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JP7658136B2 - Manufacturing method of laminated welded film body - Google Patents
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JP7658136B2 - Manufacturing method of laminated welded film body - Google Patents

Manufacturing method of laminated welded film body Download PDF

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Publication number
JP7658136B2
JP7658136B2 JP2021052919A JP2021052919A JP7658136B2 JP 7658136 B2 JP7658136 B2 JP 7658136B2 JP 2021052919 A JP2021052919 A JP 2021052919A JP 2021052919 A JP2021052919 A JP 2021052919A JP 7658136 B2 JP7658136 B2 JP 7658136B2
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JP
Japan
Prior art keywords
adhesive layer
film
welded
protective layer
film substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021052919A
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Japanese (ja)
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JP2022150351A (en
Inventor
雄斗 百瀬
純 滝沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2021052919A priority Critical patent/JP7658136B2/en
Priority to US17/703,179 priority patent/US20220306364A1/en
Publication of JP2022150351A publication Critical patent/JP2022150351A/en
Application granted granted Critical
Publication of JP7658136B2 publication Critical patent/JP7658136B2/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/26Articles or materials wholly enclosed in laminated sheets or wrapper blanks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/74Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
    • B29C65/743Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using the same tool for both joining and severing, said tool being monobloc or formed by several parts mounted together and forming a monobloc
    • B29C65/7437Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using the same tool for both joining and severing, said tool being monobloc or formed by several parts mounted together and forming a monobloc the tool being a perforating tool
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    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/74Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
    • B29C65/743Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using the same tool for both joining and severing, said tool being monobloc or formed by several parts mounted together and forming a monobloc
    • B29C65/7443Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using the same tool for both joining and severing, said tool being monobloc or formed by several parts mounted together and forming a monobloc by means of ultrasonic vibrations
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    • B29C66/21Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
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    • B29C66/3032Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined
    • B29C66/30325Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of cavities belonging to at least one of the parts to be joined
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    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/347General aspects dealing with the joint area or with the area to be joined using particular temperature distributions or gradients; using particular heat distributions or gradients
    • B29C66/3472General aspects dealing with the joint area or with the area to be joined using particular temperature distributions or gradients; using particular heat distributions or gradients in the plane of the joint, e.g. along the joint line in the plane of the joint or perpendicular to the joint line in the plane of the joint
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
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    • B29C66/43Joining a relatively small portion of the surface of said articles
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    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43Joining a relatively small portion of the surface of said articles
    • B29C66/431Joining the articles to themselves
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    • B29C66/43121Closing the ends of tubular or hollow single articles, e.g. closing the ends of bags
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    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
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    • B29C66/723General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
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    • B29C66/814General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
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    • B29C66/81431General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined comprising a single cavity, e.g. a groove
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    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7311Thermal properties
    • B29C66/73115Melting point
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7311Thermal properties
    • B29C66/73115Melting point
    • B29C66/73116Melting point of different melting point, i.e. the melting point of one of the parts to be joined being different from the melting point of the other part
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/95Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94
    • B29C66/951Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools
    • B29C66/9513Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools characterised by specific vibration frequency values or ranges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/033 layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/24All layers being polymeric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/40Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/10Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/26Polymeric coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/31Heat sealable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00Containers; Receptacles
    • B32B2439/02Open containers
    • B32B2439/06Bags, sacks, sachets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2553/00Packaging equipment or accessories not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B9/00Enclosing successive articles, or quantities of material, e.g. liquids or semiliquids, in flat, folded, or tubular webs of flexible sheet material; Subdividing filled flexible tubes to form packages
    • B65B9/02Enclosing successive articles, or quantities of material between opposed webs
    • B65B9/04Enclosing successive articles, or quantities of material between opposed webs one or both webs being formed with pockets for the reception of the articles, or of the quantities of material
    • B65B9/045Enclosing successive articles, or quantities of material between opposed webs one or both webs being formed with pockets for the reception of the articles, or of the quantities of material for single articles, e.g. tablets

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Description

本発明は、積層溶着フィルム体、超音波溶着機、積層溶着フィルム体の製造方法に関するものである。 The present invention relates to a laminated welded film body, an ultrasonic welding machine, and a method for manufacturing a laminated welded film body.

物品の包装に合成樹脂製のフィルムによる袋が広く用いられる。合成樹脂製のフィルムの袋に合成樹脂製のフィルムの小片を溶着した例が特許文献1に開示されている。それによると、操作者は袋と小片とを重ねて超音波振動するホーンを押圧して溶着していた。重なったフィルムがホーンにより超音波振動させられるとき、摩擦熱によりフィルムが加熱されて溶着する。合成樹脂製のフィルムには加熱溶着し易い塩化ビニリデン系樹脂やオレフィン系樹脂が用いられた。溶着した部分はフィルムが裂けやすいので、小片は袋を開封し易くするために袋に溶着された。 Bags made of synthetic resin film are widely used to package goods. Patent Document 1 discloses an example of welding a small piece of synthetic resin film to a synthetic resin film bag. According to this, an operator overlaps the bag and the small piece and presses an ultrasonically vibrating horn to weld them together. When the overlapping films are ultrasonically vibrated by the horn, the films are heated by frictional heat and welded together. For the synthetic resin film, vinylidene chloride resin or olefin resin, which are easy to heat and weld, are used. Because the film is prone to tearing in the welded area, the small piece is welded to the bag to make it easier to open.

袋を丈夫にするために合成樹脂製のフィルムを2層以上にしたシートで形成された袋が広く用いられる。シートは接着層及び保護層を含む。袋の内側に接着層が配置され、外側に保護層が配置される。例えば、接着層にポリエチレンやCPP(Cast Polypropylene)が用いられ、保護層にはナイロンや蒸着PET(polyethylene terephthalate)が用いられる。接着層は融点が保護層より低く、熱溶着し易い。このため、容易に袋が形成される。保護層は傷付きにくく、接着層より融点が高くなっている。 To make the bags stronger, bags made of a sheet of two or more layers of synthetic resin film are widely used. The sheet includes an adhesive layer and a protective layer. The adhesive layer is placed on the inside of the bag, and the protective layer is placed on the outside. For example, polyethylene or CPP (cast polyethylene) is used for the adhesive layer, and nylon or vapor-deposited PET (polyethylene terephthalate) is used for the protective layer. The adhesive layer has a lower melting point than the protective layer, and is easily heat-sealed. This makes it easy to form bags. The protective layer is less susceptible to scratches, and has a higher melting point than the adhesive layer.

溶着するフィルムの内側に形成された接着層同士を溶着することにより袋内の気密が保持されている。溶着された包装体は、物流・梱包における小型化・コンパクト化・ハンドリング性の必要性から、袋同士を更に溶着して固定する工夫がなされている。 The airtightness of the bag is maintained by welding together the adhesive layers formed on the inside of the film to be welded. Due to the need for smaller size, compactness, and ease of handling in logistics and packaging, the welded package is often further welded together to secure the bags together.

特開2011-11784号公報JP 2011-11784 A

気密を保持した状態の袋同士を溶着するには、袋の外側の保護層同士を溶着する必要がある。超音波振動するホーンを重ねた袋に押圧して、保護層を融点まで昇温させると袋が溶けて穴が開き、包装体としての袋の気密性の確保が難しいという課題があった。 To weld bags together while maintaining their airtightness, it is necessary to weld the outer protective layers of the bags together. When an ultrasonically vibrating horn is pressed against stacked bags to heat the protective layers up to their melting point, the bags melt and holes appear, making it difficult to ensure the airtightness of the bags as a package.

積層溶着フィルム体は、第1保護層と前記第1保護層より融点が低い第1接着層とが積層された第1フィルムと、第2保護層と前記第2保護層より融点が低い第2接着層とが積層された第2フィルムと、を有する第1フィルム基体と、第3保護層と前記第3保護層より融点が低い第3接着層とが積層された第3フィルムと、第4保護層と前記第4保護層より融点が低い第4接着層とが積層された第4フィルムと、を有する第2フィルム基体と、を備え、前記第1フィルム基体の前記第1保護層と前記第2保護層との間、及び/又は、前記第2フィルム基体の前記第3保護層と前記第4保護層との間、に被包装物を包装して前記接着層の一部同士を溶着させて封止する積層溶着フィルム体であって、前記第1フィルム基体の前記第2保護層と前記第2フィルム基体の前記第3保護層とは、前記第2保護層の第1溶融貫通部、及び/又は、前記第3保護層の第2溶融貫通部を介して、前記第1接着層乃至前記第4接着層の少なくともいずれか1つから溶出した接着層によって溶着固定されており、該溶着固定された溶着固定部は、前記第1フィルム基体の前記第1接着層と前記第2接着層とが溶着された第1溶着部、及び/又は、前記第2フィルム基体の前記第3接着層と前記第4接着層とが溶着された第2溶着部によって、平面視した状態で取り囲まれている。 The laminated welded film body comprises a first film substrate having a first film in which a first protective layer and a first adhesive layer having a lower melting point than the first protective layer are laminated, a second film in which a second protective layer and a second adhesive layer having a lower melting point than the second protective layer are laminated, a third film in which a third protective layer and a third adhesive layer having a lower melting point than the third protective layer are laminated, and a fourth film in which a fourth protective layer and a fourth adhesive layer having a lower melting point than the fourth protective layer are laminated, and the adhesive is applied between the first protective layer and the second protective layer of the first film substrate and/or between the third protective layer and the fourth protective layer of the second film substrate. A laminated welded film body in which parts of layers are welded together to seal them, the second protective layer of the first film substrate and the third protective layer of the second film substrate are welded and fixed by an adhesive layer eluted from at least one of the first adhesive layer to the fourth adhesive layer through the first melt-through portion of the second protective layer and/or the second melt-through portion of the third protective layer, and the welded and fixed portion is surrounded in a plan view by a first welded portion in which the first adhesive layer and the second adhesive layer of the first film substrate are welded together and/or a second welded portion in which the third adhesive layer and the fourth adhesive layer of the second film substrate are welded together.

積層溶着フィルム体は、第1保護層と前記第1保護層より融点が低い第1接着層とが積層された第1フィルムの前記第1接着層の一部と、第2保護層と前記第2保護層より融点が低い第2接着層とが積層された第2フィルムの前記第2接着層の一部とが、前記第1フィルムと前記第2フィルムとの間に被包装物を包装した状態で溶着封止され、積層された前記第1フィルムと前記第2フィルムとは、前記第2保護層が内側に位置して対向するように折り曲げられており、該折り曲げにより対向された一方の前記第2保護層と他方の前記第2保護層とは、前記一方の前記第2保護層の第1溶融貫通部、及び/又は、前記他方の前記第2保護層の第2溶融貫通部を介して、前記第1接着層及び前記第2接着層の少なくともいずれか1つから溶出した接着層によって溶着固定されており、該溶着固定された溶着固定部を平面視した状態で取り囲んで前記第1接着層と前記第2接着層とが溶着された第1溶着部が前記一方の前記第2保護層の側に設けられ、及び、前記溶着固定された前記溶着固定部を平面視した状態で取り囲んで前記第1接着層と前記第2接着層とが溶着された第2溶着部が前記他方の前記第2保護層の側に設けられている。 In the laminated welded film body, a part of the first adhesive layer of a first film in which a first protective layer and a first adhesive layer having a melting point lower than that of the first protective layer are laminated, and a part of the second adhesive layer of a second film in which a second protective layer and a second adhesive layer having a melting point lower than that of the second protective layer are laminated are welded and sealed in a state in which a packaged item is packaged between the first film and the second film, and the laminated first film and the second film are folded so that the second protective layer is located on the inside and faces each other, and the one second protective layer and the other second protective layer that are opposed by the folding are folded so that the one The first fusion-through portion of the second protective layer and/or the second fusion-through portion of the other second protective layer are welded and fixed by an adhesive layer eluted from at least one of the first adhesive layer and the second adhesive layer, and a first fusion portion in which the first adhesive layer and the second adhesive layer are welded is provided on the side of the one second protective layer, surrounding the welded and fixed welded portion in a planar view, and a second fusion portion in which the first adhesive layer and the second adhesive layer are welded is provided on the side of the other second protective layer, surrounding the welded and fixed welded portion in a planar view.

超音波溶着機は、被溶着物と接する加振面を有するホーンと、前記ホーンを超音波振動させる振動部と、前記振動部を駆動する発振器と、前記ホーンとの間で前記被溶着物を挟持するホーン受けと、を備え、前記ホーン受けは前記被溶着物と接する受面に前記加振面の面積よりも小さな面積の凹部又は穴を備える。 The ultrasonic welding machine comprises a horn having a vibration surface that contacts the workpiece, a vibration unit that ultrasonically vibrates the horn, an oscillator that drives the vibration unit, and a horn receiver that holds the workpiece between the horn and the horn, and the horn receiver has a recess or hole on the receiving surface that contacts the workpiece that is smaller in area than the vibration surface.

積層溶着フィルム体の製造方法は、第1保護層と前記第1保護層より融点が低い第1接着層とが積層された第1フィルムの前記第1接着層の一部と、第2保護層と前記第2保護層より融点が低い第2接着層とが積層された第2フィルムの前記第2接着層の一部と、が溶着された第1フィルム基体と、第3保護層と前記第3保護層より融点が低い第3接着層とが積層された第3フィルムの前記第3接着層の一部と、第4保護層と前記第4保護層より融点が低い第4接着層とが積層された第4フィルムの前記第4接着層の一部と、が溶着された第2フィルム基体と、を用意し、加振面を有するホーンと、前記加振面に対応した受面に凹部又は穴を有するホーン受けと、の間に前記第1フィルム基体及び前記第2フィルム基体を重ねて配置し、前記第1フィルム基体及び前記第2フィルム基体が前記加振面と前記受面との間で挟持された状態で、前記第1フィルム基体及び前記第2フィルム基体を前記ホーンの振動により加熱して、前記凹部又は前記穴に対応した部位を前記凹部又は前記穴の周囲に対応した部位よりも高い温度にすることで、前記凹部又は前記穴に対応した部位において、前記第1フィルム基体の前記第1保護層及び/又は前記第2保護層を溶融させて貫通した第1溶融貫通部、及び/又は、前記第2フィルム基体の前記第3保護層及び/又は前記第4保護層を溶融させて貫通した第2溶融貫通部、を介して前記第1接着層乃至前記第4接着層のいずれかの一部から溶出させた接着層で溶着固定した溶着固定部を形成し、前記凹部又は前記穴の周囲に対応した部位において、前記溶着固定部を囲んで前記第1接着層と前記第2接着層とが溶着する第1溶着部、及び/又は、前記溶着固定部を囲んで前記第3接着層と前記第4接着層とが溶着する第2溶着部、を形成する。 A method for manufacturing a laminated welded film body includes preparing a first film substrate to which a portion of the first adhesive layer of a first film in which a first protective layer and a first adhesive layer having a lower melting point than the first protective layer are laminated, and a portion of the second adhesive layer of a second film in which a second protective layer and a second adhesive layer having a lower melting point than the second protective layer are laminated, and a second film substrate to which a portion of the third adhesive layer of a third film in which a third protective layer and a third adhesive layer having a lower melting point than the third protective layer are laminated, and a portion of the fourth adhesive layer of a fourth film in which a fourth protective layer and a fourth adhesive layer having a lower melting point than the fourth protective layer are laminated, and arranging the first film substrate and the second film substrate in a superimposed manner between a horn having a vibration surface and a horn receiver having a recess or hole in a receiving surface corresponding to the vibration surface, and in a state in which the first film substrate and the second film substrate are sandwiched between the vibration surface and the receiving surface, The first film substrate and the second film substrate are heated by the vibration of the horn, and the temperature of the portion corresponding to the recess or the hole is made higher than that of the portion corresponding to the periphery of the recess or the hole. In the portion corresponding to the recess or the hole, a first melt-through portion is formed by melting and penetrating the first protective layer and/or the second protective layer of the first film substrate, and/or a second melt-through portion is formed by melting and penetrating the third protective layer and/or the fourth protective layer of the second film substrate, and a welded and fixed portion is formed by welding and fixing with an adhesive layer eluted from a portion of any one of the first adhesive layer to the fourth adhesive layer, and in the portion corresponding to the periphery of the recess or the hole, a first welded portion is formed in which the first adhesive layer and the second adhesive layer are welded to each other around the welded and fixed portion, and/or a second welded portion is formed in which the third adhesive layer and the fourth adhesive layer are welded to each other around the welded and fixed portion.

積層溶着フィルム体の製造方法は、第1保護層と前記第1保護層より融点が低い第1接着層とが積層された第1フィルムの前記第1接着層の一部と、第2保護層と前記第2保護層より融点が低い第2接着層とが積層された第2フィルムの前記第2接着層の一部とが、前記第1フィルムと前記第2フィルムとの間に被包装物を包装した状態で溶着封止された積層溶着フィルム体を用意し、前記積層溶着フィルム体を前記第2保護層が内側に位置して対向するように折り曲げ、加振面を有するホーンと前記加振面に対応した受面に凹部又は穴を有するホーン受けとの間に、折り曲げられて対向して重ねられた一方の前記第2保護層と他方の前記第2保護層とを配置し、重ねられた前記一方の前記第2保護層と前記他方の前記第2保護層とが前記加振面と前記受面との間で挟持された状態で、前記第1フィルム及び前記第2フィルムを前記ホーンの振動により加熱して、前記凹部又は前記穴に対応した部位を前記凹部又は前記穴の周囲に対応した部位よりも高い温度にすることで、前記凹部又は前記穴に対応した部位において、前記一方の前記第2保護層を溶融させて貫通した第1溶融貫通部、及び/又は、前記他方の前記第2保護層を溶融させて貫通した第2溶融貫通部、を介して前記第1接着層及び前記第2接着層の少なくともいずれかの一部から溶出させた接着層で溶着固定した溶着固定部を形成し、前記凹部又は前記穴の周囲に対応した部位において、前記溶着固定部を平面視した状態で取り囲んで、前記一方の前記第2保護層の側に前記第1接着層と前記第2接着層とが溶着する第1溶着部、及び/又は、前記溶着固定部を平面視した状態で取り囲んで、前記他方の前記第2保護層の側に前記第1接着層と前記第2接着層とが溶着する第2溶着部、を形成する。 A method for manufacturing a laminated welded film body includes preparing a laminated welded film body in which a part of a first adhesive layer of a first film in which a first protective layer and a first adhesive layer having a melting point lower than that of the first protective layer are laminated, and a part of a second adhesive layer of a second film in which a second protective layer and a second adhesive layer having a melting point lower than that of the second protective layer are laminated, and the laminated welded film body is welded and sealed in a state in which a packaged object is packaged between the first film and the second film, folding the laminated welded film body so that the second protective layer is located on the inside and faces each other, arranging one of the second protective layers and the other of the second protective layers that are folded and overlapped opposite each other between a horn having a vibration surface and a horn receiver having a recess or hole in a receiving surface corresponding to the vibration surface, and placing the one of the second protective layers and the other of the second protective layers that are overlapped and sandwiched between the vibration surface and the receiving surface, and then, placing the first film and the second film in the state in which the one of the second protective layers and the other of the second protective layers that are overlapped are sandwiched between the vibration surface and the receiving surface. By heating with the vibration of the horn, the temperature of the portion corresponding to the recess or hole is made higher than that of the portion corresponding to the periphery of the recess or hole, and a welded and fixed portion is formed in the portion corresponding to the recess or hole by the adhesive layer eluted from at least one of the first adhesive layer and the second adhesive layer through the first melted through portion that melts and penetrates the second protective layer of the one side, and/or the second melted through portion that melts and penetrates the second protective layer of the other side, and a first welded portion is formed in the portion corresponding to the periphery of the recess or hole, in which the first adhesive layer and the second adhesive layer are welded to the side of the second protective layer of the one side, surrounding the welded and fixed portion in a planar view, and/or a second welded portion is formed in which the first adhesive layer and the second adhesive layer are welded to the side of the second protective layer of the other side, surrounding the welded and fixed portion in a planar view.

第1実施形態にかかわる積層溶着フィルム体の構成を示す概略斜視図。FIG. 1 is a schematic perspective view showing a configuration of a laminated weldable film body according to a first embodiment. 第1フィルム基体の模式側断面図。FIG. 2 is a schematic cross-sectional side view of a first film substrate. 第2フィルム基体の模式側断面図。FIG. 第1フィルム基体の模式側断面図。FIG. 2 is a schematic cross-sectional side view of a first film substrate. 第2フィルム基体の模式側断面図。FIG. 第3溶着部を説明するための要部模式側断面図。FIG. 11 is a schematic cross-sectional side view of a main portion for explaining a third welded portion. 超音波溶着機の構成を示すブロック図。FIG. 2 is a block diagram showing the configuration of an ultrasonic welding machine. ホーンの模式平面図。FIG. ホーン受けの模式平面図。FIG. 積層溶着フィルム体の製造方法のフローチャート。4 is a flowchart of a method for producing a laminated weldable film body. 超音波溶着機の稼働条件の1例を説明するための図。FIG. 4 is a diagram for explaining an example of operating conditions of an ultrasonic welding machine. 接着層、表面層、中間層の厚みの水準を説明するための図。FIG. 2 is a diagram for explaining the thickness levels of an adhesive layer, a surface layer, and an intermediate layer. 第3穴の穴径の影響を説明するための図。FIG. 13 is a diagram for explaining the influence of the hole diameter of the third hole. 第3穴の穴径の影響を説明するための図。FIG. 13 is a diagram for explaining the influence of the hole diameter of the third hole. 中間層の厚みの影響を説明するための図。FIG. 13 is a diagram for explaining the influence of the thickness of an intermediate layer. 中間層の厚みの影響を説明するための図。FIG. 13 is a diagram for explaining the influence of the thickness of an intermediate layer. 第2実施形態にかかわる積層溶着フィルム体の構成を示す概略斜視図。FIG. 11 is a schematic perspective view showing the configuration of a laminated weldable film body according to a second embodiment. 第3溶着部を説明するための要部模式側断面図。FIG. 11 is a schematic cross-sectional side view of a main portion for explaining a third welded portion. 積層溶着フィルム体の製造方法のフローチャート。4 is a flowchart of a method for producing a laminated weldable film body.

第1実施形態
本実施形態では、積層溶着フィルム体と、積層溶着フィルム体の製造方法との特徴的な例について説明する。図1に示すように、積層溶着フィルム体1は被溶着物としての第1フィルム基体2及び被溶着物としての第2フィルム基体3を備える。第1フィルム基体2及び第2フィルム基体3は袋状であり、密閉された気密状態になっている。
First embodiment In this embodiment, a characteristic example of a laminated weldable film body and a manufacturing method for the laminated weldable film body will be described. As shown in Fig. 1, a laminated weldable film body 1 includes a first film substrate 2 as an object to be welded and a second film substrate 3 as an object to be welded. The first film substrate 2 and the second film substrate 3 are bag-shaped and are sealed and airtight.

第1フィルム基体2の内部には被包装物としての第1被包装物4が収納される。第2フィルム基体3の内部には被包装物としての第2被包装物5が収納される。第1フィルム基体2及び第2フィルム基体3の内部は減圧される。積層溶着フィルム体1が水中に投入されても、第1被包装物4及び第2被包装物5は濡れない。尚、積層溶着フィルム体1には第1被包装物4及び第2被包装物5の一方だけが収納されても良い。 The first packaged item 4 is stored inside the first film base 2. The second packaged item 5 is stored inside the second film base 3. The insides of the first film base 2 and the second film base 3 are depressurized. Even if the laminated welded film body 1 is immersed in water, the first packaged item 4 and the second packaged item 5 do not get wet. It is also possible for only one of the first packaged item 4 and the second packaged item 5 to be stored in the laminated welded film body 1.

第1フィルム基体2及び第2フィルム基体3は平面視で長方形である。第1フィルム基体2の長手方向の一端を第1端2aとする。第1フィルム基体2の長手方向の他端を第2端2bとする。第2フィルム基体3の長手方向の一端を第3端3aとする。第2フィルム基体3の長手方向の他端を第4端3bとする。 The first film substrate 2 and the second film substrate 3 are rectangular in plan view. One longitudinal end of the first film substrate 2 is the first end 2a. The other longitudinal end of the first film substrate 2 is the second end 2b. One longitudinal end of the second film substrate 3 is the third end 3a. The other longitudinal end of the second film substrate 3 is the fourth end 3b.

第1被包装物4は第2端2bに近く、第1端2aから離れている。第2被包装物5は第4端3bに近く、第3端3aから離れている。 The first packaged item 4 is closer to the second end 2b and farther from the first end 2a. The second packaged item 5 is closer to the fourth end 3b and farther from the third end 3a.

第1フィルム基体2の第1端2a側の一部と第2フィルム基体3の第3端3a側の一部とが重ねられている。第1フィルム基体2と第2フィルム基体3とが重なっている場所に第3溶着部6が形成されている。第3溶着部6では第1フィルム基体2と第2フィルム基体3とが溶着されている。 A portion of the first end 2a of the first film substrate 2 overlaps with a portion of the third end 3a of the second film substrate 3. A third welded portion 6 is formed where the first film substrate 2 and the second film substrate 3 overlap. The first film substrate 2 and the second film substrate 3 are welded to each other at the third welded portion 6.

第1フィルム基体2と第2フィルム基体3とが溶着されている面において、第1フィルム基体2及び第2フィルム基体3の長手方向をX方向とし、幅方向をY方向とする。第1フィルム基体2と第2フィルム基体3とが溶着されている場所の第1フィルム基体2の厚み方向をZ方向とする。 At the surface where the first film substrate 2 and the second film substrate 3 are welded, the longitudinal direction of the first film substrate 2 and the second film substrate 3 is the X direction, and the width direction is the Y direction. The thickness direction of the first film substrate 2 at the location where the first film substrate 2 and the second film substrate 3 are welded is the Z direction.

図2は第1フィルム基体2をX負方向から見た断面図である。図2に示すように、第1フィルム基体2は第1フィルム7及び第2フィルム8を備える。第1フィルム7は主に第1フィルム基体2のZ正方向に配置される。第2フィルム8は主に第1フィルム基体2のZ負方向に配置される。第1フィルム基体2のY正方向及びY負方向では第1フィルム7と第2フィルム8とが繋がっている。第1フィルム基体2は筒状になっている。 Figure 2 is a cross-sectional view of the first film base 2 as viewed from the X-negative direction. As shown in Figure 2, the first film base 2 comprises a first film 7 and a second film 8. The first film 7 is mainly arranged in the Z-positive direction of the first film base 2. The second film 8 is mainly arranged in the Z-negative direction of the first film base 2. The first film 7 and the second film 8 are connected in the Y-positive and Y-negative directions of the first film base 2. The first film base 2 is cylindrical.

第1フィルム7では第1保護層9と接着層としての第1接着層11とが積層される。第1保護層9が外側に位置する。第1接着層11が内側に位置する。第1保護層9では第1表面層12と第1中間層13とが積層される。第1中間層13は第1接着層11と第1表面層12とを接合し易くする。第1接着層11は第1保護層9より融点が低い。 In the first film 7, a first protective layer 9 and a first adhesive layer 11 serving as an adhesive layer are laminated. The first protective layer 9 is located on the outside. The first adhesive layer 11 is located on the inside. In the first protective layer 9, a first surface layer 12 and a first intermediate layer 13 are laminated. The first intermediate layer 13 makes it easier to bond the first adhesive layer 11 and the first surface layer 12. The first adhesive layer 11 has a lower melting point than the first protective layer 9.

第2フィルム8では第2保護層14と接着層としての第2接着層15とが積層される。第2保護層14が外側に位置する。第2接着層15が内側に位置する。第2保護層14では第2表面層16と第2中間層17とが積層される。第2中間層17は第2接着層15と第2表面層16とを接合し易くする。第1フィルム基体2の内部の空間である第1内部空間18は気密状態になっている。第2接着層15は第2保護層14より融点が低い。 In the second film 8, a second protective layer 14 and a second adhesive layer 15 serving as an adhesive layer are laminated. The second protective layer 14 is located on the outside. The second adhesive layer 15 is located on the inside. In the second protective layer 14, a second surface layer 16 and a second intermediate layer 17 are laminated. The second intermediate layer 17 makes it easier to bond the second adhesive layer 15 and the second surface layer 16. The first internal space 18, which is the space inside the first film substrate 2, is in an airtight state. The second adhesive layer 15 has a lower melting point than the second protective layer 14.

図3は第2フィルム基体3をX負方向から見た断面図である。図3に示すように、第2フィルム基体3は第3フィルム19及び第4フィルム21を備える。第3フィルム19は主に第2フィルム基体3のZ正方向に配置される。第4フィルム21は主に第2フィルム基体3のZ負方向に配置される。第2フィルム基体3のY正方向及びY負方向では第3フィルム19と第4フィルム21とが繋がっている。第2フィルム基体3は筒状になっている。 Figure 3 is a cross-sectional view of the second film base 3 as viewed from the X-negative direction. As shown in Figure 3, the second film base 3 includes a third film 19 and a fourth film 21. The third film 19 is mainly arranged in the Z-positive direction of the second film base 3. The fourth film 21 is mainly arranged in the Z-negative direction of the second film base 3. The third film 19 and the fourth film 21 are connected in the Y-positive and Y-negative directions of the second film base 3. The second film base 3 is cylindrical.

第3フィルム19では第3保護層22と接着層としての第3接着層23とが積層される。第3保護層22が外側に位置する。第3接着層23が内側に位置する。第3保護層22では第3表面層24と第3中間層25とが積層される。第3中間層25は第3接着層23と第3表面層24とを接合し易くする。第3接着層23は第3保護層22より融点が低い。 In the third film 19, a third protective layer 22 and a third adhesive layer 23 serving as an adhesive layer are laminated. The third protective layer 22 is located on the outside. The third adhesive layer 23 is located on the inside. In the third protective layer 22, a third surface layer 24 and a third intermediate layer 25 are laminated. The third intermediate layer 25 makes it easier to bond the third adhesive layer 23 and the third surface layer 24. The third adhesive layer 23 has a lower melting point than the third protective layer 22.

第4フィルム21では第4保護層26と接着層としての第4接着層27とが積層される。第4保護層26が外側に位置する。第4接着層27が内側に位置する。第4保護層26では第4表面層28と第4中間層29とが積層される。第4中間層29は第4接着層27と第4表面層28とを接合し易くする。第2フィルム基体3の内部の空間である第2内部空間31は気密状態になっている。第4接着層27は第4保護層26より融点が低い。 In the fourth film 21, a fourth protective layer 26 and a fourth adhesive layer 27 as an adhesive layer are laminated. The fourth protective layer 26 is located on the outside. The fourth adhesive layer 27 is located on the inside. In the fourth protective layer 26, a fourth surface layer 28 and a fourth intermediate layer 29 are laminated. The fourth intermediate layer 29 makes it easier to bond the fourth adhesive layer 27 and the fourth surface layer 28. The second internal space 31, which is the space inside the second film substrate 3, is in an airtight state. The fourth adhesive layer 27 has a lower melting point than the fourth protective layer 26.

図4は第1フィルム基体2をY負方向から見た断面図である。図4に示すように、第1端2a及び第2端2bでは第1フィルム7の第1接着層11の一部と第2フィルム8の第2接着層15の一部と、が袋状に溶着される。第1端2a及び第2端2bにて密閉されているので第1フィルム基体2の第1内部空間18は気密状態になっている。 Figure 4 is a cross-sectional view of the first film substrate 2 as viewed from the Y-negative direction. As shown in Figure 4, at the first end 2a and the second end 2b, a portion of the first adhesive layer 11 of the first film 7 and a portion of the second adhesive layer 15 of the second film 8 are welded together in a bag shape. Since the first end 2a and the second end 2b are sealed, the first internal space 18 of the first film substrate 2 is airtight.

図5は第2フィルム基体3をY負方向から見た断面図である。図5に示すように、第3端3a及び第4端3bでは第3フィルム19の第3接着層23の一部と第4フィルム21の第4接着層27の一部と、が袋状に溶着される。第3端3a及び第4端3bにて密閉されているので第2フィルム基体3の第2内部空間31は気密状態になっている。 Figure 5 is a cross-sectional view of the second film substrate 3 as viewed from the Y-negative direction. As shown in Figure 5, at the third end 3a and the fourth end 3b, a portion of the third adhesive layer 23 of the third film 19 and a portion of the fourth adhesive layer 27 of the fourth film 21 are welded together in a bag shape. Since the third end 3a and the fourth end 3b are sealed, the second internal space 31 of the second film substrate 3 is airtight.

積層溶着フィルム体1は、第1フィルム基体2の第1保護層9と第2保護層14との間、及び/又は、第2フィルム基体3の第3保護層22と第4保護層26との間、に第1被包装物4や第2被包装物5等の被包装物を包装して第1接着層11及び第2接着層15の一部同士を溶着させて封止する。さらに、積層溶着フィルム体1は、第3接着層23及び第4接着層27の一部同士を溶着させて封止する。 The laminated welded film body 1 packages a packaged item such as a first packaged item 4 or a second packaged item 5 between the first protective layer 9 and the second protective layer 14 of the first film base 2 and/or between the third protective layer 22 and the fourth protective layer 26 of the second film base 3, and seals the package by welding together parts of the first adhesive layer 11 and the second adhesive layer 15. Furthermore, the laminated welded film body 1 seals the package by welding together parts of the third adhesive layer 23 and the fourth adhesive layer 27.

本実施形態では第1フィルム基体2の第1保護層9と第2保護層14との間に第1被包装物4を包装して封止する。第2フィルム基体3の第3保護層22と第4保護層26との間に第2被包装物5を包装して封止する。尚、積層溶着フィルム体1は第1被包装物4及び第2被包装物5の一方のみを包装しても良い。 In this embodiment, the first packaged item 4 is packaged and sealed between the first protective layer 9 and the second protective layer 14 of the first film substrate 2. The second packaged item 5 is packaged and sealed between the third protective layer 22 and the fourth protective layer 26 of the second film substrate 3. The laminated welded film body 1 may package only one of the first packaged item 4 and the second packaged item 5.

第1表面層12、第2表面層16、第3表面層24及び第4表面層28は傷つき難い層である。第1接着層11、第2接着層15、第3接着層23及び第4接着層27は融点が第1保護層9、第2保護層14、第3保護層22及び第4保護層26より低く、加熱したときに溶着し易い層である。 The first surface layer 12, the second surface layer 16, the third surface layer 24, and the fourth surface layer 28 are layers that are resistant to scratches. The first adhesive layer 11, the second adhesive layer 15, the third adhesive layer 23, and the fourth adhesive layer 27 have a lower melting point than the first protective layer 9, the second protective layer 14, the third protective layer 22, and the fourth protective layer 26, and are layers that are easily welded when heated.

図6は図1のAA線に沿う断面側から見た図である。図6に示すように、第3溶着部6では、ホーン受け38に設けられた第3穴38cの穴形状により高温になる為、その結果として第2保護層14が溶融して貫通され、第2保護層14に第1穴32が形成される。第1フィルム基体2は第2保護層14の第1穴32を囲んだ第1溶着部33を有する。第1溶着部33では第1接着層11と第2接着層15とが溶着される。 Figure 6 is a cross-sectional view taken along line AA in Figure 1. As shown in Figure 6, the third welded portion 6 becomes hot due to the shape of the third hole 38c in the horn receiver 38, and as a result, the second protective layer 14 melts and is penetrated, forming a first hole 32 in the second protective layer 14. The first film substrate 2 has a first welded portion 33 surrounding the first hole 32 in the second protective layer 14. In the first welded portion 33, the first adhesive layer 11 and the second adhesive layer 15 are welded together.

また、第3溶着部6では、同様に、ホーン受け38に設けられた第3穴38cの穴形状により高温になる為、その結果として第3保護層22が溶融して貫通され、第2穴34が形成される。第1穴32と第2穴34とは互いに対向する。第2フィルム基体3は第3保護層22の第2穴34を囲んだ第2溶着部35を有する。第2溶着部35では第3接着層23と第4接着層27とが溶着される。 Similarly, the third welded portion 6 becomes hot due to the shape of the third hole 38c provided in the horn receiver 38, and as a result, the third protective layer 22 melts and is penetrated, forming a second hole 34. The first hole 32 and the second hole 34 face each other. The second film substrate 3 has a second welded portion 35 that surrounds the second hole 34 of the third protective layer 22. In the second welded portion 35, the third adhesive layer 23 and the fourth adhesive layer 27 are welded together.

第3溶着部6では第1穴32及び第2穴34を介して第1接着層11、第2接着層15、第3接着層23及び第4接着層27のいずれかの一部が混合する。 In the third welded portion 6, a portion of the first adhesive layer 11, the second adhesive layer 15, the third adhesive layer 23, and the fourth adhesive layer 27 are mixed through the first hole 32 and the second hole 34.

第3溶着部6における第1穴32の内部が第1溶融貫通部6aである。第3溶着部6における第2穴34の内部が第2溶融貫通部6bである。第3溶着部6における第1溶融貫通部6a及び第2溶融貫通部6bの間が溶着固定部6cである。第2保護層14及び第3保護層22の間で接着層が広がる部分も第3溶着部6である。 The inside of the first hole 32 in the third welded portion 6 is the first molten penetration portion 6a. The inside of the second hole 34 in the third welded portion 6 is the second molten penetration portion 6b. The portion between the first molten penetration portion 6a and the second molten penetration portion 6b in the third welded portion 6 is the welded fixed portion 6c. The portion where the adhesive layer extends between the second protective layer 14 and the third protective layer 22 is also the third welded portion 6.

第1フィルム基体2の第2保護層14と第2フィルム基体3の第3保護層22とは、第2保護層14の第1溶融貫通部6a、及び/又は、第3保護層22の第2溶融貫通部6bを介して、第1接着層11乃至第4接着層27の少なくともいずれか1つから溶出した接着層によって溶着固定されている。溶出した接着層が第1フィルム基体2と第2フィルム基体3の間に存在して、第1フィルム基体2と第2フィルム基体3とが溶着固定されている。 The second protective layer 14 of the first film substrate 2 and the third protective layer 22 of the second film substrate 3 are welded and fixed by an adhesive layer eluted from at least one of the first adhesive layer 11 to the fourth adhesive layer 27 via the first melt-through portion 6a of the second protective layer 14 and/or the second melt-through portion 6b of the third protective layer 22. The eluted adhesive layer is present between the first film substrate 2 and the second film substrate 3, and the first film substrate 2 and the second film substrate 3 are welded and fixed.

溶着固定された溶着固定部6cは、第1フィルム基体2の第1接着層11と第2接着層15とが溶着された第1溶着部33、及び/又は、第2フィルム基体3の第3接着層23と第4接着層27とが溶着された第2溶着部35によって、平面視した状態で取り囲まれている。この平面視は第1溶着部33における第1フィルム基体2の表面に垂直な方向から見ることを示す。 The welded and fixed portion 6c is surrounded in a planar view by a first welded portion 33 formed by welding the first adhesive layer 11 and the second adhesive layer 15 of the first film substrate 2 together, and/or a second welded portion 35 formed by welding the third adhesive layer 23 and the fourth adhesive layer 27 of the second film substrate 3 together. This planar view indicates a view from a direction perpendicular to the surface of the first film substrate 2 at the first welded portion 33.

この構成によれば、溶着固定部6cは、第1フィルム基体2の第1接着層11と第2接着層15とが溶着された第1溶着部33、及び/又は、第2フィルム基体3の第3接着層23と第4接着層27とが溶着された第2溶着部35によって、平面視した状態で取り囲まれている。従って、第1フィルム基体2の第1保護層9と第2保護層14との間に第1被包装物4を包装して封止して密閉している場合は、第1フィルム基体2の第1溶融貫通部6aの形成の際(溶融して貫した際)に外部(外気)と通じることになっても、第1フィルム基体2の内部は気密状態を維持することができる。また、同様に、第2フィルム基体3の第3保護層22と第4保護層26との間に第2被包装物5を包装して封止して密閉している場合は、第2フィルム基体3の第2溶融貫通部6bの形成の際(溶融して貫した際)に外部(外気)と通じることになっても、第2フィルム基体3の内部は気密状態を維持することができる。 According to this configuration, the welded fixing portion 6c is surrounded in a plan view by the first welded portion 33 formed by welding the first adhesive layer 11 and the second adhesive layer 15 of the first film base 2, and/or the second welded portion 35 formed by welding the third adhesive layer 23 and the fourth adhesive layer 27 of the second film base 3. Therefore, when the first packaged item 4 is packaged and sealed between the first protective layer 9 and the second protective layer 14 of the first film base 2, the inside of the first film base 2 can maintain an airtight state even if it is connected to the outside (external air) when the first molten penetration portion 6a of the first film base 2 is formed (when it melts and penetrates). Similarly, when the second packaged item 5 is packaged and sealed between the third protective layer 22 and the fourth protective layer 26 of the second film substrate 3, the inside of the second film substrate 3 can be maintained in an airtight state even if the second molten-through portion 6b of the second film substrate 3 is connected to the outside (external air) when it is formed (melted and pierced).

また、第1溶融貫通部6aと第2溶融貫通部6bとが対向する場所(積層した際に平面的に重なる位置)に配置されて溶着固定部6cを構成する際は、第1フィルム基体2及び第2フィルム基体3各々の気密状態を維持することができるとともに、第1フィルム基体2と第2フィルム基体3とを溶着固定部6cでの溶着によって確実に固定することができる。 In addition, when the first melt-penetrating portion 6a and the second melt-penetrating portion 6b are arranged in a position facing each other (a position where they overlap in a planar manner when stacked) to form the welded fixing portion 6c, the airtight state of each of the first film substrate 2 and the second film substrate 3 can be maintained, and the first film substrate 2 and the second film substrate 3 can be securely fixed by welding at the welded fixing portion 6c.

第3溶着部6には第2保護層14と第3保護層22との一部が溶融しても良い。換言すれば、溶着固定部6cには、溶着した第2保護層14及び第3保護層22の一部が含まれても良い。溶着固定部6cには、第1保護層9乃至第4保護層26の一部が含まれても良い。この構成によれば、第2保護層14及び第3保護層22を溶着させる為、溶着固定部6cにおいて、上述した溶出した接着層による接着力に加えて、第2保護層14と第3保護層22同士の溶着による接着力が作用するので、第1フィルム基体2と第2フィルム基体3とを確実に固定することができる。 The third welded portion 6 may include a portion of the second protective layer 14 and the third protective layer 22 melted. In other words, the welded fixed portion 6c may include a portion of the welded second protective layer 14 and the third protective layer 22. The welded fixed portion 6c may include a portion of the first protective layer 9 to the fourth protective layer 26. With this configuration, in order to weld the second protective layer 14 and the third protective layer 22, in addition to the adhesive force due to the eluted adhesive layer described above, the adhesive force due to the welding between the second protective layer 14 and the third protective layer 22 acts in the welded fixed portion 6c, so that the first film substrate 2 and the second film substrate 3 can be reliably fixed.

第1接着層11、第2接着層15、第3接着層23及び第4接着層27の材質はポリエチレン又はCPPを含む。第1保護層9、第2保護層14、第3保護層22及び第4保護層26の材質はPET又はナイロンを含む。CPPはポリプロピレンに変えても良い。 The material of the first adhesive layer 11, the second adhesive layer 15, the third adhesive layer 23, and the fourth adhesive layer 27 includes polyethylene or CPP. The material of the first protective layer 9, the second protective layer 14, the third protective layer 22, and the fourth protective layer 26 includes PET or nylon. CPP may be replaced with polypropylene.

ポリエチレンの融点は130℃より低い。CPPの融点は138℃である。PETの融点は264℃であり、ナイロンの融点は215℃である。第1接着層11~第4接着層27の融点は第1保護層9~第4保護層26の融点より低い温度である。積層溶着フィルム体1の構成によれば、第1保護層9、第2保護層14、第3保護層22及び第4保護層26は、第1接着層11、第2接着層15、第3接着層23及び第4接着層27よりも高い温度を部分的に加えることによって、第1溶融貫通部6a、第2溶融貫通部6bを形成するとともに溶着固定部6cを形成することができる。PETには表面に酸化ケイ素や酸化アルミニウムを蒸着した透明蒸着PETを用いても良い。 The melting point of polyethylene is lower than 130°C. The melting point of CPP is 138°C. The melting point of PET is 264°C, and the melting point of nylon is 215°C. The melting points of the first adhesive layer 11 to the fourth adhesive layer 27 are lower than the melting points of the first protective layer 9 to the fourth protective layer 26. According to the configuration of the laminated welded film body 1, the first protective layer 9, the second protective layer 14, the third protective layer 22, and the fourth protective layer 26 can form the first melt-penetrating part 6a, the second melt-penetrating part 6b, and the welded fixing part 6c by partially applying a temperature higher than that of the first adhesive layer 11, the second adhesive layer 15, the third adhesive layer 23, and the fourth adhesive layer 27. Transparent vapor-deposited PET with silicon oxide or aluminum oxide vapor-deposited on the surface may be used for the PET.

図7に示す超音波溶着機36は第1フィルム基体2と第2フィルム基体3とを溶着する機械である。図7に示すように、超音波溶着機36は基台37を備える。基台37は載置部37a及び支柱部37bを備える。 The ultrasonic welding machine 36 shown in FIG. 7 is a machine that welds the first film substrate 2 and the second film substrate 3. As shown in FIG. 7, the ultrasonic welding machine 36 has a base 37. The base 37 has a mounting portion 37a and a support portion 37b.

載置部37aの上にはホーン受け38が交換可能に設置される。ホーン受け38の上面を受面38aとする。ホーン受け38の受面38aの上には第1フィルム基体2及び第2フィルム基体3が重ねて配置される。支柱部37bは重力方向に立脚する。支柱部37bの載置部37aを向く面に直動機構39が設置される。直動機構39はレール39bと移動部39aとを備える。レール39bは支柱部37bに設置される。直動機構39はサーボモーターを備える。サーボモーターが回転するとき、直動機構39は移動部39aを移動させる。移動部39aはレール39bに沿って昇降する。移動部39aには載置部37aを向く面に振動部41が設置される。振動部41には載置部37aを向く面にホーン42が設置される。 A horn receiver 38 is replaceably installed on the mounting portion 37a. The upper surface of the horn receiver 38 is the receiving surface 38a. The first film substrate 2 and the second film substrate 3 are arranged on top of each other on the receiving surface 38a of the horn receiver 38. The support portion 37b stands in the direction of gravity. A linear motion mechanism 39 is installed on the surface of the support portion 37b facing the mounting portion 37a. The linear motion mechanism 39 includes a rail 39b and a moving portion 39a. The rail 39b is installed on the support portion 37b. The linear motion mechanism 39 includes a servo motor. When the servo motor rotates, the linear motion mechanism 39 moves the moving portion 39a. The moving portion 39a rises and falls along the rail 39b. A vibration portion 41 is installed on the moving portion 39a on the surface facing the mounting portion 37a. A horn 42 is installed on the vibration portion 41 on the surface facing the mounting portion 37a.

超音波溶着機36は制御部43、駆動部44及び発振器45を備える。制御部43は超音波溶着機36の動作を制御する。駆動部44は制御部43及び直動機構39と電気的に接続される。駆動部44は制御部43の指示信号を入力し、指示信号に従って直動機構39のサーボモーターを駆動する。 The ultrasonic welding machine 36 includes a control unit 43, a drive unit 44, and an oscillator 45. The control unit 43 controls the operation of the ultrasonic welding machine 36. The drive unit 44 is electrically connected to the control unit 43 and the linear motion mechanism 39. The drive unit 44 inputs an instruction signal from the control unit 43 and drives the servo motor of the linear motion mechanism 39 according to the instruction signal.

制御部43は発振器45に発振開始信号または発振停止信号を出力する。発振器45は発振回路を備え、発振開始信号を受信するとき駆動信号を形成する。発振器45は駆動信号を振動部41に出力して、振動部41を駆動する。振動部41はホーン42を超音波振動させる。ホーン42は第1フィルム基体2と接する加振面42aを有する。加振面42aから第1フィルム基体2に超音波振動が伝導する。制御部43にはスタートスイッチ46が電気的に接続される。 The control unit 43 outputs an oscillation start signal or an oscillation stop signal to the oscillator 45. The oscillator 45 has an oscillation circuit and forms a drive signal when it receives an oscillation start signal. The oscillator 45 outputs a drive signal to the vibration unit 41 to drive the vibration unit 41. The vibration unit 41 ultrasonically vibrates the horn 42. The horn 42 has a vibration surface 42a that contacts the first film substrate 2. The ultrasonic vibration is transmitted from the vibration surface 42a to the first film substrate 2. A start switch 46 is electrically connected to the control unit 43.

操作者がスタートスイッチ46を操作するとき、発振器45が振動部41を振動させるので、ホーン42が振動する。駆動部44がホーン42を下降させる。ホーン42が下降するとき、ホーン42とホーン受け38との間で第1フィルム基体2及び第2フィルム基体3を挟持する。所定の時間、ホーン42が第1フィルム基体2及び第2フィルム基体3を振動させる。所定の時間が経過したら、発振器45がホーン42の振動を停止させて、駆動部44がホーン42を上昇させる。 When the operator operates the start switch 46, the oscillator 45 vibrates the vibration unit 41, causing the horn 42 to vibrate. The drive unit 44 lowers the horn 42. As the horn 42 lowers, the first film substrate 2 and the second film substrate 3 are clamped between the horn 42 and the horn receiver 38. The horn 42 vibrates the first film substrate 2 and the second film substrate 3 for a predetermined time. When the predetermined time has elapsed, the oscillator 45 stops the vibration of the horn 42, and the drive unit 44 raises the horn 42.

発振器45の最大出力は30W以上50W以下が好ましい。発振器45の定格発振周波数は50kHz以上70kHz以下が好ましい。ホーン42に加わる負荷や温度の変化等でホーン42の周波数は微妙に変化する。発振器45はホーン42の微妙な変化に追従して、出力する駆動信号の周波数を自動で微調整する。駆動信号の周波数を自動で微調整することを自動追尾という。発振器45はタイマーを備え、0.1秒から7秒の間で、振動部41を駆動する時間を調整する。 The maximum output of the oscillator 45 is preferably 30 W or more and 50 W or less. The rated oscillation frequency of the oscillator 45 is preferably 50 kHz or more and 70 kHz or less. The frequency of the horn 42 changes subtly due to the load applied to the horn 42, changes in temperature, etc. The oscillator 45 automatically fine-tunes the frequency of the drive signal it outputs in response to the subtle changes in the horn 42. Automatic fine-tuning of the frequency of the drive signal is called automatic tracking. The oscillator 45 is equipped with a timer, and adjusts the time for driving the vibration unit 41 between 0.1 and 7 seconds.

図8に示すように、ホーン42の加振面42aの平面形状は円形である。加振面42aの直径である加振面径42bは特に限定されないが、本実施形態では例えば、8mmである。ホーン42の材質は金属製であり、例えば、アルミ、チタン、鉄鋼である。 As shown in FIG. 8, the planar shape of the excitation surface 42a of the horn 42 is circular. The diameter of the excitation surface 42a, that is, the excitation surface diameter 42b, is not particularly limited, but is, for example, 8 mm in this embodiment. The material of the horn 42 is metal, such as aluminum, titanium, or steel.

図9に示すように、ホーン受け38の受面38aの平面形状は円形である。受面38aの直径である受面径38bは特に限定されないが、本実施形態では例えば、12mmである。受面径38bは加振面径42bより大きい。ホーン受け38の材質は金属製であり、本実施形態では、例えば、ステンレス鋼である。 As shown in FIG. 9, the planar shape of the receiving surface 38a of the horn receiver 38 is circular. The diameter of the receiving surface 38a, that is, the receiving surface diameter 38b, is not particularly limited, but is, for example, 12 mm in this embodiment. The receiving surface diameter 38b is larger than the vibration surface diameter 42b. The material of the horn receiver 38 is metal, and in this embodiment, for example, stainless steel.

ホーン受け38は受面38aの中心に穴としての第3穴38cを備える。第3穴38cの直径である第3直径38dは加振面径42bより小さい。従って、ホーン受け38は第2フィルム基体3と接する受面38aに加振面42aの面積よりも小さな面積の第3穴38cを備える。尚、ホーン受け38は第3穴38cの代わりに凹部を備えても良い。第3穴38c及び凹部は受面38aから凹んでいれば良い。 The horn receiver 38 has a third hole 38c in the center of the receiving surface 38a. The third diameter 38d of the third hole 38c is smaller than the vibration surface diameter 42b. Therefore, the horn receiver 38 has a third hole 38c with an area smaller than the area of the vibration surface 42a on the receiving surface 38a that contacts the second film substrate 3. The horn receiver 38 may have a recess instead of the third hole 38c. The third hole 38c and the recess need only be recessed from the receiving surface 38a.

図6に示すように、ホーン受け38及びホーン42が第1フィルム基体2及び第2フィルム基体3を挟持する。第1フィルム基体2及び第2フィルム基体3が押圧された状態でホーン42が超音波振動する。超音波振動は加振面42aから第1フィルム基体2及び第2フィルム基体3に伝達される。超音波振動により第1フィルム基体2及び第2フィルム基体3は互いに擦れ合い摩擦熱が生ずる。 As shown in FIG. 6, the horn receiver 38 and the horn 42 clamp the first film substrate 2 and the second film substrate 3. The horn 42 ultrasonically vibrates while the first film substrate 2 and the second film substrate 3 are pressed. The ultrasonic vibration is transmitted from the vibration surface 42a to the first film substrate 2 and the second film substrate 3. The ultrasonic vibration causes the first film substrate 2 and the second film substrate 3 to rub against each other, generating frictional heat.

第3溶着部6、第1溶着部33及び第2溶着部35となる場所では温度が上昇する。第1フィルム基体2及び第2フィルム基体3に蓄積された熱の一部は受面38aからホーン受け38に伝導して放熱される。第3穴38cでは第1フィルム基体2及び第2フィルム基体3に蓄積された熱が伝導しないので、第3穴38cと加振面42aとの間は受面38aと加振面42aとの間に比べて温度が高い。詳しくは、第3穴38cと加振面42aとの間の温度は250℃以上になり第2保護層14及び第3保護層22の融点を超える。第3穴38cの周囲と加振面42aとの間の温度は130℃以上150℃以下となり、第1接着層11~第4接着層27の融点を超える。 The temperature rises at the locations of the third welded portion 6, the first welded portion 33, and the second welded portion 35. A part of the heat accumulated in the first film substrate 2 and the second film substrate 3 is conducted from the receiving surface 38a to the horn receiver 38 and dissipated. Since the heat accumulated in the first film substrate 2 and the second film substrate 3 is not conducted through the third hole 38c, the temperature between the third hole 38c and the vibration surface 42a is higher than the temperature between the receiving surface 38a and the vibration surface 42a. In more detail, the temperature between the third hole 38c and the vibration surface 42a is 250°C or higher, exceeding the melting points of the second protective layer 14 and the third protective layer 22. The temperature between the periphery of the third hole 38c and the vibration surface 42a is 130°C or higher and 150°C or lower, exceeding the melting points of the first adhesive layer 11 to the fourth adhesive layer 27.

第3穴38cと加振面42aとの間で第2保護層14及び第3保護層22の温度が融点を超えるとき、第2保護層14に第1穴32が形成される。第3保護層22に第2穴34が形成される。第2保護層14及び第3保護層22は同じ材質であるので、第1穴32及び第2穴34は略同時に形成される。 When the temperature of the second protective layer 14 and the third protective layer 22 between the third hole 38c and the vibration surface 42a exceeds the melting point, a first hole 32 is formed in the second protective layer 14. A second hole 34 is formed in the third protective layer 22. Since the second protective layer 14 and the third protective layer 22 are made of the same material, the first hole 32 and the second hole 34 are formed at approximately the same time.

第1接着層11、第2接着層15、第3接着層23及び第4接着層27の融点は第2保護層14及び第3保護層22より低い。従って、第1穴32及び第2穴34は略同時に形成されるときには、第3穴38cと加振面42aとの間では第1接着層11、第2接着層15、第3接着層23及び第4接着層27が溶融している。このため、第3穴38cと加振面42aとの間では第1接着層11、第2接着層15、第3接着層23及び第4接着層27が混じり合う。その結果、第3溶着部6が形成される。 The melting points of the first adhesive layer 11, the second adhesive layer 15, the third adhesive layer 23, and the fourth adhesive layer 27 are lower than those of the second protective layer 14 and the third protective layer 22. Therefore, when the first hole 32 and the second hole 34 are formed substantially simultaneously, the first adhesive layer 11, the second adhesive layer 15, the third adhesive layer 23, and the fourth adhesive layer 27 are melted between the third hole 38c and the vibration surface 42a. Therefore, the first adhesive layer 11, the second adhesive layer 15, the third adhesive layer 23, and the fourth adhesive layer 27 are mixed between the third hole 38c and the vibration surface 42a. As a result, the third welded portion 6 is formed.

第3穴38cの周囲では受面38aと加振面42aとの間の温度が第1接着層11、第2接着層15、第3接着層23及び第4接着層27の融点より高く、第2保護層14及び第3保護層22の融点より低い温度になる。第1接着層11、第2接着層15、第3接着層23及び第4接着層27が溶融するので、第1溶着部33及び第2溶着部35が形成される。 Around the third hole 38c, the temperature between the receiving surface 38a and the vibration surface 42a is higher than the melting points of the first adhesive layer 11, the second adhesive layer 15, the third adhesive layer 23, and the fourth adhesive layer 27, and is lower than the melting points of the second protective layer 14 and the third protective layer 22. As the first adhesive layer 11, the second adhesive layer 15, the third adhesive layer 23, and the fourth adhesive layer 27 melt, the first welded portion 33 and the second welded portion 35 are formed.

超音波溶着機36は第3穴38cと対向する場所の第1フィルム基体2及び第2フィルム基体3を、第3穴38cの周囲と対向する場所よりも高温に加熱する。尚、第3穴38cを凹部にするとき、超音波溶着機36は凹部と対向する場所の第1フィルム基体2及び第2フィルム基体3を、凹部の周囲と対向する場所よりも高温に加熱する。 The ultrasonic welder 36 heats the first film substrate 2 and the second film substrate 3 at the location facing the third hole 38c to a higher temperature than the location facing the periphery of the third hole 38c. When forming the third hole 38c into a recess, the ultrasonic welder 36 heats the first film substrate 2 and the second film substrate 3 at the location facing the recess to a higher temperature than the location facing the periphery of the recess.

この構成によれば、ホーン受け38の凹部又は第3穴38cと対向する場所の第1フィルム基体2では第2保護層14が溶融して第1溶融貫通部6aが形成される。ホーン受け38の凹部又は第3穴38cと対向する場所の第2フィルム基体3では第3保護層22が溶融して第2溶融貫通部6bが形成される。 According to this configuration, the second protective layer 14 melts in the first film substrate 2 at a location facing the recess or third hole 38c of the horn receiver 38, forming the first melt-through portion 6a. The third protective layer 22 melts in the second film substrate 3 at a location facing the recess or third hole 38c of the horn receiver 38, forming the second melt-through portion 6b.

第2保護層14の第1溶融貫通部6a及び第3保護層22の第2溶融貫通部6bを介して接着層を溶出させて溶着させることができる。ホーン受け38の凹部又は第3穴38cの周囲では保護層に穴や貫通部を開けずに内部の接着層を溶着させることができる。 The adhesive layer can be dissolved and welded through the first melt-through portion 6a of the second protective layer 14 and the second melt-through portion 6b of the third protective layer 22. Around the recess or third hole 38c of the horn receiver 38, the internal adhesive layer can be welded without drilling holes or through-holes in the protective layer.

受面38aの平面視で凹部又は第3穴38cの面積は加振面42aの面積の1%~80%である。この構成によれば、凹部又は第3穴38cと対向する場所の第1フィルム基体2及び第2フィルム基体3の温度を凹部又は第3穴38cの周囲の温度より熱くすることができる。 When viewed from above on the receiving surface 38a, the area of the recess or third hole 38c is 1% to 80% of the area of the vibration surface 42a. With this configuration, the temperature of the first film substrate 2 and the second film substrate 3 at the location facing the recess or third hole 38c can be made higher than the temperature around the recess or third hole 38c.

超音波溶着機36の構成によれば、発振器45が振動部41を駆動して、振動部41がホーン42を超音波振動させる。第1フィルム基体2及び第2フィルム基体3はホーン42とホーン受け38とに挟まれて振動して加熱される。ホーン受け38は受面38aに加振面42aの面積よりも小さな面積の凹部又は第3穴38cを備える。このとき、凹部又は第3穴38cと対向する場所の第1フィルム基体2及び第2フィルム基体3の温度を凹部又は第3穴38cの周囲の第1フィルム基体2及び第2フィルム基体3の温度より熱くすることができる。 According to the configuration of the ultrasonic welding machine 36, the oscillator 45 drives the vibration unit 41, which then ultrasonically vibrates the horn 42. The first film substrate 2 and the second film substrate 3 are sandwiched between the horn 42 and the horn receiver 38 and vibrate to be heated. The horn receiver 38 has a recess or third hole 38c on the receiving surface 38a, the area of which is smaller than the area of the vibration surface 42a. At this time, the temperature of the first film substrate 2 and the second film substrate 3 at the location facing the recess or third hole 38c can be made higher than the temperature of the first film substrate 2 and the second film substrate 3 around the recess or third hole 38c.

次に上述した積層溶着フィルム体1の製造方法について図10にて説明する。図10のフローチャートにおいて、ステップS1は包装体設置工程である。ステップS1では、まず、第1フィルム基体2及び第2フィルム基体3が用意される。 Next, the manufacturing method of the laminated welded film body 1 described above will be described with reference to FIG. 10. In the flow chart of FIG. 10, step S1 is the packaging body installation process. In step S1, first, the first film substrate 2 and the second film substrate 3 are prepared.

第1フィルム基体2は第1フィルム7の第1接着層11の一部と第2フィルム8の第2接着層15の一部とが溶着されている。第1フィルム7は第1保護層9と第1接着層11とが積層されている。第2フィルム8は第2保護層14と第2接着層15とが積層されている。第1接着層11の融点は第1保護層9より低い。第2接着層15の融点は第2保護層14より低い。第1フィルム基体2には第1被包装物4が収納される。 The first film base 2 is formed by welding a part of the first adhesive layer 11 of the first film 7 and a part of the second adhesive layer 15 of the second film 8. The first film 7 is formed by laminating a first protective layer 9 and a first adhesive layer 11. The second film 8 is formed by laminating a second protective layer 14 and a second adhesive layer 15. The melting point of the first adhesive layer 11 is lower than that of the first protective layer 9. The melting point of the second adhesive layer 15 is lower than that of the second protective layer 14. The first packaged item 4 is stored in the first film base 2.

第2フィルム基体3は第3フィルム19の第3接着層23の一部と第4フィルム21の第4接着層27の一部とが溶着されている。第3フィルム19は第3保護層22と第3接着層23とが積層されている。第4フィルム21は第4保護層26と第4接着層27とが積層されている。第3接着層23の融点は第3保護層22より低い。第4接着層27の融点は第4保護層26より低い。第2フィルム基体3には第2被包装物5が収納される。 The second film base 3 is formed by welding a part of the third adhesive layer 23 of the third film 19 and a part of the fourth adhesive layer 27 of the fourth film 21. The third film 19 is formed by laminating a third protective layer 22 and a third adhesive layer 23. The fourth film 21 is formed by laminating a fourth protective layer 26 and a fourth adhesive layer 27. The melting point of the third adhesive layer 23 is lower than that of the third protective layer 22. The melting point of the fourth adhesive layer 27 is lower than that of the fourth protective layer 26. The second packaged item 5 is stored in the second film base 3.

加振面42aを有するホーン42と、加振面42aに対応した受面38aに凹部又は第3穴38cを有するホーン受け38と、の間に第1フィルム基体2及び第2フィルム基体3が重ねて配置される。次にステップS2に移行する。 The first film substrate 2 and the second film substrate 3 are placed in a stacked manner between the horn 42 having the vibration surface 42a and the horn receiver 38 having a recess or a third hole 38c on the receiving surface 38a corresponding to the vibration surface 42a. Next, proceed to step S2.

ステップS2は加熱工程である。ステップS2では第1フィルム基体2及び第2フィルム基体3が加振面42aと受面38aとの間で挟持された状態で、第1フィルム基体2及び第2フィルム基体3を超音波溶着機36がホーン42の振動により加熱する。凹部又は第3穴38cに対応した部位を凹部又は第3穴38cの周囲に対応した部位よりも高い温度にする。 Step S2 is a heating process. In step S2, the first film substrate 2 and the second film substrate 3 are sandwiched between the vibration surface 42a and the receiving surface 38a, and the ultrasonic welding machine 36 heats the first film substrate 2 and the second film substrate 3 by vibrating the horn 42. The temperature of the area corresponding to the recess or the third hole 38c is made higher than the temperature of the area corresponding to the recess or the periphery of the third hole 38c.

凹部又は第3穴38cに対応した部位において、第1フィルム基体2の第1保護層9及び/又は第2保護層14を溶融させて貫通した第1溶融貫通部6a、及び/又は、第2フィルム基体3の第3保護層22及び/又は第4保護層26を溶融させて貫通した第2溶融貫通部6b、を介して第1接着層11乃至第4接着層27のいずれかの一部から溶出させた接着層で溶着固定した溶着固定部6cを超音波溶着機36が形成する。 At the portion corresponding to the recess or third hole 38c, the ultrasonic welding machine 36 forms a welded and fixed portion 6c, which is welded and fixed with an adhesive layer dissolved from a portion of any one of the first adhesive layer 11 to the fourth adhesive layer 27, via a first melted through portion 6a that has melted and penetrated the first protective layer 9 and/or the second protective layer 14 of the first film substrate 2, and/or a second melted through portion 6b that has melted and penetrated the third protective layer 22 and/or the fourth protective layer 26 of the second film substrate 3.

凹部又は第3穴38cの周囲に対応した部位において、溶着固定部6cを囲んで第1接着層11と第2接着層15とが溶着する第1溶着部33、及び/又は、溶着固定部6cを囲んで第3接着層23と第4接着層27とが溶着する第2溶着部35を超音波溶着機36が形成する。 At the area corresponding to the recess or the periphery of the third hole 38c, the ultrasonic welding machine 36 forms a first welded portion 33 surrounding the welded fixed portion 6c and welding the first adhesive layer 11 to the second adhesive layer 15, and/or a second welded portion 35 surrounding the welded fixed portion 6c and welding the third adhesive layer 23 to the fourth adhesive layer 27.

第1溶融貫通部6a、第2溶融貫通部6b、溶着固定部6c、第1溶着部33及び第2溶着部35の形成は同時に行われる。積層溶着フィルム体1の平面視で第1被包装物4及び第2被包装物5は溶着固定部6cと重ならない。次にステップS3に移行する。 The first melt-penetrating portion 6a, the second melt-penetrating portion 6b, the welded and fixed portion 6c, the first welded portion 33, and the second welded portion 35 are formed simultaneously. In a plan view of the laminated welded film body 1, the first packaged item 4 and the second packaged item 5 do not overlap the welded and fixed portion 6c. Next, proceed to step S3.

ステップS3は包装体除去工程である。この工程では、直動機構39がホーン42を上昇させる。ホーン受け38とホーン42との間に隙間ができる。積層溶着フィルム体1が超音波溶着機36から取り除かれる。以上の工程により、積層溶着フィルム体1が完成する。 Step S3 is the packaging removal process. In this process, the linear motion mechanism 39 raises the horn 42. A gap is created between the horn receiver 38 and the horn 42. The laminated welded film body 1 is removed from the ultrasonic welding machine 36. Through the above process, the laminated welded film body 1 is completed.

この製造方法によれば、溶着固定部6cは、第1フィルム基体2の第1接着層11と第2接着層15とが溶着された第1溶着部33、及び/又は、第2フィルム基体3の第3接着層23と第4接着層27とが溶着された第2溶着部35によって、平面視した状態で取り囲まれて形成される。従って、第1フィルム基体2の第1保護層9と第2保護層14との間に第1被包装物4を包装して封止して密閉している場合は、第1フィルム基体2の第1溶融貫通部6aの形成の際(溶融して貫した際)に外部(外気)と通じることになっても、第1フィルム基体2の内部は気密状態を維持することができる。また、同様に、第2フィルム基体3の第3保護層22と第4保護層26の間に第2被包装物5を包装して封止して密閉している場合は、第2フィルム基体3の第2溶融貫通部6bの形成の際(溶融して貫した際)に外部(外気)と通じることになっても、第2フィルム基体3の内部は気密状態を維持することができる。 According to this manufacturing method, the welded fixed portion 6c is surrounded in a plan view by the first welded portion 33 formed by welding the first adhesive layer 11 and the second adhesive layer 15 of the first film base 2, and/or the second welded portion 35 formed by welding the third adhesive layer 23 and the fourth adhesive layer 27 of the second film base 3. Therefore, when the first packaged item 4 is packaged and sealed between the first protective layer 9 and the second protective layer 14 of the first film base 2, the inside of the first film base 2 can maintain an airtight state even if it is connected to the outside (external air) when the first molten penetration portion 6a of the first film base 2 is formed (when it is melted and penetrated). Similarly, when the second packaged item 5 is packaged and sealed between the third protective layer 22 and the fourth protective layer 26 of the second film substrate 3, the inside of the second film substrate 3 can be maintained in an airtight state even if the second molten-through portion 6b of the second film substrate 3 is connected to the outside (external air) when it is formed (melted and pierced).

また、第1溶融貫通部6aと第2溶融貫通部6bとが対向する場所(積層した際に平面的に重なる位置)に溶着固定部6cが形成される際は、第1フィルム基体2及び第2フィルム基体3各々の気密状態を維持することができるとともに、第1フィルム基体2と第2フィルム基体3とを溶着固定部6cでの溶着によって確実に固定することができる。 In addition, when the welded fixing portion 6c is formed where the first melt-penetrating portion 6a and the second melt-penetrating portion 6b face each other (where they overlap in a planar manner when stacked), the airtight state of each of the first film substrate 2 and the second film substrate 3 can be maintained, and the first film substrate 2 and the second film substrate 3 can be securely fixed together by welding at the welded fixing portion 6c.

ステップS2の加熱工程では凹部又は第3穴38cと対向する場所の第1フィルム基体2及び第2フィルム基体3を250℃以上に加熱し、凹部又は第3穴38cの周囲と対向する場所の第1フィルム基体2及び第2フィルム基体3を200℃以下で加熱するのが好ましい。 In the heating process of step S2, it is preferable to heat the first film substrate 2 and the second film substrate 3 at the locations facing the recess or the third hole 38c to 250°C or higher, and to heat the first film substrate 2 and the second film substrate 3 at the locations facing the recess or the periphery of the third hole 38c to 200°C or lower.

この製造方法によれば、凹部又は第3穴38cと対向する場所で、接着層の融点よりも高い温度(250℃以上)で加熱して保護層を溶融させて第1溶融貫通部6a及び/又は第2溶融貫通部6bを形成する。この際に、凹部又は第3穴38cの周囲と対向する場所で、接着層の融点の温度(200℃以下)で加熱されて、溶着固定部6cを囲んで第1フィルム基体2において第1溶着部33、及び/又は、溶着固定部6cを囲んで第2フィルム基体3において第2溶着部35が形成される。そのため、第1溶融貫通部6a及び/又は第2溶融貫通部6bが形成される際(溶融して貫した際)に外部(外気)と通じることになっても、第1フィルム基体2の内部及び/又は第2フィルム基体3の内部は気密状態を維持することができる。 According to this manufacturing method, the protective layer is melted by heating at a temperature (250°C or higher) higher than the melting point of the adhesive layer at a location facing the recess or the third hole 38c to form the first melt-penetrating portion 6a and/or the second melt-penetrating portion 6b. At this time, the protective layer is heated at a temperature (200°C or lower) of the melting point of the adhesive layer at a location facing the recess or the periphery of the third hole 38c to form the first melted portion 33 in the first film base 2 surrounding the welded fixed portion 6c, and/or the second melted portion 35 in the second film base 3 surrounding the welded fixed portion 6c. Therefore, even if the first melt-penetrating portion 6a and/or the second melt-penetrating portion 6b are connected to the outside (external air) when they are formed (melted and penetrated), the inside of the first film base 2 and/or the inside of the second film base 3 can maintain an airtight state.

次に、超音波溶着機36で積層溶着フィルム体1を溶着した例を示す。図11に超音波溶着機36の稼働条件の1例を示す。超音波溶着機36ではホーン42の振動数が自動追尾される。ホーン42に加わる負荷や温度の変化等でホーン42の周波数は微妙に変化する。発振器45は微妙な変化に追従するように振動部41に出力する電力の周波数を自動で微調整する。 Next, an example of welding the laminated welded film body 1 with the ultrasonic welding machine 36 is shown. Figure 11 shows an example of the operating conditions of the ultrasonic welding machine 36. In the ultrasonic welding machine 36, the vibration frequency of the horn 42 is automatically tracked. The frequency of the horn 42 changes subtly due to the load applied to the horn 42, changes in temperature, etc. The oscillator 45 automatically fine-tunes the frequency of the power output to the vibration unit 41 so as to follow the subtle changes.

ホーン42の押圧力は、例えば、チューブ内径6mmのエアシリンダーを用いて0.08Mpa~0.2Mpaの間で調整可能である。本実施形態ではホーン42の押圧力の中央値は0.1Mpa~0.14Mpaの間で行われる。溶着時間は、例えば、0.4sec~1secの間で調整可能である。本実施形態では溶着時間の中央値は0.6sec~0.8secの間で行われる。 The pressing force of the horn 42 can be adjusted between 0.08 MPa and 0.2 MPa, for example, using an air cylinder with an inner tube diameter of 6 mm. In this embodiment, the median pressing force of the horn 42 is between 0.1 MPa and 0.14 MPa. The welding time can be adjusted between 0.4 sec and 1 sec, for example. In this embodiment, the median welding time is between 0.6 sec and 0.8 sec.

ホーン受け38の穴径は第3穴38cの第3直径38dを示す。ホーン受け38の穴径はホーン受け38を取り換えることにより変更可能になっている。 The hole diameter of the horn receiver 38 indicates the third diameter 38d of the third hole 38c. The hole diameter of the horn receiver 38 can be changed by replacing the horn receiver 38.

図12に示すように、第1接着層11~第4接着層27の材質にはポリエチレンを使用した。第1接着層11~第4接着層27の厚みは50μmである。第1表面層12~第4表面層28の材質には蒸着PETを使用した。第1表面層12~第4表面層28厚みは12μmである。第1中間層13~第4中間層29の材質にはナイロンを使用した。第1中間層13~第4中間層29の厚みは25μm、40μm、50μmの3水準を用意した。 As shown in FIG. 12, polyethylene was used as the material for the first adhesive layer 11 to the fourth adhesive layer 27. The thicknesses of the first adhesive layer 11 to the fourth adhesive layer 27 were 50 μm. Vapor-deposited PET was used as the material for the first surface layer 12 to the fourth surface layer 28. The thicknesses of the first surface layer 12 to the fourth surface layer 28 were 12 μm. Nylon was used as the material for the first intermediate layer 13 to the fourth intermediate layer 29. Three thickness levels were prepared for the first intermediate layer 13 to the fourth intermediate layer 29: 25 μm, 40 μm, and 50 μm.

図13及び図14はホーン受け38の第3直径38dを変えたときの第1フィルム基体2と第2フィルム基体3との溶着力の変化を示す。各データはサンプル数が8個のときの平均値を示す。穴径は第3直径38dを示す。溶着力は第1フィルム基体2の第2端2bと第2フィルム基体3の第4端3bとを引っ張ったときに、第1フィルム基体2と第2フィルム基体3とが離れるときに要する力を示す。 Figures 13 and 14 show the change in the welding force between the first film substrate 2 and the second film substrate 3 when the third diameter 38d of the horn receiver 38 is changed. Each data shows the average value when there are eight samples. The hole diameter shows the third diameter 38d. The welding force shows the force required to separate the first film substrate 2 and the second film substrate 3 when the second end 2b of the first film substrate 2 and the fourth end 3b of the second film substrate 3 are pulled.

溶着可否の判定値は0.1kgfである。溶着可否の判定値で積層溶着フィルム体1で引っ張ったときに、第1フィルム基体2と第2フィルム基体3とが離れるとき不可と判定する。第1フィルム基体2と第2フィルム基体3とが離れないとき可と判定する。 The judgment value for whether welding is possible is 0.1 kgf. When the laminated weldable film body 1 is pulled, if the first film substrate 2 and the second film substrate 3 separate, it is judged as not possible. If the first film substrate 2 and the second film substrate 3 do not separate, it is judged as possible.

溶着面積は、第3溶着部6の面積である。第1フィルム基体2と第2フィルム基体3とを分離させた後で、撮像装置が第3溶着部6を撮像する。第3溶着部6の画像を用いて画像処理装置が第3溶着部6の面積を算出する。 The welded area is the area of the third welded portion 6. After the first film base 2 and the second film base 3 are separated, an imaging device captures an image of the third welded portion 6. An image processing device calculates the area of the third welded portion 6 using the image of the third welded portion 6.

第3直径38dが0.5mm~6mmの範囲では第1フィルム基体2及び第2フィルム基体3の溶着が良好に行われたことを示す。第3直径38dの範囲は特に限定されない。第1フィルム基体2及び第2フィルム基体3の材質や厚みに応じて変更しても良い。第3穴38cが無いときには第1フィルム基体2及び第2フィルム基体3の溶着はできなかった。第3直径38dが0.5mmのときの加振面42aの面積に対する第3穴38cの面積は0.4%である。第3直径38dが6mmのときの加振面42aの面積に対する第3穴38cの面積は56.3%である。第3直径38dが7.2mmのときの加振面42aの面積に対する第3穴38cの面積は80%である。データは表示されないが、第3直径38dが7.2mmのときにも第1フィルム基体2及び第2フィルム基体3の溶着が良好に行われたことが確認されている。従って、受面38aの平面視で第3穴38cの面積が加振面42aの面積の1%~80%であるとき、第1フィルム基体2及び第2フィルム基体3は良好に溶着できる。 This indicates that the welding of the first film substrate 2 and the second film substrate 3 was performed well when the third diameter 38d was in the range of 0.5 mm to 6 mm. The range of the third diameter 38d is not particularly limited. It may be changed according to the material and thickness of the first film substrate 2 and the second film substrate 3. When the third hole 38c was not present, the welding of the first film substrate 2 and the second film substrate 3 could not be performed. When the third diameter 38d was 0.5 mm, the area of the third hole 38c relative to the area of the vibration surface 42a was 0.4%. When the third diameter 38d was 6 mm, the area of the third hole 38c relative to the area of the vibration surface 42a was 56.3%. When the third diameter 38d was 7.2 mm, the area of the third hole 38c relative to the area of the vibration surface 42a was 80%. Although the data is not shown, it has been confirmed that the first film substrate 2 and the second film substrate 3 were well welded even when the third diameter 38d was 7.2 mm. Therefore, when the area of the third hole 38c is 1% to 80% of the area of the vibration surface 42a in a plan view of the receiving surface 38a, the first film substrate 2 and the second film substrate 3 can be well welded.

図14の棒グラフは溶着力を示す。折れ線グラフは溶着面積を示す。溶着力と溶着面積とに強い相関性は見られない。第3直径38dが0.5mmのとき、溶着面積に比べ溶着力は低い。第3直径38dが1mmのとき、溶着面積が一番小さい。第3直径38dが2mmのとき、溶着力が一番強く、接着層の溶けだしも少なく最適条件に近いと言える。第3直径38dが4mmのとき、溶着面積は一番広いが溶着力は弱い。温度が上昇しすぎて第3溶着部6に穴が空いてしまっている。第3直径38dが6mmのとき、幅広く溶着されているが溶けて第3溶着部6に穴が空いている。溶着力は第3直径38dが0.5mmのとき最も低いが判定値より高い。 The bar graph in Figure 14 shows the welding force. The line graph shows the welding area. There is no strong correlation between the welding force and the welding area. When the third diameter 38d is 0.5 mm, the welding force is low compared to the welding area. When the third diameter 38d is 1 mm, the welding area is the smallest. When the third diameter 38d is 2 mm, the welding force is the strongest, there is little melting of the adhesive layer, and it can be said that it is close to the optimal condition. When the third diameter 38d is 4 mm, the welding area is the widest but the welding force is weak. The temperature has risen too much and a hole has been made in the third welded part 6. When the third diameter 38d is 6 mm, the welding is wide, but it has melted and a hole has been made in the third welded part 6. When the third diameter 38d is 0.5 mm, the welding force is the lowest but is higher than the judgment value.

図15及び図16は中間層の厚みを変えたときの第1フィルム基体2と第2フィルム基体3との溶着力の変化を示す。各データはサンプル数が8個のときの平均値を示す。第3穴38cの第3直径38dは2mmである。中間層の厚みが25μm~50μmの間では溶着力が0.1kgf以上であり、第1フィルム基体2及び第2フィルム基体3は良好に溶着できる。 Figures 15 and 16 show the change in the welding strength between the first film substrate 2 and the second film substrate 3 when the thickness of the intermediate layer is changed. Each data shows the average value for eight samples. The third diameter 38d of the third hole 38c is 2 mm. When the thickness of the intermediate layer is between 25 μm and 50 μm, the welding strength is 0.1 kgf or more, and the first film substrate 2 and the second film substrate 3 can be welded well.

図16の棒グラフは溶着力を示す。折れ線グラフは溶着面積を示す。溶着力と溶着面積とに強い相関性は見られない。厚みの水準が2のときは、厚みの水準が1のときより溶着力が大きい。このとき、面積が小さく効率よく接着できている。厚みの水準が2のときは、溶着面積に対する溶着力が優れている。 The bar graph in Figure 16 shows the welding strength. The line graph shows the welding area. There is no strong correlation between the welding strength and the welding area. When the thickness level is 2, the welding strength is greater than when the thickness level is 1. In this case, the area is smaller and the adhesion is more efficient. When the thickness level is 2, the welding strength relative to the welding area is excellent.

第2実施形態
本実施形態が第1実施形態と異なるところは、第1フィルム基体2と同等のフィルム基体を折り曲げて溶着している点にある。尚、第1実施形態と同一の構成については同一の符号を付して、重複する説明を省略する。
Second Embodiment The present embodiment differs from the first embodiment in that a film substrate equivalent to the first film substrate 2 is folded and welded. Note that the same components as those in the first embodiment are denoted by the same reference numerals and redundant explanations will be omitted.

図17に示すように、被溶着物としての積層溶着フィルム体51は袋状であり、積層溶着フィルム体51の内部は密閉された気密状態になっている。積層溶着フィルム体51の内部には被包装物としての第3被包装物52が収納される。積層溶着フィルム体51の内部は減圧される。積層溶着フィルム体51が水中に投入されても、第3被包装物52は濡れない。 As shown in FIG. 17, the laminated welded film body 51 serving as the welded object is bag-shaped, and the inside of the laminated welded film body 51 is sealed and airtight. A third packaged object 52 serving as the packaged object is stored inside the laminated welded film body 51. The inside of the laminated welded film body 51 is depressurized. Even if the laminated welded film body 51 is immersed in water, the third packaged object 52 does not get wet.

積層溶着フィルム体51は長方形である。積層溶着フィルム体51の長手方向の一端を第1端51aとする。積層溶着フィルム体51の長手方向の他端を第2端51bとする。第3被包装物52は第2端51bに近く、第1端51aから離れている。 The laminated welded film body 51 is rectangular. One end in the longitudinal direction of the laminated welded film body 51 is the first end 51a. The other end in the longitudinal direction of the laminated welded film body 51 is the second end 51b. The third packaged item 52 is close to the second end 51b and away from the first end 51a.

図18は図17のBB線に沿う断面側から見た図である。図17及び図18に示すように、第1実施形態の第1フィルム基体2と同様に積層溶着フィルム体51は第1保護層53と接着層としての第1接着層54とが積層された第1フィルム55の第1接着層54の一部と、第2保護層56と接着層としての第2接着層57とが積層された第2フィルム58の第2接着層57の一部とが、第1フィルム55と第2フィルム58との間に第3被包装物52を包装した状態で溶着封止される。第1フィルム55及び第2フィルム58が溶着封止される場所は第1端51a及び第2端51bである。積層溶着フィルム体51の長手方向をX方向とし、幅方向をY方向とする。積層溶着フィルム体51の厚み方向をZ方向とする。積層溶着フィルム体51はX負方向が2つ折りに折り曲げられている。折り曲がった部分が折り曲げ部51cである。 18 is a cross-sectional view taken along the line BB in FIG. 17. As shown in FIG. 17 and FIG. 18, in the same manner as the first film base 2 in the first embodiment, the laminated welded film body 51 has a part of the first adhesive layer 54 of the first film 55, in which the first protective layer 53 and the first adhesive layer 54 as an adhesive layer are laminated, and a part of the second adhesive layer 57 of the second film 58, in which the second protective layer 56 and the second adhesive layer 57 as an adhesive layer are laminated, welded and sealed in a state in which the third packaged item 52 is packaged between the first film 55 and the second film 58. The first film 55 and the second film 58 are welded and sealed at the first end 51a and the second end 51b. The longitudinal direction of the laminated welded film body 51 is the X direction, and the width direction is the Y direction. The thickness direction of the laminated welded film body 51 is the Z direction. The laminated welded film body 51 is folded in half in the negative X direction. The bent portion is the bent portion 51c.

図18に示すように、積層された第1フィルム55と第2フィルム58は、第2保護層56が内側に位置して対向するように折り曲げられている。該折り曲げにより対向された一方の第2保護層56と他方の第2保護層56は、一方の第2保護層56の第1溶融貫通部6a、及び/又は、他方の第2保護層56の第2溶融貫通部6bを介して、第1接着層54及び第2接着層57の少なくともいずれか1つから溶出した接着層によって溶着固定されている。折り曲げられた第2保護層56において、一方の第2保護層56はZ正方向の第2保護層56であり、他方の第2保護層56はZ負方向の第2保護層56である。 As shown in FIG. 18, the laminated first film 55 and second film 58 are folded so that the second protective layer 56 faces the inner side. The one second protective layer 56 and the other second protective layer 56 that are opposed by this folding are welded and fixed by an adhesive layer eluted from at least one of the first adhesive layer 54 and the second adhesive layer 57 via the first melt-through portion 6a of the one second protective layer 56 and/or the second melt-through portion 6b of the other second protective layer 56. In the folded second protective layer 56, the one second protective layer 56 is the second protective layer 56 in the Z positive direction, and the other second protective layer 56 is the second protective layer 56 in the Z negative direction.

溶着固定された溶着固定部6cを平面視した状態で取り囲んで第1接着層54と第2接着層57とが溶着された第1溶着部33が一方の第2保護層56の側に設けられ、及び、溶着固定された溶着固定部6cを平面視した状態で取り囲んで第1接着層54と第2接着層57とが溶着された第2溶着部35が他方の第2保護層56の側に設けられている。第1接着層54及び第2接着層57から溶出した接着層が折り曲げられた一方の第2保護層56と他方の第2保護層56との間、に存在して溶着固定されている。 A first welded portion 33, in which the first adhesive layer 54 and the second adhesive layer 57 are welded to each other, is provided on one side of the second protective layer 56, surrounding the welded welded portion 6c in a planar view, and a second welded portion 35, in which the first adhesive layer 54 and the second adhesive layer 57 are welded to each other, surrounding the welded welded portion 6c in a planar view, is provided on the other side of the second protective layer 56. The adhesive layers eluted from the first adhesive layer 54 and the second adhesive layer 57 are present and welded between the folded second protective layer 56 on one side and the other second protective layer 56 on the other side.

この構成によれば、溶着固定部6cは、折り曲げられて対向する第2保護層56のうち、一方の第2保護層56の側に設けられた第1接着層54と第2接着層57とが溶着された第1溶着部33、及び/又は、他方の第2保護層56の側に設けられた第1接着層54と第2接着層57とが溶着された第2溶着部35によって、平面視した状態で取り囲まれている。従って、一方の第2保護層56の第1溶融貫通部6a、及び/又は、他方の第2保護層56の第2溶融貫通部6bの形成の際(溶融して貫した際)に外部(外気)と通じることになっても、第1フィルム55と第2フィルム58の間で第3被包装物52を包装する内部は気密状態を維持することができる。 According to this configuration, the welded fixed portion 6c is surrounded in a plan view by the first welded portion 33 formed by welding the first adhesive layer 54 and the second adhesive layer 57 provided on one of the folded second protective layers 56, and/or the second welded portion 35 formed by welding the first adhesive layer 54 and the second adhesive layer 57 provided on the other second protective layer 56. Therefore, even if the first melt-penetrated portion 6a of one second protective layer 56 and/or the second melt-penetrated portion 6b of the other second protective layer 56 are connected to the outside (external air) when they are formed (melted and penetrated), the inside where the third packaged item 52 is packaged between the first film 55 and the second film 58 can be maintained in an airtight state.

また、一方の第2保護層56の第1溶融貫通部6aと他方の第2保護層56の第2溶融貫通部6bとが対向する場所(積層した際に平面的に重なる位置)に配置されて溶着固定部6cを構成する際は、第1フィルム55と第2フィルム58の間の気密状態を維持することができるとともに、折り曲げられて対向して配置された第2保護層56同士を溶着固定部6cでの溶着によって確実に固定することができる。 In addition, when the first melt-penetrating portion 6a of one second protective layer 56 and the second melt-penetrating portion 6b of the other second protective layer 56 are arranged at a location facing each other (a position where they overlap in a planar view when stacked), the airtight state between the first film 55 and the second film 58 can be maintained, and the second protective layers 56 that are folded and arranged facing each other can be reliably fixed to each other by welding at the melt-penetrating portion 6c.

積層溶着フィルム体51では第1接着層54及び第2接着層57の材質はポリエチレン又はCPPを含み、第1保護層53及び第2保護層56の材質はPET又はナイロンを含むのが好ましい。CPPはポリプロピレンでも良い。 In the laminated welded film body 51, the material of the first adhesive layer 54 and the second adhesive layer 57 preferably includes polyethylene or CPP, and the material of the first protective layer 53 and the second protective layer 56 preferably includes PET or nylon. CPP may also be polypropylene.

ポリエチレンの融点は130℃より低い。CPPの融点は138℃である。蒸着PETの融点は264℃であり、ナイロンの融点は215℃である。積層溶着フィルム体51の構成によれば、第2保護層56は、第1接着層54及び第2接着層57よりも高い温度を部分的に加えることによって、折り曲げられて対向配置された一方の第2保護層56の側に設けられた第1溶融貫通部6a、他方の第2保護層56の側に設けられた第2溶融貫通部6b、を形成するとともに溶着固定部6cを形成することができる。第1保護層53は外側に配置され、積層溶着フィルム体51を保護することができる。 The melting point of polyethylene is lower than 130°C. The melting point of CPP is 138°C. The melting point of vapor-deposited PET is 264°C, and the melting point of nylon is 215°C. According to the configuration of the laminated welded film body 51, the second protective layer 56 can be partially heated to a temperature higher than that of the first adhesive layer 54 and the second adhesive layer 57, thereby forming a first melt-penetrating portion 6a on one side of the second protective layer 56 that is folded and arranged opposite to each other, a second melt-penetrating portion 6b on the other side of the second protective layer 56, and a welded fixed portion 6c. The first protective layer 53 is arranged on the outside and can protect the laminated welded film body 51.

積層溶着フィルム体51の溶着固定部6cには、第1保護層53及び/又は第2保護層56の一部が含まれるのが好ましい。この構成によれば、溶着固定部6cにおいて、上述した溶出した接着層による接着力に加えて、折り曲げられて対向する一方の第2保護層56と他方の第2保護層56との溶着による接着力が作用するので、折り曲げられた状態で一方の第2保護層56と他方の第2保護層56とを確実に固定することができる。 The welded and fixed portion 6c of the laminated welded film body 51 preferably includes a part of the first protective layer 53 and/or the second protective layer 56. With this configuration, in the welded and fixed portion 6c, in addition to the adhesive force due to the eluted adhesive layer described above, the adhesive force due to the welding between one second protective layer 56 and the other second protective layer 56 that are folded and facing each other acts, so that one second protective layer 56 and the other second protective layer 56 can be reliably fixed in the folded state.

次に上述した積層溶着フィルム体51の製造方法について図19にて説明する。図19のフローチャートにおいて、ステップS11は包装体折曲工程である。ステップS11では、まず、折り曲げ部51cが形成されていない積層溶着フィルム体51が用意される。積層溶着フィルム体51の第1端51a及び第2端51bは、第1フィルム55と第2フィルム58との間に第3被包装物52を包装した状態で溶着封止されている。第1フィルム55では第1保護層53と第1接着層54とが積層されている。第2フィルム58では第2保護層56と第2接着層57とが積層されている。積層溶着フィルム体51では第1フィルム55の第1接着層54の一部と第2フィルム58の第2接着層57の一部とが溶着封止されている。第2保護層56が内側に位置して対向するように積層溶着フィルム体51が折り曲げられる。次にステップS12に移行する。 Next, the manufacturing method of the laminated welded film body 51 described above will be described with reference to FIG. 19. In the flow chart of FIG. 19, step S11 is a package folding process. In step S11, a laminated welded film body 51 without a folded portion 51c is prepared. The first end 51a and the second end 51b of the laminated welded film body 51 are welded and sealed in a state in which the third packaged item 52 is packaged between the first film 55 and the second film 58. The first protective layer 53 and the first adhesive layer 54 are laminated in the first film 55. The second protective layer 56 and the second adhesive layer 57 are laminated in the second film 58. In the laminated welded film body 51, a part of the first adhesive layer 54 of the first film 55 and a part of the second adhesive layer 57 of the second film 58 are welded and sealed. The laminated welded film body 51 is folded so that the second protective layer 56 is located on the inside and faces each other. Next, proceed to step S12.

ステップS12は包装体設置工程である。ステップS12では、加振面42aを有するホーン42と加振面42aに対応した受面38aに凹部又は第3穴38cを有するホーン受け38との間に、折り曲げられて対向して重ねられた一方の第2保護層56と他方の第2保護層56とが配置される。次にステップS13に移行する。 Step S12 is a packaging installation process. In step S12, one second protective layer 56 and the other second protective layer 56 are folded and stacked facing each other and placed between the horn 42 having the vibration surface 42a and the horn receiver 38 having a recess or third hole 38c in the receiving surface 38a corresponding to the vibration surface 42a. Next, proceed to step S13.

ステップS13は加熱工程である。ステップS13では重ねられた一方の第2保護層56と他方の第2保護層56が加振面42aと受面38aとの間で挟持された状態で、凹部又は第3穴38cに対応した部位を凹部又は第3穴38cの周囲に対応した部位よりも高い温度にして、超音波溶着機36が積層溶着フィルム体51をホーン42の振動により加熱する。凹部又は第3穴38cに対応した部位を凹部又は第3穴38cの周囲に対応した部位よりも高い温度にする。 Step S13 is a heating process. In step S13, with the stacked second protective layers 56 on one side and the other second protective layer 56 sandwiched between the vibration surface 42a and the receiving surface 38a, the ultrasonic welding machine 36 heats the laminated welded film body 51 by the vibration of the horn 42, with the area corresponding to the recess or third hole 38c at a higher temperature than the area corresponding to the periphery of the recess or third hole 38c.

凹部又は第3穴38cに対応した部位において、一方の第2保護層56を溶融させて貫通した第1溶融貫通部6a、及び/又は、他方の第2保護層56を溶融させて貫通した第2溶融貫通部6b、を介して第1接着層54及び第2接着層57の少なくともいずれかの一部から溶出させた接着層で溶着固定した溶着固定部6cを超音波溶着機36が形成する。 At the portion corresponding to the recess or third hole 38c, the ultrasonic welding machine 36 forms a welded and fixed portion 6c that is welded and fixed with an adhesive layer eluted from at least one of the first adhesive layer 54 and the second adhesive layer 57 via a first melted through portion 6a that has melted and penetrated one of the second protective layers 56 and/or a second melted through portion 6b that has melted and penetrated the other of the second protective layers 56.

凹部又は第3穴38cの周囲に対応した部位において、溶着固定部6cを平面視した状態で取り囲んで、一方の第2保護層56の側に第1接着層54と第2接着層57とが溶着する第1溶着部33、及び/又は、溶着固定部6cを平面視した状態で取り囲んで、他方の第2保護層56の側に第1接着層54と第2接着層57とが溶着する第2溶着部35を超音波溶着機36が形成する。 At a portion corresponding to the recess or the periphery of the third hole 38c, the ultrasonic welding machine 36 forms a first welded portion 33 in which the first adhesive layer 54 and the second adhesive layer 57 are welded to one side of the second protective layer 56, surrounding the welded fixed portion 6c in a planar view, and/or a second welded portion 35 in which the first adhesive layer 54 and the second adhesive layer 57 are welded to the other side of the second protective layer 56, surrounding the welded fixed portion 6c in a planar view.

第1溶融貫通部6a、第2溶融貫通部6b、溶着固定部6c、第1溶着部33及び第2溶着部35の形成は同時に行われる。積層溶着フィルム体51の平面視で第3被包装物52は溶着固定部6cと重ならない。次にステップS14に移行する。 The first melt-penetrating portion 6a, the second melt-penetrating portion 6b, the welded and fixed portion 6c, the first welded portion 33, and the second welded portion 35 are formed simultaneously. In a plan view of the laminated welded film body 51, the third packaged item 52 does not overlap with the welded and fixed portion 6c. Next, proceed to step S14.

ステップS14は包装体除去工程である。この工程では、直動機構39がホーン42を上昇させる。ホーン受け38とホーン42との間に隙間ができる。積層溶着フィルム体51が超音波溶着機36から取り除かれる。以上の工程により、積層溶着フィルム体51が完成する。 Step S14 is the packaging removal process. In this process, the linear motion mechanism 39 raises the horn 42. A gap is created between the horn receiver 38 and the horn 42. The laminated welded film body 51 is removed from the ultrasonic welding machine 36. Through the above process, the laminated welded film body 51 is completed.

この方法によれば、溶着固定部6cは、一方の第2保護層56の側で第1接着層54と第2接着層57とが溶着された第1溶着部33、及び/又は、他方の第2保護層56の側で第1接着層54と第2接着層57とが溶着された第2溶着部35によって、平面視した状態で取り囲まれて形成される。そのため、一方の第2保護層56の側で第1溶融貫通部6aの形成の際(溶融して貫した際)に外部(外気)と通じることになっても、第1フィルム55と第2フィルム58との間の内部は気密状態を維持することができる。また、同様に、他方の第2保護層56の側で第2溶融貫通部6bの形成の際(溶融して貫した際)に外部(外気)と通じることになっても、第1フィルム55と第2フィルム58との間の内部は気密状態を維持することができる。 According to this method, the welded fixed portion 6c is surrounded in a plan view by the first welded portion 33 in which the first adhesive layer 54 and the second adhesive layer 57 are welded on one side of the second protective layer 56, and/or the second welded portion 35 in which the first adhesive layer 54 and the second adhesive layer 57 are welded on the other side of the second protective layer 56. Therefore, even if the first molten penetration portion 6a is formed (melted and penetrated) on one side of the second protective layer 56 and communicates with the outside (outside air), the inside between the first film 55 and the second film 58 can be maintained in an airtight state. Similarly, even if the second molten penetration portion 6b is formed (melted and penetrated) on the other side of the second protective layer 56 and communicates with the outside (outside air), the inside between the first film 55 and the second film 58 can be maintained in an airtight state.

また、一方の第2保護層56の第1溶融貫通部6aと他方の第2保護層56の第2溶融貫通部6bとが対向する場所(積層した際に平面的に重なる位置)に配置される溶着固定部6cを形成する際は、第1フィルム55と第2フィルム58の間の気密状態を維持することができるとともに、折り曲げられて対向して配置された第2保護層56同士を溶着固定部6cでの溶着によって確実に固定することができる。 In addition, when forming the welded fixing portion 6c that is arranged at the location where the first melt-penetrating portion 6a of one second protective layer 56 and the second melt-penetrating portion 6b of the other second protective layer 56 face each other (the location where they overlap in a plane when stacked), the airtight state between the first film 55 and the second film 58 can be maintained, and the second protective layers 56 that are folded and arranged opposite each other can be reliably fixed to each other by welding at the welded fixing portion 6c.

第3実施形態
第1実施形態では、第1フィルム基体2及び第2フィルム基体3の各層が、ポリエチレン、CPP、ナイロン、PETの組み合わせであった。他にも、第1フィルム基体2及び第2フィルム基体3の各層は延伸ポリプロピレンであるOPP、無延伸ポリプロピレンであるCPP、高密度ポリエチレンであるHDPE、低密度ポリエチレンであるLDPE、直鎖状低密度ポリエチレンであるL-LDPEを組み合わせても良い。他にも、第1フィルム基体2及び第2フィルム基体3の各層はポリエチレンテレフタレートであるPET、ナイロンであるO-NY、ポリアミドであるPA、ビニロンであるPVA、ポリビニルアルコールであるEVOH、ポリ塩化ビニリデンコートであるOPPを組み合わせても良い。
Third embodiment In the first embodiment, the layers of the first film substrate 2 and the second film substrate 3 are a combination of polyethylene, CPP, nylon, and PET. Alternatively, the layers of the first film substrate 2 and the second film substrate 3 may be a combination of OPP, which is oriented polypropylene, CPP, which is unoriented polypropylene, HDPE, which is high density polyethylene, LDPE, which is low density polyethylene, and L-LDPE, which is linear low density polyethylene. Alternatively, the layers of the first film substrate 2 and the second film substrate 3 may be a combination of PET, which is polyethylene terephthalate, O-NY, which is nylon, PA, which is polyamide, PVA, which is vinylon, EVOH, which is polyvinyl alcohol, and OPP, which is polyvinylidene chloride coated.

例えば、第1フィルム基体2及び第2フィルム基体3の各層の組み合わせを、KOP/LDPE、ONY/LDPE、KONY/LDPE、PET/LDPE、PET/EVOH/LDPE、ONY/EVOH/LDPE、NY/EVOH/LDPE、OPP/EVOH/LDPE、PET/アルミ蒸着PET/LDPEとしても良い。他にも、第1フィルム基体2及び第2フィルム基体3の各層の組み合わせを、NY/MXD/NY/LDPE、PVAコートOPP/LDPE、OPP又はPET/アルミ蒸着CPP、シリカ蒸着PET/LDPE、アルミナ蒸着PET/LDPEとしても良い。この内容は第2実施形態にも適用できる。 For example, the layers of the first film substrate 2 and the second film substrate 3 may be combined as follows: KOP/LDPE, ONY/LDPE, KONY/LDPE, PET/LDPE, PET/EVOH/LDPE, ONY/EVOH/LDPE, NY/EVOH/LDPE, OPP/EVOH/LDPE, PET/aluminum-vapor-deposited PET/LDPE. The layers of the first film substrate 2 and the second film substrate 3 may be combined as follows: NY/MXD/NY/LDPE, PVA-coated OPP/LDPE, OPP or PET/aluminum-vapor-deposited CPP, silica-vapor-deposited PET/LDPE, alumina-vapor-deposited PET/LDPE. This can also be applied to the second embodiment.

1…積層溶着フィルム体、2…被溶着物としての第1フィルム基体、3…被溶着物としての第2フィルム基体、4…被包装物としての第1被包装物、5…被包装物としての第2被包装物、6a…第1溶融貫通部、6b…第2溶融貫通部、6c…溶着固定部、7,55…第1フィルム、8,58…第2フィルム、9,53…第1保護層、11,54…接着層としての第1接着層、14,56…第2保護層、15,57…接着層としての第2接着層、19…第3フィルム、21…第4フィルム、22…第3保護層、23…接着層としての第3接着層、26…第4保護層、27…接着層としての第4接着層、33…第1溶着部、35…第2溶着部、38…ホーン受け、38c…穴としての第3穴、41…振動部、42…ホーン、42a…加振面、45…発振器、51…被溶着物としての積層溶着フィルム体、52…被包装物としての第3被包装物。 1...Laminated weldable film body, 2...First film substrate as the welded object, 3...Second film substrate as the welded object, 4...First packaged item as the packaged item, 5...Second packaged item as the packaged item, 6a...First melt-penetration portion, 6b...Second melt-penetration portion, 6c...Welded fixed portion, 7, 55...First film, 8, 58...Second film, 9, 53...First protective layer, 11, 54...First adhesive layer as adhesive layer, 14, 56...Second protective layer, 15, 57...Adhesion Second adhesive layer as layer, 19...third film, 21...fourth film, 22...third protective layer, 23...third adhesive layer as adhesive layer, 26...fourth protective layer, 27...fourth adhesive layer as adhesive layer, 33...first welded part, 35...second welded part, 38...horn receiver, 38c...third hole as hole, 41...vibration part, 42...horn, 42a...vibration surface, 45...oscillator, 51...laminated welded film body as welded object, 52...third packaged item as packaged item.

Claims (3)

第1保護層と前記第1保護層より融点が低い第1接着層とが積層された第1フィルムの前記第1接着層の一部と、第2保護層と前記第2保護層より融点が低い第2接着層とが積層された第2フィルムの前記第2接着層の一部と、が溶着された第1フィルム基体と、
第3保護層と前記第3保護層より融点が低い第3接着層とが積層された第3フィルムの前記第3接着層の一部と、第4保護層と前記第4保護層より融点が低い第4接着層とが積層された第4フィルムの前記第4接着層の一部と、が溶着された第2フィルム基体と、を用意し、
加振面を有するホーンと、前記加振面に対応した受面に凹部又は穴を有するホーン受けと、の間に前記第1フィルム基体及び前記第2フィルム基体を重ねて配置し、
前記第1フィルム基体及び前記第2フィルム基体が前記加振面と前記受面との間で挟持された状態で、前記第1フィルム基体及び前記第2フィルム基体を前記ホーンの振動により加熱して、前記凹部又は前記穴に対応した部位を前記凹部又は前記穴の周囲に対応した部位よりも高い温度にすることで、
前記凹部又は前記穴に対応した部位において、前記第1フィルム基体の前記第1保護層及び/又は前記第2保護層を溶融させて貫通した第1溶融貫通部、及び/又は、前記第2フィルム基体の前記第3保護層及び/又は前記第4保護層を溶融させて貫通した第2溶融貫通部、を介して前記第1接着層乃至前記第4接着層のいずれかの一部から溶出させた接着層で溶着固定した溶着固定部を形成し、
前記凹部又は前記穴の周囲に対応した部位において、前記溶着固定部を囲んで前記第1接着層と前記第2接着層とが溶着する第1溶着部、及び/又は、前記溶着固定部を囲んで前記第3接着層と前記第4接着層とが溶着する第2溶着部、を形成することを特徴とする積層溶着フィルム体の製造方法。
a first film substrate, in which a part of a first adhesive layer of a first film in which a first protective layer and a first adhesive layer having a melting point lower than that of the first protective layer are laminated, and a part of a second adhesive layer of a second film in which a second protective layer and a second adhesive layer having a melting point lower than that of the second protective layer are laminated, are welded together;
a second film substrate having a third film in which a third protective layer and a third adhesive layer having a melting point lower than that of the third protective layer are laminated, and a fourth film in which a fourth protective layer and a fourth adhesive layer having a melting point lower than that of the fourth protective layer are laminated, and a part of the fourth adhesive layer of the fourth film in which a fourth protective layer and a fourth adhesive layer having a melting point lower than that of the fourth protective layer are laminated, and
The first film substrate and the second film substrate are arranged in a stacked manner between a horn having a vibration surface and a horn receiver having a recess or a hole in a receiving surface corresponding to the vibration surface;
With the first film substrate and the second film substrate sandwiched between the vibration surface and the receiving surface, the first film substrate and the second film substrate are heated by the vibration of the horn to heat the area corresponding to the recess or the hole to a higher temperature than the area surrounding the recess or the hole,
a first melt-through portion formed by melting and penetrating the first protective layer and/or the second protective layer of the first film substrate, and/or a second melt-through portion formed by melting and penetrating the third protective layer and/or the fourth protective layer of the second film substrate, at a portion corresponding to the recess or the hole, the first melt-through portion being welded and fixed with an adhesive layer eluted from a portion of any one of the first adhesive layer to the fourth adhesive layer;
A method for manufacturing a laminated welded film body, characterized in that a first welded portion where the first adhesive layer and the second adhesive layer are welded together surrounding the welded fixing portion, and/or a second welded portion where the third adhesive layer and the fourth adhesive layer are welded together surrounding the welded fixing portion are formed in a region corresponding to the periphery of the recess or the hole.
請求項に記載の積層溶着フィルム体の製造方法であって、
前記凹部又は前記穴と対向する場所の前記第1フィルム基体及び前記第2フィルム基体を250℃以上に加熱し、前記凹部又は前記穴の周囲と対向する場所の前記第1フィルム基体及び前記第2フィルム基体を200℃以下で加熱することを特徴とする積層溶着フィルム体の製造方法。
A method for producing the laminated weldable film body according to claim 1 ,
A method for manufacturing a laminated welded film body, characterized in that the first film substrate and the second film substrate at the location facing the recess or the hole are heated to 250°C or higher, and the first film substrate and the second film substrate at the location facing the periphery of the recess or the hole are heated to 200°C or lower.
第1保護層と前記第1保護層より融点が低い第1接着層とが積層された第1フィルムの前記第1接着層の一部と、第2保護層と前記第2保護層より融点が低い第2接着層とが積層された第2フィルムの前記第2接着層の一部とが、前記第1フィルムと前記第2フィルムとの間に被包装物を包装した状態で溶着封止された積層溶着フィルム体を用意し、
前記積層溶着フィルム体を前記第2保護層が内側に位置して対向するように折り曲げ、
加振面を有するホーンと前記加振面に対応した受面に凹部又は穴を有するホーン受けとの間に、折り曲げられて対向して重ねられた一方の前記第2保護層と他方の前記第2保護層とを配置し、
重ねられた前記一方の前記第2保護層と前記他方の前記第2保護層とが前記加振面と前記受面との間で挟持された状態で、前記第1フィルム及び前記第2フィルムを前記ホーンの振動により加熱して、前記凹部又は前記穴に対応した部位を前記凹部又は前記穴の周囲に対応した部位よりも高い温度にすることで、
前記凹部又は前記穴に対応した部位において、前記一方の前記第2保護層を溶融させて貫通した第1溶融貫通部、及び/又は、前記他方の前記第2保護層を溶融させて貫通した第2溶融貫通部、を介して前記第1接着層及び前記第2接着層の少なくともいずれかの一部から溶出させた接着層で溶着固定した溶着固定部を形成し、
前記凹部又は前記穴の周囲に対応した部位において、前記溶着固定部を平面視した状態で取り囲んで、前記一方の前記第2保護層の側に前記第1接着層と前記第2接着層とが溶着する第1溶着部、及び/又は、前記溶着固定部を平面視した状態で取り囲んで、前記他方の前記第2保護層の側に前記第1接着層と前記第2接着層とが溶着する第2溶着部、を形成することを特徴とする積層溶着フィルム体の製造方法。
A laminated welded film body is prepared in which a part of a first adhesive layer of a first film in which a first protective layer and a first adhesive layer having a melting point lower than that of the first protective layer are laminated, and a part of a second adhesive layer of a second film in which a second protective layer and a second adhesive layer having a melting point lower than that of the second protective layer are laminated, are welded and sealed in a state in which an article to be packaged is packaged between the first film and the second film;
The laminated welded film body is folded so that the second protective layer faces the inside of the film body,
One of the second protective layers and the other of the second protective layers are folded and overlapped opposite to each other and disposed between a horn having a vibration surface and a horn receiver having a recess or a hole in a receiving surface corresponding to the vibration surface;
In a state in which the one second protective layer and the other second protective layer are sandwiched between the vibration surface and the receiving surface, the first film and the second film are heated by the vibration of the horn to heat the portion corresponding to the recess or the hole to a higher temperature than the portion corresponding to the periphery of the recess or the hole,
a first melt-through portion formed by melting and penetrating the one of the second protective layers and/or a second melt-through portion formed by melting and penetrating the other of the second protective layers at a portion corresponding to the recess or the hole, the first adhesive layer and the second adhesive layer being melted and fixed by an adhesive layer eluted from at least a portion of the second adhesive layer;
A method for manufacturing a laminated welded film body, characterized in that a first welded portion is formed in a region corresponding to the periphery of the recess or hole, surrounding the welded fixing portion in a planar state, and in which the first adhesive layer and the second adhesive layer are welded to the side of the one of the second protective layers, and/or a second welded portion is formed in a region corresponding to the periphery of the recess or hole, surrounding the welded fixing portion in a planar state, and in which the first adhesive layer and the second adhesive layer are welded to the side of the other of the second protective layers.
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