JP7645489B2 - CALIBRATION SYSTEM, CALIBRATION METHOD, AND COMPONENT PLACEMENT APPARATUS - Google Patents

Description

The present invention relates to a calibration system and calibration method for calibrating a component mounting device, and the component mounting device.

The component mounting device mounts components held by nozzles onto a board to produce a mounted board. In order to reduce misalignment of components to be mounted on the board and increase mounting accuracy, the component mounting device performs calibration to measure offset values in advance that cancel out distortion in each part of the device, and controls each part based on this offset value to mount the components on the board. The system (substrate-related work machine) of Patent Document 1 mounts a head having multiple nozzles, measures the height of the mounted head based on the downward stroke of the nozzles, and performs calibration to determine the mounting error, which is the difference from the design height stored by the head, and controls the component mounting work based on this mounting error.

JP 2014-123781 A

The mounting head is equipped with a component mounting section for each nozzle, which has a mechanism for lowering the nozzle, and in order to mount components with high precision, an offset value that cancels out the distortion of the mechanism is stored for each component mounting section. However, if calibration is performed for all component mounting sections when the component mounting device is relocated, when the mounting head is replaced, or when distortion of the device caused by heat generation during component mounting work is corrected at specified intervals, there is a problem that productivity decreases because component mounting work is interrupted during calibration.

The present invention aims to provide a calibration system, calibration method, and component mounting device that can properly calculate the offset value of a mounting head having multiple nozzles.

The calibration system of the present invention includes a plurality of component mounting sections, each having a component holder for holding components, for mounting components on a board, a storage section for storing at least offset values for each of the plurality of component mounting sections, a data acquisition means for acquiring data relating to the heights of the plurality of component mounting sections, and an offset value calculation section for calculating offset values for the plurality of component mounting sections based on the data, the data acquisition means acquiring data for at least two of the plurality of component mounting sections, and the offset value calculation section calculating offset values for each of the plurality of component mounting sections based on the acquired data for the at least two component mounting sections.

The calibration method of the present invention is a calibration method that calculates offset values for a plurality of component mounting parts that mount components on a board, each of which has a component holder that holds components, and includes a data acquisition process that acquires data on the heights of the plurality of component mounting parts, and an offset value calculation process that calculates offset values for the plurality of component mounting parts based on the data, in which the data is acquired for at least two of the plurality of component mounting parts in the data acquisition process, and the offset values for the plurality of component mounting parts are calculated based on the data acquired for the at least two component mounting parts in the offset value calculation process.

The component mounting device of the present invention includes a plurality of component mounting sections, each having a component holder for holding components, which mounts components on a board; a storage section for storing at least the offset values of each of the plurality of component mounting sections; a data acquisition section for controlling each of the plurality of component mounting sections to acquire data relating to the heights of the plurality of component mounting sections; and an offset value calculation section for calculating offset values of the plurality of component mounting sections based on the data, the data acquisition section acquiring data for at least two of the plurality of component mounting sections, and the offset value calculation section calculating the offset values of each of the plurality of component mounting sections based on the data for the at least two component mounting sections.

According to the present invention, it is possible to properly calculate the offset value of a mounting head having multiple nozzles.

FIG. 1 is a plan view of a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is a configuration explanatory diagram of a component mounting device according to an embodiment of the present invention; FIG. 2A is a plan view of a mounting head provided in a component mounting apparatus according to an embodiment of the present invention; FIG. 2 is a block diagram showing the configuration of a control system of the component mounting device according to the embodiment of the present invention. FIG. 1 is an explanatory diagram of measurement of the height of a component mounting unit provided in a component mounting device according to an embodiment of the present invention; FIG. 2 is an explanatory diagram of calibration of a component mounting unit provided in a component mounting device according to an embodiment of the present invention; FIG. 2 is an explanatory diagram of calculation of an offset value of a component mounting unit provided in a component mounting device according to an embodiment of the present invention. FIG. 1 is a flow diagram of a calibration method according to an embodiment of the present invention;

An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the component mounting device and mounting head. In the following, the same reference numerals are used for corresponding elements in all drawings, and duplicated explanations will be omitted. In FIG. 1 and in some parts described below, the X-axis (left-right direction in FIG. 1) in the board transport direction and the Y-axis (up-down direction in FIG. 1) perpendicular to the board transport direction are shown as two axes that are perpendicular to each other in the horizontal plane. In FIG. 2 and in some parts described below, the Z-axis (up-down direction in FIG. 2) is shown as the height direction perpendicular to the horizontal plane.

First, the configuration of the component mounting device 1 will be described with reference to Figures 1 and 2. Note that Figure 2 shows a schematic view of a portion of the component mounting device 1 in Figure 1. The component mounting device 1 has the function of performing a component mounting operation in which components supplied from a component supply unit are mounted on a board. A board transport mechanism 3 is disposed along the X-axis in the center of the base 2. The board transport mechanism 3 transports the board P transported from upstream to the mounting operation position, positions it, and holds it. The board transport mechanism 3 also transports the board P downstream after the component mounting operation has been completed.

Component supply units 4 are arranged on both sides of the board transport mechanism 3 (front and rear directions of the Y axis). Each component supply unit 4 has multiple tape feeders 5 attached along the X axis. The tape feeders 5 feed a component tape, on which pockets for storing components D are formed, at a pitch rate in a direction (tape feed direction) from the outside of the component supply unit 4 toward the board transport mechanism 3, thereby supplying components D to a component supply position where the components D are picked up by a mounting head, which will be described below.

In Figures 1 and 2, a Y-axis table 6 equipped with a linear drive mechanism is arranged along the Y-axis at both ends of the X-axis on the top surface of the base 2. A beam 7 similarly equipped with a linear drive mechanism is connected to the Y-axis table 6 so as to be freely movable along the Y-axis. The beam 7 is arranged along the X-axis. A mounting head 8 is attached to the beam 7 via a plate 7a so as to be freely movable along the X-axis. The mounting head 8 is detachable from the plate 7a. The mounting head 8 is equipped with a plurality of component mounting units 9. A nozzle 10 that sucks and holds a component D is attached to the lower end of each component mounting unit 9. Each component mounting unit 9 is equipped with an elevation motor 9a that raises and lowers the nozzle 10 along the Z-axis.

In FIG. 1, the Y-axis table 6 and beam 7 constitute a head movement mechanism 11 that moves the mounting head 8 along the X-axis and Y-axis. The head movement mechanism 11 and mounting head 8 perform a mounting turn in which a component D is sucked up and removed from a tape feeder 5 arranged in the component supply section 4 by a nozzle 10 attached to the component mounting section 9, and mounted at a mounting position on a board P positioned by the board transport mechanism 3. In this way, each of the multiple component mounting sections 9 has a component holder (nozzle 10) that holds the component D, and mounts the component D on the board P.

In Figures 1 and 2, a component recognition camera 12 is disposed between the component supply unit 4 and the board transport mechanism 3. When the mounting head 8, which has picked up a component D from the component supply unit 4, moves above the component recognition camera 12, the component recognition camera 12 captures an image of the component D held by the mounting head 8 to recognize the holding posture of the component D. A head camera 13 is attached to the plate 7a to which the mounting head 8 is attached. The head camera 13 moves integrally with the mounting head 8.

As the mounting head 8 moves, the head camera 13 moves above the board P positioned on the board transport mechanism 3 and captures an image of a board mark (not shown) on the board P to recognize the position of the board P. When the mounting head 8 mounts components on the board P, the mounting position is corrected taking into account the recognition results of the component D by the component recognition camera 12 and the recognition results of the board position by the head camera 13.

In FIG. 2, a cart 14 with multiple tape feeders 5 already attached to the top is set in the component supply section 4. The cart 14 holds a reel 16 that stores a component tape 15 holding components D in a wound state. The component tape 15 pulled out from the reel 16 is pitch-fed by the tape feeders 5 to the component supply position.

1 and 2, multiple (four in this example) reference posts 17 are installed on the upper surface of the base 2 around the mounting position of the board transport mechanism 3. The reference posts 17 are made of a hard material such as metal, and have a flat upper surface. In FIG. 2, the height position of the upper surface of the reference posts 17 is located at the mounting reference height H0, which is the same as the height of the upper surface of the board P positioned at the mounting position of the board transport mechanism 3. The head camera 13 captures the upper surfaces of the multiple reference posts 17 and recognizes the position of each reference post 17 in the horizontal plane, thereby measuring the thermal deformation of the Y-axis table 6 and beam 7 caused by heat generated by the repeated movement of the beam 7 and mounting head 8. The reference posts 17 are also used to measure (calibrate) the height of the component mounting section 9 of the mounting head 8 mounted on the plate 7a, which will be described later.

Next, the configuration of the mounting head 8 will be described with reference to Figures 3(a) and 3(b). The mounting head 8, which is detachable from the plate 7a, has multiple component mounting sections 9(1) to 9(16). In this example, the mounting head 8 has eight component mounting sections 9 aligned along the X-axis in two rows along the Y-axis. That is, the mounting head 8 has eight component mounting sections 9(1) to 8(8) in the first row, and eight component mounting sections 9(9) to 8(16) in the second row. Each component mounting section 9(1) to 9(16) has a lifting motor 9a. By driving the lifting motor 9a, each component mounting section 9(1) to 9(16) raises and lowers the nozzle 10 attached to its lower end (arrow a). The distance (height position) that the nozzle 10 has descended is detected by the encoder of the lifting motor 9a.

Next, referring to Figure 4, the configuration of the control system of the component mounting device 1 will be described, focusing on the function of calculating offset values for the multiple component mounting units 9 of the mounting head 8. The component mounting device 1 includes a control device 20, a board transport mechanism 3, a tape feeder 5, a mounting head 8, a head movement mechanism 11, a component recognition camera 12, and a head camera 13. The mounting head 8 includes a head memory unit 8a and multiple component mounting units 9.

The head memory unit 8a is a non-volatile memory device that stores offset values that cancel out distortions caused by variations in the characteristics of the lift motors 9a of the multiple component mounting units 9 equipped on the mounting head 8, misalignments during manufacturing, etc. The offset values stored in the head memory unit 8a are calculated and updated during shipping inspection of the mounting head 8, calibration after mounting on the component mounting device 1, etc.

In FIG. 4, the control device 20 includes a control memory unit 21, a mounting control unit 22, a data acquisition unit 23, an offset value calculation unit 24, and an update unit 25. The control memory unit 21 is a storage device that stores mounting data 26, acquisition data 27, offset value data 28, etc. The mounting data 26 stores various information such as the type of component D to be mounted on the board P and the coordinates of the mounting position on the board P for each type of mounting board.

When the mounting head 8 is mounted on the component mounting device 1 or when the component mounting device 1 is started, the mounting control unit 22 reads out the offset value (first offset value) stored in the head memory unit 8a of the mounting head 8 and stores it in the control memory unit 21 as offset value data 28. In this way, the head memory unit 8a and the control memory unit 21 are memory units that store at least offset values that cancel out the distortions of the multiple component mounting units 9.

In FIG. 4, the mounting control unit 22 performs a component mounting operation by raising and lowering the nozzle 10 (component holder) mounted on the component mounting unit 9 of the mounting head 8 based on the mounting data 26 and offset value data 28 (first offset value) to pick up the component D supplied by the tape feeder 5 (component supply unit) and mount it at the mounting position on the board P. For example, when the nozzle 10 mounted on the component mounting unit 9(1) picks up the component D from the tape feeder 5 and mounts the component D on the board P, the mounting control unit 22 controls the lifting motor 9a of the component mounting unit 9(1) based on the offset value of the component mounting unit 9(1) included in the offset value data 28 to correct the amount of descent of the nozzle 10.

The data acquisition unit 23 controls the head movement mechanism 11 and the lifting motors 9a of the multiple component mounting units 9 of the mounting head 8 to execute a height measurement process to acquire data on the heights of the multiple component mounting units 9 (mounting unit heights). The acquired data is stored in the control memory unit 21 as acquired data 27.

Here, the height measurement process by the data acquisition unit 23 will be described with reference to FIG. 5. In the height measurement process, the data acquisition unit 23 first controls the head movement mechanism 11 to move the component mounting unit 9 to be measured above the reference post 17 (arrow b). Next, the data acquisition unit 23 controls the lift motor 9a of the component mounting unit 9 to be measured to lower the nozzle 10 mounted on the component mounting unit 9 to be measured until its bottom end abuts the upper surface of the reference post 17 (arrow c). Next, the data acquisition unit 23 acquires the distance the nozzle 10 has descended and stopped, detected by the encoder of the lift motor 9a, as the mounting unit height (data).

The component mounting device 1 is set so that the height at which the lower ends of the nozzles 10 of the multiple component mounting units 9 of the mounting head 8 mounted on the plate 7a wait is set to a waiting reference height H1, which is set above the mounting reference height H0 set on the top surface of the reference post 17 by the reference height Z0 along the Z axis.

In this way, the data acquisition unit 23, the head movement mechanism 11, the lifting motor 9a of the component mounting unit 9, and the reference post 17 constitute a data acquisition means 29 that acquires data (mounting unit height) regarding the heights of the multiple component mounting units 9. The data acquisition means 29 (data acquisition unit 23) acquires data (mounting unit height) by lowering the nozzle 10 (component holder) of the component mounting unit 9. Note that the area for measuring the height against which the lower end of the nozzle 10 abuts is not limited to the upper surface of the reference post 17. In other words, the area for measuring the height may be any area that is in a position where the lower end of the nozzle 10 can abut, is hard, and has little fluctuation in height (for example, the upper surface of the rail of the board transport mechanism 3).

Furthermore, the data acquisition means 29 is not limited to a configuration in which the lowered nozzle 10 is brought into contact with the reference post 17 and data is acquired by the encoder of the lifting motor 9a. For example, the data acquisition means 29 may be configured to acquire data on the height of the lowered nozzle 10 by capturing an image of the vicinity of the tip of the lowered nozzle 10 using a camera that captures the image from the side.

In FIG. 4, the offset value calculation unit 24 calculates offset values (second offset values) for the multiple component mounting units 9 based on the data (mounting unit height) acquired by the data acquisition means 29. The offset value calculation unit 24 stores the calculated offset values in the control memory unit 21 as offset value data 28.

The data acquisition means 29 (data acquisition unit 23) acquires data (mounting unit height) for at least two of the multiple component mounting units 9(1)-9(16). The offset value calculation unit 24 then calculates the offset values for each of the multiple component mounting units 9(1)-9(16) based on the acquired data for at least two of the multiple component mounting units 9(1)-9(16). For example, when the mounting head 8 is replaced in an operation to change the board type of the mounting board produced by the component mounting device 1, data is acquired for some of the component mounting units 9(1)-9(16), and offset values for all of the component mounting units 9(1)-9(16) are calculated.

Now, referring to FIG. 6 and FIG. 7, an example of calculation of the offset value by the offset value calculation unit 24 will be described. In this example in FIG. 6, the data acquisition means 29 measures the mounting part heights Z1 and Z2 at two of the multiple component mounting parts 9(1) to 9(16), namely, at the component mounting part 9(1) and the component mounting part 9(8). That is, among the eight component mounting parts 9(1) to 9(8) in the first row of the mounting head 8, the mounting part heights Z1 and Z2 are measured at the two component mounting parts 9(1) and 9(8) at both ends. Note that the component mounting parts for measuring the mounting part heights Z1 and Z2 are not limited to the component mounting part 9(1) and the component mounting part 9(8), and may be any of the component mounting parts 9(1) to 9(16). For example, the data acquisition means 29 may measure the mounting part heights Z1 and Z2 at the two component mounting parts 9(9) and 9(16) at both ends of the second row.

Figure 7 shows an example of offset value data 28 before and after the calculation of the offset value. The numbers indicate the positions of the component mounting units 9 (1) to 9 (16). The offset value before calculation is the offset value (first offset value) stored in the memory unit (head memory unit 8a, control memory unit 21). The offset value after calculation is the offset value (second offset value) calculated by the offset value calculation unit 24 based on the mounting unit heights Z1 and Z2. The offset value is set as the deviation from the standby reference height H1 at which the lower end of the nozzle 10 mounted on the component mounting units 9 (1) to 9 (16) waits. In other words, the offset value is a correction value from the reference height Z0 when the waiting nozzle 10 is lowered.

First, the offset value calculation unit 24 calculates the difference A (A = Z1 - Z0) between the mounting part height Z1 of the component mounting part 9 (1) and the reference height Z0, and the difference B (B = Z2 - Z0) between the mounting part height Z2 of the component mounting part 9 (8) and the reference height Z0. Next, the offset value calculation unit 24 calculates the offset values of the component mounting parts 9 (1) to 8 (8) by complementing the difference A and the difference B. In other words, the offset value is calculated so that the offset value changes between adjacent component mounting parts by the complement value "(B - A)/7".

Specifically, the offset value calculation unit 24 calculates the calculated offset value "a+A" by adding the difference A to the offset value "a" before calculation for the component mounting unit 9 (1) in the first row. The offset value calculation unit 24 also calculates the calculated offset value "b+A+(B-A)/7" by adding the difference A and the complementary value "(B-A)/7" to the offset value "b" before calculation for the component mounting unit 9 (2). The offset value calculation unit 24 also calculates the calculated offset value "c+A+2×(B-A)/7" by adding the difference A and twice the complementary value to the offset value "c" before calculation for the component mounting unit 9 (3). The calculated offset values (second offset values) for the component mounting units 9 (4) to 9 (8) in the first row are calculated in the same manner.

The offset value calculation unit 24 also calculates the post-calculation offset value "i+A" for the component mounting unit 9 (9) in the second row by adding the difference A to the pre-calculation offset value "i". The offset value calculation unit 24 also calculates the post-calculation offset value "j+A+(B-A)/7" for the component mounting unit 9 (10) by adding the difference A and the complementary value "(B-A)/7" to the pre-calculation offset value "j". Similarly, the offset value calculation unit 24 calculates the post-calculation offset values (second offset values) for the component mounting units 9 (11) to 8 (16) in the second row.

In this way, the mounting part heights Z1 and Z2 are acquired for only some of the component mounting parts 9(1) and 9(8), and the offset values (second offset values) for all of the component mounting parts 9(1) to 9(16) are calculated based on the acquired mounting part heights Z1 and Z2. This makes it possible to shorten the time required to acquire the offset values (calibration time).

In FIG. 4, the update unit 25 updates the offset value (first offset value) stored in the memory unit (head memory unit 8a, control memory unit 21) to the offset value (second offset value) calculated by the offset value calculation unit 24. At that time, if the offset value (second offset value) calculated by the offset value calculation unit 24 is within a predetermined range (for example, between -0.1 and +0.1), the update unit 25 does not update the offset value (first offset value) stored in the memory unit.

Alternatively, if the difference (differences A and B) between the offset value (second offset value) calculated by the offset value calculation unit 24 and the offset value (first offset value) stored in the memory unit is within a predetermined range (for example, between -0.05 and +0.05), the update unit 25 does not update the offset value (first offset value) stored in the memory unit. For example, if the difference between the offset value (second offset value) calculated from the mounting section heights Z1 and Z2 of some component mounting sections 9(1) and 9(8) and the offset value before calculation (first offset value) is within the measurement error range, the component mounting work is performed using the existing offset value (first offset value).

Next, following the flow of FIG. 8, a calibration method (offset value calculation method) for calculating offset values that cancel out distortions of the multiple component mounting units 9 that mount components D on the board P in the component mounting device 1 will be described. First, the mounting control unit 22 reads out the offset value (first offset value) stored in the head memory unit 8a, and stores it in the control memory unit 21 as offset value data 28 (ST1: first offset value reading process).

Next, the data acquisition means 29 acquires data (mounting part height) for some of the multiple component mounting parts 9 (ST2: partial data acquisition process). In the example of Figures 6 and 7, mounting part heights Z1 and Z2 are acquired for two component mounting parts 9 (1) and 9 (8).

In FIG. 8, the offset value calculation unit 24 then calculates offset values (second offset values) for each of the component mounting units 9 based on the acquired data (mounting unit heights) for some of the component mounting units 9 (ST3: offset value calculation process). The update unit 25 then determines whether the offset value calculated in the offset value calculation process (ST3) satisfies a predetermined update condition (ST4: update determination process).

For example, the update unit 25 determines that the update condition is satisfied when the calculated offset value (second offset value) is not within a predetermined range. Alternatively, the update unit 25 determines that the update condition is satisfied when the difference between the calculated offset value and the offset value (first offset value) stored in the memory unit (head memory unit 8a, control memory unit 21) is not within a predetermined range.

In FIG. 8, if the offset value (second offset value) calculated in the offset value calculation process (ST3) satisfies the update condition (Yes in ST4), the update unit 25 updates the offset value (first offset value) stored in the memory unit (head memory unit 8a, control memory unit 21) to the offset value (second offset value) calculated in the offset value calculation process (ST3) (update process: ST5). If the offset value calculated in the offset value calculation process (ST3) does not satisfy the update condition (No in ST4), the calibration ends without executing the update process (ST5). That is, the offset value (first offset value) stored in the memory unit (head memory unit 8a, control memory unit 21) is not updated.

As described above, the calibration method of this embodiment includes a data acquisition process (ST2) for acquiring data (mounting section height) relating to the heights of multiple component mounting sections 9, and an offset value calculation process (ST3) for calculating offset values (second offset values) for the multiple component mounting sections 9 based on the acquired data. Then, data (mounting section heights) are acquired for at least two component mounting sections 9 (ST2), and offset values (second offset values) for all component mounting sections 9 are calculated (ST3). This makes it possible to appropriately calculate offset values that cancel out distortions in a mounting head 8 having multiple component mounting sections 9 (nozzles 10).

In the above, an example has been described in which the calibration system for calculating the offset value of a mounting head 8 having multiple component mounting units 9 is configured only with a component mounting device 1, but the calibration system is not limited to this example. For example, the calibration system may be configured by combining a management computer that manages a component mounting line configured to include the component mounting device 1 with the component mounting device 1, with the management computer having an offset value calculation unit 24.

The calibration system, calibration method, and component mounting device of the present invention have the effect of being able to properly calculate the offset value of a mounting head having multiple nozzles, and are useful in the field of mounting components to a circuit board.

1. Component mounting device (maintenance system)
9, 9 (1) to 9 (16) Component mounting section 10 Nozzle (component holder)
29 Data acquisition means D Part P Board Z1, Z2 Mounting part height (data)

Claims (15)

a plurality of component mounting sections each having a component holder for holding a component and configured to mount the components on a board;
A storage unit that stores at least an offset value of each of the component mounting units;
A data acquisition means for acquiring data relating to the heights of the component mounting portions;
an offset value calculation unit that calculates offset values of the component mounting units based on the data,
the data acquisition means acquires data from at least two of the component mounting units of the plurality of component mounting units, and the offset value calculation unit calculates offset values of the plurality of component mounting units based on the acquired data of the at least two component mounting units,
Calibration system. An update unit that updates the offset value stored in the storage unit to the offset value calculated by the offset value calculation unit.
The calibration system of claim 1 . When the offset value calculated by the offset value calculation unit is within a predetermined range, the update unit does not update the offset value stored in the storage unit.
The calibration system of claim 2 . When a difference between the offset value calculated by the offset value calculation unit and the offset value stored in the storage unit is within a predetermined range, the update unit does not update the offset value stored in the storage unit.
The calibration system of claim 2 . the data acquisition means acquires the data by lowering the component holder of the component mounting unit.
A calibration system according to any one of claims 1 to 4. A calibration method for calculating offset values of a plurality of component mounting units each having a component holder for holding a component and mounting the components on a board, the method comprising the steps of:
a data acquisition step of acquiring data relating to heights of the component mounting portions;
and an offset value calculation step of calculating offset values of the component mounting portions based on the data,
In the data acquiring step, the data is acquired for at least two of the component mounting units of the plurality of component mounting units, and in the offset value calculating step, offset values of the plurality of component mounting units are calculated based on the acquired data for the at least two component mounting units.
Calibration method. The method further includes an updating step of updating the offset value stored in the storage unit to the offset value calculated in the offset value calculation step.
The calibration method according to claim 6. When the offset value calculated in the offset value calculation step is within a predetermined range, the offset value stored in the storage unit is not updated in the update step.
The calibration method according to claim 7. When a difference between the offset value calculated in the offset value calculation step and the offset value stored in the storage unit is within a predetermined range, the offset value stored in the storage unit is not updated in the update step.
The calibration method according to claim 7. In the data acquisition step, the component holder of the component mounting unit is lowered to acquire the data.
The calibration method according to any one of claims 6 to 9. a plurality of component mounting sections each having a component holder for holding a component and configured to mount the components on a board;
A storage unit that stores at least an offset value of each of the component mounting units;
a data acquisition unit that controls each of the component mounting units to acquire data relating to heights of the component mounting units;
an offset value calculation unit that calculates offset values of the component mounting units based on the data,
the data acquisition unit acquires data from at least two of the component mounting units of the plurality of component mounting units, and the offset value calculation unit calculates offset values of the plurality of component mounting units based on the data from the at least two component mounting units.
Parts mounting device. An update unit that updates the offset value stored in the storage unit to the offset value calculated by the offset value calculation unit.
The component mounting apparatus according to claim 11. When the offset value of the at least one component mounting unit calculated by the offset value calculation unit is within a predetermined range, the update unit does not update the offset value stored in the storage unit.
13. The component mounting apparatus according to claim 12. When a difference between the offset value of the at least one component mounting unit calculated by the offset value calculation unit and the offset value of the at least one component mounting unit stored in the storage unit is within a predetermined range, the update unit does not update the offset value stored in the storage unit.
13. The component mounting apparatus according to claim 12. the data acquisition unit acquires the data by lowering the component holder of the component mounting unit.
15. The component mounting apparatus according to claim 11.

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