JP7651291B2 - Solar cell module and its manufacturing method - Google Patents

Description

The present invention relates to a solar cell module and a method for manufacturing the same.

The spread of IoT (Internet of Things) devices that combine sensing and wireless communication has led to the use of big data in society, starting with the collection of data from our surroundings. In particular, wireless communication does not require wiring and allows for a high degree of freedom in installation, and is expected to be applied to fault diagnosis in difficult-to-access locations such as bridge piers and the inside of tunnels. However, because battery power is generally used for power, battery replacement is essential, and issues remain from the perspective of maintenance. Therefore, solar cells have been developed with the goal of being installed in such IoT devices (see, for example, Patent Document 1).

JP 2019-179898 A

In the above solar cells, the area of the power generation layer relative to the light incident surface is large, resulting in a large amount of power generation relative to the size. On the other hand, since the power generation layer is exposed from the side of the solar cell, it is necessary to seal the side with resin. However, it is difficult to seal the exposed part of the power generation layer with resin. On the other hand, in order to improve resistance to shocks caused by dropping, etc., it is necessary to fix the solar cell to a mounting member.

The present invention was made in consideration of the above problems, and aims to provide a solar cell module that can be easily sealed and fixed, and a manufacturing method thereof.

The solar cell module according to the present invention is characterized by comprising: a solar cell having a first electrode layer, a second electrode layer, and a solid-state power generation layer sandwiched between the first electrode layer and the second electrode layer; a mounting member having a support portion supporting the first electrode layer side of the solar cell and an inner wall provided on the periphery of the support portion and surrounding the side surface of the solar cell; and a sealing portion covering the side surface of the solid-state power generation layer and bonding the solid-state power generation layer to the inner wall.

In the solar cell module, the solar cell is disposed on the surface of the second electrode layer opposite the first electrode layer, and includes a light-transmitting substrate formed to be thicker than the solid-state power generation layer, and the sealing portion may extend to the side surface of the light-transmitting substrate.

In the solar cell module, the optically transparent substrate may extend beyond the inner wall to the upper surface of the side wall that constitutes the inner wall.

In the solar cell module, the bottom surface of the support may have a groove around the periphery, and the sealing portion may extend into the groove.

In the solar cell module, the inner wall may have a step that is closer to the side of the solar cell on the first electrode layer side in the stacking direction of the first electrode layer and the second electrode layer, and farther from the side of the solar cell on the second electrode layer side.

In the solar cell module, the inner wall may have a slope that is closer to the side of the solar cell on the first electrode layer side in the stacking direction of the first electrode layer and the second electrode layer, and farther from the side of the solar cell on the second electrode layer side.

In the solar cell module, the second electrode layer may have an area where the solid-state power generation layer and the first electrode layer are not formed, and the bottom surface of the recess may have a hole in an area corresponding to the area of the second electrode layer and a hole in an area corresponding to the first electrode layer.

In the solar cell module, the solid power generation layer may be a layer having semiconductor particles with a dye supported on the surface.

The method for manufacturing a solar cell module according to the present invention is characterized by including a step of supporting the first electrode layer side of a solar cell having a solid-state power generation layer sandwiched between a first electrode layer and a second electrode layer with a support, and bonding an inner wall that is provided on the periphery of the support and surrounds the side of the solar cell, and that covers the side of the solid-state power generation layer and the inner wall to a sealing part.

The present invention provides a solar cell module that can be easily sealed and fixed, and a method for manufacturing the same.

FIG. 1 is an external perspective view of a dye-sensitized solar cell. 1A and 1B are perspective views showing a manufacturing process of a dye-sensitized solar cell. 1A and 1B are perspective views showing a manufacturing process of a dye-sensitized solar cell. 1A and 1B are perspective views showing a manufacturing process of a dye-sensitized solar cell. FIG. 2 is an enlarged cross-sectional view of the vicinity of a side surface of the power generation layer. 1A is a plan view of a mounting member on which a dye-sensitized solar cell is mounted, FIG. 1B is a cross-sectional view taken along line A-A of FIG. 1A, and FIG. 1C is a cross-sectional view of the dye-sensitized solar cell mounted on the mounting surface. FIG. 6B is a partially enlarged view of FIG. 1A to 1C are diagrams for explaining the difficulty of applying a sealing resin to the side surface of a dye-sensitized solar cell. 4A and 4B are diagrams illustrating examples of the relationship between the outer periphery shape of a light-transmitting substrate and the outer periphery shape of a light-transmitting electrode layer. FIG. FIG. 1 is a diagram for explaining mass production of dye-sensitized solar cells. 1A is a plan view of a mounting member on which a dye-sensitized solar cell is mounted, FIG. 1B is a cross-sectional view taken along line A-A of FIG. 1A, and FIG. 1C is a cross-sectional view of the dye-sensitized solar cell mounted on the mounting surface. FIG. FIG. FIG. FIG. FIG.

The following describes the embodiment with reference to the drawings.

First, an overview of the dye-sensitized solar cell will be described. FIG. 1 includes an external perspective view of the dye-sensitized solar cell 100 and a schematic cross-sectional view illustrating the layered structure. As illustrated in FIG. 1, the dye-sensitized solar cell 100 has a structure in which a light-transmitting electrode layer 21, a reverse electron transfer prevention layer 22, a power generation layer 25, a solid electrolyte layer 27, and a counter electrode layer 33 are layered in this order on one main surface of a light-transmitting substrate 20 having a rectangular shape. The counter electrode layer 33 corresponds to the first electrode layer, the light-transmitting electrode layer 21 corresponds to the second electrode layer, and the power generation layer 25 and the solid electrolyte layer 27 correspond to the solid power generation layer.

The light-transmitting substrate 20 is a substrate having light transmittance, such as a glass substrate or a plastic plate. On one main surface of the light-transmitting substrate 20, a right-angled triangular region at one corner is the electrode region R1, and a pentagonal region excluding this corner is the cell region Rc. The light-transmitting electrode layer 21 is provided in an integrated region on the electrode region R1 and the cell region Rc. In FIG. 1, as an example, the two regions R1 and Rc constitute the entire area of the light-transmitting substrate 20, and the light-transmitting electrode layer 21 covers the entire area of the light-transmitting substrate 20. The reverse electron transfer prevention layer 22, the power generation layer 25, the solid electrolyte layer 27, and the counter electrode layer 33 are not provided in the electrode region R1, but are provided in the cell region Rc. Therefore, even if the reverse electron transfer prevention layer 22, the power generation layer 25, the solid electrolyte layer 27, and the counter electrode layer 33 are provided, the light-transmitting electrode layer 21 provided in the electrode region R1 is exposed.

The light-transmitting electrode layer 21 is, for example, an ITO layer having a thickness of about 0.1 μm to 0.5 μm. Instead of an ITO layer, a fluorine doped tin oxide (FTO) layer, a zinc oxide layer, a laminated film of an indium-tin composite oxide layer and a silver layer, an antimony-doped tin oxide layer, or the like may be used as the light-transmitting electrode layer 21.

The reverse electron transfer prevention layer 22 is, for example, a layer in which oxide semiconductor particles are formed in a layered form. The reverse electron transfer prevention layer 22 has a thickness of, for example, about 1 nm to 50 nm.

The power generation layer 25 is a layer in which oxide semiconductor particles are formed in layers. A sensitizing dye is bonded to a group on the surface of the oxide semiconductor particles. The oxide semiconductor particles are, for example, titanium oxide particles. As the oxide semiconductor particles, particles of any of oxides of Cd, Zn, In, Pb, Mo, W, Sb, Bi, Cu, Hg, Ti, Ag, Mn, Fe, V, Sn, Zr, Sr, Ga, Si, Cr, and Nb can also be used. Alternatively, particles of perovskite oxides such as _SrTiO3 and _CaTiO3 can also be used.

The sensitizing dye is, for example, CYC-B11(K). In addition, metal complex dyes, organic dyes, etc. can also be used. Among these, examples of metal complex dyes include transition metal complexes such as ruthenium-cis-diaqua-bipyridyl complex, ruthenium-tris complex, ruthenium-bis complex, osmium-tris complex, and osmium-bis complex. In addition, zinc-tetra(4-carboxyphenyl)porphyrin and iron-hexacyanide complex are also examples of metal complex dyes. In addition, examples of organic dyes include 9-phenylxanthene dyes, coumarin dyes, acridine dyes, triphenylmethane dyes, tetraphenylmethane dyes, quinone dyes, azo dyes, indigo dyes, cyanine dyes, merocyanine dyes, xanthene dyes, and carbazole compound dyes.

The solid electrolyte layer 27 is a layer containing a solid electrolyte. For example, 1,3-dimethylimidazolium iodide (DMII) can be used as the electrolyte. In addition to DMII, for example, iodine salts such as pyridinium salts, imidazolium salts, and triazolium salts, which are in a solid state near room temperature, or room-temperature molten salts in a molten state, can be used as the ionic liquid. As such room-temperature molten salts, for example, quaternary ammonium iodide compounds such as 1-methyl-3-propylimidazolium iodide, 1-butyl-3-methylimidazolium iodide (BMII), and 1-ethyl-pyridinium iodide can be used. Alternatively, organic semiconductor materials such as molten salts containing redox pairs, oxadiazole compounds, and pyrazoline compounds can be used. Metal halide materials such as copper iodide and copper bromide can also be used. The solid electrolyte contained in the solid electrolyte layer 27 is also contained in the power generation layer 25.

The total thickness of the power generation layer 25 and the solid electrolyte layer 27 is, for example, about 5 μm to 100 μm.

The counter electrode layer 33 has a structure in which, for example, a catalyst layer 32 and a metal foil 31 are provided in this order from the bottom on the solid electrolyte layer 27 side. The metal foil 31 is, for example, a titanium foil and has a thickness of 50 μm to 200 μm. The catalyst layer 32 is, for example, a platinum layer and has a thickness of 0.01 μm to 1 μm. As the material for the catalyst layer 32, metals having catalytic functions such as palladium, rhodium, and indium, in addition to platinum, can also be used. The catalyst layer 32 may also be formed of graphite. Furthermore, the catalyst layer 32 may be formed of any of carbon carrying platinum, indium-tin composite oxide, tin oxide doped with antimony, and tin oxide doped with fluorine. Other materials include organic semiconductors such as poly(3,4-ethylenedioxythiophene) (PEDOT) and polythiophene. The counter electrode layer 33 has a thickness of, for example, about 50 μm to 200 μm.

In such a dye-sensitized solar cell 100, when light is incident on the sensitizing dye in the power generation layer 25 through the light-transmitting substrate 20 and the light-transmitting electrode layer 21, the sensitizing dye in the power generation layer 25 becomes excited, and electrons move from the sensitizing dye to the oxide semiconductor particles in the power generation layer 25. In the power generation layer 25 and the solid electrolyte layer 27, the electrolyte dissociates into ions, and a current flows between the counter electrode layer 33 and the light-transmitting electrode layer 21. For example, if the electrolyte is DMII, DMII dissociates into DMI ⁺ and iodide ions (I ^- ). The iodide ions (I ^- ) and iodine molecules (I ₂ ) are combined to generate triiodide ions (I ₃ ^- ). The iodide ions (I ^- ) are an example of halide ions, and the triiodide ions (I ₃ ^- ) are an example of trihalide ions. The triiodide ion (I ₃ ^- ) receives electrons from the counter electrode layer 33 to become an iodide ion (I ^- ), which then passes the electrons to the sensitizing dye. The potential difference between ^the light-transmitting electrode layer 21 and the counter electrode layer 33 is the difference between the oxidation-reduction potential of the redox pair consisting of the iodide ion (I ^- ) and the triiodide ion (I ₃ ^- ) and the Fermi level of the oxide semiconductor particles. Through the above-mentioned actions, the dye-sensitized solar cell 100 generates electricity in response to incident light.

The manufacturing method of the dye-sensitized solar cell 100 will be described below with reference to Figures 2(a) to 4(b).

First, as shown in FIG. 2(a), a light-transmitting substrate 20 is prepared that has a first main surface 20a and a second main surface 20b that face each other. Of these surfaces, the first main surface 20a is the incident surface through which light is incident during actual use. On the other hand, a light-transmitting electrode layer 21 is formed in advance on the second main surface 20b.

The light-transmitting substrate 20 is a glass substrate that is roughly rectangular (square in this case) in plan view, with the lengths Ax and Ay of each side being approximately 5 mm to 40 mm, and 15 mm in this embodiment. The thickness Az of the light-transmitting substrate 20 is approximately 0.1 mm to 3 mm, and 1.1 mm in this embodiment.

Next, FIG. 2(b) shows the process of forming the reverse electron transfer prevention layer 22. An alcohol solution is prepared from an alkoxide (e.g., titanium alkoxide) containing the metal that constitutes the target oxide. The alcohol solution is applied onto the light-transmitting electrode layer 21 in the cell region Rc, and then the alcohol solution is heated and dried to form the reverse electron transfer prevention layer 22. The drying temperature in this process is in the range of 450°C to 650°C, and in this embodiment, drying is performed at a temperature of about 550°C.

Of the sides of the electrode region R1, the length Cx of one side sandwiching the right angle is about 0.5 mm to 5 mm, for example, 3 mm. The length Cy of the other side is about 0.5 mm to 5 mm, for example, 3 mm. As a result, the area of the cell region Rc excluding the electrode region R1 on the second main surface 20b of the light-transmitting substrate 20 is about 2.21 ^cm2 .

The reverse electron transfer prevention layer 22 is formed only in the cell region Rc, and the light-transmitting electrode layer 21 is exposed in the electrode region R1.

Next, as shown in FIG. 3(a), the particle size is about 5 nm to 50 nm, for example, 40 nm here. The paste containing these oxide semiconductor particles is applied by screen printing onto the reverse electron transfer prevention layer 22, and then heated to remove the organic components to form the power generation layer 25. The heating temperature of this paste is about 450°C to 650°C, 550°C here, and the drying time is 10 minutes to 120 minutes, for example, about 30 minutes. The paste is not particularly limited, but for example, PST-30NRD, a titanium oxide paste manufactured by JGC Catalysts and Chemicals, is used.

The power generation layer 25 is formed only in the cell region Rc, and the power generation layer 25 is not formed in the electrode region R1, so that the light-transmitting electrode layer 21 corresponding to the electrode region R1 is exposed. In this case, the area on which the paste is printed is 2.21 ^cm2 .

Then, the light-transmitting substrate 20 is immersed in an organic solution containing a sensitizing dye, and the sensitizing dye is adsorbed onto the surface of the oxide semiconductor particles that make up the power generation layer 25. The organic solution used is an organic solvent in which acetonitrile and t-butanol are mixed in a volume ratio of 1:1 and the sensitizing dye is added. The concentration of the sensitizing dye in the organic solution is 0.1 mM to 1 mM, for example 0.2 mM. The organic solution is then kept at a temperature of 0°C to 80°C, for example 50°C, and the light-transmitting substrate 20 is left standing in the organic solution for 1 hour to 12 hours, for example 4 hours, to allow the sensitizing dye to be adsorbed onto the oxide semiconductor particles.

Next, the process illustrated in FIG. 3(b) will be described. First, iodine, electrolyte, acetonitrile, and polyethylene oxide with a molecular weight of 1 million are mixed uniformly as the solid electrolyte precursor 26. Next, 0.1 μL to 50 μL, for example 20 μL, of this solid electrolyte precursor 26 is dropped onto the power generation layer 25 to impregnate the power generation layer 25 with the solid electrolyte precursor 26. Then, the power generation layer 25 is heated to 50° C. to 150° C., for example 100° C., and this state is maintained for 1 minute to 60 minutes, for example 5 minutes, to volatilize the excess acetonitrile contained in the solid electrolyte precursor 26, and the solid electrolyte precursor 26 on the power generation layer 25 becomes the solid electrolyte layer 27. After that, the power generation layer 25 is returned to room temperature.

Next, as shown in FIG. 4(a), the counter electrode layer 33 is disposed above the solid electrolyte layer 27. The outer shape of the counter electrode layer 33 is a pentagon, the same as the cell region Rc, formed by cutting off one corner of a square with a side length of approximately 15 mm.

Next, as shown in FIG. 4(b), the counter electrode layer 33 is adhered to the solid electrolyte layer 27 while removing any air bubbles between the solid electrolyte layer 27 and the counter electrode layer 33. Note that by performing this process in a reduced pressure atmosphere or in a vacuum, air bubbles are less likely to remain between the solid electrolyte layer 27 and the counter electrode layer 33.

In addition, in the cell region Rc, the light-transmitting electrode layer 21, the power generation layer 25, the solid electrolyte layer 27, and the counter electrode layer 33 overlap each other in a planar view, and an electromotive force is generated in the power generation layer 25 in the cell region Rc when light is incident on it.

Figure 5 is an enlarged cross-sectional view of the vicinity of the side of the power generation layer 25. The side of the light-transmitting substrate 20, the side of the light-transmitting electrode layer 21, the side of the reverse electron transfer prevention layer 22, the side of the power generation layer 25 and the solid electrolyte layer 27, and the side of the counter electrode layer 33 are originally formed to form the same plane. On the other hand, as illustrated in Figure 5, there is a risk of manufacturing errors. For example, based on the side of the light-transmitting substrate 20, the side of the power generation layer 25 and the solid electrolyte layer 27 may have a manufacturing error of ±20 μm, and the side of the counter electrode layer 33 may have a manufacturing error of ±50 μm.

In such a dye-sensitized solar cell 100, the power generation layer 25 and the solid electrolyte layer 27 are formed of a solid material (for example, a gel-like body is acceptable, and solid materials include those that do not have a large degree of fluidity like liquids and remain in place to a certain extent, such as gelatin), so phenomena such as liquid leakage, which occurs with liquid electrolytes, do not occur. Therefore, from this process until the substrate module is attached to the mounting member 200, we came to the conclusion of proceeding without providing a sealing structure to prevent liquid leakage (spill-out) on the side of the dye-sensitized solar cell 100.

Furthermore, because they are solid materials as described above, it was thought possible to arrange the power generation layer 25 and the solid electrolyte layer 27 on the side of the dye-sensitized solar cell 100, that is, on the side of the light-transmitting substrate 20 or close to it. In this configuration, the area of the power generation layer 25 can be expanded to the side of the light-transmitting substrate 20 or close to it, making it possible to increase the amount of power generated by the dye-sensitized solar cell 100.

On the other hand, since the power generation layer 25 and the solid electrolyte layer 27 are exposed on the side surfaces of the dye-sensitized solar cell 100 (the four surfaces connecting the four sides of the first main surface and the four sides of the second main surface), it is ultimately necessary to seal the side surfaces of the dye-sensitized solar cell 100 with a resin or the like. This is from the viewpoint of preventing deterioration over time. It is also from the viewpoint of preventing a decrease in reliability due to peeling between different materials. It is also from the viewpoint of absorbing manufacturing variations in the manufacturing configuration.

However, the light-transmitting substrate 20 is about 1 mm thick, and the opposing electrode layer 33 is about 50 μm to 200 μm thick, so even when the power generation layer between them is taken into account, the thickness is still roughly 1 mm. Moreover, it is quite difficult to apply sealing resin to seal the exposed parts of the power generation layer 25 and solid electrolyte layer 27, including the sides of the substrate module consisting of the light-transmitting substrate 20 and the negligible opposing electrode layer 33, particularly the sides of the opposing electrodes.

On the other hand, in order to improve resistance to shocks caused by drops, etc., it is necessary to fix the dye-sensitized solar cell 100 to a mounting member. Furthermore, since solar cells are used to make various sensors standalone as part of the IOT, a power supply circuit is required to supply power to the sensors, and a signal transmission circuit such as a BLE that transfers sensor detection information, and installation of these circuits is also required.

The solar cell module according to this embodiment has a configuration that allows the dye-sensitized solar cell 100 to be easily sealed and fixed. Details are described below.

Figure 6(a) is a plan view of the mounting member 200 on which the dye-sensitized solar cell 100 is mounted. Figure 6(b) is a cross-sectional view taken along line A-A in Figure 6(a). In Figures 6(a) and 6(b), three mutually orthogonal axes (X-axis, Y-axis, and Z-axis) are defined. The plane formed by the X-axis and Y-axis is defined as the planar direction of the mounting member 200. In the following description, the plan view of the mounting member 200 is defined as the view from the positive direction of the Z-axis to the negative direction of the Z-axis. As an example, the positive side in the Z-axis direction is the upper side in the vertical direction, and the negative side in the Z-axis direction is the lower side in the vertical direction.

As illustrated in FIG. 6(a) and FIG. 6(b), the mounting member 200 is provided with a support member 201 so as to be exposed on the positive side in the Z-axis direction. The surface of the support member 201 on the positive side in the Z-axis direction is the mounting surface 202. The mounting surface 202 is provided parallel to the XY plane. The mounting surface 202 is substantially rectangular. The peripheral shape of the mounting surface 202 substantially matches the peripheral shape of the dye-sensitized solar cell (substrate module) 100 (the peripheral shape of the second main surface 20b of the light-transmitting substrate 20). In reality, the periphery of the mounting surface 202 is formed 1 mm wider than the dye-sensitized solar cell 100. Therefore, the dye-sensitized solar cell 100 can be mounted on the mounting surface 202.

In plan view, side walls 203 are provided so as to surround the periphery of the support member 201. The side walls 203 are provided so as to protrude further in the Z-axis direction than the mounting surface 202. The Z-axis direction positive end (upper surface) of the side walls 203 is located further in the Z-axis direction than the mounting surface 202. In other words, this mounting member 200 is box-shaped, consisting of a hexahedron made up of a top surface, a bottom surface, and four side surfaces connecting the two surfaces. A rectangle is formed on the top surface with a depth thinner than the thickness of the top surface. This groove is formed to be about the same thickness as the board module or the same thickness as the circuit board 300 described later, and when mounted, a small gap (0.5 mm) is left on the four side edges. The bottom surface of this groove is the support member 201, and the four frames around the groove are the side walls 203.

Figure 6(c) is a cross-sectional view of the dye-sensitized solar cell 100 mounted on the mounting surface 202. As illustrated in Figure 6(c), the dye-sensitized solar cell 100 is mounted on the mounting surface 202. The counter electrode layer 33 of the dye-sensitized solar cell 100 faces the mounting surface 202. Therefore, the light-transmitting substrate 20 is exposed from the mounting member 200.

As illustrated in FIG. 6A, a hole 204 is formed in the mounting surface 202 of the support member 201. Therefore, the hole 204 is provided in correspondence with the area of the counter electrode layer 33. A lead-out wiring can be provided through this hole 204. This lead-out wiring is electrically connected to the counter electrode layer 33. A hole 205 is also formed in the support member 201 at a position that corresponds to and overlaps with the electrode area R1 in a plan view. A lead-out wiring can be provided through this hole 205. This lead-out wiring is electrically connected to the light-transmitting electrode layer 21. With this configuration, the wiring does not spread in the XY plane direction, and can be led out to the negative Z-axis side. This makes it possible to mount the device on another substrate in a space-saving manner.

The sidewall 203 may protrude further in the negative Z-axis direction than the support member 201. In this case, other circuit boards, etc. may be placed in the space defined by the negative Z-axis direction surface of the support member 201 and the sidewall 203. As illustrated in Figures 6(b) and 6(c), the bottom 206 may be located further in the negative Z-axis direction than the support member 201 and provided so as to face the negative Z-axis direction surface of the support member 201 while being spaced apart from it. In this way, other circuit boards, etc. can be further accommodated within the mounting member 200, enabling high-density mounting.

7 is a partially enlarged view of FIG. 6(c). In plan view, the outer periphery of the mounting surface 202 is formed slightly larger than the outer periphery of the dye-sensitized solar cell 100. Therefore, a gap is generated between the side surface of the dye-sensitized solar cell 100 and the side wall 203. The gap is filled with the sealing resin 50 (sealing portion). The sealing resin 50 can seal the power generation layer 25 and the solid electrolyte layer 27 of the dye-sensitized solar cell 100 and fix the dye-sensitized solar cell 100 to the mounting member 200 at the same time. In addition, since the sealing resin 50 is applied to at least the side surface of the dye-sensitized solar cell 100, it is not necessary to apply it to the cell region Rc of the dye-sensitized solar cell 100. This makes it possible to increase the power generation area. The sealing resin 50 may extend to the surface on the negative side of the Z-axis direction of the dye-sensitized solar cell 100.

Here, with reference to Figures 8(a) to 8(c), the difficulty of applying sealing resin to the side of the dye-sensitized solar cell 100 will be described. In order to seal the side of the dye-sensitized solar cell 100, as illustrated in Figures 8(a) and 8(b), resin 400 is applied to the side of the dye-sensitized solar cell 100. The parts of the side of the dye-sensitized solar cell 100 that need to be sealed are the power generation layer 25 and the solid electrolyte layer 27, as illustrated in Figure 8(c). Since the power generation layer 25 and the solid electrolyte layer 27 are formed very thin, it is very difficult to apply resin only to the side of the power generation layer 25 and the solid electrolyte layer 27. In order to adequately seal the power generation layer 25 and the solid electrolyte layer 27, the thickness of the resin becomes large, as illustrated in Figure 8(c).

In contrast, in this embodiment, the sealing resin 50 can be applied to the side surface of the dye-sensitized solar cell 100 simply by applying the sealing resin 50 to the inner wall portion of the side wall 203. The sealing resin 50 is, for example, an ultraviolet-curing resin, and can be cured by irradiating the ultraviolet-curing resin before curing with ultraviolet light.

In this embodiment, the light-transmitting substrate 20 is formed to be thicker than the combined thickness of the power generation layer 25 and the solid electrolyte layer 27. The light-transmitting substrate 20 is located on the positive side of the Z-axis direction relative to the power generation layer 25 and the solid electrolyte layer 27. In this positional relationship, if the sealing resin 50 can be applied to the side surface of the light-transmitting substrate 20, the adhesive resin can be applied to the side surfaces of the power generation layer 25 and the solid electrolyte layer 27 as a result. In this way, it is preferable that the sealing resin 50 extends to the side surface of the light-transmitting substrate 20.

Second Embodiment
9 , in a plan view, the outer periphery of the light-transmitting substrate 20 may be formed to be larger than the outer periphery of the light-transmitting electrode layer 21. In addition, the outer periphery of the light-transmitting substrate 20 may be formed to be larger than the outer periphery of the mounting surface 202. The outer periphery of the light-transmitting electrode layer 21 roughly coincides with the outer periphery of the mounting surface 202, but is slightly smaller than the outer periphery.

In this configuration, as illustrated in FIG. 10, the outer peripheral portion of a part of the dye-sensitized solar cell 100 (e.g., the light-transmitting substrate 20) contacts the positive end of the side wall 203 in the Z-axis direction. Therefore, the outer peripheral portion of the light-transmitting substrate 20 can be used for sealing. By filling the space between the outer peripheral portion of the light-transmitting substrate 20 and the positive end (upper surface) of the side wall 203 in the Z-axis direction with sealing resin 50, the connection strength of the dye-sensitized solar cell 100 to the mounting member 200 can be improved.

For example, as illustrated in FIG. 11, it becomes possible to use solar cells obtained by mass production in which multiple light-transmitting electrode layers 21 are formed on a large light-transmitting substrate 20, other layers are formed on each light-transmitting electrode layer 21, and the light-transmitting substrate 20 is cut along the dashed lines.

The example in which the outer periphery of the light-transmitting substrate 20 is larger than the outer periphery of the light-transmitting electrode layer 21 can also be applied to the third to sixth embodiments described below.

Third Embodiment
In the third embodiment, the mounting surface 202 has a pentagonal shape with one corner missing, as illustrated in Fig. 12(a). In a plan view of the support member 201, a groove 207 is provided on the periphery of the mounting surface 202. As illustrated in Fig. 12(b), the bottom surface of the groove 207 is located on the negative side in the Z-axis direction relative to the mounting surface 202. Therefore, a step is formed between the mounting surface 202 and the bottom surface of the groove 207.

The sidewall 203 surrounds the groove 207 in plan view. The outer peripheral shape of the groove 207 (the shape of the inner wall of the sidewall 203 in plan view) roughly matches the outer peripheral shape of the dye-sensitized solar cell 100, but is slightly larger than the outer peripheral shape of the dye-sensitized solar cell 100. Therefore, as illustrated in FIG. 12(c), the dye-sensitized solar cell 100 can be mounted on the mounting surface 202.

The hole 205 is formed in the groove 207 at a position that overlaps with the electrode region R1 in a plan view. A lead-out wiring can be provided through this hole 205. This lead-out wiring is electrically connected to the light-transmitting electrode layer 21.

In this embodiment, since the groove 207 is provided, as illustrated in FIG. 13, the sealing resin 50 extends around the groove 207. This increases the contact area between the sealing resin 50 and the dye-sensitized solar cell 100. As a result, the connection strength of the dye-sensitized solar cell 100 to the mounting member 200 can be improved.

The example in which the groove 207 is formed around the periphery of the mounting surface 202 can also be applied to the following fourth to sixth embodiments.

Fourth Embodiment
The shape of the inner wall of the side wall 203 may be changed so as to conform to the shape of the side surface of the dye-sensitized solar cell 100. For example, the dye-sensitized solar cell 100 may have a quadrangular pyramid shape whose area gradually decreases from the first main surface 20a of the light-transmitting substrate 20 toward the counter electrode layer 33. For example, when a paste containing oxide semiconductor particles is applied onto the reverse electron transfer prevention layer 22 by a screen printing method in the process of forming the power generation layer 25, the power generation layer 25 may have a substantially quadrangular pyramid shape.

In this case, the inner wall of the side wall 203 is formed to follow the shape of the side surface of the dye-sensitized solar cell 100. For example, as illustrated in FIG. 14, the inner wall of the side wall 203 has a slope that is closer to the side surface of the dye-sensitized solar cell 100 on the negative side of the Z axis direction and farther from the side surface of the dye-sensitized solar cell 100 on the positive side of the Z axis direction, so that the inner wall follows the shape of the side surface of the dye-sensitized solar cell 100.

Fifth Embodiment
A step may be provided on the positive side in the Z-axis direction of the sidewall 203 relative to the mounting surface 202. As illustrated in Fig. 15, the inner wall of the sidewall 203 may have a step that is closer to the side surface of the dye-sensitized solar cell 100 on the negative side in the Z-axis direction and farther from the side surface of the dye-sensitized solar cell 100 on the positive side in the Z-axis direction. By providing such a step, the area of the recess is smaller on the negative side in the Z-axis direction and larger on the positive side in the Z-axis direction in plan view.

In this configuration, the dye-sensitized solar cell 100 can be positioned by first placing the dye-sensitized solar cell 100 in a small recess on the negative side of the Z axis direction. Then, the adhesive resin that extends into the step portion and has a large exposed area can be efficiently irradiated with ultraviolet light. This can promote the hardening of the sealing resin 50.

Sixth Embodiment
As illustrated in Fig. 16, the inner wall of the side wall 203 may be provided with a step as illustrated in Fig. 15 and an inclination as illustrated in Fig. 14. In this configuration, the contact area between the side surface of the dye-sensitized solar cell 100 and the mounting member 200 is reduced, so that the generation of air bubbles in the sealing resin 50 is suppressed. In addition, the exposed area of the sealing resin 50 is larger than that in the upward direction, so that the air bubbles can easily escape upward. Furthermore, by providing a step, the overlapping portion between the bottom surface of the dye-sensitized solar cell 100 and the mounting member 200 is reduced, so that the air bubbles can easily escape. From the above, the generation of air bubbles in the sealing resin 50 can be suppressed.

Seventh Embodiment
As illustrated in Fig. 17, the dye-sensitized solar cell 100 may be mounted on a circuit board 300 whose peripheral shape in plan view is approximately the same as that of the dye-sensitized solar cell 100, and the circuit board 300 may be mounted on the mounting surface 202. The counter electrode layer 33 of the dye-sensitized solar cell 100 faces the circuit board 300. Therefore, the light-transmitting substrate 20 is exposed from the mounting member 200. In this manner, the dye-sensitized solar cell 100 may be mounted on the mounting surface 202 via the circuit board 300. The dye-sensitized solar cell 100 mounted on the mounting surface 202 via the circuit board 300 may also be applied to other embodiments.

Although each embodiment has been described in detail above, the present invention is not limited to the above. For example, in each of the above embodiments, the side surfaces of the power generation layer 25 and the solid electrolyte layer 27 are exposed to the side surface of the dye-sensitized solar cell 100, but the present invention is not limited to this. For example, the solid electrolyte layer 27 may be provided on the positive side of the power generation layer 25 in the Z-axis direction and extend to the side surface of the power generation layer 25. In this case, the solid electrolyte layer 27 is exposed to the side surface of the dye-sensitized solar cell 100. Also, for example, although the above focuses on the dye-sensitized solar cell 100, each embodiment can be applied to other organic solar cells and can also be applied to silicon solar cells.

20 Light-transmitting substrate 21 Light-transmitting electrode layer 22 Reverse electron transfer prevention layer 25 Power generation layer 27 Solid electrolyte layer 31 Metal foil 32 Catalyst layer 33 Counter electrode layer 50 Sealing resin 100 Dye-sensitized solar cell 200 Mounting member 201 Support member 202 Mounting surface 203 Side wall 204 Hole 205 Hole 206 Bottom 207 Groove 300 Circuit board

Claims (10)

a solar cell including a first electrode layer, a second electrode layer, a solid-state power generation layer sandwiched between the first electrode layer and the second electrode layer, and a light-transmitting substrate disposed on a surface of the second electrode layer opposite to the first electrode layer and formed to be thicker than the solid-state power generation layer;
a mounting member including a support portion that supports the first electrode layer side of the solar cell, and an inner wall that is provided on a periphery of the support portion and surrounds a side surface of the solar cell;
a sealing portion that covers a side surface of the solid-state power generation layer and bonds the solid-state power generation layer to the inner wall,
the sealing portion extends to a side surface of the light-transmitting substrate,
The solar cell module, wherein the light-transmitting substrate extends beyond the inner wall to an upper surface of a side wall that constitutes the inner wall. The bottom surface of the support portion has a groove on a circumferential portion,
The solar cell module according to claim 1 , wherein the sealing portion extends to the groove. The solar cell module according to claim 1 or 2, characterized in that the inner wall has a step that is closer to the side of the solar cell on the first electrode layer side in the stacking direction of the first electrode layer and the second electrode layer, and is farther from the side of the solar cell on the second electrode layer side. The solar cell module according to any one of claims 1 to 3, characterized in that the inner wall has a slope that is closer to the side of the solar cell on the first electrode layer side in the stacking direction of the first electrode layer and the second electrode layer, and farther from the side of the solar cell on the second electrode layer side. the second electrode layer has a region in which the solid-state power generation layer and the first electrode layer are not formed,
5. The solar cell module according to claim 1, characterized in that a bottom surface of a recess formed by the support portion and the inner wall and in which the solar cell is arranged has a hole in an area corresponding to the area of the second electrode layer and a hole in an area corresponding to the first electrode layer. The solar cell module according to any one of claims 1 to 5, characterized in that the solid power generation layer is a layer having semiconductor particles carrying a dye on the surface. a solar cell including a first electrode layer, a second electrode layer, and a solid-state power generation layer sandwiched between the first electrode layer and the second electrode layer;
a mounting member including a support portion that supports the first electrode layer side of the solar cell, and an inner wall that is provided on a periphery of the support portion and surrounds a side surface of the solar cell;
a sealing portion that covers a side surface of the solid-state power generation layer and bonds the solid-state power generation layer to the inner wall,
The bottom surface of the support portion has a groove on a circumferential portion,
The solar cell module, wherein the sealing portion extends to the groove. a solar cell including a first electrode layer, a second electrode layer, and a solid-state power generation layer sandwiched between the first electrode layer and the second electrode layer;
a mounting member including a support portion that supports the first electrode layer side of the solar cell, and an inner wall that is provided on a periphery of the support portion and surrounds a side surface of the solar cell;
a sealing portion that covers a side surface of the solid-state power generation layer and bonds the solid-state power generation layer to the inner wall,
A solar cell module characterized in that the inner wall has a step that is closer to the side of the solar cell on the first electrode layer side in the stacking direction of the first electrode layer and the second electrode layer, and is farther from the side of the solar cell on the second electrode layer side. a solar cell including a first electrode layer, a second electrode layer, and a solid-state power generation layer sandwiched between the first electrode layer and the second electrode layer;
a mounting member including a support portion that supports the first electrode layer side of the solar cell, and an inner wall that is provided on a periphery of the support portion and surrounds a side surface of the solar cell;
a sealing portion that covers a side surface of the solid-state power generation layer and bonds the solid-state power generation layer to the inner wall,
The inner wall has a slope that is closer to the side of the solar cell on the first electrode layer side in the stacking direction of the first electrode layer and the second electrode layer, and is farther from the side of the solar cell on the second electrode layer side. a solar cell including a first electrode layer, a second electrode layer, and a solid-state power generation layer sandwiched between the first electrode layer and the second electrode layer;
a mounting member including a support portion that supports the first electrode layer side of the solar cell, and an inner wall that is provided on a periphery of the support portion and surrounds a side surface of the solar cell;
a sealing portion that covers a side surface of the solid-state power generation layer and bonds the solid-state power generation layer to the inner wall,
the second electrode layer has a region in which the solid-state power generation layer and the first electrode layer are not formed,
A solar cell module characterized in that a bottom surface of a recess formed by the support portion and the inner wall and in which the solar cell is placed has a hole in an area corresponding to the area of the second electrode layer and a hole in an area corresponding to the first electrode layer.

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