JP7641708B2 - Composite having a supporting substrate and a polymer member and also having inorganic particles, method for producing the same, and polymer particles suitable for the method - Google Patents

Description

The present disclosure relates to a composite having a support substrate and a polymer member and inorganic particles, and a method for producing the same.

The present disclosure also relates to polymer particles and dispersions that can be suitably used in the above-mentioned methods. Furthermore, the present disclosure also relates to a polymer substrate, a composite comprising a polymer substrate and a support substrate, a composite comprising a polymer substrate and an additional polymer substrate, a composite comprising a polymer substrate and an inorganic substrate, a polymer substrate laminate, and a composite comprising a polymer substrate laminate and an inorganic substrate, as well as methods for producing the same.

Polymer materials, such as polyolefin-based polymer substrates such as polypropylene, polyethylene, and cycloolefin polymers, are widely used in molded products such as resin films, nonwoven fabrics, automotive parts, electrical equipment parts, and camera lenses because of their excellent lightness, mechanical strength, and chemical resistance. In contrast, inorganic materials such as metals, semiconductors, and their oxides have different mechanical, thermal, optical, and chemical properties than polymer materials.

Therefore, studies are being conducted to produce a polymer member-inorganic substrate composite by bonding a polymer member to an inorganic substrate, and to utilize their different properties in a favorable manner.

In addition, it is being considered to obtain a composite with new properties by further depositing a polymer containing inorganic particles onto such a polymer member-inorganic substrate composite.

Here, when producing the above-mentioned composite, the solvent used to form the upper layer may have an undesirable effect on the supporting substrate of the lower layer.

Patent Document 1 discloses a method for manufacturing an organic thin film laminate in which organic functional layers are laminated. The document describes that by forming an intermediate layer that can block the solvent of the upper layer from penetrating into the lower layer, damage caused by the solvent to the lower layer (first light-emitting layer side) when forming the upper layer (second light-emitting layer side) by a wet method is reduced.

JP 2017-22063 A

As described above, when producing a composite having a support substrate and a polymer member and also having inorganic particles, there was a risk that the support substrate would be undesirably affected by the solvent.

In this context, the present disclosure aims to provide a method for producing a composite having a support substrate and a polymer member and having inorganic particles while ensuring excellent quality.

The present disclosure also aims to provide polymer particles and dispersions suitable for the above-mentioned method. Furthermore, the present disclosure also aims to provide a polymer substrate having excellent quality, a composite including a polymer substrate and a support substrate, a composite including a polymer substrate and an additional polymer substrate, a composite including a polymer substrate and an inorganic substrate, a polymer substrate laminate, and a composite including a polymer substrate laminate and an inorganic substrate, as well as methods for producing the same.

In response to the above problems, the present inventors have discovered the present invention having the following aspects:
<Aspect 1>
Providing polymer particles;
providing a supporting substrate; and depositing the polymer particles onto the supporting substrate to form a polymer particle layer on the supporting substrate.
Including,
At least one of the polymer particles or the supporting substrate contains inorganic particles;
A method for producing a polymer particle layer-support substrate composite.
<Aspect 2>
2. The method of claim 1, wherein the polymer particles are inorganic particle-containing polymer particles.
Aspect 3
2. The method of claim 1, wherein the polymer particles are a mixture of inorganic particle-containing and inorganic particle-free polymer particles.
<Aspect 4>
The method of any one of the preceding aspects, wherein depositing the polymer particles onto the support substrate comprises:
providing a dispersion of said polymer particles in a dispersion medium; and coating said dispersion onto said supporting substrate and drying.
<Aspect 5>
The method of any one of the preceding aspects, wherein the support substrate is a polymeric substrate free of inorganic particles.
<Aspect 6>
The method of any one of the preceding aspects, wherein the supporting substrate is an inorganic particle-containing polymeric substrate.
Aspect 7
The method of any one of aspects 1 to 4, wherein the supporting substrate is:
An additional polymer substrate-polymer substrate composite comprising a polymer substrate and an additional polymer substrate, the polymer substrate and the additional polymer substrate being disposed at least partially on top of each other, and at least one of the polymer substrate and the additional polymer substrate comprising inorganic particles.
<Aspect 8>
The method of any one of the preceding aspects, wherein the supporting substrate is an inorganic substrate.
<Aspect 9>
Producing a polymer particle layer-support substrate composite by the method according to any one of aspects 1 to 8; and forming a polymer substrate on the support substrate by heat pressing the polymer particle layer of the polymer particle layer-support substrate composite.
A method for producing a polymer substrate-support substrate composite, comprising:
Aspect 10
the supporting substrate is held on a release substrate; and before or after the polymer particle layer is heat-pressed, the supporting substrate is peeled off from the release substrate.
10. The method of claim 9, further comprising:
<Aspect 11>
Obtaining a polymer substrate-support substrate composite by the method according to aspect 9 using a release substrate as the support substrate;
Obtaining a polymer substrate by peeling the polymer substrate from the support substrate, which is a release substrate, in the polymer substrate-support substrate composite;
A method for producing a polymer substrate comprising:
<Aspect 12>
Producing a polymer substrate by the method according to aspect 11;
Providing an additional polymeric substrate; and
laminating the polymer substrate and the additional polymer substrate together;
Additional methods for making polymer substrate-polymer substrate composites.
<Aspect 13>
Producing a polymer substrate by the method according to aspect 11;
Providing an inorganic substrate; and
disposing the polymeric substrate on the inorganic substrate;
The method for producing a polymer substrate-inorganic substrate composite includes the steps of:
<Aspect 14>
Producing a polymer substrate-inorganic substrate composite by the method of claim 9 or 13, comprising: providing an additional polymer substrate; and disposing the additional polymer substrate on the polymer substrate of the polymer substrate-inorganic substrate composite.
Additional methods for making a polymer substrate-polymer substrate-inorganic substrate composite include:
<Aspect 15>
Obtaining a polymer particle layer-support substrate composite by the method according to any one of aspects 1 to 8;
depositing inorganic particle-free polymer particles, inorganic particle-containing polymer particles, or a mixture of inorganic particle-containing and inorganic particle-free polymer particles on the polymer particle layer-support substrate composite to form an additional polymer particle layer on the polymer particle layer-support substrate composite;
A method for producing an additional polymer particle layer-polymer particle layer-support substrate composite, comprising:
<Aspect 16>
Producing an additional polymer particle layer-polymer particle layer-support substrate composite by the method of claim 15;
forming a polymer substrate and an additional polymer substrate on the supporting substrate by heat pressing the polymer substrate layer and the additional polymer substrate layer of the additional polymer substrate layer-polymer substrate layer-supporting substrate composite;
Additional methods for making a polymer substrate-polymer substrate-support substrate composite include:
<Aspect 17>
Obtaining an additional polymer substrate-polymer substrate-support substrate composite by the method according to aspect 16 using a release substrate as the support substrate;
A method for producing an additional polymer substrate-polymer substrate composite, the method including: obtaining an additional polymer substrate-polymer substrate composite by peeling the additional polymer substrate-polymer substrate composite from the support substrate, which is a release substrate, in the additional polymer substrate-polymer substrate-support substrate composite.
<Aspect 18>
Producing an additional polymer substrate-polymer substrate composite having a polymer substrate and an additional polymer substrate at least partially overlapping each other by the method of any one of aspects 9, 10, 12 and 17, wherein the polymer substrate is an inorganic particle-containing polymer substrate and/or the additional polymer substrate is an additional inorganic particle-containing polymer substrate.
providing an inorganic substrate; and disposing the additional polymer substrate-polymer substrate composite on the inorganic substrate such that the polymer substrate is an inorganic particle polymer substrate or the additional polymer substrate is an additional inorganic particle-containing polymer substrate faces the inorganic substrate.
Additional methods for making a polymer substrate-polymer substrate-inorganic substrate composite include:
<Aspect 19>
A method for producing a polymer substrate laminate having at least three polymer substrates stacked together such that the content of inorganic particles in each of the polymer substrates increases or decreases stepwise along the stacking direction starting from the outermost layer of the laminate, the method comprising:
(a) selecting at least two materials from the group consisting of a polymer substrate not containing inorganic particles, a polymer substrate containing inorganic particles, and a composite composed of at least two polymer substrates, wherein the at least two materials include a polymer substrate produced by the method according to aspect 11 and/or a composite composed of at least two polymer substrates produced by the method according to any one of aspects 9, 10, 12, 16, and 17, and the composite comprises at least three polymer substrates in total;
(b) laminating said at least two materials such that the content of inorganic particles increases or decreases stepwise along the lamination direction to obtain a polymeric substrate laminate.
Aspect 20
A method for producing a polymer substrate laminate having at least one inorganic particle-containing polymer substrate and at least one inorganic particle-free polymer substrate, the polymer substrate laminate having a structure in which the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate are alternately laminated, the method comprising:
(a) selecting at least two materials from the group consisting of inorganic particle-free polymer substrates, inorganic particle-containing polymer substrates, and composites consisting of at least one inorganic particle-containing polymer substrate and at least one inorganic particle-free polymer substrate and having a structure in which the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate are alternately laminated, wherein the at least two materials include a polymer substrate produced by the method according to aspect 11 or a composite produced by the method according to any one of aspects 9, 10, 12, 16, and 17, and the total number of polymer substrates is at least three;
(b) laminating said at least two materials in a side-by-side relationship between the inorganic particle-containing polymeric substrate and the inorganic particle-free polymeric substrate to produce a polymeric substrate laminate;
<Aspect 21>
Producing a polymer substrate laminate having at least three polymer substrates by the method of claim 9, 10, 16, 19 or 20;
Providing an inorganic substrate or a composite having a polymeric substrate and an inorganic substrate; and disposing the polymeric substrate laminate on the inorganic substrate or on the polymeric substrate of the composite.
A method for producing a polymer substrate laminate-inorganic substrate composite, comprising:
<Aspect 22>
providing an inorganic substrate or a composite having a polymeric substrate and an inorganic substrate; and producing the polymeric substrate laminate on the inorganic substrate or on the polymeric substrate of the composite by the method of claim 19 or 20.
A method for producing a polymer substrate laminate-inorganic substrate composite, comprising:
<Aspect 23>
23. The method according to claim 21 or 22, wherein the composite having a polymeric substrate and an inorganic substrate is produced by the method according to any one of claims 8, 13, 14, 16 and 18.
<Aspect 24>
a polymer; and inorganic particles selected from the group consisting of metals and semi-metals, oxides of metals and semi-metals, nitrides of metals and semi-metals, carbides of metals and semi-metals, carbon materials, and combinations thereof, the particles having a primary particle size of 1 nm to 500 nm and dispersed in the polymer.
The inorganic particle-containing polymer particle comprises:
<Aspect 25>
25. The inorganic particle-containing polymer particles according to claim 24, wherein the inorganic particles are silicon particles.
Aspect 26
26. The inorganic particle-containing polymer particle according to claim 24 or 25, wherein the polymer is an olefin polymer.
<Aspect 27>
27. The inorganic particle-containing polymer particle according to any one of aspects 24 to 26, wherein the polymer is a cycloolefin polymer.
<Aspect 28>
28. The inorganic particle-containing polymeric particle of any one of aspects 24 to 27, further comprising a coupling agent.
<Aspect 29>
29. The inorganic particle-containing polymer particles according to any one of aspects 24 to 28, having an average particle size of 0.5 μm to 100 μm.
Aspect 30
A dispersion comprising inorganic particle-free polymer particles and/or inorganic particle-containing polymer particles according to any one of aspects 24 to 29, and a dispersion medium.
<Aspect 31>
31. The dispersion of claim 30, wherein the dispersion medium comprises at least one of 2-propanol, ethylene glycol, and terpineol.
<Aspect 32>
a polymeric substrate; and a layer of polymeric particles deposited on the polymeric substrate;
The polymer particle layer comprises the inorganic particle-containing polymer particles according to any one of aspects 24 to 29.
Polymer particle layer-polymer substrate composite.
<Aspect 33>
a polymeric substrate; and a layer of polymeric particles deposited on the polymeric substrate;
The polymer particle layer is made of polymer particles that do not contain inorganic particles.
Polymer particle layer-polymer substrate composite.
Aspect 34
34. The composite of claim 33, wherein the polymeric substrate is an inorganic particle-containing polymeric substrate.
<Aspect 35>
Polymer substrate,
a layer of polymer particles deposited on the polymer substrate;
an additional layer of polymer particles deposited on said layer of polymer particles;
The additional polymer particle layer-polymer particle layer-polymer substrate composite comprising:
Aspect 36
36. The composite of claim 35, wherein at least one of the polymer substrate, the polymer particle layer, and the additional polymer particle layer comprises inorganic particles.
<Aspect 37>
a polymer substrate and an additional polymer substrate;
At least one of the polymer substrate and the additional polymer substrate comprises inorganic particles;
The polymer substrate and the additional polymer substrate are disposed so as to at least partially overlap each other, and an interface between the polymer substrate and the additional polymer substrate is flat.
Additional polymer substrate-polymer substrate composites.
<Aspect 38>
38. The composite of claim 37, wherein the polymeric substrate and/or the additional polymeric substrate further comprises a coupling agent.
<Aspect 39>
39. The composite of claim 37 or 38, wherein the polymer substrate and the additional polymer substrate are in the form of a membrane or film.
<Aspect 40>
The laminated laminate includes at least three polymer substrates, and at least one of the interfaces of adjacent polymer substrates is flat.
Polymer-based laminates.
<Aspect 41>
A laminate according to claim 40, wherein the inorganic particle content in the at least three polymer substrates constituting the polymer substrate laminate is different from each other.
<Aspect 42>
The polymer substrates are laminated such that the content of inorganic particles in the at least three polymer substrates constituting the polymer substrate laminate increases or decreases stepwise along the lamination direction.
42. The laminate according to claim 41.
<Aspect 43>
The polymer substrate has at least one inorganic particle-free polymer substrate and at least one inorganic particle-containing polymer substrate, and has a structure in which the inorganic particle-free polymer substrate and the inorganic particle-containing polymer substrate are alternately laminated.
41. The laminate according to claim 40.
<Aspect 44>
A composite according to any one of aspects 32 to 40, or a laminate according to any one of aspects 41 to 43, which is for optical use.
<Aspect 45>
A membrane- or film-like substrate comprising a cycloolefin polymer and silicon particles having a primary particle size of 1 nm to 500 nm.

The present disclosure provides a method for producing a composite having a support substrate and a polymer member and also having inorganic particles while ensuring excellent quality.

The present disclosure also provides polymer particles and dispersions suitable for the above-mentioned methods. Furthermore, the present disclosure also provides inorganic particle-containing polymer substrates, polymer particle layer-support substrate composites, polymer substrate-support substrate composites, additional polymer substrate-polymer substrate-support substrate composites, and polymer substrate laminates, as well as methods for producing the same, all of which have excellent quality.

FIG. 1 illustrates generally one embodiment of a method for producing a polymer particle layer-support substrate composite according to the present disclosure. FIG. 2 illustrates generally another embodiment of a method for producing a polymer particle layer-support substrate composite according to the present disclosure. FIG. 3 illustrates a schematic diagram of one embodiment of a deposition step in a method for making a polymer particle layer-support substrate composite according to the present disclosure. FIG. 4 shows a schematic representation of an embodiment of a dispersion that can be used in the deposition step of the method for making a polymer particle layer-support substrate composite according to the present disclosure. FIG. 5 illustrates generally one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure. FIG. 6A shows a schematic diagram of one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, in which a polymer substrate not containing inorganic particles is used as the support substrate. FIG. 6B shows a schematic diagram of one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, when a polymer substrate containing inorganic particles is used as the support substrate. FIG. 6C shows a schematic diagram of another embodiment of the method for producing a polymer substrate-support substrate composite according to the present disclosure, in which an inorganic particle-containing polymer substrate is used as the support substrate. FIG. 7A is a schematic diagram illustrating one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, in which a composite having two polymer substrates is used as the support substrate. FIG. 7B is a schematic diagram illustrating another embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, in which a composite having two polymer substrates is used as the support substrate. FIG. 8A illustrates a schematic diagram of one embodiment of a method for making a polymer substrate-support substrate composite according to the present disclosure, where the support substrate is supported by a release substrate. FIG. 8B illustrates a schematic diagram of another embodiment of a method for making a polymer substrate-support substrate composite according to the present disclosure, where the support substrate is supported by a release substrate. FIG. 9 is a schematic diagram showing one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, in which an inorganic substrate is used as the support substrate. FIG. 10A illustrates a schematic diagram of one embodiment of a method for producing a polymer substrate according to the present disclosure, in which a release substrate is used as a supporting substrate. FIG. 10B is a schematic diagram showing another embodiment of the method for producing a polymer substrate according to the present disclosure, in which a release substrate is used as the supporting substrate. FIG. 11 illustrates generally one embodiment of a method for producing an additional polymer substrate-polymer substrate composite according to the present disclosure, which includes overlapping substrates. FIG. 12 illustrates generally one embodiment of a method for making a polymer substrate-inorganic substrate composite according to the present disclosure, comprising disposing a polymer substrate on an inorganic substrate. FIG. 13 illustrates generally one embodiment of a method for producing an additional polymer substrate-polymer substrate-inorganic substrate composite according to the present disclosure, comprising providing an additional polymer substrate. FIG. 14A illustrates generally one embodiment of a method for making an additional polymer particle layer-polymer particle layer-support substrate composite according to the present disclosure, including using a polymer substrate as the support substrate. FIG. 14B illustrates generally one embodiment of a method for making an additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure, which includes using a polymer substrate as the support substrate. FIG. 15A illustrates generally one embodiment of a method for making an additional polymer particle layer-polymer particle layer-support substrate composite according to the present disclosure, comprising using a composite comprising two polymer substrates as the support substrate. FIG. 15B illustrates generally one embodiment of a method for making an additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure, comprising using a composite comprising two polymer substrates as the support substrate. FIG. 16 illustrates generally one embodiment of a method for making an additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure, which includes using an inorganic substrate as the support substrate. FIG. 17 illustrates generally one embodiment of an additional method for making a polymer substrate-polymer substrate composite according to the present disclosure, including using a release substrate as the supporting substrate. FIG. 18 illustrates generally one embodiment of a method for making an additional polymer substrate-polymer substrate-inorganic substrate composite, comprising disposing an additional polymer substrate-polymer substrate composite on an inorganic substrate. FIG. 19 illustrates generally one embodiment of a method for making a polymeric substrate laminate according to the present disclosure. FIG. 20 illustrates generally another embodiment of a method for making a polymeric substrate laminate according to the present disclosure. FIG. 21 illustrates generally one embodiment of a method for making a polymer substrate laminate-inorganic substrate composite according to the present disclosure, comprising placing a polymer substrate laminate onto an inorganic substrate. FIG. 22 illustrates generally one embodiment of a method for making a polymer substrate laminate-inorganic substrate composite according to the present disclosure, comprising placing a polymer substrate laminate on a polymer substrate of a composite having a polymer substrate and an inorganic substrate. FIG. 23 illustrates generally another embodiment of a method for making a polymer substrate laminate-inorganic substrate composite according to the present disclosure, comprising producing a polymer substrate laminate on the polymer substrate of a composite having a polymer substrate and an inorganic substrate. FIG. 24 shows an SEM image of the polymer particles according to Example 1 produced by a spray drying method. FIG. 25 shows an SEM image of the polymer particles according to Example 2 produced by the reprecipitation method. FIG. 26A is a diagram showing an SEM image of a cross section of a polymer substrate-support substrate composite according to Comparative Example 2, and a method for evaluating flatness. FIG. 26B is a diagram showing an SEM image of a cross section of the polymer substrate-support substrate composite according to Example 1, and a method for evaluating flatness.

<<Method for producing polymer particle layer-support substrate composite>>
The method for producing a polymer particle layer-support substrate composite according to the present disclosure includes the steps of:
Providing polymer particles (polymer particle providing step);
providing a support substrate (support substrate providing step); and depositing polymer particles on the support substrate to form a polymer particle layer on the support substrate (depositing step);
Including,
At least one of the polymer particles or the supporting substrate comprises inorganic particles.

Figure 1 is a schematic diagram of one embodiment of a method for producing a polymer particle layer-support substrate composite 210a according to the present disclosure. In the method of Figure 1, polymer particles 14 including inorganic particles 13 and a polymer 12 are deposited on a support substrate 100 to form a polymer particle layer 160a on the support substrate 100, thereby obtaining a polymer particle layer-support substrate composite 210a.

In the method for producing a polymer particle layer-support substrate composite according to the present disclosure, at least one of the polymer particles or the support substrate contains inorganic particles. Therefore, according to the method according to the present disclosure, a composite can be obtained in which at least one of the polymer particle layer and the support substrate contains inorganic particles.

In conventional methods, when manufacturing a composite having a support substrate and a polymer member and also having inorganic particles, a solution in which the polymer is dissolved in a solvent is used when placing the polymer on the support substrate. In such cases, there is a risk that the solvent used to dissolve the polymer may have an undesirable effect on the support substrate.

In contrast, in the method according to the present disclosure, when a composite having a support substrate and a polymer member and inorganic particles is produced, instead of applying a polymer solution onto the support substrate, polymer particles are deposited, so that the amount of solvent used to dissolve the polymer can be reduced. Therefore, it is possible to avoid or suppress undesirable effects on the support substrate caused by the solvent. In addition, in the method according to the present disclosure, the use of a solvent used to dissolve the polymer is suppressed, so that the environmental burden and undesirable effects on health associated with the use of a solvent can be reduced.

<Polymer particle providing step>
In the polymer particle providing step in the method for producing a polymer particle layer-support substrate composite according to the present disclosure, polymer particles are provided.

(Polymer Particles)
The polymer particles include inorganic particle-free polymer particles, inorganic particle-containing polymer particles, and mixtures of inorganic particle-containing polymer particles and inorganic particle-free polymer particles.

When the supporting substrate does not contain inorganic particles, for example when the supporting substrate is a polymer substrate that does not contain inorganic particles, the polymer particles may be polymer particles that contain inorganic particles, or a mixture of polymer particles that contain inorganic particles and polymer particles that do not contain inorganic particles.

When the support substrate contains inorganic particles, for example when the support substrate is a polymer substrate containing inorganic particles, polymer particles not containing inorganic particles can be used as the polymer particles.

The average particle size of the polymer particles is preferably 0.1 μm to 1000 μm, more preferably 0.5 μm to 100 μm, particularly preferably 1.0 μm to 50 μm, and even more particularly preferably 1.5 μm to 10 μm. By having the average particle size of the polymer particles within this range, good moldability can be ensured, for example, when forming a layer using the polymer particles.

The average particle size of the polymer particles can be measured by calculating the average equivalent circle diameter of 100 randomly selected particles in images taken with a scanning electron microscope (SEM), transmission electron microscope (TEM), etc.

The polymer particles according to the present disclosure may be amorphous particles, and the shape is not particularly limited. The shape of the polymer particles may be, for example, spherical, scaly, or fibrous. In the present application, "amorphous" means that the polymer particles are not shaped by a mold or the like.

(Polymer particles containing inorganic particles)
The inorganic particle-containing polymer particles include inorganic particles and a polymer.

In the method according to FIG. 1 described above, inorganic particle-containing polymer particles 14 are used as the polymer particles. In this case, for example, the content of inorganic particles in the inorganic particle-containing polymer particles can be adjusted by adjusting the content of inorganic particles in the resulting polymer particle layer.

The content ratio of inorganic particles and polymer in the inorganic particle-containing polymer particles can be, for example, such that the volume ratio of polymer to inorganic particles in the inorganic particle-containing polymer particles is 1:99 to 99:1, 5:95 to 95:5, 10:90 to 85:15, 20:80 to 80:20, 30:70 to 75:25, or 40:60 to 70:30. If the amount of inorganic particles is too small, the desired effect expected from the inclusion of inorganic particles may not be obtained. Also, if the amount of inorganic particles is too large, the integrity and strength of the inorganic particle-containing polymer particles may not be maintained.

In inorganic particle-containing polymer particles, it is preferable that the inorganic particles are dispersed in the polymer.

The inorganic particle-containing polymer particles according to the present disclosure can be produced, for example, by a spray-drying method or a reprecipitation method.

In the method for producing inorganic particle-containing polymer particles by the spray drying method, a spray drying device can be used. Specifically, the method for producing inorganic particle-containing polymer particles by the spray drying method includes, for example, a step of preparing a precursor solution in which inorganic particles are dispersed in a polymer solution, a step of spraying this precursor solution, a step of drying the inorganic particle-containing polymer particle precursor formed by spraying, and a step of disintegrating the dried inorganic particle-containing polymer particle precursor. In the step of preparing the precursor solution, the polymer solution may be prepared, for example, by dissolving a polymer in a solvent such as toluene. In addition, it is preferable that the inorganic particle-containing polymer particles are substantially free of a solvent for dissolving the polymer. The method of disintegration is not particularly limited and can be performed by a known method.

The spray-drying method may produce inorganic particle-containing polymer particles with relatively high sphericity. The spray-drying method may also produce inorganic particle-containing polymer particles with an area-equivalent circle diameter of 0.1 to 50 μm.

The method for producing inorganic particle-containing polymer particles by the reprecipitation method includes, for example, a step of preparing a precursor solution in which inorganic particles are dispersed in a polymer solution, a step of dropping this precursor solution into a solvent, a step of recovering the solid content generated in the solvent as a precipitate, and a step of drying the recovered precipitate. In the step of preparing the precursor solution, for example, the polymer solution can be prepared by dissolving the polymer in a solvent such as toluene. It is preferable that the inorganic particle-containing polymer particles are substantially free of a solvent for dissolving the polymer. In the step of dropping the precursor solution into the solvent, for example, 2-propanol can be used as the solvent. In the step of recovering the precipitate, for example, a centrifuge can be used. In the step of drying the recovered precipitate, drying can be performed using a vacuum oven.

The reprecipitation method may be able to obtain relatively amorphous inorganic particle-containing polymer particles. The reprecipitation method may also be able to obtain inorganic particle-containing polymer particles with an area-equivalent circle diameter of 1 μm or less.

(Inorganic particles)
Inorganic particles in the present disclosure can include any inorganic particles that can be dispersed in a polymer, such as metal or semi-metal particles, metal or semi-metal oxide or fluoride particles, and metal or semi-metal containing compound particles.

As such a metal or semimetal, at least one selected from the group consisting of Si, Ge, Al, Mg, Ti, Ni, Cr, Fe, Cu, Au, Ag, W, Zr, Y, In and Ir can be preferably used, and Si and Ge can be particularly preferably used. Furthermore, as such metal or semi-metal oxides and fluorides, at least one _selected from _{the group} consisting _of MgO, _Al2O3 , _Bi2O3 , _{CaF2 , In2O3} , _In2O3.SnO2 , _HfO2 , _La2O3 , _MgF2 , _Sb2O5 , _Sb2O5.SnO2 , _SiO2 , _{SnO2 , TiO2 , Y2O3} , _{ZnO and ZrO2} can be preferably used, _and MgO, _Al2O3 , _{SiO2 and TiO2} can be particularly preferably used. Furthermore, examples of compounds containing such metals or semimetals include GaAs, InGaAs, InAlAs, LiTaOx, NbTaOx, ZnTe, GaSe, GaP, CdTe, diamond, diamond-like carbon, and SiC.

When the inorganic particles are silicon particles, examples of the silicon particles include silicon particles obtained by laser pyrolysis, particularly laser pyrolysis using a _CO2 laser.

The inorganic particles, particularly silicon particles, may have individual impurity element concentrations of 1,000 ppm or less, 500 ppm or less, 300 ppm or less, 100 ppm or less, 50 ppm or less, 10 ppm or less, or 1 ppm or less. When the inorganic particles are silicon particles, such impurities may include Group 13 and Group 15 elements. Silicon particles in which impurities have been reduced as described above are preferred because they have good physical properties, and are particularly preferred because they provide good optical properties.

The average primary particle diameter of the inorganic particles is preferably 1 nm or more, or 3 nm or more, and 10,000 nm or less, 5,000 nm or less, 2,000 nm or less, 1,000 nm or less, 500 nm or less, 200 nm or less, 100 nm or less, 50 nm or less, 30 nm or less, 20 nm or less, or 10 nm or less.

Here, in the present invention, the average primary particle diameter of the particles can be determined as the number average primary particle diameter by directly measuring the equivalent circle diameter based on images taken by a scanning electron microscope, a transmission electron microscope, or the like, and analyzing particle groups consisting of 100 or more aggregates.

In addition, if the particle size of the inorganic particles is too large, scattering may occur easily, which may be undesirable. Also, if the particle size of the inorganic particles is too small, the specific surface area of the particles increases, promoting activation of the particle surface, and the cohesion between the particles increases significantly, which may be undesirable as it reduces handleability.

Inorganic particles, particularly metal or metalloid particles, can be treated on their surfaces with ozone, UV light, etc. to increase the functional groups, e.g., hydroxyl groups, available for bonding with the polymer.

(polymer)
The polymer contained in the polymer particles may be formed of an olefin polymer, for example, a cycloolefin polymer.

The olefin polymer refers to a polymer obtained by polymerizing a monomer containing an olefin as a main component, that is, a polymer obtained by polymerizing a monomer containing 50% by mass or more, 60% by mass or more, 70% by mass or more, 80% by mass or more, 90% by mass or more, or 95% by mass or more of a monomer portion derived from an olefin. Examples of olefin polymers include copolymers of α-olefins and ethylene or propylene, such as polyethylene, polypropylene, polybutene, polymethylpentene, propylene-ethylene copolymers and propylene-butene copolymers, styrene-butadiene-styrene block copolymers, styrene-hexadiene-styrene copolymers, styrene-pentadiene-styrene copolymers, ethylene-propylene-diene copolymers (RPDM), and cycloolefin polymers, but the present invention is not limited to these examples. These olefin polymers may be used alone or in combination of two or more types.

Among these olefin polymers, cycloolefin polymers can be mentioned in particular.

Cycloolefin polymers are polymers that have a cycloolefin moiety in the polymer backbone. Examples of such cycloolefin polymers include ring-opening polymers of cycloolefin monomers, addition polymers of cycloolefin monomers, and copolymers of cycloolefin monomers and linear olefins, but the present invention is not limited to these examples.

Cycloolefin monomers are compounds that have a ring structure formed by carbon atoms and have a carbon-carbon double bond in the ring structure. Examples of cycloolefin monomers include norbornene-based monomers that are monomers containing a norbornene ring, such as bicyclic monomers such as 2-norbornene and norbornadiene, tricyclic monomers such as dicyclopentadiene and dihydrodicyclopentadiene, tetracyclic monomers such as tetracyclododecene, ethylidenetetracyclododecene, and phenyltetracyclododecene, pentacyclic monomers such as tricyclopentadiene, and heptacyclic monomers such as tetracyclopentadiene; and monocyclic cycloolefins such as cyclobutene, cyclopentene, cyclooctene, cyclododecene, and 1,5-cyclooctadiene, but the present invention is not limited to these examples. Cycloolefin monomers may have a substituent within the scope of the present invention.

Cycloolefin polymers are readily available commercially, for example, under the trade names Zeonex series and Zeonor series manufactured by Zeon Corporation, Sumilite series manufactured by Sumitomo Bakelite Co., Ltd., Arton series manufactured by JSR Corporation, APEL series manufactured by Mitsui Chemicals, Inc., Topas manufactured by Ticona, and Optretz series manufactured by Hitachi Chemical Co., Ltd.

(Coupling Agent)
The inorganic particle-containing polymer particles according to the present disclosure may further include a coupling agent.

The coupling agent in the present invention is not particularly limited, and any coupling agent that can be combined with inorganic particles can be preferably used. Specifically, the coupling agent may be a silane coupling agent, a titanate coupling agent, or an aluminate coupling agent, and in particular, a silane coupling agent can be used.

When an olefin polymer, for example, a cycloolefin polymer, is used as the polymer contained in the inorganic particle-containing polymer particles, the coupling agent may be a coupling agent having a functional group with good miscibility with these polymers, such as an alkyl chain, a cyclohexyl group, or a benzene ring, more specifically, a coupling agent having an alkyl chain, a cyclohexyl group, or a benzene ring having 1 to 30, 1 to 25, or 1 to 20 carbon atoms. The coupling agent and/or the hydrolysis condensate of the coupling agent may be used alone or in combination of two or more kinds.

Specifically, coupling agents include octadecyltriethoxysilane (OTS), octyltriethoxysilane, triethoxyphenylsilane, 3-phenylpropyltriethoxysilane, cyclohexyltrimethoxysilane, octadecyltrimethoxysilane, octadecyltrichlorosilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, γ-(2-aminoethyl)aminopropyltrimethoxysilane, γ-(2-aminoethyl)aminopropyltriethoxysilane, γ-(2-aminoethyl)aminopropylmethyldimethoxysilane, γ-(2-aminoethyl)aminopropylmethyldiethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane hydrochloride, Examples include N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltriethoxysilane hydrochloride, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, vinyltriacetoxysilane, γ-anilinopropyltrimethoxysilane, γ-anilinopropyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, octadecyldimethyl[3-(trimethoxysilyl)propyl]ammonium chloride, octadecyldimethyl[3-(triethoxysilyl)propyl]ammonium chloride, γ-ureidopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, 3-isocyanatopropyltrimethoxysilane, and 3-isocyanatopropyltriethoxysilane.

By further containing a coupling agent in the inorganic particle-containing polymer particles, the adhesion between the inorganic particle-containing polymer particles and the supporting substrate may be further improved. In particular, when the adhesion between the inorganic particle-containing polymer particles and the supporting substrate is reduced due to the inclusion of inorganic particles, the adhesion may be further improved.

Without being limited by theory, it is believed that when the inorganic particle-containing polymer particles further contain a coupling agent, the coupling agent attached to the surfaces of the inorganic particles improves the dispersibility of the inorganic particles in the inorganic particle-containing polymer particles, and the remaining coupling agent improves the adhesion of the inorganic particle-containing polymer particles to the supporting substrate (particularly the polymer substrate).

When the inorganic particle-containing polymer particles contain a coupling agent, the content ratio of the coupling agent can be, for example, such that the mass ratio of the inorganic particles to the coupling agent is 1:99 to 99:1, 5:95 to 95:5, 10:90 to 90:10, 20:80 to 80:20, 30:70 to 70:30, or 40:60 to 60:40. By having the mass ratio of the inorganic particles to the coupling agent in this range, it may be possible to ensure particularly good adhesion between the inorganic particle-containing polymer particles and the supporting substrate, and it may be possible to ensure good integrity and strength of the inorganic particle-containing polymer particles.

The inorganic particle-containing polymer particles used in the manufacturing method according to the present disclosure may contain other additives. Examples of additives include a curing accelerator, a discoloration inhibitor, a surfactant, a colorant, and a viscosity modifier.

(Polymer particles not containing inorganic particles)
The inorganic particle-free polymer particles contain a polymer and are free of inorganic particles.

For the polymer contained in the inorganic particle-free polymer particles, the above description of the inorganic particle-containing polymer particles can be referred to. In addition, the inorganic particle-free polymer particles can contain a coupling agent and other additives, as described above for the inorganic particle-containing polymer particles. When the inorganic particle-free polymer particles further contain a coupling agent, the adhesion between the inorganic particle-free polymer particles and the supporting substrate can be further improved in some cases.

Polymer particles not containing inorganic particles can be produced in the same manner as the spray drying method or reprecipitation method described above for polymer particles containing inorganic particles, except that a polymer solution is used as the precursor solution instead of a precursor solution in which inorganic particles are dispersed in a polymer solution.

(Mixture of polymer particles containing inorganic particles and polymer particles not containing inorganic particles)
The polymer particles may be a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles.

Figure 2 shows a schematic diagram of another embodiment of the method for producing a polymer particle layer-support substrate composite according to the present disclosure. In the method according to Figure 2, a mixture of inorganic particle-containing polymer particles 14 and inorganic particle-free polymer particles 15 is used as the polymer particles. When a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles is used as the polymer particles, it is possible to adjust not only the content of inorganic particles contained in the inorganic particle-containing polymer particles, but also the ratio of inorganic particle-containing polymer particles and inorganic particle-free polymer particles in the mixture. Therefore, by using a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles as the polymer particles, it is possible to more easily adjust the content of inorganic particles in the polymer particle layer.

The ratio of inorganic particle-containing polymer particles and inorganic particle-free polymer particles in a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles is not particularly limited, but the inorganic particle-free polymer particles contained in the mixture may be 0.01 parts by mass or more, 0.1 parts by mass or more, 1 part by mass or more, 5 parts by mass or more, 10 parts by mass or more, or 50 parts by mass or more relative to 100 parts by mass of inorganic particle-containing polymer particles, and/or 10,000 parts by mass or less, 1,000 parts by mass or less, 100 parts by mass or less, or 75 parts by mass or less.

A mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles may be produced by directly mixing the inorganic particle-containing polymer particles and the inorganic particle-free polymer particles, or by adding the inorganic particle-free polymer particles or the inorganic particle-containing polymer particles to a suitable dispersion medium containing the inorganic particle-containing polymer particles or the inorganic particle-free polymer particles, and stirring the mixture.

<Support base material provision process>
In the support substrate providing step of the polymer particle layer-support substrate composite according to the present disclosure, a support substrate is provided.

(Support substrate)

The support substrate can be a polymer substrate, an inorganic substrate, or a peelable substrate.

The support substrate may be in any shape, such as a film, sheet, plate, tube, rod, or disk. The support substrate may be in any size.

The thickness of the support substrate is not particularly limited, but may be, for example, 1 nm or more, 5 nm or more, or 10 nm or more, and may be 10 cm or less, 1 cm or less, 1 mm or less, 100 μm or less, 30 μm or less, or 10 μm or less, or even 1000 nm or less, 500 nm or less, or 100 nm or less.

When the polymer particle layer on the support substrate is further subjected to a heat press treatment, it is preferable to use a material that has a glass transition temperature or melting point higher than the glass transition temperature of the polymer that constitutes the polymer particles as the material that constitutes the support substrate.

(Polymer Substrate)
The polymer substrate includes a polymer. For the polymer contained in the polymer substrate, the above description regarding the polymer contained in the polymer particle can be referred to. The polymer substrate may be formed of an olefin polymer, for example, a cycloolefin polymer. The polymer substrate may be a member of any shape, for example, a membrane or film. The thickness of the polymer substrate may be 0.5 μm or more, 1 μm or more, 2 μm or more, 5 μm or more, or 10 μm or more, and may be 1000 μm or less, 500 μm or less, 200 μm or less, or 100 μm or less.

The polymer substrate can be obtained, for example, by mixing and stirring a polymer dissolved in a solvent at room temperature to obtain a polymer solution, which is then applied to a substrate such as a glass plate and dried. The polymer substrate thus produced may be peeled off from the substrate as necessary. In the process of applying the polymer solution, a doctor blade or gravure coater may be used to apply the solution at a constant thickness. In the drying process after application, the solution may be dried by heating, for example, at a temperature of 80°C to 200°C for 1 minute to 2 hours. For example, toluene may be used as a solvent for dissolving the polymer.

The polymer substrate can also be obtained, for example, by depositing a powder made of a polymer on a substrate such as a glass plate or a layer of polymer particles, and then heat-pressing the layer made of the deposited powder.

The polymer substrate can also be obtained by extruding molten polymer through a die such as a T-die, stretching the resulting film, and molding it to the desired thickness.

The polymer substrate may or may not contain inorganic particles. In particular, the polymer substrate may be an inorganic particle-free polymer substrate that does not contain inorganic particles, or an inorganic particle-containing polymer substrate that contains inorganic particles.

When the polymer substrate contains inorganic particles, the content ratio of the inorganic particles and the polymer in the polymer substrate can be, for example, such that the volume ratio of polymer to inorganic particles is 1:99 to 99:1, 5:95 to 95:5, 10:90 to 85:15, 20:80 to 80:20, 30:70 to 75:25, or 40:60 to 70:30.

The polymer substrate as the supporting substrate may also be the following additional polymer substrate-polymer substrate composites:
An additional polymer substrate-polymer substrate composite comprising a polymer substrate and an additional polymer substrate, the polymer substrate and the additional polymer substrate being disposed at least partially overlapping each other, and at least one of the polymer substrate and the additional polymer substrate comprising inorganic particles.

In the above-mentioned additional polymer substrate-polymer substrate composite, it is preferable that the polymer substrate and the additional polymer substrate at least partially overlap each other via their respective main surfaces, and it is more preferable that they overlap each other. Even more preferably, in the above-mentioned additional polymer substrate-polymer substrate composite, the main surface of one of the polymer substrate and the additional polymer substrate substantially covers the main surface of the other.

Alternatively, the polymer substrate may be an additional polymer substrate-polymer substrate composite as described below:
a polymer substrate and an additional polymer substrate laminated to the polymer substrate;
An additional polymer substrate-polymer substrate composite, wherein at least one of the polymer substrate and the additional polymer substrate comprises inorganic particles.

Preferably, in the additional polymer substrate-polymer substrate composite, the additional polymer substrate is laminated to a major surface of the polymer substrate.

The inorganic particle-free polymer substrate, inorganic particle-containing polymer substrate, or the additional polymer substrate-polymer substrate composite described above as the support substrate may be manufactured by the method according to the present disclosure.

When the polymer particles do not contain inorganic particles, for example, when the polymer particles are inorganic particle-free polymer particles, the support substrate provided in the support substrate providing step contains inorganic particles.

(Inorganic Substrate)
The material constituting the inorganic substrate may be any inorganic material, and may be selected from the group consisting of, for example, metals and semimetals, oxides of metals and semimetals, nitrides of metals and semimetals, carbides of metals and semimetals, carbon materials, and combinations thereof. Specifically, metals include aluminum, magnesium, titanium, nickel, chromium, iron, copper, gold, silver, tungsten, zirconium, yttrium, indium, iridium, etc., and semimetals include silicon, germanium, GaAs, InGaAs, InAlAs, LiTaOx, NbTaOx, ZnTe, GaSe, GaP, CdTe, diamond, diamond-like carbon, etc. Therefore, metal oxides include oxides of these metals, etc., and semimetal oxides include oxides of these semimetals, etc. Examples of silicon oxides include glass such as quartz glass and soda glass, and examples of aluminum oxides include sapphire, etc. Examples of nitrides include aluminum nitride, silicon nitride, etc. An example of the carbide is silicon carbide, and an example of the carbon material is diamond.

The surface of the inorganic material constituting the inorganic substrate, particularly a metal or semimetal, can be treated with ozone, ultraviolet light, or the like to increase the number of functional groups, such as hydroxyl groups, available for bonding with the polymer contained in the polymer particle layer or inorganic particle-containing polymer layer.

When a polymer particle layer formed on an inorganic substrate is subjected to a heat press treatment, from the viewpoint of forming a stable polymer substrate on the inorganic substrate, it is preferable to use an inorganic material having a melting point higher than the thermal modification temperature of the thermally modified polymer layer.

(Release Substrate)
The release substrate is not particularly limited, but is preferably one that has excellent release properties from the polymer substrate. The release substrate may be, for example, a glass plate, a polyamide film, a polyethylene naphthalate film, a polyethylene sulfide, a polyphenylene oxide, or a polytetrafluoroethylene.

<Stacking Process>
In the depositing step in the method for producing a polymer particle layer-support substrate composite according to the present disclosure, polymer particles are deposited on the support substrate to form a polymer particle layer on the support substrate.

The deposition of the polymer particles on the support substrate may be carried out by a known method, such as a wet method including dispersing the polymer particles in a dispersion medium, an electrodeposition method, an electrostatic adsorption method, or an inkjet method.

In one embodiment of the method for producing a polymer particle layer-support substrate composite according to the present disclosure, the depositing step may include the following operations:
Providing a dispersion in which polymer particles are dispersed in a dispersion medium; and
Coating the dispersion onto a supporting substrate and drying.

Figure 3 is a schematic diagram of one embodiment of a deposition process according to the present disclosure. In the method shown in Figure 3, inorganic particle-containing polymer particles 14 are dispersed in a dispersion medium 24 to obtain a dispersion 22. This dispersion 22 is then applied onto a support substrate 100 using an instrument 29, such as a doctor blade, and dried to obtain a polymer particle layer-support substrate composite 210a.

(Dispersion)
The method of providing the dispersion in which the polymer particles are dispersed in the dispersion medium is not particularly limited. For example, the dispersion may be obtained by adding the polymer particles to the dispersion medium held in a container and appropriately stirring the mixture with a homogenizer or the like.

Figure 4 shows schematics of various embodiments of dispersions that can be used in the deposition process. In the dispersion 22' shown on the left in Figure 4, inorganic particle-free polymer particles 15 and inorganic particle-containing polymer particles 14 are dispersed in a dispersion medium 24. In the dispersion 22'' shown on the right in Figure 4, inorganic particle-free polymer particles 15 are dispersed in a dispersion medium 24.

(Dispersion medium)
The dispersion medium that can be used in the deposition step is not particularly limited as long as it can disperse the polymer particles well, but it is preferable that it is difficult to dissolve the polymer components contained in the polymer particles.Moreover, it is particularly preferable that the dispersion medium that can be used in the deposition step is difficult to dissolve the material that constitutes the support substrate.By using a dispersion medium that is difficult to dissolve the material that constitutes the support substrate, it is possible to avoid or suppress the undesirable influence on the support substrate when the polymer particles are deposited on the support substrate.

In particular, when a polymer substrate is used as the support substrate, it is preferable that the dispersion medium used in the deposition process is one that does not easily dissolve the polymer components that make up the polymer substrate.

Dispersion media that can be used in the deposition process include water, alcohols, esters, ether solvents, and mixtures containing at least one of these. Examples of alcohols include ethanol, 2-propanol, ethylene glycol, and terpineol.

When the viscosity of the dispersion medium is high, a highly viscous dispersion is obtained, which has the advantage of producing a highly uniform coating film in the coating process. From this perspective, it is preferable that the dispersion medium contains a high-viscosity solvent such as ethylene glycol or terpineol.

The boiling point of the solvent constituting the dispersion medium is preferably 20°C or higher, or 50°C or higher, and is preferably 350°C or lower, 300°C or lower, 250°C or lower, or 230°C or lower. If the boiling point of the solvent constituting the dispersion medium is within the above range, coating defects due to drying during coating are unlikely to occur, and the solvent can be easily removed in the drying process.

It is preferable to use a dispersion medium that has good wettability with the resin contained in the polymer particles. When the dispersion medium has good wettability with the polymer particles, the polymer particles are well dispersed in the dispersion, which has the advantage that a uniform, defect-free coating film can be formed.

The dispersion may also contain a dispersant to improve the dispersibility of the polymer particles in the dispersion medium. The dispersant may be, for example, a surfactant.

(Coating)
In one embodiment of the deposition process, for example, the above dispersion is applied onto a support substrate and then dried. Examples of the application method include a method using a solution such as spin coating, roll coater method, spray coating method, die coater method, applicator method, dip coating method, brush coating, spatula coating, roller coating, curtain flow coater method, etc. In the application process of the deposition process, for example, a doctor blade may be used to apply the solution to a certain thickness.

(Drying)
In one embodiment of the deposition step, the drying step after coating may be performed by heating, for example, at a temperature of 100° C. to 200° C. for 1 minute to 2 hours. For example, after the dispersion is applied to the support substrate in the deposition step, drying may be performed by removing the dispersion medium by heating. In this case, the heating conditions may be selected to be a temperature, heating time, and atmospheric pressure conditions sufficient to remove the dispersion medium from the coating film.

(Method for producing the supporting substrate-polymer particle layer-inorganic substrate composite body)
In one embodiment according to the present disclosure, the support substrate-polymer particle layer-inorganic substrate composite can also be formed by a method having the following steps:
Producing a polymer particle layer-support substrate composite according to the method of the present disclosure;
Providing an inorganic substrate and disposing a polymer particle layer-support substrate composite on the inorganic substrate with the polymer particle layer facing the inorganic substrate.

Here, a polymer substrate is preferably used as the support substrate in the production of the support substrate-polymer particle layer-inorganic substrate composite.

<Method for producing polymer substrate-support substrate composite>
The method for producing a polymer substrate-support substrate composite according to the present disclosure includes the steps of:
Obtaining a polymer particle layer-support substrate composite by the method according to the present disclosure (composite providing step); and forming a polymer substrate on the support substrate by heat pressing the polymer particle layer of the polymer particle layer-support substrate composite (heat pressing step).
Includes.

Figure 5 shows a schematic diagram of one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure. In the production method shown in Figure 5, the polymer particle layer-support substrate composite 210a has an inorganic particle-containing polymer particle layer 160a deposited on the support substrate 100, and the inorganic particle-containing polymer substrate-support substrate composite 220a obtained by subjecting the polymer particle layer-support substrate composite 210a to a heat press treatment has an inorganic particle-containing polymer substrate 170a disposed on the support substrate 100.

The method for producing a polymer substrate-support substrate composite illustrated in FIG. 5 uses a polymer particle layer-support substrate composite obtained by the method according to the present disclosure. Therefore, as explained above, it is possible to avoid or suppress undesirable effects on the support substrate caused by the solvent for dissolving the polymer. In addition, since the amount of the solvent for dissolving the polymer can be reduced, the environmental burden and undesirable effects on health associated with the use of the solvent for dissolving the polymer can be reduced.

Furthermore, since the manufacturing method of the polymer substrate-support substrate composite according to the present disclosure includes a step of heat-pressing the polymer particle layer, it is believed that a polymer substrate having even better packing properties and strength than the polymer particle layer can be obtained. Without intending to be limited by theory, it is believed that gaps may exist between the polymer particles in the polymer particle layer, and that such gaps can be reduced or substantially eliminated by heat-pressing the polymer particle layer. As a result, it is believed that a polymer substrate having even better packing properties and strength can be obtained.

<Complex Providing Step>
In the composite providing step in the method for producing a polymer substrate-support substrate composite, a polymer particle layer-support substrate composite is obtained according to the method for producing a polymer particle layer-support substrate composite according to the present disclosure. For the method for obtaining the polymer particle layer-support substrate composite, the description of the method for producing a polymer particle layer-support substrate composite described above can be referred to.

In the method for producing a polymer substrate-support substrate composite according to the present disclosure, the content of inorganic particles in the polymer substrate of the resulting polymer substrate-support substrate composite can be adjusted by adjusting the content of inorganic particles in the polymer particle layer of the polymer particle layer-support substrate composite. The content of inorganic particles in the polymer particle layer may be adjusted by adjusting the amount of inorganic particles in the inorganic particle-containing polymer particles that make up the polymer particle layer, or by adjusting the ratio of inorganic particle-containing polymer particles to inorganic particle-free polymer particles.

<Heat pressing process>
In the heat pressing step in the manufacturing method of the polymer substrate-support substrate composite, the polymer particle layer of the polymer particle layer-support substrate composite provided in the above-mentioned composite providing step is heat pressed to form a polymer substrate on the support substrate.

The manner in which the heat press is performed is not particularly limited. For example, the heat press may be vacuum heat press using a vacuum heating press. The temperature of the heat press is preferably equal to or higher than the thermal denaturation temperature of the polymer that constitutes the polymer particles. The heat press may be performed, for example, under vacuum conditions (e.g., 0 to 10 Pa), or under temperature conditions of 100°C to 300°C, and may be performed for 1 minute to 10 hours. The heat press may be performed, for example, under pressure conditions of 0.1 to 1000 MPa, 0.2 to 500 MPa, 0.5 to 500 MPa, 1 to 200 MPa, 2 to 100 MPa, 5 to 100 MPa, or 10 to 70 MPa.

<Polymer Substrate as Support Substrate>
In one embodiment according to the present disclosure, in the method for producing a polymer substrate-support substrate composite, a polymer substrate is used as the support substrate.

Figure 6A shows a schematic diagram of one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, which includes using a polymer substrate that does not contain inorganic particles as a support substrate. In the production method shown in Figure 6A, a polymer particle layer-support substrate composite 212a having an inorganic particle-containing polymer particle layer 160a deposited on an inorganic particle-free polymer substrate 150 as a support substrate is heat-pressed to obtain an inorganic particle-containing polymer substrate-support substrate composite 222a. The obtained inorganic particle-containing polymer substrate-support substrate composite 222a has an inorganic particle-containing polymer substrate 170a disposed on an inorganic particle-free polymer substrate 150 as a support substrate.

Conventionally, composites in which inorganic particle-containing polymers containing inorganic particles and polymers are laminated with inorganic particle-free polymers have been used, for example, as optical components. In conventional methods, when placing an inorganic particle-containing polymer on an inorganic particle-free polymer substrate, inorganic particles are added to a polymer solution in which the polymer is dissolved in a solvent, and then the solution is applied. However, with this method, the polymer substrate is dissolved by the solvent for dissolving the polymer during application, and there is a risk of the quality of the resulting composite being degraded.

In contrast, in the method illustrated in FIG. 6A, instead of applying a polymer solution, deposition of polymer particles is performed to obtain a composite in which an inorganic particle-containing polymer layer is disposed on a polymer substrate as a support substrate, and the amount of solvent used to dissolve the polymer is reduced. Therefore, the problem of the polymer substrate being dissolved by the solvent can be avoided or suppressed, and as a result, good properties of the composite produced can be ensured. In addition, the polymer substrate-support substrate composite having a polymer substrate as a support substrate obtained by the method according to the present disclosure has improved flatness of the interface between the polymer substrates compared to the conventional method of deposition using a polymer solution.

Furthermore, a polymer substrate-support substrate composite having an inorganic particle-containing polymer substrate has physical properties that are useful for various applications, compared to a substrate consisting of only a polymer. For example, since it is believed that an inorganic particle-containing polymer substrate may have a refractive index different from that of a layer consisting of only a polymer, a polymer substrate-support substrate composite having an inorganic particle-containing polymer substrate is believed to be useful as an optical component having excellent reflection and transmission properties, particularly excellent anti-reflection properties.

In another embodiment of the method for producing a polymer substrate-support substrate composite according to the present disclosure, a polymer substrate containing inorganic particles can also be used as the support substrate.

Figure 6B shows a schematic diagram of one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, which includes using an inorganic particle-containing polymer substrate as the support substrate.

In FIG. 6B, a polymer particle layer-support substrate composite 213a having an inorganic particle-free polymer particle layer 160 deposited on an inorganic particle-containing polymer substrate 170a as a support substrate is heat-pressed to obtain a polymer substrate-support substrate composite 222a. The polymer substrate-support substrate composite 222a has an inorganic particle-free polymer substrate 150 disposed on an inorganic particle-containing polymer substrate 170a as a support substrate.

The manufacturing processes shown in Figures 6A and 6B have different steps, but the resulting composite has the same configuration. Therefore, the present disclosure can provide multiple options for manufacturing a composite having a specific configuration.

Figure 6C shows a schematic diagram of another embodiment of the method for producing a polymer substrate-support substrate composite according to the present disclosure, which includes using an inorganic particle-containing polymer substrate as the support substrate. In Figure 6C, the polymer particle layer-support substrate composite 213b has an inorganic particle-containing polymer particle layer 160b deposited on the inorganic particle-containing polymer substrate 170a as the support substrate, and the polymer substrate-support substrate composite 222b obtained by heat pressing has an inorganic particle-containing polymer substrate 170b disposed on the inorganic particle-containing polymer substrate 170a as the support substrate.

In FIG. 6C, the inorganic particle-containing polymer substrate 170b has a lower inorganic particle content than the inorganic particle-containing polymer substrate 170a. That is, the polymer substrate-support substrate composite 222b has a gradient of inorganic particle content in which the inorganic particle content increases or decreases along the stacking direction. In order to form such a gradient of inorganic particle content, the method according to FIG. 6C uses a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles, and adjusts the ratio of inorganic particle-containing polymer particles to inorganic particle-free polymer particles in the mixture so that the inorganic particle content in the inorganic particle-containing polymer substrate 170b is lower than that in the inorganic particle-containing polymer substrate 170a.

Therefore, according to the method of the present disclosure, a composite having two polymer substrates with different inorganic particle contents can be produced relatively easily while ensuring excellent quality.

In addition, a polymer substrate-support substrate composite having two inorganic particle-containing polymer substrates with different inorganic particle contents has physical properties that are useful for a variety of applications, compared to a substrate consisting of only a polymer. For example, this composite is considered to be useful as an optical component with excellent anti-reflection properties, since it is possible to adjust the refractive index between the constituent members by adjusting the difference in inorganic particle content between adjacent inorganic particle-containing polymer substrates.

In another embodiment of the method for producing a polymer substrate-support substrate composite according to the present disclosure, the following additional polymer substrate-polymer substrate composites can be used as the support substrate:
An additional polymer substrate-polymer substrate composite comprising a polymer substrate and an additional polymer substrate, the polymer substrate and the additional polymer substrate being disposed at least partially overlapping each other, and at least one of the polymer substrate and the additional polymer substrate comprising inorganic particles.

For the additional polymer substrate-polymer substrate composite as the support substrate, the above description regarding the support substrate in the manufacturing method of the polymer particle layer-support substrate composite can be referred to. The additional polymer substrate-polymer substrate composite may be, for example, the composite 222a or 222b illustrated in Figures 6A to 6C.

Figures 7A and 7B are schematic diagrams illustrating one embodiment of a method for producing a polymer substrate-support substrate composite according to the present disclosure, including using a composite having two polymer substrates as the support substrate. The polymer particle layer-support substrate composites 322a and 322b shown in Figures 7A and 7B each have a composite having two polymer substrates 222a and 222b as the support substrate, respectively, and each have a polymer particle layer 160a and 160c, respectively. The composites 222a and 222b have the same configuration as described in Figures 6A and 6B.

In the composite 322a in FIG. 7A, an inorganic particle-containing polymer particle layer 160a is formed on the inorganic particle-free polymer substrate 150 constituting the composite 222a. The composite 332a obtained by heat pressing this composite 322a has two inorganic particle-containing polymer substrates 170a, 170a' and the inorganic particle-free polymer substrate 150 sandwiched between them.

In the composite 322b of FIG. 7B, a polymer particle layer 160c composed of a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles is formed on 170b, which is one of the two inorganic particle-containing polymer substrates constituting composite 222b and has a relatively low inorganic particle content. Composite 332b obtained by subjecting this composite 322b to a heat press treatment has three inorganic particle-containing polymer substrates 170a, 170b, and 170c, which are stacked so as to have a gradient of inorganic particle content along the stacking direction.

Polymer substrate-support substrate composites having two polymer substrates as support substrates have physical properties that are useful for a variety of applications. For example, in these composites, it is possible to adjust the refractive index between the constituent members by adjusting the difference in inorganic particle content between adjacent inorganic particle-containing polymer substrates, and therefore it is believed that they are useful as optical components having excellent transmission and reflection properties, particularly excellent anti-reflection properties. In particular, the composite exemplified in Figures 7A and B has three polymer substrates, and therefore it is believed that the optical properties can be adjusted even more finely.

(An embodiment in which the supporting substrate is held by the peeling substrate)
In one embodiment according to the present disclosure, the support substrate is held on a release substrate, and the polymer substrate is peeled off from the release substrate before or after the polymer particle layer is heat pressed.

In the method shown in FIG. 8A, the polymer substrate 150 as the support substrate is held on the peeling substrate 190. After forming the inorganic particle-containing polymer particle layer 160a on the polymer substrate 150 as the support substrate by the method according to the present disclosure, a composite 226a of the polymer substrate-support substrate composite 222a and the peeling substrate 190 is obtained by a heat press treatment. Then, in this composite 226a, the polymer substrate-support substrate composite 222a is peeled off from the peeling substrate 190 to obtain the polymer substrate-support substrate composite 222a.

In another embodiment of the present disclosure, the polymer substrate as a support substrate may be peeled off from the peeling substrate before the polymer particle layer is heat-pressed. That is, for example, as shown in FIG. 8B, a polymer substrate 150 as a support substrate is formed on a peeling substrate 190, and an inorganic particle-containing polymer particle layer 160a is formed on the polymer substrate 150 to obtain a composite 216a of the polymer particle layer-polymer substrate composite and the peeling substrate, and then the polymer particle layer-support substrate composite 212a is peeled off from the peeling substrate 190 in the composite 216a to obtain a polymer particle layer-support composite 212a. Furthermore, the polymer substrate-support substrate composite 222a can be manufactured by subjecting the polymer particle layer-support substrate composite 212a thus obtained to a heat press treatment.

The release substrate for holding the support substrate is not particularly limited. The release substrate is preferably a glass plate, a polyamide film, a polyethylene naphthalate film, a polyethylene sulfide, a polyphenylene oxide, or a polytetrafluoroethylene, because these substrates have good releasability when peeling the polymer-containing layer from the release substrate.

According to the above manufacturing method in which the support substrate is held by the release substrate, it is possible to protect the support substrate from the external environment when forming the polymer particle layer and/or when the polymer particle layer is heat pressed, and in some cases, the quality of the obtained composite can be further improved.

<Aspect of using an inorganic substrate as a supporting substrate>
In one embodiment according to the present disclosure, in the method for producing a polymer substrate-support substrate composite, an inorganic substrate is used as the support substrate.

Figure 9 shows a schematic diagram of one embodiment of the method for producing a polymer substrate-support substrate composite according to the present disclosure when an inorganic substrate is used as the support substrate. In the embodiment shown in Figure 9, a polymer particle layer-support substrate composite 421a having an inorganic particle-containing polymer particle layer 160a deposited on an inorganic substrate 180 as the support substrate is produced by the method according to the present disclosure. Then, the polymer particle layer 160a of the obtained polymer particle layer-support substrate composite 421a is heat-pressed to form an inorganic particle-containing polymer substrate 170a on the inorganic substrate 180 as the support substrate, thereby obtaining a polymer substrate-support substrate composite 420a. The obtained polymer substrate-support substrate composite 420a has an inorganic particle-containing polymer substrate 170a disposed on the inorganic substrate 180 as the support substrate.

A polymer substrate-support substrate composite having an inorganic substrate as the support substrate has different physical properties compared to, for example, inorganic substrates, and is useful in a variety of applications, particularly as an optical component. For example, a polymer substrate-support substrate composite having an inorganic particle-containing polymer substrate as the polymer substrate and an inorganic substrate as the support substrate has a reduced difference in refractive index between the constituent members compared to a composite consisting of a polymer substrate not containing inorganic particles and an inorganic substrate, and as a result, it is believed that the reflectance of the composite is reduced.

<Aspect of using a release substrate as a supporting substrate>
In one embodiment according to the present disclosure, in the method for producing a polymer substrate-support substrate composite, a release substrate is used as the support substrate.

In particular, according to the present disclosure, a polymer substrate can be produced by using a release substrate as a supporting substrate. That is, the present disclosure includes a method for producing a polymer substrate, including:
Obtaining a polymer substrate-support substrate composite by the method according to the present disclosure using a release substrate as the support substrate (composite providing step);
In the polymer substrate-support substrate complex, the polymer substrate is peeled off from the support substrate, which is a peeling substrate, to obtain the polymer substrate (peeling step).

Figure 10A shows a schematic diagram of a method for obtaining an inorganic particle-free polymer substrate 150 by using a peeling substrate 190 as a support substrate. In the method shown in Figure 10A, a polymer particle layer-support substrate composite 216b is produced by the method according to the present disclosure, using inorganic particle-free polymer particles as the polymer particles and a peeling substrate 190 as the support substrate. Then, the inorganic particle-free polymer particle layer 160 in this polymer particle layer-support substrate composite 216b is heat-pressed to form an inorganic particle-free polymer substrate 150 on the peeling substrate 190, thereby obtaining a polymer substrate-support substrate composite 226b. Then, the inorganic particle-free polymer substrate 150 is peeled off from the peeling substrate 190 to obtain an inorganic particle-free polymer substrate 150 as a polymer substrate.

Figure 10B shows a method for obtaining an inorganic particle-containing polymer substrate 170a as a polymer substrate by a method similar to that shown in Figure 10A, except that inorganic particle-containing polymer particles are used as the polymer particles.

In the manufacturing method according to the present disclosure for obtaining a polymer substrate, peeling of the inorganic particle-containing polymer substrate can be performed relatively easily by selecting an appropriate substrate for peeling.

In addition, the inorganic particle-containing polymer substrate obtained by the manufacturing method according to the present disclosure has physical properties different from those of, for example, a polymer substrate consisting only of a polymer due to the inclusion of inorganic particles. In particular, the inorganic particle-containing polymer substrate can have an intermediate refractive index value between the inorganic substrate and the polymer, and is therefore useful, for example, in optical applications. Specifically, for example, when there is a large difference in refractive index between the inorganic substrate and the polymer, the inorganic particle-containing polymer substrate can be used to reduce problems caused by the difference, such as an increase in reflectance.

(Complex providing step)
In the composite providing step of the method for producing a polymer substrate according to the present disclosure, a release substrate is used as the supporting substrate, and a polymer substrate-supporting substrate composite is obtained by the method according to the present disclosure. The above description can be referred to for the method for producing a polymer substrate-supporting substrate composite.

(Release Substrate)
The release substrate used as the supporting substrate in the method for producing a polymer substrate according to the present disclosure is not particularly limited, but is preferably one that has excellent releasability from the polymer substrate. For the release substrate, the above description can be referred to.

(Peeling process)
In the peeling step of the method for producing a polymer substrate according to the present disclosure, the polymer substrate is obtained by peeling the polymer substrate from the supporting substrate, which is a substrate for peeling, in the polymer substrate-supporting substrate composite. The peeling method is not particularly limited and can be performed by a known method.

<<Method for producing additional polymer substrate-polymer substrate composite, including overlapping substrates>>
The present disclosure includes additional methods of making polymer substrate-polymer substrate composites, including:
Producing a polymer substrate by the method according to the present disclosure (substrate production step);
Providing an additional polymer substrate (substrate providing step); and
Laminating the polymer substrate and the additional polymer substrate onto one another (positioning step).

In the method shown in FIG. 11, an inorganic particle-containing polymer substrate 170a is produced by the method according to the present disclosure, and an inorganic particle-free polymer substrate 150 is provided as an additional polymer substrate. The inorganic particle-containing polymer substrate 170a and the inorganic particle-free polymer substrate 150 are then stacked on top of each other to obtain an additional polymer substrate-polymer substrate composite 222a'.

An additional polymer substrate-polymer substrate composite having an inorganic particle-containing polymer substrate as the additional polymer substrate has physical properties that are useful for various applications, compared to a substrate consisting of only a polymer. In particular, since it is believed that the inorganic particle-containing polymer substrate may have a refractive index different from that of a layer consisting of only a polymer, the composite is believed to be useful as an optical component having excellent anti-reflection properties.

<Substrate manufacturing process>
In the substrate manufacturing step of the additional method for manufacturing a polymer substrate-polymer substrate composite including overlapping substrates according to the present disclosure, a polymer substrate is manufactured by the method according to the present disclosure. The above description of the method for manufacturing a polymer substrate can be referred to.

<Substrate provision process>
In the substrate providing step in the method for producing an additional polymer substrate-polymer substrate composite including overlapping substrates according to the present disclosure, an additional polymer substrate is provided. The additional polymer substrate may be an inorganic substrate-containing polymer substrate or an inorganic substrate-free polymer substrate. For the inorganic substrate-containing polymer substrate or inorganic substrate-free polymer substrate as the additional polymer substrate, reference may be made to the above description. The inorganic substrate-containing polymer substrate or inorganic substrate-free polymer substrate as the additional polymer substrate may be one produced by the method for producing a polymer substrate according to the present disclosure.

Placement process
In the arranging step in the method for producing an additional polymer substrate-polymer substrate composite including overlapping substrates according to the present disclosure, the polymer substrate and the additional polymer substrate are overlapped with each other. In the arranging step, the polymer substrate and the additional polymer substrate are preferably overlapped with each other via their main surfaces so as to at least partially overlap with each other, in particular so as to overlap with each other. More preferably, the polymer substrate and the additional polymer substrate are overlapped with each other so that the main surface of one of the polymer substrate and the additional polymer substrate substantially covers the main surface of the other.

<Thermocompression bonding process>
In one embodiment according to the present disclosure, the additional polymer substrate-polymer substrate composite obtained in the disposing step can be further subjected to a thermocompression treatment. By subjecting the composite to a thermocompression treatment, the adhesion between the additional polymer substrate and the polymer substrate can be further improved. For the thermocompression treatment, the following description regarding the method for producing a polymer substrate-inorganic substrate composite can be referred to.

<Method for producing polymer substrate-inorganic substrate composite>
The present disclosure includes a method for making a polymer substrate-inorganic substrate composite, comprising:
Producing a polymer substrate by the method according to the present disclosure (substrate production step);
Providing an inorganic substrate (inorganic substrate providing step); and
Disposing a polymeric substrate on an inorganic substrate (disposing step).

In the method shown in FIG. 12, an inorganic particle-containing polymer substrate 170a is produced by the method according to the present disclosure, and an inorganic substrate 180 is provided. Then, the inorganic particle-containing polymer substrate 170a is placed on the inorganic substrate 180 to obtain a polymer substrate-inorganic substrate composite 420a. The inorganic particle-containing polymer substrate 170a may be produced, for example, by the production method illustrated in FIG. 10B.

A polymer substrate-inorganic substrate composite having an inorganic particle-containing polymer substrate as the polymer substrate has different physical properties compared to inorganic substrates, and is useful for various applications, particularly as optical components. In particular, the composite has a reduced difference in refractive index between the constituent members compared to a composite consisting of a polymer substrate not containing inorganic particles and an inorganic substrate, and as a result, it is believed that the reflectance of the composite is reduced.

<Substrate manufacturing process>
In the substrate manufacturing process in the method for manufacturing a polymer substrate-inorganic substrate composite of the present disclosure, a polymer substrate is manufactured by the method according to the present disclosure. For the method for manufacturing a polymer substrate, the above description according to the present disclosure can be referred to.

<Inorganic base material provision process>
In the inorganic substrate providing step in the method for producing a polymer substrate-inorganic substrate composite of the present disclosure, an inorganic substrate is provided. For the inorganic substrate, the above description can be referred to.

Placement process
In the disposing step in the manufacturing method of the polymer substrate-inorganic substrate composite of the present disclosure, the polymer substrate is disposed on the inorganic substrate.

In the disposing step, the polymer substrate may be disposed on the inorganic substrate, preferably such that the polymer substrate and the inorganic substrate at least partially overlap each other, particularly overlap each other, via their main surfaces. Alternatively, in the disposing step, the polymer substrate may be disposed on the inorganic substrate, such that the main surface of one of the polymer substrate and the inorganic substrate substantially covers the main surface of the other.

The manner in which the polymer substrate is disposed on the inorganic substrate in the disposing step is not particularly limited. For example, the polymer substrate can be disposed directly on the inorganic substrate.

In another embodiment, when the polymer substrate is disposed on the inorganic substrate in the disposing step, for example, an adhesive polymer layer may be disposed on the inorganic substrate in advance, and the polymer substrate may be disposed on the inorganic substrate via the adhesive polymer layer. When the polymer substrate is disposed on the inorganic substrate via the adhesive polymer layer, the adhesion between the polymer substrate and the inorganic substrate is further improved, which is preferable.

The adhesive polymer layer is not particularly limited as long as it can improve the adhesion between the polymer substrate and the inorganic substrate. It is particularly preferable that the adhesive polymer layer is composed of the same type of polymer as the polymer substrate, since this further promotes bonding between the adhesive polymer layer and the polymer substrate.

The adhesive polymer layer is preferably a thermally modified polymer layer. The thermally modified polymer layer as the adhesive polymer layer can be formed, for example, by forming a polymer layer on the inorganic substrate by coating and/or thermocompression bonding, and then heating the polymer layer to form a thermally modified polymer layer. The heating method is not particularly limited, but examples include methods using a heating source such as an oven, a hot plate, infrared rays, a flame, a laser, or a flash lamp. Here, the degree of thermal modification can be adjusted by the heating temperature, time, surrounding atmosphere, etc. for thermal modification. Specifically, the degree of thermal modification can be, for example, such that the adhesion of the thermally modified polymer layer to the inorganic substrate is greater than the adhesion of the polymer layer to the inorganic substrate.

<Thermocompression bonding process>
In one embodiment according to the present disclosure, the polymer substrate-inorganic substrate composite obtained in the disposing step can be further subjected to a thermocompression treatment. When the thermocompression treatment is performed on the composite, the adhesion between the polymer substrate and the inorganic substrate can be further improved.

The manner of thermocompression bonding of the polymer substrate-inorganic substrate composite is not particularly limited, and can be performed by a known method. The thermocompression bonding can be performed, for example, under vacuum conditions (e.g., 0 to 10 Pa) and/or at or above the thermal denaturation temperature of the polymer constituting the polymer substrate. The temperature of the thermocompression bonding can be, for example, 80°C to 300°C. The pressure of the thermocompression bonding can be, for example, 0.1 to 1000 MPa, or 0.2 to 500 MPa, 0.5 to 500 MPa, 1 to 200 MPa, 2 to 100 MPa, 5 to 100 MPa, or 10 to 70 MPa. The time of the thermocompression bonding can be, for example, 1 minute to 10 hours, or 10 minutes to 300 minutes, or 30 minutes to 120 minutes.

<<Method for producing an additional polymer substrate-polymer substrate-inorganic substrate composite, comprising providing an additional polymer substrate>>
The present disclosure includes additional methods of making polymer substrate-polymer substrate-inorganic substrate composites, including:
Producing a polymer substrate-inorganic substrate composite by the method according to the present disclosure (composite production process)
providing an additional polymer substrate (substrate providing step); and disposing the additional polymer substrate on the polymer substrate in the polymer substrate-inorganic substrate composite (disposing step).

In FIG. 13, a polymer substrate-inorganic substrate composite 420a is produced by the method according to the present disclosure, and an inorganic particle-free polymer substrate 150 is provided as an additional polymer substrate. The inorganic particle-free polymer substrate 150 is then placed on top of the inorganic particle-containing polymer substrate 170a in the polymer substrate-inorganic substrate composite 420a, thereby producing an additional polymer substrate-polymer substrate-inorganic substrate composite 430a.

The additional polymer substrate-polymer substrate-inorganic substrate composite having an inorganic particle-containing polymer substrate has excellent physical properties, and in particular, compared to composites consisting of a polymer substrate not containing inorganic particles and an inorganic substrate only, the difference in refractive index between the constituent members is reduced, and as a result, it is believed to have excellent reflective properties.

<Composite Manufacturing Process>
In the composite production step of the additional polymer substrate-polymer substrate-inorganic substrate composite production method according to the present disclosure, which includes providing an additional polymer substrate, a polymer substrate-inorganic substrate composite is produced by the method according to the present disclosure. The above description can be referred to for the method for producing a polymer substrate-inorganic substrate composite, and for example, a polymer substrate-inorganic substrate composite can be produced by the production method exemplified in FIG. 9 or FIG. 12 described above.

Preferably, in the composite manufacturing process, a polymer substrate-inorganic substrate composite is manufactured, in which the polymer substrate is an inorganic substrate-containing polymer substrate. In this case, an additional polymer substrate-polymer substrate-inorganic substrate composite can be obtained in which the refractive index between the constituent members is relatively reduced, which is particularly useful in optical applications.

<Substrate provision process>
In the substrate providing step of the method for producing an additional polymer substrate-polymer substrate-inorganic substrate composite according to the present disclosure, which includes providing an additional polymer substrate, an additional polymer substrate is provided. The additional polymer substrate may be an inorganic substrate-containing polymer substrate or an inorganic substrate-free polymer substrate, which may be produced by the method according to the present disclosure. For the inorganic substrate-containing polymer substrate or inorganic substrate-free polymer substrate as the additional polymer substrate, the above description can be referred to. Preferably, the additional polymer substrate provided in the substrate providing step is an inorganic particle-free polymer substrate, or has a lower inorganic particle content than the polymer substrate contained in the composite produced in the composite production step.

Placement process
In the arranging step of the method for producing an additional polymer substrate-polymer substrate-inorganic substrate composite according to the present disclosure, which includes providing an additional polymer substrate, the additional polymer substrate is arranged on the polymer substrate in the polymer substrate-inorganic substrate composite. In the arranging step, the additional polymer substrate and the polymer substrate in the polymer substrate-inorganic substrate composite may be arranged so that they at least partially overlap each other via their respective main surfaces, in particular so that they overlap each other. Alternatively, in the arranging step, the arrangement may be performed so that one main surface of the additional polymer substrate or the polymer substrate in the polymer substrate-inorganic substrate composite substantially covers the other main surface.

<Thermocompression bonding process>
In one embodiment according to the present disclosure, the additional polymer substrate-polymer substrate-inorganic substrate composite obtained in the disposing step can be further subjected to a thermocompression treatment. The thermocompression treatment can further improve the adhesion between the substrates constituting the composite. For the thermocompression treatment, the above description regarding the "method for producing a polymer substrate-inorganic substrate composite" can be referred to.

When producing an additional polymer substrate-polymer substrate-inorganic substrate composite, the additional polymer substrate may be placed on the polymer substrate in the polymer substrate-inorganic substrate composite, or the polymer substrate may be placed at a different timing. Although not shown in FIG. 13, for example, after producing an additional polymer substrate-polymer substrate composite by placing a polymer substrate on an inorganic particle-containing polymer substrate, this additional polymer substrate-polymer substrate composite may be placed on the inorganic substrate, or the additional polymer substrate may be placed on the polymer substrate before peeling the polymer substrate from the peeling substrate in the polymer substrate-peeling substrate composite.

<<Method for producing additional polymer particle layer-polymer particle layer-support substrate composite>>
The present disclosure includes additional methods of making a polymer particle layer-polymer particle layer-support substrate composite, including:
Obtaining a polymer particle layer-support substrate composite by the method according to the present disclosure (composite providing step);
Depositing inorganic particle-free polymer particles, inorganic particle-containing polymer particles, or a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles on the polymer particle layer-support substrate composite to form an additional polymer particle layer on the polymer particle layer-support substrate composite (additional polymer particle layer providing step).

In the example shown in FIG. 14A, a mixture of inorganic particle-containing polymer particles 14 and inorganic particle-free polymer particles 15 is deposited onto the polymer particle layer 160b of the polymer particle layer-support substrate composite 214b to form an additional polymer particle layer 160c, producing composite 312b.

The manufacturing method according to the present disclosure allows a composite having two polymer particle layers to be produced relatively easily, and in particular, allows a composite having two polymer particle layers with different inorganic particle contents to be produced relatively easily.

The additional polymer particle layer-polymer particle layer-support substrate composite having a polymer substrate as a support substrate is believed to be useful as an optical component, since it may have multiple polymer particle layers with different inorganic particle contents and therefore have different optical properties compared to, for example, a single polymer substrate.

<Complex Providing Step>
In the composite providing step in the additional method for producing a polymer particle layer-polymer particle layer-support substrate composite according to the present disclosure, a polymer particle layer-support substrate composite is obtained by the method according to the present disclosure. Preferably, the polymer particle layer-support substrate composite is produced using a polymer substrate as the support substrate. The above description can be referred to for the method for producing a polymer particle layer-support substrate composite.

<Step of Providing Additional Polymer Particle Layer>
In the additional polymer particle layer providing step in the manufacturing method for the additional polymer particle layer-polymer particle layer-support substrate composite according to the present disclosure, inorganic particle-free polymer particles, inorganic particle-containing polymer particles, or a mixture of inorganic particle-containing polymer particles and inorganic particle-free polymer particles are deposited on the polymer particle layer-support substrate composite to form an additional polymer particle layer on the polymer particle layer-support substrate composite.

The deposition of the polymer particles can be carried out in the same manner as described above for the polymer particle layer-support substrate composite according to the present disclosure. Specifically, for example, a dispersion is prepared by dispersing the polymer particles in a dispersion medium, and the dispersion is deposited on the polymer particle layer of the polymer particle layer-support substrate composite provided in the composite providing step, and the dispersion is dried to produce an additional polymer particle layer-polymer particle layer-support substrate composite.

<<Additional method for producing polymer substrate-polymer substrate-support substrate composite>>
Methods according to the present disclosure include additional methods for making polymer substrate-polymer substrate-support substrate composites, including:
Producing an additional polymer particle layer-polymer particle layer-support substrate composite by the method according to the present disclosure (composite production step);
The polymer particle layer and the additional polymer particle layer of the additional polymer particle layer-polymer particle layer-support substrate composite are heat-pressed to form a polymer substrate and an additional polymer substrate on the support substrate (heat-pressing step).

Figure 14B shows one embodiment of a method for producing an additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure when a polymer substrate is used as the support substrate. In the method shown in Figure 14B, the additional polymer substrate-polymer substrate-support substrate composite 332b is produced by heat pressing the polymer particle layer 160b and the additional polymer particle layer 160c of the additional polymer particle layer-polymer particle layer-support substrate composite 312b produced by the method according to the present disclosure. The obtained additional polymer substrate-polymer substrate-support substrate composite 332b has polymer substrates 170a, 170b, and 170c with different inorganic particle contents.

In the additional method for producing a polymer substrate-polymer substrate-support substrate composite according to the present disclosure, a composite including multiple stacked polymer particle layers is heat-pressed, so that two polymer particle layers can be heat-pressed at once to produce a composite having multiple stacked polymer substrates. Therefore, according to this production method, a composite having two stacked polymer substrates can be produced relatively easily. In particular, according to the additional method for producing a polymer substrate-polymer substrate-support substrate composite according to the present disclosure, a composite including three or four polymer substrates can be produced relatively easily by using a polymer substrate as the support substrate.

In addition, the method disclosed herein reduces the use of solvents to dissolve the polymer, resulting in a composite with improved interface flatness between adjacent polymer substrates.

Furthermore, the additional polymer substrate-polymer substrate-support substrate composite having an inorganic particle-containing polymer substrate has physical properties that are useful for various applications. For example, the composite is considered to be useful as an optical component having excellent reflective properties, particularly excellent anti-reflective properties, because it is possible to adjust the refractive index between the components by adjusting the difference in inorganic particle content between adjacent inorganic particle-containing polymer substrates.

As described above, according to the manufacturing method of the additional polymer substrate-polymer substrate-support substrate composite of the present disclosure, a composite composed of four polymer substrates can also be manufactured. In the method shown in FIG. 15A, a polymer particle layer-support substrate composite 322b having two polymer substrates as support substrates is manufactured by the method of the present disclosure, and an additional polymer particle layer 160d is formed on the polymer particle layer 160c of this composite 322b to manufacture an additional polymer particle layer-polymer particle layer-support substrate composite 422a. Then, in FIG. 15B, an additional polymer substrate-polymer substrate-support substrate composite 442a is manufactured by heat pressing the additional polymer particle layer 160d and the polymer particle layer 160c of the obtained composite 422a. The obtained composite 442a has four polymer substrates 170a, 170b, 170c, and 170d having different inorganic particle contents, and has a gradient of inorganic particle content in the stacking direction.

The composite composed of four polymer substrates obtained by the method according to the present disclosure can have a configuration in which the content of inorganic particles increases or decreases stepwise in the stacking direction, starting from the polymer substrate constituting the outermost layer, as shown in FIG. 15B, for example. In such a composite, four inorganic particle-containing polymer substrates with different inorganic particle contents are adjacent to each other, making it possible to adjust the refractive index between the constituent members even more finely, and it is believed to be particularly useful as an optical component with excellent anti-reflection properties.

<Composite Manufacturing Process>
In the composite manufacturing step in the manufacturing method of the additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure, the additional polymer particle layer-polymer particle layer-support substrate composite is manufactured by the method according to the present disclosure. The manufacturing method of the additional polymer particle layer-polymer particle layer-support substrate composite can be referred to the above description.

<Heat pressing process>
In the heat pressing step in the manufacturing method of the additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure, the polymer particle layer and the additional polymer particle layer of the additional polymer particle layer-polymer particle layer-support substrate composite are heat pressed to form a polymer substrate and an additional polymer substrate on the support substrate. For the method of heat pressing the polymer particle layer and the additional polymer particle layer, the above description of the manufacturing method of the polymer substrate-support substrate composite according to the present disclosure can be referred to.

<<Additional method for producing a polymer substrate-polymer substrate-support substrate composite, including using an inorganic substrate as the support substrate>>
In the method for producing an additional polymer substrate-polymer substrate-support substrate composite according to the present disclosure, by using an inorganic substrate as the support substrate, a composite in which a polymer substrate and an additional polymer substrate are laminated on the inorganic substrate can be obtained.

In FIG. 16, an additional polymer particle layer-polymer particle layer-support substrate composite 431a is produced having polymer particle layers 160a and 160 deposited on an inorganic substrate 180, and a heat press process is performed on this composite 431a to produce an additional polymer substrate-polymer substrate-support substrate composite 430a' having polymer substrates 150 and 170a disposed on the inorganic substrate 180 as a support substrate.

According to this method, a composite in which a polymer substrate and an additional polymer substrate are laminated on an inorganic substrate can be obtained relatively easily. In addition, the additional polymer substrate-polymer substrate-support substrate composite having an inorganic substrate as a support substrate and an inorganic particle-containing polymer substrate has excellent physical properties. For example, compared to a composite consisting of a polymer substrate not containing inorganic particles and an inorganic substrate alone, the difference in refractive index between the constituent members is reduced, and as a result, it is considered to have excellent reflective properties, particularly excellent anti-reflective properties.

<<Additional method for producing a polymer substrate-polymer substrate composite, including using a release substrate as a supporting substrate>>
The present disclosure includes additional methods of making polymer substrate-polymer substrate composites, including:
Obtaining an additional polymer substrate-polymer substrate-support substrate composite by the method according to the present disclosure using a release substrate as the support substrate (composite manufacturing step);
In the additional polymer substrate-polymer substrate-support substrate composite, the additional polymer substrate-polymer substrate composite is peeled off from the support substrate, which is a peeling substrate, to obtain an additional polymer substrate-polymer substrate composite (peeling step).

Figure 17 shows one embodiment of a method for producing an additional polymer substrate-polymer substrate composite 222a', including using a release substrate as a support substrate. For each component in the figure, the above description can be referenced. The additional polymer substrate-polymer substrate composite having an inorganic particle-containing polymer substrate is believed to have physical properties useful for various applications, similar to the additional polymer substrate-polymer substrate composites already described, and is believed to be useful as an optical component having excellent anti-reflection properties.

<Composite Manufacturing Process>
In the composite manufacturing step of the manufacturing method of the additional polymer substrate-polymer substrate composite including using a release substrate as a supporting substrate according to the present disclosure, the additional polymer substrate-polymer substrate-support substrate composite is manufactured by the above-described method according to the present disclosure using a release substrate as a supporting substrate. The above description can be referred to for the release substrate as a supporting substrate and the manufacturing method of the additional polymer substrate-polymer substrate-support substrate composite.

At least one of the additional polymer substrate and the polymer substrate that constitute the additional polymer substrate-polymer substrate composite produced in the composite production process is preferably an inorganic particle-containing polymer substrate.

<Peeling process>
In the peeling step of the method for producing an additional polymer substrate-polymer substrate composite including using a release substrate as a support substrate according to the present disclosure, the additional polymer substrate-polymer substrate composite is peeled off from the support substrate, which is the release substrate, in the additional polymer substrate-polymer substrate-support substrate composite to obtain an additional polymer substrate-polymer substrate composite. The peeling method is not particularly limited, and a known method can be used.

<<Additional method for producing a polymer substrate-polymer substrate-inorganic substrate composite, comprising disposing the composite on an inorganic substrate>>
The present disclosure includes additional methods of making polymer substrate-polymer substrate-inorganic substrate composites, including:
Producing an additional polymer substrate-polymer substrate composite having a polymer substrate and an additional polymer substrate at least partially overlapping each other by the production method according to the present disclosure (composite production step), wherein the polymer substrate is an inorganic particle-containing polymer substrate and/or the additional polymer substrate is an additional inorganic particle-containing polymer substrate;
providing an inorganic substrate (inorganic substrate providing step); and disposing an additional polymer substrate-polymer substrate composite on the inorganic substrate such that the polymer substrate is an inorganic particle polymer substrate or the additional polymer substrate is an additional inorganic particle-containing polymer substrate faces the inorganic substrate (disposing step).

Figure 18 shows one embodiment of a method for producing an additional polymer substrate-polymer substrate-inorganic substrate composite 430a'' including disposing the composite on an inorganic substrate. In the method shown in Figure 18, a polymer substrate-support substrate composite 222a is produced by the method according to the present disclosure illustrated in Figure 6A and the like, and an inorganic substrate 180 is provided. Then, the polymer substrate-support substrate composite 222a is disposed on the inorganic substrate 180 such that the inorganic particle-containing polymer substrate 170a of the polymer substrate-support substrate composite 222a faces the inorganic substrate 180.

As described above, the additional polymer substrate-polymer substrate-inorganic substrate composite having an inorganic particle-containing polymer substrate has excellent physical properties. For example, the composite has a reduced difference in refractive index between the constituent members compared to a composite consisting of only a polymer member and an inorganic substrate, and as a result, it is believed to have excellent anti-reflection properties.

<Composite Manufacturing Process>
In the composite manufacturing process according to the manufacturing method of the additional polymer substrate-polymer substrate-inorganic substrate composite of the present disclosure, which includes disposing a composite on an inorganic substrate, an additional polymer substrate-polymer substrate composite having a polymer substrate and an additional polymer substrate that are at least partially overlapped with each other is manufactured. Here, the "additional polymer substrate-polymer substrate composite" may be an additional polymer substrate-polymer substrate composite manufactured by the method according to the present disclosure illustrated in FIG. 11 or FIG. 17. Also, the "additional polymer substrate-polymer substrate composite" may be a polymer substrate-support substrate having a polymer substrate as a support substrate, manufactured by the method according to the present disclosure illustrated in the above-mentioned FIGs. 6A, 6B, 6C, 8A, and 8B.

<Inorganic base material provision process>
In the inorganic substrate providing step of the additional method for producing a polymer substrate-polymer substrate-inorganic substrate composite of the present disclosure, which includes disposing a composite on an inorganic substrate, an inorganic substrate is provided. For the inorganic substrate, the above description can be referred to.

Placement process
In the disposing step of the manufacturing method of the additional polymer substrate-polymer substrate-inorganic substrate composite of the present disclosure, which includes disposing a composite on an inorganic substrate, the additional polymer substrate-polymer substrate composite is disposed on the inorganic substrate such that the polymer substrate which is an inorganic particle polymer substrate or the additional polymer substrate which is an additional inorganic particle-containing polymer substrate faces the inorganic substrate.

For the manner in which the additional polymer substrate-polymer substrate composite is disposed on the inorganic substrate in the disposing step, the above description regarding the manufacturing method of the polymer substrate-inorganic substrate composite can be referred to. For example, the additional polymer substrate-polymer substrate composite can be disposed on the inorganic substrate directly or via an adhesive polymer layer.

In the positioning step, the additional polymer substrate or polymer substrate and the inorganic substrate of the additional polymer substrate-polymer substrate composite may be positioned so that they at least partially overlap each other, particularly so that they overlap each other, via their respective main surfaces. Alternatively, in the positioning step, the additional polymer substrate or polymer substrate and the inorganic substrate may be positioned so that the main surface of one of them substantially covers the main surface of the other.

<Thermocompression bonding process>
In one embodiment according to the present disclosure, the additional polymer substrate-polymer substrate-inorganic substrate composite obtained in the disposing step can be further subjected to a thermocompression treatment. The thermocompression treatment can further improve the adhesion between the additional polymer substrate-polymer substrate composite and the inorganic substrate composite. For the thermocompression treatment, the above description regarding the method for producing a polymer substrate-inorganic substrate composite can be referred to.

<Method for manufacturing gradient polymer substrate laminate>
The present disclosure includes a method for producing a polymer substrate laminate having at least three polymer substrates stacked together, in which the at least three polymer substrates are stacked together such that the content of inorganic particles in each of the polymer substrates increases or decreases stepwise along the stacking direction starting from the outermost layer of the laminate (hereinafter referred to as a "gradient type polymer substrate laminate"). The method for producing the polymer substrate laminate includes the following steps (a) and (b):
(a) selecting at least two materials from the group consisting of a polymer substrate not containing inorganic particles, a polymer substrate containing inorganic particles, and a composite composed of at least two polymer substrates (material selection step), wherein the at least two materials include a polymer substrate produced by the method according to the present disclosure, and/or a composite composed of at least two polymer substrates produced by the method according to the present disclosure, and the at least two materials include a total of at least three polymer substrates;
(b) Laminating at least two materials so that the content of inorganic particles increases or decreases stepwise along the lamination direction to obtain a polymer substrate laminate (lamination step).

Figure 19 shows a schematic diagram of one embodiment of a method for manufacturing a gradient polymer substrate laminate. In the method shown in Figure 19, polymer substrate-support substrate composites 222b, 222d, and 222e having a polymer substrate as a support substrate, which are manufactured by the method according to the present disclosure, are selected as at least two materials. These composites are composites composed of at least two polymer substrates manufactured by the method according to the present disclosure. In composite 222b, the content of inorganic particles in polymer substrate 170a is higher than that in polymer substrate 170b. In composite 222d, the content of inorganic particles in polymer substrate 170c is lower than that in polymer substrate 170b and higher than that in polymer substrate 170d. Composite 222e has polymer substrate 170e having a lower inorganic particle content than polymer substrate 170d, and inorganic particle-free polymer substrate 150.

In the method shown in FIG. 19, these selected materials are laminated so that the content of inorganic particles increases or decreases stepwise along the lamination direction to obtain polymer substrate laminate 470a'. Polymer substrate laminate 470a' has six polymer substrates 170a-170e and 150 that are laminated, and the six polymer substrates are laminated so that the content of inorganic particles in each of the polymer substrates that make up polymer substrate laminate 470a' increases or decreases stepwise along the lamination direction, starting from the outermost layer of the laminate.

This method allows for the relatively easy production of gradient-type polymer substrate laminates with excellent quality. In particular, when a composite having two polymer substrates obtained by the production method according to the present disclosure is used, a polymer substrate laminate with relatively high flatness at the interface between the polymer substrates can be obtained.

The gradient polymer substrate laminate obtained by the above method has physical properties that are useful for various applications. For example, in a gradient polymer substrate laminate having a large number of inorganic particle-containing polymer substrates, special effects can be added by changing the film structure, for example, the transmitted wavelength band can be expanded, contracted or limited, or the reflectance can be set to any value. Therefore, the gradient polymer substrate laminate according to the present disclosure is particularly useful as an optical component having excellent reflection and transmission properties.

Gradient Polymer-Based Laminates
The gradient type polymer substrate laminate has at least three polymer substrates laminated. The gradient type polymer substrate laminate may be composed of at least three inorganic particle-containing polymer substrates, or may be composed of at least two inorganic particle-containing polymer substrates and one inorganic particle-free polymer substrate. The above description can be referred to for the polymer substrate, inorganic particles, and polymer constituting the polymer substrate laminate. The at least three polymer substrates constituting the polymer substrate laminate preferably contain the same type of polymer.

The gradient polymer substrate laminate may preferably have 3 or more, 4 or more, 5 or more, 6 or more, 7 or more, or 8 or more polymer substrates, and/or 20 or less, 18 or less, 16 or less, 14 or less, 12 or less, or 10 or less polymer substrates.

In a gradient polymer substrate laminate, at least three polymer substrates are laminated so that the content of inorganic particles in each polymer substrate increases or decreases stepwise along the stacking direction, starting from the outermost layer of the laminate.

"The content of inorganic particles increases or decreases stepwise along the stacking direction" means that a gradient in the content of inorganic particles is formed along the stacking direction in the polymer substrate laminate. The stepwise increase or decrease in the content of inorganic particles may be formed between at least one pair of polymer substrates constituting the polymer substrate laminate. For example, in a polymer substrate laminate composed of six polymer substrates, the inorganic particle content in the five polymer substrates from the outermost layer may be the same, and the sixth polymer substrate may have a higher or lower inorganic particle content than the other five polymer substrates. Preferably, each of the polymer substrates constituting the polymer substrate laminate has a different inorganic particle content from the adjacent polymer substrates.

For the content of inorganic particles in the polymer substrate, the above description regarding the polymer substrate as a support substrate can be referred to. Each polymer substrate constituting the polymer substrate laminate may contain different types of inorganic particles, or may contain the same type of inorganic particles. Preferably, each polymer substrate constituting the polymer substrate laminate contains the same type of inorganic particles.

Preferably, the polymer substrate laminate is made of a polymer substrate and does not include a release substrate or an inorganic substrate. Such a polymer substrate laminate can be manufactured by using a polymer substrate and/or a composite of a polymer substrate as a material.

<Material selection process>
In the method of making a gradient polymeric substrate laminate according to the present disclosure, the material selection step comprises selecting at least two materials from the group consisting of:
Polymer substrates free of inorganic particles;
An inorganic particle-containing polymer substrate, and
A composite comprised of at least two polymeric substrates.

The at least two materials selected in the material selection process include a polymer substrate produced by the method of the present disclosure, and/or a composite composed of at least two polymer substrates produced by the method of the present disclosure, and include a total of at least three polymer substrates.

The "polymer substrate manufactured by the method according to the present disclosure" in the material selection process may be an inorganic particle-containing polymer substrate manufactured by the method according to the present disclosure. For the method of manufacturing the inorganic substrate-containing polymer substrate, please refer to the above description.

In the material selection step, the "composite composed of at least two polymer substrates produced by the method according to the present disclosure" is preferably composed of two to four, more preferably two to three, and particularly preferably two polymer substrates, and/or does not include any components other than the polymer substrate, particularly an inorganic substrate or a release substrate. Examples of the "composite composed of at least two polymer substrates produced by the method according to the present disclosure" include a polymer substrate-support substrate composite produced using a polymer substrate as a support substrate (see, for example, Figures 6A to 6C), a polymer substrate-support substrate composite produced using a composite having two polymer substrates as a support substrate (see, for example, Figure 7B), an additional polymer substrate-polymer substrate composite containing an inorganic particle-containing polymer substrate (see, for example, Figure 11), an additional polymer substrate-polymer substrate-support substrate composite having a polymer substrate or a composite having two polymer substrates as a support substrate (see, for example, Figures 14B and 15B), and an additional polymer substrate-polymer substrate composite (see, for example, Figure 17).

In the material selection process, when all polymer substrates contained in the entire selected material are considered, the inorganic particle content differs between at least any pair of polymer substrates. Preferably, when all polymer substrates contained in the entire selected material are considered, the inorganic particle content differs from each other in all polymer substrates. For example, in the example of FIG. 19, when all polymer substrates 170a to 170e and 150 contained in selected materials 222b, 222d, and 222e are considered, the inorganic particle content differs from each other in all polymer substrates.

In the material selection step, the materials are selected so that the resulting polymer substrate laminate has at least three polymer substrates. For example, only composites having three or four polymer substrates can be selected as materials, or composites having two polymer substrates and one polymer substrate can be selected as materials.

In addition, in the material selection process, the materials are selected so that the content of inorganic particles in the polymer substrate laminate obtained by stacking the materials increases or decreases stepwise along the stacking direction. For example, when a composite having three or four polymer substrates is selected as a material, the composite has a content of inorganic particles that increases or decreases stepwise along the stacking direction.

<Lamination process>
In the lamination step in the method for producing a gradient-type polymer substrate laminate according to the present disclosure, at least two materials are laminated so that the content of inorganic particles increases or decreases stepwise along the lamination direction to obtain a polymer substrate laminate.

For example, in the example shown in FIG. 19, the composite 222d is laminated on the polymer substrate 170b constituting the composite 222b, with the polymer substrate 170c having a lower inorganic particle content than the polymer substrate 170b facing the polymer substrate 170b. Then, in the laminate consisting of the obtained composites 222b and 222d, the composite 222e is laminated on the polymer substrate 170d, with the polymer substrate 170e having a lower inorganic particle content than the polymer substrate 170d facing the polymer substrate 170d. As a result, starting from the polymer substrate 170a constituting the outermost layer, a polymer substrate laminate 470a' is obtained in which the content of inorganic particles decreases stepwise along the lamination direction. In the polymer substrate laminate 470a', the content of inorganic particles increases stepwise along the lamination direction, starting from the polymer substrate 150 constituting the outermost layer.

<Thermocompression bonding process>
In one embodiment according to the present disclosure, the gradient-type polymer substrate laminate obtained in the lamination step can be further subjected to a thermocompression treatment. The thermocompression treatment can further improve the adhesion between the polymer substrates constituting the gradient-type polymer substrate laminate. For the thermocompression treatment, the above description regarding the method for producing a polymer substrate-inorganic substrate composite can be referred to.

<Method for producing alternating polymer substrate laminate>
The present disclosure includes a method for producing a polymer substrate laminate having at least one inorganic particle-containing polymer substrate and at least one inorganic particle-free polymer substrate, the polymer substrate laminate having a structure in which the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate are alternately laminated (hereinafter referred to as an "alternate type polymer substrate laminate"), the method including the following steps (a) and (b):
(a) selecting at least two materials from the group consisting of inorganic particle-free polymer substrates, inorganic particle-containing polymer substrates, and composites consisting of at least one inorganic particle-containing polymer substrate and at least one inorganic particle-free polymer substrate and having a structure in which the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate are alternately laminated (material selection step), wherein the at least two materials include a polymer substrate produced by the method according to the present disclosure or a composite produced by the method according to the present disclosure, and include at least three polymer substrates in total;
(b) Laminating at least two materials, with an inorganic particle-containing polymer substrate and an inorganic particle-free polymer substrate side-by-side, to produce a polymer substrate laminate (lamination step).

20 is a schematic diagram of another embodiment of the method for producing a polymer substrate laminate according to the present disclosure. In the method shown in FIG. 20, four composites 222a are selected as materials. These composites 222a as materials each have one inorganic particle-containing polymer substrate and one inorganic particle-free polymer substrate. The composites 222a may be, for example, a polymer substrate-support substrate composite having a polymer substrate as a support substrate produced by the method according to the present disclosure (see FIGS. 6A and 6B). In the method shown in FIG. 20, the four selected composites 222a are laminated so that the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate are adjacent to each other to produce a polymer substrate laminate 490a'. The obtained polymer substrate laminate 490a' has four inorganic particle-containing polymer substrates and four inorganic particle-free polymer substrates, and has a structure in which the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate are alternately laminated.

The above method allows for the relatively easy production of alternating polymer substrate laminates with excellent quality.

The alternating polymer substrate laminate obtained by the above method has physical properties useful for various applications. For example, in the alternating polymer substrate laminate according to the present disclosure in which inorganic particle-free polymer substrates and inorganic particle-containing polymer substrates are alternately laminated, substrates with different refractive indices are arranged alternately, so that a reflective film with a very high reflectance may be obtained as a whole laminate. In addition, in the polymer substrate laminate according to the present disclosure, which has a large number of polymer substrates, special effects can be added by changing the film structure, for example, the transmitted wavelength band may be expanded, reduced or limited, or the reflectance may be set to an arbitrary value. Therefore, the alternating polymer substrate laminate according to the present disclosure is particularly useful as an optical component having excellent reflection and transmission properties.

Alternating Polymer-Based Laminates
The alternating polymer substrate laminate has at least one inorganic particle-containing polymer substrate and at least one inorganic particle-free polymer substrate. The polymer substrate, inorganic particles, and polymer constituting the polymer substrate laminate can be referred to the above description. Each polymer substrate constituting the polymer substrate laminate is preferably composed of the same type of polymer.

The alternating polymer substrate laminate may preferably have 3 or more, 4 or more, 5 or more, 6 or more, 7 or more, or 8 or more polymer substrates, and/or 20 or less, 18 or less, 16 or less, 14 or less, 12 or less, or 10 or less polymer substrates. The alternating polymer substrate laminate preferably has the same number of inorganic particle-free polymer substrates and inorganic particle-containing polymer substrates.

<Material selection process>
In the method of making an alternating polymeric substrate laminate according to the present disclosure, the material selection step comprises selecting at least two materials from the group consisting of:
Polymer substrates free of inorganic particles;
A polymer substrate containing inorganic particles, and
A composite which is composed of at least one inorganic particle-containing polymer substrate and at least one inorganic particle-free polymer substrate, and has a structure in which the inorganic particle-containing polymer substrate and the inorganic particle-free polymer substrate are alternately laminated;

The at least two materials selected in the material selection process include a polymer substrate produced by the method of the present disclosure, or a composite produced by the method of the present disclosure.

The "polymer substrate manufactured by the method according to the present disclosure" in the material selection process may be an inorganic substrate-containing polymer substrate manufactured by the method according to the present disclosure as illustrated in FIG. 10B. The above description may be referred to for the method for manufacturing an inorganic substrate-containing polymer substrate.

The "composite produced by the method according to the present disclosure" in the material selection step is preferably composed of two to four polymer substrates, more preferably two or three polymer substrates, and particularly preferably two polymer substrates, and/or does not include any components other than the polymer substrate, particularly an inorganic substrate or a release substrate. Examples of the "composite produced by the method according to the present disclosure" include a polymer substrate-support substrate composite having a polymer substrate or a composite having two polymer substrates as a support substrate (see, for example, Figures 6A-B, 7A, 8A, and 8B), an additional polymer substrate-polymer substrate composite having an inorganic particle-containing polymer substrate and an inorganic particle-free polymer substrate (see, for example, Figure 11), an additional polymer substrate-polymer substrate-support substrate composite having a polymer substrate or a composite having two polymer substrates as a support substrate, and an additional polymer substrate-polymer substrate (see, for example, Figure 17). The above description can be referred to for the manufacturing method of these composites.

<Lamination process>
In the lamination step in the method for producing a gradient-type polymer substrate laminate according to the present disclosure, at least two materials are laminated so that an inorganic particle-containing polymer substrate and an inorganic particle-free polymer substrate are adjacent to each other to produce a polymer substrate laminate.

The lamination process will be described with reference to FIG. 20. For example, one of the four composites 222a as materials is arranged so that the inorganic particle-containing polymer substrate 170a contained in another composite 222a is in contact with the inorganic particle-free polymer substrate 150 of the other composite 222a, thereby producing a laminate precursor A having a total of four polymer substrates. Then, another composite 222a is similarly arranged on the inorganic particle-free polymer layer 150 constituting the outermost layer of the laminate precursor A, thereby producing a laminate precursor B having a total of six polymer substrates. Then, by repeating the same process, an alternating type polymer substrate laminate 490a' can be produced.

<Thermocompression bonding process>
In one embodiment according to the present disclosure, the alternating polymer substrate laminate obtained in the lamination step can be further subjected to a thermocompression treatment. The thermocompression treatment can further improve the adhesion between the polymer substrates constituting the alternating polymer substrate laminate. For the thermocompression treatment, the above description regarding the polymer substrate-inorganic substrate composite can be referred to.

<Production method of polymer substrate laminate-inorganic substrate composite having arrangement step>
The present disclosure includes a method for making a polymer substrate laminate-inorganic substrate composite, the method comprising:
Producing a polymer substrate laminate having at least three polymer substrates by the method according to the present disclosure (polymer substrate laminate production process);
Providing an inorganic substrate or a composite having a polymeric substrate and an inorganic substrate (Providing step); and disposing a polymeric substrate laminate on the inorganic substrate or on the polymeric substrate of the composite (Disposing step).

Figure 21 shows a schematic diagram of one embodiment of a method for producing a polymer substrate laminate-inorganic substrate composite 470a according to the present disclosure, which includes placing a polymer substrate laminate 470a' on an inorganic substrate 180. Figure 22 shows a schematic diagram of one embodiment of a method for producing a polymer substrate laminate-inorganic substrate composite 470a according to the present disclosure, which includes placing a polymer substrate laminate 470a'' on a polymer substrate 170b of a composite 430b having a polymer substrate and an inorganic substrate.

In the above-described method for producing a polymer substrate laminate-inorganic substrate composite according to the present disclosure, a polymer substrate laminate-inorganic substrate composite is produced using a polymer substrate laminate produced by the method according to the present disclosure, so that a polymer substrate laminate-inorganic substrate composite having excellent quality can be produced relatively easily. In addition, since the polymer substrate laminate-inorganic substrate composite produced by the method according to the present disclosure has the polymer substrate laminate according to the present disclosure, it is believed to be particularly useful in optical applications.

(Polymer Substrate Laminate-Inorganic Substrate Composite)
The polymer substrate laminate-inorganic substrate composite comprises an inorganic substrate and a polymer substrate laminate having at least three polymer substrates disposed on the inorganic substrate. The polymer substrate laminate having at least three polymer substrates may be the gradient type polymer substrate laminate described above or the alternating type polymer substrate laminate described above (see, for example, Figures 19 and 20). The polymer substrate laminate having at least three polymer substrates may also be a polymer substrate-support substrate composite using a composite having two polymer substrates as a support substrate (see, for example, Figures 7A and 7B), or an additional polymer substrate-polymer substrate-support substrate composite having a polymer substrate as a support substrate (see, for example, Figures 14B and 15B).

<Polymer substrate laminate manufacturing process>
In the polymer substrate laminate manufacturing step of the method for manufacturing a polymer substrate laminate-inorganic substrate composite according to the present disclosure, a polymer substrate laminate having at least three polymer substrates is manufactured by the method according to the present disclosure. For the polymer substrate laminate having at least three polymer substrates, the polymer substrate-support substrate composite using a composite having two polymer substrates as the support substrate, and the manufacturing method of an additional polymer substrate-polymer substrate-support substrate composite having a polymer substrate as the support substrate, reference can be made to the above descriptions.

<Provision process>
In the providing step of the method for producing a polymer substrate laminate-inorganic substrate composite according to the present disclosure, an inorganic substrate or a composite having a polymer substrate and an inorganic substrate is provided.

The "composite having a polymer substrate and an inorganic substrate" provided in the providing step may be a composite produced by the method according to the present disclosure. For example, the "composite having a polymer substrate and an inorganic substrate" may be a composite produced by disposing a polymer substrate produced by the production method according to the present disclosure or an additional polymer substrate-polymer substrate composite on an inorganic substrate (see, for example, Figures 12, 13, and 18), or may be a polymer substrate-support substrate composite produced by the method according to the present disclosure using an inorganic substrate as the support substrate (see, for example, Figure 9) or an additional polymer substrate-polymer substrate-support substrate composite (see, for example, Figure 16).

Placement process
In the disposing step of the method for producing a polymer substrate laminate-inorganic substrate composite according to the present disclosure, the polymer substrate laminate is disposed on the inorganic substrate or on the polymer substrate of the composite.

For the manner in which the polymer substrate laminate is disposed on the inorganic substrate in the disposing step, the above description regarding the manufacturing method of the polymer substrate-inorganic substrate composite can be referred to. For example, the polymer substrate laminate can be disposed on the inorganic substrate directly or via an adhesive polymer layer.

<Thermocompression bonding process>
In one embodiment according to the present disclosure, the polymer substrate laminate-inorganic substrate composite obtained in the disposing step can be further subjected to a thermocompression treatment. The thermocompression treatment can further improve the adhesion between the polymer substrate laminate and the inorganic substrate. For the thermocompression treatment, the above description regarding the method for producing a polymer substrate-inorganic substrate composite can be referred to.

<<Method for producing a polymer substrate laminate-inorganic substrate composite, comprising producing a polymer substrate laminate on an inorganic substrate>>
The present disclosure also includes a method for making a polymer substrate laminate-inorganic substrate composite, comprising:
providing an inorganic substrate or a composite having a polymer substrate and an inorganic substrate (providing step); and producing a polymer substrate laminate on the inorganic substrate or on the polymer substrate of the composite by the method according to the present disclosure (laminating step).

FIG. 23 shows a schematic diagram of another embodiment of a method for producing a polymer substrate laminate-inorganic substrate composite 470a according to the present disclosure, which includes producing a polymer substrate laminate on top of a polymer substrate 170b of a composite 430b having a polymer substrate and an inorganic substrate, using a polymer substrate 170c and a composite 332c having three polymer substrates as materials.

In the method for producing a polymer substrate laminate-inorganic substrate composite having a lamination process according to the present disclosure, a polymer substrate laminate-inorganic substrate composite is produced by producing a polymer substrate laminate on an inorganic substrate or the like by the method according to the present disclosure. Therefore, according to this method, a polymer substrate laminate-inorganic substrate composite having excellent quality can be produced relatively easily.

(Providing process)
For the providing step in the method for producing a polymer substrate laminate-inorganic substrate composite having a lamination step, the description in the above "Method for producing a polymer substrate laminate-inorganic substrate composite having an arrangement step" can be referred to.

(Lamination process)
In the lamination step in the method for producing a polymer substrate laminate-inorganic substrate composite having a lamination step, a polymer substrate laminate is produced on the inorganic substrate provided in the above-mentioned providing step, or on the polymer substrate in the composite provided in the above-mentioned providing step, according to the method according to the present disclosure. The produced polymer substrate laminate may be the above-mentioned gradient type polymer substrate laminate or the above-mentioned alternating type polymer substrate laminate. The above description can be referred to for the production method of these polymer substrate laminates.

(Thermocompression bonding process)
In one embodiment according to the present disclosure, the polymer substrate laminate-inorganic substrate composite obtained in the lamination step can be further subjected to a thermocompression treatment. The thermocompression treatment can further improve the adhesion between the polymer substrate laminate and the inorganic substrate. For the thermocompression treatment, the above description regarding the polymer substrate-inorganic substrate composite can be referred to.

<Polymer particles containing inorganic particles>
The present disclosure includes inorganic particle-containing polymer particles comprising:
a polymer; and inorganic particles selected from the group consisting of metals and semi-metals, oxides of metals and semi-metals, nitrides of metals and semi-metals, carbides of metals and semi-metals, carbon materials, and combinations thereof, the particles having a primary particle size of 1 nm to 500 nm and dispersed in the polymer.

The inorganic particle-containing polymer particles according to the present disclosure are particularly useful in producing the above-mentioned polymer particle layer-support substrate composite according to the present disclosure. By using the inorganic particle-containing polymer particles according to the present disclosure, a composite can be produced while reducing the amount of solvent used to dissolve the polymer, and therefore it is possible to avoid undesirable effects on the support substrate caused by the solvent used to dissolve the polymer. In particular, when the support substrate is a polymer substrate, it is possible to avoid dissolving the support substrate caused by the solvent used to dissolve the polymer.

For the inorganic particle-containing polymer particles according to the present disclosure, and the polymer and inorganic particles contained in the inorganic particle-containing polymer particles, the above description of the inorganic particle-containing polymer particles according to the manufacturing method of the present disclosure, and the polymer and inorganic particles contained in the inorganic particle-containing polymer particles, may be referred to.

<Coupling Agent>
The inorganic particle-containing polymer particles according to the present disclosure can further comprise a coupling agent.For the coupling agent that can be contained in the inorganic particle-containing polymer particles according to the present disclosure, the above description of the coupling agent that can be contained in the inorganic particle-containing polymer particles according to the manufacturing method of the present disclosure can be referred to.

<Dispersion body>
The present disclosure includes a dispersion comprising inorganic particle-free polymer particles and/or inorganic particle-containing polymer particles according to the present disclosure and a dispersion medium.

By using the dispersion according to the present disclosure, it is possible to easily obtain a uniform polymer particle layer, for example, when forming a film-like polymer particle layer on a support substrate.

It is also preferable to use a dispersion medium that does not easily dissolve the support substrate as the dispersion medium. In this case, undesirable effects on the support substrate can be further suppressed when polymer particles are deposited on the support substrate using the dispersion.

<Polymer particles, dispersion medium, dispersion body>
For the dispersion according to the present disclosure, and the polymer particles and dispersion medium contained in the dispersion, reference may be made to the above descriptions of the dispersion, polymer particles, and dispersion medium in the production method according to the present disclosure, respectively.

<Inorganic particle-containing polymer particle layer-polymer substrate composite>
The present disclosure includes a polymer particle layer-polymer substrate composite that is:
a polymeric substrate; and a layer of polymeric particles deposited on the polymeric substrate;
The polymer particle layer comprises inorganic particle-containing polymer particles according to the present disclosure.

A polymer particle layer-polymer substrate composite including an inorganic particle-containing polymer particle layer may have different physical properties compared to, for example, a substrate made of only a polymer, due to the presence of inorganic particles in the polymer particle layer. For example, the composite may have a refractive index different from that of a substrate made of only a polymer, and is therefore considered to be useful as an optical component, particularly an anti-reflection film, or a precursor material for the anti-reflection film.

Such a polymer particle layer-polymer substrate composite can be manufactured by the manufacturing method according to the present disclosure described above. For the polymer substrate, inorganic particle-containing polymer particle layer, and inorganic particle-containing polymer particles contained in the polymer particle layer-polymer substrate composite according to the present disclosure, the above description of the manufacturing method according to the present disclosure can be referenced.

The thickness of the inorganic particle-containing polymer particle layer may be 2 μm or more, 5 μm or more, 10 μm or more, or 20 μm or more, and may be 2000 μm or less, 1000 μm or less, 500 μm or less, 200 μm or less, or 100 μm or less.

<Coupling Agent>
In the polymer particle layer-polymer substrate composite according to the present disclosure, either or both of the polymer particle layer and the polymer substrate may further contain a coupling agent. For the coupling agent that may be contained in the polymer particles of the present disclosure, reference may be made to the above description of the coupling agent that may be contained in the polymer particles in the production method of the present disclosure.

<<Inorganic particle-free polymer particle layer-polymer substrate composite>>
The present disclosure also includes a polymer particle layer-polymer substrate composite that is:
a polymeric substrate; and a layer of polymeric particles deposited on the polymeric substrate;
The polymer particle layer is made of polymer particles that do not contain inorganic particles.

The polymer substrate constituting the polymer particle layer-polymer substrate composite is preferably a polymer substrate containing inorganic particles.

The inorganic particle-free polymer particle layer-polymer substrate composite having an inorganic particle-containing polymer substrate as the polymer substrate may have different physical properties, for example, compared to a substrate consisting of only a polymer, due to the presence of inorganic particles in the inorganic particle-containing polymer particle layer. For example, the composite may have a refractive index different from that of a substrate consisting of only a polymer, and is therefore considered to be useful as an optical component, particularly an anti-reflection film, or a precursor material for the anti-reflection film.

Such a polymer particle layer-polymer substrate composite can be manufactured by the manufacturing method according to the present disclosure described above. For the polymer substrate, inorganic particle-free polymer particle layer, and inorganic particle-free polymer particles contained in the polymer particle layer-polymer substrate composite according to the present disclosure, the description of the manufacturing method according to the present disclosure described above can be referenced.

<Coupling Agent>
In the inorganic particle-containing polymer particle layer-polymer substrate composite according to the present disclosure, either or both of the inorganic particle-containing polymer particle layer and the polymer substrate may further contain a coupling agent. For the coupling agent that may be contained in the polymer particles of the present disclosure, the above description of the coupling agent that may be contained in the polymer particles in the manufacturing method of the present disclosure can be referred to.

<<Additional polymer particle layer-polymer particle layer-polymer substrate composite>>
The present disclosure includes additional polymer particle layer-polymer particle layer-polymer substrate composites, including:
Polymer substrate,
a layer of polymer particles deposited on a polymer substrate;
An additional layer of polymer particles is deposited on the layer of polymer particles.

Preferably, at least one of the polymer substrate, the polymer particle layer, and the additional polymer particle layer contained in the additional polymer particle layer-polymer particle layer-polymer substrate composite contains inorganic particles.

In an additional polymer particle layer-polymer particle layer-support substrate composite including an inorganic particle-containing polymer particle layer, the refractive index can be adjusted by adjusting the difference in inorganic particle content between adjacent polymer particle layers, and therefore it is believed to be useful as an optical component.

The polymer substrate included in the additional polymer particle layer-polymer particle layer-polymer substrate composite may be a polymer substrate not containing inorganic particles, or a polymer substrate containing inorganic particles, or may be a composite having at least two polymer substrates. The polymer substrate and the composite having at least two polymer substrates may be obtained by the method according to the present disclosure described above.

The polymer particle layer and the additional polymer particle layer are each composed of inorganic particle-free polymer particles, inorganic particle-containing polymer particles, or a mixture of inorganic particle-free polymer particles and inorganic particle-containing polymer particles.

Such inorganic particle-free polymer particle layer-polymer substrate composites can be manufactured by the manufacturing method according to the present disclosure described above. For the polymer substrate, polymer particle layer, and additional polymer particle layer contained in the additional polymer particle layer-polymer particle layer-polymer substrate composite according to the present disclosure, the description of the manufacturing method according to the present disclosure described above can be referenced.

Additional polymer substrate-polymer substrate composite
The present disclosure includes additional polymer substrate-polymer substrate composites that are:
a polymer substrate and an additional polymer substrate;
At least one of the polymer substrate and the additional polymer substrate comprises inorganic particles;
The polymer substrate and the additional polymer substrate are disposed at least partially on top of each other, and an interface between the polymer substrate and the additional polymer substrate is flat.

The additional polymer substrate-polymer substrate composite according to the present disclosure can be used as an optical component, and in particular can be used as an anti-reflection film. In particular, a polymer substrate-polymer substrate composite having an inorganic particle-containing polymer substrate has reduced interfacial roughness at the interface between the polymer substrate and the inorganic particle-containing polymer layer, which suppresses light scattering and is believed to be particularly useful as an optical component, in particular an anti-reflection film.

The additional polymer substrate-polymer substrate composite according to the present disclosure has a polymer substrate and an additional polymer substrate, and at least one of the polymer substrate and the additional polymer substrate has inorganic particles, and preferably the polymer substrate and the additional polymer substrate have inorganic particles. In particular, in the additional polymer substrate-polymer substrate composite according to the present disclosure, at least one of the polymer substrate and the additional polymer substrate is an inorganic particle-containing polymer substrate, and particularly preferably the polymer substrate and the additional polymer substrate are inorganic particle-containing polymer substrates. The additional polymer substrate-polymer substrate composite according to the present disclosure may have an inorganic particle-free polymer substrate as the polymer substrate or the additional polymer substrate. When both the polymer substrate and the additional polymer substrate are inorganic particle-containing polymer substrates, the inorganic particle content in each substrate may be different from each other.

The additional polymer substrate-polymer substrate composite according to the present disclosure may be an additional polymer substrate-polymer substrate composite produced by the manufacturing method according to the present disclosure, for example, a polymer substrate-support substrate composite produced by the method according to the present disclosure using a polymer substrate as the support substrate.

For the polymer substrate, inorganic particles, and polymer that constitute the additional polymer substrate-polymer substrate composite according to the present disclosure, as well as the inorganic particle-containing polymer substrate and inorganic particle-free polymer substrate, the above description of the manufacturing method according to the present disclosure can be referenced.

In the additional polymer substrate-polymer substrate composite according to the present disclosure, at least one of the polymer substrate and the additional polymer substrate may be in the form of a membrane or film, or the polymer substrate and the additional polymer substrate may be in the form of a membrane or film.

In the additional polymer substrate-polymer substrate composite according to the present disclosure, the thickness of the polymer substrate and the additional polymer substrate may be 0.5 μm or more, 1 μm or more, 2 μm or more, or 5 μm or more, and may be 2000 μm or less, 1000 μm or less, 500 μm or less, 200 μm or less, or 100 μm or less.

<Coupling Agent>
In the additional polymer substrate-polymer substrate composite according to the present disclosure, at least one of the polymer substrate and the additional polymer substrate may further contain a coupling agent. For the coupling agent that may be contained in at least one of the polymer substrate and the additional polymer substrate, reference may be made to the above description of the coupling agent that may be contained in the polymer particles in the production method of the present disclosure.

In the additional polymer substrate-polymer substrate composite according to the present disclosure, at least one of the polymer substrate and the additional polymer substrate may further contain a coupling agent, which may further improve the adhesion between the additional polymer substrate and the polymer substrate.

In the additional polymer substrate-polymer substrate composite of the present disclosure, the polymer substrate and the additional polymer substrate are arranged to at least partially overlap each other.

In the above-mentioned additional polymer substrate-polymer substrate composite, the polymer substrate and the additional polymer substrate may at least partially overlap each other via their respective main surfaces. Alternatively, in the above-mentioned additional polymer substrate-polymer substrate composite, the polymer substrate and the additional polymer substrate may have one main surface substantially covering the other main surface. Alternatively, the above-mentioned additional polymer substrate-polymer substrate composite may have a polymer substrate and an additional polymer substrate laminated to the polymer substrate.

<Flatness>
In the additional polymer substrate-polymer substrate composite according to the present disclosure, the interface between the polymer substrate and the additional polymer substrate is flat. The interface being flat means that the roughness of the interface (interface roughness) is reduced. In the additional polymer substrate-polymer substrate composite according to the present disclosure, the interface roughness at the interface between the polymer substrate and the additional polymer substrate is reduced, and preferably, the "interface roughness s" calculated by the following method is 0.01 μm or more, 0.1 μm or more, 0.2 μm or more, 0.5 μm or more, 0.8 μm or more, 1.0 μm or more, or 1.2 μm or more, and is 2.5 μm or less, 2.0 μm or less, or 1.7 μm or less.

A method for evaluating the "interface roughness s" at the interface between polymer substrate (P1) and polymer substrate (P2) that are arranged to at least partially overlap each other will be described with reference to Figure 26B. Figure 26B shows an SEM image of a cross section of a polymer substrate-support substrate composite having a polymer substrate as a support substrate according to Example 1, and a method for evaluating flatness.

The "interface roughness s" at the interface between the polymer substrate P1 and the polymer substrate P2, which are arranged at least partially overlapping each other, can be evaluated by the following method:
In an SEM image of a cross section of the composite obtained by a scanning electron microscope (SEM), 25 line segments are drawn at regular intervals along the surface direction of the polymer substrate P2, extending in the thickness direction from an interface A between the polymer substrate P2 and the surrounding atmosphere (air or the like) (or a surface A of the polymer substrate P2 opposite to the polymer substrate P1) to an interface B between the polymer substrate P2 and the polymer substrate P1;
Among the 25 line segments, a line segment whose end at the interface B on the polymer substrate P1 side is located closest to the ambient atmosphere (whose end at the interface B on the polymer substrate P1 side is located farthest from the polymer substrate P1) is identified;
Draw a straight line (reference line) that is tangent to the end of the line segment at the interface B on the polymer substrate P1 side and perpendicular to the line segment;
For each of the 25 line segments, measure the length from the intersection with the reference line to the end at the interface on the polymer substrate side;
The standard deviation of the measured length is calculated, and the calculated standard deviation is set as the roughness s of the interface.

<Polymer-based laminate>
The present disclosure includes a polymeric substrate laminate that is:
It contains at least three polymeric substrates that are stacked together, and at least one of the interfaces of adjacent polymeric substrates is flat.

The polymer substrate laminate according to the present disclosure can be used as an optical component, and in particular can be used as an anti-reflection film. In particular, in the polymer substrate laminate according to the present disclosure, the interface roughness of at least one of the interfaces of adjacent polymer substrates is reduced, so that light scattering is suppressed, and it is considered to be particularly useful as an optical component, in particular an anti-reflection film.

The polymer substrate laminate according to the present disclosure contains at least three polymer substrates. The at least three polymer substrates may be composed of inorganic particle-containing polymer substrates and/or inorganic particle-free polymer substrates. Preferably, the polymer substrate laminate may be an alternating type polymer substrate laminate or a gradient type polymer substrate laminate.

In the polymer substrate laminate according to the present disclosure, at least three polymer substrates are laminated. Preferably, the at least three polymer substrates are in contact with the main surface of the polymer substrate constituting the lower layer via their main surfaces. More preferably, the at least three polymer substrates are each substantially covering, with their main surfaces, the main surface of the polymer substrate constituting the lower layer.

In the polymer substrate laminate according to the present disclosure, at least one of the interfaces of adjacent polymer substrates is flat. The above description can be referred to for the flatness of the interface and the interface roughness s as an index for evaluating the flatness of the interface.

In one embodiment of the polymer substrate laminate according to the present disclosure, the inorganic particle contents of at least three polymer substrates constituting the polymer substrate laminate are different from each other, and in particular, the inorganic particle contents of at least three inorganic particle-containing polymer substrates constituting the polymer substrate laminate are different from each other. In this embodiment, the polymer substrate laminate may have a polymer substrate not containing inorganic particles in addition to a plurality of inorganic particle-containing polymer substrates having different inorganic particle contents from each other.

Gradient Polymer-Based Laminates
In another embodiment of the polymer substrate laminate according to the present disclosure, the polymer substrates are laminated such that the content of inorganic particles in at least three polymer substrates constituting the polymer substrate laminate increases or decreases stepwise along the lamination direction, and in particular, the polymer substrates are laminated such that the content of inorganic particles in at least three inorganic particle-containing polymer substrates constituting the polymer substrate laminate increases or decreases stepwise along the lamination direction. For such a polymer substrate laminate, the above description of the method for producing a gradient type polymer substrate laminate can be referred to.

In this embodiment, the polymer substrate laminate may have a polymer substrate that does not contain inorganic particles in addition to a plurality of inorganic particle-containing polymer substrates having different inorganic particle contents.

Gradient-type polymer substrate laminates have physical properties that are useful for a variety of applications. For example, in a gradient-type polymer substrate laminate having a large number of inorganic particle-containing polymer substrates, special effects can be added by changing the film structure, such as expanding, contracting or limiting the transmitted wavelength band, or setting the reflectance to an arbitrary value. Therefore, the gradient-type polymer substrate laminate according to the present disclosure is considered to be useful as an optical component having excellent reflection and transmission properties.

Alternating Polymer-Based Laminates
In yet another embodiment of the polymer substrate laminate according to the present disclosure, the polymer substrate laminate has at least one inorganic particle-free polymer substrate and at least one inorganic particle-containing polymer substrate, and has a structure in which the inorganic particle-free polymer substrate and the inorganic particle-containing polymer substrate are alternately laminated. For such a polymer substrate laminate, the above description of the method for producing an alternating type polymer substrate laminate can be referred to.

The alternating polymer substrate laminate has physical properties that are useful for various applications. For example, in the alternating polymer substrate laminate according to the present disclosure, in which inorganic particle-free polymer substrates and inorganic particle-containing polymer substrates are alternately laminated, substrates with significantly different refractive indices are arranged alternately, so that the entire laminate may be able to obtain a reflective film with a very high reflectance. In addition, in a polymer substrate laminate having a large number of polymer substrates, special effects can be added by changing the film structure, for example, the transmitted wavelength band may be expanded, reduced, or limited, or the reflectance may be set to an arbitrary value. Therefore, the gradient polymer substrate laminate according to the present disclosure is considered to be useful as an optical component with excellent reflection and transmission properties.

The polymer substrate laminate according to the present disclosure can be manufactured by the manufacturing method for the polymer substrate laminate according to the present disclosure described above.

<Silicon particle-containing cycloolefin polymer component>
The present disclosure includes a membrane- or film-like member containing a cycloolefin polymer and silicon particles having a primary particle size of 1 nm to 500 nm.

The silicon particle-containing cycloolefin polymer member has physical properties different from, for example, a polymer member consisting only of a cycloolefin polymer due to the inclusion of silicon particles. In particular, the silicon particle-containing cycloolefin polymer member can have an intermediate value in terms of refractive index between the silicon substrate and the cycloolefin polymer, and is therefore useful, for example, in optical applications. Specifically, for example, the silicon particle-containing cycloolefin polymer member can be used to reduce problems caused by the difference in refractive index between the silicon substrate and the cycloolefin polymer, such as an increase in reflectance.

Furthermore, the silicon particle-containing cycloolefin polymer member contains silicon particles with a primary particle size of 1 nm to 500 nm, which provides advantageous effects in optical applications, and in particular provides excellent anti-reflection effects. In addition, the member is in the form of a membrane or film, which makes it particularly suitable for use as an anti-reflection film.

The invention disclosed herein will now be described in more detail with reference to examples.

In the following Examples 1-2 and Comparative Examples 1-2, a cycloolefin polymer (COP; Zeon Corporation, Zeonex (trademark) 480R, glass transition temperature 138°C) was used as the polymer.

In the following Examples 1-2 and Comparative Examples 1-2, silicon particles were used as the inorganic particles. The silicon as the inorganic particles was produced by laser pyrolysis. The metal impurity contents of the obtained silicon particles were measured using an inductively coupled plasma mass spectrometer (ICP-MS), and the Fe content was 15 ppb, the Cu content was 18 ppb, the Ni content was 10 ppb, the Cr content was 21 ppb, the Co content was 13 ppb, the Na content was 20 ppb, and the Ca content was 10 ppb. The average primary particle size of the inorganic particles was 100 nm.

Example 1
(Production of polymer particles containing inorganic particles)
(Preparation of inorganic particle-dispersed polymer solution)
35.5 parts by mass of silicon particles as inorganic particles, 64.5 parts by mass of cycloolefin polymer as polymer, and 826 parts by mass of toluene as polymer solvent were mixed and dispersed using a homogenizer (T25, manufactured by IKA) at a rotation speed of 20,000 rpm to obtain an inorganic particle-dispersed polymer solution.

The inorganic particle-dispersed polymer solution was dried and granulated using a spray dryer (Okawahara Chemical Engineering, CNL-3) to obtain inorganic particle-containing polymer particles. The resulting inorganic particle-containing polymer particles had an equivalent circle diameter of 2.0 μm. The equivalent circle diameter was determined by calculating the average diameter of 100 randomly selected particles in an observation image obtained using a scanning electron microscope (Hitachi High-Tech, TM3000).

Figure 24 shows an optical microscope image of the inorganic particle-containing polymer particles of Example 1 obtained by the spray drying method.

Preparation of Dispersion
A dispersion medium was obtained by mixing 70 parts by mass of ethylene glycol (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) and 30 parts by mass of terpineol (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) 65 parts by mass of this dispersion medium and 35 parts by mass of the inorganic particle-containing polymer particles were mixed and dispersed at a rotation speed of 20,000 rpm using a homogenizer (manufactured by IKA, T20) to obtain a dispersion in which the inorganic particle-containing polymer particles are dispersed in the dispersion medium (the dispersion of Example 1).

Preparation of a polymer substrate supported on a release substrate
A dope in which a cycloolefin as a polymer was dissolved in toluene at a concentration of 35% by weight was applied onto a glass plate by a doctor blade, and the dope was heated in an electric furnace at 100° C. for 10 minutes to remove the solvent, thereby obtaining a polymer substrate as a supporting substrate held on the glass plate as a substrate for peeling. The thickness of the polymer substrate was 30 μm.

<Production of Polymer Particle Layer-Support Substrate Composite>
The above-mentioned dispersion in which the inorganic particle-containing polymer particles are dispersed in a dispersion medium was applied to the above-mentioned polymer substrate as a support substrate by a doctor blade, and the dispersion medium was removed by heating in an electric furnace at 170°C for 15 minutes to obtain a composite of an inorganic particle-containing polymer particle layer-support substrate composite and a peeling substrate. The polymer particle layer-support substrate composite was then peeled off from the glass plate as the peeling substrate to obtain a polymer particle layer-support substrate composite according to Example 1. The polymer particle layer-support substrate composite according to Example 1 had an inorganic particle-containing polymer particle layer as the polymer particle layer, and had an inorganic particle-free polymer substrate as the support substrate. The thickness of the polymer particle layer of the polymer particle layer-support substrate composite according to Example 1 was 52 μm.

<Production of polymer substrate-support substrate composite>
The obtained polymer particle layer-support substrate composite according to Example 1 was heat-pressed for 1 hour under conditions of 130°C and 50 MPa using a vacuum hot press device (Kitagawa Seiki Co., Ltd., VH1-2294), to obtain a polymer substrate-support substrate composite according to Example 1. The polymer substrate-support substrate composite according to Example 1 had an inorganic particle-containing polymer substrate as the polymer substrate, and had an inorganic particle-free polymer substrate as the support substrate. The thickness of the inorganic particle-containing polymer substrate was 22 µm.

No surface cracks were observed in the polymer substrate-support substrate composite of Example 1, and the composite had good integrity.

<Flatness evaluation>
The flatness (interface roughness) of the interface between the inorganic particle-free polymer substrate as the supporting substrate and the inorganic particle-containing polymer substrate as the polymer substrate was examined for the polymer substrate-supporting substrate composite according to Example 1. The polymer substrate-supporting substrate composite according to Example 1 was cut with a cutter knife, and a cross-sectional image of the composite was obtained with a scanning electron microscope (SEM). From the obtained SEM image, the interface roughness s was calculated according to the following procedure:
(1) 25 line segments were drawn at regular intervals along the surface direction of the polymer substrate, extending in the thickness direction from the polymer substrate-ambient atmosphere (air) interface to the polymer substrate-support substrate interface.
(2) Of the 25 line segments, the line segment whose end at the interface on the supporting substrate side is located closest to the ambient atmosphere was identified.
(3) A straight line (reference line) was drawn that was tangent to the end of the line segment thus identified at the interface on the supporting substrate side and perpendicular to the line segment.
(4) For each of the 25 line segments, the length from the intersection with the reference line to the end at the interface on the supporting substrate side was measured, and the standard deviation of the measured lengths was calculated. This standard deviation was defined as the roughness s of the interface.

The interface roughness s of the polymer substrate-support substrate composite of Example 1 was 1.54 μm. Figure 26B shows an SEM image of the cross section of the polymer substrate-support substrate composite of Example 1, and the process of calculating the interface roughness. The evaluation results for Example 1 are summarized in Table 1 below.

Example 2
Inorganic particle-containing polymer particles according to Example 2 were produced as follows:
A dispersion obtained by mixing 10 parts by mass of toluene with 1 part by mass of the inorganic particle-dispersed polymer solution prepared by the method described in Example 1 was dropped into 90 parts by mass of 2-propanol while stirring the 2-propanol, and the polymer was coagulated in the 2-propanol to obtain a solid content. The obtained solid content was precipitated using a centrifuge (CR20GIII, manufactured by Hitachi High-Technologies Corporation), and the precipitate was dried in a vacuum oven to obtain inorganic particle-containing polymer particles according to Example 2.

Figure 25 shows an SEM image of the inorganic particle-containing polymer particles of Example 2 produced by the reprecipitation method.

Comparative Example 1
A dope in which cycloolefin was dissolved in toluene as a solvent at a concentration of 35% by weight was applied onto a glass plate, and the dope was heated in an electric furnace at 100° C. for 10 minutes, and the solvent was removed to obtain a polymer substrate as a support substrate on the glass plate. The thickness of the polymer substrate was 30 μm.

Furthermore, when the inorganic particle-dispersed polymer solution prepared by the method described in Example 1 was applied to the polymer substrate as the above-mentioned support substrate and dried, cracks occurred in the polymer substrate. The evaluation results for Comparative Example 1 are summarized in Table 1 below.

Comparative Example 2
A dope in which cycloolefin was dissolved in toluene at a concentration of 35% by weight was applied onto a glass substrate, and the dope was heated in an electric furnace at 100° C. for 10 minutes, and the solvent was removed to obtain a polymer substrate as a support substrate on the glass substrate. The thickness of the polymer substrate was 30 μm.

Furthermore, 1 part by mass of the inorganic particle-dispersed polymer solution prepared by the method described in Example 1 was mixed with 9 parts by mass of toluene to obtain a liquid, which was spray-coated onto the polymer substrate as the support substrate, and the solvent was removed by heating in an electric furnace at 100°C for 10 minutes to obtain a polymer substrate precursor-support substrate composite according to Comparative Example 2.

Then, the polymer substrate precursor-support substrate composite of Comparative Example 2 was heat-pressed for 1 hour at 130°C and 50 MPa using a vacuum heat press device (Kitagawa Seiki, VH1-2294) to obtain a polymer substrate-support substrate composite of Comparative Example 2. The polymer substrate-support substrate composite of Comparative Example 2 had an inorganic particle-containing polymer substrate as the polymer substrate, and an inorganic particle-free polymer substrate as the support substrate. No surface cracks were observed in the polymer substrate-support substrate composite of Comparative Example 2, and it had good integrity.

When the interface roughness between the polymer substrate and the support substrate of the polymer substrate-support substrate composite of Comparative Example 2 was evaluated in the same manner as in Example 1, the interface roughness s was found to be 2.81 μm. Figure 26A shows an SEM image of the cross section of the polymer substrate-support substrate composite of Comparative Example 2, and the process of calculating the interface roughness. The evaluation results for Comparative Example 2 are summarized in Table 1 below.

As can be seen in Table 1, the polymer substrate-support substrate composite of Example 1, which was produced by a method involving deposition of polymer particles and heat pressing of the polymer particle layer, had better integrity than the polymer substrate-support substrate composite of Comparative Example 1, which had a polymer substrate produced by a method involving a coating process.

The manufacturing method according to Comparative Example 1 includes a step (coating step) of coating the polymer substrate as a supporting substrate with an inorganic particle-dispersed polymer solution containing toluene, which is a solvent for dissolving the polymer, and therefore it is believed that the supporting substrate is undesirably affected and that, as a result, a composite having good integrity cannot be obtained. In contrast, the manufacturing method according to Example 1 does not use toluene, which is a solvent for dissolving the polymer, when depositing the polymer particles on the polymer substrate as a supporting substrate, but uses ethylene glycol, which is a non-solvent for the polymer, as a dispersing medium for the polymer particles, so that damage to the supporting substrate can be suppressed and, as a result, a composite having good integrity can be obtained.

Furthermore, as can be seen in Table 1, the polymer substrate-support substrate composite of Example 1, which was produced by a method involving deposition of polymer particles and heat pressing of the polymer particle layer, had a higher flatness at the interface between the polymer substrate and the support substrate (interface roughness was reduced) compared to the polymer substrate-support substrate composite of Comparative Example 2, which had a polymer substrate produced by a method involving a spraying process.

The method according to Comparative Example 2 includes a step (spraying step) of spraying a solution containing toluene, which is a solvent for dissolving polymers, onto the polymer substrate, which is the supporting substrate. This is thought to have caused the surface of the supporting substrate to be partially dissolved by toluene, resulting in a relatively rough interface between the polymer substrate and the supporting substrate in the composite. In contrast, the manufacturing method according to Example 1 does not use toluene, which is a solvent for dissolving polymers, when depositing polymer particles on the polymer substrate as the supporting substrate, but uses ethylene glycol, which is a non-solvent for polymers, as a dispersing medium for the polymer particles. This makes it possible to suppress dissolution of the polymer substrate as the supporting substrate, and as a result, it is thought to have improved the flatness of the interface between the polymer substrate and the supporting substrate in the composite.

100 Support substrate 12 Polymer 13 Inorganic particles 14 Polymer particles containing inorganic particles 15 Polymer particles not containing inorganic particles 150 Polymer substrate not containing inorganic particles 160, 160a, 160b, 160c, 160d Polymer particle layer 170a, 170a', 170b, 170c, 170d, 170e Polymer substrate containing inorganic particles 180 Inorganic substrate 190 Substrate for release 210a, 210b Polymer particle layer-support substrate composite 212a, 213a, 213b, 214b Polymer particle layer-support substrate composite having a polymer substrate as a support substrate 214a Additional polymer particle layer-polymer particle layer-support substrate composite having a substrate for release as a support substrate 216a Composite of polymer particle layer-support substrate composite having a polymer substrate as a support substrate and substrate for release 216b, 216c Polymer particle layer-support substrate composite having a release substrate as a support substrate 220a Polymer substrate-support substrate composite 222a, 222b, 222d, 222e Polymer substrate-support substrate composite having a polymer substrate as a support substrate 222a' Additional polymer substrate-polymer substrate composite 226a Composite of a polymer substrate-support substrate composite having a polymer substrate as a support substrate and a release substrate 226b, 226c Polymer substrate-support substrate composite having a release substrate as a support substrate 223a Additional polymer substrate-polymer substrate-support substrate composite having a release substrate as a support substrate 312b Additional polymer particle layer-polymer particle layer-support substrate composite having a polymer substrate as a support substrate 322a, 322b Polymer particle layer-support substrate composite having a composite having two polymer substrates as a support substrate 332a, 332b, 332c Polymer substrate-support substrate composite having two polymer substrates as a support substrate 420a Polymer substrate-support substrate composite having inorganic substrate as support substrate 421a Polymer particle layer-support substrate composite having inorganic substrate as support substrate 422a Additional polymer particle layer-polymer particle layer-support substrate composite having composite having two polymer substrates as support substrate 430a, 430a'' Additional polymer substrate-polymer substrate-inorganic substrate composite 430a' Additional polymer substrate-polymer substrate-support substrate composite 431a Additional polymer particle layer-polymer particle layer-support substrate composite having inorganic substrate as support substrate 430b Additional polymer substrate-polymer substrate-support substrate composite having inorganic substrate as support substrate 442a Additional polymer substrate-polymer substrate-support substrate composite having composite having two polymer substrates as support substrate 470a', 470a'' Gradient type polymer substrate laminate 490a' Alternating type polymer substrate laminate 470a Polymer substrate laminate-inorganic substrate composite 22, 22', 22'' Dispersion 24 Dispersion medium 29 Doctor Blade

Claims (10)

The inorganic particle-containing polymer particles are used by dispersing them in a dispersion medium,
Polymers, and
Inorganic particles having an average primary particle size, measured as an average equivalent circle diameter, of 1 nm to 500 nm and dispersed in the polymer;
Including ,
The inorganic particles are silicon particles , and
The polymer is an olefin polymer .
Polymer particles containing inorganic particles. 2. The inorganic particle-containing polymer particles according to claim 1, which are dispersed in a dispersion medium to form a dispersion, which is then coated on a supporting substrate and dried to obtain a polymer particle layer-supporting substrate composite. The inorganic particle-containing polymer particles according to claim 2 , wherein the supporting substrate is an inorganic substrate. The inorganic particle-containing polymer particle according to any one of claims 1 to 3 , wherein the polymer is a cycloolefin polymer. The inorganic particle-containing polymer particle according to any one of claims 1 to 4 , further comprising a coupling agent. The inorganic particle-containing polymer particles according to any one of claims 1 to 5 , having an average particle size measured as an average equivalent circle diameter of 0.5 µm to 100 µm. A dispersion comprising the inorganic particle-containing polymer particles according to any one of claims 1 to 6, and a dispersion medium. 8. The dispersion of claim 7 , wherein the dispersion medium comprises at least one of 2-propanol, ethylene glycol, and terpineol. a polymeric substrate; and a layer of polymeric particles deposited on the polymeric substrate;
The polymer particle layer comprises the inorganic particle-containing polymer particles according to claim 1 or 2 .
Polymer particle layer-polymer substrate composite. 10. The composite of claim 9 , wherein the polymer substrate and/ or the polymer particle layer comprises inorganic particles.

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