JP7642125B2 - Semiconductor coolers and beauty or physical therapy equipment - Google Patents

Description

This application relates to the technical field of semiconductor cooling, and in particular to semiconductor coolers and cosmetic or physical therapy devices.

Semiconductor coolers are also called thermoelectric coolers (TECs), heat pumps or Peltier coolers. They use two unique semiconductors, p and n types, where p and n type semiconductor particles are thermally arranged in parallel with each other and electrically connected in series to form a semiconductor electric dipole layer, one side of which is connected to a cooling substrate to form a low temperature surface, and the other side is connected to a heat conducting substrate to form a high temperature surface. When a direct current flows through the semiconductor node, a temperature difference is generated, and the low temperature surface absorbs heat, which is then transferred to the high temperature surface by the semiconductor electric dipole particles.

At present, some beauty devices use the low temperature surface of a semiconductor cooler as the end surface that contacts the skin (i.e., the beauty work surface), or cool the end surface and put the end surface into contact with the skin, and the cooled end surface provided by the semiconductor cooler provides an icing effect on the skin that is in contact. In beauty devices according to the prior art, all semiconductor coolers need to detect the temperature by attaching an external NTC (temperature sensor) to the conductive member, and the temperature sensor receives the temperature data and then transmits it to the control circuit board to control the temperature range of the conductive member. Some beauty devices need to accurately control the temperature, for example, to control the temperature within a certain range for skin/collagen regeneration/skin firmness, etc., but the method of attaching an external NTC (temperature sensor) detects the temperature of the conductive member, so the temperature of the low temperature surface/high temperature surface/beauty work surface cannot be accurately controlled. Therefore, this method is disadvantageous to the spatial layout and assembly of the product, and costs are wasted due to the relatively large space and difficulty in assembly, the NTC is easily damaged during adhesion or pressure attachment, and the temperature difference is relatively large due to the instability of assembly.

The objective of this application is to provide a semiconductor cooler that overcomes the temperature regulation and structural shortcomings caused by external NTCs when using conventional semiconductor coolers in beauty products.

To solve the above technical problems, the present application provides a semiconductor cooler that includes a semiconductor electric dipole layer, a low temperature surface and a high temperature surface at both ends thereof, and a built-in temperature sensor module. The temperature sensor module is used to detect the temperature of the high temperature surface or the low temperature surface and transmit the temperature data to a main control unit, and the main control unit controls the power supply of the semiconductor cooler based on the received temperature data.

In some embodiments, the temperature sensor module includes positive and negative electrodes, the semiconductor cooler includes positive and negative electrodes, the positive and negative electrodes are connected to a main control unit or a control circuit board on which the main control unit is provided by an H-bridge driver, and the temperature sensor module transmits temperature data by being electrically connected or communicatively connected to the main control unit or the control circuit board on which the main control unit is provided.

In some embodiments, the temperature sensor module is provided in intimate contact with the inner surface of the hot or cold surface.

In some embodiments, the shapes of the cold surface and the hot surface are consistent with each other, the p-type and n-type semiconductor particles of the semiconductor electric dipole layer are laid flat on the inner surfaces of the cold surface and the hot surface, the semiconductor cooler forms full-surface cooling over the entire cold surface or forms full-surface heating over the entire hot surface, and the semiconductor electric dipole layer and the temperature sensor module are located between the cold surface and the hot surface.

In some embodiments, a through hole is formed on one side of the semiconductor cooler, or the low temperature surface and/or the high temperature surface of the semiconductor cooler is a transparent substrate, the p-type and n-type semiconductor electric dipole particles of the semiconductor electric dipole layer are provided inside one side of the semiconductor cooler, and the p-type and n-type semiconductor electric dipole particles are not provided inside the other side of the semiconductor cooler, forming a blank area, and a light-emitting area is formed corresponding to the blank area, i.e., the low temperature surface and the high temperature surface are transparent substrates and form a light-emitting area, or one of the low temperature surface or the high temperature surface is a transparent substrate and the other forms a through hole corresponding to the other, and the low temperature surface and the high temperature surface engage with each other to form a light-emitting area.

In some embodiments, the p-type and n-type semiconductor electric dipole particles of the semiconductor electric dipole layer are arranged as annular bands, and a blank area is formed in the central internal region without the p-type and n-type semiconductor electric dipole particles, and the cold surface and/or the hot surface are provided as through holes corresponding to the central internal region of the semiconductor electric dipole layer, or one of the cold surface and/or the hot surface forms a through hole corresponding to the other being a transparent substrate, and the cold surface and the hot surface engage with each other to form a light emitting region.

In some embodiments, the cold surface and the hot surface are thermally conductive material substrates, and the thermally conductive material substrates are ceramic material substrates, aluminum substrates, copper substrates, or transparent crystal substrates.

The present application further provides a cosmetic or physical therapy device in which the end surface of the head portion forms a working surface, and the working surface comes into contact with the skin to perform cosmetic or physical therapy treatment, and the cosmetic or physical therapy device is characterized in that a semiconductor cooler described in any of the above embodiments is attached inside the cosmetic or physical therapy device, and the low temperature surface of the semiconductor cooler is used as the working surface, or the low temperature surface of the semiconductor cooler is attached to the inside of the working surface to cool the working surface, or the low temperature surface of the semiconductor cooler and the working surface are connected by a cooling conductive member in a high-speed cooling conduction manner to cool the working surface.

In some embodiments, the cosmetic or physical therapy device includes a housing, a light source assembly, a power supply assembly, a control circuit board, and a heat dissipation assembly mounted within the housing, the positive and negative electrodes of the semiconductor cooler and the built-in temperature sensor module are electrically connected to the control circuit board, a main control unit is provided on the control circuit board, and the heat dissipation assembly is used to dissipate heat from a hot surface of the semiconductor cooler.

In some embodiments, the heat dissipation assembly includes a fan, the fan includes a thermally conductive case, the hot surface of the semiconductor cooler and the thermally conductive case are thermally conductively connected, or the thermally conductive case serves directly as the hot surface of the semiconductor cooler, a thermal terminal circuit is provided on the outer wall of the thermally conductive case and welded to the semiconductor electric dipole layer, and the cold surface of the semiconductor cooler and the working surface are connected in a fast cooling conduction manner by a cooling conductive member.

In some embodiments, the thermally conductive case includes one or more combinations of a heat pipe, a superconducting heat pipe, a superconducting heat plate, or a VC temperature uniformizing plate, and the cooling conductive member is a heat pipe, a VC temperature uniformizing plate, a superconducting heat pipe, or a superconducting heat plate.

The beneficial effects of this application are as follows:

In the semiconductor cooler of the present application, the temperature sensor module is built into the semiconductor cooler and is in close contact with the hot or cold surface of the semiconductor cooler, and is used to detect the temperature of the cold or hot surface, thereby reducing the error and time of the intermediate temperature conduction member and realizing the instantaneous and accurate monitoring and measurement of the temperature change of the cooler. The temperature sensor module is electrically connected to the main control unit or control circuit board, and the main control unit or control circuit board controls the power supply of the semiconductor cooler according to the received temperature data, thereby always maintaining the temperature within the desired temperature range. In addition, the structure of the semiconductor cooler is simpler and more compact, and the temperature sensor module is less likely to be damaged.

FIG. 1 is an exploded schematic view of a semiconductor cooler according to a first embodiment of the present invention. FIG. 2 is a side view of the semiconductor cooler according to the first embodiment of the present application. FIG. 3 is an exploded schematic view of a semiconductor cooler according to a second embodiment of the present invention. FIG. 4 is a side view of a semiconductor cooler according to a second embodiment of the present invention. FIG. 5 is an exploded schematic view of a semiconductor cooler according to a third embodiment of the present invention. FIG. 6 is a side view of a semiconductor cooler according to a third embodiment of the present invention. FIG. 7 is a control circuit diagram of a semiconductor cooler according to an embodiment of the present application. FIG. 8 is a perspective view of an exemplary beauty device using the semiconductor cooler of the present application. FIG. 9 is an exploded view of the cosmetic device in FIG. FIG. 10 is a perspective view of an exemplary physical therapy device that uses the solid state cooler of the present application. FIG. 11 is a cross-sectional view of the physiotherapy device in FIG. FIG. 12 is an exploded view of the physiotherapy device in FIG. FIG. 13 is an exploded view of a heat dissipation assembly according to one embodiment of the present disclosure.

The exemplary embodiments of the present application are described in more detail below with reference to the drawings. Although the drawings show exemplary embodiments of the present application, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, the purpose of providing these embodiments is to provide a more complete understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

It should be understood that the terms used in the specification are merely for the purpose of describing certain exemplary embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "a", "an" and "said" used in the specification may also include the plural. The terms "comprise", "include", "contain" and "have" are inclusive and indicate the presence of a described feature, step, operation, assembly and/or member, but do not exclude the presence or addition of one or more other features, steps, operations, assemblies, members and/or combinations thereof. Unless an order of execution is explicitly indicated, the steps, processes and operations of the method described in the specification should not be construed as necessarily having to be performed in the particular order described or illustrated. It should be further understood that alternative or alternative steps may be employed.

Although the specification may use the terms "first", "second", "third", etc. to describe multiple assemblies, members, regions, layers, and/or portions, these assemblies, members, regions, layers, and/or portions should not be limited by these terms. These terms may be merely intended to distinguish one assembly, member, region, layer, or portion from another region, layer, or portion. Unless otherwise clearly indicated by the context above and below, terms such as "first", "second", and other numerical terms, when used in the specification, do not imply a sequence or order. Thus, an assembly, member, region, layer, or portion discussed below may be referred to as a second assembly, member, region, layer, or portion without departing from the teachings of the exemplary embodiments.

For ease of explanation, the specification may use spatial relative terms to describe the relationship of one illustrated assembly or feature to another assembly or feature, such as, for example, "inside," "outside," "inner," "outside," "lower," "upper," "upper," "front," "rear," and the like. Such spatial relative terms are intended to include different orientations of the device during use or operation other than the orientation shown. For example, if the illustrated device is flipped over, an assembly described as "under the other assembly or feature" or "under the other assembly or feature" would then be oriented as "on top of the other assembly or feature" or "above the other assembly or feature." Thus, the exemplary term "under" may include orientations of "on top of" and "under." The device may be otherwise oriented (rotated 90 degrees or in other directions) and correspondingly interpreted in the spatial relative descriptors used in the specification.

Referring to Figs. 1 to 7, the semiconductor cooler 10 according to the embodiment of the present application includes an intermediate semiconductor electric dipole layer 12 and a hot surface 13 and a cold surface 11 at both ends, and the semiconductor cooler 10 is equipped with a temperature sensor module 15. The semiconductor electric dipole layer 12 is formed by thermally arranging p-type and n-type semiconductor particles in parallel with each other alternately and electrically connected in series, and the hot surface 13 and the cold surface 11 formed at both ends of the p&n-type semiconductor particles are thermally conductive material substrates, which may be thermally conductive materials such as ceramic/aluminum/copper/transparent crystal. The temperature sensor module 15 may be an NTC sensor. In the embodiment of the present application, the temperature sensor 15 is equipped inside the semiconductor cooler 10. In some embodiments, the temperature sensor 15 is located in the intermediate semiconductor electric dipole layer 12 and is in close contact with one of the hot surface 13/cold surface 11 of the cooler 10 to directly detect the temperature of the cold surface 11/hot surface 13 of the cooler.

Referring to Figures 1-2, the semiconductor cooler 10 of the first embodiment includes an intermediate semiconductor electric dipole layer 12 and a high-temperature surface 13 and a low-temperature surface 11 at both ends thereof, and the semiconductor cooler 1 is equipped with a temperature sensor module 15. In this embodiment, the entire low-temperature surface 11 of the semiconductor cooler 10 forms a full-surface cooling, or the entire high-temperature surface 13 forms a full-surface heating, the semiconductor electric dipole particles are placed flat or nearly flat on the inner surfaces of the low-temperature surface 11 and the high-temperature surface 13, the shapes of the low-temperature surface 11 and the high-temperature surface 13 are consistent, and the semiconductor electric dipole layer 12 and the temperature sensor module 15 are located between the low-temperature surface and the high-temperature surface. The temperature sensor module 15 is in close contact with the high-temperature surface 13 or in close contact with the low-temperature surface 11. The positive and negative electrodes 150 of the temperature sensor module 15 and the positive and negative electrodes 120 of the semiconductor electric dipole layer 12 extend out of the semiconductor cooler 10 and are electrically connected to a control circuit board or a main control unit.

3-4, the semiconductor cooler 10 of the second embodiment includes an intermediate semiconductor electric dipole layer 12 and a high-temperature surface 13 and a low-temperature surface 11 at both ends, and the semiconductor cooler 1 is equipped with a temperature sensor module 15. In this embodiment, a through hole 16 is provided on one side of the semiconductor cooler 10, and the through hole 16 can be used as a light-emitting area 16, for example, when the semiconductor cooler is applied to a photonic beauty or physical therapy device. The through hole 16 can be formed by extending the substrate of the low-temperature surface 11 or the high-temperature surface 13, and the through hole 16 can be formed corresponding to the side where the two substrates of the low-temperature surface 11 and the high-temperature surface 13 extend. The low-temperature surface corresponding to the side where the semiconductor electric dipole layer 12 is provided inside the semiconductor cooler 10 is used as a cooling surface, or the high-temperature surface 13 on one side is used as a heating surface. The shapes of the low-temperature surface 11 and the high-temperature surface 13 are the same, and the semiconductor electric dipole layer 12 and the temperature sensor module 15 are located between the low-temperature surface and the high-temperature surface. In the figure, as an example, the temperature sensor module 15 is in close contact with the high-temperature surface 13, but it may of course be in close contact with the low-temperature surface 11. The positive and negative electrodes 150 of the temperature sensor module 15 and the positive and negative electrodes 120 of the semiconductor electric dipole layer 12 extend outside the semiconductor cooler 10 and are electrically connected to a control circuit board or a main control unit.

Referring to Figures 5-6, the semiconductor cooler 10 of the third embodiment includes an intermediate semiconductor electric dipole layer 12 and high-temperature and low-temperature surfaces 13 and 11 at both ends, and the semiconductor cooler 10 is equipped with a temperature sensor module 15. In this embodiment, the p&n type semiconductor electric dipole particles of the semiconductor electric dipole layer 12 inside the semiconductor cooler 10 are arranged as an annular band, and no p&n type semiconductor electric dipole particles are provided in the intermediate internal region, forming a blank region. The low-temperature surface 11/high-temperature surface 13 includes an annular region and corresponds to the semiconductor electric dipole layer 12. The intermediate region of the low-temperature surface 11/high-temperature surface 13 is a through hole, or a through hole is formed correspondingly in one of the low-temperature surface substrate/high-temperature surface substrate, and the other substrate is a transparent substrate (e.g., transparent crystal), or, as shown in Figure 6, the low-temperature surface substrate/high-temperature surface substrate are both transparent substrates (e.g., transparent crystal). Therefore, the semiconductor cooler 10 has a high temperature surface, a low temperature surface and an intermediate semiconductor electric dipole layer in an annular region, and the blank region is a through hole, a through hole/transparent substrate or a transparent substrate region, which may be used as a light emitting region 16, for example, when the semiconductor cooler 10 is applied to a photonic beauty or physical therapy device, it may be used as a light emitting region. The low temperature surface corresponding to one side of the annular semiconductor electric dipole layer 12 of the semiconductor cooler 10 may form a full cooling, or the high temperature surface 13 on one side may form a full heating. The shapes of the low temperature surface 11 and the high temperature surface 13 are the same, and the semiconductor electric dipole layer 12 and the temperature sensor module 15 are located between the low temperature surface and the high temperature surface. In the figure, as an example, the temperature sensor module 15 is in close contact with the high temperature surface 13, but it may naturally be in close contact with the low temperature surface 11. The positive and negative electrodes 150 of the temperature sensor module 15 and the positive and negative electrodes 120 of the semiconductor electric dipole layer 12 extend outside the semiconductor cooler 10 and are electrically connected to a control circuit board or a main control unit.

The positive and negative electrodes 120 of the semiconductor cooler 10 and the positive and negative electrodes 150 of the temperature sensor module 15 are electrically connected to a control circuit board or a main control unit to supply power, and the control circuit board is provided with a main control unit, and the temperature sensor module 15 is electrically connected or communicatively connected to the control circuit board or the main control unit to transmit temperature data. Referring to FIG. 6, the operating principle of the semiconductor cooler 10 of the present application is as follows. The semiconductor cooler 10 with the built-in temperature sensor module 15 detects the temperature data of the low temperature surface 11 or the high temperature surface 13 through the temperature sensor module 15, transmits the temperature data to the main control unit on the control circuit board, and the main control unit controls the power supply operation of the semiconductor cooler 10 by controlling and outputting a control signal for the semiconductor cooler according to the analysis of the temperature data and the requirements of the expected temperature range. Taking advantage of the characteristics of the semiconductor cooler, which cools when power is supplied in the forward direction and heats when power is supplied in the reverse direction, the semiconductor cooler 10 is supplied with power in the forward or reverse direction by the H-bridge driver to adjust the operating state of the semiconductor cooler 10, thereby realizing an accurate and constant temperature within the expected temperature range. The operation of the semiconductor cooler 10 may be controlled by providing an independent control circuit board, which is electrically connected to a PCBA inside the electrical product to which the semiconductor cooler 10 is applied, or the main control unit is integrated into a PCBA inside the electrical product to which the semiconductor cooler 10 is applied.

The number of temperature sensor modules 15 may be one or more depending on the area and shape of the semiconductor cooler.

In the above embodiment, the semiconductor electric dipole layer 12 and the temperature sensor module 15 are located between the low temperature surface and the high temperature surface, and the temperature sensor module 15 is in close contact with the inner surface of the high temperature surface 13 or in close contact with the inner surface of the low temperature surface 11, thereby allowing the temperature of the low temperature surface or the high temperature surface to be more accurately controlled; in other embodiments, the temperature sensor module 15 may be provided on the outer surface of the low temperature surface or the high temperature surface of the semiconductor cooler and in close contact with the outer surface of the low temperature surface or the high temperature surface, allowing the temperature of the low temperature surface or the high temperature surface to be accurately controlled in the same manner.

The semiconductor cooler 10 of the present application may be used for cooling or heating the inside of an electrical appliance. For example, the semiconductor cooler 10 is applied to beauty appliances and physiotherapy products having a cooling or heating function, such as photonic beauty appliances, high-frequency appliances, and physiotherapy massage appliances that come into contact with the human body.

8-9, for example, the photonic beauty device 100 uses the low-temperature surface 11 of the semiconductor cooler 10 of the above embodiment as an end surface that contacts the skin or for cooling the end surface, and the semiconductor cooler 10 is attached to the rear of the end surface on the head side of the beauty device or to the low-temperature surface as it is, and the end surface is brought into contact with the skin, and the cosmetic end surface that provides cooling in the semiconductor cooler provides an icing effect to the contacting skin. In a specific example, the photonic beauty device 100 includes a housing 6, a heat dissipation assembly 2, a light source assembly 3, a power supply assembly 4, and a control circuit board 5 in the housing 6. The control circuit board 5 is electrically connected to the light source assembly 3 and the power supply assembly 4 to control the light source assembly to generate photons. The power supply assembly 4 is used to supply power to the light source assembly 3. The semiconductor cooler 10 is attached to the head of the photonic beauty device 100 as a cosmetic end surface (work surface) that contacts the skin or for cooling the cosmetic end surface (work surface) to provide an icing effect. The control circuit board 5 controls the power supply assembly 4 to activate the light source assembly 3 to generate photons, and the photons pass through the cosmetic end surface (work surface) to treat the skin that comes into contact with it. The housing 6 is provided with a ventilation port 60 used as an air inlet and an exhaust port. The heat dissipation assembly 2 is mainly used to dissipate heat from the semiconductor cooler 10, and illustratively includes a heat pipe 21, a heat sink 23 connected to the heat pipe, and a fan 25. The heat pipe 21 is connected to the high temperature surface 13 of the cooler 10, so that the heat generated in the cooler 10 is conducted to the heat sink 23 to dissipate the heat. The surrounding air enters the surface of the heat sink 23 of the housing 6 from the ventilation port (air inlet) 60 to carry away heat, and the hot air is exhausted from the ventilation port (exhaust port) 60 to the outside of the housing by the power of the fan 25. The photons generated by the light source assembly 3 are transmitted to the semiconductor cooler 10 and emitted from the through-hole of the cooler 10 or the light-emitting area 16 formed on the transparent substrate to perform cosmetic treatment on the skin that comes into contact with it. In this embodiment, if the semiconductor cooler 10 has a light-emitting region 16, the low-temperature surface of the semiconductor cooler 10 may be used as the cosmetic end surface, or may be attached to the back surface of the cosmetic end surface to cool the end surface. If the semiconductor cooler 10 does not have a light-emitting region 16, the semiconductor cooler 10 may be attached directly to the back surface of the cosmetic end surface, or may be connected to the cosmetic end surface by a cooling conductive member to cool the cosmetic end surface.

The positive and negative electrodes 120 of the semiconductor cooler 10 and the positive and negative electrodes 150 of the temperature sensor module 15 are connected to the control circuit board 5, and the temperature of the low or high surface of the semiconductor cooler is detected by the built-in temperature sensor module 15, which is electrically connected to the control circuit board 5 to feed back the temperature data. The control circuit board 5 controls the power supply operation of the positive and negative electrodes 120 of the semiconductor cooler according to the analysis of the temperature data and the requirements of the expected temperature range, thereby constantly maintaining the temperature of the low surface 11 or cosmetic end surface within the expected temperature range.

For example, referring to Figs. 10-12, the photon physical therapy instrument is cooled by a semiconductor cooler 10. As a specific example, the photon high frequency beauty device 100 is provided with a high frequency module, a light source assembly 3, a heat dissipation assembly 2, a control module and a power supply assembly 4, and these modules are arranged in a housing 6. The photon beauty device integrates high frequency treatment and photon treatment, and performs high frequency treatment on the skin by generating high frequency current by the high frequency module, and performs photon assisted treatment on the skin by photons generated by the light source assembly. The high frequency heats the dermis layer of the skin, but uses the permeability of the red light wavelength range (600 nm or more) in the photons to heat the deep part of the skin at the same time, and quickly heats the skin area to be currently treated. Effectively improves the treatment speed. At the same time, the yellow light and green light wavelength range (480-600 nm) in the photons have lower permeability than red light, so they are absorbed by the epidermis layer to treat and improve the skin pigmentation layer, spots and redness in the epidermis layer. This results in wrinkle removal, tightening, toning, whitening and firming of the skin.

The housing 6 is provided with a plurality of ventilation openings 60 as intake and exhaust openings of the air flow path inside the photon high frequency beauty device 100, and cool air enters through the ventilation openings (intake openings) and carries away heat inside the beauty device (including heat generated in, for example, the circuit board, the light source lamp, the hot end of the cooler, or other heat generating elements) through the air flow path, and finally is discharged to the outside of the housing through the ventilation opening (exhaust opening) on the housing. The head part of the high frequency beauty device 100 is spherical (not limited to spherical) and has a light emitting port, and the light emitting panel 70 is provided inside the light emitting port at the front end of the light emitting passage, i.e., covering the light emitting port. The light emitting panel 70 may be a transparent material, such as a transparent crystal, such as sapphire, or the light emitting panel 70 may be a non-transparent material with limited light emitting through holes, such as a metal material, such as aluminum or copper, or other heat conductive material. The outer wall surface of the light-emitting panel 70 serves as a working surface or end surface and can be in contact with the skin, and the high-frequency electrode 7 is provided on the working surface 70, and is electrically connected to the control circuit board 5 inside the high-frequency cosmetic device by the conductive pillar of the high-frequency electrode 71. The light source assembly 3 is provided in the head part, and an optical filter can be further arranged to obtain photons of the required wavelength. The light source assembly 3 includes a light source lamp, which may be an IPL fluorescent lamp, a halogen lamp, or other light source applied to beauty or physical medical functions. The control module includes a control circuit board 5 and is used to control the operation of the photon high-frequency cosmetic device 100. The light source assembly 3 is electrically connected to the control circuit board 5. The control circuit board 5 not only integrates the control module, but also further includes related functional modules such as a DC power supply module, a flashing control module, etc. These functional modules are conventional technologies and can be purchased on the market. The high-frequency module includes multiple pairs of high-frequency electrodes 71 and a high-frequency circuit board 72, and the high-frequency circuit board 72 may be integrated into the control circuit board 5 or provided independently. Functional modules such as a control module, a DC power supply module, and a high-frequency driving module are provided in the high-frequency circuit board 72. These functional modules are conventional technologies and can be purchased on the market. When the high frequency circuit board 72 is provided independently, the high frequency circuit board 72 is electrically connected to the control circuit board 5, and the DC power supply module of the high frequency circuit board 72 is branched and fed by the power supply module on the control circuit board. The multiple pairs of high frequency electrodes 71 are electrically connected to the high frequency circuit board 72, and each pair of electrodes includes a positive and negative electrode. The electrodes are strip-shaped, column-shaped or any suitable shape, provided on the working surface 70, form high frequency electrode points, and contact the skin, and the high frequency electrode points and the light emitting port may be provided overlapping or around the light emitting port, and one or more pairs are provided. The multiple pairs of high frequency electrodes 71 are electrically connected to the internal high frequency circuit board 72. The high frequency circuit board 72 controls the DC power supply module to supply the voltage required for the corresponding stage to the high frequency driving module, and the high frequency driving module converts the DC power supply voltage into a high voltage sine wave by a step-up transformer and sends it to the output control module, and the output control module transmits the high frequency current to the user's skin through the high frequency electrode 71 to perform high frequency treatment on the skin.

The power supply assembly 4 may include a plug-in interface that is electrically connected to the control circuit board and to an external power source to provide power, and the power supply assembly may further include an energy storage capacitor or battery that is electrically connected to the control circuit board 5 and the light source assembly 3.

13, the heat dissipation assembly 2 includes a fan 25 and further includes a semiconductor cooler 10 for cooling the working surface 70. The semiconductor cooler 10 may use the structure of the first embodiment described above, the semiconductor electric dipole layer 12 and the temperature sensor module 15 are located between the high temperature surface 13 and the low temperature surface 11 at both ends, the temperature sensor module 15 may be in close contact with the inside of the high temperature surface 13 or the low temperature surface 11, the positive and negative electrodes 120 of the semiconductor cooler and the positive and negative electrodes 150 of the temperature sensor module 15 are electrically connected to the control circuit board 5, the temperature sensor module 15 is electrically connected or communicatively connected to the control circuit board 5, and the fan 25 is electrically connected to the control circuit board 5. The high temperature surface 13 of the semiconductor cooler 10 and the heat conduction case 251 made of a heat pipe, a superheat conducting pipe, a superheat conducting plate or VC are connected by rapid heat conduction. The high-temperature surface 13 of the semiconductor cooler 10 and the heat conduction case 251 made of a heat pipe, a superconducting heat pipe, a superconducting heat plate, or VC are in close contact with each other to transfer heat, or are in close contact with each other through a heat conduction plate to transfer heat, or the high-temperature surface 13 of the semiconductor cooler 10 and the heat conduction case 251 made of a heat pipe, a superconducting heat pipe, a superconducting heat plate, or VC are provided at different positions on the fan cover, and rapidly conduct heat to each other, or the semiconductor cooler 10 and the heat conduction case 251 made of a heat pipe, a superconducting heat pipe, a superconducting heat plate, or VC are integral in structure, and by providing a thermal end circuit in the heat conduction case 251 made of a heat pipe, a superconducting heat pipe, a superconducting heat plate, or VC, it is welded and electrically connected to the semiconductor electric dipole layer 12 and functions directly as the high-temperature surface 13.

The cold surface 11 of the semiconductor cooler 10 contacts the light-emitting panel 70 of the photon high frequency beauty device 100, for example, is provided around the light-emitting panel 70. Alternatively, the cold surface 11 of the semiconductor cooler 10 and the light-emitting panel 70 are connected to the light-emitting panel 70 by a cooling conductive member (heat transfer element or heat transfer member) 73. The cooling conductive member 73 is a heat transfer structural member that can rapidly transfer the heat of the light-emitting panel 70 to the semiconductor cooler, thereby realizing the effect of cooling the working surface 70, and thereby forming a cold compress or pre-cooling effect on the surface of the skin in contact with the working surface.

One end of the cooling conductive member 73 is connected to the low temperature surface 11 of the semiconductor cooler in a fast heat transfer manner, and the other end is connected to the light emitting panel 70 in a fast cooling conduction manner. The cooling conductive member 73 is a heat pipe, a VC temperature equalizing plate, a superheat conductive pipe or a superheat conductive plate. Preferably, the superheat conductive pipe is an aluminum superconducting tube, and the superheat conductive plate is an aluminum superconducting plate. According to the shape of the light emitting panel 70 and the desired cooling effect, the end of the cooling conductive member 73 that contacts the light emitting panel 70 may be designed in an annular shape or an annular cooling conductive member may be provided, so as to be in close contact with the periphery of the light emitting panel 70 to quickly absorb the heat of the working surface 70 or the surrounding environment of the working surface 70. More preferably, the light emitting panel 70 is a heat conductive material, such as a transparent crystal, a metal material or a heat conductive silicone rubber, and the material can transmit light or has holes.

The high-temperature surface 13 of the semiconductor cooler 10 is provided on the outer wall of a heat conduction case 251 made of a heat pipe, a superconducting heat pipe, a superconducting heat plate, or a VC, or the heat conduction case 251 made of a heat pipe, a superconducting heat pipe, a superconducting heat plate, or a VC functions directly as the high-temperature surface of the semiconductor cooler. The heat sink 252 provided on the inner wall of the heat conduction case 251 made of a heat pipe, a superconducting heat pipe, a superconducting heat plate, or a VC is for increasing the heat dissipation area and is located in the air flow path inside the fan. The heat generated on the high-temperature surface 13 is quickly conducted to the heat sink 252 by the heat conduction case 251, and the air in the air flow path of the fan carries away the heat of the heat conduction case 251 and the heat sink, and is discharged from the ventilation port (exhaust) of the fan. The cold surface 11 of the semiconductor cooler is connected to one end of the cooling conductive member 73, more preferably with a maximum contact area or by rapid heat conduction, the other end of the cooling conductive member is bent and connected to the annular cooling conductive member with a maximum contact area, and the light emitting panel 70 is connected to the annular cooling conductive member with a maximum contact area. The semiconductor cooler 10 rapidly conducts cooling to the light emitting panel 70 through the cooling conductive member 73. The annular cooling conductive member is a heat pipe, a VC temperature uniforming plate, a superheat conductive pipe, or a superheat conductive plate. Preferably, the superheat conductive pipe is an aluminum superconducting tube, and the superheat conductive plate is an aluminum superconducting plate. More preferably, the cooling conductive member 73 is an aluminum superconducting tube or an aluminum superconducting plate. The fan 25 may be a type of blower, and includes a fan cover 253 having a cavity formed therein and an impeller 250 attached within the cavity.

In each of the above embodiments, the semiconductor cooler 10 is equipped with a built-in temperature sensor module (NTC) 15 to detect the temperature of the low temperature surface 11 or high temperature surface 13 of the semiconductor cooler, and the temperature data is transmitted to the control circuit board, processed by the main control unit on the control circuit board, and then the power supply to the positive and negative electrodes 120 of the semiconductor cooler is controlled, the operating state of the semiconductor cooler is adjusted, and the temperature is accurately and consistently within the desired temperature range, thereby achieving accurate temperature control. The beauty device 100 using the semiconductor cooler 10 can accurately control the temperature of the working surface or end surface that comes into contact with the skin, has a built-in temperature sensor module (NTC), is simple in structure, and can protect the built-in temperature sensor module (NTC) from damage.

Although the embodiments of the present application have been illustrated and described above, as will be understood by those skilled in the art, various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of protection of the present application is limited by the appended claims and their equivalents.

Claims (3)

A cosmetic or physical therapy instrument in which an end surface of a head portion forms a working surface, and the working surface comes into contact with skin to perform cosmetic or physical therapy treatment,
A semiconductor cooler installed inside,
a cooling conductive member provided in contact with the work surface;
A main control unit,
a light emitting port is provided in the head portion, a light emitting panel is provided to cover the light emitting port, and an outer wall surface of the light emitting panel functions as the work surface and is capable of contacting the skin;
The semiconductor cooler includes a semiconductor electric dipole layer and a temperature sensor module;
The semiconductor electric dipole layer and the temperature sensor module are located between the low temperature surface and the high temperature surface, the temperature sensor module is in close contact with the inner surface of the high temperature surface, or is in close contact with the inner surface of the low temperature surface, or the temperature sensor module is provided on the outer surface of the low temperature surface or the high temperature surface, and is in close contact with the outer surface of the low temperature surface or the high temperature surface; the temperature sensor module detects the temperature of the high temperature surface or the low temperature surface and transmits the temperature data to the main control unit, so that the main control unit is used to control the power supply of the semiconductor cooler according to the received temperature data;
the low temperature surface of the semiconductor cooler and the work surface of the light emitting panel are connected by the cooling conductive member to cool the work surface;
the p-type and n-type semiconductor electric dipole particles of the semiconductor electric dipole layer are arranged as annular bands, and no p-type or n-type semiconductor electric dipole particles are provided within a central inner region;
The low temperature surface and/or the high temperature surface are provided as through holes corresponding to the central inner region of the semiconductor electric dipole layer, or one of the low temperature surface and/or the high temperature surface is a transparent substrate, and the other forms a through hole, and the through hole forms a light emitting region that transmits light from a light source;
A cosmetic or physical therapy device, characterized in that light emitted from the light emitting region performs cosmetic treatment on the skin of a user. a housing; a light source assembly having the light source mounted within the housing, a power supply assembly, a control circuit board, and a heat dissipation assembly;
2. The beauty or physical therapy device according to claim 1, wherein the positive and negative electrodes of the semiconductor cooler and the built-in temperature sensor module are electrically connected to the control circuit board, the control circuit board is provided with a main control unit, and the heat dissipation assembly is used to dissipate heat from a high-temperature surface of the semiconductor cooler. The beauty or physical therapy device according to claim 2, characterized in that the heat dissipation assembly includes a fan, the fan includes a thermally conductive case, the high temperature surface of the semiconductor cooler and the thermally conductive case are thermally conductively connected or the thermally conductive case directly functions as the high temperature surface of the semiconductor cooler, the thermally conductive case includes one or more combinations of a heat pipe, a superheat conductive pipe, a superheat conductive plate, or a temperature equalizing plate, and the cooling conductive member is a heat pipe, a temperature equalizing plate, a superheat conductive pipe, or a superheat conductive plate.