JP7645171B2 - Terminal structure and method for manufacturing same - Google Patents

Description

The present invention relates to a terminal structure that prevents short circuits between soldered terminals and a method for manufacturing the same.

Semiconductor pressure sensors are known that incorporate electronic components (semiconductor elements) such as a sensor chip as a pressure detection element. In recent years, one-chip semiconductor pressure sensors have also been developed in which the pressure detection element and signal processing circuit are integrated on the same silicon chip. For example, Patent Document 1 describes a semiconductor pressure sensor with improved waterproofing.

This semiconductor pressure sensor has a contact pin connected to a connection pin (lead pin) from the semiconductor pressure detection unit by a wiring material made of an FPC (flexible printed circuit board) inside the pressure sensor body as an output terminal in the pressure sensor body, and the contact pin is fitted into a terminal connected to the tip of an electric wire to the outside, and the connection part (connector part) between the terminal of the electric wire and the contact pin is molded with room temperature curing resin.

As mentioned above, in conventional semiconductor pressure sensors, a connector portion is provided in which a contact pin is fitted into the terminal of the electric wire that connects to an external device, and when waterproofing is required, the connector portion and the like are filled with resin. In order to improve the reliability of the connection and reduce costs in such waterproof pressure sensors, it is conceivable to eliminate the connector portion and directly connect the electric wire to the outside to a terminal integrated with the contact pin that is installed on the terminal block inside the pressure sensor body. The electric wire required for such direct-wire-attached semiconductor pressure sensors is usually a three-wire type (output, power supply, ground), and the length used for connecting to an external device is about 0.5 to 3 m.

In a terminal structure like this terminal block, the ends of the conductor wires (conductive material) that are connected to the outside are soldered to each terminal arranged on the terminal installation surface to establish a conductive connection, and then the terminal connections are surrounded by a resin mold to ensure insulation (see, for example, Patent Documents 2 and 3).

If ultrasonic welding is used to connect the conductor to the terminal, for example, a method is used to join the twisted conductor to the terminal, which increases the amount of management work required for polishing and replacing the horn and anvil due to wear and tear, and the associated need to determine the joining conditions. In addition, mechanical loads such as twisting can cause the twisted conductor to break. As a countermeasure to this increase in management work, soldering may be used, which has excellent rigidity (resistance) against mechanical loads.

JP 2001-141588 A Japanese Unexamined Patent Publication No. 63-241883 Patent No. 3131229

However, in this type of terminal structure, the terminal is inserted into the terminal block or is insert-molded together, and an adhesive is applied to fix the terminal or to seal the gap between the terminal and the terminal block. In this case, if peeling occurs between the fixing adhesive and the molding resin, gaps are likely to form.

For example, as shown in FIG. 13, the terminal 1 is inserted into the terminal mounting surface 2b of the terminal block 2 and fixed with adhesive 3, and the gap in the insertion part is filled with adhesive (see FIG. 13(a)). The end of the conductor 4e (conductive material) which is the core of the electric wire 4 such as a power line or a signal line is soldered to the end of the terminal 1 protruding from the terminal block 2 with solder material 5 to establish a conductive connection (see FIG. 13(b) and FIG. 13(c)).

Depending on the installation environment, this terminal block 2 may allow moisture w to penetrate through the core wire (conductor) 4e of the electric wire 4 from the end of the terminal 1 on the mating circuit or board side (not shown). In addition, if interfacial peeling occurs between the solder material 5 and the resin material 6 of the resin mold, the gap G will continue to the terminal installation surface 2b side (see FIG. 13(d)). If these conditions are all met, there is a possibility that the terminals 1 on the terminal installation surface 2b side will short-circuit, causing insulation breakdown, as described below.

In detail, as shown in FIG. 14, multiple terminals 1 are arranged in parallel on the terminal installation surface 2b of the terminal block 2. If a gap G is formed on the terminal installation surface 2b side of the terminal block 2 due to interfacial peeling between the adhesive 3 and the resin material 6 of the resin mold, allowing moisture w to penetrate, the terminals 1 on the terminal installation surface 2b side may short-circuit and cause insulation breakdown. Note that metal materials such as solder material 5 may cause migration or whiskers on the surface, and if a gap exists on the surface side, it may grow without limit and cause a short circuit.

The present invention aims to provide a terminal structure and a method for manufacturing the same that can reduce the possibility of dielectric breakdown occurring between terminals.

One aspect of the invention of the terminal structure that solves the above problem is a terminal structure in which a plurality of terminal parts, to which a conductive material is electrically connected by soldering with molten solder, are arranged on a terminal installation surface, and the terminal parts are surrounded by a resin mold together with the conductive material to ensure insulation, and the terminal parts are characterized in that the end side of the terminal parts is a soldering area for the conductive material, and a limiting part is formed that limits the extension of the molten solder from the soldering area to the adjacent terminal installation surface side.

In addition, one aspect of the invention of the method for manufacturing a terminal structure that solves the above problem is a method for manufacturing a terminal structure in which a plurality of terminal parts to which a conductive material is conductively connected by soldering with molten solder are arranged on a terminal installation surface, and the terminal parts are surrounded by resin molding together with the conductive material to ensure insulation, and the conductive material is soldered to the terminal parts to conductively connect them while restricting the molten solder from extending from the soldering area toward the terminal installation surface so that the end side of the terminal parts becomes the soldering area of the conductive material.

In these embodiments, the diffusion (wetting and spreading) of molten solder from the soldering area on the end side of the terminal portion to the terminal installation surface side is restricted, and the resin comes into contact with the surface of the terminal portion on the terminal installation surface side to be molded without the presence of solder.

With this structure, if a gap is formed between the solder surface located on the end side of the terminal portion and the resin mold, even if moisture penetrates from the conductive end side to be soldered, it can be prevented from penetrating to the terminal installation surface side of the terminal portion.

One aspect of the invention of the terminal structure that solves the above problem is a terminal structure in which a plurality of terminal parts, to which a conductive material is electrically connected by soldering with molten solder, are arranged in parallel on a terminal installation surface, and the terminal parts are surrounded by a resin mold together with the conductive material to ensure insulation, and the terminal parts are arranged so that the creepage distance on the terminal installation surface between adjacent parts is greater than the adjacent distance when the terminal parts are arranged in series in a straight line.

In this configuration, the creepage distance on the terminal installation surface of adjacent terminal parts is made larger than the adjacent distance that ensures insulation between the terminal parts, in other words, the adjacent distance when viewed from the front in the parallel direction, and the terminal parts are resin molded.

With this structure, even if a gap is formed between the terminal mounting surface and the resin mold and moisture penetrates into the terminal mounting surface, the creepage distance of the terminal mounting surface between the terminals can be increased, reducing the possibility of moisture continuing between the terminals.

In this way, according to one aspect of the present invention, it is possible to provide a structure and a manufacturing method that can prevent moisture from continuously flowing between adjacent terminals, thereby reducing the possibility of dielectric breakdown occurring between the terminals.

FIG. 1 is a diagram illustrating an example of a terminal connection structure of a pressure sensor implementing a first embodiment of the terminal structure and its manufacturing method of the present invention, where (a) is an external view showing the pressure sensor, and (b) is a plan view of the pressure sensor as viewed from the extension direction of the electric wire. 2A is a partial cross-sectional front view of the pressure sensor in an upright position taken along line IIa-IIa in FIG. 1, and FIG. 2B is a cross-sectional plan view of the pressure sensor taken along line IIb-IIb in FIG. 2A. FIG. 3 is a diagram illustrating the terminal, where (a) is an elevated front view showing the single terminal structure, (b) is an elevated front view showing the terminal after resin molding, (c) is an elevated side view showing the terminal after resin molding, and (d) is an elevated side view showing the gap formed around the terminal. FIG. 4 is a diagram showing the first alternative embodiment, where (a) is an elevational front view showing the single terminal structure, and (b) is an elevational front view showing the terminal after resin molding. FIG. 5 is a diagram showing the second alternative embodiment, where (a) is an elevational front view showing the single terminal structure, and (b) is an elevational front view showing the terminal after resin molding. FIG. 6 is a diagram showing the third alternative embodiment, where (a) is a perspective view showing the single terminal structure, and (b) is an elevational side view thereof. FIG. 7 is a diagram showing the fourth alternative embodiment, where (a) is a perspective view showing the single terminal structure, and (b) is an elevational side view thereof. 8A and 8B are diagrams illustrating an example of a terminal connection structure of a pressure sensor implementing a second embodiment of the terminal structure and its manufacturing method of the present invention, in which (a) is an elevated front view showing the single terminal structure, (b) is an elevated front view showing the terminal after resin molding, (c) is an elevated side view showing the terminal after resin molding, and (d) is an elevated side view showing a gap formed around the terminal. 9A and 9B are diagrams illustrating an example of a terminal connection structure of a pressure sensor implementing a third embodiment of the terminal structure and its manufacturing method of the present invention, in which (a) is an elevated front view showing the single terminal structure, (b) is an elevated front view showing the terminal after resin molding, (c) is an elevated side view showing the terminal after resin molding, and (d) is an elevated side view showing a gap formed around the terminal. 10A and 10B are diagrams showing an example of a terminal connection structure of a pressure sensor implementing a fourth embodiment of the method for manufacturing a terminal structure of the present invention, in which (a) is a side view explaining soldering to the terminal in a horizontal state, (b) is an elevated front view showing the terminal after resin molding, (c) is an elevated side view showing the terminal after resin molding, and (d) is an elevated side view showing the gap formed around the terminal. FIG. 11 is a diagram showing an example of a terminal connection structure of a pressure sensor having a fourth embodiment of the terminal structure of the present invention, in which (a) is an elevated front view showing the parallel terminals after resin molding, (b) is a plan view showing the terminals after resin molding, and (c) is an elevated front view showing a gap formed around the terminal. FIG. 12 is a diagram showing an example of a terminal connection structure of a pressure sensor having a fifth embodiment of the terminal structure of the present invention, in which (a) is an elevated front view showing the parallel terminals after resin molding, (b) is a plan view showing the terminals after resin molding, and (c) is an elevated front view showing a gap formed around the terminal. FIG. 13 is a diagram illustrating the prior art terminal structure, where (a) is an elevated front view showing the single terminal structure, (b) is an elevated front view showing the terminal after resin molding, (c) is an elevated side view showing the terminal after resin molding, and (d) is an elevated side view showing a gap formed around the terminal. FIG. 14 is a diagram for explaining the prior art terminal structure, and is an elevational front view showing the parallel terminals after resin molding.

The following describes in detail an embodiment of the present invention with reference to the drawings. Figures 1 to 3 show an example of a terminal connection structure of a pressure sensor that embodies a first embodiment of the terminal structure and manufacturing method of the present invention.

<First embodiment of terminal structure>
1 and 2, the pressure sensor 100 is constructed with a connector 101A having a waterproof function and accommodating a three-wire electric wire 4 for output, power supply, and ground, and a sensor element 101B accommodating a signal line conductively connected to a sensor main body having a waterproof function such as a sensor chip or a circuit board (not shown). This pressure sensor 100 is electrically connected with waterproofness (insulation) ensured inside a connector case 102A and a sensor case 102B, respectively, so as to prevent dielectric breakdown between the conductors in the connector 101A and the sensor element 101B.

In particular, in the connector 101A on the device side of this embodiment, the core wires (conductors) 4e of each electric wire 4 of the input/output lines (power supply voltage, zero V, signal output) connected to the sensor element 101B are housed in the connector case 102A and soldered to each terminal (terminal portion) 10 of the terminal block 2 for conductive connection, and although not shown in the figure, the various conductors in the sensor case 102B of the sensor element 101B are conductively connected to the terminals 10 for electrical connection. Incidentally, in the connector 101A, the connector case 102A is filled with resin material 6 and resin molded to surround the entire terminal 10, thereby ensuring waterproofing around the terminal 10, and the sensor element 101B is also waterproofed so that moisture does not penetrate from the sensor case 102B side to the connector 101A side.

The terminal 10 is inserted or insert-molded into the terminal block 2, and adhesive 3 is applied to the terminal mounting surface 2b to seal or fix the gap at the insertion point of the terminal block 2, and the core wire 4e of the electric wire 4 is soldered to the end portion 10u on one end side with molten solder 5m to establish an electrical connection.

The terminal 10 has a terminal surface 10f that is formed as an affinity surface for the molten solder 5m, and the molten solder 5m spreads out while blending with the terminal surface 10f and generating surface tension, extending in a direction from the end portion 10u toward the terminal base portion 10b on the terminal installation surface 2b side, and the solidified solder material 5 of the molten solder 5m is conductively connected to the core wire 4e of the electric wire 4.

At this time, the molten solder 5m may be solidified and soldered to the solder material 5 in a state where it is extended to the terminal base 10b side close to the terminal installation surface 2b of the terminal 10. In this case, the entire terminal surface 10f of the terminal 10 is covered with the solder material 5, which has no affinity with the resin material 6 for resin molding, and when the resin material 6 is also incompatible with the adhesive 3 for fixing the terminal 10 to the terminal block 2, peeling may occur at the interface between them, forming a continuous gap G. That is, in this terminal structure, there is a possibility that a gap G may be formed from the core 4e side of the electric wire 4 through the surface of the solder material 5 and the adhesive 3 to the terminal installation surface 2b (see Figures 13 and 14). In this case, in the terminal 10 of this terminal block 2, moisture w that penetrates from the termination part 10u side, which is the mating circuit or board side of the electric wire 4, through the gap G depending on the installation environment may cause a short circuit between adjacent terminals 10.

As shown in FIG. 3(a), the terminal 10 of this embodiment has a soldering area 10a that is a predetermined area sufficient for soldering the core wire 4e of the electric wire 4 to the terminal surface 10f, for example, more than half the area of the terminal surface 10f, and a rectangular opening 13 is formed between both side edges 10s of the soldering area 10a on the terminal installation surface 2b side.

The opening 13 of the terminal 10 is formed to be large enough to ensure a current capacity between the both sides 10s, and as shown in Fig. 3(b) and Fig. 3(c), the molten solder 5m that solders the core 4e of the electric wire 4 to the end 10u spreads and extends toward the terminal installation surface 2b side beyond the soldering area 10a due to its own weight and surface tension, and functions as a limiting portion that restricts this by narrowing the gap between the both sides 10s. Here, in this embodiment, the case where the terminal 10 is soldered in an upright position is described as an example, but this is not limited to this, and even when the terminal 10 is soldered with the molten solder 5m placed on it in a horizontal position, the extension of the molten solder 5m that spreads due to surface tension can be restricted.

As a result, when the resin material 6 is filled into the connector case 102A and resin molded to ensure insulation after the core wire 4e of the electric wire 4 is soldered, as shown in FIG. 3(d), the resin material 6 can be prevented from coming into close contact with the terminal surface 10f where there is no solder material 5, thereby preventing the formation of a gap G.

Therefore, even if a gap G is formed between the adhesive 3 or solder material 5 on the terminal installation surface 2b and the resin material 6, the terminal 10 can prevent the gap G on the adhesive 3 side from communicating with the solder material 5 side. At this time, the resin material 6 is filled inside the opening 13 of the terminal 10, so that the resin materials 6 on the front and back of the terminal 10 are more firmly attached to each other than when there is no limiting portion, thereby improving the adhesion between the terminal 10 and the resin material 6.

<First embodiment of method for manufacturing terminal structure>
1 to 3, the connector 101A of the pressure sensor 100 is manufactured by preparing a terminal 10 having an opening 13 formed in advance, which is inserted or insert-molded into the terminal mounting surface 2b of the terminal block 2 and has a gap sealed or fixed with an adhesive 3, soldering the core wire 4e of the electric wire 4 to the end portion 10u of the terminal 10 to establish an electrical conductive connection, and then filling the connector case 102A with a resin material 6 and resin-molding the entire terminal 10, thereby ensuring waterproofing around the terminal 10.

In this manufacturing procedure (manufacturing method), molten solder 5m is supplied so as to flow into the soldering area 10a while the core wire 4e of the electric wire 4 is in contact with the end portion 10u protruding from the terminal block 2 of each terminal 10, thereby solidifying the solder material 5 so as to maintain the connection while ensuring electrical continuity, thereby creating an installation structure for the terminal 10.

At this time, when the molten solder 5m is poured into the soldering area 10a of the terminal 10, the flow path from the soldering area 10a toward the terminal installation surface 2b is narrowed between both side edges 10s and the opening 13, and the surface tension of the solder together with the edge of the opening 13 restricts the solder from diffusing out of the soldering area 10a.

As described above, this makes it possible to prevent the gap G formed between the resin material 6 and the solder material 5 held within the soldering area 10a of the terminal 10 from communicating with the gap G formed between the adhesive 3 on the terminal mounting surface 2b and the resin material 6.

In this way, the installation structure of the terminal 10 and the method for manufacturing it in this embodiment can prevent moisture w that has permeated from the mating circuit or board of the electric wire 4 from penetrating through the gap G on the solder material 5 side to the gap G on the adhesive 3 side and spreading over the surface of the terminal installation surface 2b.

Therefore, the pressure sensor 100 can prevent moisture w from penetrating between adjacent terminals 10 in the terminal block 2 and causing a short circuit, and can prevent dielectric breakdown from occurring between the terminals 10.

As shown in Fig. 4(a), the terminal 10 of the first alternative embodiment of this embodiment has a notch 14 formed on the terminal installation surface 2b side of the soldering area 10a, which extends in the width direction from one side edge 10s of the terminal 10. As with the opening 13 of this embodiment, the notch 14 of this terminal 10 functions as a restricting portion that narrows the gap between the one side edge 10s and restricts the molten solder 5m from diffusing (extending) from the soldering area 10a, as shown in Fig. 4(b).

As shown in Fig. 5(a), the terminal 10 of the second alternative embodiment of this embodiment has a pair of notches 15 formed on the terminal installation surface 2b side of the soldering area 10a, which extend in the width direction from both side edges 10s of the terminal 10. As with the opening 13 of this embodiment, the notches 15 of this terminal 10 function as restricting portions that narrow the central gap between the side edges 10s to restrict the molten solder 5m from diffusing (extending) from the soldering area 10a, as shown in Fig. 5(b).

In this way, even in these other terminals 10, the gap G formed between the adhesive 3 side or the solder material 5 side of the terminal installation surface 2b and the resin material 6 can be prevented from communicating with each other, and the moisture w that has permeated from the opposing circuit or board side of the wire 4 can be prevented from spreading to the surface of the terminal installation surface 2b. Therefore, it is possible to prevent a short circuit caused by the moisture w that permeates between adjacent terminals 10 in the terminal block 2 of the pressure sensor 100, which would cause insulation breakdown. By providing the openings 13 and the cutouts 14, 15 in the terminals 10 in this way, the bonding area between the resin material 6 on the front and back of the terminals 10 at the narrowed portions of the terminals 10 can be increased, and therefore the resin material 6 can be prevented from peeling off from the terminals 10, improving adhesion.

Furthermore, in the third and fourth alternative aspects of the terminal 10 of this embodiment, instead of the opening 13 and the notches 14 and 15, a rib shape or step protruding from the terminal surface 10f may be formed, or a continuous rib shape may be formed between the side edges 10s. Specifically, the third alternative aspect of the terminal 10 may be curved to form a rib shape 17 protruding from the terminal surface 10f on one side, as shown in FIG. 6. In addition, the fourth alternative aspect of the terminal 10 may be formed into a hook shape that is bent into a two-stage L-shape to form a step portion 18, as shown in FIG. 7. In this case, as with the opening 13 of this embodiment, the rib shape 17 or step portion 18 can function as a limiting portion that limits the molten solder 5m from diffusing (extending) from the soldering region 10a, and the same effect can be obtained, preventing the terminals 10 from shorting out due to moisture w penetrating between them and causing insulation breakdown.

<Second embodiment of terminal structure>
8 is a diagram showing an example of a terminal connection structure of a pressure sensor implementing a second embodiment of the terminal structure and its manufacturing method of the present invention. Here, since this embodiment has substantially the same configuration as the above-mentioned embodiment, the same reference numerals are used for the similar configuration to mainly explain the characteristic parts (the same applies to the other embodiments described below).

In FIG. 8(a), the pressure sensor 100 has terminals (terminal portions) 20 to which the core wires 4e of the electric wires 4 for input and output to the pressure sensor chip are soldered for electrical connection, and these terminals 20 are arranged in parallel with the terminal block 2 in the connector case 102A, as in the above-described embodiment. The terminals 20 are waterproofed by filling the connector case 102A with resin material 6 and resin-molding the terminals 20 so that they are entirely surrounded by the resin material 6.

The terminal 20 has a plating (or a pre-solder) 21 formed on the soldering area 10a of the terminal surface 10f, which is more compatible with the molten solder 5m than the terminal 10 of the above embodiment. As shown in Fig. 8(b) and Fig. 8(c), the molten solder 5m that solders the core wire 4e of the electric wire 4 effectively matches the plating 21 of the soldering area 10a, while the soldering area 10a itself functions as a limiting portion by suppressing (limiting) the active diffusion of the molten solder 5m away from the soldering area 10a toward the terminal installation surface 2b. The type of plating may be a general tin plating or gold plating, or may be any other type of metal plating that can improve the wettability of the solder. The method of forming this compatible surface is more effective when the terminal is made of a material that is difficult to wet with solder, such as stainless steel. In addition, by using a material that has been partially plated in the areas that will become the soldering areas before pressing, the sides 10s on both sides are exposed to a material surface that is difficult for solder to wet, which can prevent the solder from diffusing to those areas, providing further benefits.

As a result, when the core 4e of the electric wire 4 is soldered and then resin molded to ensure insulation, as shown in FIG. 8(d), the resin material 6 can be placed in close contact with the terminal surface 10f where there is no solder material 5, thereby limiting the formation of gaps G, and preventing gaps G that may form between the adhesive 3 or solder material 5 on the terminal installation surface 2b and the resin material 6 from communicating with each other.

<Second embodiment of method for manufacturing terminal structure>
In FIG. 8, the connector 101A of the pressure sensor 100 is manufactured by preparing a terminal 20 in which plating 21 has been formed in advance on the soldering area 10a of the terminal surface 10f as an affinity surface for molten solder 5m, and the terminal 20 is inserted or insert-molded into the terminal mounting surface 2b of the terminal block 2, and the gap is sealed or fixed with adhesive 3. The core wire 4e of the electric wire 4 is soldered to the end portion 10u of the terminal 20 to establish an electrical conductive connection. After that, the connector case 102A is filled with resin material 6 and resin-molded so as to surround the entire terminal 20, thereby ensuring waterproofing around the terminal 20.

In this manufacturing procedure, molten solder 5m is poured into the soldering area 10a while the core 4e of the electric wire 4 is in contact with the end portion 10u of each terminal 20, ensuring electrical continuity, and the solder material 5 is solidified to maintain the connection, creating an installation structure for the terminal 20.

At this time, when the molten solder 5m is poured into the soldering area 10a of the terminal 20, it actively blends with the plating 21 of the soldering area 10a and is restricted from diffusing from the soldering area 10a by its own surface tension.

As described above, this makes it possible to prevent the gap G formed between the resin material 6 and the solder material 5 held within the soldering area 10a of the terminal 20 from communicating with the gap G formed between the adhesive 3 on the terminal mounting surface 2b and the resin material 6.

In this way, in the terminal 20 installation structure and manufacturing method of this embodiment, as in the above-described embodiment, moisture w that has permeated from the mating circuit or board side of the electric wire 4 can be prevented from penetrating into the gap G on the adhesive 3 side through the gap G on the solder material 5 side and spreading onto the surface of the terminal installation surface 2b, thereby preventing dielectric breakdown between the terminals 20 of the pressure sensor 100.

Here, as another aspect of this embodiment, although not shown in the figures, it goes without saying that it may be combined with the first embodiment described above.

<Third embodiment of terminal structure>
FIG. 9 is a diagram showing an example of a terminal connection structure of a pressure sensor implementing the third embodiment of the terminal structure and the manufacturing method thereof according to the present invention.

In FIG. 9(a), the pressure sensor 100 has terminals (terminal portions) 30 to which the core wires 4e of the electric wires 4 for input and output to the pressure sensor chip are soldered for electrical connection, and these terminals (terminal portions) 30 are arranged in parallel with the terminal block 2 in the connector case 102A, as in the above-described embodiment. The terminals 30 are waterproofed by filling the connector case 102A with resin material 6 and resin-molding the terminals 30 so as to surround them entirely.

As shown in Figures 9(b) and 9(c), the terminal 30 has an adjacent area 30n below the soldering area 10a on the terminal surface 10f, which is formed as a non-compatible surface that is less compatible with the molten solder 5m than the soldering area 10a, and the adjacent area 30n functions as a limiting portion that limits the descent of the molten solder 5m toward the terminal installation surface 2b.

The adjacent area 30n of the terminal 30 is formed as an affinity surface that is compatible with the resin material 6, and is designed to prevent the resin material 6 from peeling off at the interface with the terminal surface 10f during resin molding, resulting in the formation of a gap G. Specific examples of non-compatible surfaces of solder and affinity surfaces of resin materials include coatings, resin paint films such as polyurethane, and electrochemical coatings, which are formed in a manner that inhibits the wetting and spreading of solder while not affecting the adhesion of the resin material 6 or the adhesiveness of the adhesive 3.

As a result, when the terminal 30 is resin-molded to ensure insulation after soldering the core 4e of the electric wire 4 to the soldering area 10a as shown in FIG. 9(d), it is possible to promote close contact of the resin material 6 while suppressing the presence of the solder material 5 in the adjacent area 30n of the soldering area 10a, and to suppress communication between the adhesive 3 or the solder material 5 on the terminal installation surface 2b and the resin material 6.

<Third embodiment of method for manufacturing terminal structure>
In FIG. 9, the connector 101A of the pressure sensor 100 is manufactured in a manner such that an adjacent area 30n on the terminal installation surface 2b side adjacent to the soldering area 10a is formed as a non-compatible surface that is less compatible with the molten solder 5m than the soldering area 10a, and as a compatible surface that is compatible with the resin material 6, and the terminal 30 is inserted or insert-molded into the terminal installation surface 2b of the terminal block 2, and the gap is sealed or fixed with adhesive 3. The core wire 4e of the electric wire 4 is soldered to the end portion 10u of the terminal 30 to establish an electrical conductive connection, and then the resin material 6 is filled into the connector case 102A and resin molded to surround the entire terminal 30, thereby ensuring waterproofing around the terminal 30.

In this manufacturing procedure, molten solder 5m is poured into the soldering area 10a while the core 4e of the electric wire 4 is in contact with the end portion 10u of each terminal 30, ensuring electrical continuity, and the solder material 5 is solidified to maintain the connection, creating an installation structure for the terminal 30.

At this time, when the molten solder 5m is poured into the soldering area 10a of the terminal 30, it is restricted from diffusing from the soldering area 10a to the adjacent area 30n below, and the resin material 6 for resin molding actively blends with and adheres to the adjacent area 30n.

As described above, this allows the solder material 5 to remain within the soldering area 10a of the terminal 30 while actively adhering the resin material 6 to the adjacent area 30n, and prevents the gap G formed between the solder material 5 and the resin material 6 from connecting to the gap G formed between the adhesive 3 on the terminal installation surface 2b and the resin material 6.

In this way, in the terminal 30 installation structure and manufacturing method of this embodiment, as in the above-described embodiment, moisture w that has permeated from the mating circuit or board side of the electric wire 4 can be prevented from penetrating into the gap G on the adhesive 3 side through the gap G on the solder material 5 side and spreading onto the surface of the terminal installation surface 2b, thereby preventing dielectric breakdown between the terminals 10 of the pressure sensor 100.

Here, as another aspect of this embodiment, although not shown in the figures, it goes without saying that it may be combined with one or both of the first and second embodiments described above.

<Fourth embodiment of method for manufacturing terminal structure>
In FIG. 10, the connector 101A of the pressure sensor 100 is manufactured by the following procedure: preparing a conventional terminal 1 as shown in FIG. 13; applying a plate-shaped mask material 41 made of a material having a non-affinity with which the molten solder 5m is incompatible to a boundary portion adjacent to the soldering area 10a; supplying molten solder 5m melted by a soldering iron 45 to the soldering area 10a; soldering the core wire 4e of the electric wire 4 to the end portion 10u of the terminal 1 for electrical continuity; and then filling the connector case 102A with a resin material 6 and resin-molding the entire terminal 1, thereby ensuring waterproofing around the terminal 1.

In this manufacturing procedure, molten solder 5m is poured into the soldering area 10a while the core wire 4e of the electric wire 4 is in contact with the end portion 10u of each terminal 1, ensuring electrical continuity, and the solder material 5 is solidified to maintain the connection, creating the installation structure for the terminal 1.

At this time, when the molten solder 5m is poured into the soldering area 10a of the terminal 1, the mask material 41 prevents the molten solder 5m from diffusing beyond the adjacent boundary of the soldering area 10a toward the terminal installation surface 2b.

As a result, as in the above embodiment, it is possible to prevent the gap G formed between the resin material 6 and the solder material 5 held within the soldering area 10a of the terminal 1 from communicating with the gap G formed between the adhesive 3 on the terminal mounting surface 2b and the resin material 6.

In this embodiment, the mask material 41 is pressed against the soldering area 10a to restrict soldering to adjacent areas, but this is not limited to the above. For example, instead of the mask material 41, a resist material may be applied (temporarily placed) as a mask to prevent the molten solder 5m from adhering, and the resist material may be removed after soldering.

In this way, in the method of manufacturing the terminal 1 of this embodiment, as in the above embodiment, it is possible to prevent moisture w that has permeated from the opposing circuit or substrate of the electric wire 4 from penetrating the gap G on the adhesive 3 side through the gap G on the solder material 5 side and spreading onto the surface of the terminal installation surface 2b, thereby preventing dielectric breakdown between the terminals 1 of the pressure sensor 100.

Here, as another aspect of this embodiment, although not shown in the figures, it goes without saying that it may be combined with one or more of the first to third embodiments described above.

<Fourth embodiment of terminal structure>
FIG. 11 is a diagram showing an example of a terminal connection structure of a pressure sensor including a terminal structure according to a fourth embodiment of the present invention.

In FIG. 11(a), the pressure sensor 100 has terminals (terminal portions) 50a to 50c, to which the core wire 4e of the electric wire 4 for input/output to the pressure sensor chip is soldered for conductive connection, arranged in parallel on a terminal block 52 in a connector case 102A, and the connector case 102A is filled with a resin material 6 and resin molded to surround the entire terminals 50a to 50c, ensuring waterproofing of the terminals 50a to 50c.

The terminal block 52 is fabricated such that the terminals 50a to 50c are inserted or insert-molded into the terminal mounting surfaces 52a to 52c, the gaps are sealed with adhesive 3, or the terminal mounting surface 52b is fixed in place with adhesive 3, and the central terminal mounting surface 52b is offset from the terminal mounting surfaces 52a and 52c on either side of the terminal mounting surface 52a toward the end of the terminal.

In contrast, as shown in FIG. 11(b), terminals 50a to 50c are arranged in parallel so that terminal surface 50f coincides with widthwise extension surface 50e, and are fixed to terminal installation surfaces 52a to 52c so that end portions 50u are at the same height as terminals 50a, 50c, as this is the soldering position for core wire 4e of electric wire 4. Terminals 50a to 50c may be made shorter than terminals 50a and 50c and embedded and fixed in terminal installation surfaces 52a to 52c, or may be made to the same length and terminal 50b may be embedded and fixed deeper than terminals 50a and 50c.

Here, the terminals 50a to 50c in this embodiment are arranged in series so that the terminal surface 50f coincides with the extension line of the extension surface 50e shown in FIG. 11, and the terminal installation surfaces 52a to 52c are offset while the adjacent intervals in the parallel (series) direction in the above embodiment are the same. For this reason, the following describes the relationship between the offset adjacent locations of the terminals 50a to 50c using the X direction, Y direction, and Z direction, which are mutually orthogonal to each other, to explain the three-dimensional space. In short, the offset relationship of the terminals 50a to 50c is described as the parallel direction in which the width direction of the terminal surface 50f is in series (parallel direction to the terminal installation surfaces 52a to 52c that extend the extension line of the extension surface 50e) as the X direction. Similarly, the offset relationship is described as the thickness direction between the front and back of the terminal surface 50f of the terminals 50a to 50c, that is, the direction parallel to the terminal installation surfaces 52a to 52c and perpendicular to the X direction as the Y direction. Additionally, the offset relationship will be explained with the longitudinal direction from the terminal installation surfaces 52a-52c of the terminals 50a-50c toward the end portion 50u, i.e., the direction perpendicular to the X and Y directions parallel to the terminal installation surfaces 52a-52c, being the Z direction.

In other words, the terminals 50a to 50c are installed on terminal installation surfaces 52a to 52c that are offset in the Z direction, i.e., the installation planes are staggered in the longitudinal direction, and are arranged so that the creepage distance in the X direction + Z direction between adjacent locations is greater than the adjacent distance on terminal installation surface 2b at the same height (the adjacent distance in only the X direction when viewed from the front perpendicular to the parallel direction).

As a result, when moisture w penetrates from the core 4e side of the wire 4, as shown in FIG. 11(c), even if a gap G is formed between the solder material 5 or adhesive 3 and the resin material 6 and they communicate with each other, the creepage distance between the installation points on the terminal installation surfaces 52a to 52c can be made larger (longer) than between the terminals 1 on the terminal installation surface 2b shown in FIG. 14, thereby reducing the possibility of a short circuit caused by the moisture w. Also, if the terminals 50a to 50c and the resin material 6 peel off at or near the interface and cracks occur, the cracks are less likely to connect, reducing the possibility of a short circuit caused by the moisture w.

In this way, in the installation structure of the terminals 50a to 50c of this embodiment, even if moisture w that has permeated from the opposing circuit of the electric wire 4 or the substrate enters through the gap G on the solder material 5 side and the adhesive 3 side, the creepage distance between adjacent installations on the terminal installation surfaces 52a to 52c can be increased to prevent short circuits, thereby reducing the possibility of dielectric breakdown occurring between the terminals 10 of the pressure sensor 100.

Here, as another aspect of this embodiment, although not shown in the figures, it goes without saying that it may be combined with one or more of the first to third embodiments described above.

<Fifth embodiment of terminal structure>
FIG. 12 is a diagram showing an example of a terminal connection structure of a pressure sensor including a terminal structure according to a fifth embodiment of the present invention.

In FIG. 12(a), the pressure sensor 100 has terminals (terminal portions) 60a to 60c, to which the core wire 4e of the electric wire 4 for input/output to the pressure sensor chip is soldered for conductive connection, arranged in parallel on a terminal block 62 in a connector case 102A, and the connector case 102A is filled with a resin material 6 and resin molded so as to surround the entire terminals 60a to 60c, ensuring waterproofing of the terminals 60a to 60c.

The terminal block 62 is fabricated so that the terminals 60a to 60c are inserted or insert-molded into the terminal mounting surface 62b at the same level in the longitudinal direction (Z direction), and the gaps are sealed with adhesive 3 or the terminals are fixed with adhesive 3.

In contrast, as shown in FIG. 12(b), the central terminal 60b is fixed in a so-called in-plane offset position in which the extension surface 60e of the terminal surface 60f in the width direction is offset from the extension surfaces 60e of the terminals 60a and 60c on both sides in the direction perpendicular to the adjacent direction, i.e., in the Y direction.

In other words, the terminals 60a to 60c are installed on the terminal installation surface 62b at positions offset in the Y direction in a plane, i.e., staggered in the orthogonal Y direction relative to the parallel X direction, and are arranged so that the creepage distance in the X direction + Y direction between adjacent locations is greater than the adjacent spacing on the terminal installation surface 2b (the adjacent spacing in only the X direction when viewed from the front perpendicular to the parallel direction).

As a result, when moisture w penetrates into the terminals 60a-60c from the core wire 4e side of the electric wire 4 as shown in FIG. 12(c), even if a gap G is formed between the solder material 5 or adhesive 3 and the resin material 6 and they communicate with each other, the creepage distance between the installation points on the terminal installation surface 62b can be made larger (longer) than between the terminals 1 on the terminal installation surface 2b shown in FIG. 14, thereby reducing the possibility of a short circuit caused by the moisture w. Also, if the terminals 60a-60c and the resin material 6 peel off at or near the interface and cracks occur, the cracks are less likely to connect, reducing the possibility of a short circuit caused by the moisture w.

Thus, even in the installation structure of the terminals 60a to 60c of this embodiment, even if moisture w that has permeated from the opposing circuit of the electric wire 4 or the substrate enters through the gap G on the solder material 5 side and the adhesive 3 side, the creepage distance between adjacent installations on the terminal installation surface 62b can be increased to prevent short circuits, thereby reducing the possibility of dielectric breakdown occurring between the terminals 10 of the pressure sensor 100.

Here, as another aspect of this embodiment, although not shown in the figures, it goes without saying that it may be combined with one or more of the first to fourth embodiments described above.

In this embodiment, a pressure sensor has been used as an example, but the invention is not limited to pressure sensors and can be applied to other devices such as pressure switches, solenoid valve coils, relay connectors, and other devices that require general waterproofing, in which the terminals and wires are soldered together and housed inside a waterproof cover that is filled with a resin material.

The scope of the present invention is not limited to the exemplary embodiments shown and described, but includes all embodiments that achieve the same effect as the object of the present invention. Furthermore, the scope of the present invention is not limited to the combination of the inventive features defined by each claim, but can be defined by any desired combination of specific features among all the respective disclosed features.

1, 10, 20, 30, 50a to 50c, 60a to 60c... terminals 2, 52, 62... terminal blocks 2b, 52a to 52c, 62b... terminal installation surface 3... adhesive 4... electric wire 4e... core wire 5... solder material 5m... molten solder 6... resin material 10a... soldering area 10s... sides 10u, 50u, 60u... termination portion 13... openings 14, 15... notch portion 21... plating 30n... adjacent area 41... mask material 45... soldering iron 100... pressure sensor 101A... connector 101B... sensor element 102A... connector case 102B... sensor case G... gap w... moisture

Claims (13)

A terminal structure in which a plurality of terminal portions to which a conductive material is electrically connected by soldering with molten solder are arranged on a terminal installation surface, and the terminal portions are surrounded by a resin mold together with the conductive material to ensure insulation,
the terminal portion is bonded and fixed to the terminal installation surface by an adhesive,
The terminal portion has an end side that is a soldering area for the conductive material, and a limiting portion is formed that limits the extension of the molten solder from the soldering area toward the adjacent terminal installation surface, thereby achieving close contact of the resin mold with the terminal portion between the soldering area and the adhesive, thereby avoiding dielectric breakdown between the terminal portions on the terminal installation surface side that occurs when a gap opens between the solder surface of the soldering area and the resin mold that may form on the adhesive surface on the terminal installation surface side. The terminal structure according to claim 1, characterized in that the limiting portion is formed narrower than the soldering area of the terminal portion to limit the molten solder from extending toward the terminal installation surface. The terminal structure according to claim 2, characterized in that the limiting portion is narrower than the soldering area by forming an opening between both sides of the terminal portion in the width direction, or by forming a notch on one or both sides of the terminal portion in the width direction. The terminal structure according to claim 1, characterized in that the restricting portion restricts the molten solder from extending toward the terminal installation surface by forming an area adjacent to the soldering area of the terminal portion on a surface that is incompatible with the molten solder. The terminal structure according to any one of claims 1 to 4, characterized in that the soldering area of the terminal portion has a surface that is compatible with the molten solder. The terminal structure according to any one of claims 1 to 5, characterized in that the terminal portion has a surface in which the area adjacent to the soldering area is in close contact with the resin mold. A method for manufacturing a terminal structure in which a plurality of terminal portions, to which a conductive material is electrically connected by soldering with molten solder, are arranged on a terminal installation surface, and a resin molding is performed to surround the terminal portions together with the conductive material to ensure insulation,
The terminal portion is bonded and fixed to the terminal installation surface by an adhesive,
A method for manufacturing a terminal structure, characterized in that the molten solder is restricted from extending from the soldering area toward the terminal installation surface so that the end side of the terminal portion becomes the soldering area of the conductive material, and tight adhesion of the resin mold to the terminal portion between the soldering area and the adhesive is achieved, thereby avoiding insulation breakdown between the terminal portions on the terminal installation surface side caused by a gap between the solder surface of the soldering area and the resin mold that may form on the adhesive surface on the terminal installation surface side. preparing a terminal portion having a limiting portion formed thereon that limits the extension of the molten solder from the soldering area toward the terminal installation surface side so that an end side of the terminal portion becomes a soldering area of the conductive material;
8. The method for manufacturing a terminal structure according to claim 7, wherein the conductive material is soldered to the terminal portion for electrical connection. The method for manufacturing the terminal structure described in claim 7, characterized in that the conductive material is soldered to the terminal portion to establish a conductive connection while a mask is temporarily placed to limit the extension of the molten solder from the soldering area so that the end side of the terminal portion becomes the soldering area of the conductive material. A terminal structure in which a plurality of terminal parts to which a conductive material is electrically connected by soldering with molten solder are arranged in parallel on a terminal installation surface, and the terminal parts are surrounded by a resin mold together with the conductive material to ensure insulation,
The terminal portion is bonded and fixed to the terminal installation surface by an adhesive, and an end side of the terminal portion is a soldering area of the conductive material,
The terminal portions are arranged so that the creepage distance on the terminal installation surface between adjacent portions is greater than the adjacent spacing when the terminal portions are arranged in series in a straight line, thereby reducing the possibility of dielectric breakdown between the terminal portions on the terminal installation surface side compared to when the terminal portions are arranged in series, even when a gap between the solder surface of the soldering area and the resin mold, which may be formed on the adhesive surface on the terminal installation surface side, communicates. The terminal structure according to claim 10, characterized in that the terminal parts are arranged at offset positions in one or both of the Y direction parallel to the terminal installation surface and the Z direction perpendicular to the terminal installation surface, when the X direction is the serial direction in which the installation locations of the terminal parts are arranged in a straight line, among the X direction, Y direction, and Z direction which are mutually orthogonal. A terminal structure in which a plurality of terminal parts to which a conductive material is electrically connected by soldering with molten solder are arranged in parallel on a terminal installation surface, and the terminal parts are resin-molded together with the conductive material to ensure insulation,
The terminal structure is a combination of the terminal structure according to any one of claims 1 to 6 and the terminal structure according to any one of claims 10 and 11. A terminal structure in which a plurality of terminal parts to which a conductive material is electrically connected by soldering with molten solder are arranged on a terminal installation surface, and the terminal parts are surrounded by a resin mold together with the conductive material to ensure insulation,
the terminal portion is bonded and fixed to the terminal installation surface by an adhesive,
The terminal portion has an end side that is a soldering area of the conductive material and a soldering area on a surface that is compatible with the molten solder, and achieves close contact with the terminal portion of the resin mold between the soldering area and the adhesive, thereby avoiding insulation breakdown between the terminal portions on the terminal installation surface side that would occur if a gap were to form between the solder surface of the soldering area and the resin mold, which may form on the adhesive surface on the terminal installation surface side, and which would result in insulation breakdown between the terminal portions on the terminal installation surface side.

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