JP7656196B2 - Resin residue removal device - Google Patents

Description

The present invention relates to a resin sludge removal device that removes resin sludge adhering to the die of a molding device.

Conventionally, there is a technique for producing a molded product by blow molding a parison extruded from a molding device. For example, Patent Document 1 discloses a method for producing a hollow molded product by extruding a cylindrical parison from a slit formed in the die of the molding device, allowing it to hang down, and blow molding this in a metal mold. Patent Document 2 discloses a method for producing a resin panel by extruding a resin sheet from the T-die of a pair of molding devices, allowing it to hang down, and clamping it together with a core material in a metal mold.

JP 2010-214815 A JP 2019-098560 A

However, after the molten resin is extruded through the die slits, some of the resin remains near the slits and adheres to the molding device as resin residue, which can have a detrimental effect on molding.

The present invention was made in consideration of these circumstances, and provides a resin residue removal device that can properly remove resin residue adhering to the underside of the die of a molding device.

According to the present invention, there is provided a resin scum removal device for removing resin scum adhering to the underside of a die of a molding device, the device comprising a moving means and a resin scum removal head, the moving means being configured to move the resin scum removal head between a lateral position away from directly below the die and a directly below position that is directly below the die, and also to move the resin scum removal head at the directly below position between a distant position away from the underside and a close position close to the underside, the resin scum removal head being configured to be able to remove resin scum adhering to the underside by moving along the underside.

According to the present invention, the moving means is configured to move the resin residue removal head between a lateral position and a directly below position, and between a separated position and a close position, so that the resin adhering to the underside of the die can be removed without damaging the die.

Various embodiments of the present invention are illustrated below. The embodiments shown below can be combined with each other.

Preferably, the moving means includes a support arm that supports the resin residue removal head at its tip end, and includes at least one of the following configurations (1) and (2): (1) A configuration in which the support arm moves horizontally to move the resin residue removal head between the side position and the directly below position. (2) A configuration in which the support arm swings in a seesaw manner to move the resin residue removal head between the separated position and the close position.

Preferably, the moving means includes a guide means, a slide member, and a linear drive means, the support arm is supported by the slide member, and the slide member slides along the guide means when driven by the linear drive means, thereby moving the resin residue removal head between the directly below position and the lateral position.

Preferably, the guide means extends toward the die at the side position, and the linear drive means drives the slide member to slide along the guide means, thereby moving the support arm forward and backward, and moving the resin residue removal head between the directly below position and the side position.

Preferably, the slide member includes a support shaft that supports the support arm and a pressing portion that presses the support arm, and the support arm includes a pressed portion located on the opposite side of the support shaft from the resin residue removal head, and when the support arm advances with the sliding of the slide member, the pressing portion presses the pressed portion from above downward, causing the support arm to swing in a seesaw shape around the support shaft.

Preferably, the pressing portion is a roller installed on a support frame that supports the guide means, and the pressed portion is a cam whose upper surface is inclined upward as it approaches the rear end of the support arm, and when the support arm advances with the sliding of the sliding member, the roller abuts against the upper surface and presses the cam downward.

Preferably, the molding device extrudes a cylindrical parison, and the bottom surface of the die has an annular slit through which the cylindrical parison can be extruded, and the resin residue removal head includes a resin residue removal member and a removal drive means, the resin residue removal member has an opposing surface that faces the bottom surface, and the removal drive means drives the resin residue removal member to rotate so that the opposing surface moves along the slit.

Preferably, the resin residue removal member is a columnar member supported so as to be rotatable.

Preferably, the resin residue removal member is a removal blade having a cutting edge in the direction of rotation.

Preferably, the molding device extrudes a sheet-shaped resin sheet, and a linear slit is formed on the underside of the die through which the resin sheet can be extruded, the guide means is arranged along the longitudinal direction of the slit, and the linear drive means drives the slide member to slide along the guide means, thereby sliding the support arm, and the resin residue removal head moves between the side position and the directly below position, and further moves along the slit.

Preferably, the slide member includes a support shaft that supports the support arm,
The moving means includes a swing drive means for swinging the support arm in a seesaw manner about the support shaft.

Preferably, the device includes a control means for controlling the moving means, and the control means causes the linear drive means to move the resin residue removal head to a position farthest from the lateral position at the directly below position while the resin residue removal head is in the separated position, then causes the swing drive means to swing the support arm to move the resin residue removal head to the close position, and then causes the linear drive means to move the resin residue removal head along the slit toward the lateral position while the resin residue removal head is in the close position.

Preferably, a cleaning means is provided for cleaning the resin residue adhering to the resin residue removal head.

Preferably, the cleaning means includes a cooling means for cooling the resin residue removal head.

Preferably, the cleaning means is a flap that scrapes off the resin residue adhering to the resin residue removal head when the resin residue removal head moves to the lateral position.

Preferably, the cleaning means includes a cleaning member that moves along the resin residue removal head to scrape off the resin residue adhering to the resin residue removal head, and an air ejection means that ejects air toward the cleaning member.

1 is a schematic diagram showing a positional relationship between a resin residue removing device 1 according to a first embodiment of the present invention and a molding device 100 that uses the same to remove resin residue. FIG. FIG. 2 is an enlarged side view of the resin residue removing device 1 of FIG. 3A is a front view of the resin residue removing head 4 of the resin residue removing device 1 of FIG. 1, and FIG. 3B is an enlarged view of a portion L in FIG. 3A. 4A and 4B are explanatory diagrams showing the rotational drive operation of the resin residue removing head 4 in FIG. Figure 5A is a schematic diagram showing the resin residue removal head 4 of the resin residue removal device 1 of Figure 1 in a state where it is in a directly below position X2 and a separated position Z1, and Figure 5B is a schematic diagram showing the resin residue removal head 4 in a directly below position X2 and a close position Z2. 6A and 6B are explanatory diagrams showing the swinging operation of the support arm 34 of the resin residue removing device 1 of FIG. FIG. 7 is an enlarged view showing the cleaning means 5 (the tongue 51) attached to the support frame 2. As shown in FIG. 8A and 8B are explanatory diagrams that diagrammatically show the operation of the resin residue removing device 1 according to the modified example 1-1 of the first embodiment of the present invention. 9A and 9B are explanatory diagrams that diagrammatically show the operation of the resin residue removing device 1 according to Modification 1-2 of the first embodiment of the present invention. FIG. 11 is a side view showing the positional relationship between a resin residue removing device 1 according to a second embodiment of the present invention and a molding device 100 that uses the same to remove resin residue. 11 is a plan view showing the positional relationship between the resin residue removing device 1 and the molding device 100 in FIG. 10. FIG. 11 is a perspective view of the resin residue removing device 1 of FIG. 10. FIG. 11 is a side view of the resin residue removing device 1 of FIG. 11 is a perspective view showing a resin residue removing head 4 of the resin residue removing device 1 of FIG. 10. This is a cross-sectional view of line AA in Figure 13. 16A is a side view showing the arrangement of the cleaning means 5 of the resin residue removing device 1 of FIG. 10, and FIG. 16B is a plan view showing the arrangement of the cleaning means 5. As shown in FIG. 17A to 17D are explanatory diagrams showing how the resin residue removing head 4 of the resin residue removing device 1 of FIG. 10 moves along the die 101 of the molding device 100. Figure 18A is a schematic diagram showing the resin residue removal head 4 of the resin residue removal device 1 of Figure 10 in a lateral position X1 and a separated position Z1, and Figure 18B is a schematic diagram showing the resin residue removal head 4 in a directly below position X2 and a close position Z2. 1 is an explanatory diagram showing a state in which a protrusion 102a is present at the rear edge of the lower surface 102 of a die 101. FIG. 20A and 20B are side views showing how the cleaning means 5 of the resin residue removing device 1 of FIG. 10 removes the resin residue R adhering to the resin residue removing head 4. FIG. 21A and 21B are plan views showing how the cleaning means 5 of the resin residue removal device 1 of FIG. 10 removes the resin residue R adhering to the resin residue removal head 4. FIG. 2 is a side view showing the positional relationship between a resin residue removing device 1 according to a modified example 2-1 of the second embodiment of the present invention and a molding device 100 that uses the same to remove resin residue. FIG. 13 is an explanatory diagram illustrating the operation of the resin residue removing device 1 according to the modified example 2-2 of the second embodiment of the present invention. FIG. Figure 24A is a plan view showing the support arm 34 and resin residue removal head 4 of a resin residue removal device 1 relating to variant example 1-3 of the first embodiment of the present invention, and Figure 24B is a side view showing a removal blade 142 attached to the rotating plate 41 of the resin residue removal head 4 of Figure 24A via an attachment member 41b.

The following describes the embodiments of the present invention. The various features shown in the embodiments below can be combined with each other. In addition, each feature can be an invention independently.

1 and 2, a resin residue removal device 1 according to a first embodiment of the present invention includes a support frame 2, a moving means 3, and a resin residue removal head 4. As shown in Fig. 1, the resin residue removal device 1 removes resin residue adhering to a lower surface 102 of a die 101 of a molding device 100 by using the resin residue removal head 4.

The molding device 100 in which the resin residue removal device 1 of this embodiment is used extrudes cylindrical molten resin 103 (cylindrical parison) from an annular slit (not shown) formed in a die 101 and causes it to hang down. The hanging molten resin 103 is blow molded in a pair of dies 104 to obtain a hollow molded product. Basically, the resin residue is generated by the cylindrical molten resin 103 remaining on the die 101 side after it is separated into the die 101 side and the die 104 side during mold clamping. Each component of the resin residue removal device 1 will be described in detail below.

In the following description, the direction in which the resin residue removal head 4 slides is referred to as the front-rear direction, and the direction in which the resin residue removal head 4 advances toward the molding device 100 is referred to as the forward direction (see FIG. 1). The direction perpendicular to the front-rear direction and the up-down direction is referred to as the left-right direction (see FIG. 3A and FIG. 4A). In this embodiment, the front-rear direction coincides with the mold closing/opening direction of the mold 104, as shown in FIG. 1.

1.1 Configuration of resin residue removal device 1 <Support frame 2>
As shown in Fig. 2, the support frame 2 includes a U-shaped frame 21 having a substantially U-shape in a side view, and a pair of side frames 22 provided on both sides in the width direction of the U-shaped frame 21. The U-shaped frame 21 includes an upper frame 21a, a rear frame 21b, and a lower frame 21c, and as shown in Fig. 2, the lower frame 21c is longer than the upper frame 21a.

The side frame 22 is attached to the upper frame 21a and the lower frame 21c at a position near the front end of the upper frame 21a. As shown in Figs. 6A and 6B, two rollers 23 are provided on the inside of each side frame 22 as pressing parts that press the support arm 34. The number of rollers 23 is not limited to two. The pair of side frames 22 also support the cleaning means 5 that extends forward from above the U-shaped frame 21. The cleaning means 5 has a tongue 51 at its tip that scrapes off the resin residue adhering to the columnar member 42 of the resin residue removal head 4.

The support frame 2 itself is supported, for example, by hanging it together with the molding device 100.

<Transportation Means 3>
1, 5A and 5B, the moving means 3 moves the resin residue removing head 4 between a position away from directly below the die 101 where it does not interfere with the molding operation and a position where it is possible to remove the resin residue adhering to the lower surface 102 of the die 101. Specifically, as shown in Fig. 2, the moving means 3 includes a rail member 31 as a guide means, a slide member 32, a rodless cylinder 33 as a linear driving means, and a support arm 34. The moving means 3 including these components is supported by the support frame 2.

A pair of rail members 31 are arranged parallel to each other in the front-rear direction on the upper surface of the lower frame 21c of the support frame 2. Each rail member 31 slidably supports a slide member 32 via a guide block 36. Each rail member 31 extends toward the die 101 at a lateral position X1 (see FIG. 1) of the die 101. In other words, each rail member 31 extends along the normal direction of an annular slit (not shown) formed in the die 101.

As shown in FIG. 2, the slide member 32 has a generally U-shape in side view and is arranged along the inside of the U-shaped frame 21 of the support frame 2. The slide member 32 includes an upper plate portion 32a, a rear plate portion 32b, and a lower plate portion 32c. A support shaft 35 that supports the support arm 34 is arranged at a front position on the upper surface of the lower plate portion 32c. In addition, guide blocks 36 that can slide relative to the rail members 31 are attached to the lower surface of the lower plate portion 32c at positions corresponding to each of the pair of rail members 31, at the front and rear ends of the lower plate portion 32c. Meanwhile, a swing restriction portion 37 that restricts the swing of the support arm 34 is provided at a rear position on the lower surface of the upper plate portion 32a.

The rodless cylinder 33 includes a slide block 33a and a guide rail 33b as a guide member. The slide block 33a is fixed to the upper part of the upper plate portion 32a of the slide member 32. The guide rail 33b is provided in the sliding direction at the lower part of the upper plate of the support frame 2. The slide block 33a moves along the guide rail 33b, causing the slide member 32 to slide along the rail member 31.

The rodless cylinder 33 may be a magnet type or an air type. In this embodiment, a rodless cylinder is used as a linear drive means to reduce the installation area, but an electric cylinder, air cylinder, or the like may be used as long as it is possible to drive the slide member 32 back and forth.

As shown in Figs. 3A, 4A and 4B, the support arm 34 is a long and thin plate-like member having a substantially rectangular cross-sectional shape. The support arm 34 supports the resin residue removal head 4 at the front end 34a, which is the end on the molding device 100 side. The support arm 34 is supported by a support shaft 35 extending in the left-right direction and installed on the slide member 32, and can swing in a seesaw shape around the support shaft 35. As shown in Fig. 2, cams 38 are provided on the left and right sides of the support arm 34, at positions rearward of the positions where the support arm 34 is supported by the support shaft 35, as pressed parts that are pressed by the rollers 23 provided on the side frame 22. As shown in Figs. 6A and 6B, the upper surface of the cam 38 is an inclined surface 38a that is inclined upward toward the rear end of the support arm 34.

<Resin residue removal head 4>
2 and 3A to 4B, the resin residue removal head 4 includes a rotating plate 41, a pair of columnar members 42 as resin residue removal members, and a removal drive means 43. The resin residue removal head 4 of this embodiment is configured to be able to remove resin residue adhering to the lower surface 102 of the die 101 by the pair of columnar members 42 by rotating the rotating plate 41 at position X2 directly below the die 101 of the molding device 100.

The rotating plate 41 is a long, thin plate-like member with a roughly rectangular cross-sectional shape. The rotating plate 41 is disposed at the front end 34a of the support arm 34 and is supported by the support arm 34 via the rotating shaft 44.

The pair of columnar members 42 are supported rotatably (rotatably) on the shaft 41a extending upward from both ends of the rotating plate 41. Each columnar member 42 is cylindrical and arranged so that its axis faces the up-down direction. As a result, the circular upper surface of the columnar member 42 becomes the facing surface 42a facing the lower surface 102 of the die 101 (see FIG. 3B). The columnar member 42 is preferably made of a soft metal, for example, brass. By using a soft metal, it is possible to prevent damage to the die 101 even if it comes into contact with the die 101. In addition, the upper edge of the columnar member 42 is an enlarged diameter portion 42b that is enlarged in an inverse taper shape, as shown in FIG. 3B. In addition, the distance between the centers of the pair of columnar members 42 is approximately the same as the diameter of the annular slit formed in the die 101 (in other words, the diameter of the cylindrical molten resin 103 hanging down from the molding device 100).

The removal drive means 43 is configured to rotate the rotating plate 41 at the front end 34a of the support arm 34. As shown in Figures 3A, 4A, and 4B, the removal drive means 43 includes a rotating shaft 44, a front end pulley 45, a rear end pulley 46, a chain 47, and a rodless cylinder 48.

As shown in FIG. 3A, the rotating shaft 44 has a rotating plate 41 fixed to its upper end, and is configured so that the rotating shaft 44 and the rotating plate 41 rotate together. A front-end pulley 45 is fitted to the lower end of the rotating shaft 44 so that it cannot rotate relative to the rotating shaft 44. The front-end pulley 45 is disposed below the front end 34a of the support arm 34, and is covered by a front-end cover 34b (see also FIG. 2). A gear for accelerating or decelerating the speed may be provided between the front-end pulley 45 and the rotating shaft 44.

The rear end pulley 46 is disposed below the rear end 34d of the support arm 34 and is supported by the support arm 34 via a rotating shaft 49. The rear end pulley 46 is covered by the rear end cover 34c (see FIG. 2). A single chain 47 is wound around the front end pulley 45 and the rear end pulley 46. Both ends of the chain 47 are connected to slide blocks 48b of the rodless cylinder 48, respectively, to form a ring structure.

As shown in FIGS. 4A and 4B, the rodless cylinder 48 includes a support plate 48a (see also FIG. 2), a slide block 48b, and a guide rail 48c. The support plate 48a is arranged so that its longitudinal direction is along the front-rear direction and is attached to the support arm 34. The support plate 48a supports the guide rail 48c. The slide block 48b is supported by the guide rail 48c and is movable along the guide rail 48c. One end of the chain 47 is connected to one end of the slide block 48b, and the other end of the chain 47 is connected to the other end of the slide block 48b. The guide rail 48c is arranged along the longitudinal direction of the support plate 48a, that is, along the front-rear direction. The slide block 48b moves backward and forward along the guide rail 48c, so that the chain 47 moves, and the front end pulley 45 and the rear end pulley 46 rotate clockwise and counterclockwise in conjunction with this (see FIGS. 4A and 4B).

The rodless cylinder 48 may be a magnetic type or an air type. Also, as long as it is possible to move the chain 47, an electric cylinder, an air cylinder, or the like may be used.

1.2 Operation of the resin residue removal device 1 Next, with reference to Figs. 4A to 6B, the operation of the resin residue removal device 1 configured as above, specifically, the removal head moving operation for moving the resin residue removal head 4 and the resin residue removal operation by the resin residue removal head 4 will be described. Note that these operations are performed at a timing when the molten resin 103 in a molten state is extruded from the slit (not shown) of the die 101 of the molding device 100 and the drooping of the molten resin 103 from the slit is interrupted. More specifically, for example, after the mold 104 is closed, the resin residue removal device 1 is operated at a timing when the removal machine (not shown) for removing the molded body after the mold is closed pinches the molten resin 103 protruding from the upper part of the mold 104. Note that these operations are preferably performed every time the mold 104 is closed, but may be configured to be performed every predetermined number of times or according to a user's instruction.

Each operation of the resin residue removal device 1 is controlled by a control means (not shown). Specifically, the control means can be configured, for example, as an information processing device equipped with a CPU, memory (e.g., flash memory), input section, and output section. Furthermore, the processing by each of the above-mentioned components of the control means configured by the information processing device is performed by the CPU reading and executing a program stored in the memory. As the information processing device, for example, a personal computer, a PLC (programmable logic controller), or a microcomputer is used. However, some of the functions of the control means may be configured to be executed on a cloud connected by any communication means.

<Removal head movement>
1 and 5A, in the resin residue removal device 1 of this embodiment, the moving means 3 moves the resin residue removal head 4 between a lateral position X1 off from directly below the die 101 and a directly below position X2 that is directly below the die 101. In addition, as shown in Figures 5A and 5B, the moving means 3 moves the resin residue removal head 4 at the directly below position X2 between a distant position Z1 away from the lower surface 102 of the die 101 and a close position Z2 close to the lower surface 102.

In this embodiment, the "directly below position X2" refers to a position inside the cylinder formed by extending the side of the die 101 downward. In addition, when the resin residue removal head 4 is at the directly below position X2, it means that the rotating shaft 44 of the resin residue removal head 4 is located inside the cylinder. The movement operation of the removal head by the movement means 3 will be specifically described below.

When the resin residue removal device 1 of this embodiment is not performing a resin residue removal operation, as shown in FIG. 1, the resin residue removal head 4 is retracted to a lateral position X1 and is kept on standby in a position that does not interfere with the molding operation by the molding device 100. In this state, as shown in FIGS. 2 and 6A, the rear end 34d of the support arm 34 of the moving means 3 abuts against a swing restriction portion 37 (see FIG. 2), so that the swing, specifically, the rotation of the rear end 34d in the upward direction about the support shaft 35 is restricted. In this state, the support arm 34 is slightly tilted so that the front end 34a is downward.

To move the resin residue removal head 4 from this state to remove the resin residue, the rodless cylinder 33 of the moving means 3 is driven. Specifically, the slide block 33a of the rodless cylinder 33 is slid forward along the guide rail 33b. Then, as the slide block 33a slides, the slide member 32 slides forward along the rail member 31, and the support arm 34 supported by the slide member 32 moves forward. As the support arm 34 moves forward, the resin residue removal head 4 supported by its front end portion 34a moves from the lateral position X1 toward the directly below position X2.

Figure 5A shows the state in which the resin residue removal head 4 has moved to the directly below position X2. At the stage in Figure 5A, the center of the resin residue removal head 4, i.e., the rotating shaft 44, has not yet reached directly below the center of the die 101. Furthermore, until the resin residue removal head 4 moves from the side position X1 to the directly below position X2 shown in Figure 5A, it remains tilted so that the front end 34a is facing downwards.

When the rodless cylinder 33 of the moving means 3 is driven further from the state shown in FIG. 5A, as shown in FIGS. 6A and 6B, the support arm 34 advances, and the cam 38 provided on the support arm 34 approaches the roller 23 of the side frame 22, after which the roller 23 comes into contact with the inclined surface 38a. When the support arm 34 then advances further, the roller 23 presses the cam 38 from above downward, and a downward force is applied to the cam 38. When a downward force is applied to the cam 38, the support arm 34 swings in a seesaw shape around the support shaft 35, and the front end 34a of the support arm 34 moves upward. As a result, the support arm 34 becomes horizontal. In other words, in this embodiment, the rodless cylinder 33, the roller 23, and the cam 38 can be said to be a swing drive means that swings the support arm 34 in a seesaw shape around the support shaft 35.

Then, as a result of the front end 34a moving upward, the resin residue removal head 4 moves from the separated position Z1 to the close position Z2 inside the directly below position X2, as shown in Figures 5A and 5B. The center (rotating shaft 44) of the resin residue removal head 4 reaches directly below the center of the die 101 when the resin residue removal head 4 moves to the close position Z2. In this state, the opposing surface 42a of the columnar member 42 faces the lower surface 102 of the die 101 in parallel. In this state, the resin residue removal device 1 of this embodiment performs the next resin residue removal operation.

In the resin residue removal device 1 of this embodiment, even when the support arm 34 swings and the resin residue removal head 4 moves to the approach position Z2, it is preferable to leave a small gap (e.g., about 2 mm) between the die 101 and the columnar member 42 of the resin residue removal head 4. This makes it possible to prevent the rotating columnar member 42 from interfering with the die 101.

After the resin residue removal operation is completed, the moving means 3 slides the slide block 33a of the rodless cylinder 33 backward along the guide rail 33b, causing the slide member 32 to slide backward and the support arm 34 to retract. As a result, in the opposite manner to the above, the resin residue removal head 4 moves from the close position Z2 to the separated position Z1, and then moves from the directly below position X2 to the side position X1.

When the resin residue removal head 4 moves from the direct below position X2 to the side position X1, as shown in FIG. 7, the tongue 51 of the cleaning means 5 supported by the support frame 2 (the pair of side frames 22) scrapes off the resin residue adhering to the columnar member 42.

In this way, the moving means 3 of this embodiment is configured to move the resin residue removal head 4 between the lateral position X1 and the directly below position X2 by the support arm 34 moving forward and backward (moving horizontally) relative to the support frame 2. In addition, the moving means 3 is configured to move the resin residue removal head 4 between the separated position Z1 and the close position Z2 by the support arm 34 swinging in a seesaw manner.

<Resin residue removal operation>
Next, the resin residue removal operation by the resin residue removal head 4 will be described with reference to Figures 4A and 4B. In this embodiment, the resin residue removal operation is an operation of moving a pair of columnar members 42 along the lower surface 102 of the die 101. More specifically, the resin residue removal operation is an operation of rotating (revolving) the opposing surfaces 42a (see Figure 3B) of the columnar members 42 along the annular slits of the die 101.

The resin residue removal operation is performed when the resin residue removal head 4 is in the direct below position X2 and in the close proximity position Z2 shown in FIG. 5B.

In the resin residue removal head 4 of this embodiment, the removal drive means 43 is driven to rotate the pair of columnar members 42. Specifically, the slide block 48b of the rodless cylinder 48 is moved forward and backward along the guide rail 48c. Then, the chain 47 moves with the slide of the slide block 48b, and the front end pulley 45 rotates. When the front end pulley 45 rotates, the rotating shaft 44, which is fitted with it so that it cannot rotate relative to it, also rotates, and the rotating plate 41 fixed to the upper end side also rotates. Then, as the rotating plate 41 rotates, the pair of columnar members 42 supported at both ends of the rotating plate 41 via the shaft 41a also rotates.

In this embodiment, when the resin residue removal head 4 is in the direct below position X2 and the close proximity position Z2 shown in FIG. 5B, the center of the resin residue removal head 4 (the axis of the rotating shaft 44) is located directly below the center of the die 101, in other words, the center of the annular slit. The distance between the centers of the pair of columnar members 42 is approximately the same as the diameter of the slit. For these reasons, the columnar members 42 in this embodiment rotate along the annular slit, thereby flicking off any resin residue adhering near the slit.

In this way, by rotating the pair of columnar members 42 while the resin residue removal head 4 is in the direct below position X2 and the close proximity position Z2 shown in FIG. 5B, it is possible to effectively remove the resin residue adhering to the underside 102 of the die 101, particularly near the slits.

In addition, in one resin residue removal operation, it is preferable to move the pair of columnar members 42 in both clockwise and counterclockwise directions by reciprocating the slide block 48b of the rodless cylinder 48. This allows the resin residue adhering to the lower surface 102 of the die 101 to be scraped off from both sides, making it possible to effectively remove the resin residue.

In addition, when the columnar member 42 rotates (revolves) around the rotating shaft 44, the columnar member 42 itself can also rotate (spin) around the axis 41a. By rotating the columnar member 42 itself, it is possible to prevent the columnar member 42 from getting caught on the resin residue.

In addition, the upper edge of the columnar member 42 is an enlarged diameter portion 42b that is inverted and tapered, making it possible to effectively tear off resin residue adhering to the die 101.

1.3 Action and Effects As described above, according to the resin residue removal device 1 of this embodiment, by driving the rodless cylinder 33, the support arm 34 is advanced and retreated to move it horizontally, thereby moving the resin residue removal head 4 between the lateral position X1 and the directly below position X2, and by swinging the support arm 34, the resin residue removal head 4 can be moved between the separated position Z1 and the close position Z2.

In this way, the resin residue removal device 1 of this embodiment is capable of performing two operations, the advance/retract movement and the swinging movement of the support arm 34, by driving only one rodless cylinder 33. And, by performing the swinging movement of the support arm 34 at the directly below position X2, it is possible to prevent the resin residue removal head 4 from interfering with the die 101 during the advance/retract movement.

In addition, in the resin residue removal device 1 of this embodiment, by replacing the resin residue removal head 4, it is possible to remove resin residue from dies 101 with different diameters.

1.4 Modifications The present invention according to this embodiment can also be implemented in the following aspects.

<Modification 1-1>
In the above-described embodiment, the moving means 3 is configured to move the resin residue removing head 4 between the side position X1 and the immediately below position X2 by moving the support arm 34 back and forth in the horizontal direction. However, the configuration for moving the resin residue removing head 4 between the side position X1 and the immediately below position X2 is not limited to this. For example, as shown in Figs. 8A and 8B, it is also possible to move the resin residue removing head 4 between the side position X1 and the immediately below position X2 by rotating the support arm 34 around a rotation axis 39 extending vertically outside the die 101 in a plan view by an arbitrary rotation driving means (not shown). As the rotation driving means, an electric motor can be mentioned.

<Modification 1-2>
In the above-described embodiment, the moving means 3 is configured to move the resin residue removing head 4 between the separated position Z1 and the adjacent position Z2 by swinging the support arm 34 around the support shaft 35. However, the configuration for moving the resin residue removing head 4 between the separated position Z1 and the adjacent position Z2 is not limited to this. For example, as shown in FIG. 9A and FIG. 9B, it is also possible to move the resin residue removing head 4 between the separated position Z1 and the adjacent position Z2 by vertically raising and lowering the support arm 34 using the telescopic driving means 6. As the telescopic driving means 6, for example, an electric cylinder is given. Furthermore, it is also preferable to combine the configuration for swinging the support arm 34 around the support shaft 35 and the configuration for raising and lowering the support arm using the telescopic driving means 6 to make it applicable to dies 101 of different heights.

<Modification 1-3>
In the above-described embodiment, the resin residue removal head 4 is configured to include a pair of columnar members 42 as a resin residue removal member for removing resin residue. However, as shown in Fig. 24A and Fig. 24B, the resin residue removal head 4 may be configured to include a pair of removal blades 142 having blade portions 142b in the rotation direction (the direction of the arrow in Fig. 24A and Fig. 24B) of the resin residue removal head 4 (rotating plate 41) instead of the pair of columnar members 42 as a resin residue removal member. In one example, the pair of removal blades 142 are fixed to both ends of the rotating plate 41 via mounting members 41b. In addition, the material of the removal blade 142 is preferably a soft metal, like the columnar members 42, and is made of, for example, brass.

It is preferable that the removal blade 142 is attached to the mounting member 41b in such a manner that its height, i.e., the distance between the opposing surface 142a of the removal blade 142 and the lower surface 102 of the die 101, can be adjusted. Specifically, for example, as shown in FIG. 24B, the mounting member 41b is configured to have a mounting surface 41b1 inclined with respect to the above-mentioned rotation direction, and the removal blade 142 is configured to have a mounting surface 142c inclined corresponding to the mounting surface 41b1. Then, with the mounting surface 41b1 and the mounting surface 142c in contact with each other, the bolt 41c is inserted into a long hole (not shown) opened in the removal blade 142, and the bolt 41c is screwed into the mounting member 41b to fix the removal blade 142. With such a configuration, it is possible to adjust the height of the removal blade 142 by sliding it along the mounting surface 41b1 and fix it. In addition, it is more preferable to finely adjust the angle of the removal blade 142 by adjusting the mounting angle of the removal blade 142 with respect to the rotating plate 41.

In addition, in this modified example, the removal blade 142 is attached at an angle to the rectangular rotating plate 41 so that its blade portion 142b faces inward, as shown in FIG. 24A. Specifically, the removal blade 142 is attached so that the straight line formed by the tip of the blade portion 142b in a plan view extends toward the rotation axis of the rotating plate 41. This causes the direction of the tip of the blade portion 142b to match the movement direction of the blade portion 142b that rotates with the rotation of the rotating plate 41, making it possible to effectively scrape off resin residue adhering to the lower surface 102 of the die 101.

In addition, as shown in FIG. 24B, the tip of the blade portion 142b facing the direction of rotation in side view forms an acute angle. The blade portion 142b can scrape off the resin residue adhering to the lower surface 102 of the die 101 by rotating the rotating plate 41 with the opposing surface 142a of the removal blade 142 pressed against the lower surface 102 of the die 101. Note that a small gap may be left between the opposing surface 142a of the removal blade 142 and the lower surface 102 of the die 101, as in the first embodiment.

<Other Modifications>
In the above embodiment, the rollers 23 provided on the side frames 22 press the cams 38 of the support arms 34 downward, and the support arms 34 swing using the sliding action of the slide members 32 caused by the rodless cylinders 33. However, it is also possible to configure the support arms 34 to swing using a power means other than the rodless cylinders 33.
In the above embodiment, the resin residue removal head 4 is configured to include a pair of pillar members 42, but the number and shape of the pillar members 42 are not limited to this. For example, the cross-sectional shape of the pillar members 42 may be rectangular. Also, a configuration in which only one pillar member 42 is provided on the rotating plate 41 is also possible.
In the above embodiment, the rotating plate 41 of the resin residue removal head 4 is rotated by the movement of the chain 47 driven by the rodless cylinder 48. However, it is also possible to configure the rotating plate 41 to be rotated by other driving means such as an electric motor.
In the above embodiment, the molding device 100 in which the resin residue removal device 1 is used has an annular slit and extrudes and hangs down a cylindrical molten resin 103 (parison). However, the present invention can also be used in a molding device that supplies a sheet-like molten resin.

10 and 11, a resin residue removing device 1 according to a second embodiment of the present invention includes a support frame 2, a moving means 3, a resin residue removing head 7, a cleaning means 5 (see Figs. 16A and 16B), and a control means 10. As shown in Fig. 10, the resin residue removing device 1 removes resin residue R adhered to a lower surface 102 of a die 101 (T die) of a molding device 100 by using the resin residue removing head 7.

Here, the molding device 100 in which the resin residue removal device 1 of this embodiment is used is different from that of the first embodiment in that it extrudes a sheet-like molten resin 103 (resin sheet), and the lower surface 102 of the die 101 (T-die) is formed with a linear slit 105 (see FIG. 11) through which the molten resin 103 can be extruded. As shown in FIG. 10, the molding devices 100 are arranged in a pair so that the molten resin 103 hangs down in parallel. The pair of molten resins 103 hanging down from each molding device 100 are shaped and clamped by a pair of dies 104 to be molded into a resin molded body. Note that resin residue is particularly likely to occur when using molten resin 103 to which a filler (particularly glass) has been added.

As shown in FIG. 10, in this embodiment, a resin residue removal device 1 is provided for each of a pair of molding devices 100. Basically, the resin residue is generated when the sheet-like molten resin 103 is separated into the die 101 side and the metal mold 104 side during mold clamping, and the resin residue remains on the die 101 side. Below, each component of the resin residue removal device 1 of this embodiment will be described in detail. Note that the pair of resin residue removal devices 1 provided for each molding device 100 have the same configuration, so below, only one of the resin residue removal devices 1 will be described.

In the description of this embodiment, the longitudinal direction of the slit 105 of the die 101 is defined as the front-rear direction, and the direction perpendicular to the front-rear direction and the up-down direction is defined as the left-right direction (see Figs. 10 and 12). In this embodiment, the left-right direction coincides with the mold closing/opening direction of the mold 104, as shown in Fig. 10.

2.1 Configuration of resin residue removal device 1 <Support frame 2>
11 and 12, a pair of support frames 2 are provided with a gap between them in the front-rear direction, i.e., in the longitudinal direction of the die 101. The support frame 2 supports a guide means 131 of the moving means 3. The support frame 2 itself is supported, for example, by being suspended together with the molding apparatus 100.

<Transportation Means 3>
The moving means 3 moves the resin residue removing head 7 between a position (see FIGS. 11 and 17A) that is not directly below the die 101 and does not interfere with the molding operation, and a position (see FIGS. 17B and 17C) where the resin residue adhering to the lower surface 102 of the die 101 can be removed. Specifically, as shown in FIGS. 11 and 12, the moving means 3 includes a guide means 131, a slide member 32, a rodless cylinder 33 as a linear driving means, a support arm 34, and a first air cylinder 138 as a swing driving means. The moving means 3 including these components is supported by the support frame 2.

The guide means 131 is disposed between the pair of support frames 2 so as to extend in the front-rear direction along the longitudinal direction of the die 101. The guide means 131 slidably supports the slide member 32 via the rodless cylinder 33.

As shown in FIG. 13, the slide member 32 includes a connection plate 32d and a pair of arm support plates 32e. The connection plate 32d is supported by a slide block 33a of the rodless cylinder 33, which will be described later, and supports the pair of arm support plates 32e. The connection plate 32d is a plate-shaped member with a main surface whose normal direction is the left-right direction, and as shown in FIG. 13, it extends downward from a position supported by the slide block 33a, which will be described later. The connection plate 32d supports the pair of arm support plates 32e on the opposite side (i.e., the left side) from the slide block 33a, and supports one end side mounting portion 138a1 of the first air cylinder 138 at a mounting base 32d1 provided on the same side (i.e., the right side) as the slide block 33a and below the slide block 33a.

As shown in FIG. 12, the pair of arm support plates 32e are plate-shaped members each having a main surface normal in the front-rear direction, and are supported by the connecting plate 32d so as to be aligned parallel to each other with a gap in the front-rear direction. As shown in FIG. 13, the pair of arm support plates 32e extend below the lower end of the connecting plate 32d, and support the support arm 34 via a support shaft 35 extending in the front-rear direction at the lower end of the pair of arm support plates 32e, between the pair of arm support plates 32e, so that the support arm 34 can be pivoted.

As shown in Figures 11 and 12, the rodless cylinder 33 includes a slide block 33a and a guide member 133b. The slide block 33a is supported by the guide member 133b and slides in the front-rear direction along the guide member 133b. The slide block 33a also supports the connection plate 32d of the slide member 32. The guide member 133b is supported by the guide means 131 and is disposed between the pair of support frames 2 so as to extend in the front-rear direction along the longitudinal direction of the die 101. The rodless cylinder 33 is configured such that the slide block 33a moves along the guide member 133b, causing the slide member 32 to slide along the guide means 131.

The rodless cylinder 33 may be a magnet type or an air type. In this embodiment, a rodless cylinder is used as a linear actuator to reduce the installation area, but an electric cylinder, air cylinder, or the like may be used as long as it is possible to drive the slide member 32 back and forth.

As shown in Figs. 12 and 13, the support arm 34 is a long and thin plate-like member having a substantially rectangular cross-sectional shape perpendicular to the longitudinal direction, and supports the resin residue removal head 7. The support arm 34 is supported by a support shaft 35 extending in the front-rear direction and installed on the arm support plate 32e, and can swing in a seesaw shape around the support shaft 35. Specifically, the support arm 34 includes a linear main body portion 34e into which the support shaft 35 is inserted, a tip portion 34f which is the end on the molding device 100 side and supports the resin residue removal head 7, and a base end portion 34g which is the end opposite to the tip portion 34f and to which the first air cylinder 138 is connected. The main body portion 34e is supported by the support shaft 35 and the first air cylinder 138 so as to lower toward the lower end of the die 101. The tip portion 34f supports the resin residue removal head 7 so that its plate-like base member 70 (described later) is substantially horizontal.

As shown in FIG. 13, the first air cylinder 138 as a swing drive means includes a cylinder portion 138a and a rod portion 138b. The cylinder portion 138a is provided with a one-end side mounting portion 138a1, and the tip of the rod portion 138b is provided with an other-end side mounting portion 138b1. The one-end side mounting portion 138a1 is rotatably connected to the mounting base 32d1 of the slide member 32 via a rotation shaft 60, and the other-end side mounting portion 138b1 is rotatably connected to the base end portion 34g of the support arm 34 via a rotation shaft 61. Here, the rotation shaft 60 and the rotation shaft 61 are both shafts extending in the front-rear direction. With this configuration, the first air cylinder 138 is configured to swing the support arm 34 in a seesaw shape around the support shaft 35 by expanding and contracting the rod portion 138b relative to the cylinder portion 138a. Specifically, when the rod portion 138b is contracted, the tip portion 34f of the support arm 34 swings downward, and when the rod portion 138b is extended, the tip portion 34f of the support arm 34 rises.

<Resin Resin Removal Head 7>
14, the resin residue removing head 7 includes a base member 70 and a plate-shaped member 71 serving as a resin residue removing member. The resin residue removing head 7 of this embodiment is configured to be able to remove resin residue adhering to the lower surface 102 of the die 101 by the plate-shaped member 71 by moving the plate-shaped member 71 along the slit 105 at a position X2 directly below the die 101 of the molding device 100.

The base member 70 is supported on the right side by the tip 34f of the support arm 34. The base member 70 is, specifically, a plate-like shape that is approximately rectangular in plan view. When the rectangle of the base member 70 is roughly divided into four in the plan view, the left and front upper surface 70a is higher than the left and front upper surface 70a, as shown in the cross-sectional view perpendicular to the left and right direction in FIG. 15. The base member 70 supports the plate-like member 71 on the left and front upper surface 70a. The left and rear upper surface is a residue receiving portion 70b that receives the resin residue scraped off by the plate-like member 71. The vertical surface 70c connecting the left and front upper surface 70a and the left and rear residue receiving portion 70b is curved downward and smoothly connected to the residue receiving portion 70b. The base member 70 supports the second air cylinder 52 of the cleaning means 5 on the right and front upper surface in the plan view.

As shown in FIG. 15, the plate-shaped member 71 is a plate-shaped member having a main surface with the vertical direction as the normal direction, and its upper surface serves as an opposing surface 71a that faces the lower surface 102 of the die 101. The edge where the opposing surface 71a of the plate-shaped member 71 intersects with the rear surface of the plate-shaped member 71 serves as a removal edge 71b that scrapes off resin residue. The material of the plate-shaped member 71 is preferably a metal that is softer than the base member 70, such as brass.

<Cleaning Means 5>
The cleaning means 5 is used to remove the resin residue R (see Figs. 20A and 21A) that is scraped off from the die 101 by the plate-like member 71 of the resin residue removal head 7 and adhered to the plate-like member 71 from the plate-like member 71. As shown in Figs. 16A and 16B, the cleaning means 5 includes a second air cylinder 52 and a cleaning member 53 as a forward/backward cleaning means, a first air ejection means 54, and a second air ejection means 55. The second air cylinder 52 advances and retreats a piston (not shown) in the cylinder 52a by supplying compressed air, and drives a rod 52b (Figs. 20B and 21B) connected to the piston forward and backward. It is also possible to configure the forward/backward cleaning means to drive the cleaning member 53 forward and backward by a configuration other than the second air cylinder 52.

The cleaning member 53 is attached to the tip of the rod 52b. As shown in Figures 14 and 15, the cleaning member 53 has a generally rectangular parallelepiped shape in a cross section perpendicular to the left-right direction, and the side where the rear surface intersects with the bottom surface has a curved shape (a shape with an R) in the cross section, corresponding to the smooth connection between the vertical surface 70c of the base member 70 and the waste receiving portion 70b.

The second air cylinder 52 is disposed on the upper right and rear side of the base member 70 of the resin residue removal head 7. The second air cylinder 52 is also disposed in such a direction that the cleaning member 53 moves left and right along the removal edge 71b of the plate-shaped member 71.

The first air ejection means 54 includes a pair of front and rear nozzles 54a and an air supply source (not shown). As shown in Figures 14 to 16B, the pair of nozzles 54a are positioned above the resin residue removal head 7 and to the right of the plate-like member 71 and cleaning member 53. The first air ejection means 54 is configured to eject compressed air from the right side toward the plate-like member 71 and cleaning member 53 via the nozzles 54a.

The second air ejection means 55 includes a pair of nozzles 55a on the left and right, an air supply source (not shown), and a nozzle support frame 55b. As shown in Figures 16A and 16B, the pair of nozzles 55a are supported by the nozzle support frame 55b at a position on the left side of the resin residue removal head 7. The second air ejection means 55 ejects compressed air backwards through the nozzles 55a at a position on the left side of the resin residue removal head 7.

<Control Means 10>
The control means 10 controls each operation of the resin residue removing device 1. Specifically, the control means 10 controls the operations of the rodless cylinder 33 and the first air cylinder 138 of the moving means 3, the second air cylinder 52 of the cleaning means 5, the first air ejection means 54 and the second air ejection means 55.

Specifically, the control means 10 can be configured, for example, by an information processing device including a CPU, a memory (e.g., a flash memory), an input section, and an output section. Furthermore, the processing by each of the above-mentioned components of the control means 10 configured by the information processing device is performed by the CPU reading and executing a program stored in the memory. As the information processing device, for example, a personal computer, a PLC (programmable logic controller), or a microcomputer is used. However, some of the functions of the control means 10 may be configured to be executed on a cloud connected by any communication means.

2.2 Operation of the resin residue removing device 1 Next, with reference to Figs. 17A to 21B, the operation of the resin residue removing device 1 of this embodiment, specifically, the removal head moving operation for moving the resin residue removing head 7 to remove the resin residue, and the resin residue cleaning operation for cleaning the resin residue R attached to the resin residue removing head 7 will be described. These operations are controlled by the control means 10 according to the user's instruction or a preset program. In this embodiment, the removal head moving operation also removes the resin residue from the die 101 at the same time. In addition, the removal head moving operation is performed at a timing when the molten resin 103 stops hanging down from the slit 105 (see Fig. 11) of the die 101 of the molding device 100 after the sheet-shaped molten resin 103 is extruded from the slit 105. More specifically, for example, after the mold 104 is closed, the resin residue removing device 1 is operated at a timing when the removal machine (not shown) for removing the molded body after the mold is closed pinches the molten resin 103 protruding from the upper part of the mold 104. Furthermore, these operations are preferably performed every time the mold 104 is clamped, but may be performed a predetermined number of times or in accordance with a user's instruction. The cleaning operation is performed following the removal head moving operation after the operation is completed. However, the cleaning operation does not need to be performed every time the removal head moving operation is completed, and may be performed a predetermined number of times or in accordance with a user's instruction.

<Removal head movement>
In the resin residue removing device 1 of this embodiment, the control means 10 controls the moving means 3 to move the resin residue removing head 7 between a lateral position X1 (see FIG. 17A) that is off from directly below the die 101 and a directly below position X2 (see FIG. 17B to FIG. 17D) that is directly below the die 101, as shown in FIG. 17A to FIG. 17D. In addition, the control means 10 controls the moving means 3 to move the resin residue removing head 7 at the directly below position X2 between a separated position Z1 (see FIG. 17A, FIG. 17B, FIG. 18A, FIG. 18B) that is separated from the lower surface 102 of the die 101 and a close position Z2 (see FIG. 17C, FIG. 17D, FIG. 18B) that is close to the lower surface 102, as shown in FIG. 17A, FIG. 17B, FIG. 18A, FIG. 18B.

In the resin residue removal device 1 of this embodiment, unlike the resin residue removal device 1 of the first embodiment, when the support arm 34 swings and the resin residue removal head 7 moves to the approach position Z2, the die 101 and the plate-shaped member 71 of the resin residue removal head 7 come into contact with each other. By bringing the plate-shaped member 71 into contact with the die 101 at the approach position Z2, it is possible to more reliably scrape off the resin residue adhering to the lower surface 102 of the die 101. It is also possible to press the plate-shaped member 71 of the resin residue removal head 7 against the die 101. As described above, in the present invention, the "approaching position" includes a case where there is a slight gap between the die 101 and the resin residue removal head 7 (the die 101 and the resin residue removal head 4 in the first embodiment), as well as a case where the gap is 0 mm.

In this embodiment, the "directly below position X2" refers to a position inside the cylinder formed by extending the outer edge of the lower surface 102 of the die 101 downward. Furthermore, when the resin residue removal head 7 is at the directly below position X2, it means that the center of gravity of the plate-like member 71 of the resin residue removal head 7 is located inside the cylinder. The movement operation of the resin residue removal head 7 by the movement means 3 will be specifically described below.

When the resin residue removal device 1 of this embodiment is not performing a resin residue removal operation, as shown in FIG. 17A, the resin residue removal head 7 is retracted to side position X1 (a position behind the die 101) and is kept on standby in a position that does not interfere with the molding operation by the molding device 100. In this state, the support arm 34 of the moving means 3 is maintained with the tip 34f lowered by maintaining the rod portion 138b of the first air cylinder 138 in a contracted state as shown in FIG. 18A. As a result, the tip side of the resin residue removal head 7 is also slightly lowered.

To move the resin residue removal head 7 from this state to remove the resin residue, the control means 10 drives the rodless cylinder 33 of the moving means 3. Specifically, the control means 10 slides the slide block 33a of the rodless cylinder 33 forward along the guide rail 33b (see Figures 11 and 12). Then, as the slide block 33a slides, the slide member 32 slides forward along the rail member 31, and the support arm 34 supported by the slide member 32 moves forward. Then, as the support arm 34 moves forward, the resin residue removal head 7 supported by its tip 34f moves from the side position X1 to the directly below position X2, as shown in Figures 17A to 17B. Furthermore, the control means 10 first moves the resin residue removal head 7 to the position furthest from the side position X1 (see Figure 17A) at the directly below position X2, as shown in Figure 17B.

The control means 10 maintains the rod portion 138b of the first air cylinder 138 in a contracted state from the side position X1 shown in FIG. 17A to the position furthest from the side position X1 at the directly below position X2 shown in FIG. 17B. This maintains the tip portion 34f of the support arm 34 in a lowered state, and the resin residue removal head 7 in the separated position Z1 as shown in FIG. 17B and FIG. 18A. In other words, in this embodiment, the resin residue removal device 1 does not remove resin residue until the resin residue removal head 7 moves to the position furthest from the side position X1 (see FIG. 17B).

Next, the control means 10 extends the rod portion 138b of the first air cylinder 138 while the resin residue removal head 7 is at the farthest position from the side position X1 (see FIG. 17B). Then, the support arm 34 swings and the tip portion 34f rises, and as shown in FIG. 17C and FIG. 18B, the resin residue removal head 7 moves from the separated position Z1 to the close position Z2 inside the direct below position X2. Then, the control means 10 slides the slide block 33a of the rodless cylinder 33 backward along the guide rail 33b while maintaining the resin residue removal head 7 at the close position Z2 (see FIG. 17C to FIG. 17D). As a result, the resin residue removal head 7 moves toward the side position X1 along the slit 105, and the resin residue adhering near the slit 105 is scraped off by the removal edge 71b of the plate-shaped member 71. Some of the scraped off resin residue adheres to the plate-shaped member 71, and the residue that falls off the plate-shaped member 71 is held in the residue receiving portion 70b.

When the slide block 33a of the rodless cylinder 33 of the moving means 3 is further slid backward along the guide rail 33b from the state shown in FIG. 17D, the resin residue removal head 7 moves from the direct below position X2 toward the side position X1. At this time, when the removal edge 71b of the plate-shaped member 71 reaches the rear end of the slit 105, the control means 10 contracts the rod portion 138b of the first air cylinder 138. As a result, the resin residue removal head 7 moves from the close position Z2 (see FIG. 18B) to the separated position Z1 (see FIG. 18A) by the time the resin residue removal head 7 reaches the position closest to the side position X1 at the direct below position X2. Then, while in the separated position Z1, the resin residue removal head 7 moves from the direct below position X2 to the side position X1.

In this way, by moving the resin residue removal head 7 from the direct below position X2 to the lateral position X1 while it is in the separated position Z1, as shown in FIG. 19, even if there is a slight protrusion 102a on the rear edge of the lower surface 102 of the die 101, it is possible to prevent the protrusion 102a from interfering with the resin residue removal head 7.

As described above, the moving means 3 of this embodiment is configured to move the resin residue removal head 7 between the lateral position X1 and the directly below position X2 by moving the support arm 34 back and forth (horizontally) relative to the support frame 2. In addition, the moving means 3 is configured to move the resin residue removal head 7 between the separated position Z1 and the close position Z2 by swinging the support arm 34 in a seesaw shape.

<Resin residue cleaning operation>
In the resin residue removal device 1 of this embodiment, the control means 10 controls the second air cylinder 52, the first air jetting means 54 and the second air jetting means 55 of the cleaning means 5 to perform a resin residue cleaning operation after completion of the removal head movement operation.

Specifically, as shown in Figures 20A-20B and 21A-21B, when the resin residue removal head 7 is in the lateral position X1, the control means 10 drives the second air cylinder 52, extending the rod 52b and moving the cleaning member 53 attached to its tip to the left. At the same time, the control means 10 operates the first air ejection means 54 to eject compressed air from the right side toward the plate-like member 71 and the cleaning member 53 via the nozzle 54a. Furthermore, the control means 10 operates the second air ejection means 55 to eject compressed air backwards via the nozzle 55a at a position to the left of the resin residue removal head 7.

By this operation, the resin residue R adhering to the plate-shaped member 71 of the resin residue removal head 7 and the resin residue R accumulated in the residue receiving portion 70b are peeled off by the compressed air ejected from the nozzle 54a of the cleaning member 53 and the first air ejection means 54, and are blown to the left. This cleans the plate-shaped member 71 and the residue receiving portion 70b. In this embodiment, as shown in Figures 14 and 15, the residue receiving portion 70b and the vertical surface 70c of the base member 70 are smoothly connected, and the side where the rear surface and the bottom surface of the cleaning member 53 intersect is curved, making it possible to prevent the resin residue R from getting stuck between the residue receiving portion 70b and the cleaning member 53.

The resin residue R blown off by the compressed air ejected from the cleaning member 53 and the nozzle 54a of the first air ejection means 54 is blown backward (see FIG. 21B) by the compressed air ejected from the nozzle 55a of the second air ejection means 55. By blowing the resin residue R backward, i.e., to the opposite side from the die 101, it is possible to prevent the resin residue R from adhering to the metal mold 104 and the like disposed below the die 101. The resin residue R removed and collected in this manner can be crushed, for example, by a crusher, and reused.

The compressed air ejected from the nozzle 54a of the first air ejection means 54 also functions as a cooling means for cooling the plate-like member 71 of the resin residue removal head 7. By cooling the plate-like member 71, the viscosity of the attached resin residue R decreases, making it easier to peel off the resin residue R.

2.3 Effects As described above, according to the resin residue removal device 1 of this embodiment, the rodless cylinder 33 is driven to move the support arm 34 in the front-rear direction (horizontal direction) to move the resin residue removal head 7 between the side position X1 and the directly below position X2, and the first air cylinder 138 is driven to swing the support arm 34 to move the resin residue removal head 7 between the separated position Z1 and the close position Z2. In addition, by performing a swing operation after the resin residue removal head 7 moves to the directly below position X2, it is possible to prevent the resin residue removal head 7 from interfering with the die 101 when the resin residue removal head 7 is moved from the side position X1 to the directly below position X2.

In addition, in the resin residue removal device 1 of this embodiment, the control means 10 moves the resin residue removal head 7 to the position farthest from the lateral position X1 (see FIG. 17B), and then moves the resin residue removal head 7 from the separated position Z1 to the close position Z2. This allows the resin residue that gradually seeps out from the slit 105 to be removed immediately before the next molding operation by the molding device 100, making it possible to effectively prevent the resin residue from adhering to the resin molded body.

In addition, the resin residue removal device 1 of this embodiment is equipped with a cleaning means 5 that cleans the resin residue adhering to the resin residue removal head 7, so that the resin residue removal performance can be maintained and the resin residue removal device 1 can be used continuously.

2.4 Modifications The present invention according to this embodiment can also be implemented in the following aspects.

<Modification 2-1>
In the above-described embodiment, the molding apparatus 100 in which the resin residue removing apparatus 1 is used is configured such that a pair of molten resins 103 (resin sheets) are arranged so as to hang down in parallel to a pair of dies 104. However, the resin residue removing apparatus 1 according to this embodiment can also be used in a molding apparatus 100 in which only one is arranged to a pair of dies 104, as shown in FIG.

<Modification 2-2>
Also, as in the above embodiment, it is possible to use the resin residue removing device 1 only in one of a pair of molding devices 100 arranged in a pair so that the molten resin 103 hangs down in parallel to a pair of dies 104. For example, as shown in FIG. 23, in a case where a skin material 106 (e.g., carpet material) is arranged between the molten resin 103 hanging down from one molding device 100 (the molding device 100 on the left side of the figure) and the die 104, even if the resin residue adheres to the molten resin 103, the resin residue is covered by the skin material 106 and does not affect the appearance of the completed resin molded product. Therefore, it is also preferable to arrange the resin residue removing device 1 only in the molding device 100 on the side where the skin material 106 is not arranged.

<Other Modifications>
In the above embodiment, the control means 10 moves the resin residue removal head 7 to the position furthest from the lateral position X1 (see FIG. 17B ), and then moves the resin residue removal head 7 from the separated position Z1 to the approach position Z2 to remove the resin residue. However, even when moving the resin residue removal head 7 from the lateral position X1 (i.e., the position where it is retracted when the resin residue removal operation is not being performed) to the position furthest from the lateral position X1, the resin residue removal head 7 may be moved to the approach position Z2 to remove the resin residue.
In the above embodiment, the plate-shaped member 71 of the resin residue removal head 7 is cooled by ejecting compressed air from the nozzle 54a of the first air ejection means 54 of the cleaning means 5. However, it is also possible to provide a water-cooling means for cooling the plate-shaped member 71 with water.

1: Resin residue removal device, 2: Support frame, 3: Moving means, 4: Resin residue removal head, 5: Cleaning means, 6: Telescopic drive means, 7: Resin residue removal head, 10: Control means, 21: U-shaped frame, 21a: Upper frame, 21b: Rear frame, 21c: Lower frame, 22: Side frame, 23: Roller (pressure section), 31: Rail member (guide means), 32: Slide member, 32a: Upper plate section, 32b: Rear plate section, 32c: Lower plate section, 32d: Connection plate, 32d1: Mounting base, 32e: Arm support plate, 33: Rodless cylinder (linear drive means), 33a: Slide block, 3 3b: guide rail (guide member), 34: support arm, 34a: front end, 34b: front end cover, 34c: rear end cover, 34d: rear end, 34e: main body, 34f: tip, 34g: base, 35: support shaft, 36: guide block, 37: swing regulating portion, 38: cam (pressed portion), 38a: inclined surface, 39: rotating shaft, 41: rotating plate, 41a: shaft, 41b: mounting member, mounting surface 41b1, 41c: bolt, 42: columnar member (resin residue removing member), 42a: opposing surface, 42b: enlarged diameter portion, 43: removal drive means, 44: rotating shaft, 45: front end pulley, 46: rear end pulley 47: Chain, 48: Rodless cylinder, 48a: Support plate, 48b: Slide block, 48c: Guide rail, 49: Rotating shaft, 51: Bellows, 52: Second air cylinder (advancing and retreating cleaning means), 52a: Cylinder, 52b: Rod, 53: Cleaning member, 54: First air ejection means (cooling means), 54a: Nozzle, 55: Second air ejection means, 55a: Nozzle, 55b: Nozzle support frame, 60: Rotating shaft, 61: Rotating shaft, 70: Base member, 70a: Upper surface, 70b: Resin receiving portion, 70c: Vertical surface, 71: Plate-shaped member (resin residue removal member), 71a: Opposing surface, 71b: Removal member Removal edge, 100: molding device, 101: die (T-die), 102: lower surface, 102a: protrusion, 103: molten resin (parison, resin sheet), 104: mold, 105: slit, 106: skin material, 131: guide means, 133b: guide member, 138: first air cylinder (oscillating drive means), 138a: cylinder part, 138a1: one end side mounting part, 138b: rod part, 138b1: other end side mounting part, 142: removal blade, 142a: opposing surface, 142b: blade part, 142c: mounting surface, R: resin residue, X1: lateral position, X2: directly below position, Z1: distant position, Z2: close position

Claims (15)

A resin sludge removal device for removing resin sludge adhering to the underside of a die of a molding device,
A moving means and a resin residue removing head are provided,
the moving means is configured to move the resin residue removal head between a lateral position deviated from directly below the die and a directly below position that is directly below the die, and to move the resin residue removal head, at the directly below position, between a distant position away from the lower surface and a close position close to the lower surface;
the resin residue removal head is configured to be capable of removing resin residue adhering to the lower surface by moving along the lower surface,
The moving means includes a support arm that supports the resin residue removing head at its tip end, and the resin residue removing device includes at least one of the following configurations (1) and (2).
(1) A configuration in which the support arm moves in a horizontal direction to move the resin residue removing head between the lateral position and the directly below position.
(2) The support arm is configured to swing in a seesaw manner to move the resin residue removal head between the separated position and the adjacent position. The resin residue removal device according to claim 1 ,
The moving means includes a guide means, a slide member, and a linear driving means.
The support arm is supported by the slide member,
The resin residue removing device, wherein the linear driving means drives the slide member to slide along the guide means, thereby moving the resin residue removing head between the directly below position and the lateral position. The resin residue removal device according to claim 2 ,
the guide means extending towards the die at the lateral position;
A resin residue removal device in which the linear drive means causes the slide member to slide along the guide means, thereby moving the support arm forward and backward, and the resin residue removal head moves between the directly below position and the lateral position. The resin residue removal device according to claim 3 ,
The slide member includes a support shaft that pivotally supports the support arm and a pressing portion that presses the support arm,
the support arm includes a pressed portion on a side opposite to the resin residue removing head across the support shaft,
When the support arm moves forward as the slide member slides, the pressing portion presses the pressed portion from above downward, causing the support arm to swing in a seesaw-like manner around the support axis. The resin residue removal device according to claim 4 ,
the pressing portion is a roller installed on a support frame that supports the guide means,
The pressed portion is a cam whose upper surface is inclined upward toward the rear end side of the support arm,
When the support arm advances in accordance with the sliding of the slide member, the roller comes into contact with the upper surface and presses the cam downward, in this resin residue removing device. A resin sludge removal device for removing resin sludge adhering to the underside of a die of a molding device,
A moving means and a resin residue removing head are provided,
the moving means is configured to move the resin residue removal head between a lateral position deviated from directly below the die and a directly below position that is directly below the die, and to move the resin residue removal head, at the directly below position, between a distant position away from the lower surface and a close position close to the lower surface;
the resin residue removal head is configured to be capable of removing resin residue adhering to the lower surface by moving along the lower surface,
The molding device extrudes a cylindrical parison, and a circular slit through which the cylindrical parison can be extruded is formed on a lower surface of the die.
The resin residue removing head includes a resin residue removing member and a removal drive means.
the resin residue removal member has an opposing surface opposed to the lower surface,
The resin residue removal device, wherein the resin residue removal member is rotated such that the opposing surface moves along the slit by being driven by the removal drive means. The resin residue removing device according to claim 6 ,
The resin residue removing device, wherein the resin residue removing member is a columnar member supported so as to be rotatable on its axis. The resin residue removing device according to claim 6 ,
The resin residue removing member is a removing blade having a blade portion in the rotational direction. The resin residue removal device according to claim 2 ,
The molding device extrudes a sheet-shaped resin sheet, and a linear slit through which the resin sheet can be extruded is formed on a lower surface of the die,
The guide means is disposed along the longitudinal direction of the slit,
A resin residue removal device in which the linear drive means causes the slide member to slide along the guide means, thereby sliding the support arm, and the resin residue removal head moves between the side position and the directly below position, and further moves along the slit. The resin residue removal device according to claim 9 ,
The slide member includes a support shaft that supports the support arm,
The moving means is provided with a swing drive means for swinging the support arm in a seesaw shape around the support shaft. The resin residue removal device according to claim 10 ,
A control means for controlling the moving means,
The control means, while the resin residue removal head is in the separated position, uses the linear drive means to move the resin residue removal head to the position farthest from the lateral position at the directly below position, then uses the swing drive means to swing the support arm to move the resin residue removal head to the close position, and then, while the resin residue removal head is in the close position, uses the linear drive means to move the resin residue removal head along the slit toward the lateral position. A resin sludge removal device for removing resin sludge adhering to the underside of a die of a molding device,
A moving means and a resin residue removing head are provided,
the moving means is configured to move the resin residue removal head between a lateral position deviated from directly below the die and a directly below position that is directly below the die, and to move the resin residue removal head, at the directly below position, between a distant position away from the lower surface and a close position close to the lower surface;
the resin residue removal head is configured to be capable of removing resin residue adhering to the lower surface by moving along the lower surface,
A resin residue removing device comprising a cleaning means for cleaning resin residue adhering to the resin residue removing head. The resin residue removal device according to claim 12 ,
The resin residue removing device, wherein the cleaning means is provided with a cooling means for cooling the resin residue removing head. The resin residue removing device according to claim 12 or 13 ,
The cleaning means is a tongue that scrapes off resin residue adhering to the resin residue removal head when the resin residue removal head moves to the lateral position. The resin residue removing device according to claim 12 or 13 ,
The cleaning means of the resin residue removal device includes a cleaning member that moves along the resin residue removal head to scrape off resin residue adhering to the resin residue removal head, and an air blowing means that blows air toward the cleaning member.