elements that produce a compound with a formation energy of -0.3 eV or less. The total content of Nd and Si is 0.01 at% or more and less than 0.3 at%. Here, since it is sufficient that the layered product is a Cu-Nd-Si alloy, if alloying is performed by an electron beam or laser beam during modeling, a mixed powder of Cu powder, Nd powder, and Si powder, or a Cu-Nd alloy and a Cu-Si alloy can be used as the metal powder in appropriate combination. In that case, it is necessary to adjust the composition after alloying to be within the above range. Below, the formation energy calculation results when the concentration of the additive element is changed are shown.
ここで、添加元素の含有量は、例えばＳＩＩ社製ＳＰＳ３５００ＤＤのＩＣＰ－ＯＥＳ（高周波誘導結合プラズマ発光分析法）で測定することができる。 Here, the content of the added elements can be measured, for example, using an ICP-OES (inductively coupled plasma optical emission spectrometry) on an SII SPS3500DD.
また、金属粉末の平均粒子径Ｄ５０は１０～１５０μｍであることが好ましい。平均粒子径Ｄ５０を２０μｍ以上とすることで、造形時に粉末が舞いにくくなり、粉末の取り扱いが容易になる。また、平均粒子径Ｄ５０を１５０μｍ以下とすることで、粉末の溶融が円滑に進み、さらに高精細な積層造形物を製造することが可能となる。
平均粒子径Ｄ５０とは、顕微鏡画像解析により得られる粒子の画像から算出した面積に相当する円の直径を粒径として、当該粒度分布において、積算値５０％での粒径をいう。例えば、スペクトリス株式会社（マルバーン事業部）製の乾式粒子画像分析装置Ｍｏｒｐｈｏｌｏｇｉ Ｇ３により測定することができる。
The average particle size D50 of the metal powder is preferably 10 to 150 μm. By setting the average particle size D50 to 20 μm or more, the powder is less likely to fly around during modeling, making it easier to handle. By setting the average particle size D50 to 150 μm or less, the powder melts smoothly, making it possible to produce a highly precise layered object.
The average particle diameter D50 refers to the diameter of a circle corresponding to the area calculated from an image of a particle obtained by microscopic image analysis, and the diameter is the particle diameter at an integrated value of 50% in the particle size distribution. For example, it can be measured by a dry particle image analyzer Morphologi G3 manufactured by Spectris Co., Ltd. (Malvern Division).
（金属粉末の製造方法）
金属粉末は、公知の方法によって製造された銅合金粉末を使用することができる。粒径数μｍ以上のサイズであれば、工業的には製造コストに優れるアトマイズ法に代表される乾式法によって製造された金属粉末を使用することが一般的ではあるが、還元法などの湿式法によって製造された金属粉末を使用することも可能である。具体的には、タンデッシュの底部から、溶融状態の合金成分を落下させながら、高圧ガスまたは高圧水と接触させ、合金成分を急冷凝固させることにより、合金成分を粉末化する。この他、たとえばプラズマアトマイズ法、遠心力アトマイズ法などによって、金属粉末を製造してもよい。これらの製造方法で得られた金属粉末を用いることにより、緻密な積層造形物が得られる傾向にある。
(Method of manufacturing metal powder)
The metal powder may be a copper alloy powder produced by a known method. If the particle size is several μm or more, it is common to use a metal powder produced by a dry method, such as the atomization method, which is industrially superior in manufacturing cost, but it is also possible to use a metal powder produced by a wet method, such as a reduction method. Specifically, the alloy components in a molten state are dropped from the bottom of a tundish and brought into contact with high-pressure gas or high-pressure water to rapidly cool and solidify the alloy components, thereby powdering the alloy components. In addition, the metal powder may be produced by, for example, a plasma atomization method or a centrifugal atomization method. By using the metal powder obtained by these manufacturing methods, a dense layered object tends to be obtained.
（積層造形物の製造方法）
本実施形態に係る金属粉末を用いる方法であれば、その具体的な手段は、特に制限されない。例えば、以下のような方法で製造することができる。まず、造形用のステージに金属粉末の薄層を形成し、この薄層に、装置に入力されたプログラムに沿って電子ビーム又はレーザービームを照射して溶解し、その後、冷却凝固させる。次に、造形用のステージをスライドさせ、再度、金属粉末の薄層を形成したのち、電子ビーム又はレーザービームを照射して溶解し、その後、冷却固化させる。これら一連の工程を繰り返し行うことによって、プログラムされた形の積層造形物を製造することができる。
(Method for manufacturing a laminated object)
As long as the method uses the metal powder according to the present embodiment, the specific means is not particularly limited. For example, it can be manufactured by the following method. First, a thin layer of metal powder is formed on a modeling stage, and this thin layer is irradiated with an electron beam or a laser beam according to a program inputted into the device to melt it, and then cooled and solidified. Next, the modeling stage is slid, and a thin layer of metal powder is formed again, and then irradiated with an electron beam or a laser beam to melt it, and then cooled and solidified. By repeating this series of steps, a layered object of a programmed shape can be manufactured.
本発明に係る金属粉末は、レーザー光の吸収率が上昇し、効率良くレーザーによる溶融が可能であり、複雑形状で、高導電率や高強度が求められる金属部品（放熱を目的としたヒートシンクや熱交換器、電子部品用のコネクター材、航空宇宙用の機械部材等）を製造するための積層造形用途として、特に有用である。 The metal powder of the present invention has an increased absorption rate of laser light and can be efficiently melted by a laser, making it particularly useful for additive manufacturing applications to produce metal parts with complex shapes that require high electrical conductivity and high strength (heat sinks and heat exchangers for heat dissipation, connector materials for electronic components, mechanical components for aerospace use, etc.).
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