JP7654254B2 - Certificate Form - Google Patents

Description

The present invention relates to certificate paper that is used to issue various certificates by printing the required certification information.

In identification cards such as driver's licenses, an RFID inlet recording certification information is embedded in a plastic card substrate, and the certification information printed on the surface of the card can be read from the RFID inlet without contact (see Patent Document 1). Also, in the field of logistics and the like, pieces of paper with RFID inlets affixed are used as shipping tags (see Patent Document 2). Here, when an RFID inlet is affixed to a piece of paper, the area where the IC chip of the RFID inlet is located becomes thicker than the surrounding area, so in order to prevent the load from concentrating on the IC chip, a spacer is provided around the IC chip or the IC chip is covered with a protective sheet (see Patent Document 3).

Patent No. 6433008 JP 2017-68487 A JP 2008-102805 A

In recent years, it has been considered to attach an RFID inlet to the paper base material of paper certificates such as resident's cards and qualification certificates, so that the certified information can be mechanically read without contact. Here, when storing the certified information in an RFID inlet, it is generally necessary to implement a high level of security function in the IC chip to prevent tampering with the stored information, and a larger IC chip is required than in RFID inlets for logistics purposes. Also, certificates made from certificate paper are often used for longer periods than shipping tags in the logistics field, so they are required to be more durable than shipping tags. However, the larger the IC chip in the RFID inlet, the more likely it is that load will be concentrated, so when attaching an RFID inlet to certificate paper, it is necessary to reduce the load on the IC chip.

One inexpensive way to reduce the load on the IC chip of an RFID inlet affixed to certificate paper and improve its durability is to affix a protective sheet to cover the IC chip, distributing the load on the IC chip location around the IC chip using the paper base and protective sheet. However, certificates use paper base materials that are thicker and more durable than shipping tags, so if a protective sheet is affixed to cover a large IC chip on an RFID inlet affixed to a thicker paper base, the certificate paper will become excessively thick at the IC chip location, making it bulky and increasing transportation costs, and it will be difficult to feed the paper through a general printer, increasing the cost of printing the certified information.

The present invention was made in consideration of this current situation, and aims to provide a certificate paper with an RFID inlet affixed that is highly durable and can be manufactured and used at low cost.

The present invention is a certificate paper used to print certification information and issue a certificate, comprising a paper base material provided with a printing section for printing the certification information, an RFID inlet that is affixed to a location of the paper base material other than the printing section and that can read and write the certification information without contact, and a protective sheet affixed to the RFID inlet, the RFID inlet comprising a thin-film inlet base material, an antenna formed on the surface of the inlet base material, and an IC chip that is disposed on the antenna and connected to the antenna, the RFID inlet being affixed to the paper base material with the arrangement surface on which the antenna and the IC chip are disposed facing, and the non-arrangement surface on which the antenna and the IC chip are not disposed being covered by the protective sheet.

In order to appropriately distribute the load applied to the IC chip mounting area and to prevent the thickness of the IC chip mounting area from becoming excessively thick, it is necessary to keep the thickness on both sides of the IC chip within an appropriate range. However, in the present invention, since no antenna or inlet substrate is placed on the paper substrate side of the IC chip, it is possible to increase the thickness of the paper substrate while keeping the thickness of the IC chip on the paper substrate side within an appropriate range, thereby improving the durability of the paper substrate.
On the other hand, since the inlet substrate and antenna are disposed on the protective sheet side of the IC chip, the thickness of the protective sheet can be made thinner than the paper substrate by the thickness of the antenna and inlet substrate. A step is formed on the outer periphery of the protective sheet due to the thickness of the protective sheet, and when printing the certification information on the certificate paper, there is a risk that such a step may get caught inside the printer. If the thickness of the protective sheet is made thinner, such a risk is reduced.
In this way, according to the present invention, it is relatively easy to ensure the durability required for the certificate paper for the IC chip and paper base material of the RFID inlet. Also, since the present invention does not require the paper base material, protective sheet, or RFID inlet to be processed into a special shape or to be made of a special material, manufacturing costs can be reduced. Furthermore, since the IC chip installation area can be prevented from becoming excessively thick, the certificate paper does not become bulky, which increases transportation costs, and there is no increase in the printing costs of the certification information due to the difficulty of passing the paper through a general printer.

In the present invention, it is proposed that the inlet substrate is made of a PET film, and the paper substrate and the protective sheet are made of paper. The inlet substrate, which serves as the base of the antenna, is preferably made of a PET (polyethylene terephthalate) film, which has excellent dimensional stability, but PET film has poor elasticity and is less able to distribute loads in the thickness direction than paper.

In the above configuration, it is proposed that the thickness of the IC chip placement portion is 500 μm or less, the thickness of the IC chip is 70 to 150 μm, the thickness of the paper base material is 100 to 200 μm, and the combined thickness of the inlet base material, the antenna, and the protective sheet is 100 μm or more. If the thickness of the IC chip placement portion is 500 μm or less, it can be passed through a general printer. If the thickness of the paper base material is 100 μm or more, the durability required for certificate paper can be achieved with general printing paper, and if the thickness of the paper base material is 200 μm or less, the certification information can be easily printed with a general printer. If the combined thickness of the inlet base material, the antenna, and the protective sheet is 100 μm or more, the load applied to the IC chip from the protective sheet side can be appropriately distributed. In addition, the thickness of an RFID IC chip equipped with advanced security functions is generally 70 to 150 μm. The present invention makes it possible to meet all of these requirements while making the thickness of the IC chip mounting area as thin as possible.

In the present invention, it is also proposed that the protective sheet extends around the RFID inlet and is attached to the paper base material around the RFID inlet.
In this configuration, the thickness of the area where the RFID inlet is attached increases by the thickness of the protective sheet, but since the outer periphery of the protective sheet extends around the RFID inlet and does not overlap with the RFID inlet, no excessively large step is formed on the outer periphery of the protective sheet. Therefore, with this configuration, the risk of the certificate paper getting caught inside the printer when the certification information is printed on the certificate paper is reduced.
In addition, in this configuration, since the protective sheet is attached to the paper base around the RFID inlet, the RFID inlet cannot be peeled off from the paper base without peeling the protective sheet off from the paper base, making it difficult to tamper with the certificate by replacing the RFID inlet.

In the above configuration, it is proposed that an adhesive or glue used to attach the RFID inlet to the paper base material is different from an adhesive or glue used to attach the protection sheet to the paper base material.
In such a configuration, when peeling the protective sheet from the paper base material and when peeling the RFID inlet from the paper base material, the peeling methods must be adapted to the properties of the respective adhesives or bonding agents, making it even more difficult to replace the RFID inlet.

Furthermore, the present invention proposes that a plurality of the paper base materials are continuous in one direction, and that the paper base materials are folded one piece at a time or multiple pieces at a time by folding back in an accordion-like manner at the boundaries of the paper base materials, to form a continuous sheet of paper, and that for a plurality of the paper base materials overlapping in the same orientation in the vertical direction, the arrangement locations of the IC chip of the RFID inlet for each of the paper base materials are configured to be different for at least some of the paper base materials.
When the paper base material is folded in an accordion fold, every few pieces of the paper base material are stacked in the same direction. At this time, if the IC chips of all the paper base materials stacked in the same direction are stacked in the vertical direction, a heavy load is applied to each IC chip due to the thickness and weight of each IC chip, and the IC chip may be damaged. In contrast, with this configuration, the number of IC chips of the RFID inlets that are stacked in the vertical direction when the paper base material is folded can be reduced, so the load applied to each IC chip can be reduced.

As described above, the present invention makes it possible to realize certificate paper that is highly durable and can be manufactured and used at low cost.

FIG. 2 is a front view of the certificate paper 1 of the embodiment. FIG. 2 is a back view of the certificate paper 1 of the embodiment. 2 is an enlarged perspective view of the back side of the certificate paper 1, showing the RFID inlet 3 and the protective sheet 4 separated from the paper substrate 5. FIG. 2A is a plan view of an RFID inlet 3, and FIG. 2B is a cross-sectional view of the RFID inlet 3. FIG. 2 is an explanatory diagram showing a layered structure of the certificate paper 1. FIG. 2 is an explanatory diagram showing the thickness of the laminated structure of the certificate paper 1. 1 is a table showing the results of a pressure resistance test. FIG. 13 is a development view showing an outline of a modified certificate form 1a.

Embodiments of the present invention are illustrated by the following examples.

The certificate paper 1 of this embodiment is a paper for issuing resident's certificates from local governments. The certificate paper 1 is a vertically long rectangle measuring 20 cm in length and 15 cm in width, but the shape and size of the certificate paper of the present invention are not limited to this. As shown in FIG. 1, the front side of the certificate paper 1 is provided with a printing section 2 for printing the certified items (name, date of birth, address, issue date, etc.). The front side of the paper base material 5 is provided with pre-printed item names and borders of the certified items to be printed in the printing section 2. Although not shown in the figure, the entire front side of the paper base material 5 is provided with pre-printed background patterns to prevent copying and counterfeiting.

As shown in Figures 2 and 3, the back side of the paper base material 5 is blank with no pre-printing. Then, an RFID inlet 3 capable of contactlessly reading and writing data is attached to the center of the bottom of the paper base material 5, and a protective sheet 4 is attached to cover the entire RFID inlet 3 from the back side. The RFID inlet 3 and protective sheet 4 are attached to a portion of the paper base material 5 where the printing unit 2 is not located on the front side. This is because the portion of the paper base material 5 to which the RFID inlet 3 and protective sheet 4 are attached is thicker than the surrounding area by the thickness of the RFID inlet 3 and protective sheet 4, and therefore if they are provided on the back side of the printing unit 2, poor printing on the printing unit 2 is more likely to occur.

When issuing a resident's certificate using the certificate paper 1, the responsible department of the local government prints the required certification details and issue date on the printing section 2 on the front side using a thermal printer or the like, and affixes an official seal. In addition, an RFID reader/writer is used to store the same information as the printed certification details in the RFID inlet 3 affixed to the certificate paper 1. A resident's certificate issued using such a certificate paper 1 can mechanically read the certification details stored in the RFID inlet 3 without contact, making it easy to check the certification details.

As shown in FIG. 4, the RFID inlet 3 comprises a thin-film inlet substrate 11, an antenna 13 provided on the surface of the inlet substrate 11, and an IC chip 12 arranged on the antenna 13. As shown in FIG. 3, the RFID inlet 3 is attached to the paper substrate 5 with an adhesive, with the surface on which the IC chip 12 and the antenna 13 are arranged facing the paper substrate 5. The inlet substrate 11 is made of a PET film. The antenna 13 is a loop antenna for non-contact communication using electromagnetic waves in the HF band, and is printed on the surface of the inlet substrate 11 with conductive paste. The IC chip 12 is capable of electromagnetically storing the certification information printed on the printing section 2, and is arranged on the center of the antenna 13, and is bonded to the antenna 13 by an anisotropic conductive adhesive 14 and electrically connected. The size of the IC chip 12 is approximately 1500 μm in length and width and approximately 120 μm in thickness, which is large for an RFID inlet. This is because known security technology to prevent tampering with stored information is implemented in the IC chip 12. For this reason, as shown in FIG. 4(b), the IC chip 12 protrudes from the surface of the inlet base material 11.

As shown in FIG. 3, the protective sheet 4 has a generally rectangular shape in plan view. The protective sheet 4 has dimensions larger than the planar shape of the RFID inlet 3, and is attached to the entire back side of the RFID inlet 3 with an adhesive. It also extends around the RFID inlet 3 and is attached to the paper base material 5 around the RFID inlet 3 with an adhesive. The protective sheet 4 can be made of PET film or paper, but it is preferable to use paper rather than PET film. PET film is suitable for the inlet base material because of its excellent dimensional stability, but it is less stretchable than paper and is difficult to disperse the load from the thickness direction to the surroundings. In addition, the adhesive used to attach the protective sheet 4 to the paper base material 5 is different from the adhesive used to attach the RFID inlet 3 to the paper base material 5. Specifically, the RFID inlet 3 is attached to the paper base material 5 with a hot melt adhesive, while the protective sheet 4 is attached to the paper base material 5 and the RFID inlet 3 with an emulsion adhesive.

The paper base material 5 is a typical printing paper made of paper with no unevenness, and can be made of thick high-quality paper or cardboard used in existing certificate papers. As mentioned above, if the paper base material is made of paper, it is relatively easy to distribute the load from the thickness direction to the surrounding area.

Figure 5 shows the laminated structure of the attachment portion of the RFID inlet 3. As shown in Figure 5, the attachment portion of the RFID inlet 3 is raised on the back side by the thickness of the RFID inlet 3 and the protective sheet 4, and is thicker than the surrounding area. In particular, since the IC chip 12 protrudes from the surface of the inlet base material 11, the arrangement portion of the IC chip 12 is the thickest among the attachment portions of the RFID inlet 3. In this way, in the certificate paper 1 of this embodiment, the thickness of the arrangement portion of the IC chip 12 is the thickest, and the load is likely to concentrate in this area. For this reason, in this embodiment, the paper base material 5 and the protective sheet 4 on the front and back of the IC chip 12 are given an appropriate thickness, so that the load applied to the arrangement portion of the IC chip 12 is distributed around the IC chip 12, thereby reducing the load applied to the IC chip 12.

Specifically, in this embodiment, as shown in Fig. 6, the thickness t2 of the paper substrate 5 arranged on the front side of the IC chip 12 is set to 130 to 170 µm relative to the thickness t4 (approximately 120 µm) of the IC chip 12, and the combined thickness t3 of the protective sheet 4, inlet substrate 11, and antenna 13 arranged on the back side of the IC chip 12 is set to 100 to 200 µm, thereby dispersing the load applied from the front and back to the IC chip 12 placement area around the IC chip 12, preventing a large load from being applied to the IC chip 12 and improving the load-bearing performance. The reason why the thicknesses t2 and t5 on both the front and back sides of the IC chip 12 are restricted from becoming excessively thick is that if the thickness t1 of the IC chip 12 placement area becomes excessively large, that area will get caught when paper is passed through a general thermal printer. Specifically, in this embodiment, the thickness t1 of the area where the IC chip 12 is located is set to 500 μm or less, which is the thickness at which certification information can be printed using a typical thermal printer.

Here, since the paper base material 5 is required to have high durability as a certificate paper, it is desirable to thicken the paper base material 5 to increase its durability within a range in which the thickness t1 of the IC chip 12 placement portion does not become excessively large. On the other hand, for the protective sheet 4, if the step 20 (see FIG. 5) equivalent to the thickness t5 formed on the outer periphery becomes large, the step 20 may get caught inside the printer when printing the certification information on the certificate paper 1, so it is desirable to thin the protective sheet 4 within a range in which the durability of the IC chip 12 is not insufficient. For this reason, in this embodiment, the RFID inlet 3 is attached to the paper base material 5 with the placement surface facing, thereby increasing the thickness t2 of the paper base material 5 and suppressing the thickness t5 of the protective sheet 4 without thickening the placement portion of the IC chip 12 or reducing the durability of the IC chip 12. That is, in this configuration, the inlet substrate 11 and antenna 13 are not arranged on the front side (paper substrate side) of the IC chip 12, and the load needs to be distributed appropriately only by the paper substrate 5, so the thickness t2 of the paper substrate 5 can be made thicker by the amount where the inlet substrate 11 and antenna 13 are not arranged. In contrast, on the back side (protective sheet side) of the IC chip 12, the load only needs to be distributed appropriately by the protective sheet 4, inlet substrate 11, and antenna 13, so the thickness t5 of the protective sheet 4 can be made thinner by the thickness t6 of the inlet substrate 11 and antenna 13.

In this way, with the certificate paper 1 of this embodiment, it is relatively easy to ensure the durability required for the certificate paper 1 for the IC chip 12 of the RFID inlet 3 and the paper base material 5 while keeping the thickness t1 of the area where the IC chip 12 is located low. Furthermore, the certificate paper 1 of this embodiment does not require the paper base material 5, protective sheet 4, or RFID inlet 3 to be processed into a special shape or made from a special material, so manufacturing costs can be kept low. Furthermore, because the area where the IC chip 12 is located is not excessively thick, it does not become bulky, increasing transportation costs, or become difficult to feed through a general printer, increasing the cost of printing the certified information.

The protective sheet 4 is larger than the RFID inlet 3, and the outer periphery of the protective sheet 4 extends around the RFID inlet 3 and is attached to the paper substrate 5. In this configuration, in order to peel the RFID inlet 3 from the certificate paper 1, not only the RFID inlet 3 but also the protective sheet 4 must be peeled off from the paper substrate 5. For this reason, in this embodiment, it is more difficult to peel off the RFID inlet 3 than in a configuration in which only the RFID inlet 3 is attached to the paper substrate 5, and it is more difficult to tamper with the certificate by replacing the RFID inlet 3.

In particular, in this embodiment, the adhesive 23 that attaches the RFID inlet 3 to the paper base material 5 is different from the adhesive 24 that attaches the protective sheet 4 to the paper base material 5. With this configuration, when peeling off the protective sheet 4 from the paper base material 5 and when peeling off the RFID inlet 3, the peeling method must be adapted to the properties of the adhesives 23, 24, respectively, making it even more difficult to replace the RFID inlet 3. Note that in this embodiment, the RFID inlet 3 and the protective sheet 4 are attached to the paper base material 5 with the adhesives 23, 24, but one or both of the RFID inlet 3 and the protective sheet 4 may be attached to the paper base material 5 with an adhesive.

In addition, in this embodiment, the outer periphery of the protective sheet 4 extends around the RFID inlet 3 and does not overlap with the RFID inlet 3, so the step 20 on the outer periphery of the protective sheet 4 is unlikely to become relatively large, and there is less risk of the step 20 getting caught inside the printer when printing the certification information on the certificate paper 1.

The certificate paper 1 of this embodiment can be manufactured, for example, by the following steps (1) to (3).
(1) The front side of the paper base material 5 is pre-printed by offset printing or the like.
(2) The RFID inlet 3 is attached to the back side of the paper base material 5 with the adhesive 23 .
(3) The protective sheet 4 is attached to the RFID inlet 3 and the paper base material 5 with an adhesive 24 so as to cover the RFID inlet 3 .

The above manufacturing method is merely an example, and the certificate paper 1 of this embodiment can be manufactured by other manufacturing methods. For example, the protective sheet 4 may be attached to the non-installed side of the RFID inlet 3, and then the RFID inlet 3 and the protective sheet 4 may be attached together to the paper base material 5.

<Test sample 1>
The certificate paper 1 of the above embodiment was prepared using the following materials and dimensions to prepare a test sample 1.
Paper base material: Coated paper, manufactured by Nippon Paper Industries Co., Ltd., Ibest (thickness 170 μm)
Protective sheet: PET film (thickness approx. 70 μm)
RFID inlet: NFC tag (BullsEye) manufactured by SMARTRAC
Inlet substrate: PET film (thickness approx. 30 μm)
Antenna: (thickness approx. 30 μm)
IC chip: NXP NTAG216 (thickness approx. 120 μm)

<Test sample 2>
A certificate paper similar to the above test sample 1 was prepared as test sample 2, except that the material of the protective sheet 4 was changed to high-quality paper (thickness: approximately 70 μm).

<Comparative product 1>
A certificate paper having a configuration in which the protective sheet 4 was removed from the configuration of the above-mentioned test sample 1 was prepared and used as comparative sample 1.

<Comparative product 2>
A certificate paper having the same configuration as the above-mentioned test sample 1 was prepared as a comparative sample 2, except that the RFID inlet was attached to the paper base material with the non-applied side facing up.

<Pressure Test>
The IC chip breaking strength was measured for test samples 1 and 2 and comparative samples 1 and 2. Specifically, a steel ball with a diameter of 2 mm was attached to the probe of a tensile compression tester with a maximum load of 500 N, and pressure was applied to the IC chip placement portion from the thickness direction to increase the pressure, and the load at which the IC chip broke was measured. For each sample, pressure was applied from the front side and from the back side five times, and the maximum and minimum values of the five measured values for each of the front and back sides were excluded, and the average value of the remaining three measured values was taken as the breaking strength. The results are shown in Figure 7.

As shown in Figure 7, the breaking strength of the IC chip on both the front and back of the comparison sample 1, which does not have a protective sheet, is lower than that of the test sample 1, which has a protective sheet. This suggests that the protective sheet of the test sample 1 contributes to dispersing the load applied to the IC chip placement area from the front and back to the periphery of the IC chip.

In addition, when comparing the breaking strength of the IC chips in test sample 1 and comparison sample 2, test sample 1 had a breaking strength of 40N from the front side and 30N from the back side, while comparison sample 2 had a breaking strength of 90N from the front side and 20N from the back side, showing a large deviation, and was particularly vulnerable to pressure from the back side. This suggests that the inlet substrate and antenna placed on the front or back side of the IC chip contribute to dispersing the load applied to the IC chip placement area to the surrounding area. It also suggests that in order to increase breaking strength from both the front and back sides, it is necessary to provide an appropriate thickness on both the front and back sides of the IC chip.

In addition, when comparing the breaking strength of the IC chips in test sample 1 and test sample 2, test sample 1 was over 40N and under 35N from the front side, whereas test sample 2 was over 35N on both the front and back sides, meaning that the breaking strength from the back side was higher than that of test sample 1, with a well-balanced breaking strength on the front and back. This suggests that a paper protective sheet is easier to distribute the load applied to the IC chip placement area around the IC chip than a PET protective sheet.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and can be modified as appropriate without departing from the spirit and scope of the present invention.
For example, while the above embodiment applies the present invention to a certificate paper for a resident's card, the certificate paper of the present invention can be applied to all papers used for certificates issued by public institutions and private companies.

Furthermore, the certificate paper 1 in the above embodiment is a single sheet, but the certificate paper of the present invention may be continuous paper or roll paper.
FIG. 8 shows a modified certificate paper 1a in which the certificate paper 1 of the above embodiment is changed to a continuous paper. The certificate paper 1a is formed by continuously forming a plurality of pieces of the paper base material 5 of the above embodiment in the longitudinal direction. Each paper base material 5 is continuous via a perforation 26, and each paper base material 5 is cut and separated at the perforation 26 after printing the certification information. Although FIG. 8 shows an unfolded state, the certificate paper 1a is folded accordion-like at the perforation 26 and stored in a folded state in which the paper base material 5 is folded one by one. In this folded state, adjacent paper base materials 5 are overlapped with the front and back facing inversely, and the paper base material 5 of each alternate piece is overlapped with the same orientation. In contrast, in this modified example, as shown in FIG. 8, the attachment positions of the RFID inlet 3 are shifted in the left-right direction for every two pieces of the paper base material 5, so that the attachment positions of the RFID inlet 3 for each paper base material 5 of each alternate piece are configured to be different from each other. According to this configuration, when the paper base material 5 is folded, the number of IC chips 12 of the RFID inlets 3 that overlap in the vertical direction can be reduced, so that it is possible to prevent a large number of IC chips 12 overlapping vertically from being subjected to a heavy load on the IC chips 12, which would cause the IC chips 12 to be damaged. In this modified example, all perforations 26 formed at the boundaries of the paper base material 5 are accordion-folded, and the paper base material 5 is folded piece by piece, but the present invention may be a continuous paper in which every other perforation 26 is accordion-folded, and the paper base material 5 is folded two pieces at a time. When the paper base material 5 is folded two pieces at a time, the three pieces of the paper base material 5 overlap each other in the same direction, so that the attachment positions of the RFID inlets 3 on each paper base material 5 are configured to be different from each other for the three pieces of the paper base material 5, it is possible to reduce the number of IC chips 12 of the RFID inlets 3 that overlap in the vertical direction. 8, the number of IC chips 12 stacked vertically is reduced by varying the attachment positions of the RFID inlets 3 on every other sheet of paper 5, but as long as the IC chips 12 can be arranged in different locations on one or more sheets of paper 5, it is not necessary to vary the attachment positions of the RFID inlets 3. For example, if the IC chip 12 is arranged in a position away from the center of the RFID inlet 3, the RFID inlet 3 can be attached in a different location on every other sheet of paper 5 without varying the attachment positions of the RFID inlets 3 by simply flipping the RFID inlet 3 up and down by 180° and attaching it on one or more sheets of paper 5.

In the above embodiment, the back side of the paper base material 5 was blank, but the back side of the paper base material 5 may also be pre-printed. Pre-printed contents include notes about the certificate to be issued and a notes section for writing notes after the certificate is issued. Pre-printing may also be performed on the back side of the protective sheet 4 attached to the back side of the paper base material 5. In the above embodiment, the RFID inlet 3 was attached to the back side of the certificate paper 1, but the RFID inlet 3 may be attached to the front side of the certificate paper 1 (the side where the printing unit is located).

In addition, the protective sheet 4 in the above embodiment is substantially rectangular, but the planar shape of the protective sheet 4 according to the present invention is not particularly limited and may be circular or elliptical. In addition, the protective sheet 4 in the above embodiment is larger than the RFID inlet 3 and extends around the RFID inlet 3, but the protective sheet 4 according to the present invention may be the same size as the RFID inlet 3 or smaller than the RFID inlet 3.

REFERENCE SIGNS LIST 1 Certificate paper 2 Printing section 3 RFID inlet 4 Protective sheet 5 Paper substrate 11 Inlet substrate 12 IC chip 13 Antenna 14 Anisotropic conductive adhesive 20 Step 23, 24 Adhesive 26 Perforation

Claims (6)

A certificate form used to issue a certificate by printing the certification information,
a paper base material provided with a printing section for printing certification information;
an RFID inlet that is affixed to a location other than the printed portion of the paper base material and that can read and write the certification information without contact;
a protective sheet attached to the RFID inlet;
The RFID inlet comprises:
The inlet device includes a thin-film inlet base material, an antenna formed on a surface of the inlet base material, and an IC chip disposed on and connected to the antenna,
the antenna and the IC chip are attached to the paper base material with the mounting surface facing the paper base material;
A certificate paper, characterized in that a non-arrangement side on which the antenna and the IC chip are not arranged is covered with the protective sheet. The certificate paper according to claim 1, characterized in that the inlet substrate is made of a PET film, and the paper substrate and the protective sheet are made of paper. The thickness of the IC chip mounting portion is 500 μm or less,
The thickness of the IC chip is 70 to 150 μm,
The thickness of the paper base material is 100 to 200 μm,
3. The certificate paper according to claim 2, wherein a combined thickness of the inlet base material, the antenna, and the protective sheet is 100 μm or more. The certificate paper according to any one of claims 1 to 3, characterized in that the protective sheet extends around the RFID inlet and is attached to the paper base material around the RFID inlet. The certificate paper according to claim 4, characterized in that the adhesive or glue used to attach the RFID inlet to the paper base material is different from the adhesive or glue used to attach the protective sheet to the paper base material. A continuous sheet of paper in which a plurality of the paper base materials are continuous in one direction, and the paper base materials are folded one piece at a time or multiple pieces at a time by folding back the paper base materials in an accordion-like manner at the boundaries of the paper base materials,
The certificate paper according to any one of claims 1 to 5, characterized in that for a plurality of paper substrates overlapping each other in the same orientation in the vertical direction, the arrangement locations of the IC chips of the RFID inlets for each of the paper substrates are configured to be different for at least some of the paper substrates.

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