JP7640449B2 - Display device manufacturing jig, display device manufacturing method, display device manufactured using the display device manufacturing jig, and display device manufactured using the display device manufacturing method - Google Patents

Description

The present invention relates to a display device manufacturing jig, a display device manufacturing method, a display device manufactured using the display device manufacturing jig, and a display device manufactured using the display device manufacturing method.

As a conventional technique, a method for transporting micro LED (Light Emitting Diode) chips using a film for transporting micro LED chips having a first cured resin is known (see, for example, Patent Document 1).

This method of transporting micro LED chips includes a step of pressing a micro LED chip transport film onto the micro LED chips on the substrate to adhere the micro LED chips to the first cured resin, and a step of transferring the micro LED chips adhered to the first cured resin onto another substrate.

JP 2021-177506 A

In conventional methods for transporting micro LED chips, when the micro LED chips are pressed onto a film for transporting micro LED chips, all of the micro LED chips must be attached, and when the micro LED chips attached to the first cured resin are transferred to another substrate, all of the micro LED chips must be transferred, and high positioning accuracy is required to place them accurately on the substrate to which they are transferred, resulting in an increase in manufacturing costs.

The object of the present invention is therefore to provide a display device manufacturing jig that can reduce manufacturing costs, a display device manufacturing method, a display device manufactured using the display device manufacturing jig, and a display device manufactured using the display device manufacturing method.

One aspect of the present invention provides a display device manufacturing tool that includes a base that is arranged so that its back surface comes into contact with a material dispersion liquid in which material forming at least the light-emitting layer of light-emitting elements arranged corresponding to the pixels of the display device is dispersed, a light-shielding region that is provided on the base and does not transmit light incident from the front surface of the base to outside the back surface, and a transparent region that is provided on the base and transmits light incident from the front surface, and in which the material of the light-emitting elements that is accumulated and attached by the transmitted light is arranged in the same two-dimensional arrangement as the pixels of the display device.

Another aspect of the present invention provides a method for manufacturing a display device, which includes preparing a material dispersion liquid in which a material forming at least the light-emitting layer of a light-emitting element arranged corresponding to a pixel of a display device is dispersed, contacting the back surface of a display device manufacturing jig having a light-shielding region that does not transmit light incident from the front surface to the back surface and a transparent region that transmits light incident from the front surface and accumulates and adheres the material of the light-emitting element in the same arrangement as the two-dimensional arrangement of the pixels of the display device with the material dispersion liquid, irradiating light from the front surface of the display device manufacturing jig, and adhering the material of the light-emitting element accumulated around the transparent region by the transmitted light to the back surface.

Another aspect of the present invention provides a display device manufactured using the display device manufacturing jig described above. Still another aspect of the present invention provides a display device manufactured using the display device manufacturing method described above.

The present invention makes it possible to reduce manufacturing costs.

FIG. 1(a) is a diagram showing an example of a display device, FIG. 1(b) is an enlarged diagram of an example of a portion of a pixel that forms a display image, and FIG. 1(c) is a diagram showing an example of a micro LED. FIG. 2(a) is a diagram showing an example of a display device manufacturing jig, FIG. 2(b) is an example of a cross-sectional view of the display device manufacturing jig, and FIG. 2(c) is a diagram showing an example of a through hole related to a modified example. 3A to 3F are diagrams showing an example of a manufacturing process of a display device. 4A to 4G are diagrams showing an example of a manufacturing process for a display device.

Summary of the Preferred Embodiments
The display device manufacturing jig of the embodiment is roughly configured to include a base whose back surface is arranged to contact a material dispersion liquid in which material forming at least the light-emitting layer of light-emitting elements arranged to correspond to pixels of the display device is dispersed, a light-shielding region provided on the base that does not allow light incident from the front surface of the base to pass outside the back surface, and a transparent region provided on the base that transmits light incident from the front surface and accumulates and adheres the material of the light-emitting elements in an arrangement identical to the two-dimensional arrangement of the pixels of the display device.

The manufacturing method of the display device according to the embodiment includes a manufacturing method in which a material dispersion liquid in which at least a material forming a light-emitting layer of a light-emitting element arranged corresponding to a pixel of the display device is dispersed is prepared, the back surface of a display device manufacturing jig having a light-shielding region that does not transmit light incident from the front surface to the back surface and a transparent region that transmits light incident from the front surface and accumulates and adheres the material of the light-emitting element in the same arrangement as the two-dimensional arrangement of the pixels of the display device is brought into contact with the material dispersion liquid, light is irradiated from the front surface of the display device manufacturing jig, and the material of the light-emitting element accumulated around the transparent region by the transmitted light is adhered to the back surface.

Furthermore, the display device of the embodiment is at least one of a display device manufactured using the display device manufacturing jig described above and a display device manufactured using the display device manufacturing method.

At least one of the display device manufactured using this display device manufacturing jig and the display device manufactured using the display device manufacturing method has a transparent region provided corresponding to the pixel of the display device, and the light-emitting element material is accumulated around the transparent region, so that the material of a large number of light-emitting elements corresponding to the pixels can be arrayed at once and arranged on the circuit board. Therefore, the display device manufacturing jig and the display device manufacturing method have fewer steps and suppress misalignment of the light-emitting elements compared to arranging the light-emitting elements one by one, thereby reducing manufacturing costs.

[Embodiment Mode]
(Overview of display device manufacturing jig 1)
Fig. 1(a) is a diagram showing an example of a display device according to an embodiment, Fig. 1(b) is an enlarged diagram of an example of a portion of a pixel that forms a display image, and Fig. 1(c) is a diagram showing an example of a micro LED. Fig. 2(a) is a diagram showing an example of a jig for manufacturing a display device according to an embodiment, Fig. 2(b) is an example of a cross-sectional view of the jig for manufacturing a display device, and Fig. 2(c) is a diagram showing an example of a through hole according to a modified example. Figs. 3(a) to 4(g) are diagrams showing an example of a manufacturing process for a display device according to an embodiment.

Note that in the figures relating to the embodiments described below, the ratios between figures and shapes may differ from the actual ratios and shapes. Also, "A-B" indicating a numerical range is used to mean greater than or equal to A and less than or equal to B.

The manufacturing method of the display device 9 is to form a micro-sized self-luminous structure 22 (LED or quantum dot) in a display device manufacturing jig 1 with micro-holes by the method described below, and then process a metal layer 4 for adhesion to the circuit board 5 on the self-luminous structure 22, and then transfer it to the circuit board 5.

In the display device manufacturing jig 1 of this embodiment, through holes 14 are formed as micropores, which will be described later. The display device manufacturing jig 1 is formed of a material that does not transmit light of the wavelength of the laser light 3, which will be described later, or is painted with a material that does not transmit light. The through holes 14 are formed at intervals corresponding to the pitch P at which the micro LEDs 7 are arranged as light-emitting elements. The size of the through holes 14 is slightly smaller than the size of the micro LEDs 7. Below, the display device manufacturing jig 1 and the manufacturing method of the display device 9 using this display device manufacturing jig 1 will be described in more detail. Note that the display device 9 manufactured using the display device manufacturing jig 1 and the display device 9 manufactured using the manufacturing method of the display device 9 are not limited to the display device 9 shown below, and may be, for example, a display device that displays only a specific image, and a light-emitting device that emits light such as a light for illumination or a backlight.

The display device 9 is a micro LED display. As shown in Figures 1(a) to 1(c), a micro LED display is a display in which micro LEDs 7 are arranged as a plurality of pixels 91 that form a display image 90.

When the display device 9 has a resolution of 1920 x 1080, for example, approximately 2 million micro-LEDs 7 are required for each color. When the display device 9 is arranged in three colors, RGB, for color display, approximately 6 million micro-LEDs 7 must be arranged at a precise pitch. The display device 9 of this embodiment makes it possible to arrange the micro-LEDs 7 in an array using the display device manufacturing jig 1 described below, rather than arranging the micro-LEDs 7 one by one.

As shown in Figures 2(a) and 2(b), the display device manufacturing jig 1 is roughly configured to include a base 10 arranged so that its back surface 12 comes into contact with a material dispersion liquid 20 (described later) in which material forming at least the light-emitting layer of the micro-LEDs 7 arranged corresponding to the pixels 91 of the display device 9 is dispersed, a light-shielding region 13 provided on the base 10 that does not transmit light incident from the front surface 11 of the base 10 to outside the back surface 12, and a transparent region provided on the base 10 that transmits light incident from the front surface 11 and accumulates and adheres the material of the micro-LEDs 7 in the same two-dimensional arrangement as the pixels 91 of the display device 9.

As shown in Figures 2(a) and 2(b), the transparent regions in this embodiment are a number of through holes 14 provided in the base 10 that penetrate from the front surface 11 to the back surface 12 so as to transmit light incident from the front surface 11 and peel off the material of the micro-LEDs 7 that has adhered thereto by the sprayed gas 8.

As a modified example, when the transmissive region of the display device manufacturing jig 1 is not a through hole 14, as an example, the base 10 is formed from a transparent material, and at least one of the front surface 11 and back surface 12 is painted with opaque paint, and the corresponding region is peeled off with a laser or the like to form the transmissive region. Similarly, when the transmissive region of the display device manufacturing jig 1 is not a through hole 14, as an example, the base 10 is formed from a transparent material, and at least one of the front surface 11 and back surface 12 is printed with opaque paint, and the corresponding region is not printed to form the transmissive region.

The material forming at least the light-emitting layer of the integrated micro-LEDs 7 is, for example, a self-luminous structure 22 shown in FIG. 1(c). The light incident from the surface 11 is laser light 3 shown in FIG. 3(c) and FIG. 3(d).

(Configuration of display device manufacturing jig 1)
2(a) and 2(b), the display device manufacturing jig 1 has a plate-shaped base 10. The base 10 is formed using a material that has a high degree of flatness and is unlikely to warp. As an example, the base 10 is formed using a resin material such as polycarbonate, a metal material such as stainless steel, or glass.

As an example, the thickness H of the base 10 shown in FIG. 2(b) is about 5 nm, but is not limited to this. The size of the surface 11 of the base 10 is arbitrary, but is made larger than the diameter of the irradiated laser light 3. The base 10 may be formed of a material having light-shielding properties, may be formed containing a material having light-shielding properties, or may have a light-shielding film formed on at least one of the surface 11 and the back surface 12 with a light-shielding paint or the like. As an example, the base 10 in this embodiment is formed of a material that does not transmit the laser light 3. Therefore, the base 10 other than the through hole 14 is the light-shielding region 13.

As described above, the through holes 14 are provided in the base 10 according to the arrangement of the pixels 91 of the display device 9, i.e., the arrangement of the micro-LEDs 7. In this embodiment, the through holes 14 have a diameter of 20 μm, for example, but are not limited to this.

The through-hole 14 is configured as a hole smaller than the material of the integrated micro-LEDs 7, as shown by the dotted circle in FIG. 2(a). As shown in FIG. 2(a) and FIG. 2(b), the through-hole 14 is formed by removing the base 10 into a cylindrical shape with the top and bottom surfaces being the same circular shape. Note that the shape of the through-hole 14 is not limited to this, and may be a rectangular shape, a triangular shape, a star shape, or any other polygonal shape.

As a modified example, the through hole 14 may be formed as a collection of micro through holes 140 as a plurality of micro transmission regions, as shown in FIG. 2(c). The through hole 14 shown by the dotted line in FIG. 2(c) is formed as a collection of a plurality of micro through holes 140. As an example, the micro through hole 140 is a hole having a diameter of 1 to 10 μm.

The pitch P of the through holes 14 is the same in the vertical and horizontal directions, as shown in FIG. 2(a). The number of through holes 14 depends on the resolution of the display device 9. In this embodiment, the pitch P is, for example, 60 to 250 μm. It is preferable that the error of the pitch P is less than a few μm.

The through holes 14 are formed so that their centers are located on a straight line, as shown by the dashed line in Figure 2 (a), and it is preferable that the deviation in the distance between the centers is small, with an error of a few μm or less.

As described below, after the micro LED 7 is formed and pressed against the electrode pad 6 of the circuit board 5, the gas 8 blown from the front surface 11 flows through the through hole 14, facilitating the peeling of the micro LED 7 from the back surface 12.

(Configuration of material dispersion liquid 20)
The material dispersion liquid 20 is a solution in which the material of the micro-LEDs 7 to be accumulated is dispersed in the container 2 as colloidal particle-like quantum dots 21. As an example, the quantum dots 21 are semiconductors having a diameter of 2 to 10 nm. In this embodiment, the phenomenon in which the quantum dots 21 accumulate and solidify when irradiated with laser light 3 is utilized to accumulate and adhere the self-luminous structure 22 to the rear surface 12 of the display device manufacturing jig 1.

(Configuration of Laser Light 3)
The wavelength of the laser light 3 is determined according to the quantum dots 21 to be integrated. For example, the laser light 3 may have a broadening effect so as to irradiate the entire display device manufacturing jig 1, or may irradiate only a portion of the display device manufacturing jig 1.

(Configuration of Metal Layer 4)
As an example, the metal layer 4 is formed by vapor deposition of a conductive metal material such as nickel or gold. This metal layer 4 is pressed against the electrode pad 6 of the circuit board 5 when the display device manufacturing jig 1 and the circuit board 5 are pressed against each other and pressure is applied. In this embodiment, the display device manufacturing jig 1 is pressed against the circuit board 5, but this is not limiting, and they may be pressed against each other, or the circuit board 5 may be pressed against the display device manufacturing jig 1.

(Configuration of Circuit Board 5)
The circuit board 5 is a rigid board on which electrode pads 6, wiring, and the like are formed on a surface 50. On this circuit board 5, for example, a control element for controlling the driving of the micro LEDs 7, and the like are arranged.

(Configuration of electrode pad 6)
The electrode pads 6 are formed on the circuit board 5 in accordance with the micro-LEDs 7. The electrode pads 6 are formed, for example, using a conductive material paste such as solder, or a conductive metal material such as aluminum, copper, or gold. For example, the electrode pads 6 are pad-shaped electrodes.

(Configuration of Micro LED 7)
As an example, the micro LED 7 is roughly configured to include a metal layer 4 and a self-luminous structure 22 as shown in FIG.

The self-luminous structure 22 is configured to form at least a light-emitting layer using quantum dots 21. As an example, the self-luminous structure 22 of this embodiment includes a P-type semiconductor, an N-type semiconductor, and a light-emitting layer sandwiched between the P-type semiconductor and the N-type semiconductor.

(Regarding Gas 8)
The gas 8 is, for example, air, but is not limited to this, and may be an inert gas such as a rare gas that does not affect the micro-LEDs 7 and the like.

(Outline of manufacturing method of display device 9)
As shown in Figures 3(a) to 3(e), the manufacturing method of the display device 9 includes a manufacturing method in which a material dispersion liquid 20 is prepared in which a material forming at least the light-emitting layer of the micro LEDs 7 arranged corresponding to the pixels 91 of the display device 9 is dispersed, and the back surface 12 of a display device manufacturing jig 1 having a light-shielding region 13 that does not transmit the laser light 3 incident from the front surface 11 to outside the back surface 12, and a transparent region that transmits the light incident from the front surface 11 and causes the material of the micro LEDs 7 accumulated and attached by the transmitted laser light 3 to be arranged in the same two-dimensional arrangement as the pixels 91 of the display device 9 is brought into contact with the material dispersion liquid 20, and the laser light 3 is irradiated from the front surface 11 of the display device manufacturing jig 1, and the material of the micro LEDs 7 accumulated by the transmitted laser light 3 is attached to the back surface 12.

As described above, the transparent region in this embodiment is a plurality of through holes 14 that penetrate from the front surface 11 to the back surface 12 so as to transmit the laser light 3 incident from the front surface 11.

If the transmissive area is formed by painting or removing the light-shielding area 13, the material of the integrated micro-LEDs 7 is peeled off without spraying the gas 8 in the next manufacturing method.

The manufacturing method of the display device 9 further includes forming a conductive metal layer 4 on the back surface 12 of the display device manufacturing jig 1, forming the metal layer 4 on the attached micro-LED 7 material, preparing a circuit board 5 having electrode pads 6 as conductive metal regions at the positions of the pixels 91 of the display device 9, applying pressure to the display device manufacturing jig 1 and the circuit board 5, and further heating as necessary to bond the metal layer 4 of the micro-LED 7 material to the electrode pads 6, and blowing gas 8 onto the front surface 11 of the display device manufacturing jig 1 to peel off the attached micro-LED 7 material from the back surface 12. Next, an example of a specific manufacturing method of the display device 9 will be described below.

(Manufacturing method of display device 9)
3A, a material dispersion liquid 20 is prepared in which a material for forming at least the light-emitting layer of the micro LED 7 is dispersed. As described above, the quantum dots 21 in the form of colloidal particles are dispersed in the material dispersion liquid 20.

Next, as shown in FIG. 3(b), the back surface 12 of the display device manufacturing jig 1 is brought into contact with the material dispersion liquid 20.

Next, as shown in FIG. 3(c), laser light 3 is irradiated from the surface 11 of the display device manufacturing jig 1. The laser light 3 does not pass through the light-shielding region 13, but passes through the through-hole 14, which is a transparent region, and reaches the material dispersion liquid 20.

Next, as shown in FIG. 3(d), a self-luminous structure 22, which is the material of the micro LEDs 7 integrated by the transmitted laser light 3, is attached to the back surface 12. As shown by the dotted line in the top view of FIG. 2(b), the shape of the top surface of this self-luminous structure 22 is slightly larger than the through hole 14 with the through hole 14 at the center.

Next, as shown in FIG. 3(e), after irradiation with the laser light 3 is completed, the display device manufacturing jig 1 is removed from the material dispersion liquid 20.

Next, as shown in FIG. 3(f), a conductive metal layer 4 is formed on the back surface 12 of the display device manufacturing jig 1, and the metal layer 4 is formed on the attached material of the micro-LEDs 7. This metal layer 4 is formed by a vapor deposition method. The metal layer 4 is formed on the back surface 12 of the display device manufacturing jig 1 and the self-luminous structure 22.

Next, as shown in FIG. 4(a), a circuit board 5 having electrode pads 6 at the positions of pixels 91 of the display device 9 is prepared. The display device manufacturing jig 1 is precisely aligned with the circuit board 5 so that the positions of the through holes 14 coincide with the positions of the electrode pads 6.

Next, as shown in FIG. 4(b), the metal layer 4 formed on the self-luminous structure 22 of the display device manufacturing jig 1 is brought into contact with the electrode pad 6 of the circuit board 5.

Next, as shown in FIG. 4(c), pressure is applied to the display device manufacturing jig 1 and the circuit board 5 while heating them to bond the metal layer 4 and the electrode pad 6 of the self-luminous structure 22. Note that in this embodiment, the metal layer 4 and the electrode pad 6 are bonded by pressure bonding, but this is not limited to this, and may be bonded via a conductive adhesive or the like.

Next, as shown in FIG. 4(d), gas 8 is sprayed onto the surface 11 of the display device manufacturing jig 1. This gas 8 is sprayed onto the entire surface 11. By spraying gas 8, the self-luminous structure 22 having the metal layer 4, i.e., the micro LED 7, can be easily peeled off from the display device manufacturing jig 1. During this peeling, the metal layer 4 formed on the back surface 12 of the display device manufacturing jig 1 is left as it is.

Next, as shown in FIG. 4(e), the attached material of the micro LED 7 is peeled off from the back surface 12. The micro LED 7 is separated from the display device manufacturing jig 1 and becomes integrated with the electrode pad 6 of the circuit board 5.

Next, as shown in FIG. 4(f), after the micro LED 7 is peeled off from the display device manufacturing jig 1, the spraying of the gas 8 is stopped.

Next, as shown in FIG. 4(g), the display device manufacturing jig 1 is separated from the circuit board 5, and the next processing step is performed. As an example, the next processing step may include connecting the micro LEDs 7 to other electrode pads and arranging color filters, if necessary.

As a modified example, the manufacturing method of the display device 9 may include a manufacturing method in which the type of display device manufacturing jig 1 or material dispersion liquid 20 is changed as necessary. For example, when manufacturing different micro LEDs 7 for each RGB, the display device 9 is manufactured by a manufacturing method that includes preparing a display device manufacturing jig 1 and a material dispersion liquid 20 for each RGB.

(Effects of the embodiment)
The display device manufacturing jig 1, the manufacturing method of the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device 9 manufactured using the manufacturing method of the display device 9 according to the present embodiment can suppress manufacturing costs. Specifically, the display device manufacturing jig 1, the manufacturing method of the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device 9 manufactured using the manufacturing method of the display device 9 have a through hole 14 as a transmission region provided in the display device manufacturing jig 1 corresponding to the pixel 91 of the display device 9, and the quantum dots 21 are accumulated around the through hole 14 to form the self-luminous structure 22 of the micro LED 7, so that a large number of micro LEDs 7 corresponding to the pixels can be arrayed at once and arranged on the circuit board 5. Therefore, the display device manufacturing jig 1, the manufacturing method of the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device 9 manufactured using the manufacturing method of the display device 9 have fewer steps and suppress the positional deviation of the micro LEDs 7 compared to the case where the light-emitting elements are arranged one by one, so that the manufacturing costs can be suppressed.

The display device manufacturing jig 1, the manufacturing method for the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device 9 manufactured using the manufacturing method for the display device 9 have through holes 14 in the display device manufacturing jig 1 according to the pixels 91 of the display device 9, so that the required micro LEDs 7 can be manufactured in an array in any order at the required positions, compared to arranging light-emitting elements one by one.

The display device manufacturing jig 1, the manufacturing method of the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device 9 manufactured using the manufacturing method of the display device 9 can simplify the transfer work of transferring the arrayed micro LEDs 7 to the circuit board 5 by blowing gas 8 into the through holes 14, so that the display device 9, which is a micro LED display, can be manufactured more easily than when this configuration is not adopted. Therefore, the display device manufacturing jig 1, the manufacturing method of the display device 9, the display device 9 manufactured using the display device manufacturing jig 1, and the display device 9 manufactured using the manufacturing method of the display device 9 can produce a micro LED display using low-power and simple equipment, and can reduce capital investment costs.

Although several embodiments and modifications of the present invention have been described above, these embodiments and modifications are merely examples and do not limit the invention as claimed. These novel embodiments and modifications can be embodied in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the present invention. Furthermore, not all combinations of features described in these embodiments and modifications are necessarily essential to the means for solving the problems of the invention. Furthermore, these embodiments and modifications are included within the scope and gist of the invention, and are included in the scope of the invention and its equivalents as set forth in the claims.

1... Display device manufacturing jig, 3... Laser light, 4... Metal layer, 5... Circuit board, 6... Electrode pad, 7... Micro LED, 8... Gas, 9... Display device, 10... Base, 11... Surface, 12... Back, 13... Light-shielding area, 14... Through hole, 20... Material dispersion liquid, 21... Quantum dots, 22... Self-luminous structure, 91... Pixel, 140... Micro through hole

Claims (7)

a base portion arranged so that a back surface of the base portion is in contact with a material dispersion liquid in which a material for forming at least a light-emitting layer of a light-emitting element arranged corresponding to a pixel of the display device is dispersed;
a light-shielding region provided on the base and preventing light incident from a front surface of the base from being transmitted to an area outside the rear surface of the base;
a transmission region provided on the base, which transmits light incident from the surface, and in which the material of the light-emitting element that is accumulated and adhered by the transmitted light is arranged in the same two-dimensional arrangement as the pixels of the display device;
A display device manufacturing jig comprising: The transparent region is an area smaller than the integrated light-emitting element material.
The jig for manufacturing a display device according to claim 1 . The transmission region is further an aggregate of a plurality of minute transmission regions.
The jig for manufacturing a display device according to claim 1 or 2. The transmission region is a plurality of through holes provided in the base so as to penetrate from the front surface to the back surface so as to transmit light incident from the front surface and peel off the material of the light emitting element that has adhered thereto by a gas blown therethrough.
The jig for manufacturing a display device according to claim 1 . preparing a material dispersion liquid in which a material for forming at least a light-emitting layer of a light-emitting element disposed corresponding to a pixel of a display device is dispersed;
a back surface of a display device manufacturing jig having a light-shielding region that does not transmit light incident from a front surface to outside of a back surface, and a light-transmitting region that transmits light incident from the front surface and causes the light-emitting element material to be accumulated and adhered by the transmitted light in the same arrangement as the two-dimensional arrangement of the pixels of the display device, the back surface of the jig being brought into contact with the material dispersion liquid;
Irradiating the surface of the display device manufacturing jig with light;
The light-emitting element material accumulated by the transmitted light is deposited on the back surface.
A method for manufacturing a display device. The transmission region is a plurality of through holes penetrating from the front surface to the back surface so as to transmit light incident from the front surface.
The method for manufacturing the display device according to claim 5 . Further, a conductive metal layer is formed on the back surface of the jig for manufacturing the display device, and the metal layer is formed on the material of the attached light-emitting element;
providing a circuit board having conductive metal areas at the locations of the pixels of the display device;
applying pressure to the jig for manufacturing the display device and the circuit board to bond the metal layer of the material of the light-emitting element to the metal region;
a gas is blown onto the front surface of the jig for manufacturing a display device to peel off the material of the light-emitting element adhering thereto from the rear surface;
The method for manufacturing the display device according to claim 6 .

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