JP7646410B2 - 液体吐出ヘッド - Google Patents
液体吐出ヘッド Download PDFInfo
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- JP7646410B2 JP7646410B2 JP2021051490A JP2021051490A JP7646410B2 JP 7646410 B2 JP7646410 B2 JP 7646410B2 JP 2021051490 A JP2021051490 A JP 2021051490A JP 2021051490 A JP2021051490 A JP 2021051490A JP 7646410 B2 JP7646410 B2 JP 7646410B2
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- 239000007788 liquid Substances 0.000 title claims description 33
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 230000004044 response Effects 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 85
- 230000032258 transport Effects 0.000 description 15
- 238000007747 plating Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000005192 partition Methods 0.000 description 6
- 230000010287 polarization Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14274—Structure of print heads with piezoelectric elements of stacked structure type, deformed by compression/extension and disposed on a diaphragm
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
以下に、本願出願当初の特許請求の範囲に記載された発明と同等の記載を付記する。
(1)
第1領域及び第2領域を有する電極層と、前記電極層の第2領域に積層されるカバー層と、を有するFPCと、
前記FPCの電極層の第1領域に対向配置されるとともに段差を有し、前記電極層の第1領域に接続される接合面、及び前記接合面よりも前記FPCから退避する退避面を有する複数の圧電素子と、備える、液体吐出ヘッド。
(2)
前記FPCは前記圧電素子の前記接合面にハンダまたは異方導電性接着剤を介して電気的及び機械的に接続される、(1)に記載の液体吐出ヘッド。
(3)
前記圧電素子は、複数の圧電体層を積層して備え、
前記圧電素子の振動により容積が変化する圧力室と、前記圧力室に連通するノズルと、を備え、前記圧力室の容積の変化により前記圧力室に連通するノズルから液体を吐出する、(1)または(2)に記載の液体吐出ヘッド。
(4)
前記退避面は、前記圧電素子において内部電極が形成される部位とは異なる部位に設けられ、前記接合面と前記退避面との間の段差の深さ寸法は、前記FPCの前記電極層と前記カバー層の位置の差よりも大きい、(1)に記載の液体吐出ヘッド。
(5)
前記退避面と、前記FPCの前記カバー層の表面とが、接着剤により接合される、(1)に記載の液体吐出ヘッド。
Claims (4)
- 第1領域及び第2領域を有する電極層と、前記電極層の第2領域に積層されるカバー層と、を有するFPCと、
前記FPCの電極層の第1領域に対向配置されるとともに段差を有し、前記電極層の第1領域に接続される接合面、及び前記接合面よりも前記FPCから退避する退避面を有する複数の圧電素子と、備え、
前記退避面と、前記FPCの前記カバー層の表面とが、接着剤により接合される、
液体吐出ヘッド。 - 前記FPCは前記圧電素子の前記接合面にハンダを介して電気的及び機械的に接続される、請求項1に記載の液体吐出ヘッド。
- 前記圧電素子は、複数の圧電体層を積層して備え、
前記圧電素子の振動により容積が変化する圧力室と、前記圧力室に連通するノズルと、を備え、前記圧力室の容積の変化により前記圧力室に連通するノズルから液体を吐出する、請求項1または2に記載の液体吐出ヘッド。 - 前記退避面は、前記圧電素子において内部電極が形成される部位とは異なる部位に設けられ、前記接合面と前記退避面との間の段差の深さ寸法は、前記FPCの前記電極層と前記カバー層の位置の差よりも大きい、請求項1に記載の液体吐出ヘッド。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021051490A JP7646410B2 (ja) | 2021-03-25 | 2021-03-25 | 液体吐出ヘッド |
| US17/537,940 US11845275B2 (en) | 2021-03-25 | 2021-11-30 | Liquid discharge head |
| CN202210008127.2A CN115122772B (zh) | 2021-03-25 | 2022-01-05 | 液体喷头 |
| EP22152644.5A EP4063126B1 (en) | 2021-03-25 | 2022-01-21 | Liquid discharge head |
| JP2025034753A JP2025074324A (ja) | 2021-03-25 | 2025-03-05 | 液体吐出ヘッド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021051490A JP7646410B2 (ja) | 2021-03-25 | 2021-03-25 | 液体吐出ヘッド |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025034753A Division JP2025074324A (ja) | 2021-03-25 | 2025-03-05 | 液体吐出ヘッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022149368A JP2022149368A (ja) | 2022-10-06 |
| JP7646410B2 true JP7646410B2 (ja) | 2025-03-17 |
Family
ID=80113532
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021051490A Active JP7646410B2 (ja) | 2021-03-25 | 2021-03-25 | 液体吐出ヘッド |
| JP2025034753A Pending JP2025074324A (ja) | 2021-03-25 | 2025-03-05 | 液体吐出ヘッド |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025034753A Pending JP2025074324A (ja) | 2021-03-25 | 2025-03-05 | 液体吐出ヘッド |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11845275B2 (ja) |
| EP (1) | EP4063126B1 (ja) |
| JP (2) | JP7646410B2 (ja) |
| CN (1) | CN115122772B (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024027917A (ja) * | 2022-08-19 | 2024-03-01 | 東芝テック株式会社 | 液体吐出ヘッド及び液体吐出装置 |
| JP2024063655A (ja) | 2022-10-26 | 2024-05-13 | 東芝テック株式会社 | 液体吐出ヘッド及び液体吐出装置 |
| JP2024063654A (ja) * | 2022-10-26 | 2024-05-13 | 東芝テック株式会社 | 液体吐出ヘッド及び液体吐出装置 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004291515A (ja) | 2003-03-28 | 2004-10-21 | Hitachi Printing Solutions Ltd | インクジェットヘッド及びその製造方法 |
| US20060290744A1 (en) | 2005-06-25 | 2006-12-28 | Lee Jao-Cheol | Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof |
| JP2009262417A (ja) | 2008-04-25 | 2009-11-12 | Brother Ind Ltd | 液滴吐出ヘッドとその製造方法 |
| CN103085474A (zh) | 2011-10-28 | 2013-05-08 | 三星电机株式会社 | 喷墨印刷头组件 |
| JP2015233000A (ja) | 2014-05-12 | 2015-12-24 | パナソニック株式会社 | 圧電素子とケーブル基板との接続方法、ケーブル基板付き圧電素子およびこれを使用したインクジェットヘッド |
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| US6338549B1 (en) * | 1997-06-27 | 2002-01-15 | Seiko Epson Corporation | Piezoelectric vibrator unit, method for manufacturing the same, and ink-jet recording head |
| JP2004082650A (ja) * | 2002-08-29 | 2004-03-18 | Ricoh Co Ltd | 液滴吐出ヘッド及びインクジェット記録装置 |
| JP4035827B2 (ja) | 2002-10-03 | 2008-01-23 | セイコーエプソン株式会社 | 液体噴射装置 |
| JP2007090870A (ja) * | 2005-08-31 | 2007-04-12 | Brother Ind Ltd | 液体吐出ヘッド及びその製造方法 |
| JP2007076126A (ja) | 2005-09-14 | 2007-03-29 | Ricoh Co Ltd | 液体吐出ヘッド及び画像形成装置 |
| JP4930390B2 (ja) * | 2008-01-29 | 2012-05-16 | ブラザー工業株式会社 | 液体移送装置 |
| JP5381186B2 (ja) | 2009-03-12 | 2014-01-08 | 株式会社リコー | 液体吐出ヘッド、画像形成装置及び液体吐出ヘッドの製造方法 |
| JP5381527B2 (ja) | 2009-09-08 | 2014-01-08 | 株式会社リコー | 液体吐出ヘッド及び画像形成装置 |
| JP5594009B2 (ja) * | 2010-09-15 | 2014-09-24 | 株式会社リコー | 液体吐出ヘッド及び画像形成装置 |
| JP5857436B2 (ja) | 2011-04-28 | 2016-02-10 | 株式会社リコー | アクチュエータユニット、インクジェットプリンタヘッド及び画像形成装置 |
| KR20140081571A (ko) * | 2012-12-21 | 2014-07-01 | 삼성전기주식회사 | 압전 액추에이터, 잉크젯 헤드 어셈블리 및 그 제조방법 |
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-
2021
- 2021-03-25 JP JP2021051490A patent/JP7646410B2/ja active Active
- 2021-11-30 US US17/537,940 patent/US11845275B2/en active Active
-
2022
- 2022-01-05 CN CN202210008127.2A patent/CN115122772B/zh active Active
- 2022-01-21 EP EP22152644.5A patent/EP4063126B1/en active Active
-
2025
- 2025-03-05 JP JP2025034753A patent/JP2025074324A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004291515A (ja) | 2003-03-28 | 2004-10-21 | Hitachi Printing Solutions Ltd | インクジェットヘッド及びその製造方法 |
| US20060290744A1 (en) | 2005-06-25 | 2006-12-28 | Lee Jao-Cheol | Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof |
| JP2009262417A (ja) | 2008-04-25 | 2009-11-12 | Brother Ind Ltd | 液滴吐出ヘッドとその製造方法 |
| CN103085474A (zh) | 2011-10-28 | 2013-05-08 | 三星电机株式会社 | 喷墨印刷头组件 |
| JP2015233000A (ja) | 2014-05-12 | 2015-12-24 | パナソニック株式会社 | 圧電素子とケーブル基板との接続方法、ケーブル基板付き圧電素子およびこれを使用したインクジェットヘッド |
Also Published As
| Publication number | Publication date |
|---|---|
| US11845275B2 (en) | 2023-12-19 |
| JP2025074324A (ja) | 2025-05-13 |
| CN115122772A (zh) | 2022-09-30 |
| CN115122772B (zh) | 2025-08-19 |
| EP4063126B1 (en) | 2024-07-24 |
| JP2022149368A (ja) | 2022-10-06 |
| EP4063126A1 (en) | 2022-09-28 |
| US20220305786A1 (en) | 2022-09-29 |
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